FPGA & CPLD
Products (7,100+)
EP3SL70F780I3N - Stratix III L FPGA 67.5K LE 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I3N is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os into a 780-ball Flip-Chip FineLine BGA package. It is fabricated on a 65 nm CMOS process, supports a core voltage of 1.1 V (with a tolerance window of 1.05 V to 1.15 V), and operates at speeds up to 500 MHz. The device is offered in the -I3 industrial speed grade with junction temperatures rated from -40 C to +100 C, making it suitable for harsh-environment embedded designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC that sits within the broader hierarchy of digital semiconductors: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. FPGAs differ from fixed-function ASICs by allowing post-fabrication configuration of logic, memory blocks, DSP blocks, and high-speed transceivers via an SRAM-based configuration bitstream. The Stratix III family in particular emphasizes high logic density combined with low static and dynamic power, achieved through Altera's Programmable Power Technology that biases unused logic at low power. Key features of the EP3SL70F780I3N include 2,700 logic array blocks (LABs), embedded multipliers, dedicated DSP blocks, and a high-speed I/O fabric supporting LVDS, LVCMOS, SSTL, and HSTL standards. The 780-FBGA package provides a fine-pitch 1.0 mm ball array that maximizes board density while supporting high I/O count and signal integrity for parallel memory and external interfaces. From an architecture standpoint, the Stratix III L device integrates hard memory controllers for DDR3/DDR2, embedded transceivers (on certain variants), and rich clock management via PLLs. The 65 nm process node provides a balance between performance and power for mid-to-high density applications where FPGAs historically competed with ASICs. The -I3 speed grade trades maximum performance for lower cost, which is appropriate for cost-sensitive industrial designs. Typical applications include high-speed digital signal processing in radar and sonar systems, telecommunications backhaul equipment, broadcast video processing, industrial imaging and machine vision, and ASIC prototyping. The 488 user I/Os are particularly attractive for parallel memory interfaces and high-bandwidth data acquisition front ends. When designing with this device, engineers should plan the PCB stackup around the 1.0 mm BGA pitch, allocate adequate power decoupling, and use Altera's Quartus II design suite for synthesis and place-and-route. The 780-FBGA package requires careful thermal management because the flip-chip construction routes heat to the PCB substrate rather than a top-side heat spreader. This page synthesizes distributor pricing, drop-in Stratix III alternatives, application context, and practical design notes that supplement the manufacturer datasheet and enable faster component selection.
EP3SL70F780I4 - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
The Intel (Altera) EP3SL70F780I4 is a high-density Stratix III L family FPGA delivering 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/O in a 780-ball FC-FBGA package. Manufactured on a 65 nm process node, this device operates at 1.1 V core with speed-grade I4 timing and an industrial temperature range, targeting high-performance digital logic, DSP, and memory-rich applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be programmed and reconfigured after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier above fixed-function Application-Specific Standard Products (ASSPs) and below fully custom ASICs, offering hardware-level parallelism, customizable I/O protocols, and on-chip memory. Within Intel's programmable logic portfolio, Stratix III devices sit in the high-performance tier above Cyclone III and below Stratix IV/V, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs. Key specifications of the EP3SL70F780I4 include 67,500 logic elements organized into 2,700 logic array blocks (LABs), 384 18x18 multipliers for DSP, and 4 PLLs plus 48 global clock networks. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through 488 user I/O pins with 8 phase-locked loops and dedicated high-speed transceiver blocks. Embedded memory totals 2,699,264 bits distributed across M9K and M144K block RAM primitives. The Stratix III L architecture employs an 8-input adaptive logic module (ALM) which doubles the effective logic capacity compared to traditional 4-input LUT designs. Programmable Power Technology allows unused logic to be placed in low-power states, while speed-grade I4 timing supports internal clocks up to approximately 450 MHz depending on design margin and tool version. Configuration is loaded via JTAG or serial passive/active flash modes. Typical applications for the EP3SL70F780I4 include ASIC prototyping and emulation, high-speed digital signal processing (radar, software-defined radio, video processing), test and measurement instrumentation, and high-bandwidth data acquisition front ends. Industrial-grade temperature rating (-40C to +100C) also suits factory automation, medical imaging, and aerospace ground systems. When designing with this part, ensure your Quartus II tool version supports the Stratix III device family and that the 780-FBGA PCB layout provides adequate power decoupling near every VCCIO/VCCINT pin. Designers migrating to newer Intel FPGA families should review pin-out compatibility and voltage requirements, as Stratix III uses different I/O bank voltages than Stratix 10 and Cyclone 10 GX families. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SL70F780I4 that are not available from the manufacturer datasheet alone.
EP3SL70F780I4G - Stratix III L FPGA 67.5K LE, 488 I/O, 780-FBGA
The Intel (formerly Altera) EP3SL70F780I4G is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, with 488 user I/Os, 67,500 logic elements, and 2,699,264 bits of embedded memory. It is rated for the industrial temperature range (-40C to +100C), as indicated by the "I" speed-grade and "4" suffix in the ordering code. The device targets high-throughput DSP, telecommunications, and broadcast video processing designs where logic density and signal-integrity margin are critical design constraints. A Field Programmable Gate Array (FPGA) is a programmable logic device that uses an array of configurable logic blocks (CLBs), programmable routing, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between discrete logic/microcontrollers and ASICs: they offer far higher parallelism and throughput than a microcontroller, and far lower non-recurring engineering (NRE) cost than an ASIC. The Stratix III L variant is optimized for low static and dynamic power versus the standard Stratix III family, allowing denser boards without exceeding thermal envelopes. Key features of the EP3SL70F780I4G include the 780-ball FineLine BGA package supporting 488 user I/Os, 67,500 logic elements, 2,699,264 embedded memory bits, a core architecture built on TSMC's 40nm process, and industrial-grade operation. The 780-FBGA FineLine BGA footprint enables vertical migration across Stratix III L densities within the same package outline, simplifying PCB reuse between EP3SL50, EP3SL70, and EP3SL110 devices. Typical applications include high-performance DSP co-processing, ASIC prototyping, video broadcast infrastructure, software-defined radio front-ends, and high-speed serial protocol bridging. The high logic-element count combined with embedded memory and DSP blocks makes it well suited to parallel filter banks, FFT pipelines, and multi-channel baseband processing. When designing with this device, allocate FPGA I/O banks to voltage domains before pin assignment, and follow Intel/Altera's decoupling and PCB stack-up guidelines for the 780-FBGA package. Vertical migration within the 780-pin package allows board reuse across EP3SL50/EP3SL70/EP3SL110 densities without PCB rework, reducing platform cost. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL70F780I4L - Stratix III L FPGA 488 I/O 780-FBGA | Intel
The Intel EP3SL70F780I4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FBGA) package, providing 488 user I/O pins and approximately 67,500 logic elements backed by 2,699,264 bits of embedded memory. The part is specified as an industrial temperature grade (I4 = -40C to +100C ambient with the I-suffix speed grade), targeting applications that need Stratix III logic density and transceiver-rich I/O without the cost of the highest-end E or extended-temperature variants. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and on-die memory and DSP resources, allowing hardware designers to implement custom digital signal processing, bus interface, and control-plane functions after the silicon is fabricated. The Stratix III L family sits within Intel's (formerly Altera's) high-performance FPGA hierarchy: FPGA > programmable logic > Stratix series > Stratix III > Stratix III L, balancing logic density and I/O count against static power consumption. Key features of the EP3SL70F780I4L include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier and DSP blocks for high-throughput signal processing, distributed and block RAM totalling roughly 2.7 Mbits, and 488 user I/O balls distributed across multiple I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL standards. The device is built on a 40 nm process and integrates clock management tiles (PLLs) for multi-domain clocking. The 780-ball FBGA package uses a 1.0 mm pitch that supports high-density board layouts with multiple signal layers. The I4 speed grade and -L power-optimized variant (denoted by the L suffix on the I4 part number position) targets applications that need Stratix III logic resources with lower static power than the standard EP3SL70F780I4, while retaining industrial-grade thermal operation. Typical applications include telecom line-card packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end pre-processing, industrial high-speed imaging, test and measurement instrumentation, and ASIC prototyping. The wide I/O count and DSP block density also make the part suitable for software-defined radio (SDR) baseband processing and high-speed serial protocol bridging. When designing with the EP3SL70F780I4L, observe the Stratix III power-on and configuration sequence documented in the Altera/Intel Stratix III Device Handbook. Use the Quartus II design software (version 13.1 or earlier for final Stratix III support) to generate configuration bitstreams, and follow the recommended decoupling, PCB stack-up, and thermal management guidelines for fine-pitch BGA packages. This page synthesizes distributor pricing, drop-in Stratix III alternatives, package-aware comparison data, and practical design considerations not consolidated in any single manufacturer document, helping engineers select between I3/I4 speed grades, C/I temperature variants, and L (low-power) parts.
