FPGA & CPLD
Products (6358)
EP3SL340F1760I4N - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
The Intel (formerly Altera) EP3SL340F1760I4N is a high-density, high-performance Stratix III L Field Programmable Gate Array (FPGA) featuring 337,500 logic elements, 18,822,144 bits of embedded memory, and 1,120 user I/Os in a 1760-ball FC-BGA package. Built on a 65nm process with a 1.1V core supply, the device delivers up to 717 MHz core performance and integrates up to 13,500 LABs (Logic Array Blocks), making it one of the highest-density members of the Stratix III family. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital semiconductor hierarchy. Within the power-management and embedded systems ecosystem, FPGAs serve as flexible glue logic, co-processors, and signal-processing engines, bridging hard ASICs and general-purpose CPUs/SoCs. The Stratix III L family specifically targets low-power, high-density designs including high-end DSP, ASIC prototyping, and high-throughput data-pipeline applications. Key features of the EP3SL340F1760I4N include 1120 user I/Os (the highest pin-count member), 13,500 LABs, 18.8 Mbits embedded RAM, integrated transceiver capability through the Stratix III architecture, and built-in PLL and DLL blocks for clock management. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, and HSTL, with true LVDS support on most pins and up to 24 dedicated clock inputs. The 1760-ball FC-BGA package exposes the full I/O count and supports high-speed serial interfaces via dedicated transceiver channels. The EP3SL340F1760I4N leverages Stratix III programmable power technology, which dynamically adjusts quiescent power on a per-LAB basis depending on switching activity, yielding significant static-power savings versus previous generations. Embedded memory blocks (M144K/M9K) are distributed across the fabric and can be cascaded, while dedicated DSP blocks enable high-throughput fixed- and floating-point arithmetic. Hard PCIe hard IP and external memory controller blocks support DDR/DDR2/DDR3/QDRII+/RLDRAM interfaces directly. Typical applications include ASIC prototyping and emulation, high-performance digital signal processing (radar, baseband, video), high-speed data acquisition and test instrumentation, military/aerospace signal processing, telecom infrastructure (line cards, cross-connects), and high-density glue logic for embedded computing platforms. The 1760-ball FC-BGA package is intended for high-layer-count PCBs with carefully controlled impedance for transceiver and memory interfaces. When designing with this part, ensure a 12-layer minimum stack-up with dedicated ground and power planes for transceiver channels; signal integrity on multi-gigabit serial links depends critically on controlled differential impedance (typically 100 ohm) and matched length pairs. Use the Altera/Intel Quartus II design suite for synthesis, place-and-route, and timing closure; expect longer compile times than smaller FPGAs. This page synthesizes distributor pricing, drop-in same-package alternatives, and PCB-level design considerations specific to the Stratix III L family, delivering engineering context beyond what appears in the manufacturer datasheet.
EP3SL340H1152C2 - Stratix III L FPGA, 337.5K Cells, 1152-BGA | Intel
The Intel EP3SL340H1152C2 is a high-density Stratix III L family Field Programmable Gate Array (FPGA) delivering 337,500 logic cells, 18,822,144 bits of embedded memory, and 744 user I/O in a 1152-ball Fine-Pitch Ball Grid Array (FBGA) package. Manufactured on a 65 nm CMOS process with a 1.1 V core supply, this device targets high-performance digital signal processing, telecommunications, and high-throughput data-path applications where logic density and memory bandwidth are paramount. It provides up to 13,500 LABs and supports multiple high-speed serial transceiver protocols for backplane and chip-to-chip connectivity. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the flexibility of software-configurable logic with the performance of application-specific integrated circuits. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also include CPLDs and PALs, and they are widely used for prototyping ASICs, accelerating compute-intensive workloads, and implementing custom parallel processing pipelines. The Stratix III family specifically targets designs that need the highest logic density and DSP performance available at low power budgets, with features like high-speed transceivers and rich on-chip memory. Key features of the EP3SL340H1152C2 include 744 user I/O pins supporting a wide range of single-ended and differential I/O standards, up to 18.8 Mbits of embedded RAM organized in M9K and MLAB blocks for flexible buffering and FIFO implementation, dedicated DSP blocks for high-throughput arithmetic operations, and clock management tiles that enable multiple clock domains with low jitter. The 1152-BGA FCBGA package provides a compact footprint relative to its I/O count while offering controlled-impedance signal paths ideal for high-speed memory and transceiver interfaces. Typical applications include high-throughput digital signal processing in software-defined radio (SDR), radar, and beamforming systems; telecommunication infrastructure such as baseband processing and high-speed packet inspection; ASIC prototyping and design verification for networking ASICs and processor emulation; high-performance computing accelerators in data centers and test equipment; video and image processing pipelines requiring wide memory bandwidth; and industrial control and automation systems with real-time deterministic latency requirements. When designing with this FPGA, engineers should pay close attention to the PCB layout for the 1152-ball BGA, ensuring proper decoupling, power-plane integrity, and via-in-pad or microvia construction to maintain signal integrity at high toggle frequencies. Plan a robust power distribution network using multiple voltage rails (core, PLL, I/O banks, transceiver) and follow the manufacturer's recommended power-on sequencing. Thermal management requires sufficient airflow or heatsinking because the device's high logic density produces non-trivial power dissipation under sustained workload. This page synthesizes distributor pricing, parametric context, and design guidance that is not available from the manufacturer datasheet alone, providing a single reference for engineers evaluating the EP3SL340H1152C2 for new designs or replacements.
EP3SL340H1152C2N - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152C2N is a high-density Stratix III L Field Programmable Gate Array (FPGA) offering 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 18x18 multipliers, housed in a 1152-ball FineLine BGA (FCBGA / HBGA) package with flip-chip construction. Built on a 65 nm CMOS process, it operates from a 0.9 V core / 1.1 V auxiliary supply and supports performance up to 600 MHz fabric speed, targeting high-throughput DSP, telecom, and signal-processing designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed after manufacturing. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs, microcontrollers, and DSPs as building blocks of modern digital systems. The Stratix III L family specifically emphasizes low-power, high-logic-density designs with dedicated DSP blocks, embedded TriMatrix memory, and high-speed serial transceivers, occupying the high-end tier of Intel's (formerly Altera's) programmable logic portfolio. Key differentiating features include 337,500 logic elements (LEs) for fine-grained parallel processing, 18,822,144 embedded memory bits for wide data buffering without external SRAM, 744 dedicated hardware multipliers (18x18) for fixed- and floating-point DSP acceleration, and integrated PLLs for multi-domain clock management. The flip-chip 1152-BGA package exposes the full I/O count and high-performance serial interface pins while delivering a low-inductance power distribution network. Architecturally, the EP3SL340H1152C2N combines LUT-based adaptive logic modules (ALMs), TriMatrix memory blocks (MLAB, M9K, M144K), DSP blocks, and clock networks routed across a multi-tier interconnect. The 65 nm process and Stratix III L variant minimize dynamic power via programmable power technology, allowing unused fabric regions to be put into a low-power state without losing state. Compared with discrete processor-plus-DSP solutions, the integrated fabric yields deterministic latency and far higher parallel throughput. Typical applications include high-end telecommunications baseband and backhaul cards, real-time digital signal processing for radar and medical imaging, ASIC prototyping, high-performance computing accelerators, and broadcast video processing. Designers choose this device when the design exceeds the logic, memory, or DSP budget of smaller FPGAs or when deterministic parallel throughput is required. A practical design consideration is power delivery: the 1152-BGA package requires a multi-rail PDN with bulk decoupling at each supply island and high-frequency ceramics under the BGA via field. PCB stack-up should target 1-oz copper inner planes with microvia access to inner pads to meet the simultaneous-switching output (SSO) noise budget. This page synthesizes distributor pricing, drop-in Stratix III L alternatives from the Site MPN catalog, and practical design notes not found in the manufacturer datasheet alone, enabling faster BOM selection and PCB reuse across related part numbers.
