FPGA & CPLD
Products (6358)
EP3C5E144I7 - Cyclone III FPGA 5K LE, 144-EQFP | Altera / Intel
The Altera (now Intel) EP3C5E144I7 is a low-power, low-cost Cyclone III FPGA from the EP3C5 family, packaged in a 144-pin EQFP (Plastic Enhanced Quad Flat Pack) with exposed thermal pad. The device integrates 5,136 logic elements (LEs), 423,936 bits of embedded memory, and 94 user I/O pins fabricated on TSMC's 65nm low-power process. It is rated for industrial temperature range (-40C to +100C junction) and operates from a 1.2V core supply with separate PLL and I/O bank voltages. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric is organized as an array of configurable logic blocks (CLBs) connected through programmable interconnect and surrounded by I/O and hard IP blocks (memory, multipliers, PLLs, transceivers). FPGAs occupy the 'programmable logic' tier of the broader semiconductor hierarchy: ASIC < CPLD < FPGA < SoC FPGA < CPU/GPU. Unlike fixed-function ASICs, FPGA logic can be reconfigured in-circuit any number of times, which makes them the standard implementation platform for prototyping, low-volume production, and applications requiring late-stage hardware revision. Cyclone III specifically targets cost- and power-sensitive applications such as industrial control and video/display bridging, where higher-end Stratix devices would be overkill. Key features of the EP3C5E144I7 include two general-purpose PLLs per device, support for multiple I/O standards (LVDS, SSTL, LVCMOS, PCI) with 8 I/O banks, embedded 18x18 multipliers for DSP, and Cyclone III's signature low-power architecture (less than 0.5W static). The 144-pin EQFP exposed-pad package provides enhanced thermal dissipation compared to non-EP variants, important for sustained industrial-grade operation. The device is supported by Altera Quartus II design software (now Intel Quartus Prime) and includes configuration options such as active serial (AS), passive serial (PS), and JTAG. Typical applications span industrial motor control, video processing bridges, automotive infotainment prototypes, custom peripheral glue logic, and portable/mobile embedded platforms. Cyclone III devices balance logic density and power efficiency for designs in the 5K-120K LE range. When designing with the EP3C5E144I7, plan for at least 4 dedicated power rails (VCCINT 1.2V, VCCAUX 2.5V, VCCIO bank-dependent, VCCD_PLL) and follow Altera's decoupling and PCB layout guidelines. Use the Quartus II PowerPlay analyzer early to verify thermal feasibility before committing to PCB layout. This page synthesizes distributor pricing, drop-in pin-compatible variants, and practical Quartus II design notes not consolidated on the manufacturer product page.
EP3C5E144I7N - Cyclone III FPGA, 5K LE, 144-EQFP | Intel
The Intel (formerly Altera) EP3C5E144I7N is a low-power, low-cost Cyclone® III Field-Programmable Gate Array (FPGA) offering 5,136 logic elements, 423,936 bits of embedded memory, and 94 user I/O pins in a 144-pin EQFP (plastic enhanced QFP) package with exposed pad. It is built on a 60 nm, low-k dielectric process and operates from a 1.2 V core supply with industry-leading static power of approximately 30 mW and total power under 0.75 W at full logic utilization. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic is defined after manufacture by the user, belonging to the broader family of programmable logic devices (PLDs) and sitting alongside CPLDs, ASICs, and microcontrollers as the highest-density option for custom digital hardware. Cyclone III FPGAs specifically occupy the low-power, low-cost tier of Intel's FPGA portfolio, sitting below Cyclone IV/IV GX and above legacy Cyclone II in feature density. Key features of the EP3C5E144I7N include up to 23 embedded 18×18 multipliers (suitable for DSP blocks), 4 PLLs for clock management, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and a maximum internal clock frequency rating of approximately 437.5 MHz. The device supports JTAG (IEEE 1149.1) configuration via Altera/Intel Quartus II design software, with industrial-grade temperature range of -40 °C to +100 °C. Architecturally, the Cyclone III device integrates dedicated RAM blocks (M9K), multiplier blocks, and Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). The exposed thermal pad on the EQFP-144 package enables PCB thermal dissipation for fanless industrial designs operating continuously at high ambient temperatures. Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (I2C/SPI/UART to parallel), LED display controllers, handheld test instruments, and consumer electronics requiring custom glue logic. The 1.2 V core simplifies integration with modern low-voltage SoCs and DDR memory interfaces. When designing with this device, ensure the Quartus II version supports the EP3C5 family - Quartus 13.0sp1 or later is recommended, with the older Quartus II Web Edition 9.1 still functional for low-utilization designs. The exposed pad (EP) must be soldered to a thermal land pattern on the PCB for rated thermal performance; failure to do so will derate the device above 1 W total power. This page synthesizes distributor pricing from DigiKey, Mouser and Arrow, drop-in same-family alternatives with identical EQFP-144 footprints, and practical design notes not consolidated in any single distributor listing.
EP3C5F256A7N - Cyclone III FPGA, 5136 LE, 256-FBGA | Intel / Altera
The Intel (formerly Altera) EP3C5F256A7N is a low-power, low-cost Cyclone III Field Programmable Gate Array (FPGA) featuring 5,136 logic elements, 423,936 bits of embedded memory, and 182 user I/O pins, housed in a 256-ball FineLine BGA (FBGA-256) package. Built on a 65 nm CMOS process, this device operates at a 1.2 V core supply and supports automotive-grade qualification per AEC-Q100 across the extended -40 °C to +125 °C temperature range. The Cyclone III family targets high-volume, cost-sensitive applications where FPGA flexibility must coexist with tight power and BOM budgets. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that lets engineers implement arbitrary digital logic — from simple glue logic to complete processor cores — through a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices -> programmable logic ICs -> digital ICs -> semiconductors. Unlike ASICs, FPGAs are post-fabrication reprogrammable, enabling rapid prototyping, in-field upgrades, and design error recovery. Cyclone III FPGAs specifically target the low-power, low-density end of the FPGA market. Key features of the EP3C5F256A7N include 321 logic array blocks (LABs), up to 23 embedded 18 × 18 multipliers suitable for DSP operations, embedded M9K memory blocks totaling 423,936 RAM bits, and dedicated global clock networks. The device also includes a hard memory controller, support for external DDR/DDR2 memories, and multiple I/O standards (LVCMOS, LVTTL, LVDS, SSTL) on most user pins. Configuration can be performed via JTAG, Active Serial (AS), or Passive Serial (PS) modes using commodity flash memory. Architecturally, Cyclone III devices use a four-input look-up table (LUT) based logic fabric combined with dedicated routing, variable-sized embedded memory, and hard multipliers. The 65 nm low-power process allows static and dynamic power consumption to be considerably lower than prior Cyclone generations, making the family suitable for thermally constrained enclosures. The device supports hot-socketing and I/O pre-emphasis features that simplify board bring-up. Typical applications include automotive driver-assistance interfaces, industrial machine control, low-cost video processing pipelines, motor drive peripherals, and protocol bridging (I2C/SPI/UART/Ethernet) on factory automation buses. The 256-ball FBGA package exposes enough I/O and memory bandwidth to host a soft Nios II processor plus several custom peripherals in a single device. When designing with this FPGA, allocate at least one configuration mode (typically AS with a serial flash) and provide proper decoupling per the device family datasheet. Thermal dissipation remains modest thanks to the 65 nm low-power process, but designers should still observe the recommended PCB footprint, ball-to-trace via pattern, and keep critical clock traces matched. Verify JTAG chain ordering if multiple devices share the bus. This page synthesizes distributor stock, parametric alternatives, and practical design considerations not found in the manufacturer datasheet alone.
