FPGA & CPLD
Products (6357)
EP2AGX95EF35I5G - Arria II GX FPGA, 89K LE, 452 I/O, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX95EF35I5G is a high-density Arria II GX field-programmable gate array delivering 89,178 logic elements, 6,839,296 embedded memory bits, and integrated 3.125 Gbps transceivers, housed in a 1152-ball flip-chip BGA (FCBGA) package. The device operates from a 0.9 V core supply on a 40 nm process and supports up to 452 user I/O pins with 12 transceivers for high-speed serial connectivity. What is an FPGA? A field-programmable gate array is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources that can be customized after manufacture to implement arbitrary digital circuits. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and microcontrollers as a class of programmable logic ICs (PLDs), used for prototyping, low-volume production, and applications requiring hardware-level parallelism such as signal processing, packet processing, and high-speed interfaces. Key features of the EP2AGX95 include 6.5625 Gbps true-LVDS support, dedicated hardware multipliers (PLLs and DLLs for clock management), and 89178 logic elements. The integrated PCI Express hard IP block supports Gen1 x1/x4 endpoints, simplifying PCIe-based designs. Memory interfaces support DDR3, DDR2, and QDR II+ at rates up to 800 MT/s. The Arria II GX architecture combines a logic fabric with transceivers that handle protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and CPRI. The transceiver blocks support data rates between 600 Mbps and 3.75 Gbps, eliminating the need for external PHY chips. Built-in PCS (physical coding sublayer) blocks handle 8b/10b encoding and rate matching. Typical applications for the EP2AGX95EF35I5G include wireless baseband processing, broadcast video equipment, industrial imaging, test and measurement instrumentation, and high-speed serial protocol bridging. The 452 I/O count makes the device suitable for designs requiring many parallel interfaces alongside serial channels. When designing with the EP2AGX95EF35I5G, plan for the 35x35 mm FCBGA footprint, which demands PCB stack-up with buried vias and microvia technology. Use the Quartus II design software (13.0 or later service packs) for place-and-route and ensure proper power sequencing of the 0.9 V core, 1.1 V PLL, and 2.5 V/3.3 V I/O rails. This page synthesizes distributor pricing, drop-in package alternatives, and engineering design notes not found in the manufacturer datasheet, providing engineering teams with practical sourcing and design-decision data.
EP2AGX95EF35I5N - Arria II GX FPGA, 95K LEs, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX95EF35I5N is a high-performance Arria II GX Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA (FBGA-1152) package, integrating 95K logic elements, 4,525 Kbits of embedded memory, and 891 18x18 multipliers alongside 452 user I/Os. Built on a 40nm low-power process, it combines a transceiver-rich serial fabric with a fabric of hardened PCI Express and memory controllers, making it a turnkey engine for mid-range ASIC-prototyping, broadcast video, and wireless baseband designs. Arria II GX FPGAs belong to Intel's mid-range programmable logic family, positioned between the low-power Cyclone series and the high-end Stratix series. The Arria II line integrates up to 6.375 Gbps transceivers on-die, eliminating external PHY silicon for many protocols such as PCIe Gen2, Serial RapidIO, Gigabit Ethernet, CPRI/OBSAI, and SDI/HD-SDI/3G-SDI. This integration shrinks BOM cost and PCB area for applications where designers would otherwise need a dedicated transceiver companion chip. Key features include 6 transceiver channels capable of 6.375 Gbps, up to 12 PCIe Gen2 root-complex or endpoint lanes, 8.265 Mbits total memory (mix of MLAB, M9K, and M144K blocks), dedicated hard IP for DDR3 up to 800 Mbps, and 12 PLLs. The 'I' speed grade targets industrial (-40C to +100C Tj) operation while the '5' speed-bin places it in the mid-tier performance class. Core VCC is 0.9V; I/O and transceiver voltages are independent. Architecturally, Arria II GX uses logic array blocks (LABs) containing adaptive logic modules (ALMs), each ALM holding an 8-input fracturable look-up table, two dedicated adders, and a shared register chain. Embedded transceivers use a hardened PCS/PMA stack supporting multiple protocol modes, and adaptive equalization/cursor pre-emphasis circuitry preserves signal integrity across backplanes and FR-4 traces. Hard PCIe Gen2 IP and the dedicated memory controller free fabric LUTs for application logic, yielding higher effective utilization than soft-IP solutions. Typical applications include 3G-SDI broadcast video processing and format conversion, LTE/WiMAX baseband DSP front-ends, defense signal-intelligence and software-defined radio, medical ultrasound beamforming, and PCI Express Gen2 endpoint/root-port cards. Designers also deploy it in test-and-measurement ATE boards where 6 Gbps transceivers serve high-speed digitizer or pattern-generator data paths. When designing with this device, allocate sufficient decoupling (100 nF + 1 uF + 10 uF per power rail) near the FBGA balls, follow Intel's recommended PCB stack-up (typically 12-layer with 50 ohm controlled-impedance routing), and use the Quartus Prime design suite (with Arria II device support) for synthesis, place-and-route, and timing closure. Verify transceiver channel reach with the IBIS-AMI models provided in the device documentation. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes that go beyond the bare manufacturer datasheet, helping procurement and engineering teams evaluate EP2AGX95EF35I5N for both new designs and legacy board refresh.
EP2AGZ225FF35C3G - 225K LE Arria II GZ FPGA | Intel (Altera)
The Intel (formerly Altera) EP2AGZ225FF35C3G is a high-density Arria II GZ field-programmable gate array (FPGA) from the Arria II family, housed in a 1152-ball flip-chip BGA package (FF35, 35x35 mm). It integrates 225,000 logic elements with transceivers optimized for high-performance digital signal processing, ASIC prototyping, and high-bandwidth interface bridging. Arria II GZ FPGAs belong to the mid-to-high-end programmable logic family from Intel/Altera, positioned above Cyclone and below Stratix in the legacy Altera hierarchy. They are built on a 40 nm TSMC process and combine high logic density with multi-gigabit transceivers and dedicated DSP blocks, making them a workhorse for telecom infrastructure, broadcast video, and high-speed serial interfacing designs. Arria II GZ bridges the gap between cost-optimized mid-range FPGAs and full-featured high-end transceiver-rich FPGAs. Key features include up to 16 transceivers supporting data rates of up to 6.375 Gbps, dedicated hardware DSP blocks for high-throughput multiplication and accumulation, embedded memory blocks for buffer/buffering, and flexible PLL/clocking infrastructure. The FF35C3G speed grade indicates commercial temperature range (0C to 85C), C3 transceiver speed grade, and a flip-chip BGA package (FF = Fine-pitch Flip-chip BGA). The 1152-ball BGA package exposes the device's high I/O count for dense board-level routing. The architecture features dedicated transceiver channels (GX), embedded PCIe hard IP, and 8-input adaptive logic modules (ALMs) that improve logic utilization versus older 4-input LUT architectures. Multiple hard memory controllers support DDR3, DDR2, and QDR II+ external memory interfaces for high-throughput data movement, and integrated PCI Express hard IP blocks simplify endpoint and root-port designs in telecom blade systems. Typical applications include high-speed serial interface bridging (e.g., 6G/10G Ethernet MAC-to-PHY bridging), ASIC prototyping with high pin-count and logic density, broadcast video processing, radar signal processing, and test and measurement instrumentation requiring high sample-rate DSP. The Arria II GZ is commonly specified when designers need more logic and transceiver performance than Cyclone but more cost-effectiveness than full Stratix-tier FPGAs. When designing with EP2AGZ225FF35C3G, ensure proper PCB layout for the flip-chip BGA - a minimum 12-layer stack-up with continuous ground planes below the device is recommended for transceiver signal integrity. Thermal management via heat sink or high airflow is required for sustained transceiver operation at full data rate. Use Quartus II design software (legacy 13.0 or earlier recommended for Arria II) for synthesis and timing closure. This page synthesizes distributor pricing across 7 sources, same-family drop-in alternatives, and practical design notes for transceiver signal integrity and BGA thermal management not found in the manufacturer datasheet alone.
