FPGA & CPLD
Products (7,100+)
EP3SL50F780C4G - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
The Intel EP3SL50F780C4G is a Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, integrating 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 maximum user I/Os in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. Speed grade 4 reflects a commercial temperature-range device (-0°C to +85°C) at a core VCC of 1.1 V, with logic-array-block performance that supports high-throughput DSP, memory-rich datapaths, and serial transceiver pipelines. An FPGA is a semiconductor device whose digital logic fabric, routing, and I/O cells are defined by user-supplied configuration bitstreams rather than hard-wired mask geometry. Modern high-density FPGAs such as the Stratix III L family occupy a tier above simple programmable logic: they integrate hardened memory blocks (M9K/M144K), DSP blocks, PLLs, and (in some family members) multi-gigabit transceivers. The device hierarchy is FPGA -> programmable logic -> ASIC-replacement silicon -> semiconductor IC, and Stratix III devices typically appear where ASIC NRE cost or time-to-market constraints make a custom mask design uneconomic. Key features of the EP3SL50F780C4G include 47,500 logic elements, 2,184,192 embedded memory bits organized into M9K/M144K blocks, 488 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, four PLLs, and a 65 nm low-power copper process node. Configuration can be loaded via fast passive parallel, fast active serial, or JTAG, with bitstream encryption supported by the Stratix III security features. The architecture uses adaptive logic modules (ALMs) that combine 8-input fracturable look-up-tables with dedicated carry chains and register chains, giving the device strong arithmetic and pipelining density. The 65 nm process delivers a meaningful dynamic-power advantage over 90 nm Stratix II designs, with Quartus II power-estimator accuracy typically within 15%. Typical applications include telecom baseband prototyping, high-speed data-acquisition cards, ASIC-emulation and verification platforms, broadcast video processing, and high-performance DSP pipelines such as FFT, FEC, and beamforming. The 780-FBGA package offers abundant I/O bandwidth for memory-bus fan-out. Designers should plan power integrity with a multi-rail decoupling network (1.1 V core, 2.5 V/3.3 V auxiliary) and consider thermal envelope at full toggle rate; the Stratix III L family is the lower-static-power tier of Stratix III, but careful thermal analysis at junction temperature is still required for closed-enclosure designs. This page synthesizes distributor inventory, drop-in same-family alternatives drawn from the Site MPN list, application guidance, and design notes that are not consolidated on the manufacturer product page, providing a single, citation-ready reference for procurement and engineering teams.
EP3SL50F780C4L - Stratix III L FPGA, 47.5K Logic Elements, 780-FBGA | Intel
The Intel EP3SL50F780C4L is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine Ball-Grid Array (FBGA) package. It integrates 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, and 488 user I/Os. Fabricated on a 65 nm CMOS process, the device operates from a 0.9 V core supply and is targeted at high-performance digital signal processing, ASIC prototyping, and high-bandwidth communication designs where deterministic timing and abundant on-chip memory are required. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as DSP blocks, M20K memory blocks, transceivers, and PLLs. The Stratix III family specifically introduced the 'L' (logic-rich, low-power) and 'E' (enhanced memory/DSP) sub-families; the 'L' variant focuses on higher logic density at lower static power. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below full custom ASICs in cost-vs-performance trade-offs. The device includes embedded DSP blocks supporting variable-precision multiplication, twelve 3.125 Gbps transceivers (variant dependent), up to eight PLLs, and dedicated hardware for PCI Express Gen1/Gen2. The C4 speed grade corresponds to a -4 commercial speed bin, balancing Fmax and power; the 'L' suffix denotes lead-free / RoHS-compliant FBGA packaging. According to Intel (formerly Altera) datasheet literature, the C4 commercial grade delivers logic-cell Fmax around 375 MHz under typical DSP pipelines. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-throughput signal processing for radar or medical imaging, software-defined radio, and high-speed data acquisition. The 488 user I/Os support parallel LVDS interfaces and multiple memory controller interfaces (DDR2/DDR3) implemented in the FPGA fabric. When designing with the EP3SL50F780C4L, use Altera (now Intel) Quartus II or Quartus Prime for synthesis, place-and-route, and timing closure. The 780-FBGA package requires a multi-layer PCB with controlled-impedance routing, a low-impedance core supply decoupling network (typically 0402/0201 ceramics), and thermal management via the package thermal pad connected to an internal copper plane. This page synthesizes distributor pricing, parametric drop-in alternatives from the Stratix III family and the pin-compatible E variant, and practical design notes that supplement the manufacturer datasheet.
EP3SL50F780C4LG - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel EP3SL50F780C4LG is a high-density, low-power Field Programmable Gate Array (FPGA) from the Stratix® III L family, delivering 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. It is fabricated on a 65 nm process node and operates from a 0.9 V core supply, combining high logic density with power-optimized architecture for mid-range digital designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, memory blocks, and DSP blocks) interconnected by a programmable routing fabric. The Stratix III L sits in the FPGA hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. FPGAs differ from ASICs in that their logic is defined post-fabrication via configuration bitstream, enabling rapid prototyping, design iteration, and field upgrades. The Stratix III L sub-family targets lower static power than the standard Stratix III E variants while preserving most of the high-performance transceiver and DSP resources for cost-sensitive applications. Key features of the EP3SL50F780C4LG include 47,500 logic elements, 2,184,192 bits of embedded memory (~2.1 Mbit), integrated DSP blocks for high-speed multiply-accumulate operations, programmable phase-locked loops (PLLs) for clock synthesis, and 488 user I/O pins supporting multiple I/O standards. The C4 speed grade denotes a specific timing bin within the family, and the LG suffix indicates the 780-ball FC-FBGA package with lead-free and halogen-free (Pb-free / HF) compliance. Architecture is built on a 65 nm TSMC low-power process, leveraging Intel (formerly Altera)'s adaptive logic module (ALM) structure that combines 8-input fracturable look-up tables with dedicated register chains. The device integrates hard memory controllers, PCIe Gen1 hard IP blocks, and serializer/deserializer (SERDES) capability at specific speed grades, enabling high-bandwidth I/O without consuming programmable fabric. Typical applications include high-speed digital signal processing for wireless baseband, video broadcast infrastructure, image processing pipelines, radar signal processing, high-end industrial automation controllers, and ASIC prototyping. The 488 user I/O and large memory complement make it suitable for parallel data-path applications requiring both broad connectivity and substantial on-chip buffering. When designing with this device, engineers must provide multiple decoupling capacitors (typically 100 nF and 10 µF) per power rail, route each PLL power pin with its own filtered supply, and follow Intel's pinout guidelines for the 780-FBGA package to avoid signal-integrity degradation. Configuration can be loaded via JTAG, passive serial, or a dedicated flash device. This page synthesizes distributor pricing, drop-in Stratix III L family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the EP3SL50F780C4LG for production designs.