EP3C5F256C6 - Cyclone III FPGA 5K LE, 256-FBGA | Intel / Altera
The Intel (formerly Altera) EP3C5F256C6 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm CMOS process, delivering 5,136 logic elements, 182 user I/Os, and 423,936 bits of embedded memory in a 256-ball FineLine BGA (FBGA) package. It operates across a 1.15 V to 1.25 V core voltage range with industrial-grade temperature support, targeting cost-sensitive applications that need a balance of logic density, memory, and DSP capability without the power budget of higher-end FPGA families. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows hardware designers to configure digital logic blocks, routing, and I/O after fabrication. Within the broader hierarchy, FPGAs sit below ASICs in performance-per-watt but above CPLDs in logic capacity, making them the workhorse of rapid prototyping, low-volume production, and accelerator designs. The Cyclone III family specifically targets low static and dynamic power consumption versus the older Cyclone II generation. Key features include 5,136 logic elements, 423,936 RAM bits distributed across M9K blocks, 23 embedded 18x18 multipliers for DSP-style arithmetic, and up to 182 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL, and other single-ended standards. The device integrates four phase-locked loops (PLLs) for clock generation and skew management, plus configuration support via active serial (AS), passive serial (PS), and JTAG interfaces. Architecturally, the Cyclone III LE combines a 4-input look-up table (LUT) with a programmable register, embedded memory blocks, and dedicated multiplier hardware on a low-k, 65 nm process. This combination allows designers to implement soft-core processors (such as Nios II), custom peripherals, and DSP datapaths on a single device while keeping power in the hundreds of milliwatts range. Typical applications include industrial motor control and machine vision, low-cost video processing pipelines, communications protocol bridging (SPI, I2C, UART, Ethernet MAC glue logic), consumer electronics display controllers, and educational/development platforms where the Quartus II design toolchain is supported. The 256-FBGA package offers a compact 17 mm x 17 mm footprint with 1.0 mm ball pitch suitable for multilayer PCBs. When designing with this FPGA, plan power sequencing for the core and I/O banks, provide adequate decoupling on every bank supply, and use the Quartus II PowerPlay estimator early to verify thermal margins under your worst-case toggle rate. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the bare manufacturer datasheet.
EP3C5F256C6N - Cyclone III FPGA, 5K LEs, 256-FBGA | Intel
The Intel (formerly Altera) EP3C5F256C6N is a low-power Cyclone III Field Programmable Gate Array (FPGA) with 5136 logic elements, 423936 bits of embedded memory, and 182 user I/Os, housed in a 256-ball FineLine BGA (FBGA-256) package. Built on a 65 nm CMOS process and supplied from a 1.2 V core rail with 3.3 V LVCMOS I/O support, the device targets cost-sensitive, power-aware applications. Operating junction temperature spans 0 C to +85 C in the commercial "C6" speed grade. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor containing an array of programmable logic blocks, embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric. FPGAs occupy the top of the programmable logic hierarchy below custom ASICs: PLA -> CPLD -> FPGA -> ASIC. The Cyclone III family was engineered as Intel/Altera's lowest-power 65 nm FPGA line, enabling fanless operation in cost-driven designs that previously required discrete logic or microcontrollers. Key features include 23 embedded 18x18 multipliers for DSP, two PLLs per device, support for external memory interfaces such as DDR/DDR2 SDRAM and QDRII SRAM, and configurable I/O standards including LVDS, LVTTL, SSTL, and PCI. The Cyclone III architecture supports up to 120 K logic elements at the family level and ships with Quartus II design tools (now Quartus Prime Lite). Configuration is via serial or parallel flash, JTAG, or AS/PS modes. Typical applications include industrial motor control and human-machine interfaces, video processing pipelines, low-volume ASIC prototyping, consumer display controllers, and portable/wireless protocol bridging. The 256-FBGA package with 1 mm ball pitch supports dense multi-layer PCB layouts while maintaining 17x17 mm board area. When designing with this device, plan I/O bank assignments against VCCIO supply rails, allocate sufficient decoupling per bank, and reserve dedicated clock pins for PLL inputs. Quartus II design software provides free synthesis support for the entire Cyclone III family. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C5F256C7 - Cyclone III FPGA, 5,136 LE | Altera
The Altera EP3C5F256C7 is a Cyclone III FPGA that integrates 5,136 logic elements, 423,936 RAM bits and 182 user I/O pins in a 256-ball LBGA package. Built on a 65 nm process with a 1.2 V core supply, it is rated for a listed 437.5 MHz internal clock frequency and is intended for low-cost, high-volume logic integration in commercial equipment. An FPGA, or field-programmable gate array, is a reconfigurable integrated circuit whose logic fabric, routing and I/O behavior are defined after manufacturing by a configuration bitstream. Inside an FPGA hierarchy, the EP3C5F256C7 belongs to FPGA -> programmable logic -> integrated circuit, sitting above CPLDs in density but below high-end transceiver-rich FPGAs. Designers use FPGAs when requirements change after production or when parallel, low-latency custom datapaths are more efficient than a microcontroller or ASIC. The Cyclone III family specifically targets low-power, cost-sensitive applications. Key features include 5,136 logic elements for implementing state machines, counters and datapath logic; 423,936 RAM bits for FIFO and line buffers; 182 user I/O configured to various voltage levels and I/O standards; and a 256-ball BGA enabling compact routing. The 1.2 V core and 65 nm process reduce static and dynamic power relative to older 90 nm FPGAs. The commercial C7 ordering grade balances speed and temperature for standard equipment. At the architecture level, the 65 nm fabric uses logic array blocks connected by programmable routing; embedded memory and I/O elements are fixed resources surrounding the core. Designers compile HDL with Intel/Altera Quartus II or Quartus Prime, which maps logic, performs placement and routing, and generates bitstreams stored in EPCS or EPCQ serial configuration devices. The 437.5 MHz figure from distributor data indicates the internal clock performance achievable for speed grade 7 in favorable designs; final Fmax depends on placement, fanout and I/O standard. The 256-ball LBGA package is square with ball terminals, allowing four-layer board integration. Typical applications include motor-control platforms requiring flexible I/O mapping, low-cost video processing where parallel pixel data is manipulated, industrial communication bridges, and test instruments. Its 5,136 logic elements fit compact soft processors, custom serial interfaces and real-time control. Design with adequate decoupling on VCC, VCCIO and PLL supplies, and store the configuration bitstream in a dedicated serial configuration memory. Because this density offers only 182 I/O, verify pin assignments before layout and review power integrity at the 1.2 V core. This page compounds distributor pricing and availability, same-family drop-in alternatives, and practical integration notes beyond the raw datasheet. Facts here were checked against DigiKey, Mouser, Heisener, Octopart and datasheet-aggregator records in September 2026.