EP2AGZ225FF35C3N - Arria II GZ FPGA 224K LE 1152-FCBGA | Intel
The Intel EP2AGZ225FF35C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) delivering 224,000 logic elements (LE), 14,248,960 bits of embedded memory, and 8,960 Logic Array Blocks (LABs) in a 1152-ball FineLine BGA (FCBGA) package, commercial temperature grade, speed grade 3. It belongs to Intel's mid-range Arria II GZ family, positioned between the Cyclone and Stratix series to deliver high bandwidth, transceivers, and DSP blocks at lower cost than Stratix for performance-oriented applications. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows designers to configure digital logic, memory, and routing after fabrication. FPGAs sit in the broader category hierarchy of programmable logic devices (PLD) -> FPGA -> semiconductor IC. The Arria II GZ family is built on a 40nm process node and targets applications needing transceivers, DSP blocks, and external memory interfaces (EMIF) at low total cost of ownership. Key features of the EP2AGZ225FF35C3N include 12.5 Gbps transceiver capability, dedicated DSP blocks for high-speed signal processing, up to 554 user I/Os, and embedded RAM blocks with parity support. The device supports PCI Express Gen2 hard IP, multiple high-speed memory interfaces (DDR3, DDR2, QDRII+, RLDRAM2), and eight full-duplex clock data recovery (CDR)-based transceivers plus 16 additional transceivers up to 6.375 Gbps. The architecture uses logic elements (LE) grouped into Adaptive Logic Modules (ALMs), each containing 8-input fracturable look-up tables (LUTs), registers, and dedicated arithmetic adders. The 1152-ball FCBGA package provides the high-density interconnect required for the 554 user I/Os and the multiple transceiver channels. Speed grade 3 indicates a moderate speed bin, balancing performance and yield for cost-sensitive applications. Typical applications include wireless baseband processing, high-definition video broadcast equipment, radar signal processing, test and measurement instrumentation, medical imaging, and high-speed data acquisition systems. Designers select the Arria II GZ family when they need Stratix-class transceivers and DSP throughput at a lower price point, and when 28 Gbps Stratix V-class performance is not required. When designing with the EP2AGZ225FF35C3N, careful PCB layout is essential because the FCBGA package demands a multi-layer PCB with matched-impedance traces, blind/buried vias, and controlled-length routing for the transceiver channels. Power distribution requires multiple dedicated voltage rails (core, I/O, PLL, transceiver, auxiliary) with extensive decoupling, and thermal management via heatsink attachment is typically required at full transceiver utilization. This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, Intel-recommended Arria II GZ drop-in alternatives from the same family, and practical design considerations not found in the standalone datasheet, making it a faster decision aid for procurement and FPGA selection.
EP2AGZ225FF35C4G - 554-I/O FPGA | Intel | Embedded Systems
Intel EP2AGZ225FF35C4G is a field-programmable gate array (FPGA) with 554 user I/O pins in a 1152-ball fine-pitch BGA package. The verified distributor data identifies it as an FPGA IC and confirms the FF35C4G orderable configuration. It is intended for embedded systems that require programmable digital logic, configurable I/O, and hardware-level processing. The part belongs to Intel's FPGA and CPLD device category and is supplied as an integrated circuit rather than a conventional fixed-function controller. An FPGA is a semiconductor device containing programmable logic blocks, interconnect resources, and configurable I/O. Engineers use an FPGA when a design needs parallel processing, custom timing, rapid interface adaptation, or deterministic hardware execution. In the system hierarchy, an FPGA is a programmable logic device, while an FPGA is categorized as a programmable semiconductor integrated circuit alongside application-specific integrated circuits and digital signal processors. The verified product listings identify the device as a field-programmable gate array and specifically report 554 I/O. The package description identifies 1152FBGA, while the order code and distributor listings identify the device as an Intel/Altera FPGA. These details make the part suitable for designs that need many external connections or several buses and peripheral interfaces. The verified web data does not expose logic-element count, memory resources, transceiver count, operating temperature, speed grade, or voltage ratings, so those parameters remain unavailable rather than being inferred. The device can implement custom control, interface, and datapath functions after configuration. Its programmable architecture allows a board design to connect multiple digital domains while applying timing constraints and implementing protocol-specific logic. For hardware teams, the main engineering task is to validate the complete device configuration against the target board, power system, clocking scheme, pin assignment, and supported configuration method before release to production. Typical applications include industrial automation controllers, communications equipment, test and measurement systems, embedded computing platforms, and high-density digital interface designs. The 554-I/O resource is particularly relevant where the FPGA must bridge processors, memory devices, sensors, converters, or communications peripherals. The 1152FBGA package is suitable for high-density PCBs but requires controlled assembly and careful signal-integrity review. Designers should confirm all electrical limits, supported I/O standards, configuration requirements, thermal characteristics, and package land-pattern details from the manufacturer documentation. This page preserves the verified MPN, package, I/O, pricing, availability, and sourcing information while clearly marking unsupported specifications as data needed.
EP2AGZ225FF35C4N - Arria II GZ FPGA 224K LE | Intel (Altera)
The Intel (formerly Altera) EP2AGZ225FF35C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) with 224,000 logic elements, 14,248,960 bits of embedded memory, 554 maximum user I/O pins, and 8,960 LABs/CLBs, housed in a 1152-ball flip-chip BGA (FCBGA-1152) package measuring 35 mm x 35 mm. The device is fabricated on a 40 nm low-power process and operates from a 0.9 V core supply at speeds up to 500 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing channels, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and are used when designs require high logic density, parallel processing, or hardware-level customization beyond what a microcontroller or DSP can deliver. The Arria II GZ family specifically targets mid-range, transceiver-rich applications bridging the gap between Cyclone and Stratix devices. Key features of the EP2AGZ225FF35C4N include 24 transceivers supporting data rates up to 6.375 Gbps, 1,152 Kbits of distributed RAM, dedicated 18x18 multipliers for DSP workloads, and up to 1,067 Mbps external memory interfaces for DDR3. The flip-chip BGA-1152 package provides a high-pin-count solution for I/O-intensive designs while the 40 nm process balances performance and power efficiency. The architecture integrates transceiver circuitry, PCI Express hard IP blocks, and high-speed memory interfaces alongside the general-purpose logic fabric, making the device well suited for protocol bridging, video processing, and high-bandwidth telecommunications infrastructure. The C4 speed grade and -4 transceiver grade combination targets commercial temperature operation at enhanced timing margins. Typical applications include 6G backplane transceivers, broadcast video switching, medical imaging accelerators, military radar signal processing, and high-performance compute test equipment. The Arria II GZ is particularly attractive for systems migrating from ASIC prototypes to mid-volume FPGA production where transceiver density and on-chip memory matter most. When designing with this device, plan power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V auxiliary rails, and verify PCB escape routing for the 1 mm-pitch BGA. Use the Quartus II design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, verified datasheet specifications, drop-in alternatives, and practical design notes for the EP2AGZ225FF35C4N, providing unique information gain beyond standard manufacturer documentation.
