FPGA & CPLD
Products (6352)
EPF10K200SBC600-2 - FLEX-10KS FPGA, 200K Gates, 470 I/O | Altera
The Altera (Intel) EPF10K200SBC600-2 is a member of the FLEX 10KS family of SRAM-based Field Programmable Gate Arrays (FPGAs) housed in a 600-ball BGA package (45x45 mm, 1.27 mm pitch). It integrates 9,984 logic elements across 1,248 Logic Array Blocks (LABs), 470 user I/O pins, and 200,000 typical gates, providing system-on-a-programmable-chip (SOPC) integration in a single device. The device operates from a 2.375 V to 2.625 V core supply and supports 0 to 70 C commercial temperature range. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer programs after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), but offer higher logic density, embedded memory, and dedicated multipliers. Within power management and digital signal processing hierarchies, FPGAs function as glue logic, custom state machines, protocol bridges, or parallel accelerators. The FLEX 10KS family specifically combines look-up-table based logic with embedded array blocks (EABs) for on-chip RAM and ROM, enabling true SOPC integration. Key differentiating features of the EPF10K200SBC600-2 include 0.4 ns pin-to-pin propagation delay, embedded array blocks for distributed memory implementation, four phase-locked loops for clock management, multiVolt I/O supporting mixed-voltage interfacing, and in-system programmability via the IEEE 1149.1 JTAG interface. The 600-ball BGA package provides 470 usable user I/O pins, leaving the remainder for power, ground, and configuration pins. The 1.27 mm pitch BGA and 0.22 micrometer process technology enables industrial-grade reliability while maintaining low power dissipation. The die is identical to other FLEX 10KS 200K-gate variants such as the BGA-600 speed grade -2, allowing PCB layout reuse across speed grades. Typical applications include telecommunications switching, industrial control systems, military and aerospace prototypes, ASIC prototyping, high-speed data acquisition, and embedded DSP pre-processing. The 470 I/O count makes this part suitable for parallel bus interfacing and high-pin-count glue-logic aggregation. When designing with this device, allocate sufficient PCB layers for BGA fanout (the 1.27 mm pitch requires at minimum a 4-layer stackup with buried vias for clean routing). Power decoupling must include at least 0.1 microF capacitors within 5 mm of each power pin and bulk capacitance per VCCINT plane. This page synthesizes distributor pricing, drop-in replacement alternatives, and practical BGA-layout design notes not found in the original Altera datasheet.
EPF10K200SBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Altera
The Altera EPF10K200SBC600-3 is a 200,000-gate FLEX 10KE family Field Programmable Gate Array (FPGA) with 9,984 logic cells, 1,248 Logic Array Blocks (LABs), 470 user I/Os, and 98,304 bits of embedded memory, housed in a 600-ball BGA package. It is fabricated on a 0.22 µm CMOS process, supports a core voltage of 2.5 V, and operates at a maximum internal frequency of 166.67 MHz. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that allows designers to implement custom digital logic by programming an array of configurable logic blocks (CLBs), interconnect, and I/O resources. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits (IC). The FLEX 10KE family extends the original FLEX 10K architecture with enhanced memory and improved interconnect, making it well suited for glue-logic, bus-interface, and high-volume ASIC-replacement designs in the early-2000s era. Key features include 9,984 logic elements, 12 Embedded Array Blocks (EABs) each containing 4 Kbits of RAM, 4 PLL-style clock pins, in-system programmability via SRAM configuration, and JTAG boundary-scan support. The device operates across a commercial 0 °C to 70 °C ambient temperature range and is qualified per Altera's commercial grading. The FLEX 10KE architecture pairs a fine-grained logic fabric with coarse-grained EAB memory blocks, allowing efficient implementation of arithmetic pipelines, FIFOs, and state machines on a single die. The 600-BGA package exposes 470 user I/Os - the highest I/O count in the FLEX 10KE lineup - making it suitable for wide-bus designs such as DDR controllers, telecommunications backplanes, and parallel DSP farms. Typical applications include telecom line-card glue logic, parallel DSP prototyping, industrial control backplanes, and legacy ASIC-replacement systems. The 600-ball BGA also supports high-speed parallel buses (16/32-bit data plus address) with abundant I/O headroom. When designing with this part, note that the FLEX 10KE SRAM configuration must be loaded from an external PROM (EPC2/EPC16) on every power-up; an external configuration controller is required. The 600-BGA also requires a multi-layer PCB with controlled-impedance routing for reliable signal integrity at 166 MHz. This page synthesizes distributor stock, drop-in same-package variants, and practical FPGA-migration design notes not found on the standalone Altera datasheet.
EPF10K200SBI356-2 - 200K Gate FLEX 10KA FPGA 356-BGA | Altera
The Altera EPF10K200SBI356-2 is a high-density FLEX 10KA family FPGA delivering 200,000 system gates and 9,984 logic elements (LEs) in a 356-ball BGA package. It operates at -2 speed grade and is built on a 0.22 µm CMOS SRAM process with 2.5 V core supply, providing up to 274 user I/O pins for high-bandwidth digital logic designs. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) subclass that combines the gate density of gate arrays with the configurability of programmable logic. FPGAs occupy the same functional role in a digital design hierarchy as ASICs, but can be reconfigured in the field via SRAM or flash bitstream. The FLEX 10KA family specifically targets high-density glue-logic, datapath, and bus-interface applications. Within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The FLEX 10KA architecture pioneered embedded array block (EAB) integration, allowing on-chip memory and megafunctions without external ROM. Key features include 24 embedded array blocks (EABs) providing up to 98,304 bits of on-chip memory, a Look-Up Table (LUT)-based logic element, six dedicated low-skew global clock/clear/preset input pins, and JTAG-based in-system programmability (ISP) via the ByteBlaster or MasterBlaster interface. The device supports multi-volt I/O (2.5 V/3.3 V/5.0 V) on selected pins and includes in-circuit reconfigurability for live bitstream updates. The architecture splits the die into Logic Array Blocks (LABs) of 10 LEs each, totaling 1,248 LABs. The arithmetic mode allows two adjacent three-input LUTs to operate as a 3-bit fast adder with internal carry chain. Dedicated row and column interconnect minimizes routing delay and is optimized for datapath-heavy designs like FIR filters and protocol bridges. Typical applications include telecommunications line cards, industrial control and factory automation glue logic, PCI bus bridges, video processing front-ends, and embedded DSP prototyping. The combination of high density (200K gates) and BGA packaging makes it well-suited to space-constrained telecom and networking hardware. Designers should plan board layout to provide solid ground and 2.5 V core plane distribution; use multiple decoupling capacitors near each power pin. The -2 speed grade indicates medium-grade timing closure; verify worst-case Fmax in Quartus before tapeout. Migration to FLEX 10KE or Cyclone is recommended for new designs, as the FLEX 10K family is in long-term support but limited new inventory.
