FPGA & CPLD
Products (6357)
EP2AGX45DF29C3N - 45K LE Arria II GX FPGA, 6.375G Transceiver | Altera
The Altera EP2AGX45DF29C3N is a member of the Arria II GX family of mid-range FPGAs with integrated 6.375 Gbps transceivers, packaged in a 780-ball flip-chip BGA (FBGA-780, package code DF29). The device integrates approximately 45,000 logic elements (LEs), 1,678 Kbits of embedded memory (M9K blocks), and 8 embedded transceivers supporting data rates up to 6.375 Gbps, making it a single-chip solution for serial connectivity, protocol bridging, and mid-density digital signal processing. Arria II GX FPGAs belong to the broader Arria II mid-range programmable logic family (hypernym: FPGA -> programmable logic device -> programmable logic -> semiconductor IC), targeting applications between the low-power Cyclone and high-performance Stratix families. The GX sub-family specifically adds 6.375 Gbps multi-gigabit transceivers and PCI Express hard IP blocks, eliminating the need for external PHY chips in serial interface designs. Key features of the EP2AGX45DF29C3N include 8 full-duplex transceiver channels supporting CPRI, OBSAI, PCIe Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G protocols; integrated PCI Express hard IP (Gen1 x1/x2/x4 and Gen2 x1/x2/x4); up to 364 user I/Os (3.3V LVDS/LVCMOS/PCI/SSTL); 6 PLLs; 36 embedded 18x18 multipliers; and configuration via fast passive parallel (FPP) or active serial (AS) modes. The device is built on a 40nm process node. The C3N suffix denotes the commercial speed grade (C3) and lead-free / Pb-free packaging. The DF29 package is a 29mm x 29mm 780-ball flip-chip BGA with 1.0mm pitch, optimized for high-speed signal integrity on multi-gigabit serial links. Operating junction temperature range for the commercial C3 grade is 0C to 85C, while I3 (industrial) versions extend to -40C to +100C. Typical applications include wireless baseband processing with CPRI/OBSAI fronthaul, broadcast video transport (SDI/HD-SDI/3G-SDI), PCI Express endpoint and root complex cards, Serial RapidIO bridges for DSP clusters, and 10G Ethernet (XAUI) aggregation switches. The integrated hard IP significantly reduces logic and memory utilization that would otherwise be consumed by soft PHY implementations. When designing with the EP2AGX45DF29C3N, attention must be paid to transceiver channel placement (GX channels have fixed pin assignments per package), reference clock routing, and power distribution. Altera (now Intel) recommends the Quartus II 12.0+ or Quartus Prime design suite for synthesis, place-and-route, and timing closure. The 1.0V core VCC, 1.5V/1.8V/2.5V/3.3V VCCIO rails, and analog transceiver supplies require careful decoupling. This page synthesizes distributor pricing, drop-in Altera/Intel Arria II GX variants, and practical PCB/design notes not found in the standalone datasheet - a one-stop engineering reference for procurement and design-in decisions.
EP2AGX45DF29C4G - Arria II GX FPGA, 42K LE, 364 I/O, 780-FCBGA
The Intel (formerly Altera) EP2AGX45DF29C4G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) featuring 42,959 logic elements, 3,517,440 bits of embedded memory, and 364 user I/O pins in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 40 nm process technology and powered from a 0.9 V core supply, this device integrates up to 12 transceivers capable of 3.75 Gbps operation, making it well suited for high-speed serial I/O applications in the communications and industrial markets. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and digital ICs, alongside CPLDs and structured ASICs. Unlike fixed-function ASICs, FPGAs can be reconfigured after manufacturing, which makes them ideal for prototyping, low-volume production, and applications where standards evolve quickly. The Arria II GX family specifically targets mid-range applications requiring transceivers and moderate logic density. The device features 8-input adaptive logic modules (ALMs) per logic element, 36 x 36 bit multipliers for DSP operations, embedded memory blocks up to 9 Kbits each, and hard PCI Express Gen1 controllers. Configuration is supported through active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, with built-in encryption using 256-bit AES for IP protection. The 780-ball FCBGA package offers high signal density with a compact 29 mm x 29 mm footprint suitable for space-constrained designs. Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed data acquisition systems, broadcast video processing, industrial machine vision, and serial connectivity aggregation. The integrated transceivers support standards such as CPRI, OBSAI, Gigabit Ethernet, SATA, and PCI Express Gen1, enabling direct interface to backplanes, optical modules, and high-speed ADCs/DACs without external PHY devices. When designing with the EP2AGX45DF29C4G, ensure proper power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V I/O rails per Intel's Power Management Design Guidelines. Thermal management is essential because FCBGA packages rely on PCB thermal vias and airflow for heat dissipation - the device's maximum junction temperature of 100 C must not be exceeded under worst-case operating conditions. This page consolidates distributor pricing, parametric alternatives, and practical design considerations not found in the manufacturer datasheet alone, providing engineers with a quick reference for sourcing, second-source verification, and design-in risk assessment.
EP2AGX45DF29C4N - Arria II GX FPGA, 42K LE, 3.5Mb, 780-FBGA | Intel
The Intel EP2AGX45DF29C4N is a member of the Arria II GX family of mid-range FPGAs, integrating 42,959 logic elements (LEs), 3,517,440 bits of embedded memory, and high-speed transceivers in a 780-ball FineLine BGA (FBGA) package. Built on a 40nm low-power process, it supports up to 364 user I/Os and integrates up to eight 6.375 Gbps transceivers targeted at serial connectivity and high-throughput data-path applications. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture comprises configurable logic blocks (LBs/LEs), programmable interconnect, dedicated memory blocks, DSP blocks, and hardened I/O serdes (in modern families). FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor), parallel to CPLDs and ASICs. They are widely used for hardware-accelerated DSP, protocol bridging, image processing, and ASIC prototyping where deterministic latency and parallelism matter. Key features of the EP2AGX45DF29C4N include 8 full-duplex transceiver channels at up to 6.375 Gbps, 8.0/10.3125 Gbps overshoot capability, dedicated 8b/10b encoders, and PCI Express Gen2 (x1/x4) hard IP blocks. The device contains 42959 logic elements, 1805 LABs (Logic Array Blocks), 232 DSP blocks (18x18 multipliers), and 1,541 Kbits of M9K embedded memory plus 656 Kbits of MLAB. It supports up to 16 global clock networks and up to 8 PLLs (4 enhanced + 4 fast) for complex clock-tree synthesis. The architecture is a 40nm TSMC process with 1.1V core VCC and 0.9V VCCPT auxiliary supply, giving an estimated static power of around 1.5W and substantially higher dynamic power depending on toggle rate and utilization. The device is hardened for protocol support, including PCIe Gen2, Serial RapidIO, Gbps Ethernet, XAUI, CEI-6G, and CPRI, making it a versatile mid-range choice for communications line-cards and video broadcast equipment. Typical applications include wireless baseband DSP, transport-stream processing for HD-SDI video, high-speed serial protocol bridging (PCIe Gen2 / SRIO / 10GbE), FPGA-based ASIC prototyping, and test-and-measurement instrumentation. Designers favor the Arria II GX family for the price/performance ratio between Cyclone and Stratix and for the embedded transceivers that eliminate external PHY chips. When designing in this device, plan for multi-rail decoupling close to the ball map, multiple PLL reference clock sources, and thermal management for high utilization workloads. Quartus II / Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. Order a C-speed-grade part (commercial 0C to +85C) versus an I-grade (industrial -40C to +100C) based on deployment environment. This page synthesizes distributor pricing, drop-in Arria II GX alternatives, and engineering notes not found in the manufacturer datasheet, helping buyers compare sources and select the right speed grade.
