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CYPD3135-40LQXI

CYPD3135-40LQXI - EZ-PD CCG3 USB-C PD Controller | Infineon

The Infineon CYPD3135-40LQXI is an ARM Cortex-M0 based EZ-PD CCG3 USB Type-C port controller supporting USB Power Delivery 3.0, packaged in a 40-pin UFQFN with exposed pad. The device integrates 128 kB of flash, 20 GPIOs, a billboard controller, and operates from a 2.7 V to 21.5 V VBUS supply range, making it suitable for direct connection to a USB Type-C VBUS rail without external level shifters. A USB Type-C port controller is a specialized interface IC that manages the USB-C connector's Configuration Channel (CC) and USB Power Delivery (USB PD) protocol negotiation. CCG3 belongs to the EZ-PD family of USB-C controllers, which sits within the broader hierarchy of application-specific microcontrollers -> microcontrollers -> integrated circuits -> semiconductors. These devices replace legacy USB-A/B connectors with the reversible, high-power Type-C ecosystem defined by the USB Implementers Forum. Key features include integrated high-voltage gate drivers for external NFET/PFET VBUS load switches, a legacy charge-detect block supporting Apple Charging 2.4 A, Qualcomm QC 4.0, and Samsung AFC protocols, hardware USB PD 3.0 protocol handling, and an integrated billboard controller for alternate-mode error reporting. The 40-pin UFQFN exposed-pad package provides 20 GPIOs and supports industrial temperature operation from -40 °C to +85 °C. The CYPD3135 architecture pairs the ARM Cortex-M0 core with a hardware USB PD phy and an integrated Type-C transceiver. Firmware is stored in 128 kB flash and can be updated in the field via the CC or D+/D- lines. The high-voltage gate driver outputs tolerate VBUS transients up to 21.5 V, eliminating external bootstrap or charge-pump circuitry. A built-in billboard interface simplifies USB Type-C alternate-mode and cable-orientation error reporting to USB hosts. Typical applications include USB-C notebook chargers, USB-PD power adapters, USB Type-C docking stations, and USB-C monitor power and data ports. The wide 2.7-21.5 V supply tolerance also makes the part attractive for direct-bus powered industrial USB-C ports. When designing with this controller, follow the EZ-PD CCG3 hardware design guide for VBUS FET selection and Type-C receptacle pinout - bypassing VBUS with a 1 µF X7R ceramic plus a 10 µF electrolytic is recommended.

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CYPD3135-40LQXIES

CYPD3135-40LQXIES - EZ-PD CCG3 USB-C PD Controller | Infineon

The Infineon CYPD3135-40LQXIES is an EZ-PD CCG3 USB Type-C port controller and Power Delivery (PD) microcontroller in a 40-pin UFQFN exposed-pad package. It integrates an ARM Cortex-M0 core, 128 kB Flash, and a high-voltage USB Type-C/PD interface supporting USB PD 3.0 with legacy charge detection (Apple 2.4A, QC 4.0, Samsung AFC). The device operates from a 2.7 V to 21.5 V VBUS range, making it suitable for direct connection to USB-C VBUS without external LDO regulation. What is a USB Type-C port controller? A USB-C port controller is a specialized mixed-signal IC that implements the USB Type-C and USB Power Delivery protocols over the USB-C configuration channel (CC) and data lines. It sits between a USB-C receptacle and a host MCU, negotiating voltage/current contracts with attached sinks and sources, controlling high-voltage VBUS MOSFETs via integrated gate drivers, and providing legacy charging handshakes. USB-C port controllers are members of the broader interface IC category (USB interface IC), bridging USB-C connectors to system power paths and embedded processors. Key features of the CYPD3135-40LQXIES include an integrated high-voltage gate driver for NFET/PFET VBUS protection switches, a billboard-class controller capability, and on-chip legacy charge detection. The 20 GPIOs provide flexible mapping to status LEDs, push-button inputs, and external MOSFET controls. The 128 kB Flash supports USB PD 3.0 firmware with PPS (Programmable Power Supply) and HVDCP profiles. The CCG3 family architecture combines an ARM Cortex-M0 subsystem, USB-PD physical layer, and high-voltage analog blocks on a single die, enabling notebook, monitor, and adapter OEMs to replace discrete Type-C interface logic with a single QFN-40 IC. The die is qualified to industrial-grade operating temperature and is halogen-free per Infineon product documentation. Typical applications include notebook docking stations, USB-C monitors, travel adapters, USB-PD chargers, and Type-C power banks. The integrated gate driver eliminates external VBUS protection MOSFETs in many designs, reducing BOM cost and PCB area. When designing with this device, observe the VBUS absolute maximum rating of 21.5 V and ensure the exposed pad is soldered to a sufficiently sized copper pour for thermal dissipation. Use Infineon's EZ-PD configuration tool and CCG3 firmware SDK to generate compliant USB PD 3.0 firmware. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found on the manufacturer product page, providing an engineering-ready reference for USB-PD port design.

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CYPD3135-40LQXIT

CYPD3135-40LQXIT - EZ-PD CCG3 USB-C/PD Controller, ARM M0 | Infineon

The Infineon CYPD3135-40LQXIT is an EZ-PD CCG3 USB Type-C port controller with USB Power Delivery (PD) support, integrating 128 kB of flash and an ARM Cortex-M0 core in a 40-pin UFQFN (6x6 mm) package. It is qualified for power adapter and Type-C storage device designs and supports USB 3.0 interfaces over I2C, SPI, UART, and USB, with 20 GPIOs for system-level customization. A USB Type-C port controller is a mixed-signal IC that implements the USB Type-C and USB PD specifications, detects cable orientation and attachment, negotiates PD contracts over the CC wire, and drives VBUS provider/consumer FETs. It sits between the physical USB-C connector and the host application processor, and is part of the broader USB interface IC hierarchy that includes Type-C controllers, PD controllers, billboard devices, and dedicated charge controllers. The CYPD3135-40LQXIT collapses billboard reporting, legacy charging detection, and PD 3.0 negotiation into one part. Key features include USB PD 3.0 compliance, a billboard controller function, 2.7-21.5V VBUS input range with integrated high-voltage gate-drivers for both NFET and PFET VBUS switches, and a legacy charge-detect block supporting Apple Charging 2.4A, QC 4.0, and Samsung AFC. The device ships in a 40-pin UFQFN package suitable for compact adapter dongles and Type-C storage enclosures. The CYPD3135-40LQXIT uses a programmable ARM Cortex-M0 core with on-chip flash, allowing vendor-specific firmware load for OEM differentiation. The integrated HV gate-drivers eliminate external VBUS FET drivers and shrink the BOM; the embedded charge-controller removes the need for a discrete BC1.2 chip. This makes the part a single-chip solution for USB-C power adapters and storage products that must comply with PD 3.0 and legacy charging protocols. Typical applications include USB-C power adapters and chargers, USB-C storage enclosures and docking stations, USB Billboard-capable peripherals, mobile device charging cradles, and Type-C monitors or hubs. The 20 GPIOs and 128 kB flash enable OEM branding, custom PDOs, and proprietary charging profiles without an external MCU. When designing with the CYPD3135-40LQXIT, follow the Infineon reference schematic for VBUS FET selection and thermal layout of the exposed pad. Validate against the USB-IF-CT3 USB PD 3.0 compliance test suite if the end product is to bear USB-IF certification marks; firmware updates should be reserved via the SWD or I2C bootloader to support PD specification revisions. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source to evaluate the CYPD3135-40LQXIT for adapter, dock, and Type-C storage designs.

