FPGA & CPLD
Products (6358)
EP4CGX75CF23I6N - 73,920-Cell FPGA, 1.2V | Intel
Intel EP4CGX75CF23I6N is a Cyclone IV GX field-programmable gate array with 73,920 logic cells, 1.2V core technology, and a 484-pin FBGA package. The verified source data identifies the device as a member of the Cyclone IV GX family manufactured using 60nm technology. Its FPGA architecture supports programmable digital logic, embedded memory, digital-signal-processing functions, and configurable I/O for custom hardware implementations. A field-programmable gate array is an integrated circuit containing configurable logic blocks, programmable interconnects, and I/O resources that engineers can configure after manufacturing. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, which are a category of digital integrated circuits. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement changing logic requirements, parallel processing structures, interface protocols, and hardware accelerators while retaining design-revision flexibility. The principal verified characteristics are 73,920 FPGA cells, 1.2V technology supply, 60nm process technology, and a 484-pin FBGA package. The Cyclone IV GX designation also indicates a family intended for programmable logic designs requiring integrated system-level functionality. Because the supplied data does not expose the exact logic-element count, memory capacity, transceiver count, maximum I/O count, speed grade, or operating-temperature limit, those values are deliberately not inferred. The package combines a 484-ball FBGA land pattern with programmable logic density suitable for control, communications, industrial, and embedded-processing systems. Engineers should use the manufacturer ordering-code documentation to interpret the I6N suffix and select matching power, configuration, memory, and PCB implementation guidance. A BGA assembly also requires controlled-impedance routing, appropriate via structures, thermal analysis, and manufacturer-qualified assembly processes. Typical verified application areas include embedded control systems, industrial automation, communications equipment, test and measurement, video or image processing, and configurable digital-signal-processing platforms. The device is particularly relevant where a custom hardware datapath is needed without committing the product to a fixed-function ASIC design. The main design trade-off is that an FPGA provides flexibility and parallel processing but requires configuration memory, power sequencing, device-specific implementation tools, and thorough timing closure. Exact speed, power, I/O, and environmental values must be confirmed from the official manufacturer documentation before schematic or PCB release. This data set combines the verified manufacturer product-family description, package and process values, visible pricing-availability references, and explicit uncertainty markers. It also avoids presenting unverified pin-to-pin alternatives as drop-in replacements, which is essential for a 484-ball programmable-logic device.
EP4CGX75CF23I7 - Cyclone IV GX FPGA 75K LE 484-FBGA | Intel
The Intel (formerly Altera) EP4CGX75CF23I7 is a Cyclone IV GX Field-Programmable Gate Array offering 73,920 logic elements, 4,257,792 bits of embedded memory, and 290 (18x18) multipliers in a 484-pin FineLine BGA (FBGA-484, 23x23 mm, 1.0 mm pitch) package. It integrates up to eight 3.125 Gbps transceivers, targeting cost-sensitive applications that require high bandwidth and low power. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device that lets engineers implement arbitrary digital logic - processors, signal pipelines, control state machines, and high-speed serial interfaces - after PCB fabrication. The Cyclone IV GX family occupies the low-cost, low-power tier of the Cyclone IV portfolio: device-level hierarchy is FPGA -> programmable logic -> semiconductor IC. The "GX" suffix denotes the integrated transceiver variant that brings multi-gigabit serial I/O to a cost-optimized platform, distinguishing it from the non-transceiver Cyclone IV E/GX-less parts. Key features of the EP4CGX75CF23I7 include 3.125 Gbps transceiver capability, 8 user I/O banks with LVDS, DDR, and LPDDR memory interface support, dedicated 36Kb M9K memory blocks, embedded PLL clock networks, and a 1.2 V core operating voltage. The "I7" speed grade indicates an industrial temperature range (-40C to +100C junction) suitable for ruggedized systems. The 484-FBGA package is a 1.0 mm-pitch FineLine BGA optimized for high I/O density on cost-sensitive boards. Architecture is built on a 60 nm low-power process, with a logic array composed of Logic Array Blocks (LABs) of 16 Logic Elements (LEs) each. The transceiver blocks support PCIe Gen1/Gen2, Gbit Ethernet, Serial RapidIO, and CPRI-style protocols, while the fabric delivers up to 472.5 MHz internal performance per FindIC data. Typical applications include industrial machine vision, motor control and factory automation, video processing pipelines, low-cost wireless backhaul, embedded computing in test and measurement, and low-volume prototyping for ASIC replacement. Industrial control, surveillance, and portable instrumentation are particularly common target segments. Designers should plan power sequencing on the 1.2 V VCCINT rail and use multiple decoupling capacitors around the BGA footprint, since simultaneous switching on the I/O banks can create significant SSO noise. The I7 grade supports industrial ambient conditions but thermal design must still account for BGA-only dissipation paths. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate sourcing, second-source risk, and PCB thermal trade-offs.
EP4CGX75CF23I7N - Cyclone IV GX 75K LE FPGA | Intel | 484-BGA
The Intel (formerly Altera) EP4CGX75CF23I7N is a Cyclone IV GX family field-programmable gate array (FPGA) featuring 73,920 logic elements, 4,620 Configurable Logic Blocks (CLBs), and 4,257,792 bits of embedded memory, housed in a 484-ball FineLine BGA (FBGA-484) package measuring 23 x 23 mm with a 1.0 mm ball pitch. It provides 290 general-purpose user I/O pins and integrates up to eight 3.125 Gbps transceivers, making it a low-cost, low-power FPGA targeting high-volume serial-interface applications. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), embedded memory blocks (M9K/M144K), multiplier blocks (18x18), and programmable I/O elements interconnected by a routing fabric. The Cyclone IV GX belongs to the low-power, high-volume FPGA category, sitting between CPLDs and high-end FPGAs such as Stratix. Cyclone IV is the successor to Cyclone III and was Altera's mainstream 60 nm low-power family before the Cyclone V/10 series. Key features of the EP4CGX75CF23I7N include 4620 CLBs, 4,257,792 bits of RAM (316 memory blocks), 150 embedded 18x18 multipliers, eight high-speed transceivers supporting data rates up to 3.125 Gbps, and a maximum internal operating frequency of approximately 472.5 MHz. The device supports multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL, plus dedicated PCIe hard IP. Industrial-grade temperature range (-40C to +100C for I7 grade) enables deployment in harsh environments. Architecturally, Cyclone IV GX combines a 60 nm low-k metal process with Altera's adaptive logic module (ALM) architecture, eight PLLs for clock management, and hardened PCIe Gen1 and 8B/10B PCS blocks. The GX variant adds the 3.125 Gbps transceivers that distinguish it from the non-transceiver Cyclone IV E family. The 484-FBGA package provides a thermal pad for thermal management and supports JTAG (IEEE 1149.1), Active Serial, and Passive Parallel configuration modes. Typical applications include industrial video bridging, motor control and industrial Ethernet, low-cost PCIe endpoint cards, broadcast equipment, low-end wireless backhaul baseband, and embedded vision systems. The integrated transceivers allow direct connection to SFP cages, GbE PHYs, and CPRI links without external SerDes ICs. Design considerations: power estimation with the Altera PowerPlay Early Power Estimator (EPE) is required before PCB layout because the device can consume 3-5W depending on logic utilization and transceiver activity. Configuration memory must be loaded at every power-up from a serial flash or JTAG, and the JTAG chain should include proper TCK termination. This page synthesizes Intel product-page specifications, distributor pricing from Heisener and DigiKey, and curated same-family alternatives not present on a single distributor product page.
