FPGA & CPLD
Products (6358)
EP3C25E144I7N - Cyclone III FPGA, 24,624 LEs, 144-LQFP | Intel
The Intel (formerly Altera) EP3C25E144I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP Exposed Pad (EQFP-144) package with industrial temperature grade. The device integrates 24,624 Logic Elements (LEs), 608,256 bits of embedded memory (66 M9K blocks), 66 embedded 18x18 multipliers, and 4 Phase-Locked Loops (PLLs), with 82 user I/Os available in the EQFP-144 package. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductors, sitting between fixed-function ASICs and microcontrollers in design flexibility. Key features of the EP3C25E144I7N include support for up to 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP applications, and 66 M9K memory blocks totaling 608 Kbits. The device operates from a 1.2V core supply with separate bank I/O voltages, and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI/PCI-X. The Cyclone III family is fabricated on a 65nm low-power process, delivering a balance of logic density, performance, and static power efficiency. The architecture consists of Logic Array Blocks (LABs) each containing 16 LEs, with embedded multiplier and memory blocks distributed throughout the fabric. Cyclone III devices also support configuration via serial passive (AS), serial active, and JTAG modes, allowing flexible in-system programming. The integrated PLL blocks provide frequency synthesis, phase shifting, and clock duty-cycle correction for high-speed interfaces. Typical applications include industrial motor control, video processing and image sensor interfaces, low-cost ASIC prototyping, communication protocol bridging (UART, SPI, I2C to LVDS), and embedded DSP functions such as FIR filtering. The Cyclone III family is widely used in cost-sensitive designs requiring moderate logic density and DSP performance. When designing with this device, ensure decoupling capacitors are placed close to every power pin and that JTAG chain integrity is verified before final board assembly. The exposed thermal pad on the EQFP-144 package must be soldered to a sufficient copper area for thermal dissipation and electrical ground return. This page synthesizes distributor pricing, drop-in Cyclone III alternatives in the same EQFP-144 footprint, and practical design notes not consolidated in the manufacturer datasheet alone.
EP3C25F256C8N - Cyclone III FPGA, 24.6K LEs, 256-FBGA | Intel
The Altera (Intel) EP3C25F256C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, packaged in a 256-pin FineLine BGA (FBGA-256) and offered in the commercial 0 to 85 C temperature range with the speed grade 8 designation. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O cells are defined at hardware description language (HDL) compile time and re-programmed in-circuit. FPGAs occupy the middle ground between fixed-function ASICs and software-driven microcontrollers, sitting in the broader taxonomy as programmable logic > FPGA > SRAM-based LUT FPGA > low-power FPGA family. Key features include 156 user I/O pins, four general-purpose phase-locked loops (PLLs) for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII, and 0.25 mW per logic element typical dynamic power consumption. The device operates from a 1.15 V to 1.25 V core supply, supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards, and is offered in a Pb-free 17 mm x 17 mm FBGA package with 1.0 mm pitch. Architecturally, the Cyclone III silicon uses a 60 nm process with a 4-input look-up table (LUT) based logic element, embedded M9K memory blocks, and 18x18 hardware multipliers optimized for digital signal processing (DSP) throughput. The device targets low-cost, high-volume designs where the balance between logic capacity, embedded memory, DSP bandwidth, and unit cost matters more than the highest serial transceiver data rate. Typical applications include industrial motor control, video surveillance and image processing, low-end protocol bridging, consumer display controllers, and entry-level software-defined radio (SDR) baseband processing. The wide I/O bank support also suits mixed-voltage board designs integrating 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals on the same PCB. When designing with this device, allocate sufficient PCB area for the 1.0 mm pitch BGA fan-out, route PLL analog supplies through a ferrite-bead-isolated rail, and configure unused I/O pins per the Cyclone III Hardware Reference to minimize leakage. Quartus II version 7.2 or later is required for synthesis, fitting, and configuration bitstream generation. This page synthesizes distributor pricing, exact-temperature speed-grade alternatives, and practical Cyclone III design notes not consolidated in the manufacturer datasheet, providing an engineer-facing summary for selection and procurement.
EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
The Intel (formerly Altera) EP3C25F256I7N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) housed in a 256-ball FineLine Ball-Grid Array (FBGA) package. The device integrates 24,624 logic elements, 608,256 bits of embedded memory (66 Mbits), 156 maximum user I/O pins, and 66 embedded 18x18 multipliers, fabricated on a 65 nm low-power process and operating from a 1.2 V core supply. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications. Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration up to 156 GMACs, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention. Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends. Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required. When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin. This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.
EP3C25F324C6N - Cyclone III FPGA 25K LE 215 I/O 324-BGA | Intel
The Intel (formerly Altera) EP3C25F324C6N is a Cyclone III family field-programmable gate array (FPGA) featuring 24,624 logic elements, 608,256 bits of embedded memory, and 66 embedded 18x18 multipliers, housed in a 324-ball fine-pitch BGA (FBGA-324) package with 215 user I/O pins. The 'C6' speed grade targets commercial 0C to +85C operation, while the 'N' suffix denotes a lead-free, RoHS-compliant package. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic function is defined by user-loaded configuration bitstreams rather than fixed mask layers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). Cyclone III specifically targets low-cost, low-power, high-volume designs and is fabricated on TSMC's 65 nm low-power process, positioning it between traditional CPLDs and high-end FPGAs in the power/cost/performance envelope. Key differentiating features of the EP3C25F324C6N include four general-purpose PLLs, 66 dedicated DSP blocks (each capable of 18x18 multiply-accumulate operations), support for external memory interfaces including DDR/DDR2/QDRII, and up to 215 user I/O pins arranged across eight I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. The device supports both passive serial and fast passive parallel configuration schemes via industry-standard EPCS or EPCQ flash memories. Architecturally, the Cyclone III device family combines a fabric of logic array blocks (LABs) each containing 16 logic elements, a row/column interconnect mesh, embedded SRAM blocks (M9K), and dedicated multiplier/DSP blocks. The TSMC low-power process and Cyclone III's silicon-level power optimizations deliver static power consumption typically below 100 mW in idle configurations - substantially lower than competing FPGAs in this density range. Typical applications for the EP3C25F324C6N include industrial control and machine vision, automotive infotainment and driver assistance subsystems, low-cost video processing pipelines, software-defined radio front-ends, motor control, and embedded display controllers. Its combination of moderate logic density, generous memory bandwidth, and a small-footprint BGA makes it especially attractive for space-constrained cost-sensitive designs. When designing with this FPGA, plan power sequencing for the VCCINT core rail (1.2 V typical) and the VCCIO bank rails separately, and budget for in-rush current during configuration. Designers should also verify JTAG chain integrity before final board bring-up and use the Quartus II design suite (12.0sp2 or later) with the Cyclone III device library for compilation, place-and-route, and timing closure. This page synthesizes distributor inventory, drop-in compatible Cyclone III variants, and practical PCB power-integrity guidance not found in the standalone manufacturer datasheet, providing engineering value beyond what is available on DigiKey or Mouser product listings.
