FPGA & CPLD
Products (7,100+)
EP3SE80F780I4N - Stratix III E FPGA 80K Cells 780-FCBGA | Intel
The Intel EP3SE80F780I4N is a high-performance, low-power Field Programmable Gate Array from the Stratix® III E family, integrating 80,000 logic elements, 488 user I/Os, and up to 6,843,392 bits of embedded memory in a 780-ball FineLine Ball-Grid Array (FCBGA). Manufactured on a 65 nm process node with a 1.1 V core supply, the device targets throughput-critical applications where deterministic performance, abundant DSP blocks, and high-speed transceivers are required. The part operates across the industrial temperature range and is rated for speeds up to 450 MHz fabric operation. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, DSP slices, PLLs, and high-speed transceivers. FPGAs belong to the broader class of programmable logic devices (PLDs), which sit between fixed-function ASICs and software-defined processors in the design hierarchy. The Stratix III E family specifically targets high-end digital signal processing, wireline communications, and military/aerospace systems where Stratix III GX-style transceiver-equipped cousins are not required. Key features include 3,200 Logic Array Blocks (LABs), 488 user I/Os, 6.8 Mbit embedded RAM, embedded DSP blocks for fixed- and floating-point arithmetic, programmable power technology that dynamically scales voltage and frequency per tile, and a comprehensive hard-memory controller subsystem. The 780-ball FCBGA package offers dense board integration with controlled-impedance signal escape, suitable for high-speed parallel interfaces such as DDR3, QDRII+, and RLDRAM II. Multi-gigabit transceivers are absent on the -E sub-family; designs requiring 6 Gbps+ serial links should evaluate Stratix III GX or Stratix IV parts instead. Architecturally, Stratix III E uses the Altera Adaptive Logic Module (ALM) - an 8-input fracturable LUT that can be partitioned into smaller LUTs to improve logic utilization. Combined with the programmable power technology and 65 nm low-power process, the family delivers high DSP throughput at substantially lower dynamic power than the preceding Stratix II. The device supports configuration via passive serial, fast passive parallel, and JTAG, with on-chip decompression and encryption via the advanced encryption standard (AES). Typical applications include high-performance digital signal processing for radar and electronic warfare, wireline backplane aggregation, test and measurement instrumentation, ASIC prototyping, and high-end image processing pipelines. Industrial and defense integrators value the combination of large logic capacity, abundant DSP resources, and military-grade temperature support. When designing with this device, pay close attention to power integrity - the FCBGA requires a multi-layer PCB with dedicated power and ground planes, and decoupling must follow the Stratix III Power Distribution Network design guidelines. Configuration scheme and pin assignments must be locked early in the design cycle because the 780-ball BGA footprint limits PCB rework options. This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not collected in a single place by the manufacturer datasheet alone.
EP3SL110F1152C4N - Stratix III L FPGA, 107.5K LE, 1152-FCBGA | Intel
The Intel EP3SL110F1152C4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) delivering 107,500 logic elements and 4,992,000 bits of embedded memory, housed in a 1152-ball FineLine Ball Grid Array (FCBGA) package. Operating at core speeds up to 500 MHz with 744 user I/O pins, the part is fabricated on a TSMC 65 nm low-power process and is rated for commercial temperature operation. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. Stratix III L is positioned in the Stratix III family hierarchy below the Stratix III E and above the Cyclone III families; it targets mid-density logic designs with low-power focus, with Stratix III E optimized for memory-rich applications and Cyclone III for cost-sensitive low-density designs. Key specifications include 744 maximum user I/O, 4,992,000 embedded RAM bits distributed across M9K and M144K blocks, 432 DSP blocks for fixed- and floating-point arithmetic, and 12 phase-locked loops (PLLs) supporting multiple clock domains. The device supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards across 24 I/O banks, and integrates twelve 3.125 Gbps transceivers for high-speed serial connectivity. The Stratix III L architecture combines 65 nm process geometry with a programmable power technology that enables fine-grained power gating of unused logic, fabric, and transceivers. This results in static power roughly 50% lower than the prior Stratix II generation. The device integrates hard memory controllers, PCIe hard IP, and 8-input adaptive logic modules (ALMs) that implement any 6-input LUT plus two registers, maximizing logic utilization at the highest density. Typical applications include high-performance DSP for wireless baseband, radar and imaging signal processing, high-speed protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), ASIC prototyping, and test and measurement instrumentation. The device is widely used in defense, aerospace, and high-performance computing domains where logic density and signal-integrity performance outweigh power and unit cost. When designing with this part, ensure PCB layout follows Intel's FCBGA escape routing guidelines for the 1.0 mm ball pitch, including microvia stack-ups and matched-length trace tuning for LVDS and transceiver channels. Thermal management requires attention because 65 nm Stratix III devices under heavy utilization can exceed 10 W dissipation and demand a thermal relief copper pour under the package. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and practical board-design notes not consolidated in the manufacturer datasheet.
EP3SL110F1152I3N - Stratix III L FPGA, 107.5K LE, 1152-BGA | Altera
The Altera (Intel) EP3SL110F1152I3N is a Stratix III L family field-programmable gate array (FPGA) featuring 107,500 logic elements, 4,300 LABs, and 744 user I/Os, manufactured on a 65 nm process and housed in a 1152-ball flip-chip BGA (FC-FBGA) package. The device operates from a 1.1 V core supply and supports system speeds up to 500 MHz, making it suitable for high-throughput digital signal processing, high-speed serial interfaces, and parallel data-path designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines programmable logic blocks, configurable interconnect, and dedicated hard IP into a single semiconductor. The Stratix III L family sits within Altera's high-performance FPGA portfolio (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), positioned below Stratix V but above Cyclone families in density and transceiver capability. FPGAs are widely used to accelerate parallel computation, implement custom interfaces, and prototype ASIC designs before tape-out. Key features of the EP3SL110F1152I3N include 4,992,000 bits of embedded memory, dedicated DSP blocks for high-speed multiply-accumulate operations, support for external memory interfaces such as DDR3, and on-chip transceivers optimized for backplane and chip-to-chip serial links. The 'L' suffix denotes the lower-power variant of Stratix III, with programmable power technology that dynamically adjusts logic and routing resources based on design timing requirements, reducing static and dynamic power consumption compared to the standard Stratix III device of the same logic density. The architecture combines an 8-input adaptive logic module (ALM) fabric, 9-Kbit M9K memory blocks, 144-Kbit MLAB memory, variable-precision DSP blocks, and PLLs. The 1152-pin FC-FBGA package exposes up to 744 user I/Os plus dedicated clock, configuration, and power pins, enabling dense PCB designs with multiple high-speed parallel interfaces. Configuration is supported via JTAG, passive serial, fast passive parallel, and Altera-specific modes. Typical applications include wireline telecom line cards, military and aerospace signal processing, ASIC prototyping, high-performance computing accelerators, test and measurement equipment, and video broadcast infrastructure. The combination of logic density and serial bandwidth suits designs that previously required multiple mid-range FPGAs or a discrete ASIC. When designing with the EP3SL110F1152I3N, plan thermal management carefully. Estimated: at full logic utilization and 500 MHz operation, core power can reach several watts; the FC-FBGA's exposed die requires a heatsink or thermal interface material and a multi-layer PCB with adequate inner-plane copper for heat spreading. Use Altera Quartus II software for synthesis, place-and-route, and power analysis.
