FPGA & CPLD
Products (7,100+)
EP3C16Q240C8N - Cyclone III FPGA 15K LEs PQFP-240 | Altera
The Altera EP3C16Q240C8N is a Cyclone III FPGA with 15,408 logic elements (LEs), 516,096 bits of embedded memory, and up to 160 user I/O pins, housed in a 240-pin fine-pitch Ball-Grid-Array-style QFP package (240-BFQFP / PQFP-240, 32x32 mm). It is fabricated in a low-cost 65-nm process and belongs to the commercial (C) temperature range with speed grade 8 (the most cost-effective speed bin in the family). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks, routing resources, and embedded memory that designers configure in the field using HDL languages such as Verilog and VHDL. In the semiconductor hierarchy, the FPGA sits above fixed-function ASICs and ASSPs in flexibility, and the Cyclone III family targets the low-cost, low-power segment of that market. Key features of the EP3C16Q240C8N include 15,408 LEs organized as approximately 1,920 adaptive logic modules (ALMs), 516,096 bits (63 kbytes) of M9K embedded memory blocks, and up to 160 maximum user I/O including dedicated clock inputs. The M9K blocks support single- and dual-port operation with byte enables and initialization files, making FIFOs and line buffers easy to implement without external SRAM. Technically, the Cyclone III architecture uses 8-input fracturable look-up tables, a hierarchical multi-track interconnect, and a phase-locked-loop (PLL)-based clock network for on-chip frequency synthesis and jitter reduction. Configuration is supported through active serial (AS), passive serial (PS), and JTAG schemes, allowing standard EPCS serial configuration devices to load the bitstream at power-up. The Q240 package supports a maximum I/O count that may be reduced depending on the selected configuration scheme, per the Altera device package information data sheet. Typical applications include industrial motor-control and automation interfaces, video and image processing line cards, communications protocol bridging, and test/measurement glue logic. The 160-I/O budget and 65-nm low static power make it well suited to cost-sensitive volume products that do not need high-end transceivers. Design consideration: the PQFP-240 footprint is large and hand-solderable for prototypes, but its peripheral I/O ring limits signal counts versus BGA alternatives; plan I/O banking carefully to avoid mixing incompatible voltage standards on one bank. This page synthesizes verified distributor stock, drop-in same-package alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.
EP3C16U256C6 - 15,408 LEs, 256-LFBGA Cyclone III FPGA
The Altera EP3C16U256C6 is a Cyclone III field-programmable gate array (FPGA) containing 15,408 logic elements, 168 I/O, and 516,096 bits of embedded memory in a 256-ball low-profile FBGA package. The device is positioned for general-purpose programmable logic, embedded control, communications, industrial automation, and test-equipment designs that require a reusable hardware architecture and parallel programmable I/O. Distributor listings identify it as the EP3C16U256C6 Cyclone III FPGA and provide current sourcing information as of 2026-10-30. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after fabrication. The FPGA category belongs to programmable-logic devices and sits within the broader semiconductor and embedded-systems hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA allows designers to implement parallel interfaces, state machines, protocol controllers, signal processing, and control logic in one configurable device, potentially reducing board count and shortening product-development cycles. The verified device data identifies three headline characteristics: 15,408 logic elements, 168 I/O, and 516,096 bits of memory. These resources support moderately complex parallel designs and make the EP3C16U256C6 relevant to control systems, data-acquisition equipment, communications interfaces, industrial controllers, and embedded protocol bridges. Its 256-LFBGA package provides a high pin count in a compact surface-mount footprint, although the dense ball pitch demands careful PCB layout, inspection, and assembly planning. The Cyclone III architecture is based on configurable logic elements connected by programmable routing resources. Each logic element supports combinational and registered Boolean functions, while dedicated input and output paths connect the programmable core to package balls. The listed memory quantity is 516,096 bits, equivalent to 64,512 bytes when interpreted as binary memory. This embedded storage can support buffers, lookup tables, packet queues, and other on-chip data structures without relying entirely on external RAM. Typical uses include industrial automation and factory control, communications and network-interface equipment, instrumentation, embedded control, and general-purpose digital prototyping. The 168 available I/O are particularly useful when a design includes multiple parallel buses, status signals, capture inputs, or differential interface groups. Actual design suitability still depends on the required I/O standard, logic utilization, memory demand, timing closure, clocking architecture, power budget, and device programming method. Designers should treat BGA assembly and signal integrity as first-order concerns. The 256-ball package requires an HDI-capable PCB stack-up, exact land-pattern geometry, controlled impedance routing, and assembly-process qualification. Power rails should be decoupled close to the device, clock and high-speed nets should use short return paths, and unused balls should follow the manufacturer’s prescribed connectivity. Toolchain and board-support packages must also be checked against the exact Cyclone III device before committing the design. This page consolidates the verified distributor identity, package, logic-resource, I/O, memory, pricing, and sourcing data into an engineering-oriented product reference. It also distinguishes verified facts from unavailable electrical details and identifies same-brand, same-family drop-in candidates that require final validation against timing, temperature, lifecycle, and assembly requirements.
EP3C16U256C7 - Cyclone III FPGA, 15408 LEs | Intel/Altera
The Intel/Altera EP3C16U256C7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 RAM bits, and 168 user I/Os in a 256-LFBGA package. It combines programmable logic resources with 516,096 bits of embedded RAM in a low-cost FPGA device intended for control, interface, communications, and embedded-processing systems. An FPGA is a programmable-logic semiconductor whose internal lookup tables, registers, interconnect, and memory blocks can be configured after manufacture. Within the semiconductor hierarchy, this device belongs to the Cyclone III family of FPGAs and CPLDs, positioned below higher-density programmable-logic devices for cost-conscious designs that still need substantial parallel logic, on-chip memory, and flexible I/O allocation. The verified device data identifies 15,408 logic elements, 516,096 RAM bits, and 168 I/Os. Cross-reference information associates the device with the 65 nm Cyclone III process and lists a maximum clock frequency of 437.5 MHz, while one comparison listing reports a 1.2 V core supply. These figures make the EP3C16U256C7 suitable for parallel data acquisition, industrial control, protocol bridging, and general-purpose embedded logic rather than high-performance processor systems. The EP3C16U256C7 uses a 256-LFBGA package, making dense board routing and careful via-in-pad or microvia considerations important in multilayer PCB construction. Its 168 user I/Os provide connectivity for external memory, communication transceivers, sensors, and digital control signals. Configuration, clocking, and power-distribution details should be taken directly from the complete manufacturer device handbook and pin-connection guidelines. Typical uses include industrial automation modules, data-acquisition front ends, communication gateways, LED and display control, sensor aggregation, and embedded protocol converters. The 516,096 RAM bits can buffer sampled data or implement dual-port storage, while the 15,408 logic elements support parallel pipelines, state machines, protocol engines, and control logic. When designing the power system, budget for the 1.2 V core rail as well as bank-dependent I/O supplies, and separate high-current and sensitive routes to reduce coupling. Verify ball assignments, decoupling requirements, configuration-scheme support, and maximum I/O standards against the complete Cyclone III documentation before layout release. This page consolidates current distributor availability, sourced pricing, verified resource counts, and same-family replacement guidance into one engineering-focused view. It also distinguishes exact drop-in options from lower-speed or industrial-grade variants whose qualification and timing margin must be reviewed before schematic approval.