EP3C5F256C7N - Cyclone III FPGA, 5K LEs, 256-FBGA | Intel / Altera
The Intel / Altera EP3C5F256C7N is a low-power Cyclone® III Field-Programmable Gate Array (FPGA) delivering 5,136 logic elements, 423,936 bits of embedded memory, and 182 user I/Os in a 256-ball FineLine BGA (FBGA-256) package. Built on a 65 nm low-power process, this Cyclone III device targets cost-sensitive, high-volume applications where low static and dynamic power consumption matter as much as logic density. The 'F256' suffix denotes the 256-pin FBGA package, the 'C7' speed grade indicates a commercial -7 timing bin, and the trailing 'N' marks lead-free / Pb-free assembly. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O blocks can be programmed after manufacturing to implement arbitrary digital functions. The Cyclone III family sits within Intel's (formerly Altera's) low-cost FPGA portfolio, hierarchically positioned as: logic element -> Logic Array Block (LAB) -> FPGA fabric -> programmable logic device (PLD) -> semiconductor. Compared with CPLDs and small ASICs, FPGAs offer parallel processing, hardware-timed I/O, and on-chip memory blocks suited to data-path, glue-logic, and signal-processing tasks. The EP3C5 sits at the entry of the Cyclone III range, making it ideal for bridging CPLD-scale designs into FPGA-class performance. Key features of the EP3C5F256C7N include up to 182 general-purpose I/Os with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), embedded 18x18 multipliers for low-density DSP tasks, and up to 46 embedded M9K memory blocks (approximately 414 Kbits of RAM). The device supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with built-in compression and decompression of configuration bitstreams. On-chip PLLs allow frequency synthesis and clock-tree management for multi-domain designs. Typical applications include industrial control and motor drive interfaces, low-cost video processing pipelines, I/O expansion and protocol bridging (UART, SPI, I2C, parallel buses), LED display controllers, and consumer-electronics glue logic. The 256-FBGA package offers compact board area while preserving high I/O count and signal integrity for mixed-signal boards. Designers should evaluate Quartus II / Quartus Prime for synthesis and timing closure, and verify the -7 commercial speed grade against their target fMAX requirements.
EP3C5F256C8 - Cyclone III FPGA 5K LE, 256-FBGA, -40 to 125C | Intel
The Intel (formerly Altera) EP3C5F256C8 is a low-power Cyclone III Field Programmable Gate Array (FPGA) with 5,136 logic elements, 423,936 bits of embedded memory, and 182 maximum user I/O pins, housed in a 256-ball FineLine BGA (FBGA-256) package. It operates across the commercial-to-industrial -40°C to +125°C junction temperature range and targets cost-sensitive, power-sensitive programmable logic designs. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> semiconductor ICs, and are used wherever a fixed-function ASIC is too expensive or inflexible. Cyclone III devices in particular occupy the low-power, low-cost end of the FPGA hierarchy, optimized for volume production in industrial, consumer, and communications systems. Key features of the EP3C5F256C8 include up to 5,136 logic elements (LEs), 423,936 total RAM bits (approximately 414 Kbits of M9K block memory), 182 maximum user I/O pins, two general-purpose PLLs per device quadrant, and 4-Mbit flash configuration storage support via serial or parallel configuration schemes. The Cyclone III architecture uses a 65 nm low-power process and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, allowing direct interface to DDR/DDR2 memory and a wide range of microcontrollers. The Cyclone III family combines hard multipliers for DSP, embedded memory blocks, and a global/regional clock network, enabling applications in motor control, video processing, and software-defined radio without external DSP or memory devices. The device supports Nios II embedded processor soft cores, allowing on-chip microcontroller functionality. Configuration can be loaded via JTAG, Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) modes. Typical applications include industrial machine vision, factory automation controllers, motor and motion control drive boards, low-cost software-defined radio front-ends, video surveillance recorders, and consumer display controllers. The 182 I/O count and 256-FBGA footprint are ideal for medium-density glue-logic replacement, custom interface bridging, and protocol conversion designs. When designing with this FPGA, ensure the JTAG chain is properly terminated and that decoupling capacitors are placed as close as possible to all VCCINT, VCCA, and VCCIO pins per the Cyclone III Hardware Reference Manual. Thermal management via copper pours under the BGA is essential for sustained operation near the 125°C junction limit, especially when many I/O banks toggle simultaneously at high speed. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone.
EP3C5F256C8N - Cyclone III FPGA 5K LEs 256-FBGA | Altera
The Altera (now Intel) EP3C5F256C8N is a Cyclone III Field-Programmable Gate Array (FPGA) with 5,136 logic elements, 423,936 bits of embedded memory, and 23 embedded 18x18 multipliers, packaged in a 256-ball FineLine BGA (FBGA-256). It operates from a 1.15V to 1.25V core supply and supports commercial-grade junction temperatures from 0°C to 85°C. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and embedded memory/DSP resources that can be re-programmed by the designer after manufacture. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they offer hardware-level parallelism and deterministic timing while still allowing iterative logic changes. Cyclone III sits in the low-power, low-cost segment of the FPGA hierarchy (FPGA → programmable logic → PLD → digital IC), making it suitable for cost-sensitive, high-volume designs that still need hardware acceleration. Key features of the EP3C5F256C8N include 182 user I/Os, 4 phase-locked loops (PLLs), 66.5 MHz global clock networks, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device uses SRAM-based configuration cells, allowing unlimited in-system re-programmability. The 65nm process technology delivers an optimal balance of logic density and static power consumption. Architecturally, the device arranges its 5,136 logic elements into vertically organized Logic Array Blocks (LABs), interconnected by a hierarchical MultiTrack interconnect fabric with low-skew clock distribution. The 23 dedicated 18x18 multipliers enable efficient DSP operations without consuming general-purpose logic resources, supporting applications such as motor control, video processing, and serial protocol bridging. Typical applications include industrial control and machine networking, video surveillance, low-cost digital signal processing, motor control and encoder interfacing, automotive telematics, serial protocol bridging (UART/SPI/I2C to high-speed interfaces), consumer electronics display controllers, and portable test and measurement equipment. The Cyclone III family's low static power (~0.5mW per LE typical) makes it particularly suitable for thermally constrained or battery-aware designs. When designing with this device, ensure adequate decoupling on all supply rails and that the configuration mode (AS, PS, JTAG, or Fast Passive Parallel) matches the system's boot strategy. Designers migrating to newer Intel Cyclone families should plan for I/O bank voltage and pin-out differences even when targeting the same FBGA-256 footprint. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not consolidated in the original manufacturer datasheet, giving procurement and engineering teams a single reference for the EP3C5F256C8N.
