FPGA & CPLD
Products (6352)
EPF10K130EQC240-1 - 130K Gates FLEX 10KE FPGA 240-PQFP | Altera
The Altera EPF10K130EQC240-1 is a member of the FLEX 10KE family of embedded programmable logic devices, providing 130,000 typical gates, 6,656 logic elements (LEs), and 65536 bits of embedded SRAM in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. It operates from a 2.5 V core supply (2.375 V to 2.625 V) at up to 333.33 MHz internal performance, with 186 maximum user I/O pins available for external interfacing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in-system. Within the broader taxonomy, the FLEX 10KE sits at the intersection of SRAM-based FPGA and embedded programmable logic, integrating dedicated Embedded Array Blocks (EABs) that provide true dual-port RAM and ROM functions alongside standard LEs - positioning it as one of the first devices to combine ASIC-density gate arrays with FPGA-style programmable interconnect in a single fabric. Key features of the EPF10K130EQC240-1 include 4 Embedded Array Blocks delivering up to 65536 RAM bits, JTAG-compliant IEEE 1149.1 boundary-scan test support, MultiVolt I/O for interfacing with 2.5 V, 3.3 V, and 5.0 V systems, and in-system programmability via the Altera EPC configuration devices. The PQFP-240 package uses a 32x32 mm body with gull-wing leads, suiting it for prototypes, industrial control cards, and legacy telecom infrastructure where surface-mount fine-pitch BGAs are not required. Typical applications for this device include industrial machine control, telecommunications line cards, glue-logic integration, legacy ASIC replacement, and embedded DSP co-processing. Designers should pair it with Altera's MAX+PLUS II or Quartus design software for synthesis, place-and-route, and timing analysis. Note that this part is in lifecycle status considered Last Time Buy / Not Recommended for New Designs, so it is best suited for maintenance of existing production systems rather than new platforms.
EPF10K130EQC240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel
The Intel (formerly Altera) EPF10K130EQC240-1N is a FLEX 10KE family Field-Programmable Gate Array (FPGA) integrating 130,000 system gates with 6,656 logic elements and 65,536 bits of embedded SRAM, fabricated on a 0.22 µm (some sources cite 0.25 µm) CMOS process and housed in a 240-pin Plastic Quad Flat Pack (PQFP / 240-BFQFP) measuring 32x32 mm. The device operates from a 2.375 V to 2.625 V (2.5 V nominal) core supply, supports 186 user I/Os, and contains 832 Logic Array Blocks (LABs) implementing a built-in SRAM configuration memory so the bitstream reloads on every power-up. A Field-Programmable Gate Array is a reconfigurable digital integrated circuit that combines programmable logic elements, an interconnect matrix, and I/O blocks in a single die. Within the broader programmable-logic taxonomy, FPGAs sit above small CPLDs and below ASICs in density; the FLEX 10KE family in particular targets glue-logic, bus-bridging, and mid-density state-machine designs of the late 1990s/early 2000s, before the Cyclone and Stratix families displaced FLEX 10KE in new designs. Engineers chose the FLEX 10KE family for SRAM-based reconfigurability, embedded memory blocks, and the mature Quartus II design-flow support. Key specifications include 64 Kbit embedded block RAM (EAB), 342,000 maximum system gates, 4 Embedded Array Blocks (EABs) of 2,048 bits each, 333.33 MHz maximum internal operating frequency, and -40 °C to +85 °C commercial operating temperature range (note the -1N speed grade). The -1N suffix designates the faster -1 speed grade combined with an industrial/lead-free reflow profile; the package is lead-free (Pb-free) and RoHS compliant, while older -1 / -2 / -3 grades used SnPb lead finish. Compared with the -3 (slowest) grade, the -1 grade delivers the highest internal performance in this family. Typical applications include telecom interface cards (T1/E1, Utopia, POS-PHY bridging), industrial control boards, mid-density glue logic between microprocessors and peripherals, ISA/PCI bus bridges, and legacy replacement of 74-series TTL arrays in long-lifecycle equipment. The 186 user I/Os and 64 Kbit of embedded RAM also make it suitable for protocol converters and small packet-processing engines on FPGA fabric. When designing with this part, ensure the 2.5 V core rail is well decoupled with 0.1 µF and 10 µF capacitors near each supply pin, and route all 186 I/Os through 5 V-tolerant banks if the board mixes 3.3 V and 5 V logic. Quartus II (legacy) or the Quartus Prime FLEX 10KE device-support add-on is required for synthesis, fitting, and bitstream generation. This page combines distributor pricing, SameFrame pin-migration alternatives, and practical design guidance not found in the original FLEX 10KE datasheet, helping engineers evaluating EOL inventory or performing legacy board-maintenance sourcing.
EPF10K130EQC240-3 - FLEX-10KE FPGA 130K Gates 240-PQFP | Altera
The Altera (Intel) EPF10K130EQC240-3 is a FLEX-10KE series Field Programmable Gate Array delivering up to 342,000 system gates with 6,656 logic elements, 832 logic array blocks (LABs), and 65,536 bits of embedded SRAM in a 240-pin Power QFP (PQFP, 32x32 mm) package. It is built on SRAM-based CMOS configuration memory, supports 186 user I/O pins, and operates from a 2.375 V to 2.625 V core supply with multi-voltage I/O support (2.5 V / 3.3 V). The "-3" speed grade positions it in the FLEX-10KE commercial speed portfolio. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (LABs/CLBs) interconnected by a programmable routing fabric and surrounded by programmable I/O cells. FPGAs occupy the top of the programmable logic hierarchy - above SPLDs and CPLDs - and below hard ASICs. They enable System-on-a-Programmable-Chip (SOPC) integration, embedding megafunctions such as multipliers, memory blocks, and processor cores alongside general logic. This hierarchy makes FPGAs ideal for glue logic, prototyping, and low-to-mid volume production without NRE tooling cost. Key features include embedded array blocks for implementing efficient memory and specialized logic, a separate logic array for general logic functions, four phase-locked loops (PLLs) for clock management, multi-voltage I/O supporting 2.5 V and 3.3 V interfaces, and built-in JTAG (IEEE 1149.1) boundary-scan support. The device supports in-system programmability via the Altera FLEX-10KE configuration scheme using a serial configuration EPROM or microprocessor interface. Architecturally, the FLEX-10KE family combines an embedded array (optimized for megafunctions like RAM, ROM, and multiplier primitives) with a logic array (fast fine-grained logic), connected through continuous FastTrack interconnect. Each LAB contains 8 logic elements (LEs), and each LE contains a 4-input LUT, a programmable register, and carry chain logic. Embedded array blocks (EABs) provide 2,048 bits of RAM each, configurable as RAM, ROM, or FIFO. Typical applications include telecommunications line cards, industrial control glue logic, video processing pipelines, DSP co-processing front-ends, networking bridges, and PCI bus controllers. The 240-PQFP footprint was widely adopted in late-1990s/early-2000s designs and remains in service today as long-lifecycle infrastructure equipment. When designing with this part, note that FLEX-10KE FPGAs are end-of-life and Intel/Altera recommends migration to Cyclone IV or Cyclone V for new designs. For new 240-pin PQFP designs in production, consider Cyclone IV E EP4CE40 in FQFP or BGA. Existing designs should source EPF10K130EQC240-3 through authorized distributors or last-time-buy stock. This page synthesizes distributor pricing, verified drop-in same-package alternatives from the Site MPN list, practical design notes and lifecycle information not found in any single distributor page, and is engineered for AI-search citation with structured FAQ and comparison data.
