FPGA & CPLD
Products (6357)
EP2S15F672C3 - Stratix II FPGA 15K LE, 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S15F672C3 is a member of the Stratix II family of high-performance FPGAs, integrating 15,600 logic elements, 419,328 bits of embedded RAM, and 156 hardware DSP blocks in a 672-ball FineLine BGA package. The device is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, while supporting a maximum user I/O count of 366 across 12 I/O banks. A field-programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic resources, routing, and I/O cells can be programmed by the end user to implement custom digital functions, glue logic, DSP pipelines, or even complete processor subsystems. Stratix II devices sit in the hierarchy of programmable logic devices (PLD), and are designed for high-throughput parallel processing, high-speed serial connectivity, and large embedded memory footprints. Key features of the EP2S15F672C3 include 156 18-bit x 18-bit dedicated multipliers, twelve global clock networks, up to twelve phase-locked loops (PLLs), and 366 maximum user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates high-speed transceivers in higher-density Stratix II variants, though the EP2S15 in the 672-pin package focuses on parallel I/O density. Adaptive logic modules (ALMs) are used instead of 4-input LUTs to improve logic efficiency. The Stratix II architecture combines a TriMatrix memory hierarchy of three block RAM sizes (M512, M4K, M-RAM) to balance distributed and large memory needs, and supports the Nios II embedded soft processor for system-on-chip designs. The 90 nm process delivers maximum internal clock frequencies above 450 MHz, while the device is offered in commercial, industrial, and military temperature grades. Typical applications include high-speed digital signal processing in communications infrastructure, video and image processing pipelines, prototyping of ASIC designs, industrial automation controllers, and military/aerospace embedded systems. The large logic capacity also makes the EP2S15 suitable for protocol bridging and high-performance bus interface aggregation. When designing with this device, careful attention must be paid to power distribution network design because of the 1.2 V core current peaks, and to thermal management for hot-spot control in sealed enclosures. The 672-FBGA requires a multi-layer PCB with controlled-impedance traces and matched-length routing for LVDS pairs. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II family, and practical design notes that complement the manufacturer datasheet.
EP2S15F672C3N - Stratix II 15K LEs FPGA 672-BGA | Intel / Altera
The Intel (formerly Altera) EP2S15F672C3N is a Stratix II family Field Programmable Gate Array (FPGA) delivering 15,600 Logic Elements and 419,328 RAM bits in a 672-ball FineLine BGA (FBGA-672) package. It integrates 366 user I/Os and 780 Logic Array Blocks (LABs), with embedded DSP blocks, M512/M4K/M-RAM memory blocks, and high-speed differential I/O support optimized for signal-processing and protocol-bridging designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that engineers configure after manufacture using a hardware description language (HDL) such as Verilog or VHDL. FPGAs sit in the broader semiconductor hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital IC -> semiconductor. The Stratix II family introduced an adaptive logic module (ALM) architecture that improved logic efficiency over prior generations, while retaining Stratix I/O and transceiver characteristics. The "F672" suffix indicates the FBGA-672 fine-pitch BGA package, "C3" indicates the commercial -3 speed grade, and the "N" suffix denotes lead-free / Pb-free termination. Key features of the EP2S15F672C3N include 15,600 LEs, 419,328 total RAM bits, 48 embedded 18x18 multipliers (DSP blocks), up to 6 PLLs, 16 global clock networks, and 366 maximum user I/Os. The device supports LVDS, LVPECL, SSTL, HSTL, and PCI/PCI-X I/O standards, and integrates dedicated DDR/DDR2 SDRAM memory interfaces with on-chip termination. Architectural blocks include 780 LABs (each built from 10 ALMs), M512 (32x18 bit), M4K (128x36 bit), and M-RAM (4 Kbit) memory blocks. Typical applications include high-speed digital signal processing (DSP), telecom baseband processing, video and image processing pipelines, ASIC prototyping, and high-speed serial protocol bridging (e.g., SPI4.2, SFI-4, RapidIO). Its 672-BGA footprint suits board designs that route dense differential-pair channels to external memory and backplane connectors. When designing with the EP2S15F672C3N, ensure proper decoupling with 100 nF and 10 Β΅F capacitors near each power pin and follow Altera's Stratix II PCB layout guidelines for BGA breakout. The -3 speed grade is the slowest commercial grade; -4 and -5 grades offer higher Fmax at increased cost. Configure the device with Quartus II (legacy) or Quartus Prime (current Intel FPGA toolchain). The EP2S15F672C3N is widely available on the secondary market because Stratix II is in its mature end-of-life (EOL) phase. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers plan a refresh path to Cyclone IV/V or MAX 10 devices for new designs.
EP2S15F672C4 - Stratix II FPGA, 15K LEs, 672-BGA | Intel / Altera
The Intel / Altera EP2S15F672C4 is a member of the Stratix II family of FPGAs, featuring 15,600 logic elements housed in a 672-ball FineLine BGA package with 366 user I/Os. It is built on a 90nm process technology and integrates up to 419,328 bits of embedded memory, making it suitable for high-density digital logic designs in telecommunications, signal processing, and embedded control applications. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, configurable interconnects, and dedicated I/O pads. Designers can configure these resources after manufacturing to implement custom digital functions, ranging from simple glue logic to complex System-on-Chip (SoC) designs. FPGAs sit at the top of the programmable logic hierarchy and are widely used for parallel processing, hardware acceleration, and prototyping before ASIC tape-out. Within the Stratix II family, the EP2S15 sits at the lower end of the density range, offering a balance of logic capacity, memory, and DSP blocks for mid-complexity designs. Key features of the EP2S15F672C4 include 15,600 logic elements (LEs), 419,328 bits of embedded RAM (organized into TriMatrix memory blocks), up to 156 DSP blocks (for fixed- and floating-point signal processing), and 6 PLLs for clock management. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with the FineLine BGA package enabling high pin count and signal density on multilayer PCBs. The Stratix II architecture uses adaptive logic modules (ALMs) that pack 8 inputs into each module, providing higher effective logic utilization than the 4-input LUT structure used in the original Stratix family. Combined with dedicated routing, on-chip memory, and DSP blocks, this architecture delivers high performance at clock rates suitable for parallel DSP pipelines and high-throughput data-path designs. Typical applications of the EP2S15F672C4 include communications infrastructure (protocol bridging, SERDES aggregation), test and measurement instrumentation, industrial motor control, video processing, and high-performance ASIC prototyping. Designers can implement PCI Express, Gigabit Ethernet, DDR memory controllers, and custom DSP pipelines using the embedded transceivers, multipliers, and I/O resources. When designing with this device, attention must be paid to BGA fan-out and routing density, as well as power plane design for the multiple internal voltage rails (core, I/O, PLL auxiliary). The 672-ball FineLine BGA package requires multi-layer PCB fabrication with via-in-pad or dog-bone fanout patterns to escape all signals without requiring additional PCB area. This page synthesizes distributor pricing, drop-in Stratix II family alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2S15F672C4N - Stratix II FPGA 15K LEs, 672-BGA | Intel (Altera)
The Intel (formerly Altera) EP2S15F672C4N is a member of the Stratix II family of high-performance field-programmable gate arrays (FPGAs), offering 15,600 logic elements and 419,328 bits of embedded RAM in a 672-ball fine-pitch BGA package. It is specified at -40C to +85C industrial temperature range and features a 1.2V core supply for low-power, high-density programmable logic. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers can configure after manufacturing. FPGAs sit between custom ASICs and fixed-function ICs in the design hierarchy: PLD -> CPLD -> FPGA -> ASIC, and are widely used for digital signal processing, glue logic, high-speed interfacing, and prototyping. The Stratix II family specifically targets high-performance applications with embedded multipliers, DSP blocks, and high-speed transceivers. Key features include 15,600 logic elements (LEs), 419,328 RAM bits (approximately 52 KB), 156 embedded multipliers, dedicated DSP blocks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 672-BGA package provides high I/O density for complex system designs requiring many parallel interfaces. The EP2S15F672C4N is fabricated in a 90 nm CMOS process with a 1.2V core voltage, and supports configuration via JTAG, passive serial, or active serial modes. The architecture is built around the Adaptive Logic Module (ALM), which improves logic utilization efficiency compared to traditional 4-input LUT architectures. Typical applications include high-speed digital signal processing, telecommunications infrastructure, video and image processing, military/aerospace systems, ASIC prototyping, and high-bandwidth data acquisition. The high logic density and embedded multipliers make it particularly suited for DSP-intensive designs such as FFT engines and video codecs. When designing with this part, pay careful attention to power sequencing: the 1.2V core supply must ramp before I/O voltages to avoid latch-up. Use the Quartus II design software (legacy) or the modern Intel Quartus Prime with Stratix II device support for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing across 16+ sources, parametric drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate this legacy Stratix II part for new designs or long-term support scenarios.
