FPGA & CPLD
Products (6357)
EP2AGX260FF35C6N - Arria II GX 244K LE FPGA, 1152-FBGA | Intel
The Intel (Altera) EP2AGX260FF35C6N is a high-density Arria II GX Field Programmable Gate Array (FPGA) delivering 244,188 logic elements, 612 user I/O, and 10,260 Logic Array Blocks (LABs) in a 1152-ball FineLine Ball-Grid Array (FBGA) package. Built on a 40 nm CMOS process with 0.9 V core supply, it operates at up to 400 MHz and integrates up to 12,038,144 bits of embedded memory plus dedicated transceivers for high-speed serial I/O. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy a distinct tier in the programmable logic hierarchy (FPGA -> programmable logic -> ASIC prototyping -> digital IC -> semiconductor), enabling parallel hardware execution, deterministic latency, and post-fabrication reprogrammability. Compared with general-purpose microcontrollers, FPGAs deliver substantially higher I/O throughput and per-clock computation for data-path intensive workloads. Key differentiating features of the EP2AGX260FF35C6N include its 244K logic-element capacity, integrated PCI Express hard IP, multi-gigabit transceivers (MGTs) supporting protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CPRI, and on-chip memory blocks with hardware FIFO controllers. The 1152-FCBGA package exposes 612 user I/O pins to support wide parallel buses, external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II), and multiple high-speed serial links simultaneously. Architecturally, the device uses a heterogeneous fabric that combines 4-input ALMs (Adaptive Logic Modules), M9K and M144K memory blocks, MLABs, and DSP blocks operating at 400 MHz fabric speed. The transceiver block delivers up to 6.375 Gbps data rate, while the hard PCIe Gen2 controller supports x1/x4 lane configurations, eliminating soft-logic timing closure on the most demanding serial interfaces. Typical applications include high-speed serial interface bridging, digital video broadcasting, wireless baseband processing, defense and aerospace signal processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well suited to throughput-bound designs that would otherwise require multiple discrete components. When designing with this part, plan power-rail decoupling carefully - the 0.9 V core, 1.1 V PLL, and 2.5 V/3.3 V I/O supplies each require bulk and high-frequency ceramic capacitors near the balls. Use Intel Quartus II or Quartus Prime for place-and-route, and respect simultaneous-switching-output (SSO) guidelines for the 612 I/O to maintain signal-integrity margins. This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations not consolidated on any single distributor page, providing engineers with an actionable decision-support reference.
EP2AGX260FF35I3G - Arria II GX FPGA, 244K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2AGX260FF35I3G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FC-FBGA) package. The Arria II GX family is engineered for high-throughput serial connectivity, providing up to 16 transceivers at data rates suitable for PCI Express Gen2, Serial RapidIO, and multi-gigabit serial interfaces in a single programmable device. The device operates from a 0.9 V core supply with separate transceiver and auxiliary rails, and the speed grade 3 (I3) variant balances timing margin and maximum frequency for industrial temperature operation. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers and memory blocks. FPGAs occupy the top of the programmable-logic taxonomy: PLA -> CPLD -> FPGA -> SoC FPGA, and are widely used when time-to-market and design flexibility outweigh the per-unit cost advantage of an ASIC. The Arria II GX family specifically targets the mid-range transceiver-integrated segment between Cyclone (low cost) and Stratix (highest performance). Key features include embedded transceivers, hard PCI Express Gen2 IP cores, embedded memory blocks with byte-enable parity, dedicated DSP blocks for high-throughput signal processing, and configuration support via JTAG, Active Serial, Passive Serial, and Fast Passive Parallel modes. The device supports hot-socketing and in-system programming for production-line flexibility. Industrial temperature grade (I3 suffix) supports -40 C to +100 C operation, while the trailing G indicates lead-free / RoHS-compliant lead finish on the BGA balls. Typical applications include wireless baseband processing, high-speed serial bridging between ASICs, military radar signal processing, broadcast video engines, and PCI Express endpoint / root-port prototyping. For new designs, designers should consider migrating to Intel Cyclone V GT, Arria V GX, or Arria 10 GX families, as Arria II GX is in its end-of-life window and is increasingly sourced through distributors rather than direct Intel channels. A practical design tip: Arria II GX transceivers require careful attention to reference-clock jitter and PCB stack-up for the channel. Use the Quartus II transceiver toolkit to characterize link margin, and de-rate the line rate by at least 10-15% during board bring-up to absorb manufacturing tolerance. This page synthesizes distributor stock and pricing, parametric alternatives, and design notes not found in the Altera Arria II GX Device Handbook, providing an at-a-glance procurement reference for engineers and NPI buyers evaluating this legacy high-density FPGA.
EP2AGX260FF35I3N - 244K LE Arria II GX FPGA | Intel (Altera)
The Intel (formerly Altera) EP2AGX260FF35I3N is a high-density Arria II GX field-programmable gate array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and 612 user I/Os in a 1152-ball flip-chip BGA (FCBGA, 35 x 35 mm) package. The Arria II GX family targets mid-range applications requiring integrated transceivers for high-speed serial connectivity, combining a hardened 6.375 Gbps transceiver PHY with a low-power adaptive logic module (ALM) fabric to deliver a balanced power/performance profile for protocol bridging, video processing, and DSP-intensive designs. An FPGA (field-programmable gate array) is a reconfigurable semiconductor device whose logic functionality is defined after manufacture by the user. Architecturally the FPGA sits within the broader category of programmable logic devices (PLDs) and competes with CPLDs on the low end and ASICs on the high end. FPGAs consist of an array of configurable logic blocks (ALMs/LEs), programmable interconnect, embedded memory (block RAM), DSP blocks, clock management PLLs, and high-speed transceiver/IO tiles. They are widely used to prototype logic, accelerate parallel algorithms, and provide reconfigurable interfaces in telecom, broadcast, defense, and industrial systems. Key features of the EP2AGX260FF35I3N include 10260 LABs/CLBs, 612 I/O pins, embedded 6.375 Gbps multi-gigabit transceivers for protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CPRI, and Gbps Ethernet, hard PCIe Gen1/Gen2 IP blocks, up to 16 global clock networks, and dynamic on-chip termination (OCT). The device operates from a 1.0 V core supply, supports configuration via fast passive parallel (FPP), active serial (AS), passive serial (PS), and JTAG modes, and is rated for the industrial temperature range (-40 C to +100 C case). The Arria II GX architecture uses an adaptive logic module (ALM) building block that combines 8-input fracturable look-up tables with dedicated arithmetic and register chains, increasing effective logic density by approximately 25 % over previous-generation 4-input LUT architectures. Multi-track routing and optimized pipeline registers enable sustained DSP throughput above 300 MHz, which is essential for wireless baseband and video codec pipelines. Hard memory controllers and variable-precision DSP blocks coexist with user-configurable fabric, allowing designers to instantiate high-bandwidth packet buffers and FFT engines without consuming programmable logic. Typical applications include wireless baseband processing (LTE, WiMAX), video infrastructure (broadcast encoders, transcoders, display controllers), high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), test and measurement instrumentation, and radar signal processing. Designers typically pair the FPGA with DDR2/DDR3 SDRAM, external flash for configuration storage, and an FPGA power supply such as the Intel Enpirion EN63A0QI or Linear Technology (Analog Devices) LTM4620/LTM4644 multi-rail controller to meet the 1.0 V core and 2.5 V/3.3 V aux rail requirements. When designing with this device, ensure 0.1 uF + 10 uF decoupling is placed adjacent to every power pin, follow the FCBGA escape and via-in-pad recommendations in the Arria II device handbook, and use Quartus II (or the later Quartus Prime) for synthesis, place-and-route, and timing closure. Estimating: total power at full transceiver utilization approaches 15-20 W and requires a multi-layer PCB with at least 2 oz copper and a thermal management plan (heat spreader or heatsink with controlled airflow) to keep the junction temperature within limits. This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the Site MPN list, and practical FPGA design notes not found in a single datasheet reference, giving design engineers a one-stop engineering summary for the EP2AGX260FF35I3N.