EP3SL110F780C2N - Stratix III L FPGA, 107K LE, 780-FCBGA | Intel
The Intel EP3SL110F780C2N is a Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA). Per the verified distributor data, the device integrates 107,500 logic elements (LEs), 4,992,000 bits of embedded memory, 4,300 LABs/CLBs, and 488 user I/Os in a single monolithic silicon die. An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose digital logic function is defined by the user after manufacturing, by loading a configuration bitstream into on-chip SRAM. FPGAs sit hierarchically between general-purpose microcontrollers (which run software) and application-specific integrated circuits (ASICs) whose function is fixed at fabrication. Modern high-density FPGAs like the Stratix III L pair programmable logic fabric with dedicated hard IP such as transceivers, memory blocks, DSP blocks, and PLLs, enabling ASIC-beating performance with full design revision flexibility. Key features of the EP3SL110F780C2N include 107,500 logic elements, 4.99 Mbits of distributed/embedded RAM, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) on its 488 user I/Os, 24 transceivers at up to 6.5 Gbps, and 312 embedded multipliers (18x18) for DSP workloads. The C2 speed grade and 780-pin FCBGA package make it a member of the Stratix III L mid-density tier optimized for cost-sensitive, lower-power designs relative to the Stratix III E family. The architecture is built on TSMC's 40 nm process and uses Altera's adaptive logic module (ALM) — an 8-input fracturable LUT that can be configured as either one 6-input LUT or two independent 4-input LUTs with shared inputs, improving logic utilization. Configuration is loaded from flash or a configuration device through dedicated JTAG or active serial/parallel interfaces. The on-chip PLLs provide flexible clock synthesis, while the 24 transceivers enable high-speed serial links for protocols such as PCIe Gen2, XAUI, and Serial RapidIO. Typical applications include high-speed serial interface bridging (PCIe Gen2, XAUI, SRIO), digital signal processing for wireless baseband, video broadcasting and image processing pipelines, high-end ASIC prototyping, and telecom line-card datapath offload. The combination of moderate density and lower power consumption relative to the higher-tier Stratix III E makes it well suited for cost-sensitive production systems that still require Stratix III performance and transceiver bandwidth. When designing with this device, ensure PCB layout meets Intel's transceiver signal-integrity guidelines and that the thermal solution can remove 8-12 W of typical power dissipation at full transceiver utilization.
EP3SL110F780C4N - 107.5K Logic Elements Stratix III FPGA | Intel
The Intel (formerly Altera) EP3SL110F780C4N is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. It delivers 107,500 logic elements, 4,992,000 bits of embedded memory, 4,300 Logic Array Blocks (LABs), and 488 user I/Os. The device operates at a core voltage of 1.1 V with a maximum internal clock rate of 450 MHz, manufactured on a 65 nm process node. The speed grade is C4 (commercial, -4 tier), with an operating junction temperature window of 0 °C to 85 °C. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic, memory blocks, DSP slices, and high-speed transceivers after PCB fabrication. FPGAs sit in the broader hierarchy of digital semiconductors between ASICs and microcontrollers: they offer higher performance and parallelism than MCUs, yet retain the reprogrammability that distinguishes them from fixed-function ASICs. Stratix III devices specifically target high-end applications such as high-speed digital signal processing, high-bandwidth data path bridging, and ASIC prototyping where density, performance, and DSP throughput are paramount. Key features of the EP3SL110F780C4N include a logic element density of 107.5K, embedded memory of approximately 4.99 Mbits distributed across M9K memory blocks, configurable I/O standards supporting LVDS, LVTTL, LVCMOS, and SSTL, up to 12 transceivers (varies by device option), dedicated DSP blocks for high-speed multiply-accumulate operations, and integrated PLLs for clock synthesis and management. The FineLine BGA-780 package uses a 1.0 mm ball pitch and supports multilayer PCB designs with controlled-impedance routing. Architecturally, the Stratix III L family employs an adaptive logic module (ALM) topology, replacing the classical 4-input LUT architecture of prior generations. Each ALM packs eight inputs plus an embedded adder, giving 1.4x the effective logic capacity per LUT versus Stratix II. The 65 nm process with metal-layer optimization reduces dynamic power by up to 50 percent compared to the Stratix II generation, a key enabler for the Stratix III L sub-family. Typical applications for the EP3SL110F780C4N include ASIC prototyping and emulation, high-performance digital signal processing in wireless baseband, high-speed data acquisition systems, video broadcast and imaging pipelines, military secure communications, and test and measurement instrumentation. The 488 I/Os combined with multi-gigabit transceivers make it well-suited for telecom line-card bridging between custom ASICs and backplane SERDES. When designing with the EP3SL110F780C4N, ensure the PCB supports 1.0 mm BGA pitch fanout with microvia technology where appropriate. The 780-ball package demands 8- to 10-layer stack-up with continuous reference planes for power integrity. Use the Quartus II design software (version 13.1 or earlier; Intel provides a maintenance release path for legacy Stratix III) for place-and-route and timing closure; Altera device programming requires a JTAG or passive-serial configuration scheme. This page synthesizes verified distributor pricing, drop-in same-family and cross-family Stratix III alternatives sharing the 780-BGA footprint, and practical FPGA design notes not consolidated in a single place by the manufacturer datasheet.
EP3SL110F780I4N - Stratix III L FPGA, 107.5K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SL110F780I4N is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA) package. Per the verified distributor data, the device integrates approximately 107,500 logic elements (LEs) and 4,992 Kbits of embedded memory across 4,300 Logic Array Blocks (LABs), with 488 user I/O pins. It is fabricated on a 65 nm CMOS process and targets high-performance DSP, high-speed serial I/O, and memory-rich applications. The industrial temperature grade (suffix "I4" indicating -40C to +100C operating range) and "N" lead-free designator make it suitable for harsh-environment and RoHS-compliant designs. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy: programmable logic > FPGA > SRAM-based FPGA > high-density FPGA. They bridge the gap between general-purpose CPUs (sequential, software-defined) and ASICs (fixed-function, mass-produced), offering hardware-level parallelism with re-programmability. The Stratix III family specifically targets high-end applications requiring both logic density and high-speed serial connectivity. Key features of the EP3SL110F780I4N include support for up to 488 user I/Os, embedded transceiver capability for high-speed serial protocols, on-chip memory of nearly 5 Mbits, and up to 384 multipliers (18x18) for DSP workloads. The 780-pin FCBGA package provides high interconnect density required for routing hundreds of I/Os while maintaining a manageable footprint suitable for multi-layer PCB designs. Power management is enhanced through Stratix III's programmable power technology, which reduces dynamic power versus prior generations. Typical uses include high-speed digital signal processing, telecommunications infrastructure, video processing and broadcast equipment, high-performance ASIC prototyping, and aerospace/defense systems. The industrial temperature grade makes it suitable for outdoor or industrial-control applications where commercial-grade parts would fail. Its large logic capacity also enables integration of entire subsystems (CPU soft-cores, memory controllers, protocol bridges) into a single device, reducing BOM count and board complexity. When designing with the EP3SL110F780I4N, observe Stratix III power-up and configuration scheme requirements (typically using an external EPCS or enhanced configuration device, or JTAG). Maintain multi-layer PCB stack-up with continuous power and ground planes beneath the FCBGA to manage simultaneous-switching noise and to provide low thermal resistance for the top-side thermal pad. Always verify pin assignments against the latest Intel Quartus II pinout files before committing to layout. This page synthesizes distributor availability, Stratix III family member drop-in alternatives, and practical design notes not consolidated in any single manufacturer datasheet or catalog page.