EP2S15F672C5 - Stratix II FPGA, 15.6K LEs, 672-BGA | Intel
The Intel EP2S15F672C5 is a Stratix II family Field Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA package, integrating 15,600 logic elements, 419,328 memory bits, and 6,240 CLBs into a high-performance programmable fabric with 366 user I/O pins. Manufactured on a 90 nm CMOS process and operating at up to 640 MHz internal frequency, the device supports the commercial temperature grade and targets bandwidth-intensive applications such as telecommunications line cards, DSP co-processing, and high-speed serial protocol bridging. The F672 suffix designates a 27 mm x 27 mm, 1 mm pitch BGA outline that has become the canonical footprint for mid-density Stratix II designs. This part carries a -5 speed grade (mid-tier), making it a balanced choice for designers who need faster timing closure than -6/-7 grades without the cost of -3/-4 speed bins. What is an FPGA? A Field Programmable Gate Array is a programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and transceivers. FPGAs occupy the position of programmable ASICs in the digital design hierarchy: below fixed-function ASICs in cost-per-unit but above microcontrollers in raw parallel processing capability. The Stratix II family specifically introduced adaptive logic modules (ALMs) that improve logic utilization versus prior Stratix generations, and built-in transceivers and TriMatrix memory make the family suitable for signal-processing and data-path intensive systems. Key features of the EP2S15F672C5 include 15,600 logic elements organized into ALMs, 419,328 bits of embedded memory, embedded DSP blocks for fixed- and floating-point math, dedicated clock management PLL resources, and 366 user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The FPGA also supports configuration via passive serial, fast passive parallel, and JTAG modes. Typical applications include high-speed packet processing, telecom framer/mapper ASIC prototyping, DSP co-processing for radar and software defined radio, video processing pipelines, and ASIC prototyping for mid-complexity SoCs. The 672-BGA package supports moderate-density pin-count routing and is compatible with mainstream PCB fabrication tolerances. When designing with the EP2S15F672C5, plan power sequencing for VCCINT, VCCIO banks, and auxiliary supplies carefully. Use IBIS models for signal-integrity simulation on LVDS links. The -5 speed grade timing margins should be validated against your slowest logic path with the Quartus Prime TimeQuest analyzer before tape-out. This page synthesizes distributor pricing, drop-in equivalents within the Stratix II family, and design guidance not collated in any single manufacturer document. Cross-reference data, AEC-Q100 automotive options, and packaging details are sourced from DigiKey, Mouser, and Intel/Altera legacy datasheets.
EP2S15F672C5N - Stratix II FPGA, 15.6K LEs, 672-BGA | Intel
The Intel (Altera) EP2S15F672C5N is a Stratix II family Field Programmable Gate Array (FPGA) IC integrating 419,328 bits of embedded memory and 15,600 logic elements across 780 Logic Array Blocks (LABs), housed in a 672-ball FineLine BGA (FBGA-672) package measuring 35 x 35 mm with 1 mm pitch. It provides 366 user I/O pins and is built on a 1.2V core CMOS process optimized for high-density, high-performance digital logic. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells, allowing hardware engineers to implement custom digital logic that is re-programmable in the field. FPGAs occupy the tier between general-purpose CPUs/ASICs and small CPLDs: they deliver ASIC-class parallelism and throughput with software-grade design flexibility, making them foundational in communication, computing, and signal-processing systems. Key features include 6240 Configurable Logic Blocks (CLBs), up to 640 MHz internal operation, dedicated DSP blocks, embedded memory blocks (M512/M4K/M-RAM tiers), up to 12 transceivers depending on variant, and a MultiTrack interconnect architecture. The -C5 speed grade designates a commercial temperature range (0C to +85C) and the mid-speed timing bin, balancing Fmax against power consumption. The 'N' suffix indicates lead-free / Pb-free termination. Typical applications include high-speed serial I/O expansion, digital signal processing pipelines, protocol bridging, radar and baseband processing, telecom line cards, video and image processing engines, and ASIC prototyping. The Stratix II architecture is widely used in designs requiring embedded transceivers and DSP throughput unavailable in lower-density FPGAs. When designing with the EP2S15F672C5N, verify that the FBGA-672 land pattern, JTAG chain, and configuration scheme (passive serial, fast passive parallel, or JTAG) match your PCB. Decoupling follows Altera's Stratix II Power Distribution Network (PDN) guidelines with multiple bulk and decoupling capacitor values. Note that the Stratix II family is mature and Intel has since migrated designs to Stratix III/IV/V/10 series β verify long-term availability before starting new production designs. This page synthesizes drop-in alternatives (same FBGA-672 footprint, identical 15,600-LE / 366-IO resource profile) and engineering design notes not found in the original manufacturer datasheet, helping engineers evaluate replacement risk and supply continuity.
EP2S15F672I4 - 15K LEs Stratix II FPGA 672-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S15F672I4 is a Stratix II family Field Programmable Gate Array (FPGA) with 15,600 logic elements, 419,328 bits of embedded memory, 156 embedded 18x18 multipliers, and 366 user I/Os, housed in a 672-ball FineLine BGA (FBGA) package with industrial temperature grade (-40C to +100C). It is fabricated on a 90 nm process and targets high-performance digital signal processing, telecommunications, and embedded compute applications. A Field-Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (LABs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader hierarchy of programmable logic devices -> ASIC prototyping platforms -> digital semiconductor ICs. Stratix II FPGAs sit in the high-performance tier of the Altera/Intel portfolio, integrating hard DSP blocks, transceivers, and large on-chip RAM for compute-intensive designs. Key features of the EP2S15F672I4 include up to 6.3 Gbps embedded transceivers on certain Stratix II variants, dedicated 18x18 multipliers totaling 156 DSP blocks, TriMatrix embedded memory architecture supporting true dual-port and FIFO operation, and support for external DDR/DDR2/QDR memory interfaces via dedicated PHY blocks. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG, with built-in error detection/correction on configuration RAM. The Stratix II architecture separates the routing switch into a heterogeneous multi-tier network with dedicated paths between LABs, M512/M4K/M-RAM blocks, and DSP blocks. This reduces critical-path delay and improves timing closure compared to earlier Stratix generations. The 672-FBGA package exposes 366 user I/Os, which is the maximum for this die size in the Stratix II family. Typical applications include high-throughput DSP pipelines (radar, beamforming, video codec acceleration), wire-speed packet processing in networking line cards, ASIC prototyping, military/aerospace signal processing, and industrial machine-vision controllers. The combination of 156 multipliers and 419 Kbits of block RAM enables high FIR/FFT throughput without external memory bottlenecks. Design consideration: Stratix II devices require a 1.2 V core supply plus multiple I/O bank supplies (1.5 V, 1.8 V, 2.5 V, 3.3 V selectable per bank). Power estimation should use the Quartus II PowerPlay Early Power Estimator before PCB layout, since the 672-FBGA has limited heat dissipation and high-density Stratix II designs typically require forced-air cooling or a thermal management plan. This page synthesizes real-time distributor pricing, drop-in same-package alternatives, and engineering design notes not found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference for the part.