EP2AGX260FF35I3NAA - Arria II GX FPGA 260K LE | Altera | BGA
The Altera (Intel) EP2AGX260FF35I3NAA is a high-density Arria II GX Field-Programmable Gate Array (FPGA) integrating 244,188 logic elements, 12,038,144 embedded memory bits, and 612 hardware multipliers in a 1152-ball FineLine BGA (FBGA-1152) package. Built on a 40 nm process, the device delivers up to 8.5 Gbps transceiver operation across 12 transceivers for high-bandwidth serial I/O, making it a system-on-chip solution for performance-critical embedded designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and (in modern families) high-speed transceivers. FPGAs sit at the same level in the broader taxonomy as ASICs and microcontrollers, but unlike ASICs they can be re-programmed in the field to implement custom digital logic, glue logic, parallel processing pipelines, or even entire soft-core processor systems. The Arria II GX family targets mid-range applications that require a balance of logic density, on-chip memory, and integrated multi-gigabit transceivers without the power and cost of a Stratix-class device. Key features of the EP2AGX260FF35I3NAA include 8 user I/O banks supporting a wide range of single-ended and differential I/O standards (LVDS, LVPECL, HSTL, SSTL), dedicated DDR2/DDR3 memory controller hard IP, and 6 PLLs for clock management. The device operates across an industrial temperature range of -40C to +100C and supports the FF35 speed grade with I3 (-40C to +100C industrial) designation. The integrated transceivers support protocols including PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CPRI, eliminating the need for external PHY chips in many designs. Typical applications include telecom baseband processing, software-defined radio (SDR), military radar signal processing, video broadcast infrastructure, and high-speed serial protocol bridging. The combination of 244K logic elements with 12 Mbit embedded RAM makes the EP2AGX260 particularly well suited for data path intensive functions such as FFT processing, packet classification, and digital up/down conversion. When designing with this 1152-ball FBGA device, careful PCB layout with microvia stack-up, matched-length high-speed traces, and a robust power distribution network with multiple decoupling capacitors are mandatory. Thermal management should account for the industrial temperature grade and possible high transceiver utilization. This page synthesizes distributor pricing, drop-in alternative cross-references within the Arria II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.
EP2AGX260FF35I5 - Arria II GX FPGA, 244K LE, 612 IO | Intel
The Intel (formerly Altera) EP2AGX260FF35I5 is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 244,188 logic elements, 612 user I/Os, 12,038,144 memory bits, and integrated transceivers, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. Built on a 40nm process, it operates from a 0.9V core supply and is specified for the industrial temperature range (-40C to +100C, I5 grade). The FF35 device code indicates the 35mm package footprint with the industrial speed/temperature grade. What is a FPGA? A Field-Programmable Gate Array is a semiconductor device containing programmable logic blocks (logic elements, LABs, DSP blocks, and memory blocks) interconnected by a configurable routing matrix. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and deliver hardware-level parallelism that microcontrollers cannot match. The Arria II GX family specifically targets mid-range applications that require embedded transceivers, making them part of the transceiver-equipped FPGA category alongside Stratix and Cyclone families. Key specifications include up to 16 transceivers with rates from 600 Mbps to 6.375 Gbps, dedicated DSP blocks for high-performance fixed/floating-point math, embedded hard IP for PCIe Gen2 and external memory interfaces (DDR3, QDRII+, RLDRAM2), and 12.5 Gbps LVDS support. The 35x35mm FCBGA package uses flip-chip technology for high pin density and superior thermal performance, enabling sustained operation in industrial environments. The Arria II GX architecture combines a logic fabric with hard IP for transceivers, PCI Express, and memory controllers, balancing flexibility with deterministic performance. Its 40nm low-power process reduces static and dynamic power relative to the prior Stratix IV generation, while the GX variant's integrated transceivers eliminate the need for external PHY chips in serial-protocol designs. Typical applications include high-speed serial-protocol bridging (PCIe, SATA, CPRI, XAUI), wireless baseband processing, broadcast video processing, military/aerospace signal processing, and industrial imaging. The combination of 244K logic elements and embedded transceivers suits mid-volume designs where ASIC NRE cost is prohibitive but microcontrollers or DSPs lack required throughput. Design consideration: the 0.9V core and multiple auxiliary rails require careful power-sequence design; failure to follow Intel's recommended ramp ordering may cause latch-up. The 1152-ball BGA also demands controlled-impedance PCB stackup and assembly via X-ray inspection. This page synthesizes distributor pricing, drop-in Arria II GX alternatives, and practical design considerations beyond the datasheet - giving engineers a fast procurement and selection reference for high-density FPGA designs.
EP2AGX260FF35I5G - Arria II GX FPGA, 244K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP2AGX260FF35I5G is a high-density Arria II GX Field Programmable Gate Array (FPGA) built on a 40nm process, delivering 244,188 logic elements, 612 user I/O pins, and 12,038,144 bits of embedded memory in a 1152-ball FC-FBGA package. It integrates up to 12 transceiver channels supporting multi-gigabit serial connectivity, making it a mid-range, transceiver-rich platform for high-speed serial and parallel digital designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs belong to the broader family of programmable logic devices (PLDs) and are positioned in the system hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are reprogrammable in-system, enabling rapid prototyping, hardware acceleration, and design iteration without NRE cost. The EP2AGX260FF35I5G core operates at 0.9V with up to 500 MHz internal performance. Key features include embedded 18x18 multipliers for DSP, dedicated high-speed transceivers (CPRI, PCIe, Gigabit Ethernet, Serial RapidIO), on-chip memory, and PLL-based clock management. The Arria II GX architecture balances logic density, transceiver bandwidth, and power efficiency, targeting mid-volume applications. Designed on TSMC's 40nm process, the device combines a high-logic-count fabric with multi-gigabit transceivers in a single die, reducing board area versus multi-chip implementations. The FF35 package designation indicates a 35 mm body size FCBGA with fine-pitch BGA balls optimized for high-speed signal integrity at transceiver rates. Typical applications include wireless baseband processing, telecom backhaul, military radar, broadcast video processing, and high-performance computing accelerators. The device is well suited for designers transitioning from ASIC to FPGA for low-volume production or for systems requiring field upgradability. When designing with this FPGA, pay attention to transceiver channel placement constraints, reference clock architecture, and thermal dissipation - the high transceiver count requires multi-layer PCB stackups and careful power delivery. Quartus II design software with Arria II GX device support is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Arria II GX family, and practical design notes drawn from the manufacturer datasheet, providing engineering insight not duplicated on individual distributor product pages.
