FPGA & CPLD
Products (6358)
EP3C10F256C6N - Cyclone III FPGA, 10K LE, 256-BGA | Intel / Altera
The Intel (formerly Altera) EP3C10F256C6N is a Cyclone III family low-power Field-Programmable Gate Array (FPGA) housed in a 256-ball FineLine BGA package. It integrates 10,320 logic elements (LEs), 423,936 bits of embedded memory, and 182 user I/O pins, delivering a balanced logic/memory ratio for cost-sensitive programmable logic designs. The device is fabricated on TSMC's 65 nm low-power process and targets static power consumption roughly 25 percent lower than the previous Cyclone II generation, making it well suited to thermally constrained embedded systems. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as block RAM, DSP multipliers, and high-speed transceivers. The FPGA occupies the top of the programmable logic hierarchy, sitting between fixed-function ASICs and software-driven microcontrollers. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include older CPLD architectures; an FPGA provides finer-grained logic, more embedded memory, and parallel DSP capability, while a CPLD delivers faster, deterministic non-volatile boot. In a complete embedded system, an FPGA typically handles parallel data-path processing, custom interface bridging, or hardware acceleration alongside a host processor. Key features of the EP3C10F256C6N include 182 maximum user I/Os supporting LVTTL, LVCMOS, SSTL, and differential LVDS signalling, two PLL blocks for flexible clock synthesis, and an on-chip configuration controller that supports JTAG (IEEE 1149.1), Active Serial (AS), and Active Parallel (AP) configuration modes. The device also provides up to 46 embedded 18x18 multipliers for DSP, supporting common fixed-point filtering and FFT workloads without external arithmetic accelerators. Architecturally, the Cyclone III device is built around LABs (Logic Array Blocks) containing 16 LEs each, routed through a multi-level interconnect with predictable timing closure. Hard IP blocks include M9K memory blocks (each 9 Kbit) that can be cascaded to implement FIFO, ROM, RAM, or dual-port buffers. Two dedicated PLLs provide frequency synthesis, phase shifting, and clock de-skew, simplifying board-level clock-tree design for protocols such as DDR/DDR2 SDRAM. Typical applications include industrial control and motor-drive interfaces, video/display bridging and image preprocessing, low-cost software-defined radio (SDR) baseband blocks, ASIC prototyping, and custom peripheral expansion for microcontrollers. The wide I/O count also makes it suitable for parallel data acquisition, custom bus bridges, and educational development boards. When designing with the EP3C10F256C6N, supply all four VCCINT/VCCIO banks with properly decoupled bulk and ceramic capacitors, and route configuration signals (nCONFIG, nSTATUS, CONF_DONE) carefully away from switching I/O to avoid false reconfiguration. Leave at least 30 percent of logic utilization free for place-and-route closure, and verify pin assignments in Quartus II pin-planner before layout sign-off. This page synthesises distributor pricing as of 2026-09-09, drop-in alternative candidates, and practical design notes not collated in the manufacturer datasheet, giving procurement and design engineers an AEO-optimised reference in one place.
EP3C10F256C8N - 10K LEs, 182 I/O Cyclone III FPGA | Altera/Intel
The Altera (now Intel) EP3C10F256C8N is a Cyclone III family low-power FPGA with 10,320 logic elements, 423,936 bits of embedded RAM, 182 user I/Os, and 645 logic array blocks (LABs), housed in a 256-pin FineLine BGA package measuring 17 mm x 17 mm x 1.8 mm. It supports a 1.15 V to 1.25 V core supply (1.2 V nominal) and a maximum internal operating frequency of 402 MHz, targeting cost-sensitive high-volume applications. What is a Cyclone III FPGA? Cyclone III is the third-generation low-power FPGA family from Altera/Intel fabricated on a 60 nm process, sitting in the broader taxonomy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> low-power FPGA -> SRAM-based FPGA -> semiconductor IC. It is engineered specifically for low static and dynamic power dissipation while integrating sufficient logic, memory and DSP resources to displace ASICs and ASSPs in volume production. Key features of the EP3C10F256C8N include 23 embedded 18 x 18 multipliers (about 0.5 M Gates of equivalent logic), support for external memory interfaces such as DDR/DDR2/QDRII SRAM, embedded PLL-based clock management, Nios II soft-core processor compatibility, and the standard Altera Quartus II design flow. The device is RoHS-compliant, lead-free, and operates over the commercial 0 C to 85 C junction temperature range. Technically, the EP3C10F256C8N integrates 10,320 logic elements organized into 645 LABs, 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18 x 18 multipliers for DSP, and four PLLs. The 256-pin FineLine BGA provides 182 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL and other single-ended and differential I/O standards with hot-socketing capability and configurable drive strength. Typical applications include industrial motor control, video processing and display bridges, automotive infotainment (non-safety), consumer electronics control planes, communications line cards, and cost-optimized ASIC replacement. Its low power and high logic density at sub-$30 unit pricing make it suitable for both prototyping and volume production. When designing with this part, plan the power distribution network around the 1.2 V core and per-bank I/O supplies, and use the Altera Quartus II development environment for synthesis, place-and-route, and timing closure. Ensure the PCB BGA layout follows Intel's recommended 1 mm pitch escape routing and that decoupling capacitors are placed as close to the package as possible. This page synthesizes distributor pricing, verified cross-references within the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet, giving engineers a faster path to selection.
EP3C10F256I7N - 10K LE Cyclone III FPGA, 256-FBGA | Intel
The Intel (Altera) EP3C10F256I7N is a low-power, low-cost FPGA from the Cyclone III family built on a 65 nm process, offering 10,320 logic elements, 423,936 bits of embedded memory, and 182 user I/O pins in a 256-ball FineLine BGA package with 1.2 V core operation. It targets high-volume, cost-sensitive designs where FPGA flexibility is required but ASIC-like NRE costs are not justified. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs), programmable routing fabric, dedicated DSP blocks, and embedded memory blocks (M9K/M144K). FPGAs belong to the larger programmable logic hierarchy: FPGA -> programmable logic -> digital logic IC -> semiconductor. Cyclone III devices specifically target the low-power end of the FPGA market, delivering ASIC-like fabric density while preserving in-system reprogrammability for design iteration and field upgrades. Key features of the EP3C10F256I7N include 182 maximum user I/O pins (supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards), 46 embedded 18x18 multipliers for DSP functions, two PLLs per device for clock management, and up to 1.4 Mbits of RAM. The device operates across an industrial temperature range of -40C to +125C with a 1.2 V core supply, and its 65 nm process technology yields substantially lower static and dynamic power than its Cyclone II predecessor. Architecturally, the Cyclone III device uses a Look-Up Table (LUT)-based fabric with M9K memory blocks and dedicated 18x18 multipliers. The 65 nm process enables tight integration while keeping die cost low, and the FineLine BGA-256 package provides high signal density within a 17x17 mm footprint suitable for space-constrained PCBs. Typical applications include industrial motor control, video processing, automotive driver assistance, software-defined radio, consumer display controllers, and embedded system prototyping. The device is well suited for parallel processing and signal-integrating tasks. When designing with the EP3C10F256I7N, careful attention to power rail sequencing (1.2 V core and 2.5 V/3.3 V I/O supplies) and JTAG configuration is required. Configuration via Altera/Intel Quartus II software supports JTAG, Active Serial (AS), and Passive Serial (PS) modes for flexible boot options. This page synthesizes distributor pricing, drop-in alternative listings from same-family Cyclone III devices, and practical design notes not found in the manufacturer datasheet.