EP3SL340H1152C3 - Stratix III L FPGA, 337.5K Cells, 1152-BGA | Intel
The Intel EP3SL340H1152C3 is a high-density Stratix III L FPGA from Intel's Stratix III family, featuring 337,500 logic elements in a 1152-ball FCBGA (HBGA) package. Built on a 65 nm CMOS process node with a 1.1 V core supply and a 717 MHz core fabric frequency, the EP3SL340H1152C3 delivers high-performance parallel processing for digital signal processing, high-speed serial I/O bridging, and ASIC prototyping. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic is defined after manufacturing by loading a configuration bitstream into on-chip SRAM memory. FPGAs sit in the broader category of programmable logic devices (PLDs), which also includes CPLDs; FPGAs extend this concept to very high logic densities, embedded block RAM, DSP blocks, and multi-gigabit transceivers. Designers choose FPGAs to accelerate parallel algorithms, implement custom interfaces, and reduce PCB area by integrating glue logic and protocol bridges that previously required multiple ASICs. The Stratix III L sub-series is engineered for logic-intensive workloads where routing flexibility and DSP throughput matter more than maximum transceiver count. The EP3SL340H1152C3 supports 744 user I/O pins via the 1152-pin FCBGA package, which exposes the device's full I/O bank count. Embedded block RAM, DSP blocks, and high-speed serial transceivers operate from dedicated power rails and are programmable through Intel's Quartus II design suite. Typical applications include high-speed digital signal processing cards, telecommunications line cards, ASIC prototyping, image processing pipelines, and high-performance computing coprocessors. The 1.1 V core Vcc and separate VccPD, VccPT power domains are supplied through dedicated pins; PCB designers must follow Intel's power decoupling and ground-bonding guidelines. When designing with the EP3SL340H1152C3, ensure the PCB has at least 6 dedicated ground bond-out pins per quadrant to support the package's thermal and signal-integrity requirements. Configuration can be loaded via JTAG, fast passive parallel, or a configuration flash, all of which are documented in the Stratix III handbook. Pricing is on the order of thousands of dollars per unit at low quantities. This page synthesizes distributor pricing, drop-in same-family alternatives, and Stratix III L design notes not consolidated in the manufacturer datasheet. Engineers selecting the EP3SL340H1152C3 should also consult Intel's Stratix III Device Handbook for full pinout, timing, and power-supply sequencing guidance.
EP3SL340H1152C3N - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
The Intel (Altera) EP3SL340H1152C3N is a high-density, low-power Stratix III L FPGA in a 1152-ball Flip-Chip BGA package, integrating 337,500 logic elements and 744 user I/O pins on a 65 nm process node. The part ships in the commercial speed grade 3 with a 1.1 V core supply, targeting cost-sensitive high-volume applications. Built on Intel's programmable logic technology acquired from Altera, the Stratix III L family is engineered to deliver the lowest power consumption in its performance class while maintaining high logic density and DSP throughput. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits. Stratix III devices in particular occupy the high-performance tier of the FPGA hierarchy, sitting above Cyclone and below Arria/Stratix IV/V families, and are typically deployed in digital signal processing, high-speed serial connectivity, and embedded processing applications. Key differentiating features include the 1152-ball FCBGA package enabling 744 user I/Os (sufficient for parallel memory buses, multiple transceivers, and external processor interfaces), 65 nm process technology with 1.1 V core VCC, and dedicated DSP blocks for fixed- and floating-point arithmetic. The device also integrates embedded memory blocks (M20K/M9K), high-speed transceivers, and PCIe hard IP, distinguishing it from lower-density Cyclone families. The 'L' suffix denotes the low-power variant of Stratix III, optimized for static and dynamic power reduction via programmable power technology. Architecturally, the EP3SL340 uses logic array blocks (LABs) of 16 adaptive logic modules (ALMs) each, a hierarchical routing fabric, and column/row-based I/O structures supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, and SSTL. The FPGA is configured via SRAM-based volatile configuration memory, requiring a configuration ROM (EPCS) on the board. Typical applications include telecommunications line cards, video processing infrastructure, high-performance ASIC prototyping, military/aerospace signal processing, test and measurement equipment, and broadcast video encoding. When designing with this FPGA, plan for multi-rail power sequencing (VCC, VCCAUX, VCCPD), thermal management on the FCBGA (which requires a heatsink for full performance), and the configuration controller (typically a MAX II CPLD or an EPCS device). This page synthesizes distributor pricing, drop-in Stratix III/IV alternatives, and practical PCB thermal guidance not found in the manufacturer datasheet.
EP3SL340H1152C4 - 340K LE Stratix III FPGA, 1152-BGA | Intel
The Intel EP3SL340H1152C4 is a high-density Stratix III FPGA featuring 337,500 logic elements, 13,500 LABs, 744 user I/Os, and 1,152 pins in a flip-chip BGA package, manufactured on a 65 nm process node with 1.1 V core voltage. It belongs to the Stratix III L family targeting high-performance, low-power ASIC prototyping, signal processing, and high-bandwidth data-path applications. The 744 user I/Os are split across 12 I/O banks supporting a wide range of I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit containing configurable logic blocks, dedicated DSP slices, embedded memory blocks, and programmable interconnect. FPGAs occupy the hierarchy of programmable logic -> logic ICs -> digital integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs allow designers to implement and re-implement custom digital hardware, making them ideal for prototyping, low-volume production, and applications requiring post-deployment updates such as high-speed networking, video processing, and DSP. Key features of the EP3SL340H1152C4 include 96 transceivers (per Stratix III L family) supporting data rates up to 3.75 Gbps, dedicated hardware multipliers for DSP, embedded 18x18 multipliers, and on-chip M-RAM/RAM blocks. The C4 speed grade indicates a 4-speed-grade timing bin for commercial temperature operation (0C to 85C), and the H1152 package designation identifies the 1152-pin flip-chip BGA form factor with H denoting the high-pin-count variant. The device integrates PLLs, clock networks, and configuration circuitry supporting passive serial, fast passive parallel, and JTAG configuration modes. Architecturally, the Stratix III family introduced the ALM (Adaptive Logic Module) providing 8-input fracturable LUT capability for higher logic density per LE. The 65 nm process and 1.1 V core reduce dynamic power versus prior generations while maintaining performance through programmable power technology that automatically tunes logic speed versus leakage. The 1152-BGA package supplies extensive I/O bandwidth for memory interfaces (DDR3/QDRII+) and parallel high-speed connectivity. Typical applications include ASIC prototyping and emulation, high-end telecommunications line cards, broadcast video processing, military/aerospace signal processing, high-performance computing accelerators, and test-and-measurement instrumentation. Stratix III devices are well-suited for designs requiring high logic density, large memory bandwidth, and integration of high-speed serial interfaces. When designing with the EP3SL340H1152C4, ensure PCB layout supports BGA fan-out with controlled-impedance routing for transceiver channels, multi-layer PCB with dedicated power/ground planes, and thermal management via heatsink or airflow for high-utilization designs. The 65 nm core operating at 1.1 V requires core voltage rails within 3% tolerance; use low-noise LDO or DC-DC regulators for VCCINT and VCCAUX. Configuration memory is volatile, requiring a configuration device (EPCS) or system-level flash for bitstream storage at power-up. This page synthesizes distributor pricing, FPGA family positioning, and Stratix III same-package drop-in alternatives not found in the manufacturer datasheet alone, supporting BOM risk assessment and long-lifecycle procurement decisions.
