FPGA ও CPLD
পণ্য (7,100+)
XC7A75T-3CSG324E - Artix-7 210-I/O FPGA | AMD
The AMD XC7A75T-3CSG324E is an Artix-7 field-programmable gate array with 75,520 logic cells, 210 user I/O, and a maximum switching frequency of 628 MHz, supplied in a 324-LFBGA CSPBGA package. Its core voltage range is 950 mV to 1.05 V. The -3 speed designation identifies the performance grade, while the CSG324 suffix identifies the 324-ball package configuration. An FPGA is a reconfigurable digital semiconductor in which programmable logic blocks, memory, and I/O resources implement custom digital systems after fabrication. Artix-7 belongs to the broader FPGA and programmable-logic hierarchy, combining parallel programmable logic with digital signal processing, clock management, block RAM, and high-speed serial transceivers. This makes the device suitable when design flexibility is more important than the power efficiency of a fixed-function ASIC. The XC7A75T provides 75,520 logic cells and 210 I/O in one compact package. Its 628 MHz maximum switching frequency supports demanding control, acquisition, communications, and embedded-processing designs. The 324-LFBGA configuration also exposes substantially more interconnect and I/O resources than the smaller Artix-7 packages, making it appropriate for board-level designs that need multiple high-speed interfaces and external memory connections. The device contains mixed resources rather than only general-purpose gates. Depending on the selected Artix-7 configuration, these can include dedicated block RAM, digital signal processing slices, clock-management resources, and high-speed transceivers. This heterogeneous architecture allows parallel data paths, time-domain functions, packet handling, and control logic to share one programmable device, reducing the number of supporting ICs on a complex board. Typical uses include industrial automation, test and measurement, communication equipment, embedded instrumentation, and high-speed digital control. The 210-I/O count is particularly useful for parallel sensor interfaces, memory buses, board-level control, and multi-channel acquisition. Designers must still account for speed grade, temperature grade, power budgeting, pin constraints, and the high pin count when laying out the BGA PCB. A critical implementation consideration is the CSG324 BGA footprint. Its 0.8 mm ball pitch requires a constrained-layer PCB, precise component placement, appropriate escape routing, and careful via-in-pad or fanout strategy. Power delivery must also support the 950 mV to 1.05 V core range while keeping each supply rail within its published limits. This page combines the verified distributor and manufacturer information for the XC7A75T-3CSG324E with same-package family alternatives, comparison parameters, application guidance, and practical PCB considerations. It distinguishes confirmed values from specifications that still require verification against the complete manufacturer datasheet.
XC7A75T-3FGG484E - Artix-7 FPGA, 75520 Logic Cells, 285 I/O | AMD
The AMD Xilinx XC7A75T-3FGG484E is an Artix-7 field-programmable gate array (FPGA) with 75,520 logic cells, 285 user I/O pins, and a maximum clock frequency of 628 MHz, housed in a 484-ball FBGA (FGG484) surface-mount package. It is built on the 28 nm Xilinx 7 series FPGA fabric, delivering high performance-per-watt logic capacity for cost-sensitive, small form factor designs. An FPGA is a programmable logic device: a semiconductor whose internal array of configurable logic blocks, block RAM, DSP slices, and I/O banks is re-programmed by the user to implement any digital circuit from a hardware description written in Verilog or VHDL. In the product hierarchy, an FPGA sits above a CPLD: FPGAs offer far higher logic density, dedicated hard multipliers, high-speed serial transceivers, and memory resources, while CPLDs are simpler, lower-capacity devices. The Artix-7 family occupies the cost-optimized tier of the Xilinx 7 series, below the Kintex-7 and Virtex-7 performance tiers, and above the small Zynq-7000 SoCs with integrated ARM processors. The "-3" in the part number is the speed grade, indicating the maximum operating performance class of the device, while the trailing "E" designates the extended commercial temperature qualification. The FGG484 package is a 17 x 17 mm, 0.8 mm-pitch flip-chip BGA that supports up to 285 user I/O in the FGG484 configuration. Compared with the larger FGG676 and FF676 packages, FGG484 trades I/O count for a smaller board footprint, which is attractive for compact industrial, communications, and test-and-measurement equipment. Because the device is SRAM-based, configuration data must be loaded at every power-up from a flash PROM, SPI flash, or a host processor such as a Zynq or MicroBlaze. AMD supplies the Artix-7 package pinout files in ASCII and CSV formats per UG475, which are the authoritative reference for board-level symbol generation and ball assignment. Typical applications for the XC7A75T-3FGG484E include industrial Ethernet and serial protocol bridges, data acquisition and control systems, video timing and scaler pipelines, instrumentation and test equipment, and low-cost embedded processing subsystems with an external host processor. Its 484-ball FBGA also makes it a natural fit for multi-die mixed-signal boards where a mid-density FPGA handles protocol conversion and local buffering. A key design consideration is power and thermal budget: a 28 nm Artix-7 device dissipating several watts in a 17 x 17 mm BGA requires careful via-in-pad and copper-pour thermal design on the PCB, and the specified junction temperature limits of the -3E grade must be respected with margin. When a smaller footprint is acceptable, the FGG484 package is often paired with a companion XC7A50T or XC7A35T device on the same board to split protocol and DSP workloads without changing the PCB footprint family. This page consolidates distributor pricing as of 2026-10-30, same-package drop-in alternatives drawn from the Artix-7 and Kintex-7 families, a parameter-by-parameter comparison, and practical board-level design guidance that is not reproduced in the manufacturer datasheet.
