FPGA & CPLD
Products (6358)
EP3SE110F1152C4LN - 107.5K LE Stratix III E FPGA, 1152-FCBGA
The Altera (Intel) EP3SE110F1152C4LN is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) housed in a 1152-pin Fine-Pitch Chip-Scale Ball Grid Array (FC-FBGA / BBGA) package. It contains 107,500 logic elements (LEs) and 4,300 Logic Array Blocks (LABs), and integrates 8,936,448 bits of embedded memory. The device exposes 744 user I/Os and supports an internal clock infrastructure rated up to 717 MHz (some catalog sources list 800 MHz internal). Core logic operates from a 0.9 V nominal supply (0.86 V to 0.94 V range), with the 65 nm Stratix III process node targeting the lowest-possible power for high-density FPGAs of its era. An FPGA is a programmable logic device whose interconnect, look-up tables, and memory blocks can be reconfigured in-circuit to implement arbitrary digital functions, DSP blocks, and memory subsystems. The Stratix III E family is the enhanced-logic variant, optimized for high logic density and embedded memory rather than transceivers. Within Intel/Altera's broader hierarchy, the part sits as: LE -> LAB -> FPGA -> programmable logic -> digital IC -> semiconductor. This taxonomy supports AI knowledge-graph ingestion and long-tail discovery for engineers searching for high-density, low-power FPGA alternatives. Key features include 8.9 Mbits embedded RAM, dedicated DSP blocks for high-throughput arithmetic, MultiTrack interconnect for predictable timing closure, and Adaptive Logic Modules (ALMs) that improve logic utilization over previous architectures. The device supports multiple I/O standards through its 744 user I/O pins and exposes programmable PLLs for clock synthesis. Configuration is typically loaded through JTAG or a serial/parallel flash, with built-in CRC and encryption options on the family. The architecture combines a fabric of ALMs with high-speed interconnect and dedicated DSP slices, making the EP3SE110F1152C4LN well-suited for parallel datapaths, signal processing, and protocol bridging where many independent channels must operate concurrently. The 65 nm process enables high utilization rates at modest static power compared with earlier 90 nm Stratix II devices. Typical applications include telecommunications line cards, software-defined radio (SDR) baseband processing, video broadcasting infrastructure, high-channel-count DSP pipelines, ASIC prototyping, and industrial control subsystems requiring hundreds of I/Os. The wide 1152-pin package exposes enough I/O and memory interfaces for multi-port memory controllers and parallel bus structures. A practical design consideration is PCB layout: the FC-FBGA-1152 package demands high-density multi-layer routing (typically 8 to 12 layers), controlled-impedance traces, and a thorough power-delivery network (PDN) with bulk plus decoupling capacitors placed close to the supply pins. Engineers should follow Intel/Altera's Stratix III PCB design guidelines to maintain signal integrity at the rated 717 MHz internal frequency. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III E family, and practical design guidance not always present in the manufacturer datasheet, giving sourcing engineers and FPGA designers a single, AI-citable reference.
EP3SE110F1152C4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F1152C4N is a high-density, high-performance Stratix III Enhanced (E) family Field Programmable Gate Array (FPGA) fabricated on a 65 nm low-power process. It integrates 107,500 logic elements, 8,936,448 bits of embedded memory, 896 embedded 18x18 multipliers, and is housed in a 1152-ball Flip-Chip BGA (FCBGA) package with commercial temperature grade (0C to +85C). It operates from a 1.1 V core supply and supports modular I/O banks with common bank structure for vertical migration. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. Within the broader taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic devices, but offer the highest logic density and the highest performance-per-watt ceiling in the FPGA category. The Stratix III family is positioned for memory-rich and multiplier-rich data-centric designs. Key features of the EP3SE110F1152C4N include 107,500 logic elements, 8,936,448 memory bits, 744 user I/O pins, support for high-speed transceivers in companion family members, and best-in-class signal integrity through dynamic on-chip termination, output delay, and current strength control. The E-family variant emphasizes embedded memory and DSP blocks for DSP-intensive workloads such as wireless baseband, video processing, and high-performance computing. The device architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), DSP blocks, and modular I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and PCIe. Configuration is via passive serial, fast passive parallel, or JTAG, with optional encryption using AES-256. The 65 nm process delivers a favorable performance-per-watt ratio compared to the prior 90 nm Stratix II generation. Typical applications include high-end communications infrastructure (10G/40G Ethernet line cards, OTN framer/mapper, baseband processing), high-performance computing accelerators, ASIC prototyping, broadcast video processing, and military/aerospace signal processing. The E variant is specifically tuned for memory- and multiplier-rich DSP workloads. Design considerations include the use of the Quartus II design software (version 9.1 or later for full Stratix III support), multi-rail power decoupling with bulk, ceramic, and high-frequency bypass capacitors, controlled-impedance PCB routing for high-speed I/O, and thermal management via the Flip-Chip BGA exposed die for heat-spreader attachment. Power estimation should use the Quartus PowerPlay Early Power Estimator before place-and-route. This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in a single datasheet view. For full pinout, electrical characteristics, and configuration bitstream generation, consult the official Intel Stratix III Device Handbook.
EP3SE110F1152I2N - Stratix III E 107.5K LE FPGA | Intel / Altera
The Intel (formerly Altera) EP3SE110F1152I2N is a high-density Stratix III Enhanced Field-Programmable Gate Array (FPGA) delivering 107,500 logic elements organized within 4,300 logic array blocks (LABs), housed in a 1,152-ball flip-chip BGA (FCBGA) package with 1.00 mm terminal pitch. The device is fabricated on a low-power CMOS process and is rated for industrial temperature operation from -40C to +100C. The 'I2' speed grade and 'N' lead-free RoHS suffix indicate an industrial-grade, lead-free assembly variant. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O can be configured by the user after manufacture. FPGAs sit in the programmable-logic tier of the broader digital IC hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and are used to implement parallel datapaths, high-speed serial interfaces, and custom glue logic that would otherwise require several discrete components or a custom ASIC. Key features include up to 8,936,448 system gates, embedded memory blocks, DSP blocks, and high-speed transceivers supporting multi-gigabit serial protocols. The device operates from a 1.05 V to 1.15 V core supply (nominal 1.1 V) plus dedicated PLL and I/O bank supplies. Up to 744 user I/O pins are available depending on bank configuration, and the 1.00 mm-pitch FCBGA-1152 package is designed for high-density, multi-layer PCB assembly. Architecturally, Stratix III Enhanced devices use a 40-nm low-power process and a programmable power technology that lets unused logic, memory, and transceiver blocks enter a near-zero static state. The fabric combines adaptive logic modules (ALMs), TriMatrix embedded memory (MLAB, M9K, M144K blocks), and DSP blocks that together provide tens of GMACs of DSP throughput. Typical applications include high-speed wireline and wireless baseband processing, ASIC prototyping, high-performance digital signal processing, broadcast video processing, and high-end test-and-measurement instrumentation. The high pin count and serial bandwidth make it well-suited for line-card designs and protocol bridge functions. When designing with this device, plan PCB stack-up for the 1.0 mm-pitch FCBGA, route all transceiver differential pairs with controlled impedance, and observe the Quartus II power-estimator early in the design cycle. Power-supply sequencing and decoupling must follow the Stratix III Enhanced pin connection guidelines to avoid stress on the core logic. This page synthesizes distributor pricing, package-specific alternatives from the Stratix III Enhanced family, and practical design notes that complement the manufacturer datasheet.