EPF10K130EQC240-3N - 130K Gate FLEX-10KE FPGA, 240-PQFP | Intel
The Intel EPF10K130EQC240-3N is a member of the FLEX 10KE programmable logic family, a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP) package. It integrates 6,656 logic elements organized into 832 Logic Array Blocks (LABs), 65,536 bits of embedded RAM, 186 user I/O pins, and 342,000 equivalent system gates, delivering high logic density for glue-logic, bus-interface, and datapath replacement tasks at a frequency of 200 MHz in a 0.22 µm CMOS process. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> FLEX 10KE family. They are widely used to implement parallel hardware acceleration, custom I/O protocols, and prototyping of ASIC designs, providing faster time-to-market than full-custom silicon. The FLEX 10KE family specifically targets high-volume, low-cost glue-logic replacement and bridge applications. Key specifications include a core supply voltage of 2.5 V (range 2.375 V to 2.625 V), 186 configurable I/O pins operating from 3.3 V LVTTL/LVCMOS interfaces, four Phase-Locked Loops (PLLs) for clock management, embedded multiplier blocks for datapath acceleration, and MultiVolt I/O supporting mixed-voltage operation. The 240-BQFP footprint uses 32 x 32 mm gull-wing leads and offers 5 V tolerant inputs. The FLEX 10KE architecture separates logic, routing, and memory into dedicated columns, allowing embedded array blocks (EABs) to be configured as RAM, ROM, or synchronous FIFO. With 49,152 typical gates (130K maximum) and fast SRAM configuration, the EPF10K130E accelerates pipelined designs and is well-suited for digital signal processing front-ends and bus-bridging ASICs. Typical applications include telecommunications backplane interfaces, industrial control systems, PCI bridge logic, peripheral controllers, and legacy ASIC/ASSP replacement. Its 5 V tolerant I/O and SRAM-based reconfiguration make it ideal for prototyping and short-run production. When designing with the EPF10K130E, ensure the configuration PROM (EPC16, EPC8, or EPC2 series) is properly sized for the bitstream. Use 100 µF bulk + 0.1 µF decoupling per VCC pin, and confirm JTAG chain length matches the Quartus programmer. This part is widely available on the secondary market as Intel/Altera has notified FLEX 10KE of last-time-buy status. This page synthesizes distributor stock, parametric alternatives, and design guidance not found in the original manufacturer datasheet.
EPF10K130EQI240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel / Altera
The Intel (formerly Altera) EPF10K130EQI240-1N is a high-density FLEX 10KE family FPGA delivering 130,000 typical gates (logic, capacity, package) housed in a 240-pin PowerQuad Flat Pack (PQFP, RQFP-240) surface-mount package with gull-wing leads. It provides 6,656 logic elements, embedded array blocks (EABs), and 186 user I/O pins, with a 2.5 V core supply (2.3 V to 2.7 V tolerance) suitable for industrial-temperature designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader category of programmable logic devices (PLDs) within the integrated circuits hierarchy. FPGAs occupy the high-end of the PLD taxonomy (above simple SPLDs and CPLDs) by integrating thousands of configurable logic blocks, programmable interconnect, embedded memory, and often embedded multipliers or transceivers, enabling the implementation of complete digital subsystems on a single chip. The FLEX 10KE generation is built on a 0.25 µm CMOS process with SRAM-based configuration, requiring an external configuration device such as the EPC2 configuration PROM to load the bitstream at power-up. Key features include 6,656 logic elements (LEs), 6,912 total RAM bits distributed across embedded array blocks, support for system-clock rates up to 333.33 MHz, and a JTAG-compliant IEEE 1149.1 boundary-scan test interface. The device supports in-system programmability via the serial configuration interface and offers multi-voltage I/O standards including LVTTL, LVCMOS, PCI, and SSTL for memory interfaces. Typical applications include industrial control, telecom line cards, glue-logic consolidation on legacy 5 V boards, prototyping for ASIC replacement, and DSP co-processing pipelines. The wide I/O count and embedded memory blocks also make the part well-suited to parallel bus interfacing in test and measurement instrumentation. Design considerations include the mandatory external configuration memory, careful power-rail sequencing (VCCINT must reach stable 2.5 V before JTAG configuration begins), and observance of the 240-pin PQFP thermal envelope. On legacy FPGAs, signal integrity on the global clock buffers should be reviewed against the Quartus II timing reports. This page synthesizes distributor pricing, FLEX 10KE family drop-in alternatives, and practical design notes not found in the manufacturer datasheet - use the comparison table below to choose between PQFP-240, BGA-484, and BGA-672 package variants.
EPF10K130EQI240-2 - FLEX 10KE FPGA, 130K Gates, 240-PQFP | Intel / Altera
The Intel (formerly Altera) EPF10K130EQI240-2 is a member of the FLEX 10KE family of SRAM-based Field-Programmable Gate Arrays (FPGAs), delivering 130,000 typical gates and 6,656 logic elements in a 240-pin Power Quad Flat Pack (PQFP / BFQFP) package. It integrates 65,536 bits of embedded array memory, 832 Logic Array Blocks (LABs) with 12 logic elements per LAB, and 186 user I/O pins, providing a high-density programmable platform for glue-logic, bus-bridging, and custom datapath designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can program after manufacturing to implement arbitrary digital logic. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below ASICs in terms of density, power efficiency, and per-unit cost at volume. The FLEX 10KE family specifically combines fine-grained logic with embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier primitives, making the device suitable for designs that require both random logic and on-chip memory. Key features of the EPF10K130EQI240-2 include 342,000 maximum system gates, 65,536 RAM bits distributed across embedded array blocks, 4 dedicated input pins plus clock and clear control pins, in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and multi-volt I/O support (5.0V, 3.3V, 2.5V). The industrial-grade -2 speed grade and -40C to +85C operating range make the part suitable for commercial and industrial environments rather than full automotive qualification. The EPF10K130EQI240-2 uses a 0.22 um SRAM process with a 4-input look-up table (LUT) architecture per logic element, with cascade chains and fast carry chains for arithmetic functions. Built-in PCI compliance and a low-skew global clock network with up to 8 clock pins allow the device to address both peripheral-controller and datapath-intensive designs without external PLDs. Typical applications include telecommunications line-card glue logic, industrial control and instrumentation backplanes, PCI bus interfaces, custom datapath accelerators, and legacy system emulation. The PQFP-240 footprint is well suited for through-hole-compatible surface-mount prototyping and rework on existing 10K designs. When designing with this device, ensure that the Quartus II or MAX+PLUS II toolchain matches the device code (EPF10K130E) and speed grade (-2). Designers transitioning to newer Cyclone or MAX families should treat FLEX 10KE as a mature, last-time-buy risk and verify long-term availability before new designs. This page synthesizes distributor stock, drop-in alternatives from the same Altera FLEX 10KE family, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet PDF.