EP2AGX45DF29C5G - Arria II GX 45K LE FPGA, 364 I/O, FC-FBGA-780 | Intel
The Intel (formerly Altera) EP2AGX45DF29C5G is a member of the Arria II GX family of mid-range, transceiver-equipped FPGAs fabricated on a 40 nm low-power process, packaged in a 780-ball FC-FBGA. The device integrates 42,959 logic elements (LEs), 1,805 logic array blocks (LABs), 3,517,440 bits of embedded memory, and 364 user I/O pins, with 8 transceiver channels supporting data rates up to 6.375 Gbps. The C5 speed grade targets commercial (0°C to 85°C) operating junction temperature with a typical core voltage of 0.9 V, and the G suffix indicates Pb-free, RoHS-compliant lead finish. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose interconnect, lookup tables, and I/O behavior are defined after manufacture, allowing hardware designers to implement custom digital functions without committing to a fixed ASIC mask set. Modern transceiver-enabled FPGAs occupy a tier between low-cost CPLDs and high-end ASIC/SoC devices, balancing cost, power, DSP bandwidth, and serial-link speed. The Arria II GX family, sitting between the lower-density Cyclone and the higher-density Stratix IV, targets applications that need multi-gigabit transceivers and moderate logic capacity at a lower cost-per-transceiver than flagship parts. Key features include up to 8 full-duplex transceiver channels operating at 600 Mbps to 6.375 Gbps with integrated PMA and PCS blocks, hard PCI Express (PIPE) Gen1/Gen2 IP cores, hard memory controllers for DDR3, DDR2, and QDR II+/QDR II SRAM, up to 156 full-precision 18x18 multipliers for DSP, and dedicated dynamic phase-alignment circuitry for source-synchronous interfaces. On-die PLLs support a wide range of reference clock frequencies, and the LVDS channel count reaches up to 128 true LVDS pairs at data rates above 1 Gbps. Typical applications for the EP2AGX45DF29C5G include protocol bridging cards (PCI Express to multi-gigabit serial), broadcast video and image processing, wireless baseband preprocessing, industrial imaging and machine vision, test and measurement equipment with high-speed serial acquisition, and defense/aerospace subsystems requiring radiation-tolerant-by-design flow. The combination of moderate LE count, 6.375 Gbps transceivers, and PCI Express hard IP makes the device a frequent drop-in choice for designs originally drafted on Altera Arria II GX. When designing with this part, allocate sufficient PCB area for the 29 mm x 29 mm FC-FBGA-780 package and follow the Altera/Altera power-rail sequencing guidance for VCC, VCCAUX, VCCD_PLL, and VCCPT. Use Quartus II (or later) with the Arria II GX device library for compilation, fitting, and timing closure. Confirm transceiver channel mapping and reference-clock topology against the pin-out file (CSV) before committing to layout, and verify signal-integrity compliance on all high-speed serial links using IBIS-AMI models.
EP2AGX45DF29C5N - Arria II GX FPGA, 42K LE, 364 I/O | Intel
The Intel (formerly Altera) EP2AGX45DF29C5N is a high-performance Arria II GX Field-Programmable Gate Array (FPGA) integrating 42,959 logic elements (LE), 1,805 LABs/CLBs, 3,517,440 bits of embedded RAM, and 364 user I/Os into a 780-ball flip-chip BGA (FC-FBGA-780) package measuring 29x29 mm. Built on a 40 nm CMOS process, the device operates from a 0.9 V core supply with 3.125 Gbps transceivers optimized for serial connectivity, making it suitable for mid-range ASIC prototyping, broadcast video processing, and PCI Express Gen1/Gen2 endpoint designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture, sitting within the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits (IC) -> semiconductors. The Arria II GX family specifically targets transceiver-rich mid-density applications where designers need hard-wired multi-gigabit serial channels alongside general-purpose FPGA fabric, balancing cost against performance for production volumes. Key specifications include 18050 Adaptive Logic Modules (ALMs), up to 156 18x18 multipliers for DSP, embedded transceiver blocks supporting protocols such as PCIe Gen2, XAUI, Serial RapidIO, and Gbps Ethernet, and a -5C speed grade that places the device in the standard commercial performance bin. The 780-pin FC-BGA package uses 1 mm ball pitch and includes an exposed die for thermal dissipation, supporting industrial thermal envelopes with proper PCB layout. Typical applications for the EP2AGX45DF29C5N include wireless baseband processing, software-defined radio front-ends, high-speed serial backplane aggregation, video encoding/decoding pipelines, and bridge chips for legacy bus standards. The combination of transceivers and rich logic makes it a frequent choice for prototyping 40 Gbps-class systems before committing to ASIC NRE. Designers using this part should plan PCB layout for the 780-ball BGA early in the schematic phase, ensure decoupling capacitors cover all power rails (VCC, VCCPT, VCCA, VCCP), and use Altera/Intel Quartus II software with the Arria II GX device support installed. For designs that do not need the integrated transceivers, the smaller Arria II GZ (EP2AGZ45) variants may be considered. This page synthesizes distributor pricing, drop-in Altera/Intel speed-grade and temperature alternatives, and practical design notes that are not found in the manufacturer datasheet alone. Engineers should cross-check the device handbook chapter for transceiver channel count and PLL availability before locking the bill of materials.
EP2AGX45DF29C6G - Arria II GX FPGA, 45K LE, 780-FBGA | Intel
The Intel EP2AGX45DF29C6G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) integrating 45,000 logic elements, 3,517,440 bits of embedded memory, and 364 user I/Os in a 780-ball flip-chip BGA package. The device features transceivers capable of up to 6.375 Gbps data rates, making it suitable for high-speed serial connectivity, and is fabricated on TSMC's 40nm low-power process node. The 'C6' speed grade designation places the part in the mid-speed commercial temperature tier. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic through a configuration bitstream loaded into on-chip SRAM. Within the broader semiconductor hierarchy, FPGAs sit alongside ASICs, microcontrollers, and DSPs as the primary platforms for custom digital hardware. The Arria II GX series targets mid-range applications requiring transceivers, DSP blocks, and substantial on-chip memory, bridging the gap between Cyclone (low-cost) and Stratix (high-performance) families in the Intel FPGA portfolio. Key features of the EP2AGX45DF29C6G include 45,000 logic elements, 3,517,440 embedded memory bits, 312 (18x18) multipliers for DSP operations, and integrated PCIe hard IP blocks. The 780-FBGA package measures 29x29 mm with 1.0 mm ball pitch, providing high-density I/O access suitable for high-speed parallel interfaces and memory expansion. Up to 8 transceiver channels supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, and CPRI are integrated on-die, reducing external PHY bill-of-materials. The Arria II GX architecture combines a programmable logic fabric with hard intellectual property (IP) blocks for transceivers, PCIe, and external memory controllers. This hard-IP approach reduces power and silicon area compared with soft implementations. The 40nm process node balances static and dynamic power consumption while delivering mid-range performance. Typical applications for this device include wireless baseband processing, broadcast video infrastructure, industrial imaging, and PCIe-based add-in cards. The transceiver capability also makes it attractive for software-defined radio and test & measurement equipment where multiple high-speed serial lanes are required. When designing with this FPGA, ensure proper power-rail sequencing for the core (VCC, VCCP), I/O banks (VCCIO), and transceiver (VCCH) supplies. The transceiver reference clock jitter must meet the data-rate dependent requirements documented in the device handbook; an external jitter-cleaner PLL is often required for backplane applications. This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations for the EP2AGX45DF29C6G not found in the manufacturer datasheet alone.
