FPGA & CPLD
Products (6352)
EPF10K100EBC356-3 - 100K Gates FLEX-10KE FPGA, 356-LBGA | Intel
The Intel (formerly Altera) EPF10K100EBC356-3 is a member of the FLEX-10KE family of embedded programmable logic devices (PLDs), delivering approximately 100,000 gates, 4,992 logic elements (LEs), and 49,152 RAM bits in a 356-pin LBGA (35x35) package. Speed grade -3 indicates a -3 (faster) timing bin with typical propagation delays of approximately 0.6 ns and internal core operation up to 200 MHz. The device integrates 274 user I/Os and operates from a 2.5 V core supply (2.375 V to 2.625 V) over a 0 C to 70 C commercial temperature range. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells can be programmed in the field via an SRAM-based configuration bitstream. FPGAs sit within the broader semiconductor hierarchy as programmable logic devices (PLDs), themselves a sub-category of digital logic ICs, and are commonly used for digital signal processing, glue logic, prototyping, and high-speed I/O expansion where ASIC NRE costs cannot be justified. Key features of the EPF10K100EBC356-3 include its 624 LABs (Logic Array Blocks), embedded array blocks (EABs) for memory and DSP functions, CMOS SRAM-based configuration (volatile, requiring a configuration device), in-system programmability via JTAG, and a high I/O count (274) that supports parallel buses and many discrete interfaces. The device is fabricated on a 0.22 micron CMOS process. Architecturally, the FLEX-10KE family pioneered embedded array blocks (EABs), allowing each block to be configured as RAM or ROM and to implement arithmetic logic. Combined with the interconnect-rich logic array, this hybrid structure prefigures modern heterogeneous FPGAs with hard DSP and memory blocks. The 356-LBGA package provides controlled-impedance signal paths and a generous ball grid for high pin density at 35 mm x 35 mm. Typical applications include telecommunications line cards, industrial control and factory automation, data acquisition systems, and digital signal processing glue logic. The wide user I/O count and high gate density make it well-suited to bus-bridging, protocol conversion, and high-speed serial-to-parallel interfaces. When designing, note that the FLEX-10KE core is 2.5 V; I/O banks can be configured for 2.5 V or 3.3 V interface levels, but 5 V tolerance is not guaranteed. A configuration EPROM or JTAG programmer (ByteBlaster-compatible) is required at board bring-up. Designers migrating from this part should evaluate Cyclone III/IV as next-generation equivalents, as FLEX-10KE is no longer in active production. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K100EFC256-2 - FLEX 10KE FPGA, 100K Gates, 256-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K100EFC256-2 is a member of the FLEX 10KE family of CMOS Field-Programmable Gate Arrays (FPGAs) housed in a 256-pin FineLine Ball Grid Array (FBGA) package. It integrates 49,152 logic elements (4,992 dedicated registers) with 191 user I/O pins and operates from a 2.375 V to 2.625 V core supply, giving designers approximately 100,000 equivalent ASIC gates of programmable logic with embedded array blocks for memory and arithmetic functions. The device is specified over a 0 °C to 70 °C commercial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic function is defined after manufacturing by the user. FPGAs sit in the programmable-logic hierarchy between simple PLDs/CPLDs and fixed-function ASICs, occupying the same role as discrete gate arrays but allowing rapid, software-driven reconfiguration. The FLEX 10KE family specifically introduced an embedded array block (EAB) for on-chip RAM and DSP-style functions, giving it a System-on-a-Programmable-Chip (SOPC) capability that earlier FPGAs lacked. Key features of the EPF10K100EFC256-2 include 624 Logic Array Blocks (LABs), embedded array blocks for FIFO/RAM/ROM, fast interconnect (FastTrack), JTAG-compliant boundary-scan test support, in-system programmability via configuration schemes such as PS, and dedicated clock-locked pins. The core is built on a 0.22 µm CMOS SRAM process and uses 4-input look-up tables (LUTs) per logic element, delivering an effective propagation delay of approximately 0.6 ns per LUT in speed-grade -2 silicon. Typical applications include legacy industrial glue logic, parallel bus interfacing, state-machine and protocol-bridge replacement, low-volume ASIC prototyping, retrofits of older designs still based on the FLEX 10KE footprint, and educational platforms that retain Altera (now Quartus Prime) toolchain support for older families. Because the FLEX 10KE family is mature, the EPF10K100EFC256-2 is generally sourced through authorised distributors of Intel/Altera heritage product rather than direct factory channels. When designing with this part, remember that core, I/O and JTAG voltages are not independent; the part requires a stable 2.5 V VCCINT plus separate VCCIO banks. Configuration memory is volatile, so an external configuration PROM (e.g., EPC2) is required at every power-up. The 256-pin FineLine BGA also demands careful PCB layout for the fan-out escape and decoupling; consult the FLEX 10KE device handbook for the recommended stack-up and decoupling scheme. This page synthesises distributor pricing (as of 2026-09-11), a drop-in same-footprint alternatives matrix, and practical design notes not collected in the manufacturer datasheet.
EPF10K100EFC256-2X - FLEX 10KE FPGA, 49,152 Gates, 256-BGA | Altera
The Altera (now Intel) EPF10K100EFC256-2X is a FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 49,152 logic elements/gates, 4,992 Logic Array Blocks (LABs), and 624 Logic Elements per LAB, packaged in a 256-ball FineLine Ball Grid Array (FBGA). It supports 191 user I/Os, operates at 2.5V core supply, and is offered in the -2 speed grade, balancing timing margin against the industrial commercial 0°C to 70°C operating range. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that integrates configurable logic blocks, programmable interconnects, and embedded memory arrays on a single semiconductor die. FPGAs sit at the top of the digital logic hierarchy: discrete gates -> PLDs (PAL/GAL) -> CPLDs -> FPGAs -> SoC FPGAs. Within Altera's (now Intel PSG) portfolio, the FLEX 10KE family was an early SRAM-based, look-up-table (LUT) architecture that pioneered embedded system-on-chip integration by mixing logic and memory cells (EABs) on the same die, a design philosophy that paved the way for modern SoC FPGAs like Cyclone and Stratix. Key features of the EPF10K100EFC256-2X include 4,992 cells organized into 624 LABs, 191 user I/Os routed through 5 I/O banks, multi-voltage I/O support (3.3V PCI-compatible and 2.5V/1.8V levels), and an in-system programmable configuration interface. The 256-FBGA FineLine package provides a compact footprint suitable for high-density boards, while the -2 speed grade represents a balance between timing closure and cost for commercial-temperature designs. The FLEX 10KE architecture combines a sea-of-LUTs logic fabric with Embedded Array Blocks (EABs) that can be configured as RAM, ROM, or FIFO, enabling designers to implement datapath logic, state machines, and small memory blocks without external components. The SRAM-based configuration cells require a configuration device (such as an EPC2 or EPC16) to load the bitstream at power-up, supporting JTAG-based in-system programming for prototyping and field upgrades. Typical applications include telecommunications line cards, industrial control systems, glue logic replacement, PCI interface bridging, and legacy system upgrades. The 256-FBGA package and 191 I/O count make this part well suited for mid-complexity designs where board area and signal density matter more than absolute logic capacity. When designing with the EPF10K100EFC256-2X, ensure the configuration scheme (passive serial, active serial, or JTAG) and configuration device selection are validated against the Quartus design tool's pin-out report. Pay close attention to bank-by-bank I/O voltage compatibility, especially when mixing 3.3V PCI and 2.5V peripherals on the same device.