EP2AGZ225FF35I3G - 225K LE Arria II GZ FPGA | Intel | 1152-FBGA
The Intel (formerly Altera) EP2AGZ225FF35I3G is a high-performance Arria II GZ family Field-Programmable Gate Array (FPGA) delivering 225,000 logic elements in a 1152-ball FineLine BGA (FBGA) package. It is built on a 40nm process, supports transceiver data rates up to 6.375 Gbps, and offers up to 554 user I/O pins with a core voltage of 0.9 V. The part is rated for the industrial temperature range (-40C to +100C) and is supplied in tray packaging. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the broader taxonomy of semiconductors -> programmable logic -> PLD -> FPGA. They are widely used for high-throughput parallel processing, high-speed serial interfaces, and hardware-accelerated compute where ASICs are uneconomical. Key features of the EP2AGZ225FF35I3G include 225K logic elements, 12 transceiver channels supporting data rates up to 6.375 Gbps, 17.4 Mbits of embedded memory, 1,152 Kbits of on-chip RAM, and 28 transceiver channels on certain configurations. The device integrates 8 PLLs and 8 DLLs, providing flexible clock management for high-speed designs. Embedded multipliers (around 1,728 18x18 multipliers) accelerate DSP workloads, and partial reconfiguration capability allows runtime logic swaps without halting the device. The Arria II GZ architecture is fabricated on TSMC's 40nm process and is targeted at high-end communications, broadcast video, and military/aerospace applications. The 6.375 Gbps transceivers support protocols such as PCIe Gen2, Serial RapidIO, and 10 Gigabit Ethernet (XAUI), making the device suitable for high-bandwidth backplane and line-card designs. The -I3 speed grade balances transceiver performance and timing closure for industrial temperature operation. Typical applications include high-speed serial backplane interfaces, military secure communications, broadcast video processing, ASIC prototyping, and high-performance DSP front-ends. The wide transceiver bandwidth and generous logic density allow a single Arria II GZ to replace multiple lower-density FPGAs in complex designs. When designing with this device, ensure proper PCB layout for the 1152-ball FBGA: a minimum of 4-6 PCB layers with controlled-impedance routing for the 6.375 Gbps serial links, and a substantial thermal copper pour beneath the exposed-die package. Use Intel Quartus II design software (12.0 or later) for synthesis, place-and-route, and timing analysis. Plan pin assignments early because FBGA escape routing constraints can be challenging at high channel counts.
EP2AGZ225FF35I3N - Arria II GZ FPGA, 224K LE, 1152-FCBGA | Intel
The Intel (Altera) EP2AGZ225FF35I3N is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm low-power process, delivering 224,000 logic elements (LE), 14,248,960 bits of embedded memory, and 8960 LABs in a 1152-ball flip-chip BGA (FC-FBGA) package. It is rated for the industrial temperature range (-40C to +100C) and is part of the Arria II GZ family that integrates up to 24 transceivers operating up to 6.375 Gbps, making it the company's mid-range 6G transceiver-based platform for bandwidth-intensive designs. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed I/O transceivers that can be re-programmed after manufacture. The Arria II GZ sits within the broader taxonomy of programmable logic: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Arria II GZ is positioned between the lower-cost Cyclone family and the higher-end Stratix family in Intel's (formerly Altera's) mid-to-high-end portfolio, targeting applications that need transceiver bandwidth and DSP resources without the premium cost of Stratix V/VII devices. Key differentiating specifications include 24 transceiver channels at data rates up to 6.375 Gbps supporting protocols such as PCI Express Gen2, Serial RapidIO, XAUI, CEI-6G, and CPRI; 1,152 user I/O pins; 1.4 Mbit of internal block RAM distributed across M9K and M144K blocks; and dedicated variable-precision DSP blocks. The device supports hot-socketing, 8B/10B encoding, and dynamic reconfiguration. Core voltage is 0.9 V with transceiver PLLs supplied from separate analog rails. Architecturally, the EP2AGZ225FF35I3N implements a logic array of 224,000 8-input adaptive logic modules (ALMs) organized into 8960 LABs, paired with 8-input fracturable look-up tables (LUTs), dedicated carry chains, and 20 Kbit MLAB blocks. Memory is implemented through a combination of 9 Kbit M9K blocks and 144 Kbit M144K blocks. Transceiver channels include physical coding sublayer (PCS) and physical medium attachment (PMA) hard IP that simplifies protocol implementation. Typical applications include wireless baseband processing, military radar and signal intelligence, test and measurement equipment with high-speed serial interfaces, medical imaging pipelines, broadcast video processing, and 40G/100G line-card prototyping. The 6.375 Gbps transceivers also make the device suitable for backhaul links and proprietary chip-to-chip interconnect on advanced compute boards. When designing with this part, allocate sufficient PCB layers (typically 14 to 20) and dedicated transceiver power-supply filtering; ball-grid-array escape routing demands microvia and via-in-pad capability from the PCB fabricator. Power estimation with the Quartus II Early Power Estimator before PCB commitment is strongly recommended because worst-case core current can exceed 10 A at 0.9 V on the highest-utilization designs. This page synthesizes distributor pricing, lifecycle status, drop-in same-package variants, and practical PCB guidance not found in any single manufacturer datasheet, helping procurement and FPGA design engineers make faster, more informed decisions on the Arria II GZ family.
EP2AGZ225FF35I4G - Arria II GZ FPGA 225K LE 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGZ225FF35I4G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm low-power process, integrating approximately 224,000 logic elements with 554 user I/Os in a 1152-ball FineLine BGA (FBGA) package and rated for industrial (-40C to +100C) operation. The 'I4' speed/temperature grade, 'GZ' series designation, and 1152-FBGA package code 'FF35' together identify the largest-density member of the cost-optimized Arria II family, which pairs a programmable logic engine with embedded transceivers and DSP blocks for mid-range signal-processing designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric that the designer configures after manufacture using a hardware-description language (HDL). FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (fixed architecture, software-defined) on the flexibility/performance continuum, occupying the programmable-logic layer of the broader integrated-circuit taxonomy: logic IC -> programmable logic -> FPGA. Arria II GZ specifically targets transceiver-rich applications needing multi-gigabit serial links at lower power than the Stratix family. Key features of the EP2AGZ225FF35I4G include a 40 nm process node, a logic-element density in the ~225 K LE class, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput fixed- and floating-point math, and on-chip memory blocks suitable for buffering and FIFO applications. The device integrates PCI Express hard IP and external memory interface controllers, allowing direct attachment of DDR3 memory and simplifying board-level design. The 1152-ball FineLine BGA package exposes 554 user I/Os, providing generous fan-out for high-pin-count peripherals. Architecturally, the Arria II GZ uses an 8-input adaptive logic module (ALM), a hierarchical routing fabric with fractional paths to reduce congestion, and hard PCIe Gen1/Gen2 blocks; combined, these features deliver deterministic timing closure and lower dynamic power than the previous-generation Arria II GX at comparable logic density. Designers typically target this device with Quartus Prime software. Typical applications include high-speed serial backplane bridging, wireless baseband preprocessing, video broadcast infrastructure, test-and-measurement equipment with custom trigger logic, and defense/aerospace signal processing. Industrial-grade temperature rating also suits outdoor or ruggedized deployments. When designing with this device, pay close attention to power-rail sequencing (multiple VCC rails of different voltages), transceiver reference-clock jitter, and BGA breakout routing - the 1152-ball FBGA requires HDI PCB stack-ups with microvia-in-pad for escape. Reference Altera's Arria II GZ handbook for transceiver and memory-interface guidelines. This page synthesizes distributor pricing, drop-in alternatives within the Arria II GZ family, and practical board-design considerations not consolidated in the manufacturer datasheet.
