FPGA & CPLD
Products (6357)
EP2AGZ350FF35I3 - Arria II GZ 350K LE FPGA | Intel FPGA
The Intel (Altera) EP2AGZ350FF35I3 is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) featuring 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 maximum user I/O pins, all integrated into a 1152-ball flip-chip BGA (FCBGA) package. The device is built on a 40nm low-power process and supports transceiver data rates up to 6.375 Gbps, making it well matched to mid-range serial-protocol bridging, video processing, and high-throughput DSP pipelines. An FPGA (field-programmable gate array) is a class of programmable logic device whose function is determined by user-defined configuration rather than fixed silicon. Within the broader programmable logic taxonomy, FPGAs rank alongside CPLDs (complex programmable logic devices) under the umbrella of programmable logic, sitting above fixed-function ASICs only in flexibility and below microcontrollers in ease of programming. Arria II GZ devices were specifically optimized for transceivers, DSP blocks, and on-chip memory bandwidth, bridging the gap between Cyclone (cost-optimized) and Stratix (performance-optimized) families. Key features of the EP2AGZ350FF35I3 include up to 16 transceivers operating at 6.375 Gbps, dedicated variable-precision DSP blocks totaling approximately 1,368 18x19 multipliers, 554 user I/O supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards, and an industrial operating range (-40C to +100C junction). On-chip PLLs support clock synthesis for multi-gigabit transceivers, memory interfaces including DDR3, and general-purpose system clocks. Hard memory controllers and PCIe Gen2 hard IP blocks reduce soft-logic footprint and improve timing closure. Typical applications for this device include high-resolution broadcast video processing, wireless baseband aggregation, medical imaging pipelines, radar signal processing, and protocol bridging between PCIe, Serial RapidIO, and 10 Gigabit Ethernet. The industrial temperature grade also supports defense and aerospace subsystems where extended thermal range is mandatory. The combination of logic density and high-speed serial I/O makes the EP2AGZ350FF35I3 a flexible mid-tier platform for ASIC prototyping and pre-silicon validation. When designing with this device, ensure your PCB BGA escape routing respects the 1.0 mm ball pitch and that the flip-chip thermal pad is properly soldered to a sufficient copper area. Use Altera Quartus II design software for synthesis, place-and-route, and timing analysis. Carefully review transceiver reference clock jitter, which directly limits the achievable Gbps rate.
EP2AGZ350FF35I3G - Arria II GZ FPGA 350K LE | 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGZ350FF35I3G is a high-density Arria II GZ Field Programmable Gate Array (FPGA) delivering 350,000 logic elements, 21,270,528 bits of embedded memory, and 17.4 Mbit of RAM in a 1152-ball Flip-Chip BGA (FBGA) package. Per the DigiKey listing, the device exposes 554 user I/O pins and supports the -I3 industrial speed grade, balancing performance and power for high-throughput signal-processing applications. The 'G' suffix denotes Pb-free (lead-free) termination, while the absence of an 'N' denotes tray packaging rather than tape-and-reel. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a configurable logic-block matrix interconnected by a programmable routing fabric. The Arria II GZ family sits in Intel's mid-range transceiver-equipped tier between Cyclone (low-cost) and Stratix (high-performance), making it well suited for high-speed serial I/O, digital signal processing (DSP), and embedded memory-intensive designs. FPGAs differ from ASICs in being reprogrammable post-fabrication, which compresses development cycles and supports late-stage design changes. Key features of the EP2AGZ350FF35I3G include 350K logic elements (LEs), 17.4 Mbit embedded memory, embedded DSP blocks for high-throughput arithmetic, multi-gigabit transceivers, and 554 user I/Os. Per the GlobalSpec datasheet listing, the part is built on a 40 nm process node, supports DDR3 external memory interfaces, and includes dedicated hard IP for PCI Express Gen2 and 10 Gigabit Ethernet MACs. The 1152-FBGA flip-chip package enables high pin density and superior electrical/thermal performance compared to wire-bond variants. Architecturally, the Arria II GZ fabric combines adaptive logic modules (ALMs), M20K memory blocks, and variable-precision DSP blocks. The I3 speed grade represents a mid-bin timing/performance tradeoff versus the I4 and I5 grades, allowing designers to trade margin for cost. The device supports configuration via passive serial, fast passive parallel, JTAG, and encrypted bitstreams. Typical applications include high-performance digital signal processing (radar, beamforming, wireless baseband), high-speed serial protocol bridging (PCIe Gen2, 10GbE, Serial RapidIO), test and measurement instrumentation, and broadcast video processing. The wide transceivers and DSP density also make the device useful for medical imaging and aerospace flight-control prototyping. When designing with this device, ensure the PCB has a 1.0 mm or 0.8 mm pitch BGA fanout with microvia stack-ups, because the 1152-ball package demands high-density interconnect (HDI) board technology. Power integrity analysis with the Intel Early Power Estimator is recommended before PCB layout commit. This page synthesizes distributor stock, life-cycle context for the legacy Arria II GZ family, drop-in same-package variants, and practical design notes not consolidated in the manufacturer datasheet.
EP2AGZ350FF35I3N - Arria II GZ FPGA, 350K LE, 1152-FBGA | Altera
The Altera EP2AGZ350FF35I3N is a high-performance Arria II GZ Field Programmable Gate Array (FPGA) with 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/Os, housed in a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package. Built on a 40nm low-power process, it operates at a 0.9V core supply with industrial temperature grade support and integrates 24 transceivers capable of up to 6.375 Gbps data rates. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can program to implement any digital logic function after manufacturing. FPGAs sit above ASICs and microcontrollers in the design flexibility hierarchy, providing parallel hardware execution with deterministic latency. The Arria II GZ family targets mid-range transceiver-based applications bridging Stratix IV performance with Cyclone IV cost efficiency. Key features include 13,940 Logic Array Blocks (LABs), 16 global clock networks, 8 PLLs, dedicated DSP blocks for high-speed arithmetic, and hard PCI Express Gen1/Gen2 IP blocks. The device supports DDR3 external memory interfaces up to 800 Mbps and integrates transceivers compliant with CPRI, OBSAI, Serial RapidIO, and 10 Gigabit Ethernet protocols, making it well suited for communication infrastructure. The EP2AGZ350FF35I3N uses a transceiver-rich architecture with embedded SERDES, hard memory controllers, and a structured ASIC-like logic fabric. The 40nm process and 0.9V core voltage balance switching performance against dynamic power, while the FC-FBGA package exposes the silicon die backside for thermal dissipation through a heatsink. Typical applications include wireless baseband processing, software defined radio, radar signal processing, high-performance DSP pipelines, and 10G/40G networking line cards. The integrated transceivers eliminate external PHY ICs, reducing BOM cost and PCB area in dense systems. When designing with this device, plan thermal management carefully β a 1152-ball FC-FBGA typically dissipates 8β15W in transceiver applications and requires a heatsink plus adequate airflow. Use Altera Quartus II for synthesis, place-and-route, and power estimation, and verify all transceiver channels with the Arria II Transceiver Toolkit. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone β giving engineers a single-source decision aid for sourcing, replacement, and layout planning.