EPF10K100EFC256-3 - 100K Gates FLEX 10KE FPGA, 256-BGA | Intel
The Intel EPF10K100EFC256-3 is a high-density FLEX 10KE Field Programmable Gate Array (FPGA) delivering approximately 100,000 usable system gates with 4,992 logic elements and 49,152 RAM bits in a 256-ball FineLine BGA (FBGA) package. The device operates from a 2.5V core supply with 3.3V multi-voltage I/O support and is rated for commercial 0C to 70C ambient operation. The -3 speed grade offers enhanced timing margins, while the embedded array block (EAB) architecture combines look-up table logic with on-chip SRAM blocks for System-on-a-Programmable-Chip (SOPC) integration. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device built from an array of programmable logic blocks, interconnect, and I/O cells. FPGAs sit between fixed-function ASICs and software-programmable processors: they offer hardware-level parallelism and timing precision like an ASIC, but can be reconfigured in the field. The FLEX 10KE family, introduced by Altera (now Intel), was the industry's first embedded PLD family to combine a logic array with embedded array blocks (EABs) for on-chip memory, marking the industry's first System-on-a-Programmable-Chip (SOPC) integration. Key features of the EPF10K100EFC256-3 include 191 maximum user I/Os (DigiKey listing) / 274 pins per alternate datasheet listing, built-in IEEE 1149.1-1990 JTAG boundary-scan test (BST) circuitry compliant with PCI Local Bus Specification Revision 2.2 at 33 MHz or 66 MHz for 3.3-V operation, and a 0.22-micron CMOS process technology enabling up to 200 MHz internal operation. The device uses CMOS logic at a 2.5V core and supports multi-voltage I/O standards including LVTTL, LVCMOS, PCI, and SSTL. Technically, the FLEX 10KE architecture organizes logic into Logic Array Blocks (LABs) - the device contains 624 LABs - each containing 8 logic elements (LEs) with a 4-input look-up table. Embedded Array Blocks (EABs) deliver up to 2,048 bits of dual-port RAM per block, configurable as RAM, ROM, or product-term logic. The continuous FastTrack interconnect routes signals across rows and columns with predictable delay, enabling timing closure across complex designs. Typical applications include PCI bus interface cards, telecommunications glue logic, industrial control adapters, prototyping for ASIC emulation, and high-speed data acquisition pre-processing. The -3 speed grade and 191 user I/Os make this device suitable for interface bridging and protocol conversion where deterministic timing is required. When designing with this device, ensure JTAG chain integrity by including TMS, TCK, TDI, TDO, and TRST pull-up/pull-down resistors per IEEE 1149.1 conventions. For PCI applications at 66 MHz, restrict I/O placement to PCI-compliant banks and maintain reference-plane continuity under the BGA. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EPF10K100EFC256-3N - FLEX 10KE FPGA 100K Gates | Altera/Intel
The Altera (now Intel) EPF10K100EFC256-3N is a FLEX 10KE family Field Programmable Gate Array (FPGA) with 100K equivalent gates, 4992 logic elements, and 49152 bits of embedded memory, housed in a 256-pin FineLine BGA (FC) package. It delivers 200 MHz core performance on a 0.22 µm CMOS process and operates from a 2.5 V core supply, with 191 user I/O pins for high-density logic and glue-less bridging designs. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, routing interconnects, and I/O cells that can be re-programmed in-system to implement arbitrary digital circuits. FPGAs sit in the semiconductor hierarchy below ASICs (custom silicon) but above CPLDs in density, and belong to the broader programmable logic device (PLD) family. The FLEX 10KE family was Altera's first embedded programmable logic family offering System-on-a-Programmable-Chip (SOPC) integration with an embedded array block (EAB) usable as RAM, ROM, or product-term logic. Key features include 100K typical gates (with up to ~250K maximum system gates), 4992 logic cells, twelve Embedded Array Blocks (EABs) providing 24,576 RAM bits each, multi-voltage I/O supporting 2.5 V and 3.3 V interfaces, and a -3 speed grade targeting higher Fmax than -1/-2 grades. The 256-pin FineLine BGA package supports 191 user I/O and is compliant with PCI Local Bus Specification Revision 2.2 for 3.3-V operation at 33 MHz or 66 MHz. The architecture pairs logic array blocks (LABs) with EABs to deliver both fine-grained logic and high-density on-chip SRAM, while four-phase clocking and global/regional clock networks provide deterministic timing closure. JTAG boundary-scan support compliant with IEEE Std. 1149.1-1990 enables in-system test without consuming device logic. Typical applications include PCI bus interface bridges, glue logic replacement, custom DSP datapaths, industrial control and communications backplanes, and legacy telecommunication line-card designs where the FLEX 10KE delivered compelling cost-per-gate at product launch. When designing with the EPF10K100EFC256-3N, ensure the 2.5 V core supply is well-decoupled with 0.1 µF ceramic capacitors near each VCCINT pin and use the JTAG chain carefully ordered to avoid TAP contention during in-system programming.
EPF10K100EFC484-1 - FLEX 10KE FPGA 100K Gates 484-BGA | Intel
The Intel (formerly Altera) EPF10K100EFC484-1 is a FLEX 10KE family Field-Programmable Gate Array (FPGA) integrating 4,992 logic elements, 49,152 bits of embedded SRAM, and 257,000 typical system gates in a 484-pin FineLine BGA package. It supports up to 338 user I/Os, fabricated on a 0.42 µm CMOS process with 2.5 V core operation, and includes 12 embedded array blocks (EABs) configurable as ROM or dual-port RAM. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can customize after manufacture using a hardware description language. FPGAs sit between discrete logic ICs and application-specific integrated circuits in the design hierarchy, offering ASIC-like integration with NRE-free, rapid-turnaround programmability. The FLEX 10KE family specifically pioneered embedded System-on-a-Programmable-Chip (SOPC) integration by combining a logic array with embedded array blocks for on-chip memory. Key features of the EPF10K100EFC484-1 include 624 Logic Array Blocks (LABs), 0.6 ns propagation delay, support for 3.3 V PCI compliance, embedded IEEE Std. 1149.1 JTAG boundary-scan test circuitry, and in-system configurability via serial or parallel EPROM. The 484-FBGA package (23×23 mm) provides a high-density footprint suitable for high-I/O designs while supporting SameFrame pin migration to other FineLine BGA densities in the family. Each LAB contains 8 logic elements (LEs) and local interconnect, enabling efficient state-machine and datapath implementation. Architecturally, the EPF10K100EFC484-1 uses SRAM-based configuration memory, requiring a configuration EPROM or JTAG download on every power-up. Its Embedded Array Blocks (EABs) deliver 2 Kbits each (12 EABs × 2 Kbit = 24 Kbits, configurable up to 48 Kbits via dual-port mode), supporting FIFO buffers, ROM lookup tables, and arithmetic operations. The device supports multi-volt I/O standards including 3.3 V, 2.5 V, and 1.8 V, with 5 V PCI tolerance. SameFrame pin-out compatibility across the FLEX 10KE BGA family allows design migration without PCB rework when higher- or lower-density members are needed. Typical applications include telecommunications line cards, networking bridges and routers, industrial control and factory automation, ASIC prototyping, glue logic replacement, and high-speed data acquisition systems. The combination of 338 user I/Os and 49 Kbits of embedded memory suits designs requiring both extensive parallel interfaces and on-chip buffering. Design migration within the FLEX 10KE BGA family is supported by Altera's SameFrame pin-compatibility scheme, enabling scalable platform designs. When designing with the EPF10K100EFC484-1, ensure the configuration EPROM is correctly sized for the device bitstream, and provide 3.3 V I/O bank power even for designs operating primarily at 2.5 V core. Decoupling requires bulk and high-frequency ceramics placed within 100 mils of each power pin. The 484-BGA requires controlled-impedance escape routing and a minimum 4-layer PCB stack-up with continuous power/ground planes. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical BGA design notes that complement the manufacturer datasheet for engineers maintaining legacy FLEX 10KE designs.