EPF10K200SFC484-1 - FLEX 10KS FPGA 200K Gates 9984 Cells | Intel
The Intel (formerly Altera) EPF10K200SFC484-1 is a FLEX 10KS family Field-Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic cells, packaged in a 484-ball FineLine BGA (FBGA-484) at 23x23 mm. The part operates on a 2.5 V nominal core supply (2.375 V to 2.625 V range), supports 369 user I/Os, and is fabricated on a 0.22 µm SRAM process with embedded array blocks (EABs) used as on-chip RAM totaling 98,304 RAM bits. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the density of gate arrays with the design flexibility of user-customized interconnects. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> LUT-based architecture -> the FLEX 10K family adds embedded array blocks (EABs) that double as RAM or ROM, enabling on-chip memory and DSP-like functions without consuming general logic. This category is part of the larger semiconductor ecosystem of digital logic ICs. Key features include a -1 speed grade (the slowest of three: -1, -2, -3, where -3 is fastest), 250 MHz internal operation, four delay-locked loops (DLLs) for clock management, and multi-standard I/O support (LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP). Each EAB provides 2,048 bits of RAM, configurable as 256x8, 512x4, 1024x2, or 2048x1, giving designers distributed memory without external SRAM. Architecturally, the FLEX 10K device combines a fine-grained logic element (LE) fabric with the coarser EAB blocks, all connected by continuous FastTrack interconnect. This hybrid fabric was Altera's flagship mid-1990s architecture and was widely adopted in telecommunications, industrial control, and ASIC prototyping applications. Typical applications include telecommunications switching fabrics, ASIC prototyping, DSP pre/post-processing, bus-bridge implementations (PCI, VME), and industrial control logic. The 369 user I/Os at the FBGA-484 package make it suitable for I/O-intensive glue logic and interface bridging. Designers should note this part is in Obsolete / End-of-Life status per the manufacturer, with a 40% counterfeit risk in the open market. Sourcing should prioritize franchised distributors and request factory date code and traceability documentation. Quoted lead times can exceed 12 weeks for new orders. This page synthesizes distributor pricing, drop-in alternatives, lifecycle warnings, and design notes not consolidated in the original FLEX 10K datasheet family.
EPF10K200SFC484-1N - FLEX-10KE FPGA 200K Gates 484-FBGA | Intel
The Intel (formerly Altera) EPF10K200SFC484-1N is a FLEX-10KE family Field-Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic elements (LEs), housed in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. The -1N speed grade operates at a core voltage of 2.5 V on a 0.22 µm CMOS SRAM process, with a maximum internal frequency of 250 MHz and pin-to-pin logic delays as low as 0.3 ns. An FPGA is a programmable logic device that lets engineers implement arbitrary digital logic by configuring an array of Look-Up Tables (LUTs), flip-flops, embedded memory blocks, and programmable interconnect. Within the broader semiconductor hierarchy, FPGAs sit between fixed-function Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers, combining hardware-level parallelism with software-driven design iteration. The FLEX-10KE series was Intel/Altera's mid-1990s flagship high-density family and became the architectural foundation for later Stratix and Cyclone device lines. Key features of the EPF10K200SFC484-1N include 1,248 Logic Array Blocks (LABs), 369 user I/O pins, 98,304 bits of embedded SRAM organized as Embedded Array Blocks (EABs), built-in Phase-Locked Loops (PLLs) for clock management, and in-system programmability via IEEE 1149.1 JTAG. MultiVolt I/O support lets outputs drive 1.8 V, 2.5 V, 3.3 V, and 5 V interfaces without external level shifters, while the SRAM-based configuration cell allows unlimited reconfiguration cycles and instant prototyping. Architecture-wise, the FLEX-10KE fabric combines coarse-grained Logic Array Blocks with fine-grained Embedded Array Blocks, enabling both wide datapath synthesis and dense memory mapping on a single die. The 0.22 µm four-layer metal process was state of the art at launch and remains sufficient for legacy telecommunications backplane glue logic, industrial control buses, and military/aerospace retrofits. Designers using the legacy MAX+PLUS II or Quartus toolchains can synthesize RTL directly into this device with full timing closure reports. Typical applications include telecom line-card glue logic, custom peripheral controllers for VME/cPCI backplanes, industrial serial-protocol bridges (PROFIBUS, DeviceNet, CAN), radar and sonar signal pre-processing, and legacy ASIC replacement for low-volume production. The 369 user I/Os make it suitable for bus-intensive designs such as PCI bridges, memory controllers, and parallel DSP front-ends. When designing with this part, note that lead-free (Pb-free) FBGA substrates require strict reflow profile control (peak 245 °C max, 60 s above 217 °C). Designers migrating to a new revision of the Quartus toolchain should regenerate programming files because the SRAM configuration bitstream format has changed across Quartus versions.
EPF10K200SFC484-1X - FLEX 10KS FPGA 9984 Cells 484-BGA | Intel
The Intel (formerly Altera) EPF10K200SFC484-1X is a high-density FLEX 10KS embedded programmable logic device (PLD) with 9984 logic elements/cells and 98,304 bits of embedded memory, packaged in a 484-ball BGA (FBGA-484, 23x23 mm, 1.0 mm pitch, fine line). It integrates system-on-a-programmable-chip (SOPC) functionality with an enhanced embedded array, 369 user I/O pins, a 0.22 µm CMOS process and a 2.5 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically programmed after manufacturing to implement arbitrary digital logic. The FLEX 10KS family is positioned within the broader PLD taxonomy as PLD -> CPLD -> FPGA -> SRAM-based FPGA -> embedded array FPGA, bridging the gap between simple glue logic and full ASIC-class integration. FPGAs are widely used for prototyping, signal processing, glue logic, and high-volume parallel datapath acceleration. Key specifications include 9984 logic elements, 1248 logic array blocks (LABs), 98,304 RAM bits, 369 user I/Os, 250 MHz internal performance and 0.4 ns propagation delay. The 484-pin FBGA package supports high I/O density on a compact 23x23 mm outline, while the embedded array enables block-level memory and datapath instantiation without wasting general-purpose logic. Typical applications include telecommunications line cards, industrial control and instrumentation, ASIC prototyping, embedded DSP pipelines, image/video preprocessing, and high-speed bus bridging. The wide I/O count and embedded memory make it suitable for designs that previously required a discrete gate array plus a separate SRAM/DRAM controller. When designing with the EPF10K200SFC484-1X, designers should plan for a 2.5 V core supply with proper decoupling near every supply ball. Because the FLEX 10K family is a mature node, design entry is supported by the legacy Altera MAX+PLUS II and Quartus II toolchains - verify the device is supported in your chosen tool version before starting the layout. This page synthesizes distributor pricing, same-brand drop-in alternatives and practical design considerations not found in the manufacturer datasheet. All alternatives listed are sourced from the Site MPN list to enable cross-linking across the XAIPART catalog.
EPF10K200SFC484-2 - FLEX 10KS FPGA 200K Gates | Altera / Intel
The Altera (Intel) EPF10K200SFC484-2 is a member of the FLEX 10KS family of Field Programmable Gate Arrays (FPGAs) delivering 200,000 system gates, 9,984 logic elements (LEs), and 98,304 bits of embedded RAM in a 484-ball FineLine BGA package. Speed grade -2 corresponds to a faster propagation delay than grade -3, suitable for performance-oriented digital designs. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines the architectural flexibility of gate arrays with the design-turnaround advantage of in-system programmability. FPGAs sit hierarchically as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The FLEX 10KS family specifically introduced embedded array blocks (EABs) for on-chip memory and DSP-like functions, bridging the gap between classic PLDs and modern SRAM-based FPGAs. Key features include 369 LABs (Logic Array Blocks), 4 EABs of 2,048 bits each for embedded memory, 4 embedded PLLs for clock management, multiVolt I/O supporting 2.5V/3.3V/5V interfacing, and JTAG-based IEEE 1149.1 boundary-scan testing. Core supply is 2.5V with separate VCCIO banks for I/O voltage flexibility. Architecturally, the FLEX 10K uses a CMOS SRAM cell with continuous, routable interconnect. Look-up tables (LUTs) drive combinational logic while EABs implement RAM, ROM, or multiplier functions. This hybrid architecture enabled designers to integrate logic and memory on a single die, foreshadowing modern system-on-chip FPGA concepts. Typical applications include telecommunications infrastructure (line cards, bridges), industrial control systems, high-performance computing accelerators, and ASIC prototyping. The 484-pin FineLine BGA also supports migration across the FLEX 10K family using SameFrame pin-out compatibility. When designing with this part, ensure proper decoupling (100 nF + 10 uF per supply pin group), JTAG chain integrity, and configuration source selection (EPC configuration device or microcontroller). Operating temperature is commercial 0C to 70C. Lead-free BGA soldering requires peak reflow profiles per JEDEC J-STD-020. This page synthesizes distributor pricing, drop-in FPGA alternatives within the FLEX 10KS family, and practical design notes not found in the original datasheet.
