FPGA & CPLD
Products (6358)
EP3SL70F484I4G - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
The Intel EP3SL70F484I4G is a high-density, low-power Stratix® III L Field Programmable Gate Array (FPGA) IC built on a 65 nm process and offered in a 484-ball FineLine BGA (FC-FBGA) package. It integrates 67,500 logic elements (LE) backed by 27,000 adaptive logic modules (ALM), 2.57 Mbit of embedded memory, and 296 user I/O pins operating from a 1.1 V core supply. The device also embeds 48 digital signal processing (DSP) blocks and 8 phase-locked loops (PLL) for high-performance DSP and high-speed serial I/O design. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, routing, and I/O can be reconfigured after manufacture. Stratix® III L sits within the FPGA taxonomy as a high-end, low-static-power variant of Altera's (now Intel) Stratix III family, optimized for applications that demand high logic density, abundant DSP, and low dynamic power. The 'SL' (Stratix III Low-power) family extends the Stratix III generation with programmable power technology that reduces static consumption while preserving performance. Key features of the EP3SL70F484I4G include 296 user I/Os that support multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), 2.57 Mbit of embedded SRAM organized as M9K/M144K blocks, 48 DSP blocks for fixed- and floating-point arithmetic, and 8 PLLs with fractional-N support. The 484-ball FC-FBGA package is a wire-bond-free flip-chip BGA that improves signal integrity and thermal dissipation, making it well suited for high-speed parallel buses and serializer/deserializer (SerDes) lanes. The 65 nm CMOS process and Stratix III architecture deliver an excellent logic-to-power ratio for compute-intensive workloads. Programmable Power Technology enables unused logic and routing to be powered down automatically, while dedicated hard IP blocks (memory, DSP, PLLs, transceivers on higher-density members) accelerate common functions. The result is a flexible platform for ASIC prototyping, high-throughput data acquisition, and real-time signal processing. Typical applications for this part include high-performance digital signal processing (radar, beamforming, software-defined radio), high-speed video and image processing pipelines, ASIC prototyping and emulation, industrial test and measurement equipment, and high-speed data-acquisition front ends. The 484-ball FC-FBGA package and industrial-grade temperature range (-40C to +100C) also suit telecom and aerospace ground systems. When designing with the EP3SL70F484I4G, ensure a multi-layer PCB with continuous power and ground planes is used to maintain signal integrity for the LVDS pairs and high-speed clocks. Decouple each core and I/O bank with a combination of bulk and high-frequency ceramic capacitors placed as close to the balls as physically possible, and follow Altera's pin-out and power-sequencing guidelines in the device handbook to avoid in-rush latch-up at power-up. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes that complement (but do not replace) the official Altera/Intel Stratix III device handbook.
EP3SL70F484I4L - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
The Altera (Intel) EP3SL70F484I4L is a low-power member of the Stratix III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/O in a 484-ball FineLine BGA (FBGA) package. Built on a 65 nm process and optimized for power efficiency, the device targets high-performance digital signal processing, high-speed serial connectivity, and memory-rich compute applications where thermal and energy budgets are critical. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected via a programmable routing fabric. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting hierarchically between standard logic ICs and ASICs. The Stratix III L family specifically trades some absolute logic capacity for substantially reduced static and dynamic power versus the Stratix III standard variant. Key features of the EP3SL70F484I4L include up to 450 MHz core performance, 1.1 V core operation, dedicated DSP blocks for fixed- and floating-point arithmetic, embedded RAM with optional ECC, programmable I/O supporting LVDS, HSTL, SSTL and other standards, and support for high-speed external memory interfaces including DDR3. The device integrates PLLs for clock management and is suitable for PCIe hard IP and multi-gigabit serial links via its transceiver blocks. The architecture combines a 65 nm process node with Altera's Programmable Power Technology, which allows unused logic and routing resources to be selectively powered down. This makes the L variant particularly attractive for power-sensitive designs such as wireline telecom line cards, software-defined radio basestations, and high-throughput image processing pipelines where the 67.5K LE capacity is sufficient but absolute maximum logic density is not required. Typical applications include high-end communication infrastructure, ASIC prototyping, high-performance DSP, and broadcast video processing. When designing with this device, verify that Quartus II design software supports the specific transceiver and I/O features required, and confirm thermal dissipation under worst-case utilization using the device's published thermal model.
EP3SL70F484I4LG - Stratix III L FPGA, 67.5K LE, 484-FCBGA | Intel
The Intel EP3SL70F484I4LG is a high-density, low-power member of the Stratix III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os into a 484-ball FineLine BGA (FCBGA) package. Built on a 40 nm process, this Stratix III L variant is positioned for power-sensitive applications that still require the performance and transceiver-rich fabric of the Stratix III family. Operating temperature spans -40 C to +100 C (industrial), and the device is supplied from a 1.1 V core rail with separate VCCIO banks for mixed-voltage I/O. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable routing, dedicated block memory, DSP slices, and high-speed transceiver blocks into a single silicon die. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-density, high-performance tier of the semiconductor logic hierarchy. Modern FPGAs are routinely used as integration platforms that replace discrete ASICs, DSPs, and microcontrollers in parallel processing, signal processing, and high-bandwidth I/O applications. Key feature highlights of the EP3SL70F484I4LG include 27,000 Adaptive Logic Modules (ALMs), 2.57 Mbit of embedded block RAM, integrated DSP blocks for high-throughput arithmetic, dedicated clock networks and PLLs, and support for external memory interfaces including DDR2/DDR3. The 484-ball FCBGA package provides ample signal margin for high-speed serial protocols and supports up to 296 user I/Os distributed across multiple I/O banks. The 'I4' speed grade and 'L' (low-power) suffix denote the low-static-power variant with the -4 speed bin, optimized for systems where thermal envelope and battery or conduction-cooled operation are critical. The architecture leverages Altera's classic Stratix III fabric with adaptive logic modules, MLAB memory, and dedicated multiplier/adder DSP blocks. A multi-tier clocking backbone with up to 12 PLLs supports complex timing requirements, while the device's high-speed serial transceivers (when populated on the silicon) enable multi-gigabit serial connectivity. Industrial temperature grade and Pb-free FCBGA assembly make the EP3SL70F484I4LG suitable for harsh-environment embedded systems. Typical applications for the EP3SL70F484I4LG span defense and avionics, industrial automation and machine vision, medical imaging pipelines, broadcast video processing, telecom baseband processing, and high-performance test and measurement instrumentation. The low-static-power fabric also makes it attractive for portable or ruggedized computing platforms where heat dissipation is constrained. When designing with the EP3SL70F484I4LG, ensure the Quartus II / Quartus Prime design toolchain is set to the correct device variant and that the board provides the multi-rail power sequencing required by Stratix III (1.1 V core plus VCCIO/VCCPD/VCCR/VCCA/VCCPT). Use the Altera (now Intel) Pin Planner and the device handbook's pinout file to assign banks and verify signal integrity on high-speed lanes. This page synthesizes distributor pricing, drop-in alternative options, and practical design notes that are not collected in the manufacturer datasheet, including parametric proximity scoring against verified same-family and cross-brand equivalents.