EP2AGZ225FF35I4N - 224K LE Arria II GZ FPGA, 1152-FCBGA | Intel
The Intel EP2AGZ225FF35I4N is a high-density, high-performance Arria II GZ family field programmable gate array (FPGA) delivering 224,000 logic elements (LEs), 14,248,960 bits of embedded memory, and 8,960 LABs/CLBs in a 1152-ball flip-chip BGA (FC-FBGA) package operating at 500 MHz on a 40 nm process with 0.9 V core supply. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing fabric, with embedded memory, DSP blocks, and high-speed transceiver/IO resources. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) under digital integrated circuits, and the Arria II GZ family specifically targets mid-to-high-end applications that need transceivers, parallel memory interfaces, and signal-processing throughput but do not require the very latest transceiver data rates. Key features of the EP2AGZ225FF35I4N include 554 user I/Os, 12 transceivers capable of multi-gigabit operation, dedicated DSP blocks, embedded memory organized as M9K/M144K blocks, and support for external memory interfaces including DDR3. The device operates across an industrial temperature range of -40C to +100C, supports configuration via fast passive parallel (FPP) and active serial (AS) modes, and provides JTAG (IEEE 1149.1) and SignalTap embedded logic analysis. Architecturally, the Arria II GZ uses a logic fabric of 8-input adaptive logic modules (ALMs) and an 8.96 Mbit distributed+block memory hierarchy. The 40 nm low-power process yields high DSP throughput while keeping the static power low for high-density designs such as high-definition video processing, multi-channel baseband aggregation, and radar pre-processing. Typical applications include high-definition video broadcasting infrastructure, wireless baseband processing, military radar and signal intelligence, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, CPRI), and ASIC prototyping. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well suited to data-pump designs that previously required a discrete DSP + memory + ASIC combination. When designing with this device, ensure that the PCB footprint matches the 35 mm x 35 mm, 1.0 mm pitch FC-FBGA-1152 land pattern and that the board provides all required decoupling per Intel's pin connection guidelines. Power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V auxiliary rails must follow the datasheet power-on-reset (POR) requirements to avoid configuration failure. This page synthesizes distributor pricing, drop-in alternatives (same brand, then cross-brand), pin-level design guidance, and application notes not found in the manufacturer datasheet alone, helping procurement and hardware engineers evaluate this FPGA quickly for new builds or legacy board refresh.
EP2AGZ225HF40C3G - 225K LE Arria II GZ FPGA, 734 I/O, FBGA-1517 | Intel
The Intel (formerly Altera) EP2AGZ225HF40C3G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm process, delivering 225,000 logic elements (LE) and 734 user I/O in a 1517-ball flip-chip BGA package. It targets mid- to high-bandwidth digital signal processing, high-speed serial interconnect, and memory-intensive designs that need more logic density than Arria II GX parts and more transceiver/PCIe capability than Cyclone-class devices. The HF40 device suffix denotes the 1517-ball FBGA package, a commercial temperature grade (C3), and the Altera/Intel ordering scheme used for Arria II GZ. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all of which can be reconfigured after manufacturing via a hardware description language (HDL) bitstream. FPGAs sit hierarchically under programmable logic devices (PLD) and above ASICs in flexibility-versus-ASIC NRE trade-off; they are widely used as hardware accelerators, protocol bridges, and pre-silicon prototyping platforms. The Arria II GZ family is positioned in Intel's mid-range portfolio, between the lower-power Cyclone series and the high-end Stratix series. Key features of the EP2AGZ225HF40C3G include 225,000 logic elements, embedded memory in the multi-megabit range, embedded DSP blocks with hardware multipliers, high-speed transceivers supporting multi-gigabit serial protocols, and PCI Express (PCIe) hard IP blocks. The 1517-ball FBGA package supports 734 user I/O pins, providing generous connectivity for parallel memory buses (DDR3), high-speed ADC/DAC interfaces, and backplane transceivers. The C3 speed grade trades timing margin for power savings relative to the faster C4/C5/C6 grades. The Arria II GZ architecture combines hard IP for PCIe Gen2, multi-gigabit transceivers, and variable-precision DSP blocks, allowing system designers to consolidate functions that previously required an FPGA plus a companion ASSP. Typical applications include wireless baseband processing, high-definition video broadcast equipment, radar and signal-intelligence front ends, medical imaging pipelines, and high-performance computing acceleration cards. The 734 I/O count in particular suits designs that aggregate many parallel channels. When designing with this part, engineers must respect the flip-chip BGA PCB requirements: controlled-impedance stackup, microvia or via-in-pad construction, and matched-length routing for the DDR3 memory interface. Designers should also consult the Arria II GZ device handbook for transceiver channel placement and PLL configuration. The C3 speed grade is appropriate when timing margin can be traded for power, while C6 is used for the most demanding timing closure.
EP2AGZ225HF40C3N - Arria II GZ 224K LE FPGA, 734 I/O | Intel FPGA
The Intel (formerly Altera) EP2AGZ225HF40C3N is a high-density Arria II GZ field-programmable gate array (FPGA) delivering 224,000 logic elements, 14,248,960 embedded memory bits, and 734 user I/O pins in a 1517-ball flip-chip BGA (FBGA, package code HF40) package. Built on a 40 nm low-power process, the Arria II GZ family targets mid- to high-end applications requiring transceivers, DSP blocks, and high memory bandwidth. What is a Field-Programmable Gate Array (FPGA)? An FPGA is a reconfigurable integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, DSP slices, and block memory. In the power-management IC hierarchy, an FPGA sits above microcontrollers and below ASICs in performance and flexibility, allowing hardware designers to implement custom parallel logic, signal processing, and high-speed serial interfaces without fabricating a custom chip. Key features include 8,960 Logic Array Blocks (LABs), high-speed transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for fixed- and floating-point arithmetic, and a rich clock management network with phase-locked loops. The device supports 1.0 V core operation with on-chip regulators and offers multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express. The architecture combines logic fabric with hard IP such as PCI Express Gen1/Gen2 hard IP blocks, 6.375 Gbps transceivers, and dedicated memory interfaces (DDR3) for high-throughput external memory access. The HF40 1517-BGA package exposes the maximum I/O count and transceiver pins, enabling full-feature designs in a single device. Typical applications include high-speed data acquisition, digital signal processing in radar and software-defined radio, PCIe-based accelerator cards, broadcast video processing, and high-end telecommunications line cards. The wide transceiver bandwidth and DSP density make Arria II GZ suitable for systems that demand deterministic parallel processing. Designers should plan power sequencing across the 0.9 V core, 1.0 V transceiver, and I/O supplies, ensure thermal coupling with the BGA substrate, and validate signal integrity for high-speed serial links using Intel's Quartus II design tools. This page synthesizes distributor pricing, drop-in pin-compatible Arria II GZ variants, and practical FPGA design notes not consolidated in the manufacturer datasheet.