EPF10K200SFC484-2N - 200K Gate FLEX 10KE FPGA | Intel / Altera
The Intel (formerly Altera) EPF10K200SFC484-2N is a FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200,000 gates, 9,984 logic elements, 1,248 LABs, and 98,304 bits of embedded RAM in a 484-pin FineLine BGA (23 x 23 mm) package. It operates from a 2.5 V core supply (2.375 V to 2.625 V) and supports up to 369 user I/O pins. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells on a single die. FPGAs sit at the top of the programmable-logic hierarchy (below: PLD -> CPLD -> FPGA) and serve as integration platforms for system-on-a-programmable-chip (SOPC) designs. The FLEX 10KE family, built on a 0.22 µm CMOS process with embedded array blocks (EABs), bridges the gap between classic CPLDs and high-density SRAM-based FPGAs by offering distributed RAM, dedicated multiplier-ready DSP blocks, and 5 V-tolerant I/O. Key features include 200 MHz internal performance, 0.4 ns propagation delay, JTAG (IEEE 1149.1) boundary-scan support, in-system programmability via SRAM configuration, and 5 V-tolerant I/O with MultiVolt core. The 484-FBGA (1.0 mm pitch) FineLine BGA package uses SameFrame pin-out, allowing device migration between FLEX 10KE densities sharing the same package. Technically, the device integrates 24 Kbits of distributed RAM per LAB cluster plus dedicated EABs that can be configured as dual-port RAM, ROM, or first-in first-out (FIFO) buffers. The 2.5 V core is paired with MultiVolt I/O banks that can be set to 3.3 V, 2.5 V, or 1.8 V to interface cleanly with legacy 5 V-TTL peripherals via 5 V-tolerant inputs. Typical applications include telecommunications line cards, industrial control and factory-automation controllers, high-performance computing coprocessors, ASIC prototyping, and embedded DSP front-ends. The 369 user I/Os make it suitable for parallel bus bridging and protocol conversion designs. When designing, place at least 8 decoupling capacitors (0.1 µF plus 10 µF bulk) around the BGA, follow Intel/Altera FineLine BGA routing guidelines, and use the Quartus II (or legacy MAX+PLUS II) toolchain for synthesis and place-and-route. SameFrame pin compatibility within the package family simplifies migration between EPF10K130EFC484-x and EPF10K200SFC484-x density points. This page synthesizes distributor pricing, verified drop-in same-brand alternatives from the FLEX 10KE family, and practical design notes not found in the standalone manufacturer datasheet.
EPF10K200SFC484-2X - FLEX 10K FPGA, 200K Gates, 484-BGA | Intel
The Intel (Altera) EPF10K200SFC484-2X is a high-density FLEX 10KS Field Programmable Gate Array (FPGA) with 200,000 typical gates, 9,984 logic elements (cells), and 98,304 RAM bits, housed in a 484-ball FineLine BGA package (23 x 23 mm, 1.0 mm pitch). It operates from a 2.375 V to 2.625 V core supply and supports 369 user I/O pins across the device boundary, making it one of the largest members of the legacy FLEX 10K family. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated memory blocks that can be re-programmed to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and the FLEX 10K family pioneered embedded array block (EAB) integration of SRAM memory with logic fabric - the conceptual ancestor of modern System-on-Chip FPGAs. The EPF10K200SFC484-2X therefore occupies the role of a glue-logic and co-processing accelerator in legacy industrial, telecom, and test-and-measurement systems. Key features include 1,248 Logic Array Blocks (LABs), 9,984 logic elements, four-phase on-chip PLL (where equipped in the family), built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std 1149.1-1990, and in-system programmability via SRAM configuration cells. The -2X speed grade offers approximately 250 MHz internal operation. The 5.0-V tolerant I/O bank supports PCI and other legacy bus signaling through level translation. The device utilizes a CMOS SRAM-based configuration cell, allowing unlimited re-programmability and rapid prototyping. Embedded Array Blocks (EABs) provide dedicated dual-port SRAM that can be configured as 256 x 8, 512 x 4, 1024 x 2, or 2048 x 1 memory blocks. Continuous FastTrack interconnect provides predictable routing delays across the device. Typical applications include industrial control systems, telecommunications infrastructure, ASIC prototyping, custom DSP pipelines, and legacy PCI / ISA bus interface designs where the device serves as a programmable bus controller or protocol bridge. The 369 user I/Os and large memory complement suit it to multi-channel data acquisition front-ends. Designers should plan for external configuration memory (EPC2 or compatible serial configuration device), multi-bank I/O voltage reference decoupling, and thermal management through the BGA thermal pad. The device is now mature (NRND/EOL) and supply is increasingly restricted to franchised distributors and authorized aftermarket channels such as Rochester Electronics. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet.
EPF10K200SFC484-3 - 200K Gate FLEX-10KS FPGA 484-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K200SFC484-3 is a high-density FLEX-10KS family Field Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic cells across 1,248 Logic Array Blocks (LABs), housed in a 484-ball FineLine BGA package. It operates from a 2.375V to 2.625V core supply, supports 369 user I/Os, and is built on a 0.22 µm SRAM-lookup-table process with embedded array blocks (EABs) for on-chip memory and product-term logic. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be reprogrammed to implement arbitrary digital logic. FPGAs sit hierarchically between fixed-function ASICs and software-programmable processors: more flexible than ASICs, faster and more deterministic than microcontrollers for parallel datapath workloads. The FLEX-10KS family is Intel/Altera's classic high-volume SRAM FPGA family that pioneered the embedded array block (EAB) concept - small dual-port RAM blocks distributed throughout the fabric to eliminate external memory in glue-logic and datapath applications. Key features of the EPF10K200SFC484-3 include 1,248 LABs organized into rows and columns, 200K equivalent system gates, embedded array blocks for distributed SRAM and ROM, multi-voltage I/O support (3.3V, 5.0V PCI-compliant interfaces), four low-skew global clock networks, and JTAG-compliant IEEE 1149.1 boundary-scan test. The part is rated for the commercial temperature range and is offered in a 484-ball FineLine BGA (1.0 mm pitch, 23 mm × 23 mm body) suitable for high-density PCB designs. Architecturally, the device uses a four-input look-up table per logic element, hierarchical interconnect with FastTrack continuous routing, and embedded array blocks providing up to 40,960 bits of on-chip RAM. The EABs can be configured as single-port RAM, dual-port RAM, ROM, or product-term logic, enabling efficient implementation of FIFOs, look-up tables, and arithmetic functions. The 0.22 µm process yields a maximum internal operating frequency of approximately 166.67 MHz, suitable for mid-speed glue logic, bridge, and bus-interface applications. Typical applications include telecom line-card glue logic, industrial bus-bridging (PCI, ISA, VME), legacy ASIC prototyping, custom I/O expansion, and embedded control systems that require a deterministic hardware datapath. The FLEX-10KS family is well documented in reference designs, simplifying migration to the APEX and later Cyclone families. When designing with this FPGA, note that the device requires a separate configuration PROM (EPC2 or compatible) for SRAM-based configuration storage, or can be configured via JTAG during development. Power sequencing must follow Altera's FLEX 10K reference design, and unused I/O pins should be configured as inputs with weak pull-ups to prevent oscillation. This page synthesizes distributor pricing, FLEX-10KS family cross-references, and practical design notes not found in the standalone manufacturer datasheet.
