FPGA & CPLD
Products (6357)
EP2S180F1508C5N - 179400-Cell Stratix II FPGA, 1508-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S180F1508C5N is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 179,400 logic elements, 8,970 LABs/CLBs, and 9,383,040 bits of embedded RAM in a 1508-ball flip-chip BGA package (40 mm x 40 mm body, FCBGA). It exposes 1170 user I/O pins and integrates up to 96 embedded 18x18 multipliers plus 12 PLLs, making it the largest member of the Stratix II E family at the C5 speed grade with the -N lead-free / Pb-free designation. What is a Stratix II FPGA? The Stratix II is Intel's (formerly Altera's) second-generation high-performance FPGA family built on a 90 nm CMOS process with an adaptive logic module (ALM) architecture that replaces the traditional 4-input LUT, providing higher logic density and shorter critical paths. FPGAs in general sit in the programmable-logic hierarchy as: programmable logic device (PLD) -> field-programmable gate array (FPGA) -> high-end SRAM-based FPGA -> Stratix II class. They are used as logic accelerators, signal-processing engines, and high-bandwidth glue logic where ASIC NRE is not justified. Key parametric highlights include 9383040 total RAM bits (roughly 9.4 Mbit distributed + block), 96 dedicated DSP blocks (18x18 multipliers) for high-throughput DSP, 12 PLLs for multi-clock-domain synthesis, and 1170 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, HSTL and PCI/PCI-X signalling. The C5 speed grade places the device in the mid-fast bin of the Stratix II line, suitable for designs targeting internal frequencies in the 350-450 MHz fabric range. Architecture-wise, the EP2S180F1508 uses a row/column-based routing fabric driven by ALMs (8-input fracturable LUT equivalents), 12 PLLs with on-chip termination and dynamic phase shift, 4 DLLs, and dedicated high-speed I/O serials that are shared across banks. Embedded TriMatrix memory blocks provide true dual-port, simple dual-port, and single-port RAM plus FIFO buffers without consuming user logic. Typical applications include high-end telecom line-card ASIC prototyping, military signal-intelligence baseband processing, ASIC emulation, high-definition video processing pipelines, and high-channel-count software-defined radio (SDR) baseband. Its combination of 9.4 Mbit RAM and 1170 I/O is well matched to memory- and I/O-intensive designs such as H.264 encoders, multi-channel radar front-ends and routing-table lookups. When designing, pay close attention to the 1.15 V to 1.25 V core supply tolerance and the multi-rail I/O bank VCCIO requirements (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V); proper decoupling and PCB stack-up are critical at 1508 balls. Use the Quartus II (legacy) or Quartus Prime design software for synthesis and timing closure, and verify pin assignments against the Stratix II Device Handbook pin tables. This page synthesizes distributor pricing, same-package drop-in alternatives, and PCB-layout design notes that are not present in the manufacturer's datasheet alone.
EP2S180F1508I4 - Stratix II 180K LE FPGA 1170 I/O FC-FBGA | Intel
The Intel EP2S180F1508I4 is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 179,400 equivalent logic elements, 9,383,040 total RAM bits, and 1,170 user I/O pins in a 1508-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) measuring 40 mm x 40 mm. Built on a 90 nm CMOS process with a 1.2 V core supply (1.15 V to 1.25 V tolerance), this industrial-temperature-grade (I4 suffix) variant targets designs that demand the highest logic density of the Stratix II generation while operating reliably across -40C to +100C ambient conditions. The device integrates 8,970 Logic Array Blocks (LABs), 96 DSP blocks, 12 embedded PLLs, and dedicated high-speed serial interfaces. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory and multiplier resources on a single silicon die. FPGAs sit at the apex of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and PALs (Programmable Array Logic), and provide ASIC-like density with the in-system reconfigurability of a programmable device. The Stratix II family specifically introduced an adaptive logic module (ALM) architecture that breaks from traditional 4-LUT designs, achieving roughly 50 percent higher logic utilization per die area than its Stratix predecessor. Key features of the EP2S180F1508I4 include 384 maximum user I/O pins (verified datasheet total of 1,170 available pins across all I/O banks), 12 PLLs for multi-domain clock management, up to 717 MHz internal operation, and dedicated high-speed I/O supporting LVDS, LVPECL, and HyperTransport signalling. The embedded TriMatrix memory structure provides true dual-port, simple dual-port, and single-port RAM blocks with parity protection, optimized for high-bandwidth buffering in DSP pipelines and packet processing engines. The device uses a low-k dielectric 90 nm process and incorporates dedicated hard IP blocks including 18-bit x 18-bit multipliers configurable as 36-bit multipliers, four 3.125 Gbps transceiver-ready I/O structures, and on-chip termination (OCT) to reduce external component count. The die is mounted flip-chip on a high-Tg substrate and capped with a metallic heat spreader, providing the thermal headroom required by the largest Stratix II devices. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with optional external configuration devices such as the EPC16 or EPCS family. Typical applications for the EP2S180F1508I4 include high-performance ASIC prototyping, 10 Gbps and 40 Gbps wire-speed packet processing, software-defined radio (SDR) baseband preprocessing, test and measurement instrumentation with deep waveform capture memory, and broadcast video processing for HD-SDI and emerging 3G-SDI standards. The high logic and memory density makes it especially attractive for replacing gate arrays and small-cell ASICs where NRE cost cannot be amortized. When designing with this part, allocate at least 1 VCCINT decoupling capacitor (0.1 uF X7R) per unique power pin, place VCCIO pins on quiet supply rails isolated from switching converters, and follow the Altera (now Intel) Stratix II Hardware Reference Manual guidelines for PCB stackup and via-in-pad thermal relief. Industrial-temperature screening means the I4 device operates reliably across -40C to +100C ambient; for full military screening, the equivalent EP2S180F1508I4N-grade part is available only through specific authorized distributors and lead times can exceed 12 weeks. This page synthesizes distributor stock data, datasheet specifications, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, giving procurement and engineering teams a single source for the EP2S180F1508I4 lifecycle and replacement information.
EP2S180F1508I4N - Stratix II FPGA, 180K LE, 1508-FBGA | Intel / Altera
The Intel / Altera EP2S180F1508I4N is a high-density Stratix II Field Programmable Gate Array (FPGA) housed in a 1508-ball FCBGA package, featuring 179,400 logic elements, 9,383,040 bits of embedded memory, and 1,170 user I/Os. Built on a 90 nm process with a 1.2 V core voltage, it integrates 8,970 LABs (Logic Array Blocks) and embedded multipliers/DSP blocks, delivering a logic-rich platform for high-throughput parallel processing in telecom, networking, and DSP applications. A Field Programmable Gate Array (FPGA) is a type of programmable logic IC that lets designers configure digital logic, memory blocks, and routing after fabrication. Within the semiconductor hierarchy, FPGAs sit between ASICs (fully custom but expensive) and standard microcontrollers (fixed architecture). Stratix II belongs to the high-performance FPGA segment, paired in the taxonomy with families such as Xilinx Virtex-5, Lattice ECP2, and Microsemi (now Microchip) ProASIC3, and is differentiated by its adaptive logic modules (ALMs), TriMatrix embedded memory, and dedicated DSP blocks. Key features of the EP2S180F1508I4N include 1,170 user I/Os (the highest in the Stratix II family), 9 Mbits of TriMatrix memory, dedicated 18x18 multipliers for DSP, up to 12 transceivers on speed-grade -3 devices (not present on this speed-grade), and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The industrial temperature grade (-40C to +100C ambient) and Pb-free / RoHS-compliant 1508-FCBGA package suit telecom, defense, and high-end industrial systems requiring extended reliability. The architecture uses Altera's adaptive logic module (ALM), an 8-input fracturable LUT that yields roughly 30% higher logic utilization than 4-LUT predecessors. Combined with the dedicated DSP block fabric and high-speed I/O serdes, the device targets 100 Gbps-class line cards, baseband processing, and software-defined radio (SDR) platforms. Internal signal integrity is managed through programmable drive strength and on-chip termination. Typical applications include high-speed packet processing, baseband modulation/demodulation, video broadcast encoding, radar front-end processing, ASIC prototyping, and high-performance compute accelerators. Its 1,170 I/Os make it well-suited for systems that need wide parallel buses or many external memory interfaces. Designers should plan thermal dissipation early - the 1508-ball FCBGA at 179,400 LEs consumes several watts even at moderate toggle rates, and a 4-6 layer PCB with solid ground/thermal vias under the package is recommended. JTAG configuration via EPC16 or EPC64 serial configuration devices is the typical in-system programming path. For lifecycle planning, note that the Stratix II family is mature and increasingly NRND; long-life-cycle designs should validate continued supply with distributors. This page synthesizes distributor pricing, package- and pin-compatible Stratix II drop-in alternatives from the same product family, application guidance, and design notes not collated on the manufacturer datasheet - giving engineers a single reference point for sourcing, replacement, and design-in decisions.
