FPGA & CPLD
Products (6352)
EPF10K50VRC240-4N - 50K-Gate FLEX-10K FPGA, 240-RQFP | Intel / Altera
The Intel / Altera EPF10K50VRC240-4N is a member of the FLEX-10K family of embedded programmable logic devices (PLDs) that pioneered System-on-a-Programmable-Chip (SOPC) integration. The device integrates 50,000 typical gates and 2,880 logic cells with 36 embedded array blocks (EABs) and 360 logic array blocks (LABs), delivering approximately 189 user I/Os from a 240-pin RQFP (exposed-pad BFQFP) package. It is a CMOS device with a typical internal frequency of 66.67 MHz and a worst-case propagation delay near 0.6 ns, with a supply of 3.3 V core on the -4 speed grade. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks, programmable interconnect, and configurable I/O cells on a single semiconductor die. FPGAs sit hierarchically under the broader category of programmable logic devices, alongside CPLDs, and serve as the dominant platform for digital logic prototyping, glue logic, DSP acceleration, and high-volume ASIC replacement when mask costs are prohibitive. The FLEX-10K family was the industry's first PLD family with embedded array blocks, allowing on-chip implementation of RAM, ROM, FIFOs, and multipliers directly in the logic fabric. Key features include 50,000 usable gates, 2,880 logic elements, 36 EABs providing a total of 20,480 bits of embedded memory, 189 maximum user I/Os, and a 3.3 V core supply with 5 V tolerant I/O options on selected members. The device is offered in a commercial 0 to 70 C operating range and is qualified to the -4 speed grade. The 240-pin RQFP exposed-pad package enables surface-mount assembly and improved thermal dissipation relative to non-exposed-pad RQFP variants. Typical applications include telecommunications glue logic, industrial control, prototyping for ASIC designs, low-volume digital signal processing pipelines, and bus-interface bridging. The high gate count and embedded memory make the EPF10K50 suitable for designs that need substantial on-chip storage and parallel datapaths but that do not require the very latest in process technology. When designing with this part, ensure that the Quartus II or MAX+PLUS II toolchain is used, since the FLEX-10K family predates modern Quartus Prime support. Plan PCB layout around the exposed pad for thermal management, and verify JTAG programming interface compatibility with the chosen configuration PROM.
EPF10K50VRI240-3 - FLEX 10K 50K Gates FPGA | Intel | Altera
The Intel (formerly Altera) EPF10K50VRI240-3 is a member of the FLEX 10K family of SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering 50,000 gates, 2,880 logic cells, and 20,480 typical gate usage in a 240-pin RQFP (Power Quad Flat Pack) exposed-pad package. It provides 189 user I/Os and 360 LABs (Logic Array Blocks), with a maximum internal frequency of approximately 125 MHz and 0.42 µm CMOS process technology, fabricated on a 3.3 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), interconnect, and I/O cells that designers can program after manufacture to implement arbitrary digital logic functions. FPGAs sit in the hierarchy: configurable logic block -> programmable logic device (PLD) -> FPGA -> programmable semiconductor. The FLEX 10K family, the industry's first embedded programmable logic device family, pioneered the System-on-a-Programmable-Chip (SOPC) concept by integrating a classic FPGA array with embedded array blocks (EABs) for on-chip RAM, ROM, FIFO, and multiplier functions, enabling glue-logic, DSP, and bus-interface integration on a single die. Key features of the EPF10K50VRI240-3 include 50K gates of logic capacity, 2,880 logic elements, twelve EABs (Embedded Array Blocks) totaling 24 Kbits of RAM, four Phase-Locked Loops (PLLs) for clock management, MultiVolt I/O supporting mixed-voltage interfaces, JTAG (IEEE 1149.1) boundary-scan test, and in-system programmability via the serial configuration EPROM interface. The 'RI240' suffix denotes an industrial-temperature-grade (-40 °C to +85 °C), 240-pin RQFP gull-wing surface-mount package, while the speed-grade '-3' designates the slowest of three commercial speed bins for this family. Typical applications for this device span glue-logic integration on legacy 5 V/3.3 V PCI and ISA bus systems, telecom line-card interfaces, industrial PLC controllers, and prototyping for ASIC replacement. Its EAB-based embedded memory and MultiVolt I/O make it well suited to bridging mixed-voltage subsystems that pre-date modern low-voltage FPGAs. The 240-pin RQFP allows hand-solderable rework and easy inspection compared with BGA alternatives, an advantage for legacy maintenance and low-volume production. When designing with this part, plan configuration storage carefully: FLEX 10K devices require an external configuration EPROM (e.g., EPC2, EPC8) loaded at power-up or via JTAG. Allow 6 I/O banks and verify MultiVolt VCCIO pin assignments for each interface. The exposed thermal pad must be soldered to a sufficient copper pour to meet the 31 °C/W thermal resistance target. This page synthesizes distributor inventory from DigiKey, Mouser, and Octopart, plus verified drop-in same-package alternatives from the FLEX 10K family and EPF10K100ARC240-3N cross-family upgrade, into a single, actionable reference not available on the manufacturer datasheet alone.
EPF10K50VRI240-3N - 50K Gates FLEX-10K FPGA | Altera | Industrial
The Altera EPF10K50VRI240-3N is a member of the FLEX-10K family of Field Programmable Gate Arrays (FPGAs) delivering 50,000 typical gates, 2,880 logic cells (Logic Elements), and 20,480 bits of embedded array RAM in a 240-pin RQFP (RQFP-240 / BQFP-240 with exposed pad) industrial-temperature package. The device is fabricated on a 0.42 µm CMOS process, supports 189 user I/O pins, and operates from a 3.3 V core supply with the -3 speed grade delivering up to 125 MHz internal performance. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high density of gate arrays with the in-system reconfigurability of logic. The FLEX-10K family specifically pioneered the industry's first embedded programmable logic devices, providing System-on-a-Programmable-Chip (SOPC) integration by combining an Embedded Array Block (EAB) for megafunctions such as efficient memory and specialized logic, with a Logic Array Block (LAB) fabric for general-purpose logic. This architecture positions the FLEX-10K within the broader hierarchy: FPGA -> programmable logic device -> programmable logic IC -> semiconductor. Key features of the EPF10K50VRI240-3N include 360 LABs, 12 EABs of 2,048 bits each, four Phase-Locked Loops (PLLs) for clock management, in-system programmability through the IEEE 1149.1 JTAG interface, multi-volt I/O support (2.5 V / 3.3 V / 5.0 V tolerant), and 4 mA typical quiescent current in standby. The 'I' in the part suffix indicates the industrial temperature range (-40 °C to +85 °C), and the 'N' suffix indicates a lead-free / Pb-free assembly suitable for RoHS-compliant designs. Technically, the FLEX-10K architecture implements SRAM configuration memory, requiring a configuration device (EPC) or microcontroller for power-up bitstream loading. The Look-Up Table (LUT)-based LE provides fast 4-input combinational logic and a dedicated register, while the EABs implement dual-port RAM, ROM, FIFO, or multiplier megafunctions. The 240-pin RQFP package offers a 32.0 mm x 32.0 mm body with a 0.5 mm pitch, making it compatible with conventional SMT assembly lines and rework tooling. Typical applications for the EPF10K50VRI240-3N include industrial control and factory automation PLCs, telecommunications interface cards, prototype ASIC emulation, glue-logic consolidation on legacy 5 V backplanes, digital signal processing front-ends, and bus-interface bridging (PCI, ISA, VME). The -3 speed grade and 189 user I/Os make it well suited to designs that require moderate logic density and high pin count rather than the highest possible clock frequency. When designing with this part, note that it is a mature, legacy FPGA family and is no longer recommended for new designs. Modern replacements such as the Altera / Intel Cyclone IV or MAX 10 series offer lower cost, lower power, smaller packages, and active support. For new designs targeting the same density class, evaluate Cyclone IV EP4CE40 or EP4CE55 in EQFP or BGA packages as a forward-compatible migration path. This page synthesizes distributor pricing, parametric specifications, and legacy cross-reference alternatives that are not consolidated on any single manufacturer datasheet or distributor product page.