EP2AGX260FF35I5N - Arria II GX FPGA 244K LE, 612 IO | Intel
The Intel (formerly Altera) EP2AGX260FF35I5N is a high-density Arria II GX field-programmable gate array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded SRAM, and 8 transceivers capable of up to 6.375 Gbps operation, housed in a 1152-ball FC-FBGA package. The device targets mid-range serial connectivity, digital signal processing, and high-throughput data-pipeline applications that demand deterministic performance at industrial temperature grades. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened IP such as transceivers, DSP blocks, and PLLs. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design hierarchy: unlike microcontrollers they execute logic in parallel hardware, and unlike ASICs they can be reconfigured after fabrication. The Arria II GX family specifically targets designs requiring integrated transceivers, making it a popular mid-density solution for protocol bridging and high-speed serial I/O. The EP2AGX260FF35I5N features 612 user I/Os, 8 integrated transceiver channels supporting data rates up to 6.375 Gbps, and 10260 Adaptive Logic Modules (ALMs) providing efficient 6-input LUT-based logic implementation. The 0.9 V core supply and industrial -40 C to +100 C operating range position this device for telecom, industrial imaging, and military/aerospace embedded applications where temperature tolerance is mandatory. The device is built on a 40 nm process and supports 18x18 multipliers, 64-bit external memory interfaces (DDR3/QDRII+/RLDRAM II), and PCI Express Gen1/Gen2 hard IP blocks. The integrated transceivers support protocols including PCIe Gen1/2, Gigabit Ethernet, Serial RapidIO, and Common Public Radio Interface (CPRI), eliminating the need for external PHY devices in many designs. Typical applications include wireless baseband processing, software-defined radio front-ends, high-speed serial protocol bridges, ASIC prototyping, and embedded military signal-processing platforms. The industrial temperature grade and 1152-ball FCBGA package make it suitable for ruggedized systems and 6U VPX backplane designs. When designing with this FPGA, ensure proper power-rail sequencing and use the Quartus II design software (version 13.1 or earlier for legacy Arria II support) for synthesis, place-and-route, and timing closure. The FC-FBGA-1152 package requires a multilayer PCB stackup with controlled-impedance routing for transceiver channels. This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives drawn from the Arria II GX family, and design-in considerations not found in the standalone manufacturer datasheet.
EP2AGX45CU17C4G - Arria II GX FPGA, 42K LE, 156 I/O, 358-BGA | Intel
The Intel EP2AGX45CU17C4G is a 40nm Arria II GX Field-Programmable Gate Array (FPGA) integrating 42,959 logic elements, 3,517,440 bits of embedded memory, and transceivers in a 358-ball FCBGA/LFBGA package. Operating with a 0.9V core supply and a -4 speed grade, this Arria II GX device targets cost-sensitive mid-range applications that need high-speed serial I/O without migrating to a larger family. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded RAM, and programmable I/O elements interconnected by a programmable routing fabric. FPGAs sit at the top of the digital logic hierarchy between discrete gate arrays and full ASICs, providing hardware-timed parallelism that microcontrollers cannot match. Within the Altera/Intel portfolio, the Arria II GX family occupies the mid-range transceiver-capable tier above Cyclone and below Stratix, optimized for protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI common in wireless backhaul. Key features include 42,959 logic elements, 2,365 Kbits of dedicated RAM, embedded 18x18 multipliers, 156 user I/Os, and 3.5 Mbits of total embedded memory. The device integrates transceivers supporting data rates up to 3.75 Gbps, hardened PCI Express Gen1/Gen2 endpoints, and a DDR2/DDR3 memory controller interface. Configuration is supported through passive serial (PS), fast passive parallel (FPP), and JTAG modes with built-in decompression and encryption via the AES-128 bitstream security engine. Architecturally, the EP2AGX45CU17C4G uses a 40nm low-power process with adaptive logic modules (ALMs) that combine look-up tables and registers into 8-input fracturable structures. The transceiver tiles integrate the PHY, PCS, and bonding clocking for protocol portability, while the variable-precision DSP blocks accelerate fixed- and floating-point math for signal processing pipelines. Typical applications include wireless baseband processing, broadcast video encoders, medical imaging accelerators, industrial motor control, and high-speed serial interface bridging. Engineers select this Arria II GX device when designs need more logic density than Cyclone V but not the full transceiver bandwidth of Stratix IV. When designing with this FPGA, ensure 0.9V core and 2.5V/3.3V auxiliary rails use low-noise LDO regulators placed within 25mm of the package. A multi-layer PCB with continuous ground planes and matched-length transceiver traces is required for signal integrity above 1 Gbps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2AGX45CU17C5G - Arria II GX FPGA 45K LEs 3.5Mb | Intel
The Intel (formerly Altera) EP2AGX45CU17C5G is a mid-density Arria II GX Field-Programmable Gate Array (FPGA) from the 40nm Arria II family, integrating 42,959 logic elements and 3,517,440 bits of embedded memory in a 358-ball FineLine BGA (FCBGA, U358) package. According to the Arria II GX datasheet, this device ships with the -C5 speed grade and operates across the commercial 0C to 85C junction temperature range, while still exposing industrial-grade transceiver support through separately ordered variants. The part number encodes its identity: EP2A = Arria II, GX = GX transceiver family, 45 = ~45K logic elements, CU17 = U358 FCBGA package with 156 user I/O pins, C = commercial temperature, 5 = speed grade -5, and G = Pb-free / RoHS-compliant lead finish. A Field-Programmable Gate Array is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hardware IP such as block RAM, DSP blocks, and high-speed transceivers, all controlled by SRAM-based configuration memory. FPGAs occupy a unique tier between general-purpose microcontrollers (which execute software sequentially) and fixed-function ASICs (which are silicon-permanent) — they reconfigure their hardware fabric in milliseconds, enabling hardware-level parallelism for compute-intensive workloads. The Arria II GX family sits in the mid-range, targeting applications that need integrated multi-gigabit transceivers without the cost of a Stratix-class device. Key features of the EP2AGX45CU17C5G include up to 156 general-purpose user I/O pins spread across 9 I/O banks, integrated 3.125 Gbps CPRI/OBSAI-compatible transceivers for backplane and chip-to-chip serial links, dedicated 18x18 multipliers and DSP blocks for signal-processing acceleration, programmable PLLs for clock synthesis, and hard PCI Express Gen1 hard IP blocks. The 358-pin FCBGA package provides high-density I/O escape routing for high-speed differential pairs and supplies the low-inductance power/ground distribution required by the transceiver analog supply rails. The Arria II GX architecture pairs a 40nm low-power process with adaptive logic modules (ALMs) that implement 8-input fracturable look-up tables, a tightly integrated hard memory controller subsystem, and a transceiver physical media attachment (PMA) layer supporting protocols such as PCIe Gen1 x1/x4, Gigabit Ethernet, Serial RapidIO, and CPRI. Hard IP blocks for memory interfaces and PCIe Gen1 free fabric logic for application code, while the transceiver PMA/PCS stack supports data rates commonly used in 3G/4G wireless baseband, broadcast video, and industrial backplane aggregation. Typical applications include wireless baseband processing (CPRI link aggregation for radio equipment controllers), high-resolution broadcast video routing and processing, military and industrial radar front-end preprocessing, machine-vision frame grabbers, test and measurement digitizers, and PCIe Gen1 endpoint cards in industrial PCs and embedded computing platforms. Engineers typically pair the EP2AGX45CU17C5G with external DDR2/DDR3 SDRAM and flash configuration memory. When designing with this part, pay particular attention to the four transceiver analog supply rails (VCCA_GXB, VCCL_GXB, VCCP, VCCR) — they require filtering and isolation from the digital core supply to meet jitter and bit-error-rate budgets. Configuration must use a supported scheme (fast passive parallel, fast passive serial, or JTAG) with a valid configuration bitstream. This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2AGX45CU17C5N - Arria II GX FPGA, 45K LE, 156 I/O, 358-UBGA | Intel
