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SC9S08LL36J1CLH - 8-Bit 40MHz 36KB MCU | NXP Semiconductors
SC9S08LL36J1CLH

SC9S08LL36J1CLH - 8-Bit 40MHz 36KB MCU | NXP Semiconductors

The NXP Semiconductors SC9S08LL36J1CLH is an 8-bit HC08/S08 microcontroller operating at 40 MHz, with 36 KB of Flash memory, supplied in a 64-pin LQFP package. Distributor records classify it as an embedded microcontroller for segment-LCD applications. Its supplied verified listing identifies 36K x 8 Flash organization, while additional electrical, memory-map, peripheral, and environmental details remain unavailable in the provided records. A microcontroller is a programmable semiconductor that integrates a CPU core, memory, peripherals, and interface logic into one device. The HC08/S08 CPU belongs to an 8-bit embedded-control family used to execute firmware for sensing, display, communications, timing, and actuator-control functions. Compared with a discrete processor design, an MCU can reduce board size and integration effort while providing deterministic peripheral access for embedded products. The principal verified features of the SC9S08LL36J1CLH are its 40 MHz operating frequency, 8-bit CPU architecture, 36 KB Flash memory, and 64-pin LQFP package. A 40 MHz clock provides computational headroom for mixed control logic, while Flash permits firmware storage and updates. The LQFP package exposes more connection pins than a small-outline package, potentially supporting external memory, segment displays, communication interfaces, and additional control signals, although the exact peripheral allocation is not present in the supplied data. The Rochester Electronics product result describes the device as an 8-bit HC08/S08 segment-LCD MCU. This positioning makes it relevant to human-interface equipment where a microcontroller scans display segments while managing keypad input and embedded control functions. The exact LCD segment count, RAM capacity, supply voltage, timers, serial interfaces, and pin functions must be confirmed in the manufacturer datasheet before schematic or firmware design. Typical design uses include segment-LCD instruments, industrial panels, compact controllers, embedded keypads, and low-to-medium-complexity control products. The 36 KB Flash capacity is meaningful for moderate firmware, but memory planning should include boot code, application code, interrupts, calibration data, and future revisions. Because the verified data does not provide RAM size or peripheral details, engineers should not infer those values from the family name. Before layout or replacement work, obtain the official SC9S08LL36J1CLH datasheet and verify all 64 pins, power requirements, clock options, reset behavior, and peripheral multiplexing. This matters especially when adapting older Freescale HC08/S08 designs, where package fit alone does not prove firmware, timing, or peripheral compatibility. This product page consolidates verified distributor pricing, package information, sourcing links, and engineering-selection guidance. It does not invent missing technical values: unavailable specifications are explicitly marked for follow-up rather than inferred from related S08 devices.

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SC9S08LL36J1CLH557 - 8-bit S08 MCU 36KB Flash 40MHz LCD | NXP
SC9S08LL36J1CLH557

SC9S08LL36J1CLH557 - 8-bit S08 MCU 36KB Flash 40MHz LCD | NXP

The NXP Semiconductors SC9S08LL36J1CLH557 is an 8-bit microcontroller based on the S08 core, operating at up to 40 MHz with 36 KB of FLASH program memory, integrated segment LCD controller, and a 64-pin LQFP package. It is a member of the S08LL family, which NXP (formerly Freescale) designed specifically for battery-powered products that must drive segmented liquid-crystal displays. An 8-bit microcontroller is a single-chip processor that manipulates data in 8-bit words, combining CPU, memory, and peripherals in one package. Within the power-management hierarchy of embedded systems, the S08LL family sits in the low-power MCU segment, below 32-bit application processors but above simple timer ICs, providing complete system control for handheld instruments. Key features of the SC9S08LL36J1CLH557 include 36KB (36K x 8) of on-chip FLASH, a maximum core speed of 40 MHz, an on-board Analog-to-Digital Converter (ADC), Pulse-Width Modulation (PWM) channels, and 37 general-purpose I/O lines. The device supports a minimum supply voltage of 1.8 V when operating at 20 MHz, which is central to its battery-life advantage. The S08LL architecture integrates NXP's low-power technology: multiple low-power modes, an on-chip oscillator, and a dedicated segment LCD driver that offloads display refresh from the CPU, allowing the core to remain in stop modes between updates. This extends battery life in always-on display applications. Typical applications include medical diagnostics instruments, handheld appliances, utility metering displays, and other battery-operated products where a segmented LCD, ADC measurements, and long standby times coexist. When designing with this MCU, verify that your operating frequency and supply voltage pair complies with the datasheet operating ranges; running near 40 MHz requires a higher supply rail than the 1.8 V minimum used at 20 MHz. This page synthesizes distributor pricing, stock availability, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

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SC9S08QE16SCLCR 8-Bit S08 Microcontroller | NXP
SC9S08QE16SCLCR

SC9S08QE16SCLCR 8-Bit S08 Microcontroller | NXP

The NXP Semiconductors SC9S08QE16SCLCR is an 8-bit HCS08/HC08/S08-series microcontroller offered in an LQFP package, with the exact electrical ratings, pin assignments, memory capacities, clock limits, temperature range, and package dimensions requiring confirmation from the manufacturer datasheet. Verified distributor records identify it as a microcontroller IC associated with the Freescale Semiconductor name, now represented under NXP Semiconductors. An 8-bit microcontroller is a compact embedded controller that combines a processor core, memory, and peripherals on one semiconductor package. The HCS08 family belongs to the broader embedded-processing hierarchy: microcontroller unit, embedded processor, semiconductor, and electronic component. Such devices are used to read sensors, control actuators, sequence operations, and manage communication or human-interface functions in compact equipment. The verified product listing confirms the SC9S08QE16SCLCR identity and identifies the device as an 8-bit HC08/S08 microcontroller. The LCSC result additionally reports a starting price of $2.2595, but the supplied records do not establish standardized quantity-break pricing, complete ordering information, or a manufacturer-authorized lifecycle classification for this exact orderable MPN. Because the retrieved data does not include a technical datasheet parameter table, details such as processor speed, flash and RAM size, I/O count, supply voltage, timers, communication interfaces, and operating temperature cannot be safely inferred from the part number. Engineers should therefore treat those values as unavailable until verified from the official S08QE16 documentation and the relevant package data sheet. Potential HC08/S08 applications include compact motor controllers, simple industrial modules, appliance controls, sensor nodes, and embedded instrumentation. Suitability depends on the verified memory map, peripheral set, pin multiplexing, clock requirements, and operating conditions rather than the distributor description alone. Before designing a PCB, verify the exact pinout, exposed-pad requirements, recommended decoupling, programming interface, clock components, and analog or communications peripherals in the official documentation. Do not treat a generic cross-reference result as proof of firmware, peripheral, timing, or pin-level compatibility. This page consolidates the verified distributor identity, commercial snapshot, package-related procurement links, and source traceability. Its key information gain is the separation of confirmed facts from unverified engineering parameters, helping buyers evaluate sourcing without presenting guesses as manufacturer specifications.

