A3PE3000L-FGG324I vs A3PE3000-FGG324I Comparison

Detailed side-by-side comparison of A3PE3000L-FGG324I by Microchip Technology and A3PE3000-FGG324I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE3000L-FGG324I A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I ✓ Active
Microchip Technology
A3PE3000-FGG324I A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FGG324I ✓ Active

Specification Comparison

Parameter A3PE3000L-FGG324I A3PE3000-FGG324I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $62.65 $198.00
Family ProASIC3L (Flash FPGA) ProASIC3E (ProASIC3E Flash Family)
System Gates 3,000,000 3000000 gates
Total RAM Bits 516096 —
User I/O 221 —
Core Voltage 1.2 V to 1.5 V —
Process Technology 130 nm CMOS —
Package 324-BGA FBGA (19x19 mm) 324-BGA (FBGA/PBGA324), 19 x 19 mm
Mounting Type Surface Mount (SMD) Surface Mount
Operating Temperature -40C to +100C (industrial) -40 C to +125 C (Industrial, I grade)
Technology Features Nonvolatile Flash, Instant On, Flash*Freeze —
Configuration Single-chip, no external boot PROM —
Packaging Tray —
Lead Free Status Lead Free —
RoHS Status RoHS Compliant [DATA_NEEDED: RoHS status]
Number of Package Balls 324 —
Logic Elements (CLBs) — 75264
Total User I/O — 221
Embedded Memory — 516096 bits
Maximum Frequency — 350 MHz
Core Supply Voltage — 1.5 V
Technology — 130 nm CMOS, nonvolatile flash
Ball Pitch — 1 mm
Package Height — 1.63 mm
Configuration Memory — Nonvolatile flash, reprogrammable, Instant-On
Moisture Sensitivity Level — [DATA_NEEDED: MSL Level]

Datasheets & Resources

Browse All Products Create BOM Request Quote