EP3C25F324C7N - 24,624-Cell Cyclone III FPGA | Intel
Intel EP3C25F324C7N is a Cyclone III field-programmable gate array containing 24,624 logic cells, 608,256 bits of embedded memory, and 215 available I/O pins. The verified data identifies a 437.5 MHz device built on 65 nm technology with a 1.2 V core supply and a 324-ball FBGA package. It is a programmable-logic IC intended for engineers implementing configurable digital logic, interface bridging, control processing, and application-specific signal processing. A field-programmable gate array, or FPGA, is a semiconductor device whose logic functions are defined by configuration rather than fixed internal connections. Its hierarchy extends from programmable logic cells to configurable interconnects, embedded memory, I/O blocks, and a complete programmable-logic IC. Unlike an ASIC, an FPGA can be reprogrammed during development and after deployment. Compared with a fixed microcontroller, an FPGA generally provides parallel hardware execution and finely timed I/O, while trade-offs include higher power consumption, configuration requirements, and more complex implementation software. The principal verified resources are 24,624 logic cells and 608,256 memory bits, with 215 I/O pins available for external connectivity. The 324-ball FBGA package supports a substantial number of package-level connections while using surface-mount assembly. The supplied data also identifies a 437.5 MHz frequency and 65 nm process technology. These resources make the device suitable for datapaths that need more concurrent logic than a small programmable device but do not justify the cost and development cycle of a custom ASIC. Cyclone III architecture combines programmable logic arrays, routing resources, embedded memory, and programmable I/O elements. A design is captured with an FPGA development flow, synthesized into logic, mapped and placed onto available resources, routed through the device interconnect, and then loaded into configuration memory. Engineers must analyze timing closure, power, signal integrity, and configuration implementation together; an apparently efficient register-transfer design can still fail timing if fan-out, routing congestion, or unsuitable I/O constraints are ignored. Typical uses include industrial control, communications equipment, video or imaging preprocessing, test and measurement, and legacy interface emulation. The combination of 24,624 logic cells, 608,256 embedded memory bits, and 215 I/Os is relevant to glue-logic aggregation, protocol conversion, parallel acquisition, and state-machine-rich controllers. For a new high-volume product, however, lifecycle, migration, and total-cost studies are important before committing the design. PCB design should prioritize continuous power distribution, controlled-impedance connections, and clean clock routing. Because the available verified data does not provide detailed electrical limits, pin functions, configuration-interface requirements, thermal limits, or package dimensions, those values must be confirmed from the manufacturer datasheet before schematic release. Do not infer BGA ball assignments from the package name alone. This product page combines verified distributor specifications, availability signals, package context, and transparent engineering notes. Pricing is reported as of 2026-09-09, while distributor stock and lead time remain dynamic. The manufacturer ordering code, package, device family, logic-cell count, embedded memory, I/O count, process node, supply voltage, and frequency are the attributes most useful for initial device selection.
EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel
The Intel (formerly Altera) EP3C25F324C8 is a member of the Cyclone III family of low-power FPGAs fabricated on a 65 nm process, offering 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/Os in a 324-ball FineLine BGA package. It operates from a 1.2 V core supply with separate I/O bank supplies and supports commercial temperature grade (0 °C to +85 °C) at speed grade 8, with a maximum internal clock frequency of approximately 402 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit between fixed-function ASICs and microcontrollers in the digital design hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> low-power FPGA. Cyclone III FPGAs are specifically engineered for cost- and power-sensitive applications, building on the Cyclone architecture with a 65 nm process to reduce static and dynamic power while maintaining sufficient logic density for mid-range designs. Key specifications of the EP3C25F324C8 include 66 embedded 18 x 18 multipliers for DSP workloads, four general-purpose PLLs for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates 24624 logic elements organized as 1539 logic array blocks (LABs), with each LAB containing 16 logic elements. The embedded memory is configurable as RAM, ROM, or FIFO, providing flexible on-chip data buffering without external SRAM. The Cyclone III architecture supports partial dynamic reconfiguration and ships with free Quartus II design software, including IP cores for DDR/DDR2 SDRAM controllers, PCI Express, Ethernet, and common serial protocols. The 324-ball FineLine BGA package measures 19 mm x 19 mm with a 1.0 mm ball pitch, making it compatible with standard multilayer PCB manufacturing. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototypes, low-cost software-defined radio, and bridge/interface glue logic. It is also used as a prototyping vehicle for ASIC verification and as a low-volume production replacement for legacy CPLDs. When designing with this part, attention to simultaneous switching output (SSO) noise and decoupling is critical; the application notes recommend 0.1 µF and 0.01 µF high-frequency capacitors within 100 mils of each power pin. Migration paths include the Cyclone IV E family for cost reduction and Cyclone V for higher logic density. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, supporting faster engineering decisions.
EP3C25F324C8N - 24,624 LEs Cyclone III FPGA, 324-BGA | Intel
The Intel EP3C25F324C8N is a Cyclone III family Field Programmable Gate Array (FPGA) IC integrating 24,624 logic elements, 215 user I/O pins, and approximately 608 Kbits of embedded SRAM in a 324-ball FineLine BGA package. It is built on a low-power 60-nm process and operates with core logic at 1.2 V while supporting multiple I/O standards on its LVDS/LVCMOS/LVTTL banks. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions in silicon by loading a configuration bitstream. In the broader IC taxonomy, an FPGA sits below an ASIC in performance but above a microcontroller in flexibility, making it the workhorse for prototyping, low-volume custom logic, and parallel signal processing in industrial, communications, and test equipment. Key features of the EP3C25F324C8N include 66 embedded 18x18 multipliers for DSP, four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 8 in the suffix indicates the device speed grade, while the C denotes the commercial 0 C to +85 C operating range. Compared with earlier Cyclone generations, this part delivers roughly 4x the logic capacity and significant power-per-LE reductions. Typical applications span industrial motor and motion control, video processing pipelines, software-defined radio front-ends, telecom line cards, and ASIC prototyping platforms where the 215 I/O allow dense glue-logic integration with multiple parallel buses. Designers should plan for JTAG-based configuration via a 10-pin header or Altera USB-Blaster download cable, place at least four 0.1 uF and one 10 uF decoupling capacitor near each power pin group, and consult the Cyclone III device handbook for I/O-bank VCCIO planning. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical board-level design notes not collected in any single datasheet, giving engineers a one-stop reference for sourcing and second-sourcing this part.