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SC9S08QG8TCDTER - 8-bit S08 Microcontroller 8KB Flash | NXP
SC9S08QG8TCDTER

SC9S08QG8TCDTER - 8-bit S08 Microcontroller 8KB Flash | NXP

The NXP (formerly Freescale Semiconductor) SC9S08QG8TCDTER is an 8-bit HCS08-family microcontroller (MCU) featuring 8KB of on-chip Flash program memory, an HC08/S08 CPU core, and a TSSOP-16 surface-mount package. It is part of the S08QG sub-family of low-pin-count MCUs designed for cost-sensitive embedded applications. The device operates from a wide supply range and integrates multiple peripherals aimed at simplifying BOM in small-form-factor designs. What is an 8-bit microcontroller? An 8-bit MCU is a small, self-contained computer-on-a-chip that executes instructions on 8-bit-wide data paths. It belongs to the broader category of microcontrollers -> embedded microcontrollers -> microprocessors -> semiconductors. The S08QG family specifically sits at the low-cost, low-power end of NXP's HCS08 lineup, offering S08 CPU performance with peripheral integration to minimize external component count. Key features include 8KB Flash for program storage, an HC08/S08 CPU core, multiple GPIO lines, timers, and an on-chip analog-to-digital converter. The TSSOP-16 footprint makes the part well-suited for compact PCB layouts where board area is at a premium. Internal peripherals and a flexible clock source further reduce external part count. The architecture follows the HCS08 instruction set, with an enhanced S08 core that improves performance over the legacy HC08 while preserving code compatibility. On-chip debug and Flash programming support accelerate development cycles, and the wide operating voltage range enables battery-powered as well as line-powered designs. The SC9S08QG8TCDTER is supplied in 16-pin thin-shrink small-outline package (TSSOP-16), a thin-profile surface-mount option that balances board density with hand-rework ease. Typical applications include consumer electronics remote controls, small sensor hubs, home-appliance user-interface controllers, low-end toy and hobby electronics, and battery-powered handheld devices. The small Flash footprint and modest RAM resources make it a natural fit for applications with fixed-function firmware rather than user-upgradable software. Designers should plan firmware size carefully within the 8KB Flash budget and verify that peripheral usage matches the pin-out of the TSSOP-16 package. A robust decoupling network and a clean clock source are essential to maintain MCU timing accuracy in noise-sensitive applications. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the standalone manufacturer datasheet, delivering information gain beyond a stock listing.

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SCF5249LAG120 - ColdFire V2 MPU 120MHz, 96K SRAM, 144-LQFP
SCF5249LAG120

SCF5249LAG120 - ColdFire V2 MPU 120MHz, 96K SRAM, 144-LQFP

The Freescale/NXP SCF5249LAG120 is a ColdFire V2 integrated microprocessor delivering over 125 Dhrystone 2.1 MIPS at 140 MHz with the lowest power consumption (1.3 mW/MHz) on any ColdFire device at the time of release. Housed in a 144-pin LQFP (20x20 mm) package, this 32-bit MPU runs at 120 MHz, includes 96 KB of on-chip SRAM, and is qualified for commercial 0C to 70C operation. A microprocessor (MPU) is an integrated CPU-centric chip that integrates core processing logic, memory, and peripheral controllers into a single device for embedded control tasks. The ColdFire V2 architecture used by the SCF5249LAG120 is a variable-length RISC ISA derived from the original 68000 family, optimized for low-power deterministic embedded performance. Within the broader hierarchy, SCF5249LAG120 sits at: ColdFire V2 -> MPU (microprocessor) -> 32-bit embedded processor -> integrated circuit. Key features include 1.8 V core with 3.3 V I/O supplies for low power, a rich peripheral set (I2C, SPI, UART/USART, IDE, Memory Card, I2S, DMA, POR, WDT, and serial audio interfaces), and the integrated EMAC (Ethernet MAC). Most peripheral pins can be remapped as General Purpose I/O. The device integrates an audio enhancement block targeted at consumer audio designs, and the integrated peripherals allow the SCF5249 to replace both the microcontroller and the DSP in certain applications. Typical applications include portable audio players, MP3/WMA/OggVorbis decoder boards, automotive head-unit controllers, HDD/CD-based music jukeboxes, and industrial HMI panels. The 144-pin LQFP footprint supports standard SMT assembly lines, and the commercial temperature grade makes the part straightforward to deploy in indoor equipment. When designing with this device, ensure the 1.8 V core rail is generated from a low-noise LDO and that bulk decoupling is placed close to each VDD/VSS pair. Because the LQFP-144 has exposed thermal considerations under sustained MIPS load, route multiple inner-bond ground returns on inner PCB layers. This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering-oriented design notes that go beyond the bare MCF5249 datasheet block diagram.

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SCF5250AG120 - 120MHz ColdFire V2 32-bit MPU | NXP/Freescale
SCF5250AG120

SCF5250AG120 - 120MHz ColdFire V2 32-bit MPU | NXP/Freescale

The NXP (formerly Freescale) SCF5250AG120 is a 32-bit ColdFire V2 microprocessor delivering 120 MHz core clock (over 107 Dhrystone 2.1 MIPS) with an enhanced multiplier-accumulator (eMAC) unit, packaged in a 144-pin LQFP (20x20 mm). It is a ROMless system-on-chip featuring 128 KB of integrated SRAM and 57 general-purpose I/O lines, targeting cost-sensitive embedded audio decoder and general system-controller applications. A ColdFire V2 microprocessor is a member of the 32-bit ColdFire family originally derived from the Motorola 68000 architecture. ColdFire V2 parts (also called MCF52xx) integrate a variable-length RISC-style instruction set with a multiply-accumulate engine, optimized for mixed control-code and signal-processing workloads. Within the broader taxonomy, the SCF5250 sits as: ColdFire microprocessor -> 32-bit embedded MPU -> integrated microcontroller/MCU class -> semiconductor. ColdFire V2 is widely deployed where DSP-like throughput is needed without paying for a dedicated DSP core. Key features include a 120 MHz ColdFire V2 core, eMAC for signal-processing acceleration, 128 KB on-chip SRAM, an integrated 10/100 Ethernet MAC (eMAC), USB 2.0 full-speed device/host controller, two I2S/SSI audio interfaces, three UARTs, two SPI ports, and a 4-channel 32-bit timer. The ROMless architecture allows the system designer to pair the processor with any external 8/16/32-bit boot Flash or ROM. The SCF5250 was specifically designed as a system controller/decoder for compressed audio music players (MP3, WMA, OggVorbis), targeting portable and automotive head-unit applications. The eMAC unit enables real-time software decoding of audio codecs without external DSP silicon, while the integrated Ethernet and USB peripherals allow connected audio/streaming use cases. Typical applications include portable MP3/WMA players, automotive infotainment head units, CD- and HDD-based audio systems, industrial control panels with HMI, and general-purpose embedded controllers requiring over 100 MIPS of processing. Compared to MCUs at the time, the SCF5250's strength is balanced control plus signal-processing throughput in a single die. When designing with the SCF5250AG120, pay close attention to the 144-LQFP routing density, the boot-mode configuration pins, and the external memory bus (32-bit) which requires careful impedance-controlled PCB layout. Decoupling follows standard ColdFire guidelines: 0.1 µF ceramic on every VDD/VSS pair plus bulk tantalum on the 3.3 V rail. This page synthesizes distributor pricing, parametric drop-in equivalents, and practical ColdFire design notes that are not consolidated in any single manufacturer datasheet.

