10CL016YM164I7G vs 10CL010YM164I7G Comparison

Detailed side-by-side comparison of 10CL016YM164I7G by Intel and 10CL010YM164I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10CL016YM164I7G 10CL010YM164I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $12.95 $9.45
Family Cyclone 10 LP Cyclone 10 LP
Logic Elements 15,408 10,320
Adaptive Logic Modules (ALMs) 9,630 —
Embedded Memory 516,096 bits (56 M9K blocks of 9 Kbits) 423,936 bits (414 Kb)
Embedded 18x18 Multipliers 56 —
User I/O Pins 87 —
General-Purpose PLLs 4 2
Process Technology 60 nm low-power CMOS —
Package 164-ball MBGA (8x8 mm, 0.5 mm pitch) 164-ball MBGA (8 mm x 8 mm)
Operating Temperature Range -40C to +100C (industrial) -40 °C to 100 °C (Industrial)
Supply Voltage (Core) 1.0 V to 1.2 V (internal) —
I/O Bank Count 8 —
Configuration Modes Passive Serial (PS), Fast Passive Parallel (FPP), JTAG JTAG, Active Serial (AS), Passive Serial (PS)
Static Power (Typical) [DATA_NEEDED: typical static power mW at VCCINT=1.2V] —
Bitstream Encryption AES-256 supported —
RoHS Status Compliant Compliant
MSL Level 3 (per JEDEC J-STD-020) 3 (per JEDEC J-STD-020, typical for BGA)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Embedded 18 x 18 Multipliers — 23
Maximum User I/O Pins — 101
Core Supply Voltage (VCCINT) — 1.15 V to 1.25 V (1.2 V nominal)
I/O Signaling Standards — LVCMOS 1.2 V to 3.3 V, LVDS
Process Node — TSMC low-power process

Datasheets & Resources

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