EP3C16U256C8 - 15,408-LC Cyclone III FPGA | Intel
The Intel EP3C16U256C8 is a Cyclone III field-programmable gate array containing 15,408 logic elements, 963 logic array blocks, 516,096 embedded memory bits, and 168 I/O in a 256-ball UFBGA package. The device is identified by the commercial temperature grade, 14 x 14 mm package, 2.20 mm height, and 0.80 mm ball pitch. An FPGA is a programmable semiconductor whose logic, interconnect, and memory resources can be configured after manufacture. Within the semiconductor hierarchy, an FPGA is a programmable logic device, combining digital logic blocks, embedded block RAM, programmable interconnects, and user I/O. It differs from a fixed-function application-specific integrated circuit because its behavior is defined by a configuration bitstream rather than permanent circuitry. The Cyclone III architecture provides 15,408 logic elements organized into 963 logic array blocks, together with 516,096 bits of embedded memory. The device provides 168 I/O, as listed by DigiKey, and is available in the compact 256-ball package described by the verified distributor data. These resources support parallel digital logic, control, data acquisition, signal processing, embedded-memory, and interface-intensive designs. The EP3C16U256C8 belongs to the EP3C16 device family, whose 16 designation corresponds to the 15,408 logic elements and 963 logic array blocks reported by the distributor sources. Its combination of a 256-ball package and 168 available I/O makes it suitable for designs requiring moderate logic density, substantial embedded memory, and a comparatively high pin count in a compact board footprint. Typical uses include industrial control, data-acquisition systems, communications equipment, embedded signal-processing modules, video and image pipelines, and general-purpose programmable-logic prototypes. Because it uses nonvolatile configuration memory, the device can retain its programmed logic across power cycles, allowing autonomous operation without an external configuration controller once the configuration image is stored. Board design must account for power sequencing, decoupling, signal integrity, thermal performance, and configuration-data integrity. The BGA-256 footprint requires careful escape routing, while high-speed interfaces demand controlled impedance and return paths. Designers should also confirm the exact power, temperature, and pinout requirements against the manufacturer documentation before layout or substitution. This page consolidates the verified distributor specifications, source links, pricing evidence, package data, same-family replacement candidates, and practical selection guidance for engineers evaluating the Intel EP3C16U256C8.
EP3C16U256C8N - Cyclone III FPGA, 15K LE, 256-UBGA | Altera / Intel
The Intel (formerly Altera) EP3C16U256C8N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, offering 15,408 logic elements, 516,096 bits of embedded RAM, and 168 user I/Os in a 256-ball Ultra FineLine BGA package (Ux256). The 'U256' suffix denotes the plastic Ultra FineLine BGA, and the 'C8' speed grade corresponds to an 8 ns commercial-grade timing classification with -40 °C to +85 °C operating junction range. A Cyclone III FPGA is a SRAM-based programmable logic device that belongs to the family of low-cost, low-power FPGAs targeting high-volume, power-sensitive designs. It sits in the broader hierarchy of programmable logic devices (PLD), positioned between CPLDs and high-performance FPGAs such as Cyclone V / Stratix. Its low static and dynamic power consumption makes it attractive for portable, industrial, and consumer applications that previously used ASICs or ASSPs. Key features of the EP3C16U256C8N include up to 168 single-ended user I/O pins (multi-voltage I/O standards including LVDS, SSTL, LVCMOS, and LVTTL), 56 embedded 18 x 18 multipliers for DSP, four PLLs per device, and 56 M9K memory blocks. The 1.2 V core (VCCINT) with separate VCCIO bank supplies allows mixed-voltage interfacing without external level shifters. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. Typical applications span industrial motor control, video processing pipelines, automotive infotainment prototypes, communication bridges, and consumer display controllers. The Cyclone III architecture is also a popular education platform due to its low cost and Quartus II / Quartus Prime tool support. When designing with this device, pay close attention to the BGA fan-out: the 256-ball U256 package requires microvia or via-in-pad PCB technology. Decoupling must include 0.1 µF caps per VCC pin and bulk caps on each supply rail. Use the Altera / Intel Quartus Prime software (free Lite edition) for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical PCB design notes that go beyond what is printed in the manufacturer datasheet.
EP3C16U256I7 - 16K LEs, 168 I/O FPGA | Altera
The Altera EP3C16U256I7 is a Cyclone III field-programmable gate array with 16,320 logic elements, 168 I/O pins, and 516,096 RAM bits in a 256-LFBGA surface-mount package. The industrial-temperature device supports programmable logic for embedded control, signal processing, communications, and industrial automation designs. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and interconnect are configured after fabrication. An FPGA belongs to the programmable-logic hierarchy, where it combines configurable logic elements, block RAM, general-purpose I/O, clocking, and programmable routing. This implementation provides a compact alternative to combining multiple discrete logic devices while retaining design flexibility and field-updatable configurations. The verified device data identifies 16,320 logic elements, 516,096 RAM bits, 168 I/O pins, a 256-LFBGA package, and an industrial temperature grade. The 16,320 logic-element count provides substantial parallel processing capacity for control logic, interface bridging, protocol handling, and moderate-complexity digital signal processing. The 516,096 RAM bits add configurable storage for buffers, packet data, state machines, and lookup data. The Cyclone III architecture integrates programmable logic elements, embedded memory resources, and general-purpose input/output structures into one integrated device. These resources can be combined for parallel datapaths, finite-state machines, bus interfaces, and control engines. Because configuration and interconnect are programmable, engineers can adapt the same hardware platform across multiple product variants without changing the physical FPGA package. Typical uses include industrial factory controllers, communication equipment, test systems, embedded instrumentation, and network-interface subsystems. In an industrial controller, the 168 available I/O support connections among sensors, actuators, field buses, and status indicators. In a communication design, the logic elements can implement protocol framing while the RAM resources support packet buffering and temporary data storage. The 256-LFBGA package requires careful PCB layout because its 256 ball terminals provide limited escape routing and demand short, controlled-length connections to power, ground, configuration, clock, and user I/O. Adequate via access, solid plane connectivity, decoupling, and assembly-process control are essential for reliable implementation. Configuration storage and programming-device compatibility should also be reviewed before committing the design to production. This page combines verified distributor pricing and availability information with the device's reported FPGA resources, package details, application analysis, and a strict same-package replacement comparison. It also distinguishes confirmed drop-in candidates from family variants and flags technical details that require confirmation from the manufacturer datasheet.