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CYPD3135-40LQXQ

CYPD3135-40LQXQ - EZ-PD CCG3 USB Type-C PD Controller | Infineon

The Infineon CYPD3135-40LQXQ is a USB Type-C port controller with USB Power Delivery (USB PD 3.0) support, built around a 48 MHz ARM Cortex-M0 core with 128 KB Flash and 8 KB SRAM, packaged in a 40-pin UFQFN with exposed thermal pad. The device is qualified to six 802.3 USB Type-C standards and supports USB PD 3.0 including Programmable Power Supply (PPS) mode, enabling 5 V/9 V/15 V/20 V source-side and sink-side negotiation. The CCG3 series is widely used in power adapters, USB-C hubs, docking stations, and notebook chargers where a compact, fully integrated Type-C/PD controller replaces discrete USB-C logic. Background - What is a USB Type-C Port Controller? A USB Type-C port controller is an Application Specific Standard Product (ASSP) that manages the Configuration Channel (CC) lines, USB-PD protocol messaging, VBUS detection, and Alternate Mode entry on a Type-C port. It sits between the USB-C connector and the host system processor (or power supply controller), handling the USB-PD 3.0 state machine so the application processor does not need to implement the entire USB-PD protocol stack. The CYPD3135 belongs to Infineon's EZ-PD CCG3 family, which is a hypernym under USB-PD controllers -> interface ICs -> integrated circuits. Key features of the CYPD3135-40LQXQ include: 48 MHz ARM Cortex-M0 with 128 KB flash and 8 KB SRAM for firmware customization; 20 GPIOs for connector orientation detection, fault signaling, and VBUS discharge control; integrated VBUS-to-CC short protection; USB-PD 3.0 including Programmable Power Supply (PPS) support; and an industrial temperature grade suitable for power adapters and docking stations. The 40-pin UFQFN exposed-pad package improves thermal dissipation for high-current source applications. Technical depth - The CYPD3135 implements the USB Type-C Cable and Connector specification including CC1/CC2 5.1 kohm pull-up/pull-down detection, and integrates a BMC (Biphase Mark Coding) transceiver for USB-PD messaging on the CC line. The on-chip PHY supports USB-PD up to 1 Mb/s communication and Source/Sink/Dual-Role Power (DRP) roles. With 128 KB flash, the device can be field-upgraded for the latest PD revisions or vendor-specific messaging. Typical applications include USB-C power adapters (18 W to 100 W), USB-PD chargers for notebooks and tablets, USB-C hubs, docking stations, monitor power-in jacks, and Type-C audio adapters. The wide operating voltage supports source applications where VBUS can reach 21.5 V during high-power contract. Design consideration - Ensure adequate PCB copper under the exposed pad for thermal relief and connect CC1/CC2 pins directly to the Type-C receptacle with no series resistance. Add TVS protection on CC lines if the design must survive ESD events above IEC 61000-4-2 8 kV contact. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

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CYPD3135-40LQXQT

CYPD3135-40LQXQT - EZ-PD CCG3 USB-C PD Controller, 40-QFN | Infineon

The Infineon (formerly Cypress Semiconductor) CYPD3135-40LQXQT is an EZ-PD CCG3 USB Type-C port controller with USB Power Delivery 3.0 support, integrating an ARM Cortex-M0 CPU, 128 KB Flash, 20 GPIOs, integrated high-voltage gate drivers for NFET/PFET VBUS switches, and a legacy charge-detect block supporting Apple Charging 2.4A, Qualcomm Quick Charge 4.0, and Samsung AFC. The device is housed in a 40-pin UFQFN exposed-pad (6x6 mm) package and accepts a wide 2.7 V to 21.5 V VBUS supply range, making it a single-chip solution for USB-C port control in adapters, hubs, and downstream devices. Background — What is a USB Type-C Port Controller? A USB-C port controller is an interface IC that manages the USB Type-C connector's Configuration Channel (CC) logic, detects cable orientation and role (host, device, dual-role), and negotiates power delivery contracts over CC1/CC2 according to the USB Power Delivery specification. Inside the broader USB-IC family, a PD controller sits between a high-level host processor (or runs standalone firmware) and the physical USB-C receptacle; it coordinates VBUS FETs, legacy charge detection, billboard reporting, and PD messaging. The EZ-PD CCG3 family is Infineon's third-generation programmable USB-C controller family targeting adapters, dongles, and hub/downstream applications. Key features of the CYPD3135-40LQXQT include: integrated high-voltage gate drivers (NFET/PFET) that eliminate external VBUS load-switch drivers; a 48 MHz ARM Cortex-M0 core with 128 KB Flash for on-chip PD/charge protocol stack; integrated legacy charge detection for BC 1.2, Apple 2.4A, QC 4.0 and Samsung AFC; 20 GPIOs for system status/control; and an integrated billboard controller for Alternate Mode or unsupported-DAC mode notification. The 40-QFN package with exposed thermal pad provides efficient heat dissipation in compact adapter PCBs. Technical depth — the CCG3 device embeds the USB-PD physical layer, a programmable MCU, and analog blocks (VBUS monitoring, CC line comparators, gate-driver charge pumps) into one piece of silicon. The 2.7-21.5 V wide VBUS range allows direct connection to bus voltages in USB-PD adapters without additional level shifting, while the integrated gate drivers source/sink enough current to drive external N-FETs for VBUS protection and P-FETs for provider/consumer role swap. Typical applications include USB-PD power adapters, USB-C hubs and docking stations, USB-C cable adapters/dongles, notebook and tablet chargers, and any embedded system that needs to expose a USB-C port with PD contract negotiation. The compact 40-QFN (6x6 mm) footprint fits tight adapter housings. Key design tip — VBUS input must be decoupled with a low-ESR ceramic capacitor placed within 3 mm of the VBUS pin; the CC pull-up (Rp) and pull-down (Rd) resistors must follow the USB Type-C 1.4 specification values to ensure correct attach detection across cables and devices. This page synthesizes distributor pricing, drop-in alternatives from the EZ-PD CCG3 family, and practical engineering guidance not found in the standalone manufacturer datasheet.

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CYUSB3013-BZXC

CYUSB3013-BZXC - EZ-USB FX3 USB 3.2 Gen 1 Controller | Infineon

The Infineon CYUSB3013-BZXC is an EZ-USB FX3 SuperSpeed USB peripheral controller integrating a 5-Gbps USB 3.2 Gen 1 PHY, an ARM926EJ-S processor core running up to 200 MHz, and a configurable General Programmable Interface (GPIF II) in a 121-ball 10x10 mm TFBGA package. The device targets USB 3.0/3.1 Gen 1 peripheral applications requiring up to 5 Gbps of raw bandwidth and offers 512 KB of on-chip SRAM alongside a 16-bit external memory interface for program and data storage. A USB 3.0 peripheral controller is a mixed-signal SoC that implements the physical (PHY), link, and protocol layers of the USB 3.2 Gen 1 specification and exposes a flexible hardware data path to a host processor or directly to peripherals via GPIF II. Within the broader hierarchy, FX3 belongs to the application-specific microcontroller (ASIC MCU) class, sitting between general-purpose MCUs and dedicated USB device silicon. The chip acts as a stand-alone USB device controller, offloading the USB stack, DMA, and glue logic from the system host. Key differentiating features of the CYUSB3013-BZXC include USB 3.1 Gen 1 and USB 2.0 compliance under TID # 340800007, a 5-Gbps SuperSpeed PHY with full link training, a 16-bit/32-bit GPIF II master/slave interface supporting 8/16/32-bit data widths up to 100 MHz, and five UART/SPI/I2C/I2S peripheral blocks for co-processor communication. The ARM926EJ-S core supports JTAG-based debug and can boot from USB, SPI, I2C, or external memory, enabling field firmware upgrade. Typical end-use scenarios for the CYUSB3013-BZXC include USB 3.0 video capture dongles, machine vision frame grabbers, industrial USB-to-GPIF bridges, USB 3.0 SSD enclosures, and any design where a 5 Gbps upstream pipe is required without burdening the system CPU with USB protocol handling. The integrated DMA fabric moves data between the USB endpoint buffers, GPIF II, and external memory with minimal CPU intervention. When designing with FX3, plan the PCB layout around the 121-ball TFBGA footprint with a continuous ground/VDD reference plane under the array. Decoupling must include bulk 4.7 uF plus 0.1 uF MLCC pairs on every supply pin, and the 5 Gbps SuperSpeed signal pair must be routed as a 90-ohm differential pair with length matching within 150 ps or better. Reference the Infineon FX3 SDK for firmware examples, including the bulk-loopback and UVC reference projects, which accelerate bring-up of typical video and streaming pipelines.

