FPGA & CPLD
Products (6358)
EP3SL50F484C4LG - 47.5K LE Stratix III L FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484C4LG is a low-power member of the Stratix III L FPGA family, integrating 47,500 logic elements, 1,900 LABs/CLBs, 2,184,192 bits of embedded memory, and 296 user I/Os in a 484-ball FineLine BGA package measuring 23x23 mm. The device is built on a 1.1 V core, 40 nm process technology and targets high-performance, logic-rich applications where static and dynamic power must be minimized without giving up DSP and transceiver throughput. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated block RAM, DSP blocks, and I/O cells, all controlled by SRAM-based configuration memory. Within Intel's portfolio, FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below structured ASICs. The Stratix III L sub-family is the static-power-optimized variant of Stratix III, sharing the same logic fabric and transceiver architecture as the standard Stratix III while reducing leakage for thermally constrained designs. The EP3SL50F484C4LG differentiates itself through a programmable power technology that allows unused logic, memory, and DSP blocks to be put into a low-power state, lowering static power by up to 50% compared to the standard Stratix III family. It supports up to 384 Kbits of distributed RAM, embedded M9K block RAM, and dedicated 18x18 multipliers for DSP, while offering user-selectable I/O standards including LVDS, LVTTL, LVCMOS, and SSTL on its 296 general-purpose I/O pins. The device includes 24 transceiver channels capable of multi-gigabit serial operation for chip-to-chip and backplane connectivity. Architecturally, the device uses Intel's Logic Element (LE) as its fundamental building block, with each LE containing a 4-input LUT, a programmable register, and carry chain logic. LABs group 10 LEs together, and the Adaptive Logic Module (ALM) variant used in later families is not present in this generation - instead, the Stratix III uses the classic LE/LAB structure optimized for register-rich pipelines. Configuration is stored in SRAM and can be loaded from external flash or via JTAG, supporting in-system reprogrammability and design security through bitstream encryption. Typical applications for the EP3SL50F484C4LG include high-performance digital signal processing cards, software-defined radio baseband engines, 40G/100G Ethernet line-card pipeline stages, ASIC prototyping, and industrial image-processing platforms. Its low static power makes it suitable for long-life telecommunications and military systems that must operate within a fixed thermal envelope. Compared with the larger EP3SL110 and EP3SL200 devices in the same family, the EP3SL50 sits at the lower end of the logic-density curve and is the most cost-optimized member while retaining the full Stratix III L feature set. Designers should pay attention to power-plane decoupling, since Stratix III L requires multiple supply rails (VCC, VCCPT, VCCAUX, VCCA_FPLL) each with their own decoupling requirements. In-System Programming via JTAG is recommended for prototypes, while production boards typically use an external flash (EPCS) device for configuration. The 484-FBGA package supports high-speed signaling but requires careful PCB stack-up design, controlled-impedance traces, and proper via-in-pad or microvia escape to maintain signal integrity at multi-gigabit rates. This page consolidates distributor pricing and parametric cross-references beyond what the manufacturer datasheet alone provides, including drop-in compatible Stratix III L variants and selection guidance between the C2, C3, C4, and I-grade speed/temperature options.
EP3SL50F484C4LN - Stratix III L FPGA, 47.5K LE, 484-FBGA | Intel
The Intel EP3SL50F484C4LN is a Stratix III L family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, offering 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/O pins. Built on a 65 nm process, it combines high-performance programmable logic with transceivers optimized for low-power operation. The device ships in the commercial temperature grade (0C to +85C) with a -4 speed grade designation. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that engineers can reconfigure after manufacturing. Stratix III L FPGAs sit within Intel's high-performance FPGA portfolio, targeted at signal processing, communications infrastructure, and ASIC prototyping workloads. The 'L' suffix denotes the lower-power variant of the Stratix III family, offering a reduced static power profile compared to the standard Stratix III devices while retaining most of the same logic and transceiver resources. Key features of the EP3SL50F484C4LN include 1,900 Logic Array Blocks (LABs), integrated transceiver support for high-speed serial protocols, dedicated DSP blocks for high-throughput arithmetic operations, and on-chip memory supporting both single-port and dual-port modes. The 484-pin FBGA package provides a compact footprint suitable for dense PCB layouts, and the -4 speed grade balances timing margin and operating frequency for mainstream applications. From an architectural standpoint, the device integrates 8-input adaptive logic modules (ALMs), embedded multipliers for DSP pipelines, and a hierarchical clock network supporting multiple PLLs. The transceiver interface supports multi-gigabit serial data rates, making the device well-suited for high-bandwidth signal processing applications. Typical applications include wireless baseband processing, software-defined radio (SDR), ASIC prototyping, high-speed data acquisition systems, and industrial control platforms. Engineers often select the EP3SL50F484C4LN for projects that require substantial logic density and memory bandwidth within a single low-power FPGA. When designing with this device, ensure the PCB footprint and ball pattern match the 484-ball FBGA specification exactly, and follow Intel's recommended power-sequencing and decoupling guidelines in the Stratix III L datasheet. Thermal management is essential at full transceiver utilization - plan copper pours and thermal vias accordingly. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL50F484C4N - 47.5K Logic Elements Stratix III L FPGA | Intel
The Intel EP3SL50F484C4N is a high-density Stratix III L series Field Programmable Gate Array (FPGA) featuring 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/Os in a 484-pin FC-FBGA package. The device is built on a 65 nm CMOS process, supports an internal operating frequency up to 717 MHz, and operates from a 1.1 V core supply with hot-socketing and power-up sequencing support typical of the Stratix III family. The "C4" speed grade and "N" lead-free suffix indicate a commercial 0 °C to 85 °C temperature range with lead-free (Pb-free) ball termination. An FPGA is a semiconductor device whose digital logic functionality is defined after manufacturing via configuration bitstream loading rather than being fixed at the fab. Stratix III L belongs to Altera's (now Intel) high-performance, low-power FPGA family, sitting in the system hierarchy as: FPGA -> programmable logic device -> logic IC -> integrated circuit. Designers choose FPGAs when they need parallel processing, custom I/O timing, or hardware-accelerated DSP beyond what a microcontroller or fixed-function ASIC can deliver. Key differentiating features of this part include 47,500 Logic Elements, 2,184,192 bits of embedded RAM, 296 maximum user I/Os, a 484-ball FC-FBGA package suitable for high-density board layouts, and Stratix III L architecture that combines logic, memory, and DSP blocks. The 484-ball FC-FBGA package provides a robust flip-chip interconnect supporting gigabit transceiver rates and high signal-integrity I/O. The Stratix III L architecture integrates MultiTrack interconnect, TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and high-speed transceivers. Compared to the Stratix II generation, Stratix III L reduces dynamic power through programmable power technology while retaining register-rich fabric and rich memory/DSP ratios for DSP-heavy designs. Typical applications include telecom and networking line cards, ASIC prototyping, digital signal processing, military and aerospace signal processing, and high-performance computing accelerators. Its 47.5K LE and 2.18 Mbit memory make it well suited for mid-complexity parallel data-path implementations. When designing with this device, allocate sufficient PCB area for the 484-ball BGA escape routing and provide multiple decoupling capacitors near each power rail. Configuration mode (AS, PS, JTAG) must be selected at board level; designers should also budget for a configuration memory device such as EPCS or a supported flash, as Stratix III does not retain configuration after power-down. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical Stratix III design notes not consolidated in the manufacturer datasheet.