EP3C25F324I7 - Cyclone III FPGA, 24624 LEs, 324-FBGA | Intel
The Intel EP3C25F324I7 is a low-power, low-cost Field Programmable Gate Array from the Cyclone® III family, featuring 24,624 logic elements, 608,256 bits of embedded memory, and 215 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a TSMC 65nm low-power process and operates at a core voltage of 1.2 V with maximum toggle performance around 437.5 MHz. The 'I7' speed grade and industrial temperature range (-40°C to +100°C junction) make it suitable for thermally constrained and environmentally demanding designs. A Cyclone III FPGA is a programmable logic device that sits in the broader hierarchy of digital semiconductors (FPGA -> programmable logic -> ASIC alternative -> semiconductor). Unlike fixed-function ASICs, the logic function, memory configuration, and I/O behavior of an FPGA are defined at boot time by a configuration bitstream loaded from external flash, allowing one silicon platform to be reused across many product variants. Cyclone III was specifically engineered to balance logic density, DSP capability (66 embedded 18x18 multipliers), and static power consumption, displacing ASICs and ASSPs in cost-sensitive high-volume applications. Key technical features of the EP3C25F324I7 include 4 PLLs for clock management, 20 global clock networks, 66 embedded 18x18 multipliers, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 1.2 V core draws substantially lower static power than the previous Cyclone II generation, while still offering LVDS, LVPECL, SSTL, HSTL, and LVCMOS I/O standards through 8 I/O banks. Configuration can be loaded via passive serial (PS), active serial (AS), or JTAG, and the device includes built-in CRC and decompression for the bitstream. Typical applications span industrial motor control, video surveillance, automotive infotainment prototypes, low-cost software-defined radio, video processing pipelines, and PCIe endpoint prototyping (using the embedded transceivers in some Cyclone III variants or soft IP cores for GPIO-based implementations). The combination of high logic density and embedded multipliers also suits DSP front-ends such as motor-control FOC loops or multi-channel audio processing. When designing with the EP3C25F324I7, engineers must supply the four power rails (VCCINT, VCCA, VCCIO per bank, VCCD_PLL) with proper decoupling and follow Intel's pin-out guidelines for the FBGA-324 footprint. Quartus II Web Edition provides synthesis, place-and-route, and timing analysis. Note that Cyclone III is now in Intel's product lifecycle as a mature, NRND device, so designers building new platforms should evaluate Cyclone IV/V/E10AX equivalents or pin-compatible successors for long-term availability.
EP3C25F324I7N - Cyclone III FPGA, 24,624 LEs, 324-FBGA | Intel
The Intel (formerly Altera) EP3C25F324I7N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 24,624 logic elements, 608,256 bits of embedded RAM, and 66 embedded 18x18 multipliers in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. It supports up to 215 user I/O pins (66 LVDS pairs) and is rated for an industrial operating temperature range of -40C to +100C, making it well-suited for cost-sensitive, volume-driven designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to implement arbitrary digital logic functions through configurable logic blocks (LBs/LEs), programmable routing, and dedicated hard IP blocks such as memory and DSP. In the programmable-logic taxonomy, FPGAs sit alongside CPLDs as the highest-density user-configurable devices, falling under digital ICs > programmable logic > FPGA > CPLD hierarchy. Cyclone III sits at the low-power, low-cost end of Intel's FPGA portfolio, optimized for ASIC-replacement, glue-logic consolidation, and parallel DSP workloads. Key features include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and configuration via active serial (AS), passive serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The device operates from a 1.2 V core supply and supports I/O bank voltages of 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL). The 1.2 V core and 65 nm process deliver a typical power reduction of up to 50% versus the previous-generation Cyclone II family. The architecture combines LABs (Logic Array Blocks) of 16 LEs each with M9K memory blocks (9 Kbits each) distributed across the fabric, enabling efficient implementation of FIFOs, shift registers, and small ROM/RAM functions. The hard 18x18 multipliers accelerate DSP algorithms such as FIR filters, FFTs, and motor-control loops without consuming general-purpose fabric. Cyclone III's deterministic routing fabric and Quartus II / Quartus Prime design flow support rapid design iteration and proven IP libraries. Typical applications include industrial motor control and factory automation, video processing and image sensor bridging, automotive infotainment and driver-assistance subsystems, telecommunications line cards, and portable medical instrumentation. Its combination of low static power (~100 mW typical) and moderate logic density makes it a strong fit for volume designs where a low-cost CPLD would be too small and a high-end Stratix FPGA would be over-spec. When designing with this device, validate signal-integrity and length-matching rules for DDR2/QSPI interfaces early, and ensure the 1.2 V core rail uses a low-noise LDO (such as an LDO from the LDO regulator family) to meet the core voltage tolerance. Confirm BGA fanout and via-in-pad manufacturing capability with the assembly house before committing the PCB layout. This page synthesizes distributor pricing, drop-in alternatives, comparison data and practical design notes not found on any single manufacturer or distributor page, including a cross-reference comparison with EP3C25F256I7N and EP3C16F484I7N from the same Cyclone III family.
EP3C25Q240C8 - Cyclone III FPGA, 24624 LE | Intel
The Intel (Altera) EP3C25Q240C8 is a 24,624-logic-element Cyclone III FPGA with 608,256 RAM bits and 148 user I/Os, packaged in a 240-pin PQFP/BFQFP. The device has a reported internal operating frequency of about 472 MHz to 472.5 MHz and is identified as a commercial temperature, speed grade 8 version. This QFP package provides a 34.60 x 34.60 mm body, 4.10 mm height, and 0.50 mm pitch, offering a lower assembly cost alternative to BGA packages. An FPGA, or Field Programmable Gate Array, is an integrated circuit whose logic fabric can be configured after manufacturing to implement custom digital circuits. FPGAs sit above ASICs in flexibility and below MCUs in sequential processing convenience: instead of executing software instructions, an FPGA creates parallel hardware logic such as counters, state machines, DSP datapaths, memory controllers, and bus interfaces. The EP3C25Q240C8 belongs to the Cyclone III family, which is optimized for low-cost, high-volume applications requiring substantial programmable logic with moderate power consumption. Key verified parameters include 24,624 logic elements, 608,256 total RAM bits, 148 user I/O signals, a 240-lead PQFP/BFQFP package, and a maximum internal frequency of approximately 472.5 MHz. These values are captured from distributor and datasheet-aggregator listings. The 240-pin package supports enough external connections for broad interfacing while remaining routeable on conventional low-cost multilayer PCBs. The 0.50 mm lead pitch and 34.60 x 34.60 mm body allow standard surface-mount assembly equipment to be used throughout production. Cyclone III devices implement their programmable fabric using look-up-table-based logic elements, dedicated memory blocks, and embedded multiplier resources. In this EP3C25 density, the 608,256 RAM bits provide local data storage and FIFO support, while the logic elements allow parallel functions to operate at internal clock rates approaching 472 MHz. The commercial-grade C8 version is typically used in controlled indoor environments where high-speed data processing, protocol bridging, and custom state-machine logic must be implemented without the non-recurring engineering cost of an ASIC. Typical applications include industrial automation control, communication protocol bridging, video and image processing, laboratory instrumentation, medical diagnostics, and edge-oriented FPGA systems. The high I/O count and moderate density make the EP3C25Q240C8 a practical bridge between low-end CPLDs and larger, more expensive FPGAs. For systems requiring a Nios II soft processor, the RAM and logic resources are also sufficient to implement small embedded processor subsystems alongside custom peripherals. When designing with the EP3C25Q240C8, verify the exact core and I/O supply voltages from the Cyclone III device handbook, and place decoupling capacitors close to every power pin. Because the part is an SRAM-based FPGA, a configuration memory such as an EPCS or EPCQ device, or a JTAG download path, is mandatory for a self-starting board. Plans for speed grade, temperature range, and lead-free assembly should be confirmed before layout begins. This page synthesizes distributor-level pricing, drop-in EP3C25 family alternatives, and practical FPGA board design notes that are not all present on a standard distributor product page. It is intended to give engineers a compact starting point for procurement and design review while directing them to the official Cyclone III documentation for detailed electrical specifications.