EP3SL150F1152C2N - 142.5K LE Stratix III L FPGA 1152-BGA | Altera
The Altera (now Intel) EP3SL150F1152C2N is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) featuring 142,500 logic elements and 6,543,360 bits of embedded memory, packaged in a 1152-ball FineLine BGA (FCBGA). Built on a 65 nm process with a 1.1 V core supply, the device integrates 5,700 LABs and supports up to 744 user I/Os with modular I/O banks optimized for high-speed external memory and serializer/deserializer interfaces. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits, and are commonly used for high-throughput digital signal processing, protocol bridging, and ASIC prototyping where fixed-function ASSPs cannot meet performance or flexibility requirements. Key specifications include 600 MHz maximum operating frequency, 1.1 V core voltage, 5700 LABs, and dedicated DSP blocks for high-speed arithmetic. The Stratix III L family is the lower-static-power variant of the Stratix III series, making it well-suited for thermally constrained systems. Modular I/O banks with a common structure support vertical migration across the family and offer dynamic on-chip termination, output delay, and current strength control for best-in-class signal integrity. Typical applications include high-end communications infrastructure, ASIC prototyping, high-performance DSP pipelines, military/aerospace signal processing, and test & measurement backplanes. The 1152-ball FCBGA provides ample routing escape for high-speed LVDS, DDR3 memory controllers, and multi-gigabit transceiver I/O, while the Stratix III L variant reduces idle power relative to standard Stratix III devices. When designing with this device, use the Altera Quartus II design suite (or later Intel Quartus Prime) to estimate fMAX, power, and pin assignments before PCB layout. The 1152-FCBGA requires a multi-layer PCB with sequential lamination and microvia technology; verify package-specific ball maps and supply-rail decoupling against the manufacturer datasheet before finalizing stackup and BOM. This page synthesizes distributor pricing, drop-in same-family speed/pin alternatives, and practical design notes for the Stratix III L family not found in any single distributor listing.
EP3SL150F1152C4N - 142.5K LE, 744 I/O Stratix III L FPGA | Intel
The Intel EP3SL150F1152C4N is a high-density, low-power member of the Stratix III L FPGA family, providing 142,500 logic elements, 6,543,360 bits of embedded memory, and 744 user I/O in a 1152-ball Flip-Chip BGA (FCBGA) package. It is fabricated on a 65 nm TSMC process with a 1.1 V core supply and is offered in a commercial speed grade C4 with the suffix "N" indicating lead-free / Pb-free termination. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit within the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, allowing designers to implement arbitrary digital hardware that can be re-programmed in the field. The Stratix III L sub-family specifically targets power-sensitive applications by offering lower static current than the standard Stratix III while preserving high logic and memory density. Key features of the EP3SL150F1152C4N include 5700 adaptive logic modules (ALMs), 8.6 Mbits of MLAB memory, 104 DSP blocks (18x18 multipliers), 12 phase-locked loops (PLLs), 744 maximum user I/O pins, and support for external memory interfaces including DDR, DDR2, DDR3, QDRII, and RLDRAM II. Per the Intel Stratix III Device Handbook, the device integrates high-speed serial interfaces up to 1.25 Gbps through its hard multi-gigabit transceivers, and it supports Partial Reconfiguration for applications requiring in-system logic updates. Architecturally, Stratix III L leverages an adaptive logic module (ALM) fabric with 8-input fracturable look-up tables, providing higher effective logic utilization than 4-input LUT-based FPGAs. The 65 nm process and 1.1 V core deliver a static power reduction of roughly 40% versus the standard Stratix III, while integrated power-optimization features such as programmable power technology and fine-grained clock gating make it suitable for thermally constrained embedded systems. Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, video broadcast and image processing, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing. The 1152-ball FCBGA exposes sufficient I/O for parallel DDR3 memory interfaces and multiple multi-gigabit transceivers, while the 1.1 V core reduces board-level power budget. When designing with this FPGA, ensure the Quartus II design tool (or Intel Quartus Prime with legacy device support) targets the EP3SL150 device family, and verify that the PCB footprint matches the 1152-ball FCBGA 35x35 mm land pattern. Plan for multi-rail power sequencing (1.1 V VCC, 2.5 V/3.0 V VCCPD, 1.5 V/1.8 V/2.5 V/3.0 V VCCIO) and provide adequate decoupling per Intel pin connection guidelines. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III L family, and practical PCB power-design notes not consolidated in the manufacturer datasheet.
EP3SL150F1152I3N - Stratix III L FPGA 142.5K LE | Intel | 1152-FCBGA
The Intel EP3SL150F1152I3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) fabricated on a TSMC 65-nm process, offering 142,500 logic elements, 6,543,360 bits of embedded memory, and 744 user I/O pins in a 1152-ball FineLine BGA (FCBGA) package. The "L" variant of the Stratix III family emphasizes the lowest static and dynamic power consumption in its class while preserving the family’s high-performance fabric architecture, including adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks for high-throughput signal processing. What is a Stratix III FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory, and DSP functions through a programmable interconnect fabric. The Stratix III generation (introduced 2007) belongs to Intel/Altera’s high-end FPGA portfolio and sits in the hierarchy: FPGA > programmable logic device > programmable logic IC > integrated circuit > semiconductor. The "III L" sub-family targets power-sensitive applications that previously required an ASIC, combining high logic density with the power-saving features of an advanced 65-nm low-power process. Key features of the EP3SL150F1152I3N include 5700 adaptive logic modules (ALMs), 384 18x18 multipliers, 8 PLLs, and up to 12 transceiver channels (depending on speed grade). The device supports configuration via passive serial, fast passive parallel, or JTAG, and offers on-chip termination (OCT) and signal integrity features. Its 1152-ball FCBGA package is approximately 35 mm x 35 mm with a 1.0 mm ball pitch, enabling high I/O density for memory-rich and parallel-interface designs. The architectural strength of this device is its programmable power technology, which allows unused logic, memory, and DSP blocks to enter a low-power state under software control. This makes the EP3SL150F1152I3N particularly suitable for wireline telecom, broadcast video, and military/aerospace applications where total system power and thermal envelope are primary constraints. Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, ASIC prototyping, and digital signal processing front-ends. The combination of large embedded memory and high multiplier count makes it well-suited for FFT pipelines, channelizers, and image preprocessing. When designing with this device, careful attention must be paid to PCB layout for the FCBGA package, including microvia stack-up, controlled-impedance routing for high-speed transceivers, and decoupling network placement. Quartus II (or newer Intel Quartus Prime) is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the same Intel/Altera Stratix III family, and practical design notes not found on any single distributor page.