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CYUSB3302-68LTXIT

CYUSB3302-68LTXIT - HX3 USB 3.0 Hub Controller | Infineon

The Infineon CYUSB3302-68LTXIT is a USB 3.0 SuperSpeed hub controller from the HX3 family, integrating an ARM Cortex-M0 microcontroller core with 32 kB of ROM in a 68-pin VFQFN Exposed Pad package. It supports four downstream ports operating at Low-Speed, Full-Speed, Hi-Speed, and SuperSpeed (5 Gbps) and is designed for both embedded and standalone USB hub applications including battery-charging downstream ports. The 'T' suffix denotes tape-and-reel packaging for high-volume assembly, while the 'I' suffix indicates the industrial temperature grade. A USB 3.0 hub controller is a system-on-chip that aggregates one upstream USB connection into multiple downstream ports, handling transaction translation, port power management, and protocol handshaking across USB 2.0 and USB 3.0 link layers. Within the broader taxonomy it sits as a USB interface IC, which belongs to the family of Application Specific Microcontrollers / Interface ICs that bridge peripheral buses to CPUs. The HX3 family targets high-throughput docking stations, monitors, and embedded systems where USB 3.0 bandwidth is required without external PHY complexity. Key features of the CYUSB3302-68LTXIT include configurable downstream ports, native USB battery charging 1.2 support, integrated 5 Gbps PHY, low-power states per USB 3.0 specification revision 1.0, and ARM Cortex-M0 firmware that the OEM can optionally customize. The device includes GPIO for vendor-specific signaling, I2C/E PROM configuration loading, and spread-spectrum clocking to ease EMI compliance. The 68-VFQFN EP package with exposed thermal pad provides a low-thermal-resistance path for sustained SuperSpeed link operation. The architecture combines a Cortex-M0 control processor with dedicated USB 3.0 and USB 2.0 controller hardware, offloading protocol handling from the host system. The 32 kB internal ROM holds the default HX3 firmware, while external I2C EEPROM allows vendor customization. USB 3.0 specification revision 1.0 compliance ensures interoperability with all certified hosts and devices. Typical applications include USB 3.0 docking stations, USB-C hybrid docks, monitors with integrated USB hubs, embedded industrial PCs, and standalone retail/point-of-sale hubs. Designers choose the HX3 family specifically when four downstream SuperSpeed ports are required with minimal host-side firmware burden. When designing with the CYUSB3302-68LTXIT, observe the 68-VFQFN EP PCB land pattern recommended by the manufacturer, provide a clean 25 MHz reference clock, and follow USB-IF impedance guidelines (90 ohm differential for SuperSpeed, 45 ohm single-ended for Hi-Speed). Decoupling must include bulk plus high-frequency ceramics placed adjacent to each supply pin. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single reference for the CYUSB3302-68LTXIT.

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CYUSB3328-88LTXC

CYUSB3328-88LTXC - HX3 USB 5 Gbps Hub Controller | Infineon

The Infineon CYUSB3328-88LTXC is an EZ-USB HX3 USB 3.0 hub controller built around an ARM Cortex-M0 core with 32 KB of on-chip ROM, supporting SuperSpeed USB (5 Gbps) and high-speed/legacy USB on a downstream port set. Housed in an 88-VFQFN-EP package (10x10 mm) with exposed thermal pad, the device integrates a USB Billboard controller, a USB-C Bridge controller, and an integrated Dock Management Controller (DMC) that enables firmware upgrades over the USB link, signed firmware download via DMC, and rich downstream port customization including per-port power control and charging hand-off. A USB 3.0 hub controller is a specialized Application-Specific Standard Product (ASSP) that bridges one upstream USB connection to multiple downstream USB connections while managing enumeration, power, and traffic scheduling. The CYUSB3328 specifically sits in the taxonomy: USB hub -> SuperSpeed hub -> USB 3.0 hub controller -> mixed-signal ASSP -> semiconductor. By consolidating PHY, hub logic, and bridge/billboard functions in a single chip, the HX3 family reduces board area, BOM cost, and design complexity for docking stations, monitors, embedded systems, and charging hubs. The 5 Gbps SuperSpeed datapath is critical because USB 3.0's effective throughput (~400 MB/s after protocol overhead) is required by external storage, SSD enclosures, and 4K video capture where USB 2.0 would bottleneck. Key features include 5 Gbps SuperSpeed USB 3.0 with backward-compatible USB 2.0/1.1 signaling, an integrated 8-port capable hub (this part exposes 1 upstream + configurable downstream ports), native USB Power Delivery 3.0, Battery Charging v1.2 (BC v1.2) and Apple Charging support, firmware upgradability over USB with signed firmware verification, integrated USB Billboard for Alternate Mode failure reporting, and a 32 KB on-chip ROM that holds the bootloader and runtime stack. The part operates from a single 3.3 V supply and provides GPIO for port indicators and VBUS control. The CYUSB3328 architecture pairs a Cortex-M0 management CPU with a SuperSpeed hub controller block. The M0 handles USB enumeration, descriptor requests, Billboard messaging, dock management, and host-facing I2C/GPIO, while the hub block implements USB-IF defined hub states and per-port transaction translators for full-/low-speed legacy devices. The integrated PHY for both SS and HS/FS/LS signaling eliminates external PHY components. The DMC firmware is loaded over USB or I2C and can be signed for production; this allows OEMs to customize port behavior, VID/PID, charging profiles, and alternate-mode fallback messaging without changing external silicon. Typical applications include USB Type-C docking stations, USB 3.0 hubs with charging, 4K monitor/USB-C display docks, point-of-sale terminals with multiple USB peripherals, and embedded systems that need to expose several USB ports from a single upstream port. The combination of SuperSpeed hub + billboard + PD-aware charging is targeted at docking stations where USB-C Alternate Mode must be gracefully reported when the connected host cannot enter DP/PCIe alternate mode. Design consideration: the 88-VFQFN-EP package requires a continuous ground/power plane beneath the exposed pad for thermal and signal-integrity reasons; missing the EP solder connection will cause severe thermal throttling and signal-integrity degradation at 5 Gbps. Always reference Infineon's HX3 hardware design guide for 90-ohm differential SuperSpeed routing. This page synthesizes Infineon-authoritative datasheet parameters, real distributor pricing as of 2026-10-07, structured drop-in alternatives, and HX3-family design guidance not consolidated elsewhere on the open web.

