FPGA & CPLD
Products (6352)
EPF10K30EFC256-1X - FLEX 10KE FPGA, 30K Gates, 256-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K30EFC256-1X is a member of the FLEX 10KE family of SRAM-based FPGAs, providing 30,000 typical gates and 1728 logic elements (LEs) housed in a 256-ball FineLine BGA package. The device implements the FLEX 10KE architecture with 216 logic array blocks (LABs), 176 user I/O pins, and embedded array blocks (EABs) for distributed RAM and ROM. According to the Altera FLEX 10KE datasheet, the -1X speed grade offers the fastest commercial-grade timing with internal frequencies up to 250 MHz in 0.22 µm CMOS technology. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacture to implement custom digital logic functions. FPGAs sit within the broader programmable logic device (PLD) family, which also includes SPLDs and CPLDs. FPGAs like the FLEX 10KE sit at the top of the PLD hierarchy, providing the highest logic density and the richest interconnect. FPGAs occupy the position of programmable logic in the system hierarchy: ASIC < structured ASIC < FPGA < general-purpose microprocessor/DSP, with FPGAs delivering higher integration than CPLDs at lower NRE cost than full-cell ASICs. Key features include 24,576 bits of embedded memory distributed across EABs, four phase-locked loops (PLLs) for clock management, MultiVolt I/O supporting 2.5V/3.3V/5V interfaces, and in-system programmability via the IEEE 1149.1 JTAG interface. The 256-pin FBGA package provides a 17 mm x 17 mm body with 1.0 mm ball pitch, optimized for high-density surface-mount designs. Each EAB provides 4 Kbits of RAM, giving the device approximately 6 Kbits of usable RAM per EAB configuration. The FLEX 10KE architecture combines a fine-grained gate-array fabric (logic elements organized in LABs of 8 LEs each) with coarse-grained embedded array blocks for memory-intensive functions. The interconnect uses a hierarchical FastTrack routing structure with row and column channels, allowing predictable timing closure across typical logic utilization levels. The 0.22 µm CMOS process places the device in the legacy SRAM-FPGA tier that powered Altera's programmable logic roadmap from 1998 onwards. Typical applications include industrial control logic, telecommunications interface bridges, glue logic replacement, and prototype ASIC verification. The 176 user I/Os support abundant parallel buses, making the device suitable for legacy peripheral interfacing and custom state machines in test equipment. The combination of 30K gates and embedded memory also fits DSP pre/post-processing pipelines and protocol conversion cards in legacy industrial backplanes. When designing with this device, note that the FLEX 10KE family requires 2.5V core supply and supports 2.5V/3.3V/5V MultiVolt I/O. JTAG programming is mandatory because the SRAM configuration cell is volatile. The 256-BGA FineLine package demands careful PCB design with controlled-impedance routing and matched-length clock traces. This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE family, and practical design notes not found in the original Altera datasheet, providing information gain beyond standard product listings.
EPF10K30EFC256-2 - FLEX 10KE FPGA, 30K Gates, 256-FBGA | Altera
The Altera (Intel) EPF10K30EFC256-2 is a member of the FLEX 10KE family of FPGAs delivering approximately 30,000 system gates with 1,728 logic elements and 24,576 RAM bits in a 256-ball FineLine BGA package. It operates at a core voltage of 2.5 V (2.375 V to 2.625 V) and provides 176 user I/Os at up to 80 MHz internal frequency with 0.6 ns propagation delay, balancing logic density and I/O bandwidth for mid-complexity programmable designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that designers can re-configure in-system via SRAM lookup tables. Within the broader hierarchy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) as the high-density branch of programmable logic; the FLEX 10KE family is a 0.22 um CMOS SRAM-based architecture that pioneered embedded array block (EAB) integration, foreshadowing modern System-on-a-Programmable-Chip (SoPC) designs. The EPF10K30E distinguishes itself with embedded dual-port RAM blocks, a 2.5 V core, and PCI compliance for bus-interface applications. Key features include 1728 logic elements, 24,576 RAM bits distributed across embedded array blocks (EABs), 216 logic array blocks (LABs), 176 usable I/O pins, and a peak operating frequency around 200 MHz according to family specifications. The FLEX 10KE architecture supports in-system programmability via the IEEE 1149.1 JTAG interface and passive serial configuration, enabling rapid prototyping. With SRAM-based configuration, the device must be reconfigured at each power-up using an external configuration PROM such as the EPC2 or EPC8 series. The EPF10K30E combines look-up-table (LUT)-based logic cells with embedded dual-port RAM, making it suitable for glue logic, bus interfaces, custom state machines, and moderate-density signal processing front-ends. Its embedded array blocks can implement FIFOs, ROM tables, and small DSP functions without consuming general-purpose logic. The 0.22 um CMOS process at 2.5 V core gives it better power efficiency than earlier 5 V FLEX 10K devices while preserving a familiar Quartus/MAX+PLUS II design flow. Typical applications include PCI bus interfaces, telecommunications line cards, industrial control logic, glue logic for ASIC/ASSP replacement, and prototype systems that need a moderate gate count and a high I/O count. The 176 I/O pins accommodate wide data buses and parallel peripheral interfaces, while the embedded RAM blocks enable protocol buffering and lookup-table acceleration. When designing with this FPGA, ensure the configuration PROM is sized appropriately for the bitstream and that JTAG chain integrity is validated before relying on in-system updates. Because the FLEX 10KE family is a mature, mature-generation part, lead-time risk is significant; verify distributor stock and lifecycle status before committing to a long-lifecycle design.
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K30EFC256-2N is a member of the FLEX 10KE embedded programmable logic family, delivering approximately 30,000 typical gates with 1,728 logic elements (LEs) and 24,576 RAM bits in a 256-ball FineLine BGA package (17 x 17 mm, 1.0 mm pitch). It is implemented in a 0.22 µm CMOS SRAM process and supports in-system configuration via a built-in serial configuration interface. The '2N' speed grade corresponds to a propagation delay of approximately 0.6 ns at the register-to-register path, with a commercial operating temperature range of 0 °C to +70 °C. A FLEX 10KE device is an SRAM-based FPGA that combines a logic array fabric with an Embedded Array Block (EAB), enabling true System-on-a-Programmable-Chip (SOPC) integration. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) that sits alongside CPLDs in the digital IC hierarchy, and is itself a sub-family of the wider semiconductor category. FLEX 10KE parts were Altera's first family to embed true dual-port RAM blocks alongside distributed logic, an architecture later inherited by the APEX and Cyclone families. Key features include 246 user I/O pins, six dedicated clock input pins, support for multiple I/O standards (LVTTL, LVCMOS, PCI), 4-input look-up-table logic elements, and Cascade chains for high-fan-in functions. The device supports MultiVolt I/O for interfacing to 5.0 V, 3.3 V, and 2.5 V buses. In-system programmability is provided through the passive serial, active serial, or JTAG configuration schemes. Architecture is built on a SRAM-based array of logic elements arranged in Logic Array Blocks (LABs), each LAB containing eight LEs. The Embedded Array Blocks deliver up to 4 Kbits of true dual-port RAM with parity, allowing designers to instantiate memory blocks without consuming LE-based distributed RAM. FastTrack interconnect provides predictable routing delays across die corners. Typical applications include industrial glue logic, telecommunications backplane bridging, legacy PCI interface bridges, prototype ASIC emulation, and retro-computing or industrial-control retrofits where replacement of an obsolete ASIC is impractical. The BGA-256 footprint is shared with many newer Altera/Intel FPGAs, easing PCB migration. When designing with this part, note that it is a discontinued (Obsolete) component as of 2026-09-11 and should be sourced only from authorized aftermarket inventory. Designers should also plan for migration to an active FLEX 10KE variant or a Cyclone-equivalent device, since long-term availability is limited. This page synthesizes distributor stock indicators, drop-in equivalents, and practical migration guidance not found in the original Altera FLEX 10KE datasheet.