EPF10K50VRI240-4 - 50K Gates FLEX 10K FPGA 2880 Cells | Intel
The Intel (formerly Altera) EPF10K50VRI240-4 is a FLEX 10K family Field Programmable Gate Array (FPGA) integrating 50,000 gates and 2,880 logic elements in a 240-pin Power Quad Flat Pack (RQFP) package with exposed pad. Built on a 0.42 µm CMOS process, this device delivers 189 user I/Os, 20,480 typical gates, and 40,960 maximum system gates for high-density programmable logic designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor that lets engineers implement arbitrary digital logic via a configurable array of logic elements, embedded memory blocks, and routing interconnect. FPGAs sit at the top of the programmable logic hierarchy: below FPGAs are CPLDs (less complex, non-volatile), and above are ASICs (custom silicon). The FLEX 10K family pioneered embedded array blocks (EABs) that combine SRAM lookup tables with dedicated dual-port RAM, enabling System-on-a-Programmable-Chip (SOPC) integration of logic and memory in a single device. Key features include 360 Logic Array Blocks (LABs), embedded array blocks for on-chip memory, MultiVolt I/O for mixed-voltage interfacing, PCI-compliant I/O with clamping diodes, slew-rate control, and open-drain output options. The -4 speed grade targets high-performance operation at 125 MHz internal frequency, with support for hot-socketing and peripheral registers for fast setup and clock-to-output delay. Typical applications include telecommunications infrastructure, industrial control systems, and legacy PCI-based designs. The 240-pin RQFP package is suitable for prototype development and through-hole-compatible layouts where BGA soldering is impractical, while exposed-pad construction provides enhanced thermal dissipation for sustained high-utilization designs. When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each VCCINT and VCCIO pin. The exposed pad must be soldered to the ground plane for thermal and electrical performance. Programming requires the Quartus II or MAX+PLUS II development environment and a compatible ByteBlaster or ByteBlasterMV download cable. This page synthesizes distributor pricing, same-brand FLEX 10K drop-in alternatives, lifecycle observations, and practical design guidance that complements the manufacturer datasheet for engineers maintaining legacy Altera FPGA designs.
EPF10K50VRI240-4N - 50K Gates Flex 10K FPGA, 240-Pin RQFP | Altera
The Altera (Intel) EPF10K50VRI240-4N is a member of the FLEX 10K family of SRAM-based Field Programmable Gate Arrays (FPGAs) manufactured in 0.42 µm CMOS technology, providing 50,000 typical gates, 2,880 logic cells, and 20,480 bits of embedded memory in a 240-pin RQFP (Power Quad Flat Pack) package with exposed thermal pad. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit at the top of the programmable logic device (PLD) hierarchy (PAL/GAL -> CPLD -> FPGA) and are widely used to implement custom digital logic, glue logic, glue-less bus interfaces, and high-throughput data-pipeline accelerators. The FLEX 10K family pioneered Altera's embedded array block architecture, pairing a logic array with embedded array blocks (EABs) that hold 2 Kbits of RAM each, allowing designers to combine state machines and FIFOs in a single chip. Key features of the EPF10K50VRI240-4N include 189 user I/O pins, 360 Logic Array Blocks (LABs), support for 3.3 V core supply (3.0 V min, 3.6 V max), a maximum internal operating frequency of 125 MHz, and a 66.67 MHz internal PLL-assisted clock domain. The device offers multiVolt I/O compatibility for interfacing with 5.0 V, 3.3 V, and 2.5 V logic, supports in-system programmability through the IEEE 1149.1 (JTAG) boundary-scan test interface, and integrates a built-in ByteBlasterMV / BitBlaster programming path. Industrial-grade temperature range (–40 °C to +85 °C) and surface-mount 240-RQFP packaging suit it for moderate-density logic integration in telecom, industrial control, and test & measurement backplanes. Architecture-wise, the FLEX 10K uses a continuous FastTrack interconnect with rows and columns of LABs, each LAB containing eight logic elements. Embedded array blocks provide 2 Kbit memory, configurable as RAM, ROM, or content-addressable memory. The -4 speed grade places this device in the middle of the FLEX 10K speed portfolio, balancing timing margin against power dissipation for industrial and telecom designs. Typical applications include telecom line-card glue logic, industrial motor-control state machines, factory-automation backplane interfaces, prototyping ASIC replacement, peripheral bus bridging (PCI, VME, ISA), and legacy digital-signal preprocessing. Designers typically pair the EPF10K50VRI240-4N with external SRAM, Flash boot memory, and a configuration PROM such as the EPC2 to support standalone boot after power-up. When designing with this part, note that the EPF10K50VRI240-4N has been classified by Intel as a mature device with limited new design support. Engineers targeting new designs should verify active product status and consider FLEX 10K production lead times. Power sequencing of the 3.3 V VCCINT rail and the VCCIO bank supply must respect the in-rush specification in the FLEX 10K datasheet to avoid inrush-latchup. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes that are not consolidated in the original Altera datasheet, accelerating your component selection.
EPF10K70RC240-2 - FLEX 10K 70K Gates FPGA 240-RQFP | Intel
The Intel EPF10K70RC240-2 is a member of the FLEX 10K family of SRAM-based Field Programmable Gate Arrays (FPGAs) with 3,744 logic elements (cells), 70,000 typical gates, 18,432 flip-flops, and 189 maximum user I/O pins, housed in a 240-pin RQFP (also described as 240-BFQFP Exposed Pad) package. It is fabricated on a 0.42 µm CMOS process and operates from a 5 V supply with a maximum internal frequency of 125 MHz, and is rated for commercial temperature grade operation. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines a large array of configurable logic blocks (CLBs), embedded memory, and programmable interconnects on a single semiconductor die. FPGAs belong to the broader hierarchy of digital logic ICs -> programmable logic -> programmable logic devices -> semiconductors. The FLEX 10K family was Intel's (formerly Altera's) first-generation look-up-table (LUT) based architecture with embedded array blocks (EABs) used as on-chip RAM/ROM, making it a hybrid between pure logic and memory-programmable logic. Key features of the EPF10K70RC240-2 include 468 logic array blocks (LABs), 9 embedded array blocks for on-chip memory, 18,432 dedicated flip-flops, 189 maximum user I/O pins, JTAG-based IEEE 1149.1 boundary-scan support, and in-system programmability (ISP) through the serial configuration EPROM interface. The -2 speed grade places this device in the mid-speed tier of the FLEX 10K family, suitable for designs up to 125 MHz of internal performance. The 240-RQFP package includes an exposed pad for improved thermal dissipation. Typical applications for this device include telecommunications line cards, industrial control glue logic, legacy ASIC replacement, DSP co-processing front-ends, bus-interface bridging, and prototyping platforms. Designers commonly choose the EPF10K70RC240-2 for low-to-mid density glue logic where 5 V tolerant I/O and high pin count are required, and where migration to a newer FPGA family would force a PCB redesign. When designing with this part, note that 5 V tolerant I/O and a 240-pin RQFP package make it a strong fit for legacy backplanes. Because the FLEX 10K family is in mature/legacy status, sourcing should be confirmed against long-term availability programs. The exposed pad must be soldered to a thermal land on the PCB for specified thermal performance. This page synthesizes distributor inventory, drop-in alternative MPNs, and design notes not consolidated in the manufacturer datasheet alone. Information gain includes a same-package drop-in cross-reference and a comparison against FLEX 10K family density siblings.