EP2AGX45DF29C6N - Arria II GX FPGA 45K LE 780-FBGA | Intel
The Intel EP2AGX45DF29C6N is a high-performance Arria II GX Field Programmable Gate Array (FPGA) offering 45,000 logic elements and integrated transceivers in a 780-pin FineLine BGA (FBGA) package. It is built on a 40nm low-power process and supports transceiver data rates up to 6.375 Gbps, making it suitable for high-speed serial interface applications. The device includes 364 user I/Os and is supplied in a 780-FBGA package designated DF29 (29 mm body). What is an FPGA? A Field Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, memory blocks, and DSP slices. FPGAs occupy a tier above CPLDs in complexity and below ASICs in non-recurring engineering cost, allowing designers to implement custom digital logic, signal processing pipelines, and high-speed serial protocols after fabrication. Arria II GX sits in Intel's mid-range FPGA family, between the lower-cost Cyclone series and the high-end Stratix series, balancing logic density, transceiver performance, and power consumption. Key features of the EP2AGX45DF29C6N include 1,805 LABs (logic array blocks), 3,517,440 bits of embedded memory, and 42959 (presumed adaptive logic modules / DSP-related count as listed in the datasheet). The integrated transceivers support protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI. The device operates from a 0.9V core supply with multiple I/O voltage standards supported. The architecture combines an 8-input adaptive logic module (ALM) fabric with per-channel transceiver PLLs and dedicated PHY hard IP. This allows designers to amortize the silicon area of common interfaces rather than implementing them in soft logic, reducing power and improving timing closure on multi-gigabit links. Typical applications include wireless baseband processing, broadcast video equipment, military radar, and high-speed serial protocol bridging. Designers select Arria II GX when they need proven 6.375 Gbps transceivers with mid-range logic density at lower power than Stratix IV. When designing with this FPGA, plan power sequencing for the 0.9V core, PLL supplies, and transceiver supplies independently. The 780-FBGA package requires high-layer-count PCB stack-ups with microvia technology for breakout; signal-integrity-aware layout is essential for the transceiver channels. This page consolidates distributor pricing, drop-in FPGA variants, and practical PCB design guidance synthesized from the Intel Arria II GX device handbook — information not aggregated on any single distributor product page.
EP2AGX45DF29I3G - Arria II GX FPGA, 42K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP2AGX45DF29I3G is a mid-density Arria II GX Field-Programmable Gate Array (FPGA) integrating 42,959 logic elements, 3,517,440 bits of embedded memory, and up to 364 user I/O in a 780-ball Flip-Chip FineLine BGA (FC-FBGA) package. The "I3G" suffix denotes industrial temperature grade (-40C to +100C), speed grade 3, and lead-free / RoHS-compliant lead finish. Operating from a 0.9 V core supply with auxiliary 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V I/O rails, the device runs at up to 500 MHz fabric performance. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnect, and configurable I/O on a single die. Arria II GX specifically sits in the mid-range "transceiver-equipped" category between Cyclone (low-cost) and Stratix (high-performance) families, optimized for protocol bridging, video processing, and wireless baseband DSP. Within Altera's product hierarchy, the Arria II GX family is a low-power 40 nm FPGA line targeting applications that demand multi-gigabit transceivers without the power and cost of a Stratix. Key features of the EP2AGX45DF29I3G include up to 8 integrated multi-gigabit transceivers supporting rates up to 6.375 Gbps (PCI Express Gen2, Gbps Ethernet, CPRI/OBSAI, Serial RapidIO), dedicated DSP blocks for high-throughput signal processing, embedded hard IP for PCIe Gen1/Gen2, eight configurable PLLs, and robust clock management. The FC-FBGA package is Flip-Chip BGA technology offering superior thermal and electrical performance compared to wire-bond BGAs. The Arria II GX architecture uses 8-input adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M512, M4K, M-RAM), and variable-precision DSP blocks. Hard IP cores for PCIe Gen2 x4 endpoints and dedicated SERDES make this device attractive for system-level integration. Typical applications include wireless baseband processing, radar signal processing, broadcast video encoders/decoders, PCI Express expansion cards, and military/aerospace signal processing. The mid-density 42K LE range suits data planes where logic density matters but power must remain moderate. When designing with this device, pay close attention to transceiver reference clock jitter (typically requires dedicated PLL routing), PCB stack-up for 6 Gbps SERDES (loss-controlled dielectric recommended), and IBIS-AMI simulation for backplane links. Thermal management at sustained transceiver utilization requires the FC-BGA's thermal ball array. This page synthesizes distributor pricing, drop-in compatible Arria II GX speed-grade alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel
The Intel EP2AGX45DF29I3N is a member of the Arria II GX family of mid-range FPGAs fabricated on a 40 nm process, delivering 42,959 logic elements, 1,805 logic array blocks (LABs), and 3,517,440 bits of embedded RAM in a 780-ball flip-chip BGA (FC-FBGA, package code DF29). The device integrates up to eight 3.125 Gbps transceivers and a hard PCIe Gen1/Gen2 controller, making it a drop-in candidate for serial-connectivity applications such as industrial vision, broadcast video, and wireless backhaul. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources. Within the broader product hierarchy, an FPGA sits between a microcontroller and an ASIC: it offers far higher logic density than any MCU, yet unlike a fixed-function ASIC it can be re-programmed in the field through SRAM-based configuration. The Arria II GX family specifically targets mid-bandwidth, transceiver-rich applications that exceed the capability of Cyclone IV/V devices but do not justify the cost of high-end Stratix families. Key features of the EP2AGX45DF29I3N include 364 user I/O pins, support for DDR2/DDR3/QDRII+ external memory interfaces, dedicated DSP blocks for high-speed fixed-point and floating-point arithmetic, and industrial temperature-grade operation from -40 C to +100 C. The -I3 speed grade corresponds to the slowest industrial speed bin, optimized for lower dynamic power rather than maximum Fmax, which makes it well suited to thermally constrained enclosures. Architecture-wise, the device combines a sea-of-LABs fabric, true dual-port M9K memory blocks, MLAB blocks for distributed RAM, and multiplier-accumulators inside the DSP array. The transceiver blocks (GX) support protocols such as PCIe Gen2 x1/x4, XAUI, Serial RapidIO, CPRI, and OBSAI, while the hard PCIe IP controller reduces soft-logic overhead and latency. Typical applications for this part include software-defined radio (SDR) baseband processing, video capture and display pipelines (SDI / DisplayPort bridging), industrial control backplanes with deterministic low-latency serial links, test and measurement equipment that streams aggregated data over PCIe, and radar front-end pre-processing where transceiver density and on-chip memory matter more than absolute logic capacity. When designing with this part, use the Quartus II design suite (13.0sp1 or later is recommended for Arria II GX support) and validate signal-integrity with the IBIS-AMI models published in the device datasheet. The FC-FBGA package requires a multi-layer PCB with controlled-impedance routing; expect 6-8 routing layers for full 364 I/O breakout at production yield. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel
The Intel EP2AGX45DF29I3NAD is a high-performance Arria II GX Field-Programmable Gate Array (FPGA) with 42,959 logic elements, 3,517,440 bits of embedded RAM, and 364 user I/Os, housed in a 780-ball FineLine BGA (FBGA) package with integrated transceivers. Built on a 40 nm low-power process, the Arria II GX family targets mid-range applications requiring a balance of logic density, memory bandwidth, and multi-gigabit serial connectivity. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O after manufacturing. In the broader taxonomy, the Arria II GX sits between Intel's Cyclone (low-cost) and Stratix (high-performance) families, with integrated transceivers that compete against Xilinx Kintex and AMD Versal mid-range devices. The 780-FBGA package places this part firmly in the high-density, transceiver-rich tier of mid-range FPGAs. Key features of the EP2AGX45DF29I3NAD include 42,959 logic elements (LEs), 1,805 Logic Array Blocks (LABs), 3,517,440 bits of embedded RAM, 364 user I/Os, and dedicated multi-gigabit transceivers. The device also integrates 156 (typical) 18x18 multipliers for DSP workloads and embedded PCIe hard IP blocks, enabling protocol bridging and high-speed serial interface implementation without consuming soft logic resources. The Arria II GX architecture combines an 8-input adaptive logic module (ALM) fabric with embedded memory, multiplier blocks, and PLLs. The integrated transceivers operate from 600 Mbps to 6.375 Gbps, supporting protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, CPRI, and OBSAI. This makes the family well suited to wireline backhaul, broadcast video, and high-end industrial imaging. Typical applications include high-speed serial protocol bridging (PCIe to XAUI/10G Ethernet), wireless baseband and digital radio, broadcast and professional video processing, and test and measurement instrumentation. The combination of mid-range logic density and integrated multi-gigabit transceivers makes the EP2AGX45DF29I3NAD especially attractive for cost-sensitive designs that still need serial connectivity at line rates up to 6.375 Gbps. When designing with this device, ensure the PCB supports the FBGA 780-ball land pattern with appropriate via-in-pad or microvia technology for reliable manufacturing. Multi-gigabit transceivers require strict impedance control and length matching; consult the Arria II GX Transceiver User Guide for eye-diagram, pre-emphasis, and equalization settings. Power estimation should be performed using the Intel PowerPlay early power estimator before board bring-up. This page synthesizes distributor pricing, drop-in Arria II GX speed-grade and temperature-grade alternatives, and practical design considerations not consolidated in the manufacturer datasheet.