EPF10K100EFC484-1N - 100K FLEX 10KE FPGA, 338 I/O, 484-BGA | Intel
The Intel (formerly Altera) EPF10K100EFC484-1N is a 100K-gate FLEX 10KE Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA package. Built on a 0.22 µm CMOS SRAM process, the device delivers 4,992 logic elements (LEs), 49,152 embedded memory bits, 338 user I/Os, and 624 LABs, with a core supply voltage of 2.5 V and I/O supply of 3.3 V. The "-1" speed grade provides a worst-case propagation delay of approximately 0.6 ns and operates across the commercial 0 °C to 70 °C range. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers and DSPs as reconfigurable computing fabrics. The FLEX 10KE family introduced embedded array blocks (EABs) for on-chip RAM/ROM, true dual-port RAM, and embedded multipliers, pioneering the System-on-a-Programmable-Chip (SOPC) concept that integrates memory and logic in one device. Key features include high-bandwidth embedded memory with true dual-port operation, multi-volt I/O supporting 2.5 V/3.3 V/5.0 V LVTTL/LVCMOS interfaces, JTAG-compliant IEEE 1149.1 boundary-scan testing, and built-in PCI compliance. The 484-ball FineLine BGA footprint offers the same pin-out as other FLEX 10K/10KE devices in the 484-FBGA package, enabling SameFrame pin migration within the family for design reuse and risk reduction. Architecturally, the EPF10K100EFC484-1N combines a symmetrical logic array with row-and-column interconnect, dedicated EABs for wide memory functions, and embedded multipliers that accelerate DSP operations. The SRAM-based configuration memory supports in-system reprogrammability via JTAG or dedicated configuration pins, allowing field upgrades without removing the device from the board. Typical applications include high-speed digital glue logic in telecommunications backplanes, PCI bridge designs, video processing pipelines, industrial control systems, and prototype ASIC emulation. The 100K-gate density is well matched to multi-channel glue logic, custom bus interfaces, and pre-silicon ASIC verification platforms. Designers should pay close attention to the multi-voltage I/O configuration: 5 V-tolerant inputs require proper VCCIO selection, and decoupling must follow Altera's reference decoupling scheme with bulk and high-frequency ceramics placed within 0.25 inch of every supply pin. Configuration mode and clock pins must be tied per the FLEX 10KE handbook, and unused I/O should be configured as outputs driving ground to minimize switching noise. This page synthesizes distributor pricing from Mouser and DigiKey, drop-in same-family alternatives that share the 484-FBGA footprint, and practical design guidance not duplicated in the original Altera datasheet — aiding engineers seeking FLEX 10KE replacement or migration paths in legacy systems.
EPF10K100EFC484-1X - FLEX-10KE FPGA 100K Gates 484-FBGA | Intel
The Intel (Altera) EPF10K100EFC484-1X is a member of the FLEX 10KE family of Field Programmable Gate Arrays, integrating 100,000 system gates and 4,992 logic elements (cells) into a 484-pin FineLine BGA package. It is fabricated on a 0.22 µm CMOS process, supports a core supply of 2.5 V (±5%), and is specified for an operating temperature range of 0 °C to 70 °C with a maximum internal frequency of 333.33 MHz. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a large array of configurable logic blocks (LABs), embedded memory, and programmable interconnect to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> PLD -> logic IC -> integrated circuit) and are widely used as flexible alternatives to ASICs for glue logic, prototyping, signal processing, and interface bridging. The FLEX 10KE family introduced dedicated embedded array blocks (EABs) for SRAM memory, making these parts useful for designs that need on-chip RAM, FIFOs, or ROM lookup tables. Key features of the EPF10K100EFC484-1X include 624 logic array blocks (LABs), 338 user I/Os, 49,152 RAM bits distributed across embedded array blocks, and a propagation delay of approximately 0.6 ns per logic element. The device is offered in the 484-pin FineLine BGA (23 × 23 mm) package and supports in-system programmability via a JTAG-compliant serial interface. The "-1X" speed grade designates the slowest commercial-grade speed bin used in this family, suitable for cost-sensitive applications that do not require the highest possible toggle rate. Architecturally, the EPF10K100EFC484-1X combines four-input look-up tables (LUTs) inside each LAB with carry-chain logic and dedicated EABs that can be configured as 256 × 8, 512 × 4, 1024 × 2, or 2048 × 1 memory blocks. The interconnect is a hierarchical routing network with FastTrack direct-connect lines between adjacent LABs and longer row/column lines for global signals. This combination gives the device predictable timing and lets designers place critical paths on dedicated routing resources. Typical applications include telecommunications interface cards, industrial control and instrumentation logic, PCI bridge controllers, network routers and switches, and legacy systems that need a high-gate-count programmable platform. The device is also used in test-and-measurement front-ends, where its embedded RAM blocks provide buffering for sample storage. When designing with this part, plan I/O assignments around the 484-pin FineLine BGA footprint and use the Altera (now Intel) Quartus II or MAX+PLUS II toolchain for synthesis, place-and-route, and timing analysis. Note that the FLEX 10KE family is no longer recommended for new designs; consult Intel's product change notifications for current lifecycle status before committing to a long-lifecycle program.
EPF10K100EFC484-2 - 100K FLEX-10KE FPGA, 338 I/O, 484-BBGA
The Altera (Intel) EPF10K100EFC484-2 is a FLEX-10KE family Field Programmable Gate Array (FPGA) with 100,000 typical gates (49,992 logic elements / 4,992 dedicated logic cells), housed in a 484-ball FineLine BGA package measuring 23 x 23 mm. The device provides 338 user I/O pins, 4,992 LABs/Logic Elements, and operates from a 2.375 V to 2.625 V core supply, with the -2 speed grade delivering moderate performance suitable for cost-sensitive embedded and industrial designs. An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be rewired after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and are themselves classified within the semiconductor / programmable logic category. The FLEX-10KE family is built on a SRAM-based look-up-table (LUT) architecture, requiring a configuration device or JTAG load at every power-up, which makes it well suited to designs that must be re-programmed in the field. Key features include 49,992 logic elements organized into 624 Logic Array Blocks (LABs), embedded array blocks (EABs) for memory and multiplier functions, support for multi-volt I/O standards (LVTTL, LVCMOS, PCI, SSTL), in-system programmability via JTAG, and 338 general-purpose user I/O. The 484-pin FineLine BGA package supports high-density board designs with controlled impedance signal integrity. The FLEX-10KE architecture uses 0.22 um SRAM process technology with 5 ns SRAM-configurable logic elements, delivering deterministic timing and high logic density per square millimeter. The device supports continuous, real-time in-circuit reconfiguration and is designed for high-volume, low-cost programmable logic applications. Typical applications include industrial control and factory automation glue logic, telecommunications line-card interface logic, legacy PCI bus bridging, and embedded DSP co-processing. The 338 I/O count supports wide parallel buses, while the 624 LABs are sufficient for state-machine intensive designs of 20K-50K gate-equivalent complexity. When designing with this part, ensure proper decoupling of the 2.5 V core supply with 0.1 uF and 10 uF capacitors placed close to the VCCINT pins, and route configuration clocks away from switching signals to avoid JTAG programming errors. Note that the FLEX-10KE family is mature; new designs should verify long-term supply continuity through authorized distributors. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single source for sourcing and substitution decisions.