XC7A75T-3FGG676E - 75,520-Cell Artix-7 FPGA | AMD
AMD XC7A75T-3FGG676E is an Artix-7 field-programmable gate array with 75,520 logic cells, 28 nm CMOS technology, a 1 V supply, 300 user I/Os, and a 676-pin FBGA package. It combines programmable logic resources with high-speed parallel I/O in a package designated FGG676, supplied in a tray according to the verified distributor data. An FPGA is a programmable logic device in the semiconductor hierarchy. Its configurable logic blocks, block RAM, programmable I/O, and dedicated resources allow engineers to implement digital systems that would otherwise require combinations of fixed-function ICs. Artix-7 belongs to the FPGA and CPLD family of programmable logic devices, positioned between simpler programmable logic and larger system-on-chip devices. The XC7A75T provides 75,520 logic cells and 300 user I/Os. Its 28 nm CMOS process supports a 1 V operating supply, while the -3 ordering designation identifies the performance grade of this device. The FGG676 package provides 676 package balls and, according to the verified source, uses a 1.0 mm ball pitch on a 27 mm square footprint. These characteristics make the device suitable for designs requiring substantial parallel connectivity. The device is intended for industrial, communications, instrumentation, embedded processing, and high-speed digital interface applications. A representative implementation could use configurable logic for protocol conversion, embedded RAM for buffering, and programmable I/O for acquisition or control interfaces. Because the exact resources for each Artix-7 speed and package combination are organized by device variant, engineers should confirm the applicable Artix-7 data sheet and package files during design review. The extended-temperature order suffix E makes this part relevant to designs requiring operation beyond the usual commercial temperature envelope, but the exact junction and ambient limits must be selected from the manufacturer ordering guide. Commercial, industrial, and extended-temperature variants can share a package while differing in qualification and temperature requirements. A critical hardware consideration is that the 676-ball FBGA package has a fine 1.0 mm ball pitch. PCB escape routing must be designed with the manufacturer package symbol, differential-pair geometry, power planes, and via requirements taken directly from the package design files. Thermal performance also depends on multilayer construction, copper distribution, airflow, and the adjacent heat-spreader or thermal-interface strategy. This page consolidates verified package, process, logic-cell, I/O, and sourcing information while explicitly separating unavailable electrical details. It also provides same-family migration comparisons, practical PCB guidance, and a structured selection framework for engineers evaluating the XC7A75T-3FGG676E against other Artix-7 speed, temperature, and package options.
XC7K160T-1FB484I - 162240 Logic Cells Kintex-7 FPGA | AMD
The AMD XC7K160T-1FB484I is a Kintex-7 field-programmable gate array (FPGA) built on 28 nm technology, with 162240 logic cells, 285 I/O pins and a 484-ball FCBGA package. It is designed for high-performance programmable-logic systems that require substantial parallel processing, flexible interface support and deterministic configuration. The -1 speed grade is intended for general-purpose designs requiring reliable performance across industrial temperature conditions. An FPGA is a semiconductor whose logic, I/O and programmable interconnect resources are configured after manufacture. FPGA devices are placed between programmable processors and fixed-function application-specific integrated circuits: they can accelerate parallel algorithms, implement custom interfaces and consolidate multiple functions into one device. The Kintex-7 family combines high-performance programmable logic with advanced serial transceivers, memory resources and general-purpose I/O. The XC7K160T includes 162240 logic cells, 12675 logic cells and programmable blocks according to the product listing, 285 I/O pins and a 1 V core supply. The device is identified as a 484-BBGA, FCBGA package. Its extensive logic capacity makes it suitable for data acquisition, industrial control, communications, signal processing and test systems where parallel data paths or multiple independent functions must operate concurrently. The listed device belongs to the Kintex-7 product family, which is available in -3, -2, -1, -1L and -2L speed grades. The -2L versions are screened for lower maximum static power and can operate at lower core voltages for lower dynamic power than -2 devices. The XC7K160T-1FB484I uses the -1 grade designation, while its “I” suffix identifies the industrial temperature option in the manufacturer’s ordering nomenclature. Typical applications include high-speed data acquisition, industrial automation, communications infrastructure, embedded signal processing, FPGA-based accelerator boards and high-resolution control systems. The 285 available I/O pins also make the device useful for systems combining wide parallel buses with high-speed serial links. PCB implementation should preserve the exact 484-ball FCBGA footprint, power and ground distribution, decoupling, configuration interface and high-speed routing. Because the package contains many balls and a large FPGA configuration context, the layout should be reviewed against the manufacturer’s pinout, power guidance and design-assistance recommendations before fabrication. This product record combines the exact configuration, package and logic-density information with practical engineering guidance, qualified same-footprint alternatives and a parameter comparison. It is intended to accelerate component selection and board planning for engineers designing with the Kintex-7 XC7K160T platform.
XC7K160T-1FB676I - Kintex-7 162240-Cell FPGA | AMD
The AMD Xilinx XC7K160T-1FB676I is a Kintex-7 field-programmable gate array built on 28 nm technology, with 162,240 programmable logic cells, 400 user I/O, and a 676-ball FCBGA package. The -1 speed grade supports demanding programmable-logic, DSP, and high-speed interface designs, while the industrial-temperature suffix identifies the XC7K160T-1FB676I as an industrial configuration. Its 676-pin FCBGA package supports dense board-level integration without changing the footprint to a leaded or smaller BGA package. A Kintex-7 FPGA belongs to the programmable-logic hierarchy: field-programmable gate array, FPGA, programmable-logic device, and semiconductor. Unlike a fixed-function ASIC or microcontroller, an FPGA combines configurable logic blocks, programmable interconnects, block RAM, DSP resources, and selectable I/O standards on one device. This makes the family useful when hardware architecture must be updated after design entry, when parallel processing is required, or when product variants share a common board design. The XC7K160T combines 162,240 logic cells with 400 user I/O in the 676-BBGA FCBGA package. The 28 nm process technology supports a compact, high-performance implementation, and the listed 1 V core supply is a key constraint for power planning and configuration. The -1 speed designation places the device in the Kintex-7 performance range identified alongside the -3, -2, -1L, and -2L grades. Design engineers must treat this BGA package as a high-speed, multi-supply design rather than a simple two-rail component. Signal-integrity analysis, simultaneous switching-noise control, plane splitting, and thermal management become essential because the device concentrates many programmable and high-speed resources into one package. Configuration storage, startup sequencing, clocking, and power estimation should be evaluated together before schematic capture. Typical applications include industrial control and automation, communications infrastructure, test and measurement, high-speed signal processing, embedded imaging, and aerospace or defense systems requiring programmable logic. The 400 available I/O is particularly useful for parallel sensor acquisition, control interfaces, memory buses, clock distribution, and multiple communication links implemented in programmable logic. For a new design, use the AMD Kintex-7 data sheet and package files to establish the exact pinout, differential-pair rules, power rails, and PCB stack-up. Treat any board migration to another 676-ball package variant as requiring a formal ball-map, power, timing, and signal-integrity review rather than an assumption of interchangeability. This product record combines the verified device identity, package information, speed and temperature distinctions, same-footprint alternatives, comparison parameters, and practical FPGA design guidance to support component selection and PCB planning without relying on generic FPGA assumptions.