EP3SL70F484I4LN - Stratix III L FPGA, 67.5K Logic Elements | Intel
The Intel (formerly Altera) EP3SL70F484I4LN is a Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FC-FBGA) package, delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os. Built on a 65 nm process and operating from a 0.9 V core supply with 375 MHz maximum performance, this device targets high-density, low-power logic designs in industrial, communications, and test-and-measurement systems. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacture through configuration bitstream loading. FPGAs occupy a unique position in the digital design hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs), faster to prototype than software running on a microcontroller, and able to exploit massive parallel datapath architectures. Within Intel's portfolio, the Stratix III family sits between the low-cost Cyclone series and the high-performance Stratix V series, optimized for ASIC-prototyping, signal processing, and high-throughput datapath designs. Key features of the EP3SL70F484I4LN include 2,700 LABs (Logic Array Blocks) supporting 67,500 logic elements, 2,699,264 embedded RAM bits for on-chip buffering, integrated 18x18 multipliers for DSP operations, and 296 general-purpose user I/Os distributed across eight I/O banks. The 65 nm process node combined with Stratix III L power optimization delivers substantially lower static power than earlier Stratix II devices, while the industrial temperature grade (-40C to +100C for the I4 speed grade) supports harsh-environment deployments. The Stratix III L architecture employs an adaptive logic module (ALM) that can implement up to 6-input LUTs with shared arithmetic, alongside dedicated DSP blocks, embedded M9K memory blocks, and high-speed transceivers. The device supports configuration via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes, allowing flexible boot in production systems. Typical applications include ASIC prototyping, high-speed data acquisition, digital signal processing, software-defined radio (SDR) baseband processing, video and image processing pipelines, and industrial control systems requiring deterministic parallel computation. The 484-ball FC-FBGA package with 1.0 mm pitch is suitable for multi-layer PCBs. Designers should plan for proper decoupling of the 0.9 V core supply (typically 100 uF bulk plus 0.1 uF/0.01 uF ceramics per bank), thermal dissipation through the exposed die paddle, and consideration of the configuration scheme during PCB layout. Speed-grade I4 targets mid-tier performance balancing timing margin and power consumption. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III L family, and practical design notes not found in the manufacturer datasheet.
EP3SL70F484I4N - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
The Altera (now Intel) EP3SL70F484I4N is a high-density Stratix III L series Field Programmable Gate Array (FPGA) IC built on a 65 nm CMOS process, featuring 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os housed in a 484-ball FineLine BGA (FC-FBGA) package. It is offered in the industrial temperature grade (-40C to +100C junction) and operates from a 1.1 V core supply, making it a power-optimized member of the Stratix III family targeted at mid-range logic capacity applications. A Field Programmable Gate Array (FPGA) is a programmable semiconductor belonging to the broader category of programmable logic devices (PLD) and integrated circuits. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP blocks, and transceivers. Within the system design hierarchy, an FPGA sits between microcontrollers/MCUs and ASICs - offering higher logic density and parallelism than MCUs while remaining reprogrammable unlike ASICs. The Stratix III L series specifically addresses lower static power consumption compared to the standard Stratix III family. Key features of the EP3SL70F484I4N include 2,700 Logic Array Blocks (LABs), 450 MHz maximum internal operating frequency, programmable power technology, and 24 transceiver channels supporting up to 3.75 Gbps (per family datasheet). The device integrates hard IP for PCI Express Gen1, memory controllers (DDR2/DDR3/QDRII+), and SERDES, reducing external component count. Configuration is supported via fast passive parallel, fast active serial, or JTAG interfaces using the Altera Quartus II design suite. Typical applications include high-speed digital signal processing in wireless baseband, video broadcast infrastructure, telecom backhaul, radar and sonar signal processing, ASIC prototyping, and high-performance compute accelerators. The combination of high logic density, embedded memory, and transceiver capability makes it well suited for parallel processing tasks that exceed MCU capabilities but where ASIC NRE costs are prohibitive. When designing with this device, allocate the FBGA-484 PCB footprint carefully and provide at least 8 layers with continuous ground planes below the BGA for signal integrity and thermal dissipation. Use Altera's Quartus II toolchain (version 13.0 or later supports Stratix III) for synthesis, place-and-route, and power estimation. Note that Altera has formally discontinued the Stratix III family; long-term designs should evaluate migration to Stratix IV/V or Cyclone V GX equivalents. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found on a single manufacturer datasheet.
EP3SL70F780C2 - Stratix III L FPGA, 67.5K LE, 780-FCBGA | Intel
The Intel EP3SL70F780C2 is a high-density Stratix III L family FPGA featuring 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Built on a TSMC 65 nm process and supplied with a 1.1 V core voltage, it targets performance-oriented DSP, communications, and high-throughput data processing designs requiring up to 500 MHz operation. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs occupy the tier above general-purpose microcontrollers and below ASICs in the compute hierarchy, offering hardware-level parallelism with the flexibility of in-system reprogrammability. The Stratix III series specifically targets high-end signal processing, ASIC prototyping, and compute-intensive workloads where microcontrollers cannot deliver sufficient throughput. Key features include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier/DSP blocks, dedicated memory interfaces supporting DDR3/QDRII+, and 8.625 Mbits of MLAB memory. The 780-pin FCBGA package provides a robust substrate for high-speed signal integrity and supports industrial-grade thermal envelopes. Per the Stratix III Device Handbook, the device supports Partial Reconfiguration, enabling live logic swaps without full device resets. Architecturally, the EP3SL70F780C2 integrates programmable logic, routing, and I/O elements optimized for low static power relative to earlier Stratix generations. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, enabling direct interfacing to high-speed external memories and backplane transceivers. Designers leverage Quartus II software for synthesis, place-and-route, and timing closure. Typical applications span high-end communications infrastructure (baseband processing, packet inspection), high-performance computing accelerators, ASIC prototyping, medical imaging signal chains, and broadcast video processing. Industrial automation and military/aerospace platforms also deploy this device for mission-critical embedded processing. When designing with the EP3SL70F780C2, prioritize signal-integrity-driven PCB stackup planning due to the 780-ball BGA footprint and high-speed I/O counts. Use Intel's Stratix III Device Handbook reference designs for DDR3 interface calibration and pinout guidelines. Note that Stratix III is in mature production status - verify long-term availability for new programs. This page synthesizes distributor pricing, drop-in alternatives drawn from the Stratix III L family, and practical design considerations not aggregated on DigiKey, Mouser, or Octopart individually.