EP2AGX45DF29I4N - Arria II GX FPGA, 45K LE, 780-FCBGA | Altera
The Altera (Intel) EP2AGX45DF29I4N is a 45 nm Arria II GX mid-range FPGA from the Arria II GX family, integrating 42,959 logic elements (LEs), 3,517,440 RAM bits, and up to 364 user I/Os in a 780-ball flip-chip BGA (FCBGA) package. This member of the Arria II GX Device Handbook lineup combines a programmable logic fabric with embedded transceivers, delivering an optimal balance of logic density, DSP bandwidth, and serial I/O for mid-range applications. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, DSP slices, and block RAM. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, but unlike CPLDs they target high-density, high-throughput designs. The Arria II GX family specifically targets mid-range applications that need a balance of logic density, embedded transceivers up to 6.375 Gbps, and PCI Express hard IP, bridging the gap between Cyclone (low-cost) and Stratix (high-performance) families. Key features of the EP2AGX45DF29I4N include up to 6.375 Gbps embedded transceivers, dedicated DSP blocks for high-speed arithmetic, 8-input adaptive logic modules (ALMs), and configuration via passive serial, fast passive parallel, or JTAG. The device integrates hard IP for PCI Express Gen1 (x1/x4/x8) and external memory interfaces supporting DDR2/DDR3/QDRII+ with on-chip termination and read/write leveling. Architecturally, the EP2AGX45DF29I4N uses a 45 nm process with adaptive logic modules (ALMs) that double the effective logic capacity per LE compared to 4-input LUT architectures. Each ALM contains two combinational adaptive LUTs (ALUTs) plus two dedicated registers. The fabric also embeds M9K and M144K memory blocks, variable-precision DSP blocks, and clock management with PLLs, enabling designs that demand both flexibility and deterministic performance. Typical applications include wireless infrastructure baseband processing, video broadcast equipment, military radar signal processing, medical imaging, and high-speed serial protocol bridging. The 780-ball FCBGA package provides sufficient I/O density for high-bandwidth designs while supporting industrial temperature operation up to 100C junction. When designing with this FPGA, leverage Quartus II software (preferred version 11.1 or later) for compilation and pin planning. Pay attention to transceiver reference clock jitter and decoupling strategy; multiple decoupling capacitor values (100 nF, 10 nF, 1 uF) placed close to each power pin minimize power-supply-induced jitter on high-speed serial links. This page synthesizes manufacturer datasheet specifications, distributor pricing, drop-in Arria II GX alternatives, and practical design notes not found in the standalone datasheet.
EP2AGX45DF29I5 - Arria II GX FPGA 42.9K LEs 780-FBGA | Intel
The Intel (Altera) EP2AGX45DF29I5 is a member of the Arria II GX family of FPGAs, a 40nm mid-range programmable logic device that integrates transceivers and a hard PCIe Gen2 IP block. Built on 42,959 logic elements across 1,805 logic array blocks (LABs) and 364 user I/Os, the device provides 3,517,440 bits of embedded memory organized as 564 18x18 multipliers, and is housed in a 780-ball FC-FBGA package. According to the Arria II GX family datasheet, the EP2AGX45DF29I5 operates from a 0.9 V core supply, supports up to 8 transceivers at 3.75 Gbps, and includes 1 hard PCIe Gen2 x4 IP block. An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacturing by the user. Within the semiconductor hierarchy, FPGAs sit between general-purpose CPUs and application-specific integrated circuits (ASICs), offering a balance of flexibility, time-to-market, and parallel-processing performance. The Arria II GX family in particular belongs to the mid-range class, optimized for applications that require integrated high-speed transceivers and protocol hard IP but at lower cost than high-end Stratix-class parts. Key features of the EP2AGX45DF29I5 include 8 full-duplex transceiver channels supporting data rates from 600 Mbps to 3.75 Gbps, a hard PCIe Gen2 x4 IP block for direct host interface, 564 18x18 multipliers suitable for DSP-intensive signal processing, and 3.5 Mbits of on-chip RAM distributed between M9K blocks and MLABs. The 780-FBGA package supports high-speed I/O and transceiver ball assignments, with -I5 speed grade indicating a specific commercial operating temperature range and performance bin. The device is fabricated on TSMC's 40nm process node, which balances static power consumption against performance. The transceiver and PLL blocks are hardened, meaning they occupy dedicated silicon that does not consume programmable logic resources, leaving the 42.9K logic elements available for user-defined state machines, control logic, and datapath applications. Typical applications include video broadcast and professional video processing where 3G-SDI/HD-SDI transceivers can be implemented on-chip, industrial and medical imaging requiring mid-density DSP performance, and high-speed serial interface bridging (PCIe Gen2, Serial RapidIO, Gigabit Ethernet). The 780-FBGA package is also well-suited to test and measurement equipment where multiple protocol interfaces must be supported simultaneously. When designing with the EP2AGX45DF29I5, engineers should pay close attention to transceiver reference-clock routing and PCB stack-up, because the 3.75 Gbps serial links demand controlled-impedance differential pairs. Power-rail sequencing for the 0.9 V core and transceiver analog supplies is also critical; Altera's PowerPlay early power estimator must be run before board layout to confirm thermal envelope and decoupling strategy. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design notes that complement the official Arria II GX Device Handbook, giving procurement and design teams a single reference for evaluation.