EP3C25Q240C8N - 25K LE Cyclone III FPGA | Intel
Intel EP3C25Q240C8N is a Cyclone III field-programmable gate array built on 65 nm technology, providing 24,624 logic elements, 608,256 bits of embedded memory, and 148 user I/O in a 240-pin BFQFP package. It operates from a 1.2 V core supply and is specified for a maximum frequency of 402 MHz in the supplied reference data. The C8 speed grade makes this member suitable for cost-sensitive applications that still require a substantial programmable-logic fabric. A field-programmable gate array, or FPGA, is an integrated circuit containing configurable logic blocks, programmable interconnects, embedded memory, and input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture. It therefore occupies the semiconductor hierarchy between programmable logic devices and custom digital ICs, allowing engineers to implement interfaces, control logic, signal processing, and bus functions without a fabrication run. The principal Cyclone III resource is 24,624 logic elements for combinational and sequential digital functions. The device also integrates 608,256 memory bits, giving designers capacity for FIFOs, lookup tables, buffering, and control-state storage. With 148 I/O, the EP3C25Q240C8N supports many board-level interfaces. The 240-pin BFQFP package uses through-hole leads rather than a fine-pitch surface-mount ball grid, which can simplify inspection, prototyping, and legacy assembly processes. Architecture and technology determine the balance between programmable density, power, and performance. The listed 65 nm process and 1.2 V core supply characterize the Cyclone III generation, while the 402 MHz specification describes a maximum reference frequency rather than a guarantee for every customer design. Actual performance depends on logic placement, routing, clock resources, I/O standards, timing constraints, and power-supply integrity. The FPGA also supports boundary-scan testing, allowing pin connections to be checked without physical probes. Typical applications include industrial control, legacy communication equipment, test and measurement hardware, motor-control interfaces, and embedded systems requiring replaceable or updateable logic. It is particularly relevant where a 240-pin through-hole FPGA is already designed in, such as an upgrade or lifecycle-support board. Engineers can use it to consolidate board functions, implement a custom peripheral, or reproduce obsolete interface behavior. Design planning should begin with the target package, configured I/O count, required speed grade, available configuration interface, and supported power rails. Verify every pin, bank voltage, configuration mode, and timing constraint against the manufacturer documentation before schematic release. For production, assess configuration storage, JTAG access, decoupling, thermal behavior, and the availability of compatible design software and bitstream generation tools. This product data combines the supplied manufacturer and distributor specifications, package constraints, verified commercial references, and a conservative cross-reference assessment. Because no verified pin-compatible drop-in alternative was identified, the replacement list is intentionally limited rather than padded with footprint-changing devices.
EP3C25Q240I8N - Cyclone III FPGA, 25K LEs, 240-Pin PQFP | Intel (Altera)
The Intel (formerly Altera) EP3C25Q240I8N is a Cyclone III low-cost Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP / FQFP) package with gull-wing leads, offering 24,624 logic elements, 66,432 total registers, and 24624 logic cells organized into 1,539 Configurable Logic Blocks (CLBs). The device operates from a 1.2 V nominal core supply and is rated for the industrial temperature range of -40C to +100C, making it well suited to factory-floor, outdoor, and ruggedized embedded applications. As a member of the Cyclone III family, the EP3C25 occupies the low-power, low-cost tier of Altera's 65 nm FPGA portfolio, balancing logic density, on-chip memory, and DSP block count at a price point optimized for volume production. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated hardware blocks such as multipliers and block RAM into a single semiconductor IC. Within the broader taxonomy, FPGAs sit alongside microcontrollers and ASICs as flexible compute substrates: an FPGA is more power-efficient than a CPU at fixed parallel workloads, and faster to deploy than an ASIC at low-to-medium volumes. Cyclone III devices specifically target cost-sensitive applications such as industrial control, video bridging, and consumer electronics where designers need hardware-level parallelism without ASIC NRE cost. Key features of the EP3C25Q240I8N include 594 Kbits of embedded RAM distributed across M9K blocks, 66 embedded 18x18 multipliers for DSP operations, up to 148 maximum user I/O pins, and support for common configuration schemes including JTAG, Active Serial, and Passive Serial. The 240-pin PQFP body is surface-mountable but retains through-hole-style lead footprints, simplifying prototyping on 2-layer boards and hand-rework for low-volume builds. The Cyclone III architecture also embeds PLLs for clock management and supports LVDS, LVTTL, SSTL, and other I/O standards directly from the core without external transceivers. Typical applications include industrial motor control, video processing and image aggregation, low-cost software defined radio front-ends, factory automation backplanes, and bridge logic between legacy microcontrollers and modern high-speed buses. The combination of 24K logic elements with on-chip DSP multipliers is enough to implement H.264 encoding engines, multi-channel UART bridges, or a soft RISC-V core alongside customer-specific glue logic. Industrial -40C to +100C rating and the easy-to-solder PQFP package make this device attractive for long-life industrial designs. When designing with the EP3C25Q240I8N, allocate at least four PCB layers for proper power-plane decoupling of the 1.2V VCCINT rail, and use a JTAG header for in-system programming. Pair the device with an Altera/Intel EPCS serial configuration flash such as EPCS16 or EPCS64, and always include a dual-footprint option for migration to the larger Cyclone III variants if design requirements grow. This page consolidates distributor pricing, drop-in alternatives, and design notes not found on the bare datasheet.
