FPGA & CPLD
Products (6357)
EP2S60F672C4N - 60K LE Stratix II FPGA, 672-FBGA | Intel
The Intel (formerly Altera) EP2S60F672C4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 60,440 equivalent logic elements (LEs) and 2,544,192 bits of embedded memory in a 672-ball FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm process technology, operates from a 1.2 V core supply, and supports a maximum fabric clock of 711.24 MHz according to the Intel datasheet. The '-C4N' suffix denotes the commercial speed grade with lead-free / RoHS-compliant lead finish. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit within the broader programmable-logic hierarchy: programmable logic device (PLD) -> FPGA -> high-performance FPGA (Stratix / Virtex class) -> programmable SoC. The Stratix II family in particular pioneered the adaptive logic module (ALM) architecture that replaced the older 4-input LUT, doubling effective logic capacity per area compared to the original Stratix. Key features of the EP2S60F672C4N include 492 user I/O pins, an embedded memory capacity of 2,544,192 bits distributed across TriMatrix memory blocks (MRAM, M4K, M512), dedicated DSP blocks for high-throughput signal processing, and support for multiple I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI-X). The 672-pin FC-FBGA package provides a compact footprint with low inductance for high-speed signaling, suitable for high-density backplane and memory-interface designs. Typical applications include telecommunications baseband and line-card processing, high-speed serial-protocol bridging, ASIC prototyping, and DSP-intensive image and video pipelines. The combination of dedicated multipliers, large on-chip memory, and abundant I/O makes the EP2S60 a workhorse for pre-Stratix IV prototype platforms and long-lifecycle industrial designs. When designing with the EP2S60, pay close attention to decoupling (the Stratix II family draws substantial inrush current during configuration), JTAG chain integrity, and Quartus II software version compatibility - Quartus 7.2 or later with the Stratix II device library is required to generate bitstreams. Heat dissipation at full utilization can require active cooling on a 4-layer board. This page synthesizes distributor stock data from DigiKey, Mouser, Octopart and Arrow, drop-in same-package alternatives from the Stratix II family, and practical FPGA bring-up notes not found in the manufacturer's datasheet. Pricing references are stated as of 2026-09-09.
EP2S60F672C5 - Stratix II FPGA 60K LEs 672-FBGA | Intel
The Intel EP2S60F672C5 is a Stratix II family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-ball FineLine BGA (FBGA) package. Manufactured on a 90 nm CMOS process, this device operates at a core voltage of 1.2 V and supports internal clock rates up to 609.76 MHz per the FPGAkey parametric listing, providing the high-density programmable fabric required for ASIC prototyping, high-speed signal processing, and telecom infrastructure. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as memory, DSP slices, and high-speed transceivers. FPGAs sit in the broader semiconductor taxonomy as programmable logic devices, distinct from fixed-function ASICs because their logic function is defined post-manufacture via a configuration bitstream. Stratix II devices are positioned at the high-performance end of the FPGA market and were widely adopted for ASIC prototyping and high-throughput DSP. Key features of the EP2S60F672C5 include 24,176 CLBs (configurable logic blocks) per the FindIC specification listing, 12 dedicated DSP blocks for hardware-accelerated multiplication, up to 36 embedded RAM blocks (M4K/M-RAM), and 4 phase-locked loops (PLLs) for clock management. The device also incorporates 8 high-speed transceiver channels on selected die revisions and supports LVDS, LVTTL, SSTL, and HSTL I/O standards. The 672-pin FC-FBGA package measures 35 mm × 35 mm with 1 mm ball pitch, enabling high-density board integration while maintaining signal integrity. Architecturally, the Stratix II family introduced the adaptive logic module (ALM) concept, replacing traditional 4-input LUTs with 8-input fracturable LUTs that improve logic packing efficiency by 25–40%. Combined with the dedicated DSP blocks and TriMatrix memory, the EP2S60F672C5 supports sustained DSP throughput exceeding 300 GMACs at the rated core frequency, making it suitable for video processing, baseband modulation, and high-channel-count instrumentation. Typical applications for the EP2S60F672C5 include ASIC and SoC prototyping, software-defined radio (SDR) baseband processing, military/aerospace signal processing, high-end medical imaging front-ends, and high-throughput wireline communication. Engineers continue to deploy this part in long-lifecycle industrial and defense platforms where the mature Quartus II toolchain and proven silicon reliability outweigh the benefits of newer families. A key design consideration is that the EP2S60F672C5 operates in the commercial temperature range (0°C to +85°C) - the I4 and I5 suffixes denote industrial and extended temperature grades respectively. Designers should also note that Stratix II devices require a 1.2 V core supply with separate VCCIO bank voltages, and the configuration scheme (typically fast passive parallel or JTAG) must be selected during PCB layout. This page synthesizes distributor pricing, parametric specifications, drop-in alternatives, and practical design considerations not found in the manufacturer datasheet alone.
EP2S60F672C5N - Stratix II FPGA, 60K LEs, 672-FBGA | Altera
The Altera (Intel) EP2S60F672C5N is a Stratix II family Field Programmable Gate Array (FPGA) built on a 90 nm process, offering 60,440 logic elements (LEs), 2,544,192 bits of embedded memory, 492 user I/Os, and 3022 logic array blocks (LABs). It is housed in a 672-ball FineLine BGA (FC-FBGA) package and operates at 1.2 V core with a maximum internal frequency of 609.76 MHz per the Alldatasheet listing. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement custom digital circuits using configurable logic blocks (CLBs/LABs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the rung between general-purpose microcontrollers (fixed hardware, software-defined behavior) and ASICs (fixed hardware, mask-defined behavior), offering hardware-level parallelism without NRE mask charges. The Stratix II family targets high-performance applications such as DSP, telecom datapath, and high-speed serial I/O. Key features of the EP2S60F672C5N include: 60,440 LEs for fine-grained logic implementation, 2,544,192 RAM bits (about 311 kbytes) for buffering and FIFO designs, embedded DSP blocks for high-speed multiply-accumulate work, 12 PLLs/DLLs for clock management, and a 492-pin user-I/O count that supports wide parallel buses and multiple industry-standard interfaces. The device is speed-grade 5 (faster than C3/C4 but typically slower than I4/I5 industrial speed grades) and is targeted at commercial temperature operation per the suffix pattern. The Stratix II architecture replaced the Stratix I logic structure with an adaptive logic module (ALM) - an 8-input fracturable LUT - which improves logic packing efficiency and allows each ALM to implement either a full 7-bit function or two smaller independent functions. Combined with dedicated multiplier blocks, on-chip memory, and high-speed I/O, the EP2S60F672C5N can implement complex DSP pipelines, multi-gigabit serial interfaces (via external PHY), and bus-bridging logic on a single die. Typical applications include high-speed digital signal processing for communications infrastructure, software-defined radio (SDR) baseband, video processing and image pipelines, ASIC prototyping, and high-bandwidth industrial control. The 672-BGA package supplies the pin density required to bring out 492 user I/Os plus the dedicated configuration, clock, and power pins. When designing with the EP2S60F672C5N, allocate FPGA I/O banks carefully - each bank has a fixed VCCIO supply that determines the supported I/O standard (LVTTL, LVCMOS, SSTL, LVDS, etc.). Decouple every VCCINT and VCCIO pin with bulk plus high-frequency ceramic capacitors, follow the Altera Stratix II pin connection guidelines for unused pins (tie to defined logic levels, not floating), and use the Quartus II design toolchain (Stratix II device support) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single, structured reference for the EP2S60F672C5N.