EP2S30F484C3 - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel
The Intel (formerly Altera) EP2S30F484C3 is a member of the Stratix II family of field-programmable gate arrays (FPGAs) housed in a 484-ball fine-pitch BGA (FBGA-484) package. The device integrates 33,880 logic elements, 1,694 LABs/CLBs, 1,369,728 bits of embedded RAM, and 342 user I/O pins, fabricated on a 90 nm CMOS process with a 1.20 V core supply. The 'C3' speed grade and 'C' temperature grade define the device's commercial operating profile. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory/DSP blocks that can be reconfigured by the end user after manufacturing. FPGAs occupy a specific position in the digital logic hierarchy: programmable logic device -> FPGA -> high-density FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs offer rapid prototyping, in-field updates, and parallel hardware execution, which is why they are widely used in communications infrastructure, high-performance DSP, and ASIC prototyping. The Stratix II family specifically targets high-density, high-performance applications. The EP2S30F484C3 distinguishes itself with embedded DSP blocks, up to 12 embedded transceivers depending on the variant, and hard intellectual-property (IP) blocks such as memory controllers and PLLs. The 1.20 V core voltage reduces dynamic power compared with the 1.5 V Stratix generation while preserving high clock rates, with internal performance characterized up to 717 MHz. The 23 x 23 mm FBGA-484 package with 1.0 mm ball pitch provides a compact footprint suitable for high-density PCB designs while exposing up to 342 user I/O for external interfacing. This FPGA architecture is well suited for telecom baseband processing, high-speed serial protocol bridging, video/image processing pipelines, and ASIC prototyping where designers need to validate complex RTL before committing to silicon. The embedded TriMatrix memory blocks provide true dual-port RAM configurations, simplifying FIFO and packet-buffer implementations. When designing with the EP2S30F484C3, consider that the FBGA-484 package requires careful PCB layout with microvia or via-in-pad technology. Designers must follow Altera's power-decoupling and sequencing guidelines to ensure clean 1.2 V core rail delivery and avoid latch-up during hot-swap events.
EP2S30F484C3N - Stratix II FPGA 33880 LE, 342 IO | Intel
The Intel (formerly Altera) EP2S30F484C3N is a Stratix II field-programmable gate array (FPGA) with 33,880 logic elements, 1,369,728 RAM bits and 342 user I/Os, delivered in a 484-ball FC-FBGA package with a 1.2 V core supply. The C3 speed-grade ordering code places this part in the commercial-temperature Stratix II family and specifies a maximum internal frequency of 816.99 MHz according to the retrieved Altera/Intel specifications. A field-programmable gate array is an integrated circuit whose logic fabric can be reconfigured after manufacturing, allowing digital logic functions to be implemented without a custom ASIC. FPGAs sit in the programmable-logic hierarchy as FPGA -> programmable logic device -> embedded processing/accelerator; they are used when designers need parallel computing, flexible I/O, and in-field updates. Stratix II is Altera's second-generation high-density FPGA family built for high-bandwidth communications, DSP, and system-level integration. Understanding this hierarchy helps engineers position the EP2S30F484C3N inside a board-level design and select appropriate configuration, memory, and power-management companion devices. Key features of the EP2S30F484C3N include 33,880 logic elements arranged in 1,694 LABs, 1,369,728 bits of embedded RAM, 342 user I/Os, and a quoted maximum internal frequency of 816.99 MHz. The device is manufactured on a 90 nm CMOS process and operates from a 1.2 V core supply. The 484-ball FC-FBGA package provides a dense interconnect for a wide interface count while keeping the PCB footprint manageable. These parameters make the device well suited for applications that require substantial on-chip logic, distributed memory, and many parallel I/O channels. Architecturally, Stratix II organizes logic in LABs containing adaptive logic modules, giving the device more efficient mapping of wide logic functions than conventional four-input LUT architectures. Embedded memory blocks support multiple data-width and synchronous modes, while the general-purpose I/O supports numerous single-ended and differential standards. In the EP2S30F484C3N, the 1,369,728 RAM bits are available for packet buffering, image line storage, or soft-processor local memory. The 90 nm process technology balances density with power, but legacy FPGAs of this family still require careful power-supply and thermal design in modern systems. Typical applications for the EP2S30F484C3N include high-bandwidth telecom packet processing, software-defined radio, video and image processing, medical imaging, and aerospace pre-processing circuits. The abundant I/Os allow direct connection to LVDS buses, commercial memory interfaces, and backplane logic. On-chip RAM reduces off-chip memory bandwidth pressure for line-rate buffering and datapath staging. Designers should also consider this FPGA for high-performance glue logic and protocol bridging where an ASIC is not justified. When using the EP2S30F484C3N, keep the 1.2 V core supply well decoupled with low-ESR ceramic capacitors and verify that the serial configuration device supports the intended power-on reset scheme. Because this is a mature 90 nm device, plan for package date code availability, thermal management, and board-level signal integrity. The configuration bitstream should be stored in an external configuration device such as an EPC or EPCS part. This page synthesizes distributor pricing, within-family drop-in alternatives, and practical design guidance not found in a single distributor listing, helping engineers evaluate the EP2S30F484C3N for new designs and legacy replacement projects.