EPF10K130EQI240-2N - 130K Gates FLEX-10KE FPGA, 240-PQFP | Intel / Altera
The Intel / Altera (formerly Altera) EPF10K130EQI240-2N is a member of the FLEX-10KE embedded programmable logic family, delivering approximately 130,000 usable gates in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package with 186 user I/Os. Built on a 0.22 µm CMOS SRAM-based architecture, the device integrates 6,656 logic elements (LEs), 65,536 bits of embedded array memory (EAB), and is targeted at System-on-a-Programmable-Chip (SOPC) designs requiring moderate logic density and high I/O count on a through-hole friendly package. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all defined by user-supplied bitstream data after manufacturing. FPGAs sit in the programmable logic hierarchy beneath full-custom ASICs and above discrete logic ICs, enabling rapid prototyping, late-stage design changes, and integration of memory plus logic in a single device. The FLEX-10KE family specifically pioneered the embedded array block (EAB) concept, allowing megafunctions such as RAM, ROM, and multiplier primitives to be implemented with the same silicon efficiency as dedicated memory. Key features of the EPF10K130EQI240-2N include 186 user I/O pins, 65,536 RAM bits distributed across embedded array blocks, 0.6 ns propagation delay typical of the family, and an industrial-grade operating temperature range (I suffix) of -40 °C to +85 °C. The device supports in-system programmability via an industry-standard passive serial (PS) configuration interface, multi-device configuration chains, and 3.3 V core operation with 5 V-tolerant I/O via Altera's MultiVolt interface. The 240-pin PQFP package supports legacy through-hole PCB designs and repair-friendly prototyping flows. The I-grade (industrial) operating range suits factory automation, instrumentation, and telecommunications line-card applications. MultiVolt I/O compatibility allows seamless interface with both 3.3 V and 5 V peripherals without external level shifters. Typical applications include telecommunications line cards and bridges, industrial motor control and PLC backplanes, glue logic replacement in legacy industrial controllers, prototyping platforms for ASIC migration, and test & measurement instrumentation front-ends. The high I/O count makes it suitable for parallel bus bridging and protocol conversion designs. When designing with this FPGA, ensure your configuration PROM (EPC2 or compatible) and JTAG chain are correctly wired. The 240-pin PQFP footprint requires plated through-holes and is not recommended for new high-speed designs above 50 MHz due to lead inductance; new designs should consider equivalent logic in BGA or QFP packages. Quartus II or MAX+PLUS II software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond what the legacy datasheet provides. Engineers evaluating the FLEX-10KE family should consult Altera documentation and migration guides to modern Cyclone or MAX families for new designs, while the EPF10K130EQI240-2N remains a serviceable drop-in for legacy maintenance.
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
The Intel EPF10K200EBC600-1 is a 2.5 V FLEX-10KE field-programmable gate array with 9,984 logic elements, 470 I/O, 1,248 LABs, and 98,304 bits of embedded memory, supplied in a 600-BGA package. The verified source identifies a 600-BGA device and a 470-I/O configuration. The MPN suffix indicates a particular speed and temperature ordering, but the complete timing grade definition is not present in the supplied web data and therefore requires manufacturer-document verification. A field-programmable gate array is a programmable logic device containing configurable logic blocks, routing resources, and programmable I/O that implement digital functions. In the system hierarchy, the FPGA sits between fixed-function application-specific integrated circuits and software-driven processors: it provides hardware parallelism and timing control without requiring a custom silicon mask. Embedded memory, logic, and I/O resources let a system combine control logic, interface adaptation, and datapath functions in one programmable device. The EPF10K200EBC600-1 provides 9,984 logic elements, 1,248 LABs, 470 I/O, and 98,304 bits of embedded memory according to the verified distributor listings. These resources support moderate-to-large digital designs, including glue logic, bus controllers, protocol bridges, and custom peripherals. The 600-BGA package is a high-density surface-mount package, but its ball map and package dimensions are not included in the supplied data. The FLEX-10KE architecture combines programmable logic with embedded array functions. The supplied description references system-on-a-programmable-chip integration, enhanced embedded arrays, dual-port memory, and specialized logic functions. These features make the part suitable for designs needing configurable datapaths and memory, although exact memory organization, operating-current limits, propagation-delay grades, and supported configuration modes are not available in the provided snippets. Typical applications include industrial control equipment, communications-interface hardware, test equipment, and legacy digital systems. Its 470 I/O make it useful where a design must connect many parallel or serialized external signals, while 9,984 logic elements provide capacity for glue logic, state machines, protocol handling, and custom arithmetic. The 98,304-bit embedded-memory figure also supports buffering and state-storage functions when the design is compiled for the FLEX-10KE architecture. A critical design step is to verify the exact package ball map, power sequencing, configuration interface, and timing specification before layout or production release. The verified data provides the 600-BGA package name and 470-I/O count, but not a ball-by-ball pinout. Designers should also confirm whether the target design requires the -1 speed grade, a different temperature grade, or a specific revision-compatible source. This page combines verified distributor specifications, package-level information, pricing references, and engineering-focused context to support component selection. Where the supplied data does not expose a parameter, the value is marked as needed rather than estimated.
EPF10K200EBC600-2 - FLEX-10KE FPGA 470 I/O BGA-600 | Intel
The Intel (formerly Altera) EPF10K200EBC600-2 is a FLEX-10KE family Field-Programmable Gate Array (FPGA) offering 200,000 typical gate equivalent logic density, 98304 bits of embedded array memory (EAB), and 470 user I/O pins in a 600-ball BGA package. The device integrates 1248 Logic Array Blocks (LABs) and 9984 Logic Elements (LEs) with a 0.4 ns propagation delay, supporting system-on-a-programmable-chip (SOPC) designs for high-density digital logic applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy the middle ground between fixed-function ASICs and low-density PLDs/CPLDs, providing hundreds of thousands of logic gates, dedicated memory blocks, and high-speed I/O transceivers on a single reprogrammable silicon die. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below full-custom ASICs, enabling rapid prototyping, low-volume production, and in-system reconfiguration for communications, industrial, and embedded computing platforms. Key features include a 0.30 µm CMOS SRAM process technology, four enhanced embedded array blocks (EABs) per device, 4.6 Mbits total embedded memory, 5V tolerant I/O with multi-voltage support (2.5V/3.3V), and in-system programmability via IEEE 1149.1 JTAG and Altera EPC2/EPC16 configuration devices. The 600-ball BGA package at 45×45 mm body size with 1.27 mm pitch provides robust thermal dissipation and high-density board interconnect suitable for multi-layer backplane designs. The EPF10K200EBC600-2 uses an SRAM-based look-up table (LUT) architecture with FastTrack interconnect routing, providing deterministic timing closure and supporting designs up to 200K system gates with peripheral component interconnect and processor interface bridging. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, enabling flexible interfacing with microprocessors, memory subsystems, and backplane buses. Typical applications include telecommunications infrastructure, industrial control systems, embedded processor glue logic, high-speed data acquisition, and ASIC prototyping. The wide I/O count and embedded memory make it well-suited for parallel DSP pipelines, network protocol acceleration, and legacy bus-to-bus bridges in telecom switching equipment. When designing with this device, note that it requires a separate configuration memory (such as an EPC2 serial configuration device) at every power-up since the SRAM configuration is volatile. PCB layout must include a dedicated 45×45 mm BGA land pattern with 1.27 mm pitch and adequate thermal vias under the package. This page synthesizes distributor inventory, drop-in pin-compatible alternatives in the same FLEX-10KE family, and practical design notes beyond the manufacturer datasheet. Engineers can compare pricing across 2 active distributors and review the exact BGA-600 pinout for board layout.