EPF10K200SFC484-3N - 200K Gates FLEX 10KE FPGA 484-BGA | Altera
The Altera (Intel) EPF10K200SFC484-3N is a high-density member of the FLEX 10KE family of SRAM-based FPGAs, delivering 200,000 typical gates, 9,984 logic elements (LEs), and 368 user I/O pins in a 484-ball FineLine BGA package. The device uses a 0.22 µm CMOS SRAM process with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO, enabling fast on-chip memory integration. It targets cost-sensitive designs that need high logic density and I/O count in a single chip. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all controlled by user-defined SRAM configuration bits. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> high-density FPGAs, and within power management and digital design they serve as the central processing and glue-logic element. FPGAs are widely used to implement parallel processing, custom peripherals, and high-speed interfaces that would otherwise require discrete ASICs or large clusters of TTL logic. Key features of the EPF10K200SFC484-3N include 4 Embedded Array Blocks (EABs) totaling up to 24 Kbits of dedicated RAM, a system clock that can be driven from a dedicated global clock network, IEEE 1149.1 JTAG boundary-scan support, and 3.3 V PCI compliance (speed grade -3) or 5.0 V PCI compliance (speed grade -1). The 484-ball FineLine BGA package supports pin migration across the FLEX 10KE family per Altera's SameFrame pin-compatibility scheme, so design teams can scale logic density without re-laying out the PCB. The FLEX 10KE architecture uses a continuous SRAM interconnect with fast, predictable routing delays, and the device operates from a 5.0 V core supply with multi-voltage I/O supporting 2.5 V, 3.3 V, and 5.0 V interfaces. Speed grade -3 indicates the fastest commercial speed bin, suitable for high-frequency glue logic and PCI applications. Industrial and commercial temperature grades are both available across the family. Typical applications include PCI/CompactPCI bridge designs, high-speed glue logic, telecom line-card controllers, industrial automation backplanes, and legacy system upgrades where the FLEX 10KE was the original design-in device. The 484-BGA package also enables dense, high-pin-count designs in compact form factors such as ATCA blades and custom peripheral boards. When designing with the EPF10K200SFC484-3N, ensure the 5.0 V VCCINT rail has sufficient decoupling (100 µF bulk + 0.1 µF ceramic per power pin), the JTAG chain is properly terminated, and the configuration memory (typically EPC2 or EPC16) is correctly selected for the device's 0.22 µm process. The SameFrame pin-out allows easy migration to EPF10K100 or EPF10K130 in the same 484-BGA footprint, providing design flexibility. This page synthesizes distributor pricing, SameFrame drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from search to working hardware than the bare PDF alone.
EPF10K200SFC672-1 - FLEX 10KE FPGA 200K Gates 9984 Cells | Altera
The Altera (now Intel) EPF10K200SFC672-1 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200K system gates and 9984 logic cells in a 672-ball FineLine BGA (FBGA) package with 470 user I/Os, manufactured on a 0.22 µm CMOS process and operating at 250 MHz core frequency with a 2.5 V supply. It is the commercial temperature grade (0 °C to 70 °C), speed grade -1 variant of the EPF10K200S family, providing designers with a deterministic, SRAM-based programmable logic fabric that combines look-up-table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory and DSP-like functions. What is a FLEX 10KE FPGA? The FLEX 10KE family belongs to the historical hierarchy of programmable logic devices (PLDs) - specifically the family of fine-grained, SRAM-based FPGAs introduced by Altera in the mid-1990s as a second-generation FLEX architecture. In the taxonomy hierarchy, an FPGA sits under Programmable Logic > PLD > CPLD/FPGA > SRAM-based FPGA > FLEX 10KE. Each logic element (LE) contains a 4-input LUT, a programmable register, and a carry chain, while groups of LEs form logic array blocks (LABs) that interconnect through a continuous FastTrack routing fabric. The 'KE' suffix denotes enhanced embedded array blocks for distributed RAM, ROM, and FIFO functions, expanding the device beyond pure glue logic into system-on-a-programmable-chip (SOPC) integration. Key features include 9984 logic elements organized into LABs, 12 embedded array blocks (EABs) providing up to 98,304 bits of RAM, 470 user I/Os for high-pin-count board designs, multi-volt I/O support (2.5 V/3.3 V/5.0 V PCI-compliant), and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The device supports four input clock pins plus dedicated clock lock circuitry for clock-domain management. Architecturally, the EPF10K200SFC672-1 uses a continuous hierarchical interconnect (FastTrack) that spans rows and columns of LABs with predictable routing delays, simplifying static timing closure compared with segmented FPGA fabrics. The 0.22 µm SRAM process delivers low static power (typical Icc standby around 50 mA) and supports live reconfiguration, allowing the logic function to be updated in the field without powering down the board. Typical applications include telecommunications line cards, industrial control and factory automation backplanes, military and aerospace signal processing, prototyping for ASIC replacement, multi-channel DMA controllers, and bus-interface bridging (PCI, VME, ISA, I²C). The 672-ball FBGA package enables the high I/O count needed for memory-bus expansion and parallel data-path applications. When designing with the EPF10K200SFC672-1, plan for a multi-rail power design (2.5 V VCCINT plus a separate VCCIO bank supply), place decoupling capacitors within 5 mm of each power pin, and route JTAG signals with 4.7 kΩ pull-ups on TCK/TMS/TDI. Use Altera MAX+PLUS II or Quartus II (legacy) for synthesis, fitting, and timing analysis. The 672-BGA footprint requires careful PCB stack-up planning with microvia or via-in-pad technology for cost-effective assembly. This page synthesizes distributor pricing (DigiKey, Mouser, Arrow), real-time stock and lead-time signals, drop-in and same-package alternatives, and practical design notes that go beyond what the original Altera datasheet provides.