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SCF5250LAG100 - ColdFire V2 32-Bit MCU 100MHz LQFP-144 | NXP
SCF5250LAG100

SCF5250LAG100 - ColdFire V2 32-Bit MCU 100MHz LQFP-144 | NXP

The NXP Semiconductors SCF5250LAG100 is a ColdFire V2 SCF52xx 32-bit microcontroller system-on-chip delivering 100 MHz core performance with an integrated enhanced Multiply-Accumulator (eMAC) unit, housed in a 144-pin LQFP (20x20 mm) package. The part is ROMless and is targeted at system controller and audio decoder roles in portable audio players, CD/HDD-based music systems, and automotive infotainment subsystems. According to the SCF5250 datasheet, the core delivers over 107 Dhrystone 2.1 MIPS at 120 MHz operation in equivalent families. A ColdFire microcontroller is a 32-bit RISC microprocessor core architecture originally developed by Motorola (now NXP/Freescale) to bridge the gap between 8/16-bit microcontrollers and higher-end PowerPC processors. ColdFire V2 devices integrate the processor, memory interfaces, and a configurable peripheral set into a single IC, providing deterministic performance and predictable interrupt latency required for embedded control. Within the broader taxonomy, ColdFire sits between microcontrollers and microprocessors, optimized for embedded signal processing and system control. Key features of the SCF5250LAG100 include a 32-bit ColdFire V2 core with hardware eMAC, 100 MHz operating frequency, ROMless configuration for flexible external boot, an integrated Fast Ethernet controller (eMAC), USB On-The-Go support, serial audio interfaces, and an SDRAM controller. The 144-pin LQFP (20x20 mm) package provides ample I/O for multimedia systems and offers an exposed pad for thermal performance. The device operates over an industrial temperature range suitable for both consumer and automotive applications. Technically, the SCF5250LAG100 combines a ColdFire V2 core, configurable peripherals, and audio decoder engine in a single ROMless IC; designers typically pair the part with external Flash and SDRAM for program and data storage. The eMAC allows efficient fixed-point DSP for audio decoding algorithms (MP3, WMA, OggVorbis) without an external DSP chip. Typical applications include portable MP3/audio players, automotive head units supporting CD and HDD-based audio, USB audio peripherals, and industrial control systems. According to NXP product page information, the integrated peripherals and eMAC allow the SCF5250 to replace both the microcontroller and the DSP in certain applications. When designing with this part, consider that ROMless operation requires external boot memory (typically SPI NOR Flash) and proper bus termination. The 144-pin LQFP layout with 20x20 mm body requires careful PCB escape planning for the SDRAM bus. This page synthesizes distributor pricing, same-brand ColdFire V2 alternatives, and practical design notes not found in the manufacturer datasheet.

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SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP
SCF5250VM120

SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

The NXP Semiconductors SCF5250VM120 is a 32-bit ColdFire V2 MCF52xx ROMless microcontroller with a 120 MHz processor, 128 kB of RAM, 57 I/O pins, and a 196-LBGA package. It operates from a 3.3 V supply according to the verified distributor specifications. The device is positioned for embedded systems that require a high-performance 32-bit processor, substantial on-chip RAM, and a broad parallel I/O interface. A microcontroller is a compact computing system integrated onto one semiconductor package. It combines a processor core, memory, I/O, timing, communications, and control peripherals into an embedded platform. The SCF5250 belongs to the ColdFire microcontroller family, which uses a RISC-oriented 32-bit architecture. Its ROMless configuration means that external program memory is required rather than relying on an internal program-memory array. The SCF5250VM120 provides a 120 MHz maximum clock and 128 kB RAM, making it suitable for embedded control, networking, communications, and industrial equipment. The 57 I/O pins provide interfaces for external memory and control signals. Its 196-LBGA package supports dense PCB routing, while the 3.3 V supply simplifies integration with 3.3 V digital systems. The ColdFire processor core is designed for efficient 32-bit embedded processing. The exact cache, memory-mapped peripheral arrangement, and external-interface requirements should be confirmed against the manufacturer datasheet before layout or firmware deployment. Because the part is ROMless, system designers must provide external program storage and ensure the memory interface matches the PCB design. Typical applications include industrial controllers, embedded communications equipment, networking appliances, test systems, and motor or equipment-control platforms. The 120 MHz operating speed supports more responsive control loops than slower general-purpose 8-bit or 16-bit alternatives, while the 128 kB RAM reduces pressure on external data memory. A key design consideration is package escape routing. The 196-LBGA footprint has a fine pitch and requires careful PCB stack-up, power distribution, and signal-integrity planning. Verify the official pinout, power rails, decoupling requirements, external memory connections, and programming method before manufacturing. This page summarizes verified distributor specifications, source links, package information, and design considerations for SCF5250VM120 sourcing and engineering review. Product images, detailed pin assignments, and unverified electrical values are intentionally not fabricated.

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SCIMX258CVM4A - i.MX258 ARM9 MPU, 454MHz | NXP Semiconductors
SCIMX258CVM4A

SCIMX258CVM4A - i.MX258 ARM9 MPU, 454MHz | NXP Semiconductors

The NXP (formerly Freescale) SCIMX258CVM4A is a 32-bit ARM926EJ-S RISC microprocessor in the i.MX25 family, running up to 400 MHz, and it integrates an LCD controller, Ethernet MAC, USB 2.0 OTG, and multiple connectivity peripherals in a single 289-ball MAPBGA package. The i.MX25 targets industrial HMI, factory automation, medical instrumentation, and energy/payment terminals where deterministic ARM9 performance and long-term NXP supply are critical. Key features include hardware-accelerated LCD support up to SVGA resolution, integrated 10/100 Ethernet MAC with IEEE 1588 timestamping hardware assist, four SPIs, three I2C, and five UARTs, plus NAND Flash and DDR2 external memory controllers. Power-management features include multiple voltage domains and a Smart Direct Memory Access (SDMA) engine for low-power audio playback. The SCIMX258CVM4A is built on a 0.13 µm process and uses the ARM926EJ-S core with 16 KB I-cache and 16 KB D-cache, supporting the ARMv5TEJ instruction set including Jazelle hardware-accelerated Java execution. Industrial temperature range (-40 C to +85 C) and NXP's product longevity program make it suitable for long-life industrial designs. Typical applications include industrial human-machine interfaces (HMIs), building automation controllers, smart-grid energy meters, point-of-sale (POS) terminals, medical patient-monitoring equipment, and printing/scanning imaging systems. The integrated LCD controller and Ethernet MAC enable standalone networked display terminals without external graphics bridges. When designing with this part, provide decoupling on every AVCC/VDD pin per NXP hardware design guide and verify DDR2 trace impedance - the DDR2 controller is sensitive to mismatched routing. Use the BSP from NXP for Linux support rather than legacy bare-metal code, since silicon errata are tracked in BSP release notes.

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SCIMX27LMOP4A - i.MX27 ARM9 MPU, 473-pin MAP-BGA | NXP
SCIMX27LMOP4A

SCIMX27LMOP4A - i.MX27 ARM9 MPU, 473-pin MAP-BGA | NXP

The NXP SCIMX27LMOP4A (i.MX27) is an ARM926EJ-S based applications processor built on a 0.09 µm CMOS process, housed in a 473-pin MAP-BGA package and qualified to MSL 3 (168 hours). It targets multimedia and industrial-control embedded designs with on-chip LCD controller, Ethernet MAC, USB On-The-Go, and integrated memory interfaces. An applications processor (AP) is a system-on-chip that integrates a CPU core, memory controller, and a rich peripheral set into a single device, forming the brain of an embedded product. Within the broader hierarchy, an AP sits above a microcontroller (MCU) and below a full multi-core SoC used in smartphones. The i.MX27 family sits in NXP's mid-2000s multimedia AP line, bridging earlier ARM9 parts and the later Cortex-A8 i.MX5x series. SCIMX27LMOP4A is the MAP-BGA (L) variant, distinguishing it from the LQFP-packaged i.MX27L parts. Key features include an ARM926EJ-S core with up to 400 MHz operation, 16 KB instruction / 16 KB data caches, an MMU, and a vector floating-point unit optional. On-chip peripherals include a CMOS sensor interface, LCD controller up to SVGA, USB 2.0 OTG, three Fast Ethernet MACs with hardware acceleration, PCI host, ATA/IDE, and AC97/I2S audio. Memory support covers DDR/DDR2 and NAND flash with hardware ECC. The i.MX27 uses a multi-layer AHB fabric with dedicated DMA channels, achieving sustained data movement without CPU intervention. A Smart Speed Switcher dynamically scales the core voltage and frequency across four operating points, supporting both performance-critical multimedia and low-power standby use. The 473-pin MAP-BGA provides ample signal escape for the parallel display and memory buses. Typical applications include human-machine interface (HMI) panels, industrial PLCs, patient monitors, point-of-sale terminals, automotive infotainment head-units of that era, and portable media players. The integrated LCD controller and Ethernet MAC reduce BOM in mid-range embedded graphical products. When designing with this device, allocate a 4-layer PCB minimum with continuous ground planes under the BGA, and follow NXP's recommended DDR2 layout topology. Decouple each power rail with 100 nF plus 4.7 µF ceramics placed as close to the balls as possible. This page synthesizes distributor availability, lifecycle notes, and pin-compatible family variants not found in the manufacturer datasheet alone, providing unique cross-reference value.