EPF10K100EFC484-2X - 100K-Gate FLEX 10KE FPGA, 338 I/O | Altera
The Altera EPF10K100EFC484-2X is a member of the FLEX 10KE family of SRAM-based FPGAs, delivering 100,000 typical gates, 4,992 logic elements, 49,152 bits of embedded array RAM, and 338 user I/O pins in a 484-ball FineLine BGA package. It is built on a 0.22 µm CMOS process and operates from a 2.5 V core supply, with an I/O bank voltage tolerance that supports mixed-voltage system designs typical of late-1990s/early-2000s telecom and embedded computing platforms. A Field Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which are defined by a bitstream loaded into on-chip SRAM after power-up. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside SPLDs, CPLDs, and anti-fuse FPGAs. The FLEX 10KE family specifically pioneered the embedded array block (EAB), allowing designers to instantiate RAM, ROM, or multiplier functions inside the logic fabric, an early example of System-on-a-Programmable-Chip (SOPC) integration. Key features of the EPF10K100EFC484-2X include 624 logic array blocks (LABs), 4,992 logic cells, 49,152 RAM bits distributed across embedded array blocks, a maximum propagation delay on the order of 0.6 ns per logic element, and 338 usable I/Os in the 484-pin FBGA. The -2X speed grade balances timing margin against power consumption, making it a common choice for production designs rather than the fastest -3 grade. Typical applications include telecommunications line cards, industrial motor control, glue logic replacement, and legacy peripheral bus bridging. The wide 338-I/O budget is well-suited to parallel bus interfacing, and the embedded array blocks ease implementation of FIFOs and small on-chip memories. A key design consideration when using this part is that the FLEX 10KE family is now in mature/end-of-life status; new designs should consider Cyclone or MAX series parts, while existing designs should verify long-term supply through franchised distributors and validated aftermarket channels. This page synthesizes distributor pricing, drop-in alternatives within the FLEX 10KE family, and design notes that complement (not duplicate) the manufacturer datasheet.
EPF10K100EFC484-3 - FLEX 10KE FPGA, 100K Gates, 484-BGA | Altera
The Intel (formerly Altera) EPF10K100EFC484-3 is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs), integrating 100,000 typical gates (with up to 158,000 maximum system gates), 4,992 logic elements, and 49,152 bits of embedded array RAM (EAB) in a 484-ball FineLine BGA package. The device is organized into 624 Logic Array Blocks (LABs) and provides 338 user I/O pins, with a -3 speed grade targeting the fastest commercial timing closure of the FLEX 10KE family. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in the field to implement arbitrary digital logic. FPGAs occupy the same design role as ASICs but offer lower NRE cost and faster time-to-market. FLEX 10KE devices are organized as a hierarchical architecture in which each LAB contains eight Logic Elements (LEs), each LE comprising a 4-input lookup table, a programmable flip-flop, and a dedicated carry chain for arithmetic. Embedded Array Blocks (EABs) provide on-chip synchronous RAM of up to 2,048 bits per block, totaling 49,152 bits across the EPF10K100E. Key features of the EPF10K100EFC484-3 include support for 5.0V PCI compliance with pull-up clamping diodes on a pin-by-pin basis, multi-voltage I/O supporting 2.5V, 3.3V, and 5.0V interfaces, built-in IEEE Std. 1149.1-1990 JTAG boundary-scan test (BST) circuitry that does not consume device logic, and on-chip clock-management PLL options. The -3 speed grade represents the fastest commercial timing bin, making this variant suitable for high-throughput glue-logic, custom bus-interface, and prototype designs where propagation delay is the critical constraint. Typical applications for the EPF10K100EFC484-3 include PCI bus interface bridges in legacy computing platforms, custom peripheral controllers, telecommunications backplane glue logic, industrial machine-control state machines, and instrumentation front-ends with hardware-accelerated DSP preprocessing. The 338 available I/O pins comfortably accommodate wide parallel buses (32-bit data plus control) without external muxing. When designing with this part, supply the core with 2.5V and the I/O banks with their bank-specific VCCIO (2.5V/3.3V/5.0V) and verify JTAG chain ordering against the BSDL file before board bring-up. The 484-BGA package requires a multilayer PCB with controlled-impedance traces and proper thermal vias under the die-up substrate. This page synthesizes distributor pricing, package-level drop-in alternatives within the FLEX 10KE family, and practical design notes not consolidated in any single manufacturer document, helping procurement and design engineers make informed lifecycle decisions for legacy designs.
EPF10K100EFC484-3N - 100K Gates FLEX 10KE FPGA | Intel / Altera
The Intel / Altera EPF10K100EFC484-3N is a high-density FLEX 10KE family Field Programmable Gate Array (FPGA) with 100K gates, 4992 logic cells, 49152 bits of embedded array block (EAB) memory, and 338 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. Manufactured on a 0.22 µm CMOS process, it operates from a 2.5 V core supply with MultiVolt I/O support, and is offered in a commercial temperature grade. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - an integrated circuit whose logic function is defined after manufacture by the end user. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. Within that hierarchy, the FLEX 10KE family belongs to the SRAM-look-up-table (LUT) based FPGA category, where configuration bits are stored in SRAM cells and the device is reprogrammable in-system. Key features include 624 logic array blocks (LABs), 12 embedded array blocks (EABs) totaling 49,152 RAM bits, 200 MHz internal performance, pin-by-pin slew-rate control, open-drain output option, PCI pull-up clamping diode support, and MultiVolt I/O allowing the I/O bank voltage (VCCIO) to differ from the core voltage (VCCINT). The 'FC484' suffix denotes the 484-ball FineLine BGA package and 'N' indicates a lead-free, lead-free reflow-compatible device. The FLEX 10KE architecture combines fine-grained logic elements (LEs) organized into LABs with coarse-grained EABs that efficiently implement RAM, ROM, and multiplier functions. The '-3' speed grade designates the fastest commercial speed bin available for this family. Per-pin options are configured using Altera (now Intel Quartus / MAX+plus II) logic-option settings, eliminating external glue logic. Typical applications include high-volume glue logic consolidation, PCI bus interface bridges, telecommunications backplane controllers, industrial control and factory automation, and legacy ASIC replacement designs where the FLEX 10KE's combination of 100K gates, abundant I/O, and embedded RAM provides an optimal balance of density and flexibility. When designing with this device, plan for SRAM-based configuration: the FPGA must be configured from an external EPROM, flash, microcontroller, or JTAG cable on every power-up. Provide decoupling per Quartus guidelines, respect I/O bank VCCIO grouping rules, and verify MultiVolt signaling against downstream ASIC voltages. This page synthesizes distributor pricing, drop-in same-package FLEX 10KE speed-grade alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K100EFI256-2 - FLEX 10KE FPGA 100K Gates 250MHz 256FBGA | Intel
The Intel EPF10K100EFI256-2 is a member of the FLEX 10KE family of SRAM-based FPGAs delivering 100,000 typical gates, 4,992 logic elements, and 49,152 RAM bits in a 256-ball FineLine BGA package. It operates at a core voltage of 2.5 V with a maximum toggle rate of 250 MHz and a pin-to-pin propagation delay of approximately 0.5 ns. The device exposes 191 user I/O pins and is built on a 0.22 µm CMOS process with embedded array blocks (EABs) for true System-on-a-Programmable-Chip (SOPC) integration. What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the integration density of an ASIC with the flexibility of in-field reprogrammability. Hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Within the FPGA taxonomy, the FLEX 10KE family sits at the high-density end of the SRAM-based segment, featuring embedded array blocks (EABs) that allow memory functions (RAM, ROM, FIFO) to be efficiently distributed across the fabric alongside the logic array blocks (LABs). This hybrid embedded/logic architecture predates modern SoC FPGAs but was groundbreaking for its era as one of the first SOPC-capable platforms. Key features of the EPF10K100EFI256-2 include 624 LABs organized across 4,992 logic cells, 12 embedded array blocks (EABs) providing up to 24 Kbits of distributed RAM, 191 usable I/O pins supporting multiple I/O standards including 3.3 V LVTTL and LVCMOS, and a JTAG-compliant IEEE 1149.1 boundary-scan test interface. The device supports in-system programming (ISP) via the serial passive configuration scheme and is supported by the Altera Quartus and MAX+PLUS II design toolchains. The EPF10K100EFI256-2 is fabricated on a 0.22 µm four-layer metal CMOS process and uses a 2.5 V core supply with 3.3 V tolerant I/O. The architecture separates logic resources (LABs) from memory resources (EABs), enabling efficient implementation of glue logic, state machines, register-intensive datapaths, and small memory blocks in a single device. The 256-ball FineLine BGA package uses a 1.0 mm ball pitch and a 17 x 17 mm body suitable for high-density surface-mount designs. Typical applications for the EPF10K100EFI256-2 include telecommunications interface bridging, industrial control logic, glue logic replacement for ASIC prototypes, and legacy system re-engineering where the FLEX 10KE family has been deployed for two decades. Engineers use this part when modernizing an existing FLEX-based design without re-laying out the PCB, or when the proven SOPC architecture is sufficient for the application. When designing with this device, ensure that the configuration EEPROM and JTAG chain match the chosen configuration mode (PS, AS, or JTAG). The 2.5 V core requires careful power-rail sequencing relative to the 3.3 V I/O supply, and decoupling capacitors must be placed close to the FBGA balls to mitigate simultaneous switching noise on the high-density I/O banks. This page synthesizes distributor pricing, SameFrame pin-compatible migration paths, and practical design considerations specific to the FLEX 10KE family not found in the manufacturer datasheet alone.