XC7K160T-1FF676C - 162240-Cell Kintex-7 FPGA | AMD
The AMD/Xilinx XC7K160T-1FF676C is a Kintex-7 field-programmable gate array with 162,240 logic cells, 28 nm process technology, and a 676-ball FCBGA package. It is the -1 speed-grade, commercial-temperature member of the XC7K160T device family, combining programmable logic, fixed resources, memory, and high-speed I/O in one package. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be configured after fabrication. FPGAs occupy the hierarchy between programmable logic devices and application-specific integrated circuits. Unlike a fixed-function ASIC, an FPGA permits design changes, hardware acceleration, and product differentiation without fabricating a new custom chip. The Kintex-7 family balances substantial logic capacity with high-speed serial, parallel, and memory interfaces. The XC7K160T configuration provides 162,240 logic cells and 12,675 configurable logic blocks according to the device listing and family comparison material. A 1.096 GHz-class maximum clock figure is associated with the -1FFG676I ordering information, while the target part uses the -1 speed grade. Its 676-ball FCBGA package supports dense board-level integration, and the listed 400-user I/O count supports parallel digital connectivity. Exact I/O standards and performance depend on the selected bank voltage and the FPGA configuration. The 28 nm Kintex-7 architecture is intended for designs requiring substantial parallel processing without the cost and schedule of a custom ASIC. Programmable logic can implement protocol handling, packet processing, data acquisition, control, or test logic, while dedicated hard resources support clocking, memory, and high-speed serial communication. Designers can evaluate different clock rates and pin assignments before committing a final bitstream, making the device suitable for both prototype development and production control systems. Typical uses include industrial machine vision, communications infrastructure, test and measurement, radar or signal processing, high-speed data acquisition, and embedded video processing. The large logic inventory is especially useful for parallel datapaths that would otherwise require several smaller programmable devices. System partitioning should account for clocking, memory bandwidth, serial transceiver requirements, power budget, and PCB-routing constraints. A critical design consideration is that FCBGA assembly requires a dense, multilayer PCB with short, impedance-controlled escape routes and carefully planned power and ground planes. Decoupling, simultaneous-switching-noise control, thermal management, and BGA assembly capability can determine whether the FPGA achieves its intended performance. The -1 speed grade should be matched to timing constraints without assuming that a higher-grade alternative is necessary. This page combines the exact XC7K160T-1FF676C package identity with practical ordering guidance, same-package Kintex-7 alternatives, parameter comparisons, and design-focused selection criteria. It also distinguishes genuine drop-in options from device names that use a different package or ball map and therefore require PCB-level qualification.
XC7K160T-1FF676I - 162,240-Cell Kintex-7 FPGA | AMD
The AMD XC7K160T-1FF676I is a Kintex-7 field-programmable gate array with 162,240 logic cells, 250 user I/Os and a 676-ball flip-chip BGA package, built on a 28 nm CMOS process. The device uses the -1 speed grade and an industrial-temperature designation, making it suitable for high-throughput signal processing, programmable logic, connectivity and embedded control systems. A Kintex-7 FPGA is a reprogrammable semiconductor containing configurable logic blocks, programmable I/O, block RAM, DSP slices, clock-management resources and high-speed transceivers. Within the FPGA hierarchy, the XC7K160T occupies the middle of AMD's Kintex-7 range: it provides substantially more parallel processing capacity than entry-level Artix-7 devices while supporting high-speed serial connectivity and clocking functions. Key characteristics include 162,240 logic cells, approximately 250 user I/Os and 1,2675 CLBs as identified in the device listings. The -1 performance grade targets cost-sensitive applications that do not require the highest -2 or -3 speed grades. The -2 and -3 grades offer additional timing margin, while the -1 grade is appropriate when system timing closes with moderate design margins. The device combines programmable digital logic with DSP48 resources and dedicated memory blocks for filtering, modulation, waveform generation, packet processing and accelerator functions. AMD documentation identifies the Kintex-7 family as optimized for price-performance, with the 676-ball package supporting dense board-level integration where high pin count and robust interconnect access are important. Typical uses include telecommunications line cards, industrial networking, radar and signal-processing subsystems, high-speed data acquisition, video infrastructure, test equipment and aerospace-grade embedded processing. Industrial temperature screening makes the -1FF676I option relevant to equipment expected to operate in extended commercial environments. For a new PCB, use the manufacturer's package pinout, escape-routing guidance and power-supply recommendations rather than inferring connections from board-to-board-migration examples. The 676-ball package requires careful ball-grid-array escape routing, and the device's numerous high-speed I/Os make return paths, reference planes and via transitions important to signal integrity. This page consolidates the verified device identity, package and resource data, drop-in-compatible Kintex-7 options, engineering selection criteria and practical design notes into a single engineering reference. It also distinguishes exact package and speed-grade substitutions from parts that require a different PCB land pattern.
XC7K160T-2FB484I - Kintex-7 FPGA, 162240 Logic Cells, 484-FCBGA | AMD
The AMD Xilinx XC7K160T-2FB484I is a Kintex-7 field programmable gate array (FPGA) built on a 28 nm process, providing 162240 programmable logic cells, 285 I/O, and 11980800 bits of block RAM in a 484-ball FCBGA (FB484) surface-mount package. The -2 speed grade and industrial temperature qualification make it the mid-density option in the Kintex-7 family for signal processing, high-speed serial links, and general-purpose logic acceleration. A field programmable gate array is a reconfigurable digital integrated circuit whose interconnect and logic blocks are defined by a bitstream loaded at configuration time. Within the semiconductor hierarchy, an FPGA sits above programmable logic devices and below application-specific ICs, offering a middle ground between fixed-function ASICs and low-density CPLDs: the flexibility of software-programmable hardware with the density, clocking, and I/O bandwidth of a full SoC-class device. Key features of this device include the 28 nm 7-series fabric, 162240 logic cells, and a 484-FCBGA package with a 1 V nominal core supply. The -2 speed grade is the balanced performance grade in the Kintex-7 lineup, positioned between the entry -3 and -1 grades and the highest-performance -1L and -2L grades, which are screened for lower static power. Kintex-7 devices support high-speed serial transceivers, clock management, block RAM, and DSP slices for filtering and fixed-point arithmetic. Because the FB484 package is a dense flip-chip BGA on a 1.0 mm ball pitch, this device is intended for multilayer PCB designs with careful via-in-pad and power-plane planning. Decoupling must scale with the number of simultaneously switching I/O, and dedicated configuration, VCCINT, VCCAUX, and VCCBRAM rails each need their own filtering network. Typical applications include radar and sonar signal processing, high-speed data acquisition, industrial vision, test and measurement instrumentation, network interface equipment, and digital broadcast infrastructure. Kintex-7 devices are also common in aerospace, defence, and communications payloads where the industrial-grade screening and deep toolchain support matter. When planning a design, confirm the pinout and package ball assignment in the manufacturer package files, keep the VCCO supply within the I/O standard voltage range of each bank, and reserve a dedicated configuration memory interface for parallel or serial bitstream loading. This page consolidates distributor availability, package details, and drop-in alternatives together with practical design guidance that is not collected in a single datasheet. Key engineering decisions on this device center on density, package choice, and lifecycle. The 484-FCBGA footprint offers more I/O and routing headroom than smaller packages in the family but demands a laminate design with strict impedance control and a large ball escape array. Designers moving between Kintex-7 devices should confirm ball map compatibility before committing a layout, since the Xilinx package files are the authoritative source for pin assignment. The XC7K160T-2FB484I is listed as an active part, and its -2 grade and industrial rating make it the default selection for mid-density Kintex-7 designs that need more than a CPLD but do not require an UltraScale device.