EP3C16U484C6 - Cyclone III FPGA, 15,408 Logic Cells | Altera
The Altera EP3C16U484C6 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/O, and a 484-ball FBGA package. The device provides 516,096 embedded RAM bits and is specified for industrial temperature operation from -40°C to +125°C. Its surface-mount FBGA construction supports compact embedded, communications, industrial control, and test-equipment designs where programmable logic is needed alongside multiple external interfaces. A field-programmable gate array is a digital semiconductor whose configurable logic blocks, memory resources, and programmable I/O form the physical foundation of an FPGA. FPGAs sit within programmable-logic devices and broader digital semiconductors. Unlike fixed-function application-specific integrated circuits, an FPGA can be reconfigured after manufacture to implement control logic, interfaces, protocol handling, signal conditioning, and parallel data-processing functions. The Cyclone III family combines 15,408 logic elements with 346 I/O in this device. The supplied distributor data identifies 516,096 bits of embedded memory and an operating-temperature range of -40°C to +125°C. Its lead-free 484-FBGA package exposes a high pin count while keeping the assembled device compact. The package is suitable for multilayer PCB construction using the manufacturer-specified ball pattern, power architecture, and decoupling requirements. The -40°C to +125°C industrial temperature grade distinguishes this C6 device from variants identified with the C8 suffix. The C6 designation indicates the device’s speed-grade and temperature-positioning family within the ordering system, but the supplied data does not provide a complete numerical operating-frequency table. Consequently, clocking and timing decisions must be checked against the relevant Cyclone III device handbook and the system’s external interface requirements. Typical uses include industrial automation, industrial networking, data-acquisition systems, communications equipment, and embedded control platforms. With 346 I/O, the FPGA can connect parallel sensors, converters, memory devices, transceivers, and control logic while programmable logic handles protocol conversion, filtering, timing, and system supervision. Its 516,096 embedded-memory bits support buffering, packet handling, and data paths that do not require external RAM. The primary design constraint is the 484-ball FBGA footprint. Layout should preserve continuous ground and power planes, place decoupling capacitors close to the supply balls, route high-speed signals according to the Cyclone III guidance, and follow the manufacturer’s ball-assignment and high-speed layout requirements. Because the supplied web excerpts do not provide a complete pinout, power rails, decoupling values, or differential I/O assignments, those details must be confirmed from the official documentation before layout release. This product page combines verified distributor specifications, current availability information, same-family migration options, and practical selection guidance. It also distinguishes verified facts from data gaps, helping engineers evaluate procurement, PCB compatibility, temperature grade, and FPGA resource requirements without relying on unverified assumptions.
EP3C16U484C7 - 15408-LCELL 437.5MHz Cyclone III FPGA | Altera
The Altera EP3C16U484C7 is a Cyclone III field-programmable gate array with 15,408 logic cells, 346 I/O, a 437.5 MHz maximum clock rating, and a 484-pin FBGA package. Designed around a 65 nm process and a 1.2 V core supply, the device combines programmable logic resources with a high pin count for communication, control, and embedded digital-processing systems. A field-programmable gate array, or FPGA, is a programmable digital semiconductor whose logic and interconnect resources can be configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor, a programmable-logic device, and a configurable integrated circuit. The Cyclone III family combines a large I/O count with a relatively compact package, making it suitable for designs that require numerous external connections. The principal verified features are 15,408 logic cells, 346 I/O, a 437.5 MHz maximum operating frequency, 65 nm fabrication technology, a 1.2 V core voltage, and a 484-pin FBGA or UFBGA package. The source listings describe the EP3C16U484C7 as an FPGA with 346 outputs and 15,408 logic cells. Its 484-ball surface-mount format supports dense PCB routing while exposing substantially more device connections than lower-pin-count FPGA packages. The C7 suffix identifies this ordering configuration within the EP3C16 device family, while the U484 portion identifies the 484-pin package option. Available product descriptions report a temperature range of -40 °C to +125 °C. Other detailed electrical characteristics, including I/O voltage ranges, power consumption, configuration interfaces, memory resources, and pin-level functions, were not supplied in the verified dataset and should therefore be confirmed in the manufacturer datasheet before schematic or PCB sign-off. Typical design roles include industrial control logic, communication gateways, data-acquisition front ends, embedded protocol controllers, and parallel signal-processing systems. A design can use the 346 available I/O for sensor inputs, control outputs, high-speed interfaces, or mixed peripheral connections, depending on the exact pin assignments and bank voltage restrictions defined by the Cyclone III documentation. PCB implementation should prioritize a validated power architecture, decoupling, controlled clock routing, and signal-integrity review. Because this is a 484-ball BGA, assembly requires a controlled board layout and appropriate fine-pitch assembly capability. The original design should not be released for production until the exact pinout, configuration pins, I/O standards, power sequencing, and decoupling requirements have been verified against the applicable manufacturer documentation. This page consolidates the verified distributor specifications, package information, pricing evidence, and available same-family comparison references. It also distinguishes confirmed data from fields that require datasheet confirmation, helping engineers evaluate EP3C16U484C7 sourcing without treating unverified electrical details as guaranteed specifications.
EP3C16U484C8 - 15408-Logic-Cell FPGA | Altera Corporation
The Altera Corporation EP3C16U484C8 is a Cyclone III field-programmable gate array with 15,408 logic cells, 346 I/O pins, and a 484-FBGA package. It is designed for programmable digital logic implementations requiring a high pin count and a compact surface-mount footprint. The verified distributor listing identifies the device as a Cyclone III FPGA, while the available component summary specifies an operating temperature range of -40°C to +125°C. A field-programmable gate array, or FPGA, is a programmable digital integrated circuit in which designers configure interconnected logic elements, memory blocks, and input/output resources to implement a hardware function. FPGAs occupy the broader semiconductor and programmable-logic hierarchy. Compared with application-specific integrated circuits, an FPGA allows design revisions to be implemented through configuration rather than by manufacturing a new custom silicon device. Its fixed package, pin resources, and internal architecture must therefore be evaluated against the intended system requirements. The EP3C16U484C8 provides 15,408 logic cells and 346 I/O pins according to the verified DigiKey listing. These figures make the device relevant to designs that need more external connectivity than a small programmable logic device while retaining a mid-density Cyclone III implementation. The 484-FBGA package supports compact board layouts, although its fine-pitch construction requires careful PCB design, assembly process control, and inspection. The device is associated with the Cyclone III FPGA family and is offered by Altera, an Intel company, through major distributors. Its verified ordering information includes a -40°C to +125°C operating-temperature specification, providing a useful indication of its industrial-temperature capability. Other detailed operating data, including core voltage ranges, configuration characteristics, I/O standards, and speed-dependent timing, were not included in the supplied verified records and are identified as data-needed rather than estimated. Typical design uses include industrial control, communications equipment, test and measurement systems, embedded processing, and general-purpose digital interface logic. In each case, the key engineering question is whether the 15,408 logic-cell resource and 346 I/O capability align with the design's parallel logic, memory, connectivity, and external interface requirements. Software support and the selected configuration method also need to be confirmed for the complete toolchain before release to production. For PCB implementation, designers should use the manufacturer's package drawing and pinout rather than relying on distributor photographs or generic BGA diagrams. The 484-FBGA footprint requires adequate escape routing, plane geometry, solder-mask and paste control, thermal-via planning, and assembly capability for the selected ball pitch. Because the supplied records do not expose a verified pin-by-pin assignment, this page does not fabricate individual pin names. This page consolidates the verified distributor identity, resource counts, package information, temperature range, sourcing links, and engineering guidance for EP3C16U484C8. It also separates confirmed values from unavailable technical parameters, enabling engineers to assess sourcing quickly while still completing device-level validation against the official Cyclone III documentation.