EP3C120F484C7N - Cyclone III FPGA 119K LE 484-FBGA | Intel
The Intel (formerly Altera) EP3C120F484C7N is a high-density Cyclone III Field-Programmable Gate Array (FPGA) delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 embedded 18x18 multipliers in a 484-ball FineLine BGA package. Fabricated on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports I/O voltages from 1.2 V to 3.3 V via eight I/O banks. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP blocks. FPGAs occupy a unique position in the digital hierarchy between fixed-function ASICs (more integration, higher NRE) and microcontrollers (less flexibility, lower performance), offering hardware-level parallelism and reconfigurable logic for high-throughput signal processing, glue logic, and rapid prototyping. Key features of the EP3C120F484C7N include up to 472 MHz internal operation, four phase-locked loops (PLLs) for clock management, 20 global clock networks, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 484-pin FBGA package (23 x 23 mm, 1.0 mm pitch) provides robust thermal and electrical performance suitable for industrial-temperature designs, while the Cyclone III family architecture eliminates the need for dedicated configuration devices when using active serial (AS) configuration from low-cost EPCS flash. Architecturally, the EP3C120F484C7N combines logic elements organized into Logic Array Blocks (LABs), each containing 16 LEs plus associated carry and control logic. The embedded multiplier blocks support 18x18 signed multiplication natively, and the M9K memory blocks deliver true dual-port operation at 315 MHz, enabling simultaneous read/write access to the same storage location without arbitration. Typical applications include industrial motor control, video processing and display controllers, software-defined radio, telecommunications line cards, ASIC prototyping, and embedded vision systems. The combination of high logic density and low static power consumption also makes Cyclone III devices attractive for portable and thermally constrained designs where larger FPGAs would be impractical. When designing with this device, carefully plan I/O bank assignments to avoid mixed-voltage conflicts and ensure the PLL reference clock inputs meet the jitter specifications of the targeted data rate. The Quartus II design software (version 13.0 and earlier) is the canonical toolchain for compilation, fitting, and timing closure. This page synthesizes distributor pricing, same-brand Cyclone III drop-in alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone.
EP3C120F484I7 - 119K LEs Cyclone III FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP3C120F484I7 is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 user I/Os in a 484-ball FineLine BGA package. Built on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports industrial temperature grades from -40C to +100C. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions on a single die after manufacturing. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD) -> logic ICs -> integrated circuits, sitting alongside CPLDs and ASICs as a flexible alternative to fixed-function chips. FPGAs such as Cyclone III are commonly used in cost-sensitive, high-volume applications where ASIC NRE is unjustified but ASSP flexibility is insufficient. Key specifications of the EP3C120F484I7 include 119,088 logic elements, 3,981,312 bits of RAM, 576 embedded 18x18 multipliers, and 4 PLLs for clock management. The 484-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch and supports up to 283 user I/Os across 8 I/O banks. Peripherals and hard IP blocks include embedded memory blocks (M9K), a configuration interface, and high-speed LVDS support on selected pins. The Cyclone III architecture uses an SRAM-based LUT fabric with dedicated routing, M9K memory blocks, and 18x18 multiplier blocks for DSP workloads. Compared to earlier Cyclone generations, Cyclone III introduced a 65 nm process node that cut core power by roughly 50 percent while raising logic density, making the EP3C120F484I7 suitable for power-sensitive designs that still need very large logic capacity. Typical applications include industrial motor control, video processing pipelines, software-defined radio prototyping, and high-volume telecom line cards. The 283 available user I/Os also enable rich external connectivity for memory expansion, parallel sensor buses, and high-speed LVDS interfaces. When designing with the EP3C120F484I7, ensure all eight I/O banks are powered from rails within their respective VCCIO ranges and that decoupling follows Altera's power distribution network guidance. Configuration via JTAG or a passive serial EPCS device should be planned early to minimize board rework. This page consolidates distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes that supplement the manufacturer datasheet with information useful for sourcing and second-source decisions.
EP3C120F484I7N - Cyclone III FPGA 119K LE | 484-FBGA | Intel
The Intel (formerly Altera) EP3C120F484I7N is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 18x18 multipliers in a 484-pin FineLine BGA (FBGA-484) package. It is built on a low-power 65 nm TSMC process and supports internal operating frequencies up to 472 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the factory. FPGAs sit between general-purpose microcontrollers and fixed ASICs in the programmable-logic hierarchy: microcontrollers run software sequentially, FPGAs run massively parallel custom hardware, and ASICs are faster but cannot be reconfigured. Cyclone III belongs to Intel's low-cost, low-power FPGA family, optimized for high-volume cost-sensitive applications. Key features include 119,088 logic elements distributed across 7,443 logic array blocks (LABs), 4 M9K embedded memory blocks totaling approximately 4 Mbits, 288 18x18 hardware multipliers for DSP, and 8 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for I/O flexibility. Cyclone III uses a logic-element (LE) based fabric with 4-input LUTs, dedicated carry chains for arithmetic, and embedded RAM blocks. The -I7 speed grade places the part in the mid-fast tier; the -I7N suffix denotes the industrial temperature range (-40 °C to +100 °C ambient) and lead-free / Pb-free packaging. The 484-pin FBGA measures 23 mm x 23 mm with 1.0 mm pitch. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance prototypes, software-defined radio baseband, and high-volume consumer signal conditioning. Cyclone III FPGAs are pin-compatible across density grades within the same package, allowing board reuse as designs migrate from EP3C25 to EP3C120. When designing with the EP3C120F484I7N, ensure that all four dedicated clock input pins are routed cleanly and that the JTAG chain (TCK, TMS, TDI, TDO) is accessible for in-system programming with a USB-Blaster or compatible download cable. Decoupling follows the Quartus II reference schematic: 0.1 uF and 10 uF capacitors near each power pin. This page synthesizes distributor pricing, same-package alternatives, and Quartus II design considerations not found in the standalone datasheet.