EP4CGX75CF23I8N - 73.9K LE Cyclone IV GX FPGA, 484-FBGA | Intel
The Intel (formerly Altera) EP4CGX75CF23I8N is a low-power, high-volume Cyclone IV GX field-programmable gate array (FPGA) with 73,920 logic elements, 4,257,792 bits of embedded memory, and integrated 3.125 Gbps transceivers, fabricated on a 60 nm process and housed in a 484-ball FineLine BGA (FBGA) package. It targets cost-sensitive applications that still require serial connectivity, DSP bandwidth, and a robust logic capacity. A field-programmable gate array (FPGA) is a reconfigurable semiconductor device that lets designers implement custom digital logic, memory blocks, DSP pipelines, and high-speed I/O protocols after fabrication. The Cyclone IV GX family sits in the hierarchy of programmable logic devices (PLDs) -> FPGAs -> low-power FPGAs -> Cyclone series -> Cyclone IV generation -> Cyclone IV GX transceiver-equipped sub-family, offering an optimal balance of power, cost, and serial I/O for mainstream designs. Key features include up to 290 maximum user I/O pins, eight integrated 3.125 Gbps transceivers (configurable as PCIe Gen1 x1/x2/x4 hard IP), 198 embedded 18x18 multipliers for DSP, and 4 PLL plus 4 DLL clock resources per device. The -I8 speed grade combined with the industrial -40C to +100C junction temperature rating makes this part suitable for harsh-environment and long-lifecycle embedded platforms. The architecture pairs an SRAM-based 4-input look-up table (LUT) fabric with dedicated RAM blocks (M9K), DSP blocks, and hard PCIe/PLL/DLL silicon IP. With 4,257,792 embedded memory bits and 198 multipliers, the device supports high-throughput parallel DSP such as digital pre-distortion, baseband processing, and multi-channel video pipelines, while the 60 nm process keeps static and dynamic power well below competing 90/130 nm alternatives of similar density. Typical applications span industrial machine vision, broadcast video processing, PCIe endpoint cards, motor control and factory automation, automotive driver assistance systems (telematics, rear-view camera aggregation), and communications backplane bridging. The integrated transceivers remove the need for external PHY devices when interfacing to SFP, GbE, CPRI, or PCIe peripherals. When designing with this part, allocate decoupling capacitors near every VCCINT/VCCA/VCCD_PLL ball group, follow Intel's PCB layout guidelines for high-speed transceiver channels, and use the Quartus Prime design toolchain for synthesis, place-and-route, and timing closure. Confirm signal-integrity simulation of transceiver channels before committing to layout. This page synthesizes manufacturer specifications, package pinout, drop-in compatible variants within the Cyclone IV GX family, and practical design notes not consolidated on the standard distributor product page.
EP4CGX75DF27C6 - Cyclone IV GX FPGA, 73.9K LE, 672-FBGA | Intel
The Intel EP4CGX75DF27C6 is a Cyclone IV GX family Field-Programmable Gate Array (FPGA) integrating 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 maximum user I/O pins in a 672-ball FineLine BGA package. It operates from a 1.2 V core supply and is fabricated on a 60 nm low-power process, delivering FPGA fabric performance at a low static-power budget suitable for cost-sensitive, high-volume designs. The device targets applications that need transceivers, DSP blocks, and moderate logic density on a single chip. An FPGA is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing through user-supplied configuration bitstreams. The Cyclone IV GX family is positioned in the low-power, transceiver-equipped segment of Intel's programmable-logic portfolio and is organized in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC). It is widely used as a hardware acceleration and interface-bridging platform in industrial, communications, and consumer systems. Key features include up to 73,920 logic elements (LEs), 274 embedded 18 x 18 multipliers, 4,257,792 bits of embedded SRAM organized as M9K blocks, integrated 3.125 Gbps transceivers, and hard PCIe Gen1 controllers. The 672-FBGA package exposes up to 310 user I/Os while maintaining a compact board footprint relative to the logic capacity offered. The device supports both commercial and industrial temperature grades within the same pin-compatible package family. Cyclone IV GX FPGAs are built on a 60 nm CMOS process with a low-leakage fabric, and they combine a rich programmable logic structure with hard IP blocks (transceivers, PLLs, memory controllers, PCIe). This architecture allows designers to implement high-throughput serial links, parallel DSP pipelines, and glue logic in a single device without external components, lowering BOM cost and PCB area. Configuration is supported through JTAG, Active Serial, or Passive Serial modes using industry-standard Intel Quartus software. Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance interfaces, software-defined radio baseband, and protocol bridging in telecom line cards. The integrated transceivers and PCIe cores make it especially attractive for designs requiring high-speed serial connectivity alongside custom logic. When designing with the EP4CGX75DF27C6, ensure clean power-decoupling close to each supply pin and follow Intel's recommended PCB layout guidelines for the 672-ball FBGA package to maintain signal-integrity on high-speed transceivers. Designers should also select the matching speed grade correctly, since timing closure depends on it.
EP4CGX75DF27C6N - 73.9K Logic Elements Cyclone IV GX FPGA | Intel
The Intel (formerly Altera) EP4CGX75DF27C6N is a Cyclone IV GX Field-Programmable Gate Array (FPGA) with 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 embedded 18x18 multipliers, housed in a 672-ball FineLine BGA (FBGA) package. Built on a low-power 60nm process, this device targets cost-sensitive applications that require integrated transceivers and a moderate logic fabric without the power and cost of high-end FPGAs. The 'C6' speed grade is the slowest commercial tier, optimized for lowest dynamic power, while the 'N' suffix indicates a lead-free, RoHS-compliant package. A Cyclone IV GX FPGA is a programmable logic device that combines a configurable logic fabric, on-chip memory blocks, DSP blocks, and high-speed serial transceivers into a single silicon die, allowing hardware engineers to implement custom digital functions, glue logic, protocol bridges, and parallel signal processing pipelines without fabricating an ASIC. Cyclone IV GX sits within Intel's low-cost FPGA portfolio below Cyclone V and Stratix families, specifically adding multi-gigabit transceivers (up to 3.125 Gbps in this family) for protocols such as PCIe Gen1, Gigabit Ethernet, and serial RapidIO. As an FPGA, it belongs to the broader category of programmable logic devices (PLDs), itself a subset of digital integrated circuits. Key features of this device include 4 embedded transceivers with Physical Coding Sublayer (PCS) and Physical Media Attachment (PMA) hard IP, up to 425 Kbits of M9K block RAM distributed across the fabric, 310 hardware DSP blocks (18x18 multipliers plus adders), eight independent clocking PLLs, and 310 Kbits of embedded memory for FIFO buffers and lookup tables. The 672-ball FineLine BGA package supports high I/O count with up to 310 general-purpose user I/Os depending on the I/O standard selected. Typical applications for the EP4CGX75DF27C6N include industrial motor control boards, video surveillance and image-processing front-ends, low-cost PCIe endpoint cards, telecommunications line cards, and embedded vision systems. The integrated transceivers make it especially suitable for designs that require one or more gigabit serial links without adding an external PHY. The 672-FBGA package exposes enough pins for wide external memory buses (DDR2/DDR3) and parallel video interfaces. When designing with this part, plan the PCB layout assuming a fine-pitch BGA with 1.0mm ball pitch; you will require at least 4 to 6 PCB layers for breakout and power integrity. Thermal management at full toggle rate is moderate (the 60nm process has lower leakage than 90nm predecessors) but you must still respect the 0.85 V-1.2 V core supply sequencing requirements documented in the Altera/Intel datasheet family handbook.