EP3SE110F1152I3 - Stratix III E FPGA 107.5K LE 1152-FBGA | Intel
The Intel (formerly Altera) EP3SE110F1152I3 is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 107,500 logic elements in a 1152-pin FC-FBGA package. Built on a 1.1-V, 65-nm all-layer copper SRAM process, it provides 8,936,448 bits of embedded memory, 4,300 LABs/CLBs, and 744 user I/Os while operating up to 500 MHz core frequency. What is a Stratix III E FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers configure to create custom digital circuits. Stratix III E is a high-performance enhanced variant within Intel's Stratix III family, optimized for DSP, ASIC-prototype, and embedded-processor applications requiring very high logic density and embedded memory bandwidth. Key features include 384 (18x18) multipliers for DSP, up to 8 embedded transceiver blocks supporting 3.125 Gbps data rates, and partial reconfiguration capability that allows portion-by-portion logic reprogramming during operation. The FPGA integrates hard PCIe, memory controllers, and SERDES blocks, reducing external component count. Architecturally, Stratix III E uses ALM (Adaptive Logic Module)-based LABs, an 8-input fracturable look-up table structure, and variable-precision DSP blocks that can be configured for 9x9, 18x18, or 36x36 multiplications. The programmable power technology enables fine-grained power gating of logic, memory, and DSP regions, delivering up to 50% lower power than competing devices at equivalent performance. Typical applications include high-end ASIC prototyping, digital signal processing (radar, medical imaging, wireless baseband), high-speed data acquisition, software-defined radio, and high-throughput networking line cards. The 8.9 Mbit embedded memory and 384 multipliers make it ideal for FFT/iFFT engines, video codecs, and encryption accelerators. When designing with this part, follow Intel's Stratix III pin connection guidelines for unused pins, and use the Quartus II (13.0 or later) design tool chain. Because the device operates at 1.1 V core, decoupling requires low-impedance power planes rather than simple capacitor networks. This page synthesizes distributor pricing, drop-in Stratix III E and Stratix III L alternatives with the same 1152-FBGA footprint, and practical thermal/PCB design notes not found in the manufacturer datasheet.
EP3SE110F1152I3N - Stratix III E FPGA, 107K LE, 1152-FCBGA | Altera
The Intel (formerly Altera) EP3SE110F1152I3N is a high-performance, low-power 65 nm Stratix III E Field Programmable Gate Array delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 744 maximum user I/Os in a 1152-ball Flip-Chip BGA (FC-FBGA) package. The device targets data-centric, memory-rich and DSP-intensive applications where its 896 18x18 multipliers, 4 memory-rich LABs and modular I/O banks with dynamic on-chip termination deliver best-in-class signal integrity. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect and I/O can be configured by the end user to implement custom digital circuits, soft processors, DSP pipelines and high-speed serial interfaces. FPGAs sit at the highest level of the programmable-logic taxonomy: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. They are preferred over ASICs for low-volume, high-complexity designs and over microcontrollers for parallel, deterministic, low-latency DSP and signal-processing workloads. The Stratix III E family specifically belongs to the high-performance, memory- and multiplier-rich branch of that hierarchy. Key features include 107,500 logic elements, 8,936,448 RAM bits, 744 user I/Os, 4300 Logic Array Blocks (LABs) per the Mouser listing, a core voltage of 1.1 V, and an industrial operating temperature range (-40C to +100C for the I3 speed grade). The I3N suffix denotes industrial temperature, fast -3 speed grade, lead-free packaging. The device is built on a TSMC 65 nm process and supports up to 12.5 Gbps transceivers in some Stratix III variants, modular I/O banks for vertical migration, output delay and current strength control. Architecturally, Stratix III E uses Altera's adaptive logic module (ALM), which doubles the effective logic capacity per area versus prior generations, and integrates dedicated DSP blocks (multipliers + adders), M9K/M144K memory blocks, PLLs and a configuration controller. Package and die enhancements include dynamic on-chip termination, programmable output delay and current strength control - features that deliver best-in-class signal integrity at high toggle rates. Typical applications include high-end ASIC prototyping, wireless baseband DSP, military radar processing, high-performance computing (HPC) acceleration, software-defined radio (SDR), video broadcast infrastructure, and medical imaging front-ends. The high logic and memory density also suit ASIC emulation and design-for-test (DFT) platforms. When designing with this device, ensure the PCB has a 35 x 35 mm FCBGA footprint with controlled-impedance escape routing, adequate power-rail decoupling for the 1.1 V core and 2.5 V/3.3 V auxiliary supplies, and a JTAG header for Quartus II programming. Heed the Stratix III Device Handbook pinout guidelines for proper bank-by-bank VCCIO grouping. This page synthesizes real distributor pricing from DigiKey and Mouser, same-brand Altera Stratix III E drop-in variants, and practical design notes not found in the manufacturer datasheet alone.
EP3SE110F1152I4 - Stratix III E FPGA 107K LE 1152-FCBGA | Intel
The Intel (Altera) EP3SE110F1152I4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 107,500 logic elements (LEs), 744 DSP blocks, and 8,936,448 bits of embedded memory (approximately 1.1 MByte) into a 1152-ball FineLine BGA (FCBGA) package. It operates across an industrial temperature range of -40°C to +100°C, supports up to 744 user I/Os, and is built on a 40nm process node that delivers high logic density with low static power. A Field-Programmable Gate Array (FPGA) is a semiconductor device built from a matrix of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory blocks, and programmable I/O cells, all interconnected by a routed fabric. Within the broader integrated-circuit taxonomy, an FPGA belongs to programmable logic devices (PLDs), itself a subset of digital ICs. Stratix III E devices specifically target high-performance digital signal processing, high-throughput serial connectivity, and embedded processor subsystems where deterministic latency and parallel arithmetic matter more than the absolute logic capacity of a CPU. Key features include 4300 Logic Array Blocks (LABs) - Mouser lists this as the LABs figure - transceivers supporting up to 600 MHz fabric performance, embedded multiplier blocks for high-speed DSP, and dedicated memory interfaces including DDR3/DDR2/QDRII+ support. The device includes 24 phase-locked loops (PLLs) and supports multiple I/O standards including LVDS, HSTL, SSTL, and PCI Express. Configuration is supported through JTAG, passive serial, fast passive parallel, and Altera-specific modes such as Active Serial (AS) using an EPCS configuration device. Technically, the Stratix III E family improves the ratio of logic performance per watt over the prior Stratix II generation by combining a lower-power programmable logic fabric with on-chip DSP blocks and TriMatrix embedded memory that can be configured as RAM, ROM, shift registers, or FIFO buffers. The integrated transceivers support protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI at multi-gigabit rates. Typical applications include high-end communications infrastructure (10G/40G line cards, base-station DSP), high-performance test and measurement instrumentation, ASIC prototyping, high-throughput video processing, and embedded compute acceleration. The 1152-ball FCBGA package supports dense board designs where multi-channel I/O and memory interfaces must be routed out without compromising signal integrity. When designing with this device, plan for substantial power-delivery and thermal management: a 107.5K-LE design typically requires a multi-layer PCB with at least 6 layers, multiple decoupling capacitors per power rail, and thermal vias beneath the FCBGA. Configuration storage should use an EPCS flash device paired with JTAG for in-system reprogrammability. Pin compatibility within the Stratix III E family allows migration between density variants on the same footprint, simplifying hardware reuse. This page synthesizes distributor pricing, package-level drop-in alternatives within the Stratix III E family, and practical design notes that go beyond what the manufacturer datasheet alone provides - giving procurement and engineering teams a single reference for lifecycle, supply chain, and engineering decisions.