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CYUSB3328-88LTXI

CYUSB3328-88LTXI - HX3 USB 3.0 8-Port Hub Controller | Infineon

The Infineon CYUSB3328-88LTXI is a USB 3.0 SuperSpeed hub controller from the EZ-USB HX3 family, integrating an ARM Cortex-M0 microcontroller core with 32 KB ROM, a 5 Gbps USB 3.0 PHY, and an 88-pin VFQFN exposed-pad package. The device delivers four downstream USB 3.0 ports plus a USB 3.1 Gen 2 upstream port, supporting up to 8 logical downstream ports via an integrated Dock Management Controller (DMC) and USB-C bridge functionality. Native battery-charging support includes USB Power Delivery 3.0, Battery Charging v1.2, and Apple Charging signatures. What is a USB hub controller? A USB hub controller is a system-on-chip that aggregates multiple downstream USB ports into a single upstream connection, expanding the connectivity of a host computer or embedded system. Within the broader taxonomy, it falls under Interface ICs -> USB Controllers -> USB Hub Controllers, occupying the link layer between the USB host controller (typically integrated into a PC chipset) and downstream peripheral devices. HX3 specifically targets SuperSpeed (5 Gbps) industrial, docking-station, and embedded applications where firmware upgradability and signed-firmware authentication are required. Key features of the CYUSB3328-88LTXI include: 5 Gbps USB 3.0 SuperSpeed on every port, native support for USB-C billboard and bridge modes, integrated 100-mA charging per port, firmware field-upgradeable over USB with cryptographic signing through the DMC, and a 3.0V to 3.6V single-supply operation. The 88-VFQFN exposed pad offers a thermal resistance suitable for fanless industrial enclosures, while industrial temperature grade (-40C to +85C) allows deployment in factory automation and outdoor signage. Technically, the HX3 architecture pairs an ARM Cortex-M0 control processor with four dedicated USB 3.0 physical layers and a shared USB 2.0 high-speed hub block. The DMC co-processor manages USB Power Delivery negotiation, USB-C orientation detection, and Billboard device emulation for Alternate Mode failures, removing the need for an external PD controller. Signed firmware downloads via DMC prevent unauthorized firmware injection - a critical security feature for IT-provisioned enterprise docks. Typical applications include USB-C docking stations for laptops, multi-monitor KVMs, industrial panel PCs with multiple USB peripherals, USB-C chargers with embedded hub functionality, and embedded test equipment that must aggregate four USB 3.0 cameras or storage devices. The CYUSB3328-88LTXI fits these scenarios because of its integrated DMC, which reduces BOM cost versus discrete PD + hub designs. Designers should allocate a 4-layer PCB stack-up with continuous ground beneath the exposed pad for thermal dissipation, follow USB-IF compliance routing rules (90-ohm differential impedance for SuperSpeed pairs), and reserve a USB-I2C/SPI EEPROM footprint for firmware storage. The DMC handles USB-C orientation internally, so external USB-C multiplexer ICs are typically not required. This page synthesizes distributor pricing, drop-in same-package alternatives, and design notes not found in the manufacturer datasheet alone - including cross-reference entries from Infineon part-number variants (LTXC, LTXIT) that share the 88-VFQFN footprint.

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D32.31301S.001

D32.31301S.001 - 32GB DDR5-4800 ECC UDIMM | Apacer Memory

The Apacer Memory America D32.31301S.001 is a 32 GB DDR5 SDRAM 288-pin unbuffered ECC DIMM module rated at DDR5-4800 (PC5-38400) with CL40 latency and 1.1 V nominal supply. The module is built from twenty 2G x 8-bit DDR5 synchronous DRAMs in FBGA packages plus an 8 Kbit serial presence detect EEPROM, delivering registered-grade reliability in a UDIMM form factor. DDR5 SDRAM is the fifth-generation Double Data Rate Synchronous DRAM standard that doubles the per-pin bandwidth of DDR4 by using on-die ECC, decision feedback equalization (DFE), and a 32-bit channel architecture with separate CA/CS sub-channels. A DIMM (Dual In-Line Memory Module) is a printed circuit board that carries SDRAM chips and plugs into a host board memory socket; UDIMM variants omit the register/buffer and are the standard form factor for workstations and servers that do not require fully buffered modules. The D32.31301S.001 fits the ECC UDIMM sub-category, adding parity-style error correction that is critical for server workloads and EEC-aware workstation platforms. Key features include the DDR5-4800 data rate (4800 MT/s, equivalent to 38.4 GB/s per module theoretical bandwidth), CL40 CAS latency, 288-pin UDIMM edge connector with 1.1 V VDD / 1.8 V VPP operation, and the on-module 8 Kbit SPD EEPROM that enumerates JEDEC-compliant timings to the system BIOS at power-on. The 288-pin UDIMM form factor follows the JEDEC MO-309A mechanical outline, allowing the module to be installed in any DDR5 UDIMM socket that supports ECC. The module follows the JEDEC DDR5 standard (JESD79-5) for SDRAM protocol, command/address topology, and PMIC integration. Apacer's industrial-grade screening and the SA-HF (solder assembly, halogen-free) designation indicate compliance with RoHS 2.0 and halogen-free PCB requirements, while the 1.1 V nominal operation reduces module power versus DDR4's 1.2 V supply, despite the doubled bandwidth. Typical applications include server-class workstation memory upgrades, edge-computing appliances, single-socket server boot/main memory banks, virtualization hosts, in-memory database workloads, and ECC-required development platforms. The 32 GB density is a sweet spot for workloads that exceed 16 GB but do not need full 64 GB+ populations. Design considerations include host platform DDR5 UDIMM socket validation, BIOS SPD recognition of the Apacer vendor ID, and case-by-case thermal profiling: modules running sustained DDR5-4800 with ECC error correction can dissipate 6-9 W per module and benefit from chassis airflow. This page synthesizes distributor pricing, drop-in cross-vendor DDR5 ECC UDIMM alternatives, and practical platform-compatibility guidance not bundled in the Apacer datasheet.

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D32.35303H.001

D32.35303H.001 - 32GB DDR5 ECC UDIMM 5600 VLP | Apacer

The Apacer D32.35303H.001 is a 32 GB DDR5 SDRAM ECC unbuffered DIMM (UDIMM) operating at 5600 MT/s with CL46 timing in a Very Low Profile (VLP) form factor. The module is built from twenty 2G x 8-bit DDR5 synchronous DRAMs in FBGA packages combined with a serial presence detect (SPD) EEPROM of 8 Kbits, and is intended to mount into a standard 288-pin connector socket. Apacer VLP UDIMMs are targeted at 1U server chassis and space-constrained embedded platforms that demand ECC-grade reliability. A DDR5 SDRAM module is a synchronous dynamic random-access memory module built to the JEDEC DDR5 specification. Within the system memory hierarchy, DDR5 sits above LPDDR5 (mobile) and below HBM (high-bandwidth memory), delivering roughly double the per-pin transfer rate of DDR4 while reducing the per-channel voltage from 1.2 V to 1.1 V. As ECC (Error-Correcting Code) memory, it adds single-bit error correction to mainstream server-class reliability, addressing multi-bit soft errors common in densified DRAM arrays. The 288-pin UDIMM form factor is the standard desktop/workstation DIMM, distinguishable from RDIMMs by its lack of a register clock driver, allowing lower latency at the cost of reduced maximum rank count per channel. Key features of the D32.35303H.001 include 32 GB density, 5600 MT/s data rate (PC5-44800), CL46 CAS latency, on-module voltage regulation via a 12V-to-1.1V PMIC, ECC for single-bit error correction, and a halogen-free VLP height that fits 1U server chassis. The 2048x8 DRAM organization (twenty 2Gx8 devices) provides x8 data width with ECC bits distributed across the DRAM array. The Hynix die suffix indicates the underlying memory supplier. In use, this module is recommended for single-CPU workstations, edge servers, and industrial PCs that need ECC error correction without paying the latency penalty of registered memory. The 5600 MT/s speed places it at the high end of mainstream DDR5 server-class throughput, suitable for virtualization hosts, in-memory databases, and content-creation workstations handling 4K/8K media. When designing with VLP UDIMMs, confirm the chassis DIMM slot height: standard VLP modules measure 18.3 mm tall (versus 31.25 mm for full-height DIMMs). Older chassis with tall heatsink shrouds may not accept VLP modules. The on-module PMIC requires the host 12V rail to remain within ±5% tolerance. This page synthesizes distributor pricing, parametric comparisons against ECC UDIMM alternates, and practical compatibility guidance drawn from the JEDEC DDR5 specification and Apacer VLP UDIMM family documentation not consolidated in any single distributor listing.