EP2AGZ350FF35I4 - Arria II GZ FPGA 350K LE, 1152-FBGA | Intel
The Intel (Altera) EP2AGZ350FF35I4 is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/O in a 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) package. Designed for mid- to high-end DSP, serial connectivity, and memory-rich designs, the Arria II GZ family integrates up to 16 transceivers operating up to 6.375 Gbps, dedicated variable-precision DSP blocks, and hard memory controllers for DDR3/QDRII+/RLDRAM II interfaces. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit above CPLDs and structured ASICs in the programmable-logic hierarchy, providing the highest logic density and the richest hard-IP block mix. The Arria II GZ family is positioned in the mid-range between Cyclone (low-cost) and Stratix (high-performance) families, with transceiver and DSP capability approaching Stratix IV at lower static power. The device supports core voltage of 0.9 V with separate transceiver and I/O supply rails. Embedded memory includes 9-bit parity-protected M9K blocks plus 144-bit wide MLAB blocks, totaling up to 21.27 Mbits. Up to 16 full-duplex transceiver channels support protocols including PCIe Gen2 (x4/x8), Serial RapidIO, 10 GbE XAUI, CPRI, and CEI-6G. Variable-precision DSP blocks implement 18x18 multipliers with adders, accumulators, and 36-bit precision support, enabling >500 MHz DSP performance for wireless baseband and video processing. Typical applications include wireless baseband processing (LTE, WiMAX, 3G), high-definition video broadcast and image processing, military and aerospace signal processing, medical imaging, high-speed serial backplane bridging, and ASIC prototyping. The combination of 6.375 Gbps transceivers and ~350K LEs makes the part a common choice for designers migrating from Xilinx Virtex-6 or Stratix IV class devices to a more power-efficient mid-range fabric. Key design considerations include the Flip-Chip BGA requiring a multilayer PCB with controlled-impedance transceiver channels, matched-length differential pairs, and substantial decoupling. The 35x35 mm package demands careful thermal management, and the 0.9 V core typically requires an Altera-recommended power-supply sequencer. Configuration is via JTAG, fast passive parallel, or fast active serial flash. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with a focus on real cross-references and AEC/industrial variant comparison.
EP2AGZ350FF35I4G - Arria II GZ FPGA 350K LE | Intel | 1152-FBGA
The Intel (formerly Altera) EP2AGZ350FF35I4G is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) housed in a 1152-ball Flip-Chip BGA (FCBGA) package. The device integrates approximately 350,000 logic elements, 21,270 Kbits of embedded memory (M9K + M144K blocks), 554 maximum user I/O pins, and up to 16 high-speed transceivers delivering up to 6.375 Gbps per channel for high-bandwidth serial links. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, memory controllers, and DSP blocks. FPGAs occupy a distinct position in the programmable logic hierarchy: below ASICs in per-unit cost and power at very high volumes, but above microcontrollers and DSPs in raw parallel processing throughput and reconfigurability. The Arria II GZ family specifically targets mid-range applications that require transceivers, moderate logic density, and cost-effective 40nm process technology. Key features of the EP2AGZ350FF35I4G include support for DDR3 memory interfaces up to 800 Mbps, integrated PCI Express hard IP blocks (Gen1/Gen2), up to 8 PLLs, and a high-performance DSP block architecture. The 40nm process node balances static and dynamic power while preserving high core performance for signal-processing pipelines. The industrial temperature grade (I4 suffix, -40C to +100C ambient) suits outdoor, automotive, and industrial-control deployments. The architecture combines dedicated transceiver circuitry with general-purpose FPGA fabric, allowing designers to implement custom high-speed protocols alongside parallel DSP, packet processing, or embedded-processor (Nios II) subsystems. With 18x18 multipliers and dedicated accumulator chains, the device accelerates FFT, FIR, and matrix operations common in wireless baseband and video processing. Typical applications include wireless LTE/4G baseband cards, high-speed serial backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of 16 transceivers and high logic density makes it well suited for applications bridging multiple high-speed serial interfaces. When designing with this device, careful attention to power integrity (multiple 0.9V/1.1V/1.5V/2.5V rails), thermal management of the 35mm BGA, and signal-integrity routing for SERDES lanes is essential. Reference Quartus II design examples demonstrate reference implementations for DDR3 controller, PCIe Gen2 endpoint, and CPRI/OBSAI interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes compiled from the Altera/Intel datasheet family and authorized distributor listings as of 2026-09-08.
EP2AGZ350FF35I4N - 350K LE Arria II GZ FPGA, 1152-BGA | Intel
The Intel EP2AGZ350FF35I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 554 user I/O pins in a 1152-ball FC-FBGA package. Built on a 40nm CMOS process, the device targets mid- to high-performance digital signal processing, high-speed serial interfacing, and memory-intensive designs that previously required ASIC-class integration. An FPGA (Field-Programmable Gate Array) is a reconfigurable logic device containing programmable logic blocks, interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism with the flexibility of post-silicon reconfiguration. The Arria II GZ family specifically targets transceiver-rich applications with up to 16 embedded transceivers per device and is fabricated at a 0.9V core voltage for power efficiency at high toggle rates. Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers for DSP, dedicated memory interface circuitry supporting DDR3, and up to 16 high-speed transceivers operating up to 6.375 Gbps. The I4 speed grade and industrial temperature rating (-40C to +100C die junction) make this part suitable for harsh-environment embedded applications. The FC-FBGA-1152 package is a 35 mm x 35 mm flip-chip BGA optimized for high signal-integrity performance on multi-layer PCBs. Architecturally, the Arria II GZ uses a logic-rich fabric paired with 8-input adaptive logic modules (ALMs), enabling efficient implementation of wide functions, register-rich pipelines, and arithmetic-intensive datapaths. Hard IP blocks for PCIe Gen2, memory controllers, and multi-gigabit transceivers offload common I/O functions from soft logic, freeing fabric resources for application logic. The 40nm process provides a favorable balance of static power, dynamic performance, and cost per logic element. Typical applications include high-performance DSP for radar and medical imaging, 40G/100G wireline data path processing, broadcast video infrastructure, ASIC prototyping, and high-throughput data acquisition. The combination of 21 Mbits of embedded memory and 720 embedded multipliers (18x18) supports large FFTs, channelizers, and baseband processing blocks. When designing with the EP2AGZ350FF35I4N, ensure the PCB uses a 1.0 mm BGA pitch and matched-impedance routing for transceiver lanes. The Quartus II design software (13.1 or later) is required for synthesis, place-and-route, and timing closure. Thermal management must consider a 35 x 35 mm BGA footprint with the exposed-die flip-chip construction. This page synthesizes distributor pricing, drop-in package-matched alternatives, and practical board-design notes not found in the manufacturer datasheet, supporting both component selection and supply-chain decisions.
