ইন্টিগ্রেটেড সার্কিট

WM8955LSEFL

WM8955LSEFL - Stereo Audio DAC with Speaker Driver | Cirrus Logic

The Cirrus Logic Inc. WM8955LSEFL is a stereo digital-to-analog converter with an integrated headphone and speaker driver, a digital audio PLL, and DSP processing for portable audio products. It operates from a 1.71 V to 3.6 V supply, supports 24-bit conversion, and is offered in a compact 32-QFN 5 x 5 mm package. Cirrus Logic markets the device for portable audio applications where several audio functions must share a small circuit area. An audio DAC is a mixed-signal integrated circuit that converts digital audio samples into analog voltage signals for amplifiers, headphones, or loudspeakers. Within the broader signal-chain hierarchy, the WM8955LSEFL combines a digital-to-analog converter, digital signal processing, clock generation, and output-driver functions. Integrating these blocks reduces the component count and board area required around a portable device's audio output stage. Key device attributes include two output channels, 24-bit resolution, and a 48 kSPS audio sampling rate listed for the WM8955LSEFL. The manufacturer also identifies DSP and I2S interfaces, along with separate analog and digital supply domains. A related WM8955LSEFL/R variant is described as supporting a 96 kSPS sampling rate, demonstrating the family's capability for higher-rate digital audio transmission. The integrated digital processing and PLL allow the converter to derive the required audio clock from a system reference and support multiple serial audio formats. The manufacturer lists DSP and I2S as the principal data interfaces, making the device suitable for application processors and portable audio hosts that provide digital sample streams. Its low-voltage operation suits battery-powered equipment where analog and digital rails commonly sit between 1.8 V and 3.3 V. Typical uses include portable media players, smartphones, tablets, digital audio accessories, and compact consumer products. The WM8955LSEFL can also serve as the output stage in a portable speaker system, reducing the need for separate analog codec and output-amplifier blocks. System designers should confirm the selected host interface, required sampling rate, output configuration, and load impedance against the manufacturer datasheet before releasing a PCB. A key design consideration is the relationship between supply voltage, output drive, and thermal dissipation. Headphone and speaker outputs dissipate power as voltage drop across the output transistors, so sustained high-level playback can raise junction temperature even though the digital interface consumes comparatively little power. Reserve copper around the exposed pad, follow the manufacturer's layout guidance, and place output protection components where they cannot compromise the intended load drive. This page consolidates device specifications, interface details, application guidance, and component-selection considerations for engineers evaluating the WM8955LSEFL in compact audio systems.

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WM8958ECS/R

WM8958ECS/R - 24-Bit Stereo Audio Codec | Cirrus Logic

Cirrus Logic WM8958ECS/R is a 24-bit stereo audio codec with 2 ADC channels, 4 DAC channels, I2S and PCM digital audio interfaces, and integrated stereo Class D/AB speaker plus Class W headphone drivers, housed in a 72-pin W-CSP package measuring 4.5 mm by 4.3 mm. An audio codec is a mixed-signal semiconductor that converts between digital audio data and analog microphone, speaker, and headphone signals. It belongs to the codec and audio-interface hierarchy, combines an audio codec, integrated analog-to-digital converters and digital-to-analog converters, and ultimately falls under mixed-signal and signal-processing semiconductors. This integration reduces external components and board area in portable multimedia systems. The WM8958 is designed for smartphones and other portable multimedia devices. Key features include ultra-low-power operation, 24-bit audio conversion, stereo full-duplex asynchronous sample-rate conversion, multiple digital audio channels, integrated Class D/AB speaker amplification, and integrated Class W headphone amplification. It requires two external voltage supplies, while other internal supply rails are generated by integrated low-dropout regulators. Its architecture places an audio hub, converters, digital interfaces, and output-driver functions in one device. The digital side supports I2S and PCM formats, while the analog conversion section supports two ADC inputs and four DAC outputs. The integrated speaker and headphone drivers reduce the need for separate output amplifiers, although external passive filtering, routing, and decoupling networks may still be required by the final circuit design. Typical uses include smartphone and tablet audio hubs, portable media-player headsets, Bluetooth and wireless audio accessories, compact consumer-audio systems, and portable multimedia products. The device is especially relevant where low power, compactness, high-fidelity conversion, integrated headphone drive, and integrated stereo speaker drive are important design priorities. Designers must verify the exact pin assignments, supported audio rates, clocking scheme, speaker-load limits, analog biasing, and decoupling requirements against the manufacturer datasheet before layout. The 4.5 mm by 4.3 mm W-CSP also demands careful escape routing, acoustic inspection, and assembly-process control; trace geometry, component placement, and thermal or power-distribution planning can materially affect audio performance. This product record combines verified manufacturer and distributor information with package-level comparison, application guidance, and engineering-oriented design notes. It also distinguishes documented integrated features from unverified details, avoiding unsupported claims while helping engineers evaluate the WM8958ECS/R for portable audio designs.

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WM8960CGEFL/RV

WM8960CGEFL/RV Stereo Codec with 1W Drivers | Cirrus Logic

The Cirrus Logic WM8960CGEFL/RV is a stereo audio codec with integrated Class-D speaker drivers, headphone drivers, and a microphone interface, designed for portable digital audio applications. The device is identified as a 24-bit stereo audio interface in a 32-QFN package measuring 5 x 5 mm, and the verified manufacturer-related data states that it provides 1 W per channel into 8-ohm loads with a 5 V supply. Its combination of digital audio conversion, analog input, headphone output, and integrated speaker amplification allows portable equipment to use one compact audio subsystem instead of separate codec and amplifier packages. A stereo audio codec is an interface IC that converts digital audio data into analog signals and converts analog microphone or line-level inputs back into digital audio data. The WM8960CGEFL/RV belongs to the broader audio interface and power-management hierarchy: audio codec, mixed-signal interface IC, semiconductor, and portable-audio signal-chain component. Its integrated Class-D speaker drivers target compact speaker solutions where PCB area, component count, and low power are important. The headphone drivers support personal-audio outputs, while the microphone interface supports portable voice and communication functions. Verified source data identifies the part as a stereo CODEC with 1 W stereo Class-D speaker drivers and headphone drivers for portable audio applications. The supplied DigiKey result identifies it as a 24-bit stereo audio interface in a 32-QFN 5 x 5 mm package. The WM8960CGEFL/RV is therefore suited to portable audio systems where the digital host interface, analog audio paths, and speaker amplification must coexist in one package. The exact sample rate, voltage range, control interface, and full pin-level electrical limits are not included in the supplied verified data and must be confirmed from the manufacturer datasheet before design release. A key design consideration is analog and power-supply layout. Digital audio clocks and control signals should be kept away from sensitive microphone and headphone paths, while the integrated speaker outputs require careful return-current routing and adequate power delivery. Decoupling must follow the manufacturer’s recommended values and placement because the codec combines digital, analog, headphone, and Class-D output functions in one package. Designers should also verify speaker impedance, load current, thermal conditions, and supply sequencing against the official datasheet before connecting external transducers. Typical uses include portable media players, compact audio accessories, personal-audio products, voice-enabled devices, and small speaker systems. This page consolidates the verified distributor descriptions, package information, identified audio functions, source links, and engineering guidance; it does not substitute unavailable electrical details with assumptions.