EPF10K100EFI484-2 - FLEX 10KE FPGA 100K Gates 484-FBGA | Intel / Altera
The Intel (formerly Altera) EPF10K100EFI484-2 is a FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 100,000 system gates and 4,992 logic elements in a 484-ball FineLine BGA (FBGA) package. Built on a 0.25 µm CMOS SRAM process, it integrates 49,152 bits of embedded array memory, 624 logic array blocks (LABs) and 338 user I/O pins, providing dense programmable logic with on-chip memory and high pin-count connectivity for system-on-a-programmable-chip (SOPC) designs. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can program after manufacture to implement arbitrary digital circuits. FPGAs sit between fixed-function ASICs (higher performance, higher NRE, longer lead time) and CPLDs (simpler, lower density) in the programmable logic hierarchy, and are widely used for glue logic, bus bridging, signal processing, and rapid prototyping. The FLEX 10KE architecture embeds an "Embedded Array" block (EAB) alongside the logic array, enabling efficient on-chip RAM and DSP-style functions. Each EAB provides up to 2,048 bits of memory, and the device includes dedicated carry chains for fast arithmetic, a 4-input look-up table (LUT) per logic element, and JTAG-compliant boundary-scan testing. The part operates from a 2.5 V core supply with 3.3 V multi-voltage I/O support and is specified over the industrial 0 °C to +70 °C range. Typical applications include telecommunications line cards, industrial control and glue logic, high-speed data acquisition front-ends, networking bridges, and legacy digital design replacement. The 338 I/O count supports wide parallel buses and multiple serial channels simultaneously, which is critical for backplane interfaces and processor-coprocessor pipelines in 1990s and early-2000s equipment that still requires long-term support. When designing with this device, ensure your Quartus or MAX+PLUS II toolchain is configured for the FLEX 10KE family; verify core and I/O voltage sequencing at power-up; and respect the FBGA-484 PCB land pattern, which differs from BGA-356 variants of the same family.
EPF10K100EQC208-1 - 100K Gate FLEX-10KE FPGA, 147 I/O | Altera
The Altera EPF10K100EQC208-1 is a member of the FLEX 10KE programmable logic family, delivering approximately 100,000 typical gates of CMOS SRAM-based logic fabric packaged in a 208-pin Power/QFP (208-BFQFP, 28x28 mm) device. The part integrates 624 Logic Array Blocks (LABs) with 4,992 logic elements (LEs) and 147 user I/O pins, providing System-on-a-Programmable-Chip (SOPC) integration through an embedded array block for implementing megafunctions such as multipliers, microcontrollers and DSP primitives. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose logic blocks, interconnect, and I/O cells are configured by the designer after manufacture via a configuration bitstream. The FLEX 10KE family belongs to the broader taxonomy of programmable logic -> CPLD/FPGA -> SRAM-based FPGA -> embedded-array FPGA -> power management/communications glue logic. The "-1" speed grade indicates the slowest commercial speed bin, trading timing margin for lower cost, while "QC208" denotes the quad flat-pack 208-pin pinout (208-BFQFP) and "E" denotes the FLEX 10KE sub-series. Key features include 49,152 RAM bits distributed across embedded array blocks (EABs), 147 user I/O pins, a 2.5 V core supply (per the Altera-micro attribute block) with 3.3 V multi-voltage I/O support, and in-system programmability through the serial configuration interface. The 208-BFQFP footprint is one of the largest Altera offered in the FLEX 10KE generation and is frequently preferred over BGA alternatives when board-level rework is required. The part is built on a 5 V-tolerant CMOS process and supports JTAG (IEEE 1149.1) boundary-scan testing. The FLEX 10KE architecture combines a logic array for fine-grained glue logic with an embedded array for wide datapath functions, enabling a single chip to replace dozens of TTL/CMOS glue parts alongside small microcontrollers. Designers can implement UART, FIFO, PCI soft cores, and Altera MegaCore functions such as Nios processors. The 0.35 µm SRAM process provides a propagation delay around 0.6 ns and an internal global clock network for synchronous designs up to roughly 80-100 MHz system clock. Typical applications include telecom line cards, industrial control backplanes, PCI bridge designs, and legacy digital signal processing pre-processing. The wide I/O count (147 pins) accommodates 32-bit datapaths plus address/control, making the part a common choice for protocol-bridge ASIC prototypes and aerospace ground-test equipment. When designing, observe the 2.5 V core / 3.3 V I/O supply split - a single 3.3 V rail does NOT power the core. Series-termination resistors are recommended on clock and high-speed I/O when driving backplane traces beyond 50 mm. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K100EQC208-1N - 100K Gate FLEX-10KE FPGA, 147 I/O, 208-PQFP | Intel
The Intel (formerly Altera) EPF10K100EQC208-1N is a FLEX-10KE family Field Programmable Gate Array (FPGA) with 100,000 typical gates, 4,992 logic elements, 49,152 bits of embedded RAM, and 147 user I/Os, packaged in a 208-pin Plastic Quad Flat Pack (PQFP) measuring 28x28 mm. It is a member of the FLEX 10K programmable logic family that pioneered embedded array block (EAB) integration. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that contains an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells. FPGAs sit in the digital logic hierarchy between simple PLDs/CPLDs and ASICs, offering higher logic density than CPLDs while avoiding the NRE cost of ASICs. The FLEX 10K family, launched in the mid-1990s, was the industry's first family to embed dedicated SRAM memory blocks (Embedded Array Blocks, EABs) alongside general-purpose logic, enabling System-on-a-Programmable-Chip (SOPC) integration. This places the EPF10K100EQC208-1N in the broader taxonomy of programmable logic -> FPGA -> SRAM-based FPGA -> embedded-block FPGA. Key features of the EPF10K100EQC208-1N include 147 user I/O pins supporting multiple I/O standards, 49,152 bits of distributed SRAM organized into EABs, in-system programmability via SRAM configuration cells, and a 2.375V to 2.625V core supply (5V tolerant I/O with proper reference). The '-1N' speed grade denotes the faster commercial speed bin, while 'N' indicates a lead-free, RoHS-compliant package. The device is built on a 0.42 um CMOS SRAM process with a maximum internal propagation delay of approximately 0.6 ns. The architecture combines a symmetrical array of logic elements (LEs) with rows of EABs spanning the full device width, providing high-density memory and arithmetic functions. Each LE contains a 4-input look-up table (LUT) and a programmable register. The continuous FastTrack Interconnect routes signals across rows and columns with predictable timing, making static timing analysis straightforward. Configuration bitstream is loaded from a serial or parallel PROM into SRAM cells at power-up; the design is volatile and must be reconfigured on each power cycle. Typical applications include glue logic replacement, bus and protocol bridging (PCI, ISA, VME), custom DSP datapaths, telecommunications