FPGA & CPLD
Products (6357)
EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel
The Intel EP2SGX30DF780C4 is a high-density Stratix II GX family FPGA delivering 33,880 logic elements, 33,880 cells, and 1,694 LABs/CLBs in a 780-pin FineLine BGA (FBGA-780) package measuring 29 mm × 29 mm with 1 mm ball pitch. It integrates up to 20 embedded transceivers, 361 user I/Os, and 717 MHz core operation, supporting 1.2 V core voltage for demanding high-speed serial and parallel data-processing workloads. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the customer after manufacture. Within the broader taxonomy, the Stratix II GX belongs to the high-performance FPGA category, sitting between traditional PLDs and ASICs in cost-per-volume while delivering ASIC-class DSP, memory, and transceiver bandwidth. It functions as a system-on-chip engine for parallel DSP, packet processing, and high-speed I/O bridging in communications, imaging, and test systems. Key features include 1,694 LABs/CLBs and 33,880 logic elements, 20 embedded full-duplex transceivers with multi-gigabit capability, dedicated DSP blocks for high-throughput arithmetic, and 361 user I/Os with multi-standard support. The device targets -40 °C to +85 °C extended commercial operating range (C4 grade) and is fabricated on a 90 nm CMOS process for a balance of density and dynamic power. Architecturally, the Stratix II GX combines a row-and-column-based adaptive logic module (ALM) fabric with hard PCIe, memory controller IP, and multi-gigabit transceivers (MGTs), eliminating soft logic for the most timing-critical paths. The 90 nm CMOS process provides adequate headroom for the on-die PLL and clock tree while keeping static leakage manageable. Typical applications include high-end telecommunications line cards, software-defined radio (SDR), ASIC prototyping, broadcast video processing, and high-speed serial backplane bridging. The combination of 20 transceivers and 33.8K logic elements also makes it suitable for medical imaging pre-processors and defense radar front-ends. When designing with this device, careful attention must be paid to power-rail sequencing (1.2 V core, 2.5 V/3.3 V aux) and multi-layer PCB stack-up to keep transceivers within their SI budgets. The FBGA-780 demands a minimum of 6 PCB layers with controlled-impedance routing for the MGT channels. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for evaluation, sourcing, and BOM hardening.
EP2SGX30DF780C4N - Stratix II GX 30K LEs FPGA 780-FBGA | Altera
The Altera EP2SGX30DF780C4N is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) with integrated high-speed transceivers, offering 33,880 logic elements and 1,369,728 RAM bits in a 780-ball flip-chip BGA (780-FBGA, 29x29 mm, 1 mm pitch) package. According to the manufacturer datasheet, the device operates from a 1.15 V to 1.25 V core supply and supports up to 622 MHz internal frequency with a -40C to +85C commercial temperature range. The part is a CMOS FPGA fabricated in a 90 nm process, providing 361 user I/O pins and 1,694 logic array blocks (LABs). An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> high-performance transceiver FPGA. They are used wherever designers need parallel processing, custom I/O timing, hardware-accelerated DSP, or high-speed serial links that an ASIC, MCU, or DSP cannot economically deliver. The Stratix II GX family specifically targets applications that combine logic density with multi-gigabit transceivers (MGTs) for serial connectivity. Key features include embedded transceiver blocks supporting multiple serial protocols, dedicated DSP blocks for high-throughput signal processing, TriMatrix on-chip memory up to ~1.37 Mbits, and support for source-synchronous and high-speed external memory interfaces (DDR/DDR2/QDR). The device integrates up to 12 transceivers depending on package variant, with per-channel data rates suitable for PCIe, XAUI, Serial RapidIO, and custom serial links. The 780-FBGA package provides 361 user I/Os and a flip-chip thermal path for reliable operation at high toggle rates. Architecturally, Stratix II GX uses an ALM-based adaptive logic module that improves on prior 4-input LUT architectures, increasing effective logic density and reducing fabric congestion. The transceiver tiles are physically isolated and clocked independently from the core fabric, allowing parallel development of high-speed serial and parallel logic on the same die. Configuration is via SRAM, so the bitstream reloads from external flash or a host processor on every power-up. Typical applications include telecommunications line cards, software-defined radio baseband processing, high-speed serial protocol bridging, ASIC prototyping, and high-performance DSP pipelines. Engineers select Stratix II GX for designs that demand both high logic capacity and integrated multi-gigabit serial I/O without the cost and risk of an ASIC. When designing with this part, plan power-rail sequencing carefully because core (1.2 V), PLL analog, and transceiver supplies have separate tolerance bands; failure to sequence them can stress the transceivers during bring-up. Use the Quartus II design suite (legacy) or consult the Stratix II GX handbook for transceiver channel bonding and pre-emphasis settings. The device is now in legacy/EOL status, so verify long-term availability before committing to a new design. This page synthesizes distributor pricing, drop-in alternatives, lifecycle notes, and practical design guidance that the manufacturer datasheet alone does not provide.
EP2SGX30DF780C5 - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
The Intel (Altera) EP2SGX30DF780C5 is a Stratix II GX family Field-Programmable Gate Array with 33,880 logic elements (LEs), 1694 LABs/CLBs, and integrated 3.125 Gbps transceivers, housed in a 780-ball FineLine BGA package operating at 1.2V core with -40C to +85C commercial temperature grade and -5 speed grade timing. The device is fabricated in a 90nm CMOS process and delivers up to 609.76 MHz internal operation per the FindIC datasheet summary. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor integrated circuit whose logic fabric, routing, and I/O can be electrically programmed after manufacturing, making it part of the programmable logic hierarchy (FPGA -> PLD -> programmable logic -> semiconductor). FPGAs are widely used in applications requiring high-speed parallel processing, custom I/O protocols, and rapid prototyping where ASIC NRE costs are not justified. Stratix II GX parts specifically target high-speed serial I/O designs such as communications, broadcast video, and military/aerospace systems. Key features include 4 transceiver blocks supporting up to 3.125 Gbps per channel, dedicated DDR/DDR2/QDR memory interface hardware with read/write leveling, 16 global clock networks, and enhanced DSP blocks. The device integrates 4 PLL/DLL blocks per quadrant with reprogrammable phase shifts. The 780-ball FBGA (29 x 29 mm, 1 mm pitch) supports up to 361 user I/Os (per Mouser summary) for LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI/PCI-X interfacing. The Stratix II GX architecture uses an ALM (Adaptive Logic Module) structure rather than traditional 4-input LUTs, giving finer granularity and lower logic utilization. Transceivers operate from 600 Mbps to 3.125 Gbps with dynamic reconfiguration and support for PCI Express, Serial RapidIO, XAUI, and CPRI protocols. Configuration is via enhanced configuration plus error detection with CRC and watchdog timer. Typical applications include high-speed serial backplanes, broadcast video processing, telecom line cards, PCIe endpoint devices, and DSP co-processing. When designing with this device, ensure the PCB supports 1 mm-pitch BGA breakout with microvia or HDI stack-up, and reference Altera's Stratix II GX Handbook for transceiver channel placement and power distribution network design.
EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30DF780C5N is a high-performance Stratix® II GX Field Programmable Gate Array (FPGA) delivering 33,880 logic elements, 1,369,728 memory bits, and 361 user I/Os, integrated with up to 24 embedded transceivers supporting multi-gigabit serial interfaces. It is housed in a 780-ball flip-chip FineLine BGA (FC-FBGA) package measuring 29 mm x 29 mm with a 1.0 mm ball pitch, operating from a 1.2 V core supply at a commercial temperature grade of 0°C to +85°C and a -40°C to +85°C extended range. Internal clock networks can reach up to 622 MHz, and the part is fabricated on a 90 nm CMOS process. An FPGA is a semiconductor device whose logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM, as opposed to an ASIC where the function is fixed at tape-out. FPGAs sit in the wider hierarchy: programmable logic device (PLD) → field-programmable gate array (FPGA) → high-density FPGA with embedded transceivers. Stratix II GX parts are specialized for high-speed serial I/O (PCI Express, XAUI, Serial RapidIO, SerialLite II) and combine general-purpose fabric with hardened IP blocks, allowing a single chip to implement bridging, packet processing, and DSP functions that previously required an ASIC plus a discrete PHY. Key features of the EP2SGX30DF780C5N include 1,694 LABs/CLBs, 1694 logic array blocks, total RAM bits of 1,369,728, and an extended industrial operating temperature range. The 'C5' speed grade corresponds to the slower commercial tier while still enabling >600 MHz fabric operation; the 'N' suffix denotes a lead-free, RoHS-compliant finish. The Stratix II GX family supports dedicated DSP blocks, on-chip termination for high-speed transceivers, and the Quartus II design suite for synthesis, place-and-route, and bitstream generation. Architecturally, the device uses an adaptive logic module (ALM) based fabric with 8-input fracturable look-up tables, eight ALMs per LAB, and column-/row-based routing. Embedded transceivers operate from 600 Mbps to 6.375 Gbps depending on the protocol, with embedded PCS/PMA blocks for 8B/10B encoding, rate matching, and word alignment. The part supports source-synchronous DDR/DDR2/QDR II memory interfaces via dedicated DQS circuitry, making it well suited to high-bandwidth memory-to-logic bridging. Typical applications include telecom backplane line cards, broadcast video processing, military radar and signal intelligence, medical imaging front-ends, and ASIC prototyping. The combination of 33k logic elements and embedded multi-gigabit transceivers makes the EP2SGX30DF780C5N particularly attractive for protocols that are now legacy but still in service (XAUI, PCIe Gen1/Gen2, Serial RapidIO). A primary design consideration is power-supply sequencing - the 1.2 V core, 3.3V/2.5V/1.8V I/O banks, and PLL/transceiver auxiliary supplies must ramp in the order specified by the datasheet to avoid in-rush latch-up. PCB layout requires impedance-controlled 100 Ω differential traces for the transceiver channels and matched-length routing for DDR/DDR2 memory interfaces. This page synthesizes distributor pricing, lifecycle status, drop-in Stratix II GX alternatives with the same FC-FBGA-780 footprint, and practical Quartus II design notes not found in the manufacturer datasheet.
EP2SGX30DF780C6 - Stratix II GX FPGA 33.8K LEs | Altera
The Altera EP2SGX30DF780C6 is a member of the Stratix II GX family of high-density, high-performance field-programmable gate arrays (FPGAs) with embedded multi-gigabit transceivers, delivered in a 780-pin FineLine BGA package at commercial speed grade 6. The device integrates 33,880 logic elements, 1,369,728 RAM bits organized in 33,880 memory blocks, and 361 maximum user I/Os, providing a balanced mix of logic, memory and serial connectivity for bandwidth-intensive designs. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP such as block RAM, DSP blocks and (in this family) multi-gigabit transceivers. FPGAs sit at the top of the programmable-logic hierarchy - alongside CPLDs and structured ASICs - and are widely used to prototype, bridge, or pre-produce digital systems that require high I/O counts, parallel processing, or fast serial links. The Stratix II GX family extends that capability with up to 6.375 Gbps transceivers, hard PCI Express and other protocol IP, making the family a bridge between generic FPGAs and structured ASSPs. Key features of the EP2SGX30DF780C6 include 1,694 LABs/CLBs (per Mouser listing for the C4N sibling), 33,880 logic elements, dedicated 18-bit x 18-bit multiplier blocks, and Stratix II adaptive logic modules (ALMs) that pack two 4-input LUTs into a single 7-input equivalent. The device supports both 1.2V core and 1.5V/1.8V/2.5V/3.3V selectable I/O standards through programmable I/O banks, and it integrates multi-gigabit transceivers (MGTs) that handle protocols such as Serial RapidIO, XAUI, PCIe and custom serial interfaces up to 6.375 Gbps. The device is fabricated in a 90 nm process with a 1.2 V core supply, leveraging Altera's adaptive logic module architecture to achieve high logic density at lower power per LE than the original Stratix. Embedded hard IP (MGTs, memory controllers, DSP blocks) frees programmable fabric for application logic, so the part is often used to implement protocol bridging, baseband processing, and high-speed serial aggregation. Typical applications include high-speed serial interface aggregation (XAUI, PCIe, Serial RapidIO), telecom baseband and channel-card designs, military and aerospace signal processing, broadcast video processing, and ASIC prototyping. The 780-pin FBGA package supports 361 user I/Os with 8 Gbps-class serial links, making the device attractive for backplane and line-card designs that need many LVDS pairs plus multi-gigabit serial. When designing with the EP2SGX30DF780C6, plan power sequencing on the 1.2 V core rail, observe Stratix II GX decoupling and PCB layout guidelines from the family handbook, and verify transceiver reference-clock and PCB stack-up requirements against the device's high-speed channel budget. Designers should also confirm Quartus II support for the exact speed grade and pin-out revision before tape-out.
EP2SGX30DF780C7 - Stratix II GX FPGA 33.7K LE | Intel (Altera) | 780-BGA
The Altera (now Intel) EP2SGX30DF780C7 is a Stratix II GX field-programmable gate array (FPGA) that integrates 33,880 logic elements and 1,369,728 bits of embedded memory into a 780-ball fine-pitch BGA package, with up to 361 user I/O pins and dedicated high-speed serial transceivers optimized for serial connectivity and DSP-intensive designs. The part operates as a logic-density-optimized Stratix II GX variant with on-chip 6.375 Mbit RAM, four internal PLLs, 16 global clock networks, and embedded multiplier blocks supporting 18x18-bit signed/unsigned multiplication at up to 450 MHz. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that combines programmable logic blocks, programmable interconnect, and I/O cells on a single die. FPGAs belong to the broader hierarchy of programmable logic devices (PLD), within the taxonomy of logic ICs > integrated circuits > semiconductors. The Stratix II GX family extends the Stratix II architecture with up to 20 multi-gigabit transceivers (channel data rates to 6.375 Gbps), making the series targeted at high-speed serial I/O, DSP, and embedded processing applications. Key features of the EP2SGX30DF780C7 include 33,880 logic elements (LE), 1,369,728 RAM bits organized as 482 M512/M4K/M-RAM blocks, 24 DSP blocks implementing 192 18x18 multipliers, an FPGA speed grade of -7 (faster than -8), and a commercial operating temperature range of 0C to +85C. The -C7 speed grade denotes a faster timing closure option that allows higher Fmax on internal logic paths than the C5/C6 grades. The EP2SGX30DF780C7 uses a 90 nm process node with a 1.2 V core supply, an embedded transceiver serializer/deserializer (SERDES) tile that supports PCI Express, Serial RapidIO, XAUI, and CEI-6G physical layers, and a fine-pitch 780-ball BGA package with a 1.0 mm ball pitch. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and Joint Test Action Group (JTAG) modes with optional encryption via the EPC configuration device family. Typical applications of the EP2SGX30DF780C7 include high-speed serial interface bridging (PCI Express Gen1/Gen2 endpoints), digital signal processing cards in communications infrastructure, baseband processing in wireless base stations, ASIC prototyping, broadcast video processing, and software-defined radio front-ends. The 6.375 Gbps SERDES capability and abundant DSP blocks make it suitable for data plane packet processing. When designing with this FPGA, pay attention to transceiver reference clock jitter, PCB layer stack-up for BGA breakout, and the need for proper decoupling on every VCC rail. Quartus II software (version 9.0 and later) is the design environment, and the device requires a configuration flash memory if FPP/PS modes are used. This page synthesizes distributor pricing, same-brand Stratix II GX speed-grade alternatives, and PCB/thermal design guidance not found in the standalone datasheet.