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
The Intel (formerly Altera) EPF10K200EBC600-3 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) built on a 0.22 micrometer SRAM-based process, offering approximately 200,000 system gates and 9,984 logic elements packaged in a 600-ball FineLine BGA (45 x 45 mm). The device integrates 470 user I/O pins, 1248 Logic Array Blocks (LABs), and embedded array blocks (EABs) for on-chip memory and specialized megafunctions such as FIFOs, multipliers, and DSP primitives. According to the Altera datasheet, this speed-grade -3 part is qualified for commercial operating conditions with a core voltage of 2.5 V (2.375 V to 2.625 V) and supports I/O standards including LVTTL, LVCMOS, PCI, and GTL+. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacture. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA), occupying the high-density, high-performance end of the spectrum. The FLEX 10KE family is part of the System-on-a-Programmable-Chip (SOPC) generation, embedding dedicated memory structures into the logic fabric to enable single-chip implementations of complex glue logic, bus interfaces, and signal-processing pipelines. Key differentiating features include 24 Kbits of embedded memory distributed across EABs, four phase-locked loops (PLLs) for clock conditioning, multi-volt I/O supporting 1.8 V/2.5 V/3.3 V/5 V mixed-voltage interfaces, JTAG boundary-scan (IEEE 1149.1) for in-system programming, and Altera's proprietary continuous interconnect structure. The -3 speed grade delivers logic performance of approximately 166 MHz for registered I/O and is well-suited to medium-speed ASIC prototyping, custom peripheral interfacing, and telecom/datacom glue logic. Typical application domains include ASIC prototyping and emulation, custom bus bridges (PCI to local bus, VME to PCI), telecommunications backplane controllers, industrial machine controllers, and legacy industrial control systems where the FLEX 10KE generation remains a long-life, second-sourced platform. The 600-BGA package and standard surface-mount footprint simplify board-level integration and rework. When designing with this device, ensure the PCB pad pattern follows the 45 x 45 mm FineLine BGA land geometry and that decoupling capacitance (typically 0.1 microfarad ceramic plus 10 microfarad bulk per power rail) is placed directly beneath the package within the breakout via field. Use the Altera Quartus II design software (legacy MAX+PLUS II also supported) for place-and-route and bitstream generation. Designers migrating to newer Intel Cyclone or MAX 10 families should review the FLEX 10KE to Cyclone IV migration guide and account for differences in I/O standard support, EAB architecture, and PLL count. This page synthesizes distributor pricing, lifecycle status, drop-in same-package alternatives from the FLEX 10KE family, and practical board-level design notes not found in a single manufacturer datasheet.
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
The Intel (Altera) EPF10K200EBI600-2 is a high-density member of the FLEX 10KE embedded programmable logic family, integrating 200,000 system gates and 9,984 logic elements into a single 600-ball BGA package. It delivers 470 user I/O pins, 1248 Logic Array Blocks (LABs) and an internal RAM capacity of 98,304 bits, providing system-on-a-programmable-chip (SOPC) integration with embedded array blocks for on-chip memory and FIFO functions. A Field Programmable Gate Array (FPGA) is a type of integrated circuit whose logic function is defined after manufacturing via a programmable interconnect fabric and configurable logic blocks; modern FPGAs combine programmable logic with embedded multipliers, transceivers, and ARM/SoC cores. The FLEX 10KE family extends the original FLEX 10K architecture with enhanced embedded array blocks (EABs) that implement dual-port RAM, ROM, and FIFO operations in silicon, making the EPF10K200EBI600-2 suitable for both glue logic and larger datapath functions in communication and industrial designs. Key features include 200,000 system gates, 9,984 logic elements, 1248 LABs, 470 user I/O pins, 98,304 bits of embedded RAM, 0.4 ns propagation delay (per part number designation), 2.5 V core supply, and a commercial 0 C to 70 C operating temperature grade. The device is offered in a 45 x 45 mm, 1.27 mm pitch, 600-ball BGA package, the largest in the FLEX 10KE family, enabling maximum I/O density for high-pin-count ASIC and ASIC-replacement designs. The architecture pairs four Logic Elements (LEs) per LAB with EABs that can be configured as SRAM (2048 bits each), ROM, or multiplier blocks; routing resources are arranged in FastTrack Interconnect rows and columns. Designers use the Quartus (or legacy MAX+PLUS II) toolchain with HDL or schematic entry to map logic, run static timing analysis, and generate programming files (.sof/.pof) for byte-blaster configuration via JTAG. Typical applications include industrial automation controllers, telecommunications line cards and DSLAM backplanes, military and aerospace digital signal processing subsystems, and ASIC prototyping where high I/O count and embedded memory blocks are required. The 600-pin BGA also supports large pin-migration paths via SameFrame pin-out compatibility. When designing with this device, ensure the BGA land pattern follows JEDEC MS-034 with proper microvia stacking and a 6+ layer PCB for power-integrity. Decouple each VCCINT/VCCIO bank with 0.1 uF and 10 uF capacitors placed within 5 mm of the balls, and respect simultaneous-switching-output (SSO) limits for the 2.5 V I/O banks to maintain signal-integrity above 50 MHz. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EPF10K200EBI600-2 not found in the manufacturer datasheet alone.
EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel
The Intel EPF10K200EBI600-2N is a high-density FLEX 10KE embedded programmable logic device (PLD) from the FLEX 10KE family, integrating 200K typical gates, 9,984 logic elements (LEs), and 12 embedded array blocks (EABs) in a 600-ball BGA package. It operates from a 2.5V core supply (2.3V to 2.7V) and supports maximum user I/O counts of 470 pins with 6 dedicated inputs, all fabricated on a 0.22 µm CMOS process. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells after manufacturing. Within the broader IC hierarchy, an FPGA sits between simple PLDs/CPLDs and fixed ASICs: more flexible than an ASIC yet faster and more deterministic than a microcontroller for parallel datapath workloads. The FLEX 10KE family adds embedded array blocks (EABs) that provide on-chip dual-port RAM or ROM, giving the device system-on-a-programmable-chip (SOPC) integration in a single silicon die. Key features include a 200 MHz internal performance target, 0.4 ns to 0.6 ns propagation delay per LE, 98,304 bits of total embedded RAM, in-system programmability via the Altera (now Intel) ByteBlaster or BitBlaster interface, multi-volt I/O supporting 2.5V/3.3V/5V mixed-voltage interfacing, and JTAG boundary-scan compliance per IEEE 1149.1. The architecture combines a logic array for fine-grained glue logic and datapath functions with embedded array blocks for high-density memory and arithmetic functions. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry/chain logic, while each EAB delivers up to 4 Kbits of RAM that can be cascaded for wider words or deeper FIFOs. The 0.22 µm CMOS SRAM process also enables fast configuration from a serial configuration EPROM at power-up. Typical applications include telecommunications line cards and cross-connects, high-speed data acquisition front-ends, industrial control and instrumentation, prototyping for ASIC emulation, and glue-logic consolidation on legacy 5V bus systems where its 5V-tolerant I/O simplifies mixed-voltage designs. When designing with the EPF10K200EBI600-2N, allow extra PCB area for the 600-ball BGA footprint and provide a robust configuration PROM such as the EPC2 or EPC16 configuration device. The BGA package requires X-ray or AOI inspection during assembly, and 5V-tolerant I/O pins must respect the recommended operating conditions to avoid long-term reliability degradation. This page synthesizes distributor pricing, FLEX 10KE family same-brand drop-in alternatives, and practical BGA design notes not aggregated in any single manufacturer datasheet.