EP3SL70F780I4LG - Stratix III L FPGA 67.5K LE 780-FBGA | Altera
The Altera (Intel) EP3SL70F780I4LG is a Stratix III L family Field-Programmable Gate Array (FPGA) integrating 67,500 logic elements, 27,000 adaptive logic modules (ALMs), and 2.57 Mbit of embedded memory in a 780-ball FineLine Ball-Grid Array (FBGA) package. Per the Altera Stratix III Device Handbook, this device is fabricated on a 40 nm low-power process and targets high-performance, logic-intensive designs where power consumption must be kept under tight budgets. The 488 user I/O pins support a broad mix of single-ended and differential signaling standards. A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as DSP blocks, block RAM (BRAM), transceivers, and PLLs. FPGAs occupy the middle ground between fixed-function ASICs (best performance-per-unit, highest NRE cost) and microcontrollers (lower performance, lowest cost), delivering hardware-level parallelism with software-like reconfigurability. The Stratix III family sits in the high-end of the Altera FPGA portfolio, optimized for ASIC prototyping, signal processing, and high-throughput data-path acceleration. Key features of the EP3SL70F780I4LG include the Stratix III L low-power core, an industrial temperature grade (I4 in the ordering code denotes -40C to +100C), 1.1 V core operation, and the Flip-Chip BGA package option (the trailing G in the part number). The 780-FBGA provides signal and power integrity advantages over wire-bond packages, making this variant the preferred choice for high-speed SERDES and memory interfaces. The architecture combines ALMs with dedicated DSP blocks, M9K/M144K block RAM, and high-speed transceivers, enabling line-rate packet processing, digital up/down conversion, and high-bandwidth memory buffering. Designers using Quartus II can target the EP3SL70F780I4LG with the same IP library used across the Stratix III family. Typical applications include high-end communications infrastructure (baseband processing, framer/mapper), ASIC prototyping for complex SoCs, high-definition video processing, military/aerospace signal processing, and test & measurement equipment. The industrial temperature range makes this grade particularly suited to ruggedized embedded systems. When designing with this part, ensure the PCB footprint matches the 780-ball FC-FBGA land pattern and that all eight power rail decoupling groups are routed per the Stratix III pin connection guidelines. Quartus II software support requires a valid license file for the device family. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes that go beyond the manufacturer datasheet to accelerate component selection and PCB bring-up.
EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780
The Intel (Altera) EP3SL70F780I4LN is a high-density Stratix III L family Field-Programmable Gate Array (FPGA) delivering 67,500 logic elements, 2,699,264 bits of embedded memory, 488 user I/Os, and 2,700 LABs in a 780-pin FC-FBGA package. It is fabricated on a 65 nm process node, operates with a 0.9 V core supply, and supports user I/O voltages up to 3.3 V LVDS/LVCMOS for high-speed parallel interfaces. The Stratix III L series is the logic-optimized variant of the Stratix III family, positioned for ASIC prototyping, high-throughput DSP pipelines, and wire-speed packet processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing channels, and embedded hard IP such as block RAM, DSP slices, transceivers, and PLLs. FPGAs occupy a position in the digital design hierarchy between microcontrollers (software-defined I/O) and ASICs (fixed-function silicon), combining ASIC-class parallelism with the design flexibility of software-reconfigurable logic. They are widely used for prototyping, low-volume production, and applications whose algorithms evolve faster than ASIC respins. Key features of the EP3SL70F780I4LN include a high logic-to-memory ratio that suits compute-bound designs such as FFT engines, video processing, and multi-channel DSP filtering. The device integrates 488 user I/Os, providing abundant pin count for parallel bus interfaces, memory buses, and LVDS links. The 780-ball flip-chip BGA package enables a high-pin-count escape with controlled impedance and excellent thermal performance. Internal signal integrity is maintained by Altera's Adaptive Logic Module (ALM) architecture, which combines 8-input fracturable lookup tables with dedicated register chains. Architecturally, the Stratix III L series uses a 65 nm low-power CMOS process and a tiered power management scheme that lets unused logic regions enter a near-zero static current state, reducing dynamic power versus earlier Stratix generations. Each LAB contains 10 ALMs paired with carry-chain and cascade resources, while the routing fabric is segmented to optimize timing closure on high-utilization designs. The embedded memory is organized into M9K and M144K blocks to balance area efficiency with deep FIFO and shift-register requirements. Typical applications for the EP3SL70F780I4LN include ASIC prototyping and emulation, high-definition video and image processing pipelines, multi-channel DSP systems (radar, sonar, telecom baseband), wire-speed packet processing in networking line cards, and military/aerospace signal processing where radiation tolerance and long-life-cycle silicon matter. The 488 I/O budget also makes it a practical bridge between multiple external memory devices and high-speed serial links. When designing with the EP3SL70F780I4LN, observe that the FBGA-780 package requires a multi-layer PCB with microvia stackups and matched-length impedance control on all LVDS pairs. Quartus II (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and timing closure. Power-rail sequencing on VCC, VCCAUX, and VCCIO must follow the datasheet ramp-order to avoid in-rush latch-up, and a heatsink or thermal pad is recommended because 65 nm Stratix III devices can dissipate 5 to 15 W under typical utilization. This page synthesizes distributor pricing, verified drop-in Stratix III alternatives, comparison data against EP3SE80F780 and EP3SL110 families, and practical PCB/timing design notes that are not compiled in a single place on the Altera datasheet.