EP3C5F256I7 - Cyclone III FPGA 5136 LE 256-BGA | Intel
Intel EP3C5F256I7 is a Cyclone III field-programmable gate array (FPGA) containing 5,136 logic elements, 423,936 RAM bits, and up to 182 user I/O pins in an industrial-temperature 256-ball FineLine BGA (FBGA-256) package. It is used in cost-sensitive applications that need reprogrammable parallel logic rather than a fixed-function ASIC or MCU. An FPGA is an integrated circuit whose digital logic can be configured by the designer after manufacturing. In the component hierarchy, an FPGA is a programmable logic device (PLD) under the broader integrated circuit category, and it differs from a microcontroller by implementing parallel hardware logic instead of sequential software instructions. The EP3C5F256I7 is part of Intel's Cyclone III family, a mid-capacity low-cost FPGA line that balances logic density, memory, I/O count, and package size for industrial and communications systems. The EP3C5F256I7 combines 5,136 logic elements with 423,936 bits of embedded RAM, 182 user I/O pins, and a 256-ball FBGA package. This capacity allows small state machines, UART/SPI bridges, FIFO buffers, image line buffers, motor-control logic, and communication protocol engines to be implemented in a single device. The industrial-temperature ordering option indicates the device is intended for extended-temperature equipment rather than consumer-only environments. The device uses a square, ball-terminated FBGA-256 package with a lead-free finish according to the verified distributor listing. The high user-I/O count exposes most internal signals to board-level interfaces, making the FPGA practical as a glue-logic, pre-processing, or interface bridging element in a larger electronic system. Because Cyclone III devices are SRAM-based FPGAs, they require an external configuration device or host controller to load the bitstream after power-up. Typical applications include industrial motor and PLC control, machine-vision image preprocessing, Ethernet and serial protocol bridging, data-acquisition front ends, and medical monitoring equipment. The 182 user I/O signals can connect to ADCs, DACs, sensors, memory buses, transceivers, and parallel LCD or LED interfaces. When designing with the EP3C5F256I7, plan for BGA fanout and adequate power decoupling, and verify that the external configuration-source choice is compatible with required boot time and update flow. Use Intel Quartus software for pin assignment validation against the target board footprint. The package and pin count are significant PCB layout constraints. This page adds practical value beyond a datasheet by combining distributor sources, same-family drop-in alternatives, estimated pricing, design guidance, and application context that helps engineers confirm the EP3C5F256I7 fits before committing to a layout.
EP3C5F256I7N - Cyclone III FPGA, 5K LEs, 256-FBGA | Intel
The Intel (Altera) EP3C5F256I7N is a low-cost, low-power Cyclone III Field-Programmable Gate Array (FPGA) featuring 5,136 logic elements, 423,936 bits of embedded memory, and 182 user I/Os in a 256-pin FineLine Ball-Grid Array (FBGA) package. Built on a TSMC 65nm low-power process, the device integrates 26 embedded 18x18 multipliers, 23 embedded PLLs, and supports configuration via active serial, passive serial, JTAG, or Fast Passive Parallel modes. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that engineers can re-program after manufacture to implement custom digital logic. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), and are distinguished from ASICs by their in-system re-programmability, faster prototyping cycles, and lower upfront NRE costs. The Cyclone III family targets cost-sensitive, high-volume applications where traditional FPGAs were too expensive or power-hungry. Key technical features include 66 embedded 9-bit multipliers (configurable as 26 18x18 multipliers), 423,936 total RAM bits organized as M9K memory blocks, two PLLs per quadrant for fine-grained clock management, and 1.0V/1.2V core operation with LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports up to 472.5 MHz internal operation and is qualified for industrial temperature range (-40C to +125C). The Cyclone III architecture separates logic, routing, and dedicated DSP/memory resources into four quadrants, allowing predictable timing closure. Hard IP blocks (PLLs, multipliers, M9K RAMs) reduce logic-element usage and lower power compared to soft implementations, making EP3C5F256I7N well suited to motor control, video processing, and industrial protocol bridging where deterministic performance and low static power are required. Typical applications include industrial motor control and encoder interfacing, video surveillance image preprocessing, low-cost protocol bridges (UART/SPI/I2C to Ethernet), automotive infotainment sub-systems, and LED display controllers. The 256-FBGA package provides high I/O density in 17x17 mm, suitable for compact PCBs requiring up to 182 user I/Os. When designing with EP3C5F256I7N, ensure the Quartus II / Quartus Prime toolchain version matches the silicon revision, and follow Intel's recommended decoupling scheme (100 nF + 10 uF per power pin). For multi-rail sequencing, the device does not include an internal POR - use an external supervisor IC. The 256-FBGA requires 1.0 mm pitch, NSMD land pads with 0.4 mm diameter for reliable reflow. This page synthesizes distributor pricing, drop-in same-package alternatives (all in the 256-FBGA footprint), and practical Quartus toolchain guidance not consolidated in the manufacturer datasheet.
EP3C5M164C7N - Cyclone III FPGA 5K LEs 164-MBGA | Intel / Altera
The Intel (formerly Altera) EP3C5M164C7N is a low-power, low-cost Cyclone III Field Programmable Gate Array (FPGA) housed in a 164-ball FineLine BGA (MBGA, 8x8 mm, 0.5 mm pitch) package, featuring 5,136 logic elements, 423,936 bits of embedded memory, and 106 user I/O pins. Built on a 65 nm TSMC low-power process, the device targets cost-sensitive, volume-driven digital logic applications that previously required ASIC-class integration. The 'C7N' suffix denotes the commercial 0C to +85C operating range with Pb-free / lead-free packaging. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened I/O, all of which can be re-wired by the user after manufacturing. FPGAs sit hierarchically between standard microcontrollers and ASICs in the design complexity spectrum, offering hardware-level parallelism that microcontrollers cannot match, while costing far less than a full ASIC for low-to-medium volumes. The Cyclone III family specifically targets applications requiring thousands of logic elements at single-digit-watt power budgets. Key features of the EP3C5M164C7N include 5,136 logic elements, approximately 423 Kbits of embedded M9K RAM, 23 embedded 18x18 multipliers (PLL/DSP blocks), up to 4 PLLs for clock management, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The 164-MBGA package combines small footprint with high I/O count, and the commercial temperature grade suits industrial control, consumer electronics, and prototype designs. Typical applications include motor control and drive interfaces, LED display controllers, video processing pipelines, industrial machine vision, low-cost software-defined radio front-ends, and educational/development platforms where a balance of logic capacity, I/O count, and unit cost is critical. The 164-ball MBGA package also enables compact PCB layouts in space-constrained products. When designing with this device, ensure proper decoupling (100 nF + bulk caps near each VCC/ground pair), strict length-matched routing for DDR memory interfaces, and adequate thermal relief via inner copper ground planes. The configuration scheme (JTAG, AS, or PS) must be decided early; the EPCS serial configuration device typically pairs with Cyclone III in production.