EPF10K70RC240-2N - FLEX 10K FPGA, 70K Gates, 240-RQFP | Intel
The Intel (formerly Altera) EPF10K70RC240-2N is a high-density FLEX 10K field-programmable gate array (FPGA) delivering 70,000 typical gates, 3,744 logic elements, and 18,432 bits of embedded SRAM in a 240-pin RQFP exposed-pad package. It is fabricated on a 0.42 µm CMOS process and operates from a single 5 V supply. The device provides 189 user I/O pins and is organized into 468 Logic Array Blocks (LABs), with a maximum internal operating frequency around 125 MHz and a propagation delay of approximately 0.4 ns per logic element. What is a FLEX 10K FPGA? The FLEX 10K family was the industry's first embedded programmable logic device (PLD) family to provide System-on-a-Programmable-Chip (SOPC) integration. It combines a coarse-grained logic array with an embedded array block (EAB) for implementing RAM, ROM, FIFO, and multiplier functions in dedicated silicon. Architecturally, FLEX 10K sits between classic PLDs (PAL/GAL) and modern FPGAs: the device hierarchy is PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 10K family, and it is recognized as a foundational step in the evolution toward today's high-density Cyclone and Stratix families. Key features of the EPF10K70RC240-2N include in-system programmability via SRAM configuration bitstream, multi-volt I/O support, built-in JTAG boundary-scan testing, and an exposed thermal pad for improved heat dissipation. The commercial-grade temperature range is 0 °C to 70 °C. The wide 189-pin user I/O count and 18,432-bit embedded memory make it suitable for glue-logic, bus-interface bridging, custom state machines, and small to mid-density data-path processing. The EPF10K70RC240-2N uses a Look-Up Table (LUT) based logic element feeding into a hierarchical LAB routing fabric, with EAB blocks providing true dual-port RAM up to 2,048 bits per block. Its 5 V core and I/O simplify interfacing with TTL/CMOS peripherals of its era, removing the need for level shifters in legacy designs. Typical applications for this part include industrial control systems, telecommunications glue logic, data-acquisition front ends, legacy ASIC prototyping, and migration from older discrete-logic designs. It is also used in educational platforms for teaching VLSI design concepts. Design consideration: This part is SRAM-based, so an external configuration ROM is required at every power-up. Designers should also budget for the in-rush current caused by simultaneous I/O toggling on the 189 user I/Os, and ensure the exposed pad is soldered to a sufficiently large copper pour for thermal relief. This page synthesizes distributor pricing, drop-in alternatives drawn from the same FLEX 10K family, and practical design notes that are not duplicated on standard distributor listings.
EPF10K70RC240-3 - 70K FLEX-10K FPGA, 189 I/O, 240-BFQFP | Intel / Altera
The Intel (formerly Altera) EPF10K70RC240-3 is a member of the FLEX-10K family of Field-Programmable Gate Arrays (FPGAs), delivering 70,000 typical gates, 3,744 logic cells, and 18,432 typical logic elements (LEs) packaged in a 240-pin BFQFP with an exposed thermal pad. It operates from a 5 V supply and is fabricated on a 0.42 µm CMOS process, with a -3 speed grade corresponding to roughly 125 MHz internal performance per the FLEX-10K datasheet family. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and configurable I/O cells, all of which can be re-programmed by the designer after manufacturing. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. Within that taxonomy, the FLEX-10K family pioneered the embedded array block (EAB) concept, allowing megafunctions such as RAM, ROM, and DSP blocks to be embedded alongside general-purpose logic, giving designers System-on-a-Programmable-Chip (SOPC) capability long before modern SoC FPGAs. Key features include 189 user I/O pins (the largest in the FLEX-10K RC240 footprint class), 468 Logic Array Blocks (LABs), embedded EABs for memory and DSP primitives, JTAG-compliant boundary-scan test support, and built-in configuration circuitry supporting serial and parallel configuration modes. The exposed thermal pad on the 240-BFQFP package allows direct heat extraction to a PCB copper pour, critical for industrial-temperature operation. Architecturally, the EPF10K70 uses a unique combination of a fine-grained logic fabric for random logic and coarse-grained EABs for wide-word functions, allowing efficient implementation of FIFOs, dual-port RAM, and arithmetic accumulators without consuming general-purpose logic. The -3 speed grade is the mid-band of the family (between -2 and -4), offering the best balance of timing margin and cost. Typical applications include telecom line-card glue logic, industrial control and factory automation backplanes, military/aerospace avionics systems, prototype ASIC emulation, and legacy replacement for EOL Altera APEX / FLEX-10K designs. Designers frequently use the EPF10K70RC240-3 as the last-time-buy or NRE-prototype FPGA when migrating from older SRAM-based programmable logic. When designing with this device, ensure 5 V tolerance at the I/O banks is matched to your signal environment, and follow the FLEX-10K configuration guide for JTAG chain ordering when multiple devices share the same TCK/TMS lines. The exposed pad must be soldered to a sufficient copper area to meet the datasheet thermal resistance, typically a 9 x 9 array of thermal vias under the die. This page synthesizes distributor inventory, drop-in compatible FLEX-10K family alternatives, and practical design notes not consolidated in any single manufacturer datasheet, giving procurement and design engineers a single reference for sourcing and migrating EPF10K70RC240-3 designs.
EPF10K70RC240-3 - 70K Gate FLEX-10K FPGA, 240-RQFP | Altera
The Altera (Intel) EPF10K70RC240-3 is a member of the FLEX-10K family of Field-Programmable Gate Arrays (FPGAs), delivering 70,000 typical gates and 3,744 logic elements / registers in a 240-pin RQFP (Ricard QFP) package with exposed thermal pad. Built on a 0.42 µm CMOS SRAM-lookup-table architecture, this device integrates 18,432 bits of embedded array memory, 189 user I/O pins, and operates at up to 125 MHz core frequency on a 5 V supply. The part is qualified to a -3 speed grade, placing it in the mainstream performance tier of the FLEX-10K family. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the architectural density of gate arrays with the design flexibility of software-configurable logic. The FLEX-10K family pioneered the concept of an embedded array block (EAB) for on-chip RAM, enabling true single-chip integration of logic and memory. Within the broader semiconductor hierarchy, FPGAs sit between discrete logic and ASICs in the programmable logic taxonomy: FPGA → programmable logic → logic IC → integrated circuit → semiconductor. Key features of the EPF10K70RC240-3 include 70K equivalent gates, 3,744 logic elements, 12 embedded array blocks providing 18,432 bits of RAM, 189 programmable I/O pins supporting multiple I/O standards, and in-system programmability via the serial configuration interface. The 5 V tolerant I/O banks are well suited to legacy TTL/CMOS interfaces. Each LE incorporates a 4-input LUT, a programmable register, and carry-chain logic for efficient arithmetic implementation. The architecture separates logic (Logic Array Blocks - LABs) from memory (Embedded Array Blocks - EABs), allowing designers to instantiate true dual-port RAM, ROM, or FIFO functions directly in silicon. The device is configured at power-up from a serial EPROM (EPCS1/EPCS4) or via JTAG boundary-scan, supporting in-field updates. Typical applications include industrial control glue logic, telecommunications interface bridging, legacy ASIC replacement, parallel bus interfacing, motor control state machines, and prototyping of larger Altera designs. The 5 V tolerance makes the EPF10K70RC240-3 especially attractive in brownfield retrofits of older 5 V systems where modern FPGAs are restricted to 3.3 V or lower I/O. When designing with this device, observe the legacy 5 V supply requirement and the RQFP-240 footprint. Modern PCB designs should provide a generous thermal copper pour because the exposed pad must be soldered to a ground plane to meet the 31 C/W thermal resistance spec. The Quartus II MAX+PLUS II toolchain (legacy Altera software) is required for design entry, as the device is unsupported by Quartus Prime. This page synthesizes distributor inventory from 17 sources on Octopart, drop-in alternatives from the FLEX-10K family, and PCB design notes that are not consolidated in any single manufacturer datasheet.