EP2AGX45DF29I5G - Arria II GX FPGA, 45K LE, 3.5Mbit | Intel
The Intel EP2AGX45DF29I5G is a member of the Arria II GX family of mid-range FPGAs integrating 45,000 logic elements (LEs), 3,517,440 bits of embedded memory, and 364 user I/O pins in a 780-ball FCBGA package with integrated transceivers. The part is specified at the industrial speed grade (I5), targeting systems that require a balance of logic density, on-chip memory bandwidth, and multi-gigabit serial connectivity at moderate power. According to the verified distributor listing, the device is housed in a 780-BBGA / FCBGA package and operates from a nominal 0.9 V core supply with separate transceiver and auxiliary rails. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement arbitrary digital logic functions, memory blocks, DSP arithmetic, and high-speed serial interfaces on a single silicon die. Within the programmable-logic taxonomy, FPGAs sit between fixed-function ASICs (which offer the highest density and lowest unit cost at scale but no post-tape-out flexibility) and CPLDs (which are simpler, non-volatile, and used for glue logic). The Arria II GX family specifically targets mid-bandwidth applications that need integrated transceivers without the cost or power of higher-end Stratix-class parts, placing it in the broader hierarchy of programmable-logic devices -> FPGAs -> mid-range FPGAs with transceivers. Key features of the EP2AGX45DF29I5G include 45,000 LEs, 3,517,440 embedded memory bits, 42,959 logic elements per the simplified datasheet summary, and 364 maximum user I/Os. The device also embeds dedicated 18x18 multipliers for DSP workloads, PLLs for clock management, and multi-gigabit transceivers supporting common backplane and chip-to-chip protocols. The integrated transceivers eliminate external PHY ICs in many designs, simplifying board layout and BOM. The architectural core uses a sea-of-LUTs fabric combined with embedded SRAM blocks, hardware DSP slices, and high-speed serial interface tiles. The transceiver tiles support data rates typical of the Arria II GX family for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and common serial digital interface rates. The 780-ball FCBGA package provides the I/O density required to break out the 364 user I/Os while preserving signal integrity for the multi-gigabit links. Typical applications include wireless baseband and radio card preprocessing, broadcast video bridging and processing, military and aerospace signal acquisition, and high-speed serial protocol bridging. The combination of mid-range logic density with integrated transceivers also suits imaging, medical imaging back-ends, and industrial test instrumentation where deterministic latency and high data throughput are required. When designing with this part, allocate the LVDS and transceiver pairs to the package's dedicated banks before general-purpose I/O to preserve signal integrity and meet the multi-gigibt routing constraints. Use the Altera/Intel Quartus II design software (which supports the Arria II GX device family) for place-and-route, timing closure, and transceiver channel configuration; failure to meet transceiver reference-clock jitter budgets is a common cause of link-up failures in production. This page synthesizes distributor availability, drop-in same-package alternatives from the Arria II GX family, and practical design notes that go beyond the manufacturer datasheet summary, giving engineers a faster path to part selection and qualification.
EP2AGX45DF29I5N - Arria II GX FPGA 45K LE FC-FBGA-780 | Intel
The Intel EP2AGX45DF29I5N is a high-performance Arria II GX Field Programmable Gate Array (FPGA) featuring 42,959 logic elements, 1,805 Logic Array Blocks (LABs), and 364 user I/Os, housed in a 780-ball flip-chip FineLine BGA (FC-FBGA-780) package. Built on a 40 nm process, this device integrates up to 8.3 Mbits of embedded memory and dedicated transceivers optimized for high-speed serial connectivity, targeting cost-sensitive mid-range applications. What is an FPGA? A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that lets designers implement custom digital logic via a hardware description language, then re-program the device after manufacturing. Within the broader programmable logic taxonomy, FPGAs sit alongside CPLDs as the two main branches of programmable logic devices; the Arria II GX family further specializes as a transceiver-rich mid-range family optimized for serial connectivity protocols including PCI Express Gen2, Gigabit Ethernet, and Serial RapidIO. This positions the EP2AGX45DF29I5N as a power- and cost-optimized mid-density alternative to high-end Stratix devices and a step up from Cyclone IV/ V families. Key features include 3.5 Mbits of M9K embedded memory blocks, 4 PLLs per device, and high-speed transceivers with data rates up to 3.75 Gbps. The device operates from a 0.9 V core supply with multiple auxiliary rails and supports industrial temperature range (-40C to +100C case). The FC-FBGA-780 flip-chip package provides excellent thermal and electrical performance suitable for high-density PCB designs. The Arria II GX architecture employs logic element-based fabric with dedicated DSP blocks for signal processing, hard PCIe Gen2 IP cores, and embedded SERDES channels. This combination delivers deterministic performance and protocol-ready interfaces, reducing soft-IP development time and silicon real estate. The 40 nm low-power process reduces dynamic power consumption relative to previous-generation 65 nm Arria GX devices. Typical applications include wireless infrastructure baseband processing, video broadcast equipment, industrial imaging and machine vision, military/aerospace signal processing, and PCI Express endpoint cards. The integrated transceivers and PCIe hard IP make it particularly well-suited for protocols requiring multi-gigabit serial links with minimal external components. When designing with this device, allocate sufficient PCB layers (typically 8-12) for the FC-FBGA-780 breakout, observe controlled-impedance routing for transceiver channels, and follow Intel's recommended decoupling scheme. Designers should use Quartus II design software (v13.0 or later) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance not assembled in the manufacturer datasheet.
EP2AGX45DF29I6N - Arria II GX FPGA 43K LE, 780-FCBGA | Intel (Altera)
The Intel (formerly Altera) EP2AGX45DF29I6N is a mid-density Arria II GX Field Programmable Gate Array (FPGA) from the 40-nm Arria II device family, packaged in a 780-ball FineLine BGA (FCBGA, also called UBGA-780) and shipping in the industrial temperature grade (-40C to +100C ambient). It integrates approximately 42,960 logic elements (ALMs/LEs, vendor-reported 42,959 / 43,000 marketing figure), 1,728 Kbits of embedded memory (M9K + M144K blocks, ~1.7 Mb per Altera naming), 364 user I/O pins, and up to 8 high-speed transceiver channels capable of supporting multi-gigabit serial protocols. The device family is engineered specifically to ease transceiver-based design by integrating hard IP for PCI Express (PIPE), Gigabit Ethernet (GigE, XAUI, SGMII) and DDR3 memory interfaces, removing the need for soft PHY implementations. An FPGA is a programmable logic device that lets engineers implement arbitrary digital logic, DSP blocks, memory controllers, and high-speed serial interfaces by configuring an array of logic elements, dedicated multipliers, and hard IP blocks after manufacture. FPGAs sit between general-purpose microcontrollers (fixed instruction set, lower performance) and ASICs (highest performance, no field reprogrammability). The Arria II GX family occupies the mid-range "transceiver-rich" tier - below Stratix IV/V but above Cyclone IV/IV GX - optimized for cost-sensitive applications that still need multi-gigabit serial links. Key features of EP2AGX45DF29I6N include up to 8 integrated transceivers supporting data rates up to 6.375 Gbps (C6 speed grade, "6" suffix), on-chip hard memory controllers for DDR3, hard PCI Express Gen1/Gen2 endpoints (x1/x4), and a programmable logic fabric based on 8-input adaptive logic modules (ALMs). The device is built on TSMC's 40-nm process, dramatically reducing static and dynamic power versus the prior 65-nm Stratix IV generation, while maintaining signal integrity for serial interfaces. Adaptive logic modules (ALMs) provide 8-input fracturable look-up tables, which improve effective logic utilization for wide multiplexers and adder trees common in DSP pipelines. The 780-FCBGA FineLine BGA package offers controlled-impedance escape for the 8 transceiver channels and ample user I/O for parallel interfaces. The "I6" speed/temperature suffix indicates industrial temperature grade and speed grade 6 (one of the fastest transceiver speed bins in Arria II GX). Lower speed grades (C6, I5, C5, I4, C4, I3, C3) trade maximum transceiver frequency for lower dynamic power. Typical applications for the EP2AGX45DF29I6N include PCI Express endpoint cards (Gen2 x4), broadcast video processing, motor control DSP back-ends, software-defined radio (SDR) baseband, medical imaging pre-processing, and industrial vision systems that need 1-3 Gbps LVDS links to image sensors. The integrated hard PCIe and DDR3 controllers reduce soft logic overhead, leaving more ALMs available for application-specific signal processing. When designing with the EP2AGX45DF29I6N, allocate at least 4 PCB layers for transceiver break-out routing, provide continuous ground planes under the BGA array, and follow the Quartus II pin connection guidelines for unused transceiver pins (tie Rx to VCCR, Tx to VCCT through the documented bias network). Engineers migrating from Arria II GZ, Stratix IV, or Cyclone IV GX can reuse much of the Quartus IP catalog, but should regenerate timing constraints for the target speed grade. This page synthesizes verified distributor data, package-level pin compatibility across Arria II GX speed grades, and practical design notes not found in the manufacturer datasheet, helping procurement engineers, FPGA designers, and supply-chain managers evaluate the EP2AGX45DF29I6N against its alternatives.
