10M08SAM153I7G vs 10M04SAM153I7G Comparison
Detailed side-by-side comparison of 10M08SAM153I7G by Intel and 10M04SAM153I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M08SAM153I7G | 10M04SAM153I7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.40 | $9.20 |
| Family | MAX 10 | MAX® 10 FPGA |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory (M9K blocks) | 378 Kbit | — |
| Maximum User I/O | 112 | — |
| DSP Blocks (18x18 multipliers) | 24 | — |
| Package | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch | 153-ball MBGA (Micro FineLine BGA) |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (industrial) |
| Speed Grade | I7 (industrial, 7) | — |
| On-die Flash Configuration | Yes (instant-on, dual-boot) | — |
| PLLs | 4 (periphery) | [DATA_NEEDED: PLL count] |
| Global Clocks | 20 | — |
| User Flash Memory (UFM) | Up to 736 Kbyte | — |
| ADC Block | 12-bit, 1 MSPS (1 hard IP block) | [DATA_NEEDED: ADC presence on this density] |
| Configuration Method | Internal flash, JTAG | On-die flash, instant-on |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| MSL Level | 3 (168 hours) | — |
| Series | — | MAX 10 (10M04) |
| Logic Elements (LEs) | — | 4,000 |
| Embedded Memory (bits) | — | 193,536 |
| User I/O Count | — | 112 |
| Process Technology | — | 55 nm (embedded flash, TSMC) |
| Core Voltage | — | 1.2 V |
| I/O Voltage Support | — | 3.0 V / 3.3 V LVCMOS |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| Multiplier Blocks (18×18) | — | [DATA_NEEDED: multiplier count] |
| User Flash | — | [DATA_NEEDED: user flash size] |
| Lead-Free | — | Yes |