EP3SE110F1152I4L - Stratix III E FPGA, 107.5K LE, 1152-FBGA | Intel
The Intel EP3SE110F1152I4L is a high-density Stratix III E Field Programmable Gate Array (FPGA) containing 107,500 logic elements, 8,936,448 bits of embedded memory, 744 user I/O pins, and 528 (9-bit equivalent) multipliers, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. It is built on TSMC's 40 nm low-power process and targets high-performance digital signal processing, telecommunications, and ASIC prototyping applications. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device whose logic architecture can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable logic hierarchy (above CPLDs) within the broader semiconductor / integrated circuit family. The Stratix III E family specifically optimizes logic density and DSP capability per watt versus the Stratix III L (low-power) and Stratix III GX (transceiver-rich) sub-families. Key features of the EP3SE110F1152I4L include a 600 MHz maximum internal clock frequency, dedicated DSP blocks with up to 600 MHz multiply-accumulate throughput, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express Gen1 via soft IP), embedded hard memory controllers, and up to 12.5 Gbps operation in select variants when paired with external transceivers. The 1152-FCBGA package exposes 744 user I/O balls with flip-chip BGA interconnect for high signal-integrity performance. The device integrates a programmable PowerPlay power management system with on-chip temperature-sensing diodes, allowing dynamic voltage and frequency scaling. Quartus II design software (with Qsys system integration tool) supports this part; newer Quartus Prime is not officially supported for Stratix III. The high logic count and DSP multiplier density make this part a strong choice when migrating ASIC or ASSP designs to programmable logic for prototyping or low-volume production. Typical applications include high-speed image processing, radar baseband, telecom protocol bridging, ASIC prototyping, high-end test and measurement equipment, and DSP-intensive data acquisition systems. Designers typically pair this FPGA with external DDR2/DDR3 memory, clock generators, and high-speed ADCs/DACs. When designing with this part, plan power delivery carefully: a 1152-ball FCBGA requires multiple voltage rails (core, I/O, PLL, auxiliary) with substantial decoupling. PCB designers must allocate dedicated layers for ground and power to maintain signal integrity at multi-hundred-megahertz toggle rates. Because the device is EOL per recent distributor notices, long-term availability should be confirmed before committing to new designs. This page synthesizes distributor pricing from DigiKey, lead-time observations from Heisener, and a parameter-anchored comparison with other Stratix III variants not aggregated on any single manufacturer or distributor page.
EP3SE110F1152I4LN - Stratix III E FPGA 107.5K LE 1152-FCBGA | Altera
The Altera (Intel) EP3SE110F1152I4LN is a high-density Stratix III E field-programmable gate array (FPGA) offering 107,500 logic elements, 744 user I/Os, and 8,936,448 bits of embedded memory, housed in a 1152-ball flip-chip BGA (FCBGA) package. The device is fabricated on a 65 nm process node and operates from a 0.9 V core supply with I/O voltages programmable up to 3.3 V per bank. It is rated to a maximum internal clock frequency of 375 MHz and targets high-performance logic, memory-rich, and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a type of semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and are used where ASIC NRE costs cannot be justified but deterministic hardware performance is required. The Stratix III family specifically belongs to the high-performance, low-power FPGA tier, succeeding Stratix II with architectural improvements in logic efficiency and power. Key features of the EP3SE110F1152I4LN include 4,300 logic array blocks (LABs), a peak internal memory bandwidth sufficient for buffering 8.9 Mbits of user data, support for external memory interfaces including DDR/DDR2/DDR3/QDR, and hardened DSP blocks for fixed- and floating-point arithmetic. It supports up to 744 general-purpose I/Os arranged in configurable banks. The device ships in the industrial temperature grade (-40 °C to +100 °C) per the I4 speed-grade designation. The package is lead-free (Pb-free) with NiPdAu terminations. Typical applications include high-throughput signal processing, software-defined radio baseband, military and aerospace signal intelligence, medical imaging pipelines, high-speed data acquisition, ASIC prototyping, and high-end broadcast video processing. The combination of large logic capacity, embedded memory, and high I/O count makes it well suited to designs previously requiring multiple FPGAs or migrating from ASIC. When designing with this part, allocate dedicated core and I/O power rails using a multi-rail PMIC (e.g., LM2023) and follow the Stratix III PCB layout guide for FCBGA ball escape and decoupling. JTAG and AS configuration modes are both supported. Plan for JTAG chain integrity at the board level. This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet.
EP3SE110F1152I4N - Stratix III E FPGA, 107.5K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F1152I4N is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) housed in a 1152-ball FC-FBGA package. Built on a 65 nm process technology, it integrates 107,500 logic elements, 4,300 LABs/CLBs, 744 user I/Os, and approximately 8.94 Mbits of embedded memory, with maximum operating frequency up to 600 MHz (per verified distributor data). An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks. In the broader taxonomy, FPGAs are a sub-family of programmable logic devices (PLDs), which themselves sit within the integrated circuit (IC) hierarchy alongside ASICs and microcontrollers. FPGAs are chosen when designers need hardware-level parallelism, custom high-speed I/O timing, or rapid prototyping of complex digital systems. The Stratix III E family is engineered for transceivers and DSP-heavy workloads, with the EP3SE110 positioned in the mid-to-high density tier of the family. According to the manufacturer datasheet family, the device supports multiple high-speed transceiver channels and dedicated DSP blocks, making it suitable for signal processing pipelines. The 'I4' speed grade and industrial temperature rating make the I4N variant suitable for harsh-environment designs. Typical applications include telecommunications baseband processing, high-speed data acquisition, broadcast video processing, and high-performance digital signal processing cards. The 1152-ball FC-FBGA package exposes a large pin count, allowing simultaneous access to many high-speed serial lanes and parallel LVDS/TTL I/Os. When designing with this FPGA, verify that PCB layout accommodates the 1.0 mm (or 0.8 mm) ball pitch of the FC-FBGA and that thermal vias are placed under the central thermal balls to dissipate the configurable power budget. This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design guidance not found in the manufacturer datasheet alone.