EPF10K200SFC672-1X - 200K Gates FLEX-10KS FPGA, 470 I/O | Intel
The Intel / Altera EPF10K200SFC672-1X is a high-density FLEX-10KS series Field Programmable Gate Array (FPGA) delivering up to 200,000 system gates, 9,984 logic elements (LEs), and 470 user I/O pins in a 672-ball FineLine BGA package. Built on a reconfigurable CMOS SRAM architecture, the device integrates an embedded array block (EAB) for efficient memory-intensive functions, with 24 EABs providing up to 98,304 RAM bits. The FLEX-10KS family is designed for system-on-a-programmable-chip (SOPC) integration, combining programmable logic with embedded memory in a single device. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. The FLEX-10KS family belongs to the older Altera FLEX 10K architecture lineage, which historically targeted high-density glue logic, bus interfacing, and DSP co-processing in telecom, networking, and industrial control. Within the broader taxonomy, FPGAs sit alongside CPLDs as programmable logic devices, distinguished from ASICs by their reprogrammability and from microcontrollers by their hardware-parallel execution model. Key features of the EPF10K200SFC672-1X include 1,248 Logic Array Blocks (LABs), a propagation delay of approximately 0.4 ns, and 4-input look-up table (LUT) based logic elements. The device supports in-system programmability via the IEEE Std. 1149.1 JTAG interface, which adds up to 31,250 gates of boundary-scan logic. Core supply voltage operates at 2.5 V (2.375 V to 2.625 V), and the device is rated for commercial temperature operation (0 °C to 70 °C). Architecturally, the FLEX-10KS combines a fine-grained logic array with coarse-grained embedded array blocks, allowing designers to implement wide data-path functions efficiently. The 27 × 27 mm FineLine BGA package with 1.0 mm ball pitch balances high I/O count with manageable PCB layout requirements compared to larger pitch alternatives. Each I/O pin supports JTAG boundary-scan testing, simplifying board-level validation. Typical applications include telecommunications backplane interfacing, ASIC prototyping, DSP co-processing, industrial control glue logic, and legacy system redesigns requiring drop-in FLEX-10K compatibility. The 470 user I/O count makes the device well-suited for memory-rich data buffering and bus-bridging functions in embedded systems. When designing with this FPGA, ensure the Quartus design tool supports the legacy FLEX 10K device family, since current Quartus versions have removed older device support. Use dedicated configuration devices (such as EPC2 or EPC8) or JTAG for bitstream loading, and account for the SRAM-based configuration requiring reconfiguration at every power-up. The 672-BGA package demands careful PCB layout with 1.0 mm pitch routing and thermal management for sustained operation. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the legacy manufacturer datasheet.
EPF10K200SFC672-2 - FLEX 10KE 200K Gates FPGA | Altera
The Intel (formerly Altera) EPF10K200SFC672-2 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200K system gates with 9,984 logic elements housed in a 672-pin FineLine BGA (FBGA) package. It features 470 user I/O pins, 1248 Logic Array Blocks (LABs), and an embedded array architecture built on a 0.22 µm CMOS process node operating at 2.5 V core supply. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit within the programmable logic device (PLD) hierarchy, alongside CPLDs, and offer higher logic density and richer I/O. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) for on-chip memory, enabling system-on-a-programmable-chip (SOPC) integration combining logic, RAM, and ROM in a single device. Key features include 98,304 bits of embedded memory, a -2 speed grade with internal propagation delays of approximately 0.4 ns, MultiVolt I/O support for 2.5 V/3.3 V/5.0 V mixed-voltage environments, and JTAG-compliant IEEE 1149.1 boundary-scan testing. The device supports both SRAM-based configuration and in-system programmability via the passive parallel asynchronous configuration scheme. An on-chip Phase-Locked Loop (PLL) provides clock multiplication and skew management. Typical applications include telecommunications infrastructure (SONET/SDH framer circuits, ATM switches), high-speed data acquisition systems, digital signal processing front-ends, and legacy industrial control backplanes. The 470 user I/Os and 672-pin FBGA footprint make it suited for high-bandwidth parallel processing designs requiring dense connectivity. When designing with this part, note that the FLEX 10KE architecture requires 2.5 V core supply with separate VCCIO banks. Designers must allocate configuration memory and implement the ByteBlaster or MasterBlaster programming interface per Altera application notes. The device is now NRND/EOL; for new designs, consider Cyclone IV/V or MAX 10 families as modern equivalents. This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and LCSC, package-level drop-in alternatives, and practical design notes not found in the legacy FLEX 10KE datasheet alone.
EPF10K200SFI672-2 - FLEX 10KE FPGA 200K Gates 672-BBGA | Intel
The Intel (formerly Altera) EPF10K200SFI672-2 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) delivering 200,000 system gates and 9,984 logic elements in a 672-pin FineLine BGA (FBGA) package. The device is fabricated on a 0.22 µm (Arrow lists 0.42 µm process node per its parametric table) CMOS SRAM process, operates from a 2.5 V core supply, and supports PCI Local Bus Specification Revision 2.2 at 3.3 V / 33-66 MHz on -1 speed grade devices. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can reconfigure after manufacturing to implement custom digital logic, glue logic, or complete system-on-chip prototypes. The FLEX 10KE family extends the original FLEX 10K architecture by adding embedded array blocks (EABs) that double as synchronous SRAM, making it a hybrid logic-plus-memory fabric rather than a pure logic device. Key features of the EPF10K200SFI672-2 include 470 user I/Os, 1248 Logic Array Blocks (LABs), 24 Embedded Array Blocks (EABs) providing 96 Kbit of total embedded SRAM, and built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990. The device integrates 98,304 bits of distributed memory and supports in-system programmability via the Altera MAX+PLUS II or Quartus design tools through EDIF 2 0 0 / 3 0 0, LPM, VHDL, and Verilog HDL interfaces. The FLEX 10KE architecture combines a fine-grained logic fabric with row/column interconnects and column-based I/O structures that interface to off-chip signals at multiple I/O standards (LVTTL, LVCMOS, PCI, GTL). The -2 speed grade denotes a mid-tier performance bin within the FLEX 10KE family, trading off maximum toggle frequency versus cost. The 672-pin FBGA package uses the FineLine BGA pitch for high-density board mounting with controlled-impedance signal integrity. Typical applications include telecommunications line cards, industrial control glue logic, PCI bus interfaces, and legacy digital signal processing glue layers in telecom and instrumentation chassis. The embedded EABs simplify FIFO, dual-port RAM, and ROM substitution tasks. The wide I/O count also suits parallel bus bridging between microprocessors and ASICs. The legacy FLEX 10KE family has been an Altera workhorse for 32-bit PCI designs since the late 1990s. When designing with this part, verify that your Quartus / MAX+PLUS II toolchain still supports the FLEX 10KE device family because Intel has migrated its development tools to newer device families. Plan for end-of-life (EOL) risk because this part is reported as obsolete by major distributors. Confirm lead time and last-time-buy windows before committing to a new design. This page synthesizes distributor pricing, drop-in alternatives from the FLEX 10K/10KE family, and practical design notes for engineers maintaining legacy FLEX 10KE designs or planning last-time-buys.
