A3PE3000L-FG324 vs A3PE3000L-FGG324I Comparison

Detailed side-by-side comparison of A3PE3000L-FG324 by Microsemi and A3PE3000L-FGG324I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE3000L-FGG324I A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I ✓ Active

Specification Comparison

Parameter A3PE3000L-FG324 A3PE3000L-FGG324I
Brand Microsemi Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $62.65
Family ProASIC3EL (ProASIC3E Low Power) ProASIC3L (Flash FPGA)
System Gates 3000000 3,000,000
User I/O 221 221
Core Voltage 1.2 V (supports 1.2 V to 1.5 V) 1.2 V to 1.5 V
Process Technology 130 nm CMOS flash 130 nm CMOS
Package 324-ball FBGA 324-BGA FBGA (19x19 mm)
Configuration Memory On-chip flash (non-volatile, single chip) —
Mounting Type Surface Mount Surface Mount (SMD)
Max Reported Frequency (parameter listing) 781.25 MHz (per FindIC parameter data) —
RoHS Status RoHS Non-Compliant (contains lead, FG variant) RoHS Compliant
Lead Free Status Contains Lead (FG variant); choose FGG variant for lead-free Lead Free
Operating Temperature [DATA_NEEDED: Operating Temperature] -40C to +100C (industrial)
Embedded Memory [DATA_NEEDED: Embedded Memory] —
DLL/PLL Blocks [DATA_NEEDED: DLL/PLL Blocks] —
MSL Level [DATA_NEEDED: MSL Level] —
Programming Method In-system / on-board flash programming —
Total RAM Bits — 516096
Technology Features — Nonvolatile Flash, Instant On, Flash*Freeze
Configuration — Single-chip, no external boot PROM
Packaging — Tray
Number of Package Balls — 324

Datasheets & Resources

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