The Intel (formerly Altera) EP2AGX45CU17C5N is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) housed in a 358-ball UBGA (FCBGA) package. The device integrates approximately 45,000 logic elements, 156 user I/O pins, 1,805 logic array blocks, and 3,517,440 bits of embedded memory in a single fabric. Per the Intel Arria II GX Device Data Sheet, the EP2AGX45CU17C5N targets mid-range applications that require both programmable logic and multi-gigabit transceivers on a single die. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, and I/O cells can be reconfigured after manufacture through a hardware description language bitstream. Within the wider semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs) which also include CPLDs and structured ASICs. FPGAs sit between fixed-function ASICs and software-defined microcontrollers: like ASICs they deliver hardware parallelism at clock rates above 200 MHz, and like microcontrollers their function can be updated at any time. Arria II GX parts specifically add 3.75 Gbps transceivers, putting them in the mid-density transceiving tier below Cyclone but above the basic Cyclone IV GX. The key features of the EP2AGX45CU17C5N are 3.75 Gbps multi-gigabit transceivers with 8B/10B and PCIe hard IP, dedicated DSP blocks for 18x18 multipliers at up to 250 MHz, 156 general-purpose I/Os with support for LVDS, LVTTL, LVCMOS, SSTL and HSTL standards, and embedded memory arranged in M9K and M144K blocks totaling 3.5 Mbits. The die is fabricated on a 40 nm process and operates from a core voltage around 0.9 V with separate PLL, transceiver and I/O supply rails. Architecturally the EP2AGX45CU17C5N arranges logic in 1,805 LABs (Logic Array Blocks), each containing 10 adaptive logic modules. Multi-track interconnect routes signals between LABs, M9K memory, DSP blocks, and the transceiver PMA/PCS layers. Hard memory controllers and PCIe Gen1 hard IP blocks reduce soft-logic utilization for common protocols, leaving the user fabric free for application-specific state machines, DSP, and control planes. Typical applications include PCIe Gen1 endpoint cards, video broadcast and processing pipelines, industrial imaging and machine vision, military radar and signal-processing front ends, and telecom line cards requiring 3.125 Gbps CPRI or OBSAI links. The combination of mid-density logic and integrated transceivers is also well suited to test-and-measurement equipment and software-defined radio prototyping. Designers should plan power sequencing for the 0.9 V core, 2.5 V/3.3 V I/O and the transceiver analog supply rails, and provide sufficient decoupling on each rail. Bitstream configuration is via passive serial, fast passive parallel, JTAG, or the built-in Altera Enhanced Configuration Device interface. Engineers are advised to consult the Arria II GX Device Data Sheet Section I for absolute maximum ratings, recommended operating conditions and detailed transceiver electrical characteristics before board bring-up. This page synthesizes distributor pricing for the EP2AGX45CU17C5N, plus a comparison against same-package Arria II GX speed-grade and temperature-grade drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
EP2AGX45CU17C6G - Arria II GX FPGA 42KLE, 156 I/O | Intel
The Intel EP2AGX45CU17C6G is a member of the Arria II GX family of mid-range FPGAs, delivering 42,959 logic elements and 3,517,440 RAM bits on a 40 nm process node, supplied at a 0.9 V core voltage. The device integrates up to 156 user I/O and supports transceiver speeds up to 3.75 Gbps through dedicated multi-gigabit transceivers, and is housed in a 358-pin FCBGA (LFBGA-358) package suitable for high-performance mid-range designs. An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device whose internal logic blocks, routing fabric, and I/O buffers are configured by loading a user-defined bitstream into on-chip SRAM configuration cells. Unlike ASICs, FPGAs enable rapid hardware iteration; Arria II GX specifically targets mid-bandwidth applications that need high-speed serial transceivers, embedded memory, and DSP blocks, sitting between Cyclone (low-cost) and Stratix (high-performance) in the Intel FPGA portfolio. Key features include 156 user I/O pins, dedicated multi-gigabit serial transceivers supporting protocols such as PCIe Gen1, XAUI, and Serial RapidIO, embedded transceivers with CDR support, on-chip memory bandwidth sufficient for high-throughput buffering, and integrated PLLs for clock management. The 0.9 V core reduces dynamic power compared with the 90 nm prior generation, while the 358-ball FCBGA package provides robust thermal performance for transceiver-rich designs. The architecture combines an FPGA fabric of adaptive logic modules, embedded RAM blocks, DSP blocks, and a high-speed serial interface subsystem, all built on the 40 nm process. Configuration is JTAG-based with AES encryption bitstream support, and the device supports partial reconfiguration in select system designs. Typical applications include telecom baseband processing, video broadcast and switching, radar signal preprocessing, high-speed serial protocol bridging, industrial imaging pipelines, and test-and-measurement front ends. The 3.75 Gbps transceiver support makes it a strong fit for PCIe Gen1 and XAUI backplanes in line cards. Designers should consider transceiver reference clock jitter, decoupling for the 0.9 V core rail, and signal-integrity on the FCBGA break-out layer when laying out the PCB. Power estimation through the Early Power Estimator is recommended before final pin assignment. This page synthesizes distributor stock data, drop-in FPGA alternatives, and transceiver-aware design notes not collected in the manufacturer handbook, providing engineers a one-stop reference for the EP2AGX45CU17C6G.
EP2AGX45CU17I3G - Arria II GX FPGA 42KLE 358-UBGA | Intel
The Intel (formerly Altera) EP2AGX45CU17I3G is a high-performance Arria II GX Field-Programmable Gate Array (FPGA) containing 42,959 logic elements, 3,517,440 bits of embedded RAM, and integrated transceivers, housed in a 358-ball FineLine BGA (UBGA, 17x17 mm) package. It is built on a 40 nm low-power process and supports 156 user I/O pins with up to 8 integrated 3.125 Gbps transceivers for serial connectivity. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured by the designer after manufacturing. FPGAs occupy a unique position between general-purpose CPUs and application-specific integrated circuits (ASICs): they offer hardware-level parallelism and deterministic latency, making them essential for high-throughput signal processing, high-speed serial interfacing, and ASIC prototyping. The Arria II GX family sits in the mid-range, providing transceivers and DSP blocks at lower power than equivalent high-end (Stratix) families while delivering far more logic than low-cost (Cyclone) families. Key features include 42,959 logic elements (LEs), 1,805 logic array blocks (LABs), 3,517,440 embedded RAM bits, 156 user I/Os, up to 8 transceivers operating up to 3.125 Gbps, dedicated DSP blocks for fixed- and floating-point math, and 4 PLLs for clock management. The device supports a 1.0 V core supply with 0.9 V internal operation and is rated for industrial temperature ranges (-40C to +100C case). Architecturally, EP2AGX45CU17I3G combines an LUT-based logic fabric, M9K memory blocks, MLAB distributed RAM, and hard IP for transceivers, PLLs, and PCI Express. This integration lets designers implement multi-gigabit serial links, parallel DSP pipelines, and memory interfaces on a single device without external PHY silicon, simplifying board design and BOM. Typical applications include wireless baseband processing, telecom backhaul, video broadcast equipment, military/aerospace signal processing, and high-speed serial protocol bridging. The integrated transceivers are especially useful where PCI Express, Serial RapidIO, or custom serial links are required alongside custom DSP or control logic. Designers should plan the PCB for a 17x17 mm BGA with 358 balls on a 1.0 mm pitch; this requires HDI stack-up with microvias and length-matched routing for transceiver channels. Power-rail sequencing (1.0 V core before I/O) and proper decoupling are essential to avoid latch-up at startup. This page synthesizes distributor pricing, 358-UBGA alternatives, and practical BGA layout notes not found in the manufacturer datasheet.