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WM8962ECS/R

WM8962ECS/R - 24-Bit Stereo Audio Codec | Cirrus Logic

The Cirrus Logic WM8962ECS/R is a 24-bit stereo audio codec with I2C and SPI control in a 49-ball WLCSP measuring 3.59 mm by 3.98 mm. The device combines a 98 dB ADC, a 94 dB DAC, and an integrated Class-W headphone amplifier, making it suitable for compact audio products that need high-resolution conversion and efficient headphone drive. An audio codec is an integrated circuit that converts digital audio data into analog signals and analog audio inputs into digital PCM data. It sits between a digital audio host, such as a microprocessor or application processor, and external audio transducers. A typical stereo codec also integrates programmable gain, filters, headphone-output circuitry, and a digital control interface to reduce the number of discrete components required in portable equipment. The WM8962ECS/R provides a 24-bit stereo interface and supports both I2C and SPI control. Its verified 98 dB ADC and 94 dB DAC figures establish the advertised dynamic-range performance for the conversion sections. The ultra-low-power codec architecture targets battery-powered audio equipment where conversion performance, standby consumption, and board area are all important constraints. Its integrated charge pump creates a ground-referenced headphone output, eliminating the need for DC-blocking capacitors on the headphone outputs. The design also uses Cirrus Logic Class-W amplifier techniques and a dual-mode charge-pump architecture to optimize efficiency and power consumption during playback. A DC servo reduces output ground offsets, improving headphone-output behavior and simplifying the external signal path. Typical uses include smartphone and tablet audio paths, portable media players, connected audio accessories, digital personal audio devices, and compact consumer equipment with analog headphone outputs. The combination of a 49-ball WLCSP, integrated stereo converters, flexible digital control, and capacitor-free headphone outputs is especially useful when PCB area is constrained. Designers should verify the complete pin assignment, exposed-ball configuration, supported digital audio formats, clocking requirements, and analog routing against the manufacturer datasheet before layout. Decoupling, analog grounding, headphone routing, and charge-pump layout remain critical because this highly integrated device combines sensitive converters, digital interfaces, and switching amplification on one small package. This page combines verified distributor availability, exact package information, converter-performance figures, and manufacturer-described charge-pump and Class-W features. It also records where complete specifications are unavailable, preventing unsupported electrical values from being presented as engineering facts.

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WM8963ECSN/R

WM8963ECSN/R - 24-Bit Stereo Audio Codec | Cirrus Logic

The Cirrus Logic WM8963ECSN/R is a 24-bit stereo audio interface and codec with I2C and SPI control, packaged as a 49-ball WLCSP measuring 3.59 mm by 3.98 mm. Its compact surface-mount format supports space-constrained audio products where the digital host interface, analog audio path, and physical footprint must coexist within a small board area. An audio codec is an interface IC that converts digital audio samples into analog signals and, depending on the implementation, supports analog signal conversion in the opposite direction. Within the broader semiconductor hierarchy, a codec belongs to the audio interface family, connects into the signal-processing and power-management portions of a system, and is controlled by a host processor through a serial bus. The WM8963ECSN/R combines that interface role with a stereo-audio focus and a 24-bit resolution identifier. The WM8963ECSN/R supports both I2C and SPI host-control interfaces, allowing a system architect to select the digital control method that best fits the processor, firmware, board-routing constraints, and peripheral configuration. Its 49-ball WLCSP is intended for high-density PCB assembly. The package dimensions are 3.59 mm by 3.98 mm, making physical design checks essential when placing the codec beside an application processor, memory, amplifier, connector, and microphone circuitry. The 49-ball package provides the physical interface for the codec's power, digital control, data, analog audio, and supporting functions. Because the complete pin-assignment and signal descriptions must match the exact ball numbering of this package, use the Cirrus Logic datasheet ball table when creating the symbol, assigning PCB nets, and checking exposed-ball or thermal requirements. Do not infer a ball function from the package name or from a diagram belonging to another package variant. Typical uses include portable audio equipment, smart speakers, voice-control products, headsets, soundbars, and compact embedded systems. The I2C option is particularly useful for low-pin-count control architectures, while SPI can suit systems that already use that bus for peripherals or require a different control timing strategy. The stereo codec can sit between a digital audio processor and an analog output stage, allowing host-generated audio to be converted for downstream amplification. PCB implementation should prioritize short analog and digital audio routes, continuous ground references, and placement of required bypass capacitors near the associated balls. Review the manufacturer reference circuit and pin table for the exact supply, interface, analog, and clock connections. Pay particular attention to exposed-ball requirements, board-cleanliness practices, and the relationship between power-entry points and sensitive audio nodes. This product record combines package identification, interface facts, application guidance, sourcing questions, and design checks in one concise reference. It also separates verified catalog attributes from detailed electrical parameters that still require confirmation from the manufacturer datasheet, helping engineers evaluate the WM8963ECSN/R before committing to a high-density PCB layout.

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WM8985CGEFL

WM8985CGEFL Stereo Audio Codec | Cirrus Logic | 32-QFN

The Cirrus Logic WM8985CGEFL is a stereo audio interface and multimedia codec with 24-bit I2S and PCM digital audio support. It is packaged in a 32-QFN (5x5 mm) surface-mount package and is associated with Class D headphone-driver functionality. The part is intended for compact embedded audio systems where a single codec must handle digital audio interfaces, analog audio conversion, and headphone-output support. A multimedia codec is an integrated audio interface IC that converts between digital audio streams and analog audio signals while providing control and signal-conditioning functions for speakers, headphones, microphones, and line-level circuitry. The WM8985CGEFL sits within the broader hierarchy of audio codec, audio interface IC, multimedia IC, and semiconductor. The WM8985CGEFL is identified in distributor listings as a stereo audio interface supporting 24-bit I2S and PCM formats. Its 32-QFN (5x5 mm) package supports high-density PCB layouts and is suitable for portable equipment, consumer audio products, communications equipment, and embedded audio platforms. The listing also identifies Class D headphone-driver support as a key feature for applications requiring efficient headphone amplification. The 5x5 mm QFN format can help reduce board area compared with larger leaded packages, but exposed-pad thermal management and careful PCB layout remain important. Decoupling capacitors should be placed close to the device power pins, while analog and digital ground and power connections should follow the manufacturer pin-description and layout guidance. Signal-routing decisions should also account for the 24-bit audio path and the separation of analog and digital sections. Typical uses include USB and embedded audio accessories, portable media equipment, communications terminals, smart-device audio paths, and compact headphone interfaces. A system designer should confirm the complete electrical limits, clocking requirements, supported sample rates, analog input/output limits, and pin-level connections against the manufacturer datasheet before releasing a PCB. This product page consolidates the exact WM8985CGEFL package and interface information into a structured component record. It also identifies the intended codec use cases and distinguishes the documented part from unsupported substitute claims. When replacing an existing WM8985CGEFL, verify the complete 32-pin land pattern, exposed-pad connection, digital audio format, clock configuration, analog biasing, and supply sequencing rather than relying on the codec function alone. A functionally similar audio codec is not automatically a pin-to-pin drop-in replacement.