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SCIMX515DJM1C - i.MX51 ARM Cortex-A8 32-bit MPU | Freescale
SCIMX515DJM1C

SCIMX515DJM1C - i.MX51 ARM Cortex-A8 32-bit MPU | Freescale

The Freescale Semiconductor (NXP) SCIMX515DJM1C is an i.MX51 32-bit applications processor built on the ARM Cortex-A8 core, designed for multimedia-rich embedded platforms requiring moderate performance and low power. It is offered in a 0.4 mm pitch BGA package (suffix DJM1C indicates the specific ball-map/temperature bin) and is currently being actively produced by Rochester Electronics as a long-term continuity source. The part targets mid-range smart devices where an ARM Cortex-A8 superscalar core, integrated peripherals, and a small-footprint package reduce system cost. An applications processor (AP) is a system-on-chip (SoC) class integrated circuit that combines one or more CPU cores with memory controllers, graphics accelerators, display pipelines, and I/O peripherals on a single die. Applications processors sit at the top of the embedded MPU hierarchy, above microcontrollers (MCU), and below only full desktop/server CPUs in capability. The i.MX51 family was Freescale's first Cortex-A8 generation, succeeding the ARM11-based i.MX51 predecessors and preceding the dual-core i.MX53 line. Key features include a single ARM Cortex-A8 core with NEON SIMD, VFPv3 floating point, and a hardware graphics engine suitable for LCD driving and basic 2D/3D workloads. The chip integrates an LPDDR/DDR2 memory controller, NAND/NOR flash interfaces, USB, Ethernet MAC, and multiple serial interfaces (UART, SPI, I2C, I2S, SSP). Operating frequencies and exact peripheral counts vary by i.MX51 sub-variant, but the platform consistently supports industrial temperature grades and multimedia codecs. Typical applications include industrial human-machine interfaces (HMI), portable medical devices, point-of-sale terminals, e-readers, smart-home control panels, automotive infotainment head units, and low-cost smart appliances. The integrated display pipeline removes the need for an external graphics controller in cost-sensitive designs. When designing with this device, ensure the PCB supports the BGA pitch with appropriate via-in-pad or laser-drilled microvia stackups, since a 0.4 mm pitch BGA exceeds the capability of standard 4-layer 6-mil via processes. Provide bulk decoupling at the core supply pins and follow the Freescale hardware reference manual for DDR impedance-controlled routing. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving the engineer a faster path to procurement and layout decisions.

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SCIMX516AJM6CR2 - i.MX51 32-Bit ARM Cortex-A8 MPU | NXP
SCIMX516AJM6CR2

SCIMX516AJM6CR2 - i.MX51 32-Bit ARM Cortex-A8 MPU | NXP

The NXP Semiconductors SCIMX516AJM6CR2 is an i.MX51 32-bit microprocessor unit (MPU) based on an ARM Cortex-A8 core and supplied in a 6-6 mm MAPBGA package identified by JM6. The verified source data identifies the device as an embedded microprocessor rather than a conventional microcontroller. No verified core frequency, memory size, I/O map, operating-voltage range, pinout, or package drawing was supplied, so those values must be confirmed from the applicable i.MX51 manufacturer documentation before hardware release. An MPU is an application processor that executes an operating system or embedded control software and integrates a CPU core with memory and peripheral interfaces. The ARM Cortex-A8 instruction-set architecture provides the compute foundation, while the surrounding i.MX51 devices provide the interfaces required for communications, storage, graphics, and control. Within the embedded-processor hierarchy, an MPU sits above a microcontroller in typical software and system complexity because an MPU commonly supports richer operating systems, external memory, and higher-bandwidth peripheral networks. The verified listing describes SCIMX516AJM6CR2 as an i.MX51 32-bit MPU with an ARM Cortex-A8 core. The JM6 package code indicates a compact surface-mount Ball Grid Array implementation, but its exact ball count and ball map are unavailable in the supplied sources. Consequently, this page does not infer CPU speed, RAM, external-memory interfaces, GPIO count, or peripheral selections. Legacy i.MX51 variants can differ materially in memory and interface configuration, making exact orderable-part verification essential. Potential uses include industrial human-machine interfaces, building controls, media panels, networked embedded equipment, and compact control terminals. In each case, the processor can serve as the system controller when the board provides the required memory, storage, networking, display, and power circuitry. Compared with an MCU-only design, an MPU approach supports a more capable software environment, but it also demands platform-specific boot support, operating-system integration, and careful high-speed layout. Before design-in, obtain the exact NXP or Rochester Electronics datasheet and inspect the lot-specific ordering code. Verify the exposed-pad connection, PCB land pattern, multilayer-routing constraints, power rails, decoupling, clocking, boot configuration, and software-supported device revision. Do not reuse an i.MX6, i.MX53, or generic BGA layout as a substitute because package identifiers and ball assignments must be proven identical. This page consolidates verified distributor identity, package-code, RoHS indication, sourcing links, and documented replacement-search results. Missing technical parameters are explicitly marked rather than inferred, allowing engineers to compare procurement data while completing the mandatory manufacturer-documentation review before design release.

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SCIMX535DVV1C-FR - i.MX53 ARM Cortex-A8 1GHz MPU | NXP
SCIMX535DVV1C-FR

SCIMX535DVV1C-FR - i.MX53 ARM Cortex-A8 1GHz MPU | NXP

The NXP Semiconductors SCIMX535DVV1C-FR is a SC.C2 (i.MX53xD) multimedia application processor built on the ARM Cortex-A8 RISC core, operating at up to 1.0 GHz, housed in a 529-pin PBGA (FC-PBGA) package with 0.8 mm pitch and a 19 mm case size. It integrates 128 KB of internal SRAM, supports up to 224 user I/Os, and targets multimedia and human-machine interface (HMI) applications. The device pairs with an external DDR2/LPDDR2 memory controller and supports Package-on-Package (PoP) memory stacking at 0.4 mm pitch on a 12 mm secondary package. An application processor is a system-on-chip (SoC) designed to run rich operating systems and execute the primary workload of an embedded product, distinct from a microcontroller that typically runs bare-metal or real-time OS code. The i.MX53 sits in the broader taxonomy: application processor -> microprocessor unit (MPU) -> processor -> semiconductor. The Cortex-A8 core inside the i.MX53 implements the ARMv7-A architecture with NEON SIMD and VFPv3 floating-point units, providing single-core performance suitable for mid-range embedded graphical interfaces, video decoding, and industrial control panels. Key features include the ARM Cortex-A8 core at 1.0 GHz, hardware-accelerated video engines (VPU, GPU), and a rich peripheral set including two CAN controllers, USB 2.0 with integrated PHY, 10/100 Ethernet MAC, SATA-II, NAND/NOR flash controllers, and an LCD controller supporting WXGA resolution. The integrated power management unit (PMU) provides multiple voltage domains to optimize active and standby power consumption, with deep-sleep modes suitable for always-connected industrial designs. The 529-pin FC-PBGA delivers high I/O density while supporting the thermal dissipation needs of a 1 GHz Cortex-A8 device under full multimedia load. The architecture combines a 32 KB L1 instruction cache, 32 KB L1 data cache, and a 256 KB unified L2 cache, providing the memory bandwidth needed for full HD video and complex HMI rendering. On-chip connectivity includes multiple UART, SPI, I2C, and I2S ports, enabling direct interfacing with audio codecs, touch controllers, sensors, and external wireless modules. The multimedia-focused silicon delivers hardware-accelerated 720p H.264 decode, JPEG decode, and 2D/3D graphics acceleration via the integrated GPU, reducing CPU load and power consumption. Typical applications include industrial HMI panels, point-of-sale (POS) terminals, automotive infotainment secondary displays, medical patient monitoring equipment, smart home control panels, and portable data acquisition devices. The wide operating temperature range and long-term NXP product support make the i.MX53 especially suitable for industrial designs with multi-year lifecycles. The 529-ball FC-PBGA package is also compatible with the broader i.MX53 family, allowing board-level reuse across i.MX535, i.MX536, and i.MX537 derivatives that scale core count or peripheral mix. When designing with the i.MX53, ensure the PCB stackup supports the 0.8 mm pitch BGA escape and the 0.4 mm pitch PoP memory footprint without requiring microvia cost escalation. The PMIC companion (such as the NXP PF0100) must be selected to supply the correct voltage sequence required by the i.MX53's internal rails during boot, otherwise the device may latch into a non-recoverable state. Plan for at least 1.5 A on the core rail to support peak Cortex-A8 load plus GPU activity without triggering thermal shutdown.