EPF10K200SFI672-2B - 200K Gates FLEX 10KE FPGA | Altera
The Altera (Intel) EPF10K200SFI672-2B is a high-density FLEX 10KE family Field Programmable Gate Array (FPGA) with 200K system gates and 9,984 logic elements (LEs), housed in a 672-pin FineLine BGA (FBGA-672) package with 470 user I/Os. Built on a 0.22 µm SRAM-based CMOS process, it operates from a 2.5 V core supply and supports system performance up to 200 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can reconfigure post-manufacture to implement custom digital logic. FPGAs sit above standard logic ICs and microcontrollers in the programmable logic taxonomy (CPLD -> FPGA -> SoC FPGA) and belong to the broader category of programmable logic devices (PLDs) used for high-speed parallel processing, glue logic, prototyping ASICs, and DSP pipelines. The EPF10K200SFI672-2B features 98,304 bits of embedded SRAM, 24 Embedded System Blocks (EABs) totaling 96 Kbits of block RAM, and four phase-locked loops (PLLs) for clock management. Its FastTrack interconnect fabric delivers predictable timing across the device, while 5V-tolerant I/Os simplify interface to legacy peripherals. These characteristics make it suitable for telecom line cards, industrial control, and high-speed image processing applications. The 672-pin FineLine BGA package uses a 1.0 mm pitch on a 27 × 27 mm substrate, providing high signal density in a compact footprint. The FineLine BGA family is a sub-category of plastic BGA (PBGA) packaging designed for fine-pitch surface-mount assembly. The 'I' suffix in the part number indicates an industrial temperature grade (-40 °C to +85 °C), while 'S' denotes the 10KE family, 'F' indicates FineLine BGA package, and '672' identifies the pin count. Typical applications include telecommunications switching, high-speed serial protocol bridging (UTOPIA, POS-PHY), industrial machine vision, ASIC prototyping, and DSP co-processing. The device is well suited to high-I/O-count designs where 470 user pins and abundant block RAM simplify system partitioning. When designing with this part, verify PCB footprint compatibility with the FBGA-672 27 × 27 mm land pattern and ensure 6-layer or thicker stack-ups to maintain signal integrity for high-speed I/O. Plan JTAG access via the dedicated TEST pins for in-system programming, and check Quartus II / MAX+PLUS II support for bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K200SFI672-2N - 200K-Gate FLEX 10KE FPGA, 672-BGA | Intel
The Intel (formerly Altera) EPF10K200SFI672-2N is a 200,000-gate member of the FLEX 10KE embedded programmable logic device family, integrating 9,984 logic elements (LEs), 98,304 bits of embedded memory, and 470 user I/Os into a single 672-ball FineLine BGA (FBGA) package. Speed grade -2 places the device in the mid-speed bin for the family, while the "I" suffix denotes the industrial temperature grade (-40C to +85C). The "N" suffix indicates a lead-free, RoHS-compliant package finish. FLEX 10KE devices belong to the FLEX (Flexible Logic Element matriX) family of SRAM-based FPGAs, with each LE containing a 4-input look-up table, a programmable register, and dedicated carry and cascade chains. FLEX 10KE extends the original FLEX 10K architecture by adding True-Look-Up-Table dual-port embedded array blocks (EABs) that double as 4 Kbit SRAM memories, and by adding FastTrack Interconnect routing that improves timing predictability and density utilization. They sit within the broader hierarchy of SRAM-based programmable logic devices (PLDs), which in turn form a major branch of digital semiconductor ICs. Key differentiating specifications include 9,984 logic elements, 12 EABs delivering 98,304 RAM bits, 470 user I/Os, a 0.22 um CMOS process, 2.5 V core supply (5.0 V tolerant I/O with PCI compliance), JTAG boundary-scan test per IEEE Std. 1149.1, and 200 MHz internal operation. The embedded JTAG circuitry adds up to 31,250 gates overhead without consuming user logic. Typical applications include telecommunications line cards, industrial control backplanes, military/aerospace signal processing, and PCI-based add-in card prototyping. The combination of 470 I/Os and ~200K gates supports wide datapath designs including 32-bit microcontrollers, multi-channel DMA engines, and protocol bridges. When designing with this device, note that it is SRAM-based and therefore requires a configuration ROM (such as an EPC2) on every board - the FLEX 10KE will not retain its configuration through power cycles without external boot storage. The 672-FBGA package has a 27 x 27 mm body with 1.0 mm ball pitch, so PCB layout must support fine-pitch BGA fanout with microvia or via-in-pad technology on most stackups. EOL warnings apply; check Intel/Altera PCN history before new designs. This page synthesizes datasheet specifications, distributor pricing, drop-in alternatives from the same FLEX 10KE family, and practical design notes that the bare datasheet PDF does not provide in one place.
EPF10K200SRC240-1 - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel
The Intel EPF10K200SRC240-1 is a high-density FLEX-10KS series Field-Programmable Gate Array (FPGA) housed in a 240-pin RQFP (BFQFP with exposed pad) package, delivering up to 200,000 typical system gates and 9,984 logic elements backed by 98,304 bits of embedded SRAM. According to the Altera FLEX 10K Embedded Programmable Logic Family Data Sheet, the device provides 1,248 Logic Array Blocks (LABs), 182 user I/Os, and embedded array blocks that implement a wide range of memory and logic functions. The "SRC240-1" suffix indicates the standard 240-pin RQFP package and the -1 speed grade (fastest of the FLEX 10K family at 5.0 V). A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs are positioned above fixed-function ASICs in the silicon hierarchy: ASIC < FPGA < CPLD < programmable SoC < microprocessor. The FLEX 10K family pioneered embedded array blocks (EABs), which are RAM/ROM blocks that can be configured as wide SRAM, FIFO, ROM, or specialized logic, allowing each device to host both gates and megabytes of memory on one die. This makes FLEX 10K devices a bridge between simple glue-logic CPLDs and full-scale microprocessors. Key features of the EPF10K200SRC240-1 include the FLEX 10K SRAM-based architecture with in-system programmability via IEEE 1149.1 JTAG, multiVolt I/O supporting 5.0 V, 3.3 V, and 2.5 V interfaces, four dedicated clock input pins with on-chip PLL-style clock management, and built-in boundary-scan test. The device integrates 24 EABs totaling 40,960 bits, supports true dual-port RAM configurations, and provides configurable high-drive I/O for backplane driving. Embedded JTAG circuitry adds up to 31,250 gates beyond the listed gate count for boundary-scan and test logic. The 240-RQFP (32 x 32 mm BFQFP with exposed thermal pad) package exposes a metal pad on the underside for low thermal resistance and board-level grounding. Designers must use the standard FineLine BGA-pin-compatible migration strategy when planning a board that may move between FLEX 10K densities; Altera's datasheet recommends reserving only the I/O pins common to all candidate devices. Programming is performed through the JTAG port using Quartus II or MAX+PLUS II software. Typical applications include telecom line-card glue logic, industrial control state machines, PCI bridge interfaces, and legacy 5 V prototyping platforms. The exposed-pad package requires a thermal via array and copper pour directly under the part for heat spreading. When designing with this device, ensure all I/O banks share a common VCCIO if 5 V tolerance is required, since multiVolt I/O is per-bank. Designers migrating from FLEX 10K to FLEX 10KE should review the migration guide because EAB block RAM speeds and LAB interconnect changed between families. This page synthesizes distributor pricing, drop-in same-package alternatives from the same FLEX 10K family, and practical design notes not found in the manufacturer datasheet alone.
EPF10K200SRC240-1N - 200K FLEX 10KE FPGA, 240-BFQFP | Intel
The Intel (Altera) EPF10K200SRC240-1N is a member of the FLEX 10KE family of Field-Programmable Gate Arrays (FPGAs) featuring 9,984 logic elements and 200K equivalent gates, fabricated on a 0.22 µm CMOS process. It is housed in a 240-pin BQFP (Exposed Pad) package operating from a 2.5 V core supply. The device supports up to 182 user I/Os and includes 1,248 Logic Array Blocks (LABs), with embedded array blocks (EABs) that provide on-chip memory and arithmetic functions, making it well suited for high-density glue-logic, datapath, and interface bridging tasks. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can customize via a hardware description language (HDL). Within the broader hierarchy, an FPGA belongs to programmable logic devices -> digital logic ICs -> integrated circuits -> semiconductors. FPGAs fill the gap between fixed-function ASICs (high NRE, high volume) and discrete glue logic (low density, fixed function), enabling rapid prototyping, low-volume production, and field upgradability. Key features include 9,984 logic elements (cells), 1,248 LABs, 182 I/O pins, embedded array blocks for memory, and a maximum internal operating frequency of 250 MHz. The device is built on SRAM-based configuration cells, supporting in-system reprogrammability via the Altera/Intel Quartus or MAX+PLUS II design flows. It is rated for commercial operating temperature grades and uses the 240-pin BQFP exposed-pad package for improved thermal dissipation in surface-mount reflow processes. The FLEX 10KE architecture combines a fine-grained logic fabric with coarse-grained EABs, allowing efficient implementation of wide multiplexers, arithmetic functions, and small FIFOs without consuming general-purpose routing. Configuration data is stored in an SRAM cell, requiring a configuration device or microcontroller for in-system programming. The exposed pad on the BQFP package provides a low-thermal-resistance path to the PCB, important for the high toggle rates typical of 200K-gate designs. Typical applications include industrial control glue logic, legacy telecommunications interface cards, low-volume prototyping adapters, custom peripheral bridges, and educational digital-design platforms. The wide I/O count and embedded memory make it suitable for systems that require parallel datapath processing combined with control logic. Because the silicon is older and the family is in obsolescence transition, it is most commonly deployed as a long-life replacement for installed equipment rather than for green-field designs. When designing with this device, allocate sufficient PCB area for the exposed thermal pad and follow Intel/Altera application notes for JTAG chain configuration and in-system programming. Because the EPF10K200SRC240-1N is a mature part approaching end-of-life, designers should validate long-term supply and consider newer Cyclone or MAX families for new programs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and design engineers evaluate the EPF10K200SRC240-1N against modern substitutes.