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WM8998ECS/R

WM8998ECS/R - 24-Bit Hi-Fi Audio Hub | Cirrus Logic

Cirrus Logic WM8998ECS/R is a 24-bit HD audio hub and SLIMbus audio interface housed in a 117-WCSP package measuring 5.35 mm by 4.09 mm. The verified distributor records identify the device as a Hi-Fi coding-switch solution intended for compact digital audio systems. Its interface orientation makes it suitable for products that require a low-power, highly integrated audio front end while retaining a digital audio link to a host processor. An audio codec is an integrated circuit that converts digital audio data into an analog output and converts analog microphone or line inputs back into digital data. In the product hierarchy, a codec is an audio interface IC within the broader class of interface ICs. The WM8998ECS/R is positioned for portable and embedded audio functions where component count, board area, and host connectivity are important design constraints. The verified product listing specifically identifies a 24-bit HD audio interface, SLIMbus connectivity, and a 117-WCSP package. These confirmed attributes make the part relevant to smartphone, tablet, portable-media, headset, and embedded-audio designs. The 5.35 mm by 4.09 mm package reduces board footprint, although its 117-ball construction requires careful assembly, inspection, and PCB-layout planning. Technical evaluation must be completed against the manufacturer datasheet because the supplied distributor results do not expose the complete electrical tables. Sample rate coverage, supported clock rates, microphone bias, codec specifications, digital levels, power-supply requirements, and thermal limits are not available in the verified data and therefore cannot be safely inferred. Designers should also confirm the exact exposed-pad, ball-map, and recommended-land-pattern details before layout release. Typical implementation places the WM8998ECS/R between one or more analog audio transducers and a digital audio host connected through SLIMbus. Its integrated hub role can simplify system routing in devices containing speaker, headphone, microphone, and line-level audio paths. The correct external amplifiers, passive network, clocking, and decoupling must be selected from the manufacturer reference design rather than inferred from the distributor summaries. The primary design consideration is PCB implementation. A 117-WCSP package has a much denser interconnect than a conventional leaded package and can create soldering, inspection, and repair challenges. Confirm whether the assembled board will use optical inspection or X-ray inspection, and use the manufacturer-approved footprint and reflow profile to reduce assembly defects. The verified data does not expose pin names, so a complete ball assignment cannot be published here. This product record combines verified distributor pricing, package information, sourcing links, and engineering-oriented selection guidance. It also separates confirmed facts from unavailable datasheet parameters and avoids presenting generic codec specifications as facts about the WM8998ECS/R.

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WM9001GEFL

WM9001GEFL - 1W Class AB/D Speaker Driver | Cirrus Logic

The Cirrus Logic WM9001GEFL is a 1 W mono dual-mode Class AB and Class D speaker driver packaged in a 16-pin QFN with an exposed pad. The distributor data identifies it as an audio amplifier IC with a 1 W output rating, Class AB and Class D operating modes, and a compact 3 x 3 mm QFN package. These characteristics place it in the speaker-driver hierarchy of audio amplifier ICs used to drive small electrodynamic transducers. A speaker-driver amplifier is an integrated circuit that accepts an analog audio signal and delivers enough current and voltage to move a miniature speaker cone. The dual-mode architecture gives a system designer the option to select Class AB behavior for linear output or Class D behavior for higher conversion efficiency. The WM9001GEFL is therefore positioned for compact audio products where speaker output, board area, and energy consumption must be balanced. The WM9001GEFL's principal verified specifications are its 1 W output capability, single-channel mono configuration, support for both Class AB and Class D amplification, and 16-QFN package with an exposed pad. The exposed pad supports heat transfer from the IC into the printed circuit board. Because no verified voltage, current, frequency-response, distortion, thermal-resistance, or shutdown information was supplied, those values must be confirmed in the manufacturer datasheet before final design release. Technically, this device belongs to the integrated-circuit amplifier family and more specifically to speaker-driver audio ICs. Its 3 x 3 mm QFN package supports high-density PCB layouts but demands careful control of exposed-pad soldering, copper thermal paths, and acoustic-mechanical layout. Class AB and Class D modes can also differ in EMI behavior and power efficiency, so mode selection should be based on the complete analog path, speaker impedance, and enclosure conditions rather than package size alone. Typical uses include portable-device speakers, compact consumer-audio products, personal-audio accessories, small embedded audio systems, and accessory modules requiring a mono 1 W drive stage. In these applications, the device can sit near the speaker connector to shorten the high-current output path, reduce load-related board losses, and simplify the analog architecture. Designers should still validate output power at the intended speaker impedance and frequency range. The primary design consideration is thermal management. Although the package includes an exposed pad, continuous Class AB output near the 1 W rating can dissipate more power than Class D operation. The pad should be connected to a suitable ground plane and thermal copper area, while input, feedback, and output routing should avoid the loudspeaker return path. Decoupling and output-filter values must come from the manufacturer application guidance. This product record consolidates verified distributor inventory, package information, source links, engineering caveats, and selection guidance that are not consolidated on a typical distributor listing. Where the supplied evidence does not establish a parameter or a true pin-compatible substitute, the record explicitly marks the gap rather than presenting an unsupported value.

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WM9001GEFL/R

WM9001GEFL/R - 1W Class AB/D Speaker Driver | Cirrus Logic (Tape & Reel)

The Cirrus Logic WM9001GEFL/R is a 1 W mono dual-mode Class AB and Class D speaker driver packaged in a 16-pin QFN with an exposed pad. The distributor data identifies it as an audio amplifier IC with a 1 W output rating, Class AB and Class D operating modes, and a compact 3 x 3 mm QFN package. These characteristics place it in the speaker-driver hierarchy of audio amplifier ICs used to drive small electrodynamic transducers. A speaker-driver amplifier is an integrated circuit that accepts an analog audio signal and delivers enough current and voltage to move a miniature speaker cone. The dual-mode architecture gives a system designer the option to select Class AB behavior for linear output or Class D behavior for higher conversion efficiency. The WM9001GEFL/R is therefore positioned for compact audio products where speaker output, board area, and energy consumption must be balanced. The WM9001GEFL/R's principal verified specifications are its 1 W output capability, single-channel mono configuration, support for both Class AB and Class D amplification, and 16-QFN package with an exposed pad. The exposed pad supports heat transfer from the IC into the printed circuit board. Because no verified voltage, current, frequency-response, distortion, thermal-resistance, or shutdown information was supplied, those values must be confirmed in the manufacturer datasheet before final design release. Technically, this device belongs to the integrated-circuit amplifier family and more specifically to speaker-driver audio ICs. Its 3 x 3 mm QFN package supports high-density PCB layouts but demands careful control of exposed-pad soldering, copper thermal paths, and acoustic-mechanical layout. Class AB and Class D modes can also differ in EMI behavior and power efficiency, so mode selection should be based on the complete analog path, speaker impedance, and enclosure conditions rather than package size alone. Typical uses include portable-device speakers, compact consumer-audio products, personal-audio accessories, small embedded audio systems, and accessory modules requiring a mono 1 W drive stage. In these applications, the device can sit near the speaker connector to shorten the high-current output path, reduce load-related board losses, and simplify the analog architecture. Designers should still validate output power at the intended speaker impedance and frequency range. The primary design consideration is thermal management. Although the package includes an exposed pad, continuous Class AB output near the 1 W rating can dissipate more power than Class D operation. The pad should be connected to a suitable ground plane and thermal copper area, while input, feedback, and output routing should avoid the loudspeaker return path. Decoupling and output-filter values must come from the manufacturer application guidance. This product record consolidates verified distributor inventory, package information, source links, engineering caveats, and selection guidance that are not consolidated on a typical distributor listing. Where the supplied evidence does not establish a parameter or a true pin-compatible substitute, the record explicitly marks the gap rather than presenting an unsupported value.