XC7K160T-2FB676I - 162240-Cell -2 Kintex-7 FPGA | AMD
The AMD XC7K160T-2FB676I is a Kintex-7 field-programmable gate array with 162240 programmable logic cells, 400 I/O, and a 676-pin FCBGA package. It is built on 28 nm FPGA technology, operates from a 1 V core supply, and carries the -2 performance speed grade for demanding programmable-logic, communications, signal-processing, and embedded-systems designs. A field-programmable gate array is a reconfigurable digital semiconductor that combines programmable logic blocks, block RAM, programmable input/output resources, dedicated processing resources, and programmable interconnect. Within the semiconductor hierarchy, an FPGA sits above fixed-function logic and provides hardware customization through configuration bitstreams. This makes an FPGA useful when a design needs parallel processing, high I/O density, deterministic digital interfaces, or field-updatable behavior. The XC7K160T belongs to the Kintex-7 family and is identified by the -2 speed grade. Its 162240-cell architecture provides substantial logic capacity, while 400 I/O support interfaces to external memory, transceivers, converters, network controllers, and test equipment. The 1 V core supply and 28 nm process generation place the device between general-purpose programmable logic and larger, higher-cost Kintex designs that require more resources or greater I/O bandwidth. The 676-pin FCBGA package supports dense board layouts and high pin availability, but it also demands careful ball assignment, multilayer PCB construction, and controlled power delivery. Unlike a small serial FPGA, this device supports a broad mix of parallel and serial connectivity. Its industrial-temperature suffix identifies it for applications requiring operation across an extended environmental range, while the -2 grade provides a defined performance class within the Kintex-7 portfolio. Typical uses include industrial control systems, high-speed data acquisition, video and image processing, communications infrastructure, test and measurement equipment, and embedded signal-processing platforms. A video-processing design can use parallel logic for pixel pipelines and block RAM for line buffering. A communications design can partition serial transceivers, clocks, protocol logic, and supervisory functions across the programmable fabric while retaining the flexibility to update the bitstream during product maintenance. PCB design should begin with the manufacturer’s package pinout and power requirements rather than treating all 676 balls as interchangeable. Separate clean and noisy supplies, place decoupling capacitors close to their associated supply balls, provide adequate via arrays beneath the BGA, and preserve high-speed return paths. Configuration storage, programming access, and a recovery strategy must also be planned because an FPGA depends on a valid bitstream before its configured logic becomes operational. This product page combines the Kintex-7 device identity, package information, parameter-level comparisons, replacement guidance, and engineering design notes. It helps engineers distinguish speed-grade and package-suffix changes before committing to a 676-ball board design, while directing procurement requests through the Request a Quote form on this page.
XC7K160T-2FF676C - 162K Kintex-7 FPGA | AMD/Xilinx
The AMD/Xilinx XC7K160T-2FF676C is a Kintex-7 field-programmable gate array built on 28 nm FPGA technology, with 162,240 logic cells, 400 user inputs/outputs, a 1 V operating core voltage, and a 676-pin FCBGA package. It combines programmable logic, configurable I/O, embedded memory, DSP processing resources, dedicated clocking, and high-speed serial transceivers in one device. An FPGA is a semiconductor whose digital circuit is defined after manufacture by loading a configuration bitstream. Within the broader semiconductor hierarchy, an FPGA is a programmable-logic IC and a field-programmable gate array. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed for protocol bridging, parallel processing, signal acquisition, control logic, or other system functions, while its 676-ball package provides a high-density connection interface to external memory, converters, transceivers, and clock sources. The Kintex-7 family combines programmable logic with dedicated hardware for DSP and serial connectivity. The XC7K160T-2FF676C provides 162,240 logic cells and 400 user I/O in an FCBGA-676 package. Its 28 nm process technology supports a 1 V core operating voltage, while the 676-contact package supports dense board-level interconnect. The device is identified by the XC7K160T family, -2 performance suffix, and the FF676C package and commercial-grade ordering suffix. Because this is an FPGA rather than a fixed-function converter or processor, its implemented performance depends on the configuration, logic mapping, memory organization, clocking scheme, and external circuitry. The -2 ordering code denotes a specific performance grade within the Kintex-7 ordering system. Designers should use the device documentation and the pinout associated with the exact order code when assigning power rails, clock inputs, configuration pins, high-speed transceiver pins, and general-purpose I/O. Typical applications include high-speed interface aggregation, network equipment, industrial control and test systems, signal-processing platforms, embedded vision, communications infrastructure, and FPGA-based accelerators. The large logic capacity is useful when a design combines parallel datapaths with serial links, while the 400 user I/O allows external memory and multiple peripheral interfaces to be connected without a separate programmable-logic device. PCB design requires close attention to the FCBGA ball map, multilayer escape routing, power-plane integrity, decoupling, thermal management, and high-speed clock and transceiver layout. The 676-pin package does not match the available package-diagram library, so use the official package drawing and pin table for land-pattern and routing work. Confirm the exact suffix interpretation and temperature grade against the manufacturer ordering guide before release. This product record combines device specifications, package details, practical design guidance, and same-family replacement comparisons. It also distinguishes directly relevant package and speed-grade options from alternatives that require a different footprint, helping engineers narrow a replacement search without assuming that every Kintex-7 ordering code is interchangeable.