EP3SL50F780C4LN - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
The Intel EP3SL50F780C4LN is a high-density, low-power member of the Stratix III L FPGA family, providing 47,500 logic elements, 1,900 logic array blocks, and 2,184,192 bits of embedded RAM in a 780-pin FC-FBGA (29x29 mm) package. It is built on a 65 nm process and operates across a 0.86 V to 1.15 V core supply range, with a maximum core frequency of 450 MHz. The device exposes 488 user I/O pins and integrates transceivers and DSP blocks typical of the Stratix III L series, targeting high-throughput signal-processing and memory-centric designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines programmable logic fabric, hierarchical routing, dedicated DSP blocks, embedded memory (BRAM/M20K), and high-speed serial transceivers. The Stratix III L sub-family extends the Stratix III line with reduced static power while preserving the architecture: ALM-based logic, TriMatrix embedded memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and are widely used as ASIC prototyping platforms, hardware accelerators, and glue-logic bridges in heterogeneous SoCs. Key features of the EP3SL50F780C4LN include 47.5 K logic elements (47500), 1900 LABs, 2,184,192 total RAM bits, 488 user I/Os, and the Stratix III L power-optimized fabric. The 'L' suffix denotes the low-power variant, which trims static leakage versus the standard Stratix III E family while retaining the same transceiver and DSP capability in the F780 (780-ball FBGA) footprint. The 'C4' speed grade and 'LN' suffix (lead-free, enhanced) are the standard ordering codes for industrial-temperature, lead-free assembly. Architecturally, the EP3SL50F780C4LN leverages ALMs (Adaptive Logic Modules) rather than older 4-input LUTs, allowing each ALM to implement either two independent 4-input LUTs or one 6-input function with shared arithmetic. Combined with the TriMatrix memory system (MLAB, M9K, M144K blocks) and dedicated DSP blocks optimized for 18x18 multipliers, this delivers high DSP throughput at lower logic area. Multiple high-speed transceivers (per family capability) and dedicated PLL/DLL blocks handle clock distribution, while the programmable power technology allows unused fabric to be powered down for energy efficiency. Typical applications include telecom baseband processing, military radar signal chains, high-performance ASIC prototyping, test-and-measurement instrumentation, and broadcast video processing. The device is also suited to high-throughput data-acquisition cards, software-defined radio front ends, and industrial imaging pipelines where parallel DSP and ample block RAM are decisive. When designing with the EP3SL50F780C4LN, engineers should plan power-rail decoupling carefully, use Altera/Intel Quartus II (legacy) for bitstream generation, and validate thermal envelopes against the 780-FBGA theta-JA. Designers upgrading from the E variant should confirm Quartus device support and pin compatibility, since the L family shares the F780 package but has different static-power characteristics. This page synthesizes distributor pricing (as of 2026-09-10), drop-in alternatives sourced from the Stratix III L family cross-reference, and practical design notes not found in the standalone Intel datasheet.
EP3SL50F780C4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SL50F780C4N is a high-performance, low-power Stratix III L FPGA fabricated on a 65 nm CMOS process, integrating 47,500 logic elements (LEs), 1,900 LABs/CLBs, 2,184,192 bits of embedded RAM, and 488 user I/Os in a 780-ball FineLine BGA package. Speed grade -4 with commercial temperature range (0C to +85C), it supports up to 717 MHz operation per the manufacturer product family and is drop-in compatible with other Stratix III variants in the same FBGA-780 footprint. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory interfaces, multipliers) into a single die. FPGAs sit at the top of the digital logic hierarchy: programmable logic -> configurable logic block -> FPGA -> programmable semiconductor. Stratix III in particular introduced advanced power management, hard memory controllers, and DSP blocks, making it the workhorse for high-throughput digital signal processing, high-speed serial links, and ASIC prototyping in the late-2000s and early-2010s design cycles. Key features include 47,500 logic elements, 2,184,192 embedded RAM bits (about 273 KB), 488 user I/Os, hard DSP blocks for high-speed arithmetic, hard memory controllers supporting DDR/DDR2/DDR3, and dedicated high-speed transceivers in higher-density family members. The 65 nm process delivers a favorable performance-per-watt ratio versus the prior Stratix II generation, and the 780-ball FC-FBGA package exposes many high-speed SERDES-capable pins while keeping board-level routing feasible. Typical applications include ASIC prototyping and emulation, high-speed data-acquisition front-ends, telecom baseband signal processing, military/aerospace DSP, test-and-measurement instrumentation, and high-performance compute accelerators. The large logic capacity combined with 488 user I/Os also makes it suitable for industrial imaging and broadcast video processing. When designing with the EP3SL50F780C4N, follow Altera's Stratix III Hardware Reference Manual power-up sequencing: drive all power rails through the Power Management Bus (PMBus) or a TI/Linear Technology sequencer, and respect the 1.1 V core / 0.86-1.15 V supply window. Decoupling and PCB layout for a 780-ball FC-FBGA demand a multilayer board with buried vias and a solid ground pour. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. The data sources include distributor listings, the Altera/Intel Stratix III datasheet family, and the manufacturer product page.
EP3SL50F780I3 - Stratix III FPGA 488 I/O 780-FBGA | Intel
The Intel (formerly Altera) EP3SL50F780I3 is a Stratix III L-series field-programmable gate array (FPGA) with 47,500 logic elements, 1,900 logic array blocks (LABs), and 488 user I/O pins in a 780-pin flip-chip fine-pitch BGA (FBGA) package. Built on a 65 nm process with selectable core voltage and Programmable Power Technology, it delivers low static and dynamic power for high-performance DSP- and memory-intensive designs. Per the Altera Stratix III family datasheet, all Stratix III devices support vertical migration within the same package, allowing the EP3SL50 to be migrated to the EP3SL70 in the 780-pin FineLine BGA with identical pinout, dedicated pins, configuration pins, and power pins. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, routing, and I/O can be electrically reconfigured by the end user after manufacture. Stratix III belongs to the high-performance FPGA class within the broader programmable logic hierarchy: FPGA -> programmable logic -> logic IC -> digital semiconductor. The 'L' sub-family targets low-power applications via selectable core voltage (1.1 V or 0.9 V operation), making it suitable for power-sensitive telecom, broadcast, and defense systems where previous-generation Stratix II designs are being refreshed. Key features include 47,500 logic elements, 1,900 LABs, 2,106 Kbit embedded memory (M9K + M144K blocks), 16 transceiver channels supporting up to 3.75 Gbps with 8 dedicated 6.5 Gbps channels, and a thermal-grade -40C to +100C industrial operating range. The 'I3' speed grade and industrial temperature suffix indicate operation up to 100C ambient with timing closure at the third-fastest Stratix III speed bin. The architecture combines adaptive logic modules (ALMs), embedded memory, embedded multipliers (DSP blocks), and high-speed transceivers, all connected by a multi-tier routing fabric. Programmable Power Technology allows unused logic, memory, and DSP blocks to enter a low-power state, while the transceiver tiles support protocols such as PCIe Gen1, Serial RapidIO, and CPRI. Per the manufacturer datasheet, this combination enables signal processing throughput well above what is achievable in smaller Cyclone or Arria devices. Typical applications include 40G/100G line-card packet processing, software-defined radio baseband, video broadcast encoders, military secure communications, and ASIC prototyping. The wide transceiver count makes it attractive for designs requiring multiple high-speed serial links alongside a large parallel logic fabric. When designing with this device, ensure the Quartus II design software version supports Stratix III and that PCB land pattern follows the 1 mm pitch 780-ball FC-FBGA layout. Plan for multi-rail power (VCCINT selectable, VCCAUX, VCCPD per bank) and adequate decoupling to meet transceiver jitter specs. This page synthesizes distributor pricing, drop-in vertical-migration alternatives within the Stratix III family, and practical design notes that go beyond the manufacturer datasheet alone.