EP3C120F780C7AD - Cyclone III FPGA 119K LE FBGA-780 | Intel
The Intel (formerly Altera) Cyclone III EP3C120F780C7AD is a low-power, high-volume SRAM-based Field-Programmable Gate Array (FPGA) integrating 119,088 logic elements in a 780-pin FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 65nm low-power process, this Cyclone III variant delivers up to 3.9 Mb of embedded memory, four phase-locked loops (PLLs), 531 multipliers, and 20 global clock networks, while consuming as little as 0.5 W of dynamic power at typical clock rates. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after fabrication. FPGAs sit within the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor, occupying the same engineering space as CPLDs, but offering far higher logic density, embedded RAM/DSP blocks, and high-speed transceivers in larger devices. Cyclone III specifically targets cost-sensitive, power-conscious volume applications such as video processing, motor control, automotive driver assistance, and industrial communication. Key features of the EP3C120F780C7AD include 119,088 logic elements (LEs), 3,981 Kbits (approximately 498 Kbytes) of embedded RAM organized as M9K blocks, 288 18x18 hardware multipliers for DSP, and four PLLs. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across up to 20 global clock networks, with user I/O counts in the 400+ range depending on package pinout. Configuration is supported through JTAG, Active Serial, and Passive Serial modes, with on-chip encryption (AES) for design security. The Cyclone III architecture uses a logic-element fabric with 8-input adaptive look-up tables (ALUTs), each capable of implementing any 6-input function or two independent 4-input functions. Embedded M9K memory blocks support true dual-port, simple dual-port, and single-port modes with parity bits, enabling efficient buffering, FIFO, and shift-register implementations. The DSP blocks natively support 18x18 multiplication with optional add/subtract/accumulate, eliminating the need for soft-multiplier inference in DSP pipelines. Typical applications for the EP3C120F780C7AD span HD video bridging and image processing, industrial motor control and servo drives, automotive infotainment and driver-assistance modules, telecommunications line cards, software-defined radio (SDR) baseband, and embedded industrial protocols such as EtherCAT, PROFINET, and EtherNet/IP. The combination of high logic count, on-chip DSP, and low power also makes it suitable for portable medical instrumentation and handheld test equipment. When designing with the EP3C120F780C7AD, plan the power budget across core, I/O, and PLL rails. Use the Quartus II PowerPlay early power estimator before layout to size decoupling and rail sequencing. Maintain controlled-impedance PCB traces for high-speed LVDS links, and route clock and PLL analog supplies through dedicated ferrite filters to minimize jitter.
EP3C120F780C7N - 119K Logic Element Cyclone III FPGA | Intel / Altera
The Intel (formerly Altera) Cyclone III EP3C120F780C7N is a high-density, low-power Field Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 hardware multipliers inside a 780-pin FineLine BGA (FBGA) package. The 'C7' speed grade supports a core clock rate up to 437.5 MHz while operating from a 1.2 V core supply, and the 'N' suffix denotes lead-free / Pb-free terminations compliant with RoHS. Cyclone III positioned the family for cost-sensitive, high-volume applications where Cyclone II was too small and Stratix families were over-spec. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that lets designers implement arbitrary digital logic, memory blocks, and DSP functions by loading a configuration bitstream after PCB assembly. Within the broader semiconductor taxonomy, the EP3C120F780C7N sits inside the hierarchy programmable logic -> FPGA -> SRAM-based FPGA -> low-cost FPGA. Unlike ASICs, FPGAs can be reconfigured in the field, enabling rapid prototyping, late-stage design changes, and hardware reuse across product variants without respinning silicon. Key features of the EP3C120F780C7N include up to 531 embedded 18x18 multipliers for DSP, 4 PLLs with multiple outputs, support for external memory interfaces including DDR, DDR2, and QDR II SRAM, and 8 phase-locked clock networks. The device exposes up to 429 user I/O pins depending on configuration scheme and supports hot-socketing, joint Test Action Group (JTAG) boundary-scan, and Active Serial / Fast Active Parallel configuration modes via the dedicated configuration pins. Cyclone III also introduced dedicated hard IP for PCIe Gen1 soft cores implemented in fabric. Technically, the Cyclone III architecture uses 4-input look-up tables (LUT4) clustered into logic array blocks (LABs), with embedded M9K memory blocks that can be configured as RAM, ROM, or shift registers. The 65 nm process and 1.2 V core reduce dynamic power consumption versus the prior Cyclone II generation while increasing logic density roughly 4x. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and provides on-chip termination (OCT) for signal-integrity-critical interfaces. Typical applications include industrial motor control and machine vision, automotive driver-assistance ADAS prototypes, video processing and broadcast equipment, software-defined radio (SDR) baseband, low-cost DSP front ends, and PCI Express endpoint cards. Designers select the EP3C120F780C7N when they need Stratix-class capacity at Cyclone-class pricing and power budgets. When designing with this part, note that 780-pin FBGA requires high-density PCB routing with microvia stack-ups, the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) must be pulled correctly for the chosen configuration mode, and unused I/O banks must be powered and grounded per the datasheet to prevent floating inputs. This page synthesizes distributor inventory data, parametric drop-in candidates, and practical layout notes that complement the official Cyclone III Device Handbook rather than replace it.
EP3C120F780C7NAD - Cyclone III FPGA, 119K LEs, 780-FBGA | Altera
The Altera (Intel Programmable Solutions Group) EP3C120F780C7NAD is a Cyclone III family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (FBGA-780, 23 × 23 mm, 1.0 mm pitch). It integrates 119,088 logic elements, 3,981 Kbits of embedded memory, and 4 PLLs in a low-power 60-nm process node, targeting cost-sensitive high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream after manufacture. In the broader taxonomy, this part sits at FPGA → programmable logic device (PLD) → digital IC → semiconductor. Cyclone III devices are positioned below the high-end Stratix family and above legacy Cyclone II; they are widely used where designers need tens of thousands of logic elements, hardware parallelism, and moderate DSP capability without the power and price of high-end FPGAs. Key features of this device include 119,088 logic elements, 3,981 Kbits of embedded RAM (M9K blocks), 4 phase-locked loops, 531 user I/O pins, and 4 embedded multiplier blocks (18 × 18). It supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, with per-pin dynamic impedance and slew-rate control. The C7 speed grade operates with internal clock frequencies up to 472 MHz and supports commercial temperature operation. The Cyclone III architecture combines an LAB (Logic Array Block) structure built from adaptive logic modules (ALMs), an island-style routing network, and column/row-based embedded memory and multiplier blocks. Power consumption is reduced by leveraging a 1.2 V core voltage, low-k dielectric process, and programmable power-on-demand per LAB. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes using Altera/Intel Quartus II design software. Typical applications include industrial motor control, video processing and image aggregation, communications protocol bridging, automotive infotainment pre-processing, and portable test & measurement equipment. The Cyclone III family is also commonly deployed in display controllers, software-defined radio front-ends, and as a companion processor to ASICs/SoCs for glue logic and parallel DSP tasks. When designing with this part, ensure the Quartus II device fitting is reviewed for the selected speed grade, and verify that I/O bank voltage references match the connected peripherals. The N suffix on the part number indicates lead-free / Pb-free termination, and the AD suffix typically denotes a specific Altera internal ordering code variant. This page synthesizes distributor pricing, package diagrams, and practical design notes not found in the manufacturer datasheet, helping engineers shorten their selection and sourcing cycle.