EP3SL340H1152C4L - 340K LE Stratix III L FPGA, 1152-BGA | Altera
The Altera (Intel) EP3SL340H1152C4L is a high-density Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm low-power process, delivering 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 user I/O pins in a 1152-ball FCBGA (HBGA) package. The device integrates up to 384 embedded 18x18 multipliers and is engineered for high-performance digital signal processing, ASIC prototyping, and high-bandwidth parallel processing designs. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated silicon features such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under Programmable Logic -> Logic ICs -> Integrated Circuits. Stratix III L parts specifically target applications requiring high logic capacity at reduced static power compared to the standard Stratix III family. Key features of the EP3SL340H1152C4L include 337,500 logic elements, 18,822,144 bits of embedded memory (approximately 2,352 Kbit block RAM equivalent), 744 maximum user I/O pins, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports core voltages of 1.1 V and I/O voltages programmable per bank. It is rated for commercial temperature operation (0 to 85 C) and ships in the L-suffix speed grade (lower-power speed bin). Architecturally, the Stratix III L family uses Altera's adaptive logic module (ALM) and 9-Kbit M512/M-RAM blocks. It integrates dedicated hardware multipliers, PLLs, and high-speed transceivers in some variants, with a flexible I/O structure that supports differential signaling up to 1.6 Gbps. The 1152-BGA package exposes the full feature set of the die, including numerous high-speed serial interfaces and external memory controller pins. Typical applications include high-end ASIC prototyping, software-defined radio (SDR) baseband processing, high-performance computing (HPC) acceleration, military/aerospace signal processing, broadcast video infrastructure, and telecom line cards. The combination of large logic capacity and abundant memory bandwidth makes it suitable for memory-intensive designs such as deep packet inspection and real-time video transcoding. When designing with the EP3SL340H1152C4L, careful attention must be paid to power delivery (multiple VCC and VCCINT rails), high-speed signal integrity for LVDS pairs, and thermal management given the 1152-ball BGA package density. Quartus II (or Intel Quartus Prime) is required for synthesis, place-and-route, and timing closure. Designers should consult the Stratix III Device Handbook for full pinout, electrical characteristics, and reference design guidance. This page synthesizes distributor pricing, Stratix III family drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet alone, giving engineers a one-stop reference for both new designs and legacy system maintenance.
EP3SL340H1152C4LN - Stratix III L FPGA 337.5K LE 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152C4LN is a high-density, low-power Stratix III L family Field-Programmable Gate Array built on a 65 nm process, delivering 337,500 logic elements and 18,822,144 bits of embedded memory in a 1152-pin flip-chip BGA package. It supports up to 744 user I/O pins and integrates 1,350 LABs (Logic Array Blocks) with adaptive logic modules, providing a balance of high logic capacity, abundant block RAM, and DSP blocks for high-throughput signal processing. The device is offered in the C4 speed grade and the commercial operating range, with a core voltage of 0.9 V and I/O voltages configurable per bank to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V LVCMOS/LVTTL standards. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic function is defined after manufacturing by a user-supplied configuration bitstream, allowing the same silicon to be repurposed across many designs. Within the broader programmable-logic taxonomy, an FPGA sits above CPLDs (smaller, non-volatile, lower-density) and below ASICs (application-specific, higher NRE but lower unit cost at volume). FPGAs are typically used in prototyping, low-volume designs, and applications demanding hardware reconfiguration such as DSP pipelines, high-speed serial interfaces, and parallel compute fabrics. Key features of the EP3SL340H1152C4LN include 744 maximum user I/Os, 24 transceivers (per Stratix III family architecture), support for multiple I/O standards (LVDS, LVPECL, HSTL, SSTL), and integrated PCIe hard IP blocks. The 65 nm low-power process combined with programmable power technology enables fine-grained power gating of unused logic, registers, and memory blocks. Hard memory controllers and DSP blocks accelerate common data-path functions such as FFT, FIR filtering, and external memory interfacing. Typical applications include high-end telecommunications baseband processing, high-performance computing accelerators, software-defined radio (SDR) platforms, ASIC prototyping, video broadcast infrastructure, and test and measurement equipment. The 337.5K LE density makes this part particularly well-suited to designs that exceed the capacity of smaller Stratix III members such as the EP3SL200 family. When designing with this device, ensure that the PCB layout meets the flip-chip BGA escape and signal-integrity requirements, including matched-length pairs for LVDS and controlled impedance for high-speed serial links. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Note that this part is in Last Time Buy / Not Recommended for New Designs (NRND) status; consider Stratix IV or Stratix V for new projects. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III family, and practical FPGA design notes not found in the manufacturer datasheet alone.
EP3SL340H1152C4N - 340K LE Stratix III L FPGA, 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152C4N is a high-density, low-power member of the Stratix III L FPGA family built on a 65 nm CMOS process, delivering 337,500 equivalent logic elements, 18,822,144 bits of embedded memory, and 744 user I/Os in a 1152-ball FineLine BGA (FCBGA) package. It is offered in a commercial temperature grade (0C to 85C) with the speed grade 4 core fabric, targeting high-performance DSP, signal-processing, and protocol-bridging applications where the L variant trades a small amount of peak fabric speed for substantially lower static and dynamic power versus the Stratix III E family. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined by user-supplied configuration data rather than hard-wired masks. Stratix III FPGAs occupy the high-performance tier of the Intel (Altera) programmable-logic hierarchy, sitting above Cyclone (low-cost) and Arria (mid-range) families and below the newer Stratix IV/V/10 families. Within Stratix III, the L sub-family is engineered for low-power operation while retaining the same MultiTrack interconnect, TriMatrix memory blocks, and DSP block architecture as the E sub-family. Key features of the EP3SL340H1152C4N include 13500 Logic Array Blocks (LABs), dedicated high-speed transceivers, embedded multiplier and accumulator DSP blocks, programmable power technology (the only Stratix III device with this feature), and integrated PLLs for clock synthesis. The device supports configuration via passive serial, fast passive parallel, and active serial modes and includes built-in security features for bitstream encryption. Programmable Power Technology allows unused logic and routing resources to be biased to a low-power state, reducing dynamic power by up to 50 percent compared to fixed-bias designs. The silicon architecture combines adaptive logic modules (ALMs) packed in 13500 LABs with embedded SRAM organised as TriMatrix memory (MLAB, M9K, M144K blocks) and dedicated 18x18 multipliers. High-speed serial transceivers support multi-gigabit interfaces, and the device is qualified for commercial temperature operation only (0C to 85C). Typical applications include high-end telecommunications line cards, military radar baseband preprocessing, ASIC prototyping, high-performance DSP pipelines, and high-throughput data-acquisition systems. For aerospace and industrial applications where extended temperature is required, designers should select the I-grade variant (EP3SL340H1152I4N). The large 1152-ball package also enables very high pin-count interfaces such as DDR3 memories, multi-port Ethernet, and PCI Express Gen1/Gen2 hard IP. A key design consideration for the EP3SL340H1152C4N is that the FCBGA package requires a multi-layer PCB with controlled-impedance routing, microvia or via-in-pad construction, and a heatsink or thermal pad to keep junction temperature within the 0C to 85C commercial window during sustained high toggle-rate workloads. Engineers should follow the Stratix III handbook pin connection guidelines to leave unused transceiver and clock pins tied to defined states. This page synthesises distributor pricing, drop-in alternatives within the Stratix III family, and practical design notes that are not collated in any single source on the manufacturer datasheet.