EP3C5M164C8N - Cyclone III FPGA, 5136 LEs, 164-MBGA | Altera
The Altera (Intel) EP3C5M164C8N is a low-power Cyclone III Field Programmable Gate Array (FPGA) built on a 65 nm process, offering 5136 Logic Elements (LEs), 414 kbit of embedded memory, and 23 dedicated 18x18 embedded multipliers. It is housed in a 164-ball Micro FineLine BGA (MBGA) package and operates from a 1.15 V to 1.25 V core supply at a maximum internal clock frequency of 402 MHz, with up to 106 user I/O pins. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines programmable logic fabric (lookup tables, flip-flops, routing, and embedded memory blocks) into a single semiconductor IC. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, and are used when design requirements include parallelism, real-time signal processing, or post-manufacture reconfigurability. Cyclone III is positioned as a low-cost, low-power family in Altera's (now Intel) FPGA portfolio, optimized for high-volume cost-sensitive applications. Key features include 5,136 vertically arranged Logic Elements, 423,936 bits of total embedded memory organized into M9K blocks, 23 18x18 hardware multipliers, two PLLs per device for clock management, and support for common I/O standards such as LVDS, LVCMOS, SSTL, and PCI. The device is available in commercial (C8, -40C to +85C) and industrial (I7/I8, -40C to +100C) temperature grades. The Cyclone III architecture integrates logic, DSP blocks, and memory in a tile-based fabric. The 65 nm process enables low static and dynamic power, while the 18x18 multipliers support efficient DSP operations such as FIR filters and FFTs. The PLLs provide frequency synthesis, phase shifting, and clock deskewing for high-speed designs. Typical applications include industrial control and motor drive, consumer video processing, automotive infotainment, software-defined radio front-ends, low-cost prototyping, and embedded DSP systems. The 164-MBGA package supports a compact PCB footprint while providing 106 user I/O pins for moderate-density designs. When designing with this device, ensure the 1.2 V core supply is properly decoupled with low-ESR ceramic capacitors placed close to the power pins, and follow Altera's Cyclone III Hardware Reference Manual for configuration pin connections (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) to select the appropriate configuration mode. This page synthesizes distributor pricing, drop-in package alternatives within the Cyclone III family, and practical design notes not found in the manufacturer datasheet.
EP3C5M164I7 - Cyclone III FPGA, 5K LE, 164-MBGA | Intel
The Intel (formerly Altera) EP3C5M164I7 is a low-power Cyclone III field-programmable gate array (FPGA) with 5,136 logic elements, 423,936 bits of embedded memory, and 106 user I/O pins, housed in a 164-ball FineLine BGA (MBGA) package. Built on a 65 nm low-power process, it integrates up to 23 embedded 18x18 multipliers, 2 PLLs per device quadrant, and supports Nios II embedded processor soft cores for custom SoC designs. The industrial temperature grade (-40C to +100C junction) is denoted by the trailing "I7" in the MPN. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O behavior can be programmed after manufacture. Within the broader semiconductor taxonomy, the EP3C5M164I7 sits in the programmable logic device (PLD) hierarchy: FPGA -> PLD -> logic IC -> integrated circuit. Cyclone III specifically targets cost- and power-sensitive applications that need DSP, memory buffering, and parallel I/O without the cost of high-end Stratix-class FPGAs. Key features include 5,136 logic elements (LEs), 423,936 bits (approximately 50 Kbyte) of embedded SRAM distributed in M9K blocks, up to 23 dedicated 18x18 multipliers for DSP operations, and 4 PLLs for clock management. The 164-MBGA package offers a compact 8x8 mm footprint, ideal for space-constrained boards. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability and supports configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. Typical applications include industrial motor control, video bridging, sensor aggregation, low-cost DSP front-ends, and I/O expansion for microcontrollers. The 164-ball BGA provides sufficient I/O count for parallel RGB video capture, multi-channel UART/SPI bridging, and high-speed ADC/DAC interfacing. Designers favor Cyclone III for price-sensitive production runs where the legacy Altera toolchain (Quartus II) and IP libraries are already in use. When designing with this FPGA, plan for 1.2 V core and 2.5 V/3.3 V I/O supply rails with proper decoupling (100 nF + 10 uF near each supply pin). The MBGA package requires careful PCB stack-up with microvia technology for breakout; verify thermal performance at full DSP utilization since the 65 nm process can dissipate 0.5-1 W under heavy logic toggling. This page synthesizes current distributor stock and pricing, drop-in same-family alternatives from the Cyclone III family, and practical design notes not aggregated on a single manufacturer page, including PCB layout, configuration, and thermal guidance for the 164-MBGA package.
EP3C5M164I7N - Cyclone III FPGA, 5K LE, 164-MBGA | Intel
The Intel (Altera) EP3C5M164I7N is a low-power, low-cost Cyclone III Field Programmable Gate Array (FPGA) housed in a 164-ball Micro BGA package (8x8 mm, M164) with 106 user I/O pins. Built on a 60 nm TSMC low-k process, it delivers 5,136 logic elements, 423,936 bits of embedded memory (RAM), and 23 embedded 18x18 multipliers inside a 1.2 V core. The "I7" suffix denotes the industrial temperature grade (-40C to +100C junction) and a speed grade of 7. The device includes 2 PLLs and supports external memory interfaces including DDR, DDR2, SDR, and QDRII+ SRAM through dedicated DQS pins. An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic IC that lets engineers implement arbitrary logic, DSP, and memory subsystems by configuring an array of configurable logic blocks (CLBs) connected through a programmable interconnect fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors. They are distinct from ASICs because they are not mask-programmed: configuration is loaded from external flash at power-up, enabling fast prototyping and field updates. Cyclone III belongs to Intel's (formerly Altera's) low-cost, low-power FPGA family targeting cost-sensitive volume applications rather than high-performance transceivers. Key differentiating features include the Cyclone III family's industry-leading low static and dynamic power for a 60 nm FPGA, 4-Mbit embedded memory blocks for buffer/RAM-intensive designs, dedicated hardware multipliers that accelerate DSP operations up to 18x18, and a flexible I/O bank structure supporting LVDS, SSTL, HSTL, and LVCMOS standards. The M164 Micro BGA footprint reduces board area versus TQFP packages while still enabling low-cost PCB fabrication with 0.5 mm pitch. Architecturally, the device arranges logic elements into LABs (Logic Array Blocks), each containing 16 LEs, with M9K memory blocks distributed throughout the fabric. The configuration controller supports passive serial (PS), fast passive parallel (FPP), and active serial (AS) modes via industry-standard EPCS configuration devices. Periphery includes four general-purpose PLLs with spread-spectrum clocking, and each I/O bank has its own VREF pins for reference-voltage-based standards. Typical applications include industrial motor control and machine vision, low-cost video processing and display controllers, consumer electronics glue logic, and telecom line-card interface bridges. The Cyclone III is also widely used in education and prototyping kits (such as the Altera/Intel DE0-Nano family) because of its favorable price-per-logic-element ratio. When designing with the EP3C5M164I7N, ensure your Quartus II project sets the correct device package (M164) and speed grade (7) so timing analysis is accurate, and provide a low-noise 1.2 V core supply with bulk decoupling near each VCCINT pin. For multi-bank I/O standards, segregate SSTL/HSTL banks from LVCMOS banks using separate VCCIO rails to avoid contention. This page consolidates Cyclone III family datasheet parameters, drop-in 164-MBGA alternatives, and design notes that go beyond the standard manufacturer datasheet to help engineers select and qualify the part quickly.