EP2S60F672C5NGA - 60K LEs Stratix II FPGA, 492 I/O, 672-FBGA
The Intel (formerly Altera) EP2S60F672C5NGA is a high-density Stratix II family Field Programmable Gate Array (FPGA) featuring 60,440 logic elements and 492 user I/O pins in a 672-ball FineLine BGA (FBGA) package measuring 27x27 mm. This device is engineered for demanding digital signal processing, high-speed data acquisition, and communications infrastructure designs. The 'NGA' suffix denotes a specific temperature/grade variant within the Stratix II lineup, paired with the C5 speed grade targeting commercial timing. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement custom digital logic by programming an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and routing resources. Within the broader semiconductor taxonomy, an FPGA sits alongside ASICs and CPLDs as a programmable logic device (PLD), and Stratix II belongs to Intel's high-end performance FPGA family optimized for high logic density, embedded memory, and DSP throughput. This taxonomy places the EP2S60F672C5NGA in the integrated circuits > FPGA & CPLD category, serving applications where custom hardware acceleration is required without the NRE cost of an ASIC. Key features of the EP2S60F672C5NGA include 60,440 logic elements organized into 3,022 logic array blocks (LABs), approximately 2,544,192 bits of total embedded RAM, dedicated DSP blocks for high-throughput arithmetic, and 492 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, SSTL, HSTL). The 672-FBGA package exposes extensive I/O connectivity for memory interfaces and high-speed serial/parallel links. The C5 speed grade provides balanced timing margins for commercial applications, while the NGA variant supports a specific operating envelope required by OEMs. Technically, Stratix II uses a 90 nm process with adaptive logic modules (ALMs) that improve logic utilization versus earlier architectures. The device integrates TriMatrix memory blocks, up to 12 global clock networks, and dedicated multiplier/adder DSP blocks for high-performance filtering and FFT operations. These architectural elements make the EP2S60F672C5NGA suitable for protocol bridging, high-speed image processing, and software-defined radio baseband designs. Typical applications include high-end ASIC prototyping, telecommunications line-card processing, video broadcasting equipment, military/aerospace signal processing, and high-end test and measurement instrumentation. Engineers select this part when designs exceed the capacity of Cyclone II devices but do not require the larger Stratix II EP2S130/EP2S180 variants. The 672-FBGA package is the common platform for Stratix II devices, ensuring PCB layout reuse across the family. Design consideration: Stratix II FPGAs require careful power-rail sequencing (1.15 V to 1.25 V core) and robust thermal management, since high logic utilization can exceed 10 W dissipation. Designers must follow Altera's Quartus II power estimator and place decoupling capacitors within the manufacturer's guidelines to avoid in-system jitter. This page synthesizes distributor inventory, drop-in alternatives, and design notes not consolidated on the original Altera datasheet.
EP2S60F672I3N - Stratix II FPGA 60K LE 672-FBGA -40°C to 100°C | Altera
The Altera (now Intel PSG) EP2S60F672I3N is a high-density Stratix II family FPGA fabricated on a 90 nm process, integrating 60,440 logic elements (LEs) into a 672-ball FineLine BGA package. It features up to 2,544,192 bits of embedded memory, 36 DSP blocks (144 18×18 multipliers), and supports a maximum internal clock frequency of 816.99 MHz with a 1.2 V core supply. The I3 speed grade and -40°C to 100°C industrial temperature range target cost-sensitive yet performance-demanding applications. According to the Altera Stratix II Family datasheet, this device family introduces adaptive logic modules (ALMs) that pack 8 LUTs per ALM, doubling effective logic density versus the prior Stratix generation. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O are defined by a user-supplied configuration bitstream. FPGAs sit between general-purpose processors (flexible but lower performance per watt) and application-specific integrated circuits (ASICs) (high performance but high NRE). Within the taxonomy, the Stratix II family belongs to high-performance FPGAs targeting ASIC prototyping, signal processing, and high-bandwidth data path applications. The EP2S60F672I3N specifically targets designs needing 30K–60K LEs, embedded transceivers (none on this die), and abundant DSP resources. Key features include 12 embedded PLLs for clock synthesis, up to 718 user I/O pins depending on the package, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM), and 1.2 V core with 1.5 V/1.8 V/2.5 V/3.3 V multi-voltage I/O banks with auto-calibrated OCT (on-chip termination). The 672-ball FBGA enables high I/O density and signal-integrity performance for high-speed parallel interfaces. Per the Stratix II datasheet, the I3 speed grade corresponds to -2 speed in the legacy nomenclature with 2× PLL output and -10°C to 100°C junction operation. The architecture combines a programmable logic array of ALMs, M512/M4K/M-RAM memory blocks, DSP blocks each containing four 18×18 multipliers, and dedicated high-speed serial interfaces (not present on EP2S60). The device supports 1 Gbps LVDS, 1 Gbps external memory interfaces, and the Quartus II design toolchain (legacy software, replaced by Quartus Prime with limited support). Configuration is via passive serial (PS), fast passive parallel (FPP), or JTAG using Altera EPC configuration devices. Typical applications include ASIC prototyping, software-defined radio (SDR), high-end video processing, telecom line cards, industrial machine vision, and military/aerospace signal processing. The device is also widely used as a hardware emulator target for pre-silicon validation of complex SoCs. When designing with this part, note that the Quartus II toolchain is in legacy maintenance mode, with Quartus Prime supporting only a subset of Stratix II features; designers should verify tool support before committing to new designs.
EP2S60F672I4 - Stratix II FPGA 60K LE 672-FBGA | Intel
The Intel EP2S60F672I4 is a member of the Stratix II family of field-programmable gate arrays (FPGAs), delivering 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and 492 user I/Os in a 672-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, with maximum internal clock frequencies documented in the Stratix II family datasheet family. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacture to implement arbitrary digital logic functions, sitting in the broader hierarchy of programmable logic -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Modern high-density FPGAs like the Stratix II combine general-purpose logic fabric with embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, enabling single-chip implementation of complex datapaths, communications protocols, and parallel processing pipelines. Key features of the EP2S60F672I4 include 60,440 logic elements organized in 3,022 logic array blocks (LABs), 2,544,192 RAM bits distributed across M512, M4K, and M-RAM memory blocks, and a programmable interconnect fabric that supports rich digital signal processing (DSP) workloads. The device also provides up to 16 global clock networks and multiple phase-locked loops for system-level clock management and skew control. Architecturally, Stratix II uses an adaptive logic module (ALM) structure that gives the place-and-route tool fine-grained flexibility for fitting designs into the fabric, with dedicated carry chains, register chains, and look-up-table resources per ALM. The 90 nm process node provides a strong balance of performance and power efficiency for legacy high-end designs in communications infrastructure, ASIC prototyping, and test equipment. Typical applications for the EP2S60F672I4 include telecom baseband and line-card signal processing, ASIC prototyping and emulation, military and aerospace signal-processing boards, high-speed test and measurement instruments, broadcast video processing, and industrial control systems requiring deterministic parallel logic. When designing with this part, careful power-rail sequencing (1.2 V core, 3.3 V I/O, auxiliary PLL supply) and thermal management of the FC-BGA package are critical, as the 672-ball BGA has limited PCB area for copper heat-spreading and may require thermal vias and forced airflow. This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes that complement the manufacturer datasheet, helping engineers select the right FPGA configuration for their design and supply-chain constraints.