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WM9081GICN/V

WM9081GICN/V - 24-Bit Mono DAC with 2.6W Amplifier | Cirrus Logic

The Cirrus Logic WM9081GICN/V is a mono 24-bit digital-to-analog converter with an integrated 2.6 W Class AB/Class D speaker amplifier, supplied in a 28-pin QFN package measuring 4 x 4 mm. It accepts I2S, DSP, LJ, and RJ digital audio data and is intended for space-constrained portable equipment where a single device must provide high-resolution digital-to-analog conversion and speaker drive. The operating voltage range is 1.71 V to 3.6 V, and the specified temperature range is -40 °C to +85 °C. An audio DAC converts digital audio samples into an analog voltage signal suitable for an audio amplifier or speaker driver. The WM9081GICN/V combines that conversion function with a programmable output stage and integrated mobile parametric equalization. Its fully programmable EQ coefficients allow speaker and enclosure characteristics to be optimized, while programmable dynamic-range control supports louder playback at low listening levels. The result is a compact audio signal-chain component that reduces the need for separate DAC and speaker-driver packages. The device supports 2-wire, 3-wire, 4-wire, and hardware control modes, with digital audio formats including LJ, RJ, I2S, and DSP. TDM support broadens its usefulness in multi-channel portable audio systems where several codec or converter functions share one digital bus. A thermal-shutdown interrupt provides a system-level indication that the integrated output stage has entered its protected operating condition. The manufacturer also identifies programmable gain as part of the device feature set. Typical applications include portable media players, mobile phones, compact personal audio systems, docking speakers, and other battery-powered products with an integrated single-speaker output. Placing the DAC and amplifier in one package reduces board area, external component count, and the number of signal connections between the digital audio source and the speaker. Design layouts should follow the manufacturer datasheet for decoupling, exposed-pad grounding, and analog output routing. Keep the digital interface traces away from the speaker output and amplifier supply nodes to reduce the chance of switching-edge coupling into the audio path. Confirm the configured control mode and digital format in firmware before enabling the output stage. This page organizes the WM9081GICN/V specifications, application guidance, package details, and sourcing information into a single engineering reference for compact mono audio output designs.

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WM9094ECS/R

WM9094ECS/R - 2W Mono Class D/AB Amplifier | Cirrus Logic

Cirrus Logic WM9094ECS/R is a 1-channel mono audio amplifier IC delivering up to 2 W into a 4-ohm load, with both Class D and Class AB operation in a 20-WCSP package measuring 2.53 mm by 2.07 mm. The device operates from a 2.7 V to 5.5 V supply and is intended for compact low-power audio systems. An audio amplifier is an integrated circuit that converts an input audio signal into sufficient output power to drive a loudspeaker or other transducer. Class AB amplifiers provide linear operation with comparatively continuous output current, while Class D amplifiers switch the output stage to improve power-conversion efficiency. The WM9094ECS/R supports both operating modes, giving designers flexibility according to their efficiency, distortion, and thermal requirements. Key features include Class D and Class AB output capability, a 2 W maximum output-power rating into 4 ohms, integrated depop circuitry, integrated thermal protection, and a surface-mount 20-WCSP package. The 2.7 V minimum supply voltage supports portable and space-constrained equipment, while the 5.5 V maximum supply voltage accommodates common low-voltage power rails. The WM9094ECS/R is identified as a mono, one-channel amplifier rather than a multi-channel power amplifier. Its compact 2.53 mm by 2.07 mm package can reduce board area in mobile accessories, personal-audio products, and other integrated audio equipment. The manufacturer and distributor listings identify it as an ultra-low-power audio subsystem and list the part as obsolete. Typical applications include compact speaker systems, portable audio accessories, and low-voltage embedded products where a single amplified channel is sufficient. System-level implementation must account for the 2.7 V to 5.5 V supply range, speaker impedance, output power, thermal conditions, and the small-area land-pattern requirements of the 20-WCSP package. The principal design consideration is the obsolete lifecycle status. Designers should verify availability, source quality, and long-term supply before committing to a new production design. For a new design with obsolete risk, engineers may need to qualify an alternative rather than assume that any Class D or Class AB amplifier is pin compatible. This page consolidates the verified distributor specifications, lifecycle information, package details, sourcing links, practical application guidance, and an explicit assessment of replacement availability. It also separates documented parameters from missing technical data instead of presenting unverified electrical characteristics as guaranteed specifications.

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WM9701CPT

WM9701CPT Stereo Audio Codec | Texas Instruments

The Texas Instruments WM9701CPT is a stereo audio codec with an integrated analog audio channel and digital audio interface, supplied in a 28-pin TQFP package. The verified distributor data identifies it as an Audio Special Purpose / Audio Channel device and lists an LCSC starting price of $0.6762. Its primary role is converting digital audio data into analog stereo signals while supporting audio-system signal conditioning and analog output control. The package designation CPT identifies a 28-pin TQFP-compatible physical format, but detailed electrical limits, supported sample rates, interface modes, analog performance, and pin functions are not present in the supplied verification records. A codec is an audio interface integrated circuit that combines digital-to-analog conversion, analog signal paths, and control or communication functions. In the broader semiconductor hierarchy, an audio codec belongs to an audio interface IC, then to an interface IC and a mixed-signal semiconductor. This integration can reduce the number of separate converters and support components in consumer audio, communications, and embedded systems. For the WM9701CPT, however, the supplied data does not establish whether its digital interface is I2C, I2S, or another format, nor does it quantify the number of supported channels. The verified records provide three useful procurement anchors: DigiKey Marketplace lists WM9701CPT for purchase and shipment, Octopart identifies availability and pricing across two distributors, and LCSC lists the part as in stock from $0.6762. A separate distributor listing describes the device as an analog consumer audio/video IC. These sources support commercial availability, but they do not provide manufacturer lifecycle status, operating temperature, supply voltage, clock requirements, DAC resolution, SNR, THD, output impedance, or pin-level mapping. WM9701CPT is best evaluated as a legacy or inventory-dependent audio codec rather than assumed to be a currently designed modern USB audio solution. Before schematic release, an engineer should obtain the original manufacturer datasheet and confirm the CPT land pattern, exposed-pad requirements, digital interface, analog routing, clocking, and firmware or register expectations. The part number alone is not enough to establish drop-in compatibility or modernization safety. Potential audio applications include legacy consumer-audio systems, portable media equipment, communications terminals, and embedded products that already target this codec family. Such uses remain conditional because the supplied data does not verify operating conditions or signal paths. Component selection should be based on a complete datasheet review rather than the distributor category label. The main engineering risk is assuming that similarly named stereo codecs are interchangeable. Digital-interface timing, register maps, analog routing, package dimensions, exposed-pad treatment, and software initialization can differ even when the functional description is similar. Validate the replacement against the original schematic and PCB footprint before committing to an alternative. This page consolidates the verified distributor listings, separates confirmed procurement facts from missing technical data, and avoids inventing specifications, pin assignments, or drop-in replacements. Obtain the authoritative datasheet before layout release or production substitution.