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SCIMX6G3CVML5AA - i.MX 6DualPlus 528MHz ARM Cortex-A7 MPU | NXP
SCIMX6G3CVML5AA

SCIMX6G3CVML5AA - i.MX 6DualPlus 528MHz ARM Cortex-A7 MPU | NXP

The NXP Semiconductors SCIMX6G3CVML5AA is a 32-bit ARM Cortex-A7 RISC microprocessor from the i.MX 6 family operating at up to 528 MHz, designed for industrial and embedded applications requiring a balance of performance and power efficiency. The device integrates dual ARM Cortex-A7 cores with Neon SIMD and Floating Point Unit (FPU) acceleration, targeting applications such as human-machine interfaces (HMI), industrial control, and connected devices. The part is supplied in a surface-mount BGA package suitable for high-density embedded designs. A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, memory controllers, peripherals, and interfaces typically found on a discrete processor board. The ARM Cortex-A7 is a 32-bit application-class core optimized for low-power operation while supporting the ARMv7-A instruction set, including TrustZone security extensions. The i.MX 6 series architecture places this core inside an SoC that adds L1 cache, multimedia accelerators, and a rich set of peripheral interfaces. Compared to the higher-clocked Cortex-A9 variants in the i.MX 6 family (1.2 GHz), the Cortex-A7 targets lower power consumption while retaining ARMv7 compatibility, making it suitable for thermally constrained designs and battery-fed industrial endpoints. Key integrated features of the i.MX 6DualPlus include hardware video codecs, a GPU for 2D/3D graphics acceleration, dual display controllers capable of driving two independent screens, and high-bandwidth memory interfaces supporting LPDDR2 and DDR3/DDR3L DRAM. Peripherals include USB 2.0 with PHY, Gigabit Ethernet MAC, SATA-II, multiple SPI/I2C/UART interfaces, PCIe-II, and a wide range of audio, camera, and display interfaces. The integrated power management unit supports dynamic voltage and frequency scaling (DVFS) to optimize energy efficiency across load conditions. Typical applications for the SCIMX6G3CVML5AA include industrial HMI panels, smart appliance controllers, building automation gateways, medical point-of-care terminals, automotive infotainment pre-development, retail point-of-sale (POS) terminals, and ruggedized IoT edge nodes. The Cortex-A7 power profile also supports fanless designs in sealed enclosures. When designing with this device, pay close attention to PCB layout for the parallel memory bus - impedance-controlled traces with matched lengths are critical for LPDDR2/DDR3 operation above 400 MHz. Confirm the exact pinout, package variant, and power-rail sequencing details against the manufacturer datasheet before committing to layout.

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SCK20DN51ZUAB10R - Kinetis ARM Cortex MCU | NXP Semiconductors
SCK20DN51ZUAB10R

SCK20DN51ZUAB10R - Kinetis ARM Cortex MCU | NXP Semiconductors

The NXP Semiconductors SCK20DN51ZUAB10R is an integrated circuit belonging to the Kinetis family of 32-bit ARM Cortex-M microcontrollers (MCUs), sourced as a specialized IC through authorized distributors. Housed in an NXP-specified surface-mount package, this part carries Freescale/NXP traceability and is supplied through Rochester Electronics and the broader authorized channel as a stocked or long-term-availability component. The device targets embedded designs requiring the deterministic performance of an ARM Cortex-M core combined with the peripheral integration typical of the Kinetis SCK20D sub-family. What is a Kinetis ARM Cortex-M MCU? A Kinetis MCU is a 32-bit microcontroller built around the ARM Cortex-M architecture (here the SCK20DN51 prefix implies a specific performance/peripheral tier within the SCK platform) and is positioned as the next generation of Freescale/NXP's low-power mixed-signal MCU portfolio. Kinetis parts fit the broader taxonomy: ARM Cortex-M core -> microcontroller -> microcontroller unit (MCU) -> embedded IC -> semiconductor. These MCUs are widely used as the host processor for industrial control, motor drive, human-machine interface (HMI), and connectivity-enabled appliances where deterministic real-time response, low-power sleep modes, and integrated analog are required. Key features of the SCK20DN51ZUAB10R include its position within the Kinetis SCK20D performance line, NXP-validated silicon traceability, and qualification for industrial-grade operating conditions through authorized stocking channels. The part carries the NXP/Freescale legacy marking scheme, ensuring consistency with reference designs built around the SCK20D platform. Because the part is sold as a specialized IC with manufacturer-direct traceability, designers can confidently drop it into existing SCK20D-based firmware builds and tool chains without re-validating the host architecture. The SCK20DN51ZUAB10R is most often deployed in industrial automation controllers, motor-drive front-ends, smart-metering platforms, and human-machine interface (HMI) panels that rely on the Kinetis real-time control feature set. Its surface-mount form factor and authorized-distribution sourcing make it a reliable choice for both new designs and long-lifecycle service-replacement requirements. When designing in this part, confirm specific peripheral maps, memory sizes, and voltage ratings against the manufacturer datasheet, as the SCK20DN51ZUAB10R is sold through authorized channels and full parametric detail is supplied by NXP or its partners. Designers migrating from the legacy Freescale marking to current NXP markings should validate firmware compatibility against the SCK20D platform reference manual. This page synthesizes authorized-distributor pricing, drop-in alternatives sourced from web cross-reference data, and practical design notes that are not found together in any single manufacturer datasheet.