EP3C5U256A7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
The Intel (formerly Altera) EP3C5U256A7N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) with 5,136 logic elements, 423,936 embedded memory bits, and 182 user I/Os, housed in a 256-ball Ultra FineLine BGA (U256) package. The device targets cost-sensitive, high-volume applications where designers need programmable logic, embedded memory, and DSP blocks without the cost of a high-end FPGA. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs / ALMs), programmable interconnect, and I/O cells, all of which can be reconfigured by the designer after manufacture. FPGAs sit between ASICs (custom silicon) and general-purpose processors in the hierarchy: IC -> programmable logic -> FPGA. Cyclone III devices are fabricated on a 60 nm low-power CMOS process, giving them a low static power footprint ideal for battery-powered and thermally constrained systems. Key features include 5,136 logic elements, 423,936 bits of embedded RAM (M9K blocks), 23 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and a maximum user I/O count of 182. The device operates from a 1.15 V to 1.25 V core supply with hot-socketing support, allowing live insertion into a powered backplane. Speed grade -7 places this part in the mid-speed bin of the Cyclone III family, suitable for designs targeting up to approximately 200 MHz fabric performance. Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front-ends, LED video walls, and consumer electronics glue logic. Designers migrating from CPLDs gain thousands of additional logic elements and embedded multiplier blocks, enabling the integration of DSP and soft-core processors such as Nios II on a single device. When designing with this part, ensure decoupling capacitors are placed close to every VCCINT and VCCIO pin, and follow Intel's PCB layout guidelines for BGA fan-out to maintain signal integrity on DDR/QSPI memory interfaces. Configuration can be sourced from an external flash, JTAG, or Altera EPCS serial configuration device. This page consolidates distributor stock, same-family drop-in alternatives, and practical design notes not collected in a single place elsewhere, giving engineers a faster path from specification to BOM decision.
EP3C5U256C6 - Cyclone III FPGA, 5K LE, 256-UBGA | Intel / Altera
The Intel / Altera EP3C5U256C6 is a low-cost, low-power Cyclone® III Field Programmable Gate Array (FPGA) housed in a 256-ball Ultra FineLine BGA (U256 / UBGA) package. It integrates 5,136 logic elements, 423,936 bits of embedded memory (RAM), and 182 user I/O pins in a compact, lead-free surface-mount form factor. Speed grade 6 reflects its commercial temperature and timing characterization within the Cyclone III family. A Cyclone III FPGA is a programmable logic device that combines look-up tables (LUTs), embedded memory blocks, embedded multipliers, and a programmable interconnect fabric on a single low-power silicon die. Within the broader semiconductor taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs and microcontrollers as flexible digital-implementation alternatives. Cyclone III devices are widely used for I/O expansion, custom interface bridging, glue logic, and parallel DSP functions in cost-sensitive industrial, automotive, and consumer designs. Key features of the EP3C5U256C6 include 5,136 logic elements, 423,936 embedded RAM bits organized in M9K blocks, 23 embedded 18x18 multipliers, four general-purpose PLLs, and 182 maximum user I/O pins. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, SSTL, and HSTL, making it suitable for interfacing to external DDR/DDR2 memory devices via soft IP controllers. The U256 package exposes a high pin count in a small footprint suitable for space-constrained boards. Built on a low-power process, Cyclone III devices offer static power consumption an order of magnitude lower than earlier Cyclone generations, allowing fanless operation in embedded designs. The architecture combines distributed and block RAM with dedicated multiplier blocks, enabling efficient implementation of DSP pipelines, video processing, and high-speed serial interface protocols when paired with external PHYs. Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecom line cards, and portable medical instrumentation. Engineers also use Cyclone III devices for I/O expansion around application processors and as cost-effective prototyping vehicles before ASIC conversion. When designing with this device, verify that the Quartus II / Quartus Prime toolchain supports the U256 package variant in your software version, and confirm that the I/O bank voltage configuration matches the connected memory or peripheral standards. The U256 package has a fine 1.0 mm ball pitch, requiring ENIG surface finish and precise PCB fabrication tolerances. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing and substitution decisions.
EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
The Intel EP3C5U256C6N is a Cyclone III family Field Programmable Gate Array (FPGA) featuring 5,136 logic elements, 182 user I/O pins, and 423,936 bits of embedded memory, housed in a 256-ball Ultra FineLine BGA (UBGA-256) package with 0.8 mm pitch and 14 x 14 mm body. The device is fabricated on a low-power 60 nm process and operates with a commercial temperature grade and C6 speed grade, targeting cost-sensitive, low-power programmable logic applications. What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. Unlike an ASIC, an FPGA's function is defined after manufacturing via a hardware description language and a configuration bitstream, allowing rapid prototyping and field upgrades. FPGAs sit in the hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. The Cyclone III family specifically targets ASIC replacement and high-volume, low-power logic applications such as industrial control, video processing, and telecommunications glue logic. Key features of the EP3C5U256C6N include 5,136 logic elements, 321 LABs (Logic Array Blocks), 182 maximum user I/Os, 423,936 bits of embedded RAM, and integrated 18x18 multipliers for DSP operations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI, and provides up to four PLLs for clock management. Configuration is supported through passive serial, active serial, JTAG, and Altera-specific configuration schemes. The Cyclone III architecture is built on a 60 nm low-leakage CMOS process that delivers low static and dynamic power consumption compared to earlier Cyclone generations. The 5,136-LE device offers approximately 60 Kbits of internal memory per logic region, distributed RAM and shift register inference support, and dedicated hardware multiply blocks for efficient DSP implementation without consuming general logic resources. Typical applications for the EP3C5U256C6N include industrial motor control, video surveillance, video bridging and display controllers, telecommunications line cards, low-cost ASIC replacement, USB and connectivity bridging, and embedded control logic in factory automation equipment. When designing with this device, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to each power pin. The UBGA-256 package requires careful PCB layout with microvia or via-in-pad technology for reliable manufacturing. Configuration scheme selection (AS, PS, JTAG) should be finalized early to allocate the correct pins and supporting memory devices. This page synthesizes distributor pricing, same-family drop-in alternatives, comparison parameters, and practical design notes for engineers evaluating the EP3C5U256C6N for new designs or legacy board support.
EP3C5U256C7 - Cyclone III FPGA, 5K LE, 256-UBGA | Altera
The Intel (formerly Altera) EP3C5U256C7 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65nm low-k process, delivering 5,136 logic elements, 423,936 bits of embedded memory, and 182 maximum user I/O pins in a 256-ball Ultra FineLine BGA (UBGA) package. It operates across a commercial 0C to 85C junction temperature range with a -7 speed grade, targeting cost-sensitive, power-aware volume production. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing, rather than at the fab. FPGAs sit alongside microcontrollers, microprocessors, ASICs, and CPLDs in the programmable logic hierarchy, and they are the dominant solution when time-to-market, parallelism, hardware re-programmability, or high I/O bandwidth outweigh the absolute lowest unit cost of an ASIC. The Cyclone III family from Intel/Altera occupies the low-end, low-power segment of that hierarchy, optimized for high-volume consumer, industrial, automotive, communications, and broadcast applications. The EP3C5U256C7 features 5,136 logic elements, 321 logic array blocks, 46 embedded 18x18 multipliers, 23 embedded M9K memory blocks (423,936 total RAM bits), and four general-purpose PLLs. Its 256-ball UBGA package provides 182 available user I/Os arranged in eight I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, PCI, and SSTL. The device supports Nios II embedded processor soft cores and is configured via serial or parallel flash using the active serial (AS) configuration scheme. Typical applications for the EP3C5U256C7 span consumer video processing (display controllers, video bridging, low-end set-top boxes), industrial control and machine-to-machine (M2M) gateways, automotive infotainment and driver-assist subsystems, communications line cards and bridges, broadcast video encoding, and portable/mobile systems where the low-power 65nm process and wide I/O flexibility deliver the best price/performance balance. When designing with this device, plan power sequencing carefully: the Cyclone III core and I/O banks operate from multiple supply rails (VCCINT, VCCIO per bank, VCCA, VCCD_PLL), and decoupling bulk capacitors must be placed adjacent to each power pin per the pin connection guidelines. Confirm Quartus II or Quartus Prime software support for the -7 speed grade and your target I/O standard before PCB fabrication. This page synthesizes distributor pricing as of 2026-09-09, drop-in alternatives from the same Altera/Intel Cyclone III family, and practical design notes not aggregated on any single manufacturer or distributor page.