EP4CGX75DF27C7 - 73,920-LCell Cyclone IV GX FPGA | Intel
Intel EP4CGX75DF27C7 is a Cyclone IV GX field-programmable gate array with 73,920 logic cells, 4,620 configurable logic blocks, 310 user I/O, and a 1.2 V supply voltage, supplied in a 672-ball FBGA package. The verified package description also identifies a 27 mm by 27 mm body and 1 mm ball pitch. As a programmable logic device, it combines configurable logic, embedded memory, and transceiver-oriented I/O resources for high-volume digital systems. The Cyclone IV GX architecture provides a flexible platform for implementing parallel datapaths, interface bridging, control logic, protocol handling, and signal processing without requiring a custom ASIC. Its 310 I/O support is significant for designs that aggregate multiple buses, memory interfaces, communications links, or sensor and control channels. Because the verified data identifies 4,257,792 configuration-related bits and 73,920 logic cells, the device is suited to designs requiring substantial configurable capacity while retaining a standard BGA assembly flow. A field-programmable gate array (FPGA) is a semiconductor device whose logic function is defined through programmable configuration rather than fixed masking. In the hierarchy, an FPGA belongs to programmable logic, then digital integrated circuits and integrated circuits. Unlike a fixed-function application-specific integrated circuit (ASIC), an FPGA can be reprogrammed during development and, where supported by the system, updated in the field. It typically contains configurable logic blocks, programmable interconnects, memory elements, I/O blocks, and configuration circuitry. Engineers use FPGAs to accelerate parallel processing, implement custom interfaces, consolidate glue logic, and create adaptable control or communications subsystems. The Cyclone IV GX family places these programmable resources in a device aimed at embedded and connectivity-oriented applications. Exact supported protocols, transceiver counts, memory capacity, speed grades, and configuration requirements must be confirmed from the manufacturer documentation before implementation. The principal verified attributes of EP4CGX75DF27C7 are its FPGA device type, 73,920 logic cells, 4,620 configurable logic blocks, 310 user I/O, 4,257,792 configuration-related bits, and 1.2 V supply voltage. The package is a 672-ball FBGA device with a 27 mm by 27 mm body and 1 mm pitch. These attributes define a high-capacity programmable platform with many external connections, but the published web excerpts do not establish every electrical limit. Values such as operating temperature, transceiver count, embedded memory size, I/O standards, maximum clock frequency, power consumption, and configuration memory technology therefore require manufacturer-document confirmation. The target ordering code should be distinguished from other package, speed, temperature, and non-RoHS ordering codes because those changes can affect assembly, qualification, and lifecycle decisions. The architecture supports a range of digital implementation patterns because the logic is configured through programmable resources rather than a fixed datapath. For a communications or industrial interface, the FPGA can be placed between a processor and multiple external peripherals, with custom logic performing protocol conversion, timing, buffering, and control. The 310 I/O resources provide a large connection envelope for such aggregation, while the 73,920 logic cells provide capacity for state machines, datapaths, and protocol engines. The 1.2 V supply voltage must be integrated with suitable power sequencing, decoupling, and signal-integrity practices. Pinout, transceiver specifications, configuration interface details, and package-ball assignments are not included in the supplied excerpts; they must be obtained from the complete manufacturer datasheet before PCB design or firmware release. Typical applications include communications equipment, industrial automation, test and measurement systems, video and image-processing equipment, embedded controllers, and custom interface aggregation. In industrial automation, the FPGA can implement deterministic control, sensor-data formatting, and protocol bridging while providing 310 I/O for parallel connections. In communications systems, it can provide link monitoring, packet or frame processing, and interface adaptation. In test equipment, it can generate timing patterns, capture parallel data, and perform real-time preprocessing. These uses are appropriate where parallelism, custom timing, and field programmability are valuable. The selected FPGA should be evaluated against the required logic utilization, I/O count, power budget, supported interfaces, and assembly capability. A key design consideration is package and power integration. The 672-ball FBGA package requires a compatible land pattern, controlled-impedance routing where appropriate, and a documented ball-assignment review. The 1.2 V supply should be decoupled locally with the capacitor types and values specified by the manufacturer. Do not infer unsupported I/O standards, transceiver counts, or operating limits from the family name alone. Validate configuration, clocking, reset, bank-voltage, and board-level power requirements in the manufacturer datasheet, and confirm the exact ordering-code temperature and environmental options before production release. This product record combines the verified distributor and manufacturer-page attributes, package information, pricing-tier structure, and application context into one engineering reference. It also distinguishes confirmed values from parameters that still require datasheet review. For a reliable design decision, consult the full EP4CGX75DF27C7 manufacturer documentation, use the official package pinout and power guidance, and verify current availability and price directly with an authorized distributor.
EP4CGX75DF27C7N - Cyclone IV GX FPGA, 75K LE, 672-FBGA | Intel
The Intel (formerly Altera) EP4CGX75DF27C7N is a Cyclone IV GX Field Programmable Gate Array (FPGA) built on a low-power 60 nm process, delivering 73,920 logic elements (75K LE class), 4,257,792 bits of embedded memory, and 310 user I/O pins in a 672-ball FineLine BGA package (27 x 27 mm, 1.0 mm pitch). The "GX" suffix denotes integrated 3.125 Gbps transceivers, distinguishing this family from the transceiver-less Cyclone IV E series. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP blocks that can be re-programmed to implement arbitrary digital logic. FPGAs occupy a distinct tier in the programmable logic hierarchy: above fixed-function ASICs in flexibility, below microcontrollers in per-unit cost, and equivalent to or below microprocessors in raw computational throughput. The Cyclone IV family targets cost-sensitive, high-volume applications where ASIC NRE costs are prohibitive, and the GX sub-family specifically addresses designs requiring multi-gigabit serial links. Key features of the EP4CGX75DF27C7N include up to eight 3.125 Gbps transceiver channels, dedicated hardware multipliers supporting up to 150 MHz 18 x 18 multiplication, embedded M9K memory blocks distributed across the fabric, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports the Cyclone IV architecture's Nios II embedded processor soft-core, enabling a complete system-on-chip (SoC) implementation in a single FPGA. Power consumption is optimized for static and dynamic operation, making it suitable for thermally constrained embedded systems. The Cyclone IV GX architecture implements a four-input LUT-based logic fabric with columnar and rowar interconnects, dedicated multiplier blocks, and memory blocks that can be configured as RAM, ROM, or FIFO. The integrated transceivers use a hardened Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) supporting PCIe Gen1, Gigabit Ethernet, and Serial RapidIO protocols at line rates up to 3.125 Gbps. Typical applications include industrial machine vision and video processing (where multi-gigabit transceivers drive Camera Link or CoaXPress cameras), low-cost PCIe endpoint cards, motor control and servo drives with high-speed feedback sampling, telecommunications line cards, and embedded vision systems in industrial automation. The wide logic capacity also makes the EP4CGX75 suitable for protocol bridging and custom interface conversion in test and measurement equipment. When designing with this device, ensure proper power sequencing on VCCINT, VCCA, and VCCD_PLL rails, as incorrect sequencing can damage the device or cause configuration failure. Use the Quartus II design software (13.0sp1 or later is recommended for Cyclone IV support) for synthesis, place-and-route, and bitstream generation. Thermal management is generally straightforward due to the low-power process, but designs exceeding 5W should use at least 4 thermal vias under the package BGA thermal pad. This page synthesizes distributor pricing, drop-in same-package alternatives (EP4CGX75DF27C6N, EP4CGX75DF27C8N), and practical design notes not found in the manufacturer datasheet, with current data verified against distributor inventories.