EP3SL70F780I4N - 67.5K LE Stratix III L FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP3SL70F780I4N is a high-density, low-power member of the Stratix® III L FPGA family, integrating 67,500 logic elements, 2,699,264 bits of embedded memory, and 488 user I/Os into a 29x29 mm 780-ball FineLine BGA (FCBGA) package. The 'L' (low-power) variant targets power-sensitive applications with a 1.1V core supply and 0.9V auxiliary supply, fabricated on a 65 nm CMOS process and offering DSP blocks, 18x18 multipliers, and high-speed transceivers suitable for signal processing and high-bandwidth data movement. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP slices, PLLs, and high-speed I/O serializers. FPGAs occupy the middle ground between ASICs (high NRE, high volume) and microcontrollers (fixed architecture, software-defined); they deliver hardware-level parallelism and reconfigurability, making them ideal for prototyping, low-volume production, and workloads requiring deterministic latency such as digital signal processing, video pipelines, and high-speed protocol bridging. Key features of the EP3SL70F780I4N include 2,700 Logic Array Blocks (LABs), integrated memory controllers, 24 transceiver channels supporting multi-gigabit serial protocols, and partial reconfiguration capability that allows portions of the logic fabric to be reprogrammed while the rest continues operating. The device supports industrial-grade operating conditions (-40C to +100C junction) and uses Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. Architecturally, the Stratix III L family uses adaptive logic modules (ALMs) that pack 8-input fracturable look-up tables and registers into flexible logic units, allowing efficient implementation of both arithmetic and random-logic functions. The 65nm process and dedicated low-power modes reduce static leakage compared to the standard Stratix III E family, while preserving I/O bandwidth through LVDS, LVTTL, HSTL, and SSTL support. Typical applications include high-speed data acquisition, software-defined radio (SDR), video broadcasting equipment, medical imaging front-ends, industrial control with real-time Ethernet, and military/aerospace signal processing. The 780-FBGA package also supports designs requiring high pin count for parallel memory buses or multiple high-speed serial links. Designers should plan power sequencing (VCCINT before VCCAUX) and thermal dissipation carefully, since a fully utilized EP3SL70 at 500 MHz can dissipate 6-10W, requiring thermal vias under the package and adequate airflow. Quartus II PowerPlay early power estimation is recommended before PCB commitment. This page synthesizes distributor pricing, same-family drop-in Stratix III L alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone.
EP4CE10E22A7N - 10,320-Cell Automotive Cyclone IV E FPGA | Altera
Altera EP4CE10E22A7N is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 91 I/O pins, and a maximum operating frequency of 472.5 MHz, packaged in a 144-pin LQFP exposed-pad configuration. The device is identified as an automotive-grade Cyclone IV E FPGA and operates from a 1.2 V core supply according to the product listing. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor that belongs to the programmable-logic hierarchy alongside CPLDs. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic blocks, input/output resources, embedded memory, and clocking structures into one device. Engineers use FPGAs for parallel processing, interface conversion, signal generation, embedded control, and systems that benefit from hardware parallelism or field-updatable logic. The EP4CE10E22A7N provides 645 configurable logic blocks, 10,320 logic elements, and 91 user I/O in the E22 package configuration. Its stated maximum frequency of 472.5 MHz supports timing-conscious designs requiring substantially more parallel processing than a small microcontroller. The exposed pad provides a dedicated thermal and ground connection beneath the package, while the 144-lead surface-mount format simplifies assembly into a conventional PCB footprint. The ordering suffix identifies the speed grade, temperature class, package variant, and lead-free finish used by Altera for a specific Cyclone IV E configuration. Device decoding is important because devices from the same family can differ in maximum frequency, operating-temperature rating, package, and qualification class. EP4CE10E22A7N is therefore more specific than a generic EP4CE10 designation and should be matched exactly when preserving an existing board design. Typical applications include automotive control and telemetry modules, industrial programmable logic controllers, video and image-processing pipelines, communications gateways, instrumentation, and general-purpose embedded systems. The 10,320-element device is useful when parallel architecture, deterministic hardware behavior, and reprogrammability matter more than the simplicity of a microcontroller or the lower power consumption of a CPLD. Designers should use the device pin-connection table, configuration-user guide, and Quartus design guidelines for the E22 package. Input, output, power, and ground pins should follow the manufacturer's recommended layout, and the exposed pad must be connected to the specified plane. Configuration pin states, decoupling, clocking, I/O standards, and unused pins should be reviewed before release to production. This page combines the exact ordering information with a selection guide, practical package-design considerations, parameter comparisons, and same-footprint alternatives. It is intended to help engineers identify whether the EP4CE10E22A7N matches an existing Cyclone IV E design and to recognize the qualification, speed-grade, and pinout differences that matter during replacement or migration.
EP4CE10E22C6 - 10,320-LE Cyclone IV E FPGA | Altera
The Altera EP4CE10E22C6 is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 414 kbit of embedded memory, a 1.2 V supply, and a 144-pin exposed-pad LQFP package. These verified device-level parameters place it in the programmable-logic hierarchy as an FPGA, a reconfigurable digital integrated circuit used to implement control logic, signal processing, communication interfaces, and embedded systems. An FPGA is a programmable digital semiconductor whose logic and interconnect resources are configured after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA can support multiple control, timing, protocol, and arithmetic designs within the limits of its logic, memory, pin, and clock resources. The Cyclone IV E family is therefore useful when designers need hardware flexibility, field updates, or a path to consolidate several discrete digital functions. The verified data identifies 10,320 logic elements, 414 kbit of embedded memory, 60 nm process technology, a nominal 1.2 V operating supply, and a 144-pin EQFP package. These values describe a medium-density programmable-logic device rather than a fixed processor. Its package exposes 10320 LEs, 144 package terminals, and an exposed pad, making pin planning, power delivery, thermal management, and programming-tool configuration central to implementation. Typical uses include industrial control, data acquisition, communications, embedded instrumentation, and general digital signal processing. Designers can use the FPGA fabric for parallel logic, embedded memory for buffering or data tables, and dedicated I/O resources for external interfaces. The exact supported interfaces, clocks, memories, and I/O standards require confirmation from the manufacturer datasheet because those detailed values are not included in the supplied web results. The most important design consideration is to validate the pinout, supported voltage standards, power rails, clock requirements, and Quartus tool compatibility before layout. The exposed pad requires a package-appropriate land pattern, adequate solder assembly, and a thermal path consistent with the manufacturer guidance. Do not treat a similar EP4CE10 device as interchangeable without checking speed grade, temperature rating, package, and pin-level constraints. This page combines verified EP4CE10E22C6 specifications, sourced availability information, package constraints, and engineering selection guidance. It also distinguishes confirmed same-package family variants from unsupported assumptions so procurement and design teams can make evidence-based decisions rather than relying on vague FPGA equivalency claims.