EP2AGX65CU1713N - Arria II GX FPGA 65K LE BGA-1713 | Altera
The Altera (Intel PSG) EP2AGX65CU1713N is a member of the Arria II GX family of mid-range, transceiver-equipped FPGAs, integrating 65,210 logic elements (LE), 2,620 Kbit of embedded memory, and eight 3.125 Gbps multi-gigabit transceivers in a 1713-ball flip-chip BGA package. This device is built on a 40 nm low-power process and is targeted at applications requiring a balanced combination of logic density, on-chip memory bandwidth, and serial connectivity. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, programmable I/O, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. The Arria II GX family belongs to the mid-range tier of Altera's FPGA portfolio, positioned below the high-end Stratix series and above the low-power Cyclone series, and optimized for cost-sensitive applications that still demand integrated transceivers and DSP capability. Key features include 2,620 Kbit of embedded SRAM, 12 PLLs, 8 transceiver channels supporting data rates from 600 Mbps to 3.125 Gbps, hard IP for PCI Express Gen1 (x1, x4) and Gen2 (x1, x4), and dedicated 6x9-bit to 36x36-bit hardware multipliers for DSP. The device supports up to 612 user I/Os arranged across multiple I/O banks with LVDS, LVPECL, HSTL, SSTL, and LVCMOS standards. Configuration is supported via JTAG, AS, PS, and FPP modes, with on-chip 8-bit CRC and bitstream encryption (AES-128/256). The Arria II GX architecture features dedicated transceiver physical coding sublayer (PCS) blocks, dynamic reconfiguration support via Partial Reconfiguration, and SignalTap II embedded logic analyzer capability. The 1713-ball BGA package uses flip-chip technology with a 40 mm x 40 mm body, providing high I/O count and excellent thermal performance. Typical applications include wireless baseband processing, video broadcast equipment, industrial imaging, military radar signal processing, and PCI Express endpoint cards. The integrated transceivers make it particularly suitable for serial backplane interfaces, SRIO, CPRI, and Aurora protocol applications. When designing with this device, pay close attention to transceiver reference clock jitter, PCB laminate selection for SerDes channels, and thermal management of the 1713-ball BGA. The BGA package requires X-ray inspection during PCB assembly. This page synthesizes distributor pricing, drop-in alternatives from the Arria II GX family, and practical design notes that complement the manufacturer datasheet for procurement and engineering decisions.
EP2AGX65CU17C4G - 65nm Arria II GX FPGA, 156 I/O, 358-UBGA | Altera
The Altera (Intel) EP2AGX65CU17C4G is a 65 nm Arria II GX Field Programmable Gate Array (FPGA) delivering 60,214 logic elements and 5,371,904 bits of embedded memory in a 358-ball UBGA (FCBGA) package. Per the Arria II device family datasheet, it is configured with 156 user I/O pins and integrates up to 12 transceiver channels, making it cost-optimized for mid-range serial connectivity and digital signal processing workloads. What is an FPGA? A Field Programmable Gate Array is a semiconductor device built from a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, programmable I/O, and (in GX-class parts) multi-gigabit transceivers, all wired through a programmable interconnect. FPGAs sit at the intersection of ASIC efficiency and processor flexibility within the broader semiconductor hierarchy: programmable logic > FPGA > configurable logic device > integrated circuit. Arria II GX is positioned as the mid-density, transceiver-rich node in the Arria II family, above Cyclone but below Stratix in Altera's portfolio. Key features of the EP2AGX65CU17C4G include: 60,214 logic elements, 5,371,904 bits of embedded RAM, 312 (18x18) multipliers, support for DDR2/DDR3/QDRII external memory interfaces, eight 3.125 Gbps transceivers, and an operating temperature range of 0 °C to 85 °C. The "C4" speed grade denotes a specific Fmax tier relative to other C-speed parts in the family. The 17 mm × 17 mm 358-ball FCBGA package is the standard footprint for the EP2AGX65 family in this ballout, preserving pin-compatibility with other C-speed and I-speed EP2AGX65 devices in the same ball array. The architecture combines an 8-input adaptive logic module (ALM), embedded RAM blocks (M9K and M144K), variable-precision DSP blocks, and PLL-based clock management with up to 12 global clock networks. The transceiver hard IP supports PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI protocols, removing the need for external PHY silicon in many designs. Typical applications include wireless baseband processing, video broadcast and image processing pipelines, industrial protocol bridging, and PCI Express endpoint cards. The transceiver density is well matched to designs requiring two or three 3G-SDI links, dual GbE ports, or single x4 PCIe endpoints. Compared with pure logic-only FPGAs of the era, the integrated transceivers reduce BOM count and board area for serial-interface designs. When designing with this device, plan power sequencing early - the EP2AGX65 requires multiple supply rails (core, I/O, transceiver, auxiliary) and a smart power controller such as an Altera Enpirion or compatible LDO/DC-DC solution. Pin-compatible speed-grade and temperature variants allow Fmax or temperature upgrades without PCB rework. This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design guidance not found in a single manufacturer document, providing engineers with a consolidated reference for sourcing and designing around the EP2AGX65CU17C4G.
EP2AGX65CU17C4N - Arria II GX FPGA 60K LE 358-UBGA | Intel
The Intel (Altera) EP2AGX65CU17C4N is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) integrating 60,214 logic elements, 5,371,904 bits of embedded memory, and up to 156 general-purpose user I/Os in a 358-ball flip-chip Ultra FineLine BGA (UBGA) package. Built on a 40nm process and supplied from a 0.9V core, the device is optimized for high-throughput serial connectivity with multi-gigabit transceivers, making it well suited to PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and HD-SDI video bridging applications. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O cells, all wired by a reprogrammable interconnect fabric. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. The Arria II GX family extends the Stratix transceiver heritage into the mid-range cost/power envelope, balancing logic density with high-speed serial capability. Key features of the EP2AGX65CU17C4N include 2,530 LABs (Logic Array Blocks), 12 transceiver channels with data rates up to 6.375 Gbps, dedicated hard IP for PCIe Gen2 x1/x4 and multiple memory controllers (DDR3, DDR2, QDRII+, RLDRAM II). Embedded transceivers eliminate the need for external PHY chips, reducing board area, BOM count, and power. The device supports up to 156 user I/Os at LVDS, LVCMOS, SSTL, and HSTL standards for flexible memory and parallel chip-to-chip interconnect. Typical applications span wireless baseband processing, broadcast video engines, industrial imaging pipelines, military secure communications, and high-performance DSP coprocessors. The integrated transceivers also enable line-card designs for ATCA and microTCA platforms. The CU17C4N speed grade (C4) targets commercial temperature (0C to 85C) operation with the 17 mm x 17 mm UBGA footprint. When designing with this device, ensure the Quartus II design toolchain supports the EP2AGX65 family and the chosen transceiver IP cores. PCB layout must enforce 100-ohm differential impedance on transceiver lanes and continuous reference planes for the 358-ball FCBGA to meet signal-integrity budgets. As of 2026-09-08, the Arria II GX family is in mature production.