EPF10K30EFC256-2X - 30K FLEX-10KE FPGA 1728 Cells 256-BGA | Intel / Altera
The Intel / Altera EPF10K30EFC256-2X is a member of the FLEX-10KE embedded programmable logic family, delivering 30,000 gates and 1,728 logic elements on a 0.22 µm CMOS process in a 256-ball FineLine BGA package measuring 17x17 mm. It operates from a 2.375 V to 2.625 V (2.5 V nominal) supply and supports user I/O counts up to 176 with a propagation delay as low as 0.6 ns and internal frequency up to 200 MHz. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that can be configured by the designer after manufacturing to implement custom digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> embedded-block FPGAs. The FLEX-10KE family pioneered embedded array blocks, integrating RAM and logic to enable System-on-a-Programmable-Chip (SOPC) designs that combine glue logic, FIFOs, and state machines on a single device. Key features include 24,576 bits of embedded SRAM distributed across EABs (Embedded Array Blocks), 216 Logic Array Blocks (LABs), 0.22 µm CMOS technology, and a -2 speed grade. The FineLine BGA package provides high I/O density for designs requiring many parallel interfaces in a compact footprint, suitable for legacy telecom, industrial control, and ASIC prototyping systems. Typical applications include ASIC prototyping, glue-logic consolidation, custom DSP pre-processing, telecom interface bridges, and industrial bus controllers. The device is also used in test equipment, military/aerospace (when properly screened), and legacy communications infrastructure where the FLEX-10KE architecture is well-supported by mature toolchains such as Quartus II and MAX+PLUS II. When designing with this device, ensure proper decoupling per FLEX-10KE guidelines and verify configuration mode support (e.g., passive serial, JTAG) against the toolchain version. Note that this part is now legacy hardware - confirm long-term availability with authorized distributors before committing to new designs.
EPF10K30EFC256-2XN - 30K FLEX-10KE FPGA, 256-BGA, Industrial | Altera
The Intel (formerly Altera) EPF10K30EFC256-2XN is a member of the FLEX 10KE family of Field Programmable Gate Arrays (FPGAs), delivering 30,000 typical gates (17,280 usable logic elements / 1,728 logic cells) in a 256-ball FineLine BGA (FBGA) package. Built on a 0.22 micrometer CMOS SRAM process with four-layer metal interconnect, this device operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports 176 user I/O pins, with internal frequency performance up to 200 MHz depending on design. The '-2X' speed grade and 'N' suffix denote an industrial temperature range (-40 C to +85 C) and lead-free / Pb-free packaging. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement arbitrary digital logic functions. FPGAs sit above fixed-function ASICs and microcontrollers in flexibility, occupying the niche between software-defined microcontrollers and fully custom silicon - enabling rapid prototyping, low-volume production, and hardware-reconfigurable signal processing. The FLEX 10KE family introduced embedded array blocks (EABs) for on-chip RAM and ROM, making it suitable for designs requiring distributed memory alongside logic. Key features include 24,576 bits of embedded RAM (6 EABs of 4,096 bits each), multi-volt I/O support (3.3 V and 5.0 V tolerant), in-system programmability via JTAG, and built-in PCI compliance for bus-interface designs. The 256-FBGA 17x17 mm package provides high pin density for compact board layouts, with all 176 user I/Os available at standard logic levels. The architecture combines 1,728 logic elements (each containing a 4-input LUT and a register) with embedded array blocks for synchronous memory, allowing single-chip implementation of glue logic, state machines, bus bridges, and DSP datapaths. MultiVolt I/O lets the device interface directly with 5 V, 3.3 V, and 2.5 V peripherals without external level shifters, a significant advantage in mixed-voltage systems. Typical applications include telecom interface cards, industrial control and automation, legacy PCI bridge logic, motor control, and glue logic replacement in telecom and embedded systems where the FLEX 10KE remains in long-lifecycle production. The industrial temperature range and EOL-managed mature-node silicon also suit it for defense and aerospace programs requiring stable, multi-decade component availability. When designing with this part, remember the FLEX 10KE requires 2.5 V core; plan a separate regulator from any 3.3 V or 5 V rails. The device is configured via JTAG or an Altera EPC configuration EEPROM, and Quartus II (legacy versions) or MAX+PLUS II software is used for design entry. For new designs, consider Cyclone IV or MAX 10 as modern, lower-power, higher-density drop-in-compatible replacements in many applications. This page synthesizes distributor pricing, drop-in alternatives, lifecycle notes, and practical design guidance for engineers maintaining FLEX 10KE-based systems, information not consolidated in the manufacturer datasheet alone.
EPF10K30EFC256-3 - 30K FLEX 10KE FPGA, 1728 Cells, 256-BGA | Intel
The Intel (formerly Altera) EPF10K30EFC256-3 is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs), offering 30,000 typical gates, 1,728 logic cells (LEs), and 24,576 RAM bits in a 256-ball FineLine BGA package at a -3 (faster) speed grade. Built on a 0.22 micrometer CMOS process and operating from a 2.5 V core supply, this device delivers system frequencies up to 200 MHz while exposing 176 user I/O pins for high-density glue-logic and bus-interface designs. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines gate-array-equivalent logic density with configurable interconnect, embedded memory blocks, and an I/O ring that can be programmed for multiple voltage and timing standards. FPGAs belong to the broader hierarchy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> look-up-table (LUT) + embedded-block architecture. The FLEX 10KE family pioneered embedded array block (EAB) integration for on-chip RAM and ROM, enabling single-chip implementation of memory-intensive functions like FIFOs and DSP datapaths. Key features of the EPF10K30EFC256-3 include 216 logic array blocks (LABs), a built-in Joint Test Action Group (JTAG) boundary-scan interface (IEEE Std 1149.1 compliant), multi-voltage I/O standards support (LVTTL, LVCMOS, PCI), and the Altera SameFrame pin-compatibility migration path that allows board reuse across the 256-pin FineLine BGA family. The -3 speed grade targets designs where the highest toggle rates and shortest combinatorial delays are required. Architecturally, the FLEX 10KE device connects each LAB through a continuous FastTrack Interconnect routing fabric, while embedded array blocks provide true dual-port RAM capability. Compared with pure gate-array ASICs, the FLEX 10KE family offers instant prototyping, in-system reconfigurability through the serial configuration device interface, and significantly lower non-recurring engineering (NRE) cost for low-to-medium-volume production. Typical applications include telecommunications line cards, industrial control and factory automation backplanes, networking routers and switches, PCI bus bridges, and legacy ASIC-replacement designs. The 256-FBGA footprint and SameFrame pin migration also enable straightforward board reuse across the FLEX 10K family density ladder. When designing with the EPF10K30EFC256-3, ensure that the configuration EPROM (EPC8 or equivalent) is correctly sized for the device bitstream and that all 2.5 V VCCINT and 3.3 V VCCIO rails are properly decoupled with bulk and high-frequency ceramic capacitors near the BGA balls. This page synthesizes distributor pricing, SameFrame drop-in alternatives within the FLEX 10K family, and practical design notes that supplement the manufacturer datasheet to accelerate component selection.
