FPGA & CPLD
Products (6357)
EP2A15F672C7N - APEX II FPGA 16,640 Cells 672-FBGA | Intel
The Intel EP2A15F672C7N is a member of the Altera APEX II family of Field Programmable Gate Arrays (FPGAs), fabricated on a 0.15-micrometer all-layer copper-metal process with up to eight metal layers. The device integrates 16,640 logic elements (cells) backed by 425,984 bits of embedded memory and exposes 492 user I/Os, packaged in a 672-ball FineLine BGA (FC-FBGA) with 1.5V core operation. It is specified for a -7 speed grade and a commercial temperature range, with system performance reaching 500 MHz internal operation per published device specifications. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital circuits after manufacturing. APEX II sits at the upper end of the multi-level hierarchy: programmable logic device -> CPLD/FPGA -> high-density SRAM-based FPGA -> APEX II family. The APEX II family supports up to 1 Gbps True-LVDS signalling and offers MultiCore Interconnect routing that maps logic elements to four distinct interconnect regions, which is why this 672-pin BGA variant is commonly used in high-bandwidth communication and processing subsystems. Key features include 16,640 logic elements, 425,984 RAM bits, 492 user I/Os, LVDS support at 1 Gbps per channel, embedded PLLs for clock management, and dual-configuration schemes supporting JTAG and Passive Serial configuration. The device also includes dedicated hardware for digital signal processing (DSP) blocks and memory interfaces including DDR SDRAM controllers, making it suitable for data-pipeline and datapath-intensive designs that exceed the resources of smaller CPLD and FPGA families. Architecturally, the APEX II family integrates Logic Array Blocks (LABs), Embedded System Blocks (ESBs) for RAM and ROM, FastTrack Interconnect, and I/O Elements (IOEs) supporting LVTTL, LVCMOS, SSTL, HSTL, LVDS, and LVPECL standards. The 0.15 µm copper process allows denser integration while keeping power manageable for high-density designs. Typical applications include high-speed telecommunication switching, ASIC prototyping, DSP co-processing, and PCI/PCI-X bus interfacing. The 672-FBGA package with 492 user I/Os accommodates high-pin-count parallel buses and multi-channel LVDS links. When designing with this FPGA, plan BGA fanout for the 672-pin FC-FBGA, use controlled-impedance routing for LVDS pairs, and plan thermal dissipation for sustained high toggle rates. Altera Quartus II is the supported toolchain for compilation and configuration image generation. This page synthesizes distributor pricing, parametric data, and engineering design context not found on the standalone manufacturer datasheet, providing a single decision-ready reference for procurement and design teams.
EP2A15F672C9 - 16,640-Cell APEX II FPGA, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2A15F672C9 is a member of the APEX II programmable logic device family, delivering 600 K usable gates, 16,640 logic elements, and 492 user I/Os in a 27 x 27 mm, 672-ball FineLine BGA package. Fabricated on a 0.15 µm all-layer copper process with up to eight metal layers, the device supports True-LVDS, LVPECL, pseudo-CML, and HyperTransport signaling at 1 Gbps per pin, making it suitable for high-bandwidth parallel I/O. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, all controlled by a user-defined SRAM configuration bitstream. Within the broader taxonomy of programmable logic, APEX II sits between traditional CPLDs and modern high-density FPGAs: it provides LUT-based logic plus embedded dual-port RAM, and supports multiplier blocks for DSP workloads. As a member of the power-management and digital-logic ecosystem, an FPGA like the EP2A15F672C9 typically replaces discrete glue logic, custom ASICs, and DSP processors in communications, video, and embedded compute systems. Key features of the EP2A15F672C9 include 16640 logic elements (LEs), 1664 macrocells, a maximum internal operating frequency in the 300-400 MHz range, 0.15 µm CMOS process technology, and a core supply of 1.5 V. The device also provides dedicated True-LVDS / LVPECL / PCML differential I/O channels rated up to 1 Gbps, embedded system blocks (ESBs) for dual-port RAM and FIFO, JTAG-based IEEE 1149.1 boundary-scan test support, and on-chip PLLs for clock multiplication and deskew. The FineLine BGA-672 substrate enables dense board-level routing while preserving signal integrity on high-speed parallel buses. Architecturally, the EP2A15F672C9 relies on a row/column-based embedded array, with each Logic Array Block (LAB) containing 10 LEs, fast carry chains, and cascade paths. ESBs implement dual-port RAM with byte enables, while the APEX II MultiCore interconnect links logic, memory, and I/O elements via continuous, fast, and direct routing resources. The process and the dedicated I/O circuitry together enable 1 Gbps True-LVDS operation - a leading-edge specification for the early-2000s APEX II generation. Typical applications include high-speed parallel data acquisition systems, telecom backplane bridges, video broadcast and image-processing pipelines, network routers and switches with custom protocol offload, and military/aerospace signal processing. The combination of 492 user I/Os, 1 Gbps LVDS channels, and embedded multipliers makes the EP2A15F672C9 particularly well suited to multi-channel serializers / deserializers (SERDES) and protocol-conversion designs. When designing with this part, careful attention must be paid to signal-integrity on the 1 Gbps LVDS pairs, decoupled supply islands for the 1.5 V core and 3.3 V I/O rails, and thermal management of the 27 x 27 mm BGA under high toggle rates. Configuration via the passive or active serial scheme should be validated against the target JTAG/AS port topology before board bring-up. This page synthesizes distributor pricing snapshots, same-brand drop-in alternatives from the APEX II family, and practical design notes that complement (rather than duplicate) the original Altera APEX II Programmable Logic Device Family datasheet (DS-APEXII-3.0, August 2002).
EP2A15F672C9N - 600K Gates, 16640 Cells APEX II FPGA | Intel / Altera
The Intel / Altera EP2A15F672C9N is a high-density APEX II family FPGA implementing 600,000 gates of logic with 16,640 logic cells, housed in a 672-ball FineLine FC-FBGA package measuring 27 x 27 mm with 1 mm pitch. It is fabricated on a 0.15 µm all-layer copper CMOS process with up to eight metal layers and a 1.5 V core supply. The device is currently second-sourced under the Intel brand following the Altera acquisition. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory, I/O elements, and routing resources on a single die. FPGAs sit in the broader semiconductor hierarchy as a sub-category of programmable logic devices (PLDs), which also include CPLDs and SPLDs; within that taxonomy the APEX II family is positioned for high-density data-path and datapath-intensive designs where ASIC-like performance is required but with post-fabrication programmability. Key features of the EP2A15F672C9N include 492 user I/O pins, 1.94 ns propagation delay (per the chipdig.com listing), a maximum internal clock frequency of 379 MHz, and embedded system blocks including True-LVDS support and up to 1 Gbps I/O capability. The device integrates dedicated multipliers, dual-port RAM blocks, and a content-addressable memory (CAM) block for high-speed lookups. PLLs are provided for on-chip clock synthesis and skew management. The APEX II architecture combines a MultiCore architecture with embedded system blocks. The MultiCore system is built around Look-Up Tables (LUTs), product-term logic, and dedicated memory, allowing each logic element to be configured for either combinational or registered operation. Embedded system blocks accelerate arithmetic, memory, and CAM operations, offloading these functions from general-purpose logic and providing higher effective throughput than LUT-only implementations. Typical applications include high-speed digital signal processing, telecom line cards, ASIC prototyping, industrial automation controllers, and high-bandwidth data acquisition front-ends. The large gate count makes it well suited to designs that would otherwise require a multi-chip ASIC solution. When designing with this part, ensure the FC-FBGA 672-ball package is paired with a PCB stack-up supporting 1 mm BGA pitch and matched-impedance routing on all LVDS pairs. Use the Quartus II design tool (or its successor for legacy support) for place-and-route to meet timing closure at the rated 379 MHz. This page synthesizes distributor pricing, drop-in alternatives, package-level pinout, and practical design notes not aggregated in the manufacturer datasheet, providing a single reference for engineers and procurement teams evaluating the EP2A15F672C9N.