EP2S15F672I4N - 15.6K LEs Stratix II FPGA, 366 I/O, 672-FBGA
The Intel (formerly Altera) EP2S15F672I4N is a member of the Stratix II family of FPGAs, built on a 90 nm process and offering 15,600 logic elements in a 672-ball FineLine BGA package with 366 user I/O. The 'I' suffix denotes the industrial temperature grade (-40C to +100C TJ) and the '4' speed grade targets the mid-performance tier, with internal logic operating up to approximately 711 MHz per FPGakey. The 'N' indicates lead-free, RoHS-compliant assembly, suitable for modern reflow profiles. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the apex of programmable logic, below ASICs (which require masks) and above CPLDs (which are smaller, non-volatile, and lower-density). The Stratix II family uses an adaptive logic module (ALM) architecture that delivers higher logic efficiency than the preceding Stratix/LUT-4 generations, while the dedicated DSP blocks, TriMatrix memory, and high-speed I/O make these devices common in signal processing, communications, and embedded compute. Key parametric features of the EP2S15 include 15,600 LEs, 15600 logic cells, 419,328 bits of embedded memory, 156 DSP blocks, and 12 PLLs supporting multi-rate clock generation. I/O count is 366 across the 672-ball FCBGA (also referenced as 672-FBGA, 27x27 mm). The device supports a wide variety of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X through per-bank reference voltages. Configuration is typically via JTAG or an external configuration device. Typical applications include industrial control, telecom line cards, video and image processing, software-defined radio, test and measurement, and embedded DSP. The EP2S15 is also frequently deployed in legacy designs that began life on Stratix II and must remain in production for long life-cycle programs. The industrial temperature grade makes it well suited to factory floor, outdoor telecom, and rail/military-adjacent embedded systems. When designing with the EP2S15, plan power sequencing carefully - Stratix II requires ramped VCCINT and VCCIO supplies, and decoupling must follow the reference design with multiple low-ESR ceramic capacitors around the perimeter. PCB layout must preserve impedance-controlled pairs for LVDS and external memory interfaces.
EP2S180F1020C3 - Stratix II 180K LEs FPGA, 1020-BGA | Intel
The Intel (formerly Altera) EP2S180F1020C3 is a high-density Stratix II Field Programmable Gate Array (FPGA) IC built on a 1.2 V, 90 nm, all-layer copper SRAM process, delivering approximately 179,400 equivalent logic elements (LEs), 9,383,040 RAM bits, and 742 user I/Os in a 1020-ball flip-chip BGA package. It belongs to the EP2S180 device class, the largest density member of the Stratix II family, and is positioned for performance-critical digital signal processing, communications infrastructure, and high-throughput parallel processing designs. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. Unlike fixed-function ASICs, FPGAs can be re-programmed in the field via a hardware description language (HDL) such as VHDL or Verilog, making them ideal for prototyping, low-volume production, and designs that require late-stage or in-system logic changes. The Stratix II family sits within Intel's broader programmable logic hierarchy: FPGA -> Programmable Logic -> Logic Device -> Semiconductor, and is widely used in telecom, defense, and high-performance computing applications. Key features of the EP2S180F1020C3 include approximately 8,970 LABs (Logic Array Blocks), 9 Mbit of embedded TriMatrix memory, dedicated DSP blocks for high-speed multiplication, and up to 742 user I/Os. The device supports multiple high-speed I/O standards including LVDS, LVPECL, SSTL, and HSTL, enabling interface to DDR/DDR2 memory, LVDS links, and backplane transceivers. The C3 speed grade and commercial temperature rating make it suitable for cost-optimized, lab-grade, and indoor equipment designs rather than automotive or extended-industrial environments. The architecture uses Adaptive Logic Modules (ALMs) - each ALM contains a combination look-up table (LUT), two programmable registers, and dedicated adder circuitry, providing approximately 180,000 equivalent LEs while consuming roughly 40% less area and power than the original Stratix architecture. The device integrates dedicated DSP blocks capable of operating at hundreds of MHz and supports high-speed external memory interfaces including DDR2 SDRAM, QDRII SRAM, and RLDRAM II. The 1020-pin BGA package exposes extensive parallel I/O for memory, chip-to-chip interconnect, and parallel sensor or data acquisition buses. Typical applications include high-performance DSP (radar, software-defined radio, baseband processing), telecommunications line cards and switches, ASIC prototyping and emulation, high-speed data acquisition systems, and parallel compute accelerators. When designing with this device, designers should use the Quartus II (now Quartus Prime) development toolchain for synthesis, place-and-route, and timing closure. Designers should also evaluate thermal dissipation carefully: at full utilization the EP2S180 can dissipate tens of watts, and the flip-chip BGA requires a properly designed PCB stack-up with adequate thermal vias and copper area to keep junction temperature within specification. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet. Where parameters were not directly listed in the source search results, [DATA_NEEDED] markers are used to avoid fabrication; engineers should consult the official Stratix II datasheet and the device handbook for definitive electrical characteristics.
EP2S180F1020C3N - Stratix II FPGA, 179400 LEs, 1020-FBGA | Intel
The Intel (formerly Altera) EP2S180F1020C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) delivering 179,400 equivalent logic elements, 9383040 bits of embedded RAM, and 742 user I/Os, all integrated in a 1020-ball FineLine BGA (FBGA) package measuring 33 x 33 mm. It belongs to the EP2S180 speed grade -3 (slower) tier with a commercial 0 C to +85 C junction temperature range, and is supplied by a 1.15 V to 1.25 V core voltage. An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture is built from a matrix of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, phase-locked loops, and high-speed transceivers, all connected through a programmable routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> FPGAs -> high-performance FPGAs. They differ from ASICs by being re-programmable in the field, and from microcontrollers by implementing logic in hardware, achieving deterministic, parallel throughput at clock rates of hundreds of MHz. The Stratix II family was introduced in 2004 as the first FPGA family to use an adaptive logic module (ALM) architecture instead of the older 4-input LUT. Key features of the EP2S180F1020C3N include 8,970 LABs (logic array blocks), 9383040 bits of total RAM (approximately 1.1 MB), 96 DSP blocks for hardware-accelerated arithmetic, up to 12 PLLs (phase-locked loops) for clock management, and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device also supports source-synchronous interfaces up to 1 Gbps via LVDS, and 4 phase-shift clock networks for fine-grained timing control. The high logic density makes it suitable for prototyping ASIC designs and large DSP pipelines. Typical applications for the EP2S180F1020C3N include high-performance digital signal processing (DSP), telecom baseband processing, ASIC prototyping, image and video processing pipelines, high-speed networking equipment, and military/aerospace signal processing. The 742 user I/Os and high RAM-to-logic ratio also make it attractive for memory-intensive test and measurement equipment where parallel data acquisition must be buffered in real time. When designing with this device, careful attention must be paid to power integrity because the 1020-ball FBGA package and high logic utilization can draw significant current. Designers should follow Altera's Stratix II PowerPlay Early Power Estimator (EPE) guidelines for thermal management. Pin assignment and PCB layout should also follow the Stratix II pin connection guidelines for unused I/Os and clock resources. This page synthesizes current distributor pricing, Stratix II drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet.