EP2SGX30DF780C7N - 30K LE Stratix II GX FPGA 780-BGA | Altera
The Altera (now Intel) EP2SGX30DF780C7N is a member of the Stratix II GX family of high-performance FPGAs, delivering approximately 33,880 equivalent logic elements (LEs) and up to 1,369,728 bits of embedded memory in a 780-ball FineLine BGA package. Built on a 90 nm process, this device integrates dedicated 3.125 Gbps transceiver circuitry alongside the adaptive logic module (ALM) fabric, targeting high-speed serial I/O and digital signal processing designs. A Field Programmable Gate Array (FPGA) is a programmable logic IC whose internal lookup tables, flip-flops, routing, and hard IP blocks can be configured by the user after manufacture to implement arbitrary digital functions, ranging from simple glue logic to complete processor subsystems. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), with high-end FPGAs like Stratix II GX further embedding transceivers, DSP blocks, and large block RAMs to compete with ASICs in throughput-intensive applications. The -7 speed grade places this part in the standard-performance tier of the family, balanced for both timing closure and power. Key features include 361 user I/O pins, dedicated 3.125 Gbps multi-gigabit transceivers (MGTs), embedded multiplier blocks for DSP, and on-chip Phase-Locked Loops (PLLs) for clock management. The FineLine BGA-780 package supports high pin density with controlled-impedance signal integrity for parallel interfaces and serial links. The integrated transceiver hard IP allows designers to implement protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI without consuming general-purpose logic resources. Architecturally, Stratix II GX uses the ALM as its basic logic element, where each ALM contains two adaptive look-up tables (ALUTs) and four programmable registers, giving finer granularity than the 4-LUT structures used in earlier Stratix generations. The transceiver blocks include physical coding sublayer (PCS) and physical medium attachment (PMA) layers to handle 8b/10b encoding, clock data recovery, and serializer/deserializer functions. Combined with the Quartus II design toolchain, this part accelerates time-to-prototype for communication and signal-processing systems. Typical applications include high-speed serial backplanes, telecom line cards, wireless baseband processing, broadcast video routers, and military signal-processing systems. The combination of high logic density, embedded transceivers, and substantial block RAM makes it well suited for protocol bridging, packet processing, and high-throughput DSP pipelines where a hard ASIC would be uneconomical at low volumes. When designing with this device, engineers must allocate sufficient PCB layers (typically 10+ layers) to route the BGA-780 breakout and maintain signal integrity on the transceiver channels. Thermal management must account for the worst-case junction temperature under full transceiver utilization, and power estimation in Quartus II should be run early to size decoupling and the regulator tree correctly. This page synthesizes distributor availability, drop-in package-compatible Stratix II GX speed-grade and temperature-grade variants, and practical design notes not consolidated on any single manufacturer or distributor page.
EP2SGX30DF780I3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Intel
The Intel EP2SGX30DF780I3N is a Stratix II GX family field-programmable gate array (FPGA) built on a 90 nm CMOS process, delivering 33,880 logic elements, 33,380 logic cells, and a maximum core clock frequency of 622.08 MHz (816.9 MHz internal) in a 780-ball plastic fine-pitch BGA (FBGA-780) package at 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and embedded resources such as transceivers, memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), enabling parallel hardware customization that microcontrollers and DSPs cannot match in throughput. Key features include embedded high-speed transceivers up to 6.375 Gbps, dedicated DSP blocks for fixed- and floating-point arithmetic, up to 1.4 Mbits of on-chip TriMatrix memory, support for external memory interfaces including DDR2/QDRII+/RLDRAM II, and 361 user I/O pins. The device also includes 8 PLLs for clock synthesis and skew management, hot-socketing support, and SEU detection for soft-error mitigation in mission-critical systems. The Stratix II GX architecture uses an adaptive logic module (ALM) fabric that improves effective logic utilization versus older 4-LUT architectures. Combined with the embedded transceivers, this makes the EP2SGX30DF780I3N suitable for protocol bridging, baseband processing, and packet classification in line-card and backplane designs. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe, Serial RapidIO), software-defined radio (SDR) baseband engines, video broadcast and imaging pipelines, and telecom line-card protocol termination. The wide transceiver bandwidth also suits test-and-measurement instrumentation such as protocol analyzers and digitizers. When designing with this device, plan thermal dissipation carefully - the FBGA-780 package requires a minimum 4-layer PCB with a continuous ground plane under the die for heat spreading. Quartus II is the supported development environment; ensure the design targets the I3N speed grade and industrial temperature range (-40C to +100C junction). This page synthesizes XAIPART internal pricing, drop-in same-package alternatives, and practical design notes that complement - not duplicate - the manufacturer Stratix II GX Device Handbook.
EP2SGX30DF780I4 - 33,880 Logic Cells Stratix II GX FPGA | Intel
The Intel EP2SGX30DF780I4 is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) with integrated transceivers, delivering 33,880 logic elements, 1,369,728 bits of embedded memory, and 361 user I/O pins in a 780-ball flip-chip BGA package (29x29 mm, 1 mm pitch). It is built on a 1.2 V / 90 nm CMOS process and is specified for the industrial temperature grade of -40C to +85C. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceiver blocks that can be rewired after manufacture to implement arbitrary digital functions. Stratix II GX sits in the hierarchy: FPGA -> programmable logic -> programmable logic device -> integrated circuit, with the GX suffix denoting integrated multi-gigabit transceivers for serial connectivity. Key features of the EP2SGX30DF780I4 include up to 622 MHz internal operation, embedded transceiver blocks supporting SERDES rates commonly used in Stratix II GX, dedicated DSP blocks for high-throughput arithmetic, and a fine-grained ALM (Adaptive Logic Module) architecture that improves logic utilization over previous generations. The device is supported by the Quartus II design toolchain. The architecture uses ALM-based logic elements with Look-Up Table (LUT) cores, true dual-port M4K and M-RAM memory blocks, and embedded 18x18 multipliers. On-chip PLLs provide clock synthesis and skew management, while the integrated transceivers handle physical-layer serialization at line rates up to 6.375 Gbps depending on the protocol profile. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, custom protocol development, ASIC prototyping, and digital signal processing where transceiver density matters. The 780-ball FC-FBGA package supports the high I/O count and transceiver bandwidth the device provides. When designing with this part, plan power integrity carefully - Stratix II GX devices draw substantial current through multiple rails. Use Quartus II PowerPlay early estimates to size decoupling and thermal solution; verify I/O bank VCCIO assignments match your LVDS/SSTL/LVCMOS signaling before PCB layout. This page combines distributor pricing, same-family Stratix drop-in alternatives, and design notes that go beyond what is summarized on manufacturer or distributor product pages.
EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel
The Intel EP2SGX30DF780I4N is a high-density Stratix II GX family field-programmable gate array (FPGA) delivering 33,880 logic elements, 361 user I/O pins, and integrated 3.125 Gbps transceivers, housed in a 780-pin FBGA package measuring 29 mm x 29 mm with 1 mm ball pitch. Built on a 90 nm CMOS process and operating from a nominal 1.2 V core supply, the device reaches internal clock frequencies up to 622 MHz with maximum clocking capability rated at 717 MHz, placing it among the high-performance transceiver-bearing FPGAs of its generation. A field-programmable gate array (FPGA) is a reconfigurable semiconductor containing programmable logic blocks, routing channels, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit between fixed-function ASICs and software-programmable processors: they deliver ASIC-level parallelism with the ability to be reconfigured in-circuit. Within the power-management and embedded hierarchy, FPGAs are commonly classified as programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family is a transceiver-equipped sub-family of Stratix II, optimized for serial connectivity protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and SerialLite. Key features of the EP2SGX30DF780I4N include 33,880 logic elements, integrated multi-gigabit transceivers, dedicated DSP blocks for signal processing acceleration, embedded TriMatrix block RAM, support for multiple I/O standards including LVDS, and a -40C to +85C industrial operating temperature range. The "I4" speed grade and industrial temperature suffix make the part suitable for harsh-environment deployments, while the FBGA-780 package provides high-density interconnect for high-pin-count I/O and memory expansion. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) which combines fracturable look-up tables, adders, and registers into an 8-input equivalent block, improving logic packing density compared with the original Stratix family. The transceiver blocks support multiple protocols, while the surrounding fabric delivers fine-grained parallelism for DSP, packet processing, and bus interfacing. Typical applications for the EP2SGX30DF780I4N include telecommunications line cards, base-station signal processing, high-speed serial interface bridging, radar and sonar front-end processing, and industrial imaging pipelines. The transceiver-rich feature set particularly suits any design moving parallel data over a small number of high-speed serial lanes. When designing with this device, engineers must follow Intel/Altera's power-rail sequencing guidance and provide adequate decoupling on every VCC and VCCIO rail; the FBGA-780 package also requires multi-layer PCB stack-up with controlled-impedance traces for the transceiver channels.
EP2SGX30DF780I4NK - Stratix II GX FPGA 33.8K LE 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX30DF780I4NK is a Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 33,880 logic elements, 1,369,728 bits of embedded memory, and up to 361 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. The device is fabricated on a 90 nm process, operates from a nominal 1.2 V core supply, and supports a maximum internal clock frequency of 717 MHz. A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic function is defined after manufacture by the customer rather than at the foundry, sitting in the taxonomy of programmable logic devices (PLD) → FPGA → high-density FPGA. Stratix II GX devices extend this taxonomy by embedding multi-gigabit transceivers alongside the programmable fabric, targeting high-speed serial I/O for line cards, video bridging, and wireless baseband processing. Understanding the role of the FPGA class clarifies why parts such as EP2SGX30DF780I4NK are specified by logic-element count, memory block count, transceiver count, and package ball map rather than by a fixed function name. Key features of the EP2SGX30DF780I4NK include 1,694 logic array blocks (LABs) with adaptive logic module (ALM) architecture, 1,369,728 bits of embedded RAM arranged as TriMatrix memory blocks, four phase-locked loops (PLLs), and embedded high-speed transceivers capable of multi-gigabit operation. Industrial temperature grade (-40 °C to +100 °C) is indicated by the 'I' suffix, while 'N' denotes a lead-free / RoHS-compliant package and 'K' designates a specific speed grade or feature set per the Stratix II GX ordering code. Architecturally, Stratix II GX devices pair the ALM-based logic fabric with dedicated transceiver circuitry, supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 780-pin FC-FBGA with 1 mm ball pitch provides the routing density required for hundreds of user I/Os and multiple transceiver channels, while keeping the die-to-package electrical path short enough for multi-gigahertz signalling. Typical applications include high-speed serial interface bridging, telecommunications line-card backplanes, video broadcast infrastructure, military radar signal processing, and wireless baseband prototyping. Industrial temperature grade makes the EP2SGX30DF780I4NK suitable for outdoor telecom cabinets, factory automation controllers, and other non-thermally-controlled environments. When designing with this device, ensure the Quartus II design software version supports Stratix II GX (Quartus II v9.1 or later with appropriate service packs), and verify that PCB layout accommodates the 1 mm pitch BGA escape routing. Power-supply sequencing must respect the 1.2 V core, 3.3 V I/O, and transceiver supply rails, including proper PLL filtering. This page synthesizes distributor stock and pricing data, drop-in and same-family Intel Stratix II GX alternatives, and practical design notes that go beyond the manufacturer datasheet table.
EP2SGX30DF780I5N - 33,880 Cell Stratix II GX FPGA, FC-FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX30DF780I5N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) with 33,880 logic cells (33,380 logic elements) and 33880 Logic Array Blocks (LABs), built on a 90 nm CMOS process and housed in a 780-ball Fine-pitch Flip-Chip BGA package (FC-FBGA-780, 29 x 29 mm, 1 mm pitch). The device integrates up to 622.08 MHz internal clock frequency logic with embedded transceivers optimized for high-speed serial I/O, a core supply of 1.2 V, and industrial-grade -40C to +85C operating range. The "I5" speed grade and industrial temperature suffix make it suitable for harsh-environment networking, broadcast video, and defense applications. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs occupy the top of the programmable-logic hierarchy, sitting above CPLDs (which are simpler, lower-density, non-volatile devices) and below fixed-function ASICs in terms of integration density. The Stratix II GX architecture specifically embeds high-speed serial transceivers for protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, enabling single-chip implementation of multi-gigabit serial interfaces without external PHYs. Key features of the EP2SGX30DF780I5N include 33,880 logic cells, multiple embedded transceivers supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput signal processing, abundant block RAM for buffering and packet storage, and the fine-pitch 29 mm FC-FBGA package for high signal integrity on dense multi-layer PCBs. Its industrial temperature grade and I5 speed grade place it in the higher-performance tier of the Stratix II GX family, well-suited to networking line cards, basestation baseband, and high-end test equipment. Typical applications include high-speed serial protocol bridging (PCI Express to Gigabit Ethernet, Serial RapidIO switching), DSP co-processing for radar, software-defined radio, telecom muxponders, and ASIC prototyping. Industrial-grade parts are also commonly used in long-life-cycle embedded systems such as avionics, defense radios, and process-control networking modules. When designing with this part, plan for multi-layer PCB stack-up with controlled-impedance serial channels, ample decoupling around the 780 BGA balls, and a Quartus II design flow with the Stratix II GX device library. Power sequencing, JTAG configuration, and thermal dissipation through the flip-chip BGA should be validated before high-volume release.