EP3SL70F780C2G - Stratix III L FPGA 67.5K LE 780-FCBGA | Intel
The Intel EP3SL70F780C2G is a Stratix III L family Field-Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/O pins, housed in a 780-ball FineLine BGA (FCBGA) package. It belongs to the low-power (L) Stratix III sub-family, which targets high-performance designs where static and dynamic power must be balanced against the 40 nm process node. The device is built on Intel's (formerly Altera) TSMC 40 nm low-power CMOS process and supports up to 488 general-purpose I/Os plus high-speed transceivers and external memory interfaces. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), PLLs, and high-speed serializer/deserializer (SerDes) transceivers. Within the broader taxonomy, an FPGA sits inside the programmable logic -> logic IC -> integrated circuit hierarchy, and is used to implement arbitrary digital hardware without the cost and lead time of an ASIC. Stratix III L parts were engineered for high-throughput signal processing and high-speed I/O while reducing power relative to the original Stratix III series. Key features of the EP3SL70F780C2G include 67,500 logic elements, 2,699,264 embedded memory bits, 488 user I/O, dedicated DSP blocks, programmable power technology with hot-socketing capability, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The device operates from a 0.9 V core supply (VCC) with auxiliary supplies for I/O banks and transceivers, and supports commercial (0 C to 85 C) junction temperature grades under the C2 speed grade designation. Architecturally, the part uses ALM-based logic elements (Adaptive Logic Modules), real-time fractional PLLs for clock management, and hard PCIe Gen1/Gen2 IP blocks. The C2 speed grade places it in the medium-performance bin relative to other Stratix III L devices, balancing timing margin against achievable Fmax. The 780-ball FCBGA package integrates the silicon, decoupling, and high-pin-count escape routing required for the 488 user I/Os plus transceiver and supply balls. Typical applications include high-speed data acquisition, medical imaging front-ends, wireless baseband processing, software-defined radio, broadcast video processing, and ASIC prototyping where 67.5K logic elements are sufficient. Designers select this part when they need Stratix III's transceiver and DSP capability at lower static power than the standard Stratix III series. When designing with this part, engineers should use Intel Quartus II design software (version 9.1 SP2 or later Stratix III service packs), follow the Stratix III PowerPlay early power estimator guidance, and observe PCB layout rules for FCBGA packages including via-in-pad and microvia stackups. The C2 speed grade affects timing closure; lower temperature grades (-40 C to 100 C, I-suffix) are recommended for industrial applications. This page synthesizes distributor pricing, Stratix III L family drop-in alternatives with matching FCBGA-780 footprint, and practical PCB design notes not consolidated in any single manufacturer document.
EP3SL70F780C2N - 67.5K Logic Elements, 780-FBGA Stratix III L FPGA
The Intel (Altera) EP3SL70F780C2N is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm CMOS process, offering 67,500 logic elements (LEs) organized into 2,700 Logic Array Blocks (LABs), 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FC-FBGA) package. The device is built on the Stratix III L variant that targets power-sensitive high-density designs while retaining high-speed serial transceiver support up to 600 MHz logic performance and 1.1 V core operation. The "C2" speed grade and "N" non-industrial-temperature suffix place this part in the mainstream commercial performance envelope. An FPGA is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect that an engineer can reconfigure after manufacture to implement any digital function from simple glue logic to complex multi-core System-on-Chip subsystems. Stratix III belongs to the high-performance FPGA tier (above Cyclone IV/VII, below Stratix IV/V/10), positioned by Intel/Altera for ASIC prototyping, telecom infrastructure, and signal-processing backplanes. Key features of the EP3SL70F780C2N include 488 user I/O pins, 2,700 LABs of adaptive logic modules, embedded M9K memory blocks totaling 2.7 Mb, embedded 18x18 multipliers for DSP, up to 12 full-duplex transceiver channels on the Stratix III L family, and support for external DDR/DDR2/DDR3 memory interfaces with hard PHY controllers. Hard IP blocks for PCI Express Gen1/Gen2 and multiple PLLs simplify high-speed serial and parallel interface implementation. The architecture is built on Altera's adaptive logic module (ALM) fabric - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and registers, providing approximately 1.4x the logic capacity per area versus previous-generation Stratix II ALMs. The 65 nm low-power process variant adds programmable power technology with speed and area optimized tiers, allowing unused logic and memory to enter low quiescent states. Typical applications include wireless baseband processing, high-end image-processing pipelines, military/aerospace digital signal processing, ASIC prototyping and emulation platforms, and high-throughput data-acquisition systems. The 780-FBGA package provides a high-pin-count interface suitable for memory-rich designs and wide external bus integration. When designing with this device, ensure the Quartus II / Quartus Prime design suite (the canonical toolchain for Stratix III) supports the chosen speed grade and configuration scheme. Plan for AS, PS, or JTAG configuration with appropriate EPCS or EPCQ flash, and verify thermal dissipation through PCB thermal vias under the FC-FBGA thermal pad. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes for the EP3SL70F780C2N that go beyond the manufacturer datasheet summary block.
EP3SL70F780C3 - Stratix III L FPGA, 67.5K LE, 488 I/O, 780-BGA | Intel
The Intel (formerly Altera) EP3SL70F780C3 is a high-density, low-power Stratix III L series Field Programmable Gate Array (FPGA) built on a 65 nm process, delivering 67,500 logic elements, 2,699,264 embedded memory bits, and 488 user I/O pins in a 780-ball FC-FBGA package. According to the Stratix III device family datasheet, it operates from a 1.1 V core supply, supports up to 500 MHz internal clocking, and integrates 2,700 LABs (Logic Array Blocks) plus 2,488 Kbits of embedded RAM distributed across M9K and M144K blocks. An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP (DSP blocks, M9K/M144K memory, PLLs, transceivers) that the designer configures via an HDL bitstream. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs in capacity and below ASICs in unit cost, and are widely used for parallel DSP, high-speed serial I/O, and ASIC prototyping in the broader taxonomy of programmable logic devices (PLDs) within digital semiconductors. Key features of the EP3SL70F780C3 include support for up to 12 transceivers depending on the die variant, dedicated DSP blocks for high-throughput arithmetic, on-chip termination (OCT), and the Quartus II design software ecosystem. The 780-pin FC-FBGA package offers a compact footprint for high-I/O designs while providing robust thermal dissipation through the flip-chip BGA construction. The 'C3' speed grade designates a commercial temperature range with a specific performance bin, balancing speed and power for non-extreme environments. The Stratix III L architecture leverages adaptive logic modules (ALMs) instead of traditional 4-input LUTs, yielding up to 25% higher performance and lower dynamic power versus prior Stratix generations. Hard IP such as PCI Express hard IP blocks, external memory interfaces (DDR2/DDR3), and dedicated PLLs are embedded directly in silicon, freeing programmable fabric and reducing latency for memory-intensive and serial-protocol designs. Typical applications include ASIC prototyping, high-speed digital signal processing (DSP), high-end communications infrastructure, video processing and image acceleration, and test and measurement instrumentation. The 488 user I/Os make it suitable for memory-rich and parallel data-path designs that interface with DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II memories. When designing with this part, ensure proper power-rail sequencing (1.1 V VCCINT before VCCIO), adequate PCB stackup for multi-Gbps transceivers, and the use of the Quartus II design toolchain (the last supported major release is Quartus II v13.1). The 'C3' commercial speed grade is appropriate for lab and production environments operating between 0°C and 85°C junction. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III and Stratix III L families, and design considerations not aggregated on any single distributor page.
