FPGA & CPLD
Products (6358)
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP3SE260F1517C4LN is a high-density Stratix III E family Field Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 memory bits, and 976 user I/Os in a 1517-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 65 nm process node, supports core operation at 0.9 V to 1.1 V, and is specified for commercial temperature-grade operation. The 'LN' suffix designates a lead-free, halogen-free industrial-grade variant. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, configurable interconnect, and dedicated memory/DSP blocks into a single die. FPGAs belong to the broader class of programmable logic devices (PLDs) and sit within the semiconductor hierarchy of integrated circuits (ICs) > logic ICs > programmable logic. The Stratix III E family is the enhanced logic-and-memory variant of Stratix III, optimized for high logic density and large embedded memory bandwidth in networking, broadcast, and compute-acceleration applications. Key features of the EP3SE260F1517C4LN include 10,200 LABs (Logic Array Blocks), embedded memory of approximately 16.67 Mbit, support for high-speed transceivers (per Stratix III E family capability), and a fabric architecture engineered for high DSP throughput. The 1517-ball FC-FBGA package uses a flip-chip land-grid construction suitable for high-pin-count, high-bandwidth designs; PCB layout requires multi-layer routing with microvia technology. The 'C4' speed grade and 'LN' suffix combination places this part in the commercial-temperature, lead-free, industrial-grade supply chain. Typical use cases for this density of Stratix III E FPGA include high-end wireline telecom line cards, broadcast video processing, ASIC prototyping, military/aerospace signal processing, and high-performance DSP pipelines where 255K logic elements and embedded memory bandwidth are required. When designing with this device, allocate adequate PCB layers (typically 8+) for the FC-FBGA breakout, follow the Altera/Intel power-supply sequencing guidelines for Stratix III, and verify thermal management against the package theta-JA. Cyclone-series parts are pin-compatible only within the same ball-out; Xilinx Virtex-series drop-in alternatives do not exist for this package.
EP3SE260F1517C4N - Stratix III E FPGA 16.7M Gates 1517-BGA | Intel
The Intel (formerly Altera) EP3SE260F1517C4N is a high-density Stratix® III E Field-Programmable Gate Array (FPGA) IC delivering 255,000 logic elements and 16,672,768 bits of embedded memory in a 1517-ball FineLine BGA (FCBGA) package with 976 user I/Os. It is built on a 65 nm process with 0.9 V core VCC and supports up to 10,200 LABs (Logic Array Blocks) for high-performance DSP, memory-rich, and parallel-processing designs. What is an FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) - part of the semiconductor hierarchy of programmable logic -> logic IC -> integrated circuit. Unlike fixed-function ASICs, an FPGA contains an array of configurable logic blocks (CLBs/LABs), routing interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers that the engineer can program after manufacturing using a hardware description language (HDL) such as VHDL or Verilog. FPGAs are widely used for prototyping, low-volume production, and applications that demand hardware-level parallelism. Key features of the EP3SE260F1517C4N include 976 maximum user I/Os, 16,672,768 embedded memory bits, 255,000 logic elements, and up to 10,200 LABs. The 1517-FCBGA package supports high I/O density and signal-integrity routing for multi-gigabit transceivers and external memory interfaces such as DDR3/QDRII+. The Stratix III E family uses a low-power 65 nm process with programmable power technology, allowing unused logic and routing to be powered down. The device supports up to 12.5 Gbps transceivers and up to 800 MHz on-chip memory, making it suitable for high-bandwidth applications such as wireline communications, ASIC prototyping, and high-end test-and-measurement. Typical applications include ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SFI-5.1), broadcast video processing, military/aerospace signal processing, and high-performance DSP for radar or medical imaging. Its 976 user I/Os and large memory footprint also fit telecom line-card designs. When designing with this FPGA, plan power delivery carefully: the device requires multiple voltage rails (0.9 V core, 1.1 V/1.2 V/1.5 V/2.5 V/3.3 V I/O and transceiver supplies) with strict decoupling and sequence requirements. Use the Quartus II design software for HDL synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical notes not found in the manufacturer datasheet.
EP3SE260F1517I3 - 255K LE Stratix III FPGA, 976 I/O | Intel
The Intel (formerly Altera) EP3SE260F1517I3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os in a 1517-ball FineLine BGA (FCBGA) package with industrial temperature grade. Built on a 65 nm CMOS technology node, this device integrates 10,200 LABs (Logic Array Blocks) and supports transceiver-rich DSP and memory-intensive designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions through a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy the middle ground between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they are reconfigurable after manufacture, but unlike microcontrollers they execute logic in dedicated parallel hardware rather than via sequential software. Stratix III E devices specifically target high-performance digital signal processing, high-speed serial connectivity, and embedded memory applications in communications infrastructure, broadcast video, and military systems. Key differentiating features of the EP3SE260F1517I3 include 255,000 logic elements (the largest Stratix III E density), 16.67 Mbits of embedded RAM (M9K + MLAB blocks), up to 717 MHz core fabric performance, and a 1.0 V core supply with multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The industrial temperature grade (-40C to +100C ambient, with 125C junction capability) makes the part suitable for thermally demanding applications. The device is implemented on TSMC's 65 nm process node with a 12-layer metal stack optimized for signal integrity and power. Internal voltage scaling, programmable power technology, and fine-grained clock gating reduce dynamic power by up to 50% compared to Stratix II at equivalent performance, while the dedicated MLAB (memory logic array block) architecture allows each LAB to be configured either as logic or as distributed memory. Typical applications for the EP3SE260F1517I3 include high-end telecommunications base stations, ASIC prototyping and emulation, high-definition video broadcast encoders, medical imaging accelerators, military signal intelligence platforms, and high-performance computing nodes. The 976 user I/Os in a 1517-ball FCBGA make it well suited to designs that need to break out many parallel interfaces or multiple high-speed serial links. Design consideration: this 1517-ball FCBGA requires a high-density PCB with microvia stack-up, controlled-impedance routing for transceivers, and a substantial thermal solution (heatsink or forced airflow) for sustained workloads. Quartus II software version 9.0 or later is required for design entry, synthesis, place-and-route, and timing closure on this family. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III E family, and practical design notes not found in the manufacturer datasheet alone.