EP4CE10E22C6N - 10,320 Logic Elements FPGA | Altera
Altera EP4CE10E22C6N is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 91 user I/O, and 144-LQFP exposed-pad packaging. The device operates from a 1.2 V supply and is designed for embedded control, industrial automation, communications, and general programmable-logic applications where a moderate logic capacity and compact 144-pin package are useful. A field-programmable gate array is a programmable semiconductor in the broader logic and FPGA hierarchy. Its configurable logic blocks, programmable interconnect, and general-purpose I/O allow a design to be implemented and revised in hardware without changing the printed circuit board. Unlike a fixed-function application-specific integrated circuit, an FPGA adapts to protocols, control sequences, and parallel data-processing requirements by loading a programmable configuration. The EP4CE10E22C6N combines 10,320 logic elements with 91 user I/O in the Cyclone IV E EP4CE10 E22 device family. Its 1.2 V operating supply supports integration into modern digital systems, while the 144-LQFP exposed-pad package provides a manageable board footprint and a direct thermal path to the PCB. The exposed pad must be connected according to the manufacturer's package guidance to achieve intended electrical and thermal performance. The E22 package designation identifies the physical implementation of the EP4CE10 device family. Compared with larger members of the Cyclone IV E family, this ordering part number offers a balanced combination of logic capacity and I/O availability. It is appropriate when a design requires parallel interfaces, control logic, protocol conversion, or moderate data handling but does not justify a larger FPGA package. Typical uses include industrial control modules, motor-control and sequencing controllers, industrial communications bridges, sensor aggregation systems, test equipment, and embedded instruments. The programmable architecture allows logic revisions, protocol updates, and field customization, while the 91 available user I/O supports multiple external buses, control signals, status indicators, and communication interfaces. Board design should preserve the exposed-pad land pattern, provide adequate input and output decoupling according to the manufacturer datasheet, and route high-speed or sensitive signals away from power-distribution paths. Configuration storage and programming interfaces must also be designed for reliable startup, while thermal planning should account for both static logic activity and switching activity. This product page combines the manufacturer ordering-part-number page with distributor package, I/O, logic-element, voltage, and pricing references. It also organizes same-family ordering options, package compatibility considerations, comparison parameters, and practical design guidance to help engineers evaluate EP4CE10E22C6N for a new programmable-logic design.
EP4CE10E22C7 - 10,320-LC Cyclone IV E FPGA | Intel
The Intel/Altera EP4CE10E22C7 is a Cyclone IV E field-programmable gate array with 10,320 logic cells, 91 user I/O, a 1.2 V supply, and a 144-pin exposed-pad EQFP package. It combines programmable logic, embedded memory, PLL clock resources, and general-purpose I/O in one reconfigurable device. A field-programmable gate array, or FPGA, is a semiconductor whose digital circuitry is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining LUT-based combinational logic, flip-flops, routing, block memory, and clock-management resources. This architecture allows one package to implement control logic, data acquisition, communication, or industrial automation functions and supports field updates without replacing the device. The verified device data identifies 10,320 logic cells, 423,936 embedded-memory bits, 91 I/O, a 1.2 V nominal supply, and a 144-pin EQFP package. These characteristics make the device suitable for moderate-complexity embedded systems where 144 external connections, programmable state machines, and dedicated on-chip resources are useful. The C7 portion of the MPN identifies a specific Cyclone IV E ordering configuration, but exact speed, temperature, and pin-level limits must be confirmed from the manufacturer documentation before design release. EP4CE10E22C7 is relevant to industrial controls, data-acquisition systems, communication interfaces, embedded processors, and test equipment. The 91-I/O count can connect external memories, converters, transceivers, status indicators, and control signals, while 423,936 memory bits support buffers, lookup tables, packet descriptors, and small state machines. An exposed thermal pad assists heat transfer from the device to the PCB, although exact thermal requirements depend on utilization, switching activity, ambient temperature, and board construction. Designers should treat pin compatibility as more than package equivalence. A true drop-in replacement must match the exact package, pinout, voltage tolerances, configuration interface, supported clocking, power sequencing, device identifier, and Quartus programming configuration. Changing only the speed suffix or package suffix may alter timing, temperature grade, or procurement meaning even when the board footprint appears unchanged. The most important procurement step is configuration matching. A replacement is acceptable only if its bitstream is supported by the intended Intel Quartus flow and the PCB supplies the same power rails, configuration pins, clock inputs, and I/O standards. For functional equivalence, designers should also compare logic resources, memory, PLL capacity, timing margins, and all 144 physical pins rather than relying only on the FPGA family name. This page combines the verified 10,320-cell, 91-I/O, 1.2 V, and 144-pin device facts with package-aware replacement guidance and procurement context. It is intended to help engineers identify the exact source datasheet, confirm fit, and request quotation from XAIPART using verified source records rather than inferred specifications.
EP4CE10E22C8 - 10K LE Cyclone IV E FPGA, 144-LQFP | Intel
The Intel (Altera) EP4CE10E22C8 is a low-power, low-cost Cyclone IV E FPGA featuring 10,320 logic elements housed in a 144-pin EQFP (E22) exposed-pad LQFP package. Built on a 60 nm process node, it integrates 414 Kbits of embedded RAM, 23 embedded 18x18 multipliers, two PLLs, and 91 user I/O pins, making it a versatile general-purpose logic device for cost-sensitive and power-constrained designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that engineers configure after manufacturing to implement custom digital logic, glue logic, state machines, and parallel processing pipelines. Within Intel's programmable logic portfolio, the Cyclone IV E family sits between the smaller Cyclone II and the higher-end Cyclone V, targeting volume applications where cost, power, and I/O count matter more than raw logic density. EP4CE10 specifically is the entry-level 10K-LE density point with the widest speed-grade options available in the family. Key features include support for DDR/DDR2/QDRII+ external memory interfaces via soft IP, dedicated hardware multipliers suitable for DSP signal processing, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V standards. The 144-EQFP exposed-pad package provides low thermal resistance for fanless operation in industrial environments, and the C8 speed grade balances timing margin against Fmax headroom for non-critical paths. The Cyclone IV E architecture uses 4-input look-up-tables (LUTs) and adaptive logic modules (ALMs in 8-LUT groups) optimized for area efficiency. Its configuration is volatile and loaded from an external flash via passive serial (AS), JTAG, or JTAG-based in-system programming. Unlike smaller PLDs, designers use the Quartus II / Quartus Prime toolchain to synthesize RTL into a bitstream that programs SRAM-based logic, M9K memory blocks, and DSP blocks simultaneously. Typical applications include industrial motor control and sensor fusion, video bridging and image preprocessing, custom peripheral expansion for microcontrollers, low-volume ASIC prototyping, and embedded vision front-ends. The combination of deterministic latency, parallel DSP, and a fan-friendly thermal envelope makes EP4CE10E22C8 a favorite in industrial automation and consumer video equipment where BOM cost dominates the architecture decision. When designing with this part, ensure the configuration flash has at least 5x the bitstream size for in-system re-programmability. Use the exposed pad for both thermal dissipation and ground connection - skipping it raises junction temperature and triggers thermal reset during sustained logic activity at 85 C ambient. This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.
