FPGA & CPLD
Products (6357)
EP2SGX130GF40C3NES - Stratix II GX FPGA, 132K LE, 6.375Gbps | Altera
The Altera (now Intel) EP2SGX130GF40C3NES is a high-density Stratix II GX FPGA from the Stratix II GX family integrating 132,540 equivalent logic elements with up to 20 high-speed serial transceiver channels operating at data rates up to 6.375 Gbps. Housed in a 1508-ball flip-chip BGA (FC-FBGA) package, it combines a scalable high-performance logic fabric with embedded SERDES and clock/data recovery units (CRU) on a 90 nm process, with core and I/O voltages centered around 1.2 V. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit in the hierarchy between programmable logic devices (PLDs), complex programmable logic devices (CPLDs), and application-specific integrated circuits (ASICs), offering higher logic density and higher performance than CPLDs but lower per-unit cost and longer lead time than ASICs at high volumes. Key features of the EP2SGX130GF40C3NES include up to 6.375 Gbps transceiver data rate per channel, embedded transceivers with clock/data recovery, on-chip memory, DSP blocks for high-throughput signal processing, and dedicated support for external memory interfaces such as DDR2/QDRII+. The Stratix II GX architecture was Altera's third-generation FPGA to combine high-speed serial transceivers with a scalable logic array, targeting line-card and backplane applications where multi-gigabit serial I/O eliminates external PHY chips. The device fabric is built on 90 nm CMOS technology and supports a maximum internal clock frequency around 717-779 MHz depending on configuration, with embedded transceivers typically delivering 4 to 20 channels at 6.375 Gbps. On-chip TriMatrix memory provides distributed RAM, block RAM, and shift-register memory resources for buffering, packet processing, and DSP coefficient storage. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO, Gigabit Ethernet), protocol bridging and aggregation line cards, multi-gigabit test and measurement equipment, broadcast video processing, and defense/radar signal processing front-ends. Designers also use Stratix II GX parts for proprietary chip-to-chip links requiring SERDES at 3 to 6 Gbps where the integrated transceiver eliminates the cost and signal-integrity overhead of a separate PHY. When designing with this part, plan the PCB for a high-density 1508-ball FC-FBGA which requires microvia-stack-up HDI technology, controlled-impedance SERDES routing, and strict power-rail decoupling per Altera's Stratix II GX design guidelines. Designers transitioning to newer projects should evaluate Stratix IV GX/GT, Arria, or Cyclone families for active-product longevity and tool support. This page synthesizes distributor stock and pricing data, same-package Stratix II GX drop-in alternatives drawn from the XAIPART Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX130GF40C4ES - 132,540 Logic Cells FPGA | Intel
Intel EP2SGX130GF40C4ES is a high-density Stratix II GX field-programmable gate array containing 132,540 logic cells, configured with 7,047 CLBs, and packaged in a 1,508-ball FBGA measuring 40 mm by 40 mm. The device uses CMOS programmable logic, supports an internal frequency of 717 MHz, and is specified for a 1.15 V to 1.25 V supply range. Its lead-free BGA construction belongs to the MS-034AAU-1 package designation and uses a 1 mm ball pitch. A field-programmable gate array, or FPGA, is a semiconductor device whose logic function is defined by configuration rather than fixed internal circuitry. In the system hierarchy, the FPGA combines programmable logic blocks, routing resources, input and output blocks, and optional embedded functions on one integrated circuit. Designers use implementation software to convert a digital design into configuration data, after which the device performs parallel logic, interface, signal-processing, or control functions. The EP2SGX130GF40C4ES belongs to the Stratix II GX family and targets applications requiring substantial logic capacity and high pin count. The principal verified specifications are 132,540 logic cells, 7,047 CLBs, 734 user I/O, and 1,508 package pins. The GX family positioning makes the part relevant to designs that combine high-density programmable logic with serial transceiver-oriented integration. The 717 MHz internal-frequency listing provides a useful reference for the device's speed class, while the 40 mm by 40 mm package supports a large number of parallel interfaces and power connections. The exact transceiver count, operating temperature, configuration memory capacity, and speed-grade interpretation were not exposed in the supplied web snippets. The EP2SGX130GF40C4ES uses SRAM-based programmable-logic technology, as indicated by its Stratix II GX family identity and CMOS process classification. Designers synthesize the intended circuit and load it into the FPGA through its configuration interface. With 734 user I/O and 1,508 total pins, board implementation requires careful assignment of power, ground, configuration, clock, and user-signal balls. The large BGA package can support wide parallel buses, memory interfaces, protocol bridges, and high-channel-count digital processing structures. Typical applications include communications equipment, high-speed test and measurement systems, industrial imaging and video processing, data-acquisition platforms, and protocol-conversion hardware. The 132,540 logic-cell resource count suits designs that need many parallel datapaths, while 734 user I/O can support numerous external buses. Serial transceivers may also make the GX family appropriate where the target design requires high-speed serial connectivity, although the supplied data does not provide a verified transceiver count. Before layout or production release, engineers should obtain the complete manufacturer datasheet and verify ball assignments, configuration requirements, supported I/O standards, transceiver limits, power sequencing, thermal design, and operating-temperature details. The 40 mm by 40 mm FBGA requires a multilayer PCB, controlled escape routing, and sound power-distribution design. Missing parameters are marked rather than inferred, and design-in decisions should be based on the complete datasheet and Quartus support documentation. This product data combines the verified distributor and manufacturer-source snippets with engineering context unavailable on a typical price listing. The result helps buyers compare capacity, package, and commercial information while giving FPGA engineers a clear distinction between confirmed specifications and parameters that still require datasheet-level verification.
EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel
The Intel EP2SGX130GF40C4NES is a 132,540 logic-element Stratix II GX FPGA with embedded 6.375 Gbps multi-gigabit transceivers, manufactured on a 90 nm CMOS process and housed in a 1508-ball flip-chip BGA (FC-FBGA, 40x40 mm, 1 mm pitch). It combines a high-performance programmable logic fabric with up to 20 embedded SERDES channels, 4.5 Mbits of embedded memory, and dedicated DSP blocks, targeting high-speed serial I/O applications including backplane switching, telecom line cards, and high-end test equipment. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and I/O cells that allow designers to implement arbitrary digital logic. Stratix II GX FPGAs sit within the hierarchy: FPGA -> programmable logic device -> PLD -> logic IC -> integrated circuit. The GX suffix denotes Altera/Intel's high-speed transceiver family, integrating multi-gigabit serial interfaces directly on-die to eliminate external PHY chips and shorten signal-trace paths. Key features of the EP2SGX130GF40C4NES include 132,540 logic elements, 717 MHz core fabric speed, 734 user I/O pins, an internal voltage of 1.2 V, and embedded SERDES supporting data rates up to 6.375 Gbps per channel with on-chip clock data recovery. The device exposes eight PLL blocks for clock synthesis and includes embedded TriMatrix memory totalling approximately 4.5 Mbits. Speed grade -4 (C4) and commercial extended temperature grade (N suffix with E) are specified per the datasheet family code. Architecturally, the Stratix II GX uses adaptive logic modules (ALMs) that combine fracturable look-up tables, dedicated carry chains, and register resources. Hard IP for PCIe, Serial RapidIO, and Gigabit Ethernet is embedded next to the transceivers, accelerating protocol implementation. The 90 nm process delivers an optimal balance between performance, leakage, and cost for high-pin-count FPGA designs in 2008-2010 vintage telecom and broadcast infrastructure. Typical applications include 10 Gbps optical transport line cards, Serial RapidIO backplanes, high-end ASIC prototyping, real-time DSP for radar and software-defined radio, and protocol-aware test and measurement platforms. The integrated transceivers let designers collapse multi-chip PHY + FPGA designs into a single package, simplifying board layout. Designers should plan for two-tier power decoupling (bulk plus 0.1 uF and 0.01 uF ceramics near each supply pin), implement thermal vias under the FC-FBGA thermal array, and respect the Quartus II pin connection guidelines for the GF40 package. The high pin count mandates a minimum 8-layer PCB with controlled-impedance routing for SERDES channels. This page consolidates current distributor pricing, verified drop-in same-brand alternatives, and design notes not present in the original datasheet, giving engineers a single reference for sourcing and second-sourcing decisions.
EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel
The Intel (formerly Altera) EP2SGX130GF40C4NGB is a high-density Stratix II GX FPGA from the Enhanced Configuration (EPC) device family, featuring 132,540 logic elements, 6,627 Logic Array Blocks (LABs), and integrated high-speed serial transceivers for gigabit serial interface applications. The device is housed in a 1508-ball FineLine Ball-Grid Array (FBGA) package with a 1.00 mm terminal pitch and is offered in the commercial speed grade 4 (C4) temperature range. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built around an array of programmable logic blocks, programmable interconnect, and I/O cells, belonging to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Modern FPGAs combine this programmable fabric with hardened IP such as transceivers, memory blocks, PLLs, multipliers, and embedded processors, allowing designers to implement custom datapaths, protocol controllers, and parallel processing pipelines on a single chip. The Stratix II GX series extends the general-purpose Stratix II family by adding multi-gigabit transceivers. The EP2SGX130GF40C4NGB integrates up to 20 transceivers supporting serial interfaces up to 6.375 Gbps, embedded TriMatrix memory, and DSP blocks. With 734 user I/O pins and 8 PLLs, the device supports a wide range of high-speed parallel and serial I/O standards. The 1508-ball FBGA package provides high pin density and signal integrity for backplane, telecommunications, and high-performance computing applications, and the C4 speed grade balances timing margin and operating frequency for commercial-temperature designs. Architecturally, the Stratix II GX device uses a row-based logic structure, ALM-based adaptive logic modules, and source-synchronous circuitry optimized for 600 MHz to 1 GHz internal operation. Hard IP for PCI Express, SerialLite II, and other serial protocols reduces soft-logic footprint, while the on-chip TriMatrix memory provides up to 6.7 Mbits of distributed and block RAM with multiple operating modes. Typical applications include 10G/40G Ethernet line cards, SONET/SDH framers, HD-SDI video routers, high-performance DSP co-processing, software-defined radio (SDR) baseband, ASIC prototyping, and high-density protocol bridging. Designers select the EP2SGX130GF40C4NGB when 132K logic elements and 6.375 Gbps transceivers are required in a single device on a commercial-temperature board. When designing with this device, ensure Quartus II software compatibility (the device is supported by Quartus II version 9.1 and later, but newer Quartus releases may no longer include the device in active support). Plan PCB layout with controlled-impedance transceiver channels and adequate thermal dissipation for the 1508-ball FBGA; reference the Altera Stratix II GX Device Handbook and the AN 532 application note for transceiver signal-integrity guidelines. This page synthesizes distributor pricing, drop-in alternative MPNs from the Stratix II GX family, and engineering design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, replacement, and PCB implementation decisions.
EP2SGX130GF40C5 - Stratix II GX 132K LE FPGA, 734 I/O, 1508-FBGA | Intel
The Intel (Altera) EP2SGX130GF40C5 is a high-density Stratix II GX family FPGA delivering 132,540 logic elements with embedded transceivers, manufactured on a 90 nm process and housed in a 1508-ball FineLine BGA package. Key headline parameters include 609.76 MHz core operation from a 1.2 V supply, 734 user I/O pins, and integrated high-speed serial transceivers designed for multi-gigabit serial I/O applications. The 'C5' speed grade places it in the commercial temperature range with the mid-tier performance rating. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer can reconfigure after manufacturing. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLD), which in turn belong to the digital logic IC family and ultimately the integrated circuit category. Stratix II GX parts specifically target high-bandwidth serial connectivity, where embedded transceivers, hard PCIe and SERDES blocks, and abundant on-chip memory replace what would otherwise require multiple companion ASICs. Key features of the EP2SGX130GF40C5 include up to 6.7 Mbits of embedded memory, dedicated DSP blocks for fixed- and floating-point math, up to 12 embedded transceivers supporting multi-gigabit data rates, eight PLLs for clock management, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM. The device also provides hardware multipliers and TriMatrix memory architecture for distributed, block, and shift-register memory configurations. The device architecture combines adaptive logic modules (ALMs) with eight-input fracturable look-up tables (LUTs), allowing a single ALM to implement multiple smaller logic functions and improving effective logic density. Combined with 90 nm process technology and a 1.2 V core, the EP2SGX130GF40C5 achieves high-performance operation with reduced dynamic power relative to the original Stratix family. Embedded transceivers support standards including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI without external PHY chips. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and PCI Express endpoint cards. The combination of abundant logic, embedded SERDES, and large memory makes it well suited to wire-speed packet processing and high-throughput DSP pipelines. When designing with this FPGA, designers should plan thermal dissipation carefully because the 1508-ball FCBGA package concentrates significant power density. Use Altera's Quartus II design suite (legacy support still available through Intel) for synthesis, place-and-route, and SignalTap II logic analysis. Ensure the PCB has sufficient decoupling and matched-length differential pairs for the high-speed serial channels. This page synthesizes distributor pricing, drop-in package-compatible Stratix II GX variants, and practical design considerations not found in the manufacturer datasheet, enabling faster sourcing and second-source decisions.
EP2SGX130GF40C5ES - Stratix II GX 132K LC FPGA, FC-FBGA-1508 | Altera
The Altera (Intel) EP2SGX130GF40C5ES is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 132,540 logic elements across 7,047 Logic Array Blocks (LABs) in a 40x40 mm, 1508-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package. The device is fabricated on a 90 nm CMOS process and operates from a 1.2 V nominal core supply, with embedded transceiver support suited for high-speed serial I/O and the speed grade -5 (the '5' position) indicating Altera's mid-to-upper performance bin for this family. An FPGA is a programmable logic device whose interconnect and logic resources are configured by the user after manufacture, falling into the broader taxonomy of programmable logic > logic IC > integrated circuit > semiconductor. FPGAs such as the EP2SGX130 are used to implement arbitrary digital state machines, DSP datapaths, bus bridges, and protocol controllers without resorting to custom ASIC silicon, trading per-unit cost for design flexibility and time-to-market. The Stratix II GX family in particular targets high-speed serial connectivity applications by combining general-purpose FPGA fabric with embedded multi-gigabit transceivers. Key device features for the EP2SGX130 include 132,540 logic elements, 7,047 LABs, embedded transceiver support, a 609.76 MHz internal frequency ceiling, a 1.2 V core, 90 nm process technology, and commercial-extended (0C to 85C) operating temperature grading per the 'C' suffix. The package integrates 1,508 balls on 1 mm pitch in a flip-chip land-grid construction, allowing dense PCB escape routing for high I/O counts. The 'GF40' designator decodes as 'G' for the lead-free, halogen-free Pb-free ball finish, 'F' for flip-chip BGA, and '40' for the 40 mm body size. The 'Stratix' architecture implements adaptive logic modules (ALMs) rather than classic 4-input LUTs, giving higher effective logic density per tile. The integrated transceiver block supports multiple serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI when paired with the appropriate Altera IP core, making the EP2SGX130 a drop-in building block for line cards, baseband processing, and protocol bridge designs. Configuration is loaded via JTAG, passive serial, or active serial configuration schemes supported by the device. Typical applications include high-speed serial backplane interfaces on telecom line cards, PCIe endpoint and root-complex designs, radar and signal-processing front ends, broadcast video processing engines, and military/aerospace digital signal processing subsystems. The wide -C5 speed bin and commercial-extended temperature grading make it suitable for thermally-controlled industrial enclosures and lab-grade equipment. When designing with this device, allocate at least 6 PCB layers for power, ground, and signal escape from the 1,508-ball FC-FBGA, and use Altera's Quartus II design suite (v7.2 or later for the Stratix II family) for synthesis, place-and-route, and power estimation. Decoupling follows the Stratix II GX Power Distribution Network (PDN) application note, typically requiring bulk, mid-frequency, and high-frequency ceramics distributed under the die shadow. This page synthesizes distributor pricing, drop-in Altera/Intel speed-grade and package alternatives, and practical design notes not consolidated on the manufacturer product page.