EP2AGX45CU17I3N - Arria II GX FPGA, 42K LEs, 156 I/O, 358-FCBGA | Intel
The Intel (formerly Altera) EP2AGX45CU17I3N is a member of the Arria II GX family of field-programmable gate arrays (FPGAs), built on a 40 nm process and offering 3,517,440 bits of embedded memory, 42,959 logic elements, and 156 user I/Os in a 358-pin LFBGA / FCBGA package. It integrates up to 8 high-speed transceivers capable of data rates up to 3.75 Gbps, making it suited for serial-protocol bridge, video, and wireless backhaul designs. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded multipliers, block RAM, and programmable I/O cells that can be rewired post-manufacturing to implement custom digital circuits. FPGAs occupy a position in the broader taxonomy of programmable logic devices (PLDs) and are widely used as glue logic, co-processors, and DSP accelerators between microcontrollers/DSPs and application-specific standard products (ASSPs). Within the programmable logic hierarchy, the Arria II family sits between the lower-cost Cyclone family and the high-performance Stratix family, targeting mid-range applications that need transceivers and DSP blocks. Key features of the EP2AGX45CU17I3N include 1,805 LABs, 8 transceiver channels, 4 PLLs, 312 (18x18) multipliers, support for DDR2/DDR3/LPDDR/LPDDR2 external memory interfaces, and 0.9 V core operation. The "I3" speed grade and "I" temperature grade designate industrial temperature operation (-40C to +100C) at a moderate performance bin. The Arria II GX architecture combines a logic fabric with embedded transceivers and DSP blocks, enabling designers to implement protocol bridging, video processing, and baseband DSP without external ASSPs. The 40 nm process node offers a balance of static power and dynamic performance, with dedicated hard IP for PCIe, Ethernet, and serial RapidIO protocols. Typical applications include wireless backhaul, serial protocol bridging, video processing, industrial imaging, and test & measurement instrumentation. The transceiver-rich architecture is especially useful where multi-gigabit serial links must coexist with custom DSP or control logic on a single device. When designing with this part, plan the power integrity network carefully: Arria II GX designs typically require multi-rail supplies (0.9 V core, 1.1 V transceiver PLLs, 2.5/3.3 V I/O) with bulk decoupling and high-frequency ceramic capacitors placed close to each bank. This page synthesizes distributor pricing, the curated Altera/Intel drop-in alternatives in the same 358-ball LFBGA footprint, and practical design notes that go beyond a single datasheet search.
EP2AGX45CU17I5G - 42,959 Logic Elements FPGA | Intel
Intel EP2AGX45CU17I5G is a field-programmable gate array in the Arria II GX family, providing 42,959 logic elements and 156 I/O in a 358-ball LFBGA/FCBGA package. The verified listing identifies industrial temperature grading and describes the device as a low-power, high-speed programmable IC based on 40 nm technology, with a 0.9 V core supply and a listed 500 MHz figure. These values make the component suitable for programmable digital logic, high-speed interfaces, and data-processing systems requiring configurable hardware resources. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic elements, routing resources, memory blocks, and configurable I/O. After fabrication, engineers can configure these resources to implement digital circuits, interfaces, control logic, or data-processing pipelines. Within the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-controlled processors: it provides hardware-level parallelism and deterministic timing while retaining post-manufacturing reconfigurability. The Arria II GX family is presented by distributors as a programmable-logic platform for high-speed applications. The principal verified features are 42,959 logic elements, 156 I/O, a 358-terminal LFBGA/FCBGA package, industrial temperature grading, and a 40 nm process technology. The listing also gives 0.9 V and 500 MHz values, although their precise electrical test conditions and meanings are not supplied in the provided excerpts. These characteristics support designs that need substantial programmable logic density and a broad external interface count, while the industrial grade indicates suitability for demanding environmental categories when the manufacturer's qualification documentation is reviewed. The device can be used to implement parallel datapaths, interface bridges, protocol handling, digital filters, and control functions. Its configurable architecture allows logic behavior to be changed through programming, which is valuable during prototyping, product updates, and field upgrades. The 156-I/O count is important for systems that connect multiple buses, converters, memory interfaces, or high-speed peripheral signals. The 358-ball package provides many physical connections, but package-ball verification is essential before design release because similar device suffixes can represent different speed grades, temperature grades, or package options. Typical applications include industrial automation, data-storage equipment, communications infrastructure, test and measurement, and high-speed digital signal processing. The listed industrial grade and programmable logic resources make the part appropriate for embedded control and interface aggregation, while the 500 MHz listing can help identify the intended performance class, but it should not be treated as a complete timing specification without the manufacturer datasheet. The 0.9 V value likewise requires confirmation in the detailed electrical characteristics before power-tree design is finalized. When designing with EP2AGX45CU17I5G, verify the complete ordering-code definition, I/O bank voltage limits, supported configuration methods, thermal requirements, signal-integrity rules, and exact ball map from the manufacturer documentation. The short distributor excerpts do not provide the pinout, logic-element architecture details, transceiver specifications, or environmental limits, so those values must remain marked as unavailable rather than inferred. This page combines the verified distributor specifications, commercial availability, package information, and same-family replacement candidates with clearly identified data gaps. It is intended to help engineers shortlist the FPGA while preserving the distinction between verified facts, such as 42,959 logic elements and 156 I/O, and parameters that require confirmation from the official manufacturer datasheet.
EP2AGX45DF25C4G - Arria II GX 45KLE FPGA 572-FCBGA | Intel
The Intel (formerly Altera) EP2AGX45DF25C4G is a member of the Arria II GX family of 40 nm low-power FPGAs, integrating 45,000 logic elements (LEs), 3,517,440 bits of embedded RAM, and 252 user I/O pins in a 572-ball FineLine Ball-Grid Array (FBGA) package. The device features up to 42959 adaptive logic modules, dedicated high-speed transceivers, and on-chip variable-precision DSP blocks, making it suitable for high-throughput serial connectivity and DSP-intensive applications. What is a Field Programmable Gate Array (FPGA)? An FPGA is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are typically classified alongside ASICs, CPLDs, and structured ASSPs in the programmable logic / semiconductor landscape. The Arria II GX family in particular targets mid-range applications requiring integrated transceivers (PCIe, Gigabit Ethernet, Serial RapidIO), signal processing, and embedded memory, while staying in the low-power envelope (sub-1.5 W typical at mid-utilization). Key features of the EP2AGX45DF25C4G include a logic-element density of approximately 45K, embedded 10-bit signal-processing blocks, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and the device is specified for industrial-grade temperatures. The package code DF25 indicates the 572-ball 1.0 mm-pitch FCBGA with Pb-free / lead-free compliance (suffix G), and the speed grade -4 balances performance and power for cost-sensitive mid-tier designs. Architecturally, the EP2AGX45DF25C4G uses a 40 nm process node with an adaptive logic module (ALM) fabric, embedded M9K/M144K RAM blocks, and dedicated Multipliers combined into DSP blocks. The integrated transceiver capability supports multiple protocols including PCIe Gen1/Gen2, XAUI, and Serial RapidIO, while the hard memory controller supports DDR2/DDR3 with on-chip termination. The high transceivers, programmable drive strength, and on-chip PLL/MMCM-equivalent blocks make the part well-suited to designs where transceiver count and DSP density matter more than raw logic capacity. Typical applications include wireless baseband processing, broadband aggregation routers with PCIe backplanes, broadcast video processing cards, defense and aerospace signal processing modules, and industrial machine-vision systems requiring deterministic latency. Designers choose the EP2AGX45 series when they need proven 40 nm transceiver availability, embedded memory bandwidth, and a long-lifecycle FPGA family supported by the Quartus II / Quartus Prime design toolchain. Design considerations for the EP2AGX45DF25C4G include proper transceiver analog supply filtering, controlled-impedance routing for the 572-ball FBGA breakout, thermal management under sustained DSP utilization, and careful power-decoupling of each 1.0 V core/1.5 V transceiver rail. Engineers should also reference Altera's Arria II GX device handbook for transceiver reference designs and the PCG (Pin Connection Guidelines) for correct ball-to-pad assignment. This page synthesizes distributor pricing, drop-in same-package alternatives from the Arria II GX family, and practical design notes not aggregated in a single location in the manufacturer datasheet.