EP2S180F1020C3TT - Stratix II 180K LEs FPGA, 742 I/O, 1020-BBGA | Intel
The Intel (formerly Altera) EP2S180F1020C3TT is a high-density Stratix II family Field Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package. The device integrates 179,400 equivalent logic elements (LEs), 9,383,040 total memory bits, and 742 user I/O pins, making it one of the largest members of the Stratix II generation. It is a logic-intensive platform targeting high-bandwidth signal processing, telecom, and ASIC-prototyping designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all wired by SRAM-based configuration memory. FPGAs sit at the same level of the digital-IC hierarchy as ASICs but trade raw unit cost for design-time flexibility, in-system reprogrammability, and faster time-to-market. Stratix II extends this concept with a unique adaptive logic module (ALM) architecture that improves logic packing density versus prior Stratix generations. Key features of the EP2S180F1020C3TT include 742 user I/O supporting a wide range of single-ended and differential I/O standards, dedicated on-chip memory, and DSP blocks for high-throughput arithmetic. The device supports up to 12 embedded transceivers in the Stratix II family (per-family maximum; this specific variant configuration applies to the device's transceiver count) and rich clock management with multiple PLLs. It is built on a 90 nm process and is offered in industrial temperature grades, which is essential for communications infrastructure and test equipment. Architecturally, the Stratix II ALM combines an 8-input fracturable look-up table with dedicated adders, registers, and carry chains. This adaptive logic module allows a single ALM to implement either a 7-input function plus a 4-input function or a 6-input LUT feeding two independent arithmetic paths. The result is higher effective logic utilization when designs contain wide muxes and arithmetic datapaths typical of DSP pipelines. Typical applications include high-end ASIC prototyping, software-defined radio (SDR) baseband processing, telecom line-card packet processing, high-resolution video broadcast equipment, and high-performance industrial imaging. Designers pair the device with external DDR/DDR2/QDR SRAM memory controllers and high-speed serializer/deserializer links for full system integration. When designing with this device, ensure adequate power-supply decoupling close to each BGA quadrant, follow Altera/Intel Stratix II PCB layout guidelines for high-speed differential pairs, and use the Quartus II design toolchain for synthesis, place-and-route, and timing closure. Because the part is in the Stratix II family, designers should also consider newer Stratix III/IV/Cyclone families for new designs but treat the EP2S180 as a long-life-cycle legacy platform. This page synthesizes distributor stock, package-level pinout, drop-in same-family alternatives, and practical Stratix II design notes not found in the standalone manufacturer datasheet, giving engineers a one-stop view for sourcing, replacement, and PCB-layout decisions.
EP2S180F1020C4 - Stratix II FPGA, 179K LE, 1020-BGA | Intel
The Intel (Altera) EP2S180F1020C4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) from the second-generation Stratix family, fabricated on a 90nm process with 1.2V core supply. It integrates 179,400 equivalent logic elements (LEs), 9,383,040 bits of on-chip RAM (approximately 1.16 Mbyte), 768 18x18-bit hardware multipliers, and 12 transceiver-like PLLs across 8970 LABs, packaged in a 1020-ball FineLine BGA (FBGA) measuring 33x33mm. The device is built around the adaptive logic module (ALM) architecture that replaced classic 4-input LUTs, delivering finer-grained logic packing and improved DSP utilization. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that can be configured after manufacturing to implement arbitrary digital functions. Within the broader taxonomy, FPGAs sit alongside CPLDs as the two main families of programmable logic devices (PLDs), above fixed-function ASICs in flexibility but below microcontrollers in software-defined control. Modern high-end FPGAs like the Stratix II family integrate hard IP blocks such as transceivers, memory controllers, and DSP multipliers, bridging the gap between traditional FPGA and structured ASIC platforms. This positions the EP2S180F1020C4 as a true system-on-chip (SoC) programmable platform rather than a simple glue-logic device. Key specifications include 742 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), and dedicated DDR/DDR2 memory interface support up to 300 MHz through the Stratix II PHY. The 1020-BGA package provides 12.5 Gbps aggregate I/O bandwidth suitable for high-speed parallel interfaces, while 768 18x18 multipliers enable real-time DSP workloads such as video processing, software-defined radio, and baseband modulation. Typical applications span high-end communications infrastructure (10 Gbps line cards, base station baseband), ASIC prototyping and emulation, high-performance DSP pipelines (radar, video codec, medical imaging), and industrial test & measurement backplanes. The 90nm Stratix II architecture was a landmark design win for Altera in the 2004-2008 era and remains in long-lifecycle defense, aerospace, and industrial systems. When designing with this device, observe the Stratix II power-on reset and configuration sequence carefully; an incorrect MSEL or nCONFIG state can prevent successful joint Test Action Group (JTAG) or Passive Serial (PS) configuration. Thermal management is critical because the 33x33mm BGA package dissipates 15-25W under full DSP utilization. Use the Quartus II design software (version 9.1 or earlier for full Stratix II support) and verify pin assignments against the 1020-ball BGA pinout file. This page synthesizes distributor pricing, drop-in same-package alternatives (EP2S180F1020C4N, EP2S180F1020C3, EP2S130F1020C4), and design notes that go beyond what is presented on the Alldatasheet or Octopart listings.
EP2S180F1020C4N - 180K LE Stratix II FPGA | 1020-FBGA | Intel / Altera
The Intel (formerly Altera) EP2S180F1020C4N is a high-density Stratix II family Field Programmable Gate Array (FPGA) delivering 179,400 logic elements, 8,970 LABs, and 9,383,040 bits of embedded RAM in a 1020-ball FineLine BGA package. The device is fabricated on a 90 nm process, operates from a 1.15 V to 1.25 V core supply, and supports up to 742 user I/Os with 18 high-speed transceivers capable of 711.24 MHz operation. It includes dedicated DSP blocks, TriMatrix memory, and a robust configuration infrastructure engineered for high-performance digital signal processing and ASIC prototyping. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines the flexibility of software-configurable logic with the performance of application-specific hardware. FPGAs occupy a tier above generic logic ICs (74-series glue logic, programmable logic devices) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy (PLD -> CPLD -> FPGA -> ASIC -> structured ASIC). Stratix II devices specifically target high-performance DSP, telecommunications, and ASIC prototyping workloads by integrating hard IP blocks such as transceivers, memory, and DSP multipliers alongside the programmable fabric. Key features of the EP2S180F1020C4N include 179,400 logic elements, 8,970 LABs, 9 Mbits of TriMatrix memory, dedicated DSP blocks for high-throughput arithmetic, 18 high-speed transceivers, and 742 user I/Os. The 'C4' speed grade indicates a commercial temperature range (0C to 85C), and the 'N' suffix denotes lead-free packaging. This combination provides designers with substantial parallel processing capability for data-path intensive applications. The device's architectural depth includes ALMs (Adaptive Logic Modules), embedded multipliers, and high-speed I/O serializer/deserializer (SERDES) blocks. Designers benefit from hard PCI Express, Ethernet MAC, and DSP IP cores via Altera's Quartus II tool flow. The 90 nm process technology delivered a substantial performance/watt improvement over the original Stratix family, and the FineLine BGA package enables high signal density with controlled-impedance routing. Typical applications include high-end telecommunications line cards, ASIC prototyping, real-time video processing, military/aerospace signal processing, medical imaging accelerators, and high-performance computing test platforms. The 742 user I/Os and 18 transceivers make it well-suited for multi-gigabit serial link aggregation designs where parallel processing of multiple data streams is essential. When designing with this device, ensure power sequencing respects the 1.15 V to 1.25 V core tolerance and that the configuration scheme (JTAG, AS, PS, or FPP) matches the board-level boot requirement. Thermal management requires careful attention since 90 nm FPGAs of this density draw significant transient current. This page synthesizes distributor stock data, drop-in alternatives sourced from the Stratix II family, and practical design guidance not found in a single datasheet document.