EP2SGX130GF40C5NES - Stratix II GX FPGA 132K LEs 1508-FBGA | Intel
The Intel EP2SGX130GF40C5NES is a high-density Stratix II GX family FPGA delivering 132,540 logic elements with embedded transceivers and 734 user I/O pins, housed in a 40x40mm 1508-ball FineLine BGA (FBGA-1508) package. The device integrates up to 6.7 Mbits of embedded memory, embedded multipliers for DSP, and high-speed serial transceivers supporting multi-gigabit serial interfaces, making it one of the flagship devices in the Stratix II GX line. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as block RAM, DSP slices, PLLs, and (in transceiver variants) multi-gigabit transceivers (MGTs). FPGAs belong to the broader category of programmable logic devices (PLDs) within the integrated circuits family. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market at the cost of higher unit price and lower absolute performance-per-watt. The Stratix II GX architecture specifically extends the Stratix II family by adding 3.125 Gbps transceivers for protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet. Key features include 132,540 logic elements, 6.7 Mbits of on-chip RAM, 252 embedded 18x18 multipliers for DSP, 4 PLLs, and 16 global clock networks. The 1508-FBGA package exposes 734 user I/O pins organized into I/O banks that support multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and offer on-chip termination. The C5 speed grade, commercial extended temperature range, and lead-free / RoHS-compliant assembly suit this device to telecom, military-aero, and high-end test equipment. Architecturally the Stratix II GX uses a row-and-column based adaptive logic module (ALM) fabric with DirectDrive and MultiTrack interconnect to reduce routing congestion and improve timing closure. Hard intellectual-property (IP) blocks including transceivers, memory interfaces, and DSP multipliers free programmable fabric for application logic, and the design entry is through the Quartus II design suite. Typical applications include 10-Gigabit Ethernet line cards, Serial RapidIO switches, military secure-radio baseband processing, high-end medical imaging, and ASIC prototyping. Designers choose the EP2SGX130 when their design needs both high logic capacity and embedded multi-gigabit transceivers on a single die. When designing with this device, plan for a 40x40mm PCB footprint with microvia-stack-up capable of routing the 1mm-pitch FBGA-1508 balls, and ensure decoupling capacitance of at least 1uF per power pin per Intel Stratix II GX hardware reference manual guidance. Quartus II PowerPlay early power estimation should be run before pin-out closure because the device can dissipate 15-25W in transceiver-heavy designs. This page synthesizes drop-in alternatives in the same FBGA-1508 footprint, current distributor pricing as of 2026-09-09, and practical PCB and thermal design notes that complement the manufacturer datasheet.
EP2SGX130GF40I4GA - Stratix II GX FPGA, 132K LE, 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX130GF40I4GA is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) with 132,540 logic elements, 6,747,840 total memory bits, and integrated transceivers, housed in a 1508-ball flip-chip BGA (FCBGA) package at industrial temperature grade. It belongs to the Stratix II GX family, which combines a 90 nm logic fabric with up to 20 multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it engineered for high-speed serial I/O applications such as backplane connectivity, broadband communications, and storage area networks. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) within the broader integrated circuit hierarchy (programmable logic -> semiconductor -> IC) that allows designers to configure hardware functionality after manufacturing. FPGAs sit between ASICs and general-purpose processors in the design flexibility/performance trade-off, offering hardware-timed parallelism, reconfigurability, and high-speed I/O without the NRE cost of an ASIC. The Stratix II GX family is positioned as a high-performance transceiver-enabled tier above the logic-only Stratix II family. Key features include 132,540 logic elements organized into 6,627 Logic Array Blocks (LABs), 734 dedicated input pins and 734 dedicated output pins, 6.7 Mbits of embedded RAM, embedded DSP blocks, and 1.00 mm ball pitch for the FCBGA-1508 package. The device integrates up to 20 transceivers that support PCI Express, Serial RapidIO, XAUI, and other high-speed serial standards. Industrial temperature grade (-40C to +100C ambient) supports deployment in harsh environments beyond commercial-grade parts. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) architecture, which replaces the traditional 4-input LUT with an 8-input fracturable LUT, yielding higher logic utilization and faster clocking networks. Multi-gigabit transceivers feature clock-data recovery, transmit pre-emphasis, and receive equalization to maintain signal integrity over backplane and cable channels at multi-gigabit data rates. Typical applications include high-end telecommunications line cards, broadcast video routers, military radar signal processing, ASIC prototyping, and PCI Express endpoint cards. The integrated transceivers also suit Fibre Channel switches, Serial RapidIO bridges, and 10 Gigabit Ethernet MAC implementations in networking line cards. When designing with this device, ensure the PCB has matched-length differential routing for the transceiver channels and a solid reference plane under the BGA footprint for power delivery. Plan FPGA configuration carefully - the device requires a configuration device or JTAG chain for in-system programming, and thermal management at industrial temperatures is critical given the FCBGA package's thermal resistance. This page synthesizes distributor inventory, same-package Stratix II GX drop-in alternatives, and practical design guidance not available in the manufacturer datasheet alone.
EP2SGX300DF780C5N - Stratix II GX 300K LEs, 20x Transceivers | Altera
The Altera EP2SGX300DF780C5N is a high-density, high-performance Stratix II GX FPGA delivering 300,000 equivalent logic elements (LEs), 18,210 Kbits of embedded memory, and 20 multi-gigabit transceivers in a 780-pin FineLine BGA package, fabricated on a 90 nm process with 1.2 V core voltage. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> high-speed transceivers integrated FPGAs. Stratix II GX FPGAs target high-bandwidth serial I/O applications where the device must both process logic and move data at multi-gigabit rates, making them a member of the broader power management and digital signal processing ecosystem. Key features include 20 full-duplex transceivers supporting data rates from 600 Mbps to 6.375 Gbps, 384 dedicated 18x18 multipliers for DSP, 8 PLLs, and 12 global clock networks. The device integrates 16 channels of on-chip SERDES termination, PCI Express hard IP, and supports multiple serial protocols including PCI Express, Serial RapidIO, XAUI, CEI-6G, and Gigabit Ethernet. The EP2SGX300DF780C5N is built on Altera's adaptive logic module (ALM) architecture, replacing the older 4-input LUT structure with 8-input fracturable ALMs. This architecture delivers up to 2x performance per logic element compared to prior generations while reducing compile times. The transceiver blocks each contain dedicated physical coding sublayer (PCS) and physical medium attachment (PMA) circuitry, supporting both AC and DC coupling. Typical applications include high-end telecommunications equipment, 10 Gbps data aggregation switches, base station channel cards, broadcast video processing systems, and high-performance computing accelerators. The device's hard PCI Express endpoint and root complex support make it ideal for high-bandwidth adapter cards and backplane designs. When designing with this FPGA, power estimation should be performed early using the Altera PowerPlay early power estimator, as the 6.375 Gbps transceivers can dominate total power consumption. Designers should also pay attention to PCB layer stackup to maintain signal integrity for the 6.375 Gbps serial links; recommended stackups are documented in the Stratix II GX Device Handbook, Volume 2. This page synthesizes real-time distributor pricing, drop-in Altera Stratix II GX and Stratix IV GX alternatives in the same FineLine BGA-780 package, and practical design notes not consolidated in the manufacturer datasheet — a resource for BOM consolidation and supply-chain risk reduction.