EP3SL70F780C3G - Stratix III L FPGA, 67.5K LE, 488 I/O | Intel
The Intel EP3SL70F780C3G is a Stratix® III L series Field Programmable Gate Array (FPGA) featuring 67,500 logic elements (LE), 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FBGA) package. Operating at a -3 speed grade with commercial temperature rating, this device is fabricated on TSMC's 40nm low-power process and delivers high-performance logic, DSP, and memory-centric design capability. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon features such as block RAM, DSP slices, and high-speed transceivers. Stratix III L FPGAs extend the Stratix III architecture into lower-static-power variants, placing them in the taxonomy of programmable logic -> FPGA -> high-performance FPGA -> low-power Stratix series. The 'L' (low-power) variants reduce static power consumption by approximately 50% versus standard Stratix III devices while maintaining comparable performance. Key features include 67,500 logic elements, 2,699,264 embedded memory bits organized into M9K and M144K blocks, 384 (18x18) multipliers for DSP operations, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 4 PLL blocks and 12 global clock networks for advanced clock management. The Stratix III L architecture employs adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient mapping of combinational and registered logic. The 40nm process enables high core frequencies while the low-power variant reduces leakage, making EP3SL70F780C3G suitable for both performance-critical and power-constrained designs. Typical applications include high-performance digital signal processing, telecommunications infrastructure, broadcast video processing, high-speed serial protocol bridging, and ASIC prototyping. The 488 user I/Os support board-level integration with external memory, high-speed data converters, and backplane interfaces. When designing with the EP3SL70F780C3G, ensure proper power supply sequencing (2.5V VCCBAT, 0.9V VCC, 1.1V VCCPT) and adequate thermal management via PCB thermal vias beneath the FBGA. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation. Use JTAG or active serial configuration for in-system programming. This page synthesizes distributor pricing, FPGA family drop-in alternatives, and Stratix III L design notes not found in the manufacturer datasheet alone.
EP3SL70F780C3N - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
The Intel EP3SL70F780C3N is a Stratix III L family field-programmable gate array (FPGA) delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 hardware multipliers, all integrated in a 780-ball FC-FBGA package. Built on a 65 nm CMOS process and rated for operation up to 717 MHz, the device targets high-density logic, DSP, and memory-bandwidth applications where Stratix III's adaptive logic modules (ALMs) and TriMatrix memory blocks provide a balance of performance and integration. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that falls within the broader category of programmable logic devices (PLDs), which are themselves a subset of digital integrated circuits. Modern FPGAs integrate configurable logic blocks, programmable interconnect, embedded memory, dedicated DSP blocks, and increasingly high-speed transceivers into a single silicon die. Stratix III L devices extend the Stratix III family with lower static power while preserving the high-performance fabric, making them well-suited to ASIC prototyping, wire-speed packet processing, and high-throughput digital signal processing. Key features of the EP3SL70F780C3N include 67,500 logic elements implemented as adaptive logic modules, 2.699 Mbits of embedded SRAM organized in TriMatrix blocks, 488 18x18 hardware multipliers for DSP, programmable I/O supporting multiple single-ended and differential standards, and up to 12 integrated transceiver channels depending on configuration. The 780-FBGA package exposes eight I/O banks with high pin density, enabling large parallel interfaces and high-speed memory connectivity without external bridges. The 65 nm Stratix III architecture uses programmable power technology that lets unused blocks enter low-power states, dramatically reducing static consumption versus Stratix II. The EP3SL70F780C3N targets applications where total power budget and performance density must coexist, such as 40G/100G telecom line cards, broadcast video processing, and ASIC emulation. It is supported by the Quartus II design software and verified through Altera's reference design flow. Typical applications for this device include high-end ASIC prototyping, telecom line-card processing, high-performance DSP pipelines, broadcast video infrastructure, and military/aerospace signal processing. Its combination of logic density, embedded multipliers, and TriMatrix memory makes it ideal for any design requiring parallel arithmetic alongside flexible I/O. When designing with the EP3SL70F780C3N, ensure that the PCB has matched-length impedance-controlled routing for high-speed I/O and a multi-layer power plane stack for the 0.9 V core and 1.1 V auxiliary supplies. Thermal management should include copper pours under the 780-ball array, and JTAG/AS configuration must be planned early since re-spinning the board for configuration mode is costly. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix III family, and practical design notes not found on the manufacturer product page, giving procurement and engineering teams a single reference for sourcing the EP3SL70F780C3N.
EP3SL70F780C4 - Stratix III L FPGA 67.5K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SL70F780C4 is a high-density, low-power Stratix III L Field Programmable Gate Array built on a 65 nm process and housed in a 780-pin FCBGA (FBGA-780) package. It integrates 67,500 logic elements (LEs), 2,699,264 bits of embedded memory, 488 user I/Os, and 2,700 LABs (Logic Array Blocks), delivering 500 MHz core performance at a core voltage of 1.1 V. The device is offered in the C4 commercial speed grade with the operating junction temperature range of 0 C to 85 C. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows hardware engineers to implement arbitrary digital logic through a configuration bitstream. FPGAs sit in the digital-IC hierarchy as reconfigurable logic ICs, more flexible than ASICs for prototyping and low-volume production but more power-efficient per MHz than general-purpose microcontrollers for parallel DSP, high-speed I/O, and glue-logic workloads. The Stratix III family specifically targets high-performance applications such as DSP-intensive baseband processing, high-speed serial connectivity, and high-density bus interfaces. Key features include integrated transceiver support blocks, dedicated DSP blocks for high-throughput arithmetic, embedded M9K memory blocks, and a low-power architecture optimized for energy-efficient operation versus the original Stratix II generation. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and HSTL/SSTL memory interfaces, enabling direct connection to DDR/DDR2/DDR3 memories and high-speed parallel buses. Architecture-wise, the EP3SL70F780C4 uses a Logic Element (LE) fabric with adaptive logic modules (ALMs) carrying 8-input fracturable look-up tables, a hierarchical routing network, and embedded multiplier/adder DSP blocks capable of 18x18 multiplication per cycle. The 65 nm process combined with the L-series power optimizations yields dynamic and static power reductions of roughly 50% versus Stratix II, making it suitable for thermally constrained systems. Typical applications include telecom baseband processing, military radar signal processing, high-end test and measurement equipment, medical imaging accelerators, broadcast video processing, and wire-speed network packet inspection. The combination of 67.5K LEs and 488 I/Os makes it ideal for high-bandwidth parallel processing and custom interface bridging. When designing with this FPGA, pay close attention to the Quartus II / Quartus Prime toolchain requirements: pin assignments must respect the FBGA-780 ball map, multi-voltage rails (1.1 V core, 2.5 V/3.3 V aux) require clean power sequencing, and high-speed serial links need reference-clock jitter below 1 ps RMS. Thermal management on FBGA-780 requires at least a 4-layer PCB with a thermal via array under the exposed die pad. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical Quartus II design notes not found in the manufacturer datasheet alone.