EP3C40F324C7N - Cyclone III FPGA, 39.6K LE, 324-FBGA | Intel
The Intel (formerly Altera) EP3C40F324C7N is a Cyclone III Field-Programmable Gate Array (FPGA) from the low-power, low-cost Cyclone III family built on a 65 nm TSMC process. The device integrates 39,600 logic elements (LEs), 1,161,216 bits of embedded memory (1161 Kb / 141.25 Kbytes per the FPGAkey listing), 195 user I/O pins, and 4 PLLs in a 324-pin FineLine BGA (FBGA) package with a 1.2 V core supply. The C7 speed grade targets commercial 0 to 85 °C operation at 437.5 MHz internal performance. A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based fabric, distributed and block RAM (M9K/M144K), DSP blocks, and PLL clock management in a single chip. In the broader taxonomy it sits under programmable logic -> FPGA -> SRAM-based FPGA -> low-power FPGA -> semiconductor. The Cyclone III family introduced hard 3.125 Gbps transceivers-free design with significantly lower static and dynamic power than Cyclone II, making it a common choice for cost-sensitive, high-volume designs. Key differentiating features of the EP3C40F324C7N include 4 phase-locked loops for flexible clock synthesis, embedded multiplier blocks for moderate DSP workloads, support for external memory interfaces such as DDR/DDR2 SDRAM, QDRII SRAM, and single data-rate SRAM through dedicated DQS pins, and a MultiTrack interconnect optimized for high-utilization designs. The device supports serial configuration via EPCS or EPCQ devices as well as JTAG (IEEE 1149.1) and parallel passive/active configuration. Architecturally, the EP3C40F324C7N employs logic-array-block (LAB) tiles of 16 LEs each, with carry chains and register chains spanning LABs for efficient arithmetic. Logic is paired with M9K (9 Kbit) block RAM blocks and dedicated 18x18 hardware multipliers, giving designers a balanced fabric for control logic, FIFOs, and signal processing. Configuration data is stored in SRAM; an external configuration device (EPCS4/EPCS16/EPCQ16, etc.) or JTAG programmer loads the bitstream at power-up. Typical applications include industrial motor control, video surveillance and image processing pipelines, low-cost software-defined radio (SDR) front-end glue logic, telecom baseband glue logic and protocol bridging, prototyping of ASIC designs, and consumer display controllers. The 324-FBGA package's compact footprint suits space-constrained boards while retaining enough I/O for parallel external memory buses and high-speed LVDS pairs. When designing, treat the 1.2 V core and 2.5 V/3.3 V I/O rails as separate supply domains and decouple each with 0.1 µF and 10 µF capacitors near the balls. Configure PLL loop-bandwidth settings per the datasheet for jitter-sensitive applications, and verify FPGA timing with TimeQuest (Quartus Prime) against the chosen speed grade. This page synthesizes distributor pricing, drop-in alternatives within the Cyclone III family, and practical PCB/power design notes not consolidated in any single manufacturer document.
EP3C40F324C8N - 39.6K LE Cyclone III FPGA, 324-FBGA | Intel
The Intel (formerly Altera) EP3C40F324C8N is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory (approximately 1.16 Mbit), and 126 embedded 18x18 multipliers, housed in a 324-ball FineLine BGA (FBGA-324) package. The device is fabricated on a low-power 60 nm process and operates from a 1.2 V core supply with a maximum core clock frequency of 402 MHz in the speed grade 8 commercial temperature part. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic circuits through a configuration bitstream stored in SRAM. FPGAs sit in the broader taxonomy of programmable logic device -> programmable logic IC -> semiconductor. They are widely used to implement glue logic, high-speed parallel DSP, custom bus interfaces, and hardware-accelerated functions that would otherwise require multiple discrete logic ICs or an ASIC. The Cyclone III family specifically targets cost-sensitive, low-power applications that still need the parallel processing and DSP density of an FPGA. Key features of the EP3C40F324C8N include up to 215 user I/O pins (the 324-FBGA variant exposes the largest I/O count in the EP3C40 group), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. Each logic element (LE) contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic. Configuration is volatile (SRAM-based) so the bitstream must be reloaded from a flash or microcontroller on every power-up. Architecturally, the Cyclone III device uses a 60 nm TSMC low-power process with a 1.2 V core. The Logic Array Block (LAB) is composed of 16 LEs, and columns of embedded memory and DSP blocks are interleaved across the fabric to provide local high-bandwidth connectivity. The four PLLs support programmable frequency synthesis, phase shifting, and spread-spectrum clocking. This combination enables the EP3C40 to drive high-throughput parallel DSP pipelines, video processing, and protocol bridging at low static and dynamic power. Typical applications for the EP3C40F324C8N include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver-assistance prototypes, telecommunications line-card glue logic, low-cost software-defined radio front ends, and portable medical instrumentation. The 324-FBGA package makes the device suitable for board designs where maximum I/O count is required but a fine-pitch BGA assembly process is acceptable. When designing with this part, note that the 1.2 V core and the PLL analog supply both require decoupling - place 0.1 uF and 10 uF capacitors close to each supply pin and use a power-plane cutout beneath the BGA to control return-current paths. The BGA also requires a multi-layer PCB with microvia or via-in-pad technology to reliably route all 324 balls. Finally, because the configuration memory is SRAM-based, a boot source (EPCS flash, parallel flash, or microcontroller) must be present at every power-up. This page synthesizes distributor pricing, drop-in alternatives across the Cyclone III EP3C family, and practical design notes not found in the manufacturer datasheet alone, giving a single reference for sourcing and engineering the EP3C40F324C8N.
EP3C40F324I7N - Cyclone III FPGA, 39.6K LE, 324-BGA | Intel
The Intel (formerly Altera) EP3C40F324I7N is a Cyclone III low-cost, low-power field-programmable gate array (FPGA) offering 39,600 logic elements (39600 cells / 39600 4-input LUTs as logic resources), 1,161,216 bits of embedded memory, and 195 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package at 19 x 19 mm with 2.2 mm height. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened blocks such as embedded RAM, multipliers (DSP blocks), PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design-flexibility vs. unit-cost spectrum. They are typically used to implement custom digital logic, high-speed parallel processing, glue logic, and hardware acceleration that would be too expensive, slow, or power-hungry on a CPU or MCU. The EP3C40F324I7N is fabricated on TSMC's low-power 65 nm process and operates from a 1.15 V to 1.25 V core supply (VCCINT), giving it the lowest static and dynamic power envelope of the Cyclone III family. It integrates 126 embedded 18 x 18 multipliers, 4 general-purpose PLLs, and supports configuration via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. Maximum internal clock frequency is 437.5 MHz and the maximum user I/O count is 195. Typical applications include industrial motor control and factory automation, video processing and display bridges, telecom line cards and baseband preprocessing, low-cost ASIC prototyping, and software-defined radio (SDR) front-end glue logic. The device's combination of logic density and DSP block count makes it well-suited for parallel signal-processing pipelines. When designing, ensure that the 324-ball FBGA land pattern meets JEDEC MS-034 tolerances and that at least four PCB layers are dedicated to GND/VCCINT planes for power integrity. JTAG chain ordering must place the FPGA before or after other JTAG devices without signal-integrity stubs to avoid boundary-scan failures. This page synthesizes distributor pricing as of 2026-09-09, same-package drop-in alternatives, and engineering design notes that are not aggregated in any single manufacturer datasheet.
EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera
The Intel (formerly Altera) EP3C40F484C6N is a Cyclone III family low-cost FPGA delivering 39,600 logic elements in a 484-ball FineLine BGA (FBGA) package. Built on a 65 nm low-k dielectric process, the device integrates 1,161,216 bits of embedded memory, 4 PLLs, 396 embedded 18x18 multipliers, and up to 331 general-purpose user I/O pins. According to the Cyclone III Device Handbook, the part is offered in the commercial C6 speed grade targeting cost-sensitive high-volume applications. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. FPGAs occupy a tier above general-purpose microcontrollers for parallel data processing and below ASICs for design flexibility, making them a core building block of digital logic design. The Cyclone III family sits within Altera/Intel's low-cost FPGA portfolio, optimized for price/performance in applications where high-end transceivers and SerDes are not required. The EP3C40F484C6N ships in the F484 package (23x23 mm, 1.0 mm ball pitch) and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through dedicated I/O banks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. Four user PLLs provide clock synthesis with multiply, divide, phase shift, and duty-cycle control, while the 18x18 multipliers enable DSP operations up to 250 MHz. The device operates from a 1.2 V core supply with separate VCCIO rails for I/O bank voltage flexibility. Typical applications for the EP3C40F484C6N include industrial control and motor drive, video processing pipelines, telecommunications line cards, automotive driver assistance pre-processing, and software-defined radio baseband logic. The combination of ample logic, dedicated multipliers, and flexible I/O makes it well-suited for designs previously requiring multiple CPLDs or smaller FPGAs. When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin, and follow Intel's PCB layout guidelines for FBGA breakout. The Quartus II / Quartus Prime design suite is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting sourcing engineers and FPGA design teams in component selection.
EP3C40F484C7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel
The Intel / Altera EP3C40F484C7N is a Cyclone III field-programmable gate array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 331 user I/Os in a 484-ball fine-pitch BGA (FBGA-484) package. It belongs to the Cyclone III family, built on a low-power 65 nm process, and is specified for commercial-grade operating temperatures with lead-free / RoHS-compliant packaging. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, multipliers, and I/O serdes. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below ASICs in terms of integration density, and they belong to the broader integrated-circuit / semiconductor category. Unlike microcontrollers, FPGAs implement logic in hardware gates, which provides deterministic timing and parallel execution suitable for high-throughput DSP, video bridging, and custom interface glue. Key features of the EP3C40F484C7N include 4 embedded PLL clock managers, 126 embedded 18x18 multipliers for DSP, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The 484-FBGA package offers a 1.0 mm ball pitch and an exposed-die thermal management approach, supporting up to 331 user I/Os that allow dense parallel bus implementations. Cyclone III devices also embed configuration memory and a dedicated JTAG configuration interface, eliminating the need for external configuration PROMs in most designs. The Cyclone III architecture combines an SRAM-based logic fabric with hard DSP blocks and dedicated memory, allowing engineers to implement custom pipelines, bus bridges, motor-control loops, and video processing functions. Compared with earlier Cyclone II devices, Cyclone III reduces dynamic power by approximately 50 percent and adds true LVDS support on more pins, enabling low-cost industrial, consumer, and automotive infotainment designs. Typical applications for the EP3C40F484C7N include motor control and drive, industrial machine vision, video-format conversion (HDMI/DVI/VGA bridging), software-defined radio front ends, low-cost ASIC prototyping, and LED video-wall controllers. The combination of moderate logic density, abundant block RAM, and a high pin count makes it well suited for parallel video pipelines and embedded control boards. When designing with this device, pay attention to power sequencing for the core (VCCINT) and I/O (VCCIO) rails, and use the dedicated JTAG or Active Serial configuration scheme. Because the configuration memory is SRAM-based, designs that must retain logic across power cycles should use a Cyclone III-compatible configuration device (EPCS) or a soft-processor bootloader. This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III and Cyclone IV families, and practical design notes not found in the manufacturer datasheet alone.
EP3C40F484C8 - Cyclone III FPGA, 39.6K LE, 484-BGA | Intel
The Intel (formerly Altera) EP3C40F484C8 is a Cyclone III family Field-Programmable Gate Array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers into a 484-ball FineLine BGA package. It supports up to 331 user I/O pins and is built on a low-power 60-nm process, drawing as little as 0.25 W of dynamic power at typical operation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic functions after PCB fabrication. The Cyclone III FPGA belongs to the broader taxonomy of semiconductor devices: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs sit alongside microcontrollers and DSPs in the digital signal processing hierarchy, offering parallel hardware execution that microcontrollers cannot match. Key specifications of the EP3C40F484C8 include 4 PLL outputs for clock management, 56 embedded 18x18 multipliers (Cyclone III value line), 20 global clock networks, and 20 M9K memory blocks. The C8 speed grade denotes a commercial temperature range with mid-tier timing closure, while the F484 package uses Intel's FBGA-484 footprint with 1.0 mm ball pitch. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards for interfacing with DDR/DDR2 memory and high-speed parallel peripherals. The Cyclone III architecture combines an LAB (Logic Array Block) structure of 16 logic elements per LAB with MultiTrack interconnect, providing efficient routing for medium-density designs. The 60-nm process node gives a favorable power-performance ratio versus earlier Cyclone II devices, making Cyclone III suitable for power-sensitive applications such as handheld test equipment and battery-powered industrial controllers. Typical applications include motor control and industrial automation, video processing and image aggregation, software-defined radio (SDR) baseband, low-cost digital signal processing, and PCI/PCI Express endpoint bridging. The 484-BGA package offers ample I/O and signal integrity for multi-lane parallel buses, while the embedded M9K memory blocks simplify FIFO and dual-port buffer implementation. Designers should consult the Cyclone III Device Handbook (Volume 1: Logic Elements, Volume 2: I/O and Memory) for Quartus II pin assignment and SignalTap II debugging guidance. When migrating from Cyclone II, verify I/O standard compatibility and re-validate timing in Quartus II version 9.0 or later. This page synthesizes distributor pricing, drop-in same-package alternatives (EP3C16F484C8N, EP3C25F484C8N), and practical design notes not found in the manufacturer datasheet.