EP2A15F672I8 - APEX II 600K Gate FPGA, 672-FBGA | Altera
The Altera (now Intel) EP2A15F672I8 is a member of the APEX II family of FPGAs built on a 0.15-µm all-layer copper-metal process with up to eight metal layers, packaged in a 672-ball FineLine BGA (FBGA, 27 x 27 mm, 1.0 mm pitch). The device integrates approximately 600K typical gates and 16,640 logic elements (cells), supporting a maximum internal clock frequency of 435 MHz with a propagation delay around 1.94 ns and is fabricated as a 1.5 V core CMOS PLD. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic, interconnect, and I/O behavior are configured by the user after manufacture via a configuration bitstream stored in SRAM or antifuse. APEX II sits in the historical Altera device hierarchy as APEX II -> APEX -> PLD -> programmable logic device -> semiconductor, and as a Look-Up Table (LUT)-based coarse-grained FPGA it sits alongside structured-ASIC predecessors and contemporary CPLDs at the high-density end of programmable logic. Key features of the EP2A15F672I8 include 492 user I/O pins (LVTTL/LVCMOS compatible), MultiVolt I/O support, embedded system blocks (ESBs) for dual-port RAM and FIFO, embedded array blocks (EABs), up to 416 Kbits of embedded memory, and dedicated clock management circuits (PLL-like clockLock/clockBoost circuitry in the APEX II architecture). Per-pin and per-bank I/O standards are software-configurable via the Quartus design tool. Typical applications include high-speed communications line cards, telecom backplane interfaces, DSP co-processing engines, industrial control and machine-vision front-ends, and PCI/PCI-X system interconnect bridging. Designers select this device when they need high logic density combined with up to 1 Gbps LVDS-style I/O capability (the APEX II platform advertises up to 1 gigabit-per-second serial I/O bandwidth). When designing with this part, pay attention to the FBGA 27 x 27 mm footprint and 1.0 mm pitch — it requires multilayer PCB with microvia or via-in-pad fabrication. The industrial-grade -40 °C to 100 °C junction range makes it suitable for harsh-environment systems but engineering samples of this part are no longer in active production.
EP2A25B652C7 - APEX II FPGA, 652-pin BGA | Intel / Altera
The Intel (formerly Altera) EP2A25B652C7 is a member of the APEX II family of embedded FPGAs, integrating a high-density programmable logic fabric with a 652-ball FineLine BGA package and a -7 speed grade. It provides approximately 25,000 logic elements backed by embedded system blocks (ESBs) for dual-port RAM and CAM, and a dedicated MultiCore interconnect routing architecture that minimizes timing skew across wide buses. The device is fabricated on a sub-micron CMOS process and operates from a 1.5 V core supply with separate I/O bank voltages. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), above simple CPLDs in density and below ASICs in per-unit cost at high volume. APEX II is Altera's mid-to-high density family targeted at ASIC prototyping, high-speed datapath glue logic, and embedded system bus bridging. EP2A25B652C7 supports LVTTL, LVCMOS, SSTL, and LVDS I/O standards with up to 16 LVDS channels per bank. Key features of EP2A25B652C7 include approximately 40,960 RAM bits distributed across embedded system blocks, four phase-locked loops for clock multiplication and deskew, JTAG IEEE 1149.1 boundary-scan support, and on-chip pull-up resistors configurable per pin. The 652-ball FineLine BGA exposes up to 488 user I/O pins across multiple I/O banks with independent VCCIO rails, allowing mixed-voltage interfacing on a single die. Boundary-scan and SignalTap-style embedded logic analysis are supported via Altera's Quartus II design software. The APEX II architecture combines a MultiCore interconnect with look-up-table based logic elements, ESBs that can be configured as either dual-port SRAM, single-port SRAM, ROM, or CAM, and dedicated high-speed carry chains for arithmetic-intensive datapaths. The four PLLs provide clock multiplication, division, phase shifting, and external clock feedback, enabling precise timing alignment in multi-clock domain designs. Compared to the original APEX family, APEX II doubles the available ESBs and improves interconnect speed by approximately 30 percent. Typical applications for EP2A25B652C7 include ASIC prototyping and emulation, telecommunications line cards, high-speed bridge and protocol converter logic, DSP co-processing front-ends, and industrial control glue logic. The 652-pin BGA package supports the high I/O count required for parallel bus interfaces such as 64-bit PCI, UTOPIA, and POS-PHY, as well as LVDS-based SERDES companion chips. It is also commonly used in legacy telecom backplane designs and military/aerospace prototypes where the APEX II family's long-term availability through industrial distributors is valued. When designing with EP2A25B652C7, ensure that PCB layout follows Altera's FineLine BGA escape and decoupling guidelines: at least one 0.1 microfarad ceramic capacitor per VCC pin pair, four 10 microfarad bulk capacitors under the package, and a continuous power plane on inner layers. Verify JTAG chain ordering against the BSDL file before production programming, and derate I/O timing by 10 to 15 percent to compensate for board-level skew on high-fanout nets. This page synthesizes distributor stock levels, the same-family APEX II alternative MPNs already indexed on XAIPART, and practical design notes not aggregated in the manufacturer datasheet alone, enabling faster sourcing decisions for engineering teams working on legacy or long-life-cycle designs.
EP2A25B652C8 - Altera APEX II FPGA, 25K LE, BGA-652 | Intel FPGA
The Intel (formerly Altera) EP2A25B652C8 is a member of the APEX II family of high-density FPGAs in a 652-pin BGA package with -8 speed grade and commercial (0C to +85C) temperature rating. Built on a 0.15-micron CMOS process with embedded SRAM, the APEX II device integrates up to 25,000 logic elements together with embedded system blocks, PLLs, and high-speed LVDS interfaces. The 'C8' suffix denotes the -8 speed grade (C = commercial, 8 = speed bin), and 'B652' identifies the 652-ball FineLine BGA package. An FPGA (Field Programmable Gate Array) is a programmable logic device whose interconnect and logic resources are configured by the user after manufacture. In the system hierarchy, FPGAs sit between microcontrollers (fixed-function) and ASICs (custom silicon), offering high logic density, parallel DSP capability, and reconfigurable I/O. The APEX II family specifically targets high-bandwidth datapath, telecommunications, and DSP applications that benefit from dedicated multipliers, embedded memory, and multi-gigabit LVDS I/O. Key features include embedded system blocks (ESBs) implementing dual-port RAM, ROM, and CAM, dedicated hardware multipliers for DSP, four PLLs for clock management, and high-speed LVDS I/O pairs supporting DDR memory interfaces. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, enabling direct interface to modern memory and bus architectures. Configuration is supported via passive serial, passive parallel, and JTAG modes, with optional configuration via Altera EPC configuration devices. Architecturally, APEX II combines the MultiCore architecture of APEX 20KE with additional embedded memory bandwidth and enhanced I/O capability. The lookup-table based logic elements (LEs) feed into MegaLAB structures that contain ESBs and continuous LEs-to-ESB interconnect, allowing efficient implementation of wide datapaths. The hardware multiplier blocks accelerate FIR filters and FFT computations without consuming general-purpose logic. Typical applications include telecommunications infrastructure (multi-channel basestation DSP, SONET/SDH framer backplanes), high-speed networking line cards, video broadcast equipment (HD-SDI routing, MPEG processing), and military/aerospace signal processing. The -8 speed grade and BGA-652 package make this device particularly suited to high-density backplane designs where hundreds of signal pins and several hundred I/Os are required. When designing with the EP2A25B652C8, plan for a multi-layer PCB with continuous power and ground planes under the BGA. The Quartus II design suite (or later Intel Quartus Prime) supports this device, but newer tool versions are recommended for productivity. Decoupling must follow Altera's APEX II pin connection guidelines: every VCCINT and VCCIO pin must have a dedicated decoupling capacitor with short traces to the ground plane. This page consolidates distributor stock, exact-package drop-in alternatives, and engineering guidance specific to the EP2A25B652C8 that are not available on any single distributor or datasheet page.
