A3PE600-2FGG484I vs A3PE600-1FG484I Comparison
Detailed side-by-side comparison of A3PE600-2FGG484I by Microchip Technology and A3PE600-1FG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-2FGG484I ✓ ActiveMicrochip Technology
A3PE600-1FG484I - 600K-Gate Flash FPGA, 270 I/O | Microchip
A3PE600-1FG484I ✓ ActiveSpecification Comparison
| Parameter | A3PE600-2FGG484I | A3PE600-1FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $48.60 |
| Family | ProASIC3E Flash FPGA | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Elements (CLBs) | 13824 | — |
| Number of Registers | [DATA_NEEDED: number of registers] | — |
| User I/Os (max, FG484) | 270 | — |
| Speed Grade | -2 | -1 |
| Core Supply Voltage | 1.5 V | 1.5 V |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Technology | 130 nm Flash CMOS | — |
| Max System Frequency | 231 MHz | — |
| Embedded Memory | Embedded flash family; 110592 (bits, per distributor listing) | — |
| Configuration Memory | On-chip flash (single-chip, non-volatile) | Flash-based (nonvolatile, Live-at-Power-Up Level 0) |
| Soft CPU Support | Optional soft ARM support | — |
| Package | FBGA-484 (PBGA484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) | 484-ball FBGA (PBGA484), 1.0 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range] |
| Terminal Form | Ball | — |
| Number of Terminals | 484 | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Packaging | Tray | — |
| Logic Cells (CLBs) | — | 13824 |
| User I/O | — | 270 |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Embedded Memory (family max) | — | Up to 504 kbits True Dual-Port SRAM |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height |
| Logic Family | — | CMOS |
| Single-Chip Solution | — | Yes (no external configuration device required) |