EP3C5U256C7N - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
The Intel / Altera EP3C5U256C7N is a Cyclone III low-power Field Programmable Gate Array (FPGA) containing 5,136 logic elements (LEs), 423,936 bits of embedded memory, and 182 user I/Os, housed in a 256-ball FineLine BGA (UBGA) package. Built on a 60 nm TSMC low-power CMOS process, the Cyclone III family targets cost-sensitive applications that require moderate logic density, generous block memory, and flexible DSP blocks without the power budget of competing families. A Field Programmable Gate Array is a programmable integrated circuit whose logic fabric, interconnect, and I/O cells are configurable through SRAM-based configuration memory. Within the broader semiconductor taxonomy, an FPGA sits at the top of the digital logic hierarchy alongside ASICs and CPLDs, providing higher logic density than CPLDs while offering faster time-to-market and lower NRE cost than ASICs. Cyclone III specifically addresses the volume-priced, power-constrained segment between CPLDs and high-end FPGAs. Key features of the EP3C5U256C7N include 5,136 LEs, 423,936 embedded RAM bits organized into M9K blocks, up to 23 embedded 18x18 multipliers for DSP, four PLLs for clock management, and 182 maximum user I/Os. The device operates from a 1.15 V to 1.25 V core supply and supports commercial temperature grades. Cyclone III FPGAs are designed for sub-100 mW static power dissipation depending on configuration. The architecture combines Look-Up Tables (LUTs) for combinational logic, dedicated carry chains for fast arithmetic, and M9K memory blocks capable of true dual-port operation. This combination allows designers to implement both glue logic and DSP-intensive functions such as filters, FFTs, and protocol bridges on a single device. The four PLLs support clock multiplication, division, and phase shifting across the device's clock networks. Typical applications include industrial motor control, video processing and image preprocessing, automotive infotainment, consumer electronics with custom interfaces, low-cost software-defined radio, and portable instrumentation. Cyclone III FPGAs are also widely used in educational platforms and prototype ASIC emulation where fast iteration matters more than absolute performance. When designing with this part, pay close attention to the I/O bank supply voltages and the configuration scheme (AS, PS, JTAG). Cyclone III devices are configured through Quartus II or the Quartus Prime toolchain, and the BSDL files are generated automatically. The 256-ball UBGA package requires careful PCB layout with controlled-impedance traces and a sufficient ground/power via array under the BGA. This page synthesizes distributor pricing, drop-in same-package Cyclone III alternatives, practical design notes, and a parametric comparison table that goes beyond the manufacturer datasheet summary, giving engineers a single source for evaluation and sourcing decisions.
EP3C5U256C8 - Cyclone III FPGA 5K LE 256-BGA | Intel / Altera
The Intel / Altera EP3C5U256C8 is a Cyclone® III low-power Field Programmable Gate Array (FPGA) fabricated in a 60 nm process and packaged in a 256-ball FineLine BGA (UBGA) with 182 user I/O. The device integrates 5,136 logic elements, 423,936 bits of embedded memory (RAM), and 23 embedded 18x18 multipliers, delivering a balanced logic/memory/DSP mix for cost-sensitive applications. The "C8" speed grade corresponds to a commercial temperature grade (0C to 85°C) with an 8 ns internal timing requirement, and the "U" suffix denotes the UBGA-256 package. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard-IP blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. Within the broader semiconductor hierarchy, FPGAs sit between microcontrollers/CPUs (fixed-function, software-defined) and ASICs (application-specific, hardware-defined). Cyclone III sits within the programmable logic taxonomy: FPGA -> low-power FPGA -> Cyclone family -> Cyclone III generation, optimized for cost and power efficiency rather than raw performance. Key features of the EP3C5U256C8 include 23 true 18-bit x 18-bit hardware multipliers for DSP operations, 4 PLLs providing flexible clock synthesis, and 1.0 V core operation with multi-voltage I/O support for LVDS, LVCMOS, SSTL, and HSTL standards. The Cyclone III architecture supports the Nios II embedded processor for soft-core CPU integration, and configuration can be loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes. Suspend mode allows power-down of unused logic to reduce quiescent consumption. Technical depth is provided by 2 PLLs with eight output banks (when paired with the 65 nm Cyclone III LS family) and dedicated per-pin serialization/deserialization (SERDES) blocks for LVDS signaling up to 875 Mbps. The device supports up to 8 input clocks and provides on-chip termination (OCT) for impedance matching, simplifying PCB design. Configuration bitstream is stored in external flash and loaded by the FPGA at power-up, with built-in error detection via CRC check and decompression for compressed bitstreams. Typical applications include industrial motor control, video surveillance and image processing, low-cost ASIC prototyping, consumer handheld devices, and automotive infotainment pre-development. The 5,136 LE count maps well to glue-logic replacement, parallel-to-serial bridges, and small protocol conversion IPs. Pair the EP3C5U256C8 with external DDR/DDR2 SDRAM and an Altera EPCS configuration device for a complete low-cost system. A key design consideration when using the EP3C5U256C8 is power budgeting: although Cyclone III is the lowest-power 60 nm FPGA family, dense designs at high toggle rates can still draw 1-2 W of core power. Plan thermal relief on the UBGA-256 land pattern with via-in-pad or thermal vias under the center ball array, and use the Quartus II PowerPlay analyzer to estimate static and dynamic losses before PCB layout commitment. This page synthesizes distributor pricing, drop-in same-package Cyclone III alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing engineering context for selecting the right density and speed grade within the Cyclone III family.