EP3C16U484I7 - 15,408 LEs, 484-UBGA Cyclone III FPGA | Altera
Altera EP3C16U484I7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/O, a 437.5 MHz maximum device speed, and a 1.2 V core supply in a 484-UBGA package. The industrial-temperature designation indicates operation from -40°C to +125°C, making the device suitable for temperature-variable embedded, communications, control, and signal-processing systems where a compact programmable-logic implementation is advantageous. A field-programmable gate array is a semiconductor whose configurable logic blocks, programmable interconnect, and I/O resources implement digital functions after manufacture. Within the product hierarchy, an FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor. Unlike a fixed application-specific integrated circuit, the Cyclone III architecture allows designers to implement parallel processing, control logic, interfaces, and protocol functions in one device while retaining the flexibility to revise the configuration during development. The EP3C16U484I7 provides 15,408 logic elements and 346 I/O in a 484-UBGA package. Its listed 437.5 MHz speed identifies the maximum device performance grade, while the 1.2 V value describes the core supply. The large I/O count supports board-level integration that would otherwise require multiple programmable devices. The industrial temperature range also provides a clear distinction from commercial-temperature catalog variants. Cyclone III devices use programmable logic elements to build combinational and sequential functions, with dedicated resources for memory, digital signal processing, clock management, connectivity, and configuration. The combination of 15,408 logic elements and 346 I/O permits parallel datapaths and control systems to be consolidated, but the available memory, DSP resources, pin assignments, bank voltages, and configuration limits must be checked against the design before selecting the device. Typical applications include industrial control and factory automation, communications infrastructure, embedded instrumentation, data acquisition, and mixed signal processing. The device is also appropriate for general-purpose prototyping because programmable logic can shorten development cycles when requirements evolve. Its 484-UBGA package provides high I/O density but requires careful ball-grid escape routing, multilayer PCB construction, adequate thermal management, and assembly-process control. Designers should verify the exact power architecture, I/O standards, configuration scheme, clock inputs, and pin constraints in the manufacturer documentation before layout. Because the available verified data does not include a complete public ball map, pin-level assignment should be taken directly from the manufacturer device support files rather than inferred from the 484-ball package outline. Differential pairs and high-speed interfaces also require manufacturer-recommended PCB constraints. This page combines verified distributor specifications, current pricing and stock observations, practical FPGA design guidance, and same-family replacement candidates. Unlike a basic distributor listing, it also identifies which replacement details require engineering verification and highlights the package, temperature, speed-grade, and resource constraints that determine whether a candidate is a genuine drop-in choice.
EP3C25E144C7 - 24,624 Logic Elements FPGA | Altera
Altera EP3C25E144C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 1,539 logic array blocks, 608,256 bits of embedded RAM, and 82 general-purpose I/O in a 144-pin EQFP package with exposed pad. It uses 65 nm process technology, supports a 1.15 V to 1.25 V core-supply range, and is listed with a maximum operating frequency of 437.5 MHz. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic semiconductor and a more flexible alternative to application-specific integrated circuits. The Cyclone III family combines configurable logic blocks, embedded RAM, general-purpose I/O, and programmable interconnect resources within one device. Key features include 24,624 logic elements, 1,539 logic array blocks, and 608,256 bits of embedded RAM. The device provides 82 user I/O and is available in a 144-pin exposed-pad package. Its listed 437.5 MHz maximum frequency gives designers a useful benchmark for clocked digital logic, although achievable system frequency depends on the selected logic path, I/O standard, timing constraints, and implementation. The Cyclone III architecture organizes programmable resources into logic array blocks connected by general-purpose interconnect. Embedded memory allows designers to implement buffers, lookup tables, packet stores, and small data tables without using external memories. Its 82 I/O pins support integration with external processors, transceivers, converters, memory devices, and industrial interface components, subject to the voltage and timing constraints specified by the manufacturer datasheet. Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, and general-purpose logic consolidation. The device can host parallel interfaces, control logic, protocol bridges, or embedded state machines where a programmable architecture simplifies updates compared with fixed logic. Its 144-pin exposed-pad package also supports board-level thermal management through the pad and associated PCB copper. The primary design consideration is thermal management. The exposed pad must be connected to the required power and ground planes and thermally coupled to copper according to the package and board guidelines. Designers must also verify I/O voltage compatibility, pin constraints, power sequencing, memory initialization, and timing closure in the Quartus design environment. This product record combines verified distributor specifications, source links, practical application guidance, and explicitly qualified drop-in alternatives. Alternative electrical data is left as [DATA_NEEDED] where the supplied source material does not provide a verified value, allowing engineers to distinguish confirmed facts from items that still require datasheet validation.
EP3C25E144C8 - 24,624-Cell Cyclone III FPGA | Intel
The Intel EP3C25E144C8 is a Cyclone III field-programmable gate array with 24,624 logic elements, 82 I/O, 608,256 embedded-memory bits, and a maximum operating frequency of 402 MHz. The device is manufactured using a 65 nm process, operates from a 1.2 V core supply, and is supplied in a 144-pin LQFP exposed-pad package. A field-programmable gate array, or FPGA, is a programmable semiconductor in which configurable logic blocks, memory resources, and programmable I/O replace a fixed digital circuit. An FPGA belongs to the semiconductor hierarchy and provides parallel hardware implementation without changing the physical IC. The Cyclone III family is positioned for cost-sensitive embedded, communications, industrial, and control applications requiring programmable logic and deterministic hardware behavior. The EP3C25E144C8 combines 24,624 logic elements with 82 user I/O in a relatively compact 144-LQFP package. Its 608,256 bits of embedded memory support data buffering, state machines, lookup-table structures, and modest on-chip data storage. The stated 402 MHz maximum frequency provides a useful headline figure for timing planning, although actual interface performance must be evaluated against the applicable Cyclone III timing and power guidance. The device uses a 65 nm process technology and a 1.2 V core voltage. These figures place it in the low-voltage programmable-logic class, where board design must provide stable core and I/O supplies and appropriate decoupling. The exposed thermal pad in the LQFP package provides the primary thermal path from the device to the PCB, making copper area, thermal vias, and airflow important in high-utilization designs. Typical uses include industrial control, communications interfaces, instrumentation, embedded signal processing, and general-purpose logic consolidation. Its 82 I/O are suitable for parallel data buses, status and control signals, clocks, and moderate external memory interfaces. The 144-pin exposed-pad package also offers a manageable board footprint compared with larger FPGA packages while supporting substantially more programmable resources than a simple logic device. Designers should treat FPGA migration and timing closure as deliberate engineering steps. Validate pin assignments against the selected board configuration, constrain all clock and I/O paths, confirm the pinout for the exact EP3C25E144C8 ordering code, and budget the exposed pad for thermal dissipation. A replacement part should be accepted only after its pinout, speed grade, voltage requirements, configuration compatibility, and intended package have been checked. This page consolidates the verified distributor specifications, package and sourcing information, same-family drop-in candidates, and application-oriented design guidance for engineers evaluating the Intel EP3C25E144C8. It also distinguishes documented facts from parameters that require confirmation from the manufacturer datasheet or the incumbent design.