EP2S30F484C4 - Stratix II FPGA 33,880 Logic Elements | Intel / Altera
The Intel (formerly Altera) EP2S30F484C4 is a member of the Stratix II family of field-programmable gate arrays (FPGAs) built on a 90 nm process technology, integrating 33,880 logic elements, 1,369,728 RAM bits, and 1694 logic array blocks (LABs) in a 484-ball FineLine BGA (FC-FBGA-484) package. Per the manufacturer datasheet, the device supports 342 user I/Os, operates from a 1.2 V core supply, and is rated for the commercial temperature grade (0 °C to 85 °C) with a maximum core clock frequency of approximately 711 MHz. The Stratix II family introduced an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the previous Stratix generation. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to configure digital circuits after PCB assembly by loading a configuration bitstream into on-chip SRAM. FPGAs sit in the broader semiconductor hierarchy as integrated circuits (ICs) > programmable logic > programmable logic devices (PLDs) > FPGAs, and are commonly used as glue logic, DSP accelerators, high-speed serial interface bridges, and ASIC prototyping platforms. Unlike ASICs, FPGAs deliver time-to-market advantages and in-system reprogrammability at the cost of higher per-unit price and static power consumption. Key features of the EP2S30F484C4 include 13552 CLBs, 16 global clock networks, embedded 18-bit × 18-bit multipliers (DSP blocks), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via dedicated True Physical (TPHY) interface circuitry. The device integrates up to 1.36 Mbit of embedded TriMatrix memory distributed across MRAM, M4K, and M512 blocks, enabling on-chip FIFO and packet-buffer implementations without external SRAM. Dedicated high-speed transceiver channels are not included in this density; designs requiring multi-Gbps serial links would target Stratix II GX variants. Architecturally, the Stratix II family uses an 8-input ALM with a shared arithmetic chain, allowing any 6-input LUT function to be packed alongside a second smaller LUT into the same ALM, which improves logic density versus traditional 4-input LUT architectures. The 1.2 V core is supported by on-chip voltage regulation, and configuration can be loaded through JTAG, passive serial (PS), fast passive parallel (FPP), or via an external configuration device such as the EPCS or EPC4 family. Typical applications include telecom line-card processing, industrial motor control, ASIC prototyping, video processing pipelines, and military/aerospace systems where the commercial-temp variant is acceptable. The 484-pin FBGA with 1.0 mm ball pitch supports compact board layouts while exposing 342 general-purpose I/Os, sufficient for multi-lane parallel buses. When designing with this part, designers should pay particular attention to power-plane decoupling for the 1.2 V VCCINT rail (multiple 0.1 µF + bulk 10 µF capacitors adjacent to the package), the use of Quartus II design software (the original development flow; Quartus Prime is required for newer Stratix series but Stratix II is still supported in legacy versions), and thermal management on the FC-FBGA with adequate via stitching to inner ground planes. This page synthesizes distributor pricing, drop-in Stratix II alternatives (same 484-ball footprint), and practical design notes not found in the standalone manufacturer datasheet.
EP2S30F484C4N - Stratix II 33,880-LE FPGA 484-FBGA | Altera
The Altera (now Intel) EP2S30F484C4N is a Stratix II family field-programmable gate array (FPGA) with 33,880 logic elements, 1,694 logic array blocks (LABs), and 1,369,728 bits of embedded RAM, housed in a 484-ball FineLine BGA (FC-FBGA) package. Built on a 90 nm CMOS process and rated for commercial temperature grade, the device operates from a 1.2 V core supply and is specified up to 711.24 MHz internal operation. The 484-FBGA package provides 342 user I/Os, making this density suitable for mid-complexity designs that need high logic capacity and block memory. What is a Stratix II FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources, all controlled by an SRAM-based configuration bitstream. Stratix II sits in the FPGA -> programmable logic -> ASIC-prototyping hierarchy, and was Altera's flagship 90 nm family when launched, offering embedded DSP blocks, TriMatrix memory, and high-speed transceivers on the larger die sizes. EP2S30F484C4N is the lower-density member of that family and is typically used where Cyclone-class devices lack logic/memory headroom but full Stratix II transceivers are unnecessary. Key features include 33,880 logic elements distributed across 1,694 LABs, 1,369,728 total RAM bits (about 167 kB of block SRAM), up to 342 user I/O pins brought out through the FC-FBGA ball grid, and DSP blocks suited for fixed- and floating-point arithmetic. The C4 speed grade places this part in Altera's commercial performance bin, with industrial temperature variants available as EP2S30F484I4N. According to the Altera Stratix II Device Family Data Sheet, the device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, plus on-chip termination calibration for DDR/DDR2 memory interfaces. Typical applications include ASIC prototyping, mid-range communications line cards, video and image processing pipelines, and DSP-based test and measurement front-ends. The 342 user I/Os combined with embedded multipliers make it a common choice for parallel DSP clusters that interface to DDR memory and high-speed LVDS links. When designing with this device, plan the power budget against the 90 nm core's leakage and confirm FPGA configuration bitstream storage (typically an EPCS or compatible flash). Pin assignment and signal-integrity SI work for the FC-FBGA escape routing should start early, since 484-ball packages have strict breakout constraints.
EP2S30F484C5 - Stratix II FPGA 33,880 Logic Elements | Altera/Intel
The Intel (formerly Altera) EP2S30F484C5 is a Stratix II family Field Programmable Gate Array (FPGA) featuring 33,880 logic elements, 1,369,728 bits of embedded memory, 342 user I/Os, and 16 embedded DSP blocks. It is fabricated on a 90 nm CMOS process, operates from a 1.2 V core supply, and is housed in a 484-ball FineLine BGA (FC-FBGA) package. The device is specified for the commercial (C5) speed grade and supports system clock frequencies up to approximately 609.76 MHz. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to configure digital logic blocks, interconnect, and I/O behavior after manufacture. Stratix II FPGAs belong to the high-density programmable logic hierarchy, sitting between general-purpose CPLDs and ASICs in the semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor). Stratix II introduced the adaptive logic module (ALM) architecture, which improves logic utilization versus older 4-input LUT designs by roughly 50 percent per area unit. Key features of the EP2S30F484C5 include 1,694 LABs/CLBs, 342 user I/Os, embedded multiplier blocks for DSP operations, up to 12 embedded transceiver channels (per family datasheet), and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM. The C5 speed grade and FC-FBGA484 footprint align with the Stratix II family commercial-temperature catalog. The chip integrates TriMatrix embedded SRAM, dedicated DSP blocks for high-throughput arithmetic, and up to 16 global clock networks with phase-locked loop (PLL) support. The combination of ALM-based logic fabric and hard DSP blocks delivers deterministic timing paths for signal processing pipelines. The 1.2 V core, with 0.9 V and 1.8 V/2.5 V/3.3 V I/O standards supported through banked supplies, allows mixed-voltage board designs without external level shifters. Typical applications include high-speed digital signal processing, telecom baseband prototyping, ASIC verification, network packet processing, military/aerospace signal processing (industrial screening grade), and high-performance image processing front-ends. The 342 I/Os make it a strong fit for parallel video pipelines and protocol-bridging designs. When designing with this device, ensure that the Quartus II design software (version 13.0 or earlier recommended for legacy Stratix II support) is used and that the FC-FBGA484 PCB footprint includes proper microvia stack-up and 1.0 mm or 0.8 mm pitch escape routing. Power decoupling must follow Stratix II PDN guidelines, and configuration can be done via JTAG, passive serial, or Altera-enhanced configuration devices. This page synthesizes distributor pricing, pin-compatible Stratix II variants, and PCB-layout considerations not consolidated in the manufacturer datasheet.
EP2S30F484C5N - Stratix II FPGA, 33.8K LE, 484-FBGA | Intel
The Intel EP2S30F484C5N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Ball Grid Array (FBGA) package, integrating 33,880 logic elements, 1,369,728 RAM bits, 1,694 LABs (Logic Array Blocks), and 342 maximum user I/O pins. The 'C5' speed grade targets mid-range performance, with the Stratix II 90 nm CMOS fabric supporting up to 609.76 MHz internal operation per Altera/Intel documentation. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than fixed at the fab. FPGAs sit hierarchically within programmable logic -> logic ICs -> integrated circuits, and are used to implement glue logic, DSP pipelines, high-speed serial interfaces, and custom parallel compute engines in a single device. Compared with ASICs, FPGAs offer shorter development cycles and field-upgradable functionality, at the cost of higher unit price, higher dynamic power, and lower absolute performance-per-watt. The Stratix II family, introduced by Altera (now Intel FPGA), was an early 90 nm high-performance family that preceded the Stratix III/IV/Cyclone families. Key features of the EP2S30F484C5N include 24 DSP blocks (18x18 multipliers) for fixed- and floating-point pipelines, 12 PLLs (phase-locked loops) for clock synthesis and skew management, 1.2 V core supply, and 13,552 ALMs (Adaptive Logic Modules) for fine-grained logic mapping. The device supports up to 1.3 Mbits of embedded RAM, configurable as M512, M4K, or M-RAM blocks. The 484-FBGA package uses a 1.0 mm ball pitch on a 23 x 23 mm substrate and is supplied in tray packaging. Architecture-wise, the Stratix II device uses a logic-structure of ALMs and TriMatrix memory blocks, with dedicated high-speed I/O capability for LVDS, HSTL, SSTL, and PCI/PCI-X signalling. The 24 embedded DSP blocks accelerate multiplier-accumulate operations used in FIR filters and FFT engines. Twelve PLLs enable multi-domain clock synthesis and jitter-cleaning of reference clocks, supporting designs that require multiple synchronous frequencies. Typical applications include high-speed data-acquisition front-ends, software-defined radio (SDR) baseband processing, telecom line-card packet processing, video broadcast encode/decode, and ASIC prototyping. The 33.8K logic-element capacity is well-suited to mid-complexity designs that exceed Cyclone capacity but do not require the larger Stratix II EP2S60/EP2S90 devices. The 342 user I/Os allow wide parallel buses for memory or data converters. A key design consideration: the EP2S30F484C5N requires a 1.2 V core supply with separate VCCIO banks for I/O voltage; both must be sequenced correctly per the Stratix II handbook. The 484-FBGA package demands reflow-profile and PCB-pad geometry control per JEDEC J-STD-020. This page synthesizes distributor stock, lifecycle status, pin-compatibility alternatives, and design notes that go beyond what the manufacturer datasheet alone provides, helping engineers select and source this Stratix II FPGA with confidence.