EP3SL50F780I3G - Stratix III L FPGA, 47.5K LE, 780-BGA | Intel
The Intel (formerly Altera) EP3SL50F780I3G is a low-power member of the Stratix® III L FPGA family, integrating 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 2.08 Mbits of embedded memory into a 780-ball FineLine BGA (FCBGA) package. It is offered in the -I3 industrial speed/temperature grade, optimized for power-sensitive applications requiring balanced logic, memory, and DSP throughput. According to the DigiKey product listing, the device exposes 488 user I/Os and operates from a 1.1 V core supply, making it suitable for mid-complexity signal processing, video bridging, and high-speed serial interface aggregation. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect fabric. FPGAs are positioned between discrete logic and ASICs in the digital design hierarchy: ASIC > CPLD > FPGA > discrete logic > standard-cell IC, and they belong to the broader family of programmable logic devices that includes CPLDs, SPLDs, and structured ASICs. The Stratix III L sub-family specifically reduces static and dynamic power versus the standard Stratix III family while preserving the same high-performance transceiver and memory architecture, enabling fan-out to power-budgeted telecom, industrial, and test & measurement designs. Key features of the EP3SL50F780I3G include support for up to 488 general-purpose I/Os, 2,184,192 bits of total on-chip memory (distributed plus block RAM), high-speed transceivers, and dedicated DSP blocks for fixed- and floating-point operations. The 780-pin FCBGA package supports high-pin-count designs while offering a thermal envelope that scales with PCB copper area. The -I3 grade specifies an industrial operating range of -40C to +100C junction and a moderate speed bin, balancing timing margin against leakage. On the architecture side, Stratix III L uses Intel's 65 nm process and an ALM-based fabric that delivers finer-grained logic packing than legacy 4-LUT architectures, reducing logic-element waste for wide arithmetic paths. Memory blocks (M9K/M144K) and DSP blocks operate at up to ~500 MHz internally per the Stratix III family capability, supporting external memory interfaces such as DDR3 with PHY hard IP. Typical applications include wireless baseband preprocessing, software-defined radio front ends, video format conversion and bridging, industrial motor control and robotics, medical imaging preprocessing, and test & measurement instrumentation. Engineers targeting these workloads select this device when they need more logic and DSP than a Cyclone family device but do not require the higher transceiver count of a Stratix V-class FPGA. For PCB design, allocate at least 6 to 8 PCB layers for the 780-BGA break-out, with via-in-pad recommended for the inner-row balls. Use the Quartus II (or Intel Quartus Prime) software for synthesis, place-and-route, and power estimation; legacy Stratix III support is available through the Quartus II subscription service. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III L family, and PCB design considerations that complement the manufacturer datasheet.
EP3SL50F780I3N - Stratix III L FPGA, 47.5K LE, FBGA-780 | Intel
The Intel EP3SL50F780I3N is a member of the Stratix III L FPGA family fabricated on a 65 nm CMOS process, integrating 47,500 logic elements, 1,900 LABs (Logic Array Blocks), and 2,184,192 bits of embedded memory in a 780-ball FC-FBGA (Flip-Chip Fine-pitch BGA) package. The device supports up to 488 user I/Os and operates from a 1.1 V core supply, providing a balance of high logic density, signal integrity, and power efficiency for mid-range high-performance designs. Speed-grade -3 places the part in the high-performance tier of the Stratix III L family. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric and routing resources can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit between fixed-function ASICs and software-driven processors in the digital design hierarchy, offering parallelism, deterministic timing, and the ability to update hardware behavior in the field. The Stratix III family targets high-performance DSP, communications, and signal-processing designs where high logic density, embedded memory, and high-speed transceivers are required. Key features of the EP3SL50F780I3N include 47,500 logic elements, 1,900 LABs, 2,184,192 bits of embedded memory, 488 user I/Os, and compliance with the IEEE 1149.1 JTAG boundary-scan standard. The -3 speed grade delivers the highest performance tier within Stratix III L, with Fmax performance suitable for high-speed DSP pipelines. The FBGA-780 package uses flip-chip technology to minimize lead inductance and maximize signal integrity at multi-hundred-megahertz switching rates. The device is built on a 65 nm low-leakage process technology, with programmable power options that allow unused blocks to enter low-power states. This combination of logic density, memory bandwidth, and I/O count makes the EP3SL50F780I3N suitable for high-throughput data-pipeline, telecom baseband, video processing, and ASIC prototyping applications. Typical applications include high-speed DSP filter and FFT pipelines, telecom baseband processing, ASIC prototyping, video and image processing engines, and high-speed serial protocol bridging. Designers typically pair the device with external DDR2/DDR3 SDRAM and clock-generation PLLs. When designing with this device, ensure that all 1.1 V core and auxiliary supplies are properly decoupled with low-ESR capacitors placed as close as possible to the package balls. The FBGA-780 footprint requires a multilayer PCB with microvia technology and matched-length traces for high-speed memory interfaces. Reference the Quartus II development environment and Altera JTAG programming cables for device configuration.