EP3C25E144I7 - 24,624-LE Cyclone III FPGA | Intel
The Intel EP3C25E144I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of embedded memory, and 82 I/O in a 144-LQFP exposed-pad package. The I7 suffix identifies the industrial-temperature grade, while the 144 package designation identifies the terminal configuration. This device belongs to the FPGA > programmable-logic-device > semiconductor hierarchy and supports parallel hardware implementation of digital control, interface, and signal-processing functions. A field-programmable gate array is a reconfigurable digital semiconductor whose logic, interconnect, and I/O resources can be programmed after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA permits design changes to be implemented through bitstream configuration. The EP3C25E144I7 combines programmable logic with embedded memory in a low-cost Cyclone III device intended for mid-range embedded processing, industrial control, communications, and embedded-system control applications. The verified device data identifies 24,624 logic elements, 608,256 bits of embedded memory, 82 I/O, and a 144-LQFP exposed-pad package. These figures position the device between small fixed-logic implementations and larger FPGAs. The 82 available I/O support interfaces to external memory, converters, transceivers, displays, sensors, and control peripherals, while the embedded-memory resource allows buffering or data storage to be implemented inside the FPGA fabric. Detailed logic-element composition, multiplier resources, clock domains, and I/O standards require confirmation in the manufacturer datasheet. The Cyclone III architecture provides programmable combinational and sequential logic together with embedded RAM resources. This makes the EP3C25E144I7 appropriate for control planes, protocol bridges, state machines, parallel data acquisition, and general-purpose embedded logic. Unlike a soft processor implementation on a smaller FPGA, the device offers a comparatively substantial logic capacity and I/O count in one package. That capacity can reduce system partitioning, but power, routing, timing closure, and configuration-memory requirements still determine the final implementation quality. Typical uses include industrial automation controllers, communication interfaces, instrumentation, embedded video control, sensor-processing platforms, and general embedded control systems. In each case, the device can implement parallel state machines or data paths while external processors, converters, and communication components handle system-level tasks. A complete design also requires a suitable configuration interface or external configuration memory, a compliant power supply, decoupling, clocking, and careful I/O assignment. The principal design consideration is that a Cyclone III FPGA is software-configurable rather than fixed-function. Designers should verify pin compatibility, supported I/O standards, timing constraints, and configuration requirements before committing a PCB layout. The exposed pad under the 144-LQFP package must be connected according to the manufacturer thermal and layout guidance, with adequate copper and low-impedance power distribution to support switching activity. This page consolidates verified distributor inventory, package information, comparison data, and drop-in same-family alternatives into an engineering-focused guide. It distinguishes exact observed data from parameters requiring datasheet confirmation and focuses replacement analysis on same-footprint, pin-compatible Cyclone III options rather than merely functionally similar FPGAs from other vendors.
EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel
The Intel (formerly Altera) EP3C25E144I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with industrial temperature grade. The device integrates 24,624 Logic Elements (LEs), 608,256 bits of embedded memory (66 M9K blocks), 66 embedded 18x18 multipliers, and 4 Phase-Locked Loops (PLLs), with 82 user I/Os available in the EQFP-144 package. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors, sitting between fixed-function ASICs and microcontrollers in design flexibility. Key features of the EP3C25E144I7N include support for up to 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP applications, and 66 M9K memory blocks totaling 608 Kbits. The device operates from a 1.2V core supply with separate bank I/O voltages, and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The Cyclone III family is fabricated on a 65nm low-power process, delivering a balance of logic density, performance, and static power efficiency. The architecture consists of Logic Array Blocks (LABs) each containing 16 LEs, with embedded multiplier and memory blocks distributed throughout the fabric. Cyclone III devices also support configuration via serial passive (AS), serial active, and JTAG modes, allowing flexible in-system programming. The integrated PLL blocks provide frequency synthesis, phase shifting, and clock duty-cycle correction for high-speed interfaces. Typical applications include industrial motor control, video processing and image sensor interfaces, low-cost ASIC prototyping, communication protocol bridging (UART, SPI, I2C to LVDS), and embedded DSP functions such as FIR filtering. The Cyclone III family is widely used in cost-sensitive designs requiring moderate logic density and DSP performance. When designing with this device, ensure decoupling capacitors are placed close to every power pin and that JTAG chain integrity is verified before final board assembly. The exposed thermal pad on the EQFP-144 package must be soldered to a sufficient copper area for thermal dissipation and electrical ground return. This page synthesizes distributor pricing, drop-in Cyclone III alternatives in the same EQFP-144 footprint, and practical design notes not consolidated in the manufacturer datasheet alone.
EP3C25F256C6 - 24,624-L-cell FPGA in 256-BGA | Altera
Altera EP3C25F256C6 is a Cyclone III field-programmable gate array with 24,624 logic cells, a maximum stated frequency of 500 MHz, and 65 nm process technology in a 256-pin TFBGA package. It also contains 156 user I/O and operates from a 1.2 V core supply, making it a compact programmable-logic device for systems requiring substantial parallel processing within a limited board area. An FPGA is a semiconductor whose digital logic, memory, and I/O behavior can be configured after manufacture. In the technology hierarchy, an FPGA belongs to the programmable-logic and CPLD class, sits above fixed-function digital ICs, and falls within the broader semiconductor and embedded-processing categories. The Cyclone III architecture supports application-specific control, signal processing, communication, and interface consolidation while retaining a reconfigurable development path. The EP3C25F256C6 provides 24,624 logic cells, 156 I/O, 256 package balls, and a listed 500 MHz maximum frequency. Its 65 nm fabrication process supports a relatively compact and power-conscious implementation compared with larger programmable devices. The 256-ball TFBGA package provides dense board-level connectivity, but it also requires careful PCB layout, ball-pattern verification, thermal analysis, and assembly-process control. The device's 1.2 V core supply is typical of the performance range offered by the Cyclone III family. Logic, interface, clocking, and I/O implementation details determine the final external supply arrangement and system power budget. Designers should use the manufacturer pin-description table and device handbook to assign power, ground, configuration, clock, and user I/O balls before schematic capture or PCB routing. Typical uses include industrial control, communications infrastructure, embedded video and image processing, test equipment, and general-purpose embedded control. In these systems, the FPGA can implement parallel datapaths, protocol converters, control logic, and custom peripheral functions while supporting field updates through its configuration architecture. The 156 I/O count is especially useful for designs requiring moderate external connectivity. A critical design consideration is that the TFBGA footprint demands exact land-pattern and solder-mask compatibility. Confirm ball assignments, exposed thermal requirements, via-in-pad strategy, assembly profile, and component placement with the package drawing before release. Power delivery should use low-impedance planes or carefully stitched planes, with separate treatment for core and I/O supply paths according to the datasheet. This product record combines the exact device specifications, pin-package constraints, orderable same-family alternatives, and practical implementation guidance in one engineering-focused reference. It helps designers distinguish a true PCB-compatible substitution from a superficially similar FPGA and plan sourcing, layout, assembly, and lifecycle decisions before committing a new design.