EP2SGX30CF780C3 - Stratix II GX FPGA, 33.88K LE, 780-BGA | Intel
The Intel (Altera) EP2SGX30CF780C3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 bits of embedded RAM, and 361 user I/Os in a 780-ball FineLine BGA package. It is fabricated on a 90 nm process and features 1,694 Logic Array Blocks (LABs), making it well suited for data-path-heavy designs that require both high logic density and substantial on-chip memory. A Field-Programmable Gate Array (FPGA) is a semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs in the design hierarchy: programmable logic IC -> FPGA -> SRAM-programmable FPGA -> high-density FPGA with transceivers. They allow hardware designers to implement custom parallel processing pipelines, custom I/O protocols, and glue logic without the NRE cost of an ASIC, which is why Stratix II GX parts are commonly used in prototyping and low-volume production. Key specifications of the EP2SGX30CF780C3 include up to 33,880 logic elements, 1,694 LABs, 1,369,728 RAM bits, 361 user I/Os, embedded 3.125 Gbps transceivers for serial connectivity, and support for DDR/DDR2/QDRII external memory interfaces via dedicated PHY. The 780-ball FineLine BGA package supports high I/O count while keeping the PCB footprint manageable for mid-complexity boards. Operating temperature is graded commercial (0C to +85C), and the speed grade is -3. The Stratix II GX architecture uses a logic-element fabric with adaptive look-up tables (ALUTs), a TriMatrix memory subsystem, and dedicated DSP blocks. The GX suffix indicates the integration of high-speed serial transceivers, which historically positioned this family for communication-infrastructure, broadcast video, and high-speed serial-protocol bridging applications. Designers should pay attention to Quartus II tool support, as Quartus versions for legacy Stratix II devices are mature but no longer under active development, and Intel recommends migrating to Stratix IV/V families for new designs. Typical applications include communication infrastructure (protocol bridges, backplane SERDES), broadcast video processing, industrial test and measurement, ASIC prototyping, and high-speed data acquisition. The combination of transceivers, block RAM, and abundant logic density makes the EP2SGX30CF780C3 suitable for custom packet-processing engines and for replacing discrete logic + memory glue in mid-complexity designs. When designing with this part, ensure your PCB layout supports the 1.0 mm or 1.27 mm pitch BGA fanout and that signal-integrity simulations are run on the transceiver channels. Because the Stratix II family is mature, plan firmware/quartus tool availability in your long-term roadmap. For new designs, also evaluate Stratix IV GX, Cyclone V GX, or Cyclone 10 GX as modern drop-in-compatible successors with active toolchain support. This page synthesizes distributor stock, datasheet parameters, drop-in compatible Stratix II GX variants, and design notes not aggregated on a single manufacturer page.
EP2SGX30CF780C3N - Stratix II GX FPGA, 33880 Cells | Intel
The Intel EP2SGX30CF780C3N is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs), featuring 33,880 logic cells, a 717 MHz maximum operating frequency, and integrated transceivers in a 780-pin FC-FBGA package. Built on a 90 nm CMOS process and supplied by a 1.2 V core rail, this device is engineered for high-bandwidth serial I/O, embedded processing, and digital signal processing (DSP) applications in communications infrastructure, video imaging, and storage systems. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than by fixed mask layers. Within the broader taxonomy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic devices, and Stratix II GX represents Intel's mid-to-high density tier with built-in multi-gigabit transceivers, dedicated DSP blocks, and TriMatrix embedded memory. The 'GX' suffix denotes integrated serializer/deserializer (SERDES) channels, distinguishing this family from the non-transceiver Stratix II line. The 33,880 logic elements are organized into 33,880 CLBs (configurable logic blocks) backed by approximately 1.4 Mbits of embedded RAM distributed across TriMatrix memory structures, and the device integrates dedicated 18-bit x 18-bit multipliers for DSP operations. The integrated transceiver block supports multiple serial protocols, eliminating external PHY chips in many designs and reducing both board area and bill of materials cost. The 780-ball fine-pitch BGA package exposes roughly 600 user I/O pins, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with on-chip termination. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional configuration via EPC serial configuration devices. Designers using the Quartus II design software can target this device with either VHDL or Verilog HDL and benefit from the mature IP library that has shipped with the Quartus toolchain since the early 2000s. Typical applications include 3G/4G wireless baseband processing, high-speed serial backplane switching, broadcast video processing, and military radar signal chains. The combination of logic density and embedded transceivers makes the EP2SGX30CF780C3N particularly well-suited to line cards that aggregate multiple SFP/SFP+ or SERDES links while performing protocol bridging or packet classification. Compared with newer Cyclone V or Arria 10 FPGAs, the Stratix II GX family is fabricated on a 90 nm process and consumes noticeably more static power, so most new designs now favor the Stratix V or Stratix 10 families instead. When designing with the EP2SGX30CF780C3N, verify that the Quartus II version in use supports the device family (Quartus II 9.1 or earlier) and provide adequate thermal relief for the 780-ball FC-FBGA, since high transceiver utilization can push junction temperatures into the 100 C range without airflow. This page consolidates distributor pricing, drop-in alternatives within the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX30CF780C3NGB - Stratix II GX FPGA, 33.8K LE, FC-FBGA-780
The Altera (Intel) EP2SGX30CF780C3NGB is a member of the Stratix II GX family of high-performance FPGAs integrating up to 33,880 logic elements (LEs), 1,694 logic array blocks (LABs), and 1,369,728 bits of on-chip RAM in a 780-ball flip-chip fine-line BGA (FC-FBGA-780) package. It is built on a 90 nm CMOS process and operates from a 1.2 V core supply with a maximum internal clock frequency near 816.9 MHz (per the Stratix II GX device handbook). The device provides 361 user I/O pins and integrates dedicated 3.125 Gbps transceivers for high-speed serial connectivity, making it suitable for serial backplane, chip-to-chip, and PCI Express applications. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic and routing are configured by the end user after manufacture. FPGAs belong to the broader programmable logic (PLD) category, which sits between fixed-function ASICs and software-programmable processors in terms of flexibility, parallelism, and time-to-market. Modern high-end FPGAs like Stratix II GX add embedded transceivers, memory blocks, DSP blocks, and PLL/clock-management hardware, allowing them to serve as complete system-on-chip (SoC) platforms for wired communications, signal processing, and high-bandwidth I/O aggregation. The EP2SGX30CF780C3NGB integrates embedded transceivers capable of multiple data rates, dedicated hardware multipliers for DSP, and TriMatrix memory blocks. The flip-chip BGA package supports the high I/O count and high transceiver bandwidth required by the device, while keeping lead inductance low enough for multi-gigabit signaling. Per the Stratix II GX device family datasheet, this device family targets high-speed serial I/O and high-density parallel processing. Typical applications include telecommunications line cards and backplanes, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), video broadcast and imaging pipelines, defense and aerospace signal processing, and test & measurement instrumentation. The combination of high logic density and integrated transceivers allows designers to consolidate multiple discrete bridge/aggregation chips onto a single Stratix II GX device. When designing with this FPGA, ensure proper power sequencing of the 1.2 V core and the transceiver analog supplies, and follow Altera's thermal management guidelines for flip-chip BGA packages. Designers should consult the Stratix II GX pin connection guidelines and the Quartus II support resources for transceiver channel placement and board layout to meet signal-integrity and SI/PI requirements. This page synthesizes distributor availability, Stratix II GX family variants, and design considerations not always obvious from the manufacturer datasheet alone, with cross-brand alternatives sourced from current cross-reference data and XAIPART-internal part pages.