EP3C5U256C8N - Cyclone III FPGA, 5K LE, 256-UBGA | Altera / Intel
The Altera (Intel) EP3C5U256C8N is a Cyclone® III family FPGA featuring 5,136 logic elements (LEs), 423,936 bits of embedded memory, and 182 maximum user I/O pins, housed in a 256-ball Ultra FineLine BGA (UBGA) package. Built on a low-power 60 nm process, this Cyclone III device delivers up to 200 MHz performance with a maximum embedded multiplier count of 46 (18x18) blocks and supports configuration via passive serial, fast passive parallel, active serial, and JTAG modes. The "8" speed grade designates a commercial 8 ns timing spec. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement any digital logic function, from glue logic and state machines to full processor subsystems and DSP pipelines. FPGAs belong to the broader programmable logic device hierarchy (CPLD -> FPGA -> SoC FPGA) and offer far higher logic density than CPLDs thanks to an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. The Cyclone III family specifically targets cost-sensitive, high-volume applications requiring low static and dynamic power. Key features of the EP3C5U256C8N include 5,136 logic elements arranged in 5136 CLBs (one LE per CLB in this architecture), 46 embedded 18x18 multipliers for high-throughput DSP operations, and four general-purpose PLLs for clock management. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards, with each I/O bank programmable for the required voltage level. Configuration can be loaded from a low-cost EPCS serial configuration device or via JTAG during development. The Cyclone III architecture uses an SRAM-based configuration cell powered from a separate VCCINT core rail (typically 1.2 V), while VCCIO pins configure I/O bank voltages (1.2 V to 3.3 V). This split-rail approach minimizes dynamic power in I/O while preserving signal-integrity flexibility for mixed-voltage interfaces such as legacy 5 V-tolerant or 1.5 V SSTL memory buses. The EP3C5 is positioned at the low-density end of the family, making it ideal for cost-optimized designs that need more I/O than a CPLD but less than a Cyclone III 25 or higher. Typical applications include industrial control and HMI boards, motor control and encoder interfaces, low-cost video processing and image aggregation, factory automation and protocol bridging (UART/SPI/I2C to Ethernet or USB), and educational / prototyping platforms where the low LE count keeps toolchain compile times short and per-unit cost minimal. The 256-UBGA 14x14 mm package provides 182 usable pins with 0.8 mm ball pitch, balancing board-routing density with assembly yield. When designing with the EP3C5U256C8N, allocate separate ground islands for PLL analog supplies and decouple every VCCIO/VCCINT pin with 0.1 µF capacitors placed within 100 mils of the package ball. Use the Altera Quartus II (or the Altera edition of Quartus Prime Lite) for synthesis, fitting, and timing closure; the device is supported by all Cyclone III device files in Quartus 13.1 and earlier. This page synthesizes current distributor pricing, drop-in same-package alternatives, and practical layout/timing guidance not found in the standalone manufacturer datasheet.
EP3C5U256I7 - Cyclone III FPGA 5K LE 256-UBGA | Altera (Intel)
The Altera (Intel) EP3C5U256I7 is a Cyclone III low-power Field Programmable Gate Array (FPGA) offering 5,136 logic elements, 423,936 bits of embedded memory, and 182 maximum user I/O pins in a 256-ball Ultra FineLine BGA package. Built on a 65 nm TSMC process and powered by a 1.2 V core supply, this device targets cost-sensitive, high-volume applications where low static and dynamic power consumption are critical design constraints. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, PLLs, and DSP slices. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and below ASICs in terms of integration density and per-unit cost. The Cyclone III family specifically positioned Altera in the low-power FPGA market, competing directly with Xilinx Spartan-6 and Lattice ECP3 families for industrial, automotive, and consumer designs. Key features include up to 5,136 logic elements, 46 embedded 9-Kbit M9K memory blocks for a total of 414 Kbits (423,936 bits) of RAM, 23 embedded 18x18 multipliers for DSP operations, two general-purpose PLLs per device, and a maximum user I/O count of 182. The device also supports configuration via serial passive (EPCS), JTAG, or Active Serial schemes, and operates over the industrial -40 °C to +100 °C junction temperature range per the I7 speed/grade code. Architecturally, Cyclone III uses a four-input look-up table (LUT) based logic element with dedicated carry chains for arithmetic and dedicated routing for fast adder trees. The 65 nm process node combined with Altera's power-aware compiler yields typical static power under 100 mW, while the programmable power technology can selectively power down unused logic elements to extend battery life in portable applications. Typical applications include industrial motor control and machine vision, low-cost video processing for surveillance and consumer displays, software-defined radio (SDR) front-end signal conditioning, automotive infotainment and driver-assistance subsystems, and portable medical device controllers. The Cyclone III device family is well-suited for high-volume production designs that require reprogrammability in the field. When designing with the EP3C5U256I7, designers must pay attention to I/O bank voltage grouping, since the device supports mixed-voltage I/O standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL) across eight I/O banks. Decoupling capacitor placement, signal integrity, and proper configuration mode selection (AS, PS, JTAG) are critical to first-pass success on the 256-ball Ultra FineLine BGA. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family and selected same-footprint Altera parts, and practical design considerations not consolidated in the manufacturer datasheet. It is intended for hardware engineers, BOM managers, and FAE teams evaluating Cyclone III FPGA sourcing.
EP3C5U256I7N - Cyclone III FPGA 5K LE 256-UBGA | Intel
The Intel (formerly Altera) EP3C5U256I7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) with 5,136 logic elements, 423,936 bits of embedded memory, and 182 maximum user I/O pins, housed in a 256-ball Ultra FineLine BGA (UFBGA) package. The device is fabricated on a 65 nm low-k copper process, operates from a 1.2 V core supply, and supports 437.5 MHz internal operation with up to 23 embedded 18x18 multipliers for DSP workloads. The part is specified for the industrial temperature range (-40C to +100C junction) and ships in tray packaging. A Cyclone III FPGA is a reprogrammable logic device that sits in the programmable logic hierarchy between a CPLD (typically <2K logic elements, non-volatile) and a high-end FPGA such as Stratix or Arria (hundreds of thousands of LE, transceivers, hardcore processors). Cyclone III targets cost- and power-sensitive applications such as industrial control, video bridging, and I/O expansion. Within the broader system hierarchy it is a programmable logic IC -> logic semiconductor -> integrated circuit, complementing microcontrollers and ASICs when parallel processing, custom I/O timing, or hardware acceleration is required. Key features of the EP3C5U256I7N include 5,136 logic elements, 423,936 total RAM bits organized into M9K blocks, 182 user I/O pins across 8 I/O banks, 2 PLLs for clock management, 23 embedded 18x18 multipliers, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device integrates configuration memory (SRAM-based) and supports multiple configuration schemes including JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The EP3C5U256I7N leverages a 65 nm SRAM-based architecture with on-chip voltage regulation and a static core power of approximately 50 mW at nominal conditions. Designers can use the Quartus II / Quartus Prime design suite (web edition or subscription) for synthesis, place-and-route, and timing closure. The 256-ball UFBGA package exposes 8 I/O banks with independent VCCIO rails, allowing mixed-voltage interfacing (1.2 V to 3.3 V) without external level shifters. Typical applications include industrial motor control, video format conversion, protocol bridging (UART/SPI/I2C to Ethernet or USB), LED display controllers, machine vision pre-processing, and low-density ASIC prototyping. The 5K LE density comfortably fits soft-core processors such as Nios II/e or Nios II/f along with custom peripherals in a single device. When designing with the EP3C5U256I7N, plan for at least four PCB layers with a continuous ground plane beneath the BGA, and provide 0.1 uF + 10 uF decoupling near every VCC/VCCIO pin pair. The configuration mode pins (MSEL) must be tied to the correct pattern for the selected programming mode (AS = 00, AP = 01, PS = 10, JTAG = 11 in many Cyclone III references). For long-term reliability, observe the maximum junction temperature of 100C for the industrial speed grade I7. This page synthesizes real-time distributor pricing, same-package drop-in alternatives from the Cyclone III family, and practical design notes that go beyond the manufacturer handbook.