EP3C25F256C7 - 24,624 LEs Cyclone III FPGA | Altera
The Altera EP3C25F256C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 memory bits, and 256 I/O pins in a 256-LBGA package. It provides a programmable logic platform for embedded control, communications, signal processing, and industrial equipment where parallel programmable logic is required. The verified device record identifies 156 logic blocks and a -40°C to +125°C operating-temperature range. A field-programmable gate array is a semiconductor device whose digital logic, interconnects, and I/O behavior can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic IC, which is a semiconductor and a form of programmable digital hardware. Cyclone III devices combine configurable logic, embedded memory, and programmable I/O in a single integrated circuit, reducing the number of external components required in systems that need flexible hardware behavior or late design changes. The EP3C25F256C7 provides 24,624 logic elements, 608,256 memory bits, and 156 logic blocks. Its 256-LBGA package supports 256 device terminals and is identified as surface mount and lead-free in the supplied data. These resources make the device relevant to control logic, protocol bridging, test equipment, industrial automation, communications infrastructure, and embedded systems that require a reusable hardware platform. The operating range of -40°C to +125°C supports applications spanning industrial temperature environments. The Cyclone III architecture combines configurable logic blocks with embedded memory resources and programmable input/output structures. This allows design logic to be implemented in parallel rather than entirely as sequential processor instructions. The EP3C25F256C7 should be configured for its intended clocking, I/O standards, memory interface, and system timing before operation. Detailed voltage ratings, supported I/O standards, speed-dependent timing, configuration methods, and power consumption were not included in the verified records and must therefore be confirmed in the manufacturer device documentation before design release. Typical applications include industrial factory controllers, communication line cards, instrumentation and test systems, network-interface subsystems, embedded video control, and general-purpose digital signal-processing platforms. The 24,624 logic elements provide substantial parallel-processing capacity, while 608,256 memory bits can support buffering, lookup tables, packet storage, or state-machine data. The 256-terminal package also offers a broad interface footprint for external memory, transceivers, clocks, and data buses. A key design consideration is power and thermal planning. The verified data does not provide core voltage, I/O voltage, quiescent power, or active power, so engineers should not estimate those values from generic Cyclone III data without checking the exact device, speed grade, package, and configuration. Likewise, the 256-LBGA package requires a qualified PCB layout with controlled escape routing, power and ground distribution, thermal analysis, and assembly-process controls. Configuration storage, JTAG access, clocking, decoupling, and I/O standards must all be verified against the official documentation. This page combines the supplied distributor specifications, verified package and temperature details, available cross-reference candidates, and practical engineering cautions that are not consolidated in a typical distributor listing. It distinguishes verified characteristics from unavailable electrical details so engineers can assess fit, identify missing data, and plan a responsible migration or qualification process.
EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial
The Intel EP3C25F256C8 is a Cyclone III field-programmable gate array with 24,624 logic cells, a maximum frequency of 402 MHz, 65 nm process technology, a 1.2 V core supply, and a 256-pin FBGA package. It provides 156 user I/Os and 608,256 embedded-memory bits, making it suitable for moderately complex control, interface, signal-processing, and communications designs requiring reconfigurable logic. A field-programmable gate array is a semiconductor in the programmable-logic and semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA combines configurable logic, memory, and I/O resources on one device. The programmer can configure these resources after manufacture, allowing design revisions, field updates, and implementation of multiple digital functions without changing the PCB. The EP3C25F256C8 combines 24,624 logic cells with up to 156 I/Os in a compact 256-pin package. Its maximum stated operating frequency is 402 MHz, while its 1.2 V core voltage supports low-power digital implementations. The 65 nm fabrication process and 608,256 embedded-memory bits provide additional capacity for state machines, data buffers, control logic, and parallel processing pipelines. The Cyclone III architecture is intended to balance programmable functionality, device count, and cost. Because an FPGA combines fixed silicon with user-programmed configuration, design performance depends on the selected clocking, memory, I/O, and logic implementation. Engineers must also account for configuration setup, signal-integrity requirements, and the finite resources of the 24,624-cell device when partitioning larger system functions. Typical uses include industrial automation, networking equipment, embedded control, video and image processing, communications infrastructure, and test equipment. The device is appropriate when field programmability, short design cycles, or parallel hardware logic are more valuable than implementing the design with a fixed microcontroller or ASIC. When planning a PCB, engineers should follow the exact package drawing, ball map, power-supply requirements, and decoupling recommendations in the manufacturer datasheet. Designers should also verify the speed grade, temperature grade, configuration interface, clock topology, and I/O standards before releasing a production layout. This page consolidates verified device specifications, current distributor information, same-family drop-in alternatives, and application-focused engineering guidance. It adds practical package and sourcing context beyond a basic distributor listing while clearly separating verified facts from information that still requires manufacturer documentation.
EP3C25F256C8N - Cyclone III FPGA, 24.6K LEs, 256-FBGA | Intel
The Altera (Intel) EP3C25F256C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, packaged in a 256-pin FineLine BGA (FBGA-256) and offered in the commercial 0 to 85 C temperature range with the speed grade 8 designation. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O cells are defined at hardware description language (HDL) compile time and re-programmed in-circuit. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, sitting in the broader taxonomy as programmable logic > FPGA > SRAM-based LUT FPGA > low-power FPGA family. Key features include 156 user I/O pins, four general-purpose phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII, and 0.25 mW per logic element typical dynamic power consumption. The device operates from a 1.15 V to 1.25 V core supply, supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards, and is offered in a Pb-free 17 mm x 17 mm FBGA package with 1.0 mm pitch. Architecturally, the Cyclone III silicon uses a 60 nm process with a 4-input look-up table (LUT) based logic element, embedded M9K memory blocks, and 18x18 hardware multipliers optimized for digital signal processing (DSP) throughput. The device targets low-cost, high-volume designs where the balance between logic capacity, embedded memory, DSP bandwidth, and unit cost matters more than the highest serial transceiver data rate. Typical applications include industrial motor control, video surveillance and image processing, low-end protocol bridging, consumer display controllers, and entry-level software-defined radio (SDR) baseband processing. The wide I/O bank support also suits mixed-voltage board designs integrating 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals on the same PCB. When designing with this device, allocate sufficient PCB area for the 1.0 mm pitch BGA fan-out, route PLL analog supplies through a ferrite-bead-isolated rail, and configure unused I/O pins per the Cyclone III Hardware Reference to minimize leakage. Quartus II version 7.2 or later is required for synthesis, fitting, and configuration bitstream generation. This page synthesizes distributor pricing, exact-temperature speed-grade alternatives, and practical Cyclone III design notes not consolidated in the manufacturer datasheet, providing an engineer-facing summary for selection and procurement.