EP3SE260F1517I3G - Stratix III E FPGA 255K LE 1517-FBGA | Intel
The Intel (Altera) EP3SE260F1517I3G is a high-density Stratix III E family Field Programmable Gate Array delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and a maximum operating frequency of 500 MHz, housed in a 1517-ball Flip-Chip FineLine BGA (FC-FBGA) package with 976 user I/O pins and a 1.1 V core supply. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened I/O serdes that can be rewired after manufacture by the end user. Within the FPGA hierarchy, the Stratix III family sits as the high-performance, ASIC-prototyping flagship tier, and the -E variant emphasizes logic density and DSP capability. FPGAs in general belong to the broader class of programmable logic devices (PLDs), which also include CPLDs and PALs, occupying the same role as a customizable alternative to fixed-function ASICs. Key features of the EP3SE260F1517I3G include 8.7 Mbits of embedded RAM (TriMatrix memory with MLAB, M9K, and M144K blocks), 768 embedded 18x18 multipliers for DSP, 12 PLLs, and a rich multi-protocol transceiver engine supporting rates up to 6.375 Gbps. The device implements a true 1.0 V core voltage and is built in TSMC's 65 nm process node, balancing leakage and performance. Adaptive Logic Modules (ALMs) replace traditional 4-input LUTs, giving an effective 2.3x density improvement over Stratix II. Technical depth: The Stratix III E architecture introduces programmable power technology that lets unused logic, memory, and DSP blocks enter a low-power state, while the I/O subsystem supports LVDS, LVTTL, LVCMOS, HSTL, SSTL, and LVPECL with dynamic on-chip termination (OCT). Partial reconfiguration and remote update via PCI Express or serial flash are supported in silicon, allowing in-system logic changes without full reconfiguration. Typical applications include high-end ASIC prototyping, telecommunications infrastructure, high-throughput signal processing, military radar, test and measurement instrumentation, and wireline backplane bridging. The wide transceiver aggregate bandwidth (over 600 Gbps full duplex in some configurations) makes the device suitable for protocols such as PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and Interlaken. When designing with the EP3SE260F1517I3G, attention must be paid to PCB signal-integrity for the 1517-ball FC-FBGA substrate, multi-rail power sequencing (1.1 V core, 2.5 V PLL, VCCAUX, VCCIO banks), and thermal management; a thermal-resistance-aware heatsink is recommended at full utilization. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not collated in the manufacturer datasheet, giving engineers a one-stop reference for sourcing and replacement decisions.
EP3SE260F1517I3N - Stratix III E FPGA, 255K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SE260F1517I3N is a high-density Stratix® III E Field-Programmable Gate Array (FPGA) built on a 65 nm process technology, integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1517-ball FC-FBGA package. The device operates at a core voltage of 1.1 V and is speed-grade -3 (faster-than-typical) and industrial-temperature (I) qualified, supporting operating junction temperatures from -40 °C to +100 °C. What is a Stratix III E FPGA? The Stratix III E family is a high-performance, low-power FPGA line introduced by Altera (now Intel Programmable Solutions Group) targeting DSP-intensive, high-bandwidth, and high-logic-density applications. Positioned in the broader taxonomy, a Stratix III E is an FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The 'E' variant emphasizes enhanced DSP and memory subsystems relative to the base Stratix III L logic-optimized family, making it suitable for signal processing pipelines where both logic throughput and on-chip memory bandwidth matter. Key features of the EP3SE260F1517I3N include 10,200 Logic Array Blocks (LABs) supporting distributed and embedded memory, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 transceiver channels depending on configuration, and on-chip PLLs for clock management. The device supports external memory interfaces including DDR3, DDR2, and QDR II+, with embedded hard memory controllers simplifying high-throughput memory subsystem design. Configuration is typically via JTAG or passive/active serial flash. The architecture combines ALMs (Adaptive Logic Modules) with column-based M9K and M144K memory blocks, providing flexible storage for FIFOs, lookup tables, and packet buffers. The transceiver physical coding sublayer (PCS) supports multiple industry-standard protocols, while programmable I/O supports LVDS, HSTL, SSTL, and single-ended standards up to differential 1.4 Gbps. According to the Stratix III Device Handbook, the part is rated for 500 MHz internal logic performance. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-performance digital signal processing, video processing and broadcast equipment, and military/aerospace signal processing systems where industrial temperature grading is mandatory. The 1517-ball FCBGA package provides high-density interconnect required for the 976 user I/O and high transceiver count. When designing with this device, thermal management is critical at high toggle rates — ensure the FC-FBGA thermal pad is properly soldered to a multi-layer PCB with adequate thermal vias and copper pours. Quartus II (or later Quartus Prime) is the official development environment; bitstream generation, place-and-route, and SignalTap logic analysis are all supported. Confirm transceiver reference clock jitter budget against protocol masks before board bring-up. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet — a single reference for sourcing, substitution, and PCB integration decisions.
EP3SE260F1517I4 - Stratix III E FPGA, 255K LE, 1517-FCBGA | Altera
The Intel (formerly Altera) EP3SE260F1517I4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1,517-ball flip-chip BGA package. Built on a 65 nm process and operating at 1.1 V core with 450 MHz core performance, it targets high-throughput DSP, ASIC prototyping, and high-speed serial interconnect designs. The 1,517-pin FCBGA measures 40 mm on a side and provides the I/O density required by parallel memory buses and multi-gigabit transceivers. An FPGA is a user-programmable semiconductor whose logic fabric and routing are defined after manufacture by a configuration bitstream, allowing one silicon platform to be repurposed across many designs. Within the FPGA taxonomy, the Stratix III E family sits in the high-performance, logic-and-DSP-rich tier (FPGA -> SRAM-based FPGA -> high-density FPGA -> programmable logic device -> semiconductor IC), making it suitable for compute-intensive datapaths rather than glue logic. The 1.1 V core voltage and 65 nm node give a power-performance envelope that newer 28 nm and 14 nm families have since surpassed. Key features include 255,000 logic elements organized into 10,200 LABs (Logic Array Blocks), 16,672,768 embedded memory bits, 768 embedded 18x18 multipliers, and 12 embedded transceivers supporting multi-gigabit serial protocols. The 'I4' speed grade and industrial temperature rating (-40C to +100C operating) are confirmed by the Altera ordering code, and the FCBGA-1517 substrate enables the I/O count required for DDR3/DDR4 memory controllers, PCI Express Gen2 hard IP, and parallel LVDS interfaces. Architecturally, Stratix III E devices use a programmable power technology that dynamically scales core voltage per region, reducing dynamic power by up to 30% versus prior Stratix generations. The embedded transceivers support data rates up to 6.375 Gbps depending on speed grade, and the device integrates hard memory controllers, a PCI Express hard IP block, and a security-enabled configuration engine. Designers typically use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and bitstream generation. Typical applications include high-end ASIC prototyping and emulation, high-definition video broadcast equipment, military radar signal processing, test and measurement instrumentation, high-speed data acquisition systems, and telecommunications line cards. The combination of 255K logic elements and 768 DSP blocks makes the part especially well suited to multi-channel FIR filtering, FFT engines, and software-defined radio baseband processing. When designing with this part, note that Stratix III E devices are mature: Altera has issued multiple hardware errata and recommends designers review the Stratix III device handbook and errata sheets. The 1,517-ball FCBGA requires a multi-layer PCB with microvia stack-ups, controlled-impedance routing for transceiver channels, and a heatsink or thermal pad because junction-to-ambient thermal resistance is non-trivial at full utilization. This page synthesizes distributor pricing, drop-in Stratix III speed-grade alternatives, and practical PCB thermal guidance not found in the manufacturer datasheet alone.