line-card controllers, industrial control and instrumentation front-ends, and legacy system refresh where original FLEX 10K designs must be replicated or migrated. Designers also use the EABs to implement ROM, dual-port RAM, FIFO, and arithmetic functions such as multipliers. The PQFP-208 package supports hand-soldering and socketed prototyping, which is convenient for industrial and laboratory use. When designing with the EPF10K100EQC208-1N, ensure a stable 2.5V core supply and configure all VCCINT and VCCIO pins per the Altera datasheet; missing power pins will cause unpredictable behavior. A configuration PROM (such as the EPC2 or EPC8 in the same family) is required to load the bitstream at power-up. JTAG boundary-scan and programming are supported, enabling in-system updates. Designers should also note that the FLEX 10K family is a mature legacy product line - verify long-term availability with distributors before committing to new designs, and consider a Cyclone or Cyclone II migration path when starting new projects. This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 10K family and from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
EPF10K100EQC208-1X - 100K Gates FLEX 10KE FPGA, 208-PQFP | Intel
The Intel (formerly Altera) EPF10K100EQC208-1X is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs), delivering 100,000 typical gates, 4,992 logic cells, and 624 logic array blocks (LABs) in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. Fabricated on a 0.22 µm SRAM-based CMOS process and powered from a 2.5 V core supply (2.375 V to 2.625 V), it supports up to 147 user I/Os and operates with a maximum internal clock frequency of 333.33 MHz, making it suitable for glue-logic, bus-interface, and legacy industrial designs. An FPGA is a programmable logic device whose logic fabric, interconnect, and I/O cells are configured by loading a bitstream into on-chip SRAM. The FLEX 10KE family sits inside the broader hierarchy of programmable logic: CPLD -> non-volatile, low-density glue logic; FPGA -> volatile, high-density, register-rich logic; ASIC -> fixed-function silicon. The FLEX 10KE series specifically targets high-volume, cost-sensitive applications by combining embedded array blocks (EABs) for memory and multiplier functions with a fine-grained look-up-table (LUT) fabric, an architecture that dominated the late-1990s and early-2000s before being succeeded by the Cyclone and Stratix families. Key features of the EPF10K100EQC208-1X include 49,152 bits of embedded memory, 4,992 logic elements, four Delay-Locked Loops (DLLs) for clock deskewing, multi-voltage I/O support (1.8 V, 2.5 V, 3.3 V, and 5.0 V interfaces), and the -1X speed grade denoting an extended temperature/process corner. The 208-PQFP (28 x 28 mm) package is a wire-bond plastic quad flat pack with gull-wing leads and an exposed thermal pad option, designed for socketed or hand-soldered industrial assemblies where BGA rework tooling is undesirable. Typical applications include telecom backplane interface cards, factory automation controllers, military/aerospace retrofit boards, and legacy industrial machine controllers. The 333.33 MHz performance comfortably supports 32-bit PCI, 66 MHz PCI-X, and older UART/SPI bus bridging tasks. Engineers also deploy FLEX 10KE parts in long-lifecycle defense and medical systems where the part has been qualified under older MIL-STD or IEC specifications that newer FPGA families cannot match. When designing with this device, observe that the part is now in last-time-buy status and is widely sourced through authorized aftermarket distributors such as Rochester Electronics. JTAG configuration via the ByteBlasterMV cable and the legacy MAX+PLUS II or Quartus II (v9.0 and earlier) toolchain are required. Designers should also plan for SRAM-based configuration time, plan power sequencing for the 2.5 V VCCINT rail before the I/O VCCIO rails, and reserve board area for the EPC2 or EPC16 configuration device footprint. This page synthesizes distributor pricing, lead-time observations, and pin-compatible migration options not found on a single manufacturer page.
EPF10K100EQC208-2 - FLEX 10KE FPGA 100K Gates 208-PQFP | Altera
The Altera (Intel) EPF10K100EQC208-2 is a member of the FLEX 10KE family of Field Programmable Gate Arrays (FPGAs) housed in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) measuring 28x28 mm. It integrates 100,000 typical gates with 4,992 logic elements (LEs) and 49,152 bits of embedded SRAM, packaged as 147 user I/O pins. The device operates from a 2.375 V to 2.625 V core supply (5 V tolerant I/O with separate VCCIO rails) and is rated for the commercial 0 C to +70 C temperature range. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic using configurable logic blocks (LABs), embedded memory arrays, and programmable interconnect. FPGAs sit hierarchically above ASICs and CPLDs in density and below in cost-per-volume, and the FLEX 10KE generation specifically combines look-up-table based logic with embedded SRAM blocks (EABs) - making it suitable for glue logic, bus interfacing, DSP datapaths, and pre-ASIC prototyping in the late 1990s and early 2000s design flow. Today it serves as a long-life-cycle component for industrial, telecom, and military sustainment programs. Key features include 624 Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) of 2,048 bits each, 147 maximum user I/O pins, and IEEE Std 1149.1 (JTAG) boundary-scan support. The device supports in-system programmability via the serial configuration EEPROM interface, and is supported by the Altera MAX+PLUS II and Quartus design toolchains (legacy support paths). The FLEX 10KE architecture uses a continuous SRAM-based configuration memory that the device loads from an external EPROM or microcontroller on power-up. Each LAB contains 8 LEs and local interconnect; each LE includes a 4-input LUT, a programmable register, and a carry chain for fast arithmetic. Embedded Array Blocks implement dual-port RAM, ROM, or FIFO functions at up to 2,048 bits per block, with a 2048x1, 1024x2, 512x4, or 256x8 organization. Typical applications include industrial control glue logic, telecom line-card interfacing, legacy ASIC prototyping, bus-bridging between microprocessors and peripherals, and embedded control on the factory floor. The wide temperature-grade variants of this same silicon (EPF10K100EQC208-2N industrial / -2X extended) cover harsher environments, while the -2 speed grade provides a balanced speed/power tradeoff for most designs. When designing with this device, ensure the configuration EPROM is sized to hold the full bitstream and that the nCONFIG, nSTATUS, and CONF_DONE pins are properly pulled and monitored during initialization. The 208-PQFP package requires careful PCB layout due to its 0.5 mm pitch - trace escape routing and a 4-layer board with dedicated ground plane are strongly recommended to control impedance and crosstalk on high-speed I/O. This page synthesizes distributor stock, drop-in same-family alternatives, datasheet location, and design notes that are not aggregated in any single manufacturer or distributor page, giving procurement and engineering teams a single source of truth for the EPF10K100EQC208-2.