EP3C120F780C8N - Cyclone III FPGA, 119K Logic | Intel
Intel EP3C120F780C8N is a Cyclone III field-programmable gate array (FPGA) with 119,088 logic elements, 531 user I/O pins, 3,981,312 embedded-memory bits, and a 780-ball flip-chip ball grid array package. Verified distributor listings identify a 1.2 V core supply and a maximum internal frequency of 402 MHz to 472 MHz, depending on the cited source. The device belongs to the low-cost Cyclone III family and is intended for configurable digital logic, embedded processing, control, and high-density interface designs. An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, memory resources, and I/O cells. Engineers configure these resources after PCB assembly to implement combinational logic, sequential state machines, communications interfaces, processors, and application-specific accelerators. In the hierarchy of programmable devices, an FPGA sits below application-specific integrated circuits in flexibility but above fixed-function controllers in implementation speed and density. Cyclone III extends this model with a power-conscious architecture for cost-sensitive applications. The headline density of 119,088 logic elements supports larger state machines, parallel datapaths, and multiple interface functions in one programmable device. A total of 3,981,312 embedded-memory bits provides distributed or block-oriented storage for FIFOs, buffers, lookup tables, and packet processing. The device also exposes 531 user I/O pins, enabling broad connectivity in systems that aggregate memory buses, communications links, sensors, or control peripherals. Its 780-ball FBGA package uses a 1 mm pitch and occupies approximately 23 mm by 23 mm with a 2.60 mm height. The Cyclone III architecture combines programmable logic fabric with embedded memory and configurable I/O structures. Configuration data defines both logic behavior and routing, allowing the same physical component to serve different functions through a new bitstream. The 1.2 V operating point is central to power estimation, regulator selection, signal integrity, and thermal design. A design should not use either published frequency value as an unconditional system-clock guarantee; timing closure depends on the implemented logic, constraints, I/O standards, placement, routing, and selected speed grade. Typical systems include industrial control and automation equipment, communications infrastructure, video and image processing, test and measurement hardware, and embedded controllers. The logic density is useful when a design must integrate many parallel functions without an ASIC development cycle. Broad I/O availability also suits boards that bridge processor buses, external memory, converters, and high-speed peripheral interfaces. Before layout, verify the exact ball map, supported I/O standards, configuration scheme, power requirements, and timing limits in the manufacturer documentation. Decoupling, continuous core-power planes, clock distribution, signal-return paths, and configuration-interface integrity directly affect operation. The published frequency figures describe device capability but do not replace static timing analysis. This data consolidates verified distributor specifications, package information, inventory and ordering evidence, practical architecture context, and a drop-in comparison. Because the supplied cross-reference search returned no verified pin-compatible substitutes, no alternative is asserted as a drop-in replacement without package, pinout, density, voltage, and timing evidence.
EP3C120F780C8NAE - Cyclone III FPGA, 119K LE, 780-BGA | Altera
The Altera (Intel) EP3C120F780C8NAE is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 18x18 hardware multipliers, housed in a 780-ball FineLine BGA package. The part operates with a core speed grade of 8 (commercial) and is rated for industrial temperature use, delivering a balance of high functionality, low static power, and low unit cost that made Cyclone III a workhorse for high-volume programmable logic designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the foundry. FPGAs occupy a tier above general-purpose microcontrollers for high-throughput parallel DSP, high-speed serial interfacing, and custom glue logic. Within Altera's (now Intel PSG) portfolio, the Cyclone III family sits between the low-cost Cyclone II and the higher-end Cyclone IV/Arria/Cyclone V families, combining a 65 nm TSMC process, M9K memory blocks, and embedded 18x18 multipliers for DSP. Key features of the EP3C120F780C8NAE include four phase-locked loops (PLLs) for clock management, up to 531 user I/O pins, support for external memory interfaces such as DDR, DDR2, and QDR II SRAM, dedicated LVDS channels, and a configuration scheme supporting JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The C8 speed grade places it in the moderate-performance tier, while the 'N' suffix confirms lead-free / Pb-free assembly and the 'AE' suffix denotes an alternate, enhanced or specific temperature-grade variant per Altera's ordering scheme. Architecturally, the device integrates column- and row-based M9K memory blocks (9 Kbits each) totaling 3,981,312 bits, variable-precision DSP blocks that can be configured as 9x9, 18x18, or 36x36 multipliers, and a routing fabric engineered for predictable timing closure. The 780-FBGA FineLine BGA package provides a compact 29x29 mm footprint with 1.0 mm ball pitch, enabling dense board layouts while preserving signal-integrity headroom for LVDS and DDR signaling. Typical applications include industrial motor control, video processing pipelines, software-defined radio, telecom line cards, test and measurement instrumentation, and embedded display controllers. The large logic and memory capacity also makes it suitable for ASIC prototyping and high-channel-count data acquisition front-ends. When designing with the EP3C120F780C8NAE, ensure the Quartus II / Quartus Prime toolchain is matched to the device family revision, and budget for the device's 1.0 V core supply plus separate PLL and I/O bank voltages; the FBGA's 0.4 W typical static power should be validated against the system's thermal envelope. This page synthesizes distributor pricing, drop-in alternatives, and design considerations not found in the manufacturer datasheet alone, helping engineers verify availability, choose compatible substitutes, and accelerate board bring-up.