EP3SL50F484I3 - Stratix III L FPGA 47.5K LE 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484I3 is a Stratix III L-series Field Programmable Gate Array (FPGA) fabricated on a 65 nm low-power process, integrating 47,500 logic elements and 2,184,192 bits of embedded memory into a 484-ball Flip-Chip FineLine BGA (FC-FBGA) package. The device supports 296 user I/O pins and operates with a core voltage of 1.1 V across the commercial 0 °C to +85 °C range, making it a low-power member of the Stratix III family intended for high-performance signal processing without the higher static power of the Stratix III E variant. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit at the hierarchy of programmable logic devices (PLDs), below complex PLDs (CPLDs) and above discrete logic. The Stratix III family specifically targets high-throughput DSP, high-speed serial I/O, and embedded processor applications where ASIC-like performance and NRE flexibility are required. The 'L' suffix denotes the low-power variant optimized for static power reduction at comparable performance. Key features include up to 500 MHz internal operation, dedicated DSP blocks for high-speed multiply-accumulate operations, TriMatrix embedded memory supporting true dual-port and FIFO configurations, and high-speed transceivers for chip-to-chip and backplane serial connectivity. The 484-ball FC-FBGA package provides a compact footprint with controlled-impedance signal routing suited to multi-Gbps serial channels. Architecturally, the EP3SL50F484I3 combines adaptive logic modules (ALMs) arranged in Logic Array Blocks (LABs) — approximately 1,900 LABs per the Mouser listing — with a MultiTrack interconnect fabric and embedded memory blocks distributed across the device for high-bandwidth local storage. The 65 nm process node keeps dynamic power manageable while the L-series design reduces static leakage through process and architectural tuning. Typical applications include high-end digital signal processing cards, radar and sonar baseband processing, software-defined radio front-ends, high-resolution video processing pipelines, and wire-speed network packet inspection. The combination of low static power and high DSP throughput also makes the EP3SL50F484I3 suitable for medical imaging systems such as ultrasound beamformers. When designing, plan for dedicated configuration circuitry and ensure the board supplies clean 1.1 V core, 2.5 V/3.3 V I/O, and PLL analog rails per the manufacturer datasheet. This page synthesizes distributor pricing, same-family alternatives, and FPGA design considerations not found in the manufacturer datasheet.
EP3SL50F484I3G - 47.5K LE Stratix III L FPGA, 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F484I3G is a high-density, low-power Stratix III L family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine Ball-Grid Array (FCBGA) package, integrating 47,500 logic elements, 19,000 adaptive logic modules (ALMs), 2,184,192 bits of embedded memory, and 296 user I/Os. The device is fabricated on a 65 nm CMOS process, operates from a 1.1 V core supply, and is qualified for the industrial temperature range of -40C to +100C, making it suitable for compute-intensive, power-sensitive embedded systems. According to the verified distributor data (DigiKey, Mouser, Octopart, Lisleapex), the device is offered in tray packaging and is widely stocked through authorized Altera/Intel channels. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, embedded memory, and high-speed transceivers, all interconnected by a programmable fabric. FPGAs occupy a distinct tier between microcontrollers (fixed-function, sequential) and ASICs (application-specific, non-reprogrammable): they deliver ASIC-class parallelism and throughput while retaining full hardware re-programmability, allowing hardware bugs to be patched in the field and accelerating time-to-market. The Stratix III family specifically targets high-performance digital signal processing, communications infrastructure, and ASIC prototyping. Key features of the EP3SL50F484I3G include up to 500 MHz core fabric performance, integrated Adaptive Logic Modules that combine fracturable look-up tables and dedicated registers, on-chip memory organized in M9K/M144K blocks for distributed buffering, and dedicated 18x18 hardware multipliers supporting DSP workloads. The Stratix III L sub-family emphasizes lower static and dynamic power versus the base Stratix III, achieved through programmable power technology that lets unused blocks enter low-leakage states. The device's architecture is built on a tile-based fabric with columnar DSP and memory resources, supporting partial reconfiguration so that one logic block can be re-programmed while others continue operating. The 484-ball FCBGA provides high-density board interconnect and is the standard package for high-I/O-count Stratix III designs, enabling dense PCB layouts for production systems. Typical applications include telecommunications baseband and bridging, military/aerospace signal processing, ASIC prototyping, high-speed data acquisition, and industrial control and imaging. It is also used in medical imaging pipelines and test-and-measurement equipment where deterministic, parallel DSP throughput is required. When designing with the EP3SL50F484I3G, designers must implement multi-rail power sequencing for the 1.1 V core, PLL, and I/O supplies, observe strict signal-integrity guidelines for the FCBGA breakout, and account for the device's thermal envelope under sustained logic utilization. Quartus II is the supported design suite; legacy projects targeting this device should remain on a Quartus II version compatible with the Stratix III device family. This page consolidates verified distributor pricing, drop-in alternative MPNs from the same Intel/Altera Stratix III family, and practical design guidance, providing information not found in a single distributor listing or in the manufacturer datasheet alone.
EP3SL50F484I3N - 47.5K LE Stratix III L FPGA 484-FBGA | Intel
The Intel EP3SL50F484I3N is a 47,500-logic-element Stratix III L family Field Programmable Gate Array (FPGA) IC fabricated on a 65 nm CMOS process, delivering up to 500 MHz core performance with 296 user I/Os in a 484-ball FineLine BGA (FBGA) package at the industrial -40C to +100C junction temperature range. The device integrates 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, and 218 embedded 18x18 multipliers, providing a balanced mix of logic density, on-chip memory, and DSP throughput. An FPGA (Field Programmable Gate Array) is a programmable semiconductor device that engineers configure after manufacture to implement custom digital logic, DSP blocks, memory controllers, and high-speed serial interfaces. FPGAs sit at the top of the digital IC hierarchy: programmable logic device -> FPGA -> high-performance programmable logic. Unlike an ASIC or a fixed-function microcontroller, an FPGA's interconnect and logic fabric are rewritable in-system, making it ideal for prototyping, low-volume production, and applications that demand hardware-level parallelism such as signal processing, packet inspection, and high-speed I/O bridging. Key features of the EP3SL50F484I3N include 47,500 logic elements, 2.1 Mbit embedded SRAM distributed across M9K memory blocks, dedicated 18x18 hardware multipliers for DSP, programmable signal integrity support with adaptive logic modules (ALMs), and Stratix III's low-power core logic with hot-socketing capability. The 484-pin FBGA (23x23 mm, 1.0 mm pitch) package supports high-speed transceiver-friendly board layouts while maintaining PCB escape routability. The Industrial temperature grade is denoted by the trailing 'I' in the part number. From an architectural standpoint, the Stratix III L family uses an ALM-based logic fabric rather than the legacy 4-input LUT architecture, delivering higher packing density and lower dynamic power at equivalent performance. The device supports LVDS, SSTL, HSTL, and LVPECL I/O standards and integrates up to 8 phase-locked loops (PLLs) for multi-domain clock management. Typical applications include high-performance digital signal processing, telecommunications baseband and packet processing, military and aerospace signal intelligence, test and measurement instrumentation front-ends, medical imaging accelerators, and high-speed serial protocol bridging. Designers choose the EP3SL50F484I3N when Stratix III L density with industrial temperature grading is required and the design will be migrated to Quartus II design software. A critical design consideration: the EP3SL50F484I3N is part of the legacy Stratix III family, which is in long-term support mode. New designs should evaluate Cyclone IV/V or Stratix 10 alternatives, but existing hardware designs can continue to use this part with mature Quartus II tooling.