EP2S30F484I4 - Stratix II FPGA, 33880 Cells, 484-FBGA | Altera
The Intel (formerly Altera) EP2S30F484I4 is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Ball Grid Array (FBGA) package, built on a 90 nm CMOS process and operating from a 1.2 V core supply. The device integrates 33,880 logic elements, 1,694 Logic Array Blocks (LABs), 342 user I/Os, and 1,369,728 bits of embedded memory, making it a mid-density workhorse for high-performance digital design. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded memory and DSP resources, all of which the designer configures after manufacture via a hardware description language (HDL) and a vendor toolchain. FPGAs sit alongside ASICs and microcontrollers in the broader category of programmable logic devices and are chosen when high parallelism, custom I/O timing, or hardware-accelerated DSP is required - as in telecommunications, video processing, and military/aerospace systems. Key features of the EP2S30F484I4 include up to 142 embedded 18 x 18 multipliers for DSP workloads, up to 12 phase-locked loops (PLLs) for multi-clock-domain synthesis, and Stratix II's signature ALM (Adaptive Logic Module) architecture that delivers higher logic efficiency than the older Stratix/LE-based approach. The 'I' speed grade and industrial temperature rating (-40 C to +100 C ambient for this part) make it suitable for harsh-environment deployments. The 90 nm CMOS technology with 1.2 V core voltage offers a balanced trade-off between static power, dynamic performance, and logic density. The 484-pin FBGA package provides 342 usable user I/Os plus dedicated configuration, JTAG, clock, and supply balls, with the high pin count enabling wide parallel buses, multiple high-speed LVDS channels, and ample external memory interfacing. Typical applications include high-speed telecommunications line cards, DSP-intensive baseband processing, video broadcast and imaging pipelines, radar and signal-intelligence systems, and industrial control platforms requiring custom hardware acceleration. The device is also a common choice for legacy ASIC-replacement projects. When designing with this part, engineers must plan the power distribution network carefully because Stratix II core current can exceed several amps during high toggle rates; multiple 0.1 uF / 10 uF / 100 uF decoupling capacitors are required on each VCCINT and VCCPD rail, and a minimum 4-layer PCB stackup with a dedicated ground plane is recommended to control simultaneous switching output (SSO) noise. This page synthesizes distributor pricing for the EP2S30F484I4, drop-in alternatives in the same 484-FBGA footprint, and practical design notes that are not present in the standalone manufacturer datasheet - giving procurement and design engineers a single reference for evaluation.
EP2S30F484I4N - Stratix II FPGA 33.8K LE | Intel | BGA-484
The Intel (formerly Altera) EP2S30F484I4N is a member of the Stratix II family of field-programmable gate arrays (FPGAs) delivering 33,880 logic elements, 1,369,728 RAM bits, and 342 user I/O pins in a 484-ball flip-chip BGA package. It combines a 90 nm process technology with a novel adaptive logic module (ALM) architecture that improves performance versus prior Stratix devices. According to the verified distributor listing, the EP2S30F484I4N integrates dedicated DSP blocks, high-speed transceivers, and on-chip memory, targeting high-density digital signal processing and communications designs. A field-programmable gate array (FPGA) is a type of programmable logic IC whose interconnect, logic, and I/O can be configured by the end user after manufacture. FPGAs occupy a middle ground between fixed-function ASICs and software-programmable processors: faster and more deterministic than microcontrollers for parallel DSP tasks, but lower NRE cost than ASICs at low volumes. Within the wider semiconductor hierarchy, an FPGA belongs to the programmable logic category, which sits under digital ICs and is itself a sub-category of integrated circuits. The Stratix II family in particular positioned itself between mid-range FPGAs and high-end DSP platforms, with embedded multipliers and TriMatrix memory blocks optimised for parallel data paths. Key features of the EP2S30F484I4N include 33,880 logic elements, 1,369,728 bits of on-chip RAM distributed across TriMatrix memory blocks, up to 342 user I/Os (the verified listing states 342), an industrial temperature grade, and a RoHS-compliant lead-free finish. The 484-pin BGA footprint with 1.0 mm ball pitch is designed for high-speed signalling and dense board layouts. The 'N' suffix indicates that the device is lead-free and RoHS compliant, while 'I4' places the device in the -40C to +100C industrial temperature range. The Stratix II architecture introduces the ALM, which contains a fracturable lookup table, two adders, and a register, giving better utilisation than the older 4-input LUT architecture. Dedicated DSP blocks support 9x9, 18x18, and 36x36 multipliers without consuming general logic. Combined with embedded transceivers (where present on the device variant) and on-chip PLLs, this allows Stratix II designs to deliver several hundred MHz of DSP throughput and multi-gigabit serial I/O on a single die. Typical applications include high-speed digital signal processing in communications infrastructure, ASIC prototyping and emulation, video and image processing pipelines, high-performance computing acceleration, and military/aerospace signal processing. The industrial temperature grade extends suitability to outdoor base stations, factory automation controllers, and avionics subsystems where wide thermal margin is mandatory. When designing with this device, ensure PCB layout supports the 1.0 mm BGA pitch with appropriate via-in-pad or microvia construction. Power integrity requires multiple decoupling rails because Stratix II parts separate core, I/O, PLL, and transceiver supplies. Quartus II design software is the primary toolchain; legacy projects may require version pinning because the device family is end-of-life. This page synthesizes distributor stock and pricing, drop-in same-package alternatives drawn from the Stratix II family, and practical design notes not found in the manufacturer datasheet, providing unique procurement and engineering value beyond what is available on any single distributor page.