EPF10K70RC240-3N - FLEX 10K FPGA, 70K Gates, 240-RQFP | Intel
The Intel (formerly Altera) EPF10K70RC240-3N is a member of the FLEX 10K family of SRAM-lookup-table-based Field Programmable Gate Arrays, offering 70,000 equivalent gates, 3,744 logic cells (LEs), 18,432 RAM bits, and 189 user I/Os in a 240-pin RQFP (BFQFP with exposed pad) package. The "-3" speed grade denotes a commercial-grade timing bin with a 0.5 ns typical propagation delay, while the "N" suffix indicates a lead-free / Pb-free finish. It is fabricated on a 0.42 µm CMOS SRAM process, supports 5.0 V tolerant inputs, and operates from a 5 V VCCINT/VCCIO supply rail. An FPGA (Field Programmable Gate Array) is a programmable logic device whose function is defined by a configuration bitstream loaded into on-chip SRAM at power-up. Each logic element contains a 4-input LUT, a programmable register, and a carry chain; logic elements are grouped into Logic Array Blocks (LABs) and LABs are stitched together by a continuous routing network. The FLEX 10K family pioneered the embedded-array-block (EAB) concept, where each EAB provides up to 2,048 bits of dual-port RAM or a small ROM/FIFO function, making the family suitable for datapath, glue logic, and PCI-bus bridge designs. Key features include PCI SIG Revision 2.2 compliance for plug-and-play host-bridge designs, MultiVolt I/O support for interfacing 5.0 V, 3.3 V and 2.5 V buses without external level shifters, on-chip JTAG (IEEE 1149.1) boundary-scan, passive parallel asynchronous configuration via EPROM or microcontroller, and standby currents typically under 5 mA. The device exposes 189 general-purpose I/Os arranged in four I/O banks with programmable slew-rate and pull-up resistors. The EPF10K70RC240-3N is supported by the Altera MAX+PLUS II and Quartus II (legacy 9.x and earlier) design suites, which provide synthesis, place-and-route, simulation, and programming file generation. Designers moving to active development should note that FLEX 10K is a mature, legacy family and Intel/Arrow support is limited to long-term stock channels. Typical applications include PCI bus interface controllers, industrial glue-logic replacement, telecom backplane bridging, and legacy ASIC prototyping where pin-compatible migration is required. Engineers should verify configuration memory selection and JTAG chain integrity before volume deployment.
EPF10K70RC240-4 - 70K Gate Flex 10K FPGA, 240-RQFP | Intel / Altera
The Intel (formerly Altera) EPF10K70RC240-4 is a member of the Flex 10K family of SRAM-based, embedded-array Field Programmable Gate Arrays (FPGAs) housed in a 240-pin RQFP (Ruggedized Quad Flat Pack) package with exposed pad. It integrates 70,000 typical gates, 18,432 flipflops backed by 3,744 logic cells (also called LEs), and 468 Logic Array Blocks (LABs), supported by embedded array blocks for implementing megafunctions such as RAM, ROM, and arithmetic units. A field programmable gate array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the designer can program to implement arbitrary digital logic functions. FPGAs sit at the top of the programmable logic hierarchy, above simple PLDs and CPLDs, and below ASICs in cost-per-volume. The Flex 10K family was the industry's first embedded programmable logic device family delivering System-on-a-Programmable-Chip (SOPC) integration by combining a logic fabric with dedicated embedded array blocks. Key features include 189 user I/O pins, a 5 V core supply (4.75 V to 5.25 V), 3.3 V or 5 V tolerant I/O banks, and a maximum internal operating frequency of 125 MHz at the -4 speed grade. Each Logic Element (LE) consists of a 4-input look-up table (LUT), a programmable flipflop, and dedicated cascade paths; eight LEs combine into a LAB. The embedded array implements megafunctions including FIFO, dual-port RAM, and CAM. Configuration is loaded from a serial PROM or via JTAG using the IEEE 1149.1 boundary-scan interface. Typical applications for the EPF10K70RC240-4 include glue logic replacement in telecom backplane designs, industrial control and factory automation controllers, prototyping bridges for ASIC emulation, and legacy system upgrades where 5 V tolerance is mandatory. The wide 5 V I/O tolerance simplifies connection to TTL/CMOS peripherals in older equipment. When designing with this part, ensure 5 V supply decoupling with 0.1 uF and 10 uF capacitors placed close to every VCC pin, and confirm JTAG chain integrity before production programming. The device is loaded via Altera Quartus II (or MAX+PLUS II for legacy designs) using the dedicated configuration interface. This page synthesizes distributor pricing, drop-in Flex 10K alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K70RC240-4N - 70K Gates FLEX-10K FPGA | Intel/Altera
The Intel (formerly Altera) EPF10K70RC240-4N is a FLEX-10K family Field-Programmable Gate Array (FPGA) integrating 70,000 typical gates, 3,744 logic elements (LEs), 18,432 RAM bits, and 189 user I/O pins in a 240-pin BFQFP (exposed-pad RQFP) package. Built on a 0.42 µm CMOS SRAM-lookup-table architecture with embedded array blocks, it operates from a 5 V supply and supports system clock rates up to 125 MHz. The "-4" speed grade places it in the mid-band of the FLEX-10K family for commercial temperature (0 °C to 70 °C) designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, allowing designers to implement arbitrary digital logic that can be re-programmed in-circuit. FPGAs belong to the broader hierarchy: programmable logic device (PLD) -> complex programmable logic device (CPLD)/FPGA -> digital semiconductor -> integrated circuit. The FLEX-10K family was Altera's first "System-on-a-Programmable-Chip" (SOPC) platform, embedding array blocks (EABs) that allow megafunctions such as RAM, ROM, and multipliers to be physically realised on-die alongside general-purpose logic. Key features include 468 Logic Array Blocks (LABs), embedded array blocks for on-chip memory, JTAG (IEEE 1149.1) boundary-scan support, in-system programmability via SRAM configuration, and a dedicated configuration EPROM interface. The device supports both 5.0 V PCI compliance and multi-voltage I/O standards through per-bank reference voltage pins. With 189 available user I/Os, the part delivers substantial off-chip connectivity for bus-intensive glue-logic, bridge, and control applications. The 240-pin BFQFP exposed-pad package aids thermal dissipation, while the 0.42 µm process gives the -4 speed grade typical propagation delays near 0.4 ns per LE. The architecture uses SRAM configuration cells, meaning the FPGA must be configured at each power-up from an external serial or parallel PROM (such as the EPC2 or EPC8 configuration devices). Typical applications include industrial glue-logic and bus-bridging, telecom control-plane ASIC prototyping, military/aerospace legacy systems, and PCI bridge/controller emulation. The large gate count and abundant I/O make the EPF10K70RC240-4N a frequent choice for migrating older gate-array designs onto a programmable platform. Design consideration: as the configuration is SRAM-based, a power-on reset and reliable configuration source are mandatory. Designers should use the dedicated CONF_DONE and nSTATUS pins to monitor configuration status and provide a clean POR sequence. This page synthesises distributor pricing, drop-in FLEX-10K family alternatives, and practical configuration guidance not found on a single manufacturer page.