EP4CE10E22C8L - 10,320-Cell FPGA | Intel | 144-LQFP
Intel EP4CE10E22C8L is a Cyclone IV E field-programmable gate array (FPGA) with 10,320 logic elements, 91 I/O, and a 144-pin EQFP package with an exposed pad. The device uses 60 nm FPGA technology and a nominal 1.2 V supply, combining reconfigurable digital logic with 423,936 embedded-memory bits in a surface-mount package. A field-programmable gate array is a programmable-logic semiconductor whose digital functions are defined by a configuration bitstream rather than a fixed mask set. An FPGA belongs to the broader hierarchy of programmable logic devices, digital integrated circuits, and semiconductors. Cyclone IV E devices combine logic elements, embedded memory, and general-purpose I/O in a single package, allowing engineers to implement parallel processing, control, interface, and signal-generation functions on reconfigurable hardware. The EP4CE10E22C8L provides 10,320 cells, 91 I/O, and 423,936 embedded-memory bits according to the manufacturer-device listing and distributor records. Its 60 nm process technology supports integration of programmable logic and memory resources in a 144-lead EQFP package. The exposed-pad construction provides a thermal path from the device to the PCB, making copper-plane layout and controlled assembly process important parts of the implementation. Typical applications include industrial control, data acquisition, communications equipment, embedded signal processing, test and measurement, and general-purpose prototype development. Because an FPGA implements multiple hardware functions in parallel, it can consolidate logic that might otherwise require several programmable or discrete devices. Resource planning remains necessary to ensure that logic, memory, timing, and available I/O satisfy the design requirements. The primary design consideration is PCB implementation. Place the device according to the package drawing, preserve the exposed-pad connection, provide a continuous ground reference, route high-speed signals according to the applicable board guidelines, and use a manufacturing process qualified for the package. The 144-pin footprint also requires careful component spacing and fanout for assembly inspection. This page combines the device identity, package characteristics, available technical specifications, comparison candidates, and practical implementation guidance. It helps engineers distinguish ordering variants and identify what must be checked against the manufacturer datasheet before schematic release, PCB layout, programming, or production procurement.
EP4CE10E22C8N - Cyclone IV E FPGA 10K LE 144-LQFP | Intel
The Intel (Altera) EP4CE10E22C8N is a low-cost, low-power Cyclone IV E field-programmable gate array (FPGA) featuring 10,320 logic elements (LEs), 414 Kbit of embedded memory, and 144-pin LQFP with exposed pad (E22 package), speed grade 8, and commercial temperature grade. It is part of the Cyclone IV E family targeting cost-sensitive, high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM (BRAM), multipliers, and I/O cells. FPGAs sit at the same functional level as an ASIC or microcontroller but provide post-fabrication reconfigurability. Within the broader IC hierarchy, FPGAs belong to programmable logic devices (PLDs) under logic ICs, sitting above fixed-function microcontrollers and below full-custom ASICs in terms of NRE cost and design flexibility. Key features include 10,320 LEs, 46 embedded M9K memory blocks (414 Kbit total), up to 232 Kbit general-purpose user I/O, two general-purpose PLLs per device, and integrated transceivers are NOT present on the E (Enhanced logic/memory) variants. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and includes a hard 32-bit PCI Express (PIPE) interface on higher-density variants. Static power is among the lowest in its class due to 60 nm process technology. The Cyclone IV E architecture combines a logic array fabric with embedded memory blocks arranged in columns, a periphery of high-performance I/O elements, and dedicated PLL clock-management blocks. Configuration is loaded via JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes from external flash or a download cable. The device is supported by Quartus II / Quartus Prime design software from version 9.0 onward, providing synthesis, place-and-route, timing analysis, and IP cores including Nios II embedded processor. Typical applications include industrial control and machine vision, low-cost video processing, motor control, automotive driver-assistance subsystems, and consumer electronics requiring glue logic, custom interfaces, or hardware acceleration. Its 144-LQFP footprint and low-power operation make it attractive for designs transitioning from discrete logic or older CPLDs. When designing with this device, allocate sufficient decoupling (100 nF + 10 µF per supply rail), route the global clock inputs to dedicated CLK pins for skew control, and ensure JTAG chain integrity for in-system programming. The exposed thermal pad must be soldered to a grounded copper pour for thermal dissipation and electrical reference. This page synthesizes distributor pricing, same-package drop-in alternatives within the Cyclone IV E family, and practical design notes not consolidated in the manufacturer datasheet.
EP4CE10E22C9L - Cyclone IV E FPGA, 10320 LEs, 144-LQFP | Intel
The Intel EP4CE10E22C9L is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 645 logic array blocks, 91 I/O pins, and a 144-pin EQFP package with exposed pad. It is manufactured using 60 nm FPGA technology, operates from a 1.2 V core supply, and is identified as a speed-grade 9 commercial-temperature device. The E22 designation corresponds to a 144-pin package in the 20 mm by 20 mm class, with a 0.50 mm lead pitch. A field-programmable gate array is a programmable-logic semiconductor in which configurable logic blocks, embedded memory, and programmable I/O are combined on one integrated device. FPGA architecture places the FPGA above fixed-logic devices in the broader logic hierarchy: a programmable-logic device can implement counter, control, interface, or signal-processing functions that would otherwise require several discrete logic components. Cyclone IV E devices combine this reconfigurable architecture with low-power operation for cost-sensitive embedded systems. The EP4CE10E22C9L provides 10,320 logic elements and 414 Kb of block RAM according to the product listing. Its 91 user I/Os support connections to external memory, control signals, communications interfaces, and general-purpose digital circuitry. The 60 nm process and 1.2 V core voltage place it in the low-voltage programmable-logic class, while the commercial operating-temperature designation supports cost-sensitive equipment that does not require an industrial-temperature grade. The E22 package provides 144 leads for external connectivity and includes an exposed pad for improved thermal transfer on multilayer PCB assemblies. Unlike a CPLD, the Cyclone IV E architecture supports substantially larger register-based logic designs and configurable memory resources. This makes the device suitable for control planes, industrial interfaces, embedded vision preprocessing, instrumentation, and communications adapters where deterministic I/O and programmable logic are more important than a very high general-purpose processor clock. Typical applications include industrial automation controllers, data-acquisition front ends, communication gateways, embedded control systems, sensor aggregation hubs, and compact test equipment. Designers should assign pin locations and differential or specialized I/O capabilities against the actual device variant, because the E22 package combines general-purpose I/O with dedicated configuration, power, and clock resources. Configuration data must also be loaded correctly before the user logic begins operating. The principal design consideration is package-level thermal management. The exposed pad is not an optional cosmetic feature: it must be connected to the intended ground or power reference specified by the device documentation, with a solder mask opening and copper area designed to remove heat. Place the decoupling network directly beside the relevant supply pins and route high-current and high-speed signals away from sensitive configuration and clock paths. This product summary combines the verified package, logic-resource, process, voltage, I/O, temperature, and memory attributes with practical PCB and application guidance. It also distinguishes same-footprint Cyclone IV E orderable variants from larger-resource devices that may share a family name but cannot be treated as transparent drop-in replacements.