XC7K160T-2FF676I - 162K Kintex-7 FPGA | AMD Xilinx
AMD Xilinx XC7K160T-2FF676I is a Kintex-7 field-programmable gate array with 162,240 logic cells, 250 user I/Os, a maximum clock frequency of 710 MHz, and a 676-ball FCBGA package. The -2 speed grade targets designs requiring a balance of performance, power consumption, and design flexibility across industrial, communications, instrumentation, and embedded processing systems. A field-programmable gate array is a semiconductor whose digital logic can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, block RAM, DSP arithmetic resources, clock-management circuits, and high-speed serial transceivers. This architecture allows parallel processing, hardware acceleration, protocol bridging, and deterministic control functions to be consolidated into one device rather than implemented across multiple fixed-function chips. The XC7K160T belongs to the Kintex-7 family and provides 162,240 logic cells with a stated maximum operating frequency of 710 MHz. Its 250 I/Os support connection to external memory, high-speed interfaces, control signals, clocks, and data converters. The 676-ball FCBGA package also exposes the device's high-speed I/O and configuration resources, while its fine-pitch ball pitch makes careful PCB layout, thermal management, and assembly process control essential. The -2 suffix identifies the device speed grade. Compared with a -1 part, the -2 grade provides a higher performance level; a -3 grade is faster still. Core-voltage information associated with this device lists an operating range of 970 mV to 1.03 V. Because Kintex-7 devices contain configurable power-management features, actual rail requirements and current depend on the selected logic, memory interfaces, transceivers, I/O standards, clocking, and utilization reported by the implementation tools. Typical uses include industrial control, communications infrastructure, test and measurement, high-speed data acquisition, signal processing, network equipment, and embedded systems that benefit from parallel programmable logic. The large logic capacity supports parallel datapaths, protocol state machines, packet processing, and custom accelerator pipelines. Integrated block RAM and DSP resources can reduce reliance on external components when the design maps efficiently onto the FPGA architecture. When laying out a board around this FCBGA device, follow the manufacturer pinout, power-plane, decoupling, and high-speed-interface guidance exactly. Provide continuous supply planes, place bypass capacitors at the relevant power balls, route clock and differential pairs with controlled impedance, and confirm the assembly process supports the package geometry. Check worst-case junction temperature, configured transceivers, I/O standards, and core utilization before approving the power budget. This product record combines the exact manufacturer-family parameters, package information, speed-grade references, drop-in candidates, and engineering guidance needed to evaluate a board-level migration. It emphasizes where an alternate speed grade changes performance, where package suffixes require procurement review, and which design constraints remain unchanged when the FPGA itself is replaced.
XC7K160T-2FFG676I - Kintex-7 FPGA 162K Logic Cells | AMD
The AMD XC7K160T-2FFG676I is a Kintex-7 family Field Programmable Gate Array (FPGA) delivering 162,240 logic cells, 400 user I/Os, and 11,980,800 bits of block RAM in a 676-ball FCBGA package. It operates over the industrial temperature range of -40°C to +100°C and is lead-free / RoHS compliant. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the designer after manufacturing, enabling custom digital logic implementations without the cost and lead time of ASIC development. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which range from simple CPLDs to high-capacity FPGAs, and are essential in applications requiring parallel processing, rapid prototyping, and field-updatable hardware. Key features of the XC7K160T-2FFG676I include the -2 speed grade, which balances performance and power consumption, and the FFG676 package that supports easy migration between Kintex-7 family members. The device provides 400 user I/Os, 10 clock management tiles (CMTs) with MMCM and PLL, and 600 DSP slices for high-throughput signal processing. Its 36 Kb block RAM blocks total 11,980,800 bits, enabling substantial on-chip data storage. Architecturally, the Kintex-7 series is built on a 28 nm high-k metal gate (HKMG) process, offering a strong balance of performance, power, and cost. The -2 speed grade provides a middle ground between the higher-performance -3 and the lower-power -1L/-2L variants. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and HSTL, and includes integrated PCIe, Gigabit transceivers, and DDR3/DDR4 memory interfaces. Typical applications include high-performance signal processing, software-defined radio, medical imaging, aerospace and defense systems, and wired communications. The 400 I/Os and 162K logic cells make it suitable for complex digital designs requiring substantial parallel processing and connectivity. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate thermal vias and a solid ground plane to ensure reliable operation at industrial temperatures.
XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD
The AMD XC7K160T-3FFG676E is a high-performance Kintex®-7 Field Programmable Gate Array (FPGA) from the Kintex-7 family, fabricated on a 28nm process technology. It features 162,240 logic cells, 400 user I/O pins, and 11,980,800 bits of block RAM, all housed in a 676-ball FCBGA (27x27mm) package. This device is the -3 speed grade, the highest performance option in the Kintex-7 lineup, offering maximum clock frequencies and throughput for demanding applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike fixed-function ASICs, FPGAs contain a fabric of programmable logic blocks, interconnects, and I/O elements that can be reprogrammed in the field, making them ideal for prototyping, high-performance computing, and applications requiring hardware flexibility. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for accelerating workloads that benefit from parallel processing. Key features of the XC7K160T-3FFG676E include 400 user I/O pins supporting various I/O standards, 11,980,800 bits of block RAM for on-chip data storage, and 400 DSP slices for high-speed digital signal processing. The -3 speed grade provides the highest performance, with internal clock speeds exceeding 600 MHz. The device also supports PCIe® Gen2, Gigabit Ethernet, and other high-speed serial transceivers, making it suitable for a wide range of communication and processing tasks. Technically, the Kintex-7 family is optimized for best price-performance, offering a 2X improvement over the previous generation. The 28nm high-k metal gate (HKMG) process technology enables low power consumption while maintaining high logic density. The device includes advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation, and supports partial reconfiguration for dynamic logic updates. Typical applications include software-defined radio (SDR), medical imaging, aerospace and defense systems, and high-performance computing. The XC7K160T-3FFG676E is particularly well-suited for applications requiring high-speed data processing, such as radar signal processing and video/image processing, where its combination of logic density, DSP capability, and high-speed transceivers provides a competitive advantage. When designing with this device, ensure proper power supply decoupling on VCCINT, VCCAUX, and VCCO rails, and follow AMD's recommended PCB layout guidelines for high-speed signals. The device requires a 1.0V core voltage (VCCINT) and supports various I/O bank voltages (VCCO) depending on the interface standard.
