EPF10K130EFC484-1 Complete Guide: Specs, Pricing, Alternatives & Design-In Notes (Intel/Altera FLEX-10KE FPGA)

EPF10K130EFC484-1 Complete Guide: Specs, Pricing, Alternatives & Design-In Notes (Intel/Altera FLEX-10KE FPGA)
EPF10K130EFC484-1: 130K-gate FLEX-10KE FPGA, 6,656 LEs, 369 I/Os, FBGA-484, 2.5 V core. In stock at XAIPART from $92 at 1K pcs as of 2026-09-12.

The Intel (formerly Altera) EPF10K130EFC484-1 is a FLEX-10KE family SRAM-based FPGA delivering 130,000 typical gates, 6,656 logic elements, 832 logic array blocks, and 65,536 bits (64 Kbit) of embedded array block (EAB) memory in a 484-ball FineLine BGA package measuring 23 x 23 mm with a 1.0 mm ball pitch. It runs from a 2.5 V core supply with MultiVolt I/O (3.3 V, 2.5 V, 1.8 V, and 5.0 V tolerant), reaches a maximum frequency of 333.33 MHz, offers 369 user I/O pins, and supports in-system configuration via JTAG (IEEE 1149.1 / IEEE 1532). The device operates across the commercial 0°C to +70°C range. As of 2026-09-12, XAIPART lists 99,999 units in stock with MOQ 1, priced from $92 at 1,000-piece quantity up to $145 at single-piece quantity. Note that the part is marked obsolete / end-of-life by third-party lifecycle trackers, so availability depends on legacy distributor inventory — secure your allocation early. This guide consolidates verified specifications, design-in practices, drop-in alternatives, and sourcing data into one authoritative resource for engineers maintaining FLEX-10KE-based systems.

EPF10K130EFC484-1

What Is the EPF10K130EFC484-1 and What Does It Deliver?

The EPF10K130EFC484-1 belongs to the FLEX-10KE family, Altera's first embedded programmable logic family offering System-on-a-Programmable-Chip (SOPC) integration through embedded array blocks (EABs) that combine LUT-based logic with dedicated dual-port RAM. Architecturally, the device uses the FastTrack Interconnect — a continuous routing architecture that provides predictable timing across all logic and routing paths.

Key architecture facts, all verified from the FLEX-10KE datasheet and XAIPART database:

  • Logic capacity: 130,000 typical gates, 6,656 logic elements, 832 LABs.
  • Embedded memory: 65,536 bits (64 Kbit) of EAB RAM, organized as 4096-bit blocks usable for FIFO buffers, register files, and look-up tables.
  • I/O: 369 user I/Os with MultiVolt support (3.3 V, 2.5 V, 1.8 V) and 5.0 V tolerance.
  • Timing: 333.33 MHz maximum frequency and 0.6 ns propagation delay on the -1 speed grade — the slowest commercial bin in this family, optimized for cost-sensitive designs.
  • Package: FBGA-484 (484-ball FineLine BGA), 23 x 23 mm, 1.0 mm ball pitch, surface mount.
  • Process: CMOS logic family; the 'C' in the part number designates the commercial temperature grade (0°C to +70°C).

Because configuration data resides in SRAM cells, the device must be reconfigured on every power-up unless external configuration memory is used — a defining characteristic of the FLEX-10KE family that shapes your board-level design decisions.

How Do You Design In the EPF10K130EFC484-1? A Practical Technical Guide

Power Supply Architecture

The EPF10K130EFC484-1 requires two regulated rails: VCCINT at 2.5 V for internal logic and VCCIO at 3.3 V typical for I/O banks (per the FLEX-10KE datasheet). Design the decoupling network with 0.1 µF ceramic capacitors placed as close as possible to each supply pin, plus a 33 µF bulk capacitor near the package. Keep the 2.5 V core rail regulated separately from the I/O rail; do not share regulators between VCCINT and VCCIO without verifying sequencing requirements in the datasheet. [VERIFY_NEEDED: power-supply sequencing requirements for FLEX-10KE devices]

Configuration Scheme

The device supports four configuration modes via dedicated pins (nCONFIG, nSTATUS, CONF_DONE, MSEL): Passive Serial (PS), Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), and JTAG. Because the fabric is SRAM-based, plan for reconfiguration on every power-up:

  • Use JTAG (IEEE 1149.1) for in-system programming and field upgrades without removing the part from the board.
  • Match your configuration scheme to the board's pull-up topology on nCONFIG, nSTATUS, and CONF_DONE — mismatched pull-ups are a common cause of failed configuration cycles.
  • For autonomous power-up configuration, pair the FPGA with external configuration memory. [DATA_NEEDED: compatible configuration PROM part numbers]

I/O Planning and MultiVolt Interfaces

With 369 user I/Os, the EPF10K130EFC484-1 excels at parallel bus architectures: 32-bit PCI address/data plus control, TDM telecom buses, and wide legacy backplanes. MultiVolt I/O lets you connect directly to 3.3 V PHY devices and 5.0 V backplane logic without external level shifters. When planning pin assignment, remember that FLEX-10KE devices in the same 484-pin FineLine BGA package are pin-compatible (SameFrame), but I/O counts differ between family members — restrict signal placement to I/O pins common to all potential migration targets to preserve drop-in flexibility.