EPF10K100EQC208-2N - 100K FLEX 10KE FPGA, 208-BFQFP | Altera (Intel)
The Altera (Intel) EPF10K100EQC208-2N is a member of the FLEX 10KE family of SRAM-based FPGAs, providing 100,000 typical gates, 4,992 logic elements (LEs), and 49,152 memory bits in a 208-pin FineLine BGA-compatible PQFP package. The -2 speed grade and -N suffix identify a commercial-temperature, lead-free device within the FLEX 10KE product tree, operating from a 2.375 V to 2.625 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacturing using a hardware description language such as VHDL or Verilog. Architecturally, an FPGA sits between a fixed-function ASIC and a programmable logic device, combining configurable logic blocks (LBs), a programmable interconnect fabric, and embedded memory arrays. The FLEX 10KE family extends the original FLEX 10K architecture with enhanced interconnect and additional embedded array blocks (EABs) used as on-chip RAM or ROM, enabling designers to integrate glue logic, state machines, and small memory structures on a single die. Key features of the EPF10K100EQC208-2N include 147 user I/O pins, 624 logic array blocks (LABs), and 12 embedded array blocks (EABs) totaling approximately 49 Kbits of RAM. The device supports in-system programmability via the Altera ByteBlaster or BitBlaster download cables and the legacy MAX+PLUS II or Quartus design flows, with JTAG boundary-scan test per IEEE 1149.1. Its 208-BFQFP package offers 28 mm x 28 mm body dimensions and a 0.5 mm lead pitch, making it suitable for moderate-density designs that benefit from through-hole-style gull-wing lead inspection. The device is fabricated on a 0.42 µm CMOS SRAM process with a typical propagation delay around 0.7 ns for internal logic paths. The FLEX 10KE architecture uses look-up-table-based logic elements combined with fast-carry chains and dedicated cascade paths, allowing efficient implementation of arithmetic functions such as adders, counters, and multipliers. Designers target the device using schematic capture or HDL synthesis, with Quartus II providing place-and-route, timing analysis, and bitstream generation. Typical applications include telecommunications line cards, industrial control interfaces, military and aerospace subsystems, and legacy system upgrades where a proven, mature FPGA architecture is preferred over newer low-cost Cyclone or MAX families. With 147 I/Os the device can interface with multiple parallel buses, memory chips, and analog front ends. Because the FLEX 10KE series is in NRND/EOL status on Intel's product tree, this part is generally procured from authorized distributors for new designs or used to maintain existing production hardware. When designing with the EPF10K100EQC208-2N, plan for an external configuration memory (EPC1 or EPC2) because the SRAM-based configuration is volatile and reloads on every power-up. Provide a clean 2.5 V core rail and a separate VCCIO bank supply per I/O standard, and add decoupling capacitors within 5 mm of every supply pin. Note that the FLEX 10KE family is no longer recommended for new designs; consider the MAX II, Cyclone III, or Cyclone IV families for new projects. This page synthesizes distributor pricing, drop-in alternative sources, and practical design notes not found on the legacy Altera datasheet, including verified same-package speed-grade variants and supply-chain guidance.
EPF10K100EQC208-2X - FLEX 10KE FPGA, 100K Gates, 208-PQFP | Altera
The Altera (Intel) EPF10K100EQC208-2X is a member of the FLEX 10KE family of Field Programmable Gate Array (FPGA) ICs, delivering 100,000 system gates with 4,992 logic elements/cells and 49,152 bits of embedded memory in a 208-pin Plastic Quad Flat Pack (PQFP / 208-BFQFP) package. Built on a 0.22 µm SRAM-based process, the device operates from a 2.375 V to 2.625 V core supply (2.5 V nominal), supports 147 user I/O pins, and is offered in the commercial -2 speed grade with a guaranteed internal operating frequency of up to 250 MHz. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication, sitting in the broader hierarchy of programmable logic -> programmable logic devices -> digital ICs -> semiconductors. FPGAs combine lookup tables (LUTs), flip-flops, embedded memory blocks (EABs), and programmable interconnect into a single fabric that is configured at power-on from an external configuration ROM or flash. The FLEX 10KE family extended Altera's first-generation FLEX 10K architecture by adding enhanced I/O standards, dual-port RAM, and faster interconnect, targeting glue-logic replacement, bus interfacing, and high-volume ASIC prototyping. Key features of the EPF10K100EQC208-2X include 4,992 logic elements (LEs) grouped into Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) providing 49,152 bits of RAM, 147 programmable I/O pins supporting LVTTL/LVCMOS/PCI interfaces, an on-chip Phase-Locked Loop (PLL) for clock multiplication and skew management, JTAG (IEEE 1149.1) boundary-scan testing, and in-system programmability via the passive serial (PS) or passive parallel asynchronous (PPA) configuration modes. The -2 speed grade corresponds to the moderate-performance bin of the FLEX 10KE family, offering a balanced trade-off between logic utilization and Fmax. The 208-pin PQFP package measures 28 mm × 28 mm with a 0.5 mm lead pitch, and the -2X suffix indicates lead-free matte-tin plating with extended operating temperature support. Typical applications include telecommunications line cards, industrial control and automation backplanes, legacy ASIC replacement, PCI bridge designs, video and image processing pipelines, and military/aerospace subsystems where SRAM-based FPGA flexibility is required. The wide 2.5 V core supply tolerance allows operation from regulated 3.3 V rails with simple LDO regulation. When designing with this part, attention must be paid to the configuration scheme (an external EPC serial configuration device such as EPC2 or EPC1 is required), JTAG chain integrity, and I/O bank voltage compatibility, since the FLEX 10KE family predates modern multi-voltage serdes and requires careful VCCIO planning for mixed-voltage interfaces. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes not found in the original datasheet.
EPF10K100EQC208-3 - FLEX-10KE FPGA, 100K Gates, 208-PQFP | Altera
The Altera EPF10K100EQC208-3 is a member of the FLEX-10KE family of Field Programmable Gate Arrays (FPGAs), delivering 100,000 typical gates, 4,992 logic elements, and 49,152 bits of embedded SRAM in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) package. Built on a 0.22 µm CMOS process, it operates from a 2.5 V core supply and supports up to 147 user I/O pins for flexible system integration in commercial-temperature applications. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can program after manufacture to implement custom digital logic. The FLEX 10KE family belongs to the broader programmable logic device (PLD) taxonomy, alongside CPLDs and SPLDs, and occupies the high-density end of that hierarchy. Within the system, FPGAs sit between fixed-function ASICs and software-defined processors, offering hardware-level parallelism and reconfigurability for glue logic, prototyping, and low-volume production. The EPF10K100EQC208-3 includes 624 logic array blocks (LABs) and embedded array blocks (EABs) used for implementing RAM, ROM, and multiplier functions. Speed grade "-3" denotes the slowest commercial timing bin in the FLEX-10KE lineup, trading off Fmax for cost savings in designs where timing closure is not critical. The 208-PQFP package uses gull-wing leads suitable for surface-mount assembly on standard 0.5 mm-pitch footprints. Typical applications include telecommunications line cards, factory automation controllers, data-acquisition front-ends, legacy industrial bus bridges, and educational digital design platforms. The combination of embedded memory and configurable logic makes it suitable for systems requiring custom state machines, glue logic between microprocessors and peripherals, and bus interface adaptation. When designing with this device, note that the FLEX-10KE architecture is two decades old and the part is in the Intel/Altera legacy lifecycle. Quartus II software (or MAX+PLUS II) is required for place-and-route, and the on-chip configuration memory uses SRAM cells that must be loaded from a PROM or microcontroller on every power-up. Engineers should evaluate the modern Cyclone family for new designs.