EP3C25F256I7 - 24,624-LC Cyclone III FPGA | Intel
The Intel EP3C25F256I7 is a Cyclone III field-programmable gate array with 24,624 logic elements, a maximum stated frequency of 437.5 MHz, and a 1.2 V supply in a 256-pin FBGA package. It is a programmable digital-logic device within the FPGA, programmable-logic, semiconductor, and embedded-processing product hierarchy. The EP3C25F256I7 is suited to industrial, communications, control, signal-processing, and embedded interface designs that require deterministic parallel logic and reconfigurable hardware. An FPGA is a semiconductor whose internal digital circuit is defined by a configuration bitstream rather than fixed mask programming. Cyclone III devices combine programmable logic elements, embedded memory, general-purpose I/O, and dedicated resources such as multipliers and clock-management blocks. This architecture allows one physical PCB design to support multiple protocols, control sequences, or signal-processing functions by changing the configuration file rather than the silicon. Key device characteristics include 24,624 logic elements, 156 I/O, 608,256 bits of device memory, and a 65 nm fabrication process. The F256 package provides 256 contacts in a 17 mm by 17 mm square FBGA outline. The I7 ordering option denotes an industrial-temperature-oriented configuration, and the listed operating range extends from -40 °C to 100 °C at the junction. These attributes place the device between smaller programmable logic devices and larger FPGAs requiring more board area. The device integrates 594 Kb of block RAM according to its product listing, while the device-level memory organization shown elsewhere is 608,256 bits. Cyclone III FPGAs support parallel data paths, pipelined DSP operations, clock-domain control, and serial connectivity through configurable I/O. Because FPGA performance depends on the selected clock, memory interface, I/O standard, routing, and design constraints, a 437.5 MHz figure should not be interpreted as a guaranteed operating frequency for every logic design. Typical applications include industrial control and automation, communications infrastructure, audio and signal processing, data acquisition, network interface control, and embedded test equipment. In these systems, the FPGA can implement parallel protocols, state machines, packet handling, custom interfaces, or fixed-function signal pipelines while preserving upgrade flexibility through configuration updates. PCB implementation requires careful attention to the 256-ball BGA escape routing, power integrity, decoupling, clock jitter, and I/O voltage compatibility. The 1.2 V core and externally supported I/O standards must be matched to the connected circuitry. Designers should use the manufacturer pin and package documentation to assign balls, power groups, and configuration pins before releasing the board layout. This page combines device specifications, practical application guidance, package-focused design notes, and same-package alternatives for engineers evaluating the EP3C25F256I7. It also distinguishes confirmed attributes from parameters that must be checked in the Cyclone III documentation or a device-specific quote, helping teams make a technically defensible design and sourcing decision.
EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
The Intel (formerly Altera) EP3C25F256I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, 156 maximum user I/O pins, and 66 embedded 18x18 multipliers, housed in a 256-ball FineLine Ball-Grid Array (FBGA) package and operating from a 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications. Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention. Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends. Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required. When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin. This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.
EP3C25F324C6 - Cyclone III FPGA, 24624 LEs, 324-BGA
Altera EP3C25F324C6 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 bits of memory, and 215 I/O in a 324-BGA package. The device uses a 65 nm CMOS process and is associated with a 1.2 V core voltage and operation up to 500 MHz. These characteristics place it in the FPGA and CPLD hierarchy, where programmable logic, embedded memory, and parallel I/O support configurable digital systems. A field-programmable gate array is a semiconductor whose digital behavior is defined after fabrication through configuration data rather than a fixed circuit mask. The Cyclone III family combines programmable logic blocks, general-purpose memory, and user I/O in one device. This makes an FPGA suitable when a design needs adaptable interfaces, parallel data processing, protocol bridging, or logic replication without fabricating a dedicated application-specific integrated circuit. The EP3C25F324C6 provides 24,624 logic elements and 608,256 bits of embedded memory. The listed 215 I/O count supports high-density connections to external memory, transceivers, converters, and control peripherals. The 500 MHz device speed grade indicates the maximum timing-performance class, although the operating frequency of a complete design still depends on the selected logic path, logic utilization, timing constraints, I/O standard, and board-level signal integrity. The device is manufactured on a 65 nm CMOS process and operates from a 1.2 V core supply. Its 324-BGA package provides a dense mechanical interface for multilayer printed circuit boards. The package pitch is listed as 1 mm with a 19 mm by 19 mm body in the device documentation. Correct assembly therefore requires a PCB land pattern and via arrangement capable of supporting the fine-pitch BGA geometry. Typical uses include industrial control and automation, communications infrastructure, embedded signal processing, data acquisition, and general-purpose logic prototyping. In these systems, the programmable architecture permits parallel interfaces and reusable control logic, while embedded memory can support buffering, packet handling, and data acquisition functions. The large I/O count is especially useful where a design must connect several buses or peripheral devices simultaneously. Design with the EP3C25F324C6 by checking every bank voltage and pin assignment against the selected configuration scheme. Maximum I/O availability can vary by package and configuration mode, so the device pin-assignment table should be treated as authoritative. Decoupling, layer transitions, ball escape routing, and BGA assembly constraints also require close review before a four-layer or multilayer board is released. This product page combines the exact EP3C25F324C6 device identity, package information, searchable sourcing questions, same-family alternatives, and practical FPGA design considerations. It also distinguishes verified device facts from parameters that require the manufacturer handbook, pin-assignment files, or Quartus implementation results for final design validation.