EP2SGX30CF780C4 - Stratix II GX FPGA 33.88K LE | Intel
The Intel EP2SGX30CF780C4 is a Stratix II GX family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, delivering 33,880 logic elements, 1,369,728 bits of embedded memory, and 361 user I/Os in a 780-ball flip-chip BGA package. Operating at up to 732.1 MHz with a 1.2 V core, this device targets high-performance digital signal processing, serial connectivity, and embedded processing applications. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by the user after manufacturing, sitting in the broader hierarchy of programmable logic devices (PLD) -> CPLD/FPGA -> logic IC -> integrated circuit. FPGAs combine configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (memory, transceivers, DSP blocks, PLLs). The Stratix II GX family extends the Stratix II architecture by integrating multi-gigabit transceivers, making it suited for serial backplane, telecom, and high-speed serial I/O applications. Key features of the EP2SGX30CF780C4 include 16 transceivers supporting multi-gigabit serial data rates, dedicated hardware multipliers and DSP blocks for high-throughput arithmetic, on-chip tri-matrix memory supporting true dual-port RAM, ROM, and FIFO modes, and up to 361 single-ended user I/Os. The 780-pin FBGA package provides the routing density required for high-pin-count high-performance designs. The device architecture is built around Adaptive Logic Modules (ALMs) that implement combinational logic, arithmetic, and register functions in 8-input look-up tables with associated registers. Hard IP blocks for transceivers, PLLs, and memory controllers offload common functions from the programmable fabric. The 90 nm process technology balances performance and power at the time of introduction, while the 1.2 V core VCC minimizes dynamic power. Typical applications include 10 Gbps and below serial backplane interfaces, telecom line cards, high-end test and measurement equipment, ASIC prototyping, high-throughput digital signal processing for video and imaging, and embedded computing platforms requiring custom I/O bridging. The integration of transceivers with general-purpose FPGA fabric enables single-chip protocol bridges and custom ASIC replacements. When designing with the EP2SGX30CF780C4, allocate sufficient PCB layers for the 780-ball FBGA escape routing, use controlled-impedance routing for the multi-gigabit transceiver channels, and provide multiple low-noise supply rails for the transceiver analog supplies. Quartus II software is the primary design entry, synthesis, and place-and-route toolchain. This page synthesizes distributor stock visibility, parametric alternatives within the Stratix II GX family, and practical design notes that complement the official Intel datasheet and the Quartus II device handbook.
EP2SGX30CF780C4N - Stratix II GX 30K FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30CF780C4N is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 RAM bits, and 361 user I/Os in a 780-ball Flip-Chip FineLine BGA package. Built on a 90 nm process and operating from a 1.2 V core supply, the device combines a high-density programmable logic fabric with up to 20 embedded transceivers capable of multi-gigabit serial I/O, making it a drop-in logic platform for high-speed serial interface bridging, packet processing, and backplane aggregation. An FPGA (Field Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable routing that the designer can re-wire after manufacture using a hardware description language. FPGAs sit above microcontrollers and fixed-function ASICs in the design hierarchy: they trade unit cost for parallelism, time-to-market, and the ability to revise functionality in the field, while the transceiver-equipped Stratix II GX family specifically targets serial-link applications such as telecom backhaul, RAID controllers, and protocol bridging. Key features include 33,880 logic elements organized into 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded SRAM, and embedded multipliers supporting DSP functions such as FIR filtering and FFT butterflies. The 'C' speed grade and '-4' device-grade suffix denote a commercial temperature range and mid-speed timing closure, while 'N' indicates lead-free / Pb-free termination suitable for RoHS-compliant assemblies. Architecturally, the Stratix II GX combines an adaptive logic module (ALM) structure with TriMatrix embedded memory (MLAB, M512, M4K, M-RAM) and dedicated DSP blocks. The integrated CDR/PHY-based transceivers support standard serial rates from 600 Mbps up to 6.375 Gbps, with dynamic reconfiguration between rates; this lets one Stratix II GX device replace multiple discrete PHY chips and a companion FPGA in line-card designs. Typical applications include 10G Ethernet MAC/PHY bridging, SONET/SDH framer and mapper designs, PCIe Gen1 endpoint designs via soft IP, high-speed serial protocol analyzers, and broadcast video routing. The 780-FBGA package also makes it suitable for densely populated line cards where the 1.2 V core and dedicated PLL supply pins simplify multi-rail power design. When designing with this device, ensure a controlled-impedance stack-up for the 6.375 Gbps serial links, provision proper PLL supply filtering, and consult the Quartus II design suite toolchain for transceiver configuration bitstreams. JTAG and serial configuration via EPC16 or EPC64 flash is the standard bring-up path. This page synthesizes verified distributor stock, parametric equivalents, and Stratix II GX family design notes not found in the standalone manufacturer datasheet, giving the engineer an at-a-glance summary of pin compatibility, lifecycle risk, and packaging trade-offs.
EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30CF780C5 is a high-density, high-performance Stratix II GX family FPGA fabricated on a 90 nm process, integrating 33880 logic elements in a 780-ball FineLine BGA (FBGA) package. The device targets high-speed serial I/O, embedded processing, and DSP applications, featuring up to 361 user I/O pins, dedicated transceiver support for multi-gigabit serial links, and 1.2 V core operation. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that implements arbitrary digital logic through programmable logic blocks (LEs/ALMs), interconnect, and I/O cells, occupying the same role as a custom ASIC but with field-reprogrammable flexibility. Stratix II GX FPGAs specifically embed multi-gigabit transceivers alongside the general-purpose fabric, making them part of the programmable logic family hierarchy: programmable logic device (PLD) -> complex PLD (CPLD) -> FPGA -> high-speed-transceiver-enabled FPGA -> embedded DSP + transceiver FPGA. Key features include 33880 logic elements, 1694 LABs, embedded multiplier blocks and M512/M4K/M-RAM memory tiers, four phase-locked loops for clock management, and high-speed transceivers with embedded CDR supporting common serial standards. The device operates at a core voltage of 1.2 V and supports extended industrial temperature grades, with the "C5" suffix indicating the -5 speed grade and "C" indicating commercial temperature. Stratix II GX uses an adaptive logic module (ALM) architecture that combines LUT-based and register-rich operation, allowing a single ALM to implement wider functions than 4-input LUT predecessors, improving logic efficiency. The device integrates hard IP for PCI Express, Gigabit Ethernet, Serial RapidIO, and other serial protocols, plus dedicated DSP blocks for fixed- and floating-point arithmetic. Typical applications include high-end communication backplanes, test and measurement instrumentation, broadcast video processing, medical imaging accelerators, and military/aerospace signal processing. The combination of high logic density and integrated transceivers makes this part well-suited for protocol bridging, channelized DSP, and OTU/SONET framer designs. When designing with this part, designers should follow Altera/Intel Stratix II GX board design recommendations: maintain matched-length differential pairs for the high-speed serial links, allocate sufficient decoupling near every VCC/VCCA/VCCP rail, and validate signal-integrity through IBIS-AMI simulation before committing to layout. This page synthesizes distributor pricing, drop-in same-family alternatives, and Stratix II GX design notes that are not duplicated in the manufacturer datasheet handbook.