EP2S30F484I5N - Stratix II FPGA 33,880 LE FC-FBGA-484 | Intel
The Intel (formerly Altera) EP2S30F484I5N is a Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process and housed in a 484-ball Flip-Chip FineLine BGA (FC-FBGA-484) package. The device integrates 33,880 logic elements, supports a maximum internal operating frequency of approximately 609.76 MHz, and operates from a 1.2 V core supply. The 'I5' speed grade and 'N' suffix identify an industrial temperature range part with lead-free, RoHS-compliant terminations. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) within the broader integrated circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs combine configurable logic blocks (LCLBs / ALMs), programmable routing, embedded memory blocks (M4K/M512), DSP blocks, and high-speed I/O transceivers, allowing designers to implement custom digital signal processing, control, and interconnect functions that are re-programmable in-system. The Stratix II family specifically introduced the ALM (Adaptive Logic Module) architecture that improves logic packing efficiency over the original Stratix ALM-predecessor ALMs and made the family well-suited for ASIC prototyping and high-performance DSP. Key features of the EP2S30F484I5N include 33,880 logic elements, 13,552 Adaptive Logic Modules (ALMs), up to 1,369,728 bits of embedded memory, dedicated DSP blocks for high-throughput multipliers, multi-gigabit transceiver support on equivalent package variants, and a flexible I/O structure supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The FC-FBGA-484 package exposes 484 balls in a fine-pitch array that supports high I/O count and short signal paths for high-speed designs. Architecturally, Stratix II FPGAs use a 90 nm, 1.2 V CMOS process with 9-layer routing, dedicated on-chip termination (OCT), and a structured ASIC-like column-based DSP and memory layout. The internal TriMatrix memory subsystem supports three memory block sizes (M512, M4K, M-RAM) optimized for different buffer and lookup table applications. The 33,880-LE device sits in the mid-density tier of the Stratix II family (below EP2S60, EP2S90, EP2S130, EP2S180), making it appropriate for designs that need more capacity than Cyclone II but less than the largest Stratix II. Typical applications include ASIC prototyping, high-speed digital signal processing, telecom baseband processing, video and image processing pipelines, military and aerospace signal processing, and industrial control systems. The -I5N industrial temperature grade (-40C to +100C ambient, +125C junction) supports designs that must operate in harsh thermal environments such as outdoor telecom, transportation, and defense systems. When designing with the EP2S30F484I5N, plan the power distribution network carefully: Stratix II devices can exceed 20 W in high-utilization designs, requiring a multi-rail core and I/O supply with extensive decoupling. Use the Altera/Intel Quartus II design software (legacy versions support Stratix II) for synthesis, place-and-route, power analysis, and timing closure. Verify signal integrity on the FC-FBGA-484 footprint using controlled-impedance traces and matched-length routing, especially for DDR memory interfaces. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2S30F672C3 - 33,880 LEs Stratix II FPGA, 672-BGA | Intel
The Intel (Altera) EP2S30F672C3 is a member of the Stratix II FPGA family, featuring 33,880 logic elements, 1,369,728 bits of embedded memory, and 500 user I/O pins in a 672-ball FineLine BGA package. Built on a 90 nm process, it integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers for high-performance digital designs. The 'C3' suffix indicates a commercial temperature grade (0C to +85C) with the -3 speed grade. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike an ASIC, an FPGA can be reconfigured after manufacturing, enabling rapid prototyping, hardware iteration, and field upgrades. Stratix II sits within Intel/Altera's FPGA hierarchy (Stratix II -> Stratix family -> high-density FPGA -> programmable logic device -> semiconductor), targeting high-performance applications such as DSP, telecom, and ASIC prototyping. Key features include up to 1.4 Mbits of TriMatrix embedded memory per block, dedicated 18x18 multipliers supporting up to 156 GMACs DSP performance, support for external DDR/DDR2/QDRII/SRAM memories via dedicated interfaces, and up to 12 high-speed transceivers (depending on variant). The 672-FBGA package provides dense I/O and robust power distribution for demanding high-speed designs. The Stratix II architecture combines adaptive logic modules (ALMs) with eight-input look-up tables (LUTs), shared arithmetic chains, and register chains, giving designers a balance of logic density, register count, and routing flexibility. The Clearwater-style silicon combines hard IP for memory controllers and SERDES, freeing fabric for application logic. Typical applications include ASIC prototyping, high-performance digital signal processing (DSP) such as software-defined radio and video processing, telecom line cards, military/aerospace signal processing, and high-speed data acquisition. Designers choose Stratix II for applications that require a balance of high logic density, abundant memory bandwidth, and DSP throughput. When designing with this device, ensure your power budget supports the core (1.2 V), I/O banks (multiple voltages), and PLL/Transceiver (analog) supplies. Decoupling and signal integrity on a multi-layer PCB are critical to achieving timing closure at the -3 speed grade. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the bare manufacturer datasheet, giving engineers a single consolidated reference for the EP2S30F672C3.
EP2S30F672C3N - 33,880 LEs Stratix II FPGA, 672-FBGA | Intel / Altera
The Intel / Altera EP2S30F672C3N is a Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 33,880 logic elements (LEs), 1,369,728 RAM bits, 500 Kbits of embedded memory, and 1,694 Logic Array Blocks (LABs) in a 672-ball FineLine BGA (FBGA) package. It operates from a 1.2 V core supply with up to 500 user I/Os at a maximum internal clock frequency around 816.99 MHz per published specifications. The part is offered as a commercial-temperature grade (suffix "C") in speed grade "3" with Pb-free (Pb-free/N) lead finish. An FPGA is a programmable logic device that lets engineers implement arbitrary digital circuits - combinational logic, state machines, multipliers, and full microprocessors - by configuring an on-chip array of look-up tables, block RAM, DSP blocks, and routing. Within the broader semiconductor taxonomy, FPGAs sit alongside CPUs and ASICs as the three principal ways to realize digital hardware: ASICs are lowest-cost at high volume but have high NRE and long lead times; CPUs are fully programmable but limited in throughput; FPGAs offer hardware-level parallelism with no NRE and re-programmability. The Stratix II family is positioned for high-density, high-performance applications such as telecommunications, ASIC prototyping, and high-speed signal processing. Key features of the EP2S30F672C3N include 33,880 LEs for general logic, 1,369,728 bits of embedded RAM for buffers and FIFOs, embedded DSP blocks (typical Stratix II count in this density is up to ~64 18x18 multipliers), and flexible I/O support including LVDS, LVTTL, LVCMOS, and SSTL standards. The device also integrates high-speed transceivers and a hard PCI Express core on certain speed grades, making it attractive for protocol bridging and high-bandwidth interface applications. Compared with smaller Cyclone II parts, the EP2S30F672C3N offers roughly four times the logic capacity and significantly more block memory, at the cost of higher power and a larger 672-ball FBGA footprint (27 mm body typical). Architecturally, the Stratix II uses Altera's adaptive logic modules (ALMs) - 8-input fracturable LUTs that can be split into smaller functions to improve utilization - feeding into a multi-tier routing fabric with dedicated high-speed paths for clocks and reset distribution. The 90 nm process and 1.2 V core deliver a favorable performance-per-watt ratio for the era, while on-chip PLLs synthesize user-configurable clocks from a single reference. Typical applications include high-speed digital signal processing (radar baseband, software-defined radio baseband), telecommunications line cards (SONET/SDH framers, Ethernet MAC aggregation), ASIC prototyping for SoC validation, video broadcast equipment (HD/3G-SDI multiplexing), and military/aerospace image processing. The large embedded memory count makes it suitable for deep packet buffering, while the rich DSP blocks accelerate FFTs and channelization. When designing with the EP2S30F672C3N, plan a multi-layer PCB (typically 8+ layers) to fan out the 672-ball FBGA and provide clean planes for the 1.2 V core and PLL supplies. Decoupling must follow Altera's Stratix II pin connection guidelines (PDF: pin connection guidelines) - every VCCINT/VCCIO pin requires a low-ESR decoupling capacitor placed within 100 mils of the ball. Configure unused I/O pins per the device handbook to minimize leakage and crosstalk, and plan JTAG access for in-system programming and debug. This page synthesizes distributor pricing, drop-in equivalents from the Stratix II family and adjacent Altera FPGA families, and practical design notes not consolidated in the manufacturer handbook.
