10CL010ZM164I8G vs 10CL010YM164I7G Comparison
Detailed side-by-side comparison of 10CL010ZM164I8G by Intel and 10CL010YM164I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10CL010ZM164I8G | 10CL010YM164I7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $23.10 | $9.45 |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements | 10,320 | 10,320 |
| Embedded Memory | 423,936 bits (414 Kbits) | 423,936 bits (414 Kb) |
| Embedded 18x18 Multipliers | 46 | — |
| Maximum User I/O | 101 | — |
| Package | 164-ball MBGA (FineLine BGA, M164) | 164-ball MBGA (8 mm x 8 mm) |
| Operating Temperature | -40C to +100C (Industrial) | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage | 1.0 V (typical), 1.2 V I/O banks | — |
| Configuration Modes | PS, FPP, JTAG | JTAG, Active Serial (AS), Passive Serial (PS) |
| PLLs | 4 (per device, exact count [DATA_NEEDED: PLL count]) | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| External Memory Support | DDR2, DDR3, LPDDR2 (via soft IP) | — |
| RoHS Status | Compliant | Compliant |
| Packaging | Tray (I8G suffix) | — |
| Embedded 18 x 18 Multipliers | — | 23 |
| Maximum User I/O Pins | — | 101 |
| General-Purpose PLLs | — | 2 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (1.2 V nominal) |
| Operating Temperature Range | — | -40 °C to 100 °C (Industrial) |
| Mounting Type | — | Surface Mount (BGA) |
| I/O Signaling Standards | — | LVCMOS 1.2 V to 3.3 V, LVDS |
| Process Node | — | TSMC low-power process |
| MSL Level | — | 3 (per JEDEC J-STD-020, typical for BGA) |