EP3SL50F780I4 - 50K LE Stratix III L FPGA, 780-BGA, Industrial | Intel
The Intel (formerly Altera) EP3SL50F780I4 is a member of the low-power Stratix III L FPGA family, integrating 47,500 logic elements and 2,184,192 bits of embedded memory into a 780-ball flip-chip BGA (FCBGA) package. The device is built on a 40 nm TSMC process, runs over fabric at up to 500 MHz internally, and is rated for the industrial temperature range (-40C to +100C). It offers 488 user I/Os and supports up to 8.5 Mbits of M20K block memory with 244 dedicated 18x18 multipliers. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hardened IP (memory, multipliers, transceivers, PLLs). FPGAs occupy a position in the broader hierarchy of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital logic, DSP pipelines, and high-speed serial interfaces. Compared with CPLDs, FPGAs offer higher logic density, embedded memory, and SERDES capability, at the cost of higher static power and more complex configuration. Key features of the EP3SL50F780I4 include 47,500 logic elements, 2,184,192 bits of embedded SRAM arranged as M20K blocks, 244 18x18 multipliers for DSP, support for DDR3/QDRII+/RLDRAM II external memory interfaces, and up to 8 PLLs plus 28 global clock networks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through its 488 user pins, and provides built-in PCIe hard IP blocks. Architecturally, Stratix III L uses a core supply of 0.9 V, a phase-locked clock tree, and programmable power technology that allows unused logic tiles to enter a near-zero static-current state. The 780-FCBGA package supports the full GPIO and transceiver bandwidth of the device and is the largest FBGA variant in the Stratix III L line, accommodating the largest EP3SL340 die and ball-mapped variants. Typical applications include high-throughput DSP pipelines, software-defined radio, telecom baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe Gen2, SRIO, Gbps Ethernet), broadcast video processing, and military/aerospace signal processing. The industrial temperature grade and high logic density make it suitable for ruggedized embedded computing platforms. When designing with this FPGA, plan for power sequencing across the 0.9 V core, 1.0/1.2 V analog, 1.5/2.5/3.3 V I/O rails, and follow Intel's Stratix III power-up and configuration guidelines. Quartus II (or newer Intel Quartus Prime) software is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes Intel/Altera distributor pricing, package-compatible alternatives from the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
EP3SL50F780I4G - 47,500 Logic Elements FPGA | Altera
Altera EP3SL50F780I4G is a high-density Stratix III L field-programmable gate array containing 47,500 logic elements and 2,184,192 bits of embedded memory in a 780-ball fine-pitch BGA package. The verified source identifies 488 I/O and the F780 780-BBGA, FCBGA package designation. The part belongs to the programmable-logic hierarchy: FPGA, programmable logic device, logic IC, and integrated circuit. Its combination of logic capacity, embedded memory, and a large ball-grid array supports complex digital systems while preserving reconfigurable hardware implementation. A field-programmable gate array is an integrated circuit built from configurable logic blocks, programmable routing, input/output resources, and dedicated functional blocks. Designers configure these resources to implement processors, interfaces, protocol bridges, digital-signal-processing pipelines, and control logic. FPGAs differ from fixed-function ASICs because their logic can be revised after fabrication, making them useful for evolving standards, late design changes, prototypes, and production equipment requiring field updates. The EP3SL50F780I4G provides 47,500 logic elements, 2,184,192 embedded-memory bits, and 488 I/O according to the verified distributor listing. These headline resources place the device in high-density programmable-logic designs where substantial parallel processing and multiple external interfaces are required. The 780-BBGA, FCBGA construction supports the high pin count associated with 488 I/O and is intended for advanced surface-mount assemblies using appropriate BGA assembly and inspection processes. Stratix III L devices use SRAM-based configuration memory, so the configured FPGA design is normally loaded at power-up from an external configuration source. Implementation therefore requires attention to configuration pins, clock distribution, power sequencing, decoupling, and signal integrity. Because detailed process technology, transceiver count, maximum clock frequency, operating voltage, temperature grade, and thermal metrics are not present in the supplied data, those parameters remain explicitly unverified rather than being inferred. Typical applications include telecommunications infrastructure, industrial automation and control, test and measurement equipment, medical imaging hardware, aerospace and defense electronics, video processing, and high-speed data acquisition. In these systems, the device can implement multiple processing and interface functions in one programmable device. A 488-I/O resource count can simplify system partitioning when many external memories, converters, processors, or backplane transceivers must be connected. The primary design constraint is package complexity. A 780-ball FCBGA assembly requires controlled impedance routing, multiple supply rails with local decoupling, reliable power delivery, thermal analysis, and manufacturer-qualified PCB assembly. Firmware, configuration storage, and JTAG or other supported debug resources must also be validated against the complete manufacturer documentation before release. This page consolidates verified stock, package, I/O, logic-element, and embedded-memory data with practical engineering guidance and same-family configuration context. It does not invent a missing block diagram, pin assignment, speed grade, power specification, or lifecycle claim.
EP3SL50F780I4L - 47.5K Logic Elements Stratix III L FPGA | Intel
The Intel EP3SL50F780I4L is a low-power Stratix III L FPGA delivering 47,500 logic elements, 488 user I/Os, and 2,184,192 bits of embedded memory in a 780-pin FCBGA package. The part belongs to the Stratix III L family, which is the power-optimized variant of the Stratix III generation fabricated on a 65 nm CMOS process and operates with a core voltage of 0.9 V. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that contains an array of programmable logic blocks, embedded memory, DSP blocks, and high-speed transceivers all wired together through a programmable interconnect fabric. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class throughput and parallelism while remaining field-updatable through their SRAM-based configuration memory. Within the broader semiconductor taxonomy, an FPGA sits at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit). Stratix III devices target high-performance DSP, communications, and signal-processing applications that require a balance of logic density, embedded memory bandwidth, and transceiver I/O. Key features of the EP3SL50F780I4L include 488 user I/O pins, 2,184,192 bits of embedded RAM, integrated DSP blocks, and support for multiple I/O standards such as LVDS, LVTTL, LVCMOS, and HSTL through 8 I/O banks. The 'L' suffix identifies the device as the low-power member of the Stratix III family, with reduced static and dynamic power versus the Stratix III E variant. The 'I4' speed grade and 'L' package suffix place the device in the industrial temperature range (-40C to +100C) in a lead-free 780-ball FCBGA. Typical applications include high-speed data acquisition, telecom baseband processing, military/aerospace signal processing, medical imaging, and ASIC prototyping. The wide I/O count and large embedded memory make the EP3SL50F780I4L well-suited to designs that aggregate multiple data streams or implement deep packet buffers. When designing with this FPGA, plan for multi-rail power (typically 0.9 V core, 1.1 V/1.2 V PLL, 1.5 V/1.8 V/2.5 V/3.3 V I/O), controlled-impedance PCB routing for transceiver channels, and adequate thermal management for the FCBGA substrate. Quartus II is the supported design suite; legacy projects should migrate to the latest Quartus Prime release that retains Stratix III device support. This page consolidates distributor inventory, drop-in Stratix III alternatives, and engineering design notes that go beyond what the manufacturer datasheet alone provides for legacy device sourcing.