EP3SE260F1517I4L - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP3SE260F1517I4L is a high-density Stratix III Enhanced (E) family FPGA with 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 maximum user I/O pins, packaged in a 1517-ball flip-chip BGA (FCBGA). It belongs to the industrial temperature grade (-40C to +100C) and is supplied in tray packaging. The 'L' suffix denotes a lead-free / RoHS-compliant finish, and 'I4' indicates the device speed grade. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and on-chip memory and DSP blocks. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), themselves a subcategory of application-specific integrated circuits (ASICs). Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, signal-processing pipelines, or even soft-processor systems. The Stratix III family uses TSMC's 65nm process and a programmable power technology that dynamically adjusts core voltage per tile to reduce static power. Key features of the EP3SE260F1517I4L include 768 embedded 18x18 multipliers (ideal for DSP workloads), 48 transceivers (transceiver count varies by device variant - confirm via datasheet), up to 16.6 Mbits of embedded SRAM, support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II, and the HardCopy III block for ASIC prototyping. The device supports partial reconfiguration, allowing portions of the logic fabric to be reprogrammed while the rest continues to operate, which is critical for high-availability systems. The architecture combines a high-speed interconnect fabric with column-based DSP and memory blocks, delivering deterministic timing and predictable performance for high-throughput signal processing. The 1517-BGA package exposes enough I/O for multi-channel memory interfaces and high-speed serial links, making it suitable for telecom line cards, broadcast video processing, and ASIC prototyping platforms where designers need many logic elements and large on-chip memory banks. Typical applications include high-performance DSP pipelines (radar, software-defined radio, medical imaging), ASIC prototyping and emulation, high-speed serial connectivity aggregation, and test-and-measurement backplanes. The wide I/O count also makes the part suitable for telecommunications line-card designs that aggregate many lower-speed links into a single processing domain. When designing with this FPGA, allocate sufficient PCB area for the 1517-ball FCBGA (typically 40mm x 40mm with a 1mm ball pitch), provide multi-layer PCB with continuous ground and power planes, and follow Intel's power-decoupling and thermal-management guidelines for high-density flip-chip packages. The device must be configured at every power-up using JTAG, passive serial, or a supporting configuration device. This page synthesizes distributor pricing, parametric comparisons against same-family Stratix III E variants, and practical design notes that go beyond what the manufacturer datasheet provides.
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SE260F1517I4LN is a high-density, low-power Stratix III E Field-Programmable Gate Array (FPGA) fabricated on a 40 nm process, delivering 255,000 equivalent Logic Elements (LE), 16,672,768 bits of embedded memory (approximately 2,044 KBytes of M9K/M144K block RAM), and 976 user I/O pins housed in a 1,517-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA). It belongs to the transceiver-rich Stratix III Enhanced (E) family, with 10200 Logic Array Blocks (LABs) and integrated Programmable Power Technology that reduces dynamic power versus earlier Stratix generations. The 'I4' speed grade and 'L' low-power option combine with the industrial temperature range ('I' suffix, -40C to +100C case) for thermally constrained embedded designs. The 'N' indicates lead-free / RoHS-compliant terminal finish. An FPGA is a reconfigurable digital integrated circuit in which the logic function is defined by user-supplied configuration bitstream rather than hard-wired mask layers. FPGAs occupy the middle ground between general-purpose microcontrollers (fixed instruction set, sequential execution) and ASICs (custom silicon, highest performance, no NRE amortization). Stratix III E specifically targets high-throughput DSP, ASIC prototyping, and datapath-heavy signal-processing designs where the combination of large on-chip memory, dedicated DSP blocks, and high I/O count delivers application-level throughput that discrete ASSPs cannot match. Within Intel's portfolio, the EP3SE260 sits between the Stratix III GX (transceiver-equipped) and the Stratix IV E (next-generation 40 nm low-power enhancement). Key differentiating features include 24 full-duplex transceivers operating up to 8.5 Gbps (Stratix III E supports up to 12.5 Gbps variants in the family), on-chip termination (OCT), dedicated DSP blocks with up to 384 18x18 multipliers, and partial reconfiguration support that allows a portion of the device to be reprogrammed while the rest remains active. The Programmable Power Technology enables per-LAB power gating at idle, which is why Stratix III E achieves up to 50% lower dynamic power than Stratix II at the same performance. Memory interfaces up to DDR3-1600 are supported via hardened PHY blocks. Typical applications include high-end ASIC prototyping, multi-channel digital signal processing (radar, software-defined radio), high-speed image processing pipelines, network packet processing at 10G/40G line rates, and military/aerospace command-and-control systems where the industrial temperature range and high logic density justify the BGA footprint. The 1517-ball FCBGA has a 40 mm x 40 mm body with a 1.0 mm ball pitch, requiring HDI PCB stackup with microvia-in-pad assembly. When designing with this device, allocate sufficient PCB layers for power/ground planes and signal breakout. The 1.0 mm BGA pitch is at the practical limit for cost-effective 4-layer designs - a 6-layer or 8-layer stackup with buried vias is recommended for routing-out all 976 user I/O plus power balls. Thermal management should account for case temperatures up to 100C; the exposed-die FCBGA requires either a heatsink or forced-air cooling at sustained high utilization.
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
The Intel / Altera EP3SE260F1517I4N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1517-ball FC-BGA package, built on a 1.1 V TSMC 65 nm process. Per the Intel Stratix III Device Handbook, this industrial-temperature grade device operates from -40 °C to +100 °C case temperature and is targeted at high-throughput digital signal processing, ASIC prototyping, and high-speed serial backplane designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, on-chip memory, and high-speed transceiver resources on a single die. Stratix III E devices extend the Stratix III architecture with enhanced DSP performance and up to 24 transceivers operating at 600 Mbps to 6.375 Gbps, making them suitable for chip-to-chip and backplane serial links. The 1517-BGA FCBGA package provides the largest I/O count in the Stratix III family at 976 user I/O, enabling dense parallel interfaces such as DDR3 and RLDRAM II memory controllers. Key features include 12 full-duplex transceiver channels with integrated PCS and PMA, dedicated hard memory controllers with support for DDR3 up to 800 MHz, up to 384 18x18 multipliers distributed across multiple DSP blocks, and support for partial reconfiguration. The device also offers 1.1 V core operation with selectable 0.9 V low-power modes, and supports hot-socketing for live insertion into backplane systems. The Stratix III E architecture uses a 65 nm TSMC process with 8-input adaptive logic modules (ALMs), providing higher logic density per area than the prior Stratix II generation. The 1517-BGA FCBGA package, measuring approximately 40 x 40 mm, uses flip-chip interconnection for low-inductance signal and power delivery. Embedded transceiver calibration, dynamic reconfiguration, and built-in PCIE Gen1 hard IP simplify multi-gigabit serial design. Typical applications include high-end ASIC prototyping and emulation, software-defined radio baseband processing, high-performance computing accelerators, broadcast video processing, and high-speed serial backplane bridging. The combination of high logic density and embedded transceivers also makes this part a popular choice for radar signal processing and medical imaging front-ends. Designers must pay close attention to power integrity: the 1.1 V core draws substantial current at full utilization, requiring multi-layer PCB stack-ups with low-impedance decoupling and the Altera SmartVID or external DC-DC solution for voltage regulation. Thermal management for the 1517-BGA package is critical; heatsinks with thermal interface material are typically required when junction-to-ambient exceeds 0.5 °C/W. This page synthesizes distributor inventory, drop-in same-package variants from the Site MPN list, and application-specific guidance not found in the manufacturer datasheet alone.