EP2A25B652C9 - 24K LE APEX II FPGA 652-pin BGA | Intel
The Intel EP2A25B652C9 is a member of the APEX II programmable logic device family, integrating approximately 24,320 logic elements in a 652-ball FineLine BGA package. It is fabricated on a 0.18 µm CMOS process with embedded system blocks, embedded memory, and high-speed interconnect, targeting high-density, high-throughput digital designs such as telecommunications backplanes, image processing, and DSP co-processing. The 'C9' speed grade indicates a -7 (commercial, fast) timing grade operating at the core VCCINT level used by APEX II devices. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined by the customer's configuration bitstream rather than by the foundry mask set. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs in density and below ASICs in unit cost at very high volumes. APEX II devices specifically extend the APEX architecture with embedded multipliers, embedded memory blocks (EABs), and high-speed LVDS-capable I/O, enabling single-chip implementation of datapath-intensive systems. Key features include up to 24,320 logic elements, embedded array blocks for wide memory and multiplier functions, multi-gigabit interconnect support, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS through programmable I/O buffers, allowing direct interfacing with DDR SDRAM, ZBT SRAM, and legacy TTL peripherals. The APEX II architecture combines a multi-level routing fabric (FastTrack, MegaLAB, and DirectDrive interconnect) with embedded system blocks, giving designers a flexible platform for bus-oriented designs. Multi-voltage I/O banks allow independent selection of 1.5 V, 1.8 V, 2.5 V, or 3.3 V signalling on the same die, simplifying mixed-voltage board designs. Typical applications include telecommunications line-card datapaths, baseband processing, video and imaging pipelines, and ASIC prototyping. APEX II devices were widely adopted in late-1990s and early-2000s communications infrastructure and continue to appear in long-lifecycle industrial and aerospace systems that depend on stable supply. When designing with this device, plan power sequencing carefully: VCCINT must ramp before VCCIO to avoid latch-up, and decoupling must use a low-impedance distribution network with multiple bulk and ceramic capacitors near each bank. Configuration should default to a fail-safe scheme (e.g. MAX configuration) so that unconfigured I/O do not drive the board at power-up.
EP2A25B724-C7 - APEX II FPGA, 540 I/O, 724-FCBGA | Intel
The Intel (formerly Altera) EP2A25B724-C7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs), built on a 0.15 µm all-layer copper-metal fabrication process with up to eight metal layers, and housed in a 724-ball Fine-pitch Chip Ball Grid Array (FCBGA) package with 540 user I/Os. The device integrates 622,592 system gates and 24,320 logic elements, supported by embedded system blocks (ESBs) for on-chip memory and product-term logic, making it suitable for high-density, high-performance programmable logic designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reconfigure after manufacture. Within the broader taxonomy, the APEX II family belongs to high-density programmable logic, sitting above simple PLDs and CPLDs, and below structured ASICs in terms of integration scale. APEX II devices target applications requiring on-chip memory, DSP arithmetic, and high-speed serial connectivity without the NRE cost of an ASIC. Key features include 1.5 V core operation, embedded True-LVDS, LVPECL, PCML, and HyperTransport interface support capable of 1 Gbps per channel, dedicated high-speed clock networks with up to eight PLLs, and on-chip ESBs that can each be configured as a 4 Kbit SRAM block or product-term logic. The device supports multi-voltage I/O standards (1.5 V, 1.8 V, 2.5 V, 3.3 V) through banks of I/O pins, allowing direct interfacing to a wide variety of processors, memories, and bus standards. Architecturally, APEX II combines a MultiCore architecture of look-up tables, product-term logic, and embedded memory into a single fabric. The combination delivers fine-grained logic density for state machines and datapaths, while embedded multipliers and on-chip RAM eliminate the need for external DSP or SRAM devices in many signal-processing designs. The 1-Gbps True-LVDS capability reduces pin count for high-speed parallel buses by aggregating data on differential pairs. Typical applications include high-speed telecommunications backplanes, multi-gigabit serial protocol bridges, network switch fabrics, radar and signal-processing front ends, and ASIC prototyping. The 540 user I/Os and 724-ball FCBGA package also suit high-channel-count instrumentation where many parallel LVDS lanes or memory interfaces must be supported simultaneously. When designing with the EP2A25B724-C7, plan for a robust power distribution network with bulk decoupling close to each I/O bank, follow the manufacturer's BGA escape and routing guidelines for the 1-mm-pitch FCBGA, and validate the chosen configuration mode against Quartus II support for the APEX II device family before committing to layout. The '-C7' speed grade indicates commercial temperature range and a specific timing closure window; verify against your timing budget before sign-off. This page synthesizes distributor pricing snapshots, drop-in alternatives from the same APEX II family, and practical design considerations that are not collected in any single place in the manufacturer datasheet, helping procurement and hardware engineers evaluate the EP2A25B724-C7 in one pass.
EP2A25B724C7 - APEX II FPGA 540 I/O 724-FCBGA | Altera
The Altera EP2A25B724C7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs), delivering 900K system gates with 24,320 logic elements in a 724-pin FCBGA package. Operating at a core voltage of 1.5V and a maximum internal frequency of 500 MHz, this device is fabricated on a 0.15 µm CMOS process and provides 540 user I/O pins for high-density interfacing. The -C7 speed grade targets the -7 speed bin, balancing timing margin against logic throughput. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that implements arbitrary digital logic through a configurable array of logic elements (LEs), embedded memory blocks, and routing interconnects. FPGAs sit between fixed-function ASICs and discrete logic, offering hardware-level parallelism, deterministic latency, and post-manufacture design revision. Within the broader taxonomy, FPGAs are a subset of programmable logic devices (PLDs), distinct from CPLDs by their higher logic density, embedded RAM, and on-die multipliers. The APEX II family specifically combines Look-Up Table (LUT)-based logic elements with embedded memory and dedicated carry chains optimized for DSP and datapath workloads. Key features include up to 24,320 logic elements, embedded system blocks (ESBs) implementing dual-port RAM and ROM, dedicated multiplier support for DSP, multi-volt I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, and 8 PLLs for clock management. The 724-FCBGA package supports high signal-count designs with controlled-impedance traces and is compatible with multilayer PCB stack-ups. The device is rated for commercial operating temperatures and supports in-system programmability via JTAG. The EP2A25B724C7 is built on Altera's MultiCore architecture, integrating LUT-based logic with embedded memory and dedicated arithmetic resources on the same die. The 1.5V core supply and 0.15 µm process reduce dynamic power relative to older APEX devices while preserving pin compatibility across speed grades. Designers can leverage the Quartus II design environment for synthesis, place-and-route, and timing closure. Typical applications include high-throughput digital signal processing, telecommunication baseband processing, industrial machine vision, and high-speed data acquisition front-ends. The combination of 540 user I/Os and 24K logic elements makes the EP2A25B724C7 well suited for protocol bridging and parallel processing engines. When designing with this device, allocate at least four PCB layers with dedicated ground and power planes, use 1 oz copper for high-current rails, and follow Altera's pin-out guidelines for FCBGA breakout. Decoupling should include 0.1 µF ceramics at every VCC pin and bulk capacitors near each supply island. Verify signal integrity on DDR/QSPI interfaces with controlled-impedance routing and length matching. This page synthesizes distributor pricing, lifecycle observations, and drop-in same-brand speed-grade alternatives sourced from the Altera APEX II family datasheet, providing a one-stop engineering summary not found in any single distributor listing.
EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel
The Intel (formerly Altera) EP2A25F1020C8ES is a high-density APEX II Field-Programmable Gate Array (FPGA) delivering 24,320 logic elements and 2,750,000 system gates in a 1020-ball FineLine BGA package with 735 user I/O pins. Operating from a 1.5V core supply with multi-voltage I/O support, this commercial-grade device targets high-performance logic integration, on-chip bus implementation, and DSP-style datapath design. The part is rated for commercial temperature operation (0 C to +85 C) and is offered in speed grade 8 with the ES (Engineering Sample) designation. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream. APEX II specifically combines look-up table (LUT)-based logic with embedded memory blocks and a MultiCore architecture that supports both fine-grained combinatorial logic and coarse-grained datapaths. Within the broader taxonomy, the EP2A25 sits at FPGA & CPLD -> programmable logic -> logic IC -> integrated circuit, occupying the high-density tier of the APEX II family and bridging the gap between discrete gate arrays and ASICs in pre-production and prototyping designs. The EP2A25F1020C8ES features 622,592 bits of embedded RAM, embedded LVDS support on selected I/O banks, dedicated clock-management circuitry, and a high-speed interconnect fabric that supports up to 735 user I/O. The 1020-ball FineLine BGA package uses a 1.27 mm ball pitch with controlled-impedance escape routing, making it suitable for multi-layer PCBs with buried vias. Compared to ASICs, this FPGA offers design-time flexibility at the cost of higher per-unit pricing and higher dynamic power consumption. Typical applications for the EP2A25 include telecommunications line cards, custom bus-bridging glue logic, video processing pipelines, prototyping of ASIC designs, and high-density DSP co-processing. The large user-I/O count makes it particularly attractive for system-level integration where multiple parallel interfaces, memory controllers, and arithmetic blocks must coexist on a single device. The Engineering Sample (ES) suffix indicates an early-revision part intended for design validation rather than volume production deployment. When designing with this part, ensure that PCB layout supports the 1020-ball BGA escape pattern with appropriate microvia technology and that the configuration PROM is selected to match the device bitstream size. Power-supply sequencing must follow the APEX II multi-rail requirement (VCCINT before VCCIO) to prevent in-rush current damage to the I/O cells.
EP2A25F672C7 - APEX II FPGA, 25K LE, 492 I/O, 672-BGA | Altera
The Intel (formerly Altera) EP2A25F672C7 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs), featuring 25,000 logic elements housed in a 672-ball FineLine BGA (FCBGA) package. Manufactured on a 0.15-micrometer all-layer copper process supporting up to eight metal layers, the device targets high-bandwidth applications with integrated 1-Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface support. The 'C7' speed grade indicates a commercial temperature range (0C to +85C) with a -7 speed bin. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose internal logic blocks, interconnects, and I/O cells are reconfigured after manufacture via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (above CPLDs and PALs) and are widely used to implement parallel datapaths, custom interfaces, and prototype ASIC designs where time-to-market or low-volume economics preclude a custom silicon run. APEX II specifically occupies the high-density, high-I/O-count tier of the Altera portfolio, bridging the gap to early HardCopy structured ASICs. The EP2A25F672C7 integrates 492 user I/O pins, embedded system blocks (ESBs) for memory and arithmetic functions, and high-speed LVDS channels capable of 1 Gbps operation per pair. The device supports a maximum of 1,650,000 system gates and offers up to 422,976 RAM bits, making it well suited for data-path-intensive designs such as custom bus bridges, video processing pipelines, and telecommunications infrastructure. Typical applications include high-speed serial interface bridging, custom ASIC prototyping, parallel DSP architectures, and telecom line-card glue logic. The FineLine BGA package enables dense PCB layouts while supporting the LVDS signaling required for 1-Gbps chip-to-chip links. When migrating designs from APEX II to newer Cyclone or Stratix families, designers should review pinout compatibility and Quartus tool support, as the APEX II is supported by legacy Altera development software rather than current Quartus Prime releases.
EP2A25F672C7N - APEX II FPGA, 900K Gates, 672-BGA | Intel / Altera
The Intel (formerly Altera) EP2A25F672C7N is a member of the APEX II programmable logic device family, delivering approximately 900,000 system gates and 24,320 logic elements in a 672-ball FineLine BGA (FC-FBGA) package. The part is fabricated on a 0.15 µm all-layer copper process supporting up to eight metal layers, and it integrates high-speed serial interfaces capable of 1 Gbps operation including True-LVDS, LVPECL, PCML, and HyperTransport signaling. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be rewired after manufacturing to implement arbitrary digital circuits. APEX II FPGAs sit within Intel's programmable logic hierarchy as high-density, MultiCore architecture devices combining logic, embedded memory, and high-speed I/O, used for ASIC prototyping, glue logic, signal processing, and high-bandwidth interface bridging in networking, telecom, and computing systems. Key features of the EP2A25F672C7N include 24,320 logic elements, 492 user I/Os, 1.69 ns propagation delay through the LUT, and support for multiple I/O standards including LVDS, LVPECL, PCML, and HyperTransport. The device operates from a 1.5 V core supply and is offered in the commercial 0 °C to 85 °C temperature grade, indicated by the 'C7' speed-grade and 'N' non-lead-free finish-free designators in the part number. Architecturally, APEX II devices embed a MultiCore structure that pairs Look-Up Table (LUT) based logic with embedded system blocks (ESBs) acting as dual-port RAM or ROM. Up to four PLLs provide clock synthesis, while dedicated high-speed circuitry delivers up to 1 Gbps serial performance. The 672-ball FC-FBGA package uses a 27 × 27 mm body with 1 mm pitch to expose the device's 492 user I/Os alongside dedicated configuration, clock, and power pins. Typical applications include high-speed communications infrastructure, ASIC prototyping, network processor co-processing, image processing pipelines, and DSP front-end pre/post-processing. The combination of high logic density and multi-gigabit serial I/O makes the EP2A25F672C7N well suited for line-card designs requiring both DSP and SERDES functionality on a single programmable device. When designing with this part, plan PCB layout for the 1 mm-pitch BGA using microvia or via-in-pad technology, and provide at least four PCB layers with continuous power planes for the 1.5 V VCCINT rail. Decoupling must combine bulk, mid-frequency, and high-frequency capacitors placed as close as possible to the package balls to suppress simultaneous switching noise across the 492 I/Os. This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design considerations that complement the official APEX II family datasheet DS-APEXII-3.0.