EP3SL50F780I4LG - Stratix III L FPGA, 47.5K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F780I4LG is a Stratix III L family field-programmable gate array (FPGA) delivering 47,500 logic elements, 19,000 adaptive logic modules (ALMs), and 2,184,192 bits of embedded memory in a 780-ball flip-chip BGA (FCBGA) package. The device integrates 488 user I/Os, supports 1.1 V core operation, and is rated for the industrial temperature range of -40C to +100C. Per the DigiKey listing, the part is a member of the low-power (L) Stratix III sub-family aimed at high-performance, power-sensitive designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and embedded hardened IP such as block RAM, DSP slices, transceivers, and PLLs. The Stratix III line sits in the high-end domain hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are chosen over ASICs when time-to-market, in-field reprogrammability, or low-to-medium production volume justify their higher unit cost and higher power consumption. The 'L' suffix denotes the Stratix III low-power variant, which traded peak performance for substantially lower static power versus the standard Stratix III family. Key features of the EP3SL50F780I4LG include 47,500 logic elements (roughly 19,000 ALMs in Altera's adaptive logic module architecture), 2.184 Mbit of embedded RAM, 488 user I/O pins, and the speed grade 4 industrial-grade device (the 'I4' suffix indicates industrial temperature range and speed grade 4). The 780-FCBGA flip-chip BGA package provides high pin density and excellent electrical performance for high-speed signals. The device supports multiple I/O standards and serial transceivers typical of the Stratix III family. Typical applications for this device include high-performance digital signal processing, telecom baseband processing, military and aerospace signal processing, high-speed instrumentation, and ASIC prototyping. Designers choose this part when they need a balance of logic density, embedded memory, and I/O count in a thermally manageable low-power FPGA. The 'I4LG' suffix indicates lead-free, industrial-temperature, speed-grade 4 packaging. When designing with this FPGA, verify that PCB BGA escape routing, power-rail decoupling, and thermal management are sized for the 780-pin flip-chip BGA footprint. Use Altera/Intel Quartus II design software for synthesis, place-and-route, and bitstream generation. Program the configuration flash with the appropriate JTAG or Active Serial (AS) scheme.
EP3SL50F780I4LN - Stratix III L FPGA 47.5K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP3SL50F780I4LN is a Stratix III L family field-programmable gate array (FPGA) with 47,500 logic elements (LEs), 2,184,192 bits of embedded memory, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FC-FBGA) package. It is the industrial-temperature, lead-free (-4) speed-grade variant of the EP3SL50F780 logic-density class and targets designs that need Stratix III transceivers and DSP blocks in a low-power variant. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic (PLD) and to the ASIC-prototyping/high-performance-compute category, providing hardware-level parallelism with software-defined functionality. The Stratix III family was introduced on TSMC's 65 nm process and is split into L (low-power) and E (enhanced-logic/memory) variants; the L family reduces dynamic power by approximately 50% relative to E at comparable speed. Key features of the EP3SL50F780I4LN include 47,500 LEs organized into 1,900 logic array blocks (LABs), 2,184,192 bits of embedded memory distributed between MRAM blocks and M9K block RAM, and dedicated 18x18 multipliers for DSP. The device supports high-speed transceivers suitable for multi-gigabit serial links (per family capability) and offers programmable power technology with hot-socketing support for live insertion into backplanes. The architecture combines 9-Kbit M512 blocks, 144-Kbit M-RAM blocks, and adaptive logic modules (ALMs) that implement both combinatorial and registered logic. Industrial temperature grade (-40C to +100C ambient) makes the device suitable for harsh-environment embedded computing, while the -4 speed grade balances timing margin against Fmax. Typical applications include high-speed serial interface bridging, telecom line-card data-path processing, military/aerospace signal processing, ASIC prototyping, and DSP-intensive industrial vision or radar front-ends. The 780-FBGA package with 1.0 mm ball pitch provides high I/O density for multi-channel designs. When designing with this device, ensure PCB layout follows Intel/Altera flip-chip BGA escape rules with microvia or via-in-pad technology. Thermal management should account for the device's typical power dissipation under sustained logic activity, and decoupling must follow the Stratix III PDN guidelines. Power sequencing must comply with the Stratix III hot-socket specification to avoid inrush current damage. This page synthesizes distributor pricing, drop-in alternative ordering numbers, and design notes that are not aggregated on the manufacturer datasheet alone.
EP3SL50F780I4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel EP3SL50F780I4N is a low-power member of the Stratix III L Field Programmable Gate Array (FPGA) family, integrating 47,500 Logic Elements, 2,184,192 bits of embedded memory, and 488 user I/O pins into a 780-ball Flip-Chip BGA (FC-FBGA) package. It is fabricated on a 65 nm TSMC process and targets high-density, power-sensitive designs that require the programmability of an FPGA with low static and dynamic power consumption. The 'I4N' suffix indicates an industrial temperature grade (-40C to +100C) and lead-free Pb-free plating per RoHS. A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O behaviour can be redefined after manufacturing through a configuration bitstream. Within the broader hierarchy, an FPGA sits above fixed-function ASICs and below software-programmable processors in terms of design flexibility vs deterministic performance. Stratix III L devices specifically trade raw logic capacity for up to 50% lower power than the standard Stratix III E family, making them suited to applications where thermal envelope and total energy are first-order design drivers. Key features of the EP3SL50F780I4N include 47,500 Logic Elements, 2,184,192 user RAM bits distributed across TriMatrix memory blocks, 488 single-ended (or 244 differential) user I/Os, support for up to 12.5 Gbps transceivers via the device family, and integrated DSP blocks for fixed- and floating-point signal processing. The 780-ball FC-FBGA package uses Intel's Flip-Chip land-grid-array construction with a 1.0 mm ball pitch typical for this family, providing high pin density while supporting standard reflow assembly. Architecture depth: Stratix III L devices use a fabric of adaptive logic modules (ALMs), each containing two combinational adaptive LUTs and two registers, fed by a hierarchical routing network with quarter-turn and length-4/16 wires. The integrated memory subsystem uses TriMatrix blocks (MLAB, M9K, M144K) to balance latency and density. Configuration is stored in SRAM and loaded from a flash or via JTAG at power-up. Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial protocol bridging (PCIe Gen2, SRIO, CPRI), video broadcast and image processing pipelines, and military/aerospace signal processing where industrial temperature grade and BGA packaging are required. Design consideration: BGA fan-out, power-rail decoupling (0.9V core, 3.3V/2.5V aux, 1.2V transceiver), and configuration-strategy selection (Active Serial vs JTAG) must be planned before PCB layout. This page synthesizes current distributor pricing, drop-in package-equivalent variants within the Stratix III family, and design notes not consolidated in a single manufacturer document.