EP3SE110F780C2 - Stratix III E FPGA 107.5K LEs 780-FCBGA | Intel
The Intel EP3SE110F780C2 is a high-density Stratix III E FPGA delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. Built on a 65 nm TSMC process and operating at a core voltage of 1.1 V, it belongs to the Stratix III Enhanced family engineered for high-performance digital signal processing, ASIC prototyping, and high-throughput serial connectivity designs. An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks (M9K/M144K), DSP blocks, and high-speed transceivers. In the broader system hierarchy, an FPGA sits between a microcontroller (limited performance, fixed peripherals) and a custom ASIC (fixed function, highest performance, highest NRE cost). The Stratix III E family targets designs that demand far more parallel processing capability and memory bandwidth than an MCU can deliver, while retaining the time-to-market advantage and field-reprogrammability of programmable logic. Key features of the EP3SE110F780C2 include 107,500 logic elements, 8,936,448 embedded memory bits, 768 18x18 multipliers, four PLLs, 488 maximum user I/Os, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates transceivers suitable for external memory interfacing (DDR/DDR2/DDR3/QDRII) and rich logic density for parallel pipelines, which differentiates it from lower-cost Cyclone III parts in the same family tree. Architecturally, the Stratix III E uses Altera's adaptive logic module (ALM) and multi-track interconnect for predictable timing closure at 600 MHz internal performance. Hard IP blocks for memory controllers, PCI Express Gen1/Gen2, and 8B/10B serial interfaces reduce soft-logic consumption and allow designers to focus die area on application logic. Typical applications include high-speed DSP (radar, software defined radio), ASIC prototyping, video processing, high-end test and measurement, military/aerospace signal processing, and wireline backplane bridging. The 488 user I/O count enables connection to multiple parallel data buses and external memory ranks simultaneously. When designing with this device, ensure the PCB supports the FCBGA-780 ball grid with appropriate via-in-pad, microvia, or HDI stackup. Thermal management is essential: at full logic utilization the device may dissipate several watts and requires a heatsink or high-performance thermal interface material. Use Altera (now Intel) Quartus II software with the Stratix III device support installed for synthesis, place-and-route, and timing analysis. This page synthesizes distributor inventory, parametric context, and practical design considerations not bundled in the manufacturer datasheet.
EP3SE110F780C2N - Stratix III E FPGA, 107.5K LE, 780-FBGA | Altera
The Altera (Intel) EP3SE110F780C2N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107,500 logic elements, 488 user I/Os, 8,936,448 bits of embedded memory, and a 600 MHz core operating frequency, housed in a 780-ball FC-FBGA package with 1.1 V core supply on a 65 nm process node. This -C2 speed grade device is engineered for high-performance digital signal processing, multi-gigabit serial connectivity, and high-throughput parallel processing. What is an FPGA? A Field Programmable Gate Array is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement custom digital logic, DSP pipelines, and interface protocols after fabrication. Within the taxonomy of programmable logic devices, an FPGA sits between a CPLD (smaller, non-volatile) and an ASIC (fixed-function, high-NRE), offering hardware-level parallelism, reprogrammability, and high I/O counts for prototyping, low-volume production, and accelerating compute-bound workloads such as signal processing, image processing, and network packet inspection. Key features of the EP3SE110F780C2N include 4,300 Logic Array Blocks (LABs), embedded 18x18 multipliers for DSP-intensive designs, integrated transceivers in Stratix III variants, dedicated PLL and clock-tree resources, and Stratix III's programmable power technology that reduces dynamic power by intelligently gating unused logic blocks. The 780-ball FC-FBGA package supports high-speed differential I/O including LVDS at rates suitable for DDR2/DDR3 memory interfaces and high-speed serial protocols. Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) and the MultiTrack interconnect, providing higher logic utilization than traditional LUT-4 architectures. The 65 nm process and 1.1 V core voltage balance performance against leakage, while the C2 speed grade targets mid-tier timing closure for commercial temperature designs. Typical applications include high-end telecom line cards, ASIC prototyping, military radar and signal intelligence, broadcast video processing, medical imaging accelerators, and high-performance computing test platforms. The combination of logic density, embedded memory, and DSP blocks makes it suitable for algorithms that demand parallel arithmetic units such as FFT, FEC, and digital down-conversion. Designers should note that Stratix III is a legacy generation (introduced circa 2007); the part is still serviced but new designs typically migrate to Stratix IV/V or Cyclone families for active roadmap support. Quartus II software is required for synthesis, place-and-route, and bitstream generation. This page consolidates distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.
EP3SE110F780C3 - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F780C3 is a high-density Stratix III E Field Programmable Gate Array (FPGA) IC delivering 107,500 logic elements, 488 user I/Os, 8,936,448 bits of embedded memory, and 4,300 Logic Array Blocks (LABs) in a 780-ball Flip-Chip BGA (FCBGA) package. The device targets high-performance digital signal processing, high-speed serial connectivity, and memory-rich system designs requiring wide parallel data paths and high logic density on a single programmable fabric. An FPGA is a programmable logic device that lets designers implement custom digital circuits using configurable logic blocks, programmable interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers. The Stratix III E family specifically optimizes the logic-to-memory-to-DSP ratio for memory-intensive and parallel-processing designs, making it well suited for ASIC prototyping, custom compute engines, and high-throughput image or video processing. Key features include 107,500 logic elements, 4,300 LABs, 488 user I/Os, 8,936,448 embedded memory bits, and an integrated high-speed transceiver layer supporting multi-gigabit serial interfaces. The 780-ball FCBGA package exposes wide parallel banks and dedicated high-speed serial channels, enabling designs that require both broadband I/O and bulk storage on-chip. The commercial speed grade designation "C3" identifies a specific timing bin within the Stratix III E family, balancing cost against Fmax across the supported temperature range. Stratix III E devices use a 65 nm TSMC process node with an architecture that combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks. This combination enables efficient implementation of pipelined datapaths, large FIFOs, and high-throughput DSP filtering, with the transceiver and I/O circuitry supporting industry-standard serial protocols commonly used in communications, broadcast video, and test equipment. Typical applications include high-end ASIC prototyping, high-speed image and video processing, telecommunications line cards, radar and signal-intelligence front ends, and test and measurement instrumentation. The combination of high logic density and substantial embedded memory makes it suitable for systems that require real-time buffering and parallel compute such as multi-channel baseband processing and software-defined radio front ends. When designing with this device, ensure Quartus II software support for the C3 speed grade is used during synthesis and place-and-route to achieve published timing closure. Verify power budget and thermal solution against application note AN 471 by Intel, and provide a sufficient decoupling network across the FCBGA supply balls to meet simultaneous switching noise requirements. This page synthesizes distributor pricing, drop-in alternatives, application guidance and design considerations not consolidated in the manufacturer datasheet, supporting faster part selection and supply-chain evaluation for engineering teams.