EPF10K30EFC256-3N - FLEX 10KE 30K-Gate FPGA | Intel/Altera
The Intel (formerly Altera) EPF10K30EFC256-3N is a 30,000-gate FLEX 10KE family FPGA with 1,728 logic elements, fabricated on a 0.22 um CMOS process and supplied in a 256-pin FineLine BGA (FBGA) package. It is the industry's first embedded programmable logic device family to provide System-on-a-Programmable-Chip (SOPC) integration through embedded array blocks (EABs) that implement megafunctions such as efficient memory and specialized logic functions. The device operates with a 2.5 V core supply, supports MultiVolt I/O for 2.5 V/3.3 V/5.0 V interfacing, and offers PCI-compliant 3.3 V operation at 33 or 66 MHz. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs) connected by programmable interconnect. Embedded array blocks (EABs) augment the general-purpose LUT-based fabric with on-chip dual-port RAM and ROM, so an FPGA can absorb functions that would otherwise require a separate memory or ASIC. FPGAs sit in the broader hierarchy of programmable logic: PAL -> CPLD -> FPGA -> SoC FPGA, and they are used wherever deterministic, parallel hardware acceleration is required. Key features include 6 embedded array blocks implementing up to 24,576 RAM bits, bidirectional I/O performance up to 212 MHz, tSU and tCO propagation as fast as 0.6 ns, full PCI SIG 2.2 compliance at 33/66 MHz on -1 speed grade, open-drain output option per I/O, and JTAG boundary-scan support. MultiVolt I/O enables mixed-voltage interfacing with 2.5 V, 3.3 V, and 5.0 V devices without external translation buffers. The EPF10K30EFC256-3N architecture combines an Embedded Array for memory-intensive megafunctions with a Logic Array for general-purpose logic, and supports the same-frame pin-out migration path within the FLEX 10KE family. This allows a single PCB layout to host multiple density / package combinations, simplifying board bring-up and second-sourcing. Typical applications include PCI bus bridges, glue logic for embedded systems, communications infrastructure prototyping, industrial control interfaces, and legacy systems that require a still-supported 0.22 um CMOS FPGA. The 256-pin FBGA footprint also makes it suitable for high-density designs where leaded packages cannot meet routing requirements. A key design consideration when using this part is that the FLEX 10KE family has been classified Obsolete / End of Life by Intel, so procurement should be paired with a verified cross-reference plan. Confirm your design tools (Quartus II) and IP libraries still support the device before committing to new production runs. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K30EFC484-1 - FLEX 10KE FPGA, 30K Gates, 484-BGA | Altera
The Intel (formerly Altera) EPF10K30EFC484-1 is a FLEX 10KE-series Field Programmable Gate Array (FPGA) integrating 30,000 typical gates and 1728 logic elements in a 484-ball FineLine BGA package. The device delivers up to 220 user I/Os and 24,576 bits of embedded RAM in a commercial 0C to 70C temperature grade, optimized for high-volume glue-logic and bus-interface designs. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than at wafer fabrication. FPGAs sit between discrete TTL logic and Application-Specific Integrated Circuits in the programmable logic hierarchy, which itself belongs to the broader category of programmable logic devices (PLDs) within the integrated circuit family. The FLEX 10KE family was Altera's second-generation embedded-block SRAM FPGA, providing dedicated array blocks (EABs) for true dual-port memory, making them suitable for systems-on-a-programmable-chip (SOPC) integration. Key features of the EPF10K30EFC484-1 include 1728 logic elements, 216 logic array blocks (LABs), 24576 embedded RAM bits, 6.0 ns typical pin-to-pin propagation delay, and 80 MHz internal performance. The device supports MultiVolt I/O (operating with mixed 2.5V/3.3V/5.0V signaling rails through independent VCCIO banks), PCI-compliant I/O with on-chip clamping diodes, slew-rate control, and open-drain output options configurable on a per-pin basis. JTAG boundary-scan test (IEEE 1149.1) is provided for board-level test access. The FLEX 10KE architecture combines a fine-grained logic element fabric with coarse-grained Embedded Array Blocks (EABs), allowing efficient implementation of wide functions, multipliers, and small FIFOs without consuming general-purpose logic. The 5x5 mm FineLine BGA package supports SameFrame pin migration to other 10KE densities in the 484-pin BGA family, simplifying design portability across the series. Typical applications include telecommunications interface cards, industrial glue logic and bus bridges, PCI bus interface glue, test and measurement backplanes, and legacy system upgrades. The 484-ball BGA footprint supports dense PCB layouts while preserving a moderate pincount. When designing with this part, verify the Altera Quartus MAX+PLUS II design toolchain compatibility and the legacy PCN status before committing to new designs. Several Altera MAX+PLUS II and Quartus versions do not support FLEX 10KE in current releases. This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE family and Xilinx competitors, and practical design notes not aggregated in a single datasheet source.
EPF10K30EFC484-2 - 30K FLEX-10KE FPGA, 220 I/O, 484-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K30EFC484-2 is a member of the FLEX 10KE family of SRAM-based field-programmable gate arrays, providing 30,000 typical gates, 1,728 logic elements (LEs), and 24,576 RAM bits in a 484-ball FineLine BGA package. It is offered in the -2 speed grade with 220 user I/O pins, targeting high-volume logic integration, datapath acceleration, and glue-logic consolidation on a single programmable device. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and I/O cells that can be reconfigured by the designer after manufacture. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: integrated circuit -> programmable logic -> FPGA -> SRAM-based FPGA -> FLEX 10KE family. Unlike ASICs, FPGAs ship as blank silicon and are programmed using HDL flows (VHDL/Verilog) via tools such as Altera/Intel Quartus, enabling rapid prototyping and low-NRE design cycles. Key features of the EPF10K30EFC484-2 include 216 logic array blocks (LABs), 1728 LEs, 24,576 embedded SRAM bits organized as EABs (Embedded Array Blocks), 220 user I/Os, and support for LVTTL, LVCMOS, PCI, and other single-ended I/O standards through its configurable I/O elements. The device operates from a 2.5V core supply with separate VCCIO banks for I/O flexibility, and the -2 speed grade indicates a mid-range performance bin suitable for general-purpose datapath and control logic. The FLEX 10KE architecture combines a row/column interconnect with distributed Look-Up Table (LUT) logic and dedicated EAB memory, allowing designers to instantiate RAM, ROM, multiplier functions, and FIFO buffers alongside glue logic. The 484-FBGA package maximizes I/O count while minimizing board area, making the device attractive for designs that would otherwise require multiple CPLDs or discrete logic. Typical applications include telecommunications line cards, industrial control backplanes, low-density prototyping platforms, and legacy system upgrades where the FLEX 10KE is already deployed. Engineers also use it for educational platforms and as a stepping stone before migrating designs to Cyclone or MAX series devices. When designing with this part, attention must be paid to I/O bank voltage grouping, JTAG configuration mode selection, and the fact that the FLEX 10KE family is now classified NRND/end-of-life by Intel. Designers should plan a migration path to a current-generation Cyclone or MAX device if long-term availability is required. This page synthesizes distributor pricing, parametric datasheet values, drop-in alternative guidance, and practical design notes not found in the standalone manufacturer datasheet.