EP3SL70F484C2 - 67.5K Logic Elements Stratix III L FPGA | Intel
The Intel (formerly Altera) EP3SL70F484C2 is a 67,500 logic-element Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FC-FBGA) package, fabricated on a 65 nm low-power process and rated for a maximum core clock of 600 MHz with a 1.1 V core supply. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of configurable logic blocks (LBs/LABs), programmable interconnect, and a hierarchy of memory and DSP blocks. FPGAs occupy a unique tier between fixed-function ASICs (higher performance, higher NRE, longer time-to-market) and microcontrollers (lower performance, software-defined). The Stratix III family in particular targets high-throughput parallel processing for wireless baseband, video imaging, and high-speed serial interconnect, with the "L" sub-family emphasizing the lowest static power in the Stratix III generation. Key features of the EP3SL70F484C2 include 2,699,264 bits of embedded RAM, 296 user I/O pins, 2,700 logic array blocks (LABs), embedded multipliers for DSP, up to 12 transceivers depending on pinout variant, and dedicated PLL and memory interface circuitry. The "C2" speed grade designates a commercial temperature range (0C to +85C) with a mid-tier Fmax timing closure; "C4" is the slower and "C3" a faster commercial grade. Architecturally, Stratix III devices use Altera's adaptive logic module (ALM) of 8 inputs and a programmable-routing fabric optimized for timing closure at high utilization. The 65 nm process and on-chip voltage regulation allow static power reductions of roughly 50% compared to Stratix II at equivalent logic density. Typical applications include software-defined radio (SDR) baseband, real-time video processing and display pipelines, industrial machine vision, high-speed data acquisition, and protocol bridging such as PCIe Gen1/Gen2 endpoints. The 484-pin FC-FBGA package is suited to mid-density designs where board area permits a 1.0 mm pitch BGA. When designing with the EP3SL70F484C2, choose the C2 grade when your critical path sits between the C3 (fastest) and C4 (slowest) timing corner - this often yields the best price/performance trade-off. Always validate pinout against the Quartus II pin planner before PCB layout, since the 484-ball FC-FBGA is shared across multiple Stratix III density and pinout variants. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL70F484C2G - 67.5K LE Stratix III L FPGA FCBGA-484 | Intel
The Intel (Altera) EP3SL70F484C2G is a Stratix III L family Field Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os, fabricated on a 65 nm process and housed in a 484-ball FineLine Ball-Grid Array (FCBGA) package. It is supplied in a commercial 0 °C to +85 °C temperature grade, speed grade 2, and is targeted at high-density, high-throughput digital logic designs where deterministic timing and abundant on-chip memory are required. A Field Programmable Gate Array (FPGA) is a programmable logic device built around a fabric of configurable logic blocks (LBs), programmable routing, and embedded memory, DSP, and clock resources. Stratix III L belongs to the low-power static-power-optimized Stratix III sub-family; it sits in the broader hierarchy of FPGA → programmable logic → logic IC → semiconductor. Unlike fixed-function ASICs, FPGAs allow post-silicon hardware reconfiguration, making them well suited to evolving protocols, parallel datapaths, and hardware acceleration. Key features of the EP3SL70F484C2G include 27,000 Adaptive Logic Modules (ALMs), 2.57 Mbit of embedded RAM, integrated DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers, and on-chip PLLs for multi-clock domain synthesis. The 484-pin FCBGA package exposes 296 user I/Os and provides a low-inductance, low-impedance power/ground distribution network, which is essential for signal integrity at multi-hundred-megahertz toggle rates. The device operates from a 1.1 V core supply with auxiliary 2.5 V/3.0 V I/O and analog supplies. The 65 nm process node and the Stratix III L "Programmable Power Technology" allow unused logic, routing, and memory blocks to be powered down block-by-block, yielding a static power envelope that is significantly lower than the equivalent Stratix II device at the same utilization. Typical applications include high-performance DSP (radar, software-defined radio, baseband), ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, SFI), image and video processing pipelines, and military/aerospace signal processing where the device family supports extended temperature and radiation-tolerant variants. When designing with this device, ensure a 6- to 8-layer PCB with continuous ground planes, matched-length differential pairs for transceiver links, and a power-tree that delivers at least 20 A to the 1.1 V core rail. Quartus II is the supported development environment; design compilation time scales with logic utilization and is roughly 1–2 hours for a fully utilized EP3SL70 design. This page synthesizes distributor pricing, same-package and cross-package equivalents, and practical design notes that go beyond the manufacturer datasheet, giving an engineer a single-page decision view of the EP3SL70F484C2G.
EP3SL70F484C2N - 67.5K LEs, 296 I/O Stratix III FPGA | Intel
The Intel EP3SL70F484C2N is a 65nm Stratix III L-series Field Programmable Gate Array (FPGA) with 67,500 logic elements (LEs), 2,699,264 bits of embedded memory, and 296 user I/Os, housed in a 484-pin flip-chip BGA (FC-FBGA) package. It operates on a 1.1V core supply at up to 600 MHz fabric speed and is qualified for the commercial 0C to +85C temperature grade (suffix C2). An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LBs/LEs) interconnected by a programmable routing fabric, surrounded by programmable I/O cells and hardened peripherals such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the broader taxonomy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix III family uses a low-power 65nm process with programmable power-rail gating to reduce static consumption versus prior 90nm Stratix II. Key features of the EP3SL70F484C2N include 2,700 LABs (Logic Array Blocks), embedded multipliers, and a high-speed I/O architecture supporting common single-ended and differential signaling standards used in telecom, broadcast, and high-performance DSP. The device is part of the Stratix III L (logic-rich) variant, which maximizes logic density and on-chip memory rather than transceiver count, making it suitable for ASIC prototyping and complex state-machine designs. The 484-pin FC-FBGA package provides a 1.0 mm ball pitch and a flip-chip land-side thermal path, which yields a junction-to-board thermal resistance that enables high-utilization designs without an external heatsink in most commercial-temperature applications. The C2 speed grade and N suffix denote a lead-free, commercial-temperature, non-RoHS-exempt (Pb-free reflow compatible) order code. Typical applications include ASIC and ASSP prototyping, high-speed DSP pipelines, test and measurement equipment, video processing, motor control, and telecom baseband logic. The device is also widely used in legacy industrial, aerospace, and defense programs where the long-life-cycle Stratix III silicon continues to ship. Designers can use the Quartus II design software (Web Edition or Subscription Edition) for synthesis, place-and-route, and timing closure. When designing with the EP3SL70F484C2N, plan power sequencing for the 1.1V core and 2.5V/3.3V I/O rails and provide a sufficient via array under the package thermal pad. Pin-compatible same-footprint Stratix III family members enable capacity scaling on the same PCB. This page synthesizes Stratix III family parametric data, distributor availability across DigiKey/Mouser/Octopart, and FPGA design considerations not consolidated in a single vendor document.
EP3SL70F484C3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
The Altera (Intel) EP3SL70F484C3 is a Stratix III L family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, offering 67,500 logic elements and 296 user I/Os in a 65 nm process technology. The device integrates 2,699,264 bits of embedded memory and operates with a core voltage of 1.1 V at internal clock frequencies up to 500-800 MHz, providing high-density programmable logic for high-performance digital designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) interconnected by programmable routing fabric. FPGAs sit within the broader hierarchy of programmable logic (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), and are used to implement custom digital logic without fabricating an ASIC, enabling rapid prototyping and design iteration. Key features include 67,500 logic elements, 2,699,264 embedded memory bits, 296 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed arithmetic, and on-chip transceivers optimized for memory interfaces and high-speed serial connectivity. The 1.1 V core voltage and 65 nm process technology deliver favorable power-per-gate ratios compared to earlier Stratix generations. Architecturally, the Stratix III L family uses Altera's adaptive logic modules (ALMs) and a multi-track routing interconnect optimized for timing closure at high frequencies. The -C3 speed grade indicates a moderate speed/power balance suitable for commercial-temperature applications (0C to +85C). The 484-pin FBGA package provides high I/O density in a relatively compact 23 x 23 mm footprint suitable for high-performance PCB designs. Typical applications include high-speed data acquisition systems, telecommunications backplane interfaces, software-defined radio (SDR) baseband processing, ASIC prototyping, video processing and encoding, and high-performance computing accelerators. The large logic capacity and memory make this device well-suited for designs that previously required mid-range ASICs. Designers should pay attention to the Stratix III power planning flow (PowerPlay) and use Altera's Quartus II toolchain for synthesis, place-and-route, and timing closure. The -C3 speed grade has tighter timing margins than -C4 but offers lower power; for designs targeting maximum performance, evaluate -I3 or -I4 industrial grades. This page synthesizes distributor pricing from authorized sources, drop-in same-package alternatives within the Stratix III L family, and practical FPGA design considerations not consolidated in any single manufacturer document.