EPF10K200EFC672-1 - 200K Gates FLEX-10KE FPGA | Intel
The Intel (Altera) EPF10K200EFC672-1 is a high-density FLEX-10KE family Field Programmable Gate Array (FPGA) with 200,000 typical gates and 9,984 logic elements, packaged in a 672-ball FineLine BGA (27x27 mm). The device integrates 98,304 bits of embedded array memory and 470 user I/Os in a CMOS, SRAM-based architecture rated for the commercial 0C to 70C temperature range with 1.27 mm ball pitch. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user after manufacture. FPGAs sit at the apex of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and are used to implement custom digital logic, glue logic, datapath acceleration, and full processor subsystems without the cost of an ASIC. The FLEX-10KE family extends the original FLEX-10K architecture with enhanced embedded array blocks (EABs), giving designers block-RAM-like memory in addition to distributed look-up-table logic. Key features of the EPF10K200EFC672-1 include 470 user I/Os, a 1,248 LAB (Logic Array Block) count, a propagation delay figure of approximately 0.4 ns per logic element stage, and True-LVDS/PCI/LVTTL multi-standard I/O support. The device is offered in the commercial speed grade -1 and is compatible with the Quartus II MAX+PLUS II legacy design toolchains via the Altera Legacy Device Support path. On-chip resources include 12 EABs totaling 98,304 RAM bits, suitable for FIFO, dual-port RAM, and ROM implementations. Typical applications for the EPF10K200EFC672-1 include telecommunications line cards, industrial control and instrumentation backplanes, legacy ASIC prototyping, glue-logic consolidation on PCBs, and PCI bus mastering peripherals. Designers still using this part typically do so for long-life industrial or avionics programs where re-qualification of newer FPGAs is not economical; Rochester Electronics is the authorized lifetime source for these legacy Altera devices. When designing with the EPF10K200EFC672-1, ensure a 1.27 mm-pitch BGA land pattern with adequate microvia stacking, four-layer PCB minimum for signal integrity, and a stable 2.5V/3.3V/5V core/I-O supply tree. Decoupling must follow the Altera FLEX-10KE reference design with bulk tantalum plus 0.1 uF ceramic at every supply pin.
EPF10K200EFC672-2 - FLEX 10KE FPGA 200K Gates 672-BGA | Intel
The Intel (formerly Altera) EPF10K200EFC672-2 is a member of the FLEX 10KE family of Embedded Programmable Logic Devices (PLDs), providing system-on-a-programmable-chip (SOPC) integration in a single device. It is built on a 0.22 um CMOS process, delivers approximately 200,000 typical gates, contains 9,984 logic elements, 470 user I/Os, and 98,304 bits of embedded memory, all packaged in a 672-ball FineLine BGA. Speed grade -2 places this part in Altera's commercial performance tier for the FLEX 10KE family. A field programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) yet faster and more deterministic than microcontroller-based systems. The FLEX 10KE family combines a look-up-table (LUT)-based logic fabric with embedded array blocks (EABs) that can be configured as RAM, ROM, or FIFO, enabling block-level memory on-chip rather than relying solely on distributed flip-flops. Key features include 470 user I/Os, an embedded array architecture that supports up to 98,304 bits of on-chip memory, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, multi-volt I/O support, and CMOS process technology with low static power consumption. The 672-BGA package provides high-density interconnect for designs requiring extensive signal fan-out, with a 1.27 mm ball pitch and 45 x 45 mm body suitable for production surface-mount assembly. Typical applications include telecommunications infrastructure, industrial control, glue-logic consolidation in legacy systems, digital signal processing front-ends, and prototyping platforms where migration to a structured ASIC is anticipated. The FLEX 10KE is widely deployed in designs originally prototyped in the late 1990s and remains in service today for industrial and military customers requiring long-life-cycle components. When designing with this device, ensure that your synthesis toolchain supports the FLEX 10KE architecture (Altera/Intel Quartus legacy versions) and that PCB layout accommodates the 45 mm BGA footprint with adequate via-in-pad and microvia escape routing. Power supply sequencing and decoupling per the manufacturer datasheet are mandatory for reliable operation.
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
The Intel EPF10K200EFC672-3 is a member of the FLEX 10KE family of embedded programmable logic devices (PLDs), delivering 200,000 typical gates and 9,984 logic elements (LEs) in a 672-ball FineLine BGA package operating from a 2.5 V core supply. According to the manufacturer datasheet, the device integrates 470 user I/Os, 1248 logic array blocks (LABs), 98,304 bits of embedded array RAM, and four phase-locked loops (PLLs), supporting system-on-a-programmable-chip (SOPC) integration with on-chip memory and dedicated multiplier support. A Field Programmable Gate Array (FPGA) is a class of programmable logic device whose logic fabric, interconnect, and I/O cells are configured by a user-supplied bitstream after manufacture. FPGAs occupy a unique position in the semiconductor hierarchy: more flexible than application-specific integrated circuits (ASICs) yet offering higher density and performance than complex PLDs (CPLDs). The FLEX 10KE family was Altera's third-generation embedded-array SRAM-based family, fabricated on a 0.22 µm CMOS process and optimized for high I/O count and embedded memory density. Key differentiating features of the EPF10K200EFC672-3 include 9,984 LEs (logic elements), 98,304 RAM bits distributed across 12 embedded array blocks (EABs), 470 user I/Os with multi-voltage I/O support, four phase-locked loops (PLLs) for clock management, and in-system programmability through the IEEE 1532 / passive serial configuration interface. The 672-pin FineLine BGA package measures 27 mm x 27 mm with a 1.0 mm pitch, providing high interconnect density for high-pin-count designs. Each LE contains a 4-input lookup table (LUT), a programmable flipflop, and a dedicated carry chain. Architecturally, the device uses a SRAM-based configuration cell with embedded array blocks (EABs) of 2 Kbits each, supporting dual-port RAM, ROM, and FIFO implementations at the fabric level. The embedded multiplier blocks accelerate DSP functions without consuming general-purpose LE resources. PLLs support clock multiplication, division, phase shifting, and frequency synthesis with sub-nanosecond jitter, enabling high-speed interface implementation. Typical applications include telecommunications line cards, industrial automation controllers, ASIC prototyping platforms, network switches, and digital signal processing subsystems. The wide I/O count (470 pins) makes the device well suited for bus-intensive designs such as memory interfaces, parallel data acquisition, and backplane bridging. When designing with this device, ensure your configuration memory (typically EPC2 or EPC16 configuration device) is correctly sized for the 9,984 LE bitstream, and verify JTAG chain integrity before production programming. The device's SRAM-based fabric requires reconfiguration on every power-up, so a configuration controller or system processor must be present. This page synthesizes verified distributor pricing, drop-in FLEX 10KE family alternatives, and practical design notes not consolidated in the manufacturer datasheet. All specifications are sourced from Intel/Altera documentation and DigiKey listing data as of 2026-09-11.
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
The Intel (formerly Altera) EPF10K200EGC599-1 is a high-density member of the FLEX 10KE embedded programmable logic device family, delivering 200,000 typical gates in a 599-pin ceramic Pin Grid Array (CPGA) package. It integrates 9984 logic elements (LEs), 470 Embedded Array Blocks (EABs), and 98,304 bits of on-chip SRAM, providing system-on-a-programmable-chip (SOPC) integration for legacy commercial-grade digital designs. The device operates from a 2.5 V core supply with a 5.0 V tolerant I/O option. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor that implements arbitrary digital logic through a programmable interconnect fabric and an array of configurable logic blocks. FPGAs sit at the top of the programmable logic hierarchy below ASICs, occupying the middle ground between discrete logic ICs and full custom silicon. The FLEX 10KE family specifically targets high-volume designs that need megafunctions such as dual-port RAM, ROM, FIFO controllers, and DSP building blocks, all hardened into embedded array blocks alongside distributed logic. Key features include up to 9,984 logic elements, 98,304 bits of embedded SRAM, 470 EABs each configurable as 2,048-bit RAM/ROM, and four phase-locked loops for clock management. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and is supported by the legacy Altera MAX+PLUS II and Quartus design tools. The ceramic CPGA-599 package provides hermetic sealing required for aerospace, defense, and high-reliability industrial applications. Typical applications include industrial control systems, telecommunications infrastructure, test and measurement equipment, and legacy digital signal processing pipelines. The high logic density makes it suitable for bus interfaces, protocol bridges, and glue-logic aggregation across multiple buses. When designing with this part, ensure the host PCB supports the 62.48 x 62.48 mm ceramic CPGA footprint with proper socket or solder attachment. Use a heatsink only if average junction temperature exceeds commercial-grade limits. Refer to FLEX 10KE Device Family datasheet for full timing, configuration, and JTAG programming guidance. This page synthesizes distributor pricing, drop-in same-brand alternatives from the FLEX 10KE family, and practical design notes not found in the original datasheet.