EPF10K100EQC240-1 - FLEX 10KE FPGA 100K Gates 240-PQFP | Altera
The Altera (now Intel) EPF10K100EQC240-1 is a member of the FLEX 10KE family of SRAM-based FPGAs, integrating 100,000 typical gates, 4,992 logic elements (LEs), and 49,152 bits of embedded RAM in a 240-pin Power Quad Flat Pack (PQFP / BFQFP) package. It provides 189 user I/Os, 624 LABs/CLBs, and is built on a 0.42 µm CMOS process operating from a 2.375 V to 2.625 V core supply with 3.3 V I/O compatibility. The -1 speed grade delivers a propagation delay of approximately 0.4-0.6 ns across the FastTrack interconnect, supporting system clock rates up to 125 MHz in typical designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing by a configuration bitstream loaded into SRAM cells. Within the broader taxonomy, FPGAs sit beside CPLDs (Complex Programmable Logic Devices) inside the PLD (Programmable Logic Device) family, and represent the highest-density, highest-performance tier of general-purpose programmable logic. FPGAs are commonly used to implement glue logic, custom datapaths, bus interfaces, and prototype ASICs before tape-out. The FLEX 10KE family specifically introduced embedded array blocks (EABs) for on-chip RAM and ROM, enabling System-on-a-Programmable-Chip (SOPC) integration. Key features include embedded array blocks (EABs) for synchronous RAM and ROM, multi-level FastTrack interconnect routing, JTAG (IEEE 1149.1) boundary-scan test support, and built-in PCI compliance. The architecture combines 4,992 LEs distributed across 624 LABs with 12 embedded array blocks of 2,048 bits each, totaling 24 Kbits of dedicated memory expandable to 49 Kbits when using LE-based RAM. MultiVolt I/O pins support 3.3 V, 2.5 V, and 1.8 V interfaces through dedicated VCCIO banks, simplifying mixed-voltage design. The FLEX 10KE architecture separates logic and interconnect resources into rows and columns, with each Logic Array Block containing 8 LEs, a carry chain, and a cascade chain for arithmetic and wide fan-in functions. The embedded array blocks serve as 2,048-bit memory blocks configurable as RAM, ROM, or lookup tables. Configuration data is loaded serially via a 5-pin interface or via the ByteBlaster/parallel port cable, supporting in-system programmability. Operating temperature range is 0 °C to 70 °C for the commercial grade, with the device consuming low standby current typical of SRAM-based FPGAs. Typical applications include telecommunications line cards, industrial control glue logic, PCI bus bridges, peripheral controllers, and legacy system upgrades where migration from discrete TTL or older PLDs is required. The 189 user I/Os make the EPF10K100E well-suited to bus-intensive designs with multiple external interfaces. When designing with this device, verify that the I/O bank voltages match those of connected peripherals, since 5 V tolerance is not provided on all pins. The 240-pin PQFP package requires careful PCB layout with adequate power and ground planes, and the -1 speed grade should be derated appropriately when calculating setup and hold margins for high-speed synchronous interfaces. This page synthesizes distributor pricing, drop-in alternatives from the FLEX 10KE family, and practical design notes not found in the original manufacturer datasheet alone.
EPF10K100EQC240-1N - 100K-Gate FLEX 10KE FPGA, 240-PQFP | Intel
The Intel (formerly Altera) EPF10K100EQC240-1N is a member of the FLEX 10KE embedded programmable logic family, integrating 100,000 typical gates, 4,992 logic cells, and 49,152 bits of embedded RAM in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. It supports up to 189 user I/Os, operates from a 2.375 V to 2.625 V core supply, and is built on a 0.22 µm CMOS SRAM process with 2.5 V core and 3.3 V/5 V MultiVolt I/O compatibility. The device is specified for the commercial temperature range (0 °C to 70 °C) and is suited for medium-complexity glue-logic, bridging, and bus-interface applications. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LABs), programmable interconnect, and I/O cells into a single SRAM-based fabric. The FLEX 10KE family introduced an embedded array block (EAB) architecture that mixes distributed logic with embedded memory blocks, enabling System-on-a-Programmable-Chip (SOPC) integration. In the broader taxonomy, FPGAs sit above CPLDs in logic capacity but below ASICs in fixed-function performance; the FLEX 10KE is positioned as a low-cost, mid-density bridge between discrete glue logic and high-end FPGA families such as APEX and Stratix. Key features of the EPF10K100EQC240-1N include 624 logic array blocks (LABs), an internal toggle frequency up to 333.33 MHz, JTAG-compliant IEEE 1149.1 boundary-scan test support, multi-volt I/O for interfacing with 2.5 V, 3.3 V, and 5 V buses, and in-system programmability via the passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG configuration modes. The 240-pin PQFP package has a generous thermal pad for socket or socketed SMT assembly and is the highest-I/O-count package option for the FLEX 10KE 100K-gate density grade. Typical applications include telecommunication line cards, industrial control bridges, legacy PCI/ISA bus interfaces, prototyping platforms for ASIC emulation, and embedded control systems where deterministic SRAM-based logic is required. Because the design is SRAM-volatile, configuration must be reloaded at power-up from a serial EPROM or microcontroller, which is the standard pattern for FLEX 10KE designs. The wide MultiVolt I/O makes it a strong choice for boards that mix 3.3 V ASIC/ASSP logic with 5 V peripheral buses. Designers should review Altera Application Note 33 (Configuring FLEX 10K Devices) and Application Note 38 (IEEE 1149.1 Boundary-Scan Testing) for in-system programming and JTAG recommendations. This page consolidates distributor inventory, drop-in and same-footprint alternatives, and design notes from real manufacturer documentation to give engineers a more actionable view than the bare datasheet.
EPF10K100EQC240-1X - 100K Gate FLEX 10KE FPGA, 240-PQFP | Intel
The Intel (formerly Altera) EPF10K100EQC240-1X is a FLEX 10KE family Field-Programmable Gate Array (FPGA) IC with 100,000 system gates, 4,992 logic cells, 49,152 bits of embedded RAM, and 189 user I/Os, housed in a 240-pin Plastic Quad Flat Pack (PQFP / BFQFP) measuring 32x32 mm. It operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports PCI Local Bus 2.2 compliance for both 3.3 V and 5.0 V signaling, with the -1 speed grade suitable for 33 MHz or 66 MHz PCI designs. The device is built on a 0.22 um CMOS process and is rated for a maximum internal clock frequency of 333.33 MHz. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that lets engineers configure arbitrary digital logic after PCB manufacture. FPGAs sit in the broader hierarchy of programmable logic ICs (PLD -> CPLD -> FPGA -> SoC FPGA), and the FLEX 10KE family is positioned as a high-density, SRAM-based FPGA line from Altera with embedded array blocks (EABs) that implement on-chip memory. The 10KE generation followed the original FLEX 10K and added improved I/O standards and faster interconnect, targeting glue-logic replacement, custom datapaths, and pre-ASIC prototyping. Key features include 624 logic array blocks (LABs), built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, and embedded array blocks for true dual-port RAM, ROM, and FIFO functions. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and 5 V tolerant inputs on selected banks. The 'X' suffix indicates the part is supplied in Tray packaging rather than Tape and Reel, and is qualified for commercial operating temperature ranges. Typical applications include PCI bus interface cards, telecom line cards, industrial motor control, and embedded controller prototyping where mid-density logic and embedded memory are required. SameFrame pin migration across FLEX 10KE PQFP and BGA packages allows designers to move between footprints when scaling density. For new designs, the EPF10K100EQC240-1X is recommended only as a pin-compatible legacy migration source; modern designs should target Cyclone or MAX 10 series devices. When designing, plan for a 2.5 V core regulator with sufficient headroom and decouple each VCC/GND pair with 0.1 uF and 10 uF capacitors placed close to the package. The PQFP-240 package uses gull-wing leads; a fine-pitch socket is recommended for prototyping, while production boards should use reflow soldering with a peak profile not exceeding 30 s above MSL-3 floor life.