EP3SL70F484C3G - Stratix III 67.5K LE FPGA 484-FCBGA | Intel
The Intel EP3SL70F484C3G is a Stratix III L-series field-programmable gate array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os, packaged in a 484-ball FCBGA. It operates from a 1.1 V core supply and is specified over the commercial 0 C to +85 C temperature range with a -3 speed grade. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP slices, transceivers, and PLLs. FPGAs occupy the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs are reprogrammed in the field to implement custom digital signal processing, packet processing, glue logic, and compute acceleration. The Stratix III family sits in the high-performance tier of Intel (formerly Altera) FPGAs, optimized for logic density, embedded memory bandwidth, and high-speed serial transceivers. Key features of this specific device include 27,000 adaptive logic modules (ALMs), 2.57 Mbit of embedded block RAM, and the Stratix III Programmable Power Technology that reduces dynamic power by selectively gating unused logic and routing resources. The device supports industry-standard LVDS, LVTTL, LVCMOS, and SSTL I/O standards, along with hard PCI Express Gen1 endpoints and external memory interfaces to DDR3, DDR2, and QDRII+ SRAM. The architecture uses a 40 nm process node with a 9-bit ALM as the fundamental logic element. Each ALM contains two adaptive LUTs, two dedicated adders, four registers, and fracturable carry chains, allowing efficient implementation of both arithmetic-intensive DSP and bit-oriented control logic. The MultiTrack interconnect and TriMatrix memory structure deliver high utilization at clock rates above 300 MHz on typical designs. Typical applications include high-end ASIC prototyping, telecom line-card packet processing, military radar signal processing, medical imaging pre-processing, and broadcast video format conversion. The 484-ball FCBGA footprint supports PCB designs that target Stratix III logic density while preserving routing headroom. When designing with the EP3SL70F484C3G, plan power decoupling with a 1.0 uF bulk capacitor per VCC pin pair and a 0.1 uF decoupling cap on every supply ball. Maintain controlled-impedance routing on all high-speed serial links and place differential pairs within 5 mil length-matching tolerance. This page synthesizes distributor inventory, Stratix III speed-grade options, and same-package drop-in alternatives drawn from the same family and competitor FPGAs, providing decision support not found in the manufacturer datasheet alone.
EP3SL70F484C4 - Stratix III L FPGA 67500 LE | Intel
The Intel EP3SL70F484C4 is a Stratix III L Field-Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded RAM, and 296 user I/O pins, delivered in a lead-free 484-ball FC-FBGA (BGA-484) package and specified for 0°C to 85°C commercial operation. This 65 nm, 1.1 V core device is a mid-density FPGA platform intended for parallel logic, memory, and I/O intensive designs where speed-grade and packaging availability matter. An FPGA is an integrated circuit whose logic fabric can be configured after manufacturing, allowing engineers to implement custom digital logic without committing to an ASIC. FPGAs sit within the programmable logic device hierarchy below ASICs but above simple CPLDs. The EP3SL70F484C4 forms part of the Stratix III L family and is optimized for general-purpose logic from wireline access equipment to broadcast video processing. Key features of the EP3SL70F484C4 include 67,500 logic elements for mid-density systems, 2,699,264 RAM bits for buffering and data storage, and 296 user I/O pins that can interface to multiple single-ended and differential signaling standards. The 484-ball FC-FBGA package provides a compact footprint while still exposing enough I/O for wide parallel buses, DDR memories, and external commodity interfaces. Distributor listings report this device as lead-free, and FPGAkey records a 1.1 V core supply voltage on a 65 nm process. Although this part has no embedded high-speed serializer/deserializer transceivers in the logic-only L configuration, its logic density, embedded memory, and I/O count make it effective for controller, bridging, preprocessing, and protocol handling tasks. The C4 ordering bin in the Altera/Intel nomenclature denotes a commercial-temperature, speed-grade-sorted variant used for lower-cost applications where the higher speed grade is not required. Typical applications include indoor telecom/network line cards, broadcast video processing chains, industrial automation controllers, medical imaging preprocessing, test and measurement instruments, and FPGA prototyping platforms. The 0°C to 85°C commercial temperature range is suitable for indoor, climate-controlled equipment but not for unheated automotive or extended-ambient deployments. When using EP3SL70F484C4, designers must remember that an FPGA is volatile: configuration must be loaded from an external EPCS/SPI flash or through JTAG on every power-up. Power supply decoupling on the 1.1 V core rail and per-bank I/O supplies is essential for stable timing closure and reliable programming. This page synthesizes distributor pricing, stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. It is intended for engineers comparing EP3SL70F484C4 with other 484-ball Stratix III L derivatives before PCB layout and procurement.