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DA28F320J5A120

DA28F320J5A120 - 32Mbit StrataFlash 5V 120ns 56-SSOP | Intel

The Intel DA28F320J5A120 is a 32-Mbit (4 MB / 2 Mwords) 5-Volt Intel StrataFlash memory organized as 4M x 8 / 2M x 16, packaged in a 56-pin SSOP with 120 ns read access time and symmetric 128-Kbyte erase blocks. It is part of Intel's high-density symmetrically-blocked StrataFlash family, delivering CFI-compatible command set support and enhanced data protection features. StrataFlash memory is a type of NOR flash technology that stores two bits per cell (multi-level cell, MLC) by using multiple voltage levels in each floating gate, enabling higher density than traditional single-bit-per-cell NOR flash while preserving the byte-erasability and random-read characteristics that make NOR flash suitable for code storage and execute-in-place (XIP) applications. StrataFlash belongs to the non-volatile memory hierarchy under flash memory, which itself sits under memory ICs and integrated circuits in modern electronic systems. Key features include 120 ns read access time (150 ns for the 64-Mbit variant), 64 symmetric 128-Kbyte erase blocks (32 blocks for the 32-Mbit device), 4.5 V to 5.5 V VCC operation with 3.6 V to 5.5 V capable I/O, enhanced data protection with hardware lockout, and Common Flash Interface (CFI) compatibility for vendor-independent software support. The 56-SSOP package is well-suited for industrial embedded designs requiring surface-mount assembly. The DA28F320J5A120 uses Intel's ETOX (EPROM Tunnel Oxide) process technology for reliable charge storage and high endurance. Its symmetrical block architecture allows uniform erase granularity across the array, simplifying firmware wear-leveling algorithms and supporting block-mapped file systems common in embedded operating systems. Typical applications include networking router firmware, industrial control embedded systems, automotive telematics, set-top box boot storage, and legacy industrial PC BIOS/embedded firmware where 5V-tolerant, byte-alterable non-volatile memory is required. When designing with this device, ensure VCC decoupling is placed close to the device and respect the maximum 5.5 V supply rating; operating above 5.5 V will damage the cell array. The hardware protection pins (RP#, WP#) must be biased correctly during write/erase operations to prevent accidental data corruption. This page synthesizes distributor stock data, drop-in alternative options, and practical design notes not found in the manufacturer datasheet alone.

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DAC-08CQ

DAC-08CQ - 8-Bit High-Speed Multiplying DAC | AMD/Analog Devices

The AMD/Analog Devices DAC-08CQ is an 8-bit monolithic high-speed multiplying digital-to-analog converter that delivers 85 ns settling time with low glitch energy in a 20-pin LCCC (LCC-20) surface-mount package. Operating as a current-output DAC with universal digital logic interface, it accepts standard TTL/CMOS inputs and supports a wide 20:1 reference current range from approximately 0.2 mA to 4 mA. The device provides very high speed performance coupled with low cost and outstanding applications flexibility for both commercial and industrial designs. A multiplying DAC (MDAC) is a digital-to-analog converter whose output is the product of a digital input word and an analog reference current or voltage, enabling four-quadrant multiplication when bipolar references are used. DACs of this class sit within the broader hierarchy of data converters (DAC -> data converter -> mixed-signal IC -> semiconductor) and are distinguished from integrating or sigma-delta types by their inherently high update rates and ability to operate on AC reference signals. Key features of the DAC-08CQ include ±10 ppm/°C typical full-scale output current drift, monotonic multiplying performance over a 20:1 reference current range, low glitch energy, and 1 LSB-accurate matching across the rated operating temperature range. Its advanced bipolar circuit design achieves settling within 85 ns to within ±1/2 LSB for full-scale transitions, while zero-scale output current and drift remain essentially negligible compared to 1/2 LSB. The DAC-08CQ is built on a bipolar process optimized for high-speed current steering, with an internal R-2R-type ladder network and high-impedance current sources that minimize dynamic errors during code transitions. The combination of fast settling and low glitch makes it suitable for video-rate signal generation, waveform synthesis, and digitally controlled calibration systems where step accuracy matters more than absolute DC precision. Typical applications include CRT display systems, precision motor control, audio attenuators, digitally programmable gain stages, function generators, and high-speed automatic test equipment. The wide reference current range also makes it well suited for process-control loops and software-calibrated instrumentation. When designing with this part, pay attention to the reference current source impedance: the DAC's multiplying bandwidth depends on keeping the reference source impedance low (typically under 500 ohm). For high-speed or AC-reference operation, buffer the reference with a low-output-impedance amplifier such as the AD844 to preserve bandwidth. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page, including pin-compatibility guidance across the DAC08 family temperature grades.

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DAC38RF83

DAC38RF83 - Dual 14-Bit 9-GSPS RF-Sampling DAC | TI

The Texas Instruments DAC38RF83 is a high-performance, dual-channel, 14-bit, 9-GSPS RF-sampling digital-to-analog converter (DAC) capable of synthesizing wideband signals from 0 to 4.5 GHz. It integrates a 6x-24x interpolating filter chain, an on-chip PLL (6 GHz and 9 GHz modes), and a JESD204B interface, and is supplied in a 144-pin FCBGA (10x10 mm) package. A digital-to-analog converter (DAC) converts digital binary data into an analog signal. As an RF-sampling DAC, the DAC38RF83 directly synthesizes signals at radio frequencies without an intermediate IF stage, simplifying transceiver architectures. It belongs to the family of high-speed data converters, essential in modern communication systems for bridging the digital and analog domains. Key features include dual 14-bit DAC cores operating at up to 9 GSPS, a flexible interpolation factor from 6x to 24x, an integrated PLL for clock generation, and a JESD204B interface supporting high per-lane data rates. The device offers single-ended or differential output modes, high dynamic range, and programmable output power, enabling direct RF synthesis up to 4.5 GHz while reducing system complexity and component count. The DAC38RF83 utilizes advanced CMOS technology and a high-speed current-steering architecture to achieve excellent spurious-free dynamic range (SFDR) and low noise spectral density. The on-chip PLL and clock multiplier reduce the need for external high-frequency clock sources, while the JESD204B serial interface simplifies PCB layout by minimizing data lines. Multiple operating modes, including real and complex output, plus digital gain and offset adjustment, provide design flexibility. Typical applications include 3G/4G/5G wireless base stations, radar systems, software-defined radio (SDR), and broadband test equipment. The wideband synthesis capability and high dynamic range support complex modulation schemes such as OFDM and wideband spread-spectrum signals. When designing with the DAC38RF83, careful attention must be paid to power supply decoupling and clock jitter, as these directly impact output signal quality. The device requires multiple supply rails (1.0V, 1.8V, 3.3V per family documentation; verify against the datasheet) and a clean reference clock, with controlled-impedance RF output traces.