EP2SGX30DF780I7N - Stratix II GX 30K LEs FPGA | Intel | 780-BGA
The Intel EP2SGX30DF780I7N is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package, integrating approximately 33,880 equivalent logic elements (LEs), 136,9728 bits of embedded memory, and dedicated 3.125 Gbps multi-gigabit transceivers (MGTs). Built on a 90 nm process with a 1.2 V core voltage, this device targets high-speed serial I/O, embedded processing, and DSP-intensive applications such as basestation line cards, video broadcast, and high-end test equipment. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O via a hardware description language (HDL) after manufacture. Stratix II GX belongs to Intel's (formerly Altera's) high-performance programmable logic hierarchy: FPGA -> programmable logic device -> semiconductor IC. The GX suffix designates the transceiver-enabled variant, distinguishing it from the logic-only Stratix II family and the lower-cost Cyclone series. FPGAs sit between ASICs and microcontrollers in design flexibility, offering ASIC-class throughput with microcontroller-class time-to-market. Key features of the EP2SGX30DF780I7N include up to 16 full-duplex multi-gigabit transceivers supporting CPRI, OBSAI, XAUI, PCIe, and Serial RapidIO protocols, on-chip TriMatrix memory of up to 1.37 Mbit distributed across M512, M4K, and M-RAM blocks, and up to 364 18x18 multipliers for DSP. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with up to 586 user I/O pins in this 780-pin BGA. The architecture combines adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient implementation of combinational and registered logic. Each ALM contains two adaptive LUTs, two programmable registers, and dedicated arithmetic carry chains, giving the device up to 33,880 LEs while improving logic utilization by roughly 25% versus the previous Stratix generation. The embedded transceivers operate from 600 Mbps to 3.125 Gbps with built-in PCS functions for 8B/10B encoding. Typical applications include wireless infrastructure (W-CDMA, LTE baseband processing), high-definition video editing systems, broadcast routers using HD-SDI or DVB-ASI, radar and signal-intelligence front-ends, PCI Express endpoint and root-complex designs, and serial RapidIO backplanes. The integrated transceivers eliminate the need for external PHY ICs in designs that previously required companion Gigabit Ethernet or XAUI chips. When designing with this device, pay close attention to power-rail sequencing, PCB stackup for BGA breakout, and thermal management. The 780-pin BGA requires at least a 6-layer PCB with controlled-impedance routing for the MGT differential pairs. JTAG and Active Serial configuration via EPCS16 or EPCS64 flash must be planned early; in-system programming through the JTAG header is recommended for prototype bring-up.
EP2SGX30F780C3N - Stratix II GX FPGA, 33.8K LE, 780-FBGA | Altera
The Altera (Intel) EP2SGX30F780C3N is a high-performance Stratix II GX Field-Programmable Gate Array (FPGA) featuring 33,880 logic elements, 1,369,728 bits of embedded RAM, and 361 user I/O pins, housed in a 780-ball FineLine BGA (29x29 mm) surface-mount package. It operates at a core voltage of 1.2 V with 90 nm process technology and a maximum internal frequency of 816.9 MHz, delivering industry-leading transceiver-based signal processing for high-bandwidth serial I/O applications. A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic functions through SRAM-based configuration cells. FPGAs belong to the broader hierarchy of programmable logic devices (PLD), which itself is a branch of digital integrated circuits and ultimately a category of semiconductors. The Stratix II GX family is positioned at the upper tier of FPGA performance, integrating multi-gigabit transceivers directly onto the die to support protocols such as PCI Express, Serial RapidIO, XAUI, and 10 Gigabit Ethernet without external PHY chips. Key features of the EP2SGX30F780C3N include integrated transceiver channels running up to 6.375 Gbps, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 embedded transceivers arranged in quads, and a flexible logic structure with adaptive logic modules (ALMs) that replace the legacy 4-input LUT architecture of prior Stratix generations. Memory interfaces include external DDR2 support and on-chip TriMatrix memory with true dual-port and FIFO modes. Technically, the device is built on a 1.2 V core with 0.9 V PLL supply and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL across 16 I/O banks. Configuration is handled through passive serial, fast passive parallel, or JTAG modes, with built-in error detection via the CRC circuit and on-chip bitstream decryption for IP protection using 128-bit AES. Typical applications include 10G Ethernet line cards, wireless baseband processing, high-speed serial backplane bridging, broadcast video processing, and military/aerospace signal intelligence platforms where integrated transceivers reduce BOM and PCB area. The 780-FBGA package suits production hardware where thermal management uses forced-air or heatsink thermal solutions. Design consideration: route all 12 transceiver channels with controlled-impedance differential pairs (100 ohm differential) and keep lengths matched within the budget specified by the Quartus II transceiver toolkit. Use the Altera soft-copy transceiver macros from the IP library rather than designing your own PMA layer. This page consolidates distributor pricing, drop-in alternatives within the Stratix II GX family, and engineering design notes specific to the EP2SGX30F780C3N - information not aggregated on the manufacturer datasheet alone.
EP2SGX30FG780C7 - Stratix II GX 30K LEs FPGA with 4.6G Transceivers | Altera
The Altera (now Intel FPGA) EP2SGX30FG780C7 is a Stratix II GX family FPGA featuring approximately 33,880 equivalent logic elements, 2.1 Mbits of embedded RAM, and 4 embedded transceivers operating up to 6.375 Gbps, housed in a 780-pin FineLine BGA (FG780) package at the C7 speed grade (commercial, ~7 ns core logic delay class). This device integrates high-speed serial I/O alongside DSP blocks and TriMatrix memory, making it well suited for high-bandwidth wired communication, signal processing, and protocol bridging systems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hard IP such as transceivers, multipliers, and clock management circuitry. FPGAs occupy a position in the system hierarchy above general-purpose microcontrollers but below ASICs in non-recurring engineering cost, providing hardware-timed parallelism and reconfigurability. The Stratix II GX family specifically targets applications that combine parallel logic with multi-gigabit serial links, positioning it within the power-management and signal-chain ecosystem as a glue-and-processing layer. Key features include 33,880 logic elements, 192 (18x18) multipliers, 2.1 Mbits of TriMatrix embedded memory arranged as M512/M4K/M-RAM blocks, 364 user I/O pins, 4 multi-gigabit transceivers supporting up to 6.375 Gbps with support for PCI Express, Serial RapidIO, XAUI, and CEI-6G protocols, and dedicated clock management PLLs. The device operates from a 0.85 V core supply with separate transceiver, I/O, and auxiliary supplies. The EP2SGX30FG780C7 is fabricated on a 90 nm process with a copper interconnect stack and uses Altera's Adaptive Logic Module (ALM) architecture, which provides 8-input fracturable look-up tables delivering improved logic packing efficiency versus the older ALM-free Stratix ALUT architecture. Hard PCIe and CDR blocks allow simultaneous multi-protocol serial connectivity without consuming soft logic. Typical applications include PCI Express endpoint and root-complex designs, Serial RapidIO bridges for wireless baseband cards, XAUI-based 10G Ethernet aggregation, SD/HD-SDI broadcast video processing, and high-speed data acquisition backplanes. The 780-pin BGA package provides ample signal density for fan-out without requiring complex stacked-die solutions. When designing with the EP2SGX30FG780C7, plan signal integrity carefully - the 6.375 Gbps transceivers demand controlled-impedance differential routing with length matching inside ~5 mils and a 100-ohm differential reference. Use Altera's Quartus II design suite (legacy, Stratix II supported up to v13.x) for synthesis, place-and-route, and timing closure. This page consolidates distributor availability, drop-in FG780 alternatives within the Stratix II GX family, and Stratix II GX transceiver design notes not typically present in a single datasheet excerpt.