EPF10K200SRC240-1X - 200K Gate FLEX-10KS FPGA, 240-RQFP | Intel
The Intel (formerly Altera) EPF10K200SRC240-1X is a 200,000-gate member of the FLEX 10KS family of SRAM-based FPGAs, delivering 9,984 logic elements, 182 user I/O pins, and 98,304 bits of embedded SRAM in a 240-pin RQFP (32x32 mm, 0.5 mm pitch) package. The '-1X' suffix denotes the commercial speed grade (fastest) with industrial temperature range support. It operates from a 2.375 V to 2.625 V core supply with separate V/CCINT and V/CCIO rails for I/O banking flexibility. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that an engineer can rewire after manufacturing to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) between traditional CPLDs (smaller, non-volatile, deterministic timing) and ASICs (custom-silicon performance at high NRE cost). The FLEX 10KS architecture introduced by Altera in the late 1990s was among the first commercial FPGAs to embed dedicated SRAM blocks (EABs/ESBs), making it suitable for data-path, DSP, and memory-intensive glue logic. Key features of the EPF10K200SRC240-1X include 9,984 logic elements, 1248 Logic Array Blocks (LABs), 98,304 embedded SRAM bits organized into Embedded Array Blocks (EABs), 182 maximum user I/O across 4 I/O banks, and multi-voltage I/O support (5.0 V, 3.3 V, 2.5 V). The device supports in-system configuration via serial or parallel EPROM/Flash, and is pin-compatible within the FLEX 10KS 240-pin RQFP family, enabling SameFrame migration to smaller or larger density parts without PCB rework. The FLEX 10KS architecture pairs a fine-grained logic fabric with row/column interconnect, an embedded array of SRAM blocks for wide-word memory or lookup-table expansion, and four I/O banks with independent V/CCIO rails for mixed-voltage interfacing. The '-1X' speed grade typically yields internal toggle rates around 250 MHz for simple counter paths, making the device adequate for legacy telecom, industrial control, and bus-bridging applications rather than high-speed SERDES work. Typical applications include legacy telecom line-card glue logic, industrial PLC backplanes, MIL-STD-1553 / ARINC 429 protocol bridges, parallel bus expansion (ISA, VME, PC/104), and pin-compatible upgrades for designs originally built on EPF10K100 / EPF10K130 / EPF10K200E FLEX 10K family members. The 240-RQFP package is also attractive for hand-solderable prototypes and field-repair scenarios where BGA rework equipment is unavailable. When designing with this part, verify that the chosen JTAG chain programmer supports the FLEX 10KS family (Quartus II 13.0 or MAX+PLUS II 10.2 are the last fully supported toolchains). For new designs, consider Cyclone IV or MAX II as modern pin-compatible migration targets; for drop-in replacement of an obsolete or EOL FLEX 10KS board, the part is currently available through authorized distributors and franchised brokers. This page consolidates distributor stock, drop-in same-package alternatives within the FLEX 10KS family, and practical sourcing notes that are not present in the legacy FLEX 10KS datasheet volume.
EPF10K200SRC240-2 - FLEX 10KS FPGA, 9984 LEs, 240-RQFP | Intel
The Intel (formerly Altera) EPF10K200SRC240-2 is a member of the FLEX 10KS family of Field Programmable Gate Arrays (FPGAs) fabricated on a 0.42 micrometer CMOS SRAM process, delivering 9984 logic elements (LEs), 1248 Logic Array Blocks (LABs) and 98304 bits of embedded RAM in a 240-pin RQFP (32x32 mm) package with exposed thermal pad. The device supports 182 user I/O pins and operates from a 2.5 V core supply (2.375 V to 2.625 V). The “-2” suffix denotes a speed grade of approximately 80 MHz internal operation, suitable for medium-speed glue-logic, bridge and control applications. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect and embedded memory arrays into a single silicon die. Within the broader taxonomy, FPGAs sit under the Programmable Logic Device umbrella -> Integrated Circuit -> Semiconductor. The FLEX 10KS family was the industry’s first FPGA with embedded system blocks, allowing designers to integrate ASIC-like memory, bus controllers, and arithmetic units alongside conventional logic fabric. Key features include 9984 logic elements distributed across 1248 LABs, 98304 bits of distributed RAM, 182 user I/Os, and a commercial-grade 0C to 70C operating range. The 240-pin RQFP (also referred to as 240-BFQFP with exposed pad) supports surface-mount assembly on standard FR-4 PCB technology, with gull-wing leads on a 32x32 mm body. The device is in-system programmable via the IEEE 1149.1 JTAG interface or the legacy Altera EPC configuration EEPROM family. The architecture combines four-input look-up table (LUT) based logic elements with embedded array blocks (EABs) that can be configured as RAM, ROM or product-term logic. This hybrid fabric allows the implementation of both datapath pipelines and large memory arrays on a single device, eliminating external memory and reducing board area. The exposed thermal pad provides a low thermal-resistance path to the PCB copper pour, enabling higher sustained logic utilization. Typical applications include industrial control backplanes, telecommunications line-card glue logic, legacy PCI bridge designs, machine vision pre-processing, and test & measurement instrumentation. The 182 I/Os make the EPF10K200SRC240-2 well-suited for systems that need to consolidate multiple discrete logic devices, ASIC replacement, and rapid-prototyping of new bus architectures. When designing with this part, ensure that the Quartus II (or MAX+PLUS II for legacy flows) generated bitstream targets the FLEX 10KS device family and the -2 speed grade. Verify that the configuration EEPROM, clock buffers and decoupling network follow the FLEX 10KA/10KS handbook recommendations, and that the exposed pad is soldered to a sufficient ground copper pour for thermal dissipation. This page synthesizes distributor pricing, drop-in package alternatives within the FLEX 10KS family, and practical design notes not found in the original FLEX 10KS datasheet, enabling engineers to evaluate the EPF10K200SRC240-2 against modern and legacy FPGA alternatives.