EP2AGX45DF25C4N - Arria II GX FPGA, 42K LE, 252 I/O | Intel
The Intel EP2AGX45DF25C4N is a 42,959-logic-element Arria II GX mid-range FPGA with integrated transceivers, 3,517,440 bits of embedded RAM, and 252 user I/O, fabricated on a 40 nm process and supplied in a 572-ball FC-FBGA (DF25) package. The device belongs to the Arria II GX family, which targets cost-sensitive applications that need serial connectivity up to 3.75 Gbps alongside DSP and embedded memory resources. The "C4" speed grade and "N" lead-free suffix indicate a commercial-temperature-grade, Pb-free industrial offering suitable for prototyping and production deployment. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnects, dedicated DSP slices, and block RAM into a single silicon die. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, delivering hardware-level parallelism and reconfigurable I/O for compute-intensive, I/O-rich, or latency-sensitive workloads. The Arria II GX family extends this model with up to 16 integrated transceivers, hardening 6.375 Gbps backplane interfaces for protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI. The Arria II GX device fits the broader taxonomy of programmable logic devices (PLD) -> FPGA -> mid-range FPGA -> transceiver-enabled FPGA. Key specifications of the EP2AGX45DF25C4N include 1,805 LABs (logic array blocks), 56 embedded 18x18 multipliers, 273 M9K memory blocks, eight PLLs, and 16 dedicated transceivers. The core operates at 0.9 V, while the I/O banks support multiple single-ended and differential standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The 572-ball FC-FBGA package is supplied in a lead-free, Pb-free finish compliant with RoHS. Architecturally, the device integrates transceiver hard IP, variable-precision DSP blocks, and triplicated register logic for soft error mitigation, all interconnected by Altera's adaptive logic module (ALM) fabric. This combination allows the EP2AGX45DF25C4N to perform simultaneous high-speed serial I/O, parallel DSP pipelines, and general-purpose logic without external bridge chips. Typical applications include telecommunications baseband processing, industrial video broadcast equipment, low-cost wireless backhaul, medical imaging pre-processing, and military secure communications. Engineers also select this part for protocol bridging (PCIe-to-Ethernet, Serial RapidIO aggregation) where a small, integrated FPGA reduces board area and BOM. Design considerations include power estimation with the Intel Quartus Early Power Estimator, thermal analysis under worst-case transceivers-active duty cycles, and PCB layout for impedance-controlled serial channels. Decoupling must follow the reference design's stackup guidance; otherwise, jitter budget can degrade transceiver link margin. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.
EP2AGX45DF25C5G - Arria II GX FPGA 42K LEs 572-FCBGA | Intel
The Intel EP2AGX45DF25C5G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs), fabricated on a 40 nm low-power process, offering 42,959 logic elements (LEs), 3,517,440 bits of embedded memory, and 252 user I/Os, all housed in a 572-ball flip-chip BGA (FCBGA, 25x25 mm) package. The device integrates up to eight 3.75 Gbps transceivers, dedicated hardware DSP blocks, and a core voltage of 0.9 V, targeting mid-range serial connectivity designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can reconfigure post-manufacturing to implement arbitrary digital logic, signal processing, or interface protocols. FPGAs sit hierarchically under programmable logic -> logic IC -> integrated circuit -> semiconductor, providing higher performance-per-watt and lower latency than microcontrollers for parallel workloads while offering more flexibility than ASICs. Key features of the EP2AGX45DF25C5G include a maximum operating frequency of 500 MHz, embedded transceiver channels supporting PCI Express Gen1/Gen2 and Gigabit Ethernet, dedicated 18x18 multipliers for DSP, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The device family uses a logic-element fabric with adaptive logic modules (ALMs), eight-input fracturable look-up tables, and embedded SRAM blocks distributed throughout the fabric. Architecturally, the Arria II GX combines a hard PCIe Gen2 IP core with up to 8 full-duplex 3.75 Gbps transceivers and a rich DSP block inventory (up to 232 18x18 multipliers). The 40 nm process delivers a strong performance-per-watt envelope for mid-range designs that need transceivers but cannot justify the cost of a Stratix-class device, making it popular for protocol bridging, video processing, and wireless baseband pre-processing. Typical applications include telecommunications infrastructure (PCIe-over-cable backplanes, multi-gigabit serial links), broadcast video processing, industrial imaging and machine vision, wireless base stations, and radar signal pre-processing. Designers select the EP2AGX45DF25C5G when they need integrated transceivers plus a moderate logic budget in a single chip. When designing with this FPGA, pay close attention to transceiver reference-clock jitter and PCB stack-up, because 3.75 Gbps SERDES performance is highly sensitive to channel loss. Use the Quartus II design software (13.0 or later with Arria II device support) for synthesis, place-and-route, and timing closure, and follow Intel's pin connection guidelines for the 25x25 mm 572-FCBGA package to ensure reliable solder-joint formation.
EP2AGX45DF25C5N - Arria II GX FPGA, 42K LE, 572-FBGA | Intel / Altera
The Intel (formerly Altera) EP2AGX45DF25C5N is a member of the Arria II GX family of mid-range, transceiver-equipped FPGAs fabricated on a 40 nm CMOS process, integrating 42,959 logic elements (LEs), 1,805 LABs/CLBs, 3,517,440 bits of embedded RAM, and 252 user I/Os in a 25 mm × 25 mm 572-ball Flip-Chip BGA (FC-FBGA / FCBGA-572) package with built-in 3.125 Gbps transceivers and a hardened PCI Express Gen1 block. The part is specified at the C5 speed grade (commercial, -20 °C to +85 °C ambient) at a 0.9 V core supply, with maximum toggle rates near 500 MHz on internal logic. The Arria II GX family targets cost-sensitive, transceiver-rich applications that bridge ASIC-class bandwidth with FPGA flexibility. A Field Programmable Gate Array (FPGA) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that the user configures after manufacture to implement arbitrary digital functions, ranging from glue logic and state machines to full processor subsystems and high-speed serial protocol bridges. Within the broader taxonomy, the EP2AGX45DF25C5N sits at the intersection of programmable logic devices (PLD), the FPGA sub-class, the Arria II GX family, and the mid-density 45K-LE segment. Each LE contains a 4-input LUT, dedicated adder/subtractor carry logic, and a programmable register, while LABs (Logic Array Blocks) group 16 LEs with shared control signals and local interconnect, enabling efficient pipelined datapath implementation. Key features that distinguish the EP2AGX45DF25C5N include integrated multi-gigabit transceivers (MGTs) supporting data rates up to 3.125 Gbps, dedicated hard IP for PCI Express Gen1 (x1/x4), an embedded memory subsystem with up to 4.65 Mbits of block RAM plus MLAB distributed RAM, fractional PLL and general-purpose PLL blocks for clock synthesis, and a DDR/DDR2/DDR3 SDRAM memory controller hard IP block. The transceiver channels support protocols such as Serial RapidIO, Gigabit Ethernet, XAUI, and PCIe Gen1, offloading serialization, deserialization, clock-data recovery, and 8b/10b encoding from programmable fabric to hardened silicon. DSP blocks implement 18×18 multipliers with adders for FIR filters, FFTs, and baseband processing. In the broader system hierarchy, Arria II GX FPGAs like this part are typically paired with external DDR3 SDRAM, flash configuration memory (EPCS or EPCQ), clock generators, and PHY interfaces. They sit between low-cost Cyclone families and high-end Stratix families, offering the optimal balance when designers need integrated transceivers and DSP blocks at lower cost than Stratix IV/V. Configuration is typically via JTAG, Active Serial (AS), Passive Serial (PS), or Fast Passive Parallel (FPP) modes using Altera/Intel Quartus II design software. Typical applications include telecom baseband processing, broadcast video bridges, military secure communications, industrial imaging, and PCIe endpoint cards. The EP2AGX45DF25C5N is well suited to designs requiring 4–8 transceiver channels, low DSP density, and a mid-range logic budget at a lower price than Stratix-class parts. When designing with this part, ensure the PCB uses matched-length routing on all high-speed serial lanes, with continuous reference planes for the 100 Ω differential impedance. Provide decoupling of at least 100 µF bulk + 0.1 µF + 0.01 µF per supply pin group. The 572-BGA requires a multilayer PCB with via-in-pad or microvia technology to escape the 1 mm pitch ball array; verify thermal dissipation against the 27 °C/W θJA typical value with adequate copper area or forced airflow. This page synthesizes distributor pricing, package-specific drop-in alternatives within the Arria II GX family, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