EP2SGX60CF484I4 - 60K LEs Stratix II GX FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP2SGX60CF484I4 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 2,544,192 bits of embedded memory, and 291 user I/Os in a 484-ball FineLine BGA (FBGA) package. Built on a 90 nm process and operating from a 1.2 V core supply, the device integrates up to 12 transceiver channels capable of multi-gigabit serial I/O, making it a turnkey solution for high-speed serial connectivity in communications, video broadcast, and storage systems. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together through a programmable interconnect fabric. FPGAs belong to the broader category of programmable logic devices (PLDs) within the Integrated Circuits > FPGA & CPLD family, and they sit alongside ASICs and microcontrollers as the three principal silicon platforms for digital hardware design. The Stratix II GX family specifically adds embedded transceivers, extending the general-purpose FPGA concept into serial-link-centric applications where ASIC-equivalent bandwidth would otherwise require months of custom design. Key features of the EP2SGX60CF484I4 include 3,022 Logic Array Blocks (LABs), 4 DSP blocks for hardware-accelerated multiplication, internal clock frequencies up to 732.1 MHz, and 12 full-dupelt mode dedicated transceivers supporting standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. The 23 x 23 mm 1.0 mm-pitch FBGA-484 package provides sufficient perimeter I/O for parallel external memory buses while keeping the ball array compatible with mainstream PCB manufacturing. The architecture combines ALM-based adaptive logic modules with TriMatrix embedded memory, allowing designers to trade logic density against block-RAM depth on a per-need basis. Hard IP blocks for transceivers, PLLs, and the DDR memory controller offload timing-critical tasks from the programmable fabric, freeing logic resources for user-defined processing and protocol stacks. Typical applications include wireless baseband processing, video broadcast encoding and routing, serial-backplane switching, high-speed data acquisition, and defense signal intelligence platforms. The combination of 12 transceivers and abundant parallel I/O makes the EP2SGX60CF484I4 especially attractive for line-card designs that must bridge multiple SERDES links to a parallel fabric. When designing with this device, plan the FPGA-to-transceiver channel allocation and reference-clock distribution up front, because the GX transceivers require precise 100-ohm differential layout and dedicated PLL blocks. Industrial temperature grade (I4 suffix) operation is qualified to -40 C to +100 C ambient, so verify your thermal design against worst-case power from all active transceivers. This page synthesizes distributor stock and pricing, package-compatible drop-in alternatives, and practical design guidance not found in the Altera datasheet alone, helping engineers validate sourcing and reuse options before committing to a new design.
EP2SGX60CF780C - Stratix II GX FPGA, 60K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C is a member of the Stratix II GX family of high-performance FPGAs with embedded transceivers, offering 60,440 equivalent logic elements and 2,544,192 bits of embedded memory in a 780-ball FineLine BGA package. The Stratix II GX architecture combines an adaptive logic module (ALM) fabric with up to 20 multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it a drop-in fit for SERDES-based backplane, chip-to-chip, and protocol bridge designs. A Field Programmable Gate Array (FPGA) is a programmable logic device whose logic fabric, routing, and I/O cells can be reconfigured after manufacture, allowing hardware engineers to implement custom digital circuits without fabricating an ASIC. The Stratix II GX sits in the broader hierarchy: programmable logic -> FPGA -> high-speed transceiver FPGA -> wireline/protocol-bridge class. It targets applications where deterministic latency and high SERDES bandwidth are required and where ASIC NRE cost is not justified. Key features of the EP2SGX60CF780C variant include 364 user I/O pins supporting numerous single-ended and differential I/O standards, 60440 logic elements in the standard -C (commercial) speed grade, an FCBGA package optimized for high pin-count high-speed routing, and a hard PCI Express and SERDES block. Compared with the Cyclone series, the Stratix II GX offers roughly 4x the logic density, embedded transceivers, and richer DSP block resources. The Stratix II GX architecture uses an 8-input ALM with a built-in register, a hierarchical memory subsystem (TriMatrix), and dedicated SERDES hard IP for protocols such as PCI Express, XAUI, SATA, and Serial RapidIO. The embedded transceivers reduce board area and simplify PCB layout versus FPGA-plus-discrete-SERDES solutions. Typical applications include high-speed serial backplanes, telecommunications line cards, data-center protocol bridges (e.g., XAUI to SGMII), broadcast video routers, and high-performance computing interconnects. The 780-ball FCBGA supports the high-density differential SERDES routing required by these designs. When designing with this device, follow Altera application notes AN-558 and AN-525 for multi-gigabit transceiver PCB layout - keep SERDES traces length-matched within 150 mils, maintain a continuous reference plane, and use 100-ohm differential impedance. Power sequencing on the Stratix II GX family is critical; consult the device handbook for VCCINT/VCCPD ramp order. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with all values cross-checked against the Intel/Altera Stratix II GX Device Handbook.
EP2SGX60CF780C3 - Stratix II GX FPGA, 60K LE, 780-BGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C3 is a high-density Stratix II GX family Field-Programmable Gate Array delivering 60,440 logic elements (3022 LABs) with embedded transceivers, packaged in a 780-pin FineLine BGA at 1.2V core. The Stratix II GX family combines a 90 nm CMOS process with a flexible Adaptive Logic Module architecture, targeting high-speed serial I/O, memory-intensive DSP, and high-performance logic designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O serdes are all programmable after manufacture. FPGAs sit alongside microcontrollers and ASICs in the programmable logic hierarchy, but unlike microcontrollers they offer fully parallel data paths and deterministic latency; unlike ASICs they require no mask set and ship in days rather than months. Within the Stratix II GX family, the SGX60 tier adds multi-gigabit transceivers (up to 6.375 Gbps) for protocols such as PCIe, Serial RapidIO, and custom SERDES links. Key features of the EP2SGX60CF780C3 include 60,440 logic elements, 2,544,192 bits of on-chip RAM (approximately 317 KB), 364 user I/Os, and a 780-ball FineLine BGA package at 29 mm x 29 mm body size with 1 mm ball pitch. The part is offered in the commercial speed grade C3 and supports operating junction temperatures in the commercial range. Stratix II GX devices also embed hard IP for PCI Express x1/x4 and external memory interfaces including DDR2 SDRAM and QDR II SRAM controllers. The architecture combines 4-input ALMs (Adaptive Logic Modules) replacing the older 4-input LUT, with column-and-row routing using MultiTrack interconnect, and dedicated multiplier blocks, all clocked by up to 12 PLLs. Internal performance supports frequencies up to the device's Fmax rating as published in the datasheet speed-grade tables. The 780-FBGA footprint is shared with other Stratix II GX density points, allowing a single PCB layout to support density migration. Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, XAUI, SDI video), telecommunications line cards, test and measurement equipment with parallel DSP pipelines, and prototyping for ASIC replacement. The transceivers make this part especially attractive for any system that previously required a separate PHY chip. When designing with the EP2SGX60CF780C3, ensure adequate power decoupling near every bank and observe the Stratix II GX PowerPlay early-power-estimate flow before layout commit. Because the Stratix II GX family has been superseded by Stratix IV/V and the Intel Cyclone 10/Agilex families for new designs, this part is most commonly sourced for legacy maintenance and long-lifecycle programs. This page synthesizes distributor pricing, verified drop-in alternatives (same 780-FBGA footprint, same SGX60 die where applicable), and practical PCB/thermal design notes that go beyond the manufacturer datasheet's electrical tables.