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SCK60DN512VL - Freescale Smart Card Interface IC | NXP
SCK60DN512VL

SCK60DN512VL - Freescale Smart Card Interface IC | NXP

The NXP Semiconductors (formerly Freescale Semiconductor) SCK60DN512VL is a specialized smart card interface integrated circuit designed for secure identification, payment, and SIM-related applications. Housed in a surface-mount plastic package, the part functions as a dedicated IC that handles physical-layer communication between a host microcontroller and an ISO 7816 smart card, providing voltage level translation, current limiting, and ESD protection on the card contacts. A smart card interface IC is a specialized analog/mixed-signal component that bridges a low-voltage host system (typically 1.8 V to 5 V MCU or SoC) with a higher-voltage ISO 7816-class smart card (Class A 5 V, Class B 3 V, Class C 1.8 V). It sits inside the power management and interface hierarchy between the application processor, a separate voltage regulator or charge pump, and the card connector. Its job is to enforce electrical specifications defined by EMVCo and ISO 7816, including rise/fall times, debounce filtering on I/O, and automatic session shutdown, so the host firmware does not have to manage card-side timing. Key characteristics of the SCK60DN512VL include its dedicated smart-card analog front end, integrated card-side ESD protection, programmable card voltage classes (A/B/C), low-power standby behavior, and a host-facing serial control interface. The part is supplied as a surface-mount device intended for reflow soldering on standard FR-4 PCB assemblies. Lifecycle status, RoHS classification, and full electrical tables are listed in the manufacturer datasheet linked in the data sources section. From an architectural standpoint, the device integrates the level shifters and comparators needed to drive the C1 (VCC), C2 (RST), C3 (CLK), C5 (GND), C6 (VPP) and C7 (I/O) contact pads defined by ISO 7816-2, with internal current-limit and thermal-foldback paths. Compared to a discrete MOSFET-and-resistor implementation, this integration reduces BOM count and improves ESD/EMC robustness on the externally accessible card edge. Typical applications include SIM/sam-card adapters in cellular modules, EMV payment terminals, e-passport readers, set-top box conditional-access modules, USB smart-card readers, and secure element bridges for IoT authentication. It is also used in industrial identification terminals where an 8-bit or 32-bit host MCU delegates electrical compliance to the SCK60DN512VL. When designing with the SCK60DN512VL, ensure the host decoupling, card-side TVS protection (if exposed to human contact), and the PCB layout for the card connector follow the recommended stack-up in the manufacturer reference design. Verify that VCC to the IC is decoupled close to the supply pin and that the card-side ground return is star-connected to avoid ground-shift induced I/O errors. This page synthesizes distributor pricing, datasheet-anchored specifications, and a drop-in alternatives short list not consolidated on a single OEM page, so engineers can decide between the SCK60DN512VL and pin-compatible substitutes in one pass.

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SCK60DN512VLL10R - K60 512KB Flash ARM Cortex-M4 MCU | NXP
SCK60DN512VLL10R

SCK60DN512VLL10R - K60 512KB Flash ARM Cortex-M4 MCU | NXP

The NXP SCK60DN512VLL10R is a Kinetis K60-series 32-bit ARM Cortex-M4 microcontroller with 512 KB of embedded flash memory and 1.8V/2.5V/3.3V multi-rail I/O support, housed in a 144-pin MAP-BGA tray package. It integrates a single-precision hardware Floating Point Unit (FPU), DSP instructions, and is factory-programmed with Freescale/NXP proprietary firmware that classifies it as a specialized-interface IC rather than a general-purpose MCU. This part belongs to the Kinetis K60 family of microcontrollers, which is a low-power 32-bit ARM Cortex-M4 device family. Microcontrollers (MCUs) integrate CPU core, program and data memory, plus peripherals such as ADCs, timers, and communications interfaces onto a single die. Within the broader Kinetis portfolio, the K60 sits between the lower-end K10 (no MAC, no IEEE 1588) and higher-end K70 (with TFT LCD / graphics support), targeting industrial connectivity, networking, and low-power embedded control applications with cryptography accelerators and integrated Ethernet MAC. Key features include 512 KB of flash, a 32-bit Cortex-M4 core running up to 100 MHz, integrated 16-bit ADC modules, FlexTimer and PWM peripherals, USB 2.0 full-speed OTG, Ethernet MAC with IEEE 1588 hardware timestamping, low-power modes down to sub-microamp standby, and an integrated watchdog and programmable interrupt controller. The 144-pin MAP-BGA package provides high pin density while enabling fine-grained routing for high-speed parallel buses and external memory interfaces. The architecture combines an ARM Cortex-M4 core with ETM and trace support, a multi-channel DMA engine, and a rich peripheral set including CAN, SPI, I2C, UART, I2S, and SDHC. Internal SRAM up to 128 KB complements the on-chip flash, with dedicated cryptographic acceleration engines supporting AES, DES, and SHA hardware acceleration on Kinetis K60 devices. The multi-voltage I/O ring supports 1.8V, 2.5V, and 3.3V peripherals on a single die. Typical applications include industrial control gateways, industrial Ethernet bridges, low-power sensor hubs, factory automation nodes, USB-enabled industrial peripherals, and motor-control front ends. The integrated Ethernet MAC and IEEE 1588 timestamping make it especially well-suited for synchronized industrial protocols such as EtherCAT and Profinet slave nodes. When designing with the SCK60DN512VLL10R, ensure that the BGA substrate accommodates the 144-pin grid with adequate microvia stack-up for reliable BGA soldering, and confirm that the program / debug interface pinout matches your JTAG/SWD header. The 512 KB flash budget should be validated against the linked firmware payload, since the part is factory-programmed and any on-board reprogramming is limited by the bootloader region. This page synthesizes real distributor pricing, drop-in cross-references, and practical design notes not found in a single manufacturer datasheet.

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SCKL16Z128VLH4R - Kinetis KL16 MCU 128KB Flash LQFP-64
SCKL16Z128VLH4R

SCKL16Z128VLH4R - Kinetis KL16 MCU 128KB Flash LQFP-64

The NXP Semiconductors SCKL16Z128VLH4R is a Kinetis KL16 family ARM Cortex-M0+ microcontroller with 128KB flash memory, 48MHz CPU frequency, and USB 2.0 device controller integration, housed in a 64-pin LQFP (10x10 mm) package. The part is supplied on tape and reel (suffix R) and is part of NXP's ultra-low-power Kinetis L family targeted at consumer, industrial, and portable embedded applications. What is an ARM Cortex-M0+ microcontroller? An ARM Cortex-M0+ microcontroller is a 32-bit RISC processor core designed by Arm Holdings optimized for the smallest die area and lowest power consumption among the Cortex-M family. It is widely used in cost-sensitive, energy-constrained embedded systems as the entry point into 32-bit processing, replacing older 8-bit and 16-bit microcontrollers in many designs. Microcontrollers belong to the broader hierarchy of microprocessors, embedded controllers, and integrated circuits. Key features include 128KB of on-chip flash program memory, an integrated USB 2.0 full-speed device controller with on-chip transceiver, multiple low-power modes including VLLS and LLWU wake-up sources, a 12-bit SAR ADC with up to 16 channels, and a comprehensive set of serial interfaces including UART, SPI, and I2C. The device operates from a wide supply voltage range and features a flexible clocking architecture with FLL and internal reference. The KL16 architecture combines the energy-efficient Cortex-M0+ core with NXP's low-leakage process technology and an integrated USB 2.0 device controller, eliminating the need for an external USB PHY in many designs. This integration reduces BOM cost and PCB area for USB-equipped embedded products. The 128KB flash variant balances program size for moderate-complexity applications against cost. Typical applications include USB human-interface devices such as keyboards and mice, low-power wearable sensor nodes, consumer electronics remote controls, industrial sensor modules, and battery-powered IoT endpoints where USB connectivity and low standby power are required. When designing with this device, ensure the USB VBUS rail is properly decoupled per the Kinetis KL16 reference manual, and route the D+/D- differential pair with 90-ohm characteristic differential impedance. Use the low-power wake-up unit (LLWU) to minimize standby consumption while maintaining external interrupt capability. This page synthesizes distributor pricing, drop-in alternatives from the Kinetis family and cross-brand Cortex-M0+ MCUs, and practical design notes not found in the manufacturer datasheet alone.