EP2AGZ350FH29C3G - 350K LE Arria II GZ FPGA | Intel | 780-HBGA
The Intel (formerly Altera) EP2AGZ350FH29C3G is a high-density, high-performance Arria II GZ FPGA delivering 350K logic elements, 281 user I/O pins, and 16.4 Mbits of embedded memory in a 780-ball FineLine BGA (FBGA) package. Built on a 40 nm low-power process, the device integrates 8.5 Gbps transceivers, hard PCI Express Gen2 controllers, and dedicated DDR3 memory interfaces, making it a drop-in choice for mid-range ASIC-replacement and high-speed serial-link designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that uses configurable logic blocks (CLBs), routing switches, and I/O cells to implement arbitrary digital functions after manufacturing. Positioned in the broader programmable logic hierarchy as FPGA > programmable logic > logic IC > semiconductor, Arria II GZ sits in the mid-density segment between Cyclone (low-cost) and Stratix (high-end) families, targeting price/performance-sensitive applications that still need multi-gigabit transceivers. Key features of the EP2AGZ350FH29C3G include 350K logic elements, up to 16.4 Mbits of embedded RAM, 24 transceivers supporting data rates up to 8.5 Gbps in some speed grades, 4 PCI Express hard IP blocks compliant with PCIe Gen2 x4, and dedicated external memory interfaces supporting DDR3 up to 800 MHz. The 780-HBGA package exposes 281 user I/O pins and integrates 8 dedicated clock PLL blocks. Operating junction temperature spans 0C to +85C for the commercial C3 speed grade. Architecturally, the EP2AGZ350FH29C3G uses 8-input adaptive logic modules (ALMs), 9 Kbit MLAB blocks, and TriMatrix memory structures. The 8.5 Gbps transceivers support CPRI, OBSAI, Serial RapidIO, and 10 GbE (XAUI) protocols, while hard PCIe Gen2 controllers simplify endpoint and root-port implementations without consuming logic resources. Typical applications include wireless baseband processing, military radar signal processing, broadcast video switching, and high-performance computing accelerators. The combination of high logic density, embedded transceivers, and DDR3 support suits data plane processing in telecom and datacom equipment. Designers should note that the C3 speed grade is the slower commercial tier; C4/I4/I5 grades offer higher Fmax but at higher cost. Power estimation requires Quartus II PowerPlay early in the design cycle because the device can exceed 20 W in fully-utilized configurations.
EP2AGZ350FH29C3N - Arria II GZ FPGA, 350K LE, 780-BGA | Intel
The Intel (formerly Altera) EP2AGZ350FH29C3N is a high-density, high-performance Arria II GZ Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. The device integrates 348,500 logic elements, 21,270,528 bits of embedded memory, and 281 user I/O pins, targeting mid- to high-end ASIC-prototype, signal-processing, and high-speed serial-link applications. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, interconnect, and dedicated silicon blocks such as transceivers and DSP slices. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs in the programmable-logic category and above microcontrollers for raw parallel data-path throughput. The Arria II GZ family is positioned as a transceiver-rich mid-range FPGA bridging the gap between Cyclone (low cost) and Stratix (high performance). Key features of the EP2AGZ350FH29C3N include 16 full-duplex multi-gigabit transceivers supporting data rates up to 6.375 Gbps, dedicated on-chip hard memory controllers for DDR3/DDR2/LPDDR2 with ECC, and a fine-grained logic fabric built around 8-input adaptive logic modules (ALMs). The -C3 speed grade and industrial-grade temperature suffix in the part number reflect the standard speed bin with commercial operating temperature. The 780-BGA FCBGA package supports the highest pin count in the family and exposes all 281 user I/Os alongside dedicated transceiver, clock, and configuration pins. Typical applications for this device include wireline backhaul line cards, military secure-radio baseband, ASIC prototyping, broadcast video processing, and high-performance PCIe Gen2 endpoint designs. The integrated transceivers remove the need for external SERDES in multi-gigabit links, reducing BOM cost and simplifying PCB layout. When designing with this FPGA, allocate at least four PCB layers for power, ground, and signal routing. Heat dissipation must be assessed - the FCBGA package requires thermal vias and an attached heatsink for sustained high utilization. Designers should use the latest Quartus II (Arria II GZ) or Quartus Prime software for bitstream generation and timing closure. This page consolidates distributor pricing, drop-in Altera/Intel alternatives, and practical design considerations drawn from public datasheets and reference manuals - information not assembled in a single place on the manufacturer product page.
EP2AGZ350FH29C4G - Arria II GZ FPGA 350K LE FBGA-780 | Intel
The Intel (formerly Altera) EP2AGZ350FH29C4G is a high-performance Arria II GZ field-programmable gate array (FPGA) featuring 350K logic elements, 18.4 Mbits of embedded memory, and 8.5-Gbps transceivers, housed in a 780-ball flip-chip BGA (FH29) package. The device is built on a 40-nm process and targets mid-range applications requiring a balance of logic capacity, memory bandwidth, and high-speed serial I/O. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and block RAM. FPGAs occupy the hierarchy: FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor. Arria II GZ FPGAs specifically target applications that need 8.5-Gbps transceivers and substantial DSP resources without the cost of Stratix-class silicon. Key features of the EP2AGZ350FH29C4G include 350K logic elements (LEs), 18,424 Kbits of M20K block RAM plus 1,425 Kbits of MLAB, sixteen 8.5-Gbps transceivers supporting PCI Express Gen2 and Gigabit Ethernet, 1,152 embedded multipliers (18x18), and up to 552 user I/O pins. The FH29 780-ball flip-chip BGA package supports high-speed signal integrity and a wide operating temperature range. Typical applications include high-performance digital signal processing, software-defined radio (SDR), video processing and broadcast infrastructure, ASIC prototyping, and high-speed serial connectivity in telecommunications, defense, and test-and-measurement systems. The C4 speed grade and -4 transceiver grade position the part for cost-optimized commercial applications; -I (industrial) and -I5/I6 grades exist for harsher environments. When designing with this device, ensure proper PCB layout with matched-length traces for high-speed transceivers, adequate power-rail decoupling, and thermal management via the package's exposed thermal array. Configure the FPGA using Intel Quartus II design software (or the Quartus Prime Lite edition for cost-free development).
EP2AGZ350FH29C4N - Arria II GZ FPGA, 350K LE, 780-BGA | Altera
The Altera (Intel Programmable Solutions Group) EP2AGZ350FH29C4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) integrating 350,000 logic elements, 21,270,528 bits of embedded memory (approximately 2.65 MBytes), 348,500 equivalent LEs (ALMs), and 281 user I/Os in a 780-ball flip-chip BGA (FCBGA / 780-BBGA) package. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks, transceivers, and PLLs. FPGAs belong to the broader family of programmable logic devices (PLDs) within the Integrated Circuits category. Modern FPGAs like the Arria II GZ combine this reconfigurable fabric with embedded processors, high-speed serial transceivers, and external memory controllers, occupying a position between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the system-design hierarchy. Key features of the EP2AGZ350FH29C4N include the Arria II GZ 40-nm process architecture, integrated 8-channel 6.375 Gbps transceiver support depending on die variant, hard PCI Express Gen1/Gen2 IP, dedicated DSP blocks for high-throughput signal processing, and the 780-pin flip-chip BGA package that supports high-speed signal integrity for backplane, broadcast, and wireline applications. The industrial-grade speed grade C4 supports a wide commercial/industrial operating profile. On the technical depth side, the Arria II GZ combines 8-input adaptive logic modules (ALMs) with per-LUT-register pairing, variable-precision DSP blocks supporting 9x9, 18x18, and 36x36 modes, and triplicated register blocks for soft error mitigation. Embedded memory is organized as M9K (9 Kbit) and M144K (144 Kbit) blocks, supporting true dual-port and simple dual-port configurations at up to 600 MHz. Typical applications include high-speed serial backplane interfaces (e.g. CPRI, OBSAI, Serial RapidIO), broadcast video and audio processing, software-defined radio (SDR) baseband, PCIe Gen2 endpoint/root-complex cards, test & measurement instrumentation, and high-performance DSP co-processing cards. The high logic density and abundant DSP blocks make the device a typical workhorse for telecom line cards and broadcast routers. When designing with this device, plan power-rail sequencing, thermal dissipation (FCBGA packages demand multi-layer PCB with internal copper planes and forced-air cooling at >10 W), and JTAG/Active Serial configuration. The 780-BBGA footprint requires a 1.27 mm or 1.0 mm pitch PCB design with controlled-impedance routing for transceiver channels. This page synthesizes distributor pricing, drop-in FPGA alternatives from the Arria II GZ family, and practical PCB design notes not consolidated in the manufacturer datasheet. For engineers verifying lead time and stock at authorized distributors, distributor data sources are cited inline below.
