A3PE3000L-1FG484 vs A3PE3000-1FGG484I Comparison

Detailed side-by-side comparison of A3PE3000L-1FG484 by Microchip Technology and A3PE3000-1FGG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE3000L-1FG484 A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FG484 ✓ Active
Microchip Technology
A3PE3000-1FGG484I A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology

A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology

A3PE3000-1FGG484I ✓ Active

Specification Comparison

Parameter A3PE3000L-1FG484 A3PE3000-1FGG484I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $280.54 $1,336.60
Family ProASIC3L (Flash FPGA) —
System Gates 3000000 3,000,000 (3M)
Logic Cells / CLBs 75264 —
Logic Elements (LEs) [DATA_NEEDED: LE count] —
User I/O 341 —
Embedded Memory 516096 bits —
Core Voltage 1.2 V to 1.5 V —
Speed Grade -1 -1
Package 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch 484-ball FBGA, 1.0 mm pitch (FGG484)
Mounting Type Surface Mount Surface Mount
Configuration Technology Flash (non-volatile, single-chip) —
Special Features Flash*Freeze technology, live reprogrammability —
RoHS Status Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) Compliant (FGG green package)
Operating Temperature [DATA_NEEDED: operating temperature range] 0 to 70 C (per Digchip listing; confirm I-grade limits)
Supply Voltage - I/O [DATA_NEEDED: I/O voltage range] —
Number of PLLs [DATA_NEEDED: PLL count] —
Package Height 2.23 mm —
Product Family — ProASIC3E
Logic Elements — 35,000
Embedded SRAM — 504 Kbits (516,096 bits)
User I/O (FGG484) — 341
Total Balls — 484
Logic Family — CMOS
Supply Voltage — 1.5 V
System Performance — 231 MHz
Process Technology — 130-nm, 7-layer metal (6 copper), flash-based CMOS
Max User I/O (Family) — 616

Datasheets & Resources

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