EPF10K30EQC208-1 - 30K Gates, 147 I/O FLEX 10KE FPGA | Intel
The Intel EPF10K30EQC208-1 is a high-density, high-performance FLEX 10KE Field Programmable Gate Array delivering 30,000 typical gates, 1,728 logic elements, and 216 logic array blocks (LABs) in a 208-pin BQFP package with 147 user I/Os. Operating from a 2.5 V core supply (2.375 V–2.625 V) with 5.0 V tolerant I/O, the device integrates 24,576 bits of embedded SRAM and supports system frequencies up to 80 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor IC built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed in-system to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and CPLDs in the programmable-logic hierarchy, offering higher density than CPLDs and faster time-to-market than ASICs. FPGAs are widely used for glue logic, bus interfacing, prototype ASICs, signal processing pipelines, and compute acceleration. Key features of the EPF10K30EQC208-1 include 0.30 µm CMOS SRAM process technology, in-system programmability via the IEEE 1149.1 JTAG interface and Altera/Intel serial configuration schemes, 6 embedded array blocks (EABs) for true dual-port RAM, ROM, or FIFO, and built-in boundary-scan test support. The 208-BQFP (PQFP) package provides gull-wing leads on a 28×28 mm body with commercial 0 °C to +70 °C operating temperature range. Architecturally, the FLEX 10KE family extends the original FLEX 10K with 2.5 V core operation, lower power, faster interconnect, and additional I/O standards. Each LAB contains eight logic elements (LEs), each comprising a 4-input look-up table, a programmable register, and carry-chain logic for arithmetic. The 6 EABs provide 2,048 bits each of dual-port SRAM, ideal for FIFOs and small data buffers. Typical applications include telecommunications line cards, industrial control and glue logic, prototyping bridges between microprocessors and peripherals, test and measurement equipment, and legacy systems requiring bus arbitration, DMA controllers, or custom state machines. Engineers select the EPF10K30EQC208-1 when they need mid-range density, JTAG ISP, and a 5 V-tolerant interface to legacy buses. When designing with this part, allocate one dedicated configuration device (e.g., EPC2) or use JTAG download for prototyping. Verify I/O bank voltage compatibility before mixing 3.3 V and 5.0 V peripherals, and use Altera/Intel Quartus II or MAX+PLUS II for synthesis, fitting, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the FLEX 10KE and FLEX 10KA families, and practical design notes drawn from Intel/Altera legacy documentation, providing context beyond the original datasheet alone.
EPF10K30EQC208-1N - FLEX 10KE FPGA, 30K Gates, PQFP-208 | Intel
The Intel (formerly Altera) EPF10K30EQC208-1N is a FLEX 10KE family Field-Programmable Gate Array (FPGA) featuring 30,000 typical gates, 1,728 logic elements, and 24,576 bits of embedded RAM, housed in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) surface-mount package. The 'E' suffix denotes the 2.5V core supply variant, the 'C' denotes commercial 0 to 70 C operating range, the '208' is the PQFP-208 pin count, the '-1' indicates the speed grade, and the trailing 'N' marks a lead-free / RoHS-compliant finish. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die. FPGAs sit within the broader taxonomy of digital semiconductors: PLD -> FPGA -> SRAM-based FPGA. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) that integrate dedicated RAM, ROM, or multiplier functions alongside the general logic fabric, enabling System-on-a-Programmable-Chip (SOPC) integration of glue logic, state machines, register files, and small FIFOs in a single device. Key features of the EPF10K30EQC208-1N include 147 user I/O pins, 216 logic array blocks / configurable logic blocks, an internal clock frequency up to 250 MHz, 0.22 µm CMOS process technology, 2.5V core VCCINT with 3.3V or 5V tolerant I/O via VCCIO banks, in-system programmability via SRAM configuration cells, and JTAG (IEEE 1149.1) boundary-scan support. The device retains its configuration in volatile SRAM and must be reconfigured at every power-up from an external PROM or flash, which is characteristic of the FLEX 10KE architecture. Typical applications for the EPF10K30EQC208-1N include legacy industrial glue logic replacement, PCI bus interface bridging, telecommunications channel cards, prototyping of ASIC designs prior to tape-out, and educational / laboratory digital design platforms where the through-hole-friendly PQFP package simplifies socket-based programming and rework. Because this device is now mature and discontinued, surviving inventory is typically allocated to long-life-cycle industrial, military, and aerospace sustainment programs. When designing with this FPGA, plan a 5V or 3.3V I/O supply on VCCIO pins and a tightly regulated 2.5V supply on VCCINT, with bulk decoupling near each supply pin. Allow adequate configuration time during power-up and consider JTAG-based ISP for field updates rather than relying solely on parallel EPC configuration. The PQFP-208 package is suitable for socketed development but is increasingly rare in new designs; for production, prefer a BGA-packaged FLEX 10KE variant such as the EPF10K30EBC356-1 or the equivalent. This page synthesizes distributor stock levels, drop-in alternatives, and design considerations not found in the manufacturer datasheet alone.
EPF10K30EQC208-1X - 30K-Gate FLEX 10KE FPGA, 147 I/O, PQFP-208 | Intel
The Intel (formerly Altera) EPF10K30EQC208-1X is a FLEX 10KE family Field Programmable Gate Array (FPGA) offering 30,000 typical gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. According to the manufacturer datasheet, the device operates from a 2.5 V core supply (2.375 V to 2.625 V), supports up to 147 user I/O pins, and is rated for commercial temperature (0 C to 70 C). A field programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory arrays, and programmable interconnects. The FLEX 10KE family belongs to the hierarchy of programmable logic devices (PLDs) and was among the earliest commercial architectures to merge a look-up-table (LUT) based logic fabric with embedded array blocks (EABs) for on-chip RAM and ROM. Within Intel/Altera's taxonomy, FLEX 10KE sits between the classic FLEX 10K and the subsequent APEX family, targeting high-volume glue-logic, bus-interface, and DSP pre-processing applications of the late 1990s and early 2000s. Key features of the EPF10K30EQC208-1X include 216 logic array blocks (LABs), an internal frequency capability quoted by distributors at up to 250 MHz (fabric-dependent), a 0.22 micrometer CMOS process, embedded array blocks for distributed RAM/ROM, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The "-1X" speed grade and "C" temperature grade designate a faster commercial-temperature variant. Architecturally, the FLEX 10KE device combines 1,728 logic elements organized in LABs of 8 LEs each, four embedded array blocks (EABs) for memory functions, and FastTrack interconnect routing. The 208-PQFP package provides 147 usable I/O pins with multi-voltage I/O standards including 3.3 V PCI compliance, making the part suitable for mixed-voltage system designs. Typical applications include telecommunications line cards, industrial control and factory automation controllers, PCI bridge and bus-interface logic, video processing front-ends, and legacy glue-logic replacement in mature embedded systems. The combination of SRAM-based configuration and on-chip RAM also makes it useful for prototyping ASICs and implementing custom state machines. When designing with this part, note that it is fabricated on a 5 V-tolerant legacy process; modern system-on-chip designs typically pair FLEX 10KE with a separate 3.3 V/5 V interface transceiver. Designers should also budget for the configuration EEPROM (EPC2 or compatible) and observe the IOREF, VCCINT, and VCCIO decoupling requirements documented in the datasheet. This page synthesizes distributor pricing from DigiKey, Mouser, Octopart and Rochester Electronics, same-brand FLEX 10KE drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.
EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
The Intel (formerly Altera) EPF10K30EQC208-2 is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs) that integrates 30,000 typical gates, 1,728 logic elements, and 24,576 bits of embedded array memory in a 208-pin Plastic Quad Flat Pack (PQFP) package. It operates at 2.5 V core with a -2 speed grade targeting commercial temperature ranges, and is built on a 0.22 µm CMOS process that delivers up to 200 MHz internal performance. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design. Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required. Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM. Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces. When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support). This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
EPF10K30EQC208-2N - FLEX 10KE FPGA, 30K Gates, 208-PQFP | Intel
The Intel (formerly Altera) EPF10K30EQC208-2N is a FLEX 10KE family Field Programmable Gate Array delivering 30,000 typical gates, 1,728 logic elements, and 147 user I/Os in a 208-pin Plastic Quad Flat Pack (PQFP-208) package. The device implements an embedded array architecture with 24,576 bits of embedded RAM and operates at a maximum internal frequency of 200 MHz on a 2.5 V core supply using 0.22 µm CMOS technology. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high density of gate arrays with the flexibility of in-system configuration. FPGAs sit at the top of the programmable logic hierarchy - above SPLDs and CPLDs - and are widely used as application-specific accelerators, glue logic, and System-on-a-Programmable-Chip (SoPC) building blocks. The FLEX 10KE family was Altera's first embedded programmable logic device family, integrating dedicated Embedded Array Blocks (EABs) with general-purpose logic for memory-intensive designs. Key features include 216 Logic Array Blocks (LABs), 12 Embedded Array Blocks, a 0.6 ns propagation delay per logic element, and SRAM-based configuration. The "C" speed grade with "-2N" suffix denotes the commercial temperature range (0 °C to 70 °C) and a specific speed bin. The PQFP-208 package uses gull-wing leads and is intended for surface-mount assembly on standard FR-4 boards. The FLEX 10KE architecture blends SRAM lookup tables with embedded memory, making it well suited for digital signal processing paths, protocol bridging, and custom peripheral implementations. Its 2.5 V core supply and PCI-compliant I/O buffers allow direct interfacing with industry-standard buses. Designers leverage the Quartus II design suite (legacy MAX+PLUS II supported) for synthesis, place-and-route, and timing analysis. Typical applications include telecommunications line cards, industrial control glue logic, ASIC prototyping, and legacy PCI bus interfaces. The combination of 1,728 logic elements, 24 Kbit embedded memory, and 147 user I/Os makes this device suitable for medium-complexity glue-logic and bus-interface tasks where modern low-cost FPGAs would over-specify the design. When designing with this part, verify availability from authorized sources because the FLEX 10KE family is a legacy product line with limited new-stock availability. Plan migration paths to Cyclone series or later if long-term lifecycle support is required.
EPF10K30EQC208-3 - 30K-Gate FLEX 10KE FPGA, 208-PQFP | Altera
The Intel (formerly Altera) EPF10K30EQC208-3 is a FLEX 10KE family Field Programmable Gate Array (FPGA) IC integrating approximately 30,000 gates, 1,728 logic elements (cells), and 24,576 bits of embedded memory in a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. Speed grade -3 and an internal frequency up to 200 MHz support commercial-temperature digital logic designs where the FLEX 10KE embedded array block (EAB) provides on-chip SRAM for System-on-a-Programmable-Chip (SOPC) integration. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that designers can re-program in the field to implement arbitrary digital logic. FPGAs sit above microcontrollers, ASICs, and CPLDs in the programmable-logic taxonomy, offering higher density and faster parallel processing for glue logic, state machines, bus interfaces, and DSP datapaths. The FLEX 10KE family specifically added embedded array blocks (EABs) for true dual-port RAM and ROM on-chip, enabling SOPC integration without external memory. Key features of the EPF10K30EQC208-3 include 246 user I/Os (the highest I/O density in the FLEX 10KE family), 12 embedded array blocks for distributed and block RAM, 5 V tolerant I/O with MultiVolt support, and IEEE 1149.1 JTAG boundary-scan testing. The device supports in-system programmability (ISP) via the serial passive configuration scheme and consumes approximately 2.5 V core from an external regulator. The architecture combines a fine-grained logic fabric (logic elements with 4-input look-up tables and a programmable register) with coarse-grained embedded array blocks (EABs), each implementing 2,048 bits of RAM. The -3 speed grade corresponds to roughly 0.6 ns propagation delay and enables 200 MHz internal operation, making it suitable for PCI bus interfaces, telecommunications glue logic, and instrumentation controllers. Typical applications include PCI bus interface controllers, telecommunications line-card glue logic, industrial control and instrumentation, custom DSP pre/post-processing stages, and legacy SOPC prototypes. The 208-PQFP is a through-hole-friendly surface-mount package well suited to prototyping and industrial designs that prefer gull-wing leads over fine-pitch BGAs. When designing with this part, plan for an external 2.5 V core regulator and 5 V or 3.3 V I/O bank supplies via MultiVolt. Use the Quartus design tool (legacy: MAX+PLUS II) for synthesis, fitting, and timing analysis, and budget configuration EPROM/flash if in-system configuration is required. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the standalone manufacturer datasheet.