EP2A25F672C8 - APEX II FPGA 492 I/O 672-FBGA | Intel / Altera
The Altera (now Intel) EP2A25F672C8 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs) delivering 25,000 logic elements in a 672-ball FineLine BGA package. It provides 492 user I/Os, 2,432 macrocells, and is fabricated on a 0.15 microm all-layer copper process with up to eight metal layers, giving it high density and predictable timing closure for complex digital designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacture, via a hardware description language and a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and simple PLDs, and below fixed-function ASICs. APEX II specifically combines Look-Up Table (LUT)-based logic, Embedded System Blocks (ESBs) for memory and product-term functions, and True-LVDS/PLL clock management, making it suitable for high-throughput data-path and bus-interface designs. Key features of the EP2A25F672C8 include 25,000 typical gates, 40,960 maximum system gates, 1.69 ns propagation delay, 1 Gbps LVDS-capable I/O performance, 4 PLLs, dual-port RAM, and embedded content-addressable memory (CAM) blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI-X, GTL+, SSTL-2/3, HSTL, LVDS, and LVPECL through 16 I/O banks, allowing mixed-voltage interfacing to DDR SDRAM, ZBT SRAM, and QDR SRAM without external translators. The architectural strength of APEX II lies in its MultiCore architecture: each Logic Array Block (LAB) contains 10 Logic Elements (LEs), and adjacent LABs share ESBs that can be configured as FIFO, dual-port RAM, ROM, CAM, or standard product-term logic. Four PLLs with up to 16 outputs each provide low-jitter clock synthesis for high-speed serializer/deserializer and DDR memory interfaces. Typical applications include telecom line-card glue logic, high-speed serial backplane bridging, DDR/QDR memory controllers, digital signal processing front-ends, and industrial ASIC prototyping where time-to-market outweighs unit cost. Designers should note the -C8 speed grade (8 is the speed bin, slower than -C7 but faster than -C9) and confirm Quartus II version compatibility, as APEX II is a legacy device family supported by older Altera tool releases only.
EP2A25F672C8N - APEX II 900K Gates 333MHz FPGA | Altera/Intel
The Altera (now Intel) EP2A25F672C8N is a high-density programmable logic device from the APEX II family, manufactured on a 0.15-micrometer all-layer copper-metal process with up to eight metal layers and offering up to 1 Gbps I/O performance. The device delivers approximately 900,000 system gates, 24,320 logic elements (cells), and 333 MHz internal operation while housed in a 672-ball FineLine BGA package (FC-FBGA) at 1.0 mm pitch and a 27 x 27 mm body. The 'C8' speed grade and 'N' lead-free suffix indicate the commercial 0 to 85 degrees C operating range. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, I/O elements, and routing resources that the designer programs after manufacture using a hardware description language (HDL) or schematic entry. FPGAs occupy the middle ground between fixed-function ASICs and discrete glue logic, providing high integration, parallel processing, and rapid design iteration. The APEX II family in particular belongs to Altera's high-end, pre-Cyclone/Stratix era of multi-gigabit serial-interface capable PLDs, suitable for high-speed telecommunications, video, and DSP backplane designs. Key features of the EP2A25F672C8N include 492 user I/Os for high pin-count designs, embedded system blocks (ESBs) for memory and CAM implementation, multi-gigabit transceivers (up to 1 Gbps per channel) for high-speed serial I/O, LVDS and HSTL I/O support, and a 1.5 V core supply with on-chip PLL clock management. The PLLs deliver low-jitter clock multiplication and skew control for multi-channel synchronous designs. Architecturally, the APEX II device combines a hierarchical routing fabric with embedded array blocks (EABs) that double as RAM, ROM, or content-addressable memory (CAM). The 0.15-micrometer copper process enables higher logic density and lower power than the 0.18-micrometer process used in the original APEX family, while the dedicated high-speed serial interfaces make the part attractive for 1 Gbps backplanes, optical transport, and parallel DSP pipelines. Typical applications include 1 Gbps networking line cards, optical transport and SONET/SDH framer ICs, multi-channel DSP coprocessors for wireless base stations, broadcast video processing engines, and high-speed test and measurement instrumentation. Designers choose the EP2A25F672C8N when they need a mature, second-sourced Altera architecture with abundant logic capacity and multi-gigabit I/O. When designing with this part, engineers should verify Quartus II tool support for the APEX II device family and confirm long-term supply continuity, because APEX II has been classified as a mature device by Intel. For new designs, current-generation Cyclone or Stratix devices are typically recommended. Ensure PCB layout follows FineLine BGA escape rules with microvia or via-in-pad technology to fan out the 672-ball array.
EP2A25F672C9 - APEX II FPGA 25K LE 492 I/O 672-FBGA | Altera
The Altera EP2A25F672C9 is a member of the APEX II family of field-programmable gate arrays (FPGAs) housed in a 672-pin FineLine BGA (FCBGA) package measuring 27 mm × 27 mm with a 1.0 mm ball pitch. According to the manufacturer datasheet, the device integrates approximately 25,000 logic elements (LEs), 2,432 macro cells, and 492 user I/O pins, making it suitable for high-density logic, DSP, and memory-intensive designs. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. APEX II devices belong to the broader hierarchy: programmable logic device (PLD) → FPGA → embedded programmable logic → high-density programmable logic IC. They are manufactured on a 0.15 µm all-layer copper process supporting up to eight metal layers and are designed for systems that require parallel processing, deterministic timing, and on-chip memory integration. Key features of the EP2A25F672C9 include embedded system blocks (ESBs) for dual-port RAM, ROM, and FIFO functions, fast interconnect with MultiCore interconnect routing, dedicated carry and cascade chains for arithmetic, and 1 Gbps LVDS-capable I/O support per the APEX II architecture. The device supports in-system programmability through Altera's passive serial (PS), passive parallel synchronous (PPS), and JTAG interfaces. It also offers multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) for interfacing with legacy and modern logic families. The APEX II architecture combines Look-Up Table (LUT)-based logic with embedded memory and a high-speed interconnect fabric. The 0.15 µm copper process reduces interconnect resistance, enabling higher toggle rates and lower dynamic power per logic operation compared to the previous-generation APEX 20K family. The 672-ball FineLine BGA package supports high pin count with controlled impedance for high-speed signal integrity. Typical applications of the EP2A25F672C9 include telecommunications baseband processing, network switching fabrics, high-speed data acquisition front ends, digital signal processing (DSP) co-processors, and ASIC prototyping. With 492 user I/Os, it can interface with multi-channel parallel ADC/DAC arrays, PCI bus bridges, and memory subsystems in embedded computing platforms. Designers should note that the APEX II family has been classified as a mature/legacy product line, with new designs generally directed to Altera/Intel Stratix or Cyclone families. The 672-ball FCBGA also requires careful PCB stack-up, controlled-impedance routing, and reflow profile management to ensure reliable assembly. Lead-time for this legacy part should be confirmed before committing to volume production.
EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel
The Intel EP2A25F672C9ES is a high-density APEX II family Field-Programmable Gate Array (FPGA) delivering up to 900,000 system gates and 24,320 logic elements (LEs), operating at up to 236 MHz internal frequency and fabricated on a 0.15 µm all-layer copper-metal process with up to eight metal layers. The device integrates 492 user I/Os and is housed in a 672-pin FineLine Ball-Grid Array (FC-FBGA) measuring 27 mm x 27 mm with a 1.0 mm pitch, and is supplied from a 1.5 V core rail. It is offered in the commercial 0 °C to 85 °C temperature grade with a -9 speed grade and Enhanced (ES) configuration support. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - itself a category of integrated circuits - that combines an array of configurable logic blocks, programmable interconnect, and dedicated I/O cells on a single semiconductor die. Within the broader semiconductor taxonomy, FPGAs sit under digital ICs -> programmable logic -> FPGAs, where they are differentiated from CPLDs by their register-rich, fine-grained architecture and ability to implement complex arithmetic, memory, and high-speed serial interfaces. The APEX II family was Intel's (formerly Altera's) high-density, multi-core architecture targeting parallel data-path and multi-gigabit serial I/O designs. Key features of the EP2A25F672C9ES include 24,320 logic elements, embedded system blocks (ESBs) for on-chip RAM and CAM, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, dedicated clock-management circuitry with up to four phase-locked loops (PLLs), and propagation delay of approximately 1.69 ns per logic element. The 672-pin FC-FBGA package enables high I/O count (492 user I/Os) on a compact fine-pitch land pattern, while the 1.5 V core reduces dynamic power compared with the prior 2.5 V APEX family. Architecturally, the APEX II device combines a fine-grained Logic Array Block (LAB) fabric with row/column-based ESBs and a high-bandwidth MultiTrack interconnect. This enables designers to integrate PCI, LVDS, SDRAM controllers, and multi-gigabit transceivers in a single chip. The 1.5 V core, combined with 0.15 µm process geometry, gives the EP2A25F672C9ES an attractive speed/power envelope for telecom line-card, base-station pre-processing, and high-speed instrumentation front-ends. Typical applications include telecommunications line-card interface logic, high-speed data-acquisition front-ends, military signal-processing subsystems, medical imaging pre-processors, and industrial automation controllers. The 492 user I/Os are well matched to designs that aggregate many parallel buses, such as legacy parallel RapidIO or custom ASIC replacement projects. When designing with the EP2A25F672C9ES, designers must use the Quartus II design suite (or MAX+PLUS II for legacy projects) and pay close attention to power-rail sequencing on the 1.5 V core - inrush current can exceed several amps during configuration. Bypass capacitors must be placed within 5 mm of every power pin pair, and the FC-FBGA land pattern requires laser-via or microvia PCB fabrication for reliable assembly. This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, and practical design notes that extend beyond the manufacturer datasheet. Where the underlying data set is incomplete, [DATA_NEEDED] markers flag parameters requiring datasheet verification.
EP2A25F672C9N - 900K Gates APEX II FPGA, 672-BGA | Intel (Altera)
The Intel (formerly Altera) EP2A25F672C9N is a high-density APEX II family FPGA implementing approximately 900,000 system gates with 24,320 logic elements, fabricated on a 0.15-µm all-layer copper-metal process supporting up to eight metal interconnect layers. The device operates from a 1.425 V to 1.575 V supply (1.5 V nominal) and is offered in a 672-ball FineLine BGA package measuring 27.0 × 27.0 mm with a 1.00 mm ball pitch, marketed in the Altera ordering scheme as the F672 package code. Per the manufacturer datasheet, the silicon supports True-LVDS, LVPECL, pseudo current mode logic (PCML), and HyperTransport signaling, plus 1-Gbps I/O capability, making it suitable for high-speed parallel interfaces, telecom backplanes, and embedded processing pipelines. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture. FPGAs belong to the broader Programmable Logic Device (PLD) family, sitting hierarchically between fixed-function ASICs (which are mask-programmed and non-reusable) and software-programmable microcontrollers. The APEX II architecture combines embedded memory blocks, embedded multiplier blocks, and LUT-based logic, allowing it to map datapath, control, and interconnect functions into a single device. Modern successors such as Stratix, Cyclone, and Agilex inherit the architectural innovations introduced by APEX II, including true-LVDS support and high-speed I/O. Key features include 492 user I/O pins, an internal core operating at up to 236 MHz per the part decoder, and support for multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport). The device contains embedded ESBs (Enhanced System Blocks) for fast on-chip RAM, and dedicated phase-locked loops (PLLs) for clock synthesis and skew management. Configuration can be performed via serial or parallel PROM, JTAG, or the Altera passive parallel scheme using the enhanced configuration interface. The 0.15-µm eight-layer copper interconnect process is engineered to maximize signal integrity and reduce die-level resistance for high-performance routing, while embedded multiplier blocks accelerate DSP operations such as FIR filters and FFT engines. The PLD provides abundant routing resources for high-utilization designs, with the 25-series being the densest member of the APEX II family. Typical applications include high-speed data acquisition, telecom baseband processing, network switching fabrics, industrial imaging pipelines, and ASIC prototyping for ASIC emulation. The combination of LVDS support, large logic capacity, and embedded multipliers makes the EP2A25 particularly suitable for DSP-intensive designs. When designing with EP2A25F672C9N, use the Quartus II design software (version 5.1 or later) for synthesis, place-and-route, and timing closure. Ensure adequate decoupling on the 1.5 V core supply and provide proper LVDS termination networks. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2A25F672ES - APEX II 25K Logic Elements FPGA | Altera | 672-BGA
The Altera EP2A25F672ES is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs) that integrates up to 900,000 gates and 24,320 logic elements in a 672-ball FineLine BGA package. Manufactured on a 0.15 µm CMOS process, the device supports core voltages of 1.5 V with multi-voltage I/O standards, system clock rates up to 500 MHz, and embedded system blocks that combine look-up tables, product-term logic, and dual-port RAM on a single die. What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of integrated circuit that can be configured by the customer after manufacturing using a hardware description language. FPGAs sit at the top of the programmable logic hierarchy: programmable logic device -> CPLD (complex programmable logic device) -> FPGA -> SoC FPGA. APEX II extends this hierarchy by embedding large blocks of SRAM and product-term logic, making it suitable for high-density system-on-chip prototyping, custom DSP datapaths, and parallel processing front-ends. Key features include 24,320 logic elements, 24 embedded system blocks (ESBs) providing up to 1.4 Mbit of dual-port RAM, four phase-locked loops (PLLs) for clock management, and 24 clock networks supporting low-skew global distribution. The device supports LVTTL, LVCMOS, PCI, LVDS, LVPECL, and HSTL I/O standards via sixteen I/O banks, enabling flexible mixed-voltage interfacing without external level shifters. The APEX II architecture uses a multi-tier interconnect hierarchy (FastTrack, local, row, and column) that delivers predictable timing closure for high-speed designs. Multi-gigabit serial capability is provided via LVDS ports, while embedded dual-port RAM blocks allow true single-cycle access for FIFO and register-file applications. Typical applications include high-throughput digital signal processing, telecommunications line cards, ASIC prototyping, and parallel processor glue logic. Designers also deploy EP2A25F672ES in image processing pipelines, network packet inspection engines, and high-speed serial backplane interfaces where deterministic latency is required. A key design consideration is power integrity: the EP2A25F672ES can draw several amps during configuration and full-speed operation, so a minimum of four 0.1 µF decoupling capacitors must be placed within 5 mm of each power pin pair. The 672-ball FCBGA also requires a 6-layer or higher PCB stack-up to maintain signal integrity above 100 MHz. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2A25F672I-7 - APEX II FPGA 900K Gates 672-BGA | Intel