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
The Altera (Intel) EP3SE260H780C2 is a high-density Stratix® III E family Field Programmable Gate Array (FPGA) with 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FCBGA) package. It is built on a 65 nm low-power CMOS process and targets the highest-performance, lowest-power tier of the Stratix III family. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers into a single silicon die. Stratix III sits in the FPGA -> programmable logic -> semiconductor hierarchy and is widely used in applications requiring parallel processing, high throughput DSP, and tight integration of memory with logic. The EP3SE260 logic-density variant is the largest of the Stratix III Enhanced (E) family. Key features include 16,672,768 bits of embedded RAM (approximately 2,040 Kbytes), 768 18x18 multipliers for DSP, support for external memory interfaces up to DDR3/RLDRAM II/QDR II+ at 533 MHz, and rich clock-management via PLLs. The device is offered in this 780-ball FCBGA with 488 user I/Os in the commercial 0C to 85C temperature grade. Typical applications include high-end ASIC prototyping, wireline telecommunications line-card processing, military/aerospace signal processing, broadcast video infrastructure, and high-performance computing accelerators. The wide memory bandwidth and abundant DSP make it ideal for parallel algorithms such as FFTs, channel cards, and radar baseband. When designing, plan for the 780-ball FCBGA's 1.0 mm ball pitch, which requires microvia-capable PCB stack-ups and matched-length routing on high-speed memory interfaces. Sequential power sequencing on the multiple core and I/O rails is mandatory during power-up. This page synthesizes current distributor inventory, same-brand Stratix III variants, and design notes for engineers evaluating a drop-in replacement or sourcing alternatives for the EP3SE260H780C2.
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
The Intel (formerly Altera) EP3SE260H780C2N is a high-density Stratix III E Field-Programmable Gate Array integrating 255,000 logic elements, 10,200 LABs/CLBs, and 16,672,768 bits of embedded RAM into a 780-ball FineLine BGA (FCBGA) package. It is fabricated on TSMC's 40 nm low-power process and operates with a 0.9 V core supply, providing the high logic density and on-chip memory bandwidth demanded by ASIC prototyping, high-performance DSP, and high-speed serial bridging designs. The device exposes 488 user I/O pins and supports up to 24 transceivers running at up to 6.375 Gbps, enabling protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and multi-gigabit serial interconnect. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O standards are defined at design time by loading a configuration bitstream into on-chip SRAM. FPGAs sit hierarchically between application-specific integrated circuits (ASICs) and software processors, combining hardware parallelism with software-defined functionality, and Stratix III E variants are positioned within Intel's high-end, transceiver-rich family. Key features of the EP3SE260H780C2N include 488 user I/Os, 16,672,768 total RAM bits (14,049,152 user bits plus additional memory), support for DDR/DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces, and up to 24 full-duplex transceivers. The FCBGA-780 package combines flip-chip attach with a thermal lid suitable for high-power dissipation, while 12 global clock networks and 88 PLLs/DCMs provide flexible clock synthesis for high-performance timing closure. Architecturally, the Stratix III E device uses adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), a tiered memory hierarchy (MLABs, M9K, M144K), and dedicated DSP blocks capable of 600 MHz 18x18 multiplication. The transceiver blocks include embedded PMA, PCS, and hard IP for PCIe and Gbps Ethernet, substantially offloading soft logic. Typical applications include ASIC and SoC prototyping, high-speed data acquisition cards, radar and baseband processing, broadcast video processing, and 40G/100G wire-speed bridging. When laying out the board, allocate contiguous 780-BGA land pattern, observe transceiver break-out length and impedance rules, and provide adequate decoupling for the 0.9 V core rail to avoid logic-margin loss.
EP3SE260H780C3 - Stratix III E FPGA 255K LE, 488 I/O | Intel
The Intel EP3SE260H780C3 is a high-density Stratix III Enhanced (FPGA) IC delivering 255,000 logic elements and 488 user I/Os in a 780-ball FCBGA (HBGA) package. Built on a 65 nm process and operating from 0.9 V core with 1.1 V auxiliary supplies, this device integrates 16,672,768 bits of embedded memory, 10200 LABs, and high-speed transceiver logic designed for high-bandwidth DSP, ASIC prototyping, and telecommunications infrastructure. The "C3" speed grade targets commercial temperature ranges with typical performance tuned for parallel DSP pipelines and high-throughput memory interfaces. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed after manufacture. Within the broader integrated circuit taxonomy, FPGAs sit between fixed-function ASICs (application-specific, lowest per-unit cost at volume) and software-driven processors (most flexible but lower throughput per watt). High-density Stratix III E devices bridge the gap by offering ASIC-class compute density while retaining FPGA reprogrammability, making them ideal for evolving standards and prototype-to-production workflows. Key features include 255K logic elements with dedicated DSP blocks, embedded memory totaling 16.67 Mbit, 488 user I/Os supporting LVDS, LVCMOS, HSTL, and SSTL standards, and a 780-ball flip-chip BGA package for high signal density. The Stratix III Enhanced family adds hardened floating-point and variable-precision DSP support and additional transceers versus baseline Stratix III, supporting high-speed serial protocols. Embedded PLLs and clock networks enable multiple domain clocking at frequencies up to 500 MHz core operation. Reliability features include hot-socketing support, on-chip termination, and built-in CRC verification of configuration memory. Architecturally, the EP3SE260H780C3 combines a fine-grained logic fabric with hard IP blocks for memory, DSP, and transceivers, with Altera/Intel Quartus II design software support for synthesis, place-and-route, and timing closure. The 65 nm CMOS process balances density and static power, with speed-grade "C3" indicating the device's static-timing corner and supported toggle rates. Typical applications include high-end ASIC prototyping, wireless baseband DSP pipelines, high-throughput image and signal processing, military communications, test and measurement instrumentation, and high-speed data acquisition. The Stratix III E family is well-suited to designs that require both high logic density and large I/O counts in a single package. When designing with this device, ensure the PCB can handle the 780-ball flip-chip BGA land pattern with proper microvia or via-in-pad stack-ups for signal integrity. Plan thermal management using the thermal-resistance metrics in the device handbook, and validate configuration schemes (fast passive parallel, JTAG, or active serial) against system bring-up requirements. This page synthesizes distributor availability, drop-in same-family Stratix III E alternatives, design notes, and parametric context not collected in any single distributor listing - giving engineers a one-stop engineering summary for the EP3SE260H780C3.