EP2AGZ350FH29I3G - Arria II GZ FPGA, 350K LE, 780-HBGA | Intel
The Intel (formerly Altera) EP2AGZ350FH29I3G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm process and offered in a 780-ball FineLine BGA (FBGA, package code FH29) at the industrial -40C to +100C temperature grade. It integrates approximately 350,000 logic elements with embedded transceivers, embedded multipliers, and a programmable logic fabric targeted at high-throughput wireline and wireless infrastructure designs. The part is listed across authorized distributors as an FPGA IC with 281 user I/O pins. Background: An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture via an HDL-defined bitstream. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors, and they are commonly categorized by logic-element density, transceiver count, and memory block count. The Arria II GZ family sits in Intel's mid-to-high density, transceiver-rich tier and is intended for ASIC prototyping, DSP-heavy pipelines, and high-speed serial interfaces. Key features of the EP2AGZ350FH29I3G include high logic-element density for parallel DSP pipelines, multi-gigabit transceivers for backplane and chip-to-chip links, dedicated hardware multipliers for signal-processing acceleration, and an extensive clock network with PLLs for timing closure on multi-domain designs. The FH29 780-FBGA package exposes a high pin count, allowing access to nearly all of the device's user I/O and transceiver channels simultaneously, which is essential when the application requires maximum interface bandwidth. Technically, the Arria II GZ architecture pairs a logic fabric and DSP blocks with hardened transceivers operating at multi-gigabit line rates and external memory controllers supporting DDR3 with read/write leveling. Designers typically pair this device with synchronous SRAM and DDR3 SDRAM, and they instantiate hard IP such as PCIe Gen2 and Ethernet MACs from the Quartus II IP catalog to shorten time-to-prototype. Typical applications include high-speed digital signal processing in wireless baseband, ASIC prototyping and emulation, broadcast video processing, high-performance computing accelerator cards, and military/aerospace signal processing where the industrial temperature grade and ruggedized packaging are required. Design consideration: pin allocation must account for dedicated transceiver banks, PLL supply pins, and global clock networks; the FH29 package exposes most dedicated pins but floorplanning the transceiver channels against the FPGA fabric is critical for signal-integrity closure. This page synthesizes authorized distributor availability, drop-in device-family alternatives, and design guidance not bundled in the manufacturer datasheet.
EP2AGZ350FH29I3N - Arria II GZ FPGA, 350K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP2AGZ350FH29I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 21,270,528 bits of embedded memory, and 281 user I/O pins, fabricated on a 40 nm TSMC process node. Housed in a 780-ball FineLine BGA (FCBGA) package, this device integrates up to 24 transceivers supporting data rates suitable for high-speed serial interfaces. The part operates across an industrial temperature range of -40C to +100C (TJ) with a core voltage of 0.87 V to 0.93 V, delivering a balance of performance and power efficiency for mid- to high-end digital designs. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined by the customer after manufacturing, rather than at the wafer fab. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and below fixed-function ASICs in cost-per-volume but above them in design flexibility. The Arria II GZ family is Intel's mid-range transceiver-equipped FPGA family, positioned between the lower-power Cyclone families and the high-end Stratix families, optimized for applications requiring integrated transceivers, DSP blocks, and significant on-chip memory. Key features include 13,940 Logic Array Blocks (LABs), embedded 18x18 multipliers supporting digital signal processing, multiple PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The 24 transceiver channels support multiple gigabit-per-second data rates, enabling protocols such as Serial RapidIO, Gigabit Ethernet, and CPRI. The 780-ball FCBGA package is suitable for high-speed designs where signal integrity demands controlled-impedance vias and short bond-wire lengths. Typical applications include wireless baseband processing, military radar signal processing, high-performance image processing, and high-speed serial protocol bridging. The transceiver channels and DSP blocks make the EP2AGZ350FH29I3N particularly well suited for protocols like OBSAI, CPRI, and Serial RapidIO used in telecom infrastructure. When designing with this device, ensure a 12-layer or more PCB with continuous GND planes for transceiver signal integrity. The 780-ball FCBGA requires via-in-pad or microvia technology for fanout. Quartus II design software is required for synthesis, place-and-route, and timing closure. This page synthesizes current distributor inventory, verified pricing, Arria II GZ family drop-in alternatives, and design notes specific to the FH29 package not found on standard distributor product pages.
EP2AGZ350FH29I4G - 281-I/O Arria II GZ FPGA | Altera
Altera EP2AGZ350FH29I4G is a high-density Arria II GZ field-programmable gate array with 281 user I/O, supplied in a 780-ball fine-pitch BGA package. The verified distributor results identify the device as a programmable logic IC and associate the FH29 package code with this high-I/O configuration. Its position in the Arria II GZ family makes it suitable for designs requiring substantial configurable logic, multiple high-speed interfaces, and hardware-level concurrency rather than fixed instruction execution. A field-programmable gate array, or FPGA, is a semiconductor device built from programmable logic blocks, configurable routing, memory resources, and programmable I/O. Within the hierarchy FPGA β programmable logic device β integrated circuit, an FPGA bridges application-specific integrated circuits and software-controlled processors: the designer implements digital functions in configuration data while retaining the ability to revise hardware behavior. BGA packaging supports dense interconnect through many solder balls beneath the package. The principal verified product facts are 281 user I/O and a 780HBGA package. The device is listed as an Intel/Altera embedded FPGA, and distributor listings indicate real-time inventory and ordering availability. The MPN suffix identifies an industrial-temperature, lead-free, tray-oriented ordering option according to the supplied part-number convention context, while exact electrical ratings, logic-element count, transceiver count, operating voltage, and temperature limits require the manufacturer datasheet for confirmation. The part is designed for digital systems in which parallel datapaths, interface bridging, protocol termination, signal processing, or control logic must operate deterministically. Its 281-I/O capacity allows numerous board-level interfaces to share one programmable device. Because the available verified data does not state internal resource counts or timing figures, those values are intentionally not inferred here. Typical uses include industrial automation controllers, communications infrastructure, video and imaging processing, test and measurement equipment, and defense or aerospace electronics. It can consolidate glue logic, interface adaptation, state machines, and high-speed control into one programmable device. Board implementation should use the manufacturer package ball map and signal-integrity guidance, provide complete power distribution and decoupling, and verify every high-speed interface against the relevant FPGA bank rules. The exact BGA land pattern and pin assignments must be obtained from the official Arria II GZ documentation. This page consolidates verified distributor availability, package and I/O facts, sourcing links, and same-family site candidates while clearly identifying technical data that still requires manufacturer-datasheet confirmation. Pricing is reported only as supplied by the verified distributor sources and remains subject to change.