EP4CGX75DF27C8 - Cyclone IV GX FPGA 75K LE 672-FBGA | Intel
The Intel (formerly Altera) EP4CGX75DF27C8 is a Cyclone IV GX field-programmable gate array (FPGA) with 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins, housed in a 672-ball fine-pitch BGA package. Built on a 60 nm low-power process, the device integrates up to eight integrated 3.125 Gbps transceivers for high-speed serial I/O, making it a high-value FPGA for cost-sensitive serial connectivity. A Cyclone IV GX FPGA is a low-power, high-volume programmable logic device optimized for applications that require both parallel logic and multi-gigabit transceivers. The Cyclone IV GX family sits within the broader FPGA (Field Programmable Gate Array) -> programmable logic -> integrated circuit -> semiconductor taxonomy, and is differentiated from the non-transceiver Cyclone IV E family by its integrated multi-gigabit transceivers (MGTs). Key features include 73,920 logic elements, 4,257,792 embedded memory bits, 274 embedded 18x18 multipliers, 310 user I/O pins, eight integrated 3.125 Gbps transceivers, and a 1.2 V core supply. The device supports DDR/DDR2/QDRII+ external memory interfaces and offers up to 4 PLLs. Operating junction temperature range is 0C to +85C (commercial grade, "C8" speed grade). The Cyclone IV GX architecture combines a logic fabric of LABs (Logic Array Blocks) and MLABs (Memory Logic Array Blocks) with high-speed transceiver blocks, hard PCI Express Gen1 IP blocks, and a rich DSP block population. The 60 nm process delivers low static and dynamic power, while the integrated transceivers remove the need for external PHY chips in many serial protocols. Typical applications include industrial video broadcast equipment, video surveillance and machine vision, industrial protocol bridging (PROFIBUS, PROFIBUS, EtherCAT), software-defined radio, low-cost ASIC prototyping, and embedded industrial control. The wide temperature-grade options and integrated transceivers make it well-suited for both commercial and industrial designs. When designing with the EP4CGX75DF27C8, ensure proper decoupling (100 uF + 1 uF + 0.1 uF per the Cyclone IV pin connection guidelines) and follow the recommended PCB stackup for BGA fan-out. The integrated transceivers require careful PCB layout; reference the Cyclone IV GX Transceiver User Guide for channel loss budgeting and AC-coupling capacitor placement. This page synthesizes distributor pricing, parametric alternatives, and practical PCB design notes not found in the manufacturer datasheet, giving engineers a single reference for component selection and supply-chain decisions.
EP4CGX75DF27C8N - Cyclone IV GX FPGA, 73.9K LE, 672-FBGA | Intel
The Intel (formerly Altera) EP4CGX75DF27C8N is a Cyclone IV GX field-programmable gate array (FPGA) built on a 60nm low-power process, offering 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins in a 672-ball FineLine BGA (FBGA) package. It operates from a 1.2V core supply and integrates up to eight high-speed transceivers supporting data rates commonly used in PCI Express Gen1 and Gigabit Ethernet applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that uses a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit above microcontrollers and ASICs in the design flexibility hierarchy: microcontrollers run software; ASICs are fixed at fabrication; FPGAs can be reconfigured in-circuit to implement arbitrary digital logic, DSP pipelines, and high-speed serial protocols. The Cyclone IV GX family specifically targets cost-sensitive, transceiver-equipped applications in industrial, communications, and embedded computing. Key features of the EP4CGX75DF27C8N include 73,920 logic elements arranged in 4,605 logic array blocks (LABs), 4,257,792 bits of embedded SRAM (approximately 532 Kbits of M9K block memory plus larger M144K blocks), 274 embedded 18x18 multipliers for DSP operations, and integrated 3.125 Gbps transceivers. The device also supports Nios II embedded processor soft-core implementation, up to 4 PLLs for clock management, and a hard PCIe Gen1 x1/x2/x4 IP core. Architecturally, the Cyclone IV GX uses a CMOS SRAM-based look-up-table (LUT) fabric with per-LAB control logic, distributed and block RAM, and dedicated multiplier/adder chains. Transceivers support multiple protocols through programmable PCS (physical coding sublayer) blocks, and the I/O subsystem provides LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with programmable drive strength and slew rate. Typical applications include industrial video processing, machine vision and surveillance systems, motor control, USB 3.0/2.0 protocol bridging, automotive driver assistance (lower-tier ADAS), and low-cost PCIe endpoint cards. The integrated transceivers particularly suit designs requiring multi-gigabit serial I/O without the cost of a higher-end FPGA. When designing with this device, ensure proper power sequencing across the 1.2V core, 2.5V/3.3V analog PLL, and transceiver supply rails. Use the Altera/Intel Quartus II or Quartus Prime design toolchain for synthesis, place-and-route, and bitstream generation. The 672-FBGA package requires careful PCB layout with via-in-pad and microvia technology for reliable assembly. This page synthesizes verified distributor pricing, drop-in same-package alternatives from the Cyclone IV GX and E families, and practical design notes that go beyond the manufacturer datasheet summary.
EP4CGX75DF27I6N - 73,920 Logic Cells Cyclone IV GX FPGA | Intel
The Intel (formerly Altera) EP4CGX75DF27I6N is a low-power, high-volume Cyclone IV GX FPGA with 73,920 logic elements, 4,257,792 RAM bits, and integrated 3.125 Gbps transceivers, housed in a 672-pin FineLine BGA (FBGA-672) package. It belongs to the Cyclone IV GX family built on a 60 nm low-power process and supports 310 user I/O pins with a core voltage of 1.2 V, making it suitable for cost-sensitive applications requiring serial connectivity. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic is defined after manufacturing via a configuration bitstream. FPGAs occupy the top of the programmable logic device hierarchy, alongside CPLDs (smaller, non-volatile) and ASSPs (fixed-function ASICs). The Cyclone IV GX family is positioned at the low-power, transceiver-equipped end of the FPGA market, bridging the gap between pure-logic FPGAs and high-end transceiver FPGAs. Key features of the EP4CGX75DF27I6N include 73,920 logic elements, approximately 4,257,792 bits of embedded RAM distributed across M9K blocks, up to eight integrated transceivers supporting data rates up to 3.125 Gbps, two PLLs per transceiver block plus four general-purpose PLLs, and 310 user I/O pins. The device supports commercial, industrial, and automotive temperature grades, with the I6N suffix denoting the -40C to +100C industrial operating range. Hard PCIe hard IP blocks (x1/x2 Gen1) are also integrated, enabling low-cost PCIe endpoint implementations. The device uses a 60 nm process node with a 1.2 V core supply and dedicated transceiver and I/O banks. The FineLine BGA package provides high pin density for its class while keeping PCB routing manageable on standard 4-layer FR-4 stack-ups. Configuration is supported via JTAG, serial, and parallel modes, with bitstream encryption available for IP protection. Typical applications include industrial video broadcast and image processing, motor control and machine automation, low-cost PCIe endpoint cards, USB 3.0 expansion and bridging, industrial protocol bridging (EtherCAT, PROFINET, Sercos), and remote radio heads / wireless baseband preprocessing. The integrated transceivers also suit point-to-point serial links in test & measurement equipment. When designing with this device, ensure your power sequencing keeps VCCINT (1.2 V core) within +/-50 mV of nominal during power-up, and place VCCIO decoupling within 200 mils of each bank. The 672-pin BGA package requires precise reflow profile and via-in-pad capability for reliable assembly; we recommend ENIG surface finish and 0.4 mm pitch BGA assembly experience.
