5CSEBA6U19I7NTS vs 5CSEBA6U19C7SN Comparison

Detailed side-by-side comparison of 5CSEBA6U19I7NTS by Intel and 5CSEBA6U19C7SN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA6U19I7NTS 5CSEBA6U19C7SN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $46.25 $149.85
Product Type System-on-Chip FPGA (SoC FPGA) —
Series Cyclone V SE Cyclone V SE SoC FPGA
Logic Elements 110K 110,000
HPS Core Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 925 MHz —
FPGA Architecture Cyclone V SE, 28 nm low-power process —
Package 484-ball UBGA (19x19 mm) —
Operating Temperature -40C to +100C (Industrial, 'I7' speed grade) Industrial grade (per part number code)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level [DATA_NEEDED: MSL rating] —
RoHS Status Compliant Compliant
Lead-Free Yes Yes
Configuration Method SRAM-based, via Quartus Prime —
DSP Blocks [DATA_NEEDED: DSP block count] Variable-precision DSP blocks (Cyclone V architecture)
Memory Type DDR3/DDR3L with ECC support —
HPS Peripherals Gigabit Ethernet, USB 2.0 OTG, CAN, SPI, I2C, UART —
Device Family Cyclone V —
Family Variant SE (SoC FPGA with HPS) —
Family — 5CSEBA6 (Cyclone V SE, 110K LE)
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Clock Frequency — 800 MHz
User I/O Pins — 66 (FPGA fabric, per distributor listing)
Total Package Pins — 484
Package Type — 484-UBGA (Ultra BGA), 19x19 mm
FPGA Process Node — Low-power TSMC process
On-Chip Memory — Embedded SRAM (FPGA fabric)
Transceivers — Not enabled on this SE variant

Datasheets & Resources

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