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
The Intel / Altera EP3SE260H780C3N is a high-density Stratix® III E Field Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os, housed in a 780-ball FineLine BGA (FCBGA) package. The device is fabricated on a TSMC 40 nm process, supports core speeds up to approximately 717 MHz, and is rated for commercial temperature operation (C grade, 0 °C to +85 °C). A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (LABs/CLBs) embedded in a programmable interconnect fabric. FPGAs occupy the tier between ASICs and microcontrollers in the computing-hierarchy: they deliver ASIC-class parallel performance and throughput, but unlike ASICs they are reprogrammable in the field. Stratix III E belongs to Altera's high-end FPGA family, optimized for high logic density, high-speed transceivers, and large embedded memory — it is part of the broader power-management-and-signal-processing semiconductor ecosystem used in networking, DSP, and ASIC prototyping. Key features of the EP3SE260H780C3N include 10200 LABs/CLBs for fine-grained parallel logic, embedded DSP blocks for high-speed fixed- and floating-point arithmetic, up to 488 user I/Os supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential I/O standards, and on-chip transceivers suitable for 1 Gbps+ serial links. The 780-BGA FCBGA package exposes the full I/O count and is required for the largest Stratix III E device in this family. Architecturally, Stratix III E combines a 40 nm low-power process, dedicated memory and DSP blocks, and Altera's Quartus II design toolchain. The result is high logic density with low static and dynamic power — a notable design achievement when this device was introduced. The 'N' suffix denotes a lead-free / RoHS-compliant package finish. Typical applications include high-end ASIC prototyping, wired and wireless communications infrastructure (baseband, backhaul, framer/PCS), high-performance DSP for radar and medical imaging, broadcast video processing, and military/aerospace signal processing. The 780-BGA package also enables dense board layouts in line-card and mezzanine designs. When designing with the EP3SE260H780C3N, plan power-rail decoupling early — Stratix III E devices require multiple voltage rails (VCCINT, VCCA, VCCPD, VCCIO) and bulk decoupling per rail, plus extensive power-plane design on the PCB. Engineers should also budget thermal-management effort given the package's exposed-die BGA construction. This page synthesizes verified distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the standalone datasheet.
EP3SE260H780C4 - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel / Altera
The Intel / Altera EP3SE260H780C4 is a high-density Stratix III E FPGA delivering 255,000 logic elements, 16,672,640 bits of embedded memory, and 488 user I/Os in a 780-ball flip-chip BGA (FCBGA) package. Fabricated on a 65 nm process, this device operates from a 0.9 V core supply with a 1.1 V auxiliary rail and targets performance-critical digital logic, signal processing, and high-bandwidth I/O designs. The "C4" speed grade and 780-ball FCBGA make it a flagship member of the Stratix III E family. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture. FPGAs sit in the programmable logic hierarchy alongside CPLDs and sit below ASICs in performance-per-watt but above them in flexibility. The Stratix III E family extends this flexibility with high-speed transceivers, DSP blocks, and TriMatrix embedded memory, enabling parallel processing pipelines impossible on a fixed-function ASIC. Key features of the EP3SE260H780C4 include 10,200 Logic Array Blocks (LABs), 1020 Kbits of distributed memory, 576 embedded 18x18 multipliers for DSP, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. The device exposes 8 PLLs and 488 general-purpose user I/Os that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, making it a strong fit for high-speed parallel interfaces. Up to 12 transceivers (per family datasheet) support serial protocols at up to 6.375 Gbps, accelerating backplane and chip-to-chip links. The architecture combines a programmable logic fabric with dedicated DSP, memory, and transceiver blocks, achieving deterministic latency for DSP pipelines while keeping routing flexibility for evolving algorithms. Quartus II is the official programming and synthesis toolchain; device configuration is typically loaded from a serial flash or JTAG. Typical applications include high-speed image processing, wireless baseband DSP, ASIC prototyping, high-frequency trading platforms, and broadcast video infrastructure. Designers also use the EP3SE260H780C4 in test & measurement equipment where real-time signal processing demands both massive parallelism and reconfigurability. When designing with this device, thermal management is critical. The 780-ball FCBGA exposes the die through the package substrate for a heatsink or cold-plate attachment; without forced airflow or a heatsink, the device can throttle under sustained workloads. Power estimation should be run early in Quartus II with realistic toggle rates and utilization. This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not found in the manufacturer datasheet, helping sourcing and hardware teams evaluate the EP3SE260H780C4 alongside its same-family peers.
EP3SE260H780C4L - Stratix III E 255K LE FPGA, 780-BGA | Intel
The Intel EP3SE260H780C4L is a high-density Stratix III E family Field Programmable Gate Array (FPGA) featuring 255,000 logic elements, 10,200 LABs/CLBs, and 16,672,768 bits of embedded RAM in a 780-pin flip-chip BGA package. The device exposes 488 user I/O pins and is built on TSMC's 40nm process for low static and dynamic power consumption. Speed grade 4 (C4) places it in Intel/Altera's middle-to-slow tier for design margin headroom. A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated memory blocks, DSP blocks, and high-speed transceivers that can be reconfigured by the user after manufacture. FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs in the programmable-logic hierarchy, offering hardware-level parallelism for DSP, packet processing, and prototyping workloads that demand deterministic latency. The Stratix III E family in particular introduced the Programmable Power Technology that allows each logic block to operate in high-performance or low-power mode at compile time. Key features include up to 384 DSP blocks (18x18 multipliers), 24 transceivers supporting up to 6.375 Gbps (C4 speed grade dependent), 16 global clock networks, and a hard memory controller supporting DDR3/DDR2/QDRII+/RLDRAM II external memory. The 780-ball FCBGA uses flip-chip packaging for superior thermal and electrical performance versus wire-bond equivalents. The architecture combines ALMs (Adaptive Logic Modules) of 8-input fracturable look-up tables with carry chains and register chains, providing high logic density. Hard IP blocks such as PCIe Gen1/Gen2 controllers, memory controllers, and serial transceivers free up logic resources for application code. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using industry-standard EPCS or EPCQ configuration devices. Typical applications include high-performance digital signal processing in defense radar, software-defined radio (SDR) baseband, medical imaging acceleration, high-frequency trading ASIC prototyping, video broadcast processing, and 40G/100G wireline aggregation. The C4 speed grade with 488 I/Os is favored when interfaces demand many parallel LVDS pairs rather than maximum clock frequency. When designing with this part, allocate sufficient PCB layers for the FCBGA breakout (typically 4 to 6 routing layers with microvia stack-ups), and follow Intel/Altera's Pin Connection Guidelines for unused transceiver and clock pins. Quartus II software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from the Stratix III device handbook not always presented on individual distributor listings.