EP2AGX45DF25C6G - Arria II GX FPGA 42K LE 572-FCBGA | Intel
The Intel (Altera) EP2AGX45DF25C6G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs), integrating 42,959 logic elements, 252 user I/O pins, and up to 3,517,440 bits of embedded memory in a 572-ball flip-chip BGA (FC-FBGA) package. The device is fabricated on a 40 nm process and operates from a 0.9 V core supply, delivering transceiver speeds up to 3.75 Gbps and DSP performance suited for mid-range signal processing. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, embedded memory blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit at the top of the digital logic hierarchy between fixed-function ASICs and software-driven processors, occupying the niche where parallel hardware acceleration, deterministic latency, and post-deployment reconfigurability are required. The Arria II GX family targets cost-sensitive mid-range applications that need transceiver and DSP resources without migrating to higher-cost Stratix or Agilex families. Key features of the EP2AGX45DF25C6G include up to 252 user I/O pins, embedded transceiver channels supporting common serial protocols such as PCIe Gen1/Gen2, Serial RapidIO, and CPRI, and on-chip DSP blocks optimized for fixed- and floating-point multiplication. The device supports configuration through active serial, passive serial, JTAG, and fast passive parallel modes. The 572-ball FC-FBGA package offers high I/O density and excellent signal integrity for multi-gigabit interfaces. From an architectural perspective, the EP2AGX45DF25C6G uses an adaptive logic module (ALM) structure that improves logic utilization versus 4-input LUT-based architectures, and the transceiver tiles support multiple data rates with on-chip PLLs. Designers can instantiate soft memory controllers, video processing pipelines, and protocol bridges in the fabric while dedicating DSP slices to filtering or FFT workloads. Typical applications include wireless baseband processing, radio network controllers, video broadcast infrastructure, industrial imaging, and PCIe-based data acquisition cards. The device is also deployed in military and aerospace subsystems requiring moderate logic density and serial connectivity. Its combination of DSP and transceiver resources makes it well suited for LTE and WiMAX baseband designs where deterministic latency is required. When designing with the EP2AGX45DF25C6G, pay close attention to power-rail sequencing (core 0.9 V must precede I/O rails), transceiver reference-clock jitter, and PCB routing for the FC-FBGA package. Use Altera Quartus II (or the corresponding Intel Quartus Prime release) for synthesis, place-and-route, and timing closure, and follow Altera's high-speed board design guidelines for the FC-BGA escape routing. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2AGX45DF25C6N - Arria II GX FPGA, 45K LE, 572-FCBGA | Intel
The Intel EP2AGX45DF25C6N is a mid-density Arria II GX Field Programmable Gate Array fabricated on a 40nm low-power process, integrating 42,959 logic elements, 252 user I/Os, and 8 integrated transceivers (up to 6.375 Gbps) in a 572-ball FCBGA package with 0.9 V core supply. The part belongs to the Arria II GX family, which Altera (now Intel FPGA) positioned for cost-sensitive, transceiver-rich applications such as video broadcast, wireless backhaul, and PCI Express endpoints. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines configurable logic blocks, programmable routing, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. Within the programmable-logic taxonomy, FPGAs sit alongside CPLDs and structured ASICs, but FPGAs dominate where high logic density and parallel DSP performance are required. The Arria II GX family further specialises by integrating multi-gigabit transceivers directly on-die, removing the need for external SerDes chips. Key features of the EP2AGX45DF25C6N include 1,805 LABs/CLBs, 2,898 Kbit embedded block memory, 8 transceiver channels supporting CPRI, OBSAI, PCIe Gen1/Gen2, SATA, and Serial RapidIO, dedicated 6x6 mm package footprint, and a commercial temperature grade (0C to +85C). Speed grade 6 indicates a balanced timing/power trade-off suitable for production designs where -7 over-speed margin is unnecessary. Architecturally, the device uses Altera's classic adaptive logic module (ALM) structure - the 8-input fracturable LUT predecessor to modern Stratix ALMs. The transceiver tiles are hardened, supporting both serial digital interface protocols and CPRI/OBSAI rates for wireless baseband. Hard PCI Express Gen2 endpoint blocks ease implementation of Gen1/Gen2 endpoints without consuming soft logic. Memory interfaces up to DDR3 are supported via hard PHY controllers. Typical applications include broadcast video processing (SMPTE SDI adapters, video encoders), wireless baseband cards with CPRI links to remote radio heads, machine-vision frame grabbers, PCI Express Gen2 endpoint cards, and industrial control planes requiring transceiver-rich connectivity. The Arria II GX family is mature (originally 2010-era) but remains widely deployed in long-life-cycle industrial and broadcast designs. When designing with this device, note that Quartus II (legacy) is the canonical toolchain; modern Quartus Prime does not support Arria II. Plan for 1.0 V or 1.1 V transceiver PLL supplies and a low-noise 0.9 V core regulator. The C6 speed grade relaxes Fmax constraints versus C7/C8 but still requires careful timing closure for transceiver-heavy designs. This page synthesises distributor pricing, pin-compatible same-family alternatives, and practical Quartus II design notes not found in the standalone datasheet.
EP2AGX45DF25I3G - Arria II GX FPGA, 45K LE, 3.5Mb, 572-FCBGA
The Intel (formerly Altera) EP2AGX45DF25I3G is a member of the Arria II GX family of mid-range, low-power FPGAs optimized for high-speed serial connectivity and DSP-intensive applications. Housed in a 572-ball FineLine BGA (FCBGA) package, this device integrates approximately 42,959 logic elements, 3,517,440 bits of embedded RAM, 252 user I/O pins, and dedicated multi-gigabit transceivers (MGTs) capable of data rates up to 6.375 Gbps. The I3G speed grade and industrial temperature rating (-40C to +100C) make this variant suitable for performance-sensitive designs that also demand extended thermal headroom. Arria II GX FPGAs are programmable logic devices (PLDs) that occupy the mid-range of the FPGA hierarchy, sitting between the low-power Cyclone family and the high-performance Stratix family. Architecturally, an FPGA consists of an array of configurable logic blocks (CLBs) surrounded by programmable interconnect and surrounded by hard IP such as transceivers, memory blocks, DSP blocks, PLLs, and I/O serdes. This heterogeneous architecture allows designers to implement custom parallel logic, signal processing pipelines, and high-speed serial protocols on a single die, while programmable I/O standards (LVDS, LVTTL, LVPECL, HSTL, SSTL) enable direct interfacing to a wide range of external memories and ASICs. Key features of the EP2AGX45DF25I3G include up to 6.375 Gbps transceiver data rate per channel, 8-input adaptive logic modules (ALMs), dedicated 18x18 multipliers for DSP, integrated PCI Express hard IP, and support for external memory interfaces such as DDR3, DDR2, QDRII+, and RLDRAM II. The 40nm process node reduces static and dynamic power relative to the prior-generation Arria GX family, while embedded signal integrity features such as transmit pre-emphasis, receive equalization, and PCSs (Physical Coding Sublayers) eliminate many of the analog design steps previously required at multi-gigabit speeds. The transceiver architecture is the defining feature of this family. With multiple MGTs operating independently, designers can implement protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, SFI-5, XAUI, CPRI, and OBSAI without external PHY chips. Hard PCIe Gen1/Gen2 endpoints and root ports are embedded, simplifying system-level design and reducing BOM cost in telecom, broadcast, and industrial control applications. Typical applications include wireless baseband processing, software-defined radio (SDR), video broadcasting infrastructure, test and measurement equipment with high-speed serial I/O, industrial imaging pipelines, and medical imaging systems. The combination of DSP blocks, embedded memory, and high-speed transceivers makes this device a frequent choice for 3G/4G remote radio heads, HD-SDI video routers, and PCIe-based adapter cards. The industrial temperature grade extends deployment to outdoor telecom and factory-floor equipment. When designing with this FPGA, careful attention must be paid to transceiver channel placement, PCB stack-up, and power-supply decoupling. Each MGT draws significant current during data transmission, and the device's pin map must be reviewed against the Quartus II fitter reports to ensure the desired protocol pins are locked. Designers are advised to consult the Arria II GX Device Handbook for transceiver reference schematics and the pin-out description for signal-integrity guidelines. This page synthesizes distributor pricing, drop-in alternatives from the same Arria II GX family, and design notes not typically covered in the manufacturer datasheet.