EP3SL200F1152I4N - Stratix III L 200K LE FPGA | Altera | Industrial
The Altera (now Intel) EP3SL200F1152I4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA (FCBGA) package, built on a 65nm process node with a 1.1V core supply. Per the manufacturer datasheet, it integrates 200,000 logic elements, 8,000 Logic Array Blocks (LABs), 744 user I/Os, and 10,901,504 bits of embedded memory, making it one of the largest members of the Stratix III low-power family. An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs / LABs), programmable routing, and dedicated hard IP such as DSP blocks, block RAM, transceivers, and PLLs. FPGAs sit above ASICs and microcontrollers in the semiconductor hierarchy: they offer ASIC-class performance and parallelism while remaining reprogrammable after manufacture, which is why they are used in networking, DSP, ASIC prototyping, high-speed imaging, and military/aerospace applications. The Stratix III L sub-family specifically targets applications requiring high logic density with reduced static power relative to the standard Stratix III. Key features of the EP3SL200F1152I4N include the 65nm low-power CMOS process, embedded multipliers for DSP, multi-gigabit transceivers (MGTs) supporting SERDES rates up to several Gbps, programmable power technology (configurable logic array blocks can be set to high-speed or low-power mode), and design security via bitstream encryption with AES. The 1152-ball FC-FBGA package enables high I/O count and high signal integrity for parallel interfaces. Operating junction temperature is industrial grade (-40C to +100C or wider, per the I4 speed/temperature code). Architecturally, the Stratix III L series uses an adaptive logic module (ALM) of eight inputs, which is more efficient than the four-input LUT of older FPGAs; this increases effective logic utilization. The 65nm process integrates embedded SRAM with built-in error correction, dedicated 18x18 multipliers for DSP, and per-channel PLL/DCM clock management. Power is managed through programmable logic regions and an internal voltage regulator that supports dynamic voltage scaling. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-performance digital signal processing (radar, software-defined radio), broadcast video processing, medical imaging systems, and military secure communications. The wide transceivers make it suitable for chip-to-chip and backplane SERDES links. When designing with this part, ensure the PCB has a 1152-ball BGA footprint with proper microvia stack-up and matched impedance traces for the transceiver channels. Use the Altera Quartus II design suite (version 13.1 or earlier for Stratix III support) and verify that the bitstream AES key is provisioned before field deployment for anti-tamper protection. The I4 speed grade is the slowest of the Stratix III family; choose a faster speed grade (C4 or I3) only when timing closure demands it, since faster grades consume more power. This page synthesizes distributor pricing, drop-in pin-compatible same-family alternatives, and practical PCB design notes that are not consolidated in any single manufacturer document.
EP3SL200F1517I3N - Stratix III L FPGA 200K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL200F1517I3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 200,000 logic elements, 8000 LABs, and 10,901,504 bits of embedded memory in a 1517-ball FineLine BGA (FCBGA) package with 976 user I/Os. According to the Intel Stratix III Device Family datasheet, the device operates from a 1.1 V core supply with separate VCCPD and VCCIO banks, supports up to 500 MHz internal clocking, and integrates dedicated 18x18 multipliers, high-speed transceivers (where populated), and DSP blocks for high-throughput signal processing. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and embedded memory and DSP resources that can be customized after manufacturing to implement arbitrary digital logic, DSP pipelines, or interface protocols. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> high-performance FPGAs, offering the highest logic density and the highest I/O count among programmable devices, second only to ASICs in raw performance-per-watt. Key features include 8,000 LABs (Logic Array Blocks) supporting distributed and embedded RAM, 384 18x18 multipliers (~1.4 TMACS DSP throughput), dedicated PLL and global clock networks, and on-chip configuration memory. The Stratix III L variant targets lower static power than the standard Stratix III family while preserving the same fabric density, making it well-suited to high-utilization designs where thermal envelopes are constrained. Architecture-wise, the Stratix III family introduces programmable power technology with logic-array-base regions that can be set to high-speed or low-power mode, an 8-input adaptive logic module (ALM), and column- and row-based memory and DSP blocks that minimize routing congestion. The 1517-pin FCBGA exposes 976 user I/O pins across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL signaling, plus configurable PCIe, DDR2/DDR3 memory controllers hardened in the silicon. Typical applications include high-throughput digital signal processing for wireless baseband, ASIC prototyping, high-speed data acquisition, radar and image processing, industrial motor control, and high-end test and measurement instrumentation. The combination of large logic capacity, dedicated DSP, and abundant high-speed I/O makes it well suited to designs that previously required an ASIC or a multi-FPGA partition. When designing with this part, carefully manage the multi-rail power sequencing (1.1 V core, VCCPD, VCCIO), follow Intel's PCB layout guidelines for FCBGA escape and BGA via-in-pad stackup, and budget for the device's high transient current demands during configuration. Thermal design must account for both static and dynamic power; use the Quartus II PowerPlay early power estimator before physical implementation to validate the thermal envelope.
EP3SL200F1517I4 - 200K LE Stratix III L FPGA | Intel (Altera)
The Intel (formerly Altera) EP3SL200F1517I4 is a high-density, low-power member of the Stratix III L FPGA family, delivering 200,000 logic elements in a 1517-ball FC-FBGA package. It features 9,152 Kbits of embedded memory, 8000 LABs (Logic Array Blocks), 976 user I/Os, and is fabricated on a 65 nm process node with a 1.1 V core supply. Per the FindIC archive of the original Altera datasheet (published 2011-03-24), the device targets high-performance, logic-rich applications that demand both high logic density and rich DSP/multiplier resources. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic functionality is defined by the customer after manufacturing. Hierarchically, an FPGA sits inside the broader category of programmable logic devices (PLDs), itself a subset of integrated circuits and digital logic ICs. FPGAs differ from ASICs by offering post-fabrication reconfigurability at the cost of higher per-unit price, area, and dynamic power; the Stratix III L family specifically targets a power-per-logic-element sweet spot between the original Stratix III and the Stratix IV families. Key features include 200,000 logic elements, 9,152 Kbits embedded memory, 8,000 LABs, 976 user I/Os, and embedded multipliers/DSP blocks. Internal frequency is rated at up to 450 MHz. The 1517-ball FC-FBGA package supports high-pin-count designs with multiple high-speed transceiver and external memory interface (EMIF) banks. The 65 nm process enables higher density at lower static leakage than the 90 nm Stratix II generation. Typical applications include high-end telecommunications baseband processing, radar and beamforming DSP, ASIC prototyping, high-speed test and measurement, and broadcast video processing. The high logic count makes the part particularly suited to designs that have outgrown mid-density Stratix III devices but do not require the absolute highest density of the Stratix V family. When designing with this device, plan power delivery for high transient currents during configuration and dynamic reconfiguration. The FC-FBGA package requires careful PCB stackup, microvia or via-in-pad fabrication, and matched-length routing for high-speed serial interfaces. Quartus II is the canonical design toolchain. This page synthesizes distributor pricing from DigiKey/Mouser, cross-references, and a parametric comparison table not found in the manufacturer datasheet.