EP2S60F672I4N - 60K LE Stratix II FPGA, 672-BGA | Intel
The Intel EP2S60F672I4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) with 60,440 logic elements, 60440 equivalent LE capacity, 2,544,192 bits of embedded memory, and 492 user I/Os, housed in a 672-ball FineLine BGA package. Built on a 90 nm CMOS process with 1.2 V core voltage, this industrial-temperature-grade device integrates 3022 LABs/CLBs, 24 DSP blocks, and supports up to 718 user I/O on the highest pin-count package variant. It targets high-performance digital signal processing, telecommunications infrastructure, and ASIC-prototyping applications where the unique Adaptive Logic Module (ALM) delivers a 40% performance advantage over previous-generation architectures. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reprogrammed post-manufacturing to implement arbitrary digital logic. Within the broader IC taxonomy, FPGAs sit at the apex of programmable logic devices, above CPLDs in both density and complexity, and form a key sub-category of Integrated Circuits > FPGA & CPLD. Stratix II FPGAs target ASIC-prototype and high-throughput DSP applications where hard multipliers, embedded TriMatrix memory, and high-speed external memory interfaces (DDR, DDR2, QDR, RLDRAM) are required. Key features of the EP2S60F672I4N include 2544192 bits of total embedded RAM distributed across TriMatrix memory blocks, 24 dedicated 18-bit x 18-bit hardware multipliers for DSP, 4 phase-locked loops (PLLs), and support for external memory interfaces up to 300 MHz DDR2. The device provides 12 global clock networks and up to 16 regional clock networks, with True-LVDS and LVPECL I/O support for high-speed serial source-synchronous interfaces. The 672-BGA package supports JTAG boundary-scan (IEEE 1149.1) and passive serial configuration modes. The Stratix II architecture combines ALMs (8-input fracturable look-up tables with dedicated adders), efficient interconnect, and embedded DSP blocks to deliver sustained throughput on DSP-heavy workloads. Row- and column-based I/O banks permit flexible mixed-voltage signaling (1.5 V, 1.8 V, 2.5 V, 3.3 V) without external level shifters. Hard IP for PCI Express, Gigabit Ethernet, and Serial RapidI/O is supported via soft IP and embedded transceivers (none on EP2S60 - this die does not include the GX transceiver blocks). Typical applications include wireline telecommunications line cards, ASIC prototyping, high-speed image-processing pipelines, test-and-measurement instrumentation, and military/aerospace signal processing. The wide operating-temperature range and high logic capacity make it well suited for industrial-control and defense electronics where commercial-grade FPGAs are inadequate. Design consideration: Stratix II requires careful power-rail sequencing (1.2 V VCCINT before VCCIO) and a decoupling network of 100 nF + 10 uF per supply pin group. The 672-BGA demands a multi-layer PCB with microvia technology; signal-integrity analysis on DDR2/RLDRAM interfaces is strongly recommended. This page synthesizes distributor stock data, parametric cross-reference alternatives, and practical design notes not aggregated on the manufacturer datasheet, giving engineers a single source for sourcing, design, and second-source decisions on EP2S60F672I4N.
EP2S60F672I5 - 60K LEs Stratix II FPGA, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S60F672I5 is a high-density member of the Stratix II FPGA family, integrating 60,440 logic elements, 2,544,192 bits of embedded RAM, and 492 user I/Os in a 672-ball FineLine BGA package. It is built on a 90 nm process, supports a core voltage of 1.2 V, and operates across the industrial temperature range. Per the Stratix II Family datasheet, the device includes 36 DSP blocks (144 18x18 multipliers) and twelve PLLs, providing ample headroom for parallel DSP pipelines and high-speed serial interfaces. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic and routing are defined by a user-supplied configuration bitstream rather than at the factory. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit above simple CPLDs and below structured ASICs in cost-per-volume but far above both in design flexibility. FPGAs are used to implement arbitrary digital functions - from glue logic and bus interfaces to entire SoC prototypes - while preserving the ability to re-spin the design in minutes. The Stratix II family targets high-performance compute, communication, and signal-processing applications where high logic density, large block memory, and abundant DSP throughput are required. Key features of the EP2S60F672I5 include 60,440 logic elements (LEs), 36 DSP blocks equivalent to 288 18x18 multipliers, 12 PLLs with on-chip termination support, and 2,544,192 RAM bits distributed across M4K and M-RAM memory blocks. The device also exposes 12 transceiver channels on selected package variants, though the F672 ball-out does not break out transceivers. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional configuration via EPC16 or EPCS serial configuration devices. At the architecture level, the Stratix II device uses adaptive logic modules (ALMs) - an 8-input fracturable LUT that can implement either a full 6-input LUT or two smaller LUTs sharing common inputs - paired with TriMatrix memory blocks (MLAB, M4K, M-RAM) and dedicated high-speed I/O serdes on supported packages. The 'I5' speed grade corresponds to a -5 speed bin, while the trailing 'I' denotes the industrial temperature range (-40C to +100C junction). Power estimation tools such as the Altera PowerPlay Early Power Estimator and TimeQuest timing closure are required to validate thermal and timing budgets at 1.2 V core. Typical applications include high-speed digital signal processing (radar, baseband, software-defined radio), ASIC prototyping and emulation, high-throughput data acquisition and aggregation, video and image processing pipelines, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The combination of 60K LEs and 36 DSP blocks makes the EP2S60 well-suited to multi-channel DSP designs that would otherwise require multiple smaller FPGAs. When designing with this part, use the Quartus II design software (version 9.0 or later) and verify that the selected pin-out F672 matches your board's BGA footprint. Industrial temperature operation requires a junction-to-ambient thermal analysis; the 672-ball FC-FBGA has a theta-JA of approximately 9.1 C/W with appropriate heatsinking, and worst-case core power can exceed 10 W. This page synthesizes distributor pricing, drop-in alternatives, and practical Stratix II design notes not always found in a single manufacturer document.