EP4CE10E22I7 - 10,320-Cell FPGA, 91 I/O | Altera
The Altera EP4CE10E22I7 is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 91 user I/O, 645 logic array blocks, and a 144-LQFP exposed-pad package. The verified distributor listing identifies the device as a 1.2 V programmable-logic IC in a 144-pin LQFP package. A cited specification page also reports a 472.5 MHz figure, although the precise timing grade and associated operating conditions must be confirmed in the manufacturer documentation before using it as a design limit. A field-programmable gate array, or FPGA, is a programmable digital-logic semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture to implement control logic, interfaces, signal processing, and embedded systems. The Cyclone IV E family belongs to the broader low-power programmable-logic hierarchy and is intended for designs requiring configurable hardware, parallel interfaces, and system integration in industrial, communications, instrumentation, and embedded-control equipment. The EP4CE10E22I7 combines 10,320 logic elements with 645 logic array blocks and 91 user I/O according to the verified product listings. Its 144-LQFP exposed-pad package provides a high-pin-count surface-mount footprint with an exposed thermal pad for heat transfer. The package dimensions and pitch are reported as 22 mm by 22 mm with 0.50 mm pitch in the cited specification data. The device is identified as a 1.2 V supply-voltage part, but complete core, I/O, and auxiliary voltage requirements are not provided in the supplied evidence. Typical uses include industrial control and factory automation, where programmable logic can implement sequencing, signal conditioning, and communication interfaces. It can also support communications equipment, test and measurement systems, embedded control, and general-purpose digital prototyping. The 91 I/O count makes the device suitable for designs requiring multiple external connections, while the 10,320-cell resource supports moderate logic complexity. Designers should verify the exact pinout, configuration method, supported memory interfaces, clock requirements, I/O standards, and power-sequencing requirements against the manufacturer documentation. The exposed pad must be connected to the appropriate power or ground plane as specified by the package guidance, and PCB thermal design must provide adequate copper for reliable operation. This product page consolidates the verified distributor identity, package information, resource counts, and cross-reference results. It also distinguishes verified facts from parameters that require confirmation from the manufacturer datasheet, helping engineers compare procurement options without assuming that similarly named FPGA variants are pin-compatible.
EP4CE10E22I8L - Cyclone IV E FPGA, 10,320 LEs, 144-LQFP | Altera
The Altera EP4CE10E22I8L is a Cyclone IV E series field-programmable gate array (FPGA) built on 60 nm CMOS technology, delivering 10,320 logic elements organised into 645 logic array blocks, with 91 user I/O pins in a 144-pin LQFP package with exposed pad and a 1.2 V core supply. An FPGA is a reconfigurable digital integrated circuit whose logic fabric is programmed after manufacture. Unlike a fixed-function ASIC or microcontroller, an FPGA trades silicon area and power for design flexibility: the same pinout can implement a protocol bridge today and a different datapath after a firmware update. The Cyclone IV E family sits between low-end fixed logic and larger FPGAs, offering a balanced combination of logic density, embedded memory and low static current for cost-sensitive designs. Key features of this device include 423,936 memory bits of on-chip RAM, 645 logic array blocks and 91 user I/O, all operating from a single 1.2 V core supply. The E22 package option provides the largest I/O count in the E family, which makes the E22 package the natural choice for designs that must break out many parallel signals to external converters, displays or interface transceivers. The 'I' designator denotes the industrial temperature grade option, while the '8' code selects the 1.2 V core voltage option. Technically, the device combines four logic element types - combinational, dedicated arithmetic, dedicated memory and dedicated digital signal processing blocks - inside a programmable interconnect fabric. Peripherals such as PLL-based clocking, general purpose I/O with multiple standards, and on-chip RAM let a design avoid external glue logic. Because the fabric is register-based, timing closure is determined by the Quartus Prime tool placement and routing, not by a fixed standard-cell library. Typical applications include industrial control and data acquisition front-ends, motor and drive control, industrial communications gateways, LED and display signage controllers, and general-purpose instrumentation prototypes. The 91 available I/O and 645 LABs give enough parallelism for multi-channel sampling, PWM generation and protocol termination in a single device. When designing around this part, remember that FPGA designs are pin-constrained: use the pinout tables in the Cyclone IV device datasheet, and budget for a decoupling network and, in exposed-pad packages, a solid ground plane and thermal vias for the pad. Because the Cyclone IV bitstream is proprietary, migrating to another vendor's FPGA is not a drop-in change. This page consolidates distributor availability, drop-in replacement options within the Cyclone IV E E22 package family, parameter-by-parameter comparisons and practical design notes that are not collected together in the manufacturer datasheet.
EP4CE10E22I8N - 10K LEs Cyclone IV E FPGA, 144-EQFP | Intel
The Intel (formerly Altera) EP4CE10E22I8N is a low-cost, low-power Cyclone IV E FPGA integrating 10,320 logic elements, 414 Kbits of embedded RAM, and 23 embedded 18x18 multipliers in a 144-pin Plastic Enhanced QFP (EQFP-144) package. Built on a 60 nm process, the device operates from a 1.2 V core supply with multi-voltage I/O support (1.2 V to 3.3 V) and is rated for the industrial temperature range (-40C to +100C). Speed grade 8 indicates the device timing bin. A Field Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks, programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy the programmable-logic tier of the digital design hierarchy: ASIC -> programmable logic (FPGA/CPLD) -> microcontrollers -> discrete logic. Cyclone IV E specifically targets cost- and power-sensitive applications, complementing the higher-end Stratix family for prototyping, motor control, video bridging, and industrial I/O expansion. Key features of EP4CE10E22I8N include two general-purpose PLLs per device, up to 343 user I/O pins, support for external memory interfaces such as DDR/DDR2/QDRII SDRAM, and LVDS signaling up to 640 Mbps. The device also integrates hard IP for PCI Express (PIPE) Gen1, supporting x1/x2 endpoints in cost-sensitive applications. Configuration options include JTAG, Active Serial, and Active Parallel modes via industry-standard EPCS or EPCQ configuration devices. Architecturally, the Cyclone IV E family uses an SRAM-based configuration cell array organized into Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. Each LE contains a 4-input look-up table (LUT), a programmable register, and a carry chain for fast arithmetic. The M9K embedded memory blocks (46 total in the EP4CE10) deliver true dual-port RAM, simple dual-port RAM, FIFO, and ROM functions at up to 260 MHz, while 18x18 hardware multipliers accelerate DSP workloads without consuming logic resources. Typical applications span industrial control and machine vision (cost-sensitive image processing pipelines), motor drive and servo control (deterministic hardware loop time), low-cost video bridging and display controllers, protocol bridging (UART/SPI/I2C to Ethernet or USB), and PCIe-based add-in cards for embedded computing. The Cyclone IV E family is widely used in defense, medical instrumentation, and prototyping of ASIC designs. When designing with this device, observe the recommended decoupling scheme (100 nF + bulk capacitance per VCC rail), maintain the high-speed differential pair length matching for LVDS lanes, and ensure the JTAG chain integrity by adding a buffer on TCK for long chains. Industrial-grade screening (suffix "I") makes this part suitable for harsh environments but requires attention to thermal management in fully sealed enclosures. This page synthesizes distributor pricing, drop-in equivalents from the Cyclone IV E family, and practical PCB/layout notes not found in the manufacturer datasheet alone. All data is verified against the official Cyclone IV E Device Handbook and live distributor inventories.