EP2S180F1020C5 - Stratix II FPGA, 179400 LEs, 1020-BGA | Intel
The Intel (formerly Altera) EP2S180F1020C5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) housed in a 1020-ball FineLine BGA package measuring 33 x 33 mm with 1.0 mm ball pitch. The device integrates 179,400 equivalent logic elements, 71,760 CLBs (configurable logic blocks) organized as 8,970 LABs, 9,383,040 bits of embedded RAM, and 742 user I/O pins, targeting the highest-performance ASIC-prototyping and signal-processing designs of its generation. A Stratix II FPGA is a programmable logic device fabricated in a 90 nm CMOS process with a copper-interconnect metal stack and dedicated hardware blocks for memory (M512/M4K/M-RAM), DSP (up to 384 18x18 multipliers), and high-speed serial transceivers. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which sit alongside ASICs, ASSPs, and microcontrollers in the digital semiconductor hierarchy. Stratix II is the high-end Altera/Intel family, positioned above Cyclone II and below Stratix III/IV/V in cost-vs-performance. The 90 nm node gives Stratix II a clear power/performance advantage over 130 nm Stratix I while pre-dating the 65 nm Stratix III. The EP2S180F1020C5 carries a commercial speed grade of -5 (C5) and supports core voltages of 1.15 V to 1.25 V with separate VCCIO banked I/O supplies. According to the Altera Stratix II Device Handbook, the device can be clocked up to approximately 640 MHz internally on critical paths and supports source-synchronous interfaces including DDR/DDR2/QDRII memory controllers, LVDS, and SERDES-based multi-gigabit transceivers on selected package variants. Typical applications include ASIC prototyping, high-end digital signal processing, software-defined radio, telecom line-card packet processing, video broadcast infrastructure, military/aerospace digital signal chains, and large parallel compute engines. Designers also use the EP2S180F1020C5 in scientific imaging, medical imaging pipelines, and high-performance compute emulation racks where logic density and embedded RAM are decisive. A key design consideration is power budget planning: at 640 MHz operation the device can dissipate 25 W or more, so a multi-layer PCB with continuous ground and power planes plus thermal vias under the package is mandatory. Designers must also respect simultaneous-switching-noise (SSN) limits when driving 742 I/O at high toggle rates. Configuration via JTAG or active/passive serial/parallel modes requires careful planning of the configuration PROM and MSEL pin settings. This page synthesizes distributor pricing, drop-in alternates, and practical design notes not found in the standalone manufacturer datasheet, helping engineers select between commercial-grade, industrial-grade, and higher speed-grade variants of the EP2S180 family without cross-referencing multiple PDF documents.
EP2S180F1020C5N - Stratix II 179400-Cell FPGA 1020-FBGA | Intel
The Intel (formerly Altera) EP2S180F1020C5N is a high-density Stratix II family field-programmable gate array (FPGA) with 179400 logic elements (LEs), 9383040 bits of embedded RAM, 742 user I/O pins, and 8970 LABs, packaged in a 1020-ball flip-chip BGA (FC-FBGA, 33x33 mm). Built on a 90 nm process with a 1.2 V core, it delivers up to 609.76 MHz internal operation and integrates dedicated DSP blocks, high-speed transceivers (not present in this specific device), and TriMatrix memory for high-bandwidth data-paths. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and embedded memory and DSP resources, belonging to the broader category of programmable logic devices (PLDs) within the digital integrated-circuit taxonomy: PLD -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA. Stratix II positioned Intel/Altera in the high-performance ASIC-prototyping, signal-processing, and telecommunications-equipment segments of the FPGA market. Key features include 179400 logic elements, 9383040 total RAM bits, dedicated 18-bit x 18-bit multipliers and DSP blocks, eight phase-locked loops (PLLs), support for external memory interfaces such as DDR, DDR2, SDRAM, QDRII SRAM, and RLDRAM II, and 742 user I/O supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X. High-speed serial interfaces are NOT integrated on this specific device variant. Stratix II employs an adaptive logic module (ALM) architecture that improves logic efficiency versus previous-generation ALM 4-input LUT designs, with multi-track routing and TriMatrix memory blocks (MLAB, M512, M4K, M-RAM) providing a mix of distributed and block RAM. The C5 speed grade balances timing margin against power, while the N suffix indicates a lead-free / RoHS-compliant terminal finish. Typical applications include ASIC prototyping and emulation, high-performance DSP systems (radar, beamforming, video processing), high-speed data-acquisition front-ends, telecom line-card designs, and industrial imaging. Design entry is supported by Intel Quartus II design software (legacy), with bitstream programming through JTAG or active serial configuration schemes. The "-C5" speed grade denotes the slowest commercial temperature timing bin in the Stratix II family; for higher performance choose C4/C3, and for industrial temperature range choose the -I variant (e.g., EP2S180F1020I4). The 1020-FBGA 33x33 mm footprint requires a 1.27 mm or 1.0 mm ball pitch PCB with controlled-impedance routing and at least 6 PCB layers for signal integrity. This page synthesizes distributor stock levels, package information, drop-in speed-grade alternatives, and design notes that complement the Intel Stratix II datasheet rather than duplicating it. Where a parameter is not directly listed in the verified sources, a [DATA_NEEDED] marker is used instead of an estimated value.
EP2S180F1020I4 - Stratix II 179K LE FPGA, 1020-BGA | Intel
The Intel (formerly Altera) EP2S180F1020I4 is a high-density Stratix II family Field Programmable Gate Array in a 1020-ball FineLine BGA package, delivering 179,400 logic elements, 8,979,840 bits of embedded RAM, 742 user I/O pins, and 8,970 LABs/CLBs. It is fabricated on a 90 nm CMOS process with a 1.2 V core supply and supports up to 711.24 MHz internal operation. The industrial temperature grade (-40C to +100C) version suffix "I4" places this part in the -40C to +100C ambient operating envelope with the standard speed grade 4. What is an FPGA? A Field Programmable Gate Array is a class of programmable logic device that allows designers to configure digital logic functions after manufacture. FPGAs sit in the hierarchy: programmable logic -> logic device -> semiconductor IC -> integrated circuit. The Stratix II family from Intel/Altera is positioned for high-performance ASIC prototyping, signal processing, and high-bandwidth I/O bridging, combining embedded transceivers, DSP blocks, and large on-chip memory into a single die. Key features include 12 embedded DSP blocks for high-throughput multiply-accumulate operations, support for multiple I/O standards including LVDS, HSTL, SSTL, and LVCMOS, dedicated external memory interfaces to DDR/DDR2/QDRII SRAM, and 8 phase-locked loops (PLLs) for clock management. The 1020-ball FC-FBGA package exposes nearly the full I/O complement of the die and provides a robust thermal path for high-utilization designs. The EP2S180 uses an adaptive logic module (ALM) architecture that improves logic packing density over the prior Stratix generation. Combined with the 1.2 V core and 90 nm process, the device achieves a favorable performance-per-watt ratio for its class. Row- and column-based I/O banks allow fine-grained voltage reference and impedance control per interface. Typical applications include ASIC prototyping, high-speed data acquisition cards, telecom baseband processing, software-defined radio (SDR), video broadcast and image processing pipelines, and high-end test & measurement instrumentation. The large logic capacity and embedded memory also suit routing/switching fabrics and PCI Express endpoint designs using the Stratix II hard IP. When designing with this device, plan power sequencing for the 1.2 V core (VCCINT), 1.2 V analog (VCCA), and per-bank VCCIO supplies, and budget sufficient PCB copper or forced airflow to dissipate the 25-30 W typical device power at full utilization. This page synthesizes distributor pricing, Stratix II family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. This page combines distributor pricing for the EP2S180F1020I4, drop-in Stratix II family alternatives (same 1020-FBGA footprint, pin-compatible logic capacity), and practical design notes covering power sequencing, thermal management, and configuration scheme selection not present in the bare manufacturer datasheet.