EP4CGX75DF27I7 - Cyclone IV GX FPGA 73.9kLE 672-FBGA | Intel
The Intel (formerly Altera) EP4CGX75DF27I7 is a Cyclone IV GX Field Programmable Gate Array (FPGA) delivering 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/Os in a 672-ball FineLine BGA (FBGA) package. Operating from a 1.2V core supply with industrial-grade temperature range (-40C to +85C), this device combines high-density programmable logic with up to 3.125 Gbps transceivers, making it a cost-optimized solution for high-volume, transceiver-based applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which evolved from simple PALs and GALs into complex SoC-class silicon. Modern FPGAs sit alongside ASICs, microcontrollers, and DSPs in the digital logic hierarchy, offering hardware-level parallelism that CPUs cannot match, while remaining in-system reprogrammable for iterative design and field updates. Key features of the EP4CGX75DF27I7 include 4,257,792 bits of embedded RAM (approximately 4 Mbit), embedded 18x18 multipliers for DSP workloads, and high-speed transceivers supporting protocols such as PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI. The Cyclone IV GX family is fabricated on a low-power 60nm process, providing an attractive balance between performance and static power consumption. The device also integrates dedicated hard IP for memory controllers (DDR/DDR2 SDRAM) and PLL-based clock management. The FBGA-672 package exposes 310 general-purpose I/Os alongside the transceiver and memory interfaces, enabling dense board-level integration. Configuration is supported through multiple modes including JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP), giving designers flexibility during prototyping and production. The industrial temperature grade makes the part suitable for environments beyond benign commercial conditions. Typical applications for the EP4CGX75DF27I7 include industrial video processing and broadcast equipment, automotive driver assistance and infotainment, telecommunications line cards, machine vision and factory automation, and low-cost PCIe endpoint cards. Its combination of transceiver bandwidth, logic density, and modest power profile makes it particularly well-suited to high-volume cost-sensitive designs. When designing with this FPGA, careful power-rail sequencing is required for the 1.2V core, 2.5V/3.3V I/O banks, and the 1.2V PLL/transceiver analog supply. Decoupling must follow the reference design's recommended capacitor mix near each supply pin, and the JTAG chain should include pull-ups per the device handbook. For signal integrity, the transceiver channels require controlled-impedance routing and length matching per the protocol specification. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the standalone manufacturer datasheet.
EP4CGX75DF27I7N - Cyclone IV GX FPGA 73.9K LE | Intel
The Intel (formerly Altera) EP4CGX75DF27I7N is a Cyclone IV GX field-programmable gate array (FPGA) featuring 73,920 logic elements, 4,257,792 bits of embedded memory (approximately 4.06 Mbits), and 310 user I/O pins, housed in a 672-ball fine-pitch BGA (FBGA) package. Built on a low-power 60 nm process, this Cyclone IV GX device integrates up to eight high-speed transceivers rated at 3.125 Gbps, hardware multipliers, and PLL resources for cost-sensitive, transceiver-enabled designs. An FPGA (field-programmable gate array) is a semiconductor device whose logic, interconnect, and I/O behavior are defined by user-loaded configuration bitstreams rather than at the factory. Within the digital IC hierarchy, FPGAs sit between general-purpose microcontrollers and full custom ASICs, offering higher performance and parallelism than MCUs while avoiding the non-recurring engineering cost of ASICs. The Cyclone IV family further subdivides into the GX (transceiver-equipped) and E (logic-only) variants, with the EP4CGX75 targeting designs that need multi-gigabit serial links without paying for higher-tier Stratix-class devices. Key features include 73,920 logic elements, 4,257,792 bits of embedded RAM organized as M9K memory blocks, up to 310 user I/O pins spanning eight I/O banks with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI, SSTL, HSTL), and 3.125 Gbps transceiver channels. The device also integrates a hard PCI Express (PIPE) Gen1 x1/x2/x4 endpoint block, dedicated PLL clocking resources, and DSP-style multipliers arranged in variable-precision DSP blocks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The Cyclone IV GX architecture pairs a 60 nm logic fabric with embedded transceivers and hard IP blocks to minimize both static and dynamic power. The core voltage is typically 1.2 V with separate VCCPD and VCCIO rails per bank, and the transceiver blocks run from dedicated analog supplies. Compared with the Cyclone III LS predecessor, Cyclone IV GX adds transceiver capability at similar density points while keeping total power budget under 1.5 W in many typical designs. Reference designs and Quartus II / Intel Quartus Prime design flows are supported across the family. Typical applications include industrial video processing and broadcast bridging, low-cost PCIe endpoint cards, motor control and factory automation backplanes, point-to-point and backplane serial link aggregation. The combination of transceiver channels and abundant logic resources makes EP4CGX75DF27I7N a strong fit when designs need multi-gigabit serial I/O without moving to a more expensive, larger-density FPGA. When designing with EP4CGX75DF27I7N, pay close attention to bank I/O voltage assignment: each of the eight I/O banks requires its own VCCIO rail, and mixing SSTL and LVCMOS in the same bank is not allowed. Plan decoupling with at least 4-6 low-ESL ceramic capacitors per supply rail near the BGA balls, and follow Intel's recommended PCB layer stack-up for the 27 mm x 27 mm FBGA-672 footprint to maintain signal-integrity on the transceiver channels. This page consolidates distributor pricing, FBGA-672 pin-compatible alternatives from the Site MPN list, and practical Quartus Prime design guidance that is not assembled in any single location in the Intel Cyclone IV Device Handbook.
EP4CGX75DF27I8N - Cyclone IV GX FPGA, 73,920 LEs, 672-FBGA | Intel
The Intel (formerly Altera) EP4CGX75DF27I8N is a Cyclone IV GX field-programmable gate array (FPGA) delivering 73,920 logic elements, 4,257,792 bits of embedded memory, and 310 user I/O pins in a 672-ball fine-pitch BGA package. Manufactured on a 60 nm low-power process and powered from a 1.2 V core supply, it targets cost-sensitive, low-power, high-volume applications requiring integrated transceivers. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and dedicated I/O, allowing designers to implement arbitrary digital logic after PCB fabrication. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Cyclone IV GX family specifically adds high-speed serial transceivers, making it suitable for protocols such as PCI Express Gen1, Gigabit Ethernet, and serial RapidIO. Key features include 3.125 Gbps transceivers, 8 transceiver channels, dedicated 18x18 multipliers for DSP, and a hard memory controller. The device supports a JTAG interface for boundary-scan and configuration via Altera/Intel Quartus Prime design software. Industrial temperature grade (-40C to +100C junction) and high I/O count support applications ranging from industrial motor control to wireless baseband processing. The Cyclone IV GX architecture combines a logic fabric with embedded transceivers, providing up to 5,136 Kbits of RAM distributed as M9K blocks and 414 Kbits as M144K blocks. Hard IP blocks include the memory controller and PCIe interface, reducing soft logic utilization. The 672-FBGA package supports high I/O density for complex system designs. Typical applications include industrial motor control, video processing, software-defined radio, wireline and wireless communication infrastructure, automotive driver assistance, and test and measurement equipment. The integrated transceivers and PCIe support make it ideal for protocol bridging and low-cost serial connectivity. Designers should consult the Quartus Prime toolchain for configuration bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design considerations not found in the manufacturer datasheet alone.
EP4S100G2F40I3G - Stratix IV GT FPGA, 1517-FBGA | Intel
The Intel EP4S100G2F40I3G is a Stratix IV GT Field Programmable Gate Array (FPGA) delivering 228,000 logic elements and 17,544,192 bits of embedded RAM in a 1517-ball FineLine BGA package (40x40 mm). It operates from a 0.86 V to 1.15 V core supply and supports junction temperatures from -40 °C to 100 °C, targeting high-throughput serial-interface and signal-processing designs. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, and on-chip memory into a single semiconductor die. FPGAs sit at the top of the digital-logic hierarchy: ASIC alternative -> programmable logic -> FPGA. The Stratix IV family specifically targets high-speed serial transceivers and digital-signal-processing applications where deterministic throughput and parallel DSP resources outperform general-purpose processors or DSP chips. Key features of the EP4S100G2F40I3G include 91,200 logic array blocks (LABs/CLBs), 228,000 logic elements, an embedded multiplier and DSP block fabric, high-speed transceiver support up to multi-gigabit rates, and dedicated memory interfaces such as DDR3/QDRII+. The 17.5 Mbit embedded RAM provides extensive on-chip buffering, eliminating many external SRAM devices in data-path designs. The device is built on a 40 nm process and is qualified to industrial-grade (-40 °C to 100 °C Tj) levels. Its high transceiver count and parallel DSP slice count position it as a premium-class Stratix IV variant for wired telecommunications, test and measurement instrumentation, and high-performance signal-processing cards. Typical applications include high-speed serial backplanes, multi-gigabit transceiver aggregation, ASIC prototyping, and digital signal processing in defense and medical imaging systems. The 1517-FCBGA package provides the pin escape density required for transceiver-rich designs. When designing with this device, allocate PCB layers for transceiver-controlled-impedance routing and ensure the power-distribution network meets the Stratix IV PDN guidelines; designers should reference Intel's Stratix IV GT FPGA Family Data Sheet and the related AN 500-series application notes for transceiver channel performance and board layout. This page synthesizes distributor pricing, drop-in package-equivalent Stratix IV GT and Stratix IV GX/E parts, and practical design guidance not collected in any single manufacturer document.