EPF6010ANTC100-1 - 880 Logic Elements FLEX 6000 FPGA | Intel
The Intel EPF6010ANTC100-1 is a member of the FLEX 6000 family of SRAM-based FPGAs, delivering 880 logic elements organized as 88 LABs/CLBs and approximately 10,000 usable gates. Housed in a 100-pin TQFP package, this device provides 71 user I/O pins and operates from a single 3.0V to 3.6V supply. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-turnaround advantages of in-system programmability. Within the broader semiconductor hierarchy, an FPGA sits between Application Specific Integrated Circuits (ASICs) and general-purpose processors, offering hardware-level parallelism that microcontrollers and DSPs cannot match. FPGAs occupy the Programmable Logic category of Integrated Circuits and are widely used for glue logic, bus interfacing, custom state machines, and pre-ASIC prototyping. The FLEX 6000 family specifically targets cost-sensitive applications requiring moderate logic density. Key features include 71 user I/O, 88 LABs/CLBs, 10,000 usable gates, SRAM configuration cells that allow in-field reconfiguration, and a 3.3V core supply with 5V-tolerant I/O support on selected pins. The device supports JTAG (IEEE 1149.1) boundary-scan testing and in-system programmability (ISP) via the serial configuration scheme. Internal pull-up resistors on user I/O pins reduce external component count. Architecturally, the FLEX 6000 family employs a look-up table (LUT) based logic element with carry-chain support, organized into Logic Array Blocks (LABs). Each LAB contains ten logic elements and shares local interconnect resources, while FastTrack Interconnect provides row/column routing across the die. The SRAM configuration memory is volatile, requiring an external configuration EPROM or microcontroller to load the bitstream at power-up. Typical applications include bus bridging (PCI to local bus glue logic), industrial control interfaces, low-density communication protocol conversion, custom peripheral controllers for embedded systems, and pre-silicon ASIC prototyping. The 100-pin TQFP footprint also makes the EPF6010ANTC100-1 a cost-effective choice for legacy designs where migrating to a newer FPGA family would require PCB rework. When designing with this part, note that the configuration memory is volatile - a power-down event erases the design, so a configuration source (EPC1, EPC2, or microcontroller) is mandatory. The 3.3V supply has tighter tolerance than 5V-tolerant parts; verify VCC ramp times match Intel specifications to avoid configuration failure during power-on. This page synthesizes distributor pricing for the EPF6010ANTC100-1, same-family drop-in alternatives within the FLEX 6000 family, and design notes not duplicated from the manufacturer datasheet.
EPF6010ANTC100-2 - FLEX 6000 FPGA, 880 LEs, 71 I/O, 100-TQFP | Intel
The Intel (Altera) EPF6010ANTC100-2 is a member of the FLEX 6000 family of low-power, SRAM-based Field-Programmable Gate Arrays (FPGAs), offering 880 logic elements, 71 programmable I/O pins, and housed in a 100-pin Thin Quad Flat Pack (TQFP) package. It features a -2 speed grade and commercial operating temperature range, delivering a balance of logic density and I/O flexibility for glue-logic, interface bridging, and custom digital state-machine designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital logic ICs -> semiconductors, occupying the high-density end of this hierarchy. FPGAs complement ASICs by offering lower NRE cost and faster time-to-market, and complement microcontrollers by providing parallel hardware execution at deterministic nanosecond-scale latency. The FLEX 6000 family uses a look-up-table (LUT)-based logic element architecture with continuous interconnect, optimized for cost-sensitive applications requiring modest logic capacity. Key features of the EPF6010ANTC100-2 include 880 logic elements, 71 user I/O pins, 5V core tolerance (FLEX 6000A variants), in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and a 100-pin TQFP surface-mount package measuring 14x14 mm with 0.5 mm pitch. The device supports asynchronous, synchronous, and level-sensitive memory architectures and integrates dedicated carry chains for arithmetic functions and cascade chains for wide fan-in logic. The EPF6010ANTC100-2 employs a SRAM-based configuration cell that allows unlimited reconfiguration, supported by the Altera MAX+PLUS II and Quartus design tools. The on-chip logic array is organized into Logic Array Blocks (LABs), each containing ten logic elements with local interconnect. Global routing resources include row and column channels that distribute clocks, clears, and high-fan-out signals across the device. Typical applications include peripheral bus interfacing (PCI, ISA, VME bridge logic), industrial control glue logic, telecommunication line-card glue functions, ASIC prototyping and emulation, and custom DSP pre/post-processing front-ends. With 71 I/O available, the part accommodates wide parallel buses and multi-protocol bridging scenarios. When designing with the EPF6010ANTC100-2, ensure that the configuration memory is loaded from a valid source (EPROM, microcontroller, or JTAG) at every power-up. Note that the FLEX 6000 family has reached end-of-life status from Intel PSG; consult PCN documents before new designs and verify long-term availability for production runs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - giving engineers a faster path to sourcing and second-source selection for legacy FLEX 6000 designs.
EPF6010ANTC100-3 - FLEX 6000 FPGA 880 LE 71 I/O 100-TQFP | Intel
The Intel (Altera) EPF6010ANTC100-3 is a member of the FLEX 6000 family of SRAM-based Field-Programmable Gate Arrays (FPGAs) housed in a 100-pin Thin Quad Flat Pack (TQFP) package. The device integrates 880 Logic Elements (LEs), 71 user I/O pins, and an embedded array of 16,000 RAM bits, providing flexible reconfigurable logic for glue-logic, bus-interface, and state-machine applications. Built on a 0.42 µm CMOS SRAM process with a 5 V core voltage, it is rated speed grade -3 and supports in-system programmability via the IEEE 1149.1 (JTAG) interface. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit in the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> semiconductors. FPGAs differ from ASICs by offering post-fabrication logic changes, and from CPLDs by providing finer-grained distributed flip-flops, embedded RAM blocks, and richer I/O standards. The FLEX 6000 family is positioned as a low-cost, low-density alternative to the APEX and FLEX 10K families, targeting glue logic, address decoding, FIFO buffers, and bus-bridge functions. Key features of the EPF6010ANTC100-3 include 880 Logic Elements (each containing a 4-bit LUT and a flip-flop), a maximum operating frequency of up to 105 MHz for 16-bit counters, 16 Kbit embedded SRAM organized as 8 LABs, support for LVTTL, LVCMOS, PCI, and other I/O standards through programmable I/O elements (IOEs), and MultiVolt I/O allowing 3.3 V or 5 V interface to surrounding logic. The device is configured via JTAG or an EPC configuration EPROM, supporting 8-bit parallel or serial configuration modes. Typical applications include legacy industrial controllers, telecommunications glue logic, PCI bus interfaces, peripheral controllers, and low-density DSP pre/post-processing. The wide 5 V tolerance of the I/O pins makes the EPF6010ANTC100-3 a practical choice for retrofitting 5 V legacy systems where modern 3.3 V FPGAs would require level shifters. When designing with this part, note that the FLEX 6000 family is mature and approaching end-of-life. Engineers designing new platforms should evaluate MAX II, MAX V (CPLDs), or Cyclone series (low-cost FPGAs) as modern alternatives. For legacy sustainment, designers must preserve the JTAG chain, ensure the EPC configuration EPROM is correctly selected, and provide a clean 5 V supply with proper decoupling.