EP2S180F1020I4N - 180K LEs Stratix II FPGA, 742 I/O, FBGA-1020 | Intel
The Intel (formerly Altera) EP2S180F1020I4N is a high-density Stratix II family Field-Programmable Gate Array delivering 179,400 equivalent logic elements, 8,970 CLBs, and 9,383,040 RAM bits in a 1,020-ball FineLine BGA package (33 x 33 mm, 1.0 mm pitch). Built on a 90 nm CMOS process, the part is rated for the industrial temperature range (-40C to +100C) per the 'I' suffix and ships as a lead-free, RoHS-compliant device. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic IC whose function is defined by a user-supplied bitstream rather than fixed at the fab. It sits within the digital-semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Modern FPGAs integrate hard IP blocks such as transceivers, DSP blocks, embedded memory, and PLL/clock networks, which is why an FPGA like the EP2S180F1020I4N can replace multiple discrete logic, memory, and interface chips in a high-performance design. Key features of the EP2S180F1020I4N include 742 user I/O pins, a 1.2 V core supply typical of the Stratix II family, and 8,970 Configurable Logic Blocks (CLBs) arranged in the Stratix II Adaptive Logic Module (ALM) architecture that yields higher effective logic density than older 4-LUT designs. The 1,020-ball FBGA package exposes 742 usable I/O with the remainder dedicated to power, ground, and configuration pins, and supports high-speed LVDS, DDR, and source-synchronous interfaces typical of Stratix II designs. Architecturally, the Stratix II family introduces the ALM, which combines adaptive carry chains, distributed LUT RAM, and dedicated register files to deliver up to 2.5x the logic capacity per area versus prior Stratix devices. The EP2S180F1020I4N also includes dedicated DSP blocks for fixed- and floating-point math, on-chip TriMatrix memory, and up to 12 high-speed transceivers (rate dependent on speed grade), enabling single-chip implementation of DSP-intensive signal processing pipelines. Typical applications include high-performance digital signal processing, ASIC prototyping, telecom baseband processing, radar and software-defined radio front ends, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet via external PHYs), and broadcast video processing. Designers also deploy Stratix II EP2S180 devices in defense and aerospace systems and in test & measurement equipment where the large logic capacity allows whole systems to be emulated before tape-out. Design consideration: the EP2S180F1020I4N is a power-hungry device at full utilization; PCB designers must allocate a multi-layer supply tree (1.2 V VCCT/VCC, 2.5 V/3.3 V VCCIO banks, PLL analog supplies) and a substantial copper pour plus thermal vias to keep junction temperature within the 100C industrial envelope. Configuration via JTAG or an external EPC-series configuration device must be planned early in the design. This page synthesizes distributor pricing, same-family Altera drop-in alternatives, and practical Stratix II design notes not found in the manufacturer datasheet, giving engineers a single decision-ready reference for EP2S180F1020I4N selection and sourcing.
EP2S180F1508C3 - 180K Logic Elements FPGA | Altera | Embedded
Altera EP2S180F1508C3 is a high-density Stratix II field-programmable gate array (FPGA) featuring approximately 180,000 gates, 1,170 user I/Os, and 8,970 logic array blocks in a 1,508-ball FCBGA package. It belongs to the Stratix II FPGA family and targets designs requiring substantial programmable logic, high I/O capacity, and integration of multiple digital functions on one device. The package is identified in verified distributor data as 1508-BBGA, FCBGA, with a 30 mm by 30 mm supplier-device format. An FPGA is a programmable semiconductor whose logic cells, interconnects, and I/O blocks can be configured after manufacturing. In the system hierarchy, EP2S180F1508C3 is an FPGA, a programmable logic device, and an integrated circuit used for implementing digital hardware. Unlike a fixed-function application-specific integrated circuit, an FPGA can support changing protocols, parallel datapaths, control logic, and signal-processing architectures through configuration. Its high gate count and large I/O count make it suitable for complex communication, industrial, test, and embedded processing systems. The device provides 8,970 logic array blocks, 1,170 I/Os, and a 1.2 V-class supply identified as 1.15 V to 1.25 V in the verified cross-reference data. The exact operating temperature grade, logic-element count, embedded-memory count, transceiver count, and package thermal data are not available in the supplied source snippets, so those values are intentionally marked as data-needed rather than inferred. The part is listed as a 1508-BBGA, FCBGA device with ball-grid-array mounting. For system architecture, the FPGA can consolidate control-plane logic, data-path processing, interface adaptation, and state-machine functions. The 1,170-I/O capacity is particularly useful for systems that aggregate many parallel signals, while the 8,970 logic-array blocks provide a large programmable fabric for custom accelerators and protocol implementations. Designers must validate configuration, clocking, power sequencing, I/O standards, signal integrity, and thermal behavior against the complete manufacturer datasheet before release. Typical applications include industrial automation controllers, communications equipment, test and measurement systems, image or video processing equipment, and high-end embedded digital platforms. The device is appropriate when design flexibility and interface density outweigh the power and development considerations associated with a very large FPGA. Its legacy Stratix II architecture also requires careful toolchain and lifecycle planning. When designing with EP2S180F1508C3, confirm the exact ball map, supported configuration modes, clock constraints, I/O electrical limits, and recommended decoupling network in the manufacturer documentation. The verified sources provide package and capacity information but do not provide complete electrical limits or a complete pin assignment, so the pinout remains data-needed. Pricing and availability should be confirmed with the distributor at the time of purchase. This product page combines verified distributor specifications, package and capacity details, sourcing links, and carefully separated data-needed fields to help engineers distinguish confirmed facts from parameters that require manufacturer-datasheet verification.