EP3SE260H780C4LG - Stratix III E FPGA, 488 I/O, 780-HBGA | Altera
The Altera (now Intel) EP3SE260H780C4LG is a high-density, high-performance Stratix III Enhanced family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package. It integrates 254,400 logic elements (LEs) with 18.36 Mbits of embedded memory, delivering ASIC-grade performance for compute-intensive and signal-processing workloads. The "C4" speed grade denotes a commercial temperature grade (0C to +85C) at the mid-speed tier. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital circuits after PCB assembly. FPGAs occupy the highest tier of programmable logic, above CPLDs in density and below custom ASICs in per-unit cost, making them ideal for low-volume designs, rapid prototyping, and applications whose algorithms continue to evolve after deployment. Key features include 950 MHz DSP block performance, dedicated 9-bit x 9-bit multiplier blocks, up to 800 Mbps external memory interface support (DDR3, QDR II+, RLDRAM II), 488 user I/O pins, and 8 full-duplex transceivers supporting rates up to 6.375 Gbps. The 780-HBGA package provides the highest user I/O density in the Stratix III E lineup, suited for data-path-heavy designs. The Stratix III Enhanced family uses a 65 nm low-power process and introduces programmable power technology that dynamically scales voltage on logic blocks. Combined with hard IP for PCI Express Gen2, 10 Gigabit Ethernet MACs, and multi-gigabit transceivers, it accelerates protocol bridging, baseband processing, and high-speed serial links. Typical applications include ASIC prototyping, high-performance DSP (radar, medical imaging, video processing), high-speed serial protocol bridging, broadcast equipment, military/aerospace signal processing, and test & measurement instrumentation. The 780-HBGA package supports high pin-count designs where board area and trace-length control are critical. When designing with this device, allocate FPGA fabric utilization below 70% to leave timing margin for place-and-route closure, plan power sequencing across VCC, VCCA_PLL, and VCCPT rails, and validate transceiver reference-clock jitter against protocol masks. This page synthesizes distributor pricing, same-package drop-in alternatives (speed/temperature/revision grade variants), and practical design considerations for the EP3SE260H780C4LG that are not consolidated in the manufacturer datasheet.
EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel
The Intel (Altera) EP3SE260H780C4LN is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. The device integrates 10,200 Logic Array Blocks (LABs) and 384 embedded 18x18 multipliers, supporting DSP-intensive workloads at core speeds up to 600 MHz. This C4LN speed grade variant is specified for commercial temperature operation (0C to +85C) and uses 1.0V core VCC with auxiliary VCCPD and VCCPT rails for I/O and phase-locked loop (PLL) blocks. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a configurable logic fabric of programmable Look-Up Tables (LUTs), flip-flops, routing, and hardened IP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and ASICs: microcontrollers run software, FPGAs implement custom hardware at wire-speed, and ASICs are fixed-silicon implementations of a single design. The Stratix III E family adds dedicated transceivers, DSP blocks, and TriMatrix on-chip memory to the general-purpose FPGA fabric, making it suitable for high-throughput parallel processing. Key features of the EP3SE260H780C4LN include 16 global clock networks, 8 PLLs per device, 4 configuration schemes (Fast Passive Parallel, Active Serial, Passive Serial, JTAG), and support for up to 12.5 Gbps operation when paired with Stratix III GX/LX transceivers on adjacent package variants. The device also exposes the partial reconfiguration controller and CRC error-detection circuitry that are hallmarks of the Stratix III generation. The EP3SE260H780C4LN is fabricated in TSMC's 40 nm process node and uses a 1.0V core supply. The 780-FCBGA package exposes 488 general-purpose I/O arranged across 24 I/O banks with support for LVDS, LVCMOS, SSTL, and HSTL I/O standards. On-chip termination (OCT) eliminates external series/parallel resistors on critical nets. Typical applications include high-performance digital signal processing (radar, beamforming, software-defined radio), ASIC prototyping, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, 10 Gigabit Ethernet MAC), broadcast video processing, and high-frequency trading accelerators. The 16.67 Mbit embedded memory enables wide data-path implementations without external SRAM. When designing with this part, attention to PCB layout is critical: the 780-FCBGA requires microvia or via-in-pad PCB technology, matched-length routing on LVDS pairs, and decoupling capacitors within 100 mil of every VCC pin. Designers should also budget power using the Altera PowerPlay Early Power Estimator (EPE) tool before PCB commitment. This page synthesizes distributor pricing, same-family Stratix III E drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
EP3SE260H780C4N - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE260H780C4N is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 10,200 Logic Array Blocks (LABs), and 16,672,768 bits of embedded RAM, housed in a 780-ball FineLine Ball-Grid Array (FCBGA) package. The device operates across a 0.86 V to 1.15 V core voltage range using TSMC's 65 nm process node, with a maximum core clock frequency of 450 MHz. The 488 user I/O pins support a broad mix of single-ended and differential I/O standards for high-bandwidth system connectivity. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory blocks, DSP slices, PLLs) on a single silicon die. FPGAs sit in the wider taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors, and they enable parallel hardware implementation of algorithms that would otherwise require custom ASICs or multi-chip DSP solutions. Key features of the EP3SE260H780C4N include 768 18x18 multipliers for DSP, 12 phase-locked loops (PLLs) for clock management, support for external memory interfaces including DDR3, DDR2, and QDRII+ up to 800 MHz, and integrated transceiver capability depending on die variant. The device is hardened for signal integrity with on-chip termination and adaptive equalization, and is rated for industrial-grade operating temperature. Architecturally, the Stratix III E family uses an adaptive logic module (ALM) fabric that is roughly 25 percent more area-efficient than prior Stratix II Adaptive Look-Up Tables, while the partial reconfiguration and dedicated configuration logic enable secure in-field updates. The 65 nm process and 1.1 V core deliver a favorable performance-per-watt envelope for high-end DSP and packet-processing workloads. Typical applications include high-performance digital signal processing for radar and software-defined radio, ASIC prototyping and emulation, high-speed packet processing in network infrastructure, video broadcasting and medical imaging pipelines, and high-throughput data-acquisition systems. The combination of logic density and dedicated multiplier resources is well suited to multi-channel DSP and FEC implementations. Designers should plan for 0.86 V to 1.15 V core supply sequencing and use the Altera/Intel Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure. Thermal management at high toggle rates requires a multi-layer PCB with sufficient ground and power planes; reference the Stratix III handbook for thermal design guidelines. This page synthesizes distributor stock and pricing, the Stratix III family pin-compatible variants, and practical design notes that complement the manufacturer datasheet and Quartus II device documentation.