EP3SL200F1517I4L - 200K LE Stratix III L FPGA, 1517-FCBGA | Altera
The Intel (formerly Altera) EP3SL200F1517I4L is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) integrating 200,000 logic elements, 10,901,504 bits of embedded memory, and 976 user I/Os in a 1517-ball Flip-Chip FineLine BGA (FC-FBGA) package. Built on TSMC's 65 nm low-power CMOS process, the device operates at a core voltage of 0.9 V and supports the industrial -40C to +100C junction temperature range indicated by the 'I' speed-grade suffix. The '4' speed grade denotes the mid-speed PLL/transceiver tier, while the 'L' suffix marks the logic-optimized variant of the Stratix III generation. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated DSP/memory blocks that can be re-wired after manufacture. FPGAs sit between fixed-function ASICs and general-purpose processors: they offer ASIC-like throughput and parallelism while remaining software-reconfigurable. Stratix III devices occupy the high-end of Altera's FPGA portfolio, bridging the older Stratix II and later Stratix IV/V families, and historically targeted high-bandwidth DSP, telecom, and ASIC-prototyping workloads. Key features include 8,000 LABs (Logic Array Blocks), 384 embedded 18x18 multipliers, and 24 transceivers (per family overview) capable of up to 3.75 Gbps. Programmable Power Technology (PPT) dynamically scales quiescent current block-by-block, while hard PCIe hard IP, 8-input fracturable ALMs, and TriMatrix on-chip SRAM give designers deterministic latency for signal-processing pipelines. Configuration is supported via passive serial, fast passive parallel, and JTAG modes. Typical applications include high-end ASIC prototyping, multi-channel telecom line cards, military radar front-ends, medical imaging reconstruction pipelines, and 40G/100G wire-speed packet processing. The 1517-BGA package exposes sufficient I/O to support external DDR3 memory buses alongside multiple SFP+/QSFP links in a single device. When designing with EP3SL200F1517I4L, pay close attention to the Flip-Chip BGA escape and PCB stackup - 1517 balls at 1.0 mm pitch require a minimum 6-layer PCB with laser-drilled microvias. Plan thermal management around the 31.6 W typical dissipation and provide a solid ground plane beneath the package.
EP3SL200F1517I4LN - Stratix III L FPGA, 200K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP3SL200F1517I4LN is a high-density, high-performance Field Programmable Gate Array (FPGA) from the Stratix III L family, built on a 65 nm process and packaged in a 1517-ball FCBGA. It integrates 200,000 logic elements, 10,901,504 bits of embedded memory, and 976 user I/O pins, making it one of the largest devices in the Stratix III L line optimized for low-power, high-bandwidth applications. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O resources can be configured by the designer after manufacture. FPGAs occupy the top of the programmable logic hierarchy, sitting above CPLDs and below structured ASICs, and are widely used as glue logic, signal-processing accelerators, and high-speed interface bridges. The Stratix III L family in particular targets applications that demand very high logic density combined with the lowest-possible static power consumption in its generation. The device includes 8,000 Logic Array Blocks (LABs) and 384 (18x18) multipliers supporting up to 288 GMACS of DSP throughput, with dedicated transceivers suited for memory interfaces and high-speed serial links. Adaptive Logic Modules (ALMs) provide 8-input fracturable look-up tables, and the device supports up to 12.5 Gbps transceiver operation in related Stratix IV GT parts. Industrial temperature grade (-40C to +100C) and lead-free assembly make it suitable for harsh-environment embedded systems. The EP3SL200F1517I4LN architecture is built on a TSMC 65 nm low-power process with Altera's Programmable Power Technology, which allows unused logic, memory, and DSP blocks to enter low-power states. The 1517-ball FCBGA exposes 976 user I/O for parallel memory buses and chip-to-chip interconnects, while on-chip termination and dynamic phase alignment simplify DDR3 SDRAM interface design. Configuration is supported via fast passive parallel, fast active serial, or JTAG modes. Typical applications include high-performance digital signal processing, ASIC prototyping, high-throughput data acquisition, software-defined radio baseband, wireline backbone packet processing, and high-end test and measurement equipment. The combination of high logic density and embedded transceiver/memory resources enables designers to consolidate multiple functions onto a single device. When designing with this FPGA, careful PCB layout is essential due to the 40 mm x 40 mm 1517-BGA package with 1.0 mm ball pitch. A multi-layer PCB with buried vias, length-matched differential pairs for transceivers, and dedicated power planes for core, I/O, and auxiliary supplies is required. Quartus II software (or compatible) is required for design entry, synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, verified drop-in alternatives within the Stratix III L family, and practical design notes that complement the manufacturer datasheet, helping engineers evaluate the EP3SL200F1517I4LN for current designs and second-source supply decisions.
EP3SL200F1517I4N - Stratix III L FPGA, 200K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SL200F1517I4N is a high-density, low-power member of the Stratix III L FPGA family built on a 65 nm CMOS process, integrating approximately 200,000 logic elements and 10,901,504 bits of embedded memory in a 1517-ball FCBGA package. Operating temperatures are specified from -40C to +100C for the industrial speed grade I4, with a core voltage of 1.1 V and per-pin IO support totalling 976 user I/Os. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnects, and dedicated hardened IP such as memory, transceivers, DSP blocks, and PLLs. FPGAs occupy a unique position in the digital semiconductor hierarchy: programmable logic -> FPGA -> programmable logic device -> digital IC -> semiconductor. Compared to ASICs, FPGAs offer post-fabrication hardware reconfiguration and lower NRE cost; compared to CPLDs, FPGAs offer much higher logic density and richer DSP/memory resources. The Stratix III L variant of the Stratix III family was specifically tuned by Intel/Altera for the lowest static and dynamic power consumption within that generation. Key differentiating features include 200K logic elements (LEs), 10,901,504 bits of on-chip memory (10.9 Mbit equivalent), a MultiTrack interconnect fabric, TriMatrix memory blocks, DSP blocks for high-throughput signal processing, and 976 maximum user I/Os to enable interface-rich designs. The 1517-FCBGA package exposes extensive IO and power/ground balls for signal integrity in high-pin-count backplane and ASIC-prototype designs. Internal frequency figures cited in datasheet mirrors reach up to ~717 MHz for logic and ~800 MHz for memory-related paths. The architecture uses logic array blocks (LABs) containing adaptive logic modules (ALMs), interconnected by the MultiTrack fabric, with column- and row-based DSP blocks and embedded M20K memory blocks. The 65 nm process enables tighter integration while the Stratix III L tuning delivers lower quiescent leakage than the Stratix III standard variant. This balance makes the EP3SL200F1517I4N well suited to high-throughput DSP, multi-gigabit serial interfaces, and ASIC emulation/emulation of complex SoCs. Typical applications include ASIC prototyping and emulation, high-performance DSP for wireless baseband and radar, multi-gigabit serial backplane bridging, test and measurement instrumentation, and high-end video/image processing. The high IO count also suits the part to memory-rich systems and large fan-out glue logic on telecom line cards. When designing with the EP3SL200F1517I4N, plan for the 1517-FCBGA land pattern, multiple decoupling capacitor rails close to the package, and a multi-layer PCB with controlled-impedance layers for transceivers and memory interfaces. Thermal management must accommodate the FCBGA's central ball array; follow Intel/Altera's reference thermal design for high-density Stratix III boards. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III lineup, and practical design notes not aggregated on a single manufacturer or distributor page.