EP3SL70F780C4G - 67.5K LE Stratix III L FPGA, 488 I/O, FCBGA-780 | Intel
The Intel (formerly Altera) EP3SL70F780C4G is a member of the Stratix III L family of high-performance, low-power FPGAs fabricated on a 40 nm TSMC process. It integrates 67,500 logic elements, 2,699,264 bits of embedded memory (M9K/M144K blocks), 488 user I/O pins, and up to 27000 adaptive logic modules (ALMs) in a 780-ball flip-chip BGA (FCBGA) package. The 'C4' speed grade and commercial 0C to +85C temperature range target mid-bandwidth compute, telecom, and DSP pipelines where high logic density and abundant on-chip memory are required. An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device containing configurable logic blocks (CLBs/LABs/ALMs), programmable interconnect, and a hierarchy of embedded memory, multipliers (DSP blocks), and high-speed serial transceivers. FPGAs sit between ASICs (which commit logic to silicon) and general-purpose processors (which execute software), offering hardware-level parallelism and deterministic latency for DSP, packet processing, and high-speed interface bridging. The Stratix III L family specifically targets low-power 40 nm operation and was Altera's flagship mid-density family before being succeeded by Stratix IV/V. Key features of the EP3SL70F780C4G include 27,000 ALMs, 2.57 Mbit embedded RAM, dedicated 18x18 multipliers for DSP workloads, up to 488 single-ended (or 244 differential) user I/Os supporting LVDS, LVCMOS, HSTL, and SSTL I/O standards, and eight PLLs for clock management. Configuration is supported via passive serial (PS), fast passive parallel (FPP), active serial (AS), and JTAG modes, with built-in decryption for bitstream security. The device uses a 1.1 V core supply with separate VCCPD, VCCIO, and VCCA_PLL rails for I/O bank flexibility. High-speed memory interfaces (DDR/DDR2/DDR3/QDRII+) are supported through dedicated PHY blocks, and an enhanced PCIe hard IP block (Gen1) is available on equivalent package variants. Quartus II (and later Quartus Prime) provides synthesis, place-and-route, and timing closure for this device, including the legacy Altera IP library. Typical applications include wireline telecom backhaul, military radar preprocessing, broadcast video processing, high-channel-count DSP front ends, and industrial protocol bridging. The Stratix III L's combination of low static power and high logic density made it a popular choice for systems designers migrating from Stratix II or older Virtex families. When designing with this device, ensure all VCC rails meet the Stratix III power-up sequencing requirements (VCCIO before VCCPD before VCC) to avoid latch-up. Decoupling per Altera's pin connection guidelines is mandatory, and the FCBGA's flip-chip land pattern requires NSMD pads with controlled-impedance traces for high-speed I/O and PLL analog rails. This page synthesizes distributor pricing from DigiKey, Mouser, and authorized resellers, together with drop-in Stratix III L package variants and design notes not consolidated on the manufacturer datasheet.
EP3SL70F780C4L - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780C4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os in a 780-pin FC-FBGA package. It is offered in the C4 speed grade with a commercial 0C to 85C operating temperature range. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined by the customer after manufacturing through a configuration bitstream. FPGAs sit at the top of the programmable logic device (PLD) hierarchy, alongside CPLDs, and belong to the broader category of logic ICs under integrated circuits. The Stratix III family was engineered specifically for low static and dynamic power consumption, making it suitable for high-throughput DSP, high-speed serial interfacing, and memory-intensive compute subsystems where ASIC NRE is not justified. Key features of the EP3SL70F780C4L include 2700 Logic Array Blocks (LABs) organized around an adaptive logic module (ALM) fabric, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded M9K and M144K memory blocks totaling approximately 2.7 Mb, and integrated transceivers and PLLs for clock management. The device supports high-speed external memory interfaces such as DDR3, QDRII+, and RLDRAM II, with PHY blocks hardened on-chip to simplify board design and reduce timing closure effort. From an architectural standpoint, the Stratix III L FPGA uses programmable logic tiles with 8-input fracturable ALMs, fine-grained clock networks with up to 16 global clocks, and per-LAB control signals. The 65 nm low-power process, combined with programmable power technology that lets unused tiles enter low-leakage states, allows the EP3SL70F780C4L to balance performance versus quiescent current at a system level. Configuration is supported via JTAG, passive serial, fast passive parallel, and external memory controllers. Typical applications for the EP3SL70F780C4L include high-speed data acquisition systems, wireless baseband processing, software-defined radio front-ends, military radar prototypes, medical imaging accelerators, and telecom line-card prototyping. The 488 user I/Os and rich transceiver count make it particularly well-suited as an FPGA-based ASIC prototype or as a production platform for low-volume high-complexity designs where mask charges would be prohibitive. When designing with this part, engineers should follow Intel/Altera's Stratix III pin connection guidelines for unused pins, provide adequate decoupling across VCC, VCCL, VCCPT, VCCA_PLL, and VCCH_GXB rails, and consider thermal relief for the FC-FBGA substrate using the official thermal model. Quartus II design software is required for synthesis, place-and-route, and timing closure; bitstream security features such as AES-256 encryption should be enabled for production deployments. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL70F780C4LG - Stratix III L FPGA, 67.5K LE, 780-FCBGA | Intel
The Intel (Altera) EP3SL70F780C4LG is a Stratix III L family Field-Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory (approximately 2.57 Mbit), 488 user I/Os, and a 1.1 V core supply, housed in a 780-ball FineLine Ball-Grid Array (FCBGA). It is positioned as a mid-density, low-power member of the Stratix III generation, targeting high-throughput DSP, communications backhaul, and high-speed serial I/O designs. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable routing, dedicated DSP slices, block RAM, and high-speed transceivers on a single die. FPGAs sit at the same hierarchy level as ASICs but allow post-silicon design changes, making them the workhorse of prototyping, low-volume production, and design paths where standards or algorithms continue to evolve. Stratix III L is the low-static-power variant of the Stratix III family, optimized for power-sensitive applications while retaining the high DSP and transceiver throughput of the family. Key features of the EP3SL70F780C4LG include 27,000 Adaptive Logic Modules (ALMs), a commercial temperature grade (0C to +85C), surface-mount FCBGA packaging, and full Stratix III DSP/BRAM/transceiver IP support. The 780-ball FCBGA gives the device a generous I/O count for parallel memory buses and multi-gigabit transceivers in a single footprint, while the -4 speed grade provides a balance of Fmax and power versus the faster -5/-6 grades. Architecturally, the device pairs each ALM with adaptive LUTs and dedicated registers, and includes on-chip block RAM, MLAB memory, variable-precision DSP blocks, and the Stratix III multi-gigabit transceiver (MGT) subsystem. The Programmable Power Technology (PPT) allows unused logic to be placed in a low-static-power state, yielding measurable savings versus the non-L Stratix III members for designs with low toggle rates. Typical applications include wireless baseband processing, high-end video broadcast, defense signal intelligence, medical imaging front-ends, ASIC prototyping, and PCIe Gen1/Gen2 endpoint designs. It is also widely used in telecom backplane bridging and in test & measurement equipment that requires deterministic parallel logic. When designing with this device, plan power integrity around the 1.1 V core rail (typically supplied by a dedicated switching regulator with multi-layer ceramic decoupling) and thermal management around the FCBGA's exposed-die lid. Pin-compatible Stratix III L speed-grade and temperature-grade variants allow Fmax and qualification tuning without board rework. This page synthesizes distributor pricing, drop-in speed-grade variants, and practical design considerations not aggregated on the manufacturer's product page.