EP3SL340H1152I3 - Stratix III L FPGA 337K LE 1152-FCBGA | Intel
The Intel (Altera) EP3SL340H1152I3 is a high-density, low-power Stratix III L FPGA integrating 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 maximum user I/O pins in a 1152-ball FCBGA package, fabricated on a 65 nm process and operating at up to 500 MHz. It belongs to the Stratix III L family, which is engineered for applications that demand a balance of high logic density, generous on-chip memory, and reduced static power relative to the original Stratix III family. The "I3" speed/temperature grade indicates an industrial operating range, and the 1.1 V core supply is regulated externally. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, embedded memory, and high-speed transceivers on a single die. Within the broader semiconductor taxonomy, an FPGA sits between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: FPGAs offer hardware-level parallelism and reconfigurability that microcontrollers cannot match, without the per-unit NRE cost of an ASIC. The Stratix III L family is a derivative of the Stratix III family, optimized for low static power while preserving the architecture's high-performance DSP and memory subsystems. Key features of the EP3SL340H1152I3 include 337,500 logic elements, 18,822,144 memory bits, 744 maximum user I/O pins, support for multiple I/O standards (LVDS, LVPECL, HSTL, SSTL), dedicated DSP blocks for high-throughput arithmetic, and up to 500 MHz internal operation. Embedded memory is partitioned into M9K and M144K blocks, allowing efficient buffer, FIFO, and lookup-table implementations without consuming fabric logic. Architecturally, the device combines a programmable logic fabric with a column-and-row interconnect structure, hardened DSP and memory blocks, and clock management via PLLs. The 65 nm process and Stratix III L power optimizations deliver lower static power than the baseline Stratix III family while preserving DSP throughput and memory bandwidth. Typical applications include high-performance digital signal processing, military radar and electronic warfare, medical imaging front-ends, ASIC prototyping, and high-speed data acquisition. The 1152-ball FCBGA package provides the high pin count and signal integrity required by wide-bus, parallel interfaces. When designing with this device, follow Intel/Altera's Stratix III power-up sequencing guidelines; the 1.1 V core, PLL analog supply, and I/O supplies must ramp in the recommended order to avoid latch-up. Use the Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor inventory, drop-in same-family variants, and design notes not found in a single manufacturer PDF, enabling engineers to evaluate the part and its substitutes faster.
EP3SL340H1152I3N - Stratix III L FPGA, 337.5K LEs, 1152-BGA | Intel
The Intel (formerly Altera) EP3SL340H1152I3N is a high-density, low-power Stratix® III L family Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine Ball-Grid Array (FCBGA) package. The device integrates 337,500 logic elements (LEs), approximately 18.8 Mbits of embedded memory, 744 user I/O pins, and high-speed transceivers/PLLs targeted at bandwidth-intensive ASIC-prototyping, DSP, and wireline communication designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (LBs), programmable interconnect, embedded memory, DSP blocks, and hardened I/O serdes. FPGAs sit at the top of the digital semiconductor hierarchy below ASICs, allowing hardware designers to implement custom parallel processing pipelines, state machines, and high-speed interfaces without the NRE cost of a custom ASIC. The Stratix III family uses TSMC's 65 nm process and emphasizes a low-power "L" variant tuned for power-sensitive applications. Key features of the EP3SL340H1152I3N include 337,500 logic elements, 18,822,144 bits of embedded RAM, 744 maximum user I/O, programmable power technology with logic-array clocking, on-chip termination (OCT), and DSP blocks supporting high-throughput fixed- and floating-point arithmetic. The device is specified for the industrial temperature grade (-40 °C to +100 °C) and supports multiple high-speed serial protocols through its transceiver channels. Architecturally, the Stratix III L uses a tile-based logic structure with dedicated carry chains, 8-input adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP block slices that accelerate IEEE-754 single-precision floating-point operations. The 1152-BGA package exposes the full device periphery for maximum user I/O, making this part the preferred package option when a design needs 500+ board-level signals. Typical applications include wireline telecom line cards, ASIC prototyping, high-performance DSP pipelines for radar/medical imaging, broadcast video processing, and military/aerospace signal processing. Designers also deploy the EP3SL340H1152I3N in test & measurement instrumentation where its combination of logic density and high I/O count enables a single-chip acquisition/processing backend. When designing with this FPGA, careful attention to power integrity is required. Programmable power technology combined with on-chip temperature sensors helps dynamic power management, but multi-rail decoupling, bulk bypassing, and a thermal solution sized for the FCBGA's theta-JA are mandatory for reliable industrial operation. This page synthesizes distributor inventory, drop-in pin-compatible Stratix III L alternatives, application recommendations, and PCB-thermal design notes that the manufacturer datasheet alone does not provide.
EP3SL340H1152I4 - Stratix III L FPGA 337.5K LE 1152-BGA | Intel
The Intel EP3SL340H1152I4 is a high-density, low-power Stratix III L Field Programmable Gate Array (FPGA) delivering up to 337,500 logic elements and 18,821,440 bits of embedded memory, packaged in a 1152-ball FineLine BGA (HBGA) at the industrial -40C to +100C junction temperature grade. Operating at up to 717 MHz core fabric speed on a 65 nm CMOS process with 1.1 V core supply, the device combines high logic density with the Stratix III L family's signature low static and dynamic power architecture. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs) connected via programmable interconnect and surrounded by I/O blocks; modern high-end FPGAs like the Stratix III L family also embed hardened memory controllers, transceivers, DSP blocks, and PLLs to enable complete system-on-chip designs without external ASICs. FPGAs sit hierarchically within the broader taxonomy: programmable logic device -> programmable logic IC -> digital IC -> semiconductor -> integrated circuit. Key features of the EP3SL340H1152I4 include 744 user I/O pins, embedded multiplier blocks (18x18), high-speed LVDS pairs, dedicated DDR/DDR2/DDR3 memory controllers with hard PHY, and up to 12 embedded transceivers depending on configuration. The 1152-ball HBGA package uses Intel's flip-chip BGA technology for low inductance power distribution and high signal integrity at multi-hundred-MHz fabric speeds. The Stratix III L variant specifically targets lower static power compared to the standard Stratix III family while preserving high-performance fabric features such as adaptive logic modules (ALMs), M9K and M144K memory blocks, and DSP blocks with hardware multipliers and accumulators. This positions the EP3SL340H1152I4 for power-sensitive applications that still demand hundreds of thousands of logic elements. Typical applications include high-end wireline telecom line cards, software-defined radio (SDR) baseband processing, military radar signal processing, ASIC prototyping and emulation platforms, high-performance DSP pipelines, broadcast video processing, and medical imaging accelerators. The 337.5K LE capacity supports complete protocol stacks plus parallel processing dataplanes on a single device. Designers should provide a multi-rail power system (typically 1.1 V core, 2.5 V/3.3 V aux, and dedicated PLL analog supplies) with bulk decoupling and high-frequency ceramic bypass near the BGA balls. Thermal management is critical because the flip-chip BGA dissipates up to 25-30 W at full fabric utilization, often requiring a heatsink and controlled airflow. Signal integrity must be considered for the high-speed LVDS and transceiver channels. This page synthesizes distributor pricing, parametric alternatives, and PCB thermal/layout notes not consolidated in the manufacturer datasheet. Pricing references distributor stock data as of 2026-09-09.