EP2S30F672C4 - 33,880 Cells Stratix II FPGA, 672-FBGA | Intel
The Intel (Altera) EP2S30F672C4 is a Stratix II family field-programmable gate array (FPGA) featuring 33,880 logic cells, 1,369,728 bits of embedded memory, and 500 user I/O pins, housed in a 672-ball fine-line BGA (FCBGA) measuring 27x27 mm. The device is fabricated on a 90 nm process node and operates from a 1.15 V to 1.25 V core supply. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that can be electrically configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy the high-performance tier of the programmable logic hierarchy, sitting above CPLDs (Complex Programmable Logic Devices) and simple PLDs in density and capability. The Stratix II family specifically targets high-performance applications including DSP, telecommunications, and high-speed serial interfaces, distinguishing itself from predecessors by adopting an adaptive logic module (ALM) architecture that improves logic utilization efficiency over the older 4-input LUT-based Stratix generation. The EP2S30F672C4 integrates up to 16 embedded DSP blocks with dedicated multipliers, an extensive clock management network with phase-locked loops (PLLs), and high-speed transceivers. The 672-ball package provides generous I/O headroom supporting LVDS, LVTTL, SSTL, and other popular I/O standards. The 90 nm process allows a maximum core clock frequency of approximately 711 MHz per published datasheet benchmarks. Architecturally, the Stratix II ALM combines eight inputs with two adaptive LUTs, providing approximately 25 percent higher logic utilization than a conventional 4-input LUT. Embedded TriMatrix memory blocks deliver true dual-port RAM, FIFO, and ROM configurations, while the device supports up to 12 megabits of on-chip RAM for buffer-heavy applications. Typical applications include high-performance digital signal processing, telecom infrastructure, video processing, high-speed serial protocol bridging, and ASIC prototyping. The combination of abundant logic, embedded multipliers, and high pin count makes the EP2S30F672C4 well-suited to designs that previously required a mid-range ASIC. When designing with the EP2S30F672C4, ensure proper power sequencing because the core, I/O, and auxiliary supplies must ramp within specified windows. Use Altera (now Intel) Quartus II design software for synthesis, place-and-route, and timing closure; signal integrity on the FCBGA fanout demands impedance-controlled PCB stack-up and length-matched routing for high-speed LVDS pairs. This page synthesizes distributor pricing, same-family Stratix II drop-in alternatives, and practical PCB layout notes not collected in any single datasheet chapter.
EP2S30F672C4N - Stratix II FPGA 33,880 LE 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S30F672C4N is a Stratix II family Field-Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 bits of embedded RAM, and 500 user I/Os in a 672-ball FineLine BGA (FBGA) package. The device is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, with the C4 speed grade denoting a commercial temperature range and a specific internal performance bin suitable for general-purpose digital logic designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as memory, PLLs, transceivers, and DSP slices. Stratix II belongs to the high-density, performance-oriented segment of the FPGA taxonomy, sitting between mid-range FPGAs (Cyclone) and the highest-end transceivers-rich families (Stratix IV/V/10 series). The 33,880 logic-element count places the EP2S30 in the mid-density tier, and its 1.4 Mbit embedded RAM enables large on-chip buffers for DSP, networking, and high-speed datapath applications. Key features include 1,694 LABs/CLBs organized for parallel logic implementation, a 711.24 MHz maximum internal frequency per the published datasheet, and support for Stratix II architecture features such as TriMatrix embedded memory blocks, DSP blocks, and source-synchronous I/O. The 672-FBGA package is a wirebond fine-pitch BGA that supports 500 single-ended user I/Os plus high-speed differential pairs, with multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) supported per the Stratix II device handbook. The EP2S30F672C4N is implemented in a 90 nm CMOS process, with hard multipliers and DSP blocks enabling fixed- and floating-point datapath acceleration. Transceivers and external memory interfaces are provided through dedicated PHY blocks, and the Quartus II design tool supports synthesis, place-and-route, and timing closure for the device family. Typical applications include telecom baseband processing, video imaging pipelines, industrial control and machine vision, military/aerospace signal processing, and high-speed data acquisition systems. The mid-range logic and memory density make the EP2S30 a fit for designs that exceed Cyclone II capacity but do not require the transceivers or larger logic budget of Stratix IV or Stratix V. When designing, ensure 1.2 V core and 3.3 V/2.5 V/1.8 V I/O supply decoupling is sized per the Stratix II pin connection guidelines, and that the FBGA land pattern is matched to JEDEC MS-034 for reliable assembly. The C4 speed grade is appropriate for most commercial systems; for industrial temperature range or faster timing closure, consider EP2S30F672I4N or C5 speed grades. This page synthesizes distributor pricing, lifecycle status, drop-in alternative listings, and practical design notes for the EP2S30F672C4N that are not consolidated on the manufacturer datasheet or single distributor page.
EP2S30F672C5 - Stratix II FPGA, 33,880 LE, 672-FBGA | Intel
The Intel (formerly Altera) EP2S30F672C5 is a Stratix II family Field Programmable Gate Array (FPGA) delivering 33,880 logic elements, 1,369,728 RAM bits, and 500 user I/Os in a 672-pin flip-chip BGA (FC-FBGA) package. The device is built on a 90 nm CMOS process and targets mid-density, high-performance logic, DSP, and memory-intensive applications at clock rates up to 609.76 MHz with a 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable interconnect into a single silicon fabric. FPGAs sit in the broader hierarchy of programmable logic: CPLD (smaller, non-volatile, lower density) -> FPGA (large, volatile, high-density) -> SoC FPGA (FPGA fabric + hard CPU cores). They are widely used as hardware accelerators, glue logic, and prototyping platforms across wired communications, industrial, and test & measurement segments. Key features of the EP2S30F672C5 include 1,694 Logic Array Blocks (LABs), 12 embedded DSP blocks for high-speed multiply-accumulate operations, and Stratix II's signature adaptive logic modules (ALMs) that give finer-grained resource utilization than the older 4-input LUT architecture. The device supports external memory interfaces including DDR, DDR2, QDR, and RLDRAM via dedicated PHY circuits, and offers high-speed serial I/O blocks for 1 Gbps+ LVDS and SERDES connectivity. The architecture implements TriMatrix embedded memory totaling 1,369,728 RAM bits, distributed across three block sizes (M512, M4K, M-RAM) for flexible FIFO and lookup-table implementations. The 90 nm process and 1.2 V core keep dynamic power within FPGA norms for the era, while the speed grade 5 (-C5) indicates a moderate-speed bin suitable for commercial-grade designs operating at 0 to 85C junction temperature. Typical applications include high-speed digital signal processing, telecom line-card glue logic, video and image processing pipelines, network protocol bridging, ASIC prototyping, and high-throughput data acquisition. Designers use the EP2S30F672C5 when they need more logic density than a CPLD but do not require the higher cost of Stratix IV/V parts. When designing with this device, ensure proper power-plane decoupling (multiple bulk + ceramic caps near every VCC/VCCIO island), follow Altera's pinout guidelines for the 672-FBGA flip-chip package, and use Quartus II design software for synthesis, place-and-route, and timing closure. Plan board layout with controlled-impedance traces for high-speed serial links. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Stratix II family, and practical design considerations not found in the manufacturer datasheet.
