10M50DAF484I7G vs 10M25DCF484A7G Comparison
Detailed side-by-side comparison of 10M50DAF484I7G by Intel and 10M25DCF484A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50DAF484I7G | 10M25DCF484A7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $58.20 | $62.50 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 25,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | — |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | — |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | 4 |
| Configuration Mode | Single-chip (no external boot device required) | — |
| Mounting Type | Surface Mount (FBGA) | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| RoHS Status | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: total Kbits, blocks count] |
| Embedded Block RAM | — | 1,728 Kbit |
| Multipliers (18x18) | — | 81 |
| Maximum User I/O | — | 360 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V (internal LDO) |
| Operating Temperature | — | -40C to +125C (automotive AEC-Q100) |
| Speed Grade | — | -7 |
| Configuration Type | — | Dual flash, internal |
| User Flash | — | 12 Kbit (32 Kbyte user flash; total device flash larger) |
| ADC Block | — | 12-bit, 1 MSPS, 17 channels |