EP2S90F1020C3 - Stratix II 90K LEs FPGA 1020-BGA | Intel / Altera
The Intel / Altera EP2S90F1020C3 is a Stratix II family Field Programmable Gate Array (FPGA) featuring 90,960 logic elements (LEs), 4,520,488 RAM bits (approximately 4.5 Mbit), 758 user I/Os, and 4548 LABs, housed in a 1020-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. Fabricated on a 90 nm CMOS process with a 1.2 V core supply, the device supports a maximum internal clock frequency of 816.99 MHz per the Altera family datasheet. What is a Stratix II FPGA? The Stratix II family is a high-performance, 90 nm SRAM-based programmable logic family introduced by Altera (now Intel) targeting high-density logic, embedded memory, and DSP-intensive applications. Within the broader hierarchy, FPGAs belong to programmable logic devices (PLDs), which sit inside the integrated circuits > logic ICs category. Stratix II FPGAs added on-chip transceivers, TriMatrix memory blocks, and dedicated DSP blocks, bridging the gap between ASIC integration and the flexibility of programmable logic. EP2S90F1020C3 is positioned as a high-density member of this family, balancing logic capacity with embedded memory and DSP throughput. Key features include 12 dedicated transceiver channels, embedded multiplier blocks for DSP, TriMatrix embedded memory blocks for distributed and block RAM, and support for external memory interfaces including DDR/DDR2/QDRII/RLDRAM. The device operates across commercial and industrial temperature grades (the "C3" speed grade denotes a specific performance bin), and is supported by the Quartus II / Quartus Prime design toolchain for HDL synthesis, place-and-route, and timing closure. The Stratix II architecture separates logic, routing, and memory into distinct hierarchical layers: each LAB (Logic Array Block) contains 16 Adaptive Logic Modules (ALMs) that combine LUT-based logic with full-adder and register resources, while embedded DSP blocks implement 9-bit / 18-bit / 36-bit multipliers with optional accumulation, and TriMatrix memory provides three block sizes (M512, M4K, M-RAM) tuned for different on-chip buffering workloads. Typical applications include high-performance digital signal processing (radar, software defined radio), high-speed data acquisition, ASIC prototyping, video and image processing, and telecom baseband processing. The 1020-pin FC-FBGA package supports the high I/O count required for parallel external memory buses and multiple high-speed serial links. When designing with EP2S90F1020C3, ensure that PCB layout accommodates the 1.0 mm (or finer) BGA pitch with proper microvia/stacked-via stackups and matched-length differential routing for transceiver channels. Power-rail decoupling must follow the Stratix II PDN (Power Distribution Network) guidelines published in the family handbook, and unused transceiver pins must be left open per AN 366: Altera Transceiver Guidelines. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix II family, and practical design notes not found in a single manufacturer datasheet - providing AEO/GEO-ready content for engineers evaluating the EP2S90F1020C3 for new designs or EOL redesigns.
EP2S90F1020C3N - 90nm Stratix II FPGA 90,960 LEs FC-FBGA-1020 | Altera
The Intel (formerly Altera) EP2S90F1020C3N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements and 4,520,488 bits of embedded RAM, housed in a 1020-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) measuring 33 x 33 mm. It is fabricated on a 1.2 V, 90 nm CMOS process and is rated for a commercial operating temperature grade. The device exposes 758 user I/O pins and provides 4,548 LABs (Logic Array Blocks) plus dedicated high-speed transceivers, multipliers, and TriMatrix memory blocks tailored to DSP, communications, and high-throughput parallel processing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks, embedded memory, DSP slices, and programmable interconnect that the designer tailors after manufacture using a hardware-description language (HDL) bitstream. FPGAs sit between fixed-function ASICs and software-programmable processors, offering hardware-level parallelism with software-level flexibility. The Stratix II family in particular targets high-performance applications such as DSP, video processing, and high-speed serial interfacing where deterministic latency and parallel datapaths are required. The EP2S90F1020C3N delivers up to 90,960 equivalent logic elements (LEs), 4,520,488 bits of TriMatrix embedded memory, and embedded DSP blocks for 18x18 multipliers. It supports external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II via dedicated PHY, and includes high-speed LVDS and differential signaling capable of several hundred MHz. The C3 speed grade denotes a commercial-temperature part at the slowest of three Stratix II speed bins, favoring design closure and timing margin over maximum Fmax. The Stratix II architecture uses an adaptive logic module (ALM) that combines fracturable 6-input LUT capability with dedicated register and carry resources, giving the part a logic-efficiency advantage over older 4-LUT architectures. Combined with a hierarchical interconnect structure and on-chip PLL / clock networks, the EP2S90F1020C3N typically achieves core performance in the 200-300 MHz range for general logic and significantly higher for dedicated DSP and memory paths. Typical applications for EP2S90F1020C3N include high-speed digital signal processing, baseband and protocol processing in telecom, video and image processing pipelines, ASIC prototyping, high-speed data acquisition, and custom compute accelerators. Its large on-chip memory and high I/O count suit designs that need to keep data on-die to avoid off-chip memory bottlenecks. When designing with this part, pay careful attention to the FC-FBGA-1020 package - it requires multilayer PCB with controlled-impedance routing, microvia or via-in-pad technology, and strict power-integrity decoupling. Designers typically use Altera (now Intel) Quartus II design software for synthesis, place-and-route, and timing analysis. The C3 speed grade is the slowest tier, so engineers targeting the highest Fmax should evaluate the C4 or C5 speed grades or step up to Stratix II GX variants for integrated transceivers. This page synthesizes distributor pricing, drop-in Stratix II alternatives, and practical design guidance that consolidates information not found in a single manufacturer datasheet.
EP2S90F1020C4 - Stratix II FPGA 90K LE 1020-BGA | Intel
The Intel (formerly Altera) EP2S90F1020C4 is a Stratix II family field-programmable gate array (FPGA) IC integrating 90,960 logic elements, 4,520,488 bits of embedded memory, and 758 user I/Os into a 1020-ball flip-chip BGA package. It is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, with maximum performance up to 711.24 MHz on internal logic. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic, a peer category to ASICs and microcontrollers, and are widely used for parallel DSP, high-speed serial I/O bridging, and rapid hardware prototyping. The Stratix II generation introduced an adaptive logic module (ALM) architecture that improved performance and density over the original Stratix family. Key features of the EP2S90F1020C4 include 4,548 LABs/CLBs, 12 embedded DSP blocks, 96 embedded 18x18 multipliers, 4 PLLs, and support for external memory interfaces including DDR, DDR2, QDR II, and RLDRAM. The device integrates 12 transceiver channels at up to 6.375 Gbps, making it suitable for high-speed serial link aggregation in communications backplanes. The Stratix II architecture combines ALMs with TriMatrix embedded memory blocks (MLABs, M4K, M-RAM), enabling efficient implementation of both DSP datapaths and on-chip buffering. Combined with 758 general-purpose I/Os across 8 banks supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X signaling, the EP2S90F1020C4 acts as a high-density system integration point. Typical applications include telecom line cards, software-defined radio baseband processing, video broadcast encoding/decoding, ASIC prototyping, and high-speed serial protocol bridging. Designers choose the EP2S90F1020C4 when raw logic density, embedded DSP throughput, and integrated transceivers must coexist on one silicon die. A key design consideration is the 1.2 V core supply rail: a low-noise regulator such as a TPS7A4701 or equivalent LDO should supply the VCCINT rail, and the 1020-BGA flip-chip land pattern demands a high-layer-count PCB with controlled-impedance routing. Power estimation tools (Quartus II PowerPlay) are recommended before thermal design closure. This page synthesizes verified distributor pricing, same-family drop-in alternatives, and practical design notes not collected in the manufacturer datasheet.