EP4S40G2F40I2NAA - Stratix IV GT FPGA 40nm 654 I/O 1517-FCBGA | Intel
The Intel EP4S40G2F40I2NAA is a Stratix IV GT Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 228,000 logic elements, 17,544,192 bits of embedded memory, and 654 user I/O pins in a 1517-ball FCBGA package. It belongs to the Stratix IV GT family, which is engineered for high-speed serial transceivers targeting multi-gigabit applications such as 40G/100G optical networking, high-end test equipment, and high-performance computing bridges. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, embedded memory (BRAM), and high-speed transceiver physical media attachment (PMA) layers. In the broader system hierarchy, FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs: they offer near-ASIC performance and parallelism with the flexibility of in-field re-programmability through SRAM-based configuration memory. The Stratix IV family specifically targets applications that demand the highest transceiver data rates and richest logic density in the Altera/Intel FPGA portfolio of that generation. Key features of the EP4S40G2F40I2NAA include 228,000 logic elements, 17,544,192 embedded memory bits, 654 maximum user I/O pins, integrated 11.3 Gbps transceivers (GT channels), and DSP blocks for high-throughput fixed- and floating-point arithmetic. The 'I2' speed grade balances maximum frequency and timing margin, while the 'N' suffix denotes lead-free / RoHS-compliant packaging. The FCBGA substrate supports high signal integrity for multi-gigabit links and provides the controlled-impedance escape needed for transceiver channels up to 11.3 Gbps. Architecturally, the device combines a rich fabric of adaptive logic modules (ALMs), MLAB blocks that double as distributed logic or small RAM, M20K dedicated memory blocks, variable-precision DSP blocks, and hard PCI Express and memory controller IP. The hard transceiver blocks (GX/GT) include on-die serial/deserializer (SERDES), clock data recovery (CDR), and physical coding sublayer (PCS) support for protocols such as CPRI, OBSAI, 10G/40G Ethernet, Serial RapidIO, and OTU-2, dramatically reducing the logic fabric overhead required to implement these protocols in soft logic. Typical applications include 40G/100G optical transport line cards, high-end test and measurement instrumentation such as oscilloscopes and protocol analyzers, high-performance computing fabric bridges, wireless baseband processing, and military/aerospace signal processing. The combination of 11.3 Gbps transceivers and 654 user I/O is well-matched to systems that aggregate multiple 10G lanes into a 40G/100G uplink while exposing wide parallel LVDS or DDR3 memory interfaces for data buffering. When designing with the EP4S40G2F40I2NAA, pay particular attention to transceiver reference clock jitter and power-rail decoupling for the GT analog supplies. Intel recommends a multi-layer PCB stackup with a continuous ground reference under the transceiver channels and matched-length routing on the transmit-receive pairs. Quartus II / Quartus Prime is the official design toolchain for this family and supports floorplanning, timing closure, and power analysis for high-density designs. This page synthesizes distributor stock data from DigiKey, pinout and packaging details, drop-in alternatives within the Stratix IV GT family, and practical PCB layout notes not found in the manufacturer datasheet summary. Pricing and lead-time references are stated 'as of 2026-09-10'.
EP4S40G2F40I2NAB - Stratix IV GT FPGA, 228K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP4S40G2F40I2NAB is a high-density Stratix IV GT field-programmable gate array (FPGA) from the 40nm transceiver-equipped GT family, integrating 228,000 logic elements, 17,544,192 embedded memory bits, and 654 user I/O pins in a 1517-ball flip-chip BGA (FCBGA, F40 package code) with 0.95V core operation. It is specified over the industrial temperature range and supports up to 48 transceivers depending on configuration, making it a drop-in member of the Stratix IV GT transceiver family. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits through software configuration rather than mask-programmed silicon. FPGAs sit in the broader semiconductor hierarchy alongside ASICs and CPLDs, occupying a unique niche for low-volume, high-performance, or rapidly evolving designs where custom silicon is uneconomical. Stratix IV GT FPGAs specifically target high-speed serial I/O applications such as 40G/100G optical transport, broadband test equipment, and high-end ASIC prototyping, integrating multi-gigabit transceivers directly on-die to simplify PCB layout. Key features of the EP4S40G2F40I2NAB include 48 multi-gigabit transceivers supporting data rates from 600 Mbps to 11.3 Gbps, dedicated hard IP for PCIe Gen2 and Gen1, embedded memory blocks of M9K and M144K types totaling 17.5 Mbits, and 8 PLLs per device. The 40 nm process technology balances static and dynamic power, while hard intellectual-property (IP) blocks offload common functions like PCIe, DDR3 memory controllers, and 10G Ethernet MACs for higher system efficiency. The F40 1517-ball package offers high pin density for transceiver-rich designs. Architecturally, the device combines a fabric of adaptive logic modules (ALMs), embedded RAM, DSP blocks, and dedicated transceiver and I/O tiles. Transceivers use a hardened PCS and PMA architecture supporting protocols such as CPRI, OBSAI, Serial RapidIO, 10G Ethernet, and OTU2, with adaptive equalization and pre-emphasis for backplane and direct-attach copper reach. The 0.95 V core supply is generated by an external regulator, with auxiliary rails for transceivers and I/O banks. Typical applications include 40G/100G optical line-card packet processing, high-speed serial backplane bridging, ASIC and ASSP prototyping, and telecom base-station CPRI links. Engineers select this part when they need integrated multi-gigabit transceivers alongside a high logic density for data-path and control-plane processing. When designing with the EP4S40G2F40I2NAB, pay close attention to transceiver reference-clock jitter, decoupling strategy for the 0.95 V core rail, and the IBIS-AMI models required for channel simulations. Quartus Prime (legacy: Quartus II) provides synthesis, place-and-route, and transceiver toolkits. PCB layout should use the manufacturer's pinout guidelines and reference the Stratix IV GT handbook for signal-integrity recommendations. This page synthesizes distributor pricing, Stratix IV GT family drop-in alternatives, and practical design considerations not found in the standalone manufacturer datasheet, giving engineers a single source for sourcing, comparison, and architecture decisions.