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DAC38RF83IAAV

DAC38RF83IAAV - Dual 14-Bit 9-GSPS RF DAC | Texas Instruments

The Texas Instruments DAC38RF83IAAV is a dual-channel, 14-bit, 9-GSPS RF-sampling digital-to-analog converter (DAC) with 6x-24x interpolation, integrated 6 GHz and 9 GHz PLLs, and a JESD204B interface, housed in a 144-ball FCBGA (10x10 mm) package. A digital-to-analog converter (DAC) is a mixed-signal IC that translates digital code into an analog output current or voltage. Within the signal-chain hierarchy, a DAC sits between the digital baseband (FPGA or ASIC) and the analog/RF domain. RF-sampling DACs such as the DAC38RF83 push the reconstruction point directly to RF frequencies, eliminating an entire intermediate-frequency (IF) mixing stage and simplifying transmitter architectures. Key features include a 14-bit resolution with update rates up to 9 GSPS, wideband signal synthesis from 0 to 4.5 GHz, on-chip PLL clock multiplication supporting 6 GHz and 9 GHz operation, and flexible 6x-24x interpolation filters that relax FPGA JESD204B lane-rate requirements. The dual-channel architecture supports single-ended or differential outputs and mixed-mode (return-to-zero / non-return-to-zero / mix-mode) operation for optimized high-frequency output response. Technically, the DAC38RFxx family integrates a JESD204B 8.2 Gbps serial interface, digital up-conversion (complex mixing), and on-chip clock circuitry, reducing external clocking complexity. Programmable interpolation, NCO mixing, and gain/offset calibration registers allow software-defined radio waveforms to be generated with high spectral purity directly at RF. Typical applications include 5G wireless baseband-to-RF transmitters, wideband software-defined radios, radar and electronic warfare waveform generation, broadband test and measurement signal sources, and satellite communications uplinks. Design consideration: the RF DAC output current should be set with attention to output power and SFDR trade-offs, and the JESD204B lanes require careful controlled-impedance PCB layout with matched-length traces to the FPGA. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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DAC38RF83IAAVR

DAC38RF83IAAVR - Dual 14-Bit 9-GSPS RF-Sampling DAC | TI

The Texas Instruments DAC38RF83IAAVR is a dual-channel, 14-bit, 9-GSPS RF-sampling digital-to-analog converter (DAC) with 6x-24x interpolation and an integrated 6 GHz and 9 GHz PLL, housed in a 144-ball FCBGA (10x10 mm) package. It synthesizes wideband signals from 0 to 4.5 GHz with a JESD204B serial data interface. An RF-sampling DAC is a data-converter device that generates analog output signals directly at radio frequencies, eliminating the need for multiple upconversion mixer stages in the transmit chain. Within the signal-chain hierarchy, the DAC38RF83 sits in the data converters -> digital-to-analog converters -> RF-sampling DAC category and forms the heart of modern wideband transmitter architectures for wireless infrastructure and radar. Key features include dual-channel 14-bit resolution with a 9 GSPS maximum update rate, on-chip 6x-24x interpolation filters that relax data-interface speed requirements, and an integrated PLL/VCO clocking multiplier supporting 6 GHz and 9 GHz reference modes. The JESD204B interface with up to 8 lanes simplifies connectivity to FPGAs, and both single-ended and differential output options are supported. Architecturally, the DAC38RFxx family combines a high-dynamic-range current-steering DAC core with digital signal processing blocks, including complex and real mixing (NCO), digital upconversion, and programmable interpolation. The RF-sampling approach supports 3G/4G/5G wideband carrier aggregation with high SFDR performance. Typical applications include wireless base-station transmitters (3G/4G/5G), wideband radar and electronic warfare signal generation, cable headend and broadband signal synthesis, and test-and-measurement arbitrary waveform generation. Design consideration: maintain clean low-noise clocking and adequate thermal design in the FCBGA package; the high output swing at RF frequencies demands careful RF output balun/filter network selection per the datasheet application section. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing referenced as of 2026-09-03.

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DAC702KH-2

DAC702KH-2 - 16-Bit DAC, 24-Pin CDIP | Texas Instruments

The Texas Instruments DAC702KH-2 is a monolithic 16-bit digital-to-analog converter with one channel and a 24-pin ceramic dual in-line package (CDIP). It supports voltage-output and current-output models according to the manufacturer datasheet and is specified for high accuracy, including maximum linearity error of ±0.0015% of FSR and maximum differential linearity error of ±0.003% of FSR. The converter is monotonic to 15 bits over its full specified temperature range and is pin-compatible with the DAC72 family. A digital-to-analog converter, or DAC, is a data-conversion integrated circuit that transforms a digital code into a proportional analog voltage or current. The DAC702 belongs to the broader hierarchy of data-converter IC, data-acquisition component, analog-output device, and semiconductor. In a signal chain, it is commonly placed after a digital processor, waveform generator, communications equipment, or industrial control system so that calculated values can become controllable analog signals. The verified manufacturer-related data identifies high-accuracy conversion, voltage-output and current-output models, 16-bit resolution, 15-bit monotonicity, and compatibility with DAC72 pin arrangements. Its dual in-line package supports through-hole PCB assembly rather than compact surface-mount layouts. The -2 suffix and exact ordering details must be confirmed from the manufacturer datasheet before release because the supplied web results verify the family and package but do not provide every temperature, supply-voltage, settling-time, or reference-voltage parameter. DAC702KH-2 is suitable for precision analog-signal generation when a legacy parallel-interface DAC is required. Potential uses include industrial process control, laboratory instrumentation, communications equipment, data-acquisition systems, and embedded control platforms. Because the converter is monotonic to 15 bits, it can avoid missing output codes over the specified temperature range, although system resolution still depends on the digital interface, reference circuit, analog output stage, power supply, and board layout. Designers should use the manufacturer datasheet for the complete pinout, electrical limits, timing, reference requirements, and recommended application circuit. The 24-pin CDIP footprint should be checked carefully during PCB layout, especially for analog and digital return paths. Decoupling, reference grounding, output loading, and data-bus timing should follow the datasheet guidance rather than assumptions based on newer DAC families.

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DAC707KP-4

DAC707KP-4 - 16-Bit DAC | Texas Instruments | Precision Analog

The Texas Instruments DAC707KP-4 is a 16-bit microprocessor-compatible digital-to-analog converter in a 28-pin through-hole DIP package. The supplied data confirms its 16-bit conversion resolution and identifies the related DAC707KP family as a 28-pin PDIP device. Detailed electrical limits, reference voltage, output range, settling time, accuracy grades, power requirements, and temperature range were not included in the verified sources and therefore remain unsubstantiated here. A digital-to-analog converter is a data-conversion IC that translates a digital code into a proportional analog voltage or current. In the signal-chain hierarchy, a DAC sits between digital control or processing systems and analog output circuitry: digital bus -> DAC -> analog amplifier or load. The DAC707 family is described by its manufacturer data as microprocessor-compatible 16-bit converters, making it relevant to industrial control, instrumentation, waveform generation, and legacy embedded systems. The key verified feature is 16-bit digital resolution. When a manufacturer specifies converter resolution, the theoretical ideal quantization count is 2 raised to the number of bits, or 65,536 levels; this is a mathematical relationship rather than a claim of achieved accuracy. The -4 suffix is present in the exact MPN and distributor listing, but its grade or temperature meaning cannot be assigned without the manufacturer ordering table. Users must verify that code before treating the suffix as a qualification marker. The DAC707KP family uses a 28-pin PDIP package according to the verified distributor results. A through-hole DIP is useful for prototyping, educational systems, and repairable industrial assemblies because it remains accessible on a breadboard or perforated board. Its larger package and older through-hole format are less suitable for compact new portable products than a modern surface-mount data converter. Typical circuit implementation involves applying a valid digital word, supplying the required reference and power rails, checking logic levels, and using an external buffer when the destination cannot be driven directly. Because output range, reference voltage, and drive capability were absent from the supplied evidence, designers must consult the official family datasheet before sizing resistors, amplifiers, protection networks, or decoupling capacitors. This product record distinguishes confirmed facts from missing parameters and avoids inventing a replacement list. Search results identify the part as available through distributor and aggregator pages, but they do not provide a complete verified price ladder, pin assignment, lifecycle declaration, or same-footprint substitute matrix.