EP3SE110F780C3N - Stratix III E FPGA 107K LE FCBGA-780 | Intel
The Intel (formerly Altera) EP3SE110F780C3N is a high-density Stratix III E family field-programmable gate array (FPGA) with 107,500 logic elements, 8,936,448 memory bits, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FCBGA) package. It operates from a 1.1 V core supply, is fabricated on a 65 nm process, and is specified for a commercial junction-temperature grade (the trailing "C" suffix). The device integrates up to 4,300 logic array blocks (LABs), 8 transceiver blocks, and dedicated DSP and memory blocks for high-throughput signal-processing designs. What is an FPGA? A field-programmable gate array is a reconfigurable semiconductor device built from an array of programmable logic blocks, embedded memory, DSP slices, and high-speed serial transceivers all interconnected by a programmable routing fabric. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), then to logic ICs, then to integrated circuits and finally to semiconductors. The Stratix III E family in particular is positioned by Intel as a high-performance, logic-rich tier intended for ASIC prototyping, telecom/datacom infrastructure, and digital signal processing where high logic density and embedded transceiver bandwidth must coexist. Key features include 107,500 logic elements (LEs), 8,936,448 embedded RAM bits, 488 user I/O pins, 8 full-duplex transceiver channels supporting multi-gigabit serial interfaces, and integrated DSP blocks. The 780-ball FCBGA package provides a high pin-count platform suitable for memory-rich and transceiver-heavy designs, while the 65 nm low-k process enables high core frequencies with reduced dynamic power versus the prior Stratix II generation. The EP3SE110F780C3N uses a logic-rich architecture built around 4- and 6-input adaptive look-up tables (ALUTs), TriMatrix embedded memory blocks (MLABs, M9K, and M144K), and DSP blocks that can be configured as multipliers, multiply-accumulate units, or finite-impulse-response filters. The device also includes a dedicated PCML transceiver block supporting backplane and chip-to-chip serial links, a configuration controller, and clock-management tiles with PLL and dynamically reconfigable phase shift. These features combine to deliver ASIC-class compute density while retaining the in-system reprogrammability of an FPGA. Typical applications include ASIC prototyping and emulation, high-end wired communication systems (10G/40G Ethernet, SONET/SDH, PCIe Gen2), wireless baseband processing, military and aerospace signal processing, broadcast video processing, and high-performance DSP firmware acceleration. The 780-ball FCBGA package is intended for multilayer PCB designs with controlled-impedance routing for the transceiver channels. When designing with this device, plan PCB stackup and power-delivery network (PDN) for the 1.1 V core and the transceiver PLL supplies in parallel - the FCBGA requires a high-layer-count board to escape the 780 balls cleanly. Use the Intel Quartus II design suite (or later) to evaluate logic utilization, transceiver channel placement, and timing closure before committing to layout. This page synthesizes distributor pricing, FPGA-stratix drop-in alternatives from the same package family, and practical design notes that go beyond the manufacturer datasheet to support an engineer's evaluation of the EP3SE110F780C3N.
EP3SE110F780C4 - Stratix III E FPGA, 107500 LEs, 780-FCBGA | Intel
The Intel (Altera) EP3SE110F780C4 is a high-density Stratix III E FPGA delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 896 18x18 multipliers, packaged in a 780-ball FineLine BGA (FCBGA) with 488 user I/O pins. Built on TSMC's 40 nm process, the device integrates 8.9 Mbits of RAM and supports data rates up to 1.6 Gbps on its multi-gigabit transceivers, making it a workhorse for high-throughput DSP, ASIC prototyping, and high-speed serial link applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect, allowing engineers to implement arbitrary digital logic after fabrication. Within the broader taxonomy, an FPGA belongs to programmable logic devices -> logic ICs -> integrated circuits. The Stratix III E family sits in Intel's high-performance tier, positioned between cost-optimized Cyclone families and the higher-end Stratix V series, and is widely deployed for ASIC prototyping, high-speed packet processing, and wireless baseband signal chains. Key features of the EP3SE110F780C4 include 4,300 Logic Array Blocks (LABs), 8.9 Mbits of M9K block RAM, 896 DSP blocks (18x18 multipliers), up to 1.6 Gbps transceiver performance, and support for DDR3 memory interfaces up to 800 MHz. The C4 speed grade places it in the lower-power corner of the speed-grade spectrum, while the 780-FCBGA package offers 488 user I/O for connectivity-dense designs. The 40 nm process node balances static power and performance, and the device supports Partial Reconfiguration for systems that require runtime logic swaps. Architecturally, the EP3SE110F780C4 implements a hierarchical routing fabric with adaptive logic modules (ALMs), each containing two 4-input fracturable look-up tables. The transceiver tiles integrate hard PCIe Gen2 and Serial RapidIO IP blocks, offloading common serial-protocol state machines from the fabric and freeing logic for application-level work. Adaptive voltage scaling reduces dynamic power by lowering Vcc on inactive regions. Typical applications include high-end ASIC prototyping, high-performance DSP acceleration, telecom baseband processing, broadcast video processing, and high-speed serial interface bridging. Designers typically use the Quartus II design suite (Cyclone/Stratix family support) for HDL entry, synthesis, place-and-route, and timing closure on this device. A practical design consideration is thermal management: the 780-FCBGA package and 40 nm process require careful PCB thermal vias and a multi-layer stack-up with adequate ground pour to dissipate the ~10-15 W typical power envelope. Signal-integrity-aware pinout planning is also essential for 1.6 Gbps transceiver channels, which mandate controlled-impedance routing and length matching within tight tolerances. This page synthesizes distributor pricing, drop-in alternatives from Intel's Stratix III E family, application guidance, and design considerations not collected in one place in the manufacturer datasheet, giving procurement and design engineers a single reference for sourcing and applying EP3SE110F780C4.
EP3SE110F780C4L - Stratix III E FPGA 107.5K LE, 780-FCBGA | Intel
The Intel (Altera) EP3SE110F780C4L is a high-performance, low-power Stratix III E Field Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Ball Grid Array (FCBGA) package. According to the verified distributor data, the device integrates 107,500 logic elements (LEs), 488 dedicated 18x18 multipliers, and 8,936,448 bits of embedded memory, providing the digital signal processing and buffering density required for high-throughput signal processing and ASIC-prototyping workloads. The part designation suffix "C4" indicates a -4 commercial speed grade, while the "L" suffix denotes a lower-leakage process variant, balancing static power against maximum performance. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit above microcontrollers and DSP processors in the silicon hierarchy: they trade deterministic instruction execution for hardware-level parallelism, allowing engineers to implement custom datapaths, interfaces, and accelerators. The Stratix III E family specifically emphasizes high logic density combined with low static power via the programmable power technology, making it well suited to dense compute boards. Key features of the EP3SE110F780C4L include 488 hardened 18x18 multipliers for fixed-point DSP pipelines, 8.9 Mbits of distributed and block RAM, programmable power technology that reduces dynamic power by selectively gating unused regions, and a rich on-chip clock network with up to 12 PLLs per device. The FCBGA-780 footprint uses a 1.0 mm ball pitch, enabling high I/O density of 488 user I/O pins on a compact substrate for board-space-constrained designs. Architecturally, the device is fabricated on TSMC's 65 nm low-leakage process node, employing Altera's classic Adaptive Logic Module (ALM) architecture - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and four registers, allowing any 7-input LUT function or two independent 4-input LUT functions to be packed efficiently. This delivers roughly 1.4x the logic capacity per area compared to the previous Stratix II generation at equivalent performance. Typical applications include high-end image and video processing pipelines, software-defined radio baseband processing, ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet), and test & measurement instrumentation where deterministic latency and reconfigurable logic are essential. With 8.9 Mbits of on-chip memory and 488 multipliers, the EP3SE110F780C4L can implement multi-channel FFT engines or H.264 encode/decode datapaths without external memory pressure. When designing with this device, allocate sufficient PCB layers (typically 12+ for the FCBGA-780 breakout) and use the Altera Quartus II design suite for synthesis, place-and-route, and power estimation. Note that the device is now in the Altera/Intel legacy FPGA portfolio, so consider second-source options from the Site MPN list within the same Stratix III family for risk mitigation. This page synthesizes distributor pricing, verified FPGA specifications, and same-family drop-in alternatives not found in a single manufacturer datasheet - giving engineers the full picture for sourcing and design reuse decisions.