EP3C120F780I7 - 119K LE Cyclone III FPGA 780-FBGA | Altera/Intel
The Altera/Intel EP3C120F780I7 is a high-density member of the Cyclone® III family of low-cost FPGAs, offering 119,088 logic elements, 531 user I/O pins, and 3,981,312 bits of embedded memory in a 780-ball FineLine BGA package. The "I7" speed grade and "F780" package suffix identify an industrial temperature-range device (-40C to +100C junction) in the 29x29 mm FBGA with 1.0 mm ball pitch. According to the Altera Cyclone III Device Handbook, the EP3C120 is fabricated on a 65 nm low-power CMOS process and is supported by the Quartus II design software. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix, surrounded by programmable I/O cells. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital circuits, from glue logic and bus bridges to high-throughput parallel DSP pipelines and soft-core microprocessors. Unlike a fixed ASIC, the function is defined by a user-supplied bitstream stored in external configuration memory. Key features of the EP3C120F780I7 include up to 531 user I/O pins, 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The device family provides up to 288 embedded 9x9 multipliers and 4 Mbits of on-chip RAM, making it suitable for cost-sensitive mid-density designs. Configuration is supported via passive serial, fast passive parallel, active serial (EPCS), and JTAG modes. Architecturally, the Cyclone III EP3C120 uses a logic-array-based fabric with row and column interconnect, 8-input adaptive logic modules (ALMs), and per-MLAB distributed memory. Process technology is TSMC 65 nm low-power CMOS with 1.2 V core supply, giving a favorable performance-per-watt ratio compared to earlier Cyclone II and Stratix generations. The 780-FBGA package uses a wire-bond die with a controlled-impedance substrate, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecom line cards and baseband prototyping, low-cost software-defined radio, and PCI/PCI Express endpoint bridges. The wide operating temperature range also makes it attractive for military and aerospace subsystems where extended-temperature commercial-grade FPGAs are acceptable. When designing with the EP3C120F780I7, plan configuration memory carefully: the uncompressed bitstream exceeds 25 Mbits, so a 64-Mbit EPCS or parallel flash is typically required. Use the Quartus II PowerPlay analyzer early to model thermal dissipation, and follow the Altera pin connection guidelines for unused I/O banks to avoid leakage. Decoupling should follow the Altera reference design with 100 nF plus 10 µF bulk capacitors per power pin pair. This page synthesizes distributor pricing, drop-in same-family alternatives from the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone.
EP3C120F780I7N - Cyclone III FPGA, 119K LEs, 780-FBGA | Intel
The Intel (formerly Altera) EP3C120F780I7N is a high-density, low-power Cyclone® III Field-Programmable Gate Array (FPGA) delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 maximum user I/O in a 780-ball FineLine BGA package. Built on TSMC's 65 nm low-power process, the EP3C120F780I7N supports up to 472 MHz internal operation with a 1.2 V core supply. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP blocks into a single semiconductor die. FPGAs sit hierarchically between ASICs (custom-designed but expensive and non-reprogrammable) and general-purpose microcontrollers (fixed-architecture, software-driven). Within the Intel FPGA portfolio, the Cyclone III family targets cost-sensitive, power-conscious high-volume applications such as industrial control, video processing, and communications infrastructure, while Stratix parts target high-performance signal processing. Key features include up to 288 embedded 18×18 multipliers for DSP, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, 4 PLLs per device for clock management, and a wide range of LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 'I' speed grade and industrial temperature range (-40 °C to +100 °C) make the EP3C120F780I7N well suited for thermally and electrically harsh environments. Architecturally, the Cyclone III fabric uses 4-input look-up tables (LUTs), M9K embedded memory blocks, and a perimeter I/O ring with up to 8 I/O banks. Configuration is supported via passive serial (AS), active serial (AP), JTAG, and Fast Passive Parallel modes. Designers can use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure. Typical applications include industrial motor control, video surveillance image processing, software-defined radio (SDR), prototyping ASIC replacement, and high-speed serial protocol bridging. The 531 user I/O and ~4 Mbit on-chip memory enable large state machines, multi-channel buffering, and parallel DSP pipelines. When designing with this device, ensure the 780-FBGA PCB layout uses 1.0 mm ball pitch with microvia or via-in-pad technology for reliable assembly. The 65 nm process requires careful decoupling (multiple 0.1 µF + bulk 47 µF per rail) to suppress simultaneous switching noise on the I/O banks. Thermal management must consider the ~6 W typical device dissipation at high toggle rates. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and PCB layout guidance not aggregated in a single manufacturer document.
EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
The Intel / Altera (formerly Altera Corporation) EP3C16E144C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 84 user I/O pins, fabricated on a 65 nm low-power process and housed in a 144-pin LQFP package with exposed thermal pad. An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained. Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing. Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks. Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint. When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation. This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.
EP3C16E144I7N - Cyclone III FPGA, 16K LEs, 144-LQFP | Intel/Altera
The Intel / Altera EP3C16E144I7N is a Cyclone III Field Programmable Gate Array (FPGA) delivering 15,408 logic elements, 516,096 bits of embedded memory, and 84 maximum user I/O pins in a 144-pin LQFP Exposed Pad package. Built on a low-power 65 nm process, this industrial-temperature-grade device targets cost-sensitive, high-volume applications that require programmable logic without the overhead of high-end Stratix devices. An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hard IP blocks such as memory, PLLs, and transceivers. Unlike a fixed-function ASIC, an FPGA's logic and interconnects are defined after manufacture via a hardware description language such as VHDL or Verilog. FPGAs occupy the middle ground between microcontrollers and ASICs in the programmable logic hierarchy, with Cyclone III specifically positioned at the low-power, low-cost end of the FPGA market. Key features of the EP3C16E144I7N include 56 embedded 18x18 multipliers for DSP-style arithmetic, four general-purpose PLLs for clock management, and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. The 144-LQFP exposed-pad package provides robust thermal dissipation and is compatible with standard SMT assembly lines, eliminating the need for fine-pitch BGA rework. Cyclone III FPGAs use a 1.2 V core supply with separate VCCIO banks that can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V for mixed-voltage interfacing. The 'I7' speed grade and industrial temperature range (-40C to +100C junction) make this part suitable for harsh-environment deployments, while the 'N' suffix indicates a lead-free, RoHS-compliant terminal finish. Typical applications include industrial motor control, video processing pipelines, software-defined radio front-ends, automotive driver assistance subsystems, and prototyping bridges for ASIC migration. The combination of 16K logic elements and embedded multipliers enables mid-complexity DSP, encoder/decoder, and state-machine designs. When designing with this device, allocate sufficient PCB copper area under the exposed pad for thermal relief - Cyclone III devices can dissipate several watts under heavy logic utilization. Use Quartus II (or the current Intel Quartus Prime Lite) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III variants, and practical design notes not found in the manufacturer datasheet.