EP3C40F484C8N - Cyclone III FPGA 39.6K LEs 484-FBGA | Intel
The Intel EP3C40F484C8N is a low-power 65nm Cyclone III FPGA integrating 39,600 logic elements, 1,161,216 bits of embedded memory (M9K blocks totaling 1134 Kbit × 9 = approximately 1.16 Mbit), 126 embedded 18×18 multipliers, and 331 user I/Os in a 484-ball FineLine BGA package. Speed grade 8 designates a commercial temperature-range device targeting -40C to +85C operation. Per the Altera/Intel Cyclone III Device Handbook, the device is built on a TSMC 65nm low-power process and supports core voltages of 1.15V–1.25V with multi-voltage I/O banks. A Cyclone III FPGA is a programmable logic device that allows hardware designers to implement arbitrary digital circuits - from glue logic and bus bridges to soft-core processors and DSP pipelines - on a single silicon die. FPGAs sit between fixed-function ASICs (Application-Specific Integrated Circuits) and microcontrollers in the digital design hierarchy: they offer higher integration density than discrete logic ICs but lower per-unit cost than full-custom ASICs at low-to-medium volumes. Cyclone III, released in 2007, is the third-generation low-cost Cyclone family and is widely used as a stepping stone between discrete logic and high-end FPGAs. Key features of the EP3C40F484C8N include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and dedicated LVDS pairs on every I/O pin with data rates up to 875 Mbps. The 484-FBGA (23×23 mm, 1.0 mm pitch) package provides ample routing density for memory-rich designs. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes with the dedicated EPCS serial configuration device family. Architecturally, the EP3C40F484C8N uses Altera's Logic Array Block (LAB) structure with each LAB containing 16 Logic Elements (LEs). Each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic. Embedded multiplier blocks support 18×18 signed or unsigned multiplication natively, enabling single-cycle DSP operations at speeds up to 260 MHz. The M9K memory blocks can be configured as RAM, ROM, shift registers, or FIFO buffers with byte enables for parity/ECC support. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, telecom line cards, and low-volume ASIC prototyping. Designers frequently pair the EP3C40 with external DDR/DDR2 SDRAM, EPCS configuration memory, and a 100 MHz LVCMOS clock source. The 484-BGA package is also suitable for designs migrating to Cyclone IV E (EP4CE40F484) via the Quartus II Cyclone III to Cyclone IV migration guide. When designing with this part, ensure proper bank voltage supply for each I/O group, keep VCCINT within 1.15V–1.25V with at least 4 bulk ceramic decoupling capacitors placed within 5 mm of the package, and verify signal-integrity on LVDS links since the 1.0 mm BGA pitch requires controlled-impedance routing on a 6+ layer PCB. Quartus II Web Edition (free) supports the EP3C40 with full synthesis, place-and-route, and timing analysis. This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives (same 484-FBGA footprint, including variants within the Cyclone III family and pin-compatible Cyclone IV E migrations), and practical hardware design notes not found in the manufacturer datasheet alone.
EP3C40F484I7 - 39.6K Logic Elements Cyclone III FPGA | Intel | 484-FBGA
The Intel (formerly Altera) EP3C40F484I7 is a low-power Cyclone III FPGA with 39,600 logic elements, 1,161,216 bits of embedded memory and 331 user I/Os, housed in a 484-ball FineLine BGA (FBGA-484) package. Fabricated on a 65 nm CMOS process and operating from a 1.2 V core supply, this device targets cost-sensitive, high-volume applications that require moderate logic density and a generous I/O count without the power penalty of higher-end families. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks and PLLs. FPGAs are reprogrammable, allowing engineers to implement custom digital logic, glue functions, parallel processing pipelines, and high-speed I/O protocols. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They complement microcontrollers and ASICs by trading unit cost for flexibility, parallelism and time-to-market. Key features of the EP3C40F484I7 include 4 PLLs, 126 multipliers (18 x 18 hardware multipliers for DSP), support for LVDS, LVTTL, LVCMOS, SSTL and HSTL I/O standards, and a configurable Logic Array Block (LAB) architecture of 2,475 LABs. The device operates over the industrial -40C to +125C temperature range, making it suitable for harsh-environment and industrial designs. Cyclone III devices use a low-k, 65 nm process and a small die footprint relative to logic capacity, delivering one of the lowest static power profiles in the FPGA market at the time of release. Designers typically pair the FPGA with DDR/DDR2 SDRAM memory controllers (using the dedicated DQS pins) and external configuration memory (such as EPCS or EPCQ serial flash). Configuration is loaded via JTAG or the active/passive serial (AS/PS) scheme. Typical applications include industrial motor control and automation, video processing pipelines, software-defined radio (SDR) baseband, test and measurement front-ends, and protocol bridging cards (PCI Express, Ethernet MACs, custom LVDS links). The 484-FBGA footprint provides enough I/O for memory buses, high-speed transceivers-like interfaces (via LVDS), and parallel expansion connectors. When designing with this FPGA, ensure that the JTAG chain and configuration mode pins (MSEL[3..0]) are correctly strapped, and verify that the chosen I/O bank voltages match the logic levels of connected peripherals. The Quartus Prime (or legacy Quartus II) toolchain is required for synthesis, place-and-route, and bitstream generation. Use the Altera/Intel PowerPlay early power estimator before PCB layout to size decoupling, planes, and any required thermal management. This page synthesizes distributor pricing, verified same-family drop-in alternatives and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers make an informed second-source decision.
EP3C40F484I7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel / Altera
The Intel (formerly Altera) EP3C40F484I7N is a low-cost Cyclone® III Field Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, housed in a 484-ball FineLine BGA package. It operates from a 1.2 V core supply and supports I/O standards including LVDS, LVCMOS, SSTL, and HSTL through eight I/O banks. The device targets cost-sensitive high-volume applications while delivering 437.5 MHz maximum core performance. What is a Cyclone III FPGA? The Cyclone III family is a low-power, low-cost SRAM-based programmable logic family from Altera (now Intel FPGA) that sits in the broader hierarchy of programmable logic devices (PLD) between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices are built on a TSMC 65 nm low-power process and integrate logic, multipliers, memory, PLLs, and high-speed I/O into a single device, making them suitable for I/O expansion, glue-logic replacement, parallel DSP, and mid-density state-machine designs. Key features of the EP3C40F484I7N include 4 PLLs, 331 user I/O pins distributed across 8 banks, 1.161 Mbit of RAM, and full industrial temperature range support from -40 °C to +125 °C (the I7N speed/temperature grade). The device supports up to 1 Gbps LVDS with external serializer/deserializer logic, provides 2.5 Gbps external memory interfaces, and includes dedicated DDR/DDR2/QDRII memory controller hard IP. Configuration is supported through passive serial (AS), active serial (AP), JTAG, and Fast Passive Parallel modes using industry-standard Altera/Intel EPCS or EPCQ configuration flash devices. Typical applications for the EP3C40F484I7N span industrial motor control, video processing and image aggregation, automotive infotainment controllers, software-defined radio baseband, low-density ASIC prototyping, and consumer display controllers. The 484-FBGA package offers 1.0 mm ball pitch and excellent signal integrity for high-speed LVDS and DDR2 interfaces, while the industrial temperature grade suits factory automation and outdoor deployments. When designing with this device, ensure proper decoupling (100 nF + 10 µF bulk per bank) and follow Intel's Cyclone III pin connection guidelines for unused pins. Configuration flash selection is critical — pair with an EPCS16 or EPCQ16 for typical 39.6 K LE designs. The QFP-484 BGA requires X-ray inspection in production, so design for manufacturability with clear pad geometry.