XC7K325T-1FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
The AMD XC7K325T-1FBG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) built on 28nm technology, offering 326,080 logic cells and 400 user I/Os in a 676-ball FCBGA package. It operates from a 1.0V core voltage and supports mainstream standards like PCIe, making it a cost-effective choice for high-bandwidth applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit between ASICs (application-specific) and microprocessors (fixed-function) in the design hierarchy, offering reconfigurability and parallel processing. The Kintex-7 family is optimized for price/performance/watt, balancing logic density, DSP capability, and transceiver performance for mid-range to high-end applications. Key features include 400 I/O pins, 16,404,480 bits of block RAM, and 326,080 logic cells. The device supports multiple speed grades (-1, -2, -3) and includes hardened blocks for PCIe, Gigabit Ethernet, and DDR3 memory controllers. The 676-ball FCBGA package provides excellent thermal and electrical performance for high-speed designs. Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with dedicated carry chains, DSP48E1 slices for multiply-accumulate operations, and configurable block RAM. The device integrates Clock Management Tiles (CMTs) with MMCM and PLL for precise clock generation. The 28nm HPL process enables low static power while maintaining high performance. Typical applications include software-defined radio, high-performance computing, video processing, and aerospace/defense systems. The device's high DSP ratio and transceiver capabilities make it ideal for signal processing and data acquisition. Its support for PCIe Gen2 and DDR3 simplifies system integration. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The core voltage must be maintained within 0.97V to 1.03V, and the FCBGA package requires a proper thermal solution for high utilization designs.
XC7K325T-1FF676I - Kintex-7 FPGA 326K Logic Cells | AMD
The AMD XC7K325T-1FF676I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It features 326,080 logic cells, 400 I/O pins, and 16,404,480 bits of block RAM, all housed in a 676-ball FCBGA package. This device operates with a core voltage of 1V and supports a wide range of I/O standards, making it suitable for demanding applications in aerospace, defense, automotive, and industrial sectors. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be reprogrammed to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are part of the semiconductor integrated circuit family. This flexibility allows engineers to prototype, iterate, and deploy custom hardware solutions without the high upfront costs of ASIC development. Key features of the XC7K325T-1FF676I include its 326,080 logic cells, which provide substantial capacity for complex digital designs. The device also integrates 840 DSP slices for high-speed digital signal processing, and 16,404,480 bits of block RAM for on-chip data storage. With 400 user I/O pins, it offers extensive connectivity options. The -1 speed grade indicates a balanced performance level, suitable for a wide range of applications without the higher power consumption of faster grades. Technically, the Kintex-7 family is built on AMD's 28nm high-k metal gate (HKMG) process, offering an optimal balance of performance, power, and cost. The device supports PCIe Gen3, 10 Gigabit Ethernet, and other mainstream standards, making it a versatile choice for system integration. The FCBGA-676 package provides excellent thermal and electrical characteristics, with a square body and ball grid array terminals for reliable surface-mount assembly. Typical applications include software-defined radio, high-performance computing, medical imaging, and wired/wireless communications infrastructure. The XC7K325T's high DSP ratio and cost-effective packaging make it particularly well-suited for signal processing and data-intensive tasks. Its support for mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet simplifies integration into existing systems. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (1V core, 1.8V and 3.3V I/O), and proper sequencing is essential. Adequate PCB layout with sufficient copper planes and decoupling capacitors is critical to ensure reliable operation at high speeds.
XC7K325T-1FFG676C - Kintex-7 FPGA 326K Cells | AMD
The AMD XC7K325T-1FFG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering 326,080 logic cells, 400 user I/Os, and 16,404,480 bits of block RAM in a 676-pin FCBGA package. It operates from a 1.0V core supply (0.97V to 1.03V range) and supports mainstream standards including PCIe Gen3 and 10 Gigabit Ethernet. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of application-specific integrated circuits (ASICs) but offer reconfigurability. The Kintex-7 family is positioned as the best price/performance/watt balance in the 7-series, bridging the gap between the low-cost Artix-7 and the high-end Virtex-7. Key features include 840 DSP48E1 slices for high-throughput signal processing, 500 MHz maximum clock frequency, and support for DDR3 memory interfaces. The device integrates 10.3 Gbps transceivers (GTX) for high-speed serial communication, and includes hardened blocks for PCIe Gen3 and 10G Ethernet MAC. The -1 speed grade provides a balanced performance point, while the C temperature grade supports commercial operation from 0°C to 85°C. Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with 203,800 LUTs, organized into configurable logic blocks (CLBs). The device includes 10 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for flexible clock generation. The 28nm high-k metal gate (HKMG) process technology delivers up to 50% lower power than previous generations while maintaining high logic density. Typical applications include software-defined radio, high-performance computing acceleration, video and image processing, and wired communications infrastructure. The 400 I/Os support a wide range of I/O standards including LVCMOS, LVDS, and HSTL, making it versatile for board-level integration. When designing with this device, careful attention to power supply decoupling is essential. The core voltage must be regulated to 1.0V with adequate bypass capacitance, and the configuration bitstream must be loaded from an external SPI flash or via JTAG. Thermal management is critical at high utilization; a heatsink or forced airflow is recommended for sustained operation above 50% logic utilization.
XC7K325T-2FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
The AMD XC7K325T-2FBG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) from the 7 series family, built on advanced 28nm process technology. It delivers 326,080 logic cells, 400 user I/Os, and 16,404,480 total RAM bits, packaged in a 676-ball FCBGA (27x27 mm) with a lidless design. This device operates over a commercial temperature range of 0°C to 85°C (TJ) and supports core voltages around 1V, making it a versatile choice for a wide range of high-bandwidth and signal processing applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, configurable I/O, and routing resources that can be programmed to implement any digital logic function. The Kintex-7 family sits in the mid-range of the 7 series, balancing logic capacity, DSP slices, and transceiver performance to address applications from cost-sensitive, high-volume systems to ultra high-end connectivity and signal processing. This places the XC7K325T within the hierarchy of FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features of the XC7K325T-2FBG676C include 400 user I/O pins, 25475 Configurable Logic Blocks (CLBs), and 326,080 logic elements/cells. The device also integrates 16,404,480 bits of block RAM, enabling substantial on-chip data storage for buffering and processing. The -2 speed grade offers a balanced performance point, with the -3 grade being the highest performance and -1/-1L for lower power. The 676-FCBGA package provides a compact footprint while supporting the high pin count required for parallel interfaces and memory controllers. From a technical architecture perspective, the Kintex-7 family is built on a 28nm high-k metal gate (HKMG) process, offering a strong price/performance/watt ratio. The device includes hardened blocks such as DSP48E1 slices for high-speed arithmetic, and supports mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet via its high-speed transceivers. The lidless FCBGA package aids in thermal management, allowing direct heatsink attachment for improved heat dissipation in high-power designs. Typical applications for the XC7K325T-2FBG676C include software-defined radio, high-performance computing, medical imaging, and aerospace/defense systems. Its combination of logic density, DSP capability, and I/O count makes it suitable for implementing complex digital signal processing chains, protocol bridging, and parallel processing architectures. The device is also commonly used in development boards like the QMTECH XC7K325T for prototyping and algorithm validation. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with appropriate filtering, and the lidless package should be paired with a suitable heatsink for applications exceeding moderate power dissipation. Refer to the AMD 7 Series FPGAs datasheet and UG475 for detailed pinout and power requirements.