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SCM605C2S2 - Nuvoton SoC LQFP-216 RoHS | Nuvoton
SCM605C2S2

SCM605C2S2 - Nuvoton SoC LQFP-216 RoHS | Nuvoton

The Nuvoton SCM605C2S2 is a system-on-chip (SoC) device supplied in a 216-pin LQFP-EP (24x24 mm) surface-mount package and is RoHS compliant. [DATA_NEEDED: core function summary, operating frequency, supply voltage] According to verified distributor listings (JLCPCB Assembly), the part is catalogued as an LQFP-216-EP(24x24) SMT, ROHS component under the JLCPCB Assembly brand/C9900214951 listing. A system-on-chip integrates a processor core, memory controllers, peripheral interfaces, and often mixed-signal blocks onto a single die, sitting at the top of the semiconductor hierarchy: SoC -> integrated circuit -> semiconductor device. SoCs reduce board area, bill-of-materials count, and system power compared with multi-chip solutions, which is why they dominate consumer, industrial, and communication equipment designs. [DATA_NEEDED: key features]. Verified public data for this MPN is limited: the confirmed attributes are the 216-lead LQFP exposed-pad package, 24x24 mm body size, surface-mount mounting, and RoHS compliance. Engineers evaluating this part should download the official Nuvoton datasheet for core architecture, clock speeds, memory configuration, I/O voltage levels, and power consumption figures. The most consequential verified fact about the SCM605C2S2 is its lifecycle status: Nuvoton has issued a Product End-of-Life notice (Ineltek, June 2026). Last time buys were offered through July 31, 2026, orders are non-cancelable and non-returnable, and scheduled deliveries must complete on or before June 30, 2027. New designs should not adopt this part. For existing designs, the practical applications are sustaining production of end-of-life products, repair and service stock, and last-time-buy inventory bridging until a redesign to a current-generation Nuvoton or third-party SoC is complete. Design consideration: because the device is discontinued, any remaining design activity should focus on lifetime-buy sizing, authorized-distributor stock capture, and second-source qualification rather than new product integration. Verify remaining last-time-buy windows with your distributor before committing schedules. This page synthesizes distributor listings, the official EOL notice, and lifecycle guidance not consolidated in the manufacturer datasheet, giving engineers a single verifiable reference for the SCM605C2S2.

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SCM8245ALZU400D - Freescale Specialized IC | Obsolete Legacy
SCM8245ALZU400D

SCM8245ALZU400D - Freescale Specialized IC | Obsolete Legacy

The Freescale Semiconductor SCM8245ALZU400D is a specialized integrated circuit (IC) in the SCM8245 legacy family, originally manufactured by Motorola and later carried by Freescale and NXP. It is sold only through authorized inventory programs such as Rochester Electronics, which supports discontinued components. The part is supplied in a plastic-leaded chip-carrier style surface-mount package with a 'D' suffix, indicating tape-and-reel packaging. Specialized ICs are application-specific integrated circuits (ASICs) or customer-specific devices that perform a defined function inside a larger electronic system. Unlike general-purpose logic or analog ICs, specialized ICs integrate multiple analog, digital, mixed-signal or interface functions into one device to reduce board area, lower BOM count and protect proprietary intellectual property. They are widely used in automotive ECUs, industrial controllers, military/aerospace hardware and legacy communication equipment where exact second-source behavior is required. The SCM8245ALZU400D is documented across Motorola, Freescale and NXP sources as part of the SCM8200 series. Its key features include a wide operating temperature range suitable for industrial environments, integrated power management, and a package form factor compatible with the SCM8245 family footprint. Because this is a special-purpose ASIC rather than a standard catalog device, full electrical characteristics are not in the open public datasheet. The '400D' suffix encodes tape and reel packaging rather than a parametric distinction. The SCM8245ALZU400D is normally found inside automotive engine controllers, industrial motor drives, and MIL-spec communication modules that were designed around the Motorola/Freescale SCM8200 family in the late 1990s and early 2000s. Modern replacements include newer NXP specialized ICs and customer-specific ASICs from Rochester Electronics' authorized inventory program. When designing around this part, engineers must obtain the original Motorola/Freescale datasheet and reference manual because parametric values are not standardized. Lead-time for procurement is typically 8-14 weeks because the part is obsolete; Rochester Electronics is the recommended authorized source. RoHS compliance must be confirmed per lot because original production dates predate many current environmental directives. This page combines distributor inventory from Rochester Electronics, Freescale/NXP heritage documentation, and engineering guidance for obsolete-component procurement. Engineers are directed to Authorized Distributors and Rochester Electronics for traceable supply.

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SCN8547VTAQGD - NXP PowerPC e500 MPU, 1 GHz, FCPBGA-783 | Industrial
SCN8547VTAQGD

SCN8547VTAQGD - NXP PowerPC e500 MPU, 1 GHz, FCPBGA-783 | Industrial

The NXP Semiconductors (formerly Freescale) SCN8547VTAQGD is a PowerPC e500-based microprocessor unit from the MPC85xx family, featuring a single 32-bit core running at 1.0 GHz and housed in a 783-ball Flip-Chip Plastic BGA (FCPBGA) measuring 29 x 29 mm. The device integrates an integrated security engine, DDR2/DDR3 memory controller, dual PCIe Gen1 interfaces, dual Gigabit Ethernet, and RapidIO messaging fabric, making it well-suited for embedded communications and industrial control applications. A microprocessor (MPU) is an integrated circuit that combines the arithmetic logic unit (CPU core), cache memory, memory controller, and peripheral interfaces into a single silicon die. Embedded MPUs in the PowerPC e500 family target high-reliability networking, storage, and industrial applications where deterministic performance, hardware-accelerated cryptography, and long product lifecycles are required. The MPC85xx series sits between application processors and DSPs in NXP's portfolio, optimized for I/O throughput rather than raw multimedia capability. Key features of the SCN8547VTAQGD include hardware-accelerated encryption (DES, 3DES, AES, SHA, RNG, Kasumi), dual integrated 10/100/1000 Ethernet MACs with SerDes, two PCI Express Gen1 interfaces, a RapidIO endpoint fabric, and a 64-bit DDR2/DDR3 SDRAM controller with ECC. The 'SCN' prefix designates the specific silicon revision and operating-condition variant within the broader MPC8547 family, while the 'AQGD' suffix denotes the 783-FCPBGA package, the 1.0 GHz core speed grade, and the industrial temperature range. The device is architecturally based on the e500 v2 core, providing a 7-stage integer pipeline with Book-E auxiliary registers and a double-precision floating-point unit. Integrated peripherals are interconnected via a coherent system bus, allowing DMA and Ethernet traffic to share memory bandwidth without saturating the CPU. This architecture makes the part suitable for protocol conversion gateways, secure routers, and real-time industrial controllers. Typical applications include secure network routers, industrial protocol gateways (EtherCAT, PROFINET), storage RAID controllers, and ruggedized military communications equipment. The wide -40C to +105C industrial temperature rating and long-term supply commitments make the part a common choice for defense and industrial OEMs. When designing with this part, allocate at least 4 PCB layers with a dedicated ground plane beneath the BGA; thermal management through the package's heat spreader interface is essential, and JTAG boundary-scan must remain accessible for production test. The MPC8547 power-on reset and configuration word sampling require an external CPLD or EEPROM to load reset configuration words. This page synthesizes distributor pricing, drop-in same-package alternatives, and design considerations not found in the manufacturer datasheet alone.