EP3C40F780C6 - Cyclone III FPGA 39.6K LE 780-BGA | Altera
The Altera EP3C40F780C6 is a Cyclone III Field-Programmable Gate Array (FPGA) housed in a 780-pin FineLine BGA package, integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/O pins. Built on a low-power 60 nm process, the Cyclone III family targets cost-sensitive, high-volume applications where designers need FPGA density without the power budget of high-end FPGAs. The 'C6' speed grade places it in the mid-speed bin of the family, and the 'F' package descriptor indicates a leaded, RoHS-compliant FineLine BGA. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device whose logic fabric, routing, and I/O behavior are defined after manufacture through a configuration bitstream. FPGAs sit between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices) in the programmable-logic taxonomy: ASIC > FPGA > CPLD > SPLD > standard logic. Cyclone III is positioned as a low-cost, low-power alternative to Stratix within Altera's portfolio, and is a direct competitor to Xilinx Spartan-6 and Lattice ECP3 families. Key features include 4 embedded 18x18 hardware multipliers (DSP blocks), up to 4 PLLs per device for clock management, and 396 Kbits of M9K embedded SRAM. The 780-BGA package provides 535 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, with 8 transceiver channels (where present) and dedicated global clock networks. Cyclone III supports configuration through AS, PS, JTAG, and Fast Passive Parallel modes, and integrates the Altera Cyclone III Configuration scheme. Architecturally, the EP3C40F780C6 uses a logic-element (LE) fabric of 4-input look-up tables (LUTs) and dedicated carry chains, surrounded by a perimeter I/O ring and column-based M9K memory blocks. The four embedded multipliers enable single-clock-cycle 18x18 signed multiplications, while the PLL blocks provide frequency synthesis, phase shifting, and clock deskew. Compared to its predecessor Cyclone II, the Cyclone III family roughly doubles logic density and adds DSP blocks at a lower static power budget. Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive driver assistance, and low-cost prototyping. The combination of high I/O count and embedded multipliers makes the EP3C40F780C6 well suited for parallel sensor aggregation, custom peripheral bridging, and image preprocessing tasks. When designing with this device, allocate sufficient PCB area for the 29 mm x 29 mm 780-BGA with 1.0 mm pitch; layer stackup with buried vias and at least 6 layers is recommended to fan out the package. Confirm Quartus II software support for the C6 speed grade before final timing closure. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III family, and practical design notes not consolidated in any single manufacturer or distributor listing.
EP3C40F780C6N - Cyclone III FPGA 39.6K LE 780-FBGA | Intel (Altera)
The Altera (now Intel) EP3C40F780C6N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 maximum user I/O pins, housed in a 780-ball FineLine BGA package with 1.0 mm pitch. Operating at a core speed grade of -6 (commercial), it is fabricated on a 60 nm low-power CMOS process and is targeted at cost-sensitive, high-volume designs that previously required ASICs. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O behavior after PCB fabrication, in contrast to an Application-Specific Integrated Circuit (ASIC) which is fixed at mask production. FPGAs occupy the IC hierarchy at programmable logic -> logic IC -> integrated circuit -> semiconductor. The Cyclone III family specifically targets the cost/performance sweet spot, offering ASIC-level density at FPGA-level flexibility for applications like motor control, video processing, and telecommunications line cards. Key specifications include 39,600 logic elements distributed across 4,065 Logic Array Blocks (LABs) and 126 M9K embedded memory blocks totaling 1,161,216 bits (113 Kbytes of true SRAM). The device integrates 4 phase-locked loops (PLLs) for clock synthesis, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) on its 535 user I/O pins, and provides up to 4 integrated hard memory controllers plus a wide range of soft IP cores from Altera/Intel. The Cyclone III architecture uses 60 nm process technology with a 1.2 V core supply and hot-socketing support, achieving typical power consumption of roughly 0.4 W to 1.5 W depending on design utilization. Its SRAM-based configuration requires external flash or a configuration device, while the built-in Cyclic Redundancy Check (CRC) circuitry catches configuration bitstream errors. The device also supports partial reconfiguration for in-field updates without system downtime. Typical applications include industrial motor control, LED display controllers, machine vision and video bridging, automotive infotainment, and low-cost telecommunications line cards. The 535 I/O count and 780-FBGA footprint make it suitable for medium-density designs requiring many parallel interfaces such as LVDS or DDR2 memory. Designers should evaluate the 780-ball FBGA routing complexity and use a minimum 6-layer PCB with controlled-impedance traces. The 1.0 mm pitch keeps the BGA manageable for standard assembly, but X-ray inspection after reflow is mandatory. JTAG programming via USB-Blaster is the standard configuration path. This page synthesizes distributor pricing, drop-in alternative FPGAs, and practical PCB/design notes not aggregated in any single Altera datasheet or distributor listing.
EP3C40F780C7 - Cyclone III FPGA 39.6K LE 780-FBGA | Intel
The Intel (formerly Altera) Cyclone III EP3C40F780C7 is a low-power, high-volume FPGA fabricated on a 60 nm TSMC process, integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers in a 780-ball fine-pitch BGA package. The device operates with a core voltage of 1.2 V and supports I/O standards from 1.2 V to 3.3 V through eight I/O banks that deliver up to 535 user I/O pins. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that implements custom digital logic through configurable logic blocks (CLBs), routing interconnect, and dedicated hardware such as block RAM and DSP blocks. FPGAs sit within the hierarchy of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-defined microcontrollers, and are widely used in parallel processing, hardware acceleration, and rapid-prototyping applications. Key features of the EP3C40F780C7 include support for high-speed external memory interfaces such as DDR2, DDR, QDRII, and SDRAM, four phase-locked loops (PLLs) for clock management, and Cyclone III's proprietary low-power architecture that reduces dynamic power consumption versus earlier Cyclone generations. The 780-FBGA package (29 x 29 mm, 1.0 mm pitch) supports commercial temperature grades (0C to +85C) and is rated for the C7 speed grade, balancing timing margin and cost. The Cyclone III family targets cost-sensitive high-volume applications such as industrial automation, video processing, and telecommunications. With 39,600 logic elements and ample DSP and memory resources, the EP3C40F780C7 supports medium-complexity algorithmic implementations, multiple soft processor cores, and rich memory buffering for streaming data pipelines. Typical applications include motor control and industrial networking, HD video bridging, software-defined radio (SDR) front ends, machine vision, and PCI Express endpoint bridging. The wide I/O count and embedded multipliers also make it suitable for custom display controllers and ASIC prototyping. When designing with this device, designers must respect the 1.0 mm BGA pitch constraint and apply standard JTAG-based configuration via the Altera/Intel Quartus Prime design suite. Power sequencing of VCCINT (1.2 V) and VCCIO banks is required to avoid inrush damage; the device supports both active serial and passive parallel configuration schemes. This page combines Intel/Altera datasheet parameters, distributor pricing, and drop-in same-package alternatives into a single reference - information not consolidated in any single source. Engineers seeking a Cyclone III device with 39.6K logic elements, 1.16 Mbit of embedded memory, and 535 user I/Os in a 780-FBGA will find the EP3C40F780C7 datasheet, pinout, and pricing summary below.