AFS600-2PQ208 vs AFS600-PQ208 Comparison
Detailed side-by-side comparison of AFS600-2PQ208 by Microchip Technology and AFS600-PQ208 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-2PQ208 - 95-I/O Fusion FPGA | Microchip | 208-BFQFP
AFS600-2PQ208 ✓ ActiveSpecification Comparison
| Parameter | AFS600-2PQ208 | AFS600-PQ208 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Unknown |
| Device Type | Fusion Field Programmable Gate Array (FPGA) | — |
| Programmable Elements | 110592 | — |
| User I/O Count | 95 | — |
| Package | 208-BFQFP | 208-pin PQFP |
| Manufacturer | Microsemi Corporation | — |
| Device Family | Fusion | — |
| Product Category | Programmable Logic IC | — |
| Mounting Type | Surface Mount | Surface mount |
| Supply Status | In stock at Heisener, 5072 pieces | — |
| DigiKey Availability | Buy now, ships today | — |
| Unit Price | [DATA_NEEDED: verified unit price] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory capacity] | Nonvolatile flash memory |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| DSP Block Count | [DATA_NEEDED: DSP block count] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Product Type | — | Fusion FPGA |
| System Gates | — | 600,000 equivalent gates |
| Logic Cells | — | 13,824 logic cells |
| Supply Voltage | — | 1.5 V nominal |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| Logic Family | — | CMOS |
| Process Technology | — | 130 nm, 7-layer metal |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Operating Temperature | — | 0 C to 70 C |
| Terminal Pitch | — | 0.5 mm |
| Input Count | — | 95 inputs |
| Output Count | — | 95 outputs |
| Programmability | — | Flash-based field-programmable logic |