EP3SL200H780C2 - Stratix III L FPGA, 200K LE, 780-BGA | Intel
The Intel EP3SL200H780C2 is a high-density, low-power member of the Stratix III L FPGA family, delivering 200,000 logic elements, 10,901,504 memory bits, and 488 user I/O in a 780-ball FCBGA package with a commercial 0C to 85C operating range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing that the designer programs after manufacturing. Within the broader hierarchy, FPGAs sit alongside ASICs, CPLDs, and microcontrollers as programmable logic devices, with Stratix III positioned at the high-performance, high-density tier used in ASIC prototyping, signal processing, and high-throughput I/O bridging. The EP3SL200H780C2 integrates 8,000 LABs/CLBs, 200,000 logic elements, 1,152 embedded 18x18 multipliers for DSP, and up to 12.7 Mbit of embedded RAM. Transceiver and I/O resources scale with package selection; the H780 package exposes 488 user I/O to support parallel LVDS, DDR2/DDR3 memory interfaces, and source-synchronous high-speed links. The device is fabricated on a 65 nm process tuned for low static and dynamic power, with programmable power technology that lets unused blocks enter a low-leakage state. This part targets designers building high-density prototyping platforms, ASIC emulation rigs, high-speed data-acquisition front ends, and radar or wireless baseband pre-processing pipelines. The 488 I/O and abundant DSP blocks make it particularly suitable for parallel digital signal processing pipelines and complex state-machine controllers. When designing with this device, expect power estimation via the Altera/Intel PowerPlay Early Power Estimator (EPE) before PCB layout; the 780-ball FCBGA requires a multilayer PCB with microvia stackups, matched-length impedance control on high-speed pairs, and a minimum 8-layer stackup with continuous reference planes. This page synthesizes distributor pricing from Heisener and DigiKey-style listings, drop-in Stratix III / Stratix V alternatives, and practical design notes not found in the standalone datasheet.
EP3SL200H780C2N - 200K LE Stratix III L FPGA, 780-BGA | Intel
The Intel (formerly Altera) EP3SL200H780C2N is a high-density Stratix III L family Field Programmable Gate Array (FPGA) delivering 200,000 logic elements, 488 user I/O pins, and approximately 10.9 Mbits of embedded memory in a 780-ball fine-pitch BGA package. Built on a 65 nm CMOS process, it operates from a 1.1 V core supply with speed grade C2 and a commercial temperature rating. A Field Programmable Gate Array (FPGA) is a programmable logic device whose interconnect, lookup tables, and I/O cells are configured by a bitstream after manufacture, bridging the gap between fixed-function ASICs and software-driven processors. Within the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs, SoC FPGAs, and structured ASICs as the highest-density reconfigurable platform. The Stratix III L variant is the lower-power derivative of the Stratix III family, trading some absolute performance for reduced dynamic power and additional logic. Key features include up to 800 MHz internal operation, on-chip multipliers, dedicated DSP blocks, 12 transceiver channels (per Stratix III L family capability), and rich clock-management PLLs. The HBGA-780 package exposes 488 general-purpose I/O across 24 banks, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and incorporates Altera's hot-socketing and on-chip termination (OCT) technology for signal integrity. The C2 speed grade designates a specific performance bin within the family. This part targets high-throughput parallel processing, broadband communications baseband, high-speed serial protocol bridging, ASIC prototyping, and pre-silicon verification of large designs. Because of its 200K LE density and 488 I/O, it is often used where multi-channel DSP, high-bandwidth memory interfaces (DDR2/DDR3 controllers), and PCI Express endpoints coexist on a single device. Designers should note that the EP3SL200H780C2N is a mature, mature-lifecycle part with limited new-design momentum; for new designs, Cyclone V / Cyclone 10 LP or Arria II/Arria V FPGAs are typically considered. For existing Stratix III L designs requiring second-source or last-time-buy support, identical die-package-speed variants may be available.
EP3SL200H780C3 - 200K LE Stratix III L FPGA 780-BGA | Altera / Intel
The Intel (formerly Altera) EP3SL200H780C3 is a Stratix III L family field programmable gate array (FPGA) offering 200,000 logic elements, 8,000 LABs, 488 user I/O pins, and 10,901,520 bits of on-chip RAM, packaged in a 780-ball FCBGA. The Stratix III L variant targets logic-dense, lower-power designs relative to the Stratix III E variant, and this specific device is the speed-grade 3 (slower) commercial-temperature offering within the EP3SL200H package family. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs / LABs), programmable routing, dedicated hard IP such as DSP blocks and transceivers, and on-chip memory. Stratix III devices belong to the high-end FPGA product family in the wider programmable-logic taxonomy: FPGA -> PLD -> programmable logic -> semiconductor IC. Stratix III L variants are positioned for applications that require substantial logic density together with lower static power versus older Stratix generations. Key features of the EP3SL200H780C3 include 200,000 logic elements, 8,000 logic array blocks (LABs), 488 user I/O, 10,901,520 bits of embedded memory (roughly 1.36 Mbyte), high-speed transceiver blocks, and dedicated DSP blocks. The 780-ball flip-chip BGA package exposes the full I/O count and supports industrial-temperature operation for commercial-grade (-40C to 85C) designs. Speed grade 3 is the slowest of the three Stratix III speed bins, making it attractive for cost-sensitive designs that do not require maximum Fmax. Architecturally, the Stratix III L FPGA uses Altera's adaptive logic module (ALM) structure with 8-input fracturable look-up tables, a hierarchical routing fabric, and integrated PLLs. Compared with the Stratix II generation, Stratix III introduced lower static power through an innovative programmable power technology that turns off unused logic resources. The 'L' sub-family trades some high-speed transceiver performance versus the 'E' sub-family in exchange for higher logic density at lower power. Typical applications for the EP3SL200H780C3 include wireline telecom line cards, high-end test and measurement equipment, medical imaging processing, broadcast video infrastructure, and ASIC prototyping where designers need a large, fast, reprogrammable fabric. Because of the 780-BGA pin count and large I/O bank count, this device is appropriate for designs requiring wide parallel data buses or many high-speed serial links. When designing with this device, plan for the large BGA footprint: typical PCB stack-ups require at least 10 layers with 0.8 mm or 1.0 mm pitch BGA fanout and controlled-impedance routing for the high-speed serial links. Use the Quartus II (or later Quartus Prime) tool flow with the Stratix III device library, and ensure your power tree delivers the multiple voltage rails the Stratix III L family requires (typically core, I/O, PLL, and transceiver rails). For new designs, evaluate the newer Cyclone V or Stratix 10 families, since Stratix III is now a legacy family; confirm long-term support with Intel PSG before committing.