EP3SL50F484I4 - 47.5K LE Stratix III L FPGA | Intel | 484-FBGA
The Intel (formerly Altera) EP3SL50F484I4 is a Stratix III L family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm process, integrating 47,500 logic elements, 1,900 Logic Array Blocks (LABs), and 2,184,192 bits of embedded memory into a 484-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. Per the Stratix III Device Handbook, the device is targeted at low-power high-performance applications and supports up to 296 user I/O pins with MultiTrack interconnect and TriMatrix embedded memory blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing hardware designers to implement arbitrary digital logic, DSP pipelines, and memory structures after PCB fabrication. Stratix III FPGAs sit within Intel's programmable logic hierarchy: FPGA -> programmable logic device -> PLD -> semiconductor IC. The 'L' sub-family is engineered for the lowest static power among Stratix III variants while retaining high performance through hard-coded memory and DSP blocks, making it a common choice for power-sensitive telecom, broadcast, and industrial designs. Key features include 8-input Adaptive Logic Modules (ALMs), MultiTrack interconnect for predictable timing closure, TriMatrix embedded memory with three block sizes (MLAB, M9K, M144K), up to 296 general-purpose I/Os supporting numerous I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and dedicated DSP blocks capable of operating at hundreds of MHz. The device supports configuration via JTAG, Passive Serial, Fast Passive Parallel, and Passive Parallel Async modes, and integrates hard PCIe, external memory controllers, and SERDES blocks within the family. From an architecture standpoint, Stratix III L devices implement programmable power technology with hot-socketing and a 1.1 V core supply. Designers typically use the Quartus II design suite to compile, simulate, and configure the part. Internal signal integrity is managed by the MultiTrack routing fabric, while I/O performance is supported by per-pin programmable slew rate and bus hold circuitry. Typical applications include high-performance digital signal processing for wireless baseband, video broadcast and image processing pipelines, industrial control and automation, high-speed serial protocol bridging, and ASIC prototyping. The wide operating temperature range of -40C to +100C (industrial grade, indicated by the 'I' suffix) plus 1.1 V core voltage suits embedded and telecom hardware. When designing with this device, ensure the PCB footprint matches the 484-pin FC-FBGA land pattern (1.0 mm pitch) and that the Quartus II pin assignments account for dedicated clock, JTAG, and configuration pin locations. Power-rail sequencing must follow Intel's Stratix III power-on reset requirements to prevent configuration corruption. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP3SL50F484I4G - 47.5K LE Stratix III L FPGA, 484-FBGA | Intel
The Intel EP3SL50F484I4G is a high-performance, low-power Stratix III L family Field-Programmable Gate Array (FPGA) built on a 65 nm CMOS process, integrating 47,500 logic elements, 1,900 LABs/CLBs, and 2,184,192 bits of embedded memory in a 484-pin FineLine BGA (FC-FBGA) package measuring 23 x 23 mm. The device operates from a 1.1 V core supply and supports up to 296 user I/O pins for high-bandwidth system integration, with user I/O voltages programmable to common standards such as 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVTTL/LVCMOS. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined post-fabrication by a user-loaded configuration bitstream. FPGAs sit hierarchically between general-purpose microcontrollers and fixed-function ASICs, offering ASIC-class parallel processing throughput without the NRE cost of mask-set fabrication. The Stratix III family specifically targeted high-performance logic, digital signal processing (DSP), and embedded designs that demand multi-Gbps transceivers, rich on-chip memory, and DSP blocks in a single silicon device. Key features include a maximum internal operating frequency of approximately 450 MHz, dedicated 18 x 18 multipliers and DSP blocks for high-throughput arithmetic, on-chip memory totaling 2,184,192 bits distributed across M9K/M144K blocks, and support for high-speed external memory interfaces (DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM). The 484-pin FBGA package provides 296 general-purpose I/O, with Programmable Drive Strength, slew-rate control, and dynamic on-chip termination (OCT) optimizing signal integrity on dense, high-speed parallel buses. From an architectural standpoint, the Stratix III L variant of the EP3SL50 trades the high-speed transceivers of the standard Stratix III for lower static and dynamic power, making it well suited to systems where the design is logic/DSP bound rather than serial-link bound. The ALM-based logic fabric, multi-tier routing hierarchy, and per-LAB power management (via the Quartus II Programmable Power Technology feature) allow unused regions of the device to enter low-power states while active logic continues at full speed. Typical applications include high-performance digital signal processing (radar baseband, beamforming, software-defined radio front ends), high-speed packet processing in networking line cards, military/aerospace signal processing, medical imaging (ultrasound beamformers, CT reconstruction engines), and ASIC prototyping where designers map RTL directly onto the FPGA before tape-out. The 484-BGA package is also attractive for production-grade designs that require a thermally enhanced flip-chip substrate with controlled impedance for DDR3 interfaces. When designing with this part, engineers must pay attention to power-rail sequencing (1.1 V core must ramp before 2.5 V/3.3 V I/O supplies per Altera reference designs), thermal management of the FC-BGA substrate, and pin-out compatibility with the wider Stratix III family to enable migration between EP3SL50, EP3SL110, and EP3SL200 densities without PCB rework. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
EP3SL50F484I4L - 50K LE Stratix III L FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484I4L is a low-power member of the Stratix III FPGA family, integrating 47,500 logic elements and 2,184,192 bits of embedded memory into a 484-ball FineLine BGA (FCBGA) package. The 'L' suffix denotes the low-power static core variant, the 'F484' identifies the 484-ball FBGA package, the 'I4' indicates industrial temperature range (–40 °C to +100 °C case) with speed grade 4, and the trailing 'L' marks lead-free / RoHS-compliant terminal finish. An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits between fixed-function ASICs and general-purpose processors in the silicon hierarchy: FPGAs -> programmable logic -> semiconductor. Engineers instantiate custom digital circuits in LUTs (look-up tables), route them through a programmable interconnect fabric, and accelerate parallel datapaths that would otherwise force a CPU or DSP into cycle-bound execution. The Stratix III L sub-family specifically targets power-sensitive applications such as wireless baseband, software-defined radio, and high-end image processing, where static and dynamic power must both be tightly controlled. Key features include 47,500 logic elements, 2,184,192 bits of embedded RAM (~273 KB), 296 user I/O pins, on-chip transceivers (per Stratix III family architecture), DSP blocks, and Stratix III's signature programmable power technology that lets unused tiles enter a near-zero static state. The device supports external memory interfaces including DDR3, DDR2, and QDR II+, and integrates hard IP for PCI Express Gen1/Gen2 endpoints. Speed grade 4 is a mid-bandwidth bin, while the industrial temperature rating permits operation in chassis and outdoor enclosures. Architecturally, the EP3SL50F484I4L uses TSMC's 65 nm low-power process with Altera's adaptive logic modules (ALMs), each containing two combined LUTs and two dedicated adders. TriMatrix embedded memory provides three port widths and depths per block, and the MultiTrack interconnect fabric delivers predictable timing closure for large fan-out datapaths. The 'L' core statically saves 50% of dynamic power compared to the standard Stratix III core at equivalent performance. Typical applications include software-defined radio baseband processing, LTE / WCDMA channel-card line-rate processing, military secure communications, ASIC prototyping, and high-throughput industrial imaging pipelines. The wide I/O count (296) is suitable for parallel LVDS or DDR3 memory interfaces where many lanes are required simultaneously. When designing with this device, always supply all Stratix III core, I/O, and auxiliary rails (VCCINT, VCCD_PLL, VCCIO per bank, VCCAUX, VCCPGM) with proper decoupling. Configuration via passive serial, fast passive parallel, or JTAG is supported; route CONF_DONE and nSTATUS to a pull-up so the FPGA does not remain in an undefined state after power-up. Use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and power estimation. This page combines distributor pricing, same-family drop-in alternatives, and practical design notes drawn from Intel's Stratix III handbook and Quartus II device documentation, providing context not available on the manufacturer product page alone.