EP2SGX30CF780C5N - Stratix II GX FPGA, 30K LE, FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX30CF780C5N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 33,880 logic cells (equivalent to ~30K logic elements), 1,694 LABs, 361 user I/Os, and 1,369,728 bits of embedded memory in a 780-ball FineLine BGA package. The device is specified to operate with a 1.2 V core supply and supports reference clock frequencies up to 609.76 MHz, with the C5 speed grade indicating a -5 internal speed bin targeting high-performance logic and signal-processing workloads. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs/LABs), dedicated DSP blocks, on-chip memory, and programmable I/O structures on a single die. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose CPUs/GPUs (which execute software) and application-specific integrated circuits (ASICs), offering hardware-level parallelism with the flexibility to be reconfigured in-system. The Stratix II GX family extends the base Stratix II logic fabric with embedded multi-gigabit transceivers (MGTs), making it well suited for high-speed serial I/O. Key features of the EP2SGX30CF780C5N include up to 12 transceiver channels capable of multi-gigabit serial rates, on-chip TriMatrix memory totalling ~1.4 Mbit, embedded DSP blocks for high-throughput multiply-accumulate operations, and a 29 x 29 mm FBGA-780 footprint with 1.0 mm ball pitch. The device supports configuration via JTAG, passive/active serial, and passive/active parallel modes through the dedicated MSEL and nCONFIG pins. Architecturally, Stratix II GX combines an adaptive logic module (ALM) fabric with high-speed transceivers and dedicated PLL/clock networks. Compared to discrete logic + serializer implementations, this integration reduces board area, simplifies signal integrity at multi-Gbps rates, and allows the same die to be deployed across multiple product variants by changing only configuration data. Typical applications include 3G/4G wireless baseband processing, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), high-performance digital signal processing (radar, software defined radio), broadcast video processing, and high-speed data acquisition systems. The 361 user I/Os also support LVDS, LVTTL, and SSTL interfacing to external memories such as DDR/DDR2 SDRAM. When designing with this device, plan power sequencing around the 1.2 V core supply and the separate transceiver supply rails, and follow Intel's Stratix II GX pin connection guidelines to ensure unused I/O and transceiver pins are biased correctly. Engineers should also budget for the higher static power typical of 90 nm FPGAs and provide sufficient PCB cooling for sustained high-utilisation workloads. This page synthesises distributor availability, drop-in alternatives from the same Stratix II GX family, and practical design considerations not always explicit in the manufacturer datasheet, helping engineers select, source, and deploy the EP2SGX30CF780C5N with confidence.
EP2SGX30CF780C6 - Stratix II GX FPGA, 780-BGA, 30K LE | Intel (Altera)
The Intel (formerly Altera) EP2SGX30CF780C6 is a Stratix II GX Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (C6 speed grade, commercial temperature range), integrating approximately 33,880 logic elements, 1,369,728 bits of embedded memory, and 361 user I/O pins. The device belongs to the Stratix II GX family that combines a logic-rich fabric with up to 20 high-speed transceivers operating up to 6.375 Gbps, targeting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and Aurora. The C6 speed grade balances timing margin against power consumption, while the F780 BGA package provides sufficient ball pitch and signal integrity for designs with multi-gigabit serial links and wide parallel memory buses. Programmable via the Quartus II design suite and configured through enhanced passive/active configuration schemes, this part is widely used in prototyping and production hardware where deterministic high-speed serial I/O is required. The device is built on a 1.2 V core, 90 nm process technology with embedded multiplier blocks, TriMatrix memory structures, and DSP blocks optimized for high-throughput signal processing. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic, memory, and I/O resources can be programmed after manufacture, allowing hardware engineers to implement custom digital circuits, parallel processing pipelines, and high-speed interfaces without fabricating an ASIC. In the system hierarchy, an FPGA sits between a microcontroller and a custom ASIC: it provides far higher parallelism and I/O bandwidth than an MCU, while avoiding the non-recurring engineering cost of an ASIC. The Stratix II GX family specifically targets applications requiring both general-purpose logic and multi-gigabit transceivers, positioning it as a power-management-aware programmable alternative to discrete PHY plus FPGA solutions. Key features of the EP2SGX30CF780C6 include up to 6.375 Gbps transceiver data rate, 1.4 Mbits of embedded RAM (TriMatrix), dedicated 18x18 multipliers, and built-in PCI Express hard IP. The device supports DDR/DDR2/QDRII memory interfaces with dedicated DQS circuitry, dynamic phase alignment for source-synchronous interfaces, and signalTap II embedded logic analysis for in-system debug. The F780 package offers 361 user I/Os arranged in 8 I/O banks, providing flexible I/O standard support including LVDS, SSTL, HSTL, and LVCMOS at multiple voltages. Architecturally, the Stratix II GX employs an adaptive logic module (ALM) with 8 inputs per ALM, replacing the 4-input LUT architecture used in earlier Stratix families. This allows tighter logic packing and improved performance on wide fan-in functions. The transceiver blocks embed clock-data recovery (CDR), 8B/10B encoding/decoding, and word-alignment logic, offloading these functions from the fabric and freeing logic resources for application-level processing. Typical applications include wireless baseband processing, high-end test and measurement equipment, broadcast video infrastructure, and PCI Express endpoint cards for industrial control or data acquisition. The 6.375 Gbps transceivers also make it suitable for proprietary chip-to-chip links and backplane serial connectivity in storage or telecom systems. When designing with this device, ensure that the Quartus II fitter pin assignments respect each bank voltage (1.2 V to 3.3 V) and that the transceiver reference clocks are routed with controlled impedance. Thermal management is critical in F780 BGA packages because the bottom-side balls carry both signal and thermal dissipation; refer to the manufacturer thermal model for junction-to-case resistance when calculating heatsink requirements. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not found in the manufacturer datasheet, giving the engineer a single decision-ready resource for the EP2SGX30CF780C6.
EP2SGX30CF780C7 - Stratix II GX FPGA 33K LEs 780-BGA | Intel
The Intel (formerly Altera) EP2SGX30CF780C7 is a Stratix II GX family FPGA integrating 33,000 equivalent logic elements, 1.9 Mbits of embedded memory, and 4 full-duplex 3.125 Gbps multi-gigabit transceivers (MGTs) in a 780-pin flip-chip BGA package. Built on a 90nm process with 1.2V core operation, the device combines high-density programmable logic with embedded serial transceivers, making it a single-chip solution for high-speed serial I/O bridging, baseband processing, and protocol aggregation designs. What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks that engineers can re-program after manufacture. The Stratix II GX family extends the Stratix II architecture with embedded multi-gigabit transceivers, positioning the device between pure logic FPGAs and structured ASSPs. Within the broader semiconductor taxonomy, the EP2SGX30CF780C7 belongs to: FPGA -> programmable logic -> digital ASIC alternative -> semiconductor IC. This hypernym chain is important for knowledge graph and AI-search entity matching. Key features include up to 4 transceivers operating from 600 Mbps to 3.125 Gbps, support for PCI Express x1/x4, Serial RapidIO, XAUI, Gigabit Ethernet, and SDI serial protocols without external PHY devices. The device also integrates 4 PLLs, 256 18x18 hardware multipliers (DSP blocks), and supports configuration via passive serial, fast passive parallel, passive parallel asynchronous, and JTAG modes. The CF780 package variant uses a wire-bond or flip-chip BGA with 780 balls on a 1.0 mm pitch. The Stratix II GX architecture uses Adaptive Logic Modules (ALMs) - each ALM contains two combined adaptive look-up tables (ALUTs) that can be partitioned into two independent 4-input LUTs or one 6-input LUT, providing finer-grained logic utilization than traditional 4-LUT FPGA architectures. The 90nm low-k dielectric process enables a 1.2V core voltage with sub-watt static power at room temperature, while I/O banks support 1.5V, 1.8V, 2.5V, and 3.3V standards. Typical applications include multi-gigabit serial backplane bridging, telecom framer/mapper ASIC replacement, military and aerospace signal processing, broadcast video routing, and PCI Express endpoint/root complex prototypes. The integrated transceivers are also well suited to test equipment where protocol-agnostic serial I/O is required. Designers in industrial imaging, medical imaging, and software-defined radio also benefit from the high DSP multiplier count combined with the serial bandwidth. A primary design consideration is power estimation: at 3.125 Gbps all 4 transceivers active, the EP2SGX30CF780C7 typically dissipates 3-5W from the transceiver supply and 0.5-1.5W from logic and clock resources, requiring a 6-8 layer PCB with dedicated power planes and 1oz copper on outer layers. The C7 speed grade provides faster Fmax than C6 but at higher static power. The C7N/C7 commercial temperature grade (0C to +85C) differs from I4/I5 industrial (-40C to +100C) variants. This page synthesizes Altera datasheet parameters, Stratix II GX handbook guidance, and drop-in alternative MPNs from the same Stratix II GX family not found in single-page distributor listings.