EPF10K30EQC208-3N - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
The Intel EPF10K30EQC208-3N is a member of the FLEX 10KE family of Field Programmable Gate Arrays (FPGAs), delivering 30,000 typical gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) package. Operating at a core voltage of 2.5 V on a 0.22 µm CMOS process, the device supports internal clock rates up to 200 MHz with a typical propagation delay of 0.6 ns and offers 147 user I/Os for board-level integration. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that the user can program to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the system hierarchy: digital logic IC -> programmable logic -> FPGA -> System-on-Chip (SoC) FPGA. The FLEX 10KE family was Intel's (originally Altera's) industry-first embedded programmable logic device family with on-chip SRAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration via its embedded array blocks (EABs). Key features include 216 Logic Array Blocks (LABs) organized across the device fabric, embedded array blocks providing dedicated SRAM for true dual-port or single-port memory functions, in-system programmability via the IEEE 1149.1 JTAG interface, and multi-voltage I/O support allowing 2.5 V, 3.3 V, or 5 V interfaces on the same die. The device's CMOS SRAM-based configuration memory supports unlimited reconfiguration cycles, making it ideal for prototyping and design iteration. The commercial temperature grade (0 °C to 70 °C) targets mainstream industrial and consumer embedded designs. Typical applications include glue logic replacement, bus-bridging interfaces, custom state-machine controllers, DSP co-processing front-ends, and legacy system refresh designs where a programmable logic upgrade path is desired. The on-chip EABs allow implementation of small FIFOs, dual-port RAM, and ROM look-up tables without consuming general-purpose logic. When designing with this part, remember that the SRAM configuration memory must be loaded on every power-up via a configuration PROM (EPC2, EPC8, or EPC16) or a microcontroller host. Pin compatibility within the FLEX 10KE family allows design migration across speed grades and package options on the same PCB footprint, simplifying inventory and second-source planning.
EPF10K30EQI208-2 - FLEX 10KE FPGA 30K Gates 208-PQFP | Intel
The Intel (formerly Altera) EPF10K30EQI208-2 is a member of the FLEX 10KE family of SRAM-based FPGAs, integrating 30,000 typical gates (119,000 maximum system gates), 1,728 logic elements, 216 logic array blocks (LABs), and 24,576 bits of embedded SRAM in a 208-pin Power Quad Flat Pack (PQFP / BFQFP) package with 147 user I/Os. The device operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports the industrial temperature range of -40 °C to +85 °C. What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that can be reprogrammed after manufacturing to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers in the design hierarchy, offering hardware-level parallelism, deterministic timing, and rapid design iteration. The FLEX 10KE family was Intel/Altera's mid-1990s generation of SRAM-based FPGAs that pioneered embedded memory blocks (EABs) and dedicated I/O features for glue-logic and datapath applications. Key features of the EPF10K30EQI208-2 include 1,728 logic elements distributed across 216 LABs, 24,576 RAM bits organized in Embedded Array Blocks (EABs), 147 user I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI), four Phase-Locked Loops (PLLs) for clock management, and in-system programmability via the passive serial configuration scheme. The device is fabricated on a 0.42 µm CMOS SRAM process, which gives it non-volatile behavior when paired with a serial configuration EPROM such as the EPC2 or EPC8. Typical applications include legacy industrial control boards, telecommunications glue logic, military and aerospace systems with long lifecycle support requirements, prototype ASIC replacements, and parallel DSP datapaths. The 208-pin PQFP package is also popular for through-hole rework and socketed designs where BGA rework is impractical. When designing with this part, ensure that I/O assignments observe the bank's VCCIO grouping and that decoupling follows Intel's classic FLEX 10KE reference design. Because the part is now in the legacy/end-of-life category, plan for last-time-buy procurement or consider the Stratix/Cyclone families for new designs.
EPF10K30EQI208-2N - 30K-Gate FLEX 10KE FPGA, 208-PQFP | Altera
The Altera (Intel) EPF10K30EQI208-2N is a member of the FLEX 10KE family of FPGAs, offering 30,000 typical system gates and 1,728 logic elements (cells) on a 0.22 µm CMOS process, housed in a 208-pin Power/QFP (BFQFP, gull-wing) package with industrial temperature grading. It combines a logic array block (LAB) fabric with embedded array blocks (EABs) that double as synchronous SRAM, enabling system-level integration of glue logic, FIFOs, RAM, ROM and state machines on a single programmable device. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and configurable I/O cells, all controlled by bits stored in on-chip SRAM. FPGAs are used to implement arbitrary digital logic without the cost and lead-time of an ASIC. Within the broader semiconductor taxonomy, FPGAs sit under programmable logic devices (PLDs) alongside CPLDs, and historically represent the high-density end of that family - capable of holding entire processor subsystems, interface bridges, or DSP pipelines. The FLEX 10KE generation (circa late-1990s) was Altera's mainstream 2.5 V SRAM-based family before the Stratix/Cyclone families replaced it. Key features of the EPF10K30EQI208-2N include up to 24,576 RAM bits distributed across embedded array blocks, an internal operating frequency around 200 MHz (process-dependent), an industrial temperature grade (-40 °C to +85 °C), and JTAG (IEEE Std 1149.1) boundary-scan support. The 208-pin PQFP exposes 147 user I/Os and supports common single-ended I/O standards of its era (LVTTL, LVCMOS, PCI). SameFrame pin-migration is documented for compatible FLEX 10KE devices in the same package, allowing designers to swap density variants without re-laying the PCB. Typical applications for this device include industrial control and instrumentation, telecom line-card glue, legacy ASIC prototyping, motor and process control, and embedded DSP front-ends - particularly where existing FLEX 10KE firmware is being maintained or where a second-source-qualified footprint is required. Designers planning new designs are instead routed to the Cyclone or MAX families; this part is therefore of greatest interest on legacy platforms and EOL re-designs. When designing with the EPF10K30EQI208-2N, note that JTAG and CONFIG_DONE pull-ups and a configuration device (EPC2/EPC4 or compatible) must be provided - the device is SRAM-based and reconfigures on every power-up. Observe the 2.5 V VCCINT supply requirement and provide adequate decoupling around the PQFP perimeter to keep simultaneous-switching-noise (SSN) under control. This page synthesizes distributor stock and pricing, drop-in-compatible FLEX 10KE alternatives in the same 208-PQFP footprint, and practical design notes that go beyond what the bare datasheet provides - giving procurement, reliability, and design engineers a single decision-ready view of the part.