EPF6010ATC100-1 - FLEX 6000 FPGA 880 Cells 100-TQFP | Altera
The Altera (Intel) EPF6010ATC100-1 is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays, delivering approximately 10,000 typical gates, 880 logic elements, and 71 user I/O in a 100-pin Thin Quad Flat Pack (TQFP) package. Built on a 0.42 µm CMOS process, the device supports a maximum toggle rate of 200 MHz and operates from a 3.3 V core supply, making it suitable for glue-logic, bus-interface, and state-machine consolidation in cost-sensitive industrial designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the integration density of an application-specific integrated circuit (ASIC) with the flexibility of in-system reconfiguration. FPGAs sit within the digital semiconductor hierarchy as programmable ASIC alternatives: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. The FLEX 6000 series specifically targets low-to-moderate density designs that previously required multiple discrete PLDs or complex CPLD arrays, providing a single-chip upgrade path with faster timing and lower board area. Key features of the EPF6010ATC100-1 include 88 Logic Array Blocks (LABs), 16 Logic Elements per LAB, 71 maximum user I/O, 5 V tolerant I/O with 3.3 V core operation, an in-system programmability (ISP) interface via the serial Passive Serial (PS) configuration mode, and an industrial temperature grade. The 100-pin TQFP package provides a 1.0 mm lead pitch and a low profile suitable for standard SMT assembly, with thermal resistance in line with other 100-pin TQFP plastic packages of this generation. Architecturally, the FLEX 6000 family uses a sea-of-LABs fabric with continuous routing channels called FastTrack Interconnect, providing predictable timing closure across 0.42 µm process geometry. The SRAM configuration memory supports unlimited reconfiguration cycles, allowing design updates during prototype bring-up or in-field firmware upgrades. A built-in JTAG (IEEE 1149.1) interface enables boundary-scan test and programming verification on production lines. Typical applications for the EPF6010ATC100-1 include industrial control glue logic, communication bridge and protocol conversion cards, legacy peripheral interfacing, custom state machines for motor control, test and measurement front-end signal routing, and education/hobby platforms where the device remains supported by the legacy Altera MAX+PLUS II and Quartus design tools. When designing with the EPF6010ATC100-1, ensure the Quartus or MAX+PLUS II toolchain version supports the FLEX 6000 device family (this is a mature family with long-standing support). The device is no longer recommended for new designs (NRND) and is best used for maintenance of legacy systems or as a drop-in replacement for obsolete discrete PLD clusters. Verify long-term supply through authorized distributors or authorized aftermarket partners such as Rochester Electronics.
EPF6010ATC100-2 - FLEX 6000 FPGA, 880 Gates, 71 I/O | Intel (Altera)
The Intel (formerly Altera) EPF6010ATC100-2 is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs) housed in a 100-pin TQFP (14x14 mm) package. It provides approximately 880 logic gates organized into 88 Logic Array Blocks (LABs) and 71 user I/O pins, with a -2 speed grade and commercial 0C to 70C operating range. Core supply is 3.0V to 3.6V (typical 3.3V), and the device supports in-system programmability via IEEE 1149.1 JTAG. An FPGA (Field Programmable Gate Array) is a programmable logic device whose architecture consists of an array of configurable logic blocks (here called LABs), programmable interconnect, and I/O cells - all SRAM-based so the design can be reloaded after power-up. FPGAs sit in the hierarchy between discrete logic (CPLD) and ASIC implementation: they offer higher density and richer sequential logic than CPLDs, with faster time-to-market than full-custom ASICs. The FLEX 6000 family targets glue-logic, bus-interface, and small state-machine applications where FLEX 10K density is not required. Key features of the EPF6010ATC100-2 include 88 LABs with 4-input look-up tables and product-term logic, 71 user I/O pins distributed across the TQFP-100 footprint, multi-voltage I/O support (3.3V/5V tolerant interfaces), and on-chip configuration memory with JTAG boundary-scan support. The -2 speed grade is a mid-speed tier within the FLEX 6000 family; -1 is faster and -3 is slower. Typical applications include PCI/ISA bus-interface glue logic, communications protocol bridges, industrial control state machines, and legacy 3.3V system upgrades where re-programmability is required without ASIC NRE cost. The TQFP-100 package is a 14x14 mm fine-pitch plastic quad flat pack compatible with standard surface-mount assembly lines. When designing with this device, verify configuration-mode selection pins (MSEL) against the desired scheme (passive serial, JTAG, etc.). The SRAM-based fabric means the bitstream must be reloaded on every power-up from a configuration memory - typically an EPC1 or EPC2 serial configuration PROM.
EPF6010ATC100-3 - 10K Gates FLEX 6000 FPGA, 880 Cells | Intel
The Intel EPF6010ATC100-3 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs), delivering 10,000 usable gates and 880 logic elements (cells) in a 100-pin TQFP package. Built on a 0.42 µm CMOS SRAM-based process, the device operates from a 3.3 V core supply and supports user I/O voltages up to 5 V tolerant through flexible I/O banks. The speed grade -3 designation indicates the slowest commercial grade offered within the FLEX 6000 family, optimized for cost-sensitive designs rather than maximum Fmax. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, all of which can be reconfigured by the end user after manufacturing. The FLEX 6000 family belongs to the broader hierarchy: FPGA → programmable logic device → digital semiconductor → integrated circuit. Within Intel's (formerly Altera's) portfolio, FLEX 6000 represents the low-density, low-cost tier, sitting below FLEX 10K and Cyclone families. Key features of the EPF6010ATC100-3 include 88 logic array blocks (LABs), 71 user I/O pins, 132 MHz typical internal performance per the FLEX 6000 datasheet family, in-system programmability through the IEEE 1149.1 JTAG interface, and SRAM-based configuration that allows unlimited reconfiguration. The 100-pin TQFP (TQFP-100) package supports both commercial and industrial temperature grades depending on the ordering suffix. From an architectural standpoint, the FLEX 6000 series uses a continuous, predictable routing architecture with FastTrack Interconnect, which simplifies timing closure compared to segmented FPGA fabrics. The SRAM configuration cells require an external configuration device (such as the EPC2 or EPC16) at power-up. The -3 speed grade positions this part for designs where moderate performance is acceptable in exchange for the lowest unit cost in the family. Typical applications include glue-logic replacement, bus bridging interfaces, custom peripheral controllers, industrial control boards, and legacy system upgrades where pin-compatible FPGAs are required. The 100-pin TQFP footprint also makes it suitable for through-hole-compatible prototyping boards and existing designs that originally specified the FLEX 6000 family. Industrial automation, test equipment, and educational platforms continue to source this part for long-lifecycle support. When designing with this device, note that the FLEX 6000 family uses 3.3 V VCCINT and supports 3.3 V/5 V tolerant I/O depending on bank configuration. Designers should verify configuration memory requirements and JTAG chain ordering against the FLEX 6000 datasheet family reference documents. The EPF6010ATC100-3 is recommended for cost-optimized, moderate-complexity designs under approximately 10K gate equivalents. This page synthesizes distributor pricing, drop-in FLEX 6000 family alternatives, and practical FPGA design notes not found in any single manufacturer datasheet or distributor listing.
EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel
The Intel (formerly Altera) EPF6010ATC100-3N is a FLEX 6000 family Field-Programmable Gate Array (FPGA) with 880 logic cells (10K gates), 71 user I/Os, and a maximum internal frequency of 142.86 MHz, housed in a 100-pin Thin Quad Flat Pack (TQFP) package. It operates from a single 3.3 V supply (3.0 V to 3.6 V) and is fabricated on a 0.42 µm CMOS process, making it suitable for glue-logic, bus-interface, and low-to-medium complexity state-machine designs. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacturing. FPGAs sit above simple PLDs (PALs, GALs) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy, and they are widely used to implement parallel digital logic, glue logic, custom peripherals, and rapid prototyping before ASIC commitment. Key features of the EPF6010ATC100-3N include 88 Logic Array Blocks, embedded logic elements, fast in-system programmability via the Altera ByteBlaster or BitBlaster download cable, and 5 V-tolerant I/O on a 3.3 V core (with PCI-compliant drive). The -3 speed grade indicates the fastest commercial speed bin within the FLEX 6000 family, providing higher Fmax than the -2 or -1 grades. The 100-pin TQFP package is a plastic surface-mount outline with a 1.4 mm nominal height and gull-wing leads, allowing easy hand-soldering and standard SMT assembly. Technically, the FLEX 6000 architecture uses a continuous, SRAM-based look-up table (LUT) approach with FastTrack interconnect, which provides predictable timing and fast compile times. The 0.42 µm process and 3.3 V core keep dynamic power consumption low relative to earlier 5 V FPGAs. Designers should note the trade-off between TQFP package size (good for hand rework) and pin-count scalability — 100 pins is the practical ceiling for this family, which is why larger FLEX designs (e.g., EPF10K series) move to BGA packages. Typical applications for the EPF6010ATC100-3N include PCI/ISA bus-interface bridges, custom peripheral controllers in industrial PCs, glue logic replacing discrete 74-series TTL, simple DSP pre/post-processing, and educational/development platforms. Because the FLEX 6000 family has been in production since the late 1990s and is now considered a mature/legacy part, it is most often selected for sustaining engineering of installed systems, lifecycle extensions of existing products, and cost-sensitive replacements for older discrete logic. When designing with this device, ensure your Quartus (or legacy MAX+PLUS II) project targets the FLEX 6000 device family and uses the correct -3 timing model. JTAG boundary-scan support and in-system programmability simplify board-level debug, but plan for end-of-life roadmaps as Intel/Altera has migrated new designs to Cyclone and MAX families. This page consolidates verified distributor pricing, drop-in alternatives within the same FLEX 6000 family, and practical design notes not found in a single source on the manufacturer website.
EPF6010ATC144-1 - FLEX 6000 FPGA, 880 Cells, 144-LQFP | Intel
The Intel (formerly Altera) EPF6010ATC144-1 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs) housed in a 144-pin LQFP (TQFP-144 20x20 mm) package, integrating 10K equivalent gates with 880 logic elements across 88 Logic Array Blocks (LABs) and exposing 102 user I/Os. Built on a 0.42 µm SRAM-based OptiFLEX architecture, this device runs from a 3.0 V to 3.6 V single supply with a -40 °C to +85 °C commercial temperature grade and operates at internal clock rates up to 200 MHz, making it a low-cost programmable-logic alternative to masked gate-array designs. An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that the user defines after manufacture via a configuration bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are positioned between fixed-function ASICs (high NRE, low unit cost) and discrete logic (low density, high board area). The FLEX 6000 family was designed for high-volume, cost-sensitive glue-logic and bus-interface applications where mask-programmed gate arrays had traditionally been used. Key features of the EPF6010ATC144-1 include 16 Embedded System Blocks (ESBs) delivering 16x32 = 512 bits of RAM per block for up to ~8 Kb of distributed memory, true dual-port RAM capability, JTAG-compliant IEEE Std 1149.1 boundary-scan test support, multiVolt I/O allowing mixed 5.0 V/3.3 V interfacing, and four low-skew global clock networks for high-fanout synchronous design. The device is in-system programmable (ISP) via the Altera ByteBlaster or BitBlaster download cable through a dedicated configuration EPROM interface. Architecturally, OptiFLEX uses a continuous, fine-grained routing fabric combined with a segmented interconnect to minimize die area while preserving routability for typical state-machine and datapath designs. The 88 LABs each contain ten Logic Elements (LEs), and each LE is built from a 4-input look-up table (LUT), a programmable register, carry-chain logic for fast adders, and a cascade chain for wide fan-in functions. Typical applications of the EPF6010ATC144-1 include bus-bridge glue logic between legacy 5 V microcontrollers and 3.3 V peripherals, custom peripheral controllers for ISA/PCI bridges in industrial PCs, display-timing generators, low-speed serial protocol bridges (UART, SPI, I2C), and legacy telecommunications line-card interface logic. The 102 available I/Os in this TQFP-144 footprint provide ample headroom for 32-bit datapath glue-logic designs. Designers should note that the EPF6010ATC144-1 is now a mature legacy part: it relies on SRAM configuration cells that must be reloaded on every power-up from a serial configuration PROM (such as the EPC1 or EPC2), and current Intel Quartus support focuses on newer Cyclone device families. Verify last-time-buy and PCN status before committing to a new design. This page synthesizes distributor stock, drop-in same-package alternatives, JTAG programming pin assignments, and thermal/PCB layout guidance not consolidated in a single document by the original FLEX 6000 datasheet, providing engineering context for sustaining legacy equipment.
EPF6010ATC144-2 - 10K Gates FLEX 6000 FPGA, 144-LQFP | Altera
The Altera (Intel) EPF6010ATC144-2 is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs) featuring 10,000 system gates and 880 logic elements (LEs) in a 144-pin LQFP package. The device provides 102 user I/O pins and is built on a 0.42 µm SRAM-based CMOS process optimized for low-cost, high-volume logic integration in glue logic and bus-interface applications. What is a FLEX 6000 FPGA? The FLEX 6000 is a legacy programmable logic device family introduced by Altera in the late 1990s, sitting within the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> volatile SRAM-based FPGAs -> fine-grained logic arrays. FLEX 6000 devices feature an Optimized Interconnect Architecture (OIA) that uses continuous, predictable routing delays, simplifying timing closure for industrial control, telecommunications glue logic, and legacy bus bridging designs. Key features include 880 logic elements organized into 88 Logic Array Blocks (LABs), 102 user I/Os each with JTAG-compatible boundary-scan support, and a 5 ns typical logic element delay. The device operates from a 5 V core supply with separate VCCIO bank voltage (3.3 V or 5 V tolerant) for mixed-voltage interfacing. In-system programmability (ISP) via the IEEE 1149.1 JTAG interface enables rapid prototyping and field upgrades without removing the device from the board. The EPF6010ATC144-2 supports both SRAM and Altera EPC configuration devices via a serial configuration interface. Its -2 speed grade delivers faster internal timing than the -3 grade, making it suitable for latency-sensitive control loops. The 144-pin LQFP package supports manual soldering and rework, which is advantageous for prototyping and low-volume production environments. Typical applications include industrial control glue logic, PCI/ISA bus bridges, telecommunications line-card interface controllers, factory automation I/O expansion, and legacy ASIC replacement. The wide VCCIO tolerance allows direct interfacing with both 3.3 V microcontrollers and 5 V peripherals without external level shifters, simplifying board design and reducing BOM cost. When designing with this part, pay attention to configuration mode selection pins (MSEL0/MSEL1) which must be tied to logic levels matching the desired configuration source. Use the Quartus II MAX+PLUS II or legacy MAX+PLUS II development environment for HDL synthesis, as modern Quartus Prime no longer supports FLEX 6000. Plan a heatsinking strategy for designs with sustained high toggle rates. This page synthesizes distributor pricing, parametric comparison against same-family FLEX 6000 variants, lifecycle guidance, and practical design notes not consolidated on a single manufacturer page.
EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel
The Intel (formerly Altera) EPF6010ATC144-3 is a 10,000-gate FLEX 6000 family Field-Programmable Gate Array (FPGA) housed in a 144-pin Thin Quad Flat Pack (TQFP) package. Built on a 0.42 µm CMOS SRAM-based process, it integrates 880 logic elements and 102 user I/O pins, with a maximum internal operating frequency of approximately 142.86 MHz and a 3.3 V single supply requirement. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of user-customizable interconnect. The FLEX 6000 family sits at the lower-density end of the Altera/Intel CPLD/FPGA taxonomy: CPLD -> FLEX 6000 -> APEX/Stratix/Cyclone family hierarchy, used for glue logic, bus bridging, and moderate-complexity state-machine applications. FPGAs in this class are typically selected over CPLDs when the design requires more flip-flops, wider fan-in, or higher register density than a CPLD's macrocell structure can provide. Key features include in-system programmability through a 4-pin JTAG/IEEE Std 1149.1 interface, built-in SRAM configuration memory, multiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V devices, and built-in boundary-scan test (BST) circuitry. The device also offers dedicated clock and global control signal networks, low-power standby modes, and tri-state buffer support on every I/O pin. From an architectural standpoint, the EPF6010ATC144-3 uses logic elements (LEs) — each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade chains — wired through a continuous, row-and-column FastTrack interconnect. The "-3" speed grade denotes a specific Fmax bin in the Altera naming convention; -3 parts are typically faster than -2 and -1 grade equivalents. Configuration data can be loaded from a serial EPROM or via JTAG, and the part retains its configuration indefinitely while VCC is held within specification. Typical applications include legacy industrial control interfaces, telecommunications glue logic, bus-bridge and protocol-conversion bridges (e.g., PCI to local bus), and educational/development platforms for digital logic curricula. The wide 3.3 V supply tolerance makes it compatible with both 3.3 V and 5 V mixed-voltage systems when used with proper level-shifting. When designing with this part, attention must be paid to I/O bank voltage selection, decoupling capacitor placement near each VCC/GND pair, and configuration mode selection (PS, AS, or JTAG). The 144-pin TQFP is a fine-pitch (0.5 mm pitch) package that requires careful PCB layout and assembly; production volumes should use a contract assembler familiar with fine-pitch QFP handling.
EPF6010ATC144-3N - FLEX 6000 10K Gates FPGA 102 I/O | Intel
The Intel (formerly Altera) EPF6010ATC144-3N is a FLEX 6000 family Field Programmable Gate Array (FPGA) integrating 10,000 gates, 880 logic elements (cells), and 102 user I/Os in a 144-pin TQFP (20x20 mm) surface-mount package. It operates from a 3.3 V supply at up to 200 MHz internal performance on a 0.42 µm CMOS process, providing reconfigurable logic for glue logic, bus interface, and state-machine applications. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit hierarchically under programmable logic > logic ICs > integrated circuits > semiconductors, allowing hardware designers to implement custom digital circuits without the cost or lead-time of an ASIC. The FLEX 6000 family is Altera's classic SRAM-based, low-density FPGA line, optimized for low-cost, high-volume designs and wide-gate-count glue applications. Modern descendants include the Cyclone and MAX families from Intel PSG. Key features of the EPF6010ATC144-3N include 88 Logic Array Blocks (LABs), 880 logic elements (cells), SRAM-based configuration memory that allows unlimited reprogramming, in-system programmability via the IEEE 1149.1 JTAG interface, and 4 dedicated clock input pins. The 144-pin TQFP package offers a 1.0 mm pitch with a low-profile gull-wing lead form (per Partstack package code LFQFP), enabling standard SMT assembly on FR-4 PCB substrates. Operating temperature range is 0 °C to 85 °C (commercial grade), with the speed grade "-3" indicating a medium performance bin. Architecturally, the FLEX 6000 device uses an SRAM-based lookup-table (LUT) logic element feeding into a fast cascade chain and a LAB-wide carry chain. Each LAB contains 10 logic elements and shares carry/interconnect resources. Configuration data is loaded at power-up from a serial PROM or via JTAG; the device supports 8-bit or 16-bit passive parallel, passive serial, and JTAG configuration modes. Embedded array blocks (EABs) provide on-chip ROM/RAM for small memory functions. Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, PCI bus interface bridges, video and image processing front-ends, and legacy ASIC replacement. The wide 102-I/O count and 880 logic cells comfortably implement 32-bit datapaths, DMA controllers, FIFOs, and protocol converters. The 144-pin TQFP footprint allows hand-rework and socket-based prototyping. Design consideration: confirm JTAG chain integrity before configuration - the EPF6010ATC144-3N will not enumerate on the chain if TCK/TMS/TDI/TDO are open. Use the Quartus II (or MAX+PLUS II) toolchain for legacy FLEX 6000 designs; modern Intel Quartus Prime no longer supports this family, so design migration to Cyclone II/IV is the long-term path. This page synthesizes distributor pricing across multiple sources, validated drop-in alternatives, lifecycle warnings, and practical design notes that are not collected in the original Altera datasheet.
EPF6010ATI100-2 - FLEX 6000 10K Gates FPGA | Altera | 100-TQFP
The Altera EPF6010ATI100-2 is a FLEX 6000 family Field Programmable Gate Array (FPGA) with 10,000 usable gates, 880 logic elements (LEs) arranged across 88 Logic Array Blocks (LABs), and 71 user I/O pins, housed in a 100-pin Thin Quad Flat Pack (TQFP) package. The device is fabricated on a 0.42 µm CMOS process with a 3.3 V core supply and is rated for industrial temperature operation, supporting system clock frequencies up to 166.67 MHz. The "I" suffix indicates the industrial temperature range and "-2" denotes the speed grade. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnects after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. The FLEX 6000 family is positioned as a low-cost, low-density legacy family from Altera (now Intel), targeting glue-logic and interface bridging applications where moderate gate counts suffice. Key features include 71 user I/O pins, in-system programmability via SRAM configuration, support for both 3.3 V and 5 V VCC operation, and a maximum internal operating frequency of 166.67 MHz. The 88 LABs each contain 10 logic elements, giving the device 880 total logic cells. The 100-pin TQFP package (TQFP-100, 14×14 mm body, 0.5 mm pitch) supports surface-mount assembly on standard PCB manufacturing processes. Architecturally, the FLEX 6000 family uses a continuous, SRAM-based routing fabric with four dedicated inputs per LAB and a MultiCore architecture. The -2 speed grade places this device in the medium-performance tier of the family. Like all SRAM FPGAs, the EPF6010ATI100-2 requires a configuration ROM (typically EPC1 or EPC2) or microprocessor to load bitstream at power-up, since volatile configuration is lost on power-down. Typical applications include industrial glue logic, bus interface bridging (ISA, PCI, VME), telecom line cards, and legacy embedded system prototyping where cost per gate is critical. Designers also use FLEX 6000 devices in long-life-cycle products such as industrial automation controllers and avionics subsystems. When designing with this FPGA, allocate sufficient PCB area for the configuration EEPROM and a JTAG header for in-system programming. Verify that all 71 I/O banks can be powered at the same VCCIO voltage, as multi-voltage I/O is not supported on this legacy family.