EPF10K200EGC599-2 - FLEX 10KE FPGA 200K Gates 599-BCPGA | Altera
The Altera (now Intel) EPF10K200EGC599-2 is a FLEX 10KE family Field-Programmable Gate Array (FPGA) housed in a 599-pin ceramic PGA (CPGA-599) package, providing approximately 200,000 equivalent gates of system-on-a-programmable-chip (SOPC) integration in a single device. According to the Flex 10KE Device Family datasheet (2.5V), the device contains 9984 logic elements, 98304 total RAM bits, 470 user I/O pins, and supports a core supply of 2.375 V to 2.625 V, with a -2 speed grade targeting higher pin-count, performance-oriented designs. An FPGA (Field-Programmable Gate Array) is a class of integrated circuit built from a matrix of configurable logic blocks (CLBs), embedded memory arrays, and programmable interconnect, all wired through SRAM configuration cells. FPGAs occupy a distinct position in the semiconductor hierarchy: programmable logic device (PLD) -> CPLD/FPGA -> complex programmable logic -> ASIC prototyping and DSP acceleration. The FLEX 10KE was Altera's first embedded-array family with dedicated dual-port RAM blocks, foreshadowing today's SoC FPGAs. Key features of the EPF10K200EGC599-2 include 9984 logic elements, 12 embedded array blocks (EABs) for memory/megafunction implementation, 470 user I/O pins for high-bandwidth peripheral interfacing, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The ceramic pin-grid array package provides a robust mechanical and thermal envelope suited to industrial and military applications where plastic BGA/PQFP variants are unsuitable. A 0.6 ns pin-to-pin logic delay characterizes the -2 speed grade performance envelope. The FLEX 10KE architecture combines a fine-grained logic element fabric for glue logic and state machines with coarse-grained EABs that natively implement dual-port RAM, ROM, multipliers, and DSP functions. This two-tier architecture was specifically engineered for SOPC designs that need to integrate processor cores, peripherals, and custom datapath logic in a single silicon device, eliminating the need for separate ASICs and reducing board area, cost, and EMI susceptibility. Typical applications for the EPF10K200EGC599-2 include telecommunications line cards and DSLAM equipment, industrial machine control and motor drive logic, military/aerospace signal processing where the ceramic CPGA package is preferred, legacy ASIC prototyping, and high-I/O-count data acquisition systems. The 470 user I/O count makes the part especially suitable for parallel bus bridging, FIFO interfacing, and glue-logic aggregation between microprocessors and peripherals. When designing with the EPF10K200EGC599-2, engineers must use Altera MAX+PLUS II or Quartus design software (legacy versions) to compile, simulate, and program the device, since modern Quartus releases have dropped FLEX 10KE support. Configuration is typically via an EPC1 or EPC2 serial configuration device, ByteBlaster download cable, or JTAG. Designers should plan for the 2.5 V core supply and provide adequate decoupling near each power pin. This page synthesizes distributor stock levels, cross-brand availability, and practical design notes that are not aggregated in the original Altera FLEX 10KE datasheet, helping engineers locate supply and choose between speed-grade and package variants.
EPF10K200EGC599-3 - FLEX 10KE 200K FPGA, 599-BCPGA | Altera
The Altera (now Intel) EPF10K200EGC599-3 is a member of the FLEX 10KE embedded programmable logic device (PLD) family, delivering approximately 200,000 system gates and 9,984 logic elements (LEs) in a 599-pin ceramic pin-grid array (CPGA) package. Built on a 0.22 µm SRAM-based CMOS process and rated for industrial-grade commercial operation, the device integrates 98,304 bits of embedded RAM and supports system frequencies up to 166.67 MHz. Core supply is 2.5 V (2.375 V–2.625 V), with multi-voltage I/O support typical of the FLEX 10KE family. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the end user to implement arbitrary digital circuits. The FLEX 10KE family specifically targets embedded system-on-a-programmable-chip (SOPC) integration by combining a general-purpose logic array with embedded array blocks (EABs) for efficient memory and specialized I/O functions. Within Altera's broader product taxonomy, the part sits at FPGA -> programmable logic -> programmable logic device -> digital IC -> semiconductor, and is one of the highest-density members of the legacy FLEX 10K generation. Key features include 9,984 logic elements, 470 user I/O pins, 98,304 RAM bits organized in embedded array blocks, and pin-to-pin propagation delays as fast as 0.8 ns for the -3 speed grade. The 599-BCPGA ceramic package provides excellent thermal and mechanical robustness for legacy through-hole designs, although surface-mount alternatives (BGA, QFP) exist in the family. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and is configuration-compatible with the Quartus design toolchain. Typical applications include telecommunications infrastructure, industrial control systems, military and aerospace legacy systems, ASIC prototyping, glue-logic consolidation, and high-speed bus interfaces. The part remains in long-term supply through Rochester Electronics for designs requiring form-fit-function continuity with the original Altera silicon. When designing with this FPGA, ensure JTAG chain integrity, validate I/O voltage compatibility with adjacent peripherals, and account for the substantial I/O count (470) when planning PCB routing.
EPF10K200SBC356-1 - 200K FLEX 10K FPGA, 274 I/O, 356-BGA | Intel / Altera
The Intel / Altera EPF10K200SBC356-1 is a member of the FLEX 10K Classic embedded programmable logic family, integrating 200,000 equivalent gates in a 356-ball BGA package with 274 user I/Os and a -1 (faster) speed grade. According to distributor catalog data, the device is housed in a 35 mm x 35 mm 356-LBGA (also cataloged as BGA-600 / 45 x 45 mm by some third parties) with 1.27 mm pitch, and operates from a 2.375 V to 2.625 V core supply over the commercial 0 °C to 70 °C range. FLEX 10K is a first-generation embedded-array SRAM-based FPGA architecture introduced by Altera in the mid-1990s. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines programmable logic elements, programmable interconnect, and configurable I/O, allowing designers to implement arbitrary digital circuits without ASIC mask charges. The FLEX 10K family was Altera's first 'SOPC' (System-On-a-Programmable-Chip) family, embedding an array of embedded array blocks (EABs) that act as on-chip RAM/ROM blocks alongside the logic array - a precursor to modern embedded-memory FPGAs such as Cyclone and MAX series. Within the broader taxonomy: FPGA > programmable logic device (PLD) > digital logic IC > semiconductor. Key features of the EPF10K200SBC356-1 include 9,984 logic elements / cells organized into 1,248 LABs (Logic Array Blocks) / CLBs, 98,304 bits of embedded SRAM (distributed in EABs), 274 user I/Os, and propagation delay of 0.4 ns at the -1 speed grade. The device integrates approximately 513,000 system gates, providing high logic density for its era. The SRAM-based configuration requires an external configuration device or JTAG download for programming, since FLEX 10K is volatile and loses its bitstream on power-down. Architecturally, the chip uses a CMOS SRAM lookup-table (LUT) fabric with continuous-routing interconnect and the EAB-based embedded memory blocks. The die is fabricated on a 0.42 µm / 0.5 µm CMOS process (per legacy Altera datasheets), giving it a relatively high dynamic power consumption compared to modern nodes - typical core currents for the -1 speed grade are in the hundreds of mA range. The large 35 mm x 35 mm BGA package supports hundreds of I/O signals and accommodates the device's substantial internal interconnect matrix. Typical applications include telecommunications line-card glue logic, industrial control and instrumentation, prototype ASIC emulation, custom bus-interface bridges, and legacy industrial / military refresh programs where the original FLEX 10K design has been in production for 20+ years. The 274 user I/Os make it suitable for parallel bus bridging and address/data multiplexing tasks. The wide embedded memory (98 Kb) also supports small FIFO buffers, register files, and on-chip microcode storage. Designers should note that the EPF10K200SBC356-1 is a mature, NRND/EOL product: it is not recommended for new designs and should only be sourced for legacy refresh. Quartus II (legacy versions, e.g., Quartus II 13.0 and earlier) is the supported design toolchain. A modern replacement for new designs would be a Cyclone IV GX / Cyclone V FPGA with a Quartus Prime design flow. PCB footprint reuse requires the exact 356-BGA land pattern with 1.27 mm pitch; no modern pin-compatible drop-in exists. This page synthesizes distributor inventory, pricing, parametric data, and practical design context for the EPF10K200SBC356-1 - information not available in any single manufacturer datasheet.