The Intel (formerly Altera) EP2A25F672I-7 is a member of the APEX II family of Field-Programmable Gate Arrays (FPGAs), delivering approximately 900K gates with 24,320 logic elements in a 672-pin FC-FBGA package. It uses 0.15um process technology, supports core voltages around 1.5V, and is rated for the industrial temperature range. The part is designed for high-performance, logic-intensive applications where programmable flexibility is required. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices -> CPLDs -> FPGAs -> semiconductor ICs. Unlike fixed-function ASICs, FPGAs offer hardware re-programmability, making them ideal for prototyping, low-volume production, and applications with evolving standards. APEX II devices specifically combine Look-Up Table (LUT)-based logic with embedded memory blocks and a high-speed interconnect fabric. Key features of the EP2A25F672I-7 include 24,320 logic cells, approximately 900K system gates, embedded system blocks (ESBs) for memory and specialized functions, multi-voltage I/O support, and high-speed LVDS capabilities. The -7 speed grade indicates a particular performance bin within the APEX II family. The FC-FBGA (Flip Chip Fine-pitch Ball Grid Array) package provides high pin density and excellent thermal performance for high-gate-count designs. Technically, the APEX II architecture combines four-input LUTs, embedded memory, and a MultiTrack interconnect structure for predictable timing closure. The device supports IEEE 1149.1 JTAG boundary-scan testing and in-system programmability through configuration schemes including passive serial, active serial, and JTAG-based configuration. The industrial temperature grade (-40C to +85C) makes it suitable for non-automotive rugged environments. Typical applications include telecommunications infrastructure, high-speed data acquisition systems, digital signal processing (DSP), network packet processing, and complex glue logic replacement. The high gate count makes this device particularly suitable for protocol bridging and bus interface implementations in industrial and communications equipment. When designing with this device, ensure proper decoupling with multiple low-ESR capacitors near each power pin, and follow Altera's APEX II hardware reference manual for impedance-controlled routing of high-speed signals. The -7 speed grade provides a specific timing margin; consult the datasheet's speed-grade tables when targeting critical paths. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes that are not readily available in the manufacturer datasheet alone.
EP2A25F672I-9 - APEX II 25K LUT FPGA, 672-BGA | Intel / Altera
The Intel (formerly Altera) EP2A25F672I-9 is a high-density APEX II family Field Programmable Gate Array (FPGA) delivering approximately 25,000 typical logic elements and 1,125 Kbits of embedded system blocks, housed in a 672-pin FineLine BGA (FCBGA) package. Built on a 0.18 µm CMOS process, the APEX II architecture combines look-up table (LUT)-based logic with embedded memory and dedicated high-speed I/O, targeting bus-interface bridging, telecom datapaths, and high-throughput DSP pre/post-processing. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital logic, memory, and I/O functions on a single silicon die after manufacturing. APEX II sits within the programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. APEX II specifically integrates MultiCore architecture with embedded system blocks (ESBs) for RAM/ROM/CAM and supports LVDS, LVTTL, LVCMOS, and PCI I/O standards, providing a single-chip solution for glue-logic replacement and high-speed bus interfacing. Key features of the EP2A25F672I-9 include up to 25,000 logic elements, 1,125 Kbits of ESB memory, four phase-locked loops (PLLs), high-speed clock networks, and up to 16 high-speed transceiver-like channels via LVDS pairs. The 672-pin FCBGA package provides ample I/O count for parallel buses and memory interfaces, while the industrial temperature grade (-40 °C to +100 °C junction, indicated by the 'I' suffix) and speed grade -9 place it in the mid-density, mid-performance segment of the APEX II family. Typical applications for the EP2A25F672I-9 span telecom backplane bridging, custom bus controllers (PCI to local bus, VME to PCI), high-speed image pre-processing pipelines, and DSP coprocessor interfaces. Designers typically pair it with external SRAM or SDRAM and a small CPLD for configuration supervision, with Quartus II software (legacy, available from the Intel FPGA archive) used for synthesis, place-and-route, and bitstream generation. When designing with this device, allocate sufficient PCB area for the 672-ball BGA fanout and use at least six PCB routing layers with microvia technology. Confirm that the chosen configuration EPROM or JTAG programmer supports the APEX II bitstream format, and respect the 1.5 V/1.8 V core voltage sequencing required by the -9 speed grade datasheet. This page synthesizes distributor availability, same-family alternatives, and practical design notes for engineers evaluating the EP2A25F672I-9 against modern FPGA migration paths or last-time-buy sourcing.
EP2A25F672I6 - APEX II 25K LUT FPGA 672-BGA | Intel (Altera)
The Intel (formerly Altera) EP2A25F672I6 is a member of the APEX II family of FPGAs, integrating approximately 25,000 logic elements in a 672-pin FineLine BGA package. The device is fabricated in a 0.18 µm CMOS SRAM-based process and is configured via an industry-standard configuration device for SRAM-based LUT architectures. Operating from a 1.5 V core supply with separate I/O banks, the EP2A25F672I6 targets high-density logic, on-chip memory, and parallel DSP workloads. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (LUTs), embedded memory, DSP blocks, and programmable interconnect into a single semiconductor die. Within the broader taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) inside the programmable logic family, which itself belongs to the digital integrated circuit / semiconductor category. APEX II extends this hierarchy by combining LUT-based logic with dedicated MultiCore multipliers and embedded system blocks, bridging the gap between traditional FPGA glue logic and early platform-level integration. Key features of the EP2A25F672I6 include approximately 25,000 typical gates (manufacturer-published logic element metric), embedded MultiCore multipliers for DSP acceleration, embedded system blocks (ESBs) for on-chip dual-port RAM and CAM, JTAG (IEEE 1149.1) boundary-scan support, and dedicated clock management circuitry. The device is offered in the industrial temperature grade (suffix "I") and a speed grade of 6, denoted by the trailing "6" in the part number. The APEX II architecture combines fine-grained LUTs with coarse-grained embedded memory, allowing a single device to implement wide datapaths, FIFO buffers, and DSP pipelines without external memories. MultiCore multipliers deliver dedicated hardware multiplication, freeing general-purpose logic from arithmetic bottlenecks. This combination makes APEX II particularly suited to mixed datapath-and-control designs where engineers want to keep everything inside one programmable fabric. Typical applications include telecom line-card glue logic, parallel DSP pipelines for video and imaging, industrial control and instrumentation front-ends, and high-density bus-interface consolidation. The 672-ball FineLine BGA package supports up to 16 user I/O banks with single-ended and differential signalling options per device documentation. When designing with this part, note that SRAM-based FPGAs require a configuration device (EPC or compatible) at every power-up. The industrial temperature grade ("I6") supports -40 °C to +100 °C ambient operation, but the device is an older generation now considered NRND (Not Recommended for New Designs) by Intel/Altera. Engineers evaluating this part for new projects should review the latest Intel product change notifications. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the APEX II family, and practical design notes not consolidated in the manufacturer datasheet.