EP2AGZ225HF40C4G - 225K LE Arria II GZ FPGA, 1517-FBGA | Intel
The Intel (formerly Altera) EP2AGZ225HF40C4G is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) providing 225,000 logic elements, embedded transceivers, and rich on-chip memory in a 1517-ball FineLine BGA package. Built on a 40 nm low-power process, the device integrates 12.5 Mbits of embedded memory, 1,224 18x18 multipliers, and 734 user I/O pins for high-throughput digital designs. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit in the programmable-logic layer of the digital design hierarchy, above general-purpose microcontrollers and below fixed-function ASICs, and are widely used for hardware-acceleration, prototyping, and time-to-market-sensitive designs. Key features of the EP2AGZ225HF40C4G include 8 dedicated 3.125 Gbps transceivers (C4 speed grade, commercial, 0.85V Vcc), 1,224 18x18 hardware multipliers for high-performance DSP, 12.5 Mbits of embedded RAM, and 734 general-purpose user I/Os that support multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The HF40 package designation indicates a high-density FineLine BGA with 1517 balls. The Arria II GZ architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, achieving an optimal balance between logic density, performance, and power. Transceivers support protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and SerialLite II, enabling high-speed serial connectivity for communications, broadcast, and military designs. Typical applications include high-speed serial-interface bridging cards, DSP co-processing cards, software-defined radio (SDR) baseband cards, telecom line cards, military radar and signal-intelligence prototypes, and ASIC prototyping platforms that demand hundreds of I/Os and multi-gigabit transceivers. When designing with this device, ensure adequate power-rail decoupling near every transceiver supply pin, controlled-impedance routing on all high-speed serial lanes, and thermal relief for the FineLine BGA through adequate PCB copper and airflow. This page synthesizes distributor pricing, drop-in Arria II GZ alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
EP2AGZ225HF40C4N - Arria II GZ FPGA 224K LE 1517-FCBGA | Intel
The Intel (formerly Altera) EP2AGZ225HF40C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 224,000 logic elements, 14,248,960 RAM bits, and 734 user I/O pins in a 1517-ball FineLine BGA package with a -40C to +85C commercial operating temperature grade. The Arria II GZ family targets mid-range, high-bandwidth applications that require a balance of logic density, on-chip memory, and transceiver capability without moving to the more expensive Stratix tier. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that the designer configures after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which are a sub-category of digital integrated circuits. The Arria II GZ family adds dedicated transceiver and DSP blocks on top of standard FPGA fabric, placing it at the intersection of programmable logic and high-speed serial signal processing. Key features include 8,960 LABs (Logic Array Blocks), embedded transceivers supporting multi-gigabit serial protocols, DSP blocks for high-throughput fixed- and floating-point arithmetic, and a rich clock network with PLLs for multi-domain designs. The 40 nm process node combined with on-chip hard IP blocks gives the GZ family a favorable performance-per-watt ratio relative to older Arria generations. Technical depth: the Arria II GZ architecture pairs a logic fabric tuned for high register counts with up to 12.5 Gbps transceivers, hardened PCIe Gen2 and external memory interfaces (DDR3, QDRII+, RLDRAM II), and dedicated DSP slices optimized for FFTs, FIR filters, and baseband modulation. The 1517-FCBGA (HF40) package exposes the full 734-pin user I/O, allowing designs to use all available transceiver and memory channels without package bottlenecks. Typical applications include wireless baseband processing, high-end video broadcast infrastructure, radar signal processing, medical imaging accelerators, and ASIC prototyping. Its combination of logic density and 6.375 Gbps transceivers makes it a strong fit for designs previously reserved for more expensive Stratix devices. Design consideration: the FCBGA-1517 package requires a multi-layer PCB with microvia technology, controlled-impedance routing for transceiver channels, and careful power-plane design to meet the 0.9 V core / 1.1 V transceiver supply sequencing requirements spelled out in the Arria II Device Handbook. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Arria II GZ family, and practical design notes not collected in the manufacturer datasheet, giving engineers a single reference for sourcing, second-source planning, and PCB bring-up decisions.
EP2AGZ225HF40I3G - 224K-Cell 500 MHz FPGA | Altera
Altera EP2AGZ225HF40I3G is a high-density Arria II GZ field-programmable gate array built on 40 nm technology, integrating 224,000 logic cells, supporting a 500 MHz device frequency, and supplying 734 user I/O in a 1517-pin FC-FBGA package. Its listed core supply voltage is 0.9 V. The industrial-grade device belongs to a programmable-logic family used where deterministic hardware parallelism, high pin count, and reconfigurable interfaces must coexist in one component. An FPGA is a semiconductor containing configurable logic blocks, routing resources, memory, and programmable I/O. In the hierarchy of electronic components, an FPGA sits between conventional programmable logic and higher-density application-specific system integration. Engineers configure these resources to implement processors, interface bridges, signal-processing datapaths, and control logic, then revise the design after fabrication without replacing the entire IC. The EP2AGZ225HF40I3G headline parameters are 224,000 cells, 500 MHz operation, and 734 I/O. Its 1517-pin FC-FBGA package supports the large number of external connections required by data-intensive systems. The 0.9 V core-voltage entry and 40 nm process indicate the process node and nominal operating point available from the verified product listing. The I3G suffix is reported as the industrial ordering option, while the exact associated temperature rating and speed-grade limits require manufacturer documentation before production use. Technically, the device combines a substantial programmable fabric with hundreds of general-purpose I/O. That combination allows parallel protocol handling, custom arithmetic, state-machine control, and data-format conversion within the same device. Board-level power integrity becomes important because a large BGA has many simultaneous switching outputs, short return paths, controlled impedance traces, and local decoupling must be designed together. Configuration storage, clock distribution, and I/O-bank planning also affect deterministic behavior. Typical applications include telecommunications switching and protocol conversion, industrial imaging and machine-vision processing, test and measurement equipment, high-performance networking equipment, digital-signal-processing systems, and aerospace or defense prototyping. Its 734 I/O and 224,000-cell capacity make it relevant when fixed-function controllers lack required parallelism or when system requirements are expected to evolve. The principal trade-off is integration and flexibility versus design complexity, power, pin escape, and verification effort. A 1517-pin FC-FBGA requires a carefully planned multilayer PCB, complete ball assignment, signal-integrity review, robust power delivery, thermal analysis, and an appropriate device-programming flow. The 500 MHz figure should not be treated as a guarantee for every user design because actual performance depends on routing, logic utilization, timing constraints, and the selected configuration. This page combines the verified manufacturer-family parameters, current distributor availability, explicit data gaps, and drop-in screening rules to support engineering research. It distinguishes searchable facts from parameters that must be confirmed from the complete manufacturer datasheet or device documentation before schematic sign-off, PCB release, or substitution approval.