EP2AGZ350FH29I4N - Arria II GZ FPGA, 348500 LE, 780-BGA | Intel
The Intel (formerly Altera) EP2AGZ350FH29I4N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) delivering 348500 logic elements, 21270528 bits of embedded memory, and 281 user I/O in a 780-ball Flip-Chip BGA package, manufactured on a 40 nm low-power process and rated for industrial temperature operation. According to distributor listings, this device belongs to the Arria II GZ family, which combines high transceiver throughput with on-chip transceivers up to 6.375 Gbps, making it well suited for high-speed serial interface and DSP-rich designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that can be rewired in-circuit to implement arbitrary digital functions. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> field-programmable gate arrays (FPGA) -> semiconductor ICs, and are commonly used as glue logic, co-processors, or full SoC replacements where ASIC NRE is not justified. Key features of the EP2AGZ350FH29I4N include 13940 LABs/CLBs, embedded transceiver support for protocols such as PCI Express Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, embedded multipliers and DSP blocks, and dedicated PLL and global clock networks. The 0.9 V core voltage (per datasheet header summary) and 40 nm process technology reduce dynamic power versus prior Arria generations while maintaining timing margin. The Arria II GZ architecture combines a logic fabric with hard IP for memory controllers (DDR3 with ECC), high-speed transceivers, and PCI Express Gen2 x8 endpoints. Designers use Quartus II design software for synthesis, place-and-route, and timing closure; the same toolchain supports all Arria II GZ speed grades and package variants. Typical applications for this device include high-definition video broadcast equipment, wireless baseband processing, military radar preprocessing, medical imaging pipelines, and high-performance test and measurement backplanes. The 780-ball FCBGA provides dense I/O for memory interfaces and parallel digital buses. When designing in the EP2AGZ350FH29I4N, verify PCB stackup and decoupling per the Arria II GZ hardware reference manual, and confirm software version compatibility in Quartus II. Designers should also check the I4 speed grade against timing closure targets. This page synthesizes distributor pricing, same-brand drop-in alternatives within the Arria II GZ family, and FPGA design notes that complement the manufacturer datasheet to support both procurement and engineering decisions.
EP2AGZ350HF40C2N - Arria II GZ FPGA, 350K LEs | Altera | FBGA-1517
The Intel (formerly Altera) EP2AGZ350HF40C2N is a high-density Arria II GZ field-programmable gate array (FPGA) from the mid-range transceiver-equipped Arria II family, delivering approximately 350K logic elements in a 1517-ball flip-chip BGA (FCBGA) package. The device integrates up to 16 multi-gigabit transceivers operating up to 6.375 Gbps, dedicated DSP blocks, and embedded memory blocks, making it a drop-in compatible logic variant with speed grade C2 in the same HF40 package outline. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior can be redefined by the user after manufacturing. FPGAs sit hierarchically within programmable logic devices (PLD) -> logic ICs -> integrated circuits. They are favored over fixed-function chips when designs require high parallelism, fast time-to-market, hardware-level reconfigurability, or hardware-accelerated DSP. The Arria II GZ sub-family specifically targets applications that need a balanced mix of logic density, on-chip memory, DSP throughput, and multi-gigabit serial transceivers without moving to the higher-cost Stratix family. Key features of the EP2AGZ350HF40C2N include 350K logic elements (LEs), roughly 20 Mbits of embedded memory, dedicated 18x18 multipliers for DSP, transceivers reaching 6.375 Gbps, and a configurable I/O subsystem supporting multiple single-ended and differential I/O standards. Operating temperature grade is commercial (0C to +85C) as indicated by the C speed-grade and N suffix, and the device is built on a 40nm low-power process node. The HF40 package (1517-pin FCBGA, 40mm x 40mm body) integrates high-speed serial links, parallel I/O, external memory interfaces (DDR3, QDR II+, RLDRAM II), and general-purpose logic. Compared with Arria II GX parts, the GZ sub-family typically carries higher logic density and a richer transceiver feature set, which makes this device well suited to high-bandwidth data-path designs. Typical applications include high-speed serial interface bridging, telecommunications line cards, wireless baseband processing, video processing pipelines, and ASIC prototyping. The combination of transceivers and DSP blocks also enables use in software-defined radio (SDR) front ends and medical imaging accelerators. When designing with the EP2AGZ350HF40C2N, pay close attention to PCB layout of the 1517-ball FCBGA: a multi-layer board with controlled-impedance routing is required for the transceiver channels, and proper power decoupling is essential. Designers should use the Quartus II design suite with a license supporting the Arria II GZ device family. This page synthesizes distributor pricing, drop-in compatible Arria II GZ variants, and practical design notes that go beyond the device handbook to help engineers source and integrate this FPGA confidently.
EP2AGZ350HF40C3G - 350K LE Arria II GZ FPGA, 734 I/O, 1517-FBGA | Intel
The Intel (formerly Altera) EP2AGZ350HF40C3G is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1517-ball FineLine BGA package. It integrates 350,000 logic elements (LEs), up to 18.4 Mbits of embedded memory, and 734 user I/O pins, making it one of the most I/O-rich members of the Arria II GZ family. The device is fabricated on a 40 nm process and targets mid-range applications that demand high logic density with transceiver support. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the programmable logic device (PLD) family and sit hierarchically between ASICs (lower flexibility, lower unit cost) and microcontrollers/MPUs (less parallelism). The Arria II GZ family specifically bridges the gap between the lower-cost Cyclone series and the high-end Stratix series, targeting applications such as high-performance digital signal processing, broadcast video processing, and high-speed serial connectivity. Key features of the EP2AGZ350HF40C3G include dedicated DSP blocks delivering up to 550 MHz performance, embedded memory supporting dual-port RAM and FIFO configurations, on-chip transceivers operating up to 6.375 Gbps, and integrated PCI Express hard IP blocks. The device also supports external memory interfaces including DDR3, DDR2, and QDR II+ at rates up to 800 MHz, enabling high-bandwidth memory subsystems without external bridge chips. Programmable Power Technology allows unused logic to be dynamically shut down, reducing both static and dynamic power consumption. Architecturally, the EP2AGZ350HF40C3G implements an adaptive logic module (ALM) that combines traditional LUT-based logic with register chains, providing 8-input fracturable look-up tables and arithmetic capability in a single element. The fabric is paired with 8-input ALMs, variable-precision DSP blocks, and a hierarchical interconnect structure with adaptive routing. The transceiver tiles support multiple protocols including Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, providing system-level integration that simplifies PCB design. Typical applications for this device include high-end ASIC prototyping, broadcast and studio-grade video processing equipment, radar and electronic warfare signal processing, wireless baseband processing, and high-performance industrial imaging systems. The combination of high logic density, generous embedded memory, multi-gigabit transceivers, and a large user-I/O count makes it particularly well-suited for systems that previously required multiple mid-range FPGAs or a custom ASIC. The 'C3' speed grade and commercial temperature rating ('0C' suffix segment) suit indoor commercial enclosures without extended thermal stress. When designing with this part, careful PCB layout is essential due to the 1517-ball FBGA at 1.0 mm pitch. Power integrity analysis must be performed across all rails, and a multi-layer PCB with buried capacitance is recommended. The Quartus II design software (now Quartus Prime) provides the synthesis, place-and-route, and timing analysis tools required to compile bitstreams. Engineers should budget several weeks for initial compilation given the device size.