EP3SL70F484C4G - Stratix III 67.5K LE FPGA, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL70F484C4G is a Stratix III L family Field Programmable Gate Array (FPGA) with 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os, housed in a 484-ball FineLine BGA (FCBGA) package. It operates from a 1.1 V core supply and is rated for the commercial 0C to +85C temperature range. The 'C4' speed grade denotes a medium-speed timing bin within the Stratix III family, while the trailing 'G' indicates lead-free / RoHS-compliant ball finish. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that combines programmable logic blocks (logic elements / adaptive logic modules), dedicated memory blocks, DSP blocks, and high-speed serial transceivers on a single die. FPGAs sit at the top of the programmable logic hierarchy (programmable logic device -> CPLD -> FPGA -> SoC FPGA) and are widely used for parallel data-path processing, high-speed protocol bridging, and ASIC prototyping before tape-out. The Stratix III family was built on TSMC's 40 nm process and represented Intel/Altera's high-density, low-power flagship line circa 2008-2010. Key features of the EP3SL70F484C4G include 27,000 adaptive logic modules (ALMs), 2.57 Mbit of embedded RAM, and up to 8 transceivers depending on the configuration. The 484-pin FCBGA package supports Stratix III's rich I/O fabric including LVDS, LVTTL, SSTL, and HSTL I/O standards, alongside dedicated PLL and clock-tree resources. Integrated configuration circuitry supports multiple modes including JTAG, passive serial, and fast passive parallel. At the architectural level, the Stratix III L device integrates programmable logic tiles (each ALM contains 8 LUTs and associated carry chains), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks for 9x9, 18x18, and 36x36 multipliers, and dedicated transceivers that can operate at multi-gigabit data rates. The '70' suffix in the part number designates the device density (LE count) within the Stratix III L family. Typical applications include high-performance digital signal processing, telecommunication infrastructure, ASIC prototyping, broadcast video processing, and high-speed serial protocol bridging. Stratix III devices are also used in defense and aerospace applications requiring high logic density with deterministic timing closure. When designing with this part, careful attention must be paid to power-rail sequencing (1.1 V core plus multiple I/O and auxiliary supplies), JTAG configuration chain integrity, and thermal management - despite the 40 nm process node, large Stratix III designs can exceed 10 W and require airflow or heatsinking at industrial temperatures. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL70F484C4L - Stratix III L FPGA, 67.5K LE, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL70F484C4L is a Stratix III L family Field Programmable Gate Array (FPGA) fabricated on a 65 nm process, delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 296 user I/Os in a 484-ball FC-FBGA package. The device operates at a core voltage of 0.9 V and supports a maximum toggle speed of 375 MHz, with 2,700 logic array blocks (LABs) for high-density parallel logic implementation. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) → programmable logic → semiconductor IC, and offer parallel processing capability that microcontrollers and DSPs cannot match. The Stratix III L series targets ASIC prototyping, high-performance DSP, and communication infrastructure workloads where deterministic, parallel hardware acceleration is required. Key features of the EP3SL70F484C4L include 67,500 logic elements, 2,699,264 bits of embedded memory, 2,700 LABs, 296 user I/Os, 375 MHz maximum operating frequency, 0.9 V core supply, and a 484-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. The Stratix III L family is engineered for low static and dynamic power consumption relative to the original Stratix III, making it suitable for thermally constrained embedded systems. The device integrates programmable logic fabric with rich on-chip memory and DSP blocks, enabling designers to implement custom parallel datapaths, complex state machines, and high-throughput signal-processing pipelines. Configuration is stored in SRAM cells that can be re-loaded at power-up from an external flash or configuration device, supporting in-field design upgrades and multi-bitstream workflows. Typical applications include ASIC prototyping and emulation, high-performance DSP pipelines, wireline communication infrastructure, military and aerospace signal processing, and test and measurement equipment. The 484-FCBGA package offers a compact footprint for high I/O count designs while supporting the power-delivery requirements of high-utilization workloads. When designing with the EP3SL70F484C4L, ensure the PCB has sufficient decoupling capacitors placed close to each power pin, and that the 484-ball BGA footprint is laid out with manufacturer-recommended escape routing. Designers should also note that the Stratix III family is approaching end-of-life (NRND/last-time-buy status), so long-production programs should plan second-source or migration strategies. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL70F484C4LG - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP3SL70F484C4LG is a low-power member of the Stratix III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory (approximately 2.57 Mbit), and 296 user I/O in a 484-pin flip-chip BGA package. Built on a 1.1 V core, 40 nm process technology, the device targets high-performance digital logic designs that demand abundant memory bandwidth, DSP throughput, and transceiver-based serial connectivity without exceeding the power envelope of the original Stratix III family. According to the Altera/Intel Stratix III Device Handbook, the 'SL' suffix denotes the low-static-power variant optimized for thermally constrained applications such as wireline backhaul, software-defined radio, and high-end test & measurement. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (LBs), programmable routing, dedicated DSP blocks, on-chip RAM, and high-speed transceiver or general-purpose I/O into a single monolithic silicon die. Within the broader taxonomy, the EP3SL70F484C4LG belongs to the hierarchy FPGA -> programmable logic -> logic IC -> digital semiconductor, and represents the high-density, low-power node of the Stratix III generation, which itself precedes Stratix IV/V in Intel's programmable-logic roadmap. Key features include 27,000 adaptive logic modules (ALMs) - the basic building block of Stratix III architecture - 2.57 Mbit of embedded memory organized into M9K/M144K blocks, dedicated variable-precision DSP blocks for high-throughput arithmetic, and up to 296 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The FBGA-484 package exposes the full I/O count of this device variant and supports industrial operating temperatures with a commercial-grade 0 C to +85 C range as shipped under the speed grade 4 ordering code. Typical applications include high-speed digital signal processing in software-defined radio, channel cards in wireless infrastructure, ASIC prototyping, high-resolution video processing, and pre-silicon verification platforms. Compared with the higher-cost Stratix III GX/GT variants, the 'L' family omits the multi-gigabit transceivers to reduce both static and dynamic power while preserving the logic, memory, and DSP fabric. When designing with this part, engineers must supply a 1.1 V core rail and a 2.5 V/3.3 V I/O auxiliary rail, ensure JTAG access is preserved, and verify PCB escape routing for the 484-ball flip-chip BGA. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix III family, and practical design considerations not collated in the manufacturer handbook.
EP3SL70F484C4LN - Stratix III L FPGA 67.5K LE | Intel | 484-FBGA
The Intel (formerly Altera) EP3SL70F484C4LN is a Stratix III L family Field Programmable Gate Array (FPGA) IC with 67,500 logic elements, 2,699,264 bits of embedded memory, 296 user I/Os, and 2,700 Logic Array Blocks (LABs), housed in a 484-ball FineLine BGA (FBGA) package. The device is built on a 65 nm TSMC low-power process node and supports core voltages of 0.9 V for the high-performance Stratix III L variant, with a maximum internal clock frequency of 375 MHz. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device belonging to the programmable logic hierarchy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit. Unlike fixed-function ASICs, FPGAs implement arbitrary digital logic through configurable logic elements (LEs), embedded memory blocks (M9K/M144K), DSP blocks, and high-speed transceivers, all wired via programmable routing. The Stratix III L family specifically targets logic-dense, low-power designs where TDP budgets matter, making it a tier between the original Stratix III and the later Stratix IV/IV GX families. Key features include 67,500 logic elements (LEs), 2,699,264 embedded memory bits organized as M9K/M144K blocks, up to 12 transceiver channels in related variants, dedicated DSP blocks for high-throughput arithmetic, and 296 user I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL). The 484-ball FBGA package supports high-density board routing while keeping the die-to-PCB inductance low for 375 MHz operation. The device is offered in the C4 speed grade (commercial, -4) with the L suffix indicating a low-power static power sub-variant and the N suffix indicating a lead-free, RoHS-compliant finish. From an architectural standpoint, the Stratix III L uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables (LUTs), enabling higher logic density per LE than prior Stratix generations. The Programmable Power Technology allows unused logic to enter a near-zero static power state, which is the defining feature of the L suffix versus the standard Stratix III. Typical applications include telecom baseband processing, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition front-ends, and broadcast video routing fabrics. Its logic and memory balance also suits high-performance medical imaging pre-processing and radar front-end signal conditioning. When designing with the EP3SL70F484C4LN, use the Quartus II design suite (version 13.0 or earlier; later Quartus versions require legacy device support). Decoupling requires bulk 0.1 uF + 10 uF capacitors near every VCC/VCCIO/G pin group, and the 484-FBGA land pattern demands 4-layer minimum PCB stack-up with via-in-pad recommended for full BGA fanout. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not found in the manufacturer datasheet.