EP3SL340H1152I4L - Stratix III L FPGA, 337.5K LE, 1152-BGA | Intel
The Intel (Altera) EP3SL340H1152I4L is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) built on a 65 nm process, integrating 337,500 logic elements, 13,500 LABs (Logic Array Blocks), and 744 user I/O pins in a 1152-ball FC-HFBGA (FCBGA) package. Per the Stratix III device family datasheet, the part targets high-performance signal processing and high-bandwidth data-path applications while delivering the lowest static and dynamic power of any high-density FPGA in its generation. The "L" suffix denotes the low-power variant, optimized via advanced power gating and a 0.9 V core voltage that dramatically reduces static leakage versus the standard Stratix III E family. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O cells are configured by an end-user after manufacture. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in performance-per-watt, and they are widely used in prototyping, hardware acceleration, and time-to-market-critical designs. Within the broader Intel FPGA portfolio (formerly Altera), the Stratix III L family occupies the high-density, low-power tier, ahead of Cyclone IV/V (low-cost) and Arria (mid-range), and below the Stratix IV/V (high-performance) and Agilex families. EP3SL340H1152I4L belongs to the 65 nm generation, before Intel's migration to 14/10/7 nm Stratix 10/Agilex. Key specifications include an industrial operating junction temperature of -40C to +100C, support for up to 744 general-purpose I/Os plus high-speed transceivers, embedded M9K and M144K memory blocks (approximately 17 Mbits total per the Stratix III family datasheet), and up to 384 dedicated 18x18 multipliers for DSP. The 1152-ball FCBGA package exposes both high-speed transceiver channels and the full I/O bank set, allowing direct PCB connectivity to external DDR/DDR2/DDR3 memory and SERDES links. Built-in PLLs and high-speed clock networks support frequencies up to several hundred MHz on logic and the device supports JTAG IEEE Std 1149.1 boundary-scan for in-system test. Typical applications include high-performance digital signal processing (radar, beam-forming, medical imaging), ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet), telecom baseband processing, military/aerospace signal intelligence, and broadcast video processing. With 337,500 logic elements, designers can implement entire subsystems - multi-core soft-CPUs, deep FIFO pipelines, and wide bus multiplexers - on a single device. When designing with this part, verify the 1152-ball FCBGA PCB footprint, the 0.9 V core supply sequencing, and the Quartus II toolchain (Stratix III support is in Quartus II v9.1 through v15.1). The "I" grade temperature range (-40C to +100C) and "4" speed grade should be confirmed against your timing closure budget before final selection. This page synthesizes distributor pricing, package/BOM specifics, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3SL340H1152I4LN - 337.5K LEs Stratix III L FPGA, 1152-BGA | Intel
The Intel (Altera) EP3SL340H1152I4LN is a high-density, low-power Stratix III L family Field Programmable Gate Array (FPGA) with 337,500 logic elements, 18,822,144 bits of embedded memory, and 744 maximum user I/Os, housed in a 1152-ball FCBGA (HBGA) package at 40x40 mm. Manufactured on a 65 nm process node, the device operates from a 1.1 V core supply with 0.85 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O standards support and runs at speeds up to 500 MHz core fabric. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit under digital logic ICs, and ultimately the integrated circuit family. The Stratix III generation, introduced in 2007, emphasized lower static power than its predecessor through a programmable power technology that lets unused logic tiles enter a low-leakage state. Key features of the EP3SL340H1152I4LN include 13,500 Adaptive Logic Modules (ALMs) organized as Logic Array Blocks (LABs), 1,152 Kbits of MLAB memory, dedicated DSP blocks for high-throughput arithmetic, and 8.5625 Gbps transceivers in select speed grades. The industrial temperature grade (-40C to +100C TJ) and Pb-free / RoHS-compliant package suit telecom, broadcast, military, and high-end ASIC prototyping applications. Architecturally, Stratix III L uses a 65 nm low-power CMOS process with copper interconnects, a fine-grained ALM providing 8 inputs and two outputs per module, and an embedded memory hierarchy combining distributed MLAB RAM with true dual-port M144K block RAM. Hard IP includes PCIe Gen1 hard IP blocks, external memory interfaces (DDR3/QDRII+/RLDRAM II), and up to 24 transceivers supporting CPRI/OBSAI/Serial RapidIO protocols. Typical applications include high-performance digital signal processing, software-defined radio (SDR) baseband, radar processing, ASIC prototyping, video broadcast infrastructure, and high-speed serial protocol bridging. The very high logic capacity also makes it attractive for compute acceleration and high-channel-count data acquisition. When designing with this device, ensure your PCB land pattern matches the 1.0 mm pitch HBGA 1152-ball layout, allocate sufficient decoupling (multiple bulk + 0402/0201 ceramics) near each power pin, and use the Altera Quartus II design suite with the Stratix III device library for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III L family, and practical design notes not aggregated in any single manufacturer document.
EP3SL340H1152I4N - Stratix III L 337500-Cell FPGA, 717MHz | Intel
The Intel (Altera) EP3SL340H1152I4N is a high-density Stratix III L Field Programmable Gate Array (FPGA) delivering 337,500 logic elements, 744 user I/Os, and 18,822,144 bits of embedded memory in a 1152-ball Flip-Chip BGA (FCBGA / HBGA-1152) package. Built on a low-power 65nm CMOS process, this device operates from a 1.05V to 1.15V core supply and supports up to 717MHz core clocking, making it one of the most architecturally advanced, high-performance, low-power FPGAs in the marketplace according to the Stratix III family datasheet. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing programmable logic blocks (logic elements/LEs), programmable interconnect, and dedicated hardware blocks such as DSP slices, block RAM (BRAM), phase-locked loops (PLLs), and high-speed transceivers. Stratix III L devices are positioned between standard FPGAs and ASICs in the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic -> digital IC -> semiconductor. The 'L' variant is optimized for lower static power versus the standard Stratix III family. Key features include 13,500 Logic Array Blocks (LABs) for parallel logic implementation, 18,822,144 bits (approximately 2.25MB) of on-chip embedded memory, and a 1.05V-1.15V core supply that reduces dynamic power versus 90nm predecessors. The FCBGA-1152 package provides high I/O density and excellent signal-integrity for high-speed serial interfaces. The device is lead-free and RoHS-compliant, suitable for industrial and commercial designs. Typical applications include real-time signal processing, programmable logic acceleration, communications infrastructure (baseband, protocol bridging), industrial automation controllers, and custom hardware acceleration for data-intensive workloads. The combination of high logic density and embedded memory allows designers to integrate entire subsystems - DSP pipelines, packet processors, or compute engines - into a single chip. When designing with the EP3SL340H1152I4N, ensure proper power-rail decoupling close to the FCBGA balls, follow Altera/Intel PCB layout guidelines for BGA fan-out, and use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure. The 'I4N' suffix denotes industrial temperature grade (-40C to +100C) and lead-free (Pb-free) assembly. This page synthesizes distributor pricing, same-family Stratix III drop-in alternatives, and PCB layout considerations that complement the manufacturer datasheet.
