AFS600-1FGG256K vs AFS600-FGG256 Comparison
Detailed side-by-side comparison of AFS600-1FGG256K by Microchip Technology and AFS600-FGG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-1FGG256K - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256K ✓ ActiveSpecification Comparison
| Parameter | AFS600-1FGG256K | AFS600-FGG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Unknown |
| Product Type | Mixed-Signal Field-Programmable Gate Array (FPGA) | — |
| FPGA Family | Fusion | — |
| System Gates | 600,000 gates | 600,000 gates |
| User I/O | 119 I/O | — |
| Logic Cells | 13,824 CLBs | — |
| Supply Voltage | 1.5 V | 1.5 V |
| Logic Family | CMOS | CMOS |
| Package Type | 256-pin FBGA | 256-pin FBGA |
| Package Pitch | 1.0 mm pitch | 1.0 mm |
| Package Pin Count | 256 pins | — |
| Process Technology | 130 nm flash-based CMOS | 130 nm |
| Metal Layers | 7 layers | 7 layers |
| Configuration Memory | Nonvolatile flash | Flash-based nonvolatile memory |
| Power-Up Behavior | Live at power-up (LAPU) | — |
| Programmable Analog | Integrated configurable analog blocks | — |
| Clock Management | Integrated clock generation and management | — |
| Embedded Memory | Large integrated flash-memory blocks | — |
| Target Operating Temperature | -55 C to +100 C junction temperature | — |
| Mounting Type | Surface mount | Surface mount |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Cells | — | 13,824 cells |
| I/O Count | — | 119 I/Os |
| Configuration Feature | — | Live at Power-Up (LAPU) |
| Maximum Clock Frequency | — | 1098.9 MHz |
| Operating Temperature | — | 0°C to 70°C |
| Packing Media | — | Tray |
| RoHS | — | Compliant |