EP3SE110F780C4LN - Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE110F780C4LN is a high-density Stratix III E Field Programmable Gate Array housed in a 780-ball Fine-pitch BGA (FBGA) package, delivering 488 user I/O pins and 107,500 logic elements backed by 8,936,448 bits of embedded memory. Built on TSMC's 40 nm process, the device targets high-performance digital logic designs requiring large block-RAM and DSP inventories, with 4,300 LABs (Logic Array Blocks) and dedicated 18x18 multipliers for DSP-heavy signal processing. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O cells. Within the broader taxonomy, FPGAs sit under programmable logic devices -> digital ICs -> integrated circuits. The Stratix III E family specifically emphasizes enhanced DSP blocks, high-speed transceivers, and on-chip memory density, making it a mid-generation platform that bridges early Stratix II architectures and the later Stratix IV/Stratix V families. Key features of the EP3SE110F780C4LN include the 780-FBGA footprint (29 mm x 29 mm typical), 4,300 LABs, 107,500 logic elements, 8,936,448 memory bits, 488 user I/O, and operating temperature range tailored for industrial (-40C to +85C). The 'C4' speed grade and 'N' suffix indicate commercial temperature rating with lead-free / RoHS-compliant assembly. The 780-ball FBGA package supports both 1.0 mm and 1.27 mm pitch variants per the Stratix III device handbook. Architecturally, the Stratix III E series implements an 8-input adaptive logic module (ALM) that doubles effective logic capacity per area over prior generations. It also integrates MLAB (memory logic array blocks) and M9K/M144K block RAM tiles, providing a heterogeneous memory fabric that can be partitioned between register files and large data buffers. Typical applications include high-speed DSP pipelines, telecommunications line-card processing, video broadcast equipment, and prototyping for ASIC/ASSP designs. The 780-FBGA package also makes it suitable for PCI Express Gen1/Gen2 endpoint and bridge designs. When designing with this device, ensure the Quartus II design suite (12.0sp2 or later) supports the C4 speed grade and that the 780-FBGA PCB land pattern matches the Intel reference footprint.
EP3SE110F780C4N - 107500 LEs, 780-FCBGA FPGA | Intel
The Intel EP3SE110F780C4N is a high-density, high-performance field-programmable gate array (FPGA) from the Stratix III E family, packaged in a 780-ball FineLine BGA (FCBGA) and built on TSMC's 65nm process. According to the verified distributor data, the device integrates 107500 logic elements (LEs), 8936448 bits of embedded memory, and 488 user I/O pins, targeting mid-to-high complexity logic, memory-intensive, and high-throughput DSP applications. This C4 speed grade variant is the commercial-temperature (0C to 85C junction) tier with -4 speed binning, making it the mainstream performance point for Stratix III E designs. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that integrates configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, DSP blocks, and embedded memory into a single silicon die. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they offer higher density and throughput than microcontrollers while remaining reprogrammable, enabling rapid prototyping, low-NPI design cycles, and field upgrades that ASICs cannot support. Key features of the EP3SE110F780C4N include 107500 LEs for combinational and sequential logic, 8.94 Mbits of embedded RAM distributed across M9K and M144K blocks, 488 general-purpose I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), up to 8 PLLs for clock management, and dedicated DSP blocks for high-speed fixed-point and floating-point math. The Stratix III E family also supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and provides encryption and bitstream authentication through the security feature set. Architecturally, the Stratix III E family uses Altera's (now Intel) Adaptive Logic Module (ALM) as the basic logic element, replacing the legacy 4-input LUT architecture of earlier Stratix generations. Each ALM contains an 8-input fracturable LUT, two dedicated adders, and two register outputs, giving significantly improved logic utilization and timing closure on wide datapath designs. The 780-FCBGA package uses a 0.8mm ball pitch, supports the full 488 user I/O count, and is compatible with the Stratix III E transceiver-less pinout footprint used in telecom, broadcast, and industrial DSP backplanes. Typical applications include high-speed digital signal processing (software-defined radio, radar baseband, video processing), wireline telecom line cards (packet classification, traffic management, OTN framer/mapper), high-performance ASIC prototyping, industrial motor control and servo drive front-ends, medical imaging front-end processing, and test and measurement instrumentation. The combination of large on-chip memory and high logic density also makes it well suited to custom image processing pipelines and protocol-bridging designs. When designing with this device, pay particular attention to power distribution: the 780-FCBGA requires a multi-rail PCB stackup (typically 1.0mm-1.4mm board thickness, microvia stackups preferred) with decoupling placed on the BGA land side. Thermal management is critical at -4 speed grade because the part can dissipate 10-20W in fully utilized designs; a thermal pad on the top of the package and forced airflow are typically required. This page synthesizes distributor pricing, Stratix III E family pinout and package detail, and same-footprint drop-in alternatives across temperature and speed grades, providing engineering context not available on a single manufacturer datasheet page.
EP3SE110F780I2N - 107.5K LE Stratix III E FPGA, 780-BGA | Intel
The Intel EP3SE110F780I2N is a high-performance, low-power Stratix III Enhanced field-programmable gate array (FPGA) featuring 107,500 logic elements, 8,244 Kbits of embedded memory, and 528 multipliers, housed in a 29x29 mm 780-ball flip-chip BGA (FBGA-780) package with industrial temperature grade (I2: -40C to +100C) and speed grade 2. Built on a 40 nm CMOS process, this device targets high-throughput DSP, high-speed serial I/O, and memory-intensive system designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceivers. FPGAs occupy the space between fixed-function ASICs and software-programmable processors, offering hardware-timed performance, parallel execution, and field reprogrammability. Within the broader taxonomy, FPGAs sit in the hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> Stratix-series high-performance FPGA, serving as the silicon foundation for telecommunications, defense, test and measurement, and high-performance computing platforms. Key features of the EP3SE110F780I2N include 4,300 logic array blocks (LABs), 488 user I/O pins, 12 transceiver blocks (up to 8.5 Gbps), 4 hard memory controllers, 8 PLLs, and 1.4 Gbps LVDS support. The Stratix III Enhanced family adds dedicated hardware for partial reconfiguration and dynamic phase alignment, supporting designs that require in-field logic updates without system downtime. Compared to the standard Stratix III, the Enhanced variants target memory-rich and I/O-heavy applications. The EP3SE110F780I2N uses an adaptive logic module (ALM) architecture where each ALM contains two combinational adaptive look-up tables (ALUTs), two dedicated full adders, four registers, and shared arithmetic chains. This fine-grained granularity yields 30% higher logic utilization than competing architectures, particularly for wide datapaths and bit-sliced arithmetic. Embedded memory uses TriMatrix blocks with three block sizes (640, 1280, 5120 bits), and DSP blocks provide 18x18 multipliers with accumulation for high-throughput filtering. Typical applications include high-speed digital signal processing (radar, beamforming, software-defined radio), high-bandwidth telecommunications line cards, ASIC prototyping and emulation, image and video processing pipelines, and high-speed test and measurement instrumentation. The 8.5 Gbps transceivers make this part suitable for CPRI/OBSAI backhaul, PCIe Gen1/Gen2, and Serial RapidIO links. When designing with this device, pay close attention to power planning: 40 nm process transceivers can draw 250 mW per channel at full data rate. Use Altera's PowerPlay Early Power Estimator (EPE) before PCB layout and follow Intel reference design PCB guidelines for flip-chip BGA decoupling to maintain signal integrity on high-speed serial links. This page synthesizes distributor pricing, drop-in alternatives, and Stratix III E design considerations not found in the manufacturer datasheet alone.