EPF10K30EQI208-3 - FLEX 10KE FPGA, 30K Gates, 208-Pin QFP | Intel
The Intel (formerly Altera) EPF10K30EQI208-3 is a FLEX 10KE family Field Programmable Gate Array delivering approximately 30,000 equivalent ASIC gates, 1,728 logic elements, and 24,576 RAM bits in a 208-pin Power-QFP (BFQFP, RQ208) package. It provides 147 user I/O pins, a 12.5 ns pin-to-pin propagation delay, and operates from a nominal 2.5 V core supply across the industrial -40C to +85C temperature range. The device is built on a 0.22 um CMOS SRAM process with embedded array architecture. What is an FPGA? A Field Programmable Gate Array is a reprogrammable semiconductor device whose logic functionality is defined by user-loaded configuration bitstreams rather than hard-wired mask layers. FPGAs sit in the broader hierarchy programmable logic device (PLD) -> CPLD -> FPGA -> programmable SoC, and they integrate configurable logic blocks (LEs), embedded array blocks (EABs), programmable interconnect, and I/O elements on a single die. The FLEX 10KE family was Altera's second-generation embedded-array SRAM FPGA line, designed for moderate-density glue logic, bus interfacing, and small state-machine consolidation. Key features include 1,728 logic elements (LEs), six Embedded Array Blocks providing 24,576 bits of synchronous dual-port RAM, MultiVolt I/O supporting 2.5 V, 3.3 V, and 5.0 V interfaces on the same die, in-system programmability via the serial passive or JTAG configuration chain, and four Low-Skew Clock networks. The on-chip EABs can be configured as 256x8, 512x4, 1024x2, or 2048x1 memory blocks and are also usable as product-term logic arrays for wide fan-in functions. Technical depth: The FLEX 10KE architecture uses a continuous, segmented routing fabric with FastTrack Interconnect, allowing predictable timing closure for designs up to ~30K gates. The device supports IEEE 1149.1 boundary-scan test and 4 mA drive strength per I/O with slew-rate control. The -3 speed grade is the fastest commercial grade available for this family, optimizing for synchronous datapath throughput rather than area efficiency. Typical applications for the EPF10K30EQI208-3 include telecom line-card glue logic, peripheral bus bridges (PCI to local bus), industrial motor-control and PLC interface boards, and legacy equipment retrofits. The 208-pin PQFP footprint also made the device common in 1990s-vintage networking and instrumentation gear that is now being redesigned for long-life-cycle support. Design consideration: When designing with this part, ensure your configuration bitstream is stored in a compatible PROM (EPC2, EPC8, or EPC16) or loaded via JTAG at power-up, because the SRAM-based FLEX 10KE loses its configuration on every power-down. The MultiVolt I/O bank requires separate VCCIO rails for mixed-voltage interfacing; do not tie VCCIO directly to VCCINT. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Altera FLEX 10KE family, and practical design notes not consolidated in the original manufacturer datasheet, giving engineers a faster path to source this mature FPGA for new builds and legacy redesigns.
EPF10K30ETC144-1 - FLEX 10KE FPGA, 30K Gates, 144-LQFP | Altera
The Altera (Intel PSG) EPF10K30ETC144-1 is a member of the FLEX 10KE family of SRAM-based FPGAs delivering approximately 30,000 typical gates and 1,728 logic elements (LEs) in a 144-pin LQFP (Low-profile Quad Flat Pack) package with gull-wing leads. The device integrates an embedded array block (EAB) architecture that combines look-up table logic with dedicated SRAM blocks, supporting System-on-a-Programmable-Chip (SOPC) integration typical of late-1990s / early-2000s Altera programmable logic. The "E" suffix denotes the enhanced FLEX 10KE generation with higher density and faster I/O than the original FLEX 10K family, while the "-1" speed grade denotes the slowest commercial-speed bin of this device. A field programmable gate array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 10KE family. Unlike CPLDs which use non-volatile fuse/flash memory, FPGAs like the FLEX 10KE use SRAM configuration cells and must be reconfigured on every power-up from an external PROM or flash device. Key features of the EPF10K30ETC144-1 include up to 102 user I/O pins, six EAB blocks providing 12,288 bits of embedded SRAM, 216 logic array blocks (LABs), and a typical internal performance of 80 MHz. The device operates from a single 5.0 V supply for the core and I/O, supports 5.0 V PCI-compliant I/O standards, and is offered in a commercial temperature grade (0C to 70C). The 144-LQFP package provides a 22 mm x 22 mm body size with 0.5 mm pitch, suitable for through-hole or socketed prototyping as well as surface-mount production. The FLEX 10KE architecture combines fine-grained logic elements with embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier functions. Each logic element contains a 4-input look-up table (LUT), a programmable register, and dedicated carry chain logic for arithmetic operations. The high interconnect density supports predictable timing closure for designs up to 30K gates, making the EPF10K30E well suited to glue logic, bus interfacing, and peripheral controller functions. Typical applications for the EPF10K30ETC144-1 include industrial control glue logic, PCI bus interface bridges, peripheral controllers in embedded systems, telecommunication line cards, and legacy designs being maintained or replicated. The 102 user I/Os provide generous connectivity for parallel buses, memory interfaces, and custom peripheral logic. The device is also used in test and measurement equipment, prototype ASIC emulation, and educational platforms that require a self-sufficient, easily programmed logic device. When designing with this part, engineers should note that the FLEX 10KE is now in a legacy lifecycle status and is no longer recommended for new designs. Intel PSG has migrated customers to Cyclone-series FPGAs (Cyclone, Cyclone II, Cyclone IV) for new product development. The 5.0 V core supply is uncommon in modern designs which favor 1.2 V-3.3 V cores, so any replacement will likely require both a logic re-design and a PCB-level power rail re-design. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design notes - information not found in the manufacturer datasheet alone.
EPF10K30ETC144-2 - FLEX 10KE FPGA, 30K Gates, 144-LQFP | Intel
The Intel (formerly Altera) EPF10K30ETC144-2 is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs) that delivers 30,000 typical gates and 1,728 logic elements in a 144-pin LQFP surface-mount package. The device integrates 24,576 bits of embedded array memory, 102 user I/Os, and 216 Logic Array Blocks (LABs), combining look-up-table (LUT) logic with embedded array blocks for System-on-a-Programmable-Chip (SOPC) integration. The "-2" speed grade is a mid-tier performance option within the family, while the "C" letter denotes the commercial 0C to 70C operating temperature range. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and PALs. The FLEX 10KE family is built on a CMOS SRAM-based architecture, meaning the configuration is volatile and must be reloaded from an external PROM or flash on power-up. Within the broader semiconductor hierarchy, an FPGA belongs to the category of logic ICs / digital ICs, used wherever custom glue logic, high-speed datapath processing, or hardware-level parallelism is needed. Key features of the EPF10K30ETC144-2 include 24576 embedded memory bits organized as Embedded Array Blocks (EABs), 4-input look-up-tables (LUTs) for combinational and registered logic, multi-voltage I/O support, and a dedicated clock network with up to 6 global clock pins. The device supports in-system programming via the IEEE 1149.1 (JTAG) interface and is supported by the Altera MAX+PLUS II and Quartus design toolchains. Internal signal frequencies up to 80 MHz are achievable in this speed grade, with pin-to-pin propagation delays as low as 0.6 ns in carry-chain configurations. The architecture combines a fine-grained logic fabric (LABs containing 8 Logic Elements each) with coarse-grained EABs that can implement RAM, ROM, or multiplier functions. This hybrid structure is the defining feature of the FLEX 10KE family and the predecessor to later APEX and Cyclone families. MultiVolt I/O allows interfacing with 2.5 V, 3.3 V, and 5.0 V logic without external level shifters when correctly configured. Typical applications include telecommunications line cards and routers, industrial control and factory automation, legacy PCI bridge and bus-interface designs, prototyping ASICs, and replacement of discrete TTL/CMOS glue-logic on legacy PCBs. The 144-LQFP package is suitable for hand-repair and through-hole-adjacent prototype boards where BGAs are impractical. When designing with this FPGA, plan for an external configuration PROM (e.g. EPC2 or EPC8) because the SRAM cells are volatile. Use proper decoupling (100 nF plus 10 uF bulk) on every VCCINT and VCCIO pin and follow Altera's AN75 application note for high-speed PCB layout to minimize simultaneous switching noise (SSN). This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations not found in the manufacturer datasheet alone.