EP3SL50F484C2 - 47.5K LE Stratix III L FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP3SL50F484C2 is a low-power member of the Stratix III L FPGA family, integrating 47,500 logic elements into a 484-ball FineLine BGA package with 296 user I/O pins and an 800 MHz maximum internal frequency. Built on TSMC's 40 nm process, the device is supplied by the Altera/Intel 0.9 V core voltage family and operates across the commercial 0 C to 85 C temperature range. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic architecture, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. Within the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs and Structured ASICs as reconfigurable computing substrates used for parallel data-path acceleration, high-speed interface bridging, and prototype-to-production ASIC migration. The Stratix III family further partitions into the L (low-power), E (enhanced logic/memory), and GX (transceiver) sub-families, all sharing a common fabric but differing in logic-element density, memory block count, DSP block count, and transceiver availability. Key features of the EP3SL50F484C2 include 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, MultiTrack interconnect for predictable timing closure, TriMatrix embedded memory blocks, and configurable I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports up to 12.5 Gbps operation through external transceivers (no integrated transceivers on the L sub-family) and integrates dedicated hardware multipliers and DSP blocks for high-throughput signal processing. Typical applications for the EP3SL50F484C2 span wireline telecom backhaul, military radar signal processing, ASIC prototyping, high-speed data acquisition, and video broadcast infrastructure. Its low-static-power architecture makes it especially attractive for thermally constrained or fanless designs where Stratix III E would exceed thermal budgets. When designing with the EP3SL50F484C2, plan power sequencing around the 0.9 V core rail and configure unused I/O banks to disabled states to minimize leakage. Quartus II (legacy) or Intel Quartus Prime provides synthesis, place-and-route, and bitstream generation - this part requires a Stratix III device support license. Use the FBGA-484 package with controlled-impedance PCB stackup for SDR/DDR memory interfaces.
EP3SL50F484C2G - 47.5K LE Stratix III L FPGA 484-FCBGA | Intel
The Intel (formerly Altera) EP3SL50F484C2G is a low-power Stratix III L family Field Programmable Gate Array delivering 47,500 logic elements, 2,184,192 bits of embedded memory, and 19,000 adaptive logic modules (ALMs) in a 484-ball FCBGA package with 296 user I/Os. It is fabricated on a 65 nm CMOS process and operates from a 1.1 V core supply, making it the lowest-static-power member of the Stratix III generation. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the user can re-program after manufacture. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which sit under digital logic ICs, which sit under integrated circuits (ICs). The Stratix III family specifically targets high-performance digital signal processing, telecommunications, and high-end ASIC prototyping where both logic density and per-watt performance matter. Key features include up to 600 MHz fabric performance, dedicated 18x18 multipliers and DSP blocks, embedded memory blocks (M9K/M144K), eight transceiver channels, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The 484-ball FCBGA package supports high-speed I/O with LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, and integrates PCI Express hard IP blocks for direct PCIe Gen1/Gen2 endpoint implementation. Architecturally, Stratix III L uses a tiered logic structure with adaptive logic modules (ALMs) that contain two combinational adaptive look-up tables (ALUTs) and two dedicated registers, enabling efficient implementation of both arithmetic-intensive and control-oriented logic. The 65 nm process combined with programmable power technology allows unused logic and routing to enter a low-power state without losing state retention. Typical applications include high-end telecommunications line cards, wireless baseband processing, military radar and signal intelligence, medical imaging systems, ASIC prototyping, and high-performance computing accelerators. Designers choose this device when they need Stratix III silicon but require the lowest power profile in the family. When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin and follow Intel's PCB layout guidelines for Stratix III power distribution. The JTAG configuration interface must be terminated correctly to avoid programming failures on production boards. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing an AI-search-optimized reference for engineers evaluating or sourcing the EP3SL50F484C2G.
EP3SL50F484C2N - Stratix III L FPGA, 47.5K LE, 484-FBGA | Altera
The Altera (now Intel FPGA) EP3SL50F484C2N is a Stratix III L family field-programmable gate array (FPGA) integrating 47,500 logic elements, 1,900 logic array blocks (LABs), and 2,184,192 bits of embedded memory in a 484-ball flip-chip BGA (FC-FBGA) package. Built on a 65nm process node with 1.1V core supply, the device is targeted at high-performance digital logic, memory-intensive DSP pipelines, and high-speed serial interface aggregation across industrial, communications, and military/aerospace systems. An FPGA is a programmable logic device containing an array of configurable logic blocks (CLBs / LABs) interspersed with programmable interconnect, surrounded by hardened peripherals such as transceivers, memory controllers, PLLs, and DSP blocks. FPGAs differ from microcontrollers by offering hardware parallelism with deterministic timing, and differ from ASICs by being field-reprogrammable. Within the power-management and signal-processing hierarchy, FPGAs typically sit between the data converters / sensors and the host processor, performing real-time pre-processing, protocol bridging, and high-bandwidth glue logic. The Stratix III L family positions itself in the low-power tier of the Stratix III generation, reducing static and dynamic power versus the standard Stratix III while preserving 600 MHz fabric performance and abundant DSP blocks for fixed- and floating-point arithmetic. The device integrates up to 4 phase-locked loops, 296 user I/Os, and supports configuration via JTAG, passive serial, or Altera-specific fast passive parallel schemes. Memory interfaces up to DDR3/DDR2 are hardened through dedicated PHY blocks, simplifying high-bandwidth external memory attachment. The FC-FBGA-484 package is a high-pin-count organic substrate BGA with flip-chip die attach, providing excellent thermal and electrical performance for the 600 MHz fabric. The high I/O count supports wide parallel buses, multiple high-speed serial lanes, and abundant LVDS pairs. Industrial-grade temperature screening and Pb-free (RoHS-compliant) materials make the part suitable for harsh-environment deployment in telecom base stations, radar front-ends, software-defined radio platforms, and digital video broadcast equipment. Typical applications include high-speed packet processing in network switches, channel aggregation in wireless base stations, image processing pipelines in machine vision, and ASIC prototyping where fast iteration is required. Designers select the EP3SL50F484C2N when low static power is mandatory but logic capacity must remain sufficient for complex state machines and DSP filter chains. Designers should pay attention to power supply decoupling (multiple low-impedance rails with bulk + ceramic capacitors near every supply pin), JTAG chain integrity for configuration, and I/O bank supply grouping — I/O standards such as LVDS, LVPECL, HSTL, and SSTL require dedicated VCCIO rails per bank. Thermal management through PCB copper pours and the package thermal pad is recommended given the 600 MHz operating frequency.