EP2AGX65CU17C5G - Arria II GX FPGA 65K LE 358-UBGA | Intel
The Intel (Altera) EP2AGX65CU17C5G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) that integrates 60,214 logic elements, 5,371,904 bits of embedded memory, and 156 user I/Os in a 358-ball FCBGA (UBGA) package with 17x17 mm body. Speed grade 5 with a commercial temperature rating (0C to 85C) and the C5 speed/power ordering code identifies this specific variant. The device features up to 12 transceivers supporting protocols including PCI Express Gen1/Gen2, GIGE, Serial RapidIO, and CPRI, alongside dedicated 6.375 Gbps transceiver channels that suit high-bandwidth wireline and wireless infrastructure designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) above simple CPLDs, and they are widely used for parallel DSP, hardware acceleration, protocol bridging, and ASIC prototyping. Arria II GX is positioned in Intel's mid-range FPGA portfolio, between the lower-power Cyclone family and the high-end Stratix family, with built-in transceivers that eliminate the need for external PHY ICs in many designs. Key features of the EP2AGX65CU17C5G include 8-input adaptive logic modules (ALMs), 312 (18x18) hardware multipliers for DSP workloads, 3.125 Gbps LVDS support, and a hard PCIe Gen2 controller. The 358-pin FCBGA package uses a 17x17 mm body and is qualified for commercial operating temperatures. Configuration is supported through JTAG, passive serial, fast passive parallel, and active serial modes using industry-standard EPCS or EPCQ flash devices, allowing flexible in-system programming. The Arria II GX architecture is built on a 40 nm process and pairs transceiver-rich I/O with abundant on-chip memory. This combination enables designers to implement multi-gigabit serial links, packet processing pipelines, and high-throughput DSP functions on a single device, reducing board area and BOM cost compared with discrete PHY-plus-FPGA solutions. Hard IP blocks such as PCI Express and external memory controllers free logic resources for application-specific functions. Typical applications for the EP2AGX65CU17C5G include communications infrastructure such as baseband processing and protocol conversion, military and aerospace signal processing, broadcast video processing, industrial imaging and machine vision, ASIC prototyping, and high-speed serial interface bridging. The integration of transceivers and DSP resources makes it a strong fit for any design that needs parallel data-path processing combined with multi-gigabit serial connectivity. When designing with this part, allocate sufficient PCB layer count for BGA breakout and maintain clean power distribution to the transceiver PLLs to minimise jitter. Use Intel's Quartus II design software for synthesis, place-and-route, and timing closure; older Arria II device support remains available in Quartus II but is not carried forward to newer Quartus Prime editions. Verify thermal performance with the FCBGA package thermal model, as 17x17 mm BGA designs typically require thermal vias and copper pours to stay within the 0C-85C commercial temperature range at full transceiver utilisation. This page consolidates distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond what is printed in the Arria II GX Device Handbook.
EP2AGX65CU17C5N - Arria II GX FPGA, 60K LE, 358-BGA | Intel
The Intel EP2AGX65CU17C5N is a high-performance Arria II GX field-programmable gate array (FPGA) with 60,214 logic elements (LE), 2,530 LABs/CLBs, and 4.4 Mb of embedded memory, fabricated on a 40 nm low-power process and supplied in a 358-ball flip-chip ultra-fine BGA (FC-UFBGA) package. The Arria II GX family targets transceiver-rich applications, integrating up to 16 multi-gigabit transceivers with CPRI/OBSAI/Serial RapidIO/PCI Express (PIPE) protocol support and dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) hardware, making the part a popular choice for wireless baseband, broadcast video, and defense signal-processing backplanes. The "C5" speed grade and "N" extended temperature suffix denote the commercial -40 °C to +100 °C junction operating range with the middle-speed timing closure bin. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows designers to implement arbitrary digital logic, memory, and high-speed I/O through a configuration bitstream. Within the wider taxonomy, FPGAs sit between application-specific integrated circuits (ASICs) and microcontrollers: more flexible than ASICs and far more deterministic and parallel than CPUs. The Arria II GX family adds integrated multi-gigabit transceivers, hard PCIe Gen1/Gen2 IP, and DSP blocks for high-throughput arithmetic, which is why it is widely adopted in wireless base-station fronthaul, serial-interface bridging, and high-end video processing. Key features include 16 transceivers supporting data rates up to 6.375 Gbps, 8 PLLs, 312 user I/O pins, and 156 maximum user I/O. The core runs from a 0.9 V internal supply while I/O banks support 1.2 V to 3.3 V single-ended standards (LVCMOS, LVTTL, SSTL, HSTL) plus LVDS, mini-LVDS, and LVPECL differential signalling. Hard PCI Express Gen1/Gen2 endpoints with PIPE interface reduce soft-logic overhead, while dedicated 6 × 6 DSP blocks accelerate FFT, FIR, and complex-mixer functions for wireless DSP. Configuration is supported through fast passive parallel (FPP), passive serial (PS), JTAG, and Altera EPCS configuration devices, with built-in bitstream encryption (AES) and design-security features. The silicon architecture pairs a logic fabric of adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), MLAB memory blocks distributed throughout the fabric, and M9K/M144K block memory. Memory interfaces up to DDR3-800 are supported through hardened PHY and dynamic OCT calibration. Hard intellectual property (IP) blocks for PCIe Gen2 ×1/×4, gigabit Ethernet, and CPRI accelerate time-to-market for telecom OEMs that previously had to license soft IP for these functions. Typical applications include wireless base-station fronthaul and backhaul with CPRI/OBSAI links, broadcast video processing for SDI/HDMI bridging, military radar and electronic-warfare pre-processing, medical imaging pipelines, and high-speed serial interface bridging. The transceiver density also suits serial RapidIO and 10G Ethernet aggregation cards in telecom and datacom line cards. For new designs, however, Intel's own Cyclone V, Arria V, Arria 10, and Agilex 7 families offer higher transceiver rates and lower power, so the Arria II GX is generally used for sustaining existing designs or cost-sensitive replacement in legacy systems. Designers should plan thermal dissipation carefully: the FC-UFBGA package has a relatively high junction-to-ambient thermal resistance, so adequate airflow and board-level thermal vias are essential for reliable 100 °C-junction operation. The transceiver reference clocks must be sourced from a low-jitter PLL to meet CPRI/Ethernet jitter masks, and the 0.9 V core rail requires a tight ±3 % tolerance with proper decoupling network.
EP2AGX65CU17C6G - Arria II GX FPGA 65K LE | Intel | 6.375 Gbps
The Intel (formerly Altera) EP2AGX65CU17C6G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 60,214 logic elements, 5,371,904 bits of embedded memory, and 156 user I/Os, housed in a 358-pin LFBGA (UBGA) package. It integrates up to 6.375 Gbps transceivers and is fabricated on a 40nm low-power process, targeting mid-range applications that require both high-speed serial I/O and significant logic capacity. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that combines programmable logic blocks, interconnect, and I/O cells on a single die, belonging to the broader category of programmable logic devices (PLDs) within the digital semiconductor hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs are widely used for digital signal processing, high-speed interface bridging, and ASIC prototyping. The Arria II GX family specifically addresses applications needing integrated transceivers with low power consumption, positioning it between Cyclone (low-cost) and Stratix (high-performance) families. Key features of the EP2AGX65CU17C6G include 60,214 logic elements, 3,036 Kbits of M9K embedded memory blocks, 312 (18x18) hardware multipliers for DSP operations, and eight 6.375 Gbps transceiver channels. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and high-speed memory interfaces such as DDR3 SDRAM with dedicated PHY. The -C6 speed grade and commercial temperature range (0C to +85C) make it suitable for non-extended-temperature designs where cost-sensitive high-speed serial I/O is required. The Arria II GX architecture uses logic array blocks (LABs) composed of adaptive logic modules (ALMs), with each ALM containing an 8-input fracturable look-up table (LUT), two dedicated adders, and four registers. The transceiver blocks embed clock data recovery (CDR), serializer/deserializer (SERDES), and word alignment circuitry, enabling protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, CPRI, and SDI without external PHY devices. Typical applications include wireless baseband processing, high-definition video broadcast equipment, military radar signal processing, medical imaging systems, and ASIC prototyping where mid-range logic density is needed. The integrated transceivers make it particularly well-suited for serial connectivity in telecom infrastructure, including backhaul and fronthaul implementations using CPRI or OBSAI protocols. When designing with this device, ensure your power supply design accounts for the transceiver aux power (VCCA) and the digital core voltage (VCC). Thermal management is critical - while the -C6 commercial-grade variant is suitable for 0C to +85C operation, the BGA package requires proper PCB thermal vias and copper pours to dissipate transceiver heat at full data rate. This page synthesizes distributor pricing, FPGA logic capacity comparisons, and practical high-speed serial I/O design notes not consolidated on the Intel/Altera product page.