EP3SE260H780I3 - Stratix III E 255K LE FPGA, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE260H780I3 is a high-density Stratix III E FPGA built on a 65 nm process, delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FC-HFBGA) package. The device integrates 10,200 LABs and 384 embedded 18x18 multipliers, providing up to 192 GMACs of DSP throughput for high-performance signal processing. An internal clock network supports operation up to 800 MHz fabric and 500 MHz logic-array frequency, with transceiver-rich variants typically reaching 717 MHz on high-speed interfaces. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices, sitting alongside CPLDs in the digital logic hierarchy and bridging the gap between fixed-function ASICs and software-driven processors. Stratix III E devices specifically target high-performance, logic-rich applications with embedded DSP and memory, paralleling Xilinx Virtex-6 in market positioning. The EP3SE260H780I3 is part of the Stratix III E family engineered for low static and dynamic power through programmable power technology, with each LAB able to operate in high-speed or low-power mode. The 780-ball FCBGA package supports industrial temperature grades, making the part suitable for harsh-environment deployments. On-chip features include partial reconfiguration, dedicated PLL and DLL clock management, and hard memory controllers for DDR2/DDR3. Typical applications span high-end wireline and wireless baseband processing, military radar and electronic warfare, ASIC prototyping, and high-definition video broadcast infrastructure. The device also serves medical imaging accelerator cards, high-frequency trading acceleration platforms, and test-and-measurement instrumentation where parallel DSP throughput and large on-chip memory dominate the design trade. A key design trade-off: the 780-ball FCBGA package requires a multi-layer PCB (typically 8-12 layers) with controlled-impedance routing, microvia or via-in-pad stackups, and matched-length traces for high-speed differential pairs. Engineers should plan for thermal management (junction-to-ambient resistance typically in single-digit C/W with proper heatsinking) and consider migration paths to Stratix IV/V or Cyclone families as the Stratix III line is no longer recommended for new designs. This page synthesizes distributor pricing, drop-in Stratix III family alternatives, and practical FPGA design notes not collected in a single place in the manufacturer datasheet.
EP3SE260H780I3N - Stratix III E FPGA 255K LE 780-FCBGA | Intel
The Intel EP3SE260H780I3N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os in a 780-pin FCBGA (HBGA) package. According to the distributor listing, it operates at up to 500 MHz core frequency on a 65 nm CMOS process with a 1.1 V core supply, and is rated for the industrial temperature range. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, embedded memory (BRAM/M9K/M144K), high-speed transceivers, and I/O cells, all configured via an SRAM-based bitstream after PCB assembly. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > PLD > digital logic IC > semiconductor), bridging software-defined hardware and ASIC-class performance for prototyping, low-volume production, and applications where time-to-market dominates unit-cost sensitivity. The Stratix III generation specifically targets high-performance signal processing, telecom baseband, and ASIC-prototyping workloads. Key features include 10,200 Logic Array Blocks (LABs), 488 user I/Os supporting multiple I/O standards (LVDS, LVTTL, SSTL, HSTL), embedded multipliers and DSP blocks for high-throughput arithmetic, and 16,672,768 bits of on-chip RAM configurable as true dual-port, simple dual-port, or single-port memory. The device also provides up to 12 transceivers (per Stratix III E family) for multi-gigabit serial links, PLL-based clock management, and dynamic on-chip termination (OCT) for signal integrity. Architecturally, the Stratix III E family uses a 65 nm TSMC process with adaptive logic modules (ALMs) - each ALM packs eight 6-input LUTs into a single structure, yielding roughly twice the logic density of the prior Stratix II generation at equivalent performance. The 'I' suffix in the part number indicates industrial temperature grade (-40 °C to +100 °C ambient operation), while the '3' speed grade positions this device in the mid-performance tier (Stratix III speed grades: 2 = fast, 3 = mid, 4 = slow). Typical applications include ASIC prototyping, high-end DSP and image processing, telecom baseband and channel cards, military/aerospace signal processing, high-speed serial protocol bridging (PCIe, Serial RapidIO, Aurora, CEI-6G), and test & measurement instrumentation. The 488 I/O count makes it well-suited for bus-heavy designs requiring wide parallel interfaces to DDR/QDR memories and external ASICs. When designing with this device, allocate adequate PCB layers (typically 12+ for a 780-pin FCBGA), use a multi-via-per-pad escape pattern for the BGA fan-out, and follow Intel/Altera's Stratix III Handbook power-rail sequencing recommendations (VCCINT, VCCAUX, VCCPD rails must sequence within 100 ms to prevent latch-up). Decoupling requires a mix of 0402/0201 ceramic capacitors placed as close to every power pin as possible. This page synthesizes distributor pricing, same-family Stratix III alternatives, application guidance, and PCB layout considerations drawn from the manufacturer datasheet family and current distributor inventory - information that a raw datasheet PDF alone does not provide.
EP3SE260H780I4 - 255K LE Stratix III FPGA, 780-BGA | Intel
The Intel (formerly Altera) EP3SE260H780I4 is a high-density Stratix III Enhanced (Stratix III E) family FPGA housed in a 780-ball FC-HFBGA (HBGA) package. According to manufacturer data, the device integrates approximately 255,000 logic elements (LEs) fabricated on a 65 nm process node, with a core voltage of 1.1 V and 488 user I/Os. The part is specified for industrial-grade temperature operation (the trailing 'I' designator in the ordering code). An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture is built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. FPGAs occupy the top of the digital hardware hierarchy between ASICs (which are fixed-function) and microcontrollers (which are software-programmed but sequential). Stratix III E parts are positioned for high-performance signal processing, high-bandwidth connectivity, and ASIC prototyping where deterministic parallelism and large embedded memory are required. Key features include up to 14.4 Mbit of embedded RAM (M9K/M144K blocks), dedicated DSP blocks supporting 9x9, 18x18, and 36x36 multipliers, up to 8 embedded transceivers operating up to 6.5 Gbps (per Stratix III family capability), and hard PCI Express Gen1 endpoints. The device supports configuration via JTAG, Passive Serial, Fast Passive Parallel, and Active Serial schemes using Altera/Intel EPCS or EPCQ flash memories. The 65 nm process and 1.1 V core enable lower static power than the prior Stratix II generation. The HBGA-780 substrate uses flip-chip interconnects that shorten the die-to-package inductance path, supporting clean multi-Gbps signaling. The 'I4' suffix indicates industrial temperature grade (-40C to +100C ambient) and speed grade 4. Typical applications include high-end test and measurement instrumentation, ASIC prototyping, broadcast video processing, defense signal processing, and wireless baseband preprocessing. The combination of 255K LEs and ~14 Mbit RAM targets pipelines that previously required multiple smaller FPGAs. A primary design consideration is power delivery: the 1.1 V core rail can draw substantial current under high toggle rates - designers must budget for a multi-phase VRM with bulk decoupling close to the BGA balls. Signal integrity on the flip-chip BGA requires matched-length routing and reference-plane continuity under the escape region. This page synthesizes distributor pricing, drop-in same-package variants, and engineering guidance not found in the manufacturer datasheet alone.