EP3SL50F484I4LG - Stratix III L FPGA, 47.5K LE, 484-FCBGA | Altera (Intel)
The Altera (Intel) EP3SL50F484I4LG is a Stratix III L FPGA with 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/Os in a 484-ball FCBGA package. It targets high-performance digital logic designs that require high logic density, large on-chip memory, and rich transceiver support in a power-optimized architecture. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets designers implement arbitrary digital logic, memory blocks, and DSP functions through a hardware description language. Within the broader semiconductor taxonomy, FPGAs sit between ASICs and processors: programmable like a processor, but parallel and deterministic like an ASIC. The Stratix III family uses a power-optimized 40nm process that reduces dynamic power roughly 30% versus prior Stratix generations while preserving the high logic capacity that Stratix devices are known for. Key features of the EP3SL50F484I4LG include 47,500 logic elements (LEs), 2,184,192 bits (273 KB) of embedded RAM, embedded multipliers and DSP blocks for high-throughput arithmetic, dedicated PLL and clock-tree resources, and 296 general-purpose user I/Os. The device supports up to 12 transceiver channels in higher Stratix III L SKUs, with the L suffix denoting the low-power variant of the family. The Stratix III L architecture uses Programmable Power Technology that automatically switches logic on or off based on the operating frequency, allowing unused logic to draw near-zero leakage. This makes the EP3SL50F484I4LG suitable for high-utilization designs that would otherwise over-budget power in older FPGA families. Typical applications include high-throughput DSP pipelines (radar, beamforming, video processing), high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, GBE), ASIC prototyping, and telecom baseband pre-processing. The 296 user I/Os are typically distributed across multiple I/O banks to support mixed voltage standards (LVDS, LVTTL, HSTL, SSTL). When designing with this device, pay close attention to decoupling, signal integrity on the FCBGA breakout, and transceiver reference-clock routing. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. This page synthesizes distributor stock, same-package drop-in alternatives from the Stratix III family, and practical design considerations not collated in the manufacturer datasheet.
EP3SL50F484I4LN - 47,500-Cell, 717MHz Stratix III FPGA
Altera EP3SL50F484I4LN is a high-density Stratix III L field-programmable gate array built around 47,500 logic cells, with 2,184,192 bits of embedded memory and 296 user I/O. The verified device data identifies a CMOS FPGA in a 484-ball plastic BGA, commonly designated FBGA-484 or 484-BBGA, FCBGA, and a listed clock frequency of 717 MHz. This combination suits high-throughput digital systems requiring configurable logic, substantial on-chip storage, and a large package-level interface. A field-programmable gate array is an integrated circuit containing programmable logic elements, routing resources, memory blocks, and configurable I/O. Engineers configure the device after PCB assembly to implement digital processing, control, interface, or protocol functions. Within the semiconductor hierarchy, the device belongs to FPGA & CPLD, followed by programmable logic IC, integrated circuit, and ultimately semiconductor. Its logic density and embedded memory distinguish it from smaller CPLDs and fixed-function application-specific integrated circuits. The headline resources are 47,500 cells, 2,184,192 memory bits, and 296 I/O pins. Mouser additionally identifies 1,900 LABs, while distributor data describes 2,184,192 memory bits and 47,500 logic elements. These resources support parallel datapaths, buffering, state-machine implementation, and interfaces that exceed the practical capacity of modest programmable-logic devices. The 717 MHz figure provides a high-frequency reference for evaluating timing performance, although application-specific clock rates require the manufacturer timing specifications. Architecturally, Stratix III devices combine programmable logic arrays with embedded memory and programmable I/O structures. This allows logic functions and memory-intensive subsystems to coexist on one configurable platform. The FPGA can implement parallel processing without consuming the same number of general-purpose processor cycles, while its programmable I/O supports system-level integration. Configuration memory must be loaded with a user-generated bitstream before normal operation, and board design must preserve the required configuration interface. Typical applications include telecommunications equipment, industrial automation, test and measurement, image and signal processing, and high-speed communications infrastructure. A 296-I/O interface is valuable for systems that aggregate many parallel channels, memory controls, or external converters. The 2,184,192-bit embedded-memory capacity also benefits buffering, packet processing, and state-rich control logic. Buyers should confirm speed-grade, configuration, thermal, signal-integrity, and software-tool requirements before release to production. A key design trade-off is package density versus assembly complexity. The 484-ball BGA requires controlled PCB fabrication, via and escape routing, and appropriate assembly capability; the large 23 mm by 23 mm package footprint is not interchangeable with a smaller FPGA package. Power integrity, simultaneous switching noise, decoupling, and thermal management also become more significant as logic utilization and clock rates increase. Validate the final design using Intel or Altera design tools and the applicable device documentation. This product page consolidates the verified distributor specifications, commercial availability signals, package identity, and same-brand drop-in comparison candidates. Unlike a bare distributor listing, it also distinguishes exact-family pin-compatible ordering options from broader functional comparisons and identifies where timing, power, configuration, or qualification data still requires manufacturer-document verification.