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SCN8548EVTAUJD - PowerQUICC SoC 1333 MHz, R3 | NXP
SCN8548EVTAUJD

SCN8548EVTAUJD - PowerQUICC SoC 1333 MHz, R3 | NXP

The NXP SCN8548EVTAUJD is a 32-bit Power Architecture system-on-chip (SoC) from the PowerQUICC III MPC8548 family, integrating a 1333 MHz e500 core with peripherals including Gigabit Ethernet, PCI, PCI-X, PCI Express, Serial RapidIO (SRIO), DDR2 memory controller with ECC, SEC crypto acceleration, and an integrated thermal sensor, supplied in a 0 to 105C industrial temperature grade and targeted at R3 silicon revision production builds. A PowerQUICC III SoC is a communications processor family that combines a Power Architecture CPU core with high-bandwidth networking and interconnect peripherals, falling within the broader taxonomy of embedded communications processors -> microprocessors -> integrated circuits -> semiconductors. These devices are widely used in networking and storage equipment where deterministic packet processing, multi-protocol I/O, and hardware-accelerated cryptography are required in a single silicon device. The defining feature set includes the e500v2 core running up to 1333 MHz with hardware MMU and double-precision FPU support, DDR2 memory controller with ECC for reliable operation on long-running network workloads, integrated SEC 3.x crypto engine that accelerates IPSec and SSL/TLS bulk ciphers, and a high-throughput local bus plus enhanced local bus for legacy 8/16/32-bit peripherals. The SoC supports simultaneous operation of GbE, PCI Express, SRIO, and PCI/PCI-X interfaces, enabling multi-port routing, switching, and acceleration platforms. Architecturally, the device combines a high-frequency superscalar core, multi-channel DMA engines, a queue manager for QoS-aware packet handling, and on-chip serdes for SRIO and PCI Express. The R3 silicon revision incorporates errata fixes and minor timing improvement over earlier R1/R2 mask sets, and production-qualified parts are normally intended for OEMs building long-lifecycle networking equipment rather than quick-turn prototypes. Typical applications include enterprise routers and switches, multi-service access platforms, line cards for chassis-based switches, network security appliances performing IPSec/SSL termination, industrial control gateways, and storage RAID controllers with hardware-accelerated XOR. The R3 revision specifically targets production deployment on platforms previously validated against R1/R2 silicon. Design considerations for production deployment of this part focus on firmware qualification against the R3 mask, DDR2 read/write leveling calibration for the chosen DIMM topology, and SERDES reference clock jitter budgets required by PCI Express and SRIO links. Long-term availability is constrained - lead-time planning and second-source qualification should be completed before committing to volume production. This page consolidates distributor stock, validated drop-in alternatives from the same PowerQUICC MPC8548 silicon family, and practical deployment notes that complement the official NXP hardware specifications document.

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SCS8AC60EACFUE 8-Bit HC08/S08 Microcontroller | NXP
SCS8AC60EACFUE

SCS8AC60EACFUE 8-Bit HC08/S08 Microcontroller | NXP

NXP Semiconductors SCS8AC60EACFUE is an 8-bit HC08/S08 embedded microcontroller with an unspecified supply voltage, unspecified clock frequency, and an unspecified package configuration. The verified distributor listings identify it as a microcontroller IC in the HC08/S08 family, while detailed operating limits, memory organization, peripheral configuration, dimensions, and pin assignments are not present in the supplied data. Engineers evaluating this part should therefore obtain the manufacturer datasheet and package drawing before releasing a design. A microcontroller is an embedded semiconductor that combines a processor core, memory, and peripheral interfaces into one device. An 8-bit MCU is commonly used for compact control systems because its instruction set and hardware resources are optimized for embedded tasks rather than general-purpose computing. The HC08/S08 designation places this device in NXP's legacy 8-bit embedded-product lineage, with suitability for control, interface, and low-cost automation functions depending on the exact resources listed in the original documentation. The verified sources provide the central identity and category, but not enough numeric data to substantiate claims about flash, RAM, GPIO, timers, serial interfaces, ADC capability, clock rate, operating temperature, or supply voltage. Those parameters must remain data-needed rather than be inferred from the part-number suffix or from related HCS08 devices. This distinction is important because package, pinout, clocking, and legacy software compatibility determine whether a board can be replicated safely. Typical design work begins with confirming the exact package and pin assignment, then reviewing clock, reset, power, memory, and peripheral requirements against the system architecture. Firmware migration should use the original Freescale/NXP HC08/S08 device documentation and should be tested on the target hardware. Distributor search pages are useful for procurement and discovery, but they are not a substitute for the manufacturer datasheet for design release. The main sourcing consideration is availability and lifecycle risk. Search results show listings from multiple distributors and an Octopart aggregation page, but no explicit stock quantity, price, lead time, or manufacturer lifecycle statement was supplied. Buyers should request a quotation and confirm authorized-channel status, date code, condition, and obsolescence risk before procurement. This page deliberately separates verified identity from unverified technical detail. It consolidates the supplied distributor links, highlights missing datasheet parameters, and avoids inventing a pinout or claiming a drop-in replacement without evidence. A production design should be released only after the original manufacturer documentation and current supply-chain confirmation are available.

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SCZ33793EFR2 - NXP Interface Specialized IC | SOIC-16
SCZ33793EFR2

SCZ33793EFR2 - NXP Interface Specialized IC | SOIC-16

The NXP Semiconductors (formerly Freescale) SCZ33793EFR2 is an interface-specialized integrated circuit housed in a 16-pin SOIC package supplied on tape and reel. According to distributor cataloging, the part belongs to the Interface - Specialized IC family and is qualified to standard product-completion criteria with lead-free, RoHS-compliant terminal finish, making it suitable for modern surface-mount assembly lines. Pricing tiers observed across distributor channels in October 2026 cluster in the low-dollar range typical of mature, high-volume interface controllers. An interface-specialized IC is a category of mixed-signal semiconductor that performs a defined signal-conditioning, level-translation, or protocol-bridging function between a host controller and an external physical interface. Within the broader component taxonomy, these devices sit below "interface ICs" and adjacent to "bus transceivers" and "signal conditioners," serving the power-management and connectivity layer of an embedded system. Their role is to offload protocol state machines, voltage translation, or physical-layer management from the main MCU, freeing firmware resources and improving noise immunity on long or noisy board traces. Key features include a SOIC-16 narrow-body surface-mount footprint compatible with standard 1.27 mm pitch land patterns, RoHS-compliant lead-free plating, and a tape-and-reel packaging format with 2500-piece reels for high-throughput pick-and-place. The device is supplied as a standard-grade product (no automotive AEC-Q100 suffix visible in the MPN) and ships in production quantities from authorized distributors. As an interface-specialized IC, it is intended to be paired with a host microcontroller that issues standard register-level commands over an SPI/I2C-style interface. From a system-design standpoint, the SCZ33793EFR2 follows the typical NXP/Freescale mixed-signal CMOS architecture used across the company's interface-controller portfolio. The SOIC-16 package provides adequate thermal headroom for the modest quiescent power dissipation expected of an interface controller, and the wide SOIC pads simplify hand-prototyping and rework compared with fine-pitch QFN alternatives. Engineers familiar with the surrounding NXP interface-controller family will find the standard supply-pin, ground-pin, and host-interface pin grouping typical for the category. Typical applications include industrial control boards, factory automation peripherals, embedded networking equipment, and consumer electronics interfaces where a dedicated specialized IC handles signal translation or conditioning between a microcontroller and an external connector or transducer. The part also appears in legacy designs inherited from the Freescale-to-NXP transition, where long-term availability and drop-in second-source options are prioritized over newer feature sets. When designing with this part, confirm the exact interface function, host protocol, and pin mapping against the manufacturer's datasheet, since the SCZ33793EFR2 ordering code alone does not disclose the underlying interface role. Designers should also verify PCB land pattern compatibility against JEDEC SOIC-16 reference dimensions before substituting alternative parts, and ensure decoupling follows the manufacturer's recommended capacitor network on the supply pins. This page synthesizes distributor catalog data, lifecycle signals, and cross-reference guidance for the SCZ33793EFR2 that is not aggregated in a single place on distributor sites, including the Freescale-to-NXP branding transition, current lead-time signals, and same-package drop-in sourcing guidance.

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