EP2A25F672I7 - APEX II FPGA 900K Gates 672-FBGA | Intel
The Intel EP2A25F672I7 is a high-density FPGA from the APEX II family, integrating 900,000 gates and 24,320 logic elements in a 672-pin FC-FBGA package. It is fabricated on a 0.15 µm CMOS process, operates from a 1.5 V core supply, and supports up to 500 MHz internal performance, making it suitable for high-throughput parallel processing and DSP-intensive applications. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor in the broader hierarchy of logic devices: programmable logic -> programmable logic device (PLD) -> FPGA -> CMOS integrated circuit -> semiconductor. Unlike a fixed-function ASIC, an FPGA can be reconfigured in the field to implement custom digital logic, DSP blocks, and memory structures. The APEX II family was Altera's (now Intel) high-end flagship in the early 2000s, positioned before the Stratix and Cyclone families and aimed at data-path-heavy designs requiring embedded memory and multipliers. Key features include 24,320 logic elements, embedded system blocks (ESBs) for RAM/ROM, support for LVDS, LVTTL, and PCI I/O standards, and a multi-gigabit embedded transceiver option via companion chipsets. The device supports in-system programmability through JTAG, and its high pin count (672 FC-FBGA) provides abundant I/O bandwidth for parallel buses, memory interfaces, and high-speed serial links. The APEX II architecture combines look-up table (LUT)-based logic with structured embedded memory and dedicated routing, balancing flexibility with deterministic timing closure. The 0.15 µm process delivers low core voltage operation (1.5 V) and moderate static power consumption relative to larger-node FPGAs of its generation. Typical applications include telecommunications line cards, ASIC prototyping, high-speed data acquisition, image processing front-ends, and legacy industrial control systems. The 672-ball FC-FBGA package enables dense board layouts required in telecom backplane designs. When designing with this device, verify availability through authorized distributors, as the APEX II family has been classified as legacy/obsolete for many years. Designers should plan migration paths to Stratix or Cyclone families for new designs. This page synthesizes distributor availability, parametric specifications, and drop-in alternative cross-references for the EP2A25F672I7, providing practical sourcing context not consolidated on the original Altera datasheet.
EP2A25F672I7N - APEX II 900K Gates FPGA | Intel / Altera
The Intel (formerly Altera) EP2A25F672I7N is a high-density programmable logic device from the APEX II family, integrating 900,000 gates and 24,320 logic elements (cells) on a 0.15 µm CMOS process operating at a 1.5 V core supply with a maximum internal frequency of 500 MHz, packaged in a 672-ball Fine-pitch Chip-scale Ball Grid Array (FC-FBGA). An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks, embedded memory blocks, and programmable routing that the designer programs after manufacture. APEX II sits within Intel/Altera's programmable logic hierarchy as a high-density, multi-vendor-standard logic family: FPGA -> programmable logic -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The architecture combines look-up tables (LUTs), product-term logic, embedded system blocks (ESBs) for memory and FIFO, and high-speed I/O elements that support multiple single-ended and differential I/O standards. Key features of the EP2A25F672I7N include 24,320 logic elements, embedded memory for distributed and block RAM, dedicated high-speed I/O supporting LVDS and other differential signaling, four phase-locked loops (PLLs) for clock management, and a 672-ball FC-FBGA package that maximizes I/O count while minimizing board area. The device supports in-system programming through the IEEE 1149.1 JTAG interface and configuration via the passive serial, fast passive parallel, and other Altera configuration schemes. Architecturally, APEX II combines a MultiCore architecture with embedded system blocks for memory and arithmetic, supporting complex system-on-chip designs including on-chip microprocessors, custom DSP datapaths, and high-bandwidth bus interfaces. The 0.15 µm process provides a balance between density and static power consumption, while the 1.5 V core voltage reduces dynamic power dissipation relative to older 2.5 V families. Typical applications include telecommunications line cards, high-speed serial protocol bridging, ASIC prototyping, image processing pipelines, and industrial automation controllers. The combination of high logic capacity, embedded memory, and high-speed I/O makes the EP2A25F672I7N well suited for designs that previously required multiple smaller FPGAs or a custom ASIC. When designing with this part, plan power distribution carefully: a 672-ball BGA requires a multi-layer PCB with dedicated power and ground planes, and the 1.5 V core supply typically needs a separate regulator such as a low-dropout (LDO) or DC-DC converter. Use Altera Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, same-brand APEX II variants, and practical design notes not found in the manufacturer datasheet alone.
EP2A25F672I8 - APEX II FPGA, 900K Gates, 492 I/O, 672-BGA | Altera
The Altera EP2A25F672I8 is a high-density APEX II Field Programmable Gate Array (FPGA) IC delivering 900K equivalent gates, 24,320 logic elements (cells), 622,592 bits of embedded RAM, and 492 user I/Os in a 672-ball FineLine BGA (FC-FBGA) package, 27 mm × 27 mm with 1 mm ball pitch. It is fabricated on a 0.15 µm all-layer copper-metal CMOS process (up to eight metal layers) and operates from a 1.5 V core supply. The part is graded for the industrial temperature range (–40 °C to +85 °C, indicated by the 'I' speed/temperature grade letter and '8' speed grade suffix per Altera's APEX II ordering scheme), making it suitable for harsh-environment embedded computing. The device supports I/O voltages up to 3.3 V and includes 4 phase-locked loops (PLUs) for clock management, embedded multiplier blocks, and high-speed True-LVDS support enabling 1 Gbps I/O bandwidth for high-speed serial-style interfaces. With propagation delay around 1.69 ns and APEX II's MultiCore architecture integrating LUT-based logic and embedded memory, the EP2A25F672I8 was a flagship high-density programmable logic device of the late-1990s/early-2000s era, designed for telecom bridging, ASIC prototyping, and complex DSP glue logic. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader taxonomy, FPGAs sit alongside CPLDs and ASICs in the programmable logic family, and underneath the larger category of digital logic ICs. APEX II sits at the high-density end of this hierarchy: it combines look-up-table based logic, embedded SRAM, embedded multipliers, and PLLs in a single fabric, allowing designers to implement microprocessors, custom DSP datapaths, and high-bandwidth bus interfaces on one die. The EP2A25F672I8's 622 Kb of embedded memory and dedicated carry chains make it well suited to data-path designs that previously required a discrete ASIC. Key features include 24,320 logic elements, 622,592 bits of RAM (~76 Kbytes), 492 user I/Os (the largest I/O count in the APEX II family), four enhanced PLLs, dedicated LVDS I/O support with data rates up to 1 Gbps, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, GTL+, PCI), and JTAG-based IEEE 1149.1 boundary-scan programming. The 672-ball FineLine BGA package provides controlled-impedance signal paths and ample power/ground balls for noise isolation. Typical applications include high-speed telecommunications bridging, ATM/packet processing, ASIC prototyping, PCI/PCI-X interface logic, custom DSP datapaths, video/imaging pipelines, and military/aerospace signal processing where industrial temperature grading is mandatory. The 672-BGA package requires multi-layer PCB design with via-in-pad or dog-bone fan-out, controlled-impedance traces, and adequate thermal vias under the central ground/power balls. Designers should plan for a 1.5 V core supply with bulk decoupling on every power ball pair, and follow Altera's AN 117 application note for APEX II PCB layout. The 'I8' industrial speed grade indicates AC performance that is slower than the 'C9' commercial 0 °C–85 °C speed grade; this trade-off is acceptable when operating temperature, not absolute clock frequency, is the primary constraint.