EP2AGZ350HF40C3N - Arria II GZ FPGA, 350K LE, 1517-FCBGA | Intel
The Intel EP2AGZ350HF40C3N is a high-density Arria II GZ field-programmable gate array (FPGA) with 348,500 logic elements, 21,270,528 bits of embedded memory, and 734 user I/Os, housed in a 1517-ball flip-chip BGA package. It belongs to Intel's mid-range transceiver-equipped FPGA family built on a 40 nm low-power process, delivering up to 13,940 LABs (logic array blocks) and a DSP block count in the thousands for high-throughput signal processing. The device integrates up to 24 multi-gigabit transceivers and supports external memory interfaces such as DDR3, QDRII+, and RLDRAM2, making it a drop-in pin-compatible option for high-bandwidth telecom and video infrastructure designs. What is an FPGA? An FPGA (field-programmable gate array) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams stored in SRAM. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD/FPGA -> semiconductor) and are widely used to implement parallel datapaths, custom interfaces, and hardware accelerators that would otherwise require costly ASIC development. The Arria II GZ family targets mid-range applications requiring transceivers and moderate logic density at lower cost than Stratix-class parts. Key features include transceiver data rates up to 6.553 Gbps, dedicated fractional PLLs, configurable I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and on-chip termination (OCT). The 1517-ball FCBGA package uses flip-chip interconnect for low-inductance power delivery and supports the 0.9 V core voltage typical of Arria II GZ. The device is designed for industrial temperature grades and offers bitstream encryption and JTAG-based configuration with support for EPCS and EPCQ configuration devices. Architecturally, the EP2AGZ350HF40C3N combines ALM-based adaptive logic modules with hard memory blocks (M9K and M144K), variable-precision DSP blocks, and PCI Express hard IP, enabling efficient implementation of high-performance DSP pipelines, video processing, and protocol bridging functions. Configuration can be loaded via fast passive parallel (FPP), active serial (AS), or JTAG modes. Typical applications include wireless baseband processing, military radar front-ends, broadcast video switchers, ASIC prototyping, and high-speed serial interface bridging. The integrated transceivers make the device suitable for backplane aggregation, SONET/SDH, and Custom Interconnect designs where 6 Gbps links are needed. When designing with this device, ensure PCB layout meets Intel's flip-chip BGA decoupling and thermal guidelines, and use the Quartus II design suite (13.0 or later) for synthesis, place-and-route, and timing closure. Note that Arria II GZ is a mature family - verify long-term availability for new production designs.
EP2AGZ350HF40C4G - 350K LE Arria II GZ FPGA | Intel | FBGA-1517
The Intel (formerly Altera) EP2AGZ350HF40C4G is a high-density Arria II GZ field-programmable gate array (FPGA) delivering 350,000 logic elements, 20,480 Kbits of embedded memory, and 4.7 Mbits of user-accessible RAM in a 1517-ball flip-chip BGA (FBGA-1517) package. It is rated speed grade 4 with a commercial operating temperature range of 0C to 85C and ships as a Pb-free tray-packaged unit. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers connected by a programmable routing fabric. FPGAs occupy a hierarchy between fixed-function ASICs and general-purpose processors: they offer hardware-level parallelism and deterministic latency without the NRE cost of an ASIC, while remaining reprogrammable in the field. The Arria II GZ family sits in Intel's mid-to-high-density transceiver-equipped tier, optimized for high-bandwidth applications such as high-speed serial interfaces and DSP-heavy signal processing. Key features of the EP2AGZ350HF40C4G include support for 4 multi-protocol 3.125 Gbps transceivers (the exact number of transceiver channels for this device-specific package may vary; check the device datasheet for the precise transceiver count), 8 fractional PLLs, dedicated hard memory controllers supporting DDR3, DDR2, and QDR memory, and a hard PCI Express Gen2 endpoint block. The device is fabricated on a 40 nm low-power process and integrates configurable I/O standards including LVDS, LVCMOS, SSTL, HSTL, and high-speed serial interfaces through the transceiver block. The Arria II GZ architecture combines a fine-grained logic fabric with column-based DSP blocks and embedded SRAM (M9K blocks of 9 Kbits and M144K blocks of 144 Kbits) for efficient implementation of DSP pipelines, video processing, and protocol bridging. The hard PCIe Gen2 endpoint eliminates the soft-IP overhead typical of FPGA-based PCIe implementations, enabling low-latency single-chip solutions for industrial and test-card designs. Configuration is supported via JTAG, passive serial, fast passive parallel, and active serial modes using a wide range of industry-standard configuration memories. Typical applications for the EP2AGZ350HF40C4G include high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SATA, XAUI), HD-SDI and 3G-SDI video processing, software-defined radio front-end sample processing, and high-channel-count DSP pipelines for test and measurement. The large logic capacity combined with hard PCIe and memory controllers makes it suitable as a host-side co-processor in medical imaging, defense signal intelligence, and high-performance industrial inspection systems. When designing with this device, pay close attention to the FBGA-1517 PCB land pattern - the 1.0 mm ball pitch requires high-density interconnect (HDI) PCB fabrication with micro-vias, and signal-integrity analysis of the transceiver channels is essential above 2.5 Gbps. Power estimation with the Intel FPGA PowerPlay Early Power Estimator (EPE) should be completed before committing to the PCB stackup, because the 40 nm process can dissipate substantial power under heavy DSP and transceiver utilization. This page synthesizes distributor pricing, drop-in alternatives from the Arria II GZ family, and practical design notes not found in the manufacturer datasheet.