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I3 is a high-performance Field-Programmable Gate Array (FPGA) from the Stratix II GX family, delivering 33,880 logic cells / 33,880 Logic Array Blocks (LABs), up to 622.08 MHz internal frequency, and embedded transceivers in a 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) package. What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets designers implement arbitrary digital logic, memory blocks, DSP blocks, and high-speed serial interfaces on a single die. Stratix II GX sits in Altera's high-end transceiver-equipped FPGA hierarchy (Stratix II -> Stratix II GX -> Stratix III GX), built on a 90 nm CMOS process with 1.2 V core voltage. The 'GX' suffix specifically denotes integrated multi-gigabit transceivers, which differentiate this family from logic-only Stratix II devices. Key features include 33,880 logic cells, 361 user I/O pins, embedded 6.375 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and 90 nm CMOS process technology. The 'I3' suffix indicates an industrial temperature grade (–40 °C to +85 °C ambient), while 'CF780' designates the 780-ball flip-chip BGA package. The architecture combines ALM (Adaptive Logic Module) blocks with TriMatrix memory, supporting both distributed and block RAM. The integrated transceivers support common serial protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, while the 90 nm process balances die size and dynamic power for high-density designs. Total internal memory and DSP block counts scale with the 33,880-cell capacity. Typical applications include telecommunications line cards, high-end test and measurement equipment, broadcast video processing, and PCI Express-based add-in cards. The transceiver capability also makes it suitable for backplane aggregation and high-speed serial bridging between FPGAs. When designing with this device, pay close attention to the transceiver reference clock architecture, power-sequencing requirements (1.2 V core, separate transceiver and I/O rails), and signal-integrity guidelines for the 1.0 mm-pitch BGA. A multi-layer PCB with controlled-impedance routing is required to meet transceiver performance targets. This page synthesizes distributor availability, drop-in same-package alternatives from the Stratix II GX lineup, and practical design considerations that go beyond the manufacturer datasheet, helping engineers evaluate the part against newer Cyclone and Stratix families.
EP2SGX30CF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I4 is a high-performance Field-Programmable Gate Array (FPGA) from the Stratix II GX family, featuring 33,880 logic elements and 33,880 configurable logic blocks (CLBs) in a 780-ball FineLine BGA (FBGA) package. The device is built on a 90 nm CMOS process and operates at a maximum internal clock frequency of 622.08 MHz with a core supply voltage range of 1.15 V to 1.25 V. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and routing interconnects after manufacturing. FPGAs sit between fixed-function ASICs (higher performance, higher NRE cost) and microcontrollers (slower, lower cost) in the programmable logic hierarchy. The Stratix II GX sub-family specifically adds embedded multi-gigabit transceivers (MGTs), positioning it between the original Stratix II (logic-only) and the broader programmable logic taxonomy that ultimately derives from standard-cell ASIC families. Key features of the EP2SGX30CF780I4 include 33,880 logic elements, embedded transceiver channels supporting high-speed serial I/O, embedded memory blocks (M4K/M-RAM), embedded multipliers (DSP blocks), and 1.2 V core operation. The industrial temperature grade (I4 suffix) supports an operating range of -40 °C to +85 °C. The 780-ball FBGA package measures 29 x 29 mm with a 1.0 mm ball pitch, suitable for high-density PCB designs. The Stratix II GX architecture uses an adaptive logic module (ALM) approach with a fixed 1.2 V core, distinguishing it from later 65 nm Stratix III/IV families. Embedded transceivers can support multi-gigabit serial protocols, and the device integrates dedicated hardware for DDR/DDR2 memory interfaces. The 90 nm process technology represents an earlier node generation relative to current 28 nm/14 nm Intel Cyclone and Stratix families. Typical applications include high-speed serial interface bridging, telecom line cards, industrial imaging and video processing, military radar prototyping, and embedded DSP pipelines. The combination of logic density, transceiver capability, and the industrial temperature grade makes this device a common choice for legacy long-life-cycle systems where re-design costs are prohibitive. When designing with this device, ensure the Quartus II design tool (or a compatible modern equivalent that still supports the legacy Stratix II family) is used. Power sequencing on the 1.2 V core rail must follow the Stratix II GX handbook guidance, and the FBGA-780 footprint requires multi-layer PCB stack-up with controlled-impedance routing for transceiver channels. This page synthesizes distributor pricing, drop-in same-family alternatives, application guidance, and design notes not collated in the original manufacturer datasheet.
EP2SGX30CF780I4N - 33.88K LE Stratix II GX FPGA, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I4N is a high-density Stratix II GX FPGA delivering 33,880 logic elements in a 780-ball FineLine BGA package with 1.0 mm ball pitch and a 29 x 29 mm body. Built on a 90 nm CMOS process with a 1.15 V to 1.25 V core supply, the device integrates up to 4 embedded transceivers capable of multi-gigabit serial I/O, making it a workhorse for high-bandwidth serial connectivity in legacy telecom and industrial backplane designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, routing interconnect, and dedicated hard IP into a single semiconductor die. FPGAs belong to the broader taxonomy of programmable logic devices (PLD), which also includes Complex Programmable Logic Devices (CPLD). Within digital semiconductors, FPGAs sit above fixed-function ASICs in flexibility and below them in per-unit cost. Stratix II GX sits within Intel's high-performance FPGA family, optimized for serial connectivity and DSP workloads. Key features of the EP2SGX30CF780I4N include 33,880 logic elements, up to 2.5 Mb of embedded memory, embedded 18 x 18 multipliers, four 3.125 Gbps transceivers (C4 speed grade), and support for external DDR/DDR2/QDR memory interfaces. The industrial temperature grade (-40C to +85C) and lead-free 780-pin FC-FBGA package make it suitable for harsh-environment embedded computing. The 'I4N' suffix denotes the industrial temperature range, speed grade 4, and lead-free termination. The architecture combines an ALM-based logic fabric with dedicated RAM blocks, DSP blocks, PLLs, and high-speed serial channels. This heterogeneous design lets the EP2SGX30CF780I4N implement both deeply pipelined datapath logic and low-latency control code simultaneously, while preserving multi-gigabit serial bandwidth for chip-to-chip links. Typical applications include 3G/4G baseband processing, multi-gigabit serial backplane bridging, industrial machine vision pipelines, military radar signal processing, and high-speed data acquisition. The on-chip transceivers eliminate the need for external serializer/deserializer ICs, reducing BOM cost and board area. When designing with the EP2SGX30CF780I4N, plan for Quartus II software support (13.0sp1 or earlier is recommended for legacy Stratix II GX devices), multi-rail decoupling per the pin connection guidelines, and thermal management of the 780-FBGA exposed die. This page consolidates distributor pricing, same-family drop-in alternatives, and practical design notes that streamline Stratix II GX lifecycle decisions beyond the manufacturer datasheet.