Development Tools

Use Altera's legacy Quartus II development tools for compilation and pin planning; the Quartus II pin planner supports this device family and provides the FBGA-484 ball-by-ball breakout with pin A1 at the index marker.

Thermal and Layout Notes

The FBGA-484 footprint of 23 x 23 mm with 1.0 mm ball pitch suits high-density control boards. Follow standard FineLine BGA layout practice: fanout via dogbone or via-in-pad patterns at 1.0 mm pitch, and verify reflow profiles against your board house's BGA capability. [VERIFY_NEEDED: specific thermal resistance (θJA/θJC) values for FBGA-484]

Which Components Can Replace the EPF10K130EFC484-1?

Drop-in alternatives must share the FBGA-484 footprint and SameFrame pin compatibility. Based on verified database data, these variants qualify:

ParameterEPF10K130EFC484-1EPF10K130EFC484-1NEPF10K130EFC484-1XEPF10K130EFC484-2X
Package / FootprintFBGA-484, 23 x 23 mmSame FBGA-484 footprintSame FBGA-484 footprintSame FBGA-484 footprint
Speed Grade-1-1 (identical electrical specs)-1 (identical electrical specs)-2 (faster)
Finish / ScreeningStandard commercialLead-free (Pb-free) finishExtended / customer-specific screening-2 speed grade plus extended screening
Pin CompatibilityReferencePin-to-pin compatibleIdentical pinoutPin-to-pin compatible
Best UseCost-sensitive baselineRoHS/restricted-substance-driven buildsPrograms requiring special screeningDesigns needing faster timing without PCB rework

Selection guidance: Choose the -1N if your compliance program requires lead-free finishes; choose the -1X for extended screening; choose the -2X when timing margins on the -1 bin are insufficient but you must keep the existing PCB. The EPF10K100EFC484-1 (100,000 gates, 4,992 logic elements, same FBGA-484 package) also serves as a SameFrame-compatible lower-density option per the verified FAQ data — see the EPF10K130EFC484-1 product page for current stock on all variants. For modern redesigns, Cyclone III or Cyclone IV devices are candidates, but these require PCB rework and are not drop-in replacements.

Where Is the EPF10K130EFC484-1 Used? Real Application Scenarios

Verified application data from the XAIPART database maps the part to six principal scenarios:

  • Industrial control systems: The 6,656 logic elements and 369 user I/Os enable parallel interfacing to legacy 32-bit buses, encoder counters, and discrete I/O without external glue logic; MultiVolt I/O simplifies integration with mixed-voltage industrial peripherals.
  • Telecommunications line cards: The 65,536-bit EAB implements small FIFOs and buffer tables for serial-protocol framing, while SRAM-based configuration supports field upgrades via JTAG as protocols evolve.
  • PCI bus interface bridging: The 369 user I/Os carry a 32-bit PCI address/data bus plus control signals, integrating bridge, arbiter, and interrupt controller in a single FBGA-484 device at 33 MHz PCI operation.
  • Custom ASIC prototyping: 6,656 logic elements and 64 Kbit of embedded memory map early-stage ASIC RTL; the 0.6 ns propagation delay and 333.33 MHz maximum frequency approximate typical 0.25 µm ASIC library timing before tape-out.
  • Legacy DSP pre-processing: 832 LABs of fast combinational logic plus EAB coefficient storage handle FIR filter pre-stages; MultiVolt I/O bridges 5 V DSP peripherals to 3.3 V DSP cores without level shifters.
  • High-density glue logic integration: Replaces dozens of 74-series chips, consolidating address decoding, bus arbitration, wait-state generation, and interrupt prioritization into one device, with late-stage design changes via JTAG reducing respin costs.

What Does the EPF10K130EFC484-1 Cost and How Available Is It?

As of 2026-09-12, XAIPART pricing for the EPF10K130EFC484-1 follows these verified tiers:

QuantityUnit Price (USD)
1+$145
10+$132
100+$118
500+$105
1,000+$92

Stock stands at 99,999 units with MOQ 1 as of 2026-09-12. Because third-party lifecycle trackers mark the part obsolete / end-of-life and Intel/Altera discontinued the FLEX-10KE family approximately two decades ago, this inventory represents legacy distributor stock rather than new production. Per verified FAQ data, distributors such as DigiKey, Mouser, Arrow, Heisener, Win Source, and Nantian Electronics also carry listings; lead times range from immediate (same-day at DigiKey per the listing) to 4–8 weeks for larger broker-sourced volumes, and Heisener lists Feb 25 – Mar 2 delivery for sample orders. Pricing fluctuates with obsolete-part scarcity, so request formal quotes from multiple distributors before placing production orders. [DATA_NEEDED: RoHS status — the database field is unfilled; the lead-free -1N variant exists, suggesting the base -1 may be non-Pb-free-finish, but confirm before compliance-critical orders]

What Should Buyers Watch Going Forward?

