900-13767-0000-0A0 vs 900-13767-0000-0A1 Comparison

Detailed side-by-side comparison of 900-13767-0000-0A0 by NVIDIA and 900-13767-0000-0A1 by NVIDIA. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 900-13767-0000-0A0 900-13767-0000-0A1
Brand NVIDIA NVIDIA
Category Wireless Modules Development Boards
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $499.00 $549.00
Product Type System-on-Module (SOM) —
AI Performance Up to 100 TOPS (INT8 sparse) 100 TOPS (INT8)
GPU 1024-core NVIDIA Ampere with 32 Tensor cores 1024-core NVIDIA Ampere with Tensor Cores
CPU 8-core ARM Cortex-A78AE 64-bit 8-core Arm Cortex-A78AE 64-bit
Memory 16 GB LPDDR5 16 GB LPDDR5
Memory Bandwidth 102.4 GB/s 102 GB/s
Storage External (via carrier board) External via carrier (no on-module eMMC)
Power Envelope 10 W to 25 W (configurable) —
Module Connector 260-pin SO-DIMM edge connector —
PCIe PCIe Gen 4 (x1/x2/x4 lanes available) PCIe Gen 4.0 x4
USB USB 3.2 Gen 2 —
Camera Interfaces Up to 6 MIPI CSI-2 lanes (2x4-lane or 4x2-lane) 2x MIPI CSI-2 (4-lane)
Display 1x HDMI 2.1 (via carrier) —
Networking 1x GbE (via carrier) —
Operating Temperature -25C to +80C (module) -25C to +80C (industrial modules vary)
Form Factor 69.6 mm x 45 mm SOM 70 mm x 45 mm (260-pin SO-DIMM connector)
Country of Origin USA —
TAA Compliance Yes (TAA/NDAA compliant) —
Software Support NVIDIA JetPack SDK, CUDA, TensorRT, DeepStream —
RoHS Status Compliant Compliant (NVIDIA Jetson module product page)
Module Type — System-on-Module (SOM)
Product Family — NVIDIA Jetson Orin NX
Video Decode — 2x NVDEC
Video Encode — 1x NVENC
Configurable TDP — 10 W to 25 W
TAA/NDAA Compliance — Yes (US Country of Origin)
COO Suffix — 0A1 = USA (0A0 = Taiwan, 000 = China per EMAC inc.)

Datasheets & Resources

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