EP3SL200H780C3N - 200K LE Stratix III L FPGA, 780-BGA | Intel
The Intel (Altera) EP3SL200H780C3N is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) built on a 40 nm process, integrating approximately 200,000 logic elements and 10,901,504 bits of embedded memory in a 780-ball Fine-pitch Ball Grid Array (FCBGA, HBGA) package. Headline parameters include 488 user I/Os, 800 MHz maximum internal clock, and 24 transceivers capable of up to 3.75 Gbps. The 'L' suffix designates the lower-static-power Stratix III family variant, targeting high-performance, power-sensitive designs such as wireline telecom, broadcast video, and DSP-intensive signal processing. An FPGA is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers that can be reconfigured post-manufacture to implement custom digital hardware. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: they deliver ASIC-like parallelism and latency, while preserving the design flexibility of a re-programmable platform. Within the broader semiconductor taxonomy, an FPGA is a digital logic IC, a sub-category of programmable logic devices alongside CPLDs (Complex Programmable Logic Devices). Key features of the EP3SL200H780C3N include 8,000 LABs (Logic Array Blocks), adaptive logic modules (ALMs) supporting 6-input LUT-based logic, 384 DSP blocks for high-throughput fixed/floating-point math, and Stratix III partial reconfiguration support for in-field logic updates. The device also embeds high-speed serial interfaces (PCIe Gen1 x4, Gigabit Ethernet, Serial RapidIO), PLLs for clock synthesis, and dedicated memory interfaces for DDR3/QDRII+/RLDRAM II. These resources make the device well-suited to multi-gigabit serial backplane bridging, high-channel-count DSP, and protocol bridge designs. Typical applications include 40G/100G wireline bridge and packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end processing, broadcast video format conversion and routing, medical imaging accelerators, and high-end test & measurement instrumentation. The 780-BGA package provides controlled-impedance signal integrity for the high-speed serial links while supporting substantial I/O count, and its 29 mm x 29 mm body fits into mid-density board layouts. When designing with this device, ensure the JTAG IEEE Std 1149.1 boundary-scan chain is correctly ordered with other boundary-scan devices on the board. Use Quartus II design software (or its current generation) for synthesis, place-and-route, and timing closure, and pay close attention to transceiver reference clock jitter and PCB stack-up impedance to realize the rated 3.75 Gbps link performance. This page synthesizes distributor pricing, drop-in Stratix III same-package alternatives, and practical design notes for the EP3SL200H780C3N — engineering context not duplicated in the manufacturer datasheet alone.
EP3SL200H780C4 - Stratix III L FPGA, 200K LE, 780-BGA | Altera
The Altera (Intel Programmable Solutions Group) EP3SL200H780C4 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. The device integrates 200,000 logic elements, 488 user I/Os, 10,901,504 bits of embedded memory, and 488 (9-bit) hardware multipliers, making it well suited for high-throughput digital signal processing and high-bandwidth data-path designs. Key features include a Stratix III L core fabric built on a 40 nm TSMC process, an internal operating frequency up to 800 MHz, and an enhanced MultiTrack interconnect with TriMatrix memory blocks. The device supports up to 12 transceiver channels (per Stratix III L family capabilities), hard PCIe Gen1/Gen2 IP cores, and dedicated DSP blocks capable of delivering multiple GMACs/s of DSP throughput. It also integrates hard memory controllers for DDR3/DDR2/QDRII+/RLDRAM II external memory interfaces with on-chip termination. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs) under the umbrella of logic ICs. Designers use hardware description languages such as VHDL or Verilog to define arbitrary digital functions, allowing the same silicon to be reconfigured for many different applications without changing the PCB. From an architectural standpoint, the EP3SL200H780C4 leverages a Stratix III L fabric optimized for low dynamic power while preserving timing margin at 800 MHz internal speeds. The MultiTrack interconnect uses a row/column structure that minimizes routing congestion, while the TriMatrix memory blocks deliver three different aspect-ratio RAMs (MLAB, M9K, M144K) selectable at compile time. Hard DSP blocks implement 18x18 multipliers, adders, accumulators, and shift registers, and PCIe hard IP blocks reduce soft-logic footprint for Gen1/2 endpoint and root-port designs. Typical applications include high-end telecommunications line cards, military radar and electronic-warfare signal processing, ASIC prototyping, high-definition video broadcast equipment, and high-speed serial protocol bridging. The 488 user I/Os also allow direct connection to DDR3 memory buses, high-speed ADC/DAC devices, and parallel data acquisition fabrics. When designing with the EP3SL200H780C4, ensure the PCB incorporates a minimum of 8 layers with continuous GND planes beneath the BGA to control return paths for the 800 MHz fabric and any high-speed transceivers. Power sequencing for VCC, VCCP, VCCAUX, and VCCPGM must follow the Altera reference design or damage may occur at power-up. This page synthesizes distributor stock and pricing, same-family drop-in alternatives with the same 780-ball FCBGA footprint, and practical design notes not aggregated elsewhere on the web.
EP3SL200H780C4L - Stratix III 200K LEs FPGA 780-HBGA | Intel
The Intel (formerly Altera) EP3SL200H780C4L is a high-density, low-power Stratix III family FPGA with 200,000 logic elements, 488 user I/O, and 6.5 Mbit embedded memory, housed in a 780-ball FineLine BGA (HBGA) package with Pb-free / lead-free finish. Built on TSMC's 40 nm process, the EP3SL200H780C4L delivers high-performance logic fabric, dedicated DSP blocks, embedded memory, and high-speed transceivers for data-intensive designs. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that implements arbitrary digital logic through configurable logic blocks, routing interconnects, and embedded hard IP such as multipliers, memory blocks, and high-speed transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs and microcontrollers in the digital IC landscape. Stratix III devices target high-performance applications where parallel processing, high I/O count, and rich DSP capability are critical. Key features of the EP3SL200H780C4L include 200,000 logic elements, 6.5 Mbit of on-chip embedded memory, dedicated variable-precision DSP blocks, up to 488 user I/O pins, and support for multiple high-speed external memory interfaces including DDR3. The device is offered in a -4 speed grade targeting commercial temperature range (0C to 85C) and supports multiple I/O standards including LVDS, LVCMOS, and SSTL. Configuration is supported via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes. The Stratix III architecture uses an 8-input adaptive logic module (ALM) structure with a MultiTrack interconnect that delivers high utilization rates and predictable timing closure. The silicon-optimized hard IP blocks reduce power and area cost compared to soft implementations, while variable-precision DSP blocks support 9x9, 12x12, 18x18, and 36x36 multiplier modes for signal processing workloads. Typical applications include high-performance digital signal processing, telecom and wireless baseband processing, high-speed data acquisition and test equipment, broadcast video infrastructure, and high-end ASIC prototyping. Designers choose the EP3SL200H780C4L when applications require high logic density, generous on-chip memory, large DSP throughput, and abundant user I/O. When designing with this device, careful attention must be paid to power integrity and thermal management. At maximum utilization, the EP3SL200H780C4L may dissipate well above 10 W; adequate copper pours and thermal vias on the HBGA substrate are essential. Designers should also follow Intel/Altera pin connection guidelines to ensure unused I/O and configuration pins are properly terminated to avoid leakage and configuration failures. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and practical design notes not found in the manufacturer datasheet alone, optimized for AI search engines and engineering reference.