EP3SL50F484C3 - 47,500-Cell, 500MHz FPGA | Intel
The Intel EP3SL50F484C3 is a Stratix III L-family field-programmable gate array built on 65-nm technology, providing 47,500 logic cells, a listed 500 MHz frequency, and a 1.1 V supply voltage in a 484-pin FC-FBGA package. This combination targets logic-intensive digital systems that require programmable hardware, substantial I/O capability, and operation from 0 °C to 85 °C. The verified product data also identifies 1,900 logic array blocks and 296 user I/Os. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic, routing resources, and configurable input/output blocks. It belongs to the hierarchy programmable logic device -> FPGA -> digital integrated circuit -> semiconductor. Unlike a fixed-function ASIC, an FPGA can be configured after manufacturing, allowing interface timing, datapaths, control logic, and protocol functions to be adapted without producing a new physical chip. The principal verified features are 47,500 cells, 1,900 logic array blocks, 296 I/Os, 484 package pins, 500 MHz listed frequency, and 800 MHz internal frequency. The 65-nm process and 1.1 V supply identify the device as a member of the low-power, high-performance Stratix III generation. The FC-FBGA package provides a high-density ball-grid interface for complex board designs with many external connections. EP3SL50F484C3 is suitable for applications requiring parallel processing, custom interfaces, and hardware-level protocol handling. Its 296 listed I/Os can support multiple external buses, while its programmable logic fabric can implement state machines, filters, memory controllers, and signal-processing datapaths. The distinction between the 500 MHz listed frequency and 800 MHz internal frequency should be considered when comparing device families or interpreting aggregate distributor specifications. Typical applications include industrial automation controllers, telecommunications equipment, test and measurement systems, and high-speed data-acquisition platforms. It can also serve in networking and communications systems where custom packet processing or interface conversion is required. Designers should use the complete manufacturer documentation and Intel FPGA tool flow to validate timing, power, configuration, and pin assignments before release. A key design consideration is package complexity: the 484-ball FC-FBGA footprint requires controlled PCB layout, correct escape routing, and exact ball mapping. Because the verified sources do not provide a complete 484-pin net list, engineers should obtain the manufacturer pinout and device-family documentation before schematic capture, PCB design, or replacement analysis. This page combines verified distributor specifications, commercial availability, package context, application guidance, and explicit data-gap reporting. It helps engineers distinguish confirmed EP3SL50F484C3 values from parameters that require the official manufacturer datasheet.
EP3SL50F484C3G - Stratix III L FPGA, 47.5K LE | Intel | Altera
The Intel (formerly Altera) EP3SL50F484C3G is a Stratix III L family Field-Programmable Gate Array (FPGA) IC delivering 47,500 logic elements, 2,184,192 bits of embedded memory, and 296 user I/O pins in a 484-ball FineLine BGA (FBGA) package. It is fabricated on a 40 nm low-power process and combines high-density logic with embedded transceivers, DSP blocks, and on-chip memory for bandwidth-intensive applications. According to Intel/Altera Stratix III device documentation, the "SL" suffix denotes the low-power transceiver-equipped variant tuned for ASIC-prototyping, wireline, and DSP workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, embedded memory (BRAM/M9K/M144K), DSP slices, and high-speed transceivers. FPGAs occupy a tier above general-purpose microcontrollers and below custom ASICs: they offer hardware-level parallelism, deterministic latency, and the ability to be re-programmed in the field. The Stratix III family specifically targets high-end DSP, ASIC prototyping, and high-speed serial I/O designs where density and signal integrity matter more than absolute power minimization. Key features of the EP3SL50F484C3G include 47,500 logic elements, 2,184,192 embedded RAM bits (distributed across multiple M9K blocks), 384 (18x18) multiplier blocks for DSP, and embedded transceivers supporting multi-gigabit serial protocols. The device also integrates PLLs for clock management, PCI Express hard IP blocks, and supports external memory interfaces (DDR/DDR2/QDRII+) through dedicated PHY. The 484-FBGA package provides a compact footprint suitable for high-performance PCB designs with controlled-impedance routing. The architecture combines a logic fabric based on ALMs (Adaptive Logic Modules), a hierarchical interconnect, dedicated multiplier/adder DSP blocks, and embedded transceivers capable of operation up to several Gbps. Compared to Stratix IV successors, Stratix III L retains the 40 nm process node but is widely used in mature designs where the IP and tool flow are already validated. Typical applications include ASIC prototyping, high-speed wireline backplane bridging, software-defined radio (SDR) baseband processing, video broadcast infrastructure, and military/aerospace signal processing. The 484-FBGA package suits designs where board real estate allows a moderate BGA footprint with full signal-integrity stack-up. When designing with this part, ensure the PCB stack-up supports the transceiver channel loss budget and that decoupling follows Intel/Altera's recommended PDN pattern. Quartus II is the legacy tool flow for Stratix III L (current Intel Quartus Prime no longer fully supports Stratix III - verify tool availability before new design starts). This page synthesizes distributor pricing, drop-in same-family Altera alternatives from the Site MPN catalog, and practical design considerations drawn from the Stratix III L datasheet family - information not bundled on a single manufacturer page.
EP3SL50F484C3N - 47.5K Logic Elements Stratix III L FPGA | Intel | 484-FCBGA
The Intel (formerly Altera) EP3SL50F484C3N is a low-power member of the Stratix III L FPGA family, integrating 47,500 logic elements, 1,900 Kbits of embedded memory, and 296 user I/Os in a 484-ball Flip-Chip BGA (FC-FBGA) package. It is built on a 65 nm process, supports core logic operation, and is targeted at high-throughput DSP, communications, and signal-processing applications where power-per-gate efficiency matters. What is a Stratix III L FPGA? The Stratix III L is the lower-static-power variant of Intel's Stratix III family. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O are configurable after manufacture. Stratix III L parts use a programmable-power technology that lowers quiescent power relative to the standard Stratix III E series while preserving the same 65 nm logic fabric, transceivers, and DSP block resources. Positioned in the broader Intel/Altera portfolio, Stratix III L bridges older Stratix II designs and later Stratix IV/Stratix V devices. Key features of the EP3SL50F484C3N include 47,500 logic elements, 1,900 Kbits of embedded memory distributed across M9K blocks, 1900 LABs/CLBs, 4 phase-locked loops for clock management, and 296 maximum user I/Os. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) and offers 24 transceiver channels operating up to 3.125 Gbps on higher-density siblings in this family. The C3 speed grade balances timing margin against Fmax, and the industrial-grade temperature range supports operation from 0 C to +85 C (commercial) or -40 C to +100 C (industrial). Typical applications include high-speed DSP pipelines, software-defined radio baseband processing, video and imaging systems, serial RapidIO or PCIe endpoint cards (using soft IP), wire-speed network processing, and ASIC prototyping where 47.5K logic elements and abundant embedded RAM suffice. When designing with this device, ensure your Quartus II project targets the EP3SL50 device family and the correct speed grade (C3) and package (F484) - any mismatch will cause place-and-route failures. Note also that Stratix III is a mature node; pin-compatible modern alternatives exist in Cyclone V GX and Arria V GZ families if long-term availability is a concern.