EP3SE110F780I3 - 107.5K LE Stratix III E FPGA, 488 I/O | Intel
The Intel (formerly Altera) EP3SE110F780I3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107500 logic elements, 8.9 Mbits of embedded memory, and 488 user I/Os in a 780-ball FC-FBGA package, manufactured on a 65 nm process node and powered at a 1.1 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital design hierarchy between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and reconfigurability for prototyping, low-volume production, and time-to-market-critical designs. The Stratix III E family is positioned in the high-performance segment, originally engineered for ASIC prototyping, high-throughput signal processing, and high-bandwidth telecommunications infrastructure. Key features of the EP3SE110F780I3 include 107500 logic elements, 4 partitions of memory totaling 8936448 bits, a maximum operating frequency of 500 MHz, 488 dedicated user I/Os, and integrated high-speed serial transceiver capability. The device is housed in a 780-ball fine-pitch FC-FBGA (Fine-pitch Chip-scale Ball Grid Array, also called FineLine BGA) package and supports vertical migration within the same package footprint to other Stratix III densities. Architecturally, the Stratix III E device combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and up to 12.5 Gbps transceivers (model-dependent). It uses a 1.1 V core supply on a 65 nm process, giving the EP3SE110F780I3 a favorable logic-element-per-watt ratio for its era. Configuration is supported via JTAG, Active Serial, Active Parallel, Fast Passive Parallel, and Passive Serial modes through the dedicated configuration pins. Typical applications include ASIC prototyping, high-performance DSP pipelines, broadcast video processing, high-speed serial backplane interfacing, military and aerospace signal processing, and high-end test and measurement equipment. When designing with the EP3SE110F780I3, ensure the Quartus II design tool version supports this specific device ID and observe the recommended power sequencing order across VCC, VCCPD, VCCPGM, and transceiver supply rails.
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
The Intel EP3SE110F780I3N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix III E family, delivering 107,500 logic elements and 8,936,448 bits of embedded memory in a 780-pin Flip-Chip FineLine BGA package. It operates at a core voltage of 1.1V with a tolerance supporting 1.05V to 1.15V, is fabricated on a 65 nm CMOS process, and supports user I/O counts of 488 across its FC-FBGA land pattern. Per the manufacturer datasheet, this device belongs to the Stratix III Enhanced family optimized for high-performance digital signal processing and high-bandwidth connectivity. A Field-Programmable Gate Array is a type of programmable logic device that combines the integration density of an application-specific integrated circuit (ASIC) with the design flexibility of in-system reprogrammability. FPGAs sit within the broader taxonomy of programmable logic (PLD) -> programmable logic device -> integrated circuit -> semiconductor. They are widely deployed in telecommunications infrastructure, defense radar, medical imaging, high-performance computing, and ASIC prototyping where parallelism, deterministic latency, and high I/O bandwidth outweigh the unit-cost advantages of fixed-function silicon. Key features of the EP3SE110F780I3N include 488 maximum user I/Os, 4,300 logic array blocks (LABs), embedded multiplier blocks and DSP slices optimized for high-speed arithmetic, up to 12 transceivers supporting multi-gigabit serial protocols, and a hardened memory controller subsystem. The device includes phase-locked loops (PLLs) for clock synthesis, configuration via passive serial, fast passive parallel, or JTAG (IEEE Std. 1149.1) interfaces, and supports Boundary-Scan Test (BST) for board-level interconnect verification without physical test probes. Architecturally, the Stratix III E family uses a 65 nm low-leakage process, an adaptive logic module (ALM) based fabric, and dedicated global/regional clock networks with up to 16 global clocks. The 780-pin FC-FBGA package exposes 488 general-purpose I/Os and high-speed serial transceiver channels suitable for PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and custom serial protocols. The device targets designs requiring between approximately 50K and 110K logic elements with moderate transceiver integration. Typical applications include high-end baseband processing in wireless base stations, software-defined radio (SDR) platforms, video broadcast encoders, medical imaging reconstruction pipelines, and military signal-intelligence systems. The combination of high logic density and embedded memory makes it well suited to data-path intensive workloads such as forward error correction (FEC) and FFT computation. When designing with the EP3SE110F780I3N, engineers should budget for the Flip-Chip BGA's PCB layer-count requirements (typically 8+ layers with microvia or via-in-pad technology), validate the JTAG chain against production fixtures, and confirm Quartus II software version compatibility for bitstream generation. Older Stratix III bitstreams are NOT forward-compatible with newer device families. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not aggregated on the manufacturer datasheet, drawing on Intel/Altera Stratix III Handbook content and current distributor inventory.
EP3SE110F780I4 - 107500 LEs Stratix III E FPGA, 780-FCBGA | Altera
The Altera (now Intel) EP3SE110F780I4 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107,500 logic elements, 8,936,448 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Built on a 40 nm low-power TSMC process, the device integrates 4,300 LABs (Logic Array Blocks) and is optimized for high-performance digital signal processing, high-speed serial connectivity, and memory-intensive system designs. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and transceivers. FPGAs sit between microcontrollers and ASICs in the design hierarchy - they offer ASIC-class performance and parallelism while remaining fully re-programmable, which makes them ideal for prototyping, low-volume production, and designs that require post-deployment logic updates. Key features of the EP3SE110F780I4 include 4,300 LABs, 8,936,448 total RAM bits distributed across M9K/M144K block memory tiles, 488 user I/Os supporting multiple single-ended and differential I/O standards, and support for high-speed external memory interfaces including DDR3. The Stratix III E family fabric also embeds variable-precision DSP blocks suitable for 18x18 and 12x12 signed multiplications and IEEE 754 single-precision floating-point arithmetic when combined with the Quartus II development toolchain. Typical applications span high-end communication infrastructure (wireless baseband, radar signal processing), test and measurement equipment, high-performance computing accelerators, ASIC prototyping, video broadcast systems, and aerospace/defense signal processing payloads. The 780-FCBGA package exposes the maximum I/O count of the family, making the -F780 variants the right choice when high signal fan-out is required. When designing with this device, pay close attention to power-rail sequencing (Stratix III requires controlled ramp on VCC, VCCAUX, and VCCPD), thermal management (use the exposed-die BGA thermal pad), and pin assignment for high-speed transceivers and external memory - all of which are documented in the Stratix III device handbook.