EP2S90F1020C4N - Stratix II FPGA 90K LEs 1020-FBGA | Intel
The Intel EP2S90F1020C4N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, integrating 90,960 equivalent logic elements (LEs), 4,548 LABs, and 758 user I/Os in a 1020-ball flip-chip BGA (FC-FBGA) package with a 1.2 V core supply. The device delivers up to 711.24 MHz fabric performance and is targeted at high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and dedicated hard-IP such as DSP blocks, M512/M4K/M-RAM memory blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable-logic hierarchy, alongside CPLDs, and are widely used as prototyping platforms or as production silicon when design volumes do not justify an ASIC. The Stratix II family specifically introduced the adaptive logic module (ALM) architecture that improves logic packing versus earlier ALM-free families like Stratix. Key features include 4,520,488 bits of embedded memory, embedded DSP blocks for fixed- and floating-point math, up to 12 transceivers on selected variants, dedicated external-memory interface controllers (DDR/DDR2/QDRII), and 1.2 V core operation with separate VCCIO banks for mixed-voltage I/O. The 1020-pin FC-FBGA package exposes the maximum I/O count in the EP2S90 family and supports JTAG-based configuration via passive, active, or JTAG modes with the EPC configuration devices. Architecturally, the Stratix II ALM combines an 8-input fracturable look-up table with dedicated adders, registers, and carry chains, allowing the fabric to map dense random logic more efficiently than 4-input-LUT predecessors. Hard IP (DSP, TriMatrix memory, PLLs) is interleaved across the fabric, giving deterministic latency for DSP and memory-intensive designs. Typical applications include ASIC prototyping and emulation, high-performance DSP for wireless baseband and radar, video processing and broadcast equipment, high-speed serial protocol bridging, and military/aerospace signal processing. The wide I/O count also suits memory-mapped backplane designs. When designing with EP2S90F1020C4N, plan power-decoupling for the 1.2 V core rail carefully and follow the Stratix II pin connection guidelines for unused I/O banks; the FC-FBGA requires multi-layer PCB with microvia technology for breakout. This page consolidates distributor stock, lifecycle status, and drop-in same-family alternatives into one engineering-focused reference not provided by the manufacturer datasheet alone.
EP2S90F1020C5 - Stratix II FPGA 90K LE 1.2V 1020-FBGA | Intel
The Intel EP2S90F1020C5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,488 bits of embedded RAM, and 758 user I/Os, fabricated on a 90 nm process and housed in a 1020-ball FineLine BGA package measuring 33x33 mm. It targets high-performance digital signal processing, communications, and ASIC-prototyping workloads. Key specifications include 90,960 logic elements (LEs), 4,520,488 total RAM bits distributed across embedded memory blocks, twelve DSP blocks for hardware-accelerated arithmetic, and twelve transceiver-friendly clock PLLs. The device is built on a 1.2 V core supply with multi-voltage I/O support, allowing I/O banks to operate at 1.5 V, 1.8 V, 2.5 V, or 3.3 V for mixed-logic interfacing. Maximum internal clock rates exceed 609 MHz per the Stratix II device family datasheet. This FPGA belongs to the Stratix II family and is one of the highest-density members within the EP2S lineup, sitting above the EP2S60 and below the EP2S130/EP2S180 series. It is fabricated in a 90 nm CMOS process with a 1.2 V core, with eight user I/O banks for flexible mixed-voltage interfacing and dedicated high-speed serial interfaces. The architecture combines adaptive logic modules (ALMs), TriMatrix memory blocks, and DSP blocks to deliver high DSP throughput per watt for bandwidth-intensive designs. Typical applications include high-speed digital signal processing for wireless baseband, ASIC prototyping, high-performance computing (HPC) emulation platforms, telecommunications line cards, and video/imaging processing pipelines. The Stratix II DSP blocks and large TriMatrix memory make it well suited to FFT, Viterbi, and other compute-intensive algorithms. When designing with this device, plan for FPGA configuration scheme (fast passive serial, JTAG, or EPC-based controllers), multi-rail decoupling for core and I/O supplies, and adequate PCB thermal relief for the FC-BGA package. Signal integrity work on 1020-ball BGA escape routing and matched-length clock traces is essential to achieve rated performance.
EP2S90F1020C5N - Stratix II FPGA, 90K LE, 758 I/O, 1020-BGA | Intel
The Intel (formerly Altera) EP2S90F1020C5N is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package. Built on a 90 nm process, it integrates 90,960 logic elements (LEs), 4,520,488 bits of embedded memory, and 758 user I/Os, and is offered in the -5 (faster) speed grade with commercial temperature rating. An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device that sits between simple CPLDs and fixed-function ASICs in the design complexity hierarchy: programmable logic -> FPGA -> structured ASIC -> full-custom ASIC. The Stratix II family was Altera's second-generation high-performance architecture, adding adaptive logic modules (ALMs), on-chip transceivers in select variants, and dedicated DSP blocks for high-throughput arithmetic, making it well suited for ASIC prototyping, DSP pipelines, and high-speed parallel I/O. Key features include 12 dedicated 18x18 multipliers and multiple embedded DSP blocks for fixed- and floating-point arithmetic, 4,520,488 bits of TriMatrix embedded SRAM distributed across M512/M4K/M-RAM blocks, 758 user I/Os supporting multiple I/O standards, and the Altera (now Intel) Quartus II design flow for synthesis, place-and-route, and timing closure. The -5 speed grade places the part in the upper performance bin for the family, at the cost of higher dynamic power than the -C4 or -C3 grades. Typical applications include ASIC prototyping and emulation platforms, high-speed digital signal processing, telecommunications line cards, video and image processing pipelines, and military/aerospace signal-processing boards. The 1020-ball FBGA exposes enough user I/O to support multiple parallel external memory interfaces (DDR/DDR2/QDRII) and multi-gigabit transceiver channels via companion PHY devices. When designing with this device, plan for a multi-layer PCB with continuous power planes, low-impedance decoupling on every VCC/GND pair, and a heatsink or forced airflow over the FBGA because the 90 nm Stratix II family dissipates significant dynamic power at high toggle rates. Use the Quartus II PowerPlay analyzer with realistic toggle-rate vectors to estimate junction temperature before sign-off. This page synthesizes distributor availability, Stratix II family alternatives from the Site MPN list, and practical design notes that go beyond what the manufacturer datasheet alone provides.
EP2S90F1020I3N - 90K LE Stratix II FPGA 1.2V FC-FBGA-1020 | Altera
The Altera EP2S90F1020I3N is a member of the Stratix II FPGA family, integrating 90,960 logic elements (LEs) with 4,520,488 RAM bits on a 90 nm process technology node. Housed in a 1020-pin flip-chip fine-line BGA (FC-FBGA) package, it operates from a 1.2 V core supply and is rated for the industrial -40C to +100C junction temperature range (I3 speed grade). The device is positioned as a high-density programmable logic platform for ASIC prototyping, high-speed digital signal processing, and high-throughput data-path designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic IC that contains an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. Stratix II specifically introduced an adaptive logic module (ALM) architecture, walking the taxonomy of: FPGA -> programmable logic -> ASIC-prototype silicon -> semiconductor. Its place in the system hierarchy is as a flexible hardware accelerator that bridges the gap between fixed-function ASICs and software-only solutions running on general-purpose processors. Key features of the EP2S90F1020I3N include up to 12 embedded DSP blocks capable of 9-bit x 9-bit multipliers, dedicated high-speed serial transceivers supporting source-synchronous interfaces, embedded TriMatrix memory with true dual-port RAM configurations, and an enhanced routing architecture with reduced congestion versus the original Stratix. The 1.2 V core and 90 nm process keep dynamic power within practical limits while still supporting DSP workloads above 250 MHz in typical pipelined designs. The Stratix II architecture adopts a DirectDrive multiplexers-based ALM that doubles the effective logic capacity per area versus the first-generation Stratix. The 1020-pin FC-FBGA package provides ample signal margin for parallel external memory interfaces (DDR/DDR2 SDRAM controllers, QDR SRAM) and source-synchronous LVDS links. The I3 speed grade is the third-fastest in the Stratix II lineup, balancing timing margin against cost. Typical applications include ASIC prototyping and emulation, high-end communications protocol bridging, high-performance DSP filter banks, video and image processing pipelines, and military/aerospace signal processing. The wide embedded memory and DSP density also suit radar and beam-forming front-ends, software-defined radio baseband, and complex state-machine controllers in industrial automation. When designing with the EP2S90F1020I3N, plan a 12-layer PCB stack-up with continuous VCCINT and GND planes to control simultaneous-switching noise on the 1020-ball BGA, and provide at least eight 0.1 uF plus four 10 uF decoupling capacitors within 200 mils of the package. The Flip-Chip BGA also requires precise reflow profiling and X-ray inspection after assembly. This page consolidates distributor stock, parametric cross-checks, and Altera/Intel Stratix II family alternatives not found in any single datasheet - a one-stop source for engineers evaluating or sourcing this legacy high-density FPGA.
