AFS600-2FGG256I vs AFS600-FGG256I Comparison
Detailed side-by-side comparison of AFS600-2FGG256I by Microchip Technology and AFS600-FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-2FGG256I - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG256I ✓ ActiveMicrochip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ ActiveSpecification Comparison
| Parameter | AFS600-2FGG256I | AFS600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Product Type | Fusion mixed-signal FPGA | — |
| Number of System Gates | 600K gates | — |
| Number of I/Os | 119 I/Os | — |
| Programmable Logic Type | Flash-based programmable logic | — |
| Configuration Memory | Nonvolatile flash | Nonvolatile flash |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Metal Layers | 7 layers | 7 layers |
| Integrated Resources | Configurable analog, large flash memory blocks, and clock generation and management | — |
| Package | 256-LBGA | — |
| Package Type | Square ball grid array | BGA-256 |
| Number of Package Balls | 256 balls | — |
| Temperature Grade | Industrial temperature | Industrial |
| Operating Temperature Range | -40 °C to +100 °C junction temperature | — |
| Core Supply Voltage | 1.425 V to 1.575 V | — |
| RoHS Status | RoHS Compliant | — |
| Lead-Free Status | Lead Free | — |
| Processor Support | Optional ARM support | — |
| Input Voltage | [DATA_NEEDED: Input Voltage] | — |
| Output Voltage | [DATA_NEEDED: Output Voltage] | — |
| Maximum I/O Frequency | [DATA_NEEDED: Maximum I/O Frequency] | — |
| Embedded Memory Capacity | [DATA_NEEDED: Embedded Memory Capacity] | — |
| Analog Block Count | [DATA_NEEDED: Analog Block Count] | — |
| System Gates | — | 600,000 gates |
| Device Type | — | Fusion mixed-signal FPGA |
| Power-Up Configuration | — | Live at Power-Up (LAPU) |
| System Performance Frequency | — | 350 MHz |
| Supply Voltage | — | 1.5 V |
| Logic Family | — | CMOS |
| Total Pin Count | — | 256 pins |
| Package Pitch | — | 1.0 mm |
| Package Form | — | Square |
| Terminal Type | — | Ball |
| Operating Temperature | — | 0°C to +70°C |
| Programmable Analog Resources | — | Configurable analog blocks |
| Embedded Flash | — | Large flash memory blocks |
| Clock Management | — | Comprehensive clock generation and management circuitry |
| Programming Interface | — | [DATA_NEEDED: programming interface] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Maximum I/O Current | — | [DATA_NEEDED: maximum I/O current] |
| Junction Temperature | — | [DATA_NEEDED: junction temperature rating] |