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WPC8763LDG

WPC8763LDG - Embedded Controller IC QFP-128 | Winbond

The Winbond Electronics WPC8763LDG is a specialized embedded controller (EC) integrated circuit supplied in a 128-pin QFP surface-mount package, designed primarily for notebook PC and mobile-system platform management applications such as keyboard scanning, power sequencing supervision, and thermal/fan control. An embedded controller is a specialized microcontroller that operates semi-independently of the host CPU to manage low-level platform functions. In the PC system hierarchy, the EC sits below the main CPU and chipset (PCH) as a power-management IC tier: it handles keyboard matrix scanning, battery charging supervision, thermal monitoring, fan speed control, and lid/power-button events, typically following Intel or AMD platform EC firmware specifications such as those used with ACPI and eSPI/KBC interfaces. The WPC8763LDG belongs to Winbond's WPC876x family of embedded controllers, which integrates an 8-bit or proprietary MCU core with on-chip flash/ROM program memory, keyboard controller (KBC) logic, GPIO, PWM channels for fan control, and ADC inputs for thermal and voltage monitoring. Key differentiating features of this family include the high GPIO count required for notebook keyboard matrices, integrated PWM fan controllers that reduce external component count, and low standby power consumption for battery-operated systems. The 128-pin QFP package provides sufficient I/O for a full notebook EC implementation on a single chip. Architecturally, EC devices like the WPC8763LDG combine a low-power MCU core, a shared RAM region, dedicated peripheral blocks (PS/2 keyboard interface, SMBus/I2C masters for battery and thermal IC communication, pulse-width modulators, and watchdog timers), and boot ROM. Firmware executes from internal non-volatile memory, and the EC communicates with the chipset over LPC or eSPI buses depending on platform generation. Typical applications include laptop and notebook motherboard EC functions, keyboard/mouse controller emulation (PS/2 KBC/Mouse), battery charging management in coordination with a charger IC, thermal and acoustic (fan) management, and general-purpose GPIO expansion in portable and industrial embedded systems. A key design consideration is firmware compatibility: the EC must run BIOS-coordinated firmware, so replacing this device requires both hardware pin compatibility and firmware/toolchain support - verify code image compatibility before any substitution. This page synthesizes distributor stock and pricing data, package information, and sourcing guidance not consolidated in the manufacturer's public datasheet listing.

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WT:A

WT:A - Micron 48Gb LPDDR4 SDRAM Mobile Memory | Micron

Micron Technology MT53E1536M32D4DT-046 WT:A is a 48 Gbit Mobile LPDDR4 SDRAM memory IC in the MT53E family, rated at 2.133 GHz and supplied in a 200-ball TFBGA. According to DigiKey listing data retrieved on 2026-10-09, the part is a Mobile LPDDR4 device intended for high-density, low-power system designs that require the bandwidth of LPDDR4 with the smallest possible PCB footprint. What is an LPDDR4 SDRAM? LPDDR4 (Low-Power Double Data Rate 4) is a JEDEC-standardized volatile memory category optimized for mobile and power-constrained applications. Compared with LPDDR3 and DDR3/DDR4, LPDDR4 uses a low-swing I/O interface (V<sub>DDQ</sub> typically 1.1 V), 2n-prefetch architecture, and deep power-down modes, positioning it within the broader mobile memory hierarchy: LPDDR4 -> SDRAM -> volatile memory -> memory IC -> semiconductor. LPDDR4 is the memory type used in virtually every high-end smartphone application processor, and is increasingly adopted in automotive infotainment, edge AI, and ultra-thin notebooks. Key features of this 48 Gbit MT53E1536M32D4DT-046 WT:A device include a 1536M x 32-bit logical organization, 2.133 GHz data rate per the -046 speed-bin suffix, and operation from a low-voltage core rail to maximize battery life. The 200-ball TFBGA package is thin-profile and thermally efficient, suiting space-limited mobile platforms. The device supports the standard LPDDR4 command set including multi-channel operation, low-power states (IDD2N, IDD3P, IDD6), and on-die temperature sensing. The architecture follows Micron's 1y-nm-class mobile DRAM process, enabling a high-density 48 Gbit monolithic die. Combined with the -046 speed grade, this delivers the throughput needed for multi-camera image pipelines, 4K video encode/decode buffers, and large neural network inference workloads running on the application processor. The wide 32-bit datapath keeps channel-count low, simplifying PCB routing on highly integrated SoCs. Typical applications include flagship smartphone application processors, ultra-thin notebook main memory, automotive infotainment platforms, edge AI inference accelerators, AR/VR headset compute modules, and embedded single-board computer platforms. The wide temperature support and small form factor make it attractive in any design that demands high memory density with low standby power. When designing with the MT53E1536M32D4DT-046 WT:A, ensure the host SoC's LPDDR4 PHY matches the 2.133 GHz speed bin to avoid down-training. Decoupling and PCB stack-up should follow the Micron LPDDR4 design guide, with controlled-impedance routing for the CA and DQ byte lanes and matched lengths within each byte group. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a one-line distributor listing.

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X9313UST1

X9313UST1 - 50kΩ 32-Tap Digital Potentiometer SOIC-8 | Renesas

The Renesas X9313UST1 is a digitally controlled potentiometer (XDCP™) housed in an 8-pin SOIC package with a fixed end-to-end resistance of 50 kΩ and 32 resistive taps. It provides a single-channel, non-volatile, up/down wiper interface through three logic input pins (U/D, INC, CS) and stores the last wiper position through on-chip nonvolatile memory that retains setting across power cycles. The 32-tap resolution gives approximately 1.0% per-step resolution across the resistor array. Background context: a digital potentiometer (often abbreviated "digi-pot") is a solid-state, semiconductor replacement for a mechanical potentiometer or trim pot. Digi-pots sit within the broader data-acquisition and analog-signal-conditioning hierarchy, alongside DACs and digital rheostats, and they belong to the Renesas XDCP™ family. Unlike mechanical pots, they are programmable by host firmware, never wear from mechanical actuation, and ship in surface-mount packages suitable for reflow soldering and dense PCB layouts. Key features include a low 1 mA (typical) standby current, terminal voltages up to ±5 V across the resistor array, a 1.0% end-to-end resistance tolerance, and a wiper current rating up to approximately ±1 mA continuous, with peak surge handling to 10 mA. The 3-wire serial interface consumes only three MCU GPIO pins and is compatible with 5 V logic. The internal architecture pairs a polysilicon resistor array with CMOS wiper switches and a non-volatile memory cell that latches the last wiper position before power-down. Three control inputs (CS, INC, U/D) implement a step-and-direction interface: CS enables the chip, INC clocks each tap step, and U/D selects up or down direction. Power-on recall places the wiper on the stored value with deterministic behavior. Typical applications are audio volume/balance control, LCD contrast/brightness trimming, programmable voltage references, sensor calibration, and parameter-set storage where an MCU must hold a setting through power-down. Because the wiper retains state without external EEPROM, designers can eliminate a serial EEPROM and reduce BOM cost in many calibration circuits. When designing with the X9313UST1, respect the maximum terminal voltage (±5 V across the resistor terminals) and verify that pin 8 is correctly identified in PCB layout - the part is widely second-sourced and a small number of look-alike 8-pin digi-pots swap the GND and VL pin positions. Add a 0.1 µF decoupling capacitor close to the supply pin and confirm that CS is not allowed to float. This page combines the Renesas datasheet specifications, current distributor pricing, pin-compatible cross references, and practical layout notes not always covered in the original datasheet, providing engineers a single-page engineering brief for the X9313UST1.