EP3C16F256I7N - Cyclone III FPGA, 15K LEs, 256-FBGA | Intel
The Intel (formerly Altera) EP3C16F256I7N is a member of the Cyclone III family of low-power, high-volume field-programmable gate arrays (FPGAs), offering 15408 logic elements (15K LEs) in a 256-ball FineLine BGA (FBGA) package. The device integrates 516096 bits of embedded memory and supports up to 168 user I/O pins, with 56 embedded 18x18 multipliers enabling DSP-style signal processing on-chip. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacture. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as a programmable logic category, with the Cyclone III family targeting low-power, cost-optimized applications in the sub-100 mW static power envelope. This part is a low-cost variant of the broader programmable logic taxonomy that includes SRAM-based, flash-based, and antifuse-based devices. Key features of the EP3C16F256I7N include support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, mini-LVDS, LVPECL, PCI, PCI-X), up to four general-purpose PLLs per device with fractional synthesis and spread-spectrum capability, and Cyclone III architecture with a logic capacity that maps efficiently to consumer, industrial, and communications designs. The device is fabricated on a TSMC low-leakage 60 nm process that reduces static power consumption by up to 50% compared to the prior generation. The architecture combines a fabric of 15408 logic elements arranged in columns and rows, 504 Kbit of M9K embedded memory blocks (totaling 516 Kbit), 56 18x18 hardware multipliers, and four PLLs. Each logic element contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic for efficient arithmetic and address generation. This combination makes the Cyclone III family a balanced general-purpose FPGA for control-plane and moderate-throughput data-plane tasks. Typical applications include industrial motor control and factory automation, automotive driver assistance and infotainment, consumer video processing, software-defined radio, video surveillance, and telecom infrastructure. The Cyclone III series was widely adopted in designs where the design team wanted the flexibility of FPGA fabric but the unit cost of an ASIC, particularly for low-to-mid volume production. When designing with this part, engineers should reference the Cyclone III Device Handbook for I/O standard and pin assignment details, use the Quartus II design software (Web Edition is free) for synthesis and place-and-route, and provide a configuration memory such as an EPCS or EPCQ flash device on the board for non-volatile configuration. The "I7N" suffix denotes the industrial temperature grade (-40C to +100C junction) and lead-free / Pb-free terminal finish. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical FPGA design notes not found in the manufacturer datasheet.
EP3C16F484C6 - Cyclone III FPGA, 16K LE, 484-BGA | Altera
The Altera (Intel) EP3C16F484C6 is a Cyclone III Field Programmable Gate Array (FPGA) featuring 15,408 logic elements, 516,096 bits of embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA (FBGA) package. It is built on a low-power 65 nm process and is offered in the -C6 speed grade with commercial temperature rating (0C to +85C). What is a Cyclone III FPGA? The Cyclone III family is Altera's low-cost, low-power SRAM-based programmable logic family introduced in 2007, positioned between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices target cost-sensitive, high-volume applications where designers need moderate logic density, on-chip memory, and DSP blocks without paying for transceivers or hard processor cores. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor category, used wherever fixed-function ASICs are too expensive or inflexible. Key features of the EP3C16F484C6 include 56 embedded 18x18 multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The 484-FBGA package exposes the maximum user I/O count of 346 pins, enabling wide parallel buses and high-pin-count peripheral connectivity. Configuration is supported through passive serial (AS), active serial (PS), fast passive parallel (FPP), and JTAG modes. The Cyclone III architecture uses 4-input look-up tables (LUTs) and embedded M9K memory blocks, providing a balanced resource mix for control-plane logic, state machines, and moderate DSP workloads. Compared to the previous Cyclone II generation, Cyclone III cuts dynamic power by approximately 50 percent and adds dedicated hardware multipliers and improved clock networks. Typical applications include industrial motor control, video processing and display bridging, telecom baseband glue logic, prototyping ASIC designs, and embedded vision systems. The wide 484-ball package also makes the EP3C16F484C6 suitable for development boards and evaluation platforms where pin access is valuable. When designing with this part, pay attention to configuration mode pin strapping (MSEL pins), JTAG chain ordering, and bank-based I/O voltage planning. The F484 package is the largest in the EP3C16 family and may require multi-layer PCB stack-ups for fan-out routing. This page synthesizes distributor pricing, package-compatible same-family alternatives, and design considerations not always collected in one place on the manufacturer datasheet.
EP3C16F484C6N - Cyclone III FPGA 16K LE 346 I/O 484-FBGA | Intel
The Intel EP3C16F484C6N is a Cyclone III FPGA from the Altera/Intel low-power FPGA family, featuring 15,408 logic elements, 504 Kbits of embedded memory, and 56 embedded 18x18 multipliers in a 484-ball FineLine BGA package. The device operates from a 1.15V to 1.25V core supply with multiple I/O bank voltages supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards at up to 346 user I/O pins. The Cyclone III family combines high functionality with low static power consumption, making it suited for cost-sensitive high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital circuits. FPGAs sit in the programmable logic hierarchy between fixed-function ASICs (lower flexibility, lower per-unit cost at scale) and microcontrollers (sequential execution, lower parallel throughput). Cyclone III specifically targets the low-power, low-cost end of the FPGA market with TSMC's 65nm process technology. Key features of the EP3C16F484C6N include four phase-locked loops (PLLs) for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and configuration via JTAG, passive serial, or fast passive parallel modes. The device also provides dedicated hardware for PCI Express endpoint, gigabit Ethernet, and basic DSP functions. The Cyclone III architecture uses adaptive logic modules (ALMs) rather than older 4-input LUT structures, achieving higher effective logic density per LE. The device supports commercial (0C to 85C) and industrial (-40C to 100C) temperature grades, with N suffix indicating lead-free, RoHS-compliant packaging suitable for high-volume manufacturing. Typical applications include industrial motor control, video processing, wireline telecommunications, automotive driver assistance, and embedded DSP. Designers use the Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. The 484-FBGA package supports high-density PCB designs using standard 1.0mm ball pitch assembly processes. When designing with this FPGA, ensure the PCB layout provides at least four PCB layers with dedicated power and ground planes for the core and I/O supplies. Decoupling capacitors must be placed as close as possible to each supply pin per Quartus power delivery guidelines, and unused I/O pins should be left floating or tied to ground per the configuration handbook. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16F484C7N - Cyclone III FPGA, 15K LEs, 484-FBGA | Intel