EP2S30F672C5N - Stratix II FPGA 30K LE FBGA-672 | Intel
The Intel (formerly Altera) EP2S30F672C5N is a member of the Stratix II family of high-performance FPGAs, featuring 33,880 logic elements (approximately 30K equivalent), 1,369,728 bits of embedded memory, and 1694 LABs (Logic Array Blocks) packaged in a 672-ball FineLine BGA with 500 user I/O pins. It is fabricated on a 90 nm process and targets high-density, high-performance applications such as DSP, communications, and ASIC prototyping. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and programmable I/O that allows engineers to implement custom digital circuits after manufacturing. Stratix II devices introduced the innovative Adaptive Logic Module (ALM) architecture, which provides finer-grained logic utilization than traditional 4-input LUT designs, achieving up to twice the logic density per area. This places Stratix II FPGAs in the broader hierarchy of programmable logic devices: PLD -> CPLD/FPGA -> high-performance FPGA with embedded transceivers and DSP blocks. Key features of the EP2S30F672C5N include up to 16 global clock networks, dedicated multiplier blocks for high-speed DSP, TriMatrix embedded memory (M512, M4K, M-RAM blocks), and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM II. The device also includes 4 phase-locked loops (PLLs) for clock management and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The C5 speed grade designation indicates a specific timing closure for the -5 commercial speed grade, while the F672 package refers to a 672-ball FineLine BGA. The 'N' suffix indicates lead-free / RoHS-compliant lead finish. The Stratix II family provides a balanced combination of logic, memory, and DSP resources, making it suitable for high-throughput parallel processing tasks. Typical applications include high-end DSP and image processing, ASIC prototyping and emulation, high-speed serial protocol bridging, telecommunications infrastructure, and military/aerospace signal processing. The wide I/O count and high memory bandwidth also make it suitable for test and measurement equipment where parallel data acquisition and real-time processing are required. When designing with this device, pay close attention to power distribution and decoupling on the BGA package, as well as signal integrity for high-speed differential pairs. Designers should use the Quartus II development environment (legacy versions support Stratix II) for synthesis, place-and-route, and timing analysis. For new designs, consider newer Cyclone, Arria, or Stratix families as Stratix II is now a legacy device family.
EP2S30F672C5NGC - Stratix II 33,880 LC FPGA, 672-BGA | Intel
The Intel EP2S30F672C5NGC is a member of the Stratix II family of FPGAs, delivering 33,880 logic elements, 1,369,728 bits of embedded RAM, and 500 maximum user I/Os in a 672-ball FC-FBGA package. It is fabricated on a 90 nm process technology and operates from a 1.2 V core supply, with internal performance reaching up to 609.76 MHz. The 672-pin FC-FBGA package uses Intel's lead-free FC-FBGA construction suitable for high-density board layouts. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all interconnected by a hierarchical routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> logic semiconductors -> integrated circuits. The Stratix II family is positioned in Intel's (formerly Altera's) high-performance, logic-rich FPGA tier, optimized for ASIC prototyping, telecom bridging, and high-speed digital signal processing. Key features of the EP2S30F672C5NGC include 64 dedicated 18x18 hardware multipliers for DSP workloads, 1,337.6 Kbits of distributed RAM, adaptive logic modules (ALMs) that are twice as dense as the prior Stratix ALM architecture, and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM. The -C5 speed grade positions this device in the mid-speed bin of the family, balancing timing closure headroom against maximum Fmax. Typical applications include 32/64-bit PCI-X bus master/target interfaces running at 66/100/133 MHz, high-throughput DSP pipelines, ASIC prototyping, and high-speed serial protocol bridging. The 500 user I/O count and large on-chip memory make the EP2S30 well suited for data-path centric designs where both logic density and memory bandwidth matter. When integrating this part, plan the power sequencing for the 1.2 V core and auxiliary supplies, and review the FC-FBGA PCB layout guidelines for the 672-ball footprint to ensure signal-integrity on the DDR2 memory interface. Designers should also confirm Quartus II version support and the latest service pack before committing to a design. This page synthesizes distributor pricing, drop-in FPGA alternatives within the Stratix II family, and practical design guidance not found in the manufacturer datasheet alone.
EP2S30F672C5NRB - Stratix II FPGA 33.8K LE 500 I/O 672-FBGA | Intel
The Intel (formerly Altera) EP2S30F672C5NRB is a member of the Stratix II family of field-programmable gate arrays (FPGAs), featuring 33,880 logic elements in a 672-ball FineLine BGA (27 mm x 27 mm) package with 500 user I/O pins. It is built on a 1.2 V core, 90 nm process technology and is supplied in a commercial temperature grade of 0 C to 85 C. The suffix 'NRB' in the MPN denotes a RoHS-compliant tray packaging variant. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers that can be re-programmed by the customer after manufacture. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design flexibility vs. performance trade-off, making them ideal for prototyping, low-volume production, and designs requiring hardware-level parallelism. The Stratix II family was Intel/Altera's second-generation high-performance FPGA, succeeding the original Stratix and adding adaptive logic modules (ALMs). Key features of the EP2S30F672C5NRB include 1,694 LABs/CLBs, 33,880 total logic elements, embedded memory, DSP blocks for high-throughput arithmetic, and high-speed I/O support. The 672-FBGA package exposes up to 500 user I/O, allowing integration with DDR/DDR2 memory, LVDS links, and parallel high-speed buses. The device operates from a 1.15 V to 1.25 V core supply and supports configuration via passive serial, fast passive parallel, or JTAG. Architecturally, the Stratix II device family is built on a 90 nm SRAM process with embedded memory, TriMatrix memory blocks, and dedicated DSP blocks capable of 9-bit, 18-bit, and 36-bit arithmetic at hundreds of MHz. The ALM (Adaptive Logic Module) architecture combines features of LUT-based and product-term-based logic, giving 1.4x the typical logic capacity of competing architectures of the same size. High-speed I/O support includes LVDS, LVPECL, and DDR memory interfaces. Typical applications include high-speed digital signal processing (DSP), telecommunications line cards, video processing pipelines, military/aerospace secure communications, and ASIC prototyping. The 500 I/O count makes it especially suitable for memory-intensive and bus-intensive designs that require many concurrent external connections. When designing with this part, note that configuration data must be loaded from an external flash or download cable on every power-up, as the SRAM-based configuration is volatile. Use the Quartus II design software for synthesis, place-and-route, and timing closure. The 672-BGA package requires careful PCB layout with matched-length traces and proper thermal management. This page synthesizes distributor pricing, parametric alternatives, and engineering guidance for the EP2S30F672C5NRB not found in the manufacturer datasheet alone.
EP2S30F672I4 - Stratix II FPGA, 33.88K LE, 672-BGA | Intel / Altera
The Intel / Altera EP2S30F672I4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, offering 33,880 logic elements, 1,694 Logic Array Blocks (LABs), 500 user I/Os, and 1,369,728 bits of embedded memory in a 672-ball FineLine BGA (FBGA) package. Housed in a 35 x 35 mm PBGA672 with 1 mm pitch, the device operates across the industrial temperature range (-40C to +100C) and integrates up to 12 embedded DSP blocks along with 6 phase-locked loops, providing a flexible compute fabric for high-throughput signal processing and ASIC prototyping workloads. According to Altera's official Stratix II datasheet, the device supports multi-gigabit transceivers via external PHYs and offers ALM-based logic architecture for higher performance per logic element versus the prior Stratix generation. The EP2S30F672I4 is a member of the Stratix II family - a 90 nm, 1.2 V core FPGA line with on-chip RAM blocks, TriMatrix memory, and dedicated multiplier/DSP blocks for DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital circuits in silicon. FPGAs sit at the top of the programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. Compared to fixed-function ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and parallel hardware execution, making them ideal for communications, video processing, and high-speed DSP. Key features of the EP2S30F672I4 include 1,369,728 total RAM bits arranged in TriMatrix memory blocks, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM) through dedicated PHY circuitry, 4 corner PLLs plus 2 additional PLLs, and JTAG-based configuration via the IEEE 1149.1 boundary-scan interface. The device is configured via serial or parallel configuration schemes supported by the Stratix II configuration architecture, with encryption via the 128-bit AES block. The EP2S30F672I4 uses Altera's ALM (Adaptive Logic Module) architecture combined with TriMatrix memory (three block sizes per column) and dedicated 18x18 multipliers. This architecture delivers higher logic utilization per area than look-up-table-only predecessors and integrates DSP blocks optimized for multiply-accumulate workloads such as FFT engines and digital filters. The 672-FBGA package exposes 500 user I/Os through Altera's High-Speed I/O standard support. Typical applications include high-speed digital communication equipment, ASIC prototyping, video and image processing pipelines, software-defined radio (SDR), test and measurement instrumentation, and DSP-acceleration cards. The combination of high logic density and embedded multipliers makes it especially suitable for processing-intensive tasks in industrial automation, defense, and broadcast video. When designing with this device, pay attention to power-rail sequencing for the 1.2 V core and I/O banks, thermal management on the 35 x 35 mm BGA, and pin-compatible migration paths within the Stratix II family. Quartus II software is required for design entry, synthesis, place-and-route, and timing closure - legacy toolchain support is available via Intel FPGA support. This page consolidates distributor pricing, Stratix II drop-in alternatives in the same FBGA-672 footprint, and practical design notes not found in the manufacturer datasheet, giving engineers a faster selection path than raw distributor listings.