EP2S90F1020I4 - Stratix II FPGA 90K LE 1020-FBGA | Intel
The Intel EP2S90F1020I4 is a high-density Stratix II Field Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package (1020-FBGA, 33x33 mm), offering 90,960 equivalent logic elements (LEs) and 4,520,488 bits of embedded memory. Built on a 1.2-V, 90-nm all-layer copper SRAM process, it features a new adaptive logic module (ALM) that maximizes performance and enables densities approaching 180,000 equivalent LEs, along with up to 758 user I/O pins. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnect routing after manufacturing using a hardware description language such as Verilog or VHDL. FPGAs sit in the broader taxonomy of programmable logic -> PLD -> digital IC -> semiconductor, and are widely used for parallel DSP, high-speed serial interfaces, and prototype ASIC development where NRE costs are not yet amortized. Key features include 12 dedicated 18x18 multipliers, 384 (9-bit) ALMs, multi-gigabit transceivers supporting up to 6.375 Gbps, and a hierarchical clock network with up to 16 global clocks. The 'I4' suffix denotes the industrial temperature grade (-40C to +100C junction), while the 'F1020' denotes the 1020-ball FBGA package. The device supports multiple I/O standards including LVDS, LVPECL, HSTL, SSTL, and PCI/PCI-X, and is supported by the Quartus II design toolchain. Typical applications include high-performance DSP for radar and baseband processing, high-speed serial protocol bridging (PCIe, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, and telecom infrastructure. Industrial -40C to +100C operating range also makes it suitable for harsh-environment embedded computing. When designing with this device, ensure proper power sequencing of VCCINT (1.2V core) and VCCIO banks, and provide adequate thermal relief via the exposed die pad. Use the Quartus II SignalTap logic analyzer for in-system debug and verify all transceiver reference-clock routing meets the jitter mask. This page synthesizes distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet, providing an engineering-grade reference for sourcing and selection decisions.
EP2S90F1020I4GA - 90K LEs Stratix II FPGA, 758 I/O FBGA-1020 | Intel
The Intel (formerly Altera) EP2S90F1020I4GA is a high-density Stratix II family FPGA built on a 90 nm CMOS process, integrating 90,960 logic elements (LEs), 192 18x18 multipliers, and approximately 4,520,488 bits of embedded SRAM into a 1020-ball flip-chip BGA package. The I4 speed grade, combined with the industrial -40C to +100C operating range suffix, makes this member of the Stratix II family suitable for compute- and memory-intensive embedded systems where deterministic logic fabric and DSP throughput are required. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. Designers describe logic using HDL (Verilog or VHDL) and synthesize it onto the FPGA fabric, allowing rapid iteration versus ASIC development. FPGAs sit hierarchically between general-purpose microcontrollers and ASICs, offering higher performance-per-watt than CPUs for parallel workloads while preserving reprogrammability. The Stratix II family extends this to ASIC-prototyping and signal-processing designs with embedded multipliers and substantial block RAM. Key features of the EP2S90 include up to 758 user I/O pins via the FBGA-1020 package, four enhanced phase-locked loops (PLLs) for clock management, support for external memory interfaces including DDR/DDR2/QDRII, and configuration via passive serial, fast passive parallel, or JTAG modes. The 'GA' suffix on the part number indicates the specific package and lead-free/RoHS designation as used by Altera/Intel ordering codes. The I4 speed grade places this part in the mid-performance Stratix II tier. Architecturally, the Stratix II device uses an ALM-based logic structure with adaptive look-up tables, dedicated carry chains, and on-chip memory distributed across M512, M4K, and M-RAM blocks. The embedded DSP blocks implement 18x18 multipliers with optional accumulation and pre-adders, ideal for FIR filters and FFTs in wireless baseband and video processing pipelines. Typical applications include ASIC prototyping, high-speed digital signal processing, telecom line cards, test and measurement equipment, and high-performance industrial control. When designing with this part, plan power sequencing carefully: the Stratix II requires multiple supply rails (VCCINT, VCCA, VCCIO, VCCPD) with monotonic ramp requirements and a specific POR (power-on-reset) sequence to avoid configuration failure.
EP2S90F1020I4N - Stratix II FPGA 90K LE 1020-BGA | Intel
The Intel EP2S90F1020I4N is a high-density Stratix II Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,520,488 bits of embedded memory, and 758 user I/Os, packaged in a 1020-ball FineLine BGA. Built on a 90 nm process, this device operates with a 1.2 V core supply and supports industrial temperature grade -40C to +100C per the suffix I4 designation. FPGAs (Field Programmable Gate Arrays) are reconfigurable semiconductor devices that sit between fixed-function ASICs and software-programmable processors in the design flexibility hierarchy. The Stratix II family specifically targets high-performance digital signal processing (DSP), communications infrastructure, and ASIC prototyping applications where massive parallel processing and high memory bandwidth are required. Within the Stratix II product family, the EP2S90 occupies the high-density tier below the EP2S130 and EP2S180. Key features include 4548 Logic Array Blocks (LABs), embedded DSP blocks for hardware-accelerated arithmetic, support for multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express, and dedicated high-speed transceivers. The 1020-ball BGA package exposes 758 user I/Os - among the highest in the Stratix II family - making the EP2S90 well-suited for memory-rich, interface-heavy designs. The Stratix II architecture introduced ALM (Adaptive Logic Module) logic elements that combine the benefits of LUT-based and product-term-based logic. This gives the EP2S90 superior logic utilization compared to the original Stratix family, often achieving 25-40% higher logic density per device. The embedded TriMatrix memory structure provides true dual-port RAM blocks with multiple aspect ratios, enabling efficient FIFO and buffer implementations without consuming logic resources. Typical applications include telecommunications base station processing, high-speed data acquisition systems, military radar signal processing, ASIC prototyping, and high-end video broadcast equipment. The 758 user I/Os make it ideal for systems requiring large numbers of parallel interfaces such as DDR2 memory controllers with multiple banks. When designing with this device, plan thermal management carefully. BGA packages with 1020 balls require 4-layer or higher PCB stackups with continuous via arrays under the package for thermal dissipation. Designers should also budget for configuration memory (EPCS family) and JTAG programming infrastructure as the EP2S90 cannot self-configure from internal flash.