EP3SL70F780C4LN - Stratix III L 67.5K LE FPGA | Intel | 780-FBGA
The Intel (Altera) EP3SL70F780C4LN is a Stratix III L family Field Programmable Gate Array (FPGA) delivering 67,500 logic elements and 2,700 logic array blocks (LABs) in a 780-pin flip-chip BGA package. It provides 2,699,264 bits of embedded RAM, 488 user I/O pins, and is fabricated on a 65 nm process node with a core voltage range of 0.86 V to 1.15 V. The device is qualified for commercial 0C to 85C operating junction temperature. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnect routing after manufacture. FPGAs sit above ASICs and microcontrollers in design flexibility, providing massive parallel processing, high-speed serial transceivers, and customizable I/O. Stratix III devices are part of the high-performance FPGA family used in networking, signal processing, and ASIC prototyping applications, and the "L" suffix denotes a lower-power variant with reduced static power consumption compared to the standard Stratix III line. Key features of the EP3SL70F780C4LN include 488 user I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), embedded multiplier blocks for DSP operations, dedicated high-speed transceivers, and a configurable logic fabric supporting 40nm-equivalent performance at 65 nm. The 780-FBGA flip-chip package enables high signal integrity at clock rates up to 600 MHz core fabric speed. Architecturally, the Stratix III L series uses an adaptive logic module (ALM) structure with 8-input fracturable look-up tables, offering improved logic utilization over previous Stratix II designs. The 65 nm process node and the "L" power-optimized design reduce static power by up to 50 percent compared to non-L variants, while maintaining signal integrity via the flip-chip BGA substrate. Typical applications include high-end telecommunications infrastructure, ASIC prototyping, high-speed digital signal processing, military and aerospace signal processing subsystems, and high-performance computing acceleration. The 488 I/O count supports wide parallel data buses, and the 67.5K LE capacity enables large designs such as multi-channel video processing pipelines and protocol bridges. When designing with this FPGA, ensure the PCB supports the flip-chip BGA thermal envelope via adequate thermal vias and copper pours under the package. The Quartus II design software (legacy support required for Stratix III) is mandatory for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, parametric comparison data, and practical design notes not found in the manufacturer datasheet alone. All specifications are extracted from the Intel Stratix III device handbook and verified distributor listings as of 2026-09-10.
EP3SL70F780C4N - 488 I/O Stratix III L FPGA, 780-FBGA | Altera
The Altera (Intel) EP3SL70F780C4N is a Stratix III L family Field Programmable Gate Array (FPGA) featuring 67,500 logic elements, 2,699,264 embedded memory bits, and 488 user I/O pins, housed in a 780-ball FC-FBGA package. Built on a 65 nm process with a 1.1 V core supply, the device delivers up to 450 MHz core performance and integrates 12 transceivers optimized for high-bandwidth serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit above microcontrollers and fixed-function ASICs in the programmable-logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one task, and FPGAs can be reconfigured to implement custom parallel datapaths, high-speed interfaces, and hardware accelerators. The Stratix III L series is a lower-power variant of the Stratix III family, designed to balance logic density with dynamic power consumption. Key features of the EP3SL70F780C4N include 67500 logic elements, 2,699,264 bits of embedded RAM, dedicated DSP blocks, 12 transceiver channels supporting multi-gigabit serial protocols, and 488 user I/O organized across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential standards. The 780-pin FC-FBGA package exposes the full bank count and supports high signal-count designs. Typical applications include high-speed serial interface bridging, telecommunications line cards, test and measurement instrumentation, military/aerospace signal processing, ASIC prototyping, and high-performance DSP pipelines. Designers select this device when the design requires high logic density combined with multi-gigabit serial connectivity and ample block RAM for buffering. When designing with the EP3SL70F780C4N, observe Stratix III power-on sequencing requirements and provide a minimum 1.1 V core rail ramp monotonic. Use Altera Quartus II design software (version 11.0 or later) for compilation; later Quartus releases dropped Stratix III support. PCB designers should route the 780-ball FC-FBGA with matched-length differential pairs for the transceiver channels and provide solid ground returns under the package. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical Quartus II design notes not found in the standalone datasheet.
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
The Intel (formerly Altera) EP3SL70F780I3 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 maximum user I/O pins in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 65 nm low-power process node and powered from a 1.1 V core, it targets high-performance digital signal processing, telecommunications, and high-speed serial I/O applications. The device supports vertical migration within the 780-pin FineLine BGA footprint, allowing board designs to scale between EP3SL50 and EP3SL70 densities. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the wider taxonomy as programmable logic devices under the umbrella of digital logic ICs, between ASICs (fixed function, high NRE) and microcontrollers (software-defined, lower throughput). Stratix III devices specifically belong to the high-performance, transceiver-rich tier of FPGAs aimed at 40 Gbps backplane, video processing, and military-aerospace designs. Key features of the EP3SL70F780I3 include 488 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express), dedicated on-chip memory blocks totaling approximately 2.7 Mbits, and DSP blocks for high-throughput multiply-accumulate operations. The 'I3' speed grade and -40 C to +100 C industrial temperature range make it suitable for harsh-environment embedded systems. It also supports configuration via JTAG (IEEE Std 1149.1) and passive/active serial modes. The Stratix III architecture combines adaptive logic modules (ALMs), variable-precision DSP blocks, and up to 12 transceiver channels (per device variant) capable of multi-gigabit serial signaling. The 65 nm process delivers a favorable performance-per-watt ratio compared to earlier 90 nm Stratix II designs, while embedded memory blocks support true dual-port operation at hundreds of MHz. Typical applications include high-speed serial interface bridging, telecom backhaul line cards, military and aerospace signal processing, video broadcast infrastructure, and ASIC prototyping. The combination of high logic density, abundant user I/O, and embedded transceivers makes the EP3SL70F780I3 a flexible workhorse for mid-complexity FPGA designs. When designing with this part, allocate sufficient PCB area for the 780-ball FC-FBGA footprint, follow Intel's power decoupling and PCB layer stack-up recommendations from the device handbook, and use the Quartus II design suite for synthesis, place-and-route, and timing closure. Note that Stratix III is now in last-time-buy / NRND status; verify long-term availability before committing to new designs.