EP3SE110F780I4L - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F780I4L is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 107,500 logic elements, 488 user I/Os, and 8,936,448 bits of embedded memory in a 780-pin Flip-Chip BGA package. Built on a 65 nm CMOS process with a 0.9 V core voltage and -40 °C to +100 °C industrial operating range, the device supports up to 375 MHz operation and contains 4,300 LABs (Logic Array Blocks) for high-throughput parallel logic implementation. The package uses a 29 mm × 29 mm FC-FBGA body with 1.0 mm ball pitch for high-density PCB layouts. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows hardware designers to configure arbitrary digital logic through software-defined routing and configurable logic blocks (CLBs). In the broader component hierarchy, an FPGA sits above fixed-function ASICs (application-specific integrated circuits) in flexibility, and alongside CPLDs (complex programmable logic devices) at the lower-density end. The Stratix III E family is optimized for high-performance signal processing, high-speed serial interconnect, and embedded memory-intensive applications in telecommunications, defense, and test & measurement. Key features of the EP3SE110F780I4L include 488 user I/O pins supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed multiplication, embedded memory blocks (M9K/M144K), and phase-locked loops (PLLs) for clock management. The 8.9 Mbit embedded memory enables on-chip buffering for high-bandwidth data paths. Industrial temperature grade (-40 °C to +100 °C) supports operation in harsh environment applications. The architecture uses Altera's Adaptive Logic Module (ALM) combined with MultiTrack interconnect to deliver high logic utilization and predictable timing closure. The 65 nm process node balances power efficiency with high performance, while the Flip-Chip BGA package enables the high pin count and signal integrity needed for parallel LVDS interfaces and multi-gigabit transceivers. Typical applications include high-speed digital signal processing, telecommunications line cards, military radar and electronic warfare, video broadcast infrastructure, ASIC prototyping, and high-performance computing accelerators. Designers choose this device when applications demand very high logic density, abundant block RAM, and industrial-grade reliability. When designing with this device, allocate sufficient PCB layers (at least 8 to 12) for power planes and signal routing under the 1.0 mm-pitch BGA. Follow Altera's Stratix III pin connection guidelines for unused pins, JTAG, and configuration (EPCS/MSEL) pins. Plan for full JTAG boundary-scan testing to simplify board bring-up. This page synthesizes real-time distributor inventory, Intel/legacy Altera datasheet specifications, and drop-in same-package alternatives not found in any single distributor listing - enabling cross-supply chain decisions.
EP3SE110F780I4LN - Stratix III E FPGA 107.5K LE 780-FBGA | Intel
The Intel EP3SE110F780I4LN is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FBGA-780) package with industrial temperature grade. Operating from a 0.9 V core supply and supporting transceiver rates up to 717 MHz in the device family, it targets high-performance signal processing, ASIC prototyping, and high-bandwidth communications backplanes. The "LN" suffix confirms lead-free, RoHS-compliant Pb-free balls suitable for modern assembly lines. The Stratix III E family uses a 40 nm process with adaptive logic modules (ALMs), 9.4 Mbit M20K memory blocks, and dedicated DSP blocks, allowing simultaneous implementation of wide datapaths and fast on-chip memory without starving either resource. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing via a programmable interconnect fabric of configurable logic blocks (CLBs), routing, and I/O cells. Architecturally, an FPGA sits between a microcontroller (fixed instruction set, software-defined) and a full-custom ASIC (fabrication-defined, non-reprogrammable), offering hardware parallelism with reconfiguration flexibility. Within the device taxonomy, an FPGA is a member of the Programmable Logic Device (PLD) family, which itself belongs to Logic ICs under the broader Integrated Circuits hierarchy. The Stratix III E line occupies the high-performance, transceiver-rich end of this spectrum, alongside competing families such as Xilinx Virtex-6 and Lattice ECP5. Key specifications include 4,300 Logic Array Blocks (LABs), a maximum operating frequency of approximately 717 MHz, embedded transceiver support, and dedicated DSP blocks for high-throughput arithmetic. The 780-pin FBGA package exposes sufficient I/O bandwidth for DDR3/QDR3 interfaces, multi-gigabit transceivers, and parallel LVDS links. Industrial temperature grading (-40C to +100C, indicated by the "I" suffix) and the lead-free ball finish make it suitable for telecom, defense, and industrial control environments. Typical applications include 40G/100G Ethernet line cards, digital video broadcasting equipment, ASIC prototyping, radar baseband processing, and high-speed test instrumentation. The combination of high logic density, plentiful transceivers, and abundant M20K memory makes the EP3SE110 particularly attractive when a single chip must absorb a large prototype design. When designing with this device, allocate sufficient PCB layers (typically 10+), use a low-Vcore power sequencing controller such as the Intel EN5330/EN63A0, and isolate high-speed transceiver channels from noisy digital regions. Designers must verify that the chosen Quartus II design software version supports the EP3SE110F780I4LN device code, as the family is mature and new compiler versions may deprecate older device codes.
EP3SE110F780I4N - Stratix III E FPGA 107K LE FCBGA-780 | Intel
The Intel (formerly Altera) EP3SE110F780I4N is a high-density Stratix III E Field Programmable Gate Array (FPGA) built on a 40nm process, delivering 107,500 logic elements and 8,936,448 bits of embedded memory in a 780-ball FineLine BGA (FCBGA) package. The device integrates 488 user I/Os, 4300 Logic Array Blocks (LABs), 672 embedded 18x18 multipliers, and a rich set of high-speed transceivers and PLLs. Background Knowledge: An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic fabric, interconnect, and I/O blocks whose function is defined by a configuration bitstream rather than fixed mask layers. FPGAs sit within the broader hierarchy: programmable logic -> programmable logic device -> digital IC -> semiconductor. Compared with ASICs, FPGAs offer lower NRE cost and faster time-to-market, while high-end FPGAs such as the Stratix III family approach ASIC performance on DSP, memory bandwidth, and transceiver throughput. Key features include up to 488 single-ended user I/O (depending on the I/O standard), dedicated 18x18 multipliers suitable for DSP and baseband workloads, embedded memory blocks with ECC support, and hard PCI Express, memory controller, and serializer/deserializer IP blocks. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, enabling direct interface to DDR/DDR2/DDR3 memory and a wide range of parallel buses. Technically, the EP3SE110F780I4N uses Altera's classic Quartus II design flow, supports partial reconfiguration, and is part of the Stratix III E family which trades raw logic density for improved signal integrity, higher transceiver data rates, and lower dynamic power relative to Stratix II. The 'I' industrial temperature grade and '4' speed grade place this part at the high-performance end of the family for non-military applications. Typical applications include high-performance DSP cards, communications infrastructure (e.g., baseband processing, protocol bridging), test and measurement equipment, ASIC prototyping, and high-speed data acquisition. The FCBGA-780 footprint is also well-suited to custom compute accelerators that need large on-chip memory and parallel processing. When designing with this device, plan power sequencing carefully: Stratix III requires specific ramp-order for VCCINT, VCCAUX, and VCCIO rails, and decoupling capacitor selection per the pin connection guidelines is mandatory to meet the high-speed transceiver signal-integrity budget. This page synthesizes distributor pricing, drop-in Stratix III alternatives, FCBGA-780 PCB layout notes, and FPGA design considerations not gathered on any single manufacturer or distributor page.