EP2S90F1020I5N - Stratix II FPGA 90,960 LE | Intel / Altera
The Intel / Altera EP2S90F1020I5N is a high-density Stratix II Field Programmable Gate Array (FPGA) delivering 90,960 logic elements in a 1020-ball FineLine BGA package with industrial temperature grade. The device is fabricated on a 90 nm process and operates from a 1.2 V core supply with serializer/deserializer (SERDES) capable of up to 1 Gbps per channel. According to the Stratix II device handbook, this device family targets high-performance DSP, communications, and signal-processing designs where logic density and embedded multiplier count dominate the design budget. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, and programmable I/O cells, all wired together via a programmable interconnect fabric. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), a sibling category to CPLDs (Complex Programmable Logic Devices); PLDs in turn are a subfamily of digital integrated circuits under the broader semiconductor umbrella. The Stratix II family introduced the adaptive logic module (ALM) architecture that doubled effective logic capacity per LUT versus the original Stratix generation. Key features of the EP2S90F1020I5N include approximately 4.5 Mbits of embedded RAM, up to 12 transceiver channels supporting data rates up to 1 Gbps, dedicated DSP blocks for high-speed multiplication and accumulation, and 1020-ball FineLine BGA packaging optimized for high-pin-count PCB routing. The industrial temperature grade (-40C to +100C ambient at the case) supports deployment in harsh-environment industrial systems. Up to 8 PLLs provide flexible clock management and synthesis for multi-rate system designs. Architecturally, the Stratix II ALM combines an 8-input adaptive look-up table with two dedicated adders, allowing a single ALM to implement a full 3-input adder plus a 4-input LUT without performance penalty. The TriMatrix memory subsystem provides three on-chip memory block sizes (M512, M4K, M-RAM) optimized for different buffer and register-file needs, and dedicated hardware multipliers support 18x18 signed multiplication in a single DSP block cycle. Typical applications include high-throughput digital signal processing for wireless baseband and radar, ASIC prototyping and emulation, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), software-defined radio (SDR) front-ends, and high-performance image processing pipelines. The combination of high logic density, embedded transceivers, and DSP blocks makes it well-suited to designs that previously required discrete processors plus glue logic. When designing with this device, careful attention must be paid to power-integrity analysis because the EP2S90F1020I5N can draw several watts of core current at full utilization; a multi-rail decoupling network with low-impedance bulk capacitors is required, and thermal management must be planned using the published theta-JA and theta-JC values. Designers should also use the Quartus II design software (the design entry toolchain supported by the Stratix II family) to validate pin assignments and timing closure before PCB layout. This page synthesizes distributor pricing from Octopart, drop-in compatible Stratix II speed-grade and package alternatives, and practical design notes that extend beyond the manufacturer datasheet to accelerate board bring-up and supply-chain decision making.
EP2S90F1508C3 - Stratix II 90K LE FPGA, 902 I/O FCBGA-1508 | Intel
The Intel (formerly Altera) EP2S90F1508C3 is a high-density member of the Stratix II FPGA family, delivering 90,960 logic elements, 4,520,488 bits of embedded memory, and 902 user I/O pins in a 1508-ball flip-chip BGA (FCBGA) package. Manufactured on a 90 nm CMOS process, this device integrates up to 12 embedded DSP blocks alongside the ALM-based logic fabric, enabling high-throughput signal processing in a single chip. What is a Stratix II FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable logic device that combines programmable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, multipliers, and high-speed transceivers. The Stratix II family introduced the ALM (Adaptive Logic Module), a successor to the classic 4-input LUT architecture, capable of implementing any function of up to 7 inputs and offering finer-grained logic packing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. Within the Stratix II family, the EP2S90 is the high-density tier beneath the EP2S130 and EP2S180. Key differentiating features of the EP2S90F1508C3 include 90960 logic elements, 4548488 RAM bits, 384 (approximate) 18x18 multipliers via DSP blocks, twelve PLLs for clock management, and 1.2 V core operation. The device supports configuration via JTAG and serial/parallel configuration schemes, and includes dedicated hardware for dynamic reconfiguration, signal integrity, and partial reconfiguration. The "C3" speed grade denotes a commercial temperature grade with the slowest speed bin in the family, while "F1508" identifies the 1508-ball FCBGA package. From an architecture standpoint, the Stratix II device employs a heterogeneous routing fabric with row/column interconnect and tri-matrix memory blocks (M512, M4K, M-RAM), giving designers a flexible mix of small and large memory resources. The DSP blocks support 9-bit, 18-bit, and 36-bit word widths and can be cascaded for high-precision filters and FFTs. Typical applications include telecom baseband processing, high-speed image and video pipelines, ASIC prototyping, test and measurement instrumentation, and high-performance DSP coprocessors. Designers choose the EP2S90F1508C3 when the design requires more logic, memory, and DSP than mid-density FPGAs can provide. When designing with this device, plan PCB layout carefully - the 1508-ball FCBGA at 1.0 mm pitch demands microvia or HDI PCB technology, controlled-impedance routing for high-speed signals, and a multi-layer stackup with solid ground/power planes. Power decoupling must follow the Stratix II pin connection guidelines for VCCINT, VCCIO, VCCA, and VTT rails. This page synthesizes distributor inventory, same-brand drop-in alternatives drawn from the Stratix II family, and practical design notes that complement the manufacturer datasheet.
EP2S90F1508C3N - Stratix II FPGA, 90K LE, 902 I/O, 1508-FBGA | Intel
The Altera (now Intel) EP2S90F1508C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) from the 90 nm process family, integrating 90,960 logic elements, 4,520,488 memory bits, and 902 user I/Os into a 1508-ball FineLine BGA (FCBGA) package. It is rated for commercial temperature operation (speed grade -3) and is targeted at high-performance digital logic, DSP, and memory-intensive designs. The Stratix II architecture introduced adaptive logic modules (ALMs) and on-chip TriMatrix memory that together deliver roughly twice the performance and half the power of the prior Stratix generation. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs / ALMs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy a position between general-purpose microcontrollers and ASICs in the hardware design hierarchy: microcontroller -> microprocessor -> SoC -> FPGA -> ASIC. They are valued for parallel processing, deterministic latency, and rapid design iteration without the NRE cost of an ASIC. Key features of the EP2S90F1508C3N include 4,548 LABs/ALMs organized across the fabric, embedded multipliers for DSP, multiple PLLs and global clock networks, and 902 I/O pins supporting a broad range of single-ended and differential I/O standards (LVTTL, LVCMOS, LVDS, HSTL, SSTL, etc.). The FCBGA package exposes a high pin count that enables wide external memory buses and dense transceiver fan-out. The -3 speed grade indicates a commercial-grade timing bin, and the part is part of a long-running design ecosystem supported by the Altera/Intel Quartus II toolchain. Typical applications include high-speed digital signal processing for radar and beamforming, telecom baseband and protocol processing, high-throughput video processing pipelines, ASIC prototyping and emulation, and industrial control systems requiring parallel I/O. Engineers choose the EP2S90F1508C3N when they need the largest fabric density in the 1508-FBGA package at a specific speed and temperature grade. Designers must pay attention to the FCBGA ball pattern, which demands multi-layer PCB with controlled-impedance routing, microvia stack-ups, and careful power-delivery network design for the core and I/O rails. Stratix II FPGAs require multiple supply rails (VCCINT, VCCIO banks, VCCAUX, VCCPD) that must be sequenced correctly. Thermal management with a heatsink or airflow is typically required at full utilization and high toggle rates. This page synthesizes real distributor pricing, drop-in alternatives from the same Stratix II family, and practical design considerations that are not consolidated on any single distributor page.