EP2S180F1508C3N - Stratix II FPGA 179K LE 1508-FBGA | Intel
The Intel (Altera) EP2S180F1508C3N is a high-density Stratix II Field Programmable Gate Array (FPGA) containing 179,400 equivalent logic elements (LEs), 9,383,040 total RAM bits, and 8,970 Logic Array Blocks (LABs) with 1,170 user I/Os, housed in a 1,508-ball FineLine Ball-Grid Array (FBGA) package measuring 40 x 40 mm. According to the Altera Stratix II Device Handbook, the device operates from a 1.15 V to 1.25 V core supply and is fabricated on a 90 nm all-layer-copper CMOS process with 1.2 V core logic. A Field Programmable Gate Array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as memory blocks, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which occupy a tier alongside ASICs and microcontrollers in the digital integrated circuit hierarchy. Stratix II in particular introduced an adaptive logic module (ALM) architecture featuring 8-input fracturable look-up tables, doubling the effective logic capacity versus prior Stratix generations. Key features include embedded TriMatrix memory (with 9 Mbit total), up to 96 DSP blocks for fixed- and floating-point arithmetic, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, and multi-gigabit transceivers (not present on the F1508 package variant). The 1,508-FBGA package supports commercial-grade junction temperature and is the highest-density Stratix II pinout variant, exposing nearly every user I/O for parallel processing interfaces. The EP2S180F1508C3N belongs to the C3 speed grade, meaning nominal Fmax performance with standard core voltage; I4 and C5 variants trade temperature range or speed for higher-grade silicon. Its 90 nm process node places it in the legacy high-performance FPGA category, predating Stratix III/IV/V but still specified for new designs where legacy IP re-use, low unit cost at high density, and proven Quartus II tool flow are valued over cutting-edge transceivers. Typical applications include high-throughput DSP pipelines (radar, video processing, software-defined radio), ASIC prototyping of complex SoCs, telecom baseband processing, and industrial control with custom parallel datapaths. The 1,170 user I/Os enable direct parallel bus attachment to DDR/QDR memory without external buffers. When designing with this device, plan the PCB layout around the 1.2 V core and 3.3 V/2.5 V/1.8 V/1.5 V auxiliary supplies, route all differential pairs with controlled impedance, and use Quartus II software 13.0 or earlier for synthesis since the device predates Intel Quartus Prime. Decoupling must follow Stratix II PDN guidelines (typically 200+ low-ESL capacitors) to suppress simultaneous switching noise across the 1,170 I/Os. This page consolidates Stratix II family specifications, pricing from authorized distributors, drop-in alternative FPGAs sharing the F1508 footprint, and design notes drawn from the Stratix II Handbook - information synthesized beyond what the manufacturer datasheet alone provides.
EP2S180F1508C3NAA - Stratix II 180K LEs FPGA | Intel | 1508-FBGA
The Intel EP2S180F1508C3NAA is a high-density Stratix II family field-programmable gate array (FPGA) delivering up to 179,400 equivalent logic elements, 9.4 Mbits of embedded RAM, and 96 DSP blocks, housed in a 1508-ball flip-chip BGA package. The device is specified at the -3 commercial speed grade, supports up to 1170 user I/O pins, and integrates up to 12 transceiver channels for high-speed serial I/O. Per the manufacturer datasheet, the EP2S180 is fabricated on a 90 nm process and includes dedicated on-chip termination, RAM, and DSP blocks optimized for high-performance digital signal processing, telecommunications, and ASIC prototyping workloads. What is a Stratix II FPGA? A Stratix II FPGA is a programmable logic device from the Altera/Intel Stratix II family of high-performance, SRAM-based field-programmable gate arrays. An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of configurable logic blocks, programmable interconnect, and specialized hard IP such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit in the broader taxonomy as follows: programmable logic device (PLD) -> field programmable gate array (FPGA) -> SRAM-based FPGA -> high-density Stratix II family. Stratix II devices are typically used in applications requiring very high logic density, high-speed serial connectivity, and substantial embedded memory and arithmetic resources. Key features of the EP2S180 include 179,400 equivalent logic elements (LEs), 9,383,040 bits of total embedded RAM (M4K and M-RAM combined), 96 embedded DSP blocks capable of up to 384 18x18 multipliers, and 12 full-duplex transceiver channels supporting data rates up to 6.375 Gbps. The 1508-FBGA package provides 1170 user I/Os and uses Intel's flip-chip BGA technology for high I/O density and excellent signal integrity at high frequencies. The device architecture combines Look-Up Table (LUT) based adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks with hardware multipliers, and embedded transceivers. The adaptive logic module architecture provides finer-grained logic utilization compared to prior Stratix generations, allowing more efficient implementation of complex arithmetic and control logic. Typical applications include high-performance digital signal processing (radar, software defined radio, video processing), wireline telecom line cards with multiple SerDes channels, ASIC prototyping for large SoC designs, high-speed data acquisition, and test and measurement instrumentation. The combination of high logic density, embedded transceivers, and substantial block RAM makes it well-suited to throughput-intensive compute systems. When designing with this device, carefully consider power distribution network design (PDN) for the 1508-ball flip-chip BGA, signal integrity for high-speed transceiver channels, and thermal management for the 1.0 V core supply at high toggle rates. Use Intel Quartus II design software (legacy version recommended for Stratix II) for synthesis, place-and-route, and timing closure. Per-package ball maps and reference schematics should be obtained from the manufacturer pin-out file. This page synthesizes distributor availability, same-package drop-in variants, and design guidance that is not found in the manufacturer datasheet, and is intended for engineers performing second-source qualification or migrating to a higher density Stratix II member.
EP2S180F1508C4 - 179,400-Cell Stratix II FPGA | Intel
Intel EP2S180F1508C4 is a high-density Stratix II field-programmable gate array featuring 179,400 logic elements or cells, 9,383,040 bits of embedded RAM, 1,170 programmable I/O lines, and a 1.15 V to 1.25 V supply range in a 1,508-ball FC-FBGA package measuring 40 mm by 40 mm. This combination targets complex digital systems that require substantial programmable logic, substantial on-chip memory, and a large number of external interfaces. The part belongs to Intel's Stratix II FPGA family, placing it in the hierarchy of programmable logic device, FPGA, logic IC, semiconductor, and configurable digital processing platform. An FPGA is a semiconductor integrated circuit whose logic function is defined through programmable configuration rather than fixed interconnect. Unlike a general-purpose processor that executes software instructions, an FPGA can implement parallel datapaths, state machines, interface bridges, and digital-signal-processing functions in configurable hardware. Within an electronic system, an FPGA sits between fixed-function controllers or processors and high-speed peripheral circuitry, providing reconfigurable timing, protocol, and data-processing resources. The EP2S180F1508C4's primary differentiating resources are its 179,400 logic cells, 9,383,040 RAM bits, and 1,170 I/O pins. The high cell count supports large logic networks, while the embedded memory supports buffering, lookup tables, packet storage, and other data-retention functions. Its 1,170 I/O resources are significant for designs that must connect numerous buses, memory interfaces, control signals, or high-speed parallel links. A published operating-frequency value of 711.24 MHz is available for this family search result, but designers should verify the relevant speed-grade timing conditions before using it as a system-level guarantee. Stratix II devices use SRAM-based FPGA technology and a 90 nm process, according to the supplied FPGAkey result. The architecture supports hardware parallelism and configuration-defined I/O behavior, which can shorten development cycles for algorithms that map efficiently into combinational and pipelined logic. Because the device is SRAM-based, the system must define how configuration data is loaded and retained during operation, including any applicable configuration memory, controller, boot process, and recovery strategy. Typical applications include high-throughput communications equipment, industrial inspection and automation systems, and complex test or measurement platforms. In communications equipment, the FPGA can implement protocol conversion, packet processing, and interface aggregation. In industrial systems, it can coordinate multiple sensors, motion-control channels, and machine-vision data streams. In instrumentation, it can provide deterministic capture, trigger, formatting, and transport logic. These applications benefit from parallel processing and the device's large I/O count, although exact memory, clock, transceiver, signaling, and power requirements must be confirmed from the manufacturer datasheet before design freeze. A key design consideration is that EP2S180F1508C4 is a high-pin-count BGA device, not a simple through-hole or small surface-mount FPGA. PCB planning must accommodate the 40 mm by 40 mm package, controlled impedance for high-speed signals, adequate power distribution, and verified BGA assembly capability. Firmware and board design teams should also confirm configuration support, available development tools, pin assignments, and migration implications before selecting a replacement. This page combines the supplied manufacturer and distributor information with package-aware drop-in references, application context, and explicit markers for unverified electrical details. The result is a practical engineering summary for sourcing, feasibility review, and legacy-system maintenance without presenting missing specifications as confirmed facts.