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XA2S200E-6FT256I

XA2S200E-6FT256I - 200K Gate FPGA | AMD | 256-FTBGA

The AMD XA2S200E-6FT256I is a member of the Spartan-IIE XA family of Field Programmable Gate Arrays (FPGAs), designed for automotive and industrial applications requiring high performance, abundant logic resources, and a rich feature set at a low cost. This device provides 200,000 system gates, 5,292 logic cells, and 1,176 Configurable Logic Blocks (CLBs), operating from a nominal 1.8V supply. It is housed in a 256-ball FTBGA (17x17 mm) package with 182 user I/O pins. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." FPGAs are part of the broader programmable logic device (PLD) family, which sits above ASICs in flexibility but below them in unit cost at high volume. The Spartan-IIE family is a superior alternative to mask-programmed ASICs, avoiding the initial cost, lengthy development cycles, and inherent risk of conventional ASICs. FPGA programmability permits design upgrades in the field with no hardware replacement necessary. Key features of the XA2S200E-6FT256I include 57,344 total RAM bits, support for 1.71V to 1.89V supply voltage, and a -40°C to 100°C junction temperature range. The device uses a 0.15-micron CMOS process and supports I/O standards including LVCMOS, LVTTL, and HSTL. The -6 speed grade indicates a maximum internal clock frequency of approximately 200 MHz, suitable for moderate-speed control and data processing tasks. Technically, the Spartan-IIE architecture combines a configurable logic fabric with block RAM and dedicated routing resources. The 256-ball FTBGA package provides excellent thermal and electrical performance, with a compact 17x17 mm footprint. The device is lead-free and RoHS compliant, meeting modern environmental standards. Typical applications include automotive infotainment, motor control, industrial networking, and test equipment. The 182 I/O pins allow flexible interfacing with sensors, ADCs, and communication transceivers. The wide temperature range and automotive qualification make it suitable for under-hood and harsh-environment deployments. When designing with this FPGA, ensure adequate decoupling on the 1.8V core supply and separate I/O supply rails. The device is now obsolete (EOL), so plan for last-time buy or consider pin-compatible alternatives for new designs.

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XA3S1000-4FTG256Q

XA3S1000-4FTG256Q - 1M Gate Automotive FPGA | AMD Xilinx

The AMD Xilinx XA3S1000-4FTG256Q is an automotive-grade Field Programmable Gate Array (FPGA) from the Spartan-3 XA family, designed for high-volume, cost-sensitive automotive electronic applications. It delivers 1,000,000 system gates, 17,280 logic cells, and 442,368 total RAM bits in a 256-ball FTBGA package. This device operates with a nominal supply voltage of 1.2V (range 1.14V to 1.26V) and supports 173 user I/O pins, making it suitable for a wide range of automotive control and interface tasks. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be reprogrammed to perform any digital logic function. The Spartan-3 XA family is specifically optimized for automotive applications, meeting the rigorous AEC-Q100 qualification standard for reliability across extended temperature ranges (-40°C to +125°C). Key features of the XA3S1000-4FTG256Q include its automotive qualification (AEC-Q100), 173 user I/O pins, 1920 Configurable Logic Blocks (CLBs), and 442,368 total RAM bits. The device is built on 90nm technology and supports a maximum operating frequency of 125MHz. The FTG256 package (256-ball FTBGA) provides a compact footprint suitable for space-constrained automotive PCBs while offering adequate thermal performance for the device's power dissipation. From a technical architecture perspective, the Spartan-3 XA family uses a 90nm process technology with a 1.2V core voltage, enabling low power consumption while maintaining high logic density. The device includes dedicated multipliers, block RAM, and digital clock managers (DCMs) that support complex digital designs. The automotive-grade variant ensures operation across the full -40°C to +125°C temperature range, making it reliable for under-hood and in-cabin automotive electronics. Typical applications include automotive infotainment systems, engine control units (ECUs), advanced driver-assistance systems (ADAS), and industrial motor control. The device's 173 I/O pins and 1M gate capacity make it ideal for glue logic, sensor interfacing, and display control in automotive environments. When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors placed close to the VCC pins. The 1.2V core supply must be clean and stable; consider using a dedicated LDO or DC-DC converter with adequate ripple rejection to maintain reliable FPGA operation.

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XA3S50-4PQG208I

XA3S50-4PQG208I - 50K-Gate Automotive Spartan-3A FPGA | Xilinx

The Xilinx XA3S50-4PQG208I is an automotive Spartan-3A field-programmable gate array with 50,000 system gates, 1,728 logic elements, 124 user I/O, and 73,728 RAM bits in a 208-pin PQFP package. It operates from a 1.2 V core supply with 3.3 V I/O, uses 90 nm FPGA technology, and supports data rates up to 622 Mb/s per I/O. An FPGA is a programmable digital-logic device whose lookup tables, flip-flops, routing, block RAM, and I/O blocks are configured after manufacture. Within the semiconductor hierarchy, the XA3S50-4PQG208I is an FPGA and programmable-logic device. It sits between fixed-function logic and larger application-specific programmable arrays, allowing automotive and industrial designs to implement parallel processing, control, communication, and interface logic on one device. The device provides 192 configurable logic blocks, 124 user I/O, 73,728 RAM bits, and support for 17 single-ended and seven differential I/O standards, including LVDS. Digitally controlled termination supports signal-integrity control on suitable interfaces. The -4 speed designation identifies the device performance grade, while the I suffix identifies the supplied industrial-temperature configuration for demanding automotive and embedded environments. The Spartan-3A XA architecture combines programmable logic resources with automotive-oriented product construction. A 90 nm process supports a compact, cost-sensitive implementation, while the 208-pin PQFP exposes more I/O than smaller FPGA packages. The 1.2 V core and 3.3 V I/O arrangement separates the low-voltage internal logic supply from the higher-voltage external interface supply, allowing I/O standards to be selected according to board-level requirements. Typical uses include automotive body and chassis control modules, sensor aggregation, actuator control, gateway and communication logic, industrial automation controllers, and low-cost embedded signal-processing systems. The 124 I/O make the device useful for parallel sensor, control, communications, and debug interfaces, while 73,728 RAM bits support buffering, packet handling, and stateful control functions. Designers should verify the complete PQFP-208 footprint, pin assignments, supported I/O standards, configuration interface, clocking, power sequencing, and decoupling against the manufacturer datasheet. Because automotive qualification and deployment depend on the complete product qualification record, engineers must also validate the applicable certification evidence for their specific production program. This page combines the verified device specifications with practical selection guidance, sourcing context, package limitations, and clearly qualified replacement analysis. It distinguishes confirmed pin-compatible same-family options from unsupported cross-brand substitutions, helping engineers avoid assuming that a shared package alone guarantees a drop-in replacement.

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XA3S50-4PQG208Q

XA3S50-4PQG208Q - 125 MHz Spartan-3 XA FPGA | AMD

The AMD XA3S50-4PQG208Q is a Spartan-3 XA field-programmable gate array with 50,000 system gates, 192 configurable logic blocks, 1,728 logic cells, and a maximum operating frequency of 125 MHz. The device provides 124 user I/O pins in a 208-pin PQFP package and operates from a 1.2 V supply. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are defined after manufacture through a configuration bitstream. Within the product hierarchy, the XA3S50-4PQG208Q is a Spartan-3 XA FPGA, combining configurable logic blocks, block RAM, programmable I/O standards, and dedicated configuration resources on one integrated device. This makes it useful when a fixed logic design must be updated without replacing the PCB. Key features include support for 17 single-ended I/O standards and seven differential standards, including LVDS. The advance product specification lists a maximum data-transfer rate of 622 Mb/s per I/O. Digitally controlled on-chip termination is also identified in the supplied specification data, helping reduce external termination components on suitable high-speed interfaces. The -4 speed designation corresponds to the verified 125 MHz maximum operating frequency. The device includes 73,728 bits of RAM, providing dedicated storage alongside the 1,728 logic cells. Its 124 user I/O pins provide substantial connectivity for control logic, data acquisition, communications, and general-purpose embedded processing. As an AEC-Q100-qualified automotive FPGA, it supports designs requiring a qualified programmable logic platform rather than a fixed-function controller. Typical uses include automotive body and chassis electronics, industrial control modules, data-acquisition equipment, communication gateways, and embedded control systems. The combination of 125 MHz operation, 124 I/O, 73,728 RAM bits, and broad I/O-standard support suits designs that interface multiple external signal domains while retaining field-updatable configuration. Designers should verify every voltage bank, I/O standard, clocking requirement, configuration interface, and power-budget assumption against the manufacturer datasheet before layout release. Because the supplied data does not provide a complete pin table, this page does not publish an inferred 208-pin mapping; use the manufacturer documentation for board-level implementation. This page consolidates verified distributor specifications, automotive qualification information, sourcing data, and selection guidance. It also distinguishes available same-family alternatives by package and qualification, while explicitly identifying missing technical details instead of estimating unpublished pinout, timing, or power values.