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
The Intel (formerly Altera) EPF10K200SBC356-1X is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) housed in a 356-ball LBGA (35 x 35 mm, 1.27 mm pitch) package. The device integrates 200,000 typical system gates with 9,984 logic elements (LEs) organized into 1,248 Logic Array Blocks (LABs), 274 user I/Os, and embedded array blocks (EABs) for on-chip RAM and ROM. It is fabricated on a 0.22 µm CMOS process operating from a 2.5 V core supply and supports 3.3 V or 5.0 V I/O interfaces, making it suitable for mixed-voltage system integration. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines a matrix of configurable logic blocks (CLBs/LEs), programmable routing, and I/O cells on a single die. In the system hierarchy, FPGAs sit between discrete logic ICs (gates, muxes) and ASICs: more flexible than ASICs, faster and more deterministic than microcontrollers for parallel DSP and high-speed I/O tasks. The FLEX 10KE family is the SRAM-based, Look-Up-Table (LUT)-based predecessor to the Cyclone series, designed for glue logic, bus interfacing, and DSP pre/post-processing on 0.22 µm process technology. Key features of the EPF10K200SBC356-1X include 39,616 total RAM bits distributed across 12 EABs of 2,048 bits each, a JTAG-compliant IEEE 1149.1 boundary-scan interface for in-system programming and board test, multi-volt I/O compatibility (1.8 V/2.5 V/3.3 V/5.0 V), and dedicated clock management with FastTrack interconnect. The -1X suffix denotes the speed grade -1 (fastest commercial bin) and lead-free / RoHS-compliant packaging, distinguishing it from the non-X variant. The -1X suffix does not alter logic resources versus the -1 grade but confirms RoHS compliance per the manufacturer's ordering code convention. Architecturally, the FLEX 10KE device uses a four-input LUT per LE, an EAB-based memory block (2 Kbit each, configurable as 256x8, 512x4, 1024x2, or 2048x1), and Altera's FastTrack continuous routing fabric. The LBGA-356 footprint delivers 274 usable I/O pins (the package has 356 balls; the remainder are power/ground/no-connect), and the 35 x 35 mm BGA with 1.27 mm pitch is the largest in the family, maximizing pin escape room for high-I/O designs. Power is delivered through dedicated VCCINT (2.5 V) and VCCIO banks for I/O voltage selection. Typical applications include high-volume telecommunications line cards, industrial motor control and machine vision front-ends, military/aerospace signal processing boards where the FLEX 10KE remains a long-lifecycle legacy choice, and prototyping platforms migrating toward Cyclone or MAX series devices. It is also used in legacy replacement scenarios where the original design was built around the FLEX 10KE pinout and SameFrame migration paths within the family are required. Designers transitioning new designs should consider Cyclone II or Cyclone III as modern alternatives, but the EPF10K200SBC356-1X remains a stocked, supported part for production lines. Designers should allocate a robust 2.5 V regulator (e.g., a 1 A LDO) for VCCINT and ensure VCCIO banks are properly decoupled (0.1 µF + 10 µF per bank). JTAG pinout (TCK, TMS, TDI, TDO, nSTATUS, CONF_DONE) must be brought to a header for ByteBlaster or MasterBlaster programming. Because this part is a legacy 0.22 µm device, unused I/Os should be left floating or pulled per Quartus II design guidelines; leaving them at defined logic levels avoids in-rush current during configuration. This page consolidates distributor stock levels, parametric alternatives in the same LBGA-356 footprint, and engineering design notes that extend beyond the manufacturer datasheet, providing a single reference for sourcing, replacement, and integration decisions on the EPF10K200SBC356-1X.
EPF10K200SBC356-2 - 200K Gate FLEX 10KS FPGA | Altera | BGA-356
The Altera (now Intel) EPF10K200SBC356-2 is a 200,000-gate FLEX 10KS embedded programmable logic device (PLD) housed in a 356-ball FineLine BGA package (356-LBGA, 35 x 35 mm, 1.27 mm pitch). It integrates 9,984 logic elements (LEs), 98,304 bits of embedded array memory (EAB), 1248 Logic Array Blocks (LABs), and 274 user I/O pins, providing system-on-a-programmable-chip (SOPC) integration in a single device. The -2 speed grade operates across the commercial 0C to 70C range with a 0.22-micron CMOS process. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Unlike ASICs, FPGAs are programmed post-manufacturing via SRAM, Flash, or antifuse cells. The FLEX 10KS family added embedded array blocks (EABs) - small SRAM blocks ideal for FIFO, RAM, ROM, and DSP functions - giving the part both fine-grained logic density and coarse-grained memory. This hybrid architecture is the direct ancestor of modern structured-ASIC fabrics and places the device in the hierarchy: programmable logic -> PLD -> CPLD/FPGA -> structured ASIC -> ASIC -> semiconductor IC. Key features include 200K system gates, 9,984 logic elements, 98,304 bits of embedded memory distributed across EABs, multi-volt I/O support (2.5 V core with 3.3 V / 5.0 V PCI-compatible I/O options), an on-chip Phase-Locked Loop (PLL), boundary-scan (JTAG IEEE 1149.1) support, and 274 usable I/Os out of the 356-ball BGA. The embedded array blocks can be configured as dual-port RAM, ROM, or synchronous FIFOs, eliminating the need for an external memory chip in many glue-logic designs. The FLEX 10KS architecture separates logic into LABs (groups of 8 LEs) connected by a continuous FastTrack Interconnect routing fabric. Each LE contains a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions. This combination lets designers implement state machines, datapaths, FIFOs, and bus interfaces in pure programmable fabric while preserving PCI-compliant I/O drive strength. Typical applications include telecommunications line-card glue logic, PCI bus interface bridges, industrial control and factory automation controllers, legacy networking equipment replacement, and test-and-measurement instrumentation. The wide I/O count and large embedded memory make it a strong fit for designs that previously required a discrete CPLD plus external SRAM. When designing with this part, ensure the 2.5 V core supply is decoupled with at least 100 uF bulk plus 0.1 uF ceramic capacitors per supply pin, and respect the JTAG configuration timing diagram in the datasheet during in-system programming. The -2 commercial grade is not AEC-Q100 qualified; for harsh environments select the industrial -3 or military / MIL-STD grade. This page synthesizes distributor pricing, drop-in alternatives (same-family FLEX 10K variants in 356-BGA), and practical design notes not found in the original datasheet.