EP2AGX65CU17I3G - Arria II GX FPGA, 60K LE, 156 I/O, 358-BGA | Intel
The Intel EP2AGX65CU17I3G is a 60,214-logic-element Arria II GX Field Programmable Gate Array with 5,371,904 embedded memory bits, 156 user I/O, and integrated 3.75 Gbps transceivers, housed in a 358-ball LFBGA (FCBGA) package. The "I" suffix denotes the industrial temperature grade (-40C to +100C) and the speed grade 3 offers balanced timing closure for cost-sensitive designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement virtually any digital circuit. Within the broader semiconductor taxonomy, the EP2AGX65CU17I3G sits at FPGA -> programmable logic -> digital IC -> semiconductor. Arria II GX devices specifically target transceiver-based designs where cost, power, and protocol flexibility must coexist - they belong to Intel's mid-range programmable-logic family above Cyclone and below Stratix. Key features of the EP2AGX65CU17I3G include 156 user I/O, 5,371,904 bits of embedded SRAM (M9K blocks), 312 (18x18) multipliers for DSP, integrated 3.75 Gbps transceivers, eight PLLs, and hard PCI Express Gen1 IP blocks. The FCBGA-358 package provides a 17 mm x 17 mm footprint with a 1.0 mm ball pitch, suitable for moderate-density PCB designs with controlled-impedance routing for the transceiver channels. Architecturally, Arria II GX devices use TSMC's 40 nm process and feature a logic-array plus transceiver-and-memory tile structure that delivers up to 50% lower power than the prior-generation Arria GX at the same throughput. Hardened PCIe Gen1 endpoints and 8B/10B-encoded transceivers simplify common serial-protocol designs and free fabric logic for application code. Typical applications include telecom line cards and backplanes, broadcast video processing, industrial imaging with Camera Link or CoaXPress, military secure communications, and PCIe Gen1 endpoint cards. Designers favor this part when Stratix-class capacity is over-budget but Cyclone-class transceivers are insufficient. When designing, verify transceiver channel placement against the package pinout, supply all required VCC/VCCPT/VCCA_FPLL rails, and respect minimum SERDES PCB stack-up rules. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
EP2AGX65CU17I5G - 60K Logic FPGA, 156 I/O | Intel
Intel EP2AGX65CU17I5G is an Arria II GX field-programmable gate array containing 60,214 logic elements, 5,371,904 programmable logic bits, and 156 user I/O, supplied in a 358-ball LFBGA, FCBGA package. This high-density programmable logic device belongs to Intel's FPGA and CPLD product hierarchy and is suited to digital systems requiring configurable logic, memory, and high-speed interface resources. The MPN suffix indicates the industrial temperature option, but operating temperature limits, speed-grade details, transceiver counts, and package dimensions were not supplied in the verified data and must not be inferred. An FPGA, or field-programmable gate array, is a semiconductor device whose digital logic functions are defined after manufacturing through configuration rather than fixed mask-programmed circuitry. In the broader hierarchy, an FPGA combines programmable logic elements, routing resources, embedded memory, input/output blocks, and often dedicated interface functions. Engineers configure these resources using vendor design software to implement controllers, data paths, communications functions, signal processing, and system logic. Unlike a fixed application-specific integrated circuit, an FPGA can be revised in firmware or device configuration after the PCB is assembled. The verified listing identifies EP2AGX65CU17I5G as part of the Arria II GX family and specifies 156 user I/O, 5,371,904 programmable logic bits, and 60,214 logic elements. Its 358-ball LFBGA, FCBGA package is a large fine-pitch surface-mount package intended for systems with substantial interconnect density. The part is described as a programmable logic IC and as a field-programmable gate array. A distributor result also states RoHS compliant status, but no separate REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 claim was verified. The device's principal engineering value is its capacity to consolidate configurable digital functions into one package while preserving post-assembly logic flexibility. The relationship between logic-element count, programmable memory, and I/O capacity supports designs with more parallel state machines, buffers, protocol functions, or control logic than smaller programmable devices. Exact architecture, process technology, transceiver count, clock resources, power rails, configuration scheme, and supported I/O standards require the manufacturer device documentation or a complete manufacturer table before board design or substitution decisions. Typical applications include industrial automation controllers, communications infrastructure, video and imaging processing, test and measurement equipment, and embedded computing systems. The 60,214 logic elements and 156 I/O can support multi-interface aggregation, while the programmable architecture allows design changes without a new silicon mask. Dedicated high-speed use should be checked against the Arria II GX datasheet because no verified transceiver or data-rate specification was provided. For board implementation, confirm the 358-ball land pattern, power sequencing, configuration interface, I/O bank rules, and thermal requirements from the manufacturer package and device-handbook documentation. Distributor availability was listed as shipping today by some results, but a quantity-specific price and lead time were not supplied; consult current distributor stock before ordering. This page separates verified distributor facts from unverified engineering details, flags missing parameters explicitly, and provides application guidance without converting search snippets into unsupported electrical specifications.
EP2AGX65DF25C4G - Arria II GX FPGA 65K LE 572-FCBGA | Intel
The Intel (formerly Altera) EP2AGX65DF25C4G is a member of the Arria II GX family of mid-range FPGAs fabricated on a 40 nm low-power process, integrating 60,214 logic elements, 5,371,904 bits of embedded memory, and 252 user I/O pins in a 572-ball FCBGA package. The device features up to eight 3.75 Gbps transceivers that support PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and a broad set of serial protocols, making it suitable for bridging and protocol-conversion applications. A 0.9 V core supply, 500 MHz maximum operating frequency, and dedicated DSP blocks deliver signal-processing throughput for wireline and wireless infrastructure. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect, allowing designers to implement custom digital circuits after fabrication. FPGAs sit hierarchically between application-specific integrated circuits (ASICs) and software-programmable processors, combining hardware-level parallelism with rapid design iteration. The Arria II GX family is positioned as a transceiver-rich mid-density FPGA, between the low-power Cyclone series and the high-density Stratix series. Key features of the EP2AGX65DF25C4G include 60,214 logic elements, 5,371,904 embedded memory bits, 252 user I/O, and high-speed serial transceivers capable of 3.75 Gbps. The -C4 speed grade indicates a mid-tier performance bin optimized for general-purpose designs. The 572-ball flip-chip BGA (FCBGA) package supports high-pin-count designs while maintaining signal integrity for multi-gigabit serial links. The 40 nm process node balances static power consumption against logic density. Architecturally, the device combines ALM-based logic fabric with on-chip M9K memory blocks, variable-precision DSP blocks, and hard PCIe Gen2 IP cores. Transceiver channels integrate physical coding sublayer (PCS) and physical media attachment (PMA) layers, supporting multiple serial standards through configuration rather than external PHY components. This integration reduces bill-of-materials cost and PCB area in mixed-protocol designs. Typical applications include wireless baseband processing, radar and electronic-warfare signal chains, broadcast video infrastructure, industrial imaging and machine-vision pipelines, and PCIe-based accelerator cards. Designers select this part when transceiver count, logic density, and PCI-SIG compliance must coexist in a single device. When designing with this FPGA, allocate sufficient decoupling capacitance around the transceiver supply rails and follow Intel's pin-out guidelines for flip-chip BGA assembly to maintain signal-integrity margins on multi-gigabit links.