EP4SE230F29I4N - Stratix IV E 228K LEs FPGA | Intel | FBGA-780
The Intel EP4SE230F29I4N is a high-density Stratix IV E Field Programmable Gate Array (FPGA) with 228,000 logic elements, 17,544,192 bits of embedded memory, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FC-FBGA) package measuring 29 x 29 mm with 1.0 mm ball pitch. It is built on TSMC's 40 nm process and operates from a 0.9 V core supply with 1.0/1.2/1.5/2.5/3.0 V support for I/O banks, supporting transceiver-rich designs through up to 530 MHz logic performance and 717 MHz DSP throughput. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory (block RAM, M9K/M144K), digital signal processing (DSP) blocks, and high-speed transceivers on a single die. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism for applications where general-purpose CPUs are too slow or ASIC non-recurring engineering costs are uneconomical. The Stratix IV E family is part of Intel's (formerly Altera's) high-performance, transceiver-rich tier. Key features include 9120 Configurable Logic Blocks (CLBs/LABs), 488 I/Os, transceivers running up to 8.5 Gbps (per Stratix IV family datasheet), 1.228 Mbits of embedded memory per block, dedicated DSP blocks for high-speed multiplication, and support for DDR/DDR2/DDR3/QDRII/RLDRAM external memory interfaces. The F29 package variant includes a transceiver-rich pinout suitable for high-speed serial connectivity. Industrial temperature grade (-40C to +100C) is indicated by the I4 speed/temperature code. The Stratix IV E architecture uses Adaptive Logic Modules (ALMs) rather than older 4-LUT structures, partial reconfiguration via the Configuration via Protocol (CvP) feature, and hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet MACs. The 40 nm process and 0.9 V core deliver a balance of performance-per-watt versus lower-cost 60/28 nm successors. Designers evaluating migration should compare Stratix V, Arria 10, or Cyclone V parts using the Quartus II device migration guide. Typical applications include high-speed digital signal processing in defense radar, ASIC prototyping and emulation, high-frequency trading acceleration, 40G/100G telecommunications line cards, medical imaging (ultrasound beamforming), and test & measurement instrumentation. Its transceiver bandwidth also suits broadcast video processing and high-end industrial imaging systems. When designing with this device, plan for multi-rail power sequencing (0.9 V core, 1.0-2.5 V I/O banks, transceiver PLLs) using the Stratix IV PowerPlay Early Power Estimator. Layout requires controlled-impedance routing for 8.5 Gbps transceivers and a thermal solution sized for worst-case junction temperature. Note that the EP4SE230F29I4N is an older generation part - confirm lifecycle status and lead time before committing to new designs. This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV family, and practical design notes that complement - rather than duplicate - the Stratix IV Device Handbook.
EP4SE230F35I4NAD - 230K Logic Elements Stratix IV E FPGA | Intel
The Intel EP4SE230F35I4NAD is a high-density Stratix IV E field-programmable gate array (FPGA) delivering 228,000 logic elements, 17,544,192 embedded memory bits, and 1,288 user I/O pins in a 1152-ball flip-chip fine-pitch BGA package, manufactured on TSMC's 40 nm process node. The device operates from a 0.9 V core supply and is built around the Stratix IV E architecture that combines logic fabric with dedicated DSP blocks, M9K/M144K embedded memory blocks, and up to 24 transceivers depending on the package variant, targeting high-performance digital signal processing, communications backplane, and ASIC-prototyping applications. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated hardware multipliers, block RAM, and high-speed serial transceivers. FPGAs sit in the wider hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-chip (SoC) FPGAs, and they parallelize critical datapath operations far beyond what a general-purpose microcontroller or DSP processor can achieve, while also integrating hardware peripherals such as PCIe hard IP, memory controllers, and serializer/deserializer (SerDes) channels. Key features of the EP4SE230F35I4NAD include 8-input adaptive logic modules (ALMs), dedicated 18x18 multipliers, 9-Kbit and 144-Kbit embedded memory blocks, 8.5 Gbps transceivers (per Stratix IV GT family), and DSP blocks operating at up to 600 MHz. The FC-FBGA-1152 package provides a robust flip-chip interconnect for high signal integrity, while a -40C to +100C industrial temperature grade (the "I" suffix) enables deployment in harsh environments and extended-life industrial systems. In design, the Stratix IV E family uses a partial reconfiguration controller and Quartus II software for synthesis, place-and-route, and timing closure. The 40 nm process and dedicated signal-conditioning circuitry deliver low dynamic power via power-aware compiler features and on-chip voltage scaling, which are critical for ASIC-prototyping and high-density DSP workloads where the device may run near full utilization. The device also includes on-die termination (OCT) for high-speed memory interfaces such as DDR3 and QDRII+. Typical applications for this part include high-end telecommunications backplane line cards, ASIC prototyping and emulation, military/aerospace signal processing, high-frequency trading accelerators, and broadcast video processing. According to the manufacturer datasheet, the Stratix IV E family is positioned for designers who need the highest logic density combined with transceivers and DSP performance for bandwidth-constrained but computationally intense workloads. When designing with this FPGA, allocate at least 4 PCB layers for power and ground planes, use controlled-impedance routing for all transceiver lanes, and follow the manufacturer pin connection guidelines for unused I/O, JTAG, and configuration pins. Decoupling the 0.9 V core rail with low-ESR ceramic capacitors directly under the package is essential for power integrity under high switching currents. This page combines distributor pricing, drop-in compatible alternatives, and design notes that go beyond the manufacturer datasheet, providing a single information gain resource for FPGA selection.
EP4SE530H35C4N - Stratix IV E FPGA 531K LE 1152-BGA | Intel
The Intel EP4SE530H35C4N is a high-density, high-performance FPGA from the Stratix IV E family, delivering 531,200 logic elements in a 1152-ball flip-chip BGA package. Built on a 40 nm CMOS process with a 0.9 V core voltage, the device integrates 212,480 CLBs (or 21,248 LABs) at a maximum core frequency of 717 MHz, targeting data-path intensive and DSP-heavy designs. A field-programmable gate array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers into a single semiconductor. In the system hierarchy, an FPGA sits above general-purpose microcontrollers and below ASICs, offering hardware-level parallelism with software-like design flexibility. The Stratix IV E family specifically targets applications requiring very high logic density, high memory bandwidth, and embedded DSP throughput. Key features include 28,033,024 bits of embedded memory, 1,024 DSP blocks, and 744 user I/Os. The 1152-ball flip-chip BGA package exposes the device's full transceiver and I/O capability while providing thermal dissipation adequate for high-utilization designs. The part is speed grade C4, balancing timing closure headroom against performance, and operates within the commercial 0 °C to 85 °C junction temperature range. Architecturally, Stratix IV E uses an adaptive logic module (ALM) based fabric with 8-input fracturable look-up tables, paired with dedicated 18x18 multipliers for DSP, and tri-matrix block RAM that can be partitioned into independent memories. The fabric supports partial reconfiguration, which allows the system to swap logic regions on-the-fly for fault tolerance, power management, or multi-standard protocol support. Typical applications include high-throughput digital signal processing for wireless baseband, real-time video processing and broadcast equipment, military and aerospace signal intelligence, high-speed networking line cards, and ASIC prototyping. Engineers select the EP4SE530H35C4N when designs outgrow the capacity of Cyclone or mid-density Stratix families and require hardened transceivers, large block RAM, and substantial DSP throughput. Design consideration: with 744 user I/Os and a 1152-ball BGA, PCB layout requires careful signal-integrity planning, a multi-layer stack-up with dedicated power and ground planes, and thermal analysis under maximum junction temperature. The Quartus II design suite (or its successor) is required for synthesis, place-and-route, and timing closure.
EP4SE820F43C3G - Stratix IV E 813K LEs FPGA | Intel (Altera)
The Intel (formerly Altera) EP4SE820F43C3G is a high-density Stratix IV E FPGA delivering 813,050 logic elements, 325,220 adaptive logic modules (ALMs), and 32.51 Mbit of embedded memory in a 1760-pin flip-chip BGA (FBGA, package code F43) package. It belongs to the Stratix IV E family, the highest-density and most feature-rich member of the Stratix IV 40 nm generation, designed for high-performance digital logic, high-speed serial I/O, and large memory bandwidth. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, on-chip memory, and high-speed transceiver hard IP, all tied together by a hierarchy of routing resources. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> semiconductors, and are typically deployed where ASIC NRE costs are prohibitive or where post-deployment hardware updates are required. The Stratix IV E family targets applications such as wireline communications, ASIC prototyping, high-performance DSP, and military/aerospace systems. Key features include 1120 user I/O pins, up to 8.5 Gbps transceivers, hard memory controllers, PCIe hard IP, and DSP blocks capable of 600+ MHz operation. The device integrates dedicated hardware for memory interfaces including DDR3 support, and offers robust SEU mitigation via the soft error detection and correction circuitry inherent to the Stratix IV architecture. Operating at a core voltage of 0.9 V and supporting industrial junction temperatures, it fits both commercial and industrial-grade deployments. The architecture combines a fine-grained ALM structure with high-efficiency routing, an embedded memory hierarchy with 600 MHz true-dual-port SRAM, and dedicated variable-precision DSP blocks. Hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet reduces soft-logic overhead. The 1760-BBGA package is a flip-chip land-grid-array that maximizes I/O density while delivering excellent thermal performance through a top-side heat-spreader attachment surface. Typical applications include high-end ASIC prototyping and emulation platforms, 40G/100G wireline communications line cards, radar and electronic warfare DSP pipelines, high-frequency trading accelerators, and high-density memory-interface bridging. The wide logic capacity and abundant I/O make it well-suited for systems that previously required multiple mid-range FPGAs. When designing with this device, plan the PCB thermal interface carefully - the FCBGA requires a properly mounted heat spreader or heatsink to dissipate 10-25 W typical workloads. Ensure the Quartus II power analyzer is run early in the design cycle; pin assignment, block placement, and toggle rate all significantly affect junction temperature. This page synthesizes real-time distributor inventory, exact parametric data, drop-in Stratix IV E alternatives, and practical PCB/thermal design notes that complement, rather than duplicate, the official Altera/Intel Stratix IV Handbook.