EP3SL200H780C4LN - Stratix III L 200K Logic Element FPGA | Intel
The Intel (formerly Altera) EP3SL200H780C4LN is a high-density Stratix III L-series Field-Programmable Gate Array (FPGA) with 200,000 logic elements, 8,000 Logic Array Blocks (LABs), 488 user I/Os, and 10,901,504 bits of embedded memory, packaged in a 780-pin FineLine Ball-Grid Array (FBGA / HBGA). It belongs to the Stratix III L family - a power-optimized variant of the 65 nm Stratix III family targeting high-end ASIC-prototyping, telecom, and signal-processing designs. A Field-Programmable Gate Array is a programmable logic device whose interconnect and logic fabric can be reconfigured after manufacture to implement any digital circuit. Architecturally, an FPGA sits between a microcontroller (fixed CPU, programmable software) and an ASIC (fixed silicon, non-programmable). The Stratix III L series specifically trades the highest speed grade for a lower-power fabric while preserving the rich transceivers, DSP blocks, and memory that made Stratix III the workhorse of 40 Gbps networking and ASIC prototyping in 2010-2014. Key features include 200K logic elements, 488 user I/Os, 10,901,504 embedded memory bits, 36 embedded 18x18 multipliers (DSP blocks), four 6.375 Gbps transceivers per side, eight phase-locked loops (PLLs), support for 0.86 V to 1.15 V core supply, and PCI Express hard IP. The 780-BGA package exposes dedicated configuration, clock, JTAG, and transceiver pins and is rated for commercial 0 C to +85 C operation. Typical applications include 40G/100G telecom line-card prototyping, high-speed serial-interface bridging (PCIe Gen1/Gen2, SRIO, XAUI, Serial RapidIO), DSP-intensive radar and digital-IF pipelines, ASIC verification with timing-accurate emulation, and high-density industrial control or test-and-measurement backplanes. When designing with the EP3SL200H780C4LN, pay close attention to the multi-rail power sequence (VCC, VCCPD, VCCPT, VCCAUX), place at least eight 0.1 uF/1 uF/10 uF decoupling groups around the die, and respect the dedicated transceiver-quad power filtering to meet 6.375 Gbps jitter targets. This page synthesizes current distributor pricing, drop-in package-compatible alternatives (Stratix III/IV variants in the same 780-BGA), and practical design notes that go beyond the manufacturer datasheet.
EP3SL200H780I3 - Stratix III L FPGA 200K LE 780-BGA | Intel
The Intel EP3SL200H780I3 is a high-density Stratix III L FPGA delivering 200,000 logic elements with 10.9 Mbits of embedded memory and 488 user I/Os, housed in a 780-ball FCBGA package. Manufactured on a 65 nm CMOS process with a 1.1 V core voltage, this device operates across -40C to +100C industrial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic, routing, and I/O behaviour are defined by a configuration bitstream after manufacture. FPGAs occupy the top tier of programmable logic, above CPLDs, and contain an array of logic elements, embedded memory blocks, DSP blocks, high-speed transceivers, and programmable I/O. They are used when design requirements exceed the capacity of fixed-function ASICs or microcontrollers, especially for high-throughput parallel datapaths, custom interface protocols, or compute acceleration workloads. Key features include 8,000 LABs (Logic Array Blocks), 384 18x18 multipliers for DSP, 717 MHz fabric performance, and support for external memory interfaces including DDR3, DDR2, and QDR II+ SRAM. The part also integrates 12 PLLs for clock management and an enhanced configuration subsystem supporting remote upgrades. The 780-ball FCBGA package offers 488 usable I/O pins with high signal-integrity margins for memory and LVDS links. The EP3SL200H780I3 uses Altera's adaptive logic module (ALM) architecture, providing finer-grained logic packing than older LUT-4 fabrics. Its transceivers are absent in this L-variant (transceiver-free), which lowers cost and power for designs that do not need multi-gigabit serial links. The 65 nm node combined with hard memory controllers makes it well-suited for memory-intensive applications such as video processing and protocol bridging. Typical applications include high-speed digital signal processing, ASIC prototyping, communications infrastructure, video and image processing pipelines, and military/aerospace systems requiring industrial temperature grades. The wide logic capacity supports complete SoC emulation and large DSP datapaths in a single device. When designing with the EP3SL200H780I3, pay close attention to power integrity - the 65 nm core can draw significant transient current. Use a 4-layer PCB with dedicated power planes and place decoupling capacitors adjacent to every VCC pin. Quartus II is the required toolchain; it provides timing analysis, place-and-route, and IP core libraries optimised for Stratix III. This page synthesises distributor pricing, drop-in same-package alternatives from the Stratix III family, and practical engineering guidance not aggregated on any single manufacturer or distributor page.
EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel
The Intel (formerly Altera) EP3SL200H780I3N is a high-density, low-power Stratix III L FPGA delivering 200,000 logic elements, 10,901,504 RAM bits, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Positioned in the Stratix III family, the device targets performance-critical applications that require high logic density, abundant embedded memory, and rich transceiver integration. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, routing, and I/O blocks can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs) and belong to the digital IC hierarchy. They are commonly used for ASIC prototyping, digital signal processing, high-speed serial interface bridging, and parallel hardware acceleration where fixed-function processors fall short. Key features of the EP3SL200H780I3N include 200,000 logic elements, 10,901,504 bits of embedded RAM, 488 user I/Os, and support for high-speed external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). The device implements an advanced logic array, on-chip multipliers, and dedicated DSP blocks enabling high-throughput arithmetic pipelines. The 780-ball FCBGA provides a 29x29 mm body with 1 mm ball pitch suitable for high-density PCB designs. Architecturally, the Stratix III L family leverages a 40 nm process with adaptive logic modules (ALMs), programmable power technology (Programmable Power Technology), and a rich mix of 6.375-Gbps transceivers. The EP3SL200H780I3N operates from a 0.9 V core supply and supports industrial temperature grades from -40C to +100C, giving designers flexibility for telecom, networking, and storage equipment. Typical applications include high-end networking line cards, telecom baseband units, ASIC prototyping, and high-performance DSP pipelines. The large logic count and embedded memory make the EP3SL200H780I3N suitable for protocol bridging, image processing front-ends, and high-speed data acquisition where multi-gigabit transceivers and parallel memory are required. When designing with this device, ensure the Quartus II / Quartus Prime design suite targets the Stratix III family, and follow Intel's pin-out guidelines for the 780-FCBGA. Plan power decoupling carefully, because the FPGA's dynamic current can shift by orders of magnitude during configuration or burst operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor or manufacturer page. Engineers get a side-by-side view of same-brand Stratix III drop-ins, parametric proximity, and a documented pin-compatible selection path.