AFS600-2PQ208 vs AFS600-PQ208I Comparison
Detailed side-by-side comparison of AFS600-2PQ208 by Microchip Technology and AFS600-PQ208I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-2PQ208 - 95-I/O Fusion FPGA | Microchip | 208-BFQFP
AFS600-2PQ208 ✓ ActiveMicrochip Technology
AFS600-PQ208I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-PQ208I ✓ ActiveSpecification Comparison
| Parameter | AFS600-2PQ208 | AFS600-PQ208I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Fusion Field Programmable Gate Array (FPGA) | — |
| Programmable Elements | 110592 | — |
| User I/O Count | 95 | — |
| Package | 208-BFQFP | 208-BFQFP |
| Manufacturer | Microsemi Corporation | — |
| Device Family | Fusion | — |
| Product Category | Programmable Logic IC | — |
| Mounting Type | Surface Mount | Surface mount |
| Supply Status | In stock at Heisener, 5072 pieces | — |
| DigiKey Availability | Buy now, ships today | — |
| Unit Price | [DATA_NEEDED: verified unit price] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory capacity] | Nonvolatile flash memory |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| DSP Block Count | [DATA_NEEDED: DSP block count] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification status] |
| Product Type | — | Fusion mixed-signal FPGA |
| System Gates | — | 600,000 gates |
| Embedded RAM | — | 110,592 RAM bits |
| Programmable I/O Pins | — | 95 pins |
| Package Type | — | 208-pin Ball Fine-Pitch Quad Flat Package |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Power-Up Behavior | — | Live at power-up (LAPU) |
| Logic Family | — | CMOS |
| Nominal Core Supply | — | 1.5 V |
| Minimum Supply Voltage | — | 1.425 V |
| Maximum Supply Voltage | — | [DATA_NEEDED: maximum supply voltage] |
| Industrial Junction Temperature Range | — | -40°C to +100°C (TJ) |
| Secondary Database Temperature Listing | — | 0°C to +70°C |
| Embedded ARM Support | — | Optional |