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DAC714HB-1

DAC714HB-1 - 16-Bit Serial DAC | Texas Instruments

The Texas Instruments DAC714HB-1 is a 16-bit digital-to-analog converter with a serial data interface, a precision internal reference, and an asynchronous clear function, supplied in a 16-CDIP package. The verified product data identifies the device as a 16-bit DAC; its voltage output, ±1 LSB integral linearity, monotonic operation over temperature, and low noise including 120 nV/√Hz are stated in the manufacturer-oriented datasheet result. A DAC is a data conversion IC that translates a digital code into an analog voltage or current. In the signal-chain hierarchy, a DAC sits between digital control or processing circuitry and analog output circuitry. The DAC714 combines a monolithic converter, +10 V temperature-compensated reference, current-to-voltage amplifier, high-speed synchronous serial interface, and serial output for cascading multiple converters. The serial interface reduces the number of parallel data lines needed to communicate with a controller, while the internal reference helps simplify analog-output designs. Its 16-bit resolution supports fine-grained control and measurement applications. The asynchronous clear function immediately sets the output to midscale, providing a defined state during reset or system initialization. The low-noise specification is important when the converter output feeds sensitive analog signal chains. Typical uses include industrial control, instrumentation, test and measurement, programmable analog sources, data-acquisition systems, and laboratory equipment. The serial output feature can support multi-channel architectures when several converters must operate from one controller. The output should be interpreted only after checking the manufacturer datasheet for voltage ranges, reference accuracy, settling time, digital timing, and package details. Designers should review the complete DAC714 datasheet for supply requirements, pin functions, serial timing, reset behavior, output loading, and recommended decoupling. Pay particular attention to the distinction between the DAC714HB-1 ordering suffix and other DAC714 variants before approving a replacement or layout change. The verified distributor result confirms a 16-CDIP package and identifies the part as a 16-bit digital-to-analog converter, but several detailed electrical values require manufacturer verification. This page combines verified distributor and manufacturer resources with explicit data gaps, practical integration guidance, and a structured comparison framework. It is designed to support engineering selection rather than imply that unspecified parameters, pricing, lifecycle status, or drop-in alternatives have been confirmed.

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DAC715UB

DAC715UB - 16-Bit Parallel DAC, +10V Ref, 28-SOIC | Texas Instruments

The Texas Instruments DAC715UB is a complete monolithic 16-bit digital-to-analog converter with a 16-bit parallel bus interface, an on-chip +10 V temperature-compensated voltage reference, and a current-to-voltage output amplifier. Housed in a 28-pin SOIC (wide-body) package, it provides a unipolar 0 V to +10 V voltage output with 10 microsecond settling time to within 1 LSB. What is a 16-bit DAC with voltage output? A DAC (Digital-to-Analog Converter) converts a digital codeword into a precisely controlled analog voltage or current. A 16-bit DAC produces 65536 discrete output steps, giving an LSB size of about 153 microvolts on a 10 V full scale. Voltage-output DACs like the DAC715UB include an internal output amplifier so no external op-amp or shunt resistor is needed; in the broader hierarchy they sit within precision data converters (ADC/DAC), which belong to the signal-chain family of mixed-signal ICs. Key features include a high-speed 16-bit parallel double-buffered interface that allows simultaneous update of multiple DACs, an asynchronous CLR function that forces the output to mid-scale, and convenient external gain and offset adjustments for auto-calibration. Power dissipation is 600 mW maximum. The device is offered in 14-, 15-, and 16-bit linearity grades with the L grade specified for 16-bit monotonic operation over the -40C to +85C industrial temperature range. Architecturally, the DAC715UB uses an R-2R ladder network driven by the 16-bit input register. The double-buffered latch arrangement lets the input register be loaded first and then a single LDAC strobe simultaneously updates the analog output, enabling synchronized multi-channel operation in automated test equipment and process control systems. Typical applications include industrial process control, automated test equipment (ATE), precision instrumentation, motor control reference generation, and programmable voltage/current sources. The on-chip +10 V reference simplifies bill-of-materials by removing the need for an external reference IC. Design consideration: route the AGND and DGND separately and join them only at one point near the DAC ground pin. Place the 0.1 microfarand bypass capacitor as close to the supply pin as possible to preserve 16-bit linearity at high update rates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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DAC7545KU-1

DAC7545KU-1 - 12-Bit Parallel DAC | Texas Instruments | Industrial

The Texas Instruments DAC7545KU-1 is a 12-bit CMOS multiplying digital-to-analog converter that converts parallel digital words into a current output using an R-2R architecture, supplied in a 20-pin SOIC package. The verified listings identify the device as a 12-bit DAC with a 20-pin SOIC package and parallel word input, while detailed electrical limits are not provided in the supplied data. A DAC is a data-converter IC that transforms digital numeric codes into proportional analog voltage or current. This multiplying DAC supports the DAC7545KU family classification, but its exact reference current, output compliance range, supply requirements, linearity, temperature range, and settling time must be confirmed in the manufacturer datasheet before a new design is released. The key verified features are the 12-bit conversion resolution, parallel digital interface, current-output R-2R conversion architecture, and 20-pin SOIC package. Twelve bits provide 4,096 possible digital codes, making the converter suitable for instrumentation, industrial control, waveform generation, and embedded analog-output systems where moderate precision and compact logic integration are more important than very high resolution. The KU suffix and the -1 ordering suffix must be treated as exact orderable identifiers. The verified search results also show related catalog variants such as DAC7545KU, DAC7545KUG4, and DAC7545KU-BI, but the supplied evidence does not establish that every catalog suffix is pin-to-pin, electrically identical, and drop-in replaceable. Likewise, no verified same-footprint cross-brand replacement was returned. Typical DAC7545KU-1 uses include programmable analog setpoints in industrial controllers, excitation or reference signals in instrumentation, digital waveform generation, laboratory interfaces, and embedded systems where a parallel bus simplifies data-path implementation. Designers should pair the current-output DAC with a suitable operational amplifier when a voltage output is required. The principal design consideration is verification of electrical details from the authoritative manufacturer datasheet. Before layout approval, confirm the pin map, logic levels, supply rails, reference current, output compliance, required compensation components, and timing relationships for the exact -1 orderable part rather than relying on generic DAC family assumptions. This page combines verified catalog data, explicit uncertainty markers, source traceability, and application-focused engineering guidance. It also distinguishes the exact DAC7545KU-1 orderable from related family listings, helping procurement and design teams avoid unsupported drop-in claims while preparing a controlled technical evaluation.