XC7K325T-2FFG676I - Kintex-7 FPGA 326K Logic Cells | AMD
The AMD XC7K325T-2FFG676I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering an optimal balance of price, performance, and power for a wide range of applications. It features 326,080 logic cells, 400 user I/Os, and 16,404,480 bits of block RAM, all housed in a 676-ball FCBGA package. This device supports mainstream standards such as PCIe Gen3 and 10 Gigabit Ethernet, making it a versatile choice for high-speed serial connectivity and data processing. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be customized to perform specific functions. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware acceleration or frequent design updates. The Kintex-7 family sits within the broader FPGA hierarchy, offering a balance between the cost-optimized Artix-7 and the high-performance Virtex-7 families. Key features of the XC7K325T-2FFG676I include 840 DSP slices for high-throughput digital signal processing, 500 I/O pins (400 user I/Os), and support for a core voltage of 0.97V to 1.03V. The device operates at a maximum frequency of 470.37 MHz and includes advanced clock management tiles (CMTs) with MMCM and PLL for precise clock generation. The -2 speed grade provides a strong balance between performance and power consumption, making it suitable for a wide range of high-speed applications. Technically, the Kintex-7 architecture integrates a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power. The device includes hardened memory controllers, high-speed transceivers, and PCIe blocks, reducing the need for external components and simplifying system design. The 676-ball FCBGA package offers excellent thermal and electrical performance, supporting the high I/O count and high-speed interfaces required for demanding applications. Typical applications include software-defined radio, high-performance computing, medical imaging, and aerospace and defense systems. The device's high DSP ratio and support for 10G Ethernet make it particularly well-suited for signal processing and high-throughput data acquisition. Its cost-effective packaging and mainstream standard support also make it a popular choice for communications infrastructure and test and measurement equipment. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The core voltage must be maintained within the specified range, and adequate cooling should be provided to keep the junction temperature within limits. The device's configuration interface should be planned early in the design to ensure reliable programming and reconfiguration.
XC7K325T-2FFG900C - Kintex-7 FPGA 326K Cells FCBGA-900 | AMD
The AMD (Xilinx) XC7K325T-2FFG900C is a Kintex-7 FPGA with 326,080 logic cells, 500 user I/Os, and up to 16 GTX serial transceivers, housed in a 900-ball fine-pitch flip-chip BGA (FCBGA-900) package with a commercial 0C to +85C operating range and -2 speed grade. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), block RAM, DSP slices, and programmable interconnect that engineers configure after manufacturing. Within the programmable logic hierarchy, the Kintex-7 family sits between the cost-optimized Artix-7 and the high-performance Virtex-7 families, built on TSMC 28nm HKMG process technology. Key features include 840 DSP48E1 slices for high-throughput math, MMCM and PLL clock management resources reaching 470.37 MHz and beyond, a 12.5 Gb/s-capable GTX transceiver class, and an on-chip XADC (dual 12-bit, 1 MSPS) with an internal +/-1% reference for supply and temperature monitoring. Architecturally, the -2 speed grade fabric operates from a core voltage of 970 mV to 1.03 V, delivering high DSP-per-watt ratios and support for mainstream standards such as PCI Express. The FFG900 package exposes the largest I/O and transceiver bank count of the 325T die, supporting wide DDR3 memory interfaces and high-bandwidth serial backplanes. Typical applications include high-performance DSP engines, wireless baseband and RF front ends, medical imaging, video broadcast processing, and ASIC prototyping. The KC705 evaluation kit accelerates development with pre-verified reference designs. Design consideration: the 1.0 mm-pitch 30x30 mm FCBGA-900 requires an 8-12 layer PCB with sequential blind/buried via fan-out, and precise multi-rail power sequencing per the 7 Series PCB Design Guide. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
XC7K325T-2FFG900I - Kintex-7 FPGA 326K Logic Cells | AMD
The AMD XC7K325T-2FFG900I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering 326,080 logic cells, 16,404,480 bits of block RAM, and 500 user I/O pins in a 900-ball FCBGA package. It is designed for applications requiring high processing power, flexibility, and reconfigurability, such as wired and wireless communications, data center acceleration, and aerospace and defense systems. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be reprogrammed to perform different logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which are a subset of integrated circuits used to implement digital logic. The Kintex-7 family is positioned as the best price/performance/watt balance in the 7-series, bridging the gap between the low-cost Artix-7 and the high-performance Virtex-7 families. Key features of the XC7K325T-2FFG900I include 840 DSP48E1 slices for high-speed digital signal processing, 500 user I/O pins supporting multiple I/O standards, and 16.4 Mb of block RAM. The device supports mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet, making it suitable for high-throughput data paths. The -2 speed grade offers a balanced performance point, while the industrial (I) temperature grade supports operation from -40°C to +100°C, enabling deployment in harsh environments. Architecturally, the Kintex-7 family is built on AMD's (formerly Xilinx) 28nm high-k metal gate (HKMG) process technology. The device integrates configurable logic blocks (CLBs), block RAM, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. This architecture allows designers to implement complex digital systems, from soft-core processors to high-speed serial interfaces, within a single device. Typical applications include software-defined radio (SDR), medical imaging, video processing, and high-performance computing. The device's high DSP ratio and cost-effective packaging make it ideal for applications that require significant parallel processing capability without the cost of a Virtex-class device. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a well-designed PCB layout to ensure signal integrity at high I/O speeds. Adequate cooling, such as a heatsink or forced airflow, is necessary to keep the junction temperature within the specified range.