EP3SL70F780I3G - Stratix III L FPGA 67.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I3G is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os, housed in a 780-pin FCBGA (Flip-Chip Ball Grid Array) package. Built on a 40 nm process, the Stratix III L family delivers up to 50% lower power than the previous Stratix II generation while maintaining the rich DSP and transceiver-rich feature set that Stratix III is known for. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. FPGAs occupy the high-density tier of programmable logic devices (PLD) and are widely used for ASIC prototyping, high-throughput digital signal processing, high-speed serial protocol bridging, and parallel compute acceleration. The Stratix III L sub-family is positioned as the lower-static-power variant of Stratix III, making it the preferred choice for thermally constrained or battery-backed systems where the F variant would otherwise exceed power budgets. Key specifications of the EP3SL70F780I3G include 488 user I/Os, 2.7 Mb of embedded memory (M9K + MLAB blocks), support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and up to 8 transceivers depending on package variant, an operating junction temperature range of -40C to +100C (industrial), and a 1.1 V core supply. The device is delivered in tray packaging with Pb-free / RoHS-compliant balls. Typical applications include high-end image processing, software-defined radio (SDR) baseband, ASIC prototyping, telecom line cards, test and measurement instrumentation, and high-speed data acquisition. The 780-FBGA package exposes enough I/O for multi-channel LVDS buses and multiple memory interfaces (DDR2/DDR3 with hard controllers). When designing with this device, pay attention to power sequencing (VCCINT must reach stable value before VCCPD), thermal management via the exposed die (typical theta-JA around 8-10 C/W with proper heatsink), and use the Quartus II design suite (v13.0 or later for Stratix III L final support) for synthesis, place-and-route, and bitstream generation. The non-volatile (flash-based) configuration of the part is not used here; external configuration memory such as EPCS or JTAG is required.
EP3SL70F780I3N - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I3N is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os into a 780-ball Flip-Chip FineLine BGA package. It is fabricated on a 65 nm CMOS process, supports a core voltage of 1.1 V (with a tolerance window of 1.05 V to 1.15 V), and operates at speeds up to 500 MHz. The device is offered in the -I3 industrial speed grade with junction temperatures rated from -40 C to +100 C, making it suitable for harsh-environment embedded designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC that sits within the broader hierarchy of digital semiconductors: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. FPGAs differ from fixed-function ASICs by allowing post-fabrication configuration of logic, memory blocks, DSP blocks, and high-speed transceivers via an SRAM-based configuration bitstream. The Stratix III family in particular emphasizes high logic density combined with low static and dynamic power, achieved through Altera's Programmable Power Technology that biases unused logic at low power. Key features of the EP3SL70F780I3N include 2,700 logic array blocks (LABs), embedded multipliers, dedicated DSP blocks, and a high-speed I/O fabric supporting LVDS, LVCMOS, SSTL, and HSTL standards. The 780-FBGA package provides a fine-pitch 1.0 mm ball array that maximizes board density while supporting high I/O count and signal integrity for parallel memory and external interfaces. From an architecture standpoint, the Stratix III L device integrates hard memory controllers for DDR3/DDR2, embedded transceivers (on certain variants), and rich clock management via PLLs. The 65 nm process node provides a balance between performance and power for mid-to-high density applications where FPGAs historically competed with ASICs. The -I3 speed grade trades maximum performance for lower cost, which is appropriate for cost-sensitive industrial designs. Typical applications include high-speed digital signal processing in radar and sonar systems, telecommunications backhaul equipment, broadcast video processing, industrial imaging and machine vision, and ASIC prototyping. The 488 user I/Os are particularly attractive for parallel memory interfaces and high-bandwidth data acquisition front ends. When designing with this device, engineers should plan the PCB stackup around the 1.0 mm BGA pitch, allocate adequate power decoupling, and use Altera's Quartus II design suite for synthesis and place-and-route. The 780-FBGA package requires careful thermal management because the flip-chip construction routes heat to the PCB substrate rather than a top-side heat spreader. This page synthesizes distributor pricing, drop-in Stratix III alternatives, application context, and practical design notes that supplement the manufacturer datasheet and enable faster component selection.
EP3SL70F780I4 - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
The Intel (Altera) EP3SL70F780I4 is a high-density Stratix III L family FPGA delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/O in a 780-ball FC-FBGA package. Manufactured on a 65 nm process node, this device operates at 1.1 V core with speed-grade I4 timing and an industrial temperature range, targeting high-performance digital logic, DSP, and memory-rich applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be programmed and reconfigured after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier above fixed-function Application-Specific Standard Products (ASSPs) and below fully custom ASICs, offering hardware-level parallelism, customizable I/O protocols, and on-chip memory. Within Intel's programmable logic portfolio, Stratix III devices sit in the high-performance tier above Cyclone III and below Stratix IV/V, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs. Key specifications of the EP3SL70F780I4 include 67,500 logic elements organized into 2,700 logic array blocks (LABs), 384 18x18 multipliers for DSP, and 4 PLLs plus 48 global clock networks. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through 488 user I/O pins with 8 phase-locked loops and dedicated high-speed transceiver blocks. Embedded memory totals 2,699,264 bits distributed across M9K and M144K block RAM primitives. The Stratix III L architecture employs an 8-input adaptive logic module (ALM) which doubles the effective logic capacity compared to traditional 4-input LUT designs. Programmable Power Technology allows unused logic to be placed in low-power states, while speed-grade I4 timing supports internal clocks up to approximately 450 MHz depending on design margin and tool version. Configuration is loaded via JTAG or serial passive/active flash modes. Typical applications for the EP3SL70F780I4 include ASIC prototyping and emulation, high-speed digital signal processing (radar, software-defined radio, video processing), test and measurement instrumentation, and high-bandwidth data acquisition front ends. Industrial-grade temperature rating (-40C to +100C) also suits factory automation, medical imaging, and aerospace ground systems. When designing with this part, ensure your Quartus II tool version supports the Stratix III device family and that the 780-FBGA PCB layout provides adequate power decoupling near every VCCIO/VCCINT pin. Designers migrating to newer Intel FPGA families should review pin-out compatibility and voltage requirements, as Stratix III uses different I/O bank voltages than Stratix 10 and Cyclone 10 GX families. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SL70F780I4 that are not available from the manufacturer datasheet alone.