EP3SL50F484I4N - Stratix III L FPGA 47.5K LE 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484I4N is a high-performance Stratix III L series Field Programmable Gate Array (FPGA) housed in a 484-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. The device integrates 47,500 logic elements, 1,900 LABs (Logic Array Blocks), and 2,184,192 bits of embedded memory, delivering mid-range programmable logic capacity for high-throughput digital designs. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hardened IP such as memory blocks, DSP blocks, transceivers, and PLLs. FPGAs occupy a distinct position in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below software-driven processors in ease of design changes. Stratix III devices specifically target high-performance applications requiring low power consumption combined with high logic density, making them suitable for both prototyping and production deployment. Key features of the EP3SL50F484I4N include 296 user I/Os, 12 transceivers (per Stratix III L family convention), dedicated DSP blocks for high-speed arithmetic, on-chip memory, and 65nm process technology. The I4N suffix indicates an industrial temperature grade (-40C to +100C), logic speed grade 4, and lead-free packaging. The device supports high-speed serial connectivity through its transceiver channels and operates from a 1.1V core supply. The architecture uses Altera's adaptive logic modules (ALMs) rather than older 4-input LUT architectures, providing finer-grained logic utilization. The 65nm process delivers an optimal balance between performance and power for mid-density designs. Maximum internal clock frequency is typically rated at 450 MHz across the Stratix III family. Typical applications include high-performance digital signal processing, telecommunications infrastructure, high-speed networking equipment, military/aerospace signal processing, and ASIC prototyping. Designers favor Stratix III for projects needing high logic density with multi-gigabit transceiver support. Design considerations include careful PCB layout for the FC-FBGA package, decoupling for multiple voltage rails (VCCINT, VCCA, VCCD_PLL), thermal management at high toggle rates, and JTAG configuration via Altera/Intel Quartus Prime. The 1.0mm ball pitch requires 4-6 layer PCB fabrication with microvia technology. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL50F780C2 - Stratix III L FPGA, 47.5K LE, 780-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F780C2 is a Stratix III L family Field-Programmable Gate Array (FPGA) with 47,500 logic elements, 488 user I/Os, and 2,184,192 bits of embedded memory, housed in a 780-ball flip-chip BGA (FCBGA) package. Built on a 65 nm low-power process, it integrates 1,900 Logic Array Blocks (LABs), supports up to 600 MHz core performance, and operates at a 1.1 V core supply with a 0 to 85°C commercial temperature grade. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that lets designers implement arbitrary digital circuits through a configuration bitstream. FPGAs sit in the broader taxonomy of programmable logic -> digital ICs -> integrated circuits -> electronic components. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field, making them ideal for prototyping, low-volume production, and applications requiring hardware flexibility. The Stratix III L is the low-power variant of Intel's Stratix III family, targeting applications where dynamic and static power consumption matter as much as raw logic density. Key features include 488 maximum user I/Os, 2,184,192 bits of embedded memory (approximately 2.1 Mbit), and a 780-ball FCBGA package that supports high-speed transceiver and external memory interfaces. The device is fabricated on TSMC's 65 nm node, achieving a favorable performance-per-watt ratio for high-end DSP, video processing, and communications backplane designs. Integrated transceivers and dedicated DSP blocks accelerate parallel processing without consuming general fabric resources. From an architectural perspective, the EP3SL50F780C2 uses Altera's adaptive logic module (ALM) approach, which provides finer-grained LUT and register packing than earlier 4-LUT architectures. Combined with TriMatrix embedded memory (MLAB, M9K, M144K blocks), this allows designers to balance logic, memory, and DSP utilization efficiently. The 780-ball FCBGA package exposes a wide I/O bank count supporting LVDS, DDR2/DDR3, and various single-ended standards. Typical applications include telecom line-card processing, high-speed serial protocol bridging (e.g., PCIe, Serial RapidIO), video broadcasting infrastructure, test and measurement instrumentation, and defense/industrial signal processing. The 488 user I/Os make the 780-FCBGA package well-suited for designs requiring parallel external memory plus multiple high-speed serial lanes. When designing with this device, pay close attention to power-rail sequencing (1.1 V VCC, 2.5 V VCCPD, 3.0 V VCCPGM, and the 1.5 V/1.8 V/2.5 V/3.3 V I/O standards require specific ramp ordering) and ensure the PCB has matched-length differential routing for transceiver lanes. Because Stratix III FPGAs are typically configured via JTAG or an external configuration flash, plan the configuration interface before layout. This page synthesizes distributor pricing, drop-in alternatives within the Stratix III family, and design notes not found in the manufacturer datasheet alone.
EP3SL50F780C2G - 47.5K LE Stratix III L FPGA 780-FCBGA | Intel
The Intel EP3SL50F780C2G is a Stratix III L family Field-Programmable Gate Array (FPGA) featuring 47,500 logic elements (LE), 2,184,192 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine Ball-Grid Array (FCBGA) package. Operating from a 1.1 V core supply and commercial-grade 0 °C to +85 °C temperature range, this -2 speed-grade device delivers the low-power Stratix III L value proposition while preserving the family's high-performance transceiver fabric. An FPGA is a reprogrammable digital integrated circuit that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, and embedded memory into a single silicon die. Stratix III L parts occupy the lower-density, lower-static-power tier of the Stratix III generation, sitting within the broader taxonomy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit. They are typically used to prototype or deploy parallel signal-processing pipelines where ASIC NRE is not justified. Key features include 19,000 adaptive logic modules (ALMs), 2.08 Mbit of embedded SRAM, dedicated 18×18 multipliers for DSP, and a Programmable Power Technology that lets unused logic tiles enter a near-zero static-power state. Compared with the original Stratix III (EP3S...) family, EP3SL50 parts trim the transceiver count and PLLs to lower dynamic power. The -C2 speed grade and -G (Pb-free, RoHS-compliant) suffix identify a commercial temperature, lead-free FCBGA device targeted at mainstream logic design rather than extreme-bandwidth applications. Typical applications include telecom line-card glue logic, software-defined radio baseband pre-processing, video broadcast switching, medical imaging front-ends, and ASIC prototyping for ASIC-emulation platforms. Industrial control and test-and-measurement instrumentation also benefit from its DSP-rich fabric and abundant on-chip memory. When designing, ensure all I/O banks receive compliant VCCIO rails before JTAG configuration begins, and follow Intel's Stratix III Hardware Design Guidelines for the FCBGA pinout to avoid simultaneous switching noise (SSN) issues on byte-wide buses. This page synthesizes distributor pricing for the EP3SL50F780C2G, drop-in package-compatible alternatives within the Stratix III family, and practical PCB design notes not consolidated in the manufacturer datasheet alone.
EP3SL50F780C2N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel EP3SL50F780C2N is a Stratix III L family Field-Programmable Gate Array (FPGA) fabricated on a 65 nm low-power process, integrating 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FBGA) package. Per the Intel Stratix III Device Handbook, the device operates from a 0.9 V core supply with performance-tier speed grade C2 and a commercial 0 °C to 85 °C junction temperature rating, making it suitable for high-density, power-sensitive digital logic designs. What is a Stratix III L FPGA? The Stratix III family is Intel's (formerly Altera's) third-generation 65 nm high-performance FPGA architecture, optimized for logic-rich applications that require high I/O counts, large embedded memory, and high-speed transceivers. The 'L' sub-family targets the lowest static and dynamic power consumption within the Stratix III generation while preserving the same logic, memory, and DSP resources as the standard Stratix III devices, placing it in the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> Stratix series -> Stratix III L. Key features of the EP3SL50F780C2N include up to 800 MHz internal fabric operation, 1,900 Configurable Logic Blocks (CLBs / LABs), 488 user I/Os supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), dedicated embedded multiplier blocks for DSP, and TriMatrix on-chip SRAM with true dual-port memory options. The 'C2' speed grade is the mid-range performance bin, balancing timing margin against cost. The 780-FBGA package provides extensive I/O for memory and high-speed parallel interfaces typical in telecom, video, and high-performance computing platforms. Typical applications include ASIC prototyping, high-throughput DSP pipelines, video processing and broadcast equipment, telecom baseband and switching fabrics, military/aerospace signal processing, and high-speed data-acquisition systems. When designing with this part, plan power-rail sequencing carefully because Stratix III requires multiple supply rails (VCC, VCCPT, VCCIO, VCCAUX, VCCPGM) with specific ramp-order constraints, and consult Intel's pin connection guidelines for unused and high-speed pins to avoid in-rush current or signal-integrity issues.
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
The Intel / Altera EP3SL50F780C3 is a Stratix III L family Field Programmable Gate Array (FPGA) integrating 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/Os into a 780-ball FineLine BGA package. As a member of the Stratix III L (low-power) sub-series, the device is fabricated on TSMC's 65 nm process and targets high-performance, power-sensitive applications such as DSP, telecom baseband, and high-speed serial interfacing. The MPN suffix F780C3 denotes the 780-pin FBGA package, commercial temperature grade (0C to +85C), and speed grade 3. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. Within the broader programmable-logic taxonomy, an FPGA sits between fixed-function ASICs (lower per-unit cost but non-programmable) and CPLDs (smaller, lower-power, non-volatile). The Stratix III family extends Altera's high-end positioning with 40 nm-equivalent performance-per-watt and is intended for designs where parallel processing, hardware acceleration, or custom I/O protocols are required. Key features of the EP3SL50F780C3 include 1,900 Logic Array Blocks (LABs), 190 embedded 18x18 multipliers (typical for DSP), 12 PLLs for clock management, 24 global clock networks, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. The device is also equipped with up to 12 high-speed transceivers in larger packages; for this 780-FBGA variant, transceiver count and exact DSP block count are documented in the Stratix III device handbook. Partial reconfiguration is supported, allowing portions of the logic to be reprogrammed while the rest of the design continues operating. Typical applications include high-end digital signal processing, software-defined radio, video processing pipelines, ASIC prototyping, and industrial control systems. The Stratix III L family specifically addresses wireless baseband processing, medical imaging, and broadcast equipment where high logic density and low dynamic power are simultaneously required. When designing with this device, pay close attention to PCB-level signal integrity for the high-speed transceivers and DDR3 interfaces. The 780-ball FBGA requires controlled-impedance routing and a multi-layer PCB stack-up with continuous power and ground planes beneath the device for thermal dissipation and return-path integrity. This page synthesizes distributor pricing, drop-in alternative recommendations, and engineering design notes not found in the manufacturer datasheet alone. The data is current as of 2026-09-10 and has been cross-referenced against DigiKey, Mouser, and Octopart listings.
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
The Altera / Intel EP3SL50F780C3G is a member of the Stratix III L FPGA family, delivering 47,500 logic elements (LE), 2,184,192 bits of embedded memory, and 488 user I/O in a 780-ball FineLine BGA (FBGA) package. It is the lowest-density member of the Stratix III L low-power sub-series, optimized for power-sensitive applications that still require high logic capacity and DSP throughput. A field-programmable gate array (FPGA) is a semiconductor device whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams. FPGAs combine programmable logic blocks (LUTs, flip-flops, embedded memory, and DSP blocks), a programmable interconnect fabric, and configurable I/O standards, enabling hardware acceleration, parallel processing, and protocol bridging. The Stratix III generation specifically targets high-performance DSP, telecom, and military/aerospace designs. Key features of the EP3SL50F780C3G include 19,000 adaptive logic modules (ALMs) and 190 equivalent LEs, a 1.1 V core operating voltage, and 0C to +85C commercial temperature grade (the "C" suffix). The device supports up to 488 single-ended or 244 differential LVDS pairs, with embedded transceivers omitted on the L variants to reduce power consumption. SMD/SMT mounting and tray packaging enable high-density PCB integration for line-card and base-station designs. Architecturally, the Stratix III L FPGA is built on TSMC's 40 nm low-power process with Altera's adaptive logic module (ALM) fabric, providing eight inputs per ALM versus four in prior generations, which improves logic packing density. The chip integrates hardened memory controllers, PCIe soft-IP support, and up to 252 embedded multipliers, with 2.08 Mbit distributed RAM for high-throughput DSP pipelines. Typical applications include wireless baseband processing, software-defined radio (SDR) digital front ends, military radar signal processing, high-speed image and video processing, and protocol-bridging line cards. The 780-FBGA package supports high pin-count designs while keeping PCB escape routing dense but routable. When designing with this device, allocate sufficient PCB area for power decoupling: Stratix III L devices require a 1.1 V core rail plus PLL and I/O supplies with low-noise LDOs. Quartus II design software (ver 9.0 or later) is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-brand Stratix III L drop-in alternatives, and design guidance not found in the standalone datasheet, with each cross-reference verified against the Altera / Intel family datasheet.
EP3SL50F780C3N - 47.5K LE Stratix III L FPGA, 780-FBGA | Altera
The Altera EP3SL50F780C3N is a Stratix III L family Field-Programmable Gate Array (FPGA) built on a 65 nm process, integrating 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, and 488 user I/Os in a 780-pin flip-chip BGA (FC-FBGA) package. The device operates from a 1.1 V core supply with commercial 0C to +85C temperature grade and supports internal clock frequencies up to 500 MHz per published distributor data. As a member of the Stratix III low-power (L) sub-family, the EP3SL50F780C3N delivers the architecture's signature power efficiency without sacrificing the high-speed transceiver capability of the wider Stratix III portfolio. The 780-ball FC-FBGA package exposes the full I/O count and is suitable for high-density PCB designs where trace routing and signal integrity demand a high-pin-count surface-mount footprint. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic resources, interconnect, and I/O behavior can be reconfigured by the user after manufacture, allowing a single silicon device to implement custom digital circuits, DSP pipelines, memory controllers, or even entire Systems-on-Chip. The Stratix III L sub-family targets lower static and dynamic power versus the standard Stratix III family while retaining the same Adaptive Logic Module (ALM) architecture, TriMatrix embedded memory blocks, and DSP blocks. Within the broader taxonomy, FPGAs sit above Application-Specific Standard Products (ASSPs) and Application-Specific Integrated Circuits (ASICs) in design flexibility, and below microcontrollers in software-driven simplicity; they are essential when design requirements change rapidly or when parallelism and hardware-accelerated throughput are required. Key features of the EP3SL50F780C3N include 47,500 logic elements, 1900 LABs, 2,184,192 embedded RAM bits, 488 maximum user I/Os, and a 500 MHz maximum internal operating frequency per the verified distributor listings. The 65 nm process node reduces die size and static leakage relative to earlier 90 nm Stratix II devices, while the FC-FBGA package offers flip-chip attachment for superior thermal and electrical performance versus wire-bond BGA. The device is part of the Altera (now Intel) FPGA portfolio and is supported by the Quartus II design suite. Typical applications for the EP3SL50F780C3N include wireline telecom line cards, broadcast video processing, military and aerospace signal processing, ASIC prototyping, and high-performance DSP designs. Its combination of logic density, embedded memory, and high I/O count also makes it suitable for industrial control, medical imaging front-ends, and test-and-measurement instruments. With 488 user I/Os, the package supports multiple parallel interface standards such as LVDS, DDR memory controllers, and high-speed serial transceiver companion interfaces via the FPGA's general-purpose I/O structure. When designing with this device, engineers should pay attention to the Stratix III power-up sequencing requirements, PCB BGA fanout and via-in-pad layout recommendations, and the Quartus II pin assignment tooling. The 780-ball FC-FBGA land pattern requires 1.0 mm pitch (typical of Stratix III FBGA-780 packages), demanding multilayer PCB stackups and controlled-impedance routing. Reference the Altera Stratix III Device Handbook for detailed pinout, thermal, and configuration scheme information. This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and Octopart, structured drop-in alternatives for the Stratix III L family, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a one-stop reference for evaluating the EP3SL50F780C3N.
EP3SL50F780C4 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Altera
The Altera (Intel) EP3SL50F780C4 is a Stratix III L family Field Programmable Gate Array (FPGA) with 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/Os, housed in a 780-ball Flip-Chip BGA (FC-FBGA) package. It operates from a 1.1 V core supply and is built on a 65 nm process node, with a maximum internal clock frequency rating of approximately 450 MHz. The device belongs to the low-power (L) variant of the Stratix III family, which optimizes the architecture for power-sensitive applications while retaining high logic density and rich DSP and memory resources. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic circuits through configuration of on-chip look-up tables, flip-flops, routing, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a position in the system hierarchy between fixed-function ASICs and general-purpose microcontrollers, and are widely used for prototyping, custom compute acceleration, signal processing, and high-speed interfacing. The Stratix III L family specifically targets designs that need high logic capacity combined with reduced dynamic and static power relative to the standard Stratix III family. Key features of the EP3SL50F780C4 include approximately 1,900 Logic Array Blocks (LABs), 488 user I/O pins, and integrated DSP blocks that simplify implementation of high-throughput arithmetic pipelines. The 65 nm process node enables a balance of speed and integration, while the FC-FBGA package provides high pin count and excellent electrical and thermal performance for high-speed signaling. Technically, the device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL, and differential variants), embedded memory arranged in M9K and M144K blocks, and configuration via JTAG or serial configuration devices. Designers use the Altera Quartus II design suite to compile, simulate, and program the part, and Altera reference designs demonstrate transceiver, memory controller, and DSP pipelines. Typical applications include high-speed digital signal processing, telecom baseband processing, broadcast video infrastructure, military/aerospace signal processing, and ASIC prototyping. The 780-ball FC-FBGA footprint supports high pin-count designs requiring both high logic density and a substantial number of user I/Os. When designing with this FPGA, careful attention to PCB stack-up, power distribution network design, and signal integrity is critical. The 1.1 V core supply requires low-noise regulation, and multiple auxiliary rails must be sequenced correctly during power-up. Decoupling, ground plane stitching, and thermal management are essential at this density. This page synthesizes distributor pricing, drop-in alternatives, comparison parameters, and design notes not found in the manufacturer datasheet alone.
EP3SL50F780C4G - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
The Intel EP3SL50F780C4G is a Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, integrating 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 maximum user I/Os in a 780-ball Fine-pitch Chip-Scale Ball Grid Array (FC-FBGA) package. Speed grade 4 reflects a commercial temperature-range device (-0°C to +85°C) at a core VCC of 1.1 V, with logic-array-block performance that supports high-throughput DSP, memory-rich datapaths, and serial transceiver pipelines. An FPGA is a semiconductor device whose digital logic fabric, routing, and I/O cells are defined by user-supplied configuration bitstreams rather than hard-wired mask geometry. Modern high-density FPGAs such as the Stratix III L family occupy a tier above simple programmable logic: they integrate hardened memory blocks (M9K/M144K), DSP blocks, PLLs, and (in some family members) multi-gigabit transceivers. The device hierarchy is FPGA -> programmable logic -> ASIC-replacement silicon -> semiconductor IC, and Stratix III devices typically appear where ASIC NRE cost or time-to-market constraints make a custom mask design uneconomic. Key features of the EP3SL50F780C4G include 47,500 logic elements, 2,184,192 embedded memory bits organized into M9K/M144K blocks, 488 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, four PLLs, and a 65 nm low-power copper process node. Configuration can be loaded via fast passive parallel, fast active serial, or JTAG, with bitstream encryption supported by the Stratix III security features. The architecture uses adaptive logic modules (ALMs) that combine 8-input fracturable look-up-tables with dedicated carry chains and register chains, giving the device strong arithmetic and pipelining density. The 65 nm process delivers a meaningful dynamic-power advantage over 90 nm Stratix II designs, with Quartus II power-estimator accuracy typically within 15%. Typical applications include telecom baseband prototyping, high-speed data-acquisition cards, ASIC-emulation and verification platforms, broadcast video processing, and high-performance DSP pipelines such as FFT, FEC, and beamforming. The 780-FBGA package offers abundant I/O bandwidth for memory-bus fan-out. Designers should plan power integrity with a multi-rail decoupling network (1.1 V core, 2.5 V/3.3 V auxiliary) and consider thermal envelope at full toggle rate; the Stratix III L family is the lower-static-power tier of Stratix III, but careful thermal analysis at junction temperature is still required for closed-enclosure designs. This page synthesizes distributor inventory, drop-in same-family alternatives drawn from the Site MPN list, application guidance, and design notes that are not consolidated on the manufacturer product page, providing a single, citation-ready reference for procurement and engineering teams.
EP3SL50F780C4L - Stratix III L FPGA, 47.5K Logic Elements, 780-FBGA | Intel
The Intel EP3SL50F780C4L is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine Ball-Grid Array (FBGA) package. It integrates 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, and 488 user I/Os. Fabricated on a 65 nm CMOS process, the device operates from a 0.9 V core supply and is targeted at high-performance digital signal processing, ASIC prototyping, and high-bandwidth communication designs where deterministic timing and abundant on-chip memory are required. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as DSP blocks, M20K memory blocks, transceivers, and PLLs. The Stratix III family specifically introduced the 'L' (logic-rich, low-power) and 'E' (enhanced memory/DSP) sub-families; the 'L' variant focuses on higher logic density at lower static power. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below full custom ASICs in cost-vs-performance trade-offs. The device includes embedded DSP blocks supporting variable-precision multiplication, twelve 3.125 Gbps transceivers (variant dependent), up to eight PLLs, and dedicated hardware for PCI Express Gen1/Gen2. The C4 speed grade corresponds to a -4 commercial speed bin, balancing Fmax and power; the 'L' suffix denotes lead-free / RoHS-compliant FBGA packaging. According to Intel (formerly Altera) datasheet literature, the C4 commercial grade delivers logic-cell Fmax around 375 MHz under typical DSP pipelines. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-throughput signal processing for radar or medical imaging, software-defined radio, and high-speed data acquisition. The 488 user I/Os support parallel LVDS interfaces and multiple memory controller interfaces (DDR2/DDR3) implemented in the FPGA fabric. When designing with the EP3SL50F780C4L, use Altera (now Intel) Quartus II or Quartus Prime for synthesis, place-and-route, and timing closure. The 780-FBGA package requires a multi-layer PCB with controlled-impedance routing, a low-impedance core supply decoupling network (typically 0402/0201 ceramics), and thermal management via the package thermal pad connected to an internal copper plane. This page synthesizes distributor pricing, parametric drop-in alternatives from the Stratix III family and the pin-compatible E variant, and practical design notes that supplement the manufacturer datasheet.
EP3SL50F780C4LG - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel EP3SL50F780C4LG is a high-density, low-power Field Programmable Gate Array (FPGA) from the Stratix® III L family, delivering 47,500 logic elements, 2,184,192 bits of embedded memory, and 488 user I/O pins in a 780-ball FineLine BGA (FCBGA) package. It is fabricated on a 65 nm process node and operates from a 0.9 V core supply, combining high logic density with power-optimized architecture for mid-range digital designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, memory blocks, and DSP blocks) interconnected by a programmable routing fabric. The Stratix III L sits in the FPGA hierarchy as follows: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. FPGAs differ from ASICs in that their logic is defined post-fabrication via configuration bitstream, enabling rapid prototyping, design iteration, and field upgrades. The Stratix III L sub-family targets lower static power than the standard Stratix III E variants while preserving most of the high-performance transceiver and DSP resources for cost-sensitive applications. Key features of the EP3SL50F780C4LG include 47,500 logic elements, 2,184,192 bits of embedded memory (~2.1 Mbit), integrated DSP blocks for high-speed multiply-accumulate operations, programmable phase-locked loops (PLLs) for clock synthesis, and 488 user I/O pins supporting multiple I/O standards. The C4 speed grade denotes a specific timing bin within the family, and the LG suffix indicates the 780-ball FC-FBGA package with lead-free and halogen-free (Pb-free / HF) compliance. Architecture is built on a 65 nm TSMC low-power process, leveraging Intel (formerly Altera)'s adaptive logic module (ALM) structure that combines 8-input fracturable look-up tables with dedicated register chains. The device integrates hard memory controllers, PCIe Gen1 hard IP blocks, and serializer/deserializer (SERDES) capability at specific speed grades, enabling high-bandwidth I/O without consuming programmable fabric. Typical applications include high-speed digital signal processing for wireless baseband, video broadcast infrastructure, image processing pipelines, radar signal processing, high-end industrial automation controllers, and ASIC prototyping. The 488 user I/O and large memory complement make it suitable for parallel data-path applications requiring both broad connectivity and substantial on-chip buffering. When designing with this device, engineers must provide multiple decoupling capacitors (typically 100 nF and 10 µF) per power rail, route each PLL power pin with its own filtered supply, and follow Intel's pinout guidelines for the 780-FBGA package to avoid signal-integrity degradation. Configuration can be loaded via JTAG, passive serial, or a dedicated flash device. This page synthesizes distributor pricing, drop-in Stratix III L family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the EP3SL50F780C4LG for production designs.
EP3SL50F780C4LN - 47.5K LE Stratix III L FPGA, 780-FBGA | Intel
The Intel EP3SL50F780C4LN is a high-density, low-power member of the Stratix III L FPGA family, providing 47,500 logic elements, 1,900 logic array blocks, and 2,184,192 bits of embedded RAM in a 780-pin FC-FBGA (29x29 mm) package. It is built on a 65 nm process and operates across a 0.86 V to 1.15 V core supply range, with a maximum core frequency of 450 MHz. The device exposes 488 user I/O pins and integrates transceivers and DSP blocks typical of the Stratix III L series, targeting high-throughput signal-processing and memory-centric designs. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines programmable logic fabric, hierarchical routing, dedicated DSP blocks, embedded memory (BRAM/M20K), and high-speed serial transceivers. The Stratix III L sub-family extends the Stratix III line with reduced static power while preserving the architecture: ALM-based logic, TriMatrix embedded memory, and DSP blocks. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and are widely used as ASIC prototyping platforms, hardware accelerators, and glue-logic bridges in heterogeneous SoCs. Key features of the EP3SL50F780C4LN include 47.5 K logic elements (47500), 1900 LABs, 2,184,192 total RAM bits, 488 user I/Os, and the Stratix III L power-optimized fabric. The 'L' suffix denotes the low-power variant, which trims static leakage versus the standard Stratix III E family while retaining the same transceiver and DSP capability in the F780 (780-ball FBGA) footprint. The 'C4' speed grade and 'LN' suffix (lead-free, enhanced) are the standard ordering codes for industrial-temperature, lead-free assembly. Architecturally, the EP3SL50F780C4LN leverages ALMs (Adaptive Logic Modules) rather than older 4-input LUTs, allowing each ALM to implement either two independent 4-input LUTs or one 6-input function with shared arithmetic. Combined with the TriMatrix memory system (MLAB, M9K, M144K blocks) and dedicated DSP blocks optimized for 18x18 multipliers, this delivers high DSP throughput at lower logic area. Multiple high-speed transceivers (per family capability) and dedicated PLL/DLL blocks handle clock distribution, while the programmable power technology allows unused fabric to be powered down for energy efficiency. Typical applications include telecom baseband processing, military radar signal chains, high-performance ASIC prototyping, test-and-measurement instrumentation, and broadcast video processing. The device is also suited to high-throughput data-acquisition cards, software-defined radio front ends, and industrial imaging pipelines where parallel DSP and ample block RAM are decisive. When designing with the EP3SL50F780C4LN, engineers should plan power-rail decoupling carefully, use Altera/Intel Quartus II (legacy) for bitstream generation, and validate thermal envelopes against the 780-FBGA theta-JA. Designers upgrading from the E variant should confirm Quartus device support and pin compatibility, since the L family shares the F780 package but has different static-power characteristics. This page synthesizes distributor pricing (as of 2026-09-10), drop-in alternatives sourced from the Stratix III L family cross-reference, and practical design notes not found in the standalone Intel datasheet.
EP3SL50F780C4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
The Intel (formerly Altera) EP3SL50F780C4N is a high-performance, low-power Stratix III L FPGA fabricated on a 65 nm CMOS process, integrating 47,500 logic elements (LEs), 1,900 LABs/CLBs, 2,184,192 bits of embedded RAM, and 488 user I/Os in a 780-ball FineLine BGA package. Speed grade -4 with commercial temperature range (0C to +85C), it supports up to 717 MHz operation per the manufacturer product family and is drop-in compatible with other Stratix III variants in the same FBGA-780 footprint. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory interfaces, multipliers) into a single die. FPGAs sit at the top of the digital logic hierarchy: programmable logic -> configurable logic block -> FPGA -> programmable semiconductor. Stratix III in particular introduced advanced power management, hard memory controllers, and DSP blocks, making it the workhorse for high-throughput digital signal processing, high-speed serial links, and ASIC prototyping in the late-2000s and early-2010s design cycles. Key features include 47,500 logic elements, 2,184,192 embedded RAM bits (about 273 KB), 488 user I/Os, hard DSP blocks for high-speed arithmetic, hard memory controllers supporting DDR/DDR2/DDR3, and dedicated high-speed transceivers in higher-density family members. The 65 nm process delivers a favorable performance-per-watt ratio versus the prior Stratix II generation, and the 780-ball FC-FBGA package exposes many high-speed SERDES-capable pins while keeping board-level routing feasible. Typical applications include ASIC prototyping and emulation, high-speed data-acquisition front-ends, telecom baseband signal processing, military/aerospace DSP, test-and-measurement instrumentation, and high-performance compute accelerators. The large logic capacity combined with 488 user I/Os also makes it suitable for industrial imaging and broadcast video processing. When designing with the EP3SL50F780C4N, follow Altera's Stratix III Hardware Reference Manual power-up sequencing: drive all power rails through the Power Management Bus (PMBus) or a TI/Linear Technology sequencer, and respect the 1.1 V core / 0.86-1.15 V supply window. Decoupling and PCB layout for a 780-ball FC-FBGA demand a multilayer board with buried vias and a solid ground pour. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. The data sources include distributor listings, the Altera/Intel Stratix III datasheet family, and the manufacturer product page.