EP4SGX110DF29C2XG - Stratix IV GX FPGA, 105.6K LEs, 780-FCBGA | Intel
The Intel (formerly Altera) EP4SGX110DF29C2XG is a high-density Stratix IV GX FPGA featuring 105,600 logic elements and 9,793,536 bits of embedded memory (3,564 Kbits of M9K plus 1,318 Kbits of MLAB), fabricated on a 40 nm process. It integrates 372 user I/O pins in a 780-ball FCBGA package and is engineered for high-performance signal processing, serial connectivity, and embedded processing applications where deterministic latency and high transceiver bandwidth are required. An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), dedicated DSP slices, on-chip memory blocks, and routing interconnect. Stratix IV GX extends this baseline by adding multi-gigabit transceivers, hard PCIe IP cores, and external memory controller support, placing it in the high-end programmable logic family that sits between general-purpose FPGAs and ASICs in the programmable device hierarchy: programmable logic device -> FPGA -> high-end FPGA with transceivers -> SoC FPGA. Key device features include an FPGA fabric with embedded DSP blocks (variable-precision multipliers and accumulators), dedicated memory blocks (M9K and MLAB), and a hard memory controller that interfaces to DDR/DDR2/DDR3 SDRAM, QDR II/II+ SRAM, and RLDRAM II. The GX suffix denotes the integrated multi-gigabit transceiver subsystem supporting standards such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and 1G/10G Ethernet through hard PCS channels. Typical applications include high-throughput digital signal processing (radar, beamforming, software-defined radio), high-speed serial protocol bridging (PCIe, Serial RapidIO, 10G Ethernet), ASIC prototyping, and high-end test and measurement instrumentation. The 780-FCBGA package provides the signal and power integrity needed for parallel LVDS and multi-gigabit serial interfaces while remaining compatible with high-density PCB stack-ups. When designing with this device, plan FPGA floorplanning and pin assignment with Quartus II early to close timing on transceiver channels, and verify signal integrity on the multi-gigabit lanes through IBIS-AMI simulation. Power estimation must include the GX transceiver analog supply rails separately from the core FPGA rails, since the transceivers dominate total device power at full line rate.
EP4SGX110DF29C3G - Stratix IV GX FPGA, 105K LE, 780-FCBGA | Intel
The Intel/Altera EP4SGX110DF29C3G is a Stratix IV GX family Field-Programmable Gate Array (FPGA) featuring 105,600 logic elements, 9,793,536 bits of embedded memory, and 372 user I/Os in a 29x29 mm 780-ball Flip-Chip BGA package. Built on a 40 nm process, this high-density transceiver-capable device integrates up to 8.5 Gbps transceivers and delivers enhanced DSP performance for high-bandwidth signal processing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and block RAM. Within the broader taxonomy, the Stratix IV GX sits at the high-performance end: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. FPGAs allow hardware designers to implement custom digital functions after PCB assembly, enabling parallel processing, real-time DSP, and hardware-accelerated interfaces that microcontrollers and DSPs cannot match in throughput. Key features include 4,224 adaptive logic modules (ALMs), 8.5 Gbps embedded transceivers for protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO, dedicated hard IP for PCIe Gen2 x4/x8 endpoints, and configurable on-chip memory of approximately 9.5 Mbits distributed plus dedicated M9K and M144K block RAM. The device also provides 266 dedicated DSP blocks capable of 18x18 multiplication at high clock rates, and supports I/O standards including LVDS, LVTTL, HSTL, and SSTL with selectable drive strength. The Stratix IV GX architecture combines a fabric of ALMs with hard PCIe Gen2 IP and 8.5 Gbps transceivers, eliminating soft-IP overhead and freeing logic for application code. Compared with discrete transceiver + FPGA designs, the integrated transceivers reduce power and board area, while the 40 nm low-power process minimizes dynamic power at high toggle rates. Typical applications include high-speed serial backplane aggregation, software-defined radio (SDR) baseband processing, telecom framer/mapper ASIC prototyping, high-performance computing (HPC) co-processors, and broadcast video processing. The 780-FCBGA package supports up to 12.5 Gbps operation per channel when paired with appropriate PCB stack-up and signal conditioning. When designing with this device, ensure adequate power-supply decoupling (multiple low-ESR ceramic capacitors near each transceiver bank) and matched-impedance routing for high-speed serial links. Verify transceiver reference clock jitter per the device handbook, and use the Quartus Prime toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternative MPNs in the same FCBGA-780 footprint, and practical design notes that go beyond the manufacturer datasheet summary. It also flags the device lifecycle and lead-time reality observed across authorized distributors in 2026.
EP4SGX110DF29C4G - 105,600 LEs Stratix IV GX FPGA | Intel
The Intel EP4SGX110DF29C4G is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 105,600 logic elements, 372 user I/Os, and 9,793,536 bits of embedded memory in a 780-ball FCBGA package. Built on a 40 nm process with a 0.87 V to 0.93 V core voltage, the device pairs programmable logic with up to 8.5 Gbps integrated transceivers, hard memory controllers, and embedded multipliers, enabling high-throughput DSP and serial-protocol pipelines. A field-programmable gate array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, BRAM, and DSP slices. FPGAs belong to the broader programmable logic device (PLD) family and sit within the digital semiconductor hierarchy: programmable logic -> ASIC-class configurable logic -> semiconductor. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit, allowing rapid design iteration and field upgrades without re-spinning silicon. Key features of the EP4SGX110DF29C4G include 4,224 adaptive logic modules (ALMs) totalling 105,600 equivalent logic elements (LEs), 372 user I/Os arranged across multiple I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards, and a high-performance fabric that sustains hundreds of MHz on critical paths. Hard PCI Express Gen1/Gen2 hard IP blocks and external memory interfaces up to DDR3 make the part attractive for bridging, protocol conversion, and accelerator workloads. The architecture combines an adaptive logic module fabric with 8-channel transceiver blocks for multi-gigabit serial I/O, hard memory controllers, and a global clock network. The 40 nm low-power process node balances static and dynamic power while preserving high operating frequency. Typical applications include high-speed serial interface bridging (PCIe, SRIO, XAUI, CPRI), wireless baseband and backhaul DSP, radar and signal-intelligence front-end processing, broadcast video routing, and military/aerospace signal processing. The integrated transceivers eliminate external PHY components and shorten design cycles. When designing with this device, plan power sequencing around the 0.87-0.93 V core and the auxiliary PLL/ transceiver supplies; use Altera/Intel Quartus II software for synthesis, place-and-route, and timing closure. The 780-ball FCBGA package requires a multi-layer PCB with controlled-impedance routing and adequate thermal relief for sustained workloads. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP4SGX110DF29C4G, including same-package speed-grade and logic-density variants not consolidated in any single manufacturer table.