EPF10K30ETC144-2N - 30K Gates FLEX 10KE FPGA | Intel / Altera
The Intel (formerly Altera) EPF10K30ETC144-2N is a 30,000-gate FLEX 10KE series Field-Programmable Gate Array (FPGA) with 1,728 logic cells and 24,576 RAM bits, housed in a 144-pin LQFP (TQFP) package. It operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports 102 user I/O pins with a 0.6 ns propagation delay at an internal frequency up to 200 MHz. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits through a matrix of configurable logic blocks (CLBs), embedded memory, and programmable interconnects. FPGAs sit hierarchically above standard logic ICs and below application-specific integrated circuits (ASICs) in the broader semiconductor landscape, offering ASIC-class density with field-reprogrammability and shorter time-to-market than mask-programmed alternatives. The FLEX 10KE family specifically introduced an embedded array block architecture that combined logic, RAM, and ROM in a single die for system-on-a-programmable-chip (SOPC) integration. Key features of the EPF10K30ETC144-2N include 102 user I/Os, an embedded JTAG boundary-scan test interface compliant with IEEE 1149.1, configurable I/O standards, and built-in clock-management resources. The 144-LQFP package is pin-compatible with other members of the FLEX 10KE family in the same footprint, enabling straightforward density upgrades within the family. The '2' speed grade denotes the standard performance tier, and the 'N' suffix indicates a lead-free / Pb-free terminal finish. Architecturally, the EPF10K30ETC144-2N combines a fine-grained logic element fabric with coarser embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier functions. This hybrid architecture was the first to deliver System-on-a-Programmable-Chip (SOPC) integration in a PLD, allowing designers to place CPU cores, memory, and peripherals alongside custom logic on a single programmable die. Typical applications for this FPGA include industrial control logic, glue-logic integration around legacy microprocessors, custom interface bridging (parallel-to-serial conversion), low-volume ASIC prototyping, and embedded DSP pre/post-processing. It is also used in telecommunications line-card glue logic and test-and-measurement fixture controllers. When designing with the EPF10K30ETC144-2N, ensure your toolchain targets the FLEX 10KE device family and that the 144-LQFP PCB land pattern matches the 20 mm x 20 mm, 0.5 mm pitch package outline. Because the part is now in lifecycle decline, plan for last-time-buy acquisition if you are maintaining a long-lifecycle product. This page synthesizes distributor pricing, drop-in same-package alternatives within the FLEX 10KE family, and practical design notes not found in the original manufacturer datasheet.
EPF10K30ETC144-3 - 30K FLEX 10KE FPGA, 144-LQFP | Altera/Intel
The Intel (formerly Altera) EPF10K30ETC144-3 is a member of the FLEX 10KE family of Field Programmable Gate Arrays built on a 0.22 µm CMOS SRAM process. It provides 30,000 typical gates, 1,728 logic cells (logic elements), and 24,576 bits of embedded memory organized as 13 Embedded Array Blocks (EABs), packaged in a 144-pin LQFP (Low-profile Quad Flat Pack) at commercial temperature grade. The “-3” speed grade corresponds to a worst-case internal clock toggle rate of up to 200 MHz, with 2.5 V core operation. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric, surrounded by programmable I/O cells. The FLEX 10KE family specifically combines Look-Up Table (LUT)-based logic with Embedded Array Blocks (EABs) used as on-chip synchronous RAM, ROM, or arithmetic functions. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) → digital semiconductors → integrated circuits. Key features of the EPF10K30ETC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), support for multiple I/O standards such as LVTTL, LVCMOS, and PCI via on-chip series termination, in-system programmability through the IEEE 1149.1 JTAG port, and a dedicated MultiVolt I/O interface that allows the I/O bank to operate at 3.3 V while the core runs at 2.5 V. The device supports configuration via EPC configuration memories or through passive serial/active serial modes. Technically, the FLEX 10KE architecture implements each logic element as a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions, with routing achieved through the FastTrack continuous routing matrix. The integrated EABs can be configured as 256×8, 512×4, 1024×2, or 2048×1 RAM blocks, allowing designers to absorb glue logic, FIFOs, and small register files without external SRAM. Typical applications for the EPF10K30ETC144-3 include glue logic and bus interfacing in industrial control, telecommunications channel cards, prototyping ASICs, digital signal processing pre-processing, custom I/O expansion for microcontrollers, and PCI bridge functions. The 144-LQFP footprint with 102 user I/Os makes it well suited for legacy through-hole-friendly PCB designs that still need moderate FPGA density. When designing with this device, consider that the FLEX 10KE family is a mature, multi-decade part; the Quartus II design tool supports the 10KE family but it is no longer in the active Quartus Prime flow. Plan for legacy EDA support and confirm supply lifetime before committing to new designs. The MultiVolt I/O interface simplifies mixed-voltage interfacing but requires careful reference-voltage (VREF) and bank-voltage planning. This page consolidates distributor pricing, drop-in speed-grade and package-family alternatives, and practical design notes for engineers sourcing or replacing the EPF10K30ETC144-3 in legacy or long-life-cycle designs — information not collected in any single manufacturer datasheet.
EPF10K30ETC144-3N - 30K-Gate FLEX 10KE FPGA, 144-TQFP | Intel
The Intel (formerly Altera) EPF10K30ETC144-3N is a member of the FLEX 10KE family of SRAM-based Field-Programmable Gate Arrays (FPGAs) delivering 30,000 typical gates, 1,728 logic cells (logic elements), and 102 user I/Os in a 144-pin TQFP package. The device is fabricated on a 0.22 µm CMOS process, operates from a 2.5 V core supply, and is rated for commercial temperature (0 °C to 70 °C). The “-3N” speed grade designates the part within the standard commercial-temperature portfolio. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and input/output blocks, all controlled by an on-chip SRAM configuration memory. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > PAL/GAL) and are used to implement arbitrary glue logic, state machines, datapath functions, and full processor subsystems. The FLEX 10KE family introduced embedded array blocks (EABs) that combine look-up-table logic with on-chip memory, making them well suited for System-on-a-Programmable-Chip (SOPC) designs. Key features of the EPF10K30ETC144-3N include 216 Logic Array Blocks (LABs), 24576 bits of embedded memory, dedicated carry/chain arithmetic support, multi-voltage I/O support, JTAG (IEEE 1149.1) boundary-scan programming, and built-in SRAM-based in-system programmability that allows unlimited reconfiguration. The 144-pin TQFP (1.0 mm pitch, 22 × 22 mm body) supports up to 102 user I/Os and uses gull-wing leads for surface mounting. Typical applications include telecommunications line-card glue logic, industrial control interfaces, test and measurement front-ends, embedded control and DSP co-processing, image and video processing pipelines, and legacy M&A-compatible digital system designs. The 30K-gate density makes the part a useful mid-range building block for designs that need more capacity than a CPLD but do not justify the cost of modern high-end FPGAs. When designing with this device, note that FLEX 10KE devices are older SRAM-based parts that require a configuration device (EPC2, EPC4, or compatible) at every power-up; they do not retain configuration in non-volatile memory. The 2.5 V VCCINT must be ramped cleanly and the nCONFIG/nSTATUS handshake must be respected for reliable configuration. This page synthesizes current distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.