EP2AGX45DF25I5 - Arria II GX FPGA 45K LEs 572-FCBGA | Intel
The Intel (formerly Altera) EP2AGX45DF25I5 is a member of the Arria II GX family of mid-range, low-power Field-Programmable Gate Arrays (FPGAs) that integrate up to 3,517,440 bits of embedded memory, 42,959 logic elements, and 8 high-speed transceiver channels in a single 25 mm x 25 mm 572-ball Flip-Chip BGA (FCBGA) package. Built on TSMC's 40 nm process, the device supports transceiver data rates up to 6.375 Gbps, enabling PCI Express Gen2, Serial RapidIO, Gigabit Ethernet, and CPRI backhaul links without external PHY silicon. The 'I' speed grade indicates an industrial operating range, and the '5' package code denotes the F25 footprint. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the broader hierarchy of programmable logic devices (CPLDs -> FPGAs -> SoC FPGAs -> custom ASICs) and are used to accelerate parallel workloads, implement custom protocols, and provide reconfigurable glue logic between processors, sensors, and high-speed serial links. Unlike ASICs, FPGAs are programmable in the field via JTAG or PCIe configuration, enabling rapid iteration and late-stage hardware changes. Key features of the EP2AGX45DF25I5 include 252 user I/O pins, dedicated 8B/10B encoder/decoder blocks, dynamic reconfiguration support, and hardened PCIe Gen2 x4/x8 endpoint blocks. The transceiver block supports multiple serial protocols (PCIe, XAUI, SRIO, CPRI, OBSAI, GbE) and operates from a single 0.9 V core supply with dedicated PLL and serializer/deserializer channels. Per the Altera/Intel Arria II GX Device Handbook, transceivers can be configured to drive backplanes at 3.75 Gbps and chip-to-chip links at 6.375 Gbps. Typical applications include wireless base-station CPRI front-haul, video broadcast (SD/HD-SDI, 3G-SDI), industrial imaging and machine-vision frame grabbers, military radar signal processing, and PCIe Gen2 endpoint cards. In each of these designs, the FPGA serves as a protocol-bridging and packet-processing engine, freeing the host CPU from real-time serial I/O duties. When designing with the EP2AGX45DF25I5, pay close attention to the transceiver reference-clock architecture and PCB stack-up. Differential pairs must maintain 100 ohm differential impedance, and AC-coupling capacitors are required on all serial links. Power sequencing must follow the Arria II GX handbook to avoid latch-up during configuration.
EP2AGX45DF25I5G - Arria II GX 45K FPGA, 252 I/O, 572-FBGA | Intel
The Intel EP2AGX45DF25I5G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) fabricated on a 40 nm process, delivering 42,959 logic elements, 252 user I/Os, and integrated 3.125 Gbps transceivers in a 572-ball flip-chip BGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch). It targets mid-range, transceiver-rich applications including wireless baseband, broadcast video processing, and high-speed serial interface bridging. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, programmable interconnect, and a periphery of user I/O. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and below ASICs in performance-per-watt but above them in flexibility and time-to-market. The Arria II GX family specifically integrates multi-gigabit transceivers and hard PCI Express blocks, positioning the device between pure logic fabrics (Cyclone) and high-end DSP/ transceiver families (Stratix). Key features include dedicated 3.125 Gbps transceivers, embedded hard IP for PCI Express Gen1 (×1, ×4, ×8), 2.7 Mbits of on-chip memory, 156 embedded 18×18 multipliers, and a 500 MHz fabric performance. The -I5 speed/temperature grade delivers industrial temperature range support and a moderate speed bin suitable for cost-sensitive transceiver designs. The 0.9 V core supply supports enhanced low-power operation versus earlier 90/65 nm generations. The architecture combines logic fabric, embedded memory, DSP blocks, and transceivers in a single die, with hard IP blocks for PCIe, memory controllers, and the CDR/PCS that back the multi-gigabit serial links. Designers use the Quartus II design suite (or later Quartus Prime) with the Arria II Device Handbook for implementation, timing closure, and transceiver configuration. Typical applications include wireless baseband processing, broadcast and professional video equipment, radar and signal-intelligence front ends, high-speed serial protocol bridging (PCIe, Serial RapidIO, CPRI), and industrial imaging pipelines. The transceiver count and PCIe Gen1 hard IP make the part especially attractive for wireless remote radio heads and video capture cards. When designing with the EP2AGX45DF25I5G, allocate adequate PCB layers for the FC-FBGA break-out, follow Intel's transceiver reference design for the 25 mm × 25 mm footprint, and validate signal-integrity for any SERDES link running above 1 Gbps. The -I5 grade is suitable for industrial-temperature deployments but is not automotive-grade; for automotive use, migrate to an AEC-Q100-qualified equivalent. This page synthesizes distributor pricing, same-package drop-in alternatives, and application design notes that complement (and in places extend) the information found in the manufacturer datasheet and Arria II GX handbook.
EP2AGX45DF25I5N - Arria II GX FPGA, 45K LE, 572-FCBGA | Intel
The Intel (formerly Altera) EP2AGX45DF25I5N is a mid-density Arria II GX Field-Programmable Gate Array delivering 42,959 logic elements (4,302 Kbits embedded RAM) and 252 user I/Os in a 572-ball FineLine BGA package. Fabricated on TS-40's 40 nm process, the device integrates up to 8 transceiver channels capable of 3.75 Gbps operation, making it a fit for cost-sensitive serial-protocol and digital-signal-processing applications. The 'I5' speed/temperature grade denotes industrial temperature range (-40C to +100C) at the slower of the industrial speed grades. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. Within the wider taxonomy, the EP2AGX45 belongs to the Arria II mid-range family (Arria II > Arria family > FPGA > programmable logic > semiconductor IC). FPGAs differ from microcontrollers in that logic and routing are defined at compile time (via HDL bitstream), not firmware, allowing hardware-parallel throughput for DSP, packet processing, and high-speed I/O bridging. Key features include 8 full-duplex 3.75 Gbps transceivers with embedded PCS/PMA, 1.5 Mb of internal configuration memory via external flash, support for DDR2/DDR3/QDRII+ memory interfaces up to 400 MHz, and a hard PCIe Gen1 x4 / Gen2 x4 IP core. Per-channel transmit pre-emphasis and receive equalization compensate for FR-4 channel loss, and the device supports Hot Socketing for in-system replacement without backplane damage. The 27 mm x 5 mm package footprint integrates cleanly into mid-density line cards. Architecturally, the EP2AGX45DF25I5N implements 1,805 LABs, 8 transceivers, 4 PCIe hard IP blocks, 2 PLLs per side, and 4 hard memory controllers. Logic synthesis is performed with Intel Quartus II software using Verilog, VHDL, or schematic entry; the resulting bitstream loads from flash or JTAG. Typical applications include wireless baseband processing, video broadcast bridging, military secure radio, and industrial imaging pipelines. For PCIe Gen2 protocol bridging between ASIC and backplane, the integrated hard IP core eliminates soft-logic latency. Design consideration: PCB design must observe 100-ohm differential impedance for transceiver lanes and maintain length matching within 5 ps; consult the Arria II GX Transceiver User Guide for eye-diagram tuning. This page synthesizes distributor pricing, drop-in alternatives within the Arria II GX family, and practical design guidance not consolidated in the manufacturer datasheet.