  • Obsolescence risk dominates: With the family discontinued roughly two decades ago, every purchase is a last-time-buy decision. XAIPART's 99,999-unit stock position (as of 2026-09-12) provides near-term coverage, but budget lifetime buys for multi-year service commitments.
  • Price volatility: The spread from $92 (1K pcs) to $145 (single piece) will likely widen as broker inventory thins. Lock volume pricing now and hedge future spares.
  • Compliance screening: Verify the RoHS status of the standard -1 finish [DATA_NEEDED: RoHS status]; if your build requires Pb-free finishes, the EPF10K130EFC484-1N variant with identical electrical specs is the verified path.
  • Maintain migration headroom: Because SameFrame pin compatibility lets you move between -1, -1N, -1X, and faster -2X grades on the same PCB, design your pin constraints around the common-I/O set to preserve flexibility.
  • Long-term redesign: Anchor your redesign feasibility study to verified specs — 6,656 LEs, 64 Kbit EAB, 369 I/Os, 333.33 MHz — so you can size a modern replacement accurately when the legacy stock is exhausted.

Key Takeaways for Engineers and Procurement Teams

The EPF10K130EFC484-1 remains a workhorse for legacy industrial, telecom, PCI, ASIC prototyping, and DSP-glue designs thanks to its 130,000 gates, 6,656 LEs, 369 I/Os, and 5 V-tolerant MultiVolt I/O. Its FBGA-484 footprint keeps drop-in migration options open across the -1N, -1X, and -2X variants. Given obsolete status, verified stock of 99,999 units at XAIPART (as of 2026-09-12, from $92/pc at 1K quantity) represents a finite resource — evaluate lifetime requirements now, confirm RoHS status for compliance-critical builds, and use SameFrame-compatible pin planning to keep every migration door open. For the full ball map, download the FLEX-10KE Family Data Sheet and use Quartus II's pin planner, or visit the XAIPART product page and browse the FPGA & CPLD category for related devices.

Frequently Asked Questions

The EPF10K130EFC484-1 contains 130,000 typical gates, 6,656 logic elements (LEs), and 832 logic array blocks (LABs). Per the FLEX-10KE family datasheet, it also integrates 65,536 bits of embedded memory (EAB), supporting SOPC integration.
It ships in a 484-ball FineLine BGA (FBGA-484) package measuring 23 x 23 mm with a 1.0 mm ball pitch. The 'C' designates a commercial temperature grade and '484' specifies the ball count.
No. Third-party lifecycle trackers mark it obsolete / end-of-life, and Intel/Altera discontinued the FLEX-10KE family approximately two decades ago. New units are limited to legacy distributor stock.
As of 2026-09-12 at XAIPART, unit price is $145 at qty 1, $132 at 10+, $118 at 100+, $105 at 500+, and $92 at 1,000+. Pricing fluctuates due to obsolete-part scarcity.
Yes. The FLEX-10KE family supports SameFrame pin migration across FBGA-484 packages. Drop-in variants include EPF10K130EFC484-1N (lead-free), -1X (extended screening), and -2X (faster -2 speed grade). Restrict signal placement to I/O pins common to all target devices.
It requires a 2.5 V core supply (VCCINT) and supports MultiVolt I/O for 3.3 V, 2.5 V, 1.8 V, and 5.0 V tolerant interfaces (VCCIO, 3.3 V typical). Separate regulation of the two rails is required.
It supports Passive Serial (PS), Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), and JTAG configuration via dedicated pins (nCONFIG, nSTATUS, CONF_DONE, MSEL). Being SRAM-based, it must be reconfigured on every power-up unless external configuration memory is used.
Drop-in replacements in the same FBGA-484 footprint include EPF10K130EFC484-1N, EPF10K130EFC484-1X, and EPF10K130EFC484-2X, plus lower-density SameFrame-compatible EPF10K100EFC484-1. Cyclone III/IV devices suit modern redesigns but require PCB rework.

Comparison Table

Parameter EPF10K130EFC484-1 EPF10K130EFC484-1N EPF10K130EFC484-1X EPF10K130EFC484-2X
Package FBGA-484, 23 x 23 mm, 1.0 mm pitch Same FBGA-484 footprint Same FBGA-484 footprint Same FBGA-484 footprint
Speed Grade -1 -1 (identical electrical specs) -1 (identical electrical specs) -2 (faster)
Finish / Screening Standard commercial Lead-free (Pb-free) finish Extended / customer-specific screening -2 speed grade plus extended screening
Pin Compatibility Reference Pin-to-pin compatible Identical pinout Pin-to-pin compatible
Typical Use Cost-sensitive baseline builds Compliance-driven Pb-free builds Programs requiring special screening Faster timing without PCB rework

All listed alternatives share the FBGA-484 footprint and are pin-compatible with the EPF10K130EFC484-1; choose -1N for lead-free finish, -1X for extended screening, and -2X for faster -2 speed grade. All values verified from the alternatives table (database).

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Sources & References

  1. EPF10K130EFC484-1 / FLEX-10KE Family Data Sheet — Datasheet, accessed 2026-09-12

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