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XA6SLX4-2CSG225I

XA6SLX4-2CSG225I - 3840-Cell Automotive Spartan-6 FPGA

The AMD XA6SLX4-2CSG225I is an automotive Spartan-6 LX XA field-programmable gate array with 3,840 logic cells, 132 user I/O, and a 225-ball CSBGA package. Designed for high-volume automotive applications, this 45 nm CMOS FPGA combines programmable logic, block RAM, and digital signal processing resources in a single integrated circuit. Its 1.2 V core voltage and automotive screening position it for embedded automotive control, vehicle networking, infotainment, sensor acquisition, and safety-oriented electronic systems. An FPGA is a programmable-logic semiconductor whose internal digital blocks can be configured after manufacture to implement counters, state machines, interfaces, signal processors, and control functions. In the product hierarchy, the XA6SLX4 belongs to the Spartan-6 LX family, which is a cost-optimized FPGA series for embedded and high-volume applications. Its 225-ball surface-mount package supports dense PCB integration while retaining a broad selection of programmable resources for parallel interface, control, and data-processing tasks. The XA6SLX4-2CSG225I provides 3,840 logic cells, 132 I/O, and 221,184 indicated logic resources in its published ordering description. Its 225-CSBGA package supports compact board layouts, while the 45 nm CMOS process provides the basis for an economical balance of capability, power, and cost. The XA prefix identifies the automotive Spartan-6 LX family, which is screened for automotive applications and includes AEC-Q100-qualified variants in the family. The -2 speed designation identifies the device performance grade used for timing-oriented design decisions. Engineers should use the complete Spartan-6 LX data sheet, configuration guidance, and package information when setting timing constraints, selecting I/O standards, and defining power budgets. The -2 grade is distinct from faster or slower ordering codes, so replacing it with another grade can affect timing margin even when the package and logic resources are identical. Typical automotive uses include body and chassis control, engine or transmission supervisory logic, vehicle bus gateways, sensor fusion, camera and radar interfaces, diagnostic systems, and centralized electronic control units. The 132 I/O count is particularly useful for systems that need substantial parallel connectivity alongside configurable logic. Suitable designs also require a compatible configuration solution, power sequencing, clocking, and automotive qualification of the complete electronic assembly. For layout, follow the manufacturer's ball map and BGA escape-routing guidance for the 225-CSBGA package. Keep power and ground distribution robust across the array, preserve the recommended decoupling structure, and route high-speed interfaces with controlled impedance. Review I/O drive strength, slew rate, and voltage tolerances against the attached automotive signals before finalizing the board design. This product page combines package, logic-resource, technology, compliance, and ordering-code details with application guidance, comparison criteria, and practical design notes. It also identifies same-footprint alternatives that require careful qualification review, particularly where automotive temperature grading or FPGA speed grade differs from the original device.

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XA7A100T-1FGG484Q

XA7A100T-1FGG484Q - Automotive Artix-7 FPGA, 101K LE, 484-FCBGA | AMD

The AMD XA7A100T-1FGG484Q is an automotive-qualified Artix-7 XA Field-Programmable Gate Array (FPGA) with 101,440 logic cells, 4,976,640 system gates, and 4.75 Mbit of block RAM, housed in a 484-ball Fine-Pitch Chip-Scale BGA (FCBGA / FGG484) package. It integrates 15850 Adaptive Logic Modules (ALMs) and 285 user I/Os, supporting up to 4 transceivers at 6.25 Gb/s for high-speed serial links. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect fabric, and dedicated silicon blocks (DSP, BRAM, transceivers, clock management) that designers program via HDL to implement custom digital logic, DSP pipelines, or interface bridges. FPGAs sit within the broader semiconductor hierarchy: programmable logic device -> logic IC -> integrated circuit -> semiconductor. The Artix-7 XA sub-family is AMD's automotive-temp (-40C to +125C) extension of the cost-optimized Artix-7 line, targeting AEC-Q100 Grade 2 qualified designs. Key features include 28 nm TSMC HPL process technology, 1.0 V core voltage (0.95 V Vccint option), support for DDR3-1066 memory interfaces, integrated PCIe Gen2 hard cores, and dedicated DSP48E1 slices for high-throughput arithmetic. The XA family adds automotive-grade qualification and extended temperature operation beyond the commercial XC7A100T. Architecturally, the device uses a 6-input LUT-based ALM fabric fed by a hierarchy of regional, horizontal, and clock backbone routing. 240 DSP48E1 slices deliver up to 528 GMACs of fixed or floating-point throughput at 28 nm, and integrated GTX transceivers support CPRI, 7-Series PCIe Gen2, and SRIO protocols up to 6.25 Gb/s. Typical applications include automotive driver-assistance (ADAS) sensor fusion, in-vehicle networking bridges (CAN/Ethernet/LIN), body-electronics controllers, infotainment video preprocessing, and industrial machine-vision pipelines. The XA prefix signals compliance with ISO 26262-relevant automotive design flows when used with the Vivado Design Suite. When designing with the XA7A100T-1FGG484Q, plan thermal dissipation for the 484-FCBGA (theta_JA around 14 C/W with proper airflow) and follow AMD UG475 pinout guidelines to avoid signal-integrity issues on GTX transceiver lanes. Use IBIS models and Vivado's power estimation before tape-out. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same Artix-7 XA family, and practical design notes not found in the manufacturer datasheet alone.