EP2S30F672I4N - Stratix II FPGA, 33.8K Logic Elements, 672-FBGA
The Altera (Intel) EP2S30F672I4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, with 500 general-purpose I/Os and 33,880 logic elements (LEs) fabricated on a 90 nm process node. It integrates 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded RAM, and DSP blocks for high-throughput arithmetic, with a core supply range of 1.15 V to 1.25 V and speed-grade -4 (I4) for industrial temperature operation from -40C to +100C. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. Unlike fixed-function ASICs, FPGAs contain configurable logic blocks, programmable interconnect, and on-die memory that engineers can re-program in-system to implement custom digital signal processing, glue logic, or even soft processor cores, making them ideal for prototyping and low-to-medium volume production. Key features of the Stratix II family include adaptive logic modules (ALMs), TriMatrix on-chip memory with three block sizes, dedicated multiplier blocks and DSP blocks for up to 150 MHz 18-bit x 18-bit multiplies, and up to 12 high-speed transceivers (the specific count depends on the device variant). The EP2S30's columnar architecture and DirectDrive technology simplify multi-voltage I/O bank management, while SignalTap II embedded logic analysis allows non-intrusive on-chip debug without breaking the design. Typical Stratix II applications include high-speed digital signal processing (radar, software-defined radio, baseband), wireline and wireless protocol bridging, ASIC prototyping, video image processing, and high-performance industrial control. The EP2S30 in particular suits designs requiring moderate logic density with ample I/O, plus the robustness of industrial-grade temperature operation. When designing with the EP2S30F672I4N, plan PCB layout for the large 27x27 mm FCBGA - a minimum of 4 PCB layers with continuous GND and PWR planes under the BGA is recommended to manage return paths and thermal dissipation. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.
EP2S30F672I5 - Stratix II FPGA, 33.8K LE, 672-BGA | Intel (Altera)
The Intel (formerly Altera) EP2S30F672I5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 33,880 logic elements, 1.36 Mbit of embedded RAM, and DSP blocks for high-performance signal processing. Fabricated on a 90 nm CMOS process, the device operates from a 1.2 V core supply and supports user I/O voltages up to 3.3 V, packaged in a 672-ball FineLine BGA (FC-FBGA) with a 1.00 mm ball pitch. According to multiple distributor listings, this industrial-grade variant supports up to 609.76 MHz internal operation with enhanced SERDES transceivers and rich memory resources. What is an FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic -> semiconductor -> integrated circuit, alongside CPLDs and structured ASICs. Stratix II FPGAs specifically target high-performance DSP, telecom, and parallel processing workloads where ASIC development cost is prohibitive. Key features include up to 500 user I/Os (492 outputs reported), embedded memory blocks totaling approximately 1.36 Mbits, 16 DSP blocks (each capable of 9-bit multiplications), four enhanced PLLs, and dedicated high-speed serial interfaces supporting multiple gigabit protocols. The Stratix II architecture introduces adaptive logic modules (ALMs) that pack 8 inputs into a single look-up-table-based slice, doubling effective logic density versus the original Stratix family. The device leverages a true 1.2 V 90 nm core with copper interconnect layers, reducing dynamic power by approximately 50% compared with the previous 130 nm Stratix generation. Internal signal integrity is enhanced through dedicated clock networks with skew matching across all four quadrants of the die. Designers benefit from Quartus II development suite support, including SOPC Builder for embedded processor subsystems and DSP Builder for algorithmic block synthesis. Typical applications include high-speed digital signal processing in wireless base stations, medical imaging front-ends, ASIC prototyping, high-end video and image processing pipelines, and telecom line-card packet processing. The 672-ball package provides sufficient I/O for multi-channel gigabit serializer/deserializer interfaces, while the rich DSP fabric accelerates FFT, FIR, and Viterbi decoding in real time. When designing with the EP2S30F672I5, ensure proper decoupling with low-ESR ceramic capacitors near each power pin and a 4-layer PCB with dedicated ground and power planes. The 1.00 mm ball pitch requires precise PCB manufacturing - non-solder mask defined (NSMD) pads with microvia-in-pad are recommended for reliable BGA assembly. Thermal management via the package's exposed thermal pad is essential when operating at full DSP throughput. This page consolidates distributor stock, lifecycle risk, and practical design considerations not found in the manufacturer datasheet alone, helping engineers validate sourcing, footprint reuse, and migration paths across the Stratix II family.
EP2S60F1020 - Stratix II FPGA, 60K LEs, 1020-BBGA | Altera
The Altera (Intel) EP2S60F1020 is a member of the Stratix II family of high-performance, 90 nm FPGAs, integrating 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory (M512 + M4K + M-RAM), and 36 DSP blocks in a 1020-ball flip-chip BGA package. The device uses Altera's adaptive logic module (ALM) architecture, replacing traditional 4-input LUTs with 8-input fracturable LUTs that improve logic packing density by roughly 25% over the prior Stratix generation. According to the manufacturer datasheet, the device supports up to 718 user I/O pins and is offered in commercial (C) and industrial (I) speed grades. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O behavior are defined post-fabrication via a configuration bitstream. FPGAs sit at the top of the programmable-logic taxonomy (above CPLDs) and below custom ASICs in NRE cost, making them the dominant platform for prototyping, low-volume production, and acceleration workloads that demand parallel processing. The Stratix II family in particular targets high-end digital signal processing, telecom backhaul, and high-speed serial I/O applications. Key features of the EP2S60F1020 include 12 transceiver channels (up to 3.125 Gbps each, in select package variants), dedicated hardware multipliers feeding 36 DSP blocks (144 18x18 multipliers), up to 12 PLLs (4 enhanced + 8 fast), and embedded TriMatrix memory comprising M512 (32x18 bit), M4K (128x36 bit), and M-RAM (4Kx144 bit) blocks. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional configuration encryption using the 128-bit AES bitstream encryption engine. The architecture emphasizes design flexibility through ALMs, where each ALM contains two adaptive LUTs plus dedicated adders and register chains, enabling efficient implementation of arithmetic pipelines, wide multiplexers, and state machines. Designers targeting DDR/DDR2 SDRAM interfaces benefit from dedicated DPA circuitry that aligns data strobes at 10 ps resolution. The 1020-ball BGA package uses flip-chip land-grid construction for low inductance power delivery to the core. Typical applications include high-speed DSP (radar, software-defined radio), telecommunications line cards (OC-48/STM-16 framer interfaces), high-end protocol bridging, and ASIC prototyping of mid-complexity SoCs. The wide memory aggregate suits image-processing datapaths where line buffers must be held on-chip. When designing with this part, pay particular attention to power estimation - the Stratix II family introduced the PowerPlay early power estimator tool which must be used before PCB commitment, because core current can exceed 3 A at full utilization. Thermal management of the BGA requires a minimum of eight ground balls in the center array and a 1.2 V core supply derived from a multi-phase buck controller with output accuracy better than +/-30 mV. This page synthesizes distributor inventory, Stratix II parametric positioning, and pin-compatible BGA alternatives that are not present in any single distributor listing - providing engineers with the consolidated replacement view needed for legacy board repair and redesign.