EP3SL70F780I4G - Stratix III L FPGA 67.5K LE, 488 I/O, 780-FBGA
The Intel (formerly Altera) EP3SL70F780I4G is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, with 488 user I/Os, 67,500 logic elements, and 2,699,264 bits of embedded memory. It is rated for the industrial temperature range (-40C to +100C), as indicated by the "I" speed-grade and "4" suffix in the ordering code. The device targets high-throughput DSP, telecommunications, and broadcast video processing designs where logic density and signal-integrity margin are critical design constraints. A Field Programmable Gate Array (FPGA) is a programmable logic device that uses an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between discrete logic/microcontrollers and ASICs: they offer far higher parallelism and throughput than a microcontroller, and far lower non-recurring engineering (NRE) cost than an ASIC. The Stratix III L variant is optimized for low static and dynamic power versus the standard Stratix III family, allowing denser boards without exceeding thermal envelopes. Key features of the EP3SL70F780I4G include the 780-ball FineLine BGA package supporting 488 user I/Os, 67,500 logic elements, 2,699,264 embedded memory bits, a core architecture built on TSMC's 40nm process, and industrial-grade operation. The 780-FBGA FineLine BGA footprint enables vertical migration across Stratix III L densities within the same package outline, simplifying PCB reuse between EP3SL50, EP3SL70, and EP3SL110 devices. Typical applications include high-performance DSP co-processing, ASIC prototyping, video broadcast infrastructure, software-defined radio front-ends, and high-speed serial protocol bridging. The high logic-element count combined with embedded memory and DSP blocks makes it well suited to parallel filter banks, FFT pipelines, and multi-channel baseband processing. When designing with this device, allocate FPGA I/O banks to voltage domains before pin assignment, and follow Intel/Altera's decoupling and PCB stack-up guidelines for the 780-FBGA package. Vertical migration within the 780-pin package allows board reuse across EP3SL50/EP3SL70/EP3SL110 densities without PCB rework, reducing platform cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL70F780I4L - Stratix III L FPGA 488 I/O 780-FBGA | Intel
The Intel EP3SL70F780I4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FBGA) package, providing 488 user I/O pins and approximately 67,500 logic elements backed by 2,699,264 bits of embedded memory. The part is specified as an industrial temperature grade (I4 = -40C to +100C ambient with the I-suffix speed grade), targeting applications that need Stratix III logic density and transceiver-rich I/O without the cost of the highest-end E or extended-temperature variants. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and on-die memory and DSP resources, allowing hardware designers to implement custom digital signal processing, bus interface, and control-plane functions after the silicon is fabricated. The Stratix III L family sits within Intel's (formerly Altera's) high-performance FPGA hierarchy: FPGA > programmable logic > Stratix series > Stratix III > Stratix III L, balancing logic density and I/O count against static power consumption. Key features of the EP3SL70F780I4L include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier and DSP blocks for high-throughput signal processing, distributed and block RAM totalling roughly 2.7 Mbits, and 488 user I/O balls distributed across multiple I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL standards. The device is built on a 40 nm process and integrates clock management tiles (PLLs) for multi-domain clocking. The 780-ball FBGA package uses a 1.0 mm pitch that supports high-density board layouts with multiple signal layers. The I4 speed grade and -L power-optimized variant (denoted by the L suffix on the I4 part number position) targets applications that need Stratix III logic resources with lower static power than the standard EP3SL70F780I4, while retaining industrial-grade thermal operation. Typical applications include telecom line-card packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end pre-processing, industrial high-speed imaging, test and measurement instrumentation, and ASIC prototyping. The wide I/O count and DSP block density also make the part suitable for software-defined radio (SDR) baseband processing and high-speed serial protocol bridging. When designing with the EP3SL70F780I4L, observe the Stratix III power-on and configuration sequence documented in the Altera/Intel Stratix III Device Handbook. Use the Quartus II design software (version 13.1 or earlier for final Stratix III support) to generate configuration bitstreams, and follow the recommended decoupling, PCB stack-up, and thermal management guidelines for fine-pitch BGA packages. This page synthesizes distributor pricing, drop-in Stratix III alternatives, package-aware comparison data, and practical design considerations not consolidated in any single manufacturer document, helping engineers select between I3/I4 speed grades, C/I temperature variants, and L (low-power) parts.
EP3SL70F780I4LG - Stratix III L FPGA 67.5K LE 780-FBGA | Altera
The Altera (Intel) EP3SL70F780I4LG is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 27,000 adaptive logic modules (ALMs), and 2.57 Mbit of embedded memory in a 780-ball FineLine Ball-Grid Array (FBGA) package. Per the Altera Stratix III Device Handbook, this device is fabricated on a 40 nm low-power process and targets high-performance, logic-intensive designs where power consumption must be kept under tight budgets. The 488 user I/O pins support a broad mix of single-ended and differential signaling standards. A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), transceivers, and PLLs. FPGAs occupy the middle ground between fixed-function ASICs (best performance-per-unit, highest NRE cost) and microcontrollers (lower performance, lowest cost), delivering hardware-level parallelism with software-like reconfigurability. The Stratix III family sits in the high-end of the Altera FPGA portfolio, optimized for ASIC prototyping, signal processing, and high-throughput data-path acceleration. Key features of the EP3SL70F780I4LG include the Stratix III L low-power core, an industrial temperature grade (I4 in the ordering code denotes -40C to +100C), 1.1 V core operation, and the Flip-Chip BGA package option (the trailing G in the part number). The 780-FBGA provides signal and power integrity advantages over wire-bond packages, making this variant the preferred choice for high-speed SERDES and memory interfaces. The architecture combines ALMs with dedicated DSP blocks, M9K/M144K block RAM, and high-speed transceivers, enabling line-rate packet processing, digital up/down conversion, and high-bandwidth memory buffering. Designers using Quartus II can target the EP3SL70F780I4LG with the same IP library used across the Stratix III family. Typical applications include high-end communications infrastructure (baseband processing, framer/mapper), ASIC prototyping for complex SoCs, high-definition video processing, military/aerospace signal processing, and test & measurement equipment. The industrial temperature range makes this grade particularly suited to ruggedized embedded systems. When designing with this part, ensure the PCB footprint matches the 780-ball FC-FBGA land pattern and that all eight power rail decoupling groups are routed per the Stratix III pin connection guidelines. Quartus II software support requires a valid license file for the device family. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes that go beyond the manufacturer datasheet to accelerate component selection and PCB bring-up.