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
The Intel (formerly Altera) EP3SE260H780I4L is a high-density Stratix III E FPGA with 255,000 logic elements, 16,672,640 bits of embedded memory, and 488 user I/O pins, housed in a 780-pin FC-HFBGA (flip-chip fine-pitch BGA) package. It operates from a 0.9 V core supply, is built on a 65 nm process, and supports DDR3 memory interfaces at up to 533 MHz (1067 Mbps data rate), with 24 transceivers up to 6.375 Gbps per the Stratix III E family specification. The device is part of the Stratix III Enhanced (E) variant that delivers higher logic density and richer DSP/memory resources than the base Stratix III L variant. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic function is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), above simple CPLDs in density, and below ASICs in per-unit cost but above them in design flexibility. FPGAs typically integrate programmable logic blocks, embedded multipliers, BRAM, clock networks, high-speed transceivers, and hard IP cores (memory controllers, PCIe, SERDES), making them suitable for high-throughput compute, signal processing, and prototyping tasks. Key features of the EP3SE260H780I4L include 488 user I/Os, 1,536 18x18-bit multipliers (per Stratix III E family maximum), 19.4 Mbits of total BRAM per device-level maximum, and support for soft-core processors such as Nios II. The FC-HFBGA package provides a fine-pitch BGA with flip-chip attach and a high pin-count for high-bandwidth signal routing. Industrial temperature grade and JTAG IEEE 1149.1 boundary-scan support enable in-system programming and test. Typical applications for the EP3SE260H780I4L include high-performance DSP and baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, SRIO, XAUI), test and measurement instrumentation front-ends, military and aerospace signal processing, and high-port-count line-card controllers. The 780-pin FC-HFBGA package and industrial-grade qualification make it well-suited to demanding environments that require large logic capacity with deterministic timing closure. When designing with the EP3SE260H780I4L, pay close attention to multi-rail power sequencing (0.9 V core, 1.1 V/1.2 V/1.5 V/2.5 V/3.3 V I/O and auxiliary supplies), thermal management on the FC-HFBGA substrate, and PCB stack-up to control impedance on the high-speed transceiver channels. Configuration can be loaded via JTAG, passive serial, or via a quad flash EPCQ device for fast multi-MB bitstreams.
EP3SE260H780I4LG - Stratix III E FPGA 255K LE HBGA-780 | Intel
The Intel (formerly Altera) EP3SE260H780I4LG is a high-density, low-power Stratix III Enhanced FPGA delivering 255,000 logic elements, 102,000 adaptive logic modules (ALMs), and 15.90 Mbit of embedded memory in a 780-ball FineLine BGA (HBGA) package. It belongs to the EP3SE260 speed-grade -4 / industrial temperature family and integrates 488 user I/O pins, eight phase-locked loops, and dedicated DSP blocks optimized for high-throughput signal processing. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), routing channels, and hardened IP such as memory, multipliers, transceivers, and PLLs. FPGAs sit hierarchically below Application-Specific Integrated Circuits (ASICs) but above general-purpose microcontrollers in the programmable-logic taxonomy, allowing hardware-level parallelism and post-manufacture functional changes. The Stratix III Enhanced family targets applications that require very high logic density combined with low static and dynamic power, achieved through Altera's programmable power technology and adaptive logic modules. Key features include 840 18x18 multipliers, 304 DSP blocks, 4 fractional PLLs plus 4 general-purpose PLLs, support for external memory interfaces including DDR3 up to 800 MHz, and an industrial temperature range of -40C to +100C. The HBGA-780 package supports high pin count with manageable board real estate for telecom, broadcast, and high-performance computing backplanes. Configuration is supported via JTAG, Passive Serial, Fast Passive Parallel, and Active Serial schemes through dedicated configuration pins. The architecture combines the Quartus II design-flow benefits with TSMC's 65 nm low-power process, providing deterministic timing closure for multi-gigabit serial and parallel interfaces. Hardware designers typically pair the device with high-speed external SRAM/DDR3, multi-gigabit transceivers (via the Stratix III Enhanced variant), and protocol IP cores for PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and Interlaken. Typical applications include wireless baseband processing, high-end medical imaging, ASIC prototyping, broadcast video processing, and high-frequency trading acceleration. Designers working on signal intelligence (SIGINT) platforms and defense radar also rely on the EP3SE260 density for channelization and beamforming workloads. When designing with this FPGA, use Intel Quartus II software v13.1 or later for synthesis, place-and-route, and PowerPlay power estimation. Verify thermal envelopes via junction-to-ambient and junction-to-case thermal resistance figures from the package datasheet, as BGA-780 at full utilization commonly exceeds 10 W. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-package alternatives drawn from the Site MPN list, and practical design notes - synthesis unavailable on the manufacturer product page alone.
EP3SE260H780I4LN - 255k LE Stratix III E FPGA | Altera | 780-BGA
The Altera (Intel) EP3SE260H780I4LN is a high-density Stratix® III E Field Programmable Gate Array (FPGA) with 255,000 logic elements, housed in a 780-ball FineLine Ball-Grid Array (FCBGA/HBGA) package. The device integrates 16,672,640 memory bits and 488 user I/O pins, fabricated on a TSMC 65 nm process node and offered in the -4 speed grade with industrial temperature rating. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit hierarchically between general-purpose microcontrollers (which execute software) and application-specific integrated circuits (ASICs) (which are fixed in silicon), offering hardware-level parallelism, in-system reprogrammability, and custom datapath design without NRE cost. The Stratix III E family specifically targets high-performance signal processing, ASIC prototyping, and high-bandwidth data-path applications. Key features of the EP3SE260H780I4LN include 10,200 Logic Array Blocks (LABs), integrated DSP blocks for high-throughput arithmetic, embedded memory for buffering and queuing, and dedicated high-speed serial transceiver resources supporting multi-gigabit data rates. The device operates from a 0.9 V core supply and supports industrial temperature range operation. Its high logic-to-I/O ratio makes it suitable for pin-intensive designs and dense parallel processing. Stratix III E devices use a 65 nm low-k dielectric CMOS process with Altera's adaptive logic module (ALM) architecture, delivering roughly 1.4× the logic capacity and 2× the transceiver performance of the preceding Stratix II generation. Embedded transceivers operate up to 6.375 Gbps, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, and CPRI. The architecture is optimized for ASIC prototyping, high-performance DSP pipelines, and communications infrastructure where deterministic parallel throughput is required. Typical applications include ASIC prototyping and emulation, high-speed digital signal processing for wireless baseband and radar, software-defined radio platforms, high-end test and measurement instrumentation, video broadcast and image processing pipelines, and high-bandwidth networking line cards. Designers choose Stratix III E parts when they require very high logic density combined with multi-gigabit transceivers and substantial on-chip memory in a single device. When designing with this FPGA, ensure robust power-delivery network design for the multi-rail core and transceiver supplies, and follow Altera's PCB layout guidelines for HBGA packages including via-in-pad and microvia construction for signal-integrity at high transceiver rates. Programming uses the Quartus II design suite. This page synthesizes distributor pricing, drop-in Stratix family alternatives, and PCB/thermal design notes for the EP3SE260H780I4LN not aggregated on the manufacturer product page.