EP3C25F256I7N vs EP3C16U256C8N Comparison
Detailed side-by-side comparison of EP3C25F256I7N by Intel and EP3C16U256C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F256I7N | EP3C16U256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $48.90 | $48.40 |
| Family | Cyclone III | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array | β |
| Logic Elements (LEs) | 24,624 | β |
| Logic Array Blocks (LABs) | 1,539 | β |
| Embedded Memory Bits | 608,256 (66 M9K blocks) | β |
| Embedded Multipliers (18x18) | 66 | β |
| Maximum User I/O Pins | 156 | β |
| PLLs | 4 | 4 |
| Process Technology | 65 nm low-power | 65 nm low-power |
| Core Voltage | 1.2 V | β |
| Package Type | 256-LBGA / 256-FBGA (17x17 mm) | β |
| Operating Temperature Range | -40 C to +125 C (Industrial) | β |
| Speed Grade | 7 | 8 (C8, commercial) |
| RoHS Status | Lead-Free / RoHS Compliant (per F suffix, 7N suffix) | Compliant (Pb-free) |
| Mounting Type | Surface Mount | Surface Mount (BGA, requires microvia PCB) |
| Logic Elements | β | 15,408 |
| Total Memory Bits | β | 516,096 bits |
| Embedded Multipliers (18 x 18) | β | 56 |
| Maximum User I/O | β | 168 |
| Package | β | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Core Voltage (VCCINT) | β | 1.2 V |
| Operating Junction Temperature | β | -40 Β°C to +85 Β°C |
| Configuration Modes | β | JTAG, AS, PS, FPP |
| MSL Level | β | [DATA_NEEDED: MSL level] |