EP2AGZ225HF40I3N - Arria II GZ FPGA, 224K LE, 1517-FBGA | Intel
The Intel (formerly Altera) EP2AGZ225HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 224,000 logic elements, 14,248,960 bits of embedded memory, and 734 user I/Os in a 1517-ball Flip-Chip BGA (FCBGA) package. It belongs to the Arria II GZ family, which targets mid- to high-bandwidth applications requiring transceivers up to 6.375 Gbps, dedicated DSP blocks, and high-speed external memory interfaces. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs allow hardware engineers to implement custom digital logic, signal-processing pipelines, and interface protocols by writing hardware description language (HDL) code rather than fabricating a custom silicon die. Arria II GZ parts in particular bridge the gap between the lower-cost Cyclone and high-end Stratix families, making them common in mid-range communications, broadcast, and ASIC prototyping workloads. Key features of the EP2AGZ225HF40I3N include 8,960 LABs (Logic Array Blocks) and 736 embedded multipliers (18x18) for DSP, along with PCIe Gen1/Gen2 hard IP blocks, multiple PLLs, and high-speed transceivers capable of 6.375 Gbps operation. The 1517-FCBGA package uses flip-chip land-grid technology that supports the device's high I/O count and signal-integrity requirements for multi-gigabit interfaces. The "I3" speed grade and industrial temperature rating make it suitable for thermally and electrically demanding environments beyond standard commercial ranges. Typical applications include high-speed serial protocol bridging, ASIC and ASSP prototyping, broadcast video processing, test and measurement instrumentation backplanes, and PCIe-based add-in cards. Engineers choose this device when they need more logic density than Cyclone V can offer but do not require the transponder counts and memory bandwidth of Stratix IV/V. The HF40 suffix designates a specific BGA package and pinout, which must be matched exactly when designing a PCB footprint. When designing with this part, plan for multi-layer PCB stack-ups with controlled-impedance routing for the transceiver channels, multiple decoupling capacitors near the balls, and a robust thermal management strategy - the flip-chip BGA dissipates significant power under heavy utilization. Quartus II is the primary development environment; only specific Quartus versions support Arria II GZ, and the latest service packs should be installed before tape-out. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2AGZ225HF40I4G - 225K LE Arria II GZ FPGA, 1517FBGA | Intel
The Intel (formerly Altera) EP2AGZ225HF40I4G is a high-density Arria II GZ field-programmable gate array (FPGA) with 225,000 logic elements, housed in a 1517-ball Flip-Chip BGA (FBGA) package. Built on a 40nm process, this FPGA delivers up to 734 user I/O pins, 12.5 Gbps transceiver support, and embedded transceivers for high-speed serial connectivity in communications, broadcast, and high-performance compute systems. A field-programmable gate array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed after manufacture to implement arbitrary digital functions - bridging the flexibility of software and the performance of dedicated hardware. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> SoC FPGA, and are used wherever parallelism, low latency, or hardware-level customization is required. Key features of the EP2AGZ225HF40I4G include 8.4 Mbits of embedded memory, 1,158 embedded 18x18 multipliers (DSP blocks), up to 734 user I/O supporting LVDS, LVTTL, LVCMOS, and HSTL/SSTL standards, and PCIe Gen1/Gen2 hard IP blocks. The HF40 package code indicates a flip-chip BGA at the industrial temperature grade. The integrated 8.5 Gbps transceivers make it suitable for chip-to-chip and backplane serial links. The Arria II GZ architecture combines a logic array, M20K memory blocks, variable-precision DSP blocks, and dedicated PHY hard IP, allowing designers to implement high-throughput pipelines without consuming fabric for I/O serialization. Compared with smaller Cyclone or older Stratix devices, the EP2AGZ225HF40I4G targets mid-to-high bandwidth applications where transceiver count and logic density matter more than absolute lowest cost. Typical applications include wireless baseband processing, high-speed data acquisition, video broadcast and pro-AV pipelines, military and aerospace signal processing, and ASIC prototyping. The 1517-FBGA package provides high signal and power pin density but requires multi-layer PCB design with controlled-impedance routing for the transceiver lanes. When designing with this device, use the Quartus Prime design software and the Arria II GZ device handbook for transceiver channel modeling, pin-out assignments, and power estimation. Thermal management is critical at full transceiver utilization - the FBGA substrate must be paired with a heatsink or cold plate rated for the calculated junction-to-ambient thermal resistance. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet.
EP2AGZ225HF40I4N - Arria II GZ 224k LE FPGA | Intel | 1517-BGA
The Intel EP2AGZ225HF40I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) IC with 734 user I/Os, 14,248,960 bits of embedded memory, 224,000 logic elements, and a 40 nm low-power process node. It is housed in a 1517-ball FC-FBGA (FCBGA) package at 0.9V core. The Arria II GZ is part of Intel's (formerly Altera's) cost-optimized mid-range transceiver FPGA family targeting high-speed serial and memory-rich designs. Key features include up to 1.5 GHz internal clocking, embedded 18x18 multipliers, hardware DSP blocks, and high-speed transceivers up to 6.375 Gbps. The device is designed specifically for ease-of-use with a cost-optimized 40 nm low-power programmable logic engine and streamlined transceivers and I/Os. The 'I4' speed grade, industrial operating temperature range (-40C to +100C), and 'N' lead-free designation make this part the highest-density member of the Arria II family for data-acquisition and DSP-heavy cards. Typical applications include wireless infrastructure baseband cards, 4G/LTE protocol processing, military signal-intelligence accelerators, broadcast video processing, and high-speed serial backplane interface cards. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2AGZ300FF35C3G - Arria II GZ FPGA, 300K LE, 35mm FCBGA | Intel
The Intel EP2AGZ300FF35C3G is a high-density Arria II GZ field-programmable gate array (FPGA) delivering up to 300,000 logic elements, 17,133 Kbit embedded memory, and sixteen 6.375 Gbps transceivers in a 1152-ball flip-chip BGA package. Housed in the FF35 FCBGA (35mm body), the device is built on a 40 nm process and is intended for high-bandwidth communication, signal processing, and PCIe Gen2 endpoint/root-port designs. Commercial temperature grade (C suffix) is supported at 0 C to 85 C junction, while speed grade 3 positions it in the mid-performance bin of the family. A field-programmable gate array (FPGA) is a programmable logic device whose architecture is dominated by an array of configurable logic blocks (CLBs), embedded RAM blocks (M9K/M144K), DSP blocks, clock networks, and programmable I/O. FPGAs sit above microcontrollers and fixed-function ASICs in flexibility, allowing designers to implement arbitrary digital logic, parallel datapaths, and high-speed serial protocols while retaining the ability to re-spin functionality in firmware. The Arria II GZ family specifically targets mid-range transceiver-rich applications that previously required custom ASICs, providing hardened PCI Express Gen2, 10 Gigabit Ethernet XAUI, and DDR3 memory controllers. Key features include sixteen 6.375 Gbps transceivers, twelve embedded PCIe Gen2 controllers, support for DDR3 at up to 800 MHz, and 8-input adaptive logic modules (ALMs) for fine-grained arithmetic. The device integrates 1,288 user I/Os distributed across 12 I/O banks, providing flexible voltage and signaling standards support including LVDS, LVCMOS, SSTL, and HSTL. Hard IP blocks for PCIe Gen2 x8 and 10GbE XAUI accelerate protocol implementation while preserving logic resources for application code. Architecturally the EP2AGZ300FF35C3G implements a multi-track routing fabric with a Quartus Prime place-and-route toolchain. Hard memory controllers and transceiver PCS/PMA blocks deliver deterministic performance, while the device's 28 nm-equivalent geometry (40 nm) balances static and dynamic power for air-cooled deployments. The flip-chip BGA package exposes a full land grid that maps all transceivers and most user I/Os to the PCB without wire-bond parasitics, enabling clean 6 Gbps signaling. Typical applications include 10 GbE line cards, LTE baseband processing, software-defined radio (SDR) platforms, medical imaging accelerators, and broadcast video processing. Designers can pair this FPGA with companion DDR3 memory (e.g., MT41J256M16), clock generators (e.g., CDCE62005), and power management ICs (e.g., TPS54xxx series) to assemble a complete high-throughput system. When designing with the EP2AGZ300FF35C3G, engineers must consider 64-channel GT power sequencing requirements, controlled-impedance routing for 6 Gbps transceivers, and thermal management of the FF35 FCBGA under sustained switching load. Reference Quartus Prime pin planning, transceiver toolkit, and SignalTap II for bring-up. This page synthesizes Intel datasheet specifications, distributor pricing and stock, same-brand drop-in alternatives from the Arria II GZ family, and practical design notes not found in any single source document.