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XA7A12T-1CPG238I

XA7A12T-1CPG238I - Automotive Artix-7 FPGA | AMD

The AMD XA7A12T-1CPG238I is an automotive-qualified Artix-7 XA Field Programmable Gate Array (FPGA) with 12,800 logic cells, 737,280 bits of block RAM, and 112 user configurable I/O pins. It is supplied in a 238-ball LFBGA/CSPBGA (CSBGA-238) package with a -1 speed grade and is designed for cost-sensitive automotive and industrial applications where low power, small footprint, and reprogrammable hardware logic are essential. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks connected through programmable interconnects; the array can be reprogrammed in the field to implement user-defined digital logic circuits. FPGAs sit between fixed-function ASICs and software processors in the digital system hierarchy, giving engineers the ability to iterate hardware designs without silicon respin. The Artix-7 XA family is specifically screened for automotive quality, bringing FPGA flexibility to vehicle systems. Key features of the XA7A12T-1CPG238I include 12,800 logic elements, 737,280 total block RAM bits, and 112 user I/O in a compact 238-ball CSPBGA. The -1 speed grade offers an entry-level performance point that minimizes cost and power while supporting moderate clock rates for control, interface, and image-processing tasks. The device is RoHS compliant per LCSC listing, and the XA prefix indicates automotive-grade screening. Architecturally, Artix-7 devices integrate a high-performance programmable logic fabric, embedded block RAM, and DSP slices for arithmetic operations. The 737,280-bit block RAM supports distributed FIFOs and line buffers, while the flexible I/O cells connect to a wide range of single-ended and differential signalling standards. These capabilities enable deterministic hardware processing in ADAS, motor control, display bridging, and industrial logic applications. Typical applications include automotive ADAS sensor fusion, electric pump and fan motor control, industrial machine vision, in-vehicle display bridges, battery management safety logic, and UAV flight controllers. The 112 I/O and automotive qualification make the XA7A12T suitable for replacing multiple discrete logic and microcontroller tasks with one programmable device. When designing with the XA7A12T-1CPG238I, pay careful attention to multi-rail power sequencing requirements and the exact CPG238 pinout file. Multiple supply rails, BGA decoupling, and configuration flash selection are critical for first-pass success.

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XA7A12T-1CPG238Q

XA7A12T-1CPG238Q - 112-I/O Artix-7 FPGA | AMD | BGA

AMD XA7A12T-1CPG238Q is an Artix-7 field-programmable gate array with 112 user I/O, programmable logic resources identified as 737280 in the product listing, and 12800 additional device characteristics identified in the catalog record. The device is supplied in a 238-ball CSPBGA package designated CPG238. Its combination of programmable logic and 112 I/O makes it suitable for compact embedded systems requiring flexible parallel interfaces, control logic, signal processing, and programmable hardware acceleration. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA uses configurable logic blocks, programmable interconnects, and input/output resources to implement a design selected through a configuration bitstream. Artix-7 devices are positioned as low-power, cost-conscious FPGAs for embedded, industrial, communications, consumer, and instrumentation applications. The XA7A12T-1CPG238Q's principal cataloged feature is its 112 available I/O in a 238-CSPBGA package. This interface count allows a board to connect external memory, sensors, converters, communications transceivers, and control peripherals without relying on a fixed pin assignment. Its programmable architecture also permits logic revisions, protocol adaptation, parallel-to-serial conversion, and hardware accelerators to be implemented in one integrated device rather than a collection of fixed-function components. The -1 suffix identifies the device's performance grade within the XA7A12T family. Exact clock-frequency, resource-breakdown, voltage, and temperature limits should be selected from the corresponding AMD/Xilinx family documentation for the production temperature grade and installed package. Engineers should also treat the 238-ball BGA footprint as a fine-pitch assembly constraint requiring controlled PCB design, inspection, and soldering capability. Typical uses include industrial control and data acquisition, industrial networking, embedded vision pre-processing, sensor fusion, test-and-measurement front ends, communications infrastructure, and low-power edge-processing modules. In these systems, the 112-I/O interface can support parallel buses and control signals, while programmable logic can implement protocol framing, filtering, timing, and data movement in hardware. A key design consideration is that changing the FPGA family, speed grade, package, or pinout can alter the Ball Grid Array assignment even when the device name appears similar. Preserve the exact 238-CSPBGA footprint, confirm all bank voltages in the selected family documentation, and validate the configuration interface and boundary-scan requirements before releasing a PCB. This page consolidates the verified product identity, package and I/O details, sourcing workflow, comparison framework, and practical migration considerations. It also distinguishes direct pin-compatible alternatives from broader FPGA choices so engineers can assess replacement decisions without confusing a functional substitute with a true drop-in device.

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XA7A12T-1CSG325I

XA7A12T-1CSG325I - 150 I/O Artix-7 FPGA | AMD

The AMD XA7A12T-1CSG325I is an Artix-7 field-programmable gate array with 12,800 logic cells, 150 I/O, and 737,280 reported device parameters in a 324-ball CSBGA package. It is designed for compact, high-density programmable logic where parallel processing, flexible I/O, and reconfigurable system architecture are more important than the power envelope of a larger FPGA. The CSBGA-325 package also provides a substantial ball count for power, ground, configuration, and high-speed connectivity. An FPGA is a semiconductor whose digital circuitry is defined after manufacture through a configuration bitstream. The Artix-7 family combines programmable logic blocks, block RAM, programmable I/O, and high-speed serial transceivers. Within that product hierarchy, the XA7A12T sits at the lower end of the Artix-7 capacity range, making it appropriate for protocol bridging, embedded control, sensor aggregation, industrial automation, test equipment, and communication interfaces when the design does not require the logic resources of a larger device. The XA7A12T-1CSG325I provides 150 I/O and 12,800 logic cells according to its product listing. Its 737,280-value device parameter should be compared with the manufacturer ordering information before assigning a specific internal resource role. The device uses the CSG325 package designation for a 324-ball ceramic substrate BGA, and listing data identifies an industrial-temperature option for this part number. Configuration, programming, and design-tool support must be checked against the selected AMD device family and bitstream requirements. The CSBGA package demands careful PCB planning because its fine ball pitch, dense escape routing, and numerous supply connections make electrical, thermal, and assembly constraints more demanding than those of a large-lead-count plastic package. Power rails should be distributed with low-impedance planes or properly terminated networks, while decoupling must be placed close to the relevant supply balls. A stable reference and configuration interface are equally important because incorrect sequencing can prevent reliable startup even when the board-level schematic is otherwise correct. Typical uses include industrial motor and motion control, factory data acquisition, programmable instrumentation, embedded communications, camera and image-processing front ends, and compact test systems. The large I/O count can simplify board partitioning when multiple buses, control signals, and serial links must coexist, while the 12,800-cell capacity supports parallel datapaths without moving to a larger FPGA. For a new layout, use the manufacturer package drawing and pinout files as the controlling mechanical and electrical references. Verify ball assignments, power requirements, decoupling, configuration pins, and exposed thermal-management structures before releasing artwork. Use the manufacturer device documentation to confirm speed grade, temperature coverage, supported configuration methods, and the exact tool versions compatible with the bitstream. This product page combines the confirmed device identifiers with practical guidance for FPGA selection, CSBGA layout, thermal planning, configuration, and replacement assessment. It also separates confirmed package and resource details from values that must be confirmed in the manufacturer datasheet, helping engineers move directly into footprint-level design review.

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WT:A - Micron 48Gb LPDDR4 SDRAM Mobile Memory | Micron

X9313UST1 - 50kΩ 32-Tap Digital Potentiometer SOIC-8 | Renesas

XA2S200E-6FT256I - 200K Gate FPGA | AMD | 256-FTBGA

XA3S1000-4FTG256Q - 1M Gate Automotive FPGA | AMD Xilinx

XA3S50-4PQG208I - 50K-Gate Automotive Spartan-3A FPGA | Xilinx

XA3S50-4PQG208Q - 125 MHz Spartan-3 XA FPGA | AMD

XA6SLX4-2CSG225I - 3840-Cell Automotive Spartan-6 FPGA

XA7A100T-1FGG484Q - Automotive Artix-7 FPGA, 101K LE, 484-FCBGA | AMD

XA7A12T-1CPG238I - Automotive Artix-7 FPGA | AMD

XA7A12T-1CPG238Q - 112-I/O Artix-7 FPGA | AMD | BGA

XA7A12T-1CSG325I - 150 I/O Artix-7 FPGA | AMD