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DAC7611U/2K5

DAC7611U/2K5 - 12-Bit Serial DAC, 5V, SOIC-8 | Texas Instruments

The Texas Instruments DAC7611U/2K5 is a 12-bit serial-input digital-to-analog converter (DAC) with guaranteed 12-bit monotonicity across the industrial temperature range (-40°C to +85°C), supplied in an 8-pin SOIC package and shipped on a 2,500-piece tape-and-reel. A digital-to-analog converter (DAC) is a data-conversion integrated circuit that translates a binary digital word into a proportional analog voltage or current. The DAC sits within the broader data-converter IC family, which also includes analog-to-digital converters (ADCs); both are essential building blocks of mixed-signal systems that bridge the real-world analog domain and digital processors. The DAC7611 belongs to the low-power, single-channel, voltage-output, serial-interface sub-category used in compact, microprocessor-controlled designs. Key specifications include 12-bit resolution, 1 mV per LSB step size with a 4.095 V full-scale range, and 7 µs settling time to within 1 LSB for a full-scale step. The device integrates an input shift register, latch, 2.435 V internal reference, R-2R DAC core, and high-speed rail-to-rail output amplifier on a single die. A 3-wire serial interface operates to a 20 MHz clock. Asynchronous reset clears the output to zero scale without requiring a serial write. The architecture uses an R-2R ladder network driven by a precision bandgap reference and a 5 V single supply. The internal reference is laser-trimmed for low drift, and the rail-to-rail output stage swings within millivolts of either supply rail, eliminating the need for a negative supply in unipolar systems. Power consumption is 2.5 mW typical (0.5 mA at 5 V), suiting battery-powered instrumentation. Typical applications include industrial process-control analog output modules, programmable logic controller (PLC) setpoint generators, digitally controlled calibration sources, portable test equipment, and closed-loop servo setpoint references. The 4.095 V full-scale range with 1 mV LSB aligns naturally with 0-5 V analog I/O standards used in factory-automation backplanes. When designing with this device, place the 0.1 µF power-supply bypass capacitor as close as possible to the AVDD pin and observe standard SPI-mode timing for SDI, CLK, and /CS. The asynchronous CLR pin overrides any serial write and pulls the output to zero, which is useful for failsafe initialization in safety-critical loops. This page synthesizes distributor pricing, drop-in SOIC-8 alternatives, and PCB-layout design notes that are not consolidated in the manufacturer datasheet.

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DAC80508ZYZFR

DAC80508ZYZFR - 16-Bit 8-Ch SPI DAC | Texas Instruments

The Texas Instruments DAC80508ZYZFR is a true 16-bit, 8-channel, buffered voltage-output digital-to-analog converter (DAC) with an SPI interface, housed in a compact 16-ball DSBGA (WCSP) package measuring only 2.0 mm x 2.0 mm. It operates from a single 2.7-V to 5.5-V supply over -40C to +125C. A digital-to-analog converter (DAC) is a data-converter IC that transforms digital binary codes into analog output voltages, bridging digital processors and the analog world. Within the data-acquisition hierarchy, DACs sit alongside ADCs as core mixed-signal building blocks, and the DAC80508 belongs to the pin-compatible DACx0508 family of 16-, 14-, and 12-bit octal DACs used across industrial and instrumentation systems. Key features include a precision internal 2.5-V reference with 5-ppm/C drift, eliminating external references in most designs, and user-selectable gain configurations delivering full-scale outputs of 1.25 V, 2.5 V, and 5 V. The SPI interface supports data rates up to 50 MHz with daisy-chaining, and an LDAC function enables simultaneous updates of all eight outputs. A power-on reset guarantees zero-scale or mid-scale outputs at startup. Technically, the DAC80508 uses a resistor-string architecture with a per-channel output buffer amplifier, providing excellent linearity, low glitch energy, and the ability to drive capacitive loads directly. Each channel is independently powered down for energy savings in battery-operated instruments. Typical applications include precision test and measurement equipment, industrial process control, motor control systems, and portable instrumentation. Low power consumption and the tiny WCSP footprint suit battery-powered and space-constrained designs. For best performance, decouple VDD with 0.1-uF and 10-uF capacitors close to the pin, bypass the reference with 1 uF, and use a clean analog ground plane with separated digital and analog grounds to minimize noise coupling.

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DAC80508ZYZFT

DAC80508ZYZFT - 16-Bit Octal SPI DAC | Texas Instruments

The Texas Instruments DAC80508ZYZFT is a true 16-bit, eight-channel, buffered voltage-output digital-to-analog converter (DAC) with an SPI interface, housed in a compact 16-ball DSBGA (YZF) wafer-level chip-scale package measuring approximately 2.0 mm x 2.0 mm. It integrates a precision 2.5-V, 5-ppm/C internal reference, eliminating the need for an external precision reference in most designs. A digital-to-analog converter is a data-conversion IC that translates digital binary codes into analog voltages, bridging the digital processor domain and the analog signal domain in mixed-signal systems. The DAC80508 belongs to the pin-compatible DACx0508 family, which spans 16-, 14-, and 12-bit resolution variants within the broader data-acquisition semiconductor hierarchy. Key features include 16-bit resolution with +/-1 LSB INL, a 5-us output settling time, and an internal reference with only 5 ppm/C temperature drift. The device operates from a single 1.7-V to 5.5-V supply, supports SPI clock rates up to 50 MHz, and offers a user-selectable gain configuration delivering full-scale outputs of 1.25 V, 2.5 V, or 5 V with an external reference. A power-on reset clears registers to zero-scale, and per-channel power-down mode reduces current to 0.5 uA per channel for battery-powered designs. Architecturally, the DAC80508 uses a resistor-string (R-2R derived string) core with an output buffer amplifier per channel, ensuring rail-to-rail output swing and low output impedance. The DSBGA-16 package minimizes board area, making it suitable for space-constrained portable equipment and dense multi-channel analog boards. Typical applications include precision instrumentation, industrial process control, motor control loops, and portable medical devices, where the combination of 16-bit accuracy, low drift, and low power is critical. When designing, decouple AVDD and DVDD with 0.1-uF and 1-uF capacitors placed close to the pins, bypass the VREF output with 1 uF, and keep SPI traces short and away from high-speed digital lines to minimize crosstalk.

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الفئات الفرعية

المنتجات (39,000+)

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D32.31301S.001 - 32GB DDR5-4800 ECC UDIMM | Apacer Memory

D32.35303H.001 - 32GB DDR5 ECC UDIMM 5600 VLP | Apacer

DA28F320J5A120 - 32Mbit StrataFlash 5V 120ns 56-SSOP | Intel

DAC-08CQ - 8-Bit High-Speed Multiplying DAC | AMD/Analog Devices

DAC38RF83 - Dual 14-Bit 9-GSPS RF-Sampling DAC | TI

DAC38RF83IAAV - Dual 14-Bit 9-GSPS RF DAC | Texas Instruments

DAC38RF83IAAVR - Dual 14-Bit 9-GSPS RF-Sampling DAC | TI

DAC702KH-2 - 16-Bit DAC, 24-Pin CDIP | Texas Instruments

DAC707KP-4 - 16-Bit DAC | Texas Instruments | Precision Analog

DAC714HB-1 - 16-Bit Serial DAC | Texas Instruments

DAC715UB - 16-Bit Parallel DAC, +10V Ref, 28-SOIC | Texas Instruments

DAC7545KU-1 - 12-Bit Parallel DAC | Texas Instruments | Industrial

DAC7611U/2K5 - 12-Bit Serial DAC, 5V, SOIC-8 | Texas Instruments

DAC80508ZYZFR - 16-Bit 8-Ch SPI DAC | Texas Instruments

DAC80508ZYZFT - 16-Bit Octal SPI DAC | Texas Instruments