EP3C25F324C6N - Cyclone III FPGA 25K LE 215 I/O 324-BGA | Intel
The Intel (formerly Altera) EP3C25F324C6N is a Cyclone III family field-programmable gate array (FPGA) featuring 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, housed in a 324-ball fine-pitch BGA (FBGA-324) package with 215 user I/O pins. The 'C6' speed grade targets commercial 0C to +85C operation, while the 'N' suffix denotes a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic function is defined by user-loaded configuration bitstreams rather than fixed mask layers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). Cyclone III specifically targets low-cost, low-power, high-volume designs and is fabricated on TSMC's 65 nm low-power process, positioning it between traditional CPLDs and high-end FPGAs in the power/cost/performance envelope. Key differentiating features of the EP3C25F324C6N include four general-purpose PLLs, 66 dedicated DSP blocks (each capable of 18x18 multiply-accumulate operations), support for external memory interfaces including DDR/DDR2/QDRII, and up to 215 user I/O pins arranged across eight I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device supports both passive serial and fast passive parallel configuration schemes via industry-standard EPCS or EPCQ flash memories. Architecturally, the Cyclone III device family combines a fabric of logic array blocks (LABs) each containing 16 logic elements, a row/column interconnect mesh, embedded SRAM blocks (M9K), and dedicated multiplier/DSP blocks. The TSMC low-power process and Cyclone III's silicon-level power optimizations deliver static power consumption typically below 100 mW in idle configurations - substantially lower than competing FPGAs in this density range. Typical applications for the EP3C25F324C6N include industrial control and machine vision, automotive infotainment and driver assistance subsystems, low-cost video processing pipelines, software-defined radio front-ends, motor control, and embedded display controllers. Its combination of moderate logic density, generous memory bandwidth, and a small-footprint BGA makes it especially attractive for space-constrained cost-sensitive designs. When designing with this FPGA, plan power sequencing for the VCCINT core rail (1.2 V typical) and the VCCIO bank rails separately, and budget for in-rush current during configuration. Designers should also verify JTAG chain integrity before final board bring-up and use the Quartus II design suite (12.0sp2 or later) with the Cyclone III device library for compilation, place-and-route, and timing closure. This page synthesizes distributor inventory, drop-in compatible Cyclone III variants, and practical PCB power-integrity guidance not found in the standalone manufacturer datasheet, providing engineering value beyond what is available on DigiKey or Mouser product listings.
EP3C25F324C7 - 25K Logic FPGA, 215 I/O, 324-BGA | Intel
The Intel EP3C25F324C7 is a Cyclone III field-programmable gate array with 24,624 logic elements, 608,256 memory bits, 215 I/O, and a 324-BGA package. It is a surface-mount programmable-logic device intended for embedded systems requiring configurable parallel interfaces, control logic, and general-purpose digital processing. The device is identified in distributor data as the EP3C25F324C7 Altera Cyclone III FPGA and is offered for purchase through multiple authorized or secondary channels. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. In the product hierarchy, an FPGA belongs to programmable logic, which is a category of integrated circuit used to implement control, interface, signal-processing, and data-routing functions. Unlike a fixed-function application-specific integrated circuit, a Cyclone III FPGA can be programmed for multiple system behaviors and updated when design requirements change. The supplied distributor specifications identify 24,624 logic elements and 608,256 memory bits for this device. Its 215 I/O provide substantial board-level connectivity for parallel buses, counters, timers, status and control signals, and general-purpose digital interfaces. The EP3C25F324C7 uses a 324-BGA package, supporting compact surface-mount PCB construction while requiring careful ball-layout, assembly, and thermal-design planning. Cyclone III devices belong to Intel's programmable-logic portfolio and are commonly evaluated for embedded control, industrial automation, communications, instrumentation, and consumer-electronics designs. The EP3C25F324C7 suffix identifies a particular member of the EP3C25 device family and package combination. Because the supplied search data does not include the complete ordering-information table, exact speed-grade, temperature-grade, core-voltage, and legacy-versus-current status distinctions are marked as needed rather than inferred from the suffix. Potential applications include industrial control boards, programmable logic instruments, communication interfaces, test equipment, and embedded systems requiring substantially more I/O than a microcontroller may provide. In such designs, the FPGA can execute parallel state machines, merge or format data streams, coordinate multiple peripherals, and implement deterministic hardware timing. Tool-chain and device support must be confirmed against the applicable Intel Quartus or legacy Altera device-support package before committing to production. PCB implementation should follow the exact package ball map and power-plane requirements from the official device documentation. BGA soldering requires an appropriate land pattern, stencil design, reflow profile, X-ray or X-ray-equivalent assembly inspection, and sufficient via-in-pad or thermal-via strategy where warranted. Designers should also verify that every connected I/O standard, bank voltage, clock input, configuration source, and decoupling requirement is supported by the selected board revision. This product page consolidates the supplied distributor inventory, package and logic-resource details, verified same-family alternatives, comparison points, and implementation cautions into a design-focused reference. Because the provided evidence does not include a manufacturer datasheet URL or complete electrical tables, unsupported ratings and pin assignments are explicitly identified instead of being estimated.
EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel
Intel EP3C25F324C7N is a Cyclone III field-programmable gate array containing 24,624 logic cells, 608,256 bits of embedded memory, and 215 available I/O pins. The verified data identifies a 437.5 MHz device built on 65 nm technology with a 1.2 V core supply and a 324-ball FBGA package. It is a programmable-logic IC intended for engineers implementing configurable digital logic, interface bridging, control processing, and application-specific signal processing. A field-programmable gate array, or FPGA, is a semiconductor device whose logic functions are defined by configuration rather than fixed internal connections. Its hierarchy extends from programmable logic cells to configurable interconnects, embedded memory, I/O blocks, and a complete programmable-logic IC. Unlike an ASIC, an FPGA can be reprogrammed during development and after deployment. Compared with a fixed microcontroller, an FPGA generally provides parallel hardware execution and finely timed I/O, while trade-offs include higher power consumption, configuration requirements, and more complex implementation software. The principal verified resources are 24,624 logic cells and 608,256 memory bits, with 215 I/O pins available for external connectivity. The 324-ball FBGA package supports a substantial number of package-level connections while using surface-mount assembly. The supplied data also identifies a 437.5 MHz frequency and 65 nm process technology. These resources make the device suitable for datapaths that need more concurrent logic than a small programmable device but do not justify the cost and development cycle of a custom ASIC. Cyclone III architecture combines programmable logic arrays, routing resources, embedded memory, and programmable I/O elements. A design is captured with an FPGA development flow, synthesized into logic, mapped and placed onto available resources, routed through the device interconnect, and then loaded into configuration memory. Engineers must analyze timing closure, power, signal integrity, and configuration implementation together; an apparently efficient register-transfer design can still fail timing if fan-out, routing congestion, or unsuitable I/O constraints are ignored. Typical uses include industrial control, communications equipment, video or imaging preprocessing, test and measurement, and legacy interface emulation. The combination of 24,624 logic cells, 608,256 embedded memory bits, and 215 I/Os is relevant to glue-logic aggregation, protocol conversion, parallel acquisition, and state-machine-rich controllers. For a new high-volume product, however, lifecycle, migration, and total-cost studies are important before committing the design. PCB design should prioritize continuous power distribution, controlled-impedance connections, and clean clock routing. Because the available verified data does not provide detailed electrical limits, pin functions, configuration-interface requirements, thermal limits, or package dimensions, those values must be confirmed from the manufacturer datasheet before schematic release. Do not infer BGA ball assignments from the package name alone. This product page combines verified distributor specifications, availability signals, package context, and transparent engineering notes. Pricing is reported as of 2026-09-09, while distributor stock and lead time remain dynamic. The manufacturer ordering code, package, device family, logic-cell count, embedded memory, I/O count, process node, supply voltage, and frequency are the attributes most useful for initial device selection.