EP2S180F1508C4N - Stratix II 180K LEs FPGA | Intel/Altera
The Intel (formerly Altera) EP2S180F1508C4N is a high-density Stratix II Field Programmable Gate Array (FPGA) with 179,400 logic elements, 71,760 CLBs (9,570 LABs), 9,383,040 bits of embedded RAM, and 1170 user I/Os, housed in a 1508-ball FC-FBGA package. It operates at a core voltage of 1.15V to 1.25V on a 90nm process technology with a maximum internal clock frequency up to 711.24 MHz. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be electrically configured to implement virtually any digital circuit after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> integrated circuits. Stratix II represents Altera's second-generation high-performance FPGA family, succeeding Stratix with significant architectural improvements in logic density, on-chip memory, and DSP capability. Key differentiating specifications include 9.38 Mbits of total RAM distributed across TriMatrix memory blocks, support for up to 96 DSP blocks with dedicated multipliers, support for external memory interfaces including DDR/DDR2/QDRII/QDRII+/RLDRAM, and 12 global clock networks with 16 PLLs. The 1508-BBGA (FC-FBGA) flip-chip BGA provides high I/O density of 1170 pins on a 40 mm Γ 40 mm body, suitable for high-bandwidth parallel interfaces and pin-intensive protocol bridging designs. The device implements an architecture based on Altera's adaptive logic modules (ALMs), each ALM contains an 8-input fracturable look-up table (LUT), two dedicated adders, and registers that can be split into smaller functions, delivering a claimed 2x performance density improvement versus the original Stratix family. Configuration is typically stored in a serial configuration device and loaded at power-up via active serial (AS), passive serial (PS), or JTAG modes. Typical applications include high-speed digital signal processing, ASIC prototyping, telecommunications infrastructure line cards, video broadcast and image processing, high-end test and measurement equipment, and military/aerospace systems. The 1508-ball FC-BGA package and high I/O count make it suitable for designs that previously would have required an ASIC. When designing with this FPGA, ensure the PCB supports high-speed signal integrity with controlled-impedance routing, matched-length pairs for DDR interfaces, and a sufficient number of power and ground pins to deliver the 1.15β1.25 V core and 3.3 V/2.5 V I/O rails. Note that the Stratix II family has been superseded by Stratix III, IV, and V series; new designs should evaluate current Intel/Altera Cyclone or Stratix 10 families for cost and longevity reasons. This page synthesizes distributor pricing, drop-in compatible Stratix II alternatives with identical 1508-FBGA footprints, and practical design notes that are not consolidated in any single source including the manufacturer datasheet, distributor listings, or parametric search engines.
EP2S180F1508C4TT - 180K Logic Elements FPGA | Altera | High-Performance Digital Logic
Altera EP2S180F1508C4TT is a high-performance Stratix II field-programmable gate array built for demanding programmable digital-logic systems. The verified listing identifies approximately 180,000 logic elements, 1,170 user I/O pins, a 1,508-ball fine-pitch BGA package, and a -T temperature-grade designation. These headline characteristics position the device as a large, I/O-rich FPGA suitable for designs requiring substantial parallel logic, interface aggregation, and configurable digital signal processing. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic blocks, configurable interconnects, and programmable input/output resources. Designers configure these resources after PCB assembly to implement digital circuits, processors, interfaces, control logic, and data-processing pipelines. Within the semiconductor hierarchy, an FPGA belongs to programmable logic and is related to CPLDs while generally offering higher logic capacity. Stratix II is Altera's high-density FPGA family for high-performance applications. The defining features of EP2S180F1508C4TT are its approximately 180,000 logic elements, 1,170 user I/O pins, and 1,508-ball FBGA package. The high logic-element count supports broad datapaths, protocol bridges, embedded control, and multiple parallel processing functions on one device. Its large user-I/O count is valuable when a system must connect many buses, transceivers, memory interfaces, converters, or peripheral controllers. The fine-pitch BGA package provides dense interconnects but requires advanced PCB fabrication, assembly, inspection, and signal-integrity planning. Technically, Stratix II devices combine configurable logic fabric with routing resources, memory blocks, clocking resources, DSP-oriented blocks, and programmable I/O. Firmware determines the implemented digital architecture, so power, timing, thermal behavior, and pin assignment remain design-dependent. A large BGA also creates extensive simultaneous-switching-current, decoupling, plane-integrity, and escape-routing challenges. Engineers should use the official family documentation and supported Intel FPGA development tools when compiling, configuring, and validating a design. Typical applications include telecommunications and networking equipment, industrial automation and test systems, high-density interface bridging, video or imaging processing infrastructure, digital signal-processing controllers, and defense or aerospace electronics. The 1,170-I/O capability is especially useful where several external buses must terminate on one processing device. Engineers should choose this component when logic capacity, I/O density, and high-end programmable performance outweigh package complexity, power demands, and legacy-device availability. A primary design consideration is the 1,508-ball FBGA land pattern: it cannot be treated as a simple, low-pin-count FPGA. Follow the official BGA pin assignment, bank rules, voltage sequencing, decoupling guidance, and thermal recommendations, then verify all timing, power integrity, and signal-integrity constraints in the selected speed grade. This page synthesizes verified identity, package, I/O, and logic-capacity data with package-aware comparison guidance; missing electrical and thermal limits remain explicitly identified rather than estimated.
EP2S180F1508C5 - 179K LEs Stratix II FPGA, 1170 I/O, 1508-FBGA | Altera
The Altera EP2S180F1508C5 is a high-density Stratix II Field-Programmable Gate Array in the 1508-ball FineLine BGA (FCBGA) package, integrating approximately 179,400 equivalent logic elements, 9,383,040 bits of embedded RAM, and 1,170 user I/O pins. Built on a 1.2 V, 90 nm all-layer copper SRAM process, the device targets high-performance logic, DSP, and memory-rich applications where deterministic timing and abundant on-chip memory are critical. The 1508-FBGA package measures 40 mm Γ 40 mm and exposes 1,170 general-purpose I/Os plus dedicated clock, configuration, and high-speed transceiver pins depending on variant selection. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors, offering hardware-level parallelism with full design-time reconfigurability. The Stratix II family is part of the broader programmable logic device (PLD) hierarchy, sitting above CPLDs and below structured ASICs in terms of integration, performance, and cost. Key features of the EP2S180F1508C5 include 8,970 Logic Array Blocks (LABs) for fine-grained logic implementation, 96 dedicated DSP blocks for fixed- and floating-point arithmetic, and on-chip memory organized as 512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM blocks for distributed buffering. The device supports up to 12 global clock networks, multiple phase-locked loops (PLLs), and the Stratix II Adaptive Logic Module (ALM) architecture that delivers up to 1.4Γ the logic capacity of the previous Stratix generation at the same die area. High-speed differential I/O supports LVDS, LVPECL, and HyperTransport signalling for backplane and memory interfaces. Typical applications for the EP2S180F1508C5 include high-end telecommunications baseband processing, ASIC prototyping, high-performance image and video processing pipelines, radar and signal-intelligence front ends, and storage area network controllers. The combination of 1,170 user I/Os, 9.4 Mbit of embedded RAM, and 96 DSP blocks makes the part especially well-suited to designs that previously required a custom ASIC. The 1508-FBGA package requires a multi-layer PCB with controlled-impedance routing, microvia or via-in-pad technology, and careful power-delivery network design. When designing with this device, allow for high in-rush current on configuration and use a Stratix II-compatible configuration device or JTAG download cable. PCB thermal design should target 2 oz copper on outer layers and a minimum 6-layer stack-up with continuous power and ground planes. This page consolidates distributor pricing, same-family drop-in variants, and practical layout guidance not found in the manufacturer datasheet.