The Intel (formerly Altera) EP3C16F484C7N is a low-power, low-cost Cyclone III Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process and packaged in a 484-ball FineLine BGA (FBGA). It integrates 15,408 logic elements, 504 Kbits of embedded memory, 56 embedded 18x18 multipliers, 4 phase-locked loops (PLLs), and 346 user I/O pins. According to the Cyclone III device family datasheet, the device supports a core voltage of 1.2 V and offers up to 437.5 MHz internal operation. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement arbitrary digital circuits after PCB fabrication. FPGAs sit in the programmable logic hierarchy above simple PLDs and below ASICs, bridging the gap between fixed-function ICs and full-custom silicon. The Cyclone III family in particular targets cost-sensitive, high-volume applications where the per-board BOM cost of a traditional FPGA would be prohibitive, while still offering DSP blocks, on-chip RAM, and high-speed serial capability for parallel digital processing. Key features of the EP3C16F484C7N include 346 LVDS-capable user I/O pins arranged across eight I/O banks, configurable LVDS/LVCMOS/LVTTL support, and dedicated hardware multipliers (up to 56 18x18) for DSP pipelines. The device supports JTAG (IEEE 1149.1) boundary-scan configuration via the EPCS serial configuration device family, plus 4 PLLs for clock synthesis. Speed grade -7 places this part in the mid-performance bin of the Cyclone III family. Cyclone III architecture combines look-up tables (LUTs), embedded memory blocks (M9K), DSP blocks, and routing fabric. The 65 nm process node reduces static leakage versus the prior Cyclone generation, enabling the family to operate with typical power well under 0.5 W for many designs. Cyclone III is widely used in industrial control, motor drive, video processing, and prototyping applications. Typical applications include industrial machine vision, motor control and drive interfaces, low-cost video bridging, LED wall controllers, software-defined radio (SDR) front ends, and ASIC/SoC prototyping. The combination of DSP blocks and a generous logic budget makes the EP3C16F484C7N especially suited to DSP-centric embedded designs. When designing with this device, validate thermal performance for your specific I/O switching profile and ensure the configuration scheme (EPCS flash or JTAG) is provisioned in your PCB layout. Speed grade -7 provides balanced timing margin; faster -8 grades are not stocked for this part number.
EP3C16F484C8N - Cyclone III FPGA 15K LE 484-BGA | Intel
The Intel (formerly Altera) EP3C16F484C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 504 Kbit embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA package. It is specified for commercial temperature range (0C to +85C) at speed grade 8, and is fabricated on a low-power 60 nm process that pairs high functionality with low static and dynamic power. Background Knowledge: A Field Programmable Gate Array (FPGA) is a programmable semiconductor that lets designers implement arbitrary digital logic - combinational, sequential, and memory - via a configuration bitstream. FPGAs sit within the broader taxonomy of programmable logic devices (PLD), bridging the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic. The Cyclone III family is positioned as a low-cost, low-power FPGA family from Intel/Altera, optimized for volume production in industrial, consumer, and communications applications rather than high-end signal processing. Key features include 15,408 logic elements organized in 963 LABs (Logic Array Blocks), 56 embedded 18x18 multipliers supporting up to 70 MHz DSP throughput, and 4 PLLs for clock management. The device also supports external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM through dedicated PHY blocks. Total on-chip RAM is 504 Kbit distributed across M9K memory blocks, sufficient for buffering moderate data streams. Architecturally, Cyclone III uses a LUT-based fabric with embedded multiplier blocks and hard memory controllers, providing deterministic timing and predictable performance across the commercial temperature range. The 60 nm process and 1.2 V core operation help reduce dynamic power versus prior Cyclone generations, making it suitable for thermally-constrained embedded systems. Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototyping, telecommunications line cards, and consumer electronics requiring custom glue logic or moderate DSP. It also serves as a cost-effective prototyping vehicle for ASIC development. When designing with this device, careful attention must be paid to power sequencing, decoupling, and JTAG configuration routing. The 484-BGA package requires a 4-layer minimum PCB with controlled-impedance traces for high-speed interfaces. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes not consolidated in the manufacturer datasheet alone.
EP3C16F484I7 - Cyclone III FPGA, 16K LE, 484-BGA | Intel
The Intel (formerly Altera) EP3C16F484I7 is a low-power Cyclone III Field Programmable Gate Array delivering 15,408 logic elements, 516,096 bits of embedded RAM, and 346 user I/Os in a 484-ball FineLine BGA package, operating across the industrial -40C to +100C temperature range. What is a Cyclone III FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, multipliers, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic, glue logic, DSP pipelines, or even soft-processor systems-on-chip. Cyclone III sits at the low-power, cost-optimized end of Intel's FPGA portfolio, fabricated on a 60 nm TSMC process and tailored for high-volume, power-sensitive designs. Key features include 15,408 logic elements organized into 963 LABs, 504 Kbit of dedicated M9K embedded memory blocks (totaling 516,096 bits), 56 embedded 18x18 multipliers for DSP, four general-purpose PLLs, and Cyclone III's signature low-power architecture that consumes roughly half the static current of the prior Cyclone II generation. The 484-FBGA package exposes 346 user I/Os supporting LVDS, SSTL, HSTL, and LVCMOS standards at up to 640 Mbps LVDS. Cyclone III devices are configured via passive serial, fast passive parallel, active serial, fast active parallel, or JTAG modes using industry-standard Altera/Intel Quartus II or Quartus Prime design software. Bitstream encryption with AES is supported on Cyclone III LS variants, and the family uses SRAM-based configuration cells requiring an external boot PROM or JTAG source. Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, low-cost software-defined radio front-ends, USB/Ethernet bridging, medical imaging pre-processing, and automotive infotainment prototypes. The combination of low unit cost and a robust Quartus toolchain makes Cyclone III a common choice for both prototypes and production runs of 10K-100K units. When designing with this device, ensure your power budget accounts for both static (always-on) consumption and dynamic toggle power, and follow Intel's cyclone III pin connection guidelines to leave unused I/Os properly biased. Bitstream configuration time at 40 MHz DCLK with a serial EPCS flash is typically under 50 ms for a full 16K LE design. This page synthesizes distributor pricing, drop-in Cyclone III speed-grade alternatives, and practical PCB and configuration design notes that complement the manufacturer datasheet.
