AFS600-1FGG256I vs AFS600-FG256I Comparison
Detailed side-by-side comparison of AFS600-1FGG256I by Microchip Technology and AFS600-FG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-1FGG256I - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FGG256I ✓ ActiveMicrochip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ ActiveSpecification Comparison
| Parameter | AFS600-1FGG256I | AFS600-FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Fusion mixed-signal FPGA | Fusion mixed-signal FPGA |
| System Gates | 600,000 gates | 600,000 gates |
| Logic Cells | 110,592 cells | — |
| User I/O | 119 I/O | 119 I/O |
| Supply Voltage | 1.5 V | 1.5 V |
| Operating Temperature | 0°C to 85°C | 0 C to 70 C |
| Junction Temperature Test | Up to 100°C | — |
| Package Type | FBGA-256, 1 mm pitch | 256-LBGA |
| Package Pin Count | 256 balls | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Metal Layers | 7 layers | 7 layers |
| Configuration Memory | Flash-based | Nonvolatile flash memory |
| Logic Family | CMOS | CMOS |
| Integrated Resources | Configurable analog, embedded flash memory, clock generation and management, and programmable logic | — |
| Device Description | Monolithic mixed-signal FPGA | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Configurable Logic Blocks | — | 13,824 CLBs |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Package Pitch | — | 1.0 mm |
| Number of Package Balls | — | 256 balls |
| Package Shape | — | Square |
| Mounting Type | — | Surface mount |