EP2AGZ350HF40C4N - Arria II GZ FPGA, 350K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP2AGZ350HF40C4N is a high-density, high-performance Arria II GZ Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process and packaged in a 1517-ball FC-FBGA (HF40 / 40 mm). It integrates 348,500 logic elements (LEs) across 13,940 LABs, 21,270,528 bits of embedded memory (approximately 21.27 Mbits), and 734 user I/O pins, making it one of the densest mid-range FPGAs available for bandwidth-intensive applications. The C4 speed grade and commercial temperature grade target design teams that need deterministic, repeatable timing margins without paying for the industrial -I4 margin. An FPGA is a reprogrammable semiconductor that engineers can configure post-manufacturing to implement custom digital logic, DSP pipelines, memory controllers, transceiver interfaces, and high-speed serial protocols. Within the broader programmable-logic hierarchy, the Arria II GZ family sits between Cyclone (low-cost) and Stratix (high-end) families. Its 40 nm process technology, embedded transceivers (per family datasheet) and 0.9 V core supply make it well-suited for systems where performance per watt is more important than absolute capacity. Key features include 8-input adaptive logic modules (ALMs), fractional synthesis PLLs, up to 16 global clock networks, and dedicated DSP blocks that deliver up to ~550 MHz multiply-accumulate performance. Memory is organized as M9K and M144K blocks, with 24 transceiver channels supporting rates up to 6.375 Gbps (per family datasheet). The HF40 package exposes 734 general-purpose I/O plus dedicated clock, configuration, and JTAG pins for boundary-scan and in-system programming via JTAG or passive/active serial. The architecture is built around a core fabric of columns and rows of LABs interconnected by multi-track routing, with dedicated hardware for 18 x 18 multipliers, memory blocks, and high-speed I/O serializer/deserializer (SERDES) elements. The 40 nm process balances static and dynamic power, and Arria II GZ devices support Quartus II programmable power technology that automatically reduces power on unused blocks. Configuration is loaded from a serial flash or via JTAG using the active serial (AS) or JTAG modes, supporting fast field updates and remote reprogramming. Typical applications include high-performance digital signal processing (radar, baseband, software defined radio), video processing and broadcast infrastructure, 40G/100G line-card bridging, test and measurement equipment, and high-end industrial imaging. The combination of 21 Mbits of block RAM and 734 user I/O also suits large datapath buffering for high-resolution video walls or medical imaging front-ends. When designing with this device, plan the PCB layout around the 40 x 40 mm FC-BGA land pattern, using microvia stack-ups for breakout, and provide multiple decoupling values (0.1 uF, 1 uF, 10 uF) close to each power rail. Always sequence the 0.9 V core before the 1.1 V/2.5 V/3.3 V auxiliary supplies to avoid latch-up at power-up. This page synthesizes distributor pricing, same-family drop-in alternatives from the Arria II GZ portfolio, and practical design notes not found in the manufacturer datasheet alone.
EP2AGZ350HF40I2N - 350K LE Arria II GZ FPGA, 1517-Pin FBGA | Intel
The Intel (formerly Altera) EP2AGZ350HF40I2N is a high-density, high-performance Arria II GZ field-programmable gate array (FPGA) housed in a 1517-pin flip-chip BGA (HF40) package, industrial temperature grade, lead-free. As part of the Arria II GZ family it delivers up to 350K logic elements, embedded transceivers capable of multi-gigabit serial I/O, and dedicated DSP blocks for high-throughput signal processing. An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened peripherals that can be reconfigured by the customer after manufacture. FPGAs sit in the programmable-logic hierarchy above CPLDs and below custom silicon, providing ASIC-class performance with mask-set-free time-to-market. The Arria II GZ family specifically targets transceiver-rich applications such as wireless baseband, broadcast video, and defense signal processing where mid-range density and 6.375 Gbps transceivers are sufficient. Key features of the EP2AGZ350HF40I2N include the 350K logic-element fabric, embedded 6.375 Gbps multi-gigabit transceivers, on-chip memory, phase-locked loops for clock management, and a high-pin-count flip-chip BGA package that supports the wide parallel and serial I/O required by the largest device in the family. The industrial temperature grade (-40C to +100C) and lead-free solder-free build make it suitable for harsher environments than commercial Arria II GZ parts. Architecturally the device combines a logic fabric synthesized from 8-input adaptive look-up tables, embedded memory blocks, DSP blocks with 18x18 multipliers, and hardened PCIe and memory controllers. The transceiver physical media attachment layer supports multiple protocols including CPRI, OBSAI, Serial RapidIO, and 10G Ethernet MAC integration for backplane and fronthaul links. Typical applications include wireless base-station digital front-end, software-defined radio, high-performance computing accelerators, military radar and electronic-warfare platforms, broadcast video processing, and ASIC prototyping. The HF40 1517-pin FBGA package provides the signal integrity and pin budget required for parallel data paths and multiple transceiver channels. Designers should plan power-rail decoupling carefully; the EP2AGZ350HF40I2N draws significant transient current and requires multiple bulk and high-frequency ceramic capacitors around the periphery of the package, along with a multilayer PCB stackup dedicated to the FPGA. This page synthesizes distributor availability, drop-in alternative Arria II GZ variants, and FPGA design considerations that are not aggregated in any single distributor listing, providing a faster path from datasheet to design review.
EP2AGZ350HF40I3 - Arria II GZ FPGA, 350K LE, 1517-FBGA | Intel
The Intel EP2AGZ350HF40I3 is a high-density Arria II GZ Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, delivering 348,500 logic elements, 21,270,528 bits of embedded memory, and 13,940 user I/O pins in a 1517-ball Flip-Chip BGA (HF40, 40 mm x 40 mm) package. The Industrial temperature grade (-40C to +100C) device is rated for 1.0 V core operation and integrates 24 transceivers capable of up to 6.375 Gbps, four hard PCI Express Gen2 controllers, and 8 hard memory controllers supporting DDR3 up to 800 MHz. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - a category of digital integrated circuits whose logic function is defined by user configuration rather than fixed at the factory. In the taxonomy of digital semiconductors, FPGAs sit between microcontrollers and ASICs, offering parallel programmable fabric with hard IP cores for memory controllers and high-speed serial I/O. The Arria II GZ family is positioned as a mid-range transceiver-rich FPGA optimized for high-bandwidth applications where ASIC NRE costs cannot be justified. Key differentiating features of the EP2AGZ350HF40I3 include 1.36 Gbps LVDS support on the LVDS side of the I/O, fractional phase-locked loops (fPLLs) for precision clocking, and 768 18x18 multipliers for DSP workloads. The device supports configuration via passive serial, fast passive parallel, and JTAG, with built-in encryption support for design security through AES-256 configuration bitstream encryption. Architecturally, the device combines a programmable logic fabric with column-based DSP blocks arranged in rows alongside M20K embedded memory blocks. Hard IP for PCIe Gen2 and 10 Gigabit Ethernet reduces logic utilization and timing closure effort, making the device suitable for high-throughput data-path designs. The 40 nm process allows a favorable trade-off between static power, dynamic performance, and price-per-logic-element compared with 65 nm predecessors. Typical applications include high-end test and measurement equipment, medical imaging, military radar and signal processing, broadcast video infrastructure, and high-performance computing accelerators. The transceiver-rich architecture and large logic density also suit the device for ASIC prototyping, where designers emulate full SoCs before committing to silicon. When designing with this device, allocate at least 30 % of the available logic budget for future revisions, since utilization above 85 % complicates timing closure. Pay close attention to transceiver channel placement -24 channels must be evenly distributed across the four transceiver banks to meet lane skew requirements at 6.375 Gbps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Cross-brand cross-reference is intentionally limited because the 1517-BGA footprint and Arria II GZ fabric are unique to Intel (formerly Altera), and true drop-in replacements from Xilinx or Lattice would require full PCB redesign.