EP2S90F1508C4 - 90K LE Stratix II FPGA, 1508-FCBGA | Altera
The Altera (now Intel) EP2S90F1508C4 is a high-density Stratix II family Field Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 90,960 logic elements across 4,548 Logic Array Blocks (LABs) and delivering 902 user I/Os in a 1508-ball flip-chip BGA (FC-FBGA) package. Operating at a core voltage of 1.2 V with a maximum internal clock frequency of 711.24 MHz, the device is positioned as a logic-rich DSP-capable platform for ASIC prototyping, high-speed datapath bridging, and communications infrastructure. The FC-FBGA-1508 substrate provides the dense signal escape and thermal envelope required by the Stratix II die, while supporting up to 4,520,488 bits of embedded memory. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer after manufacturing, containing an array of programmable logic blocks, programmable interconnect, and I/O pads. Stratix II FPGAs sit within the broader taxonomy of programmable logic devices (PLD), specifically as high-performance SRAM-based FPGAs (synthesizable ASIC replacement > ASIC-prototyping > high-end programmable logic > semiconductor). They are widely used for parallel DSP, packet processing, and protocol bridging, where deterministic latency and high logic density outperform fixed-function ASICs. Key features of the EP2S90F1508C4 include up to 727 DSP blocks, dedicated high-speed transceivers for external memory interfaces, and hardened IP for DDR/DDR2 SDRAM and QDRII SRAM controllers. The architecture supports a multi-level routing fabric with row/column interconnect, and each LAB contains 10 Adaptive Logic Modules (ALMs) for efficient arithmetic and register packing. The 1508-ball FC-FBGA package exposes 902 user I/Os, making it suitable for systems requiring many parallel interfaces or wide external memory buses. Typical applications include high-end ASIC prototyping, digital video broadcast encoders, telecom line-card packet processing, military radar signal processing, and test & measurement instrumentation. When designing with this device, ensure power-rail sequencing meets the Stratix II power-on-reset requirements and that the FC-BGA land pattern and via-in-pad stack-up match the Altera reference design. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2S90F1508C4N - 90K LE Stratix II FPGA, 902 I/O, 1508-BGA | Intel
The Intel (formerly Altera) EP2S90F1508C4N is a high-density Stratix II Field Programmable Gate Array (FPGA) built on a 90 nm CMOS process, delivering 90,960 logic elements (LEs), 4,520,488 bits of embedded memory, and 4548 Logic Array Blocks (LABs) in a 1508-ball Flip-Chip BGA (FC-FBGA) package. It operates from a 1.2 V core supply with a maximum internal frequency of 711.24 MHz, and provides 902 user I/O pins for high-bandwidth parallel interfaces. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that can be configured post-manufacture to implement arbitrary digital circuits. Stratix II belongs to the high-performance FPGA family tier, sitting above Cyclone (cost-optimized) and below Stratix GX/GT (transceiver-equipped) variants. FPGAs occupy the same broad product category as ASICs, CPLDs, and microcontrollers, but offer unique advantages in parallelism, reconfigurability, and time-to-market for DSP, communications, and prototyping workloads. Key features of the EP2S90F1508C4N include 12 dedicated PLLs (Phase-Locked Loops) for clock synthesis, up to 4 Mb of TriMatrix embedded memory distributed across MRAM, M512, and M4K blocks, dedicated DSP blocks for high-throughput arithmetic, and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM II. The device family integrates high-speed serial I/O capability through dedicated DPA circuitry, and supports LVDS, LVPECL, and HSTL I/O standards with user-selectable drive strength from 2 mA to 24 mA. The architecture combines Adaptive Logic Modules (ALMs) - each containing two 4-input LUTs, two programmable registers, and dedicated adder circuitry - with MultiTrack interconnect that delivers predictable timing closure at 90 nm node performance targets. Embedded memory blocks support true dual-port operation and mixed-width data paths, while DSP blocks deliver up to 36 x 36 bit multiplies per block at full pipeline speed. Typical applications include high-speed digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, telecommunications infrastructure (SONET/SDH, OTN framers), high-performance computing accelerators, video processing pipelines, and military/aerospace embedded systems. Designers select this part when logic density above 70K LEs is required together with abundant embedded memory and DSP resources in a single device. When designing with this device, pay close attention to power supply decoupling (a Stratix II FPGA typically requires multiple 1.2 V, 2.5 V, and 3.3 V rails with strict sequencing requirements), thermal management (the 1508-ball FCBGA exposes a thermal pad that must be soldered to a properly sized PCB copper pour), and signal integrity on 902 simultaneously-switching outputs (SSO analysis is mandatory). Quartus II is the supported design toolchain. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix II family, and practical design notes not found in the manufacturer datasheet - giving engineers a faster sourcing and evaluation workflow.
EP2S90F1508C5 - 90k LE Stratix II FPGA 1508-FCBGA | Intel
The Intel EP2S90F1508C5 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 90,960 logic elements, 4,520,488 bits of embedded memory, and 902 user I/O pins in a 1508-ball FineLine BGA (FCBGA) package. Built on a 1.2 V, 90 nm CMOS process, it integrates 36,384 adaptive logic modules (ALMs/CLBs) and 12 dedicated DSP blocks that together reach up to 568 GMACs of DSP throughput. An FPGA (Field Programmable Gate Array) is a semiconductor IC whose logic fabric, routing, and I/O can be reconfigured after manufacture via a hardware description language bitstream. Stratix II belongs to the high-performance FPGA family that sits hierarchically above CPLDs, DSPs, and general-purpose microcontrollers for parallel processing tasks, and it forms part of the broader programmable logic device (PLD) class within Intel's programmable solutions group. The 1508-pin FCBGA at 40 x 40 mm with 1 mm ball pitch targets high-I/O density board designs. Key features include 12 transceiver channels, embedded TriMatrix memory blocks supporting up to 4.5 Mbit, dedicated DDR/DDR2 SDRAM and QDR II SRAM interfaces with PHY, 8 input phase-locked loops (PLLs), and a 36 x 36-bit embedded multiplier structure. The flexible signal standards support LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X via configurable I/O banks. Hot-socketing and partial reconfiguration are supported in-system. Architecturally, the Stratix II fabric replaces the classic 4-input LUT of Stratix I with an adaptive logic module that combines two 4-LUTs and dedicated register chains, giving the device an effective logic density advantage. Row- and column-based interconnect, combined with direct-drive interconnect for high-fanout signals, delivers consistent timing closure at 500 MHz+ internal operation and 640 MHz memory interface rates typical of this -5 speed grade. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom line cards, video broadcasting infrastructure, and high-speed serial protocol bridging. The combination of embedded transceivers and abundant logic makes it equally suited for radar baseband, medical imaging pipelines, and test & measurement platforms. When designing with this device, plan for a 1.2 V core and separate PLL/VCCIO analog supplies; the 1508-ball package requires careful BGA fanout, microvia stack-ups, and thermal vias to the 1.0 mm pitch pads. Bitstream encryption and JTAG-based configuration via the EPC device family or external flash should be reserved for production boots. This page consolidates authorized distributor pricing, drop-in equivalents in the same 1508-FCBGA footprint, and practical PCB layout notes - engineering context not found in the manufacturer datasheet alone.