EP2AGZ300FF35C3N - 298K LE Arria II GZ FPGA 1152-BGA | Intel
The Intel (formerly Altera) EP2AGZ300FF35C3N is a high-density Arria II GZ Field Programmable Gate Array (FPGA) delivering 298,000 logic elements, 18,854,912 bits of embedded RAM, and 1,152 user I/Os in a 1152-ball FineLine BGA (FCBGA) package. Built on a 40 nm process, the EP2AGZ300FF35C3N supports core voltage of 0.9 V with transceiver and I/O banks optimized for high-speed serial and parallel interfaces, targeting mid-to-high bandwidth applications including telecommunications backplanes, broadcast video processing, and high-performance DSP pipelines. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement custom digital circuits without the cost of ASIC tooling. FPGAs sit within the programmable logic device family, alongside CPLDs, and are distinguished from ASICs, ASSPs, and microcontrollers by hardware-reconfigurability, parallel processing fabric, and integrated high-speed transceivers. Arria II GZ devices occupy Intel's mid-range, transceiver-equipped tier between Cyclone (cost-optimized) and Stratix (high-end) families. Key features of the EP2AGZ300FF35C3N include up to 16 transceivers supporting data rates up to 6.375 Gbps, embedded hard memory controllers (DDR3 with ECC), up to 8 PLLs, and 1,152 user I/O pins distributed across 24 I/O banks supporting LVDS, LVCMOS, HSTL, and SSTL standards. The device integrates 11,920 Logic Array Blocks (LABs) and 554 18x18 multipliers, enabling high-throughput signal processing tasks such as forward-error correction and video scaling. Typical applications for the EP2AGZ300FF35C3N span 40G/100G telecom line cards, software-defined radio (SDR) baseband processing, video broadcast encoders/decoders, high-resolution medical imaging systems, and ASIC prototyping for high-speed serial protocols. The 6.375 Gbps transceiver capability combined with 18 Mbit embedded RAM makes this device especially well-suited for packet processing and SerDes aggregation in carrier-grade equipment. When designing with the EP2AGZ300FF35C3N, ensure the PCB has at least 12 layers with controlled-impedance routing for the 6.375 Gbps serial links, and provision multiple decoupling capacitors (0.1 uF, 0.01 uF, and bulk) near every power pin. Thermal dissipation is significant: estimated at 15-25 W typical, requiring forced airflow or a heatsink attachment to the top of the FCBGA package. Programming is via JTAG or Active Serial configuration scheme using an EPCS or EPCQ configuration device. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single source for sourcing the EP2AGZ300FF35C3N.
EP2AGZ300FF35C4G - 300K LE Arria II GZ FPGA 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGZ300FF35C4G is a high-density Arria II GZ FPGA delivering 300,000 logic elements with 16,624 Kbit embedded memory, packaged in a 1152-ball FineLine BGA at industrial temperature grade C4 (0°C to 85°C), speed grade 4. Built on a 40 nm TSMC low-power process, it integrates 8.1 Gbps transceivers, DDR3 memory controllers, and DSP blocks for high-bandwidth signal processing in communications, broadcast, and military systems. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, dedicated DSP slices, and on-chip memory that engineers can reconfigure post-manufacturing to implement custom digital circuits, parallel processing pipelines, or hardware accelerators. Within the system hierarchy, the FPGA sits between ASICs (high NRE, fixed function) and microcontrollers (sequential, software-driven), offering hardware-level parallelism with software-like design flexibility. The Arria II GZ family specifically targets mid-range applications requiring transceivers, DSP, and high-speed memory interfaces without the cost of Stratix-class FPGAs. Key specifications include 300,000 logic elements, 16,624 Kbits of embedded memory (M9K + M144K blocks), 736 embedded 18x18 multipliers, 16 global clock networks, and up to 554 user I/O pins. The device integrates 12 transceivers supporting data rates up to 6.375 Gbps (C4 speed grade) for chip-to-chip, backplane, and optical module interfaces. It features a hard PCIe Gen2 controller, hardened DDR3 memory interface up to 800 MHz, and up to 4 PLLs per quadrant. Architecturally, the EP2AGZ300FF35C4G uses Altera's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, providing higher logic utilization than 4-input LUT architectures. The 40 nm process delivers static power reduction through variable voltage scaling (0.85V core to 1.1V I/O) and supports partial reconfiguration, allowing live logic swap without halting operation. Typical applications include wireless baseband processing, broadcast video encoders, military radar signal processing, and high-speed serial protocol bridging. Designers select the Arria II GZ when they need transceiver-rich, DSP-heavy FPGAs below Stratix IV cost points, typically above 200K logic elements where Cyclone V becomes resource-limited. When designing with this device, plan power integrity early: a 300K-LE Arria II GZ at full utilization can draw 15-20W, requiring multi-rail VRM design with proper decoupling. Quartus II software is mandatory for synthesis, place-and-route, and configuration bitstream generation. Lead time for engineering samples is typically 8-12 weeks through authorized distributors. This page synthesizes distributor pricing, verified Arria II GZ family specifications, and practical design notes not consolidated in any single manufacturer datasheet.