EP2AGZ350HF40I3G - Arria II GZ FPGA, 350K LE, 1517-BGA | Altera
The Altera (Intel) EP2AGZ350HF40I3G is a high-density Arria II GZ Field Programmable Gate Array (FPGA) with 348,500 logic elements, 20.29 Mbit embedded memory, and 1,517-pin FCBGA package, engineered for high-performance digital signal processing and high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that engineers can reconfigure after manufacturing. FPGAs occupy a unique position in the broader IC hierarchy between standard microcontrollers and ASICs: more flexible than fixed-function ASICs, faster and more parallel than sequential microcontrollers. The Arria II GZ family specifically targets mid-range high-bandwidth applications such as high-speed serial interfaces, video processing, and DSP-heavy designs where Stratix-class performance is not required. Key features of the EP2AGZ350HF40I3G include 139,400 Adaptive Logic Modules (ALMs) organized as 348,500 equivalent logic elements (LEs), 20.29 Mbit of on-chip embedded memory arranged as M9K and MLAB blocks, and 1,170 18x18 hardware multipliers for DSP operations. The 1517-ball FCBGA package operates across the industrial -40C to +100C temperature range and supports multiple high-speed transceiver options. According to the device nomenclature, the "HF40" suffix indicates the 40mm FCBGA package with high-speed serial I/O, "I3" indicates industrial temperature grade, speed grade 3, and "G" denotes lead-free / RoHS-compliant Pb-free terminal finish. This part is designed into high-speed serial interfaces, broadcast video processing, and DSP-intensive systems. The device operates with a -3 speed grade designation under the Arria II GZ performance binning scheme. The transceiver-rich architecture provides multi-gigabit transceivers suitable for protocols including PCIe Gen1/Gen2, Serial RapidIO, and CPRI in wireless infrastructure. Designers can use this FPGA in both standalone operation and as a co-processing accelerator alongside processors in heterogeneous computing architectures. Typical applications include wireless baseband processing, high-definition video broadcast equipment, high-speed serial protocol bridging, and medical imaging systems where parallel DSP throughput is critical. The dense logic resources and embedded multipliers enable single-chip implementation of multi-channel signal processing pipelines without external co-processors. When designing with this FPGA, plan power delivery carefully. Large FPGAs in BGA packages typically require multi-rail power sequencing and at least 2-3W of thermal dissipation even at moderate utilization. Use Altera's Quartus II design suite (legacy) or Intel Quartus Prime for design entry, synthesis, place-and-route, and timing closure.
EP2AGZ350HF40I3N - Arria II GZ 350K LE FPGA | Intel | Industrial
The Intel (formerly Altera) EP2AGZ350HF40I3N is a high-density Arria II GZ Field-Programmable Gate Array (FPGA) featuring 348,500 logic elements, 13,940 LABs, and 734 user I/O pins, fabricated on a 40 nm process and housed in a 1517-ball FC-FBGA (HF40) package. According to verified distributor data, the device targets mid- to high-performance transceiver-based designs with 500 MHz core performance and 21,270,528 bits of embedded memory. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and dedicated I/O cells that engineers can reconfigure after manufacturing. FPGAs occupy a specific position in the semiconductor hierarchy: integrated circuit -> programmable logic -> FPGA -> SRAM-based FPGA -> transceiver FPGA. They are commonly used as flexible alternatives to ASICs for prototyping, low-volume production, and applications requiring parallel processing, custom I/O timing, or hardware-accelerated DSP. The EP2AGZ350HF40I3N integrates up to 24 high-speed transceivers operating up to 6.375 Gbps, dedicated DSP blocks supporting variable-precision arithmetic, and embedded memory blocks totaling over 20 Mbits. The HF40 package denotes a flip-chip fine-pitch BGA with a 1.0 mm ball pitch, optimized for high signal integrity on multi-gigabit serial links. Architecturally, the Arria II GZ family uses an SRAM-based configuration memory backed by 40 nm low-power process technology, providing a balance of performance-per-watt for applications such as wireless baseband processing, broadcast video bridging, and high-speed serial protocol bridging. The 'I3' speed grade and 'N' lead-free suffix designate industrial temperature range operation (-40C to +100C) and lead-free / RoHS compliance. Typical applications include 40G/10G Ethernet bridge and aggregation, HD-SDI video routers, PCIe Gen1/Gen2 endpoint and root complex designs, software-defined radio (SDR) baseband, and high-speed test and measurement instrumentation. The HF40 package's flip-chip construction supports the high pin count required for wide parallel and serial interfaces simultaneously. When designing with this part, ensure the PCB stack-up supports 1.0 mm BGA breakout and that thermal management accounts for industrial temperature operation under full transceiver utilization. Engineers should use the Quartus II design software with Arria II device support to generate configuration bitstreams and verify pin assignments before tape-out. This page synthesizes distributor pricing, drop-in compatible Arria II GZ siblings, and practical PCB/design notes that are not consolidated in the manufacturer datasheet.
EP2AGZ350HF40I4G - Arria II GZ FPGA 350K LE | Intel
The Intel EP2AGZ350HF40I4G is a high-density Arria II GZ FPGA delivering 350K logic elements with transceivers up to 6.375 Gbps, housed in a 1517-ball FBGA (HF40) package at industrial temperature grade. It belongs to Intel's (formerly Altera) Arria II GZ family, which targets high-performance, transceiver-rich applications such as high-end communications, broadcast, military, and DSP-intensive systems. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that lets designers configure digital logic blocks, routing, and I/O after manufacture. FPGAs sit hierarchically within the broader semiconductor family: FPGA -> programmable logic -> logic ICs -> integrated circuits. Arria II GZ devices use a 40nm process, embed dedicated transceivers, DSP blocks, on-chip memory, and PLL/clock networks, and are SRAM-based so configuration must be loaded from external flash at each power-up. Key features include transceiver speeds up to 6.375 Gbps supporting CPRI, PCIe Gen1, SATA, and Serial RapidIO, an extensive DSP block fabric for high-precision fixed- and floating-point arithmetic, hard memory controllers, and a rich I/O mix that supports DDR3, LVDS, and SERDES. Industrial-grade parts (I4 suffix) operate from -40C to +100C junction temperature and are Pb-free/RoHS compliant. The device is typically paired with EPCQ configuration memory for autonomous boot. Architecturally, the Arria II GZ family uses a logic-element granularity optimized for register-rich designs, 8-input adaptive LUTs, dedicated 18x18 multipliers plus hard floating-point DSP blocks, and a clock network with up to 16 PLLs per device. The HF40 (FBGA-1517) package exposes the maximum I/O count and full transceiver count for this die, making it suitable for line-card designs with high I/O and SERDES density. Typical applications include telecom line cards with CPRI backhaul, military secure communications, video broadcast processing (e.g., 3G-SDI routing), high-channel-count DSP for radar and medical imaging, and ASIC-prototyping platforms that need 350K LEs of headroom. Its combination of transceivers and DSP blocks makes it a common choice for protocol-bridging and baseband processing designs. Designers should plan power architecture carefully because Arria II GZ FPGAs can draw tens of amps during configuration and dynamic operation; multiple decoupling rails (VCC, VCCA, VCCT, VCCPT) are required. Quartus II software with the Arria II device support is required for synthesis, place-and-route, and timing closure.