PIC24FV16KA301-I/SO
PIC24FV16KA301-I/SO - 16-Bit 32MHz XLP Microcontroller
The Microchip Technology PIC24FV16KA301-I/SO is a 16-bit flash microcontroller with 32 MHz maximum speed, 16 KB of program memory, and 2 KB of RAM in a 20-pin SOIC package. It includes 17 I/O pins, a 12-bit ADC, 512 bytes of EEPROM, and nanoWatt eXtreme Low Power technology for battery-powered and power-constrained products.
A 16-bit flash microcontroller combines a dedicated RISC core, integrated data memory, programmable peripherals, and on-chip program memory in one device. The PIC24F architecture belongs to the broader embedded-controller hierarchy: microcontroller, embedded processor, semiconductor, and system-on-chip design. This combination allows control, analog measurement, communications, and low-power management functions to share a compact, cost-effective platform.
The principal features include 16 KB of program memory organized as 5.5K × 24 words, 2K × 8 bits of RAM, 32 MHz operation, and 17 available I/O positions. A 12-bit ADC supports analog measurements, while 512 bytes of EEPROM preserve small amounts of nonvolatile configuration or calibration data. The XLP feature set includes peripherals that continue operating in Deep Sleep mode, including DSBOR, DSWDT, and RTCC functionality.
Microchip positions the PIC24FV16KA301 family for 2.5 V, 3.3 V, and 5 V designs. Internal fast-start oscillator options reduce external clock requirements in cost-sensitive systems. The 20-pin SOIC package provides a conventional leaded footprint suitable for through-hole assembly, prototyping, and industrial control products where component availability and inspection are important.
Typical applications include battery-operated sensors, compact industrial monitors, building-control endpoints, low-power data loggers, and embedded control modules. The 12-bit ADC supports analog sensor interfaces, while the 17 I/O pins provide connections for digital inputs, outputs, communications, and control signals. The combination of flash memory, EEPROM, XLP peripherals, and a small package makes the device useful where board area and standby power are constrained.
Designers should verify the exact pin functions, alternate-function selections, clock configuration, and decoupling requirements in the manufacturer datasheet before laying out the PCB. Pay particular attention to voltage-domain limits and the operating mode assigned to unused I/O pins. For designs based on a different package, do not reuse the PCB footprint without checking lead spacing and exposed-pad requirements.
This product record combines core device specifications, verified package information, practical application guidance, and an assessment of drop-in replacement options. It highlights where the PIC24FV16KA301-I/SO fits in low-power embedded systems and which functional and package differences must be reviewed before substituting another MCU.
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