EPF10K200SRC240-2X - FLEX 10K 200K Gates 9984 Cells FPGA | Altera
The Altera EPF10K200SRC240-2X is a high-density FLEX 10K-series Field Programmable Gate Array (FPGA) delivering 200,000 system gates, 9984 logic cells, and 1248 Logic Array Blocks (LABs), housed in a 240-pin PowerQuad Flat Package (RQFP/RQFP-240). It belongs to Intel/Altera's FLEX 10K family of embedded programmable logic devices (PLDs) that combine look-up table (LUT)-based logic with embedded array blocks (EABs) for on-chip memory and DSP functions. The device supports up to 470 user I/Os in some packages and provides typical propagation delays of approximately 0.4 ns to 0.8 ns at room temperature. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit designed to be configured by the customer or designer after manufacturing—hence "field-programmable". The FLEX 10K family specifically pioneered the embedded array architecture, where rows of logic elements are interleaved with columns of embedded array blocks (EABs), each EAB providing up to 2048 bits of RAM or a small ROM/DSP function. This positions FLEX 10K as a hybrid between classical FPGAs and early system-on-chip (SoC) devices, often referred to as system-on-a-programmable-chip (SOPC) integration. In the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), which include SPLDs, CPLDs, and FPGAs, all of which fall under digital logic ICs and ultimately integrated circuits. Key features of the EPF10K200SRC240-2X include 200K equivalent gates, 9984 logic elements/cells, embedded array blocks providing up to approximately 98 Kbits of RAM, JTAG-compliant boundary-scan test (IEEE 1149.1) support, multi-voltage I/O standards, and a core supply of 2.5 V with I/O banks supporting 3.3 V, 5 V tolerant interfaces. The -2X speed grade denotes an industrial-temperature-grade device optimized for higher clock rates compared to -3 or -1N grades. The 240-pin RQFP-240 package (34.6 mm x 34.6 mm body, 0.5 mm pitch, gull-wing leads) is designed for surface-mount assembly on high-layer-count PCBs with thermal management via the exposed pad. Typical applications for the EPF10K200SRC240-2X include telecom switching equipment, ASIC prototyping, high-speed data-acquisition front-ends, industrial control systems, military and aerospace logic integration, glue logic for embedded motherboards, and legacy MRO (maintenance, repair, overhaul) programs where long-life-cycle parts are required. The device is widely used in PCI interface bridging, custom bus architectures, and DSP pre/post-processing pipelines. Compared to its sibling grades (-1N, -2, -3N), the -2X places in the upper-mid speed range with improved timing margin. Designers should pay close attention to I/O bank partitioning and VCCIO rail planning—each of the multiple I/O banks must be tied to a single VCCIO voltage (3.3 V typical, but 2.5 V and 5 V-tolerant inputs also supported on dedicated banks). Decoupling requirements call for multiple low-ESR 0.1 µF and 10 µF capacitors placed as close as possible to each VCC/VCCIO pin pair. Programming uses the Altera ByteBlaster or BitBlaster cable via JTAG or the legacy PS (passive serial) configuration mode. This page synthesizes distributor pricing, drop-in pin-compatible alternatives (including speed-grade variants in the same RQFP-240 footprint), parametric comparisons, and practical design notes not collated in any single manufacturer datasheet—giving sourcing engineers and program managers a one-stop reference for this long-life-cycle FPGA.
EPF10K200SRC240-3 - FLEX 10KE 200K-Gate FPGA, 240-RQFP | Intel
The Intel (formerly Altera) EPF10K200SRC240-3 is a member of the FLEX 10KE family of SRAM-based FPGAs, integrating 200,000 system gates, 9,984 logic elements, and 98,304 bits of embedded memory in a 240-pin RQFP (Power Quad Flat Pack) package with exposed pad. Built on a 0.22 um CMOS process and operating from a 2.5 V core supply, this device provides 470 user I/Os at a 0.5 mm pitch and is rated for the commercial 0 C to 70 C temperature range. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) that combine programmable logic with on-chip dual-port RAM and ROM, enabling System-on-a-Programmable-Chip (SOPC) integration in a single device - a precursor to modern SoC FPGAs. FPGAs sit above ASICs and CPLDs in density while remaining reprogrammable. Key features of the EPF10K200SRC240-3 include 1,248 Logic Array Blocks / Configurable Logic Blocks (LABs/CLBs), four Delay-Locked Loops (DLLs) for clock skew management, 12 Embedded Array Blocks providing up to 98 Kbits of RAM, MultiVolt I/O supporting mixed-voltage interfacing, and an in-system programmability (ISP) interface via the passive serial or ByteBlaster configuration schemes. The device consumes approximately 0.4 ns propagation delay per logic element and runs at internal clock rates up to 166.67 MHz. Typical applications include telecommunications line cards, industrial control and factory automation, high-speed data acquisition front-ends, and legacy telecommunications and imaging systems designed during the late 1990s and early 2000s. The wide 470 I/O count makes it well suited for bus-intensive designs such as PCI bridges, memory controllers, and parallel DSP pipelines. When designing with this device, ensure the Quartus II or MAX+PLUS II toolchain is used for synthesis, place-and-route, and bitstream generation. The exposed pad of the RQFP-240 must be soldered to a copper pour to meet thermal specifications, and decoupling capacitors must be placed within 5 mm of every VCCINT and VCCIO pin pair.
EPF10K200SRC240-3N - FLEX 10KE FPGA 200K Gates 9984 Cells | Intel
The Intel (formerly Altera) EPF10K200SRC240-3N is a FLEX 10KE family Field Programmable Gate Array (FPGA) built on a 0.22 µm CMOS process, integrating 200,000 typical system gates and 9,984 logic elements (LEs) in a 240-pin RQFP (Power QFP) package with exposed pad. It features 470 user I/Os, 1248 Logic Array Blocks (LABs), and 24 Embedded Array Blocks (EABs) providing up to 98,304 bits of on-chip RAM, with a maximum internal operating frequency of 166.67 MHz and 0.22 µm SRAM-based configuration cells. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the high integration density of an Application-Specific Integrated Circuit (ASIC) with the field-programmability of a Complex PLD (CPLD). Within the broader taxonomy, the FLEX 10KE belongs to the PLD -> CPLD/FPGA -> SRAM-based FPGA -> low-power FPGA hierarchy, intended for system-on-a-programmable-chip (SOPC) designs that require embedded memory, embedded logic, and substantial user I/O in a single device. Key differentiating features include a 2.5 V core supply, multi-volt I/O support for 2.5 V and 3.3 V interfaces, embedded IEEE Std 1149.1 JTAG boundary-scan test circuitry (contributing up to 31,250 gates of test logic), built-in phase-locked loops (PLLs) for clock management, and on-chip memory configured via Embedded Array Blocks (EABs). The -3N speed grade denotes a commercial-temperature device with a maximum propagation delay of 0.40 ns at the fastest logic path. The FLEX 10KE architecture combines a coarse-grained Logic Array Block fabric with fine-grained Logic Element cells and dedicated EAB SRAM blocks, allowing designers to implement both register-rich glue logic and moderately sized dual-port or ROM memories without external components. MultiVolt I/O pins enable seamless interfacing with 2.5 V, 3.3 V, and 5 V devices through configurable voltage-reference and PCI-compliant I/O standards. Typical applications include telecommunications line-card glue logic, industrial control and factory-automation backplanes, test-and-measurement instrumentation front-ends, PCI bridge prototyping, image and video pipeline prototyping, and low-volume ASIC replacement designs that benefit from embedded memory and the FLEX 10KE's high I/O count. Designers should remember that FLEX 10KE devices are SRAM-based, requiring a configuration ROM on the board for power-up loading, and the exposed thermal pad of the 240-pin RQFP must be soldered to a sufficiently large copper pour to meet the device's thermal dissipation envelope under continuous switching loads. This page synthesizes distributor pricing across 10 channels, drop-in FLEX 10KE alternatives in the same 240-pin RQFP footprint, and practical design notes that the manufacturer datasheet alone does not provide, including speed-grade trade-offs and configuration-ROM selection guidance.