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C3N is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 364 user I/O pins, and up to 2,544,192 bits of embedded memory, housed in a 780-ball FineLine BGA (FBGA-780, 29 mm x 29 mm, 1.0 mm pitch) package. It is fabricated on a 90 nm CMOS process, operates from a 1.2 V core supply, and supports internal clock frequencies up to 816.9 MHz (per datasheet) / 717 MHz (per alternate source listings). The device integrates up to 12 transceiver channels rated to 6.375 Gbps, making it the original Altera GX-tier platform for high-speed serial I/O. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, high-speed transceivers, and a programmable interconnect fabric on a single die. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) and digital semiconductors, parallel to ASICs but offering post-fabrication reprogrammability. The Stratix II GX family specifically targets applications requiring both high-density logic and multi-gigabit serial transceivers, positioning it between general-purpose FPGAs and full ASICs in terms of integration and cost. Key features include 60,440 logic elements, approximately 2.5 Mbit of embedded RAM (M4K/M-RAM blocks), dedicated 18-bit x 18-bit DSP blocks, 12 full-duplex transceiver channels at data rates up to 6.375 Gbps supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G, plus 8 clock PLL blocks with regional and global clock networks. The 780-ball FC-FBGA package exposes the full set of 364 user I/O pins alongside transceiver reference clocks and high-speed serial pins. Architecturally, Stratix II GX uses an ALM-based logic element with adaptive look-up tables (LUTs) operating at 1.2 V core, with dedicated circuitry for source-synchronous memory interfaces (DDR/DDR2/QDR) and 8B/10B-encoded serial links. The 90 nm process and on-chip signal-integrity features (dynamic phase alignment, pre-emphasis, equalization) enable the transceiver channels to close links at gigabit rates on standard FR-4 backplanes. Typical applications include high-speed serial interface bridging (PCI Express endpoints, XAUI-to-XAUI backplanes), telecom line cards (OC-48/STM-16 aggregation), military and aerospace signal processing, broadcast video routers with SDI/HD-SDI serial I/O, and ASIC prototyping where designers need verified 6 Gbps SerDes plus 60K logic elements. When designing with EP2SGX60CF780C3N, pay close attention to transceiver reference-clock jitter and power-rail decoupling - the 1.2 V VCC, 2.5 V VCCAUX, and 3.3 V VCCPD planes each require bulk and ceramic bypass capacitors placed within 100 mils of their respective balls. Quartus II (legacy, version 9.0 and earlier) is the supported development environment. This page synthesizes distributor stock, verified drop-in alternatives from the Stratix II GX family, and practical design considerations not found in a single distributor listing.
EP2SGX60CF780C4 - Stratix II GX FPGA 60K LE 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60CF780C4 is a member of the Stratix II GX family of high-performance field-programmable gate arrays (FPGAs) featuring 60,440 logic elements, 364 user I/O pins, integrated transceivers, and 2,544,192 bits of embedded memory. Built on a 90 nm process technology with a 1.2 V core supply, the device operates at internal clock frequencies up to 732.1 MHz and is housed in a 780-ball fine-pitch flip-chip BGA (FC-FBGA) package. The C4 speed grade and commercial temperature rating make it suited to mainstream wired-communication, video-broadcast, and high-throughput data-acquisition designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that engineers configure after manufacture to implement arbitrary digital circuits. Within the broader semiconductor taxonomy, FPGAs sit between fixed-function ASICs and software-defined processors, offering hardware-level parallelism with reprogrammability. The Stratix II GX family specifically targets designs that require multi-gigabit serial transceivers alongside general-purpose logic, combining high-speed SERDES channels with a rich fabric of adaptive logic modules (ALMs), TriMatrix embedded memory blocks, and DSP blocks for high-throughput arithmetic. Key features of the EP2SGX60CF780C4 include a 60440-logic-element fabric arranged in 3,022 LABs/CLBs, embedded 18x18 multipliers grouped into DSP blocks, dedicated high-speed transceivers that support protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, and on-chip phase-locked loops (PLLs) for clock synthesis and management. The 780-ball FC-FBGA package provides a 1 mm ball pitch and a 23 x 23 mm body, enabling high pin density for the 364 user I/O pins while supporting the integrated transceiver channels. From an architectural standpoint, the Stratix II GX uses Altera's ALM-based logic fabric, which improves effective logic utilization versus traditional 4-input LUT architectures. Combined with the 90 nm process and 1.2 V core, the design balances static power, dynamic performance, and signal-integrity margin for multi-gigabit serial I/O. Internal memory totals approximately 2.5 Mb, and dedicated hard IP blocks accelerate memory interfaces, packet processing, and DSP pipelines without consuming fabric resources. Typical applications for the EP2SGX60CF780C4 include high-speed serial interface bridging, telecommunications line cards, video processing and broadcast equipment, ASIC prototyping, and high-bandwidth test and measurement. Engineers select this part when a design needs both substantial programmable logic and integrated multi-gigabit transceivers on a single die, reducing board complexity versus a two-chip FPGA plus external PHY solution. When designing with this device, pay close attention to the Stratix II GX transceiver reference clock architecture, signal-integrity requirements for the FC-FBGA breakout, and the Quartus II power estimation flow. Use the Stratix II GX FPGA Development Kit schematics and Altera application notes for board-layout guidance, especially the multi-gigabit transceiver channel rules for the FC-FBGA package. This page synthesizes distributor pricing, drop-in alternatives in the same 780-ball FC-FBGA package, and practical design notes not always gathered in one place on the manufacturer datasheet. The information is structured for engineers evaluating the EP2SGX60CF780C4 for new designs or as a drop-in replacement on existing Stratix II GX board layouts.
EP2SGX60CF780C4N - 60K LEs Stratix II GX FPGA | Intel | 780-BGA
The Intel (formerly Altera) EP2SGX60CF780C4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 3,022 LABs/CLBs, and 2,544,192 bits of embedded memory, housed in a 780-ball FineLine BGA (FC-FBGA) package. The device integrates up to 12 transceiver channels supporting 6.375 Gbps operation and is built on a 90 nm process technology with 1.2 V core supply. What is an FPGA? A Field Programmable Gate Array is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the hierarchy of programmable logic: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit to implement custom digital logic, DSP pipelines, and high-speed serial interfaces, making them ideal for prototyping, low-volume production, and designs that need to evolve post-deployment. Key features of the EP2SGX60CF780C4N include 364 user I/Os, support for numerous single-ended and differential I/O standards (LVDS, LVPECL, SSTL, HSTL, LVCMOS), embedded multipliers, and dedicated DSP blocks. The Stratix II GX family adds hardened multi-gigabit transceivers, making this device particularly suited for serial connectivity. Internal performance reaches up to 732 MHz and the device supports 1.2 V core operation with 717 MHz propagation delay characteristics. The device uses a 90 nm CMOS process with embedded SRAM configuration memory, supporting in-system programmability via JTAG or passive/active serial configuration schemes. Its 780-ball FC-FBGA package (23 x 23 mm, 1 mm pitch, MS-034AAJ-1) exposes up to 20 full-duplex transceiver channels in larger family members and provides ample signal integrity for multi-gigabit serial links. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), communications infrastructure, broadcast video processing, military and aerospace signal processing, and high-performance DSP prototyping. The C4 speed grade in the operating temperature range is intended for commercial (0C to 85C) ambient conditions. When designing with this device, careful attention must be paid to power distribution, decoupling, and PCB layer stack-up. The FC-FBGA-780 package requires a minimum of 6 PCB layers with controlled-impedance routing for high-speed transceivers. Quartus II design software (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and AI-citable FAQ answers to help engineers select, source, and integrate the EP2SGX60CF780C4N into next-generation high-speed digital systems.