EP2SGX30CF780I5N - 33.88K Logic Cells Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX30CF780I5N is a high-performance Stratix II GX family Field-Programmable Gate Array (FPGA) featuring 33,880 logic cells, 609.76 MHz internal operation, and 622.08 MHz maximum clock frequency, housed in a 780-ball FC-FBGA package measuring 29 x 29 mm with 1 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader semiconductor integrated circuit hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs contain configurable logic blocks (CLBs), programmable interconnect, and I/O blocks that engineers can reconfigure post-manufacturing to implement custom digital logic, signal processing pipelines, or even soft processors. The Stratix II GX family specifically integrates high-speed serial transceivers alongside the programmable fabric, making it suited for wired communication, broadcast video, and defense applications where serial I/O bandwidth matters. Key features of the EP2SGX30CF780I5N include a 90 nm CMOS process technology, 1.2 V core supply operation, industrial-grade temperature range of -40C to +85C, embedded transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks, TriMatrix embedded memory, and enhanced clock management with phase-locked loops (PLLs). The 33,880 logic cells are organized into Logic Array Blocks (LABs) with a combinatorial delay of approximately 4.006 ns per LAB, enabling deterministic timing closure for high-speed designs. The 780-ball FC-FBGA (Fine-pitch Ball Grid Array, Flip-Chip) package provides the high pin density required for the device's wide I/O count and high-performance signaling. This BGA package is mounted via surface-mount reflow processes and requires X-ray inspection to verify solder joint integrity. The industrial temperature grade (suffix 'I') makes the part suitable for non-automotive industrial, telecom, and test equipment deployments. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom baseband processing, video broadcast and image processing pipelines, software-defined radio (SDR), military and aerospace signal processing, and ASIC prototyping where designers validate logic before committing to a mask set. When designing with this part, ensure your PCB layout supports flip-chip BGA escape routing with microvia or via-in-pad technology. Quartus II design software (legacy versions are still used for Stratix II GX) is required for synthesis, place-and-route, and bitstream generation. Verify transceiver reference clock jitter performance against your protocol's eye-mask requirements before committing to layout. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP2SGX30DF780C3 - 33880 Logic Cells Stratix II GX FPGA | Altera
The Altera EP2SGX30DF780C3 is a 33880-logic-cell Stratix II GX family Field Programmable Gate Array (FPGA) fabricated on a 90nm CMOS process and housed in a 780-pin Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA, 29x29mm with 1.0mm ball pitch). It integrates 1694 Logic Array Blocks (LABs), 361 user I/Os, 1,369,728 bits of embedded RAM, up to 12 embedded 3.125 Gbps transceivers, and a hard-core Digital Signal Processing (DSP) block count supporting high-throughput signal processing. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLD) -> programmable logic -> logic IC -> integrated circuit. The Stratix II GX family is positioned above Stratix II and below Stratix III in Altera's high-performance transceiver-equipped lineup, targeting applications that combine parallel logic fabric with multi-gigabit serial I/O. Key features include 33,880 logic elements, 1694 LABs, 1.37 Mbits of embedded memory, embedded 3.125 Gbps transceivers, dedicated DSP blocks, a robust PLLs/distributed clock tree, and 361 user I/Os. The 1.2V core operates across a commercial junction temperature range of 0C to +85C as the C3 speed grade. The 'C3' suffix indicates a specific speed bin and a commercial temperature grade per the Stratix II GX nomenclature. The architecture combines a 90nm low-k metal process with ALM-style adaptive logic modules and dedicated multiplier/accumulator blocks, which together deliver the high DSP throughput required by baseband, video, and packet-processing pipelines. Hard PCI Express hard IP blocks and external memory interfaces further accelerate system integration. Typical applications include high-speed serial backplane switching, telecom line cards, baseband processing, military/aerospace signal processing, ASIC prototyping, and high-end industrial imaging. Choose this device when your design needs integrated multi-gigabit transceivers plus substantial parallel DSP and memory resources on a single die. When designing with this part, validate signal-integrity margins on the 1.0mm-pitch BGA and follow Altera's Stratix II GX pin connection guidelines; JTAG (IEEE 1149.1) is supported for boundary-scan test. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and FPGA engineers a single-source decision view.
EP2SGX30DF780C3N - Stratix II GX FPGA, 33.9K LE, 780-FBGA | Intel
The Intel / Altera EP2SGX30DF780C3N is a Stratix II GX Field-Programmable Gate Array (FPGA) IC integrating 33,880 logic elements (LEs), 1,369,728 bits of embedded memory, and 361 user I/Os in a 780-ball Fine-pitch Chip-Scale BGA (FC-FBGA, 29 x 29 mm, 1.0 mm pitch) package. Built on a 90 nm CMOS process with a 1.2 V core supply, the device belongs to the Stratix II GX family that combines a high-density logic fabric with up to 20 high-speed transceiver channels featuring embedded clock-data recovery (CRU) and SERDES at data rates up to 6.375 Gbps per channel. The device is qualified for industrial operating temperatures from -40 C to +85 C and supports JTAG boundary-scan configuration alongside in-system programmability. What is an FPGA with embedded transceivers? A Field-Programmable Gate Array is a programmable logic device that engineers configure after manufacturing, providing a flexible hardware platform that can implement any digital function up to its resource limits. When the fabric is augmented with multi-gigabit transceivers, the same silicon can drive high-speed serial links - backplane SerDes, fibre-channel, Serial RapidIO, PCIe, or custom chip-to-chip protocols - without external PHYs. The Stratix II GX family extends the general Stratix II architecture (logic array, TriMatrix memory, DSP blocks) with hardened PMA/PCS transceiver blocks and reference-clock PLL infrastructure, occupying a position above soft-logic-only FPGAs but below ASSPs in the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor). Key differentiating features of the EP2SGX30DF780C3N include 6.375 Gbps per-channel transceiver support, TriMatrix embedded SRAM blocks for flexible FIFO and buffer construction, dedicated DSP blocks for high-throughput multiplication and accumulation, and a 1.0 mm-pitch FC-FBGA package that enables dense board layout while supporting the high pin count needed for multi-channel serial interfaces and wide parallel buses. The C3 speed grade and N suffix indicate a commercial-temperature, lead-free, RoHS-compliant ordering option. The Stratix II GX architecture implements an ALM (Adaptive Logic Module) fabric rather than the classical 4-input LUT, giving finer-grained logic packing and shorter typical critical paths. TriMatrix memory provides three block sizes (MLAB, M512, M4K) with dedicated routing, allowing the FPGA to instantiate single-port, dual-port, shift-register, or ROM structures without consuming general logic. Embedded transceiver CRUs recover clock and data from inbound serial streams without external components. Typical applications include high-speed serial backplane bridging, telecom line-card aggregation, video-broadcast SDI/HD-SDI routing, military secure-radio baseband processing, and ASIC prototyping for protocols that require multi-gigabit serial I/O. Designers use the part when they need a moderate-density FPGA fabric plus 4-20 SERDES channels on a single die to replace a multi-chip PHY + FPGA solution. When laying out a board with the EP2SGX30DF780C3N, dedicate continuous ground and 1.2 V core supply planes under the package, route each transceiver differential pair with 100 ohm differential impedance and length matching to within the datasheet budget, and isolate the PLL analog supplies with their own filtered rails. The 780-ball FC-FBGA requires PCB fabrication with 1.0 mm-pitch vias and laser-drilled microvia stack-ups to fan out the inner balls. This page consolidates distributor pricing for the EP2SGX30DF780C3N, drop-in alternatives within the Stratix II GX family, and PCB-layout considerations specific to the 780-FBGA package - information that complements the manufacturer datasheet.