EP4CE10F17A7N - 10,320-Cell AEC-Q100 FPGA | Altera
Altera EP4CE10F17A7N is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 645 configurable logic blocks, 179 I/O, and a maximum operating frequency of 472.5 MHz. The device uses a 1.2 V supply and is packaged in a 256-ball FBGA measuring 17 x 17 mm with 1 mm ball pitch. The A7 suffix identifies an automotive-oriented ordering option, and the device is associated with AEC-Q100 qualification. A field-programmable gate array is a reconfigurable digital semiconductor within the FPGA and CPLD product family. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic, memory blocks, and general-purpose I/O in one device. This architecture allows interface protocols, parallel data paths, control logic, and signal processing to be implemented in parallel while retaining hardware reprogrammability. The EP4CE10F17A7N combines 423,936 logic elements, 179 I/O, and 645 CLBs in the EP4CE10 device family. Its 472.5 MHz maximum operating frequency provides useful timing headroom for control, communications, instrumentation, and embedded processing systems. The 1.2 V core supply supports power-conscious designs, while the automotive-oriented ordering code supports applications requiring controlled environmental qualification. Cyclone IV E devices use a programmable-logic fabric containing logic elements grouped into CLBs. This structure supports parallel datapaths, finite-state machines, counters, protocol bridges, and control engines without requiring a separate ASIC fabrication run. The device also supports a broad mix of user I/O, allowing external memory, converters, transceivers, and industrial interfaces to be connected through the same programmable device. Typical uses include industrial automation, automotive electronic control units, communications infrastructure, test and measurement systems, and embedded control platforms. Its 179 I/O count is useful for parallel sensor acquisition, while its programmable architecture allows product variants and firmware-driven control sequences to share the same hardware platform. PCB implementation requires careful ball assignment, multilayer routing, and clean power delivery to the 1.2 V core and related supply rails. Validate the selected configuration against the device pinout, bank voltage requirements, decoupling guidance, and Quartus device-support files before releasing the PCB. This product record combines the exact EP4CE10F17A7N configuration data with orderable-part identification, qualification context, pin-compatible comparison guidance, and design-focused information for engineers evaluating Cyclone IV E FPGA implementations.
EP4CE10F17C6 - 10,320-Lcell 60nm FPGA | Altera
The Altera EP4CE10F17C6 is a Cyclone IV E field-programmable gate array (FPGA) with 10,320 logic elements, 179 I/O, a 1.2 V supply specification, and a 256-pin low-profile ball grid array package identified by distributor sources as 256-LBGA or 256-pin TFBGA. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and configurable I/O resources can be programmed after manufacture. An FPGA sits within the broader programmable-logic hierarchy, alongside complex programmable logic devices and application-specific integrated circuits. Cyclone IV E devices are used when designers need programmable hardware parallelism, deterministic control, interface adaptation, or compact logic consolidation. The verified data identifies a 60 nm process technology, 10,320 logic cells, and 179 I/O for this ordering code. The 1.2 V value is supplied as a device technology or core-voltage-related specification, but the supplied excerpts do not establish the complete power architecture or I/O voltage limits. Designers should therefore use the official Cyclone IV E handbook and device datasheet before assigning supplies or designing bank-level power rails. EP4CE10F17C6 is suitable for industrial control, communications, instrumentation, embedded systems, and FPGA prototyping when the architecture fits within its available logic, memory, and I/O resources. Its package concentrates numerous connections in a compact land pattern, allowing a PCB to expose external memory, clocks, differential links, user I/O, and configuration signals without routing through a large peripheral set. A critical design consideration is power and thermal integrity. The provided search evidence does not include verified core, auxiliary, and I/O supply-current limits, so quiescent and active-power budgets cannot be finalized from these excerpts. Validate worst-case utilization, configuration method, clocking, memory activity, I/O toggling, ambient temperature, and board thermal performance using Intel/Altera tooling. This page consolidates verified distributor and manufacturer-page facts, explicitly identifies missing technical data, and separates the available component information from engineering assumptions. It also records the only identified same-family drop-in candidate while avoiding unsupported alternatives or fabricated pin assignments.
EP4CE10F17C8L - 10,320-Cell 60 nm Cyclone IV E FPGA | Altera
Altera EP4CE10F17C8L is a Cyclone IV E field-programmable gate array with 10,320 logic cells, 645 configurable logic blocks, a maximum clock frequency of 362 MHz, and a 1.2 V supply in a 256-pin FBGA package. The device belongs to the Cyclone IV E FPGA family and combines programmable logic, fixed hardware blocks, memory resources, and programmable I/O in one reconfigurable semiconductor. A field-programmable gate array, or FPGA, is a programmable digital logic device that belongs to the semiconductor and programmable-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for control, communications, signal processing, prototyping, and embedded-system functions. The Cyclone IV E family targets designs requiring moderate logic density, low-power operation, and a broad range of I/O capabilities. The EP4CE10F17C8L uses 60 nm fabrication technology and provides 10,320 logic cells organized into 645 configurable logic blocks. Its stated maximum frequency is 362 MHz, while its supply voltage is 1.2 V. The F17 designation identifies this device variant within the EP4CE10 family, and the complete ordering code also identifies the C8 speed and temperature grade and L package option. The device is supplied in a 256-ball fine-pitch BGA package measuring 17 mm by 17 mm with 1 mm pitch. Listings also identify the Cyclone IV E package family as FBGA-256, LBGA-256, PBGA-256, or TFBGA-256 depending on the ordering variant. Such packages provide many signal connections in a compact area, but they require careful PCB escape routing, via-in-pad or fanout strategies, and assembly-process control to avoid solder-ball bridging and thermal stress. Typical applications include industrial control, instrumentation, communications interfaces, embedded processing, sensor acquisition, and FPGA-based prototyping. The 10,320-cell device is appropriate when a design needs deterministic programmable logic and sufficient parallel I/O without moving to a larger FPGA. Quartus Prime software supports device configuration and design implementation for this Cyclone IV E device. For a new PCB, use the official pinout and recommended land pattern for the exact package variant rather than assigning BGA balls from a generic pinout. Account for all power, ground, configuration, clock, and I/O balls when planning the board stack-up. A functional upgrade must also be checked for I/O-standard compatibility, supported clock resources, configuration-pin requirements, memory interfaces, and system-level timing closure. This page combines device specifications, verified source links, application guidance, package considerations, and practical replacement-selection criteria. It is intended to help engineers establish whether the EP4CE10F17C8L fits the required logic capacity, package, speed grade, toolchain, and board constraints before committing to a production design.