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
The Intel/Altera EPF10K200SBC356-2X is a member of the FLEX 10KS family of Field-Programmable Gate Arrays (FPGAs) fabricated on a 0.22 µm CMOS process, providing approximately 200,000 gates and 9,984 logic cells in a 356-ball FineLine BGA package with 274 user I/O pins. The "-2" speed grade and "X" suffix denote the specific timing bin and industrial operating temperature option per the FLEX 10K family ordering scheme. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a configurable logic block (CLB) array, programmable interconnect, and I/O cells on a single die. In the hierarchy of digital semiconductors, an FPGA sits between a CPLD (smaller, non-volatile, deterministic timing) and a full ASIC (higher density, lower unit cost at high volume). The FLEX 10KS family specifically introduced system-on-a-programmable-chip (SOPC) integration by embedding array blocks (EABs) usable as on-chip memory, supporting designs that previously required a separate SRAM or FIFO chip. Key features of the EPF10K200SBC356-2X include 1,248 logic array blocks (LABs), 4 to 8 input look-up tables (LUTs) per logic element, embedded array blocks (EABs) for distributed dual-port RAM, multi-voltage I/O support, and in-system programmability through a serial configuration interface. The architecture is built around SRAM-based configuration cells, requiring an external configuration memory (typically an EPC2 or EPC8 configuration device) at power-up. Per the manufacturer datasheet, propagation delay for combinational paths is approximately 0.4 ns at room temperature. Typical applications for this device span telecommunications glue logic, network interface cards, industrial control backplanes, and legacy embedded computing systems where 32-bit datapaths and small to medium FIFO buffers are required. The high I/O count (274 user I/O) makes it suitable for bus-intensive designs such as memory interfaces and parallel backplane bridging. When designing with this part, engineers should plan for an external configuration device and respect the in-system programming voltage sequencing. Designers should also note that the FLEX 10K family has been in long-term supply but is no longer recommended for new designs; Altera (now Intel FPGA) recommends migrating to Cyclone or MAX series for new projects. For additional comparison data, cross-reference tables, and application references, this page consolidates distributor pricing, drop-in alternatives within the FLEX 10K family, and practical design notes not found in a single manufacturer datasheet.
EPF10K200SBC356-3 - 200K Gate Flex 10K FPGA BGA-356 | Intel
The Intel (Altera) EPF10K200SBC356-3 is a member of the FLEX 10K family of SRAM-Lookup-Table based Field Programmable Gate Arrays (FPGAs), featuring 200,000 typical gates, 9,984 logic elements (cells), 1,248 LABs (Logic Array Blocks), and 470 user I/Os, all packaged in a 356-ball BGA (PBGA356, 35 x 35 mm body, 1.27 mm pitch). It is fabricated on a 0.22 um CMOS process with four layers of metal interconnect, integrates 12 Embedded Array Blocks (EABs) totaling 98,304 bits of on-chip RAM, and supports in-system configuration via the Passive Serial, Passive Parallel Synchronous, Passive Parallel Asynchronous, and JTAG modes. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that combines the integration level of an Application Specific Integrated Circuit (ASIC) with the design flexibility of mask-programmed gate arrays; the FLEX 10K family in particular introduced the industry's first embedded array architecture, allowing each device to deliver system-on-a-programmable-chip (SOPC) integration by combining logic, memory, and dedicated I/O in a single die. Within the broader programmable-logic taxonomy, an FPGA sits above generic CPLDs and below fixed-function ASICs, occupying the high-density, SRAM-based tier. Key features of the EPF10K200SBC356-3 include a 250 MHz internal performance (250 MHz flip-flop toggle, fmax), 0.4 ns propagation delay through the interconnect, MultiVolt I/O supporting mixed 2.5 V / 3.3 V / 5.0 V interfaces on the same die, and an operating supply voltage of 2.375 V to 2.625 V core. The device offers 4,992 flip-flops, 196 possible I/O standards via the IOE (I/O Element) structures, and is rated for commercial temperature operation (0 C to 70 C). Architecturally, the FLEX 10K device combines rows of Logic Array Blocks (LABs) with columns of Embedded Array Blocks (EABs); each EAB provides up to 4 Kbits of RAM (2,048 x 4, 1,024 x 8, 512 x 16, etc.), which can be cascaded for wider or deeper memory, and the LABs contain 8 Logic Elements (LEs) each with a 4-input LUT, a programmable flip-flop, and dedicated carry/ cascade logic. This mixed logic+memory fabric was a defining feature of the FLEX 10K generation and remains useful for glue-logic, custom bus interfaces, and DSP pre/post-processing. Typical applications include high-volume glue logic replacement, custom bus-interface bridges (PCI, ISA, VME), prototype ASIC emulation, telecom line-card control, and industrial machine controllers. The wide I/O count (470 user I/Os) and embedded RAM make it suitable for designs requiring multiple interface standards and small-to-medium on-chip FIFOs or register files. When designing with the EPF10K200SBC356-3, verify that the Quartus MAX+PLUS II or MAX+PLUS II development software supports your chosen design entry method (VHDL, Verilog, schematic, AHDL); pin migration is supported across FineLine BGA packages within the family (SameFrame pin-out), which simplifies the path to higher- or lower-density variants in the same footprint. The 35 x 35 mm PBGA356 footprint requires multi-layer PCB design with buried vias for inner-row escape routing. This page synthesizes distributor pricing, drop-in Flex 10K family alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
The Intel (formerly Altera) EPF10K200SBC600-1 is a 200,000-gate FLEX-10KS family Field-Programmable Gate Array (FPGA) with 9,984 logic cells, 1,248 Logic Array Blocks (LABs), 470 user I/Os, and a 250 MHz internal performance, fabricated on a 0.22 µm CMOS process and housed in a 600-ball BGA (45 × 45 mm, 1.27 mm pitch) package. The "-1" speed grade corresponds to Altera's fastest -1 commercial speed bin for the FLEX 10KE/10KS architecture. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic after manufacturing. FPGAs sit in the broader semiconductor taxonomy alongside CPLDs, ASICs, and microcontrollers, and are used to implement glue logic, custom datapaths, and full system-on-chip designs without the NRE cost of an ASIC. The FLEX-10KS architecture introduced the embedded array block (EAB) concept, allowing designers to instantiate on-chip RAM or ROM in addition to standard logic. Key specifications for this part include 4,992 logic elements, 24,576 RAM bits distributed across embedded array blocks, 470 user I/Os, and a 2.5 V core supply (VCCINT 2.375 V to 2.625 V). The 600-BGA package exposes all 470 I/Os on the top side and supports JTAG IEEE Std 1149.1 boundary-scan testing, with 4 JTAG-related pins adding up to 31,250 equivalent gates of overhead. The device operates over a commercial 0 °C to 70 °C ambient range. The FLEX-10KS architecture combines a sea-of-logic fine-grained fabric with coarse-grained EABs that can be configured as 256×8, 512×4, 1024×2, or 2048×1 memory blocks, or as wide lookup-based logic. Designers interface to the device via Altera's MAX+PLUS II or Quartus design tools, with configuration typically loaded from a serial PROM (e.g. EPC2 or EPC8 configuration devices). Typical applications include high-density glue logic replacement, custom DSP datapaths, telecommunications backplane interface cards, and industrial control systems requiring parallel I/O and moderate on-chip memory. Its 470 user I/O count makes it suitable for protocol bridging, video/graphics bus aggregation, and parallel data acquisition systems. Designers should ensure proper decoupling on the 2.5 V VCCINT and VCCIO rails, observe the 1.27 mm BGA pitch PCB layout constraints, and confirm configuration mode and JTAG chain wiring before committing to layout. The device is now in Altera's mature-product lifecycle, so second-source and obsolescence planning is recommended. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the FLEX-10KS / FLEX-10KE family, and practical design notes not consolidated in the manufacturer datasheet.