EP3C16F484I7N - 15408 LE Cyclone III FPGA, 484-FBGA | Altera (Intel)
The Altera (now Intel) EP3C16F484I7N is a Cyclone III family low-power Field-Programmable Gate Array (FPGA) with 15408 logic elements, 516096 bits of embedded memory, and 346 user I/Os, housed in a 484-ball FineLine BGA (FBGA) package. The 'I7' speed/temperature grade denotes an industrial temperature range (-40C to +100C case) with a 7 ns internal timing margin, and the 'N' suffix indicates a lead-free, RoHS-compliant tray packing. The Cyclone III family is fabricated on a 65 nm TSMC low-power process and operates from a 1.2 V core supply, making it one of the lowest-power mid-density FPGAs in its generation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks (LEs), routing channels, and embedded memory/DSP into a single semiconductor. The taxonomy is: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Unlike ASICs, FPGAs are programmed in the field using HDL flows (Verilog/VHDL) and an SRAM configuration bitstream. FPGAs sit above microcontrollers and DSPs in flexibility but below ASICs in cost-per-volume, making them ideal for prototyping, low-volume production, and designs requiring parallel hardware acceleration. Key features of the EP3C16F484I7N include 4 transceivers of 156 MHz / 437.5 MHz PLL support (no multi-gigabit transceivers, but ample general-purpose LVDS), 20 global clock networks, 56 embedded 18x18 multipliers for DSP, and Cyclone III's signature 1.2 V core that delivers roughly 50% lower dynamic power than Cyclone II. Configuration is via serial passive (PS), JTAG, or Altera Fast Passive Parallel modes using the cyclone programming cable or USB-Blaster. The Cyclone III architecture uses an SRAM-based configuration cell backed by a multi-level routing hierarchy (L1/L2/L3/longlines), LAB-based logic array blocks containing 16 LEs each, and embedded M9K memory blocks (typically 56 blocks, 516 kbit total in this device). The 484-FBGA package is a 1.0 mm pitch BGA suitable for 4-6 layer PCBs, supporting high I/O count without demanding fine-line manufacturing. Typical applications include industrial motor control and PLCs, video processing and image filtering, low-cost software-defined radio front-ends, factory automation and machine vision, telecom line cards, and embedded control with Nios II soft-core processors. The 56 hardware multipliers and abundant RAM make it well-suited to DSP pipelines, while the 346 I/Os support parallel bus and high-pin-count industrial protocols. Design consideration: route configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL, nCE) per Altera reference schematics and respect the JTAG chain. Use the Quartus II (or Quartus Prime Lite 18.x for legacy device support) software flow to compile, place-and-route, and generate the .sof/.pof bitstream. The 484-FBGA requires PCB fabrication with 0.4 mm via-in-pad or 0.6 mm dog-bone fanouts and impedance-controlled traces for LVDS. This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16Q240C8N - Cyclone III FPGA 15K LEs PQFP-240 | Altera
The Altera EP3C16Q240C8N is a Cyclone III FPGA with 15,408 logic elements (LEs), 516,096 bits of embedded memory, and up to 160 user I/O pins, housed in a 240-pin fine-pitch Ball-Grid-Array-style QFP package (240-BFQFP / PQFP-240, 32x32 mm). It is fabricated in a low-cost 65-nm process and belongs to the commercial (C) temperature range with speed grade 8 (the most cost-effective speed bin in the family). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks, routing resources, and embedded memory that designers configure in the field using HDL languages such as Verilog and VHDL. In the semiconductor hierarchy, the FPGA sits above fixed-function ASICs and ASSPs in flexibility, and the Cyclone III family targets the low-cost, low-power segment of that market. Key features of the EP3C16Q240C8N include 15,408 LEs organized as approximately 1,920 adaptive logic modules (ALMs), 516,096 bits (63 kbytes) of M9K embedded memory blocks, and up to 160 maximum user I/O including dedicated clock inputs. The M9K blocks support single- and dual-port operation with byte enables and initialization files, making FIFOs and line buffers easy to implement without external SRAM. Technically, the Cyclone III architecture uses 8-input fracturable look-up tables, a hierarchical multi-track interconnect, and a phase-locked-loop (PLL)-based clock network for on-chip frequency synthesis and jitter reduction. Configuration is supported through active serial (AS), passive serial (PS), and JTAG schemes, allowing standard EPCS serial configuration devices to load the bitstream at power-up. The Q240 package supports a maximum I/O count that may be reduced depending on the selected configuration scheme, per the Altera device package information data sheet. Typical applications include industrial motor-control and automation interfaces, video and image processing line cards, communications protocol bridging, and test/measurement glue logic. The 160-I/O budget and 65-nm low static power make it well suited to cost-sensitive volume products that do not need high-end transceivers. Design consideration: the PQFP-240 footprint is large and hand-solderable for prototypes, but its peripheral I/O ring limits signal counts versus BGA alternatives; plan I/O banking carefully to avoid mixing incompatible voltage standards on one bank. This page synthesizes verified distributor stock, drop-in same-package alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.
EP3C16U256C8N - Cyclone III FPGA, 15K LE, 256-UBGA | Altera / Intel
The Intel (formerly Altera) EP3C16U256C8N is a low-power Cyclone III Field-Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, offering 15,408 logic elements, 516,096 bits of embedded RAM, and 168 user I/Os in a 256-ball Ultra FineLine BGA package (Ux256). The 'U256' suffix denotes the plastic Ultra FineLine BGA, and the 'C8' speed grade corresponds to an 8 ns commercial-grade timing classification with -40 °C to +85 °C operating junction range. A Cyclone III FPGA is a SRAM-based programmable logic device that belongs to the family of low-cost, low-power FPGAs targeting high-volume, power-sensitive designs. It sits in the broader hierarchy of programmable logic devices (PLD), positioned between CPLDs and high-performance FPGAs such as Cyclone V / Stratix. Its low static and dynamic power consumption makes it attractive for portable, industrial, and consumer applications that previously used ASICs or ASSPs. Key features of the EP3C16U256C8N include up to 168 single-ended user I/O pins (multi-voltage I/O standards including LVDS, SSTL, LVCMOS, and LVTTL), 56 embedded 18 x 18 multipliers for DSP, four PLLs per device, and 56 M9K memory blocks. The 1.2 V core (VCCINT) with separate VCCIO bank supplies allows mixed-voltage interfacing without external level shifters. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. Typical applications span industrial motor control, video processing pipelines, automotive infotainment prototypes, communication bridges, and consumer display controllers. The Cyclone III architecture is also a popular education platform due to its low cost and Quartus II / Quartus Prime tool support. When designing with this device, pay close attention to the BGA fan-out: the 256-ball U256 package requires microvia or via-in-pad PCB technology. Decoupling must include 0.1 µF caps per VCC pin and bulk caps on each supply rail. Use the Altera / Intel Quartus Prime software (free Lite edition) for synthesis, place-and-route, and configuration file generation. This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical PCB design notes that go beyond what is printed in the manufacturer datasheet.