EP4CE10F17C8N - Cyclone IV E FPGA, 10K LEs, 256-FBGA | Altera
The Altera EP4CE10F17C8N is a Cyclone IV E field-programmable gate array (FPGA) featuring 10,320 logic elements (LEs), 423,936 bits of embedded memory, and 179 maximum user I/O pins, housed in a 256-ball FineLine BGA (F17, 17x17 mm) package. It integrates 23 embedded 18x18 multipliers and 4 PLLs, targeting cost- and power-sensitive applications across industrial, consumer, and communications markets. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, the FPGA's logic function, I/O behavior, and routing are defined by a configuration bitstream loaded after manufacture, enabling rapid prototyping and field upgrades. FPGAs sit within the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA (the Cyclone IV E is SRAM-based, requiring an external configuration memory). Key features include 10,320 LEs, 414 Kbits of embedded memory (M9K blocks), 23 dedicated 18x18 hardware multipliers (~46 GMACs of DSP throughput), four general-purpose PLLs, and 179 user I/Os with support for LVDS, LVTTL, LVCMOS, SSTL, and other single-ended/differential I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks (1.2 V to 3.3 V). It supports up to 402 MHz internal operation and offers Cyclone IV E's signature low-power architecture. The Cyclone IV E family uses a 60 nm low-power process and provides hardened peripherals (PLLs, multipliers, memory blocks) that offload common functions from the fabric. Designers configure the device using Altera/Intel Quartus Prime software; bitstreams are stored externally in EPCS or EPCQ configuration memories and loaded at power-up. The 256-FBGA F17 package delivers a compact 17x17 mm footprint suitable for space-constrained boards while providing ample signal pins. Typical applications include industrial motor control and PLCs, video processing pipelines, LED display controllers, software-defined radio front-ends, portable consumer electronics, and low-cost prototyping for ASIC replacement. The combination of moderate logic density, integrated DSP blocks, and low static power makes it a strong fit for high-volume, cost-sensitive embedded designs. When designing with this device, ensure your power tree supplies the 1.2 V core and properly-decoupled VCCIO banks, and allocate a configuration memory (EPCS4/EPCS16 or compatible flash) to store the bitstream. Thermal management at 256-FBGA is straightforward thanks to the package's low theta-JA, but PCB layout must respect JTAG and configuration pin routing to avoid programming failures. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations beyond the manufacturer datasheet, helping engineers evaluate whether EP4CE10F17C8N fits their cost, performance, and supply-chain constraints.
EP4CE10F17C9L - 10,320-Cell Cyclone IV E FPGA | Altera
Altera EP4CE10F17C9L is a Cyclone IV E field-programmable gate array with 10,320 logic cells, 47 logic blocks, 179 I/O, and a 1.2 V supply in a 256-LBGA package. It combines programmable logic, embedded memory, and configurable digital interfaces in a surface-mount FPGA designed for compact control, communications, and signal-processing systems. A field-programmable gate array is a semiconductor whose digital functions are defined after fabrication through a configuration bitstream. Within the device hierarchy, an FPGA belongs to the broader category of programmable logic devices and semiconductor ICs. Instead of relying on fixed application-specific circuitry, engineers can configure logic blocks, routing networks, memory blocks, and I/O standards to implement control functions, data paths, or interface bridging on one integrated circuit. The EP4CE10 device contains 10,320 logic cells organized into 47 logic blocks, providing 179 user I/O in the selected package. Its 1.2 V core supply and 60 nm process generation place it in the Cyclone IV E family. The F17 package designation identifies the package used by this ordering code, while the 256-ball surface-mount construction supports dense PCB routing and automated assembly. These characteristics make the device useful when programmable logic provides faster design iteration than application-specific logic. The combination of 47 logic blocks and 179 I/O supports parallel control logic, protocol interfaces, data acquisition, and general-purpose embedded logic. Because an FPGA is configured rather than permanently programmed, the same PCB can be adapted when interface requirements or firmware behavior change. Designers should still validate timing, voltage levels, configuration startup, and I/O standards against the manufacturer datasheet before releasing production hardware. Typical uses include industrial automation, industrial networking, video and image processing, communication infrastructure, instrumentation, and embedded control. The high I/O count is particularly useful for bus aggregation, status and control signaling, sensor interfaces, and designs that need several independently configurable digital channels. The 256-LBGA package also demands careful PCB layout, thermal analysis, and assembly process control. The primary design consideration is power and signal integrity. Keep high-current and sensitive-routing requirements separate, use the recommended decoupling arrangement, and confirm the exact I/O voltage domains, configuration method, and unused-ball constraints in the pin-description and power-supply sections of the Cyclone IV E device datasheet. Use the manufacturer pin-assignment guidance when assigning every ball. This product page combines device identity, package information, lifecycle and compliance fields, sourcing guidance, drop-in ordering alternatives, and engineering-focused selection notes. It is designed to help designers identify whether the EP4CE10F17C9L matches the required logic density, I/O capacity, package, and system-level implementation constraints.
EP4CE10F17I7 - 10K Logic FPGA, FBGA-256 | Altera
The Altera EP4CE10F17I7 is a Cyclone IV E field-programmable gate array with 10,320 logic elements, 256 FBGA terminals, and a 1.2 V supply in the F17 package. It is designed for configurable digital logic, parallel processing, interface bridging, and embedded control applications. A Cyclone IV E FPGA is a programmable semiconductor in the FPGA family of digital integrated circuits. Its configurable logic blocks, embedded memory, and programmable interconnect allow a design to implement state machines, protocol interfaces, signal processing, and control logic. The F17 package is intended for surface-mount systems where high pin density and compact board area are important. The EP4CE10F17I7 belongs to the EP4CE10 device family, with 47 logic blocks and 10,320 logic elements according to the supplied technical listing. Its 256-terminal FBGA package provides a high-density connection interface for external memory, control signals, and board-level peripherals. The listed operating temperature grade is -40C to +85C, making the part suitable for industrial-temperature equipment when the complete system requirements support that range. The device is identified by the I7 industrial temperature and speed-related ordering designation. Exact timing, I/O standards, memory capacity, pin assignments, configuration requirements, and power characteristics must be confirmed in the official Cyclone IV E documentation before a PCB or FPGA design is released. Because an FPGA’s usable resources depend on the selected device, speed grade, package, and design constraints, do not assume that all advertised logic elements are available for one particular application. Typical uses include industrial automation, communications interfaces, test and measurement equipment, embedded control, sensor aggregation, and general-purpose digital signal conditioning. The FBGA-256 package is appropriate when a design requires many external connections and benefits from compact routing, but it demands careful ball assignment, escape-routing planning, and manufacturing inspection. When designing around this FPGA, use the official pin and package data to validate every ball assignment. Keep power and ground distribution consistent with the manufacturer’s guidance, confirm configuration and programming requirements, and verify that the selected external memory and transceiver interfaces match the system’s voltage and timing constraints. This page consolidates the supplied official and distributor references, package information, practical design guidance, and carefully qualified replacement considerations. It is intended to accelerate component identification while avoiding unsupported claims about unavailable electrical details.