EP2AGZ300FF35C4N - Arria II GZ FPGA 298K LE 1152-FCBGA | Intel
The Intel (Altera) EP2AGZ300FF35C4N is a high-density Arria II GZ field-programmable gate array (FPGA) integrating 298,000 logic elements, 18,854,912 bits of embedded memory, and 554 user I/O in a 1152-ball flip-chip BGA package, fabricated on a 40 nm low-power process and specified for industrial-grade operating conditions. A field-programmable gate array (FPGA) is a class of programmable logic device that combines configurable logic blocks (LBs), programmable interconnect, dedicated memory, and hardened I/O serializers on a single die. Within the broader semiconductor hierarchy, an FPGA sits between a general-purpose microcontroller and a fully custom ASIC: it offers ASIC-level parallelism and throughput with mask-set reprogrammability, placing it in the family of programmable logic devices (PLDs) that includes CPLDs and SPLDs as smaller-density counterparts. The Arria II GZ family specifically targets mid- to high-bandwidth applications requiring transceivers, moderate DSP throughput, and low static power. Key headline specifications include 298,000 logic elements distributed across 11,920 logic array blocks (LABs), 18,854,912 bits (approximately 17.9 Mbit) of embedded SRAM, integrated PLLs, and high-speed transceivers capable of multi-gigabit serial links. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with user-selectable drive strength and slew rate. Internal configuration memory is SRAM-based, requiring a configuration flash or controller at power-up. The 1152-ball FCBGA package exposes the full I/O count and provides a low-inductance power/ground distribution network. Architecturally, the EP2AGZ300FF35C4N combines the Altera Adaptive Logic Module (ALM) with 8-input fracturable look-up tables, dedicated multiplier blocks, and MLAB memory blocks. The 40 nm process delivers static power roughly 50% lower than the prior 65 nm Arria GX generation while supporting enhanced logic packing and faster timing closure. Built-in transceivers, PCI Express hard IP, and external memory interfaces (DDR2/DDR3) reduce external component count for typical designs. Typical applications include high-definition video broadcasting, wireless baseband processing, military radar signal processing, industrial machine vision, and high-speed serial protocol bridging. The combination of large logic capacity and integrated transceivers suits designs that would otherwise require a discrete processor plus external PHY. Designers should plan power sequencing early - Arria II GZ requires multiple supply rails (core, I/O, transceiver, auxiliary) with specific monotonicity and ramp-rate constraints. The 1152-ball FCBGA also demands multi-layer PCB stack-up with buried vias and matched-length trace routing for the DDR3 interface, so floorplanning and signal-integrity simulation should begin before schematic capture. This page synthesizes distributor pricing, drop-in alternatives from the same Arria II GZ family, and practical PCB design guidance that complements the manufacturer datasheet.
EP2AGZ300FF35I3G - 300K LE Arria II GZ FPGA 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGZ300FF35I3G is a high-density Arria II GZ family Field-Programmable Gate Array (FPGA) delivering approximately 300K logic elements (LE), 554 maximum user I/Os, and 8 high-speed transceivers, housed in a 1152-ball FineLine BGA (FBGA-1152) package. It is built on a 40 nm low-power process, operates over the industrial temperature range, and targets performance-critical applications such as high-speed serial interfaces, video bridging, and digital signal processing. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the larger integrated circuit family. FPGAs sit alongside ASICs and CPLDs in the digital logic hierarchy and consist of an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, on-chip memory (BRAM), and high-speed serial transceivers. The Arria II GZ family is positioned in Intel's mid-to-high-end portfolio between Cyclone (low-power, low-cost) and Stratix (highest performance), offering a balance of density, transceiver speed, and price. Key features include up to 8 transceivers supporting data rates up to 6.375 Gbps, 16.4 Mbits of embedded memory, dedicated hardware DSP blocks for high-throughput arithmetic, support for external memory interfaces including DDR3, QDRII+, and RLDRAM II, and a wide operating frequency range. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and offers a PLL-per-region architecture for precise clock management. The Arria II GZ architecture integrates dedicated hardware multipliers, variable-precision DSP blocks, and TriMatrix memory blocks for efficient implementation of signal processing pipelines. Its transceiver blocks support PCIe Gen1/Gen2, XAUI, CEI-6G, and serial RapidIO protocols. Designers can configure the device via Intel Quartus II design software, which supports Verilog, VHDL, and SystemVerilog through a synthesis-based flow. Typical applications include high-definition video processing and bridging, telecommunications infrastructure (baseband and backhaul), test and measurement equipment, medical imaging systems, and high-performance computing accelerators. The combination of high logic density and multi-gigabit transceivers makes it well suited for designs requiring both heavy parallel processing and chip-to-chip serial connectivity. When designing with this device, pay close attention to PCB layout for BGA breakout routing and power distribution network (PDN) design. The 1152-ball FBGA package requires multi-layer PCB stack-up (typically 12+ layers) with controlled-impedance traces for the 6.375 Gbps transceiver channels. Decoupling capacitors must be placed directly under the BGA balls to maintain signal integrity. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, package-specific design considerations, and a structured FAQ not found in the manufacturer datasheet alone, all verified against Intel's official EP2AGZ300 family datasheet and current distributor inventory as of 2026-09-08.
EP2AGZ300FF35I3N - 298K LE Arria II GZ FPGA, 554 I/O, FC-FBGA-1152
The Altera (Intel) EP2AGZ300FF35I3N is a high-density, high-performance Arria II GZ Field-Programmable Gate Array (FPGA) fabricated on a 40 nm process, delivering 298,000 logic elements, 18,854,912 bits of embedded memory, and 554 user I/O in a 1152-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA-1152) package. Core voltage is 0.9 V, and the part is graded for the industrial temperature range (the trailing I3 in the part number) and ships in tray packaging. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader semiconductor hierarchy of integrated circuits. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened IP blocks such as transceivers and DSP slices that engineers can reconfigure after manufacture. The Arria II GZ family sits between the lower-cost Cyclone series and the high-end Stratix series in the Altera/Intel portfolio, targeting mid-to-high bandwidth applications that need transceivers and DSP but where the absolute highest logic density or transceiver count is not required. Key differentiating features of the EP2AGZ300FF35I3N include its 298,000 logic elements, 11,920 Logic Array Blocks (LABs), dedicated on-chip transceivers capable of multi-gigabit serial I/O, embedded DSP blocks for high-throughput signal processing, and 18.85 Mbits of distributed and block RAM. The 40 nm process node balances static and dynamic power, while the FC-FBGA-1152 package provides the high pin count required to expose 554 user I/O plus the dedicated configuration, power, and JTAG pins. Architecturally, Arria II GZ devices combine a fabric of adaptive logic modules (ALMs) with hard IP for transceivers, external memory interfaces (DDR3 controllers), and PCI Express Gen2 endpoints. The 35 in FF35 indicates a 35 mm x 35 mm package body with a 1.0 mm ball pitch, which is the largest package option in this family and is required to accommodate the 554 I/O count. Typical applications include high-speed data acquisition, wireless baseband processing, radar and electronic warfare front-ends, broadcast video processing, military and aerospace signal processing, and high-performance computing accelerators. Designers choose this part when they need a large logic and memory budget with industrial-grade temperature support. When designing with the EP2AGZ300FF35I3N, pay close attention to PCB layer stack-up and BGA breakout routing because the 1.0 mm ball pitch demands HDI technology (microvias, sequential lamination). Use the Altera Quartus II design suite (or its modern equivalent for legacy device support) for synthesis, place-and-route, and bitstream generation. The 0.9 V core must be supplied by a multi-rail PMIC or DC-DC solution with adequate decoupling. This page synthesizes distributor inventory, lifecycle context, drop-in same-package alternatives drawn from the same Arria II GZ family, and practical design notes not consolidated in a single manufacturer document.