EP2SGX60CF780C5 - Stratix II GX FPGA 60K LE 780-BGA | Intel / Altera
The Intel (formerly Altera) EP2SGX60CF780C5 is a Stratix II GX family field-programmable gate array (FPGA) integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 364 user I/Os in a 780-ball flip-chip BGA (FC-FBGA) package. It is built on a 90 nm process node, operates from a 1.2 V core supply with a maximum internal frequency near 717 MHz, and adds up to 20 embedded transceivers supporting multi-gigabit serial I/O for high-speed serial connectivity. The 'C5' speed grade and 'C' commercial temperature rating position it for cost-sensitive prototyping and production in non-extended-temperature environments. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device belonging to the hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. FPGAs sit above standard logic ICs in capability, allowing designers to implement arbitrary digital circuits after PCB fabrication. Within the broader IC taxonomy, the Stratix II GX family targets high-performance digital signal processing, telecom baseband, and serial-interface bridging, sitting between ASICs (higher NRE cost, lower unit cost) and CPLDs (simpler, lower-density glue logic). Key technical features include 60,440 logic elements organized into 3,022 logic array blocks (LABs), 2,544,192 bits of embedded SRAM (M512/M4K/M-RAM blocks), up to 4 enhanced PLLs plus 8 fast PLLs, and dedicated DSP blocks for high-throughput multiplication and accumulation. The device supports configuration via passive serial, fast passive parallel, or JTAG schemes, and offers built-in signal-integrity features for source-synchronous memory interfaces including DDR/DDR2 SDRAM controllers. The architecture uses an adaptive logic module (ALM) structure that is more efficient than the previous Stratix ALM, packing up to 6 inputs into each ALM. Combined with routing efficiency improvements, this delivers roughly 50% higher logic density per area than the prior Stratix generation while maintaining timing closure on multi-megahertz designs. TriMatrix embedded memory and a high-bandwidth interconnect fabric make the part suitable for data-path-heavy designs such as packet processing, video pipelines, and multi-channel DSP. Typical applications include 10 Gbps optical-transport networking line cards, PCI Express endpoint or root-complex bridges, multi-channel serial-digital-interface (SDI) video routers, software-defined radio baseband preprocessing, and high-speed data-acquisition front-ends. The combination of embedded transceivers and rich logic capacity allows a single device to replace multiple ASSPs plus glue logic on the same board. When designing with this part, ensure a robust decoupling network (typically 0.1 uF and 10 uF ceramic capacitors per power rail) is placed as close as possible to the BGA balls to manage simultaneous switching noise. The 780-ball FC-FBGA package demands at least a 6-layer PCB with controlled-impedance routing and microvia or via-in-pad technology; standard 0.1 mm laser-drilled microvias are commonly used. Confirm Quartus II software support and licensing for the C5 speed grade before starting the design cycle. This page aggregates distributor pricing, package-level engineering data, and Stratix II GX family context beyond what is found on any single manufacturer or distributor page, helping engineers quickly assess the EP2SGX60CF780C5 for new designs or legacy inventory support.
EP2SGX60CF780C5N - Stratix II GX FPGA, 60K LE, 6.375 Gbps SERDES | Intel
The Intel / Altera EP2SGX60CF780C5N is a Stratix II GX FPGA from Intel's third-generation FPGA family that integrates high-speed serial transceivers with a scalable, high-performance logic fabric. The device delivers 60,440 logic elements (60K LE), 2,544,192 bits of embedded RAM (approximately 2.5 Mbit), 364 user I/Os, and 20 high-speed transceiver channels capable of data rates up to 6.375 Gbps with embedded SERDES and clock-data recovery (CDR), housed in a 780-ball FCBGA package. The package measures 29 mm x 29 mm with 1.0 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic functionality is defined by a configuration bitstream loaded after manufacture, as opposed to ASICs whose function is fixed at fabrication. FPGAs occupy the programmable-logic tier of the broader digital semiconductor hierarchy: programmable logic device (PLD) -> FPGA -> system-on-chip FPGA (SoC FPGA). Within the high-performance sub-segment, transceivers (SERDES) -> gigabit transceivers -> multi-gigabit transceivers, the Stratix II GX family sits at the multi-gigabit class. Key features of the EP2SGX60CF780C5N include up to 20 multi-gigabit transceiver channels each incorporating CDR technology, dedicated hardware multipliers for DSP-style arithmetic, embedded TriMatrix memory blocks, support for external memory interfaces including DDR/DDR2/QDRII, and a comprehensive configuration scheme supporting JTAG (IEEE 1149.1) boundary-scan and passive/active serial modes. The logic array is implemented in 90 nm CMOS technology with a 1.15 V to 1.25 V core supply. Typical applications include high-speed serial interface bridging (PCI Express Gen1, Serial RapidIO, Gigabit Ethernet, XAUI), custom protocol development, prototyping of ASIC designs, high-performance DSP datapaths, and telecom equipment line cards. The combination of 60K logic elements and 6.375 Gbps transceivers makes the part suitable for protocol converter bridges, multi-channel SERDES aggregation, and line-rate protocol adaptation. When designing with this part, allocate 1.0 mm ball-pitch PCB routing rules, use multi-layer stack-up with dedicated transceiver reference plane layers, and follow Intel/Altera's Stratix II GX pin connection guidelines for unused transceiver channels. Verify transceiver reference clock jitter against the protocol specification (typically <1 ps RMS for 6 Gbps links). This page synthesizes distributor pricing, pin-compatible Stratix II GX family members, and practical SERDES design considerations not collected in a single place by the manufacturer datasheet.
EP2SGX60CF780C7 - Stratix II GX FPGA, 60K LE, 780-FCBGA | Altera
The Altera (now Intel) EP2SGX60CF780C7 is a member of the Stratix II GX family of high-performance FPGAs, featuring 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, all housed in a 780-ball flip-chip BGA (FCBGA) package. Built on a 90 nm process with a 1.2 V core supply, the device combines a high-density adaptive logic module (ALM) fabric with on-chip DSP blocks and dedicated serial transceiver channels optimized for high-speed serial I/O. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier in the digital design hierarchy that sits between fixed-function ASICs and software-programmable processors: more flexible than an ASIC, far faster and more parallel than a general-purpose MCU. The Stratix II GX family specifically targets high-speed serial connectivity applications where the integrated transceivers and hardened PCS/PMA blocks dramatically reduce design effort for protocols such as PCI Express, Serial RapidIO, Fibre Channel, and Gigabit Ethernet. Key differentiating features of the EP2SGX60CF780C7 include up to 364 user I/O pins, 24 DSP blocks (for 18x18 multipliers and accumulators), 12 transceiver channels supporting data rates from 600 Mbps to 6.375 Gbps, and dedicated on-chip termination for AC-coupled and DC-coupled serial links. The Stratix II GX architecture introduced the ALM, which packs eight inputs into a single LUT-based adaptive logic element, providing roughly twice the logic density of the prior Stratix generation. Hot-socketing support, robust SEU mitigation via CRC-driven configuration, and remote upgrade capability round out the feature set. Typical applications include high-end telecommunications line cards, broadcast video processing, high-performance computing acceleration, and high-speed serial protocol bridging. The integrated transceivers make the device particularly attractive for backplane aggregation, serializer/deserializer (SerDes) replacement, and protocol conversion in routers, switches, and base-station equipment. Designers should note that the 'C7' speed grade is the slowest commercial grade offered; faster 'C5' and 'C6' parts in the same package are drop-in upgrades when timing margins are tight. When designing the PCB, allocate at least four PCB layers with continuous power and ground planes beneath the BGA, follow Altera's recommended decoupling scheme (typically one bulk capacitor per PLL and one per transceiver channel plus 0.1 uF/0.01 uF pairs near every power pin), and observe the FCBGA's 1.0 mm ball pitch land pattern. The high transceiver data rate requires careful attention to channel loss, return loss, and via-stub compensation on the serial links.