XC7K355T-2FF901I - Kintex-7 FPGA 356K Logic Cells | AMD
The AMD XC7K355T-2FF901I is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, designed to deliver an optimal balance of logic density, DSP capability, and power efficiency. It features 356,160 logic cells, 26,357,760 block RAM bits, and 300 user I/O pins in a 900-ball FCBGA (FF901) package. This device operates with power supplies of 1.0V, 1.8V, and 3.3V, supporting a wide range of I/O standards. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that allow the hardware to be reprogrammed to implement any digital logic function. The Kintex-7 family sits between the cost-optimized Artix-7 and the high-performance Virtex-7 in the Xilinx 7-series hierarchy, offering a balance of price, performance, and power for mid-to-high-range applications. Key features of the XC7K355T-2FF901I include 356,160 logic cells, 26,357,760 bits of block RAM, and 300 user I/O pins. The -2 speed grade indicates a mid-range performance level, while the I suffix denotes an industrial temperature range of -40°C to +100°C. The FF901 package provides 900 balls in a square BGA form factor, enabling high-density routing for complex designs. Technically, the Kintex-7 family is built on a 28nm high-k metal gate (HKMG) process technology, offering significant power and performance improvements over previous generations. The device includes advanced DSP48E1 slices, high-speed transceivers, and integrated memory controllers, making it suitable for a wide range of applications. The 900-ball package supports multiple I/O standards and provides excellent signal integrity for high-speed interfaces. Typical applications for the XC7K355T-2FF901I include telecommunications infrastructure, aerospace and defense systems, high-performance computing, and medical imaging. Its combination of logic density, DSP capability, and power efficiency makes it ideal for signal processing, software-defined radio, and video processing applications. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 28nm process and high logic density require robust power distribution networks and adequate cooling solutions to ensure reliable operation at industrial temperatures.
XC7K355T-2FFG901I - Kintex-7 FPGA 356K Logic Cells | AMD
The AMD XC7K355T-2FFG901I is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, offering an optimal balance of price, performance, and power consumption. It features 356,160 logic cells, 300 user I/Os, and 26,357,760 total RAM bits, all in a 900-ball FCBGA package. Operating from a 0.97V to 1.03V supply, this device is designed for a wide range of applications including aerospace, automotive, industrial, and defense sectors. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and reconfigurable interconnects, allowing for rapid prototyping and flexible hardware design. The Kintex-7 family is positioned as a mid-to-high-range solution, providing substantial logic density, advanced DSP capabilities, and high-speed serial connectivity. Key features of the XC7K355T-2FFG901I include 27,825 CLBs, 710 DSP slices, and support for MMCM and PLL clock management. The device operates at a maximum frequency of 1286 MHz and is built on 28nm CMOS technology. The FCBGA-901 package offers excellent thermal and electrical performance, with a compact footprint suitable for space-constrained designs. Technically, the Kintex-7 architecture integrates a flexible 6-input look-up table (LUT) fabric, dedicated block RAM, and high-speed transceivers. The device supports various configuration methods including JTAG, master SPI, and slave SelectMAP. Its advanced power management features enable efficient operation across different performance modes. Typical applications include software-defined radio, high-performance computing, medical imaging, and video processing. The XC7K355T's combination of logic density and DSP capability makes it ideal for signal processing tasks that require parallel computation. When designing with this FPGA, ensure adequate decoupling capacitors on all power rails and follow the recommended power-up sequence to avoid latch-up. The device requires careful thermal management due to its high power dissipation at full utilization.
XC7K355T-3FFG901E - Kintex-7 FPGA, 356K Logic Cells | AMD
The AMD XC7K355T-3FFG901E is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, designed to deliver an optimal balance of price, performance, and power consumption. It features 356,160 logic cells, 300 user I/O pins, and 26,357,760 bits of block RAM, all housed in a 900-ball FCBGA (31x31mm) package. The device operates from a 1.0V core supply (0.97V to 1.03V range) and supports high-speed serial transceivers, making it suitable for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The Kintex-7 family sits between the low-power Artix-7 and high-performance Virtex-7 families, offering a 2X price-performance improvement over the previous generation. This makes it a popular choice for applications requiring substantial logic density, advanced DSP capabilities, and high-speed serial connectivity without the cost of flagship devices. Key features of the XC7K355T-3FFG901E include 356,160 logic cells, 27,825 CLBs, 300 user I/O pins, and 26,357,760 bits of total RAM. It also integrates 16 GTX transceivers, 8 MMCMs, and 8 PLLs for clock management. The device is built on 28nm technology and supports a core voltage of 1.0V, enabling high performance with manageable power consumption. The FCBGA-901 package provides excellent thermal and electrical characteristics for demanding applications. From a technical perspective, the Kintex-7 architecture includes dedicated DSP48E1 slices for high-speed arithmetic, block RAM for data storage, and configurable I/O banks supporting various voltage standards. The device also features advanced clock management through MMCM and PLL blocks, ensuring precise timing for complex designs. The 28nm process technology balances performance and power, making it suitable for both compute-intensive and power-sensitive applications. Typical applications for the XC7K355T-3FFG901E include 5G wireless infrastructure, high-performance computing, aerospace and defense systems, and medical imaging equipment. Its combination of logic density, DSP capability, and high-speed transceivers makes it ideal for signal processing, data acquisition, and communication systems. The device is also used in prototyping and emulation systems where reconfigurability is essential. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The 1.0V core supply requires low-impedance decoupling capacitors placed close to the device pins. Adequate cooling, such as a heatsink or forced airflow, is necessary to maintain junction temperature within specified limits under full load.
XC7K410T-1FF900I - Kintex-7 FPGA 406K Logic Cells | AMD
The AMD XC7K410T-1FF900I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It features 406,720 logic cells, 500 user I/O pins, and 29,306,880 bits of block RAM, all housed in a 900-ball FCBGA package. This device is part of the Kintex-7 family, which balances high-speed serial connectivity, advanced memory interfacing, and cost-effectiveness for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and reconfigurable interconnects, allowing them to implement complex digital logic designs. FPGAs are used in applications requiring high-speed parallel processing, rapid prototyping, and field-upgradable hardware, such as telecommunications, data centers, and aerospace systems. Key features of the XC7K410T-1FF900I include 500 user I/O pins, 29,306,880 bits of block RAM, and support for high-speed transceivers. The device operates at a core voltage of 1V and is available in the -1 speed grade, offering a balanced performance-power trade-off. The 900-ball FCBGA package provides excellent thermal and electrical characteristics, making it suitable for high-density designs. Technically, the Kintex-7 family is built on AMD's 28nm high-k metal gate (HKMG) process, which reduces power consumption while maintaining high performance. The device includes hardened memory controllers, DSP slices, and clock management tiles (CMTs) with MMCM and PLL, enabling efficient implementation of complex algorithms and high-speed interfaces. The XC7K410T-1FF900I supports various I/O standards, including LVCMOS, LVDS, and HSTL, and can interface with DDR3/DDR4 memory. Typical applications include wired and wireless communications, data center acceleration, video and image processing, and scientific instrumentation. The high logic density and I/O count make it ideal for implementing large-scale digital signal processing (DSP) chains, packet processing, and software-defined radio (SDR) systems. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a well-designed PCB layout to ensure signal integrity at high speeds. AMD provides comprehensive design tools, including Vivado, to facilitate implementation and verification.