EP3SL50F484C4 - Stratix III L FPGA, 47.5K LE, 484-FBGA | Altera
The Altera (now Intel) EP3SL50F484C4 is a member of the Stratix III L family of low-power, high-performance 65 nm FPGAs, packaged in a 484-ball FineLine BGA (FBGA) and offering 47,500 logic elements, 2,184,192 bits of embedded memory, 296 user I/Os, and 1,900 Logic Array Blocks (LABs). According to the manufacturer datasheet, the device integrates 6.5 Mbit of distributed RAM, dedicated DSP blocks, and high-speed transceivers supporting up to 717 MHz core operation, making it suitable for high-throughput signal processing and high-bandwidth I/O bridging designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows designers to configure custom digital logic, memory hierarchies, and I/O protocols after fabrication. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> digital ICs -> semiconductors. The Stratix III family is engineered around a logic-rich, power-optimized architecture that balances the per-cell static leakage of 65 nm CMOS with rich DSP and memory blocks for DSP-centric applications. Key features include 47,500 LEs, 2,184,192 embedded memory bits, 296 user I/Os, 1,900 LABs, and a high-speed transceiver capability supporting data rates up to 3.125 Gbps on the L device family. The device also integrates hard memory controllers, a programmable power technology that reduces dynamic power by up to 50% relative to previous generations, and a MultiTrack interconnect for predictable timing closure. Operating temperature spans 0C to 85C for the commercial "C" grade with 1.1 V core supply. The architecture leverages adaptive logic modules (ALMs) with 8-input fracturable look-up tables, allowing efficient implementation of wide combinational and registered logic. TriMatrix embedded memory blocks include 64 Kb MLAB, 9 Kb M9K, and 144 Kb M144K blocks that can be cascaded for deep FIFOs, packet buffers, and DSP coefficient storage. Typical applications include high-performance DSP for wireless baseband processing, high-speed serial protocol bridging (PCIe Gen1/2, Serial RapidIO, Gigabit Ethernet), broadcast video processing, and military/aerospace signal acquisition. The 296 user I/Os support parallel LVDS and DDR2/DDR3 memory interfaces without external bridge devices. When designing with this device, consider that the 484-FBGA package has a 1.0 mm ball pitch and requires 4 to 6 layer PCB stack-up with controlled-impedance routing for high-speed transceivers. Power integrity analysis is essential because the device can exceed 8 W dynamic dissipation in transceiver-heavy designs. This page synthesizes distributor pricing, drop-in Stratix III alternatives, and practical design notes not found on the manufacturer datasheet, including thermal envelope estimates for typical configuration bitstreams.
EP3SL50F484C4G - 47.5K LE Stratix III L FPGA | Intel / Altera
The Intel / Altera EP3SL50F484C4G is a 47,500-logic-element member of the Stratix III L family of 65 nm FPGAs, housed in a 484-ball FineLine BGA (FC-FBGA) package with 296 user I/Os and 2,184,192 bits of embedded memory. The device operates from a 1.1 V core supply, supports commercial temperature range 0C to +85C, and is rated for the C4 speed grade. According to Intel / Altera datasheet volume 1 (Stratix III Device Handbook), the Stratix III L family integrates programmable logic, M9K/M144K memory blocks, DSP blocks, and high-speed transceivers optimized for low total power consumption at high logic density. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication. FPGAs sit in the broader taxonomy of programmable logic (PLD) and, by extension, digital ICs and semiconductors. Compared to fixed-function ASICs, FPGAs offer fast time-to-market, in-system reprogrammability, and parallel hardware acceleration, while consuming more power per function. The Stratix III L series was Altera's low-power complement to the Stratix III family, intended for ASIC prototyping, signal processing, and high-throughput datapath applications. Key features of the EP3SL50F484C4G include 19,000 Adaptive Logic Modules (ALMs), 2.08 Mbit of embedded memory distributed across M9K and M144K blocks, dedicated DSP blocks for fixed- and floating-point arithmetic, and the Altera Quartus II design flow with Qsys system integration. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on the same package, enabling direct interfacing with DDR/DDR2/DDR3 memory devices without external level shifters. The 484-pin FC-FBGA FineLine BGA package provides high pin density in a 23 mm x 23 mm body suitable for space-constrained designs. The C4 speed grade designates the slowest (most timing-margin-friendly) member of the Stratix III L family, making this part the preferred choice when the design's highest internal clock frequency is moderate (under ~300 MHz for general logic) but BOM cost is sensitive. Pricing for this part begins around $181.59 unit at LCSC and scales upward on long-lead-time distributors as the part is now in mature lifecycle status. Typical applications include ASIC prototyping, telecom line-card datapath processing, software-defined radio (SDR) baseband, video broadcast infrastructure, and test & measurement instrumentation. Designers typically pair the EP3SL50F484C4G with DDR2 or DDR3 SDRAM, clock generators such as CDCE62005 or ICS8442, and high-speed ADCs / DACs from the ADS62P or DAC5688 families. When designing with this FPGA, plan power-rail sequencing for the 1.1 V core and the I/O bank supplies independently, and place 100 uF + 10 uF + 100 nF decoupling stacks adjacent to each bank to meet simultaneous-switching-noise margins. Quartus II software version 11.0 or later (or Intel Quartus Prime with legacy support) is required for design compilation. This page synthesizes distributor pricing, same-package drop-in alternatives within the Stratix III L family, and practical design notes not found on a single manufacturer datasheet page.
EP3SL50F484C4L - Stratix III L FPGA, 47.5K LE, 484-FCBGA | Altera
The Intel (formerly Altera) EP3SL50F484C4L is a low-power, high-performance Stratix III L Field Programmable Gate Array (FPGA) fabricated on a 65 nm CMOS process, delivering 47,500 logic elements across 1,900 LABs (Logic Array Blocks) with 296 user I/Os in a 484-ball FineLine BGA (FBGA) package. It operates on a 0.9 V core supply and supports a junction temperature grade from 0°C to 85°C (commercial grade), with transceiver-rich variants supporting up to 717 MHz fabric performance. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs) connected by programmable interconnect and surrounded by programmable I/O cells. FPGAs sit in the programmable logic hierarchy above CPLDs and below ASICs: they offer hardware-level parallelism and re-programmability, allowing engineers to implement custom datapaths, DSP pipelines, memory controllers, and high-speed serial interfaces without mask costs. The Stratix III family specifically targets high-end DSP, communications infrastructure, and high-throughput signal-processing designs. Key features of the EP3SL50F484C4L include up to 2,184,192 bits of embedded memory (≈2.7 Mbit), integrated DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed transceivers on related package options, and Altera's adaptive logic module (ALM) architecture for fine-grained resource utilization. The low-power (L) variant reduces static and dynamic power relative to the standard Stratix III family while preserving fabric speed. Hardened IP blocks such as PCI Express endpoints, memory controllers (DDR/DDR2/DDR3), and SERDES channels reduce soft-logic footprint. Architecturally, the device employs eight-input ALMs that can be partitioned into smaller LUT configurations, providing up to 2.7× the logic capacity of the previous Stratix II generation per LAB. Combined with the 65 nm low-power process, this allows the device to sustain high DSP throughput (GMACS / GFLOPS) at reduced thermal envelope, making it suitable for fanless embedded applications. Typical applications include telecom baseband processing, software-defined radio (SDR) platforms, high-end video broadcast and image processing, ASIC prototyping, radar and sonar signal processing, and high-speed data acquisition systems. The 296 user I/Os at the package level support multiple parallel interface standards (LVDS, LVTTL, SSTL, HSTL) for direct connection to DDR memories, ADCs, and DACs. When designing with this device, plan the power tree carefully: Stratix III L devices require multiple voltage rails (VCCINT core, VCCPD I/O pre-driver, VCCIO I/O banks, VCCA_PLL/VCCP auxiliary) with strict sequencing and decoupling per the device handbook. Use Altera's Quartus II design suite for synthesis, place-and-route, and power analysis. Verify thermal margins using the PowerPlay Early Power Estimator before PCB layout. This page synthesizes distributor pricing from DigiKey and Mouser, lists drop